KR20230081306A - Indirective evaporative cooling apparatus and cooling system including the same - Google Patents

Abstract

The present invention relates to an indirect evaporative cooling device and a cooling system including the same, and more particularly, to an indirect evaporative cooling device including a plurality of heat transfer modules and a cooling system including the same.
According to the present invention, it is possible to provide an indirect evaporative cooling device including a heat transfer module, maximizing cooling efficiency and space efficiency and minimizing manufacturing cost, and a cooling system including the same.

Description

Indirect evaporative cooling apparatus and cooling system including the same {Indirect evaporative cooling apparatus and cooling system including the same}

The present invention relates to an indirect evaporative cooling device and a cooling system including the same, and more particularly, to an indirect evaporative cooling device including a plurality of heat transfer modules and a cooling system including the same.

In general, an evaporative cooling device is a cooling device using latent heat of vaporization of a refrigerant, and when the refrigerant evaporates, it absorbs heat equivalent to the heat of vaporization from the surrounding air to cool the surrounding air. Such an evaporative cooling device has the advantage of being eco-friendly because it has higher energy efficiency than a general air conditioner using a refrigeration cycle consisting of a compressor, a condenser, an expander, and an evaporator, and is economical due to a simple configuration. The refrigerant mainly uses water.

Evaporative cooling devices are largely divided into direct evaporative cooling devices and indirect evaporative cooling devices, depending on whether or not a cooling object fluid to be cooled is in contact with a refrigerant. In the direct evaporative cooling system, a fluid to be cooled and a refrigerant are in direct contact.

An indirect evaporative cooling system is an evaporative cooling system in which a fluid to be cooled does not come into contact with a refrigerant. Specifically, the working fluid is cooled after evaporating the refrigerant in contact with the refrigerant, and the fluid to be cooled is cooled by exchanging heat with the cooled working fluid. Unlike a direct evaporative cooling device, such an indirect evaporative cooling device has an advantage in providing a more comfortable environment to users because there is no change in humidity or the like even when cooling is performed.

However, in the case of an indirect evaporative cooling system, there is a problem in that heat transfer efficiency between a working fluid and a fluid to be cooled is low. In addition, there is a problem in that a sufficient space is required to inject the refrigerant into the working fluid, so that space efficiency of the device is reduced and production and installation costs are unnecessarily increased.

Japanese registered patent 03171462

Based on the above technical background, the present invention provides an indirect evaporative cooling device capable of maximizing cooling efficiency and space efficiency and minimizing manufacturing cost in an indirect evaporative cooling device and a cooling system including the same.

An indirect evaporative cooling device according to an embodiment of the present invention is an indirect evaporative cooling device including a plurality of heat transfer modules having a first module and a second module disposed symmetrically facing the first module, The first module and the second module each include a heat transfer plate, a hydrophilic member, a hydrophobic member, and a mesh member. The heat transfer plate conducts heat transfer. The hydrophilic member is disposed to face the heat transfer plate and is a porous material capable of absorbing water. The hydrophobic member is disposed facing the hydrophilic member on the opposite side of the heat transfer plate, and the water absorbed by the hydrophilic member is supplied and evaporated by the working fluid. The mesh member is disposed facing the hydrophobic member on the opposite side of the hydrophilic member to support the hydrophilic member and the hydrophobic member. The heat transfer module is formed with a water supply passage through which water is supplied, a first passage through which a working fluid flows, and a second passage through which a fluid to be cooled flows.

Also, the first passage may be formed between the mesh members of the first module and the second module, respectively.

In addition, in any two heat transfer modules adjacent to each other, the second flow path is the heat transfer plate closest to the other heat transfer module among the heat transfer plates of any one heat transfer module, and among the heat transfer plates of the other heat transfer module. It may be formed between any one heat transfer module and the closest heat transfer plate.

In addition, a plurality of through holes may be formed in the mesh member.

In addition, the mesh member may have the same shape as the heat transfer plate except for the through hole.

In addition, the heat transfer plate has a first hole through which the fluid to be cooled, a second hole through which the working fluid passes, and a third hole through which water passes, and the mesh member has a fourth hole through which the fluid to be cooled passes, a working fluid A fifth hole through which water passes and a sixth hole through which water passes are formed, and the first hole, second hole, and third hole are formed at positions corresponding to the fourth, fifth, and sixth holes, respectively. It can be.

In addition, the hydrophilic member may be exposed to the water supply passage, and the hydrophobic member may be disposed to be spaced apart from the water supply passage.

In addition, a protrusion protruding toward the water supply passage may be formed on the hydrophilic member.

In addition, a leak prevention member is disposed at the edge of the hydrophobic member, and the hydrophobic member and the water supply passage may be spaced apart from each other by the leak prevention member.

In addition, in each of the first module and the second module, the heat transfer plate, the hydrophilic member, the hydrophobic member, and the mesh member are disposed to be in close contact with each other, and the mesh member of the first module and the mesh member of the second module are in point contact with each other. It can be arranged so that a space is formed in.

In addition, in the first module, first wrinkles are formed on the upper and lower surfaces of the heat transfer plate, and second wrinkles corresponding to the first wrinkles are formed on the upper and lower surfaces of the mesh member. Having the same configuration, the second corrugated parts of the first module and the second corrugated parts of the second module may be arranged to face each other while being crossed.

In addition, the first sealer disposed on the heat transfer plate in the first module but disposed on the opposite side of the hydrophilic member, the second sealer disposed between the heat transfer plate and the mesh member in the first module, and the mesh member of the first module and the second module A third sealer disposed between the mesh members and a fourth sealer disposed between the mesh members and the heat transfer plate in the second module may be included.

In addition, the working fluid is air, the outlet of the first flow path communicates with the outdoors, the fluid to be cooled is water or air, and the inlet and outlet of the second flow path communicate with the room.

In addition, some of the indoor air may be introduced into the second passage, and the remaining part of the indoor air may be introduced into the first passage.

Also, indoor air may flow in the second flow passage, and at least a portion of the indoor air discharged from the second flow passage may be introduced into the first flow passage.

An indirect evaporative cooling system according to an embodiment of the present invention includes an indirect evaporative cooling device according to an embodiment of the present invention, a first pipe, a second pipe, a third pipe, and a fourth pipe. The inlet of the first pipe communicates with the outdoors, and the outlet communicates with the inlet of the first flow path. The inlet of the second pipe communicates with the room, and the outlet communicates with the inlet of the second flow path. The inlet of the third pipe communicates with the outlet of the second flow path, and the outlet communicates with the room. The inlet of the fourth pipe communicates with the outlet of the first flow path, and the outlet communicates with the outdoors.

In addition, the first pipe includes a 1-1 pipe whose inlet communicates with the outdoors and a 1-2 pipe whose outlet communicates with the inlet of the first flow path, and the second pipe branches a portion of the fluid. It is connected to the pass pipe, and a first switching device is disposed between the outlet of the 1-1 pipe, the inlet of the 1-2 pipe, and the bypass pipe, and the first switching device is connected to the 1-2 pipe. 1 pipe or bypass pipe can be selectively communicated.

In addition, the first pipe includes a 1-1 pipe whose inlet communicates with the outdoors and a 1-2 pipe whose outlet communicates with the inlet of the first flow passage, and the third pipe has an inlet connected to the second flow passage. It includes a 3-1 pipe communicating with the outlet and a 3-2 pipe communicating with the room, between the outlet of the 1-1 pipe and the inlet of the 1-2 pipe, and between the 3-1 pipe. A second switching device is disposed between the outlet and the inlet of the 3-2 pipe, and the second switching device may selectively connect the 1-1 pipe or the 3-1 pipe to the 1-2 pipe.

An indirect evaporative cooling device and a cooling system including the same according to the present invention can maximize cooling efficiency and space efficiency and minimize manufacturing cost by including a heat transfer module.

1 is a perspective view showing a cooling device according to a first embodiment of the present invention.
2 is an enlarged and disassembled view of the heat transfer module of the cooling device according to the first embodiment of the present invention.
3 is a cross-sectional side view of FIG. 1 taken along line AA′.
4 is a perspective view showing only the heat transfer plate separately.
5 is a perspective view showing only the mesh member separately.
6 is a cross-sectional side view of FIG. 1 taken along line BB'.
7 is a conceptual diagram showing a cooling device and a cooling system including the same according to a first embodiment of the present invention.
8 is a conceptual diagram showing a cooling device and a cooling system including the same according to a second embodiment of the present invention.
9 is a conceptual diagram showing a cooling device and a cooling system including the same according to a third embodiment of the present invention.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to completely inform the person who has the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numbers designate like elements throughout the specification.

Hereinafter, with reference to the accompanying drawings, an indirect evaporative cooling device according to the present invention and a cooling system including the same will be described.

1 is a perspective view showing a cooling device according to a first embodiment of the present invention, FIG. 2 is an enlarged and disassembled view of a heat transfer module of the cooling device according to a first embodiment of the present invention, and FIG. A side cross-sectional view taken along the line AA', Figure 4 is a perspective view showing only the heat transfer plate separately, Figure 5 is a perspective view showing only the mesh member separately, Figure 6 is a side cross-sectional view cut along the line BB' in Fig. 1, 7 is a conceptual diagram showing a cooling device and a cooling system including the same according to a first embodiment of the present invention.

Hereinafter, with reference to FIGS. 1 to 4, an indirect evaporative cooling device 1000 according to a first embodiment of the present invention will be described in detail. The indirect evaporative cooling device 1000 according to the present invention includes a plurality of heat transfer modules M. The thermal shear module includes a first module M1 and a second module M2, respectively. Each of the first module M1 and the second module M2 includes a heat transfer plate 1100, a hydrophilic member 1200, a hydrophobic member 1300, and a mesh member 1400.

In the heat transfer plate 1100, heat is transferred. The heat transfer plate 1100 may be formed of a metal material having excellent thermal conductivity. When viewed from above, the heat transfer plate 1100 may have a rectangular plate shape extending substantially in the longitudinal direction. A first hole 1110, a second hole 1120, a third hole 1130, and a first wrinkle portion 1140 may be formed in the heat transfer plate 1100.

The working fluid WF may flow through the first hole 1110 . Two first holes 1110 may be provided in the heat transfer plate 1100 . In this case, each of the first holes 1100 may be formed symmetrically with each other at both ends of the heat transfer plate 1100 in the longitudinal direction.

The fluid to be cooled (OF) may flow in the second hole 1120 . Two second holes 1120 may be provided in the heat transfer plate 1100 . In this case, each of the second holes 1120 may be formed symmetrically with each other at both ends of the heat transfer plate 1100 in the longitudinal direction. The second hole 1120 and the first hole 1110 may be formed in the same shape or replaced with each other.

A fluid such as water (W) may be supplied to the third hole 1130 . Two third holes 1130 may be provided in the heat transfer plate 1100 . In this case, each of the third holes 1130 may be formed symmetrically with each other at both ends of the heat transfer plate 1100 in the longitudinal direction. Also, the third hole 1130 may be disposed between the first hole 1110 and the second hole 1120 .

The third hole 1130 may be formed by additionally processing a heat transfer plate disposed in an existing plate heat exchanger. The above additional processing may be, for example, perforation processing. In this case, there is an advantage in that a new mold does not need to be manufactured in order to manufacture the heat transfer plate 1100 .

The first corrugated portion 1140 is formed at a different location from the first hole 1110 , the second hole 1120 , and the third hole 1130 . A second flow path 1800 through which the fluid to be cooled (OF) flows may be formed in the first corrugated portion 1140 . A plurality of wedges may be sequentially formed in the first corrugated portion 1140, and all of the plurality of wedges may be disposed in one direction. Here, the direction in which the wedges are directed refers to a direction in which crests of the wedges are directed. The first wrinkle portion 1140 may be formed on the upper and lower surfaces of the heat transfer plate 1100, respectively. The first wrinkles 1140 respectively formed on the upper and lower surfaces of the heat transfer plate 1100 may be formed by press-processing the heat transfer plate 1100 . At this time, the shape of the first wrinkled portion 1140 on the lower surface may be formed as if the shape of the first wrinkled portion 1140 on the upper surface is moved in parallel in the thickness direction of the heat transfer plate 1100 .

The hydrophilic member 1200 is disposed on the heat transfer plate 1100. The hydrophilic member 1200 is disposed to face the heat transfer plate 1100. The hydrophilic member 1200 may be disposed in close contact with the heat transfer plate 1100 . The hydrophilic member 1200 may be formed of a material that is both hydrophilic and porous. Due to this, water (W) or the like may be absorbed in the hydrophilic member 1200 . The hydrophilic member 1200 may be made of a membrane material. The hydrophilic member 1200 may be made of a membrane material, provided in the form of a film or sheet, and disposed on the heat transfer plate 1100 . In addition, the hydrophilic member 1200 may be manufactured by coating the heat transfer plate 1100 with a hydrophilic material. In this case, by minimizing the thickness of the hydrophilic member 1200, heat transfer efficiency to the heat transfer plate 1100 may be improved.

The hydrophobic member 1300 is disposed on the hydrophilic member 1200. The hydrophobic member 1300 is disposed to face the hydrophilic member 1200 on the opposite side of the heat transfer plate 1100. The hydrophobic member 1300 may be disposed in close contact with the hydrophilic member 1200. The hydrophobic member 1300 may be formed of a material that is hydrophobic and porous at the same time. Pores are formed in the hydrophobic member 1300 made of a porous material, and a fluid such as air can pass through the pores.

Like the hydrophilic member 1200, the hydrophobic member 1300 may be provided with a porous membrane material, and may also be provided in the form of a film or sheet. Also, like the hydrophilic member 1200, it may be manufactured by coating a hydrophobic material on the hydrophilic member 1200. In this case, evaporation performance of the hydrophobic member 1300 may be further improved, and heat transfer efficiency to the heat transfer plate 1100 may also be improved.

The mesh member 1400 is disposed on the hydrophobic member 1300. The mesh member 1400 is disposed to face the hydrophobic member 1300 on the opposite side of the hydrophilic member 1200. The mesh member 1400 may be disposed in close contact with the hydrophobic member 1300 . A plurality of through holes 1450 may be formed in the mesh member 1400 . The through hole 1450 may be formed to extend vertically. A fluid such as air or water (W) may pass through the through hole 1450 . The mesh member 1400 can stably support and fix the hydrophilic member 1200 and the hydrophobic member 1300 to the heat transfer plate 1100 .

The mesh member 1400 may have the same shape as the heat transfer plate 1100 except for the through hole 1450 . The mesh member 1400 may be manufactured by using the same mold as the heat transfer plate 1100 and then forming a plurality of through holes 1450 in a punching method. The mesh member 1400 may be formed of a material different from that of the heat transfer plate 1100 . For example, the mesh member 1400 may be made of a stainless material that maintains durability even when in contact with water (W) or may be provided with a surface treated with a water repellent coating.

A fourth hole 1410 , a fifth hole 1420 , and a sixth hole 1430 may be formed in the mesh member 1400 . The working fluid WF flows in the fourth hole 1410, the fluid to be cooled (OF) flows in the fifth hole 1420, and a fluid such as water W is supplied in the sixth hole 1430. can The fourth hole 1410, the fifth hole 1420, and the sixth hole 1430 are formed at positions vertically corresponding to the first hole 1110, the second hole 1120, and the third hole 1130, respectively. It can be. Alternatively, the fourth hole 1410, the fifth hole 1420, and the sixth hole 1430 may be formed identically to the first hole 1110, the second hole 1120, and the third hole 1130, respectively. .

A second wrinkle portion 1440 may be formed in the mesh member 1400 . The second corrugated portion 1440 is formed at a different location from the fourth hole 1410 , the fifth hole 1420 , and the sixth hole 1430 . The second wrinkle part 1440 has the same shape as the first wrinkle part 1140 . Like the first pleated portion 1140, the second pleated portion 1440 may be formed on the upper and lower surfaces of the mesh member 1400, respectively. At this time, the second wrinkled part 1440 of the mesh member 1400 is disposed to be inserted into the first wrinkled part 1140 of the heat transfer plate 1100 .

Accordingly, in the first module M1, the heat transfer plate 1100, the hydrophilic member 1200, the hydrophobic member 1300, and the mesh member 1400 may be sequentially disposed in close contact with each other, which is The same is true for the two-module M2.

A water supply passage 1600, a first passage 1700, and a second passage 1800 are formed in the heat transfer module M. The water supply passage 1600 is a passage through which a fluid such as water (W) is supplied. The first flow path 1700 is a flow path through which the working fluid WF flows. The second flow path 1800 is a flow path through which the fluid to be cooled (OF) flows. The water supply passage 1600 may communicate with the third hole 1130 and the sixth hole 1430 . The first passage 1700 may communicate with the second hole 1120 and the fifth hole 1420 . The second passage 1800 may communicate with the first hole 1110 and the fourth hole 1410 .

The first module M1 and the second module M2 are configured identically except for the arrangement structure. The second module M2 may be the same as the first module M1, but may be the same as one obtained by inverting the first module M1 upside down and then rotating the upside down direction by 180 degrees again using the rotation axis.

Accordingly, the direction in which the plurality of wedges are directed in the first corrugated part 1140 and the second corrugated part 1440 of the first module M1 is the first corrugated part 1140 and the second corrugated part 1140 of the second module M1 2 It may be opposite to the direction in which the plurality of wedges are directed in the corrugated portion 1440 .

In each of the first module M1 and the second module M2, the heat transfer plate 1100, the hydrophilic member 1200, the hydrophobic member 1300, and the mesh member 1400 may be placed in close contact with each other. At this time, the mesh member 1400 of the first module (M1) and the mesh member 1400 of the second module (M2) facing each other may be arranged so that a space is formed between them in point contact with each other.

In one heat transfer module M, the second corrugated portion 1440 of the first module M1 and the second corrugated portion 1440 of the second module M2 may face each other. The directions of the wedges of the second corrugation portion 1440 of the first module M1 and the directions of the wedges of the second corrugation portion 1440 of the second module M2 are formed in opposite directions to each other, and are formed to cross each other. can In this case, the second corrugated portion 1440 of the first module M1 and the second corrugated portion 1440 of the second module M2 may be in point contact with each other, and thus a space may be formed therebetween. .

A first flow path 1700 through which the working fluid WF flows may be formed in the space formed between the second corrugated parts 1440 . The first passage 1700 may communicate with the second hole 1120 and the fifth hole 1420 , respectively.

In any two different adjacent heat transfer modules (M), the heat transfer plate 1100 disposed on the side close to the other heat transfer module (M) in any one heat transfer module (M), the other heat transfer module (M) It may be arranged to face each other with the heat transfer plate 1100 disposed on the side close to any one heat transfer module (M).

At this time, in each of the heat transfer modules M, the first corrugated portions 1140 of the heat transfer plates 1100 facing each other may be formed so that the wedges are formed in opposite directions to cross each other. In this case, the first corrugated portion 1140 of one thermal shear module M and the first corrugated portion 1140 of the other heat transfer module M may be in point contact with each other, and thus there is a space between them. can be formed.

A second flow path 1800 through which the fluid to be cooled (OF) flows may be formed in the space formed between the first corrugated parts 1140 . At this time, the second flow path 1800 may communicate with the first hole 1110 and the fourth hole 1410 respectively.

The hydrophilic member 1200 may be disposed to be exposed to the water supply passage 1600 . A protrusion 1210 may be formed on the hydrophilic member 1200 . The protruding portion 1210 is a portion protruding toward the water supply passage 1600 from the end of the hydrophilic member 1200 . Specifically, the protrusion 1210 may protrude between the third hole 1130 and the sixth hole 1430 . The fluid such as water (W) supplied through the third hole 1130 passes through the sixth hole 1430 and comes into contact with the protruding part 1210, so that the fluid such as water (W) flows into the protruding part 1210. can be supplied directly. The fluid such as water (W) supplied to the protruding portion 1210 is absorbed and supplied to the entire hydrophilic member 1200 .

Unlike the hydrophilic member 1200, the hydrophobic member 1300 may be disposed to be spaced apart from the water supply passage 1600. In this case, the hydrophobic member 1300 may be blocked from fluid such as water (W) flowing in the water supply passage 1600 . At this time, a leak prevention member 1550 may be disposed on the hydrophobic member 1300 . The leakage preventing member 1550 may seal the hydrophobic member 1300 from the water supply passage 1600 and separate the hydrophobic member 1300 and the water supply passage 1600 from each other and block each other. The leak prevention member 1550 may be disposed at an edge of the hydrophobic member 1300 . The leak prevention member 1550 may be disposed to surround an edge of the hydrophobic member 1300 . The leak prevention member 1550 may be provided in a strip shape, or may be provided as a member such as an O-ring. In some cases, the leak prevention member 1550 may be replaced with a means such as an adhesive.

A sealer 1500 may be disposed in the heat transfer module M. The sealer 1500 may include a first sealer 1510 , a second sealer 1520 , a third sealer 1530 , and a fourth sealer 1540 . The first sealer 1510 is disposed on the heat transfer plate 1100 in the first module M1 and is disposed on the opposite side of the hydrophilic member 1200. The first sealer 1510 to the fourth sealer 1540 may be manufactured in a gasket method, and may be replaced with means such as an O-ring or adhesive depending on circumstances. By the first sealer 1510 to the fourth sealer 1540, a first flow path 1700 through which the working fluid WF flows, a second flow path 1800 through which the fluid to be cooled (OF) flows, and water (W) ) The water supply passage 1600 through which the etc. flows may be formed.

The first sealer 1510 includes the 1-1 sealer 1511 covering the central portion of the heat transfer plate 1100 where the first wrinkle portion 1140 is formed and the first hole 1110 and the third hole 1130. A 1-2 sealer 1512 is included.

The second sealer 1520 is disposed between the heat transfer plate 1100 and the mesh member 1400 in the first module M1. The second sealer 1520 includes the 2-1 sealer 1521 covering the fourth hole 1410, the 2-2 sealer 1522 covering the fifth hole 1420, the sixth hole 1430, and A second-third sealer 1523 surrounding the second corrugated portion 1440 and the through holes 1450 is included.

The third sealer 1530 is disposed between the mesh member 1400 of the first module M1 and the mesh member 1400 of the second module M2. The third sealer 1530 includes the 3-1 sealer 1531 covering the fifth hole 1420, the second corrugated portion 1440 and the through hole 1450, and the 3-1 sealer 1531 covering the 6th hole 1430. 2 sealer 1532.

The fourth sealer 1540 is disposed between the mesh member 1400 and the heat transfer plate 1100 in the second module M2. The fourth sealer 1540 includes the 4-1 sealer 1541 covering the first hole 1110, the 4-2 sealer 1542 covering the second hole 1120, and the first wrinkle portion 1140. and a 4-3 sealer 1543 surrounding the central portion of the heat transfer plate 1100 and the third hole 1130.

A portion of the fluid to be cooled (OF) flowing into the first hole 1110 of the first module M1 flows on the heat transfer plate 1100 by the 1-1 sealer 1511, and the remaining portion flows through the first hole 1110, and passes through the fourth hole 1410 surrounded by the 2-1 sealer 1521. The fluid to be cooled (OF) passing through the fourth hole 1410 sequentially passes through the fourth hole 1410 and the first hole 1110 of the second module M2. Some of the fluid to be cooled (OF) passing through the second module (M2) flows between other heat transfer modules (M) adjacent to each other.

The working fluid WF introduced into the second hole 1120 of the first module M1 passes through the second hole 1120 and passes through the fifth hole 1420 surrounded by the 2-2 sealer 1522. pass through A portion of the working fluid WF passing through the fifth hole 1420 is transferred to the mesh member 1400 of the first module M1 and the mesh member 1400 of the second module M2 by the 3-1 sealer 1531 ( 1400), and the remaining part flows into the second hole 1120 of the second module M2 surrounded by the 4-2 sealer 1542.

The water W introduced into the third hole 1130 of the first module M1 passes through the third hole 1130 surrounded by the first and second sealers 1512 . A part of the fluid such as water (W) passing through the third hole 1130 is absorbed by the hydrophilic member 1200 of the first module M1. The fluid such as water (W) absorbed by the hydrophilic member 1200 is supplied to the hydrophobic member 1300, and the fluid such as water (W) supplied to the hydrophobic member 1300 is evaporated by the working fluid WF. do. In this process, the working fluid WF loses heat equal to the latent heat of evaporation of the fluid, such as water W, and is cooled. The cooled working fluid WF exchanges heat with the fluid to be cooled (OF) flowing between two heat transfer modules M adjacent to each other. The fluid to be cooled (OF) is cooled by the already cooled working fluid (WF) in the heat exchange process.

In the above and below, a fluid such as water (W) is supplied to the hydrophilic member 1200 through the water supply passage 1600, and the fluid such as water (W) supplied to the hydrophilic member 1200 is supplied to the hydrophobic member 1300. It was explained that it met with the working fluid (WF) and evaporated. However, this is only an example of the indirect evaporative cooling device 1000 according to the present invention, and in some cases, a fluid such as water W supplied to the hydrophilic member 1200 through the water supply passage 1600 evaporates. It can be replaced with other possible liquid state fluids. For example, a fluid such as water (W) supplied from the water supply passage 1600 to the hydrophilic member 1200 may be replaced with a fluid such as ethanol in a liquid state. In this case, the liquid state fluid is supplied to the hydrophilic member 1200, and the liquid state fluid supplied to the hydrophilic member 1200 meets the working fluid WF in the hydrophobic member 1300 and evaporates.

Also, in the above and below, the working fluid WF may be air. However, the working fluid WF is not limited thereto, and any liquid in a gaseous state capable of evaporating a fluid in a liquid state such as water W supplied from the water supply passage 1600 to the hydrophilic member 1200 may be used. can also be replaced. Also, the fluid to be cooled (OF) may be water (W) or air. However, the fluid to be cooled (OF) is not limited thereto, and may be replaced with another fluid in a liquid or gaseous state capable of exchanging heat with the working fluid (WF) through the heat transfer plate 1100.

Hereinafter, referring to FIG. 7, an indirect evaporative cooling system according to a first embodiment of the present invention will be described in detail. The indirect evaporative cooling system according to the first embodiment of the present invention includes the indirect evaporative cooling device according to the first embodiment of the present invention, and a first pipe, a second pipe, a third pipe, and a fourth pipe.

The indirect evaporative cooling device 1000 is disposed in the room (I). The first pipe 2100 is a pipe in which the inlet I communicates with the outdoors O and the outlet communicates with the inlet of the first flow path 1700 . That is, outdoor (O) air is introduced into the inlet of the first pipe 2100, and outdoor (O) air introduced into the first pipe 2100 is discharged through an outlet and introduced into the first flow path 1700.

The second pipe 2200 is a pipe whose inlet communicates with the room I and whose outlet communicates with the inlet of the second flow path 1800 . That is, indoor (I) air is introduced into the inlet of the second pipe 2200, and indoor (I) air introduced into the second pipe 2200 is discharged through the outlet and introduced into the second flow path 1800.

The third pipe 2300 is a pipe whose inlet communicates with the outlet of the second flow passage 1800 and whose outlet communicates with the room I. That is, the cooled room (I) air discharged from the outlet of the second flow path 1800 (the fluid to be cooled (OF) that has been cooled) is introduced into the inlet of the third pipe 2300, and the third pipe 2300 Indoor (I) air introduced into is discharged through the outlet and supplied to the room.

The fourth pipe 2400 is a pipe whose inlet communicates with the outlet of the first flow passage 1700 and whose outlet communicates with the outdoors (O). That is, outdoor (O) air (the working fluid (WF) that has undergone the evaporation process of water) discharged from the outlet of the first flow path 1700 is introduced into the inlet of the fourth pipe 2400, and is passed through the fourth pipe 2400. Introduced outdoor (O) air is discharged to the outdoors (O) through the outlet.

8 is a conceptual diagram showing an indirect evaporative cooling device and a cooling system including the same according to a second embodiment of the present invention.

Referring to FIG. 8, an indirect evaporative cooling device 1000 according to a second embodiment of the present invention will be described. The configuration of the indirect evaporative cooling device 1000 according to the second embodiment of the present invention, except for the first flow passage 1700 and the second flow passage 1800, indirect evaporation according to the first embodiment of the present invention Since it is the same as the configuration of the cooling device 1000, a detailed description thereof will be omitted.

In the indirect evaporative cooling device 1000 according to the second embodiment of the present invention, air in the room I may be introduced from the inlet of the first flow path 1700 . In this case, the indoor (I) air flowing into the inlet of the first flow path 1700 may be bypassed by some of the indoor (I) air to flow into the second flow path 1800 .

If the working fluid WF flowing into the first flow path 1700 is humid outdoor (O) air, evaporation in the first flow path 1700 cannot be performed smoothly, and thus cooling efficiency is reduced. In order to prevent such a decrease in cooling efficiency, fluid in a relatively dry state must flow into the first flow path 1700 . In general, even when outdoor (O) air is humid, indoor (I) air remains drier than outdoor (O) air. Therefore, when relatively dry indoor (I) air is introduced into the first flow path (1700) instead of humid outdoor (O) air, even if the outdoor (O) environment is humid, the cooling efficiency of the cooling device 1000 can be prevented from being lowered. It can be effective.

Hereinafter, referring to FIG. 8, a cooling system 2000 including an indirect evaporative cooling device 1000 according to a second embodiment of the present invention will be described. The configuration of the cooling system 2000 according to the second embodiment of the present invention is the cooling system 2000 according to the first embodiment of the present invention, except for the first pipe 2100 and the second pipe 2200. Since it is the same as the configuration of , a detailed description thereof will be omitted.

The cooling system 2000 according to the second embodiment of the present invention includes the indirect evaporative cooling device 1000, the first pipe 2100, the second pipe 2200, and the third pipe according to the second embodiment of the present invention. 2300, a fourth pipe 2400, a first switching device 2500, and a bypass pipe 2600.

The first pipe 2100 includes a 1-1 pipe 2110 and a 1-2 pipe 2120 . The inlet of the 1-1 pipe 2110 communicates with the outdoor (O), and the outlet of the 1-2 pipe 2120 communicates with the inlet of the first flow path 1700. A first switching device 2500 is disposed between the 1-1 pipe 2110 and the 1-2 pipe 2120. That is, the first switching device 2500 is disposed to connect the outlet of the 1-1 pipe 2110 and the inlet of the 1-2 pipe 2120 to each other.

A bypass pipe 2600 is disposed between the second pipe 2200 and the first switching device 2500. That is, the inlet of the bypass pipe 2600 communicates with the second pipe 2200, and the outlet of the bypass pipe 2600 communicates with the first switching device 2500.

The first switching device 2500 selectively or together communicates at least one of the inlet of the 1-2 pipe 2120, the outlet of the 1-1 pipe 2110, and the outlet of the bypass pipe 2600. can If the outlet of the 1-1 pipe 2110 communicates with the inlet of the 1-2 pipe 2120, only outdoor (O) air flows into the first pipe 2100, and the first flow path 1700 ) The working fluid (WF) flowing in may be composed of only outdoor (O) air. Unlike this, when the bypass pipe 2600 communicates with the inlet of the first and second pipes 2120, the working fluid WF flowing in the first flow path 1700 may consist only of room (I) air. In addition, when both the 1-1 pipe 2110 and the bypass pipe 2600 are in communication with the inlet of the 1-2 pipe 2120, the working fluid WF flowing in the first flow path 1700 is outdoors. (O) air and indoor (I) air may be mixed air. As described above, when the indoor (I) air flows through the first flow path 1700, as described above, even when the outdoor (O) air is humid, the cooling efficiency of the cooling device 1000 can be prevented from being lowered. there is

9 is a conceptual diagram showing an indirect evaporative cooling device and a cooling system including the same according to a third embodiment of the present invention.

Hereinafter, an indirect evaporative cooling device 1000 according to a third embodiment of the present invention will be described with reference to FIG. 9 . The configuration of the indirect evaporative cooling device 1000 according to the third embodiment of the present invention, except for the first flow path 1700 and the second flow path 1800, indirect evaporation according to the first embodiment of the present invention Since it is the same as the configuration of the cooling device 1000, a detailed description thereof will be omitted.

In the indirect evaporative cooling device 1000 according to the third embodiment of the present invention, the fluid to be cooled (OF) discharged from the second flow path 1800 may flow into the inlet of the first flow path 1700 . In this case, at least a part of the working fluid WF in the first flow path 1700 may be composed of the fluid to be cooled (OF) discharged from the second flow path 1800 .

If the working fluid WF introduced into the first flow path 1700 is high-temperature outdoor (O) air, the heat transfer pipe 1100 may not be cooled sufficiently even if an evaporation process occurs in the first flow path 1700. . Therefore, even when the outdoor (O) air has a high temperature, when at least a part of the indoor (I) air that has already been cooled while passing through the first flow path 1700 flows into the second flow path 1800, the working fluid WF ) There is an effect that the overall temperature of the heat transfer pipe 1100 can be sufficiently cooled. In addition, when the working fluid WF introduced into the first flow path 1700 is composed of only humid outdoor (O) air, evaporation in the first flow path 1700 cannot be performed smoothly, and thus cooling efficiency may be reduced. there is. In order to prevent such a decrease in cooling efficiency, relatively dry indoor (I) air may be used as the working fluid WF, similarly to the indirect evaporative cooling device 1000 according to the second embodiment of the present invention.

Hereinafter, referring to FIG. 9, a cooling system 2000 including an indirect evaporative cooling device 1000 according to a third embodiment of the present invention will be described in detail. The configuration of the cooling system 2000 according to the third embodiment of the present invention is the cooling system 2000 according to the first embodiment of the present invention, except for the first pipe 2100 and the third pipe 2300. Since it is the same as the configuration of , a detailed description thereof will be omitted.

The cooling system 2000 according to the third embodiment of the present invention includes the indirect evaporative cooling device 1000 according to the third embodiment of the present invention, the first pipe 2100, the second pipe 2200, and the third pipe (2300), a fourth pipe (2400), and a second switching device (2700).

The first pipe 2100 includes a 1-1 pipe 2110 and a 1-2 pipe 2120 . The inlet of the 1-1 pipe 2110 communicates with the outdoor (O), and the outlet of the 1-2 pipe 2120 communicates with the inlet of the first flow path 1700. A second switching device 2700 is disposed between the 1-1 pipe 2110 and the 1-2 pipe 2120. That is, the second switching device 2700 is disposed to connect the outlet of the 1-1 pipe 2110 and the inlet of the 1-2 pipe 2120 to each other.

The third pipe 2300 includes the 3-1 pipe 2310 and the 3-2 pipe 2320. The inlet of the 3-1 pipe 2310 communicates with the outlet of the second flow passage 1800, and the outlet of the 3-2 pipe 2320 communicates with the room I. A second switching device 2700 is disposed between the 3-1 pipe 2310 and the 3-2 pipe 2320. That is, the second switching device 2700 connects the outlet of the 1-1 pipe 2110 and the inlet of the 1-2 pipe 2120, and connects the outlet of the 3-1 pipe 2310 and the 3-1 pipe 2310. It is arranged to connect the inlet of the two pipes 2320.

The second switching device 2700 selectively or together at least one of the inlet of the 1-2 pipe 2120, the outlet of the 1-1 pipe 2110 and the outlet of the 3-1 pipe 2310 can confuse If the outlet of the 1-1 pipe 2110 communicates with the inlet of the 1-2 pipe 2120, only outdoor (O) air flows into the first pipe 2100, and the first flow path 1700 ) The working fluid (WF) flowing in may be composed of only outdoor (O) air. In contrast, when the outlet of the 3-1 pipe 2310 communicates with the inlet of the 1-2 pipe 2120, the working fluid WF flowing in the first flow passage 1700 is transferred to the second flow passage 1800. ), and can be made of only indoor (I) air that has undergone a cooling process. In addition, when the outlet of the 1-1 pipe 2110 and the outlet of the 3-1 pipe 2310 are both in communication with the inlet of the 1-2 pipe 2120, the flow flows to the inlet of the first flow path 1700. The working fluid WF may be composed of outdoor (O) air and indoor (I) air. In the above case, as described above, the effect that the outdoor (O) air can be further cooled and the cooling efficiency of the cooling device 1000 can be prevented from being lowered even when the outdoor (O) air is humid. there is.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific embodiments described above, and in the technical field to which the present invention belongs without departing from the gist of the present invention claimed in the claims. Various modifications and implementations are possible by those skilled in the art, and these modifications should not be individually understood from the technical spirit or perspective of the present invention.

1000: indirect evaporative cooling device
M: heat transfer module
M1: first module
M2: 2nd module
1100: electric heating plate
1110: 1st Hall
1120: 2nd hall
1130: 3rd hole
1140: first corrugation
1200: hydrophilic member
1210: protrusion
1300: hydrophobic member
1400: mesh member
1410: 4th hole
1420: 5th hole
1430: 6th hole
1440: second corrugation
1450: through hole
1500: Sealer
1510: 1st sealer
1520: 2nd sealer
1530: 3rd sealer
1540: 4th sealer
1550: leak prevention member
1600: water supply passage
1700: 1st Euro
1800: 2nd Euro
2000 : Indirect evaporative cooling system
2100: 1st pipe
2110: 1-1 pipe
2120: 1-2 pipe
2200: 2nd pipe
2300: 3rd pipe
2310: 3-1 pipe
2320: 3-2 pipe
2400: 4th pipe
2500: 1st switching device
2600: bypass pipe
2700: 2nd switching device
W: water
WF: working fluid
OF: fluid to be cooled
I: Indoor
O: outdoor

Claims (18)

In the indirect evaporative cooling device including a plurality of heat transfer modules having a first module and a second module disposed to symmetrically face the first module, the first module and the second module, respectively,
A heat transfer plate through which heat is transferred;
a hydrophilic member made of a porous material capable of absorbing water and disposed to face the heat transfer plate;
a hydrophobic member disposed opposite to the heat transfer plate to face the hydrophilic member, in which water absorbed by the hydrophilic member is supplied and evaporated by the working fluid; and
A mesh member disposed opposite to the hydrophilic member to face the hydrophobic member and supporting the hydrophilic member and the hydrophobic member,
The indirect evaporative cooling device in which the heat transfer module is formed with a water supply passage through which water is supplied, a first passage through which a working fluid flows, and a second passage through which a fluid to be cooled flows. According to claim 1,
The first flow path is formed between the mesh members of each of the first module and the second module. According to claim 1,
In the second flow path, in any two of the heat transfer modules adjacent to each other,
The heat transfer plate closest to the heat transfer module of the other one of the heat transfer plates of one of the heat transfer modules, and
An indirect evaporative cooling device formed between one of the heat transfer plates of the other heat transfer module and the heat transfer plate closest to one of the heat transfer modules. According to claim 1,
An indirect evaporative cooling device having a plurality of through holes formed in the mesh member. According to claim 4,
The mesh member has the same shape as the heat transfer plate except for the through hole. According to claim 1,
A first hole through which the fluid to be cooled passes, a second hole through which the working fluid passes, and a third hole through which the water passes are formed in the heat transfer plate,
A fourth hole through which the fluid to be cooled passes, a fifth hole through which the working fluid passes, and a sixth hole through which the water passes are formed in the mesh member,
The first hole, the second hole, and the third hole are formed at positions corresponding to the fourth hole, the fifth hole, and the sixth hole, respectively. According to claim 1,
The hydrophilic member is exposed to the water supply passage,
The hydrophobic member is an indirect evaporative cooling device disposed to be spaced apart from the water supply passage. According to claim 7,
An indirect evaporative cooling device having a protrusion protruding toward the water supply passage formed on the hydrophilic member. According to claim 7,
An indirect evaporative cooling device wherein a leak prevention member is disposed at an edge of the hydrophobic member, and the hydrophobic member and the water supply passage are spaced apart from each other by the leak prevention member. According to claim 1,
In each of the first module and the second module, the heat transfer plate, the hydrophilic member, the hydrophobic member, and the mesh member are disposed to be in close contact with each other;
The indirect evaporative cooling device of claim 1 , wherein the mesh member of the first module and the mesh member of the second module are in point contact with each other to form a space therebetween. According to claim 10,
The first module is
First wrinkles are formed on the upper and lower surfaces of the heat transfer plate, and second wrinkles corresponding to the first wrinkles are formed on the upper and lower surfaces of the mesh member.
The second module has the same configuration as the first module, and the second corrugated portion of the first module and the second corrugated portion of the second module are arranged to face each other while being staggered. According to claim 1,
A first sealer disposed on the heat transfer plate in the first module and disposed on the opposite side of the hydrophilic member;
a second sealer disposed between the heat transfer plate and the mesh member in the first module;
a third sealer disposed between the mesh member of the first module and the mesh member of the second module; and
An indirect evaporative cooling device comprising a fourth sealer disposed between the mesh member and the heat transfer plate in the second module. According to claim 1,
The working fluid is air, and the outlet of the first flow path communicates with the outdoors,
The fluid to be cooled is water or air, and the inlet and outlet of the second flow path communicate with the room. According to claim 13,
Some of the indoor air is introduced into the second passage,
An indirect evaporative cooling device in which the remaining part of indoor air flows into the first flow path. According to claim 13,
Indoor air flows through the second passage,
An indirect evaporative cooling device in which at least a part of indoor air discharged from the second flow passage flows into the first flow passage. The cooling device according to claim 1;
a first pipe having an inlet communicating with the outdoors and an outlet communicating with the inlet of the first passage;
a second pipe having an inlet communicating with the room and an outlet communicating with the inlet of the second passage;
a third pipe having an inlet communicating with an outlet of the second passage and an outlet communicating with a room; and
An indirect evaporative cooling system comprising a fourth pipe whose inlet communicates with the outlet of the first flow path and whose outlet communicates with the outdoors. 17. The method of claim 16,
The first pipe includes a 1-1 pipe having an inlet communicating with the outdoors and a 1-2 pipe having an outlet communicating with the inlet of the first flow path,
The second pipe is connected to a bypass pipe for branching a part of the fluid,
A first switching device is disposed between the outlet of the 1-1 pipe, the inlet of the 1-2 pipe, and the bypass pipe,
The first switching device,
An indirect evaporative cooling system for selectively communicating the 1-1 pipe or the bypass pipe to the 1-2 pipe. 17. The method of claim 16,
The first pipe includes a 1-1 pipe having an inlet communicating with the outdoors and a 1-2 pipe having an outlet communicating with the inlet of the first flow path,
The third pipe includes a 3-1 pipe whose inlet communicates with the outlet of the second flow path and a 3-2 pipe whose outlet communicates with the room,
A second switching device is disposed between the outlet of the 1-1 pipe and the inlet of the 1-2 pipe, and between the outlet of the 3-1 pipe and the inlet of the 3-2 pipe,
The second switching device,
An indirect evaporative cooling system for selectively communicating the 1-1 pipe or the 3-1 pipe to the 1-2 pipe.

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