KR20230083194A - Electronic device including antenna - Google Patents

Abstract

According to one embodiment of the present document, an electronic device may comprise: a printed circuit board which comprises a first part, a second part, and a third part connecting the first part and the second part and flexible, wherein the first part contains a first surface of the printed circuit board and a second surface placed on the opposite side of the first surface, and the second part contains a third surface of the printed circuit board and a fourth surface placed on the opposite side of the third surface; a microphone placed on the first surface; a conductive pattern covering at least part of the microphone; and a wireless communication circuit placed on the first part. The printed circuit board may comprise: a first electric path connecting the conductive pattern and the wireless communication circuit; and a second electric path which connects a ground area contained in the printed circuit board to electrically connect to the first electric path or the conductive pattern and is contained in the second part. Other various embodiments may be provided. According to the present invention, an electronic device containing an antenna for ensuring antenna radiation performance can be provided.

Description

Electronic device including an antenna {ELECTRONIC DEVICE INCLUDING ANTENNA}

Various embodiments of this document relate to an electronic device including an antenna.

With the development of digital technology, electronic devices are provided in various forms such as smart phones, tablet personal computers (PCs), or personal digital assistants (PDAs). Electronic devices are also being developed in a wearable form to improve portability and user accessibility. The electronic device may include an antenna for wireless communication with an external electronic device.

The electronic device may be, for example, an ear wearable device that can be worn on the ear. Ear wearable devices are being miniaturized, and as a result, it may be difficult to arrange components in a limited space of ear wearable devices while reducing electromagnetic influence between components. In addition, since the user's body can affect components such as an antenna or a touch sensing circuit using electromagnetic energy while the ear wearable device is worn on the ear, it is possible to reduce the influence of the user's body while reducing the wearable component using electromagnetic energy. It can be difficult to place in the limited space of a device.

Various embodiments of the present document may provide an electronic device including an antenna for securing antenna radiation performance.

The technical problem to be achieved in this document is not limited to the technical problem mentioned above, and other technical problems not mentioned will be understood by those skilled in the art from the description below. .

According to one embodiment of the present document, an electronic device includes a printed circuit board including a first part, a second part, and a third part connecting the first part and the second part and being flexible, the first part includes a first surface of the printed circuit board and a second surface disposed opposite to the first surface, wherein the second portion comprises a third surface of the printed circuit board and an opposite surface to the third surface. It includes a fourth surface disposed on, a microphone disposed on the first surface, a conductive pattern disposed on the first surface and at least partially surrounding the microphone, and a wireless communication circuit disposed on the first portion. And, the printed circuit board, a first electrical path electrically connecting the conductive pattern and the wireless communication circuit, and a ground area included in the printed circuit board electrically connecting the first electrical path or the conductive pattern and a second electrical path included in the second part.

An electronic device including an antenna according to an embodiment of the present document may secure antenna radiation performance.

In addition, effects that can be obtained or predicted due to various embodiments of this document will be directly or implicitly disclosed in the detailed description of the embodiments of this document. For example, various effects predicted according to various embodiments of the present document will be disclosed within the detailed description to be described later.

1 illustrates a state in which an electronic device is coupled to an ear according to an exemplary embodiment.
2 is a front view of an electronic device according to an exemplary embodiment.
3 is a rear view of an electronic device according to an exemplary embodiment.
4 is a side view of an electronic device according to an exemplary embodiment.
5 is a block diagram of an electronic device according to an exemplary embodiment.
6 is an exploded perspective view of a part of an electronic device according to an exemplary embodiment.
7 is a cross-section of a substrate assembly in an unfolded state in one embodiment.
8 is a cross-section of a substrate assembly in a folded state, in one embodiment.
9 is a block diagram of circuitry included in an electronic device, in one embodiment.
10 is an xy plan view of a first layer included in a printed circuit board, in one embodiment.
11 is an xy plan view of a second layer included in a printed circuit board, in one embodiment.
12 is an xy plan view of a third layer included in a printed circuit board, in one embodiment.
13 is an xy plan view of a fourth layer included in a printed circuit board, in one embodiment.
14 is an xy plan view of a fifth layer included in a printed circuit board, in one embodiment.
15 is an xy plan view of a sixth layer included in a printed circuit board, in one embodiment.

Hereinafter, various embodiments of this document will be described with reference to the accompanying drawings.

Terms in this document are not intended to limit the technology described in this document to specific embodiments, but should be understood to include various modifications, equivalents, and/or substitutes of the embodiments. In connection with the description of the drawings, like reference numerals may be used for like elements. Singular expressions may include plural expressions unless the context clearly indicates otherwise. In this document, expressions such as "A or B" or "at least one of A and/or B" may include all possible combinations of the items listed together. Expressions such as “first,” “second,” “first,” or “second,” may modify the elements in any order or importance, and are intended to distinguish one element from another. It is used only and does not limit the corresponding components. When it is referred to as being "(functionally or communicatively) connected" or "connected" to some (e.g. first component) another (e.g. second component), the certain component is the other component. It may be directly connected to, or connected through another component (eg, a third component).

In this document, "configured to (or configured to)" means "suitable for," "having the ability to," "changed to," depending on the situation, for example, hardware or software. ," can be used interchangeably with "made to," "capable of," or "designed to." In some contexts, the expression "device configured to" can mean that the device is "capable of" in conjunction with other devices or components.

1 shows a state in which an electronic device 1 is coupled to an ear 2 according to an exemplary embodiment. 2 is a front view of the electronic device 1 according to an embodiment. 3 is a rear view of the electronic device 1 according to an embodiment. 4 is a side view of the electronic device 1 according to an embodiment.

Referring to FIGS. 1, 2, 3, and 4, the electronic device 1 may be an ear wearable device. The electronic device 1 may include a housing 10 that may be detachably attached to the ear 2 . The housing 10 may have a shape that can be stably seated in a groove of the auricle connected to the external auditory canal of the ear 2, for example. In one embodiment, the housing 10 may include a first housing 11 and a second housing 12 . The first housing 11 and the second housing 12 may be combined to form an internal space of the electronic device 1 in which one or more electronic components are accommodated. At least one electronic component included in the electronic device 1 may be disposed or coupled to the first housing 11 and/or the second housing 12 . The outer surface of the electronic device 1 includes a first outer surface 10A formed by the first housing 11 and a second outer surface 10A formed by the second housing 12 and positioned opposite the first outer surface 10A. It may include an outer surface 10B. The electronic device 1 may be worn on the ear 2 with the second outer surface 10B facing the ear 2 . When the electronic device 1 is worn on the ear 2, the first area of the outer surface of the electronic device 1 is covered by the ear 2 and is not exposed to the outside, and the second area of the outer surface of the electronic device 1 is covered. The area may be exposed to the outside. The second area may be substantially included in the second outer surface 10B of the second housing 12 . In some embodiments, although not shown, the housing 10 is not limited to a form including the first housing 11 and the second housing 12, and three or more housings are combined to form a first outer surface 10A and It may be implemented in a form forming the second outer surface 10B. At least a portion of the housing 10 may include a non-metallic material (eg, polymer) and/or a metallic material.

According to one embodiment, the housing 10 may include a first microphone hole 101 , a second microphone hole 102 , and/or a speaker hole 103 . The first microphone hole 101 and the second microphone hole 102 may be formed on the first outer surface 10A, and the speaker hole 103 may be formed on the second outer surface 10B. When the electronic device 1 is worn on the ear 2, the first microphone hole 101 and the second microphone hole 102 are exposed to the outside, and the speaker hole 103 is connected to the ear canal of the ear 2. can be positioned correspondingly. The electronic device 1 corresponds to a first microphone (or a first microphone) located inside the electronic device 1 corresponding to the first microphone hole 101 and a second microphone hole 102 corresponding to the electronic device ( 1) may include a second microphone (or second microphone) located inside. The electronic device 1 may include a speaker located inside the electronic device 1 corresponding to the speaker hole 103 . A sound wave such as a voice is introduced into the first microphone through the first microphone hole 101 and introduced into the second microphone through the second microphone hole 102, and the first microphone and the second microphone generate an electrical signal for the sound wave. can do. The electrical signal generated by the first microphone and/or the second microphone may be output as a sound through a speaker or used as an input signal corresponding to various functions of the electronic device 1 . The microphone hole or the position or number of microphones corresponding to the microphone hole is not limited to the illustrated example and may vary. Sound output from the speaker may be emitted through the speaker hole 103 aligned with the external auditory meatus of the ear 2 and delivered to the eardrum of the ear 2 .

According to an embodiment, the first microphone corresponding to the first microphone hole 101 and the second microphone corresponding to the second microphone hole 102 may be used for noise-cancelling.

According to one embodiment, the housing 10 may include a duct structure including an opening 104 formed in the first outer surface 10A. The duct structure can improve the quality of sound output through the speaker. The duct structure including the opening is not limited to the illustrated example and may be formed in various ways. For example, the duct structure can contribute to enriching the bass sound. In one embodiment, the electronic device 1 has an opening 105 formed in the housing 10 to allow air flow between the inside of the electronic device 1 and the outside of the ear wearable device (e.g., an air vent). vent)). The opening 105 may contribute to enabling rich sound transmission through the speaker. The location or number of openings as air vents is not limited to the illustrated example and may vary.

According to an embodiment, a portion of the first outer surface 10A of the housing 10 may be used as a user input area (or key area) 10C for receiving or sensing a user input. For example, a touch input, a hovering input, or a gesture input may be possible through the user input area 10C of the first outer surface 10A while the electronic device 1 is worn on the ear 2 . The touch input may refer to a user input generated when a dielectric such as a finger is brought into contact with the user input area 10C of the first outer surface 10A. The hovering input may indicate, for example, a user input that can be generated in a state in which a dielectric material such as a finger does not touch the user input area 10C of the first outer surface 10A. Gesture input may indicate, for example, a user input related to a movement of a dielectric such as a finger (eg, finger movements or a finger movement pattern). In one embodiment, the electronic device 1 may include a first conductive pattern 13 located inside the electronic device 1 corresponding to the user input area 10C of the first outer surface 10A. The first conductive pattern 13 may be included in, for example, a printed circuit board (eg, a flexible printed circuit (FPCB)) located inside the electronic device 1 . In one embodiment, the first conductive pattern 13 and the first microphone corresponding to the first microphone hole 101 may be disposed on the same printed circuit board. For example, the first microphone may be disposed on a first surface of the printed circuit board, and the first conductive pattern 13 may be disposed on a second surface of the printed circuit board facing in a direction opposite to the first surface. In some embodiments, the first conductive pattern 13 may be located inside the printed circuit board closer to the second side than to the first side, or closer to the first side than to the second side. In some embodiments, the first conductive pattern 13 may be disposed on the first housing 11 or inside the first housing 11 . In some embodiments, the first conductive pattern 13 may be disposed on a non-conductive support member located in an internal space of the electronic device 1 . For example, the first conductive pattern 13 may be in the form of a laser direct structuring (LDS) disposed on the first housing 11 or a non-conductive support member, or in a form realized by plating or printing. The first conductive pattern 13 may at least partially overlap the user input area 10C of the first outer surface 10A. The electronic device 1 may apply a voltage to the first conductive pattern 13, and the first conductive pattern 13 may form an electromagnetic field. When a finger touches the user input area 10C of the first outer surface 10A or reaches within a threshold distance, a change in capacitance based on a change in the electromagnetic field may be greater than or equal to a threshold value. When the change in capacitance exceeds the threshold value, the electronic device 1 may generate an electrical signal as a valid user input. In one embodiment, the user input area 10C of the first outer surface 10A and the first conductive pattern 13 corresponding to the user input area 10C will be referred to as a 'touch key'. can In some embodiments, the first conductive pattern 13 may be referred to as a 'touch sensing circuit'.

According to one embodiment, when viewed from the top of the first outer surface 10A (eg, when viewed in the -z axis direction), the first microphone corresponding to the first microphone hole 101 has a first conductive pattern 13 and They may overlap at least partially. For example, the first conductive pattern 13 may be positioned between the first microphone and the first microphone hole 101 . The first conductive pattern 13 may include a first opening aligned with the first microphone hole 101 . Sound waves may be provided to the first microphone from the outside of the electronic device 1 through the first microphone hole 101 and a first opening aligned with the first microphone hole 101 . In one embodiment, the first microphone may be disposed on a first surface of the printed circuit board, and the first conductive pattern 13 may be disposed on a second surface of the printed circuit board facing in a direction opposite to the first surface. The printed circuit board may include a second opening aligned with the first opening of the first microphone hole 101 and the first conductive pattern 13 of the housing 10 . The first opening may be located between the first microphone hole 101 and the second opening. Sound waves may be provided to the first microphone from the outside of the electronic device 1 through the first microphone hole 101 , the first opening, and the second opening.

According to one embodiment, the first housing 11 may include a non-conductive material. The electromagnetic field generated by the first conductive pattern 13 may pass through the first housing 11 made of a non-conductive material. The first housing 11 made of a non-conductive material reduces the effect on the electromagnetic field generated by the first conductive pattern 13 compared to the comparison example in which the first housing 11 is made of a conductive material, and the first conductive pattern 13 ) can contribute to securing the performance of a touch key using. In some embodiments, a first part of the first housing 11 overlapping the first conductive pattern 13 to form the user input area 10C includes a non-conductive material, and the rest of the first housing 11 The second part may include a conductive material. The housing 11 made of a non-conductive material or the part forming the user input area 10C of the first housing 11 has a permittivity that can reduce the effect on the performance of the touch key using the first conductive pattern 13 (e.g. low permittivity).

According to an embodiment, the electronic device 1 may include a second conductive pattern 14 used as a radiation portion. When viewed from the top of the first outer surface 10A, the second conductive pattern 14 may not overlap the first conductive pattern 13 used as the touch sensing circuit. For example, the second conductive pattern 14 may be disposed to at least partially surround the first conductive pattern 13 when viewed from above on the first outer surface 10A. The second conductive pattern 14 may be included in, for example, a printed circuit board (eg, FPCB) located inside the electronic device 1 . In one embodiment, the first conductive pattern 13 used as a touch sensing circuit and the second conductive pattern 14 used as a radiation portion may be included on the same printed circuit board. For example, the first microphone corresponding to the first microphone hole 101 is disposed on the first surface of the printed circuit board, and the second conductive pattern 14 is disposed on the first surface or on the first surface of the printed circuit board. And may be disposed on the opposite second side. In some embodiments, the second conductive pattern 14 may be disposed on the first housing 11 or inside the first housing 11 . In some embodiments, the second conductive pattern 14 may be disposed on a non-conductive support member located in the inner space of the electronic device 1 . The second conductive pattern 14 may have, for example, an LDS form disposed on the first housing 11 or a non-conductive support member, or a form realized by plating or printing. The second conductive pattern 14 is an electromagnetic field capable of transmitting and/or receiving at least one frequency signal in a selected or designated frequency band by being electrically connected to a wireless communication circuit (eg, a communication module) included in the electronic device 1. can form The wireless communication circuitry, for example, can provide a radiation current (or electromagnetic signal) to the second conductive pattern 14, and the second conductive pattern 14 can radiate radio waves. The second conductive pattern 14 may operate as a radiation unit that radiates a supplied electromagnetic signal to the outside or transmits and receives electromagnetic signals from the outside. The wireless communication circuit may process a transmission signal or a reception signal in at least one designated frequency band through the second conductive pattern 14 . The designated frequency band is, for example, low band (LB) (about 600 MHz to about 1 GHz), middle band (MB) (about 1 GHz to about 2.3 GHz), high band (HB) (about 2.3 GHz to about 2.7 GHz). , or ultra-high band (UHB) (about 2.7 GHz to about 6 GHz). The designated frequency band may include various other frequency bands.

According to an embodiment, energy (eg, electromagnetic waves) radiated from the second conductive pattern 14 may pass through the first housing 11 and proceed to the outside. The first housing 11 made of a non-conductive material reduces the effect on the electromagnetic field generated by the second conductive pattern 14 compared to the comparison example in which the first housing 11 is made of a conductive material, so that the second conductive pattern 14 ) can contribute to securing the antenna radiation performance of an antenna (or antenna device) using. In some embodiments, a first portion of the first housing 11 overlapping the first conductive pattern 13 and the second conductive pattern 14 includes a non-conductive material, and the remaining portion of the first housing 11 Part 2 may include a conductive material. The housing 11 formed of a non-conductive material or the part overlapping the first conductive pattern 13 and the second conductive pattern 14 of the first housing 11 is a touch key using the first conductive pattern 13. It may have a permittivity (eg, low permittivity) that can reduce the effect on the performance and the effect on the antenna radiation performance of the antenna using the second conductive pattern 14. According to one embodiment, the electronic device 1 is A connection terminal unit 15 may be included. The connection terminal unit 15 may include a plurality of terminals 151 and 152 disposed on the second outer surface 10B of the second housing 12 . The second housing 12 includes a shape protruding in a direction toward the ear 2 (hereinafter, referred to as a 'protrusion'), and the connection terminal unit 15 may include a protrusion. When the electronic device 1 is worn on the ear 2, the connection terminal 15 may be inserted into the groove of the auricle and not exposed to the outside. When the electronic device 1 is disposed in an external electronic device, the plurality of terminals 151 and 152 may be electrically connected to a plurality of terminals (eg, flexible terminals such as pogo pins) included in the external electronic device. . The electronic device 1 may receive power for charging the battery of the electronic device 1 from an external electronic device through the connection terminal unit 15 . The electronic device 1 may receive data or information from an external electronic device through the connection terminal unit 15 . The electronic device 1 may transmit data or information to an external electronic device through the connection terminal unit 15 . Although not shown, the electronic device 1 is not limited to the illustrated connection terminal unit 15 and may further include various other types of connectors (eg, USB connectors) or interface terminals connectable to external electronic devices. Although not shown, the electronic device 1 may further include a connector (eg, a card connector) or an interface terminal for connection to an external storage medium such as an external memory.

5 is a block diagram of an electronic device 1 according to an exemplary embodiment.

Referring to FIG. 5 , the electronic device 1 includes a processor 510, a memory 520, a touch pad 530, an audio module 540, a speaker 541, a microphone (or microphone) 542, and a sensor module. 550, a connection terminal 560, a power management module 570, a battery 580, a communication module 590, and/or an antenna radiator 591. In some embodiments, the electronic device 1 may omit at least one of the components of FIG. 5 or may further include one or more other components. In some embodiments, some of these components may be implemented as a single integrated circuit.

The processor 510 may, for example, execute software to control at least one other component (eg, hardware or software component) of the electronic device 1 connected to the processor 510, and process various data. Or you can perform arithmetic. As at least part of the data processing or operation, the processor 510 loads instructions or data received from other components (e.g., sensor module 550 or communication module 590) into volatile memory in memory 520; Commands or data stored in volatile memory may be processed, and resulting data may be stored in non-volatile memory.

The memory 520 may store various data used by at least one component (eg, the processor 510 or the sensor module 550) of the electronic device 1, for example. The data may include, for example, input data or output data for software (eg, a program) and commands related thereto. Memory 520 may include volatile memory and/or non-volatile memory. The program may be stored as software in the memory 520 and may include, for example, an operating system, middleware, or applications. The memory 520 may store, for example, instructions related to various operations performed by the processor 510 .

The touch pad 530 is, for example, a pointing device utilizing the user input area 10C (see FIG. 2 ) of the housing 10, and includes a touch sensing circuit 531 and a touch sensor IC (integrated circuit) (or touch sensor) 532. In one embodiment, the touch sensing circuit 531 may include a conductive pattern located inside the electronic device 1 . The touch sensing circuit 531 may include, for example, the first conductive pattern 13 (see FIGS. 1 and 2 ). The touch pad 530 may be implemented based on a capacitive type. The touch sensor IC 532 (eg, a touch controller integrated circuit (IC)) applies a voltage to the touch sensing circuit 531, and the touch sensing circuit 531 may form an electromagnetic field. For example, when a dielectric such as a finger touches the user input area 10C of the housing 10 or reaches within a critical distance from the user input area 10C, the change in capacitance based on the change in the electromagnetic field is critical. value can be greater than When the capacitance change is greater than or equal to the threshold value, the touch sensor IC 532 may generate an electrical signal related to coordinates as a valid user input and transmit the generated electrical signal to the processor 510 . The processor 510 may recognize coordinates based on an electrical signal received from the touch sensor IC 532 . It may also be referred to as a 'sensor circuit' for touch sensing including the touch sensing circuit 531 and the touch sensor IC 532 . In some embodiments, it may be referred to as a 'touch key' including the user input area 10C of the housing 10 and the touch sensing circuit 531 corresponding to the user input area 10C.

According to an embodiment, the touch sensor IC 532 may convert an analog signal acquired through the touch sensing circuit 531 into a digital signal. The touch sensor IC 532 may perform various functions such as noise filtering, noise removal, or sensing data extraction in relation to the touch sensing circuit 531 . The touch sensor IC 532 may include various circuits such as, for example, an analog-digital converter (ADC), a digital signal processor (DSP), and/or a micro control unit (MCU).

According to an embodiment, a user input related to audio data (or audio content) may be generated through the touch pad 530 . For example, functions such as start of reproduction, pause of reproduction, stop of reproduction, adjustment of reproduction speed, adjustment of reproduction volume, or muting of audio data may be executed based on a user input through the touch pad 530 . For example, various gesture inputs may be possible using a finger through the user input area 10C (see FIG. 2 ) of the housing 10, and various functions related to audio data may be implemented based on such gesture inputs. there is. For example, when a single tap is performed in the user input area 10C, the processor 510 may reproduce audio data or temporarily stop the reproduction. For example, if two taps are made in the user input area 10C, the processor 510 may switch playback to the next audio data. For example, if three taps are made in the user input area 10C, the processor 510 may switch playback to the previous audio data. For example, when swiping is performed in the user input area 10C, the processor 510 may adjust the volume related to reproduction of audio data. Gesture input can be used not only for functions related to audio data, but also for various other functions. For example, when a call is received and two taps are performed on the user input area 10C, the processor 510 may connect the call.

According to some embodiments, the touch pad 530 may further include a tactile layer. The touch pad 530 including the tactile layer may provide a tactile response to the user.

According to some embodiments, there may be a click button aligned with the touch pad 530, and an input such as clicking a mouse button may be generated when the user input area 10C (see FIG. 2) is pressed. In this case, the user input area 10C may be implemented to have flexibility or to be moved in response to pressure. In some embodiments, the touch pad 530 may include a sensor circuit (eg, a pressure sensor) (not shown) configured to measure the strength of a force generated by a user input.

According to an embodiment, although not shown, the electronic device 1 is not limited to the touch pad 530, and commands or data to be used for components (eg, the processor 510) of the electronic device 1 are electronically transmitted. It may further include various other input devices for receiving from the outside of the device 1 (eg, a user). The input device may be various, for example a physical button or an optical key.

The speaker 541 may output, for example, an audio signal to the outside of the electronic device 1 . In one embodiment, the speaker 541 may be located in the internal space of the electronic device 1 corresponding to the speaker hole 103 of FIG. 3 . Sound waves such as voice may be provided to the microphone 542 from the outside of the electronic device 1 through a microphone hole (eg, the first microphone hole 101 or the second microphone hole 102 in FIG. 2 ), and the microphone 542 may generate an electrical signal for this. The microphone 542 includes, for example, a first microphone corresponding to the first microphone hole 101 (see FIG. 2) or a second microphone corresponding to the second microphone hole 102 (see FIG. 2). can do. The audio module 540 may convert sound into an electrical signal or vice versa. The audio module 540 may acquire sound through the microphone 542 or output sound through the speaker 541 .

According to one embodiment, the audio module 540 may support an audio data collection function. The audio module 540 may reproduce the collected audio data. The audio module 540 may include an audio decoder, a digital-to-analog converter (D/A), or an analog-to-digital converter (A/D). The audio decoder may convert audio data stored in the memory 520 into a digital audio signal. The D/A converter may convert a digital audio signal converted by an audio decoder into an analog audio signal. The speaker 541 may output an analog audio signal converted by the D/A converter. The A/D converter may convert an analog audio signal acquired through the microphone 542 into a digital audio signal.

The sensor module 550 may detect, for example, an operating state (eg, power or temperature) of the electronic device 1 or an external environmental state (eg, a user state), and respond to the detected state. It can generate electrical signals or data values. In one embodiment, the sensor module 550 may include an accelerometer sensor, a gyro sensor, a geomagnetic sensor, a magnetic sensor, a proximity sensor, a temperature sensor, a gesture sensor, a grip sensor, and/or a biometric sensor.

The electronic device 1 may include, for example, an optical sensor positioned at least partially in an inner space of the electronic device 1 or the housing 10 (see FIG. 2 ). When the optical sensor is located in the inner space of the electronic device 1, a portion of the housing 10 facing the optical sensor may be implemented to allow light to pass through or may include an opening. The optical sensor includes a light emitting unit (eg, a light emitting diode (LED)) that outputs light of at least one wavelength band, or a light receiving unit (eg, a photodiode) that receives light of one or more wavelength bands and generates an electrical signal. ) may be included. In one embodiment, the optical sensor may be a sensor for detecting a state in which the electronic device 1 is worn on the ear. In some embodiments, the optical sensor may be a biometric sensor. When the electronic device 1 is worn on the ear, light output from the light emitting unit of the optical sensor may be reflected from the user's skin and introduced into the light receiving unit of the optical sensor. The light receiving unit of the optical sensor may provide an electrical signal based on the introduced light to the processor 510 . The processor 510 may transmit the electrical signal obtained from the optical sensor to an external electronic device (eg, a smart phone) through the communication module 590 . The external electronic device may acquire various biometric information such as heart rate or skin temperature based on the electrical signal obtained from the electronic device 1 . In some embodiments, the processor 510 may obtain biometric information based on an electrical signal obtained from an optical sensor, transmit the acquired biometric information to an external electronic device through the communication module 590, or transmit the acquired biometric information to an external electronic device, or the speaker 541 ) can also be output.

According to an embodiment, information or a signal about whether the electronic device 1 is coupled to the ear may be obtained through the sensor module 550 . In some embodiments, information or a signal about whether the electronic device 1 is coupled to an external device (eg, a power supply device or a charging device) may be obtained through the sensor module 550 .

According to an embodiment, although not shown, the electronic device 1 may include a sensing target member corresponding to a sensor of an external electronic device (eg, a power supply device). For example, the external electronic device may include a Hall IC disposed in the mounting unit, and the electronic device 1 may include a magnet (or magnetic material). When the electronic device 1 is coupled to the mounting part of the external electronic device, the Hall IC of the external electronic device detects the magnet disposed on the electronic device 1, and electrical information about the coupling of the external electronic device and the electronic device 1 is detected. A signal may be delivered to the processor 510 . In some embodiments, a magnet may be disposed on the connection terminal portion 15 of FIGS. 3 and 4 and may contribute to forming an attraction that facilitates connection between the electronic device 1 and an external electronic device.

The connection terminal 560 may include, for example, a connector through which the electronic device 1 may be electrically connected to an external electronic device (eg, a smart phone or a power supply device). According to one embodiment, the connection terminal 560 may include, for example, a USB connector or an SD card connector.

According to one embodiment, the connection terminal 560 may include a plurality of terminals 151 and 152 included in the connection terminal unit 15 of FIGS. 3 and 4 . The connection terminal 560 may receive power for charging the battery 580 from an external electronic device and transmit it to the power management module 570 . The electronic device 1 may perform power line communication (PLC) communication with an external electronic device (eg, a power supply device or a charging device) through the connection terminal 560 .

The power management module 570 may manage, for example, power supplied to or consumed by the electronic device 1 . In one embodiment, power management module 570 may be implemented as at least part of a power management integrated circuit (PMIC).

The battery 580 may supply power to at least one component of the electronic device 1 , for example. In one embodiment, battery 580 may include a rechargeable secondary cell.

The communication module (or communication circuit) 590 may include, for example, the electronic device 1 and an external electronic device (eg, a server, a smartphone, a personal computer (PC), a personal digital assistant (PDA), or Establishment of a direct (eg, wired) communication channel or wireless communication channel between access points, and communication through the established communication channel may be supported. In some embodiments, the communication module 590 may operate independently of the processor 510 and may include one or more communication processors supporting direct (eg, wired) or wireless communication.

The communication module 590 may transmit a signal or power to or receive a signal or power from an external electronic device through the antenna radiator 591, for example. In one embodiment, the antenna radiator 591 may include the second conductive pattern 14 of FIGS. 1 and 2 . The communication module 590 may include a wireless communication module (eg, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (eg, a local area network (LAN) communication module, or a power line communication module). can include Among these communication modules, a corresponding communication module is a first network (eg, Bluetooth (BLUETOOTH), BLE (Bluetooth low energy), NFC (near field communication), WiFi (wireless fidelity) direct or IrDA (infrared data association), etc.) The electronic device may communicate with the external electronic device through a local area communication network) or a second network (eg, the Internet or a long-distance communication network such as a computer network (eg, a LAN or a wide area network (WAN))). These various types of communication modules may be integrated into one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). In some embodiments, the electronic device 1 may include a plurality of antenna radiators, and the communication module 590 may select at least one antenna radiator suitable for a communication scheme used in a communication network from the plurality of antenna radiators. there is. A signal or power may be transmitted or received between the communication module 590 and an external electronic device through the selected at least one antenna radiator.

According to an embodiment, all or part of operations executed in the electronic device 1 may be executed in at least one external electronic device (eg, a smart phone). For example, when the electronic device 1 needs to perform a certain function or service automatically or in response to a request from a user or another device, instead of executing the function or service of the electronic device 1 itself. Or, additionally, at least one external electronic device may be requested to perform the function or at least part of the service. At least one external electronic device receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 1 . The electronic device 1 may provide the result as at least part of a response to the request as it is or additionally processed.

According to some embodiments, the command or data received by the processor 510 is sent to the electronic device 1 through a server connected to a second network (eg, the Internet or a telecommunications network such as a computer network (eg, a LAN or WAN)). ) and an external electronic device (eg, a smartphone) may be transmitted or received.

According to one embodiment, the processor 510 may be set to control various signal flow control and information collection and output related to audio data. The processor 510 receives audio data from an external electronic device (eg, a server, smartphone, PC, PDA, or access point) through the communication module 590 and stores the received audio data in the memory 520. can be set. The processor 510 may be set to receive non-volatile audio data (or download audio data) from an external electronic device and store the received non-volatile audio data in a non-volatile memory included in the memory 520 . The processor 510 may be configured to receive volatile audio data (or streaming audio data) from an external electronic device and store the received volatile audio data in a volatile memory included in the memory 520 .

According to an embodiment, the processor 510 may be configured to reproduce audio data (eg, non-volatile audio data or volatile audio data) stored in the memory 520 and output the reproduced audio data through the speaker 541 . For example, the audio module 540 may decode audio data to generate an audio signal that can be output through the speaker 541 (eg, reproduce audio data), and the generated audio signal is output through the speaker 541. It can be.

According to some embodiments, the processor 510 may receive an audio signal from an external electronic device and output the received audio signal through the speaker 541 . For example, an external electronic device (eg, an audio reproducing device) may decode audio data to generate an audio signal and transmit the generated audio signal to the electronic device 1 .

According to an embodiment, a mode in which the electronic device 1 reproduces volatile audio data or non-volatile audio data stored in the memory 520 and outputs it through the speaker 541 is a mode in which the electronic device 1 is not coupled to the ear. It can be paused when the status is confirmed using sensor module 550 . When the state in which the electronic device 1 is coupled to the ear is confirmed through the sensor module 550, the mode may be resumed.

According to an embodiment, the mode of receiving an audio signal from an external electronic device and outputting it through the speaker 541 is temporary when the state in which the electronic device 1 is not coupled to the ear is confirmed through the sensor module 550. can be stopped When the state in which the electronic device 1 is coupled to the ear is confirmed through the sensor module 550, the mode may be resumed.

According to an embodiment, when the electronic device 1 is then connected to another electronic device (not shown) in the form of a wearable device, one electronic device may become a master device and the other electronic device may become a slave device. . For example, the master device may not only output an audio signal received from an external electronic device (eg, a smartphone) to the speaker 541, but also transmit it to the slave device. The slave device may be implemented substantially the same as the master device, and may output an audio signal received from the master device through its speaker.

According to some embodiments, the electronic device 1 may provide a voice recognition function for generating a voice command from an analog audio signal received through the microphone 542 . Voice commands may be used for various functions related to audio data.

According to some embodiments, the electronic device 1 may detect the direction of sound using a plurality of microphones. At least some of the plurality of microphones may be used for noise canceling.

According to some embodiments, the electronic device 1 may further include various modules according to its provision form. Although the variations are very diverse according to the trend of convergence of digital devices, it is impossible to enumerate all of them, but components equivalent to those mentioned above may be further included in the electronic device 1. In addition, it goes without saying that in the electronic device 1 according to an embodiment, certain components may be excluded from the above components or replaced with other components according to the provision form. This will be easily understood by those skilled in the art.

6 is an exploded perspective view of a part of an electronic device 1 according to an exemplary embodiment.

Referring to FIG. 6 , the electronic device 1 includes a first housing 11, a second housing 12, a speaker 541, a battery 580, a support structure 6, a printed circuit board 7, and a second housing 12. A first conductive pattern 13 and/or a second conductive pattern 14 may be included.

According to one embodiment, the support structure 6 may be connected to the first housing 11 and/or the second housing 12 in the inner space of the electronic device 1 . The support structure 6 can be positioned within the electronic device 1 to withstand a load and contribute to durability or rigidity of the electronic device 1 . The supporting structure 6 may be formed of, for example, a metallic material and/or a non-metallic material (eg polymer). Electronic parts, such as the speaker 541, the battery 580, or the printed circuit board 7, or various members related to the electronic parts are supported by the support structure 6, the first housing 11, or the second housing ( 12), or supported by the support structure 6, the first housing 11, or the second housing 12. The printed circuit board 7 can be arranged or coupled to the support structure 6 , for example between the support structure 6 and the first housing 11 . The speaker 541 or the battery 580 may be disposed or coupled to the support structure 6 between the support structure 6 and the second housing 12 , for example. In some embodiments, housing 10 (see FIG. 4 ) and/or support structure 6 may be a 'frame', 'frame structure', or 'framework'. may be referred to by other terms. The support structure 6 is an internal structure located in the internal space of the electronic device 1, and may be referred to by various other terms such as a 'bracket' or a 'support member' in some embodiments. In some embodiments, support structure 6 can be interpreted as part of housing 10 .

According to one embodiment, the printed circuit board 7 may include a first part 71 , a second part 72 , and/or a third part 73 . The third part 73 may electrically connect the first part 71 and the second part 72 . In one embodiment, the third portion 73 may have greater flexibility than the first portion 71 and/or the second portion 72 . The third portion 73, for example, compared to the first portion 71 or the second portion 72, has a bending characteristic (eg, flexibility) that can be bent without breakage while reducing stress under the same conditions. can have In one embodiment, the third portion 73 may be a substantially flexible portion (or flexible section) of the printed circuit board 7, and the first portion 71 or the second portion 72 may be a printed circuit board It may be a substantially rigid portion (or rigid section) of the substrate 7 . In one embodiment, the third portion 73 may have a smaller thickness or a smaller number of layers than the first portion 71 or the second portion 72, and thus the first portion 71 or the second portion 72 (72). In some embodiments, third portion 73 includes a different material than first portion 71 or second portion 72 to have greater flexibility than first portion 71 or second portion 72 . can have The printed circuit board 7 may be formed using various other structures, including flexible and rigid parts, or parts having different flexibility. The printed circuit board 7 has a shape including a flexible portion and a rigid portion, and may be formed of, for example, a rigid-flexible printed circuit board (FPCB). In some embodiments, the printed circuit board 7 may be formed of a flexible printed circuit board (FPCB), for example, in a form including parts having different flexibility. In some embodiments, the first portion 71 or the second portion 72 may be implemented substantially flexibly.

According to one embodiment, the first part 71 of the printed circuit board 7 can be arranged or coupled to the support structure 6 . The third part 73 of the printed circuit board 7 is bent so that the second part 72 of the printed circuit board 7 can be disposed overlapping the first part 71 of the printed circuit board 7. there is.

In some embodiments, the second portion 72 and the third portion 73 of the printed circuit board 7 are integrally formed, and the third portion 73 is a connector (eg, FPCB connector), or solder It may be connected to the first portion 71 of the printed circuit board 7 using a conductive adhesive material such as ).

According to one embodiment, the printed circuit board 7 may include a front surface 7A and a rear surface 7B disposed opposite to the front surface 7A. A first microphone corresponding to the first microphone hole 101 of the first housing 11 may be disposed on the second portion 72 of the printed circuit board 7 . A first microphone may be disposed on the front surface 7A between the first part 71 and the second part 72 of the printed circuit board 7 . The second part 72 may include a second opening 702 corresponding to the first microphone. A sound wave such as a voice may be provided to the first microphone from the outside of the electronic device 1 through the first microphone hole 101 and the second opening 702 aligned with the first microphone hole 101 . In some embodiments, although not shown, the electronic device 1 may include a leakage preventing member positioned between the first housing 11 and the second part 72 . The leakage preventing member prevents or reduces leakage of sound waves between the first housing 11 and the second portion 72 of the printed circuit board 7, thereby substantially suppressing sound waves introduced through the first microphone hole 101. 2 can contribute to being moved to the opening 702.

According to one embodiment, the second microphone corresponding to the second microphone hole 102 of the first housing 11 may be disposed on the first part 71 of the printed circuit board 7 . The second part 72 of the printed circuit board 7 may be disposed not to overlap the second microphone or the second microphone hole 102 . The second microphone can be arranged, for example, on the back side 7B of the printed circuit board 7 between the first part 71 and the supporting structure 6 . The first part 71 may include a third opening 703 corresponding to the second microphone. A sound wave such as a voice may be provided to the second microphone from the outside of the electronic device 1 through the second microphone hole 102 and the third opening 703 aligned with the second microphone hole 102 . In some embodiments, although not shown, the electronic device 1 may include a leakage preventing member positioned between the first housing 11 and the first part 71 . The leakage preventing member prevents or reduces the leakage of sound waves between the first housing 11 and the first portion 71 of the printed circuit board 7, thereby substantially suppressing sound waves introduced through the second microphone hole 102. 3 can contribute to being moved to the opening (703).

According to an embodiment, the first conductive pattern 13 (eg, the touch sensing circuit 531 of FIG. 5 ) may be disposed on the second portion 72 of the printed circuit board 7 . The first conductive pattern 13 may be disposed on the rear surface 7B of the printed circuit board 7 between the second portion 72 and the first housing 11 . In one embodiment, the first conductive pattern 13 may include a first opening aligned with the first microphone hole 101 . The first opening may be located between the second opening 702 of the printed circuit board 7 and the first microphone hole 101 of the first housing 11, the second opening 702 and the first microphone hole can be aligned with (101). Sound waves may be provided to the first microphone from the outside of the electronic device 1 through the first microphone hole 101 , the first opening, and the second opening 702 . In some embodiments, although not shown, the first conductive pattern 13 may be implemented by modifying it to include a first opening in the form of a notch.

According to an embodiment, the second conductive pattern 14 (eg, at least a portion of the radiation portion of the antenna radiator 591 of FIG. 5 ) may be disposed on the second portion 72 of the printed circuit board 7 . The second conductive pattern 14 may be disposed on the front surface 7A of the printed circuit board 7 between the first part 71 and the second part 71 of the printed circuit board 7 . In some embodiments, the second conductive pattern 14 may be disposed on the rear surface 7B of the printed circuit board 7 between the second portion 72 and the first housing 11 . In some embodiments, the second conductive pattern 14 may be located inside the printed circuit board 7 between the front side 7A and the back side 7B of the printed circuit board 7 . For example, the second conductive pattern 14 may be located inside the printed circuit board closer to the rear surface 7B than the front surface 7A, or closer to the front surface 7A than the rear surface 7B.

According to an embodiment, the side of the second portion 72 of the printed circuit board 7 on which the first conductive pattern 13 is disposed (eg, a partial area included in the second portion 72 of the rear surface 7B) ), the first conductive pattern 13 and the second conductive pattern 14 may not overlap when viewed from above (eg, when viewed in the -z-axis direction). In one embodiment, when viewed from the top of the surface of the second portion 72 of the printed circuit board 7 on which the first conductive pattern 13 is disposed, the first conductive pattern 13 is the first microphone hole 101 may overlap with the first microphone corresponding to , and the second conductive pattern 14 may not overlap with the first microphone. In some embodiments, when viewed from the top of the surface of the second portion 72 of the printed circuit board 7 on which the first conductive pattern 13 is disposed, the second conductive pattern 14 is the first conductive pattern 13 may overlap to some extent.

7 is a cross-sectional view of the substrate assembly 70 in an unfolded state in one embodiment. 8 is a cross-sectional view of the substrate assembly 70 in a folded state in one embodiment.

7 and 8, the board assembly 70 includes a printed circuit board 7, a processor 510, a communication module 590, a touch sensor IC 532, a first conductive pattern 13, and a second conductive pattern. A pattern 14 , a first microphone 810 , and/or a matching circuit 820 may be included.

The printed circuit board 7 may be transformed from the unfolded state of FIG. 7 to the folded state of FIG. 8 and placed in the internal space of the electronic device 1 . In the folded state of the printed circuit board 7 , the second portion 72 may face and overlap the first portion 71 . In the folded state of the printed circuit board 7, the third portion 73 of the printed circuit board 7 may be disposed in a bent form. Although not shown, a support member (or support structure) for maintaining the folded state of the printed circuit board 8 may be positioned between the first portion 71 and the second portion 72, and the first portion 71 ) and the second part 72 may be disposed or coupled to the support member. In the folded state of the printed circuit board 7, the first portion 71 and the second portion 72 may be arranged in a substantially flat plate shape, and may be substantially parallel. The front surface 7A of the printed circuit board 7 may include a first surface 801 included in the second portion 72 and a third surface 803 included in the first portion 71 . The back surface 7B of the printed circuit board 7 may include a second surface 802 included in the second part 72 and a fourth surface 804 included in the first part 71 . In the folded state of the printed circuit board 7 (see FIG. 8 ), the first surface 801 may face the third surface 803 at a distance from each other. In the folded state of the printed circuit board 7, the second side 802 and the third side 803 may face in a first direction (eg, the +z axis direction), and the first side 801 and the fourth side Face 804 may be oriented in a second direction opposite the first direction (eg, -z axis direction). The coordinate axes shown in FIGS. 7 and 8 are presented based on the first part 71 of the printed circuit board 7, and for example, the +z axis may correspond to a direction in which the third surface 803 is substantially directed. there is.

According to one embodiment, the processor 510 , the communication module 590 , or the touch sensor IC 532 may be disposed on the first portion 71 of the printed circuit board 7 . The processor 510 or the communication module (or communication circuit) 590 may be disposed on, for example, the third surface 803 of the front surface 7A of the printed circuit board 7 . For example, the touch sensor IC 532 may be disposed on the fourth surface 804 of the front surface 7A of the printed circuit board 7 . In some embodiments, the processor 510 or communication module 590 may be disposed on the fourth side 804 of the front side 7A of the printed circuit board 7 . In some embodiments, the touch sensor IC 532 may be disposed on the third side 803 of the back side 7B of the printed circuit board 7 .

According to one embodiment, the first conductive pattern 13, the second conductive pattern 14, the first microphone 810, or the matching circuit 820 is on the second portion 72 of the printed circuit board 7. can be placed. The first conductive pattern 13 may be disposed on the second surface 802 of the rear surface 7B of the printed circuit board 7 . The second conductive pattern 14 may be disposed on the first surface 801 of the front surface 7A of the printed circuit board 7 . In one embodiment, the first conductive pattern 13 and/or the second conductive pattern 14 may be interpreted as components included in the printed circuit board 7 . In some embodiments, the first conductive pattern 13 or the second conductive pattern 14 may be a separate metal member disposed on the printed circuit board 7 . The first microphone 810 may be disposed on the first surface 801 of the front surface 7A of the printed circuit board 7 . The matching circuit 820 may be disposed on the first surface 801 of the front surface 7A of the printed circuit board 7 . In the folded state of the printed circuit board 7 (see FIG. 8), the second conductive pattern 14, the first microphone 810, and the matching circuit 820 form a first part 71 of the printed circuit board 7. ) and the second part 72.

According to some embodiments, the second conductive pattern 14 may be disposed on the second surface 802 included in the second portion 72 of the printed circuit board 7 . In this case, the second conductive pattern 14 may be disposed on a region of the second surface 802 different from the region where the first conductive pattern 13 is disposed. When viewed from above of the second side 802 of the printed circuit board 7 (e.g., when viewed in the +z-axis direction in the unfolded state of FIG. 7, or when viewed in the -z-axis direction in the folded state in FIG. 8), The first conductive pattern 13 and the second conductive pattern 14 may be spaced apart from each other without overlapping.

According to an embodiment, although not shown, the second conductive pattern 14 may be at least partially disposed inside the second portion 72 of the printed circuit board 7 . The second conductive pattern 14 may be closer to the second surface 802 than the first surface 801, or closer to the first surface 801 than the second surface 802, for example, the second portion 72 ) can be placed inside.

According to some embodiments, the matching circuit 820 may be disposed on the second side 802 included in the second portion 72 of the printed circuit board 7 .

According to an embodiment, the processor 510 may be electrically connected to the first microphone 810 through a third electrical path EP3 included in the printed circuit board 7 . The processor 510 may be electrically connected to the communication module 590 through an electrical path (not shown) included in the printed circuit board 7 . The processor 510 may be electrically connected to the touch sensor IC 532 through an electrical path (not shown) included in the printed circuit board 7 .

According to an embodiment, the touch sensor IC 532 connects the first conductive pattern 13 (eg, the touch sensing circuit 531 of FIG. 5) through the fourth electrical path EP4 included in the printed circuit board 7. ) and electrically connected.

According to an embodiment, the communication module 590 connects the second conductive pattern 14 (eg, the antenna radiator 591 of FIG. 5) through the first electrical path EP1 included in the printed circuit board 7. can be electrically connected. The first electrical path EP1 may be, for example, a feeding line (or transmission line) through which the communication module 590 supplies radiation current to the second conductive pattern 14 .

According to one embodiment, the printed circuit board 7 is in a folded state (see FIG. 8 ), as viewed from above of the second side 802 of the printed circuit board 7 (eg, when viewed in the -z-axis direction). , the first conductive pattern 13 may overlap the first microphone 810 . The first conductive pattern 13 may include a first opening 701 aligned with the first microphone hole 101 (see FIG. 6 ) of the first housing 11 . The second portion 72 of the printed circuit board 7 may include a second opening 702 corresponding to the first microphone 810 . The first opening 701 may be located between the second opening 702 of the printed circuit board 7 and the first microphone hole 101 (see FIG. 6) of the first housing 11, and the second opening 702 and the first microphone hole 101. Sound waves may be provided to the first microphone 810 from the outside of the electronic device 1 through the first microphone hole 101 , the first opening, and the second opening 702 .

According to one embodiment, when viewed from the top of the second side 802 of the printed circuit board 7 (e.g., in the +z-axis direction in the unfolded state of FIG. 7, or in the -z-axis direction in the folded state in FIG. 8) direction), the first conductive pattern 13 may not overlap the second conductive pattern 14 . In some embodiments, when viewed from the top of the second surface 802 of the printed circuit board 7, the first conductive pattern 13 and the second conductive pattern 14 may overlap.

The printed circuit board 7 may include, for example, a plurality of stacked conductive layers and a dielectric (or insulator) disposed at least partially between the plurality of conductive layers. The conductive layer may include at least one conductive pattern. At least one conductive pattern included in any conductive layer among the plurality of conductive layers may be used as a signal line (or electrical path). At least one conductive pattern included in any one of the plurality of conductive layers may be used as a ground plane. Hereinafter, a conductive pattern utilized as at least a part of a signal line may be referred to as a 'signal line pattern', and a conductive pattern utilized as at least a part of a ground plane may be referred to as a 'ground pattern'. The printed circuit board 7 may include a plurality of conductive vias. The conductive via may be a conductive hole in which a connection wire for electrically connecting conductive patterns of different conductive layers is disposed. The conductive via may include, for example, a plated through hole (PTH), a laser via hole (LVH), a buried via hole (BVH), or a stacked via.

The printed circuit board 7 may include, for example, a ground structure. The ground structure is not short-circuited with at least one signal line, and thus a signal or power transmitted through at least one signal line can be maintained. The ground structure may serve as an electromagnetic shielding structure to reduce electromagnetic influence (eg, electromagnetic interference (EMI)) on at least one signal line. The ground structure, for example, includes a plurality of signal lines. The ground structure may reduce electromagnetic noise (e.g., EMI) generated inside the electronic device 1 (see FIG. 2) or introduced from the outside of the electronic device 1. can reduce the effect (eg, signal loss or signal distortion) on a signal transmitted through at least one signal line included in the printed circuit board 7. The ground structure is, for example, through at least one signal line. It is possible to reduce the effect of the electromagnetic field generated when the current flows on the electrical elements around the printed circuit board 7. In one embodiment, the ground structure is provided in a plurality of layers located on different layers included in the printed circuit board 7. of ground patterns, and a plurality of conductive vias electrically connecting the plurality of ground patterns In one embodiment, in a folded state of the printed circuit board 7 (see FIG. 8), the ground structure is It is possible to reduce the electromagnetic influence between the first part 71 and the second part 72. In one embodiment, in the folded state of the printed circuit board 7, the ground structure is the front surface of the printed circuit board 7 ( 7A) of one or more components disposed on the first surface 801 (eg, the first microphone 810 or the second conductive pattern 14) and the third of the front surface 7A of the printed circuit board 7 Electromagnetic influence between one or more components disposed on face 803 may be reduced.

According to an embodiment, although not shown, an electromagnetic shielding structure (or electromagnetic shielding member) made of a conductive material may be positioned between the first part 71 and the second part 72 of the printed circuit board 7 . The electromagnetic shielding structure may include, for example, a shield can. The electromagnetic shielding structure may reduce electromagnetic influence between the first part 71 and the second part 72 . In the folded state of the printed circuit board 7 (see FIG. 8 ), the electromagnetic shielding structure includes one or more components (eg, the first surface 801 of the front surface 7A of the printed circuit board 7). Electromagnetic influence between the microphone 810 or the second conductive pattern 14 and one or more components disposed on the third surface 803 of the front surface 7A of the printed circuit board 7 may be reduced.

According to one embodiment, the first part 71, the second part 72, and the third part 73 of the printed circuit board 7 form substantially the same impedance or included in a critical range. can do. Impedance matching between the first part 71, the second part 72, and the third part 73 results in power loss and/or transmission when a signal having a selected or specified frequency is transmitted through at least one signal line. losses can be reduced. Signal integrity may be secured due to impedance matching between the first part 71 , the second part 72 , and the third part 73 .

The antenna (or antenna device, or antenna system) may include, for example, a wireless communication circuit (eg, the communication module 590 of FIG. 5 or 8), an antenna radiator (eg, the antenna radiator 591 of FIG. 5), a ground , or a transmission line. In one embodiment, the antenna radiator, ground, and transmission line may be included in the printed circuit board 7 . The antenna radiator may include, for example, at least one conductive pattern included in the printed circuit board 7 . The transmission line may include, for example, at least one electrical path included in the printed circuit board 7 . The transmission line electrically connects the wireless communication circuit and at least one antenna radiator, and may transmit radio frequency (RF) signals (voltage, current). The at least one antenna radiator may form an electromagnetic field capable of transmitting and/or receiving a signal of at least one frequency in a selected or designated frequency band when a radiation current is provided from the wireless communication circuit. The wireless communication circuit may process a transmission signal or a reception signal in at least one designated frequency band through at least one antenna radiator. The ground (or antenna ground) may include, for example, a ground plane (or ground structure) included in the printed circuit board 7 .

According to one embodiment, the printed circuit board 7 includes a first layer 81, a second layer 82, a third layer 83, a fourth layer 84, a fifth layer 85, and/or Alternatively, a sixth layer 86 may be included. The second layer 82 may be disposed between the first layer 81 and the third layer 83 . The third layer 83 may be disposed between the second layer 82 and the fourth layer 84 . The fourth layer 84 may be disposed between the third layer 83 and the fifth layer 85 . A fifth layer 85 may be disposed between the fourth layer 84 and the sixth layer 86 . The front surface 7A of the printed circuit board 7 may be formed by the first layer 81 . The rear surface 7B of the printed circuit board 7 may be formed by the sixth layer 86 . Although not shown, an insulating layer (or dielectric) for electrically separating the conductive pattern included in one layer and the conductive pattern included in the other layer between two adjacent layers (e.g., prepreg (preimpregnated materials)) (eg, an insulating resin layer) may be disposed. In some embodiments, at least one of the two layers adjacent to each other may include not only a conductive pattern but also a conductive pattern included in one layer and a conductive pattern included in the other layer. It can be interpreted as including an insulating layer for electrically separating the conductive patterns.The printed circuit board 7 is not limited to the illustrated example and may be implemented by modifying to include various other laminated structures. The number of layers included in the first part 71, the second part 72, or the third part 73 of (7) is not limited to the illustrated example and may vary.

According to some embodiments, the third portion 73 of the printed circuit board 7 may have a smaller number of layers or a smaller thickness than the first portion 71 or the second portion 72 of the printed circuit board 7 . there is.

According to some embodiments, the second portion 72 of the printed circuit board 7 may have a different number of layers or a different thickness than the first portion 71 of the printed circuit board 7 .

According to one embodiment, the printed circuit board 7 may include a second electrical path EP2. The second electrical path EP2 includes a circuit (hereinafter referred to as a 'radiation circuit') including the first electrical path EP1 (eg, a power supply line) and the second conductive pattern 14 and the printed circuit board 7 It may be a shunt line that electrically connects the ground structure included in . The second electrical path EP2 may be included in the second part 72 of the printed circuit board 7 . The second electrical path EP2 is, for example, branched from the first electrical path EP1 to be electrically connected to the ground structure of the printed circuit board 7 at the second portion 72 of the printed circuit board 7. can For another example, the second electrical path EP2 is branched from the second conductive pattern 14 to electrically connect the second portion 72 of the printed circuit board 7 to the ground structure of the printed circuit board 7. can be connected

According to one embodiment, the ground structure of the printed circuit board 7 includes a first ground structure included in the first portion 71, a second ground structure included in the second portion 72, and a third portion 73 ) may include a third ground structure included in. The first ground structure may include at least one ground pattern included in at least some of the plurality of layers included in the first portion 71 . The second ground structure may include at least one ground pattern included in at least some of the plurality of layers included in the second portion 72 . The third ground structure may include at least one ground pattern included in at least some of the one or more layers included in the third portion 73 . At least a portion of the third ground structure may electrically connect at least a portion of the first ground structure and at least a portion included in the second ground structure. The second electrical path EP2 may be branched from a radiation circuit (eg, a circuit including the first electrical path EP1 and the second conductive pattern 14) and electrically connected to at least a portion of the second ground structure. The matching circuit 820 may be disposed on the second electrical path EP2 of the printed circuit board 7 . The radiation circuit may be electrically connected to at least a portion of the second ground structure through the matching circuit 820 . In the second electrical path EP2 and the matching circuit 820 disposed in the second electrical path EP2, at least a part of the ground structure included in the printed circuit board 7 is the antenna ground (or antenna ground area) for the radiation circuit. ) can contribute to its use. The second electrical path EP2 and the matching circuit 820 disposed on the second electrical path EP2 may reinforce the ground connection between the radiation circuit and the ground structure of the printed circuit board 7 . The matching circuit 820 enables at least a portion of the ground structure included in the printed circuit board 7 to function better as an antenna ground for a radiating circuit that transmits and/or receives electromagnetic signals in a selected or specified frequency band. It can have elemental values. The matching circuit 820 adjusts the impedance (eg, characteristic impedance) between the transmission line and the load to enable maximum power transmission (or minimization of power loss) or efficient signal transmission by reducing reflection of the electromagnetic signal. It can have element values that can be matched. In one embodiment, the matching circuit 820 may include an inductor (eg, a shunt inductor). In some embodiments, the matching circuit 820 is not limited to an inductor, but at least one electrical element having a component such as inductance, capacitance, or conductance (e.g., a lumped element). element or passive element), or a shunt circuit or shunt element implemented as a combination of these electrical elements.

According to an embodiment, the second electrical path EP2 and the matching circuit 820 disposed on the second electrical path EP2 may be a radiation circuit (eg, the first electrical path EP1 and the second conductive pattern 14). The second part 72 of the printed circuit board 7 and at least one electronic component (eg, a first microphone) disposed thereon by reinforcing the ground connection between the circuit including a circuit) and the ground structure of the printed circuit board 7 (810)) can reduce the effect on the radiation circuit. The second electrical path EP2 and the matching circuit 820 disposed in the second electrical path EP2 reinforce the ground connection between the radiation circuit and the ground structure of the printed circuit board 7 to provide isolation for the radiation circuit ( isolation) can be achieved.

According to an embodiment, when the communication module 590 provides radiation current (or electromagnetic signal) to the first electrical path EP1, a portion of the radiation current may flow to the second conductive pattern 14, and Part of the current may flow to the ground structure of the printed circuit board 7 through the second electrical path EP2 where the matching circuit 820 is disposed. The second conductive pattern 14 may operate as a first radiation region (or first radiation portion) having a radiation current distribution that forms a radiation field (or electric field). At least a portion of the second ground structure included in the second portion 72 of the printed circuit board 7 may operate as a second radiation region (or second radiation portion) having a distribution of radiation current forming a radiation field. . The antenna radiator 591 of FIG. 5 may include, for example, a second conductive pattern 14 operating as a first radiation region and at least a portion of a second ground structure operating as a second radiation region. The second electrical path EP2 and the matching circuit 820 disposed on the second electrical path EP2 match impedances (eg, characteristic impedance) to reduce interference from the second radiation area to the first radiation area, Electromagnetic coupling characteristics (or electromagnetic coupling effects) between the first radiation area and the second radiation area may be improved to ensure antenna radiation performance in a selected or designated frequency band.

According to an embodiment, the communication module 590 uses an antenna radiator including at least a portion of the second conductive pattern 14 operating as a first radiation region and a second ground structure operating as a second radiation region. , may transmit and/or receive electromagnetic signals of the first frequency band. A signal used by other components (eg, the first microphone 810 or the first conductive pattern 13) disposed on the second part 72 of the printed circuit board 7 is different from the first frequency band. It can be included in 2 frequency bands. Since the first frequency band and the second frequency band are different from each other, electromagnetic influence between the antenna radiator and other components disposed in the second part 72 may be substantially absent.

9 is a block diagram of a circuit 900 included in the electronic device 1, in one embodiment. 10 is an x-y plan view of the first layer 81 included in the printed circuit board 7 in one embodiment. 11 is an x-y plan view of second layer 82 included in printed circuit board 7 in one embodiment. 12 is an x-y plan view of the third layer 83 included in the printed circuit board 7 in one embodiment. 13 is an x-y plan view of the fourth layer 84 included in the printed circuit board 7 in one embodiment. 14 is an x-y plan view of the fifth layer 85 included in the printed circuit board 7 in one embodiment. 15 is an x-y plan view of sixth layer 86 included in printed circuit board 7 in one embodiment.

Referring to FIG. 9 , the circuit 900 includes a processor 510, a communication module 590, a touch sensor IC 532, a first conductive pattern 13, a second conductive pattern 14, and a first microphone 810. ), a matching circuit 820, and/or a ground structure G. The ground structure G may include a first ground structure G1, a second ground structure G2, and/or a third ground structure G3.

According to an embodiment, the first ground structure G1 includes a plurality of ground patterns GP11, GP21, GP31, GP41, GP51, and GP61 included in the first portion 71 of the printed circuit board 7. can do. The second ground structure G2 may include a plurality of ground patterns GP12 , GP22 , GP32 , and GP42 included in the second portion 72 of the printed circuit board 7 . The third ground structure G3 may include one or more ground patterns GP33 and GP43 included in the third portion 73 of the printed circuit board 7 . Hereinafter, at least a portion included in any layer of the ground structure of the printed circuit board 7 is not limited to the term 'ground pattern', but is referred to as 'ground layer', 'ground area', or 'ground plane'. can be referred to.

9 and 10, the first layer 81 of the printed circuit board 7 includes, for example, a first ground pattern GP1, a first signal line pattern SP, and a second conductive pattern 14. ) may be included. The first ground pattern GP1 includes the ground pattern GP11 included in the first part 71 of the printed circuit board 7 and the ground pattern included in the second part 72 of the printed circuit board 7 ( GP12) may be included. The first signal line pattern SP may extend from the first part 71 through the third part 73 to the second part 72 . The first electrical path EP1 (see FIGS. 7 and 8 ) electrically connecting the second conductive pattern 14 and the communication module 590 may include the first signal line pattern SP. Although not indicated by reference numerals, the first layer 81 may include other signal line patterns other than the first signal line pattern SP. For example, a portion included in the first portion 71 of the first layer 81 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed on the first portion 71. there is. For example, a portion included in the second portion 72 of the first layer 81 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed on the second portion 72. there is. A portion included in the first portion 71 of the first layer 81 may include a conductive pad portion 1001 for disposing the processor 510 by using a conductive adhesive material (eg, solder). A portion included in the first portion 71 of the first layer 81 may include a conductive pad portion 1002 for disposing the communication module 590 by using a conductive adhesive material. A portion included in the second portion 72 of the first layer 81 may include a conductive pad portion 1003 for disposing the first microphone 810 by using a conductive adhesive material.

According to an embodiment, a portion included in the second portion 72 of the first layer 81 may include a conductive pad portion 1004 for disposing the matching circuit 820 using a conductive adhesive material. . The conductive pad portion 1004 may include a first terminal (or first land) 1004a and a second terminal (or second land) 1004b. The first terminal 1004a may be connected to the first signal line pattern SP. The second terminal 1004b may be positioned apart from the first terminal 1004a and electrically connected to the ground pattern G12. The matching circuit 820 may be disposed on the first terminal 1004a and the second terminal 1004b by using a conductive adhesive material, and the first terminal 1004a and the second terminal 1004b are the matching circuit 820 can be electrically connected via

According to an embodiment, a portion included in the second portion 72 of the first layer 81 may further include a conductive pad portion 1005 for disposing another matching circuit 830 . The matching circuit 830 may be disposed on a power supply line between the communication module 590 and the radiation area 901 (see FIG. 9) (or the Athena radiator 591 in FIG. 5). The matching circuit 830 may be disposed on a wire between the communication module 590 and the first signal line pattern SP. The matching circuit 830 may be referred to as a 'matching circuit of the power supply unit'. The matching circuit 830 may include at least one electrical element (eg, a lumped element or a passive element) having components such as inductance, capacitance, or conductance, or a combination of these electrical elements. The matching circuit 830 of the power feeding unit has a device value capable of matching the impedance between the transmission line and the load to enable maximum power transmission (or minimization of power loss) or efficient signal transmission by reducing reflection of the electromagnetic signal. can

According to an embodiment, a portion included in the third portion 73 of the first layer 81 may be implemented as a non-ground region substantially free of a ground pattern.

According to one embodiment, the part included in the second portion 72 of the first layer 81 may include a hole 702a for the second opening 702 (see FIG. 8 ).

9 and 11 , the second layer 82 of the printed circuit board 7 may include, for example, a second ground pattern GP2. The second ground pattern GP2 includes the ground pattern G21 included in the first part 71 of the printed circuit board 7 and the ground pattern included in the second part 72 of the printed circuit board 7 ( GP22) may be included. A portion included in the third portion 73 of the second layer 82 may be implemented as a non-ground region 1101 substantially devoid of a ground pattern. A portion included in the first portion 71 or the second portion 72 of the second layer 82 may include one or more signal line patterns, although not indicated by reference numerals. For example, a portion included in the first portion 71 of the second layer 82 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed on the first portion 71. there is. For example, a portion included in the second portion 72 of the second layer 82 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed on the second portion 72. there is.

According to one embodiment, the part included in the second portion 72 of the second layer 82 may include a hole 702b for the second opening 702 (see FIG. 8 ). FIG. 9 and Referring to 12 , the third layer 83 of the printed circuit board 7 may include, for example, a third ground pattern GP3. The third ground pattern GP3 includes the ground pattern GP31 included in the first part 71 of the printed circuit board 7 and the ground pattern GP32 included in the second part 72 of the printed circuit board 7. ), and the ground pattern GP33 included in the third portion 73 of the printed circuit board 7 . The ground pattern GP33 included in the third portion 73 may electrically connect the ground pattern GP31 included in the first portion 71 and the ground pattern GP32 included in the second portion 72 . . The substrate assembly 70 (see FIG. 8 ) may include two regions (eg, an upper region and a lower region) divided by the third layer 83, and the third ground pattern GP3 may include two regions. electromagnetic interference between them can be reduced. A portion included in the first portion 71 or the second portion 72 of the third layer may include one or more signal line patterns, although not indicated by reference numerals. For example, a portion included in the first portion 71 of the third layer 83 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed in the first portion 71. there is. For example, a portion included in the second portion 72 of the third layer 83 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed in the second portion 72. there is.

According to one embodiment, the portion included in the second portion 72 of the third layer 83 may include a hole 702c for the second opening 702 (see FIG. 8 ).

9 and 13 , the fourth layer 84 of the printed circuit board 7 may include, for example, a fourth ground pattern GP4. The fourth ground pattern GP4 includes the ground pattern GP41 included in the first portion 71 of the printed circuit board 7 and the ground pattern GP42 included in the second portion 72 of the printed circuit board 7. ), and the ground pattern GP43 included in the third part 73 of the printed circuit board 7 . The ground pattern GP43 included in the third portion 73 may electrically connect the ground pattern GP41 included in the first portion 71 and the ground pattern GP42 included in the second portion 72 . . Although not indicated by reference numerals, the fourth layer 83 may include a plurality of second signal line patterns extending from the first portion 71 to the second portion 72 via the third portion 73 . For example, the third electrical path EP3 (see FIGS. 7 and 8 ) electrically connecting the processor 510 and the first microphone 810 may include at least one of a plurality of second signal line patterns. . For example, the fourth electrical path EP4 (see FIGS. 7 and 8 ) electrically connecting the touch sensor IC 532 and the first conductive pattern 13 includes at least one of a plurality of second signal line patterns. can do. A portion included in the first portion 71 or the second portion 72 of the fourth layer 84 may include one or more signal line patterns, although not indicated by reference numerals. For example, a portion included in the first portion 71 of the fourth layer 84 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed in the first portion 71. there is. For example, a portion included in the second portion 72 of the fourth layer 84 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed in the second portion 72. there is.

According to an exemplary embodiment, at least one of the plurality of second signal line patterns included in the fourth layer 84 is connected to the first portion 71 of the printed circuit board 7 through a conductive via included in the first portion 71 . 71) and electrically connected to the processor 510. At least one of the plurality of second signal line patterns included in the fourth layer 84 is disposed in the second portion 72 through a conductive via included in the second portion 72 of the printed circuit board 7. 1 may be electrically connected to the microphone 810 . The third electrical path EP3 (see FIGS. 7 and 8 ) electrically connecting the first microphone 810 and the processor 510 includes at least one second signal line pattern, the processor 510 and the at least one second signal line. A conductive via electrically connecting the pattern and a conductive via electrically connecting the first microphone 810 and at least one second signal line may be included.

According to an exemplary embodiment, at least one of the plurality of second signal line patterns included in the fourth layer 84 is connected to the first portion 71 of the printed circuit board 7 through a conductive via included in the first portion 71 . 71) and electrically connected to the touch sensor IC 532. At least one of the plurality of second signal line patterns included in the fourth layer 84 is disposed in the second portion 72 through a conductive via included in the second portion 72 of the printed circuit board 7. 1 may be electrically connected to the conductive pattern 13 (eg, the touch sensing circuit 531 of FIG. 5 ). A fourth electrical path EP4 (see FIGS. 7 and 8 ) electrically connecting the first conductive pattern 13 and the touch sensor IC 532 includes at least one second signal line pattern, the touch sensor IC 532 and at least one It may include a conductive via electrically connecting one second signal line pattern and a conductive via electrically connecting the first conductive pattern 13 and at least one second signal line pattern.

According to one embodiment, the portion included in the second portion 72 of the fourth layer 84 may include a hole 702d for the second opening 702 (see FIG. 8 ).

9 and 14 , the fifth layer 85 of the printed circuit board 7 may include, for example, a fifth ground pattern GP51. The fifth ground pattern GP51 may be included in the first portion 71 of the printed circuit board 7 . A portion included in the first portion 71 of the fifth layer 85 may include one or more signal line patterns, although not indicated by reference numerals. For example, a portion included in the first portion 71 of the fifth layer 85 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed in the first portion 71. there is.

According to one embodiment, the portion included in the second portion 72 of the fifth layer 85 and/or the portion included in the third portion 73 of the fifth layer 82 are substantially free of the ground pattern. It can be implemented as a non-ground area.

According to one embodiment, the portion included in the second portion 72 of the fifth layer 85 may include a hole 702e for the second opening 702 (see FIG. 8 ).

9 and 15 , the sixth layer 86 of the printed circuit board 7 may include, for example, the second conductive pattern 14 and the sixth ground pattern G61. The second conductive pattern 14 may be included in the second portion 72 of the printed circuit board 7 . The second conductive pattern 14 may include a first opening 701 corresponding to the first microphone 810 (see FIG. 10 ). The sixth ground pattern GP61 may be included in the first portion 71 of the printed circuit board 7 . The part included in the first part 71 of the printed circuit board 7 among the sixth layers 86 is, for example, although not shown by reference numerals, a touch sensor IC using a conductive adhesive material (eg, solder). It may include conductive pad parts for disposing electronic components such as 532 . A portion included in the first portion 71 of the sixth layer 86 may include one or more signal line patterns, although not indicated by reference numerals. For example, a portion included in the first portion 71 of the sixth layer 86 may include a plurality of signal line patterns used to electrically connect a plurality of electronic components disposed in the first portion 71. there is.

According to one embodiment, a portion included in the third portion 73 of the sixth layer 86 may be implemented as a non-ground region substantially free of a ground pattern.

According to one embodiment, the portion included in the second portion 72 of the sixth layer 86 may include a hole 702f for the second opening 702 (see FIG. 8 ).

According to an embodiment, the first portion 71 of the printed circuit board 7 includes a plurality of conductive vias (eg, PTH, LVH, BVH, or PTH) electrically connecting a plurality of ground patterns included in different layers. stacked vias). The one or more conductive vias included in the first portion 71 may electrically connect at least two of the plurality of ground patterns GP11, GP21, GP31, GP41, GP51, and GP61 included in the first ground structure G1. can The first ground structure G1 may have a structure including a plurality of ground patterns GP11, GP21, GP31, GP41, GP51, and GP61 and a plurality of conductive vias.

According to an embodiment, the second portion 72 of the printed circuit board 7 includes a plurality of conductive vias (eg, PTH, LVH, BVH, or PTH) electrically connecting a plurality of ground patterns included in different layers. stacked vias). One or more conductive vias included in the second portion 72 may electrically connect at least two or more of the plurality of ground patterns GP12 , GP22 , GP32 , and GP42 included in the second ground structure G2 . The second ground structure G2 may have a structure including a plurality of ground patterns GP11, GP21, GP31, GP41, GP51, and GP61 and a plurality of conductive vias.

According to one embodiment, when the third portion 73 is bent and disposed, since via damage (eg, via crack) may occur, the third portion 73 of the printed circuit board 7 A plurality of conductive vias electrically connecting ground patterns GP33 and GP43 of different layers may not be included. In some embodiments, the third portion 73 may include one or more conductive vias provided at a location where damage to the vias does not substantially occur when the third portion 73 is bent and disposed.

According to an exemplary embodiment, the second part 72 of the printed circuit board 7 includes the ground pattern GP32 included in the third ground pattern GP3 of the third layer 83 and the fourth layer 84. A conductive via electrically connecting the ground pattern GP42 included in the fourth ground pattern GP4 may not be included. In the second portion 72, the ground pattern GP32 included in the third ground pattern GP3 of the third layer 83 and the ground pattern included in the fourth ground pattern GP4 of the fourth layer 84 (GP42) can be electrically isolated. In the second portion 72, the ground pattern G12 of the first layer 81, the ground pattern G22 of the second layer 82, and the ground pattern G32 of the third layer 83 are one or more They may be electrically connected through conductive vias. In one embodiment, the ground pattern G12 of the first layer 81, the ground pattern G22 of the second layer 82, and the ground pattern of the third layer 83 (of the second ground structure G2) G32) (hereinafter referred to as 'at least one third conductive pattern') may be electrically connected to the second electrical path EP2 where the matching circuit 820 is disposed. The radiation circuit (eg, a circuit including the first electrical path EP1 and the second conductive pattern 14) is connected to the second ground structure G2 through the second electrical path EP2 where the matching circuit 820 is disposed. It may be electrically connected to at least one third conductive pattern of the. In the second electrical path EP2 and the matching circuit 820 disposed on the second electrical path EP2, at least a portion of the ground structure G included in the printed circuit board 7 is connected to the second conductive pattern 14. It can contribute to being used as an antenna ground (or antenna ground area) for The second electrical path EP2 and the matching circuit 820 disposed on the second electrical path EP2 may reinforce the ground connection between the radiation circuit and the ground structure G of the printed circuit board 7 . At least one third conductive pattern of the second portion 72 is connected to the first ground structure ( G1) can be electrically connected. In the ground pattern GP33 included in the third part 73 of the third layer 83, the antenna ground for the radiation circuit is not limited to at least one third conductive pattern of the second part 72, and the second The antenna ground may be expanded or strengthened to further include at least one third conductive pattern of the portion 72 and the first ground structure G1 of the first portion 71 . In some embodiments, the ground pattern GP32 included in the second portion 72 of the third layer 83 and the ground pattern GP42 included in the second portion 72 of the fourth layer 84 are one. It can be electrically connected through the above conductive vias, and the antenna ground can be further expanded or strengthened. Of the first ground structure G1 of the first part 71, the part used as the antenna ground may be omitted or added to a certain ground pattern, electrical connection between two ground patterns of different layers, or different layers. Depending on the electrical separation between any two ground patterns, it is not limited to the illustrated example and may vary. Of the second ground structure G2 of the second part 72, the part used as the antenna ground may be omitted or added to a certain ground pattern, electrical connection between any two ground patterns of different layers, or different layers. Depending on the electrical separation between any two ground patterns, it is not limited to the illustrated example and may vary. Of the third ground structure G3 of the third portion 73, the portion used as the antenna ground may be omitted or added to a certain ground pattern, electrical connection between two ground patterns of different layers, or different layers. Depending on the electrical separation between any two ground patterns, it is not limited to the illustrated example and may vary.

According to one embodiment, the matching circuit 820 transmits and/or emits an electromagnetic signal in a selected or specified frequency band (eg, a circuit including the first electrical path EP1 and the second conductive pattern 14). For , at least a part of the ground structure (G) included in the printed circuit board (7) may have a device value that allows it to operate better as an antenna ground. The matching circuit 820 is capable of matching the impedance (eg, characteristic impedance) between the transmission line and the load to enable maximum power transmission (or minimization of power loss) or efficient signal transmission by reducing reflection of the electromagnetic signal. It can have elemental values. In one embodiment, matching circuit 820 may include an inductor (eg, a shunt inductor).

According to an embodiment, the second electrical path EP2 and the matching circuit 820 disposed on the second electrical path EP2 may be a radiation circuit (eg, the first electrical path EP1 and the second conductive pattern 14). The second portion 72 of the printed circuit board 7 and at least one electronic component (eg: An effect of the first microphone 810 on the radiation circuit may be reduced. The second electrical path EP2 and the matching circuit 820 disposed in the second electrical path EP2 reinforce the ground connection between the radiation circuit and the ground structure of the printed circuit board 7 to ensure isolation of the radiation circuit. can contribute to

According to an embodiment, when the communication module 590 provides radiation current (or electromagnetic signal) to the first electrical path EP1, a portion of the radiation current may flow to the second conductive pattern 14, and Part of the current may flow to the ground structure G of the printed circuit board 7 through the second electrical path EP2 where the matching circuit 820 is disposed. The second conductive pattern 14 may operate as a first radiation region (or first radiation portion) having a radiation current distribution that forms a radiation field (or electric field). At least a portion of the second ground structure G included in the second portion 72 of the printed circuit board 7 (eg, ground pattern G12, ground pattern G22, and ground pattern G32) is a radiation field It can operate as a second radiation region (or second radiation part) having a classification of radiation current forming . The second electrical path EP2 and the matching circuit 820 disposed on the second electrical path EP2 match impedances (eg, characteristic impedance) to reduce interference from the second radiation area to the first radiation area, Electromagnetic coupling characteristics (or electromagnetic coupling effects) with the first radiation region may be improved so as to secure antenna radiation performance in a selected or designated frequency band. In the case of the comparison example in which the second electrical path EP2 and the matching circuit 820 are omitted, the radiation circuit (eg, the circuit including the first electrical path EP1 and the second conductive pattern 14) is a substantial radiation area ( 902). An embodiment of this document including the second electrical path EP2 and the matching circuit 820 disposed in the second electrical path EP2 may have a more expanded radiation area 901 than the comparative example, and thus the antenna It may be more advantageous to secure radiation performance or radio transmission/reception performance. An embodiment of the present document can reduce the influence (or interference) of the second part 72 of the printed circuit board 7 and at least one electronic component disposed thereon on the radiation circuit compared to the comparative example.

According to an embodiment of the present document, an electronic device (eg, the electronic device 1 of FIG. 2 ) may include a printed circuit board (eg, the printed circuit board 7 of FIG. 8 ). The printed circuit board includes a first part (eg, first part 71 in FIG. 8 ), a second part (eg, second part 72 in FIG. 8 ), and the first part and the second part. It may include a third part (eg, the third part 73 of FIG. 8) to connect. The first portion may include a first surface of the printed circuit board (eg, first surface 801 in FIG. 8 ) and a second surface disposed opposite to the first surface (eg, second surface in FIG. 8 ). (802)). The second part may include a third surface of the printed circuit board (eg, the third surface 803 in FIG. 8 ) and a fourth surface disposed opposite to the third surface (eg, the fourth surface in FIG. 8 ). (804)) can be formed. The electronic device may include a microphone (eg, the first microphone 810 of FIG. 8 ) disposed on the first surface. The electronic device may include a conductive pattern (eg, the second conductive pattern 14 of FIG. 8 ) disposed on the first surface. The conductive pattern may surround at least a portion of the microphone. The electronic device may include a wireless communication circuit (eg, the communication module 590 of FIG. 8) disposed in the first part. The printed circuit board may include a first electrical path (eg, the first electrical path EP1 of FIG. 8 ) and a second electrical path (eg, the second electrical path EP2 of FIG. 8 ). The first electrical path may electrically connect the conductive pattern and the wireless communication circuit. The second electrical path may be included in the second part. The second electrical path may electrically connect a ground area included in the printed circuit board (eg, the ground structure G of FIG. 9 ) to the first electrical path or the conductive pattern.

According to an embodiment of the present document, the electronic device may include the second electrical path (eg, the second electrical path EP2 of FIG. 8 ) on the first surface (eg, the first surface 801 of FIG. 8 ). A matching circuit (eg, the matching circuit 820 of FIG. 8 ) disposed on may be further included.

According to an embodiment of the present document, the matching circuit (eg, the matching circuit 820 of FIG. 8 ) may include an inductor.

According to one embodiment of the present document, at least a part (eg, at least a part of the second ground structure G2 of FIG. 9) included in the second part of the ground region is the matching circuit (eg, the matching of FIG. 9 The circuit 820) is electrically connected to the second electrical path (eg, the second electrical path EP2 of FIG. 9) on which the conductive pattern (eg, the second conductive pattern 14 of FIG. 9) is disposed. It can act as an antenna radiator with.

According to one embodiment of the present document, the ground area may include a first ground area included in the first part (eg, at least a part of the first ground structure G1 of FIG. 9 ). The ground area may include a second ground area included in the second portion (eg, at least a portion of the second ground structure G2 of FIG. 9 ). The ground area may include a third ground area included in the third portion and connecting the first ground area and the second ground area (eg, at least a part of the third ground structure G3 of FIG. 9 ). there is. The second electrical path (eg, second electrical path EP2 of FIG. 9 ) may be the first electrical path (eg, first electrical path EP1 of FIG. 9 ) or the conductive pattern (eg, second electrical path EP2 of FIG. 9 ). The second conductive pattern 14 may be electrically connected to the third ground region.

According to one embodiment of the present document, the second part (eg, the second part 72 of FIG. 8 ) may further include another ground area (eg, the ground pattern G12 or G22 of FIG. 9 ). The other ground area may be included in a layer different from the second ground area (eg, the ground pattern G32 of FIG. 9) and may be electrically connected to the second ground area through a conductive via. there is.

According to one embodiment of the present document, the first part (eg, the first part 71 of FIG. 8 ) is another ground area (eg, the ground pattern (G11, G21, G41, G51, or G61 of FIG. 9 )) ) may be further included. The other ground area may be included in a different layer than the first ground area (eg, the ground pattern G31 of FIG. 9 ). The other ground area may be electrically connected to the first ground area through a conductive via.

According to one embodiment of the present document, the printed circuit board includes a plurality of layers (eg, a first layer 81, a second layer 82, a third layer 83, and a fourth layer 84 in FIG. 8). , a fifth layer 85, and a sixth layer 86). The first electrical path (eg, the first electrical path EP1 in FIG. 9 ) is closest to or is closest to the first surface (eg, the first surface 801 in FIG. 8 ) among the plurality of layers. may include a portion (eg, the first signal line pattern SP of FIG. 10) disposed on a layer forming the (eg, the first layer 81 of FIG. 8).

According to one embodiment of the present document, the third part (eg, the third part 73 of FIG. 8 ) is the first part (eg, the first part 71 of FIG. 8 ) or the second part (eg, the third part 73 of FIG. 8 ). Example: It may have greater flexibility than the second portion 72 of FIG. 8 .

According to one embodiment of the present document, the third part (eg, the third part 73 of FIG. 8 ) is the first part (eg, the first part 71 of FIG. 8 ) or the second part (eg, the third part 73 of FIG. 8 ). Example: It may have a smaller thickness or fewer layers than the second portion 72 of FIG. 8 ).

According to one embodiment of the present document, the third part (eg, the third part 73 of FIG. 8 ) is bent to obtain the first surface (eg, the first surface 801 of FIG. 8 ) and the third part. The surfaces (eg, the third surface 803 of FIG. 8 ) may face each other at a distance from each other. The microphone (eg, the first microphone 810 of FIG. 8 ) and the conductive pattern (eg, the second conductive pattern 14 of FIG. 8 ) may be positioned between the first surface and the third surface.

According to an embodiment of the present document, the second part (eg, the second part 72 of FIG. 8 ) corresponds to the microphone (eg, the first microphone 810 of FIG. 8 ) on the first surface (eg, the second part 72 of FIG. 8 ). Example: Includes an opening (eg, second opening 802 in FIG. 8 ) penetrating between the first surface 801 in FIG. 8 and the second surface (eg, second surface 802 in FIG. 8 ). can do.

According to an embodiment of the present document, the electronic device includes a touch sensing circuit (eg, the first conductive pattern 13 of FIG. 8 ) disposed on the second surface (eg, the second surface 802 of FIG. 8 ). may further include. The electronic device may further include a touch sensor IC (eg, the touch sensor IC 532 of FIG. 8 ) disposed in the first part. The touch sensor IC may be electrically connected to the touch sensing circuit.

According to an embodiment of the present document, the conductive pattern (eg, the second conductive pattern 14 of FIG. 8 ), when viewed from above the first surface (eg, the first surface 801 of FIG. 8 ), It may not overlap with the touch sensing circuit (eg, the first conductive pattern 13 of FIG. 8 ).

According to one embodiment of this document, the electronic device may include an ear wearable device.

Embodiments disclosed in this document and drawings are only presented as specific examples to easily explain technical contents according to the embodiments and help understanding of the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of various embodiments of this document should be construed as including changes or modifications other than the embodiments disclosed herein within the scope of various embodiments of this document.

800: cross-sectional structure
7: printed circuit board
71: first part
72: second part
73: third part
7A: Front
7B: rear
801 First side
802: second side
803: 3rd side
804: 4th side
510: processor
590: communication module
532: touch sensor IC
13: first conductive pattern
14: second conductive pattern
810: first microphone
820: matching circuit
EP1: first electrical path
EP2: Second Electrical Path
EP3: Third Electrical Path
EP4: Fourth Electrical Path

Claims (15)

In electronic devices,
A printed circuit board comprising a first part, a second part, and a third part connecting the first part and the second part;
the first portion includes a first side of the printed circuit board and a second side disposed opposite to the first side; and
the second portion includes a third surface of the printed circuit board and a fourth surface disposed opposite to the third surface;
a microphone disposed on the first surface;
a conductive pattern disposed on the first surface and at least partially surrounding the microphone; and
a wireless communication circuit disposed in the first portion;
The printed circuit board,
a first electrical path electrically connecting the conductive pattern and the wireless communication circuit; and
An electronic device comprising: electrically connecting a ground area included in the printed circuit board to the first electrical path or the conductive pattern, and including a second electrical path included in the second part. According to claim 1,
The electronic device further comprises a matching circuit disposed in the second electrical path on the first surface. According to claim 2,
The electronic device of claim 1 , wherein the matching circuit includes an inductor. According to claim 2,
At least a portion of the ground region included in the second portion is electrically connected to the second electrical path where the matching circuit is disposed, and operates as an antenna radiator together with the conductive pattern. According to claim 1,
The ground area includes a first ground area included in the first part, a second ground area included in the second part, and a third part included in the first part and connecting the first ground area and the second ground area. Including a third ground area,
The second electrical path electrically connects the first electrical path or the conductive pattern to the third ground region. According to claim 5,
The second part,
The electronic device further includes another ground area included in a layer different from the second ground area and electrically connected to the second ground area through a conductive via. According to claim 5,
The first part,
The electronic device further includes another ground area included in a layer different from the first ground area and electrically connected to the first ground area through a conductive via. According to claim 1,
The printed circuit board includes a plurality of layers,
The first electrical path includes a portion of the plurality of layers closest to the first surface or disposed on a layer forming the first surface. According to claim 1,
The third part has greater flexibility than the first part or the second part. According to claim 1,
The electronic device of claim 1 , wherein the third portion has a smaller thickness or a smaller number of layers than the first portion or the second portion. According to claim 1,
The third part is bent so that the first surface and the third surface face each other at a distance from each other,
The microphone and the conductive pattern are positioned between the first surface and the third surface. According to claim 1,
The second part includes an opening penetrating between the first surface and the second surface corresponding to the microphone. According to claim 1,
a touch sensing circuit disposed on the second surface; and
The electronic device further includes a touch sensor integrated circuit (IC) disposed on the first part and electrically connected to the touch sensing circuit. According to claim 13,
The conductive pattern does not overlap the touch sensing circuit when viewed from the top of the first surface. According to claim 1,
The electronic device includes an ear wearable device.

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