KR20230079983A - Camera module having fuction of protecting electro static discharge - Google Patents

Abstract

A camera module having an electrostatic protection function is disclosed. The camera module includes a lens unit in which one or more lenses are mounted; It is formed of a body having a central opening penetrating in a vertical direction, the lens unit is mounted using a circumferential surface of the central opening, and the image passing through the lens is introduced to an image sensor in a lower area of the body. an integrated housing in which an accommodation space for accommodating a sensor is formed; and a printed circuit board on which the image sensor is mounted and coupled to the integrated housing so that the image sensor is accommodated in the accommodation space.

Description

Camera module having function of protecting electro static discharge {Camera module having function of protecting electro static discharge}

The present invention relates to a camera module having an electrostatic protection function.

It is mounted on a camera module for the purpose of taking pictures or transmitting images in various portable devices such as smartphones and tablet PCs.

In a camera module mounted in a portable device, static electricity (Electro Static Discharge, ESD) is a problem. In the case of camera modules, miniaturization and power consumption are required, minimizing wiring and metal electrodes, and also due to the thinning of the oxide insulating film, the heat generated when the discharge current of relatively small static electricity is discharged also causes the oxide insulating film, Electrostatic destruction, in which metal electrodes, surfaces of insulators, bonding surfaces, and capacitive parts are melted, has emerged as a serious problem.

In addition, when an external electric shock such as static electricity is applied to the camera module, static electricity flows through the lens unit made of metal rather than the bracket made of plastic, which is an insulator, and can be introduced into the image sensor installed close to the lens unit. .

When static electricity is drawn into the image sensor, an electrical shock is applied to the image sensor, which may degrade performance of the camera module, and when the electrical shock is severe, the image sensor may be destroyed.

Korean Patent Registration No. 10-1361446

According to the present invention, the camera module can be electrically connected to a grounding unit provided in the target device only by fixing the camera module to a designated area of the target device, so that the generated static electricity flows along the surface of the integrated bracket to break the electrically connected ground line. It is to provide a camera module having an electrostatic protection function capable of preventing performance deterioration of the camera module or destruction of the image sensor by discharging through the camera module.

The present invention forms a bumper portion protruding downward at the lower part of the integrated bracket to mitigate and/or absorb shock applied to the image sensor, which is the weakest part when the camera module falls, to prevent physical damage to the image sensor. Static electricity It is to provide a camera module having a protection function.

Other objects of the present invention will be readily understood through the following description.

According to one aspect of the present invention, a lens unit equipped with one or more lenses; It is formed of a body having a central opening penetrating in a vertical direction, the lens unit is mounted using a circumferential surface of the central opening, and the image passing through the lens is introduced to an image sensor in a lower area of the body. an integrated housing in which an accommodation space for accommodating a sensor is formed; and a printed circuit board on which the image sensor is mounted and coupled to the integrated housing so that the image sensor is accommodated in the accommodating space.

The integrated housing includes a lens housing portion formed of a first sub-body having a central opening and an accommodating space in which the lens unit is mounted, and a shape surrounding the outside of the lens housing unit while maintaining the central opening. It can be manufactured by double injection molding to include the bracket part formed of 2 sub-body. In addition, the second sub-body constituting the bracket part is injection-manufactured using a conductive thermoplastic resin mixture to function as a discharge path of static electricity, and the first sub-body constituting the lens housing part transmits static electricity to the image sensor in the accommodating space. It can be manufactured by injection using a non-conductive plastic material so as to shield from.

The conductive thermoplastic resin mixture for injection molding the bracket part may be a mixture of a non-conductive thermoplastic resin, a conductive material, and a material improving wear resistance.

At least one fastening hole is formed in the second sub-body of the bracket unit, and a metallic fastening member inserted into the fastening hole is inserted and fixed into a fastening groove formed in the body of the target device, so that the camera module can be fixedly mounted on the target device. .

A ground pad electrically connected to a grounding unit provided in the target device is disposed in the fastening groove, and when a metallic fastening member inserted into the fastening hole is inserted and fixed into the fastening groove, the bracket part, the metallic fastening member, An electrostatic discharge path may be formed by electrically connecting the ground pad and the ground portion.

At least one guide portion for guiding coupling between the integrated housing and the printed circuit board may be formed on a lower surface of the bracket portion, and the guide portion may have a height corresponding to a thickness of the printed circuit board.

At least one bumper part is formed on the lower surface of the bracket part to guide the combination of the integrated housing and the printed circuit board and to mitigate an impact applied to the image sensor, so that the bumper part is exposed to the lower side of the printed circuit board. To do this, the height of the bumper portion may be set greater than the thickness of the printed circuit board.

Other aspects, features and advantages other than those described above will become apparent from the following drawings, claims and detailed description of the invention.

According to an embodiment of the present invention, the camera module can be electrically connected to the grounding unit provided in the target device only by fixing the camera module to a designated area of the target device, so that the generated static electricity flows along the surface of the integrated bracket and is electrically By discharging through the ground line connected to , there is an effect of preventing performance deterioration of the camera module or destruction of the image sensor.

In addition, by forming a bumper portion protruding downward at the bottom of the integrated bracket, there is an effect of preventing physical damage to the image sensor by mitigating and / or absorbing the impact applied to the image sensor, which is the weakest part when the camera module falls.

The effects obtainable in the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

1 is a view showing an antistatic camera module according to the prior art.
2 is a diagram showing the configuration of a camera module according to an embodiment of the present invention.
3 is a view for explaining a manufacturing technique of an integrated bracket according to an embodiment of the present invention.
Figure 4 is a cross-sectional view of an integrated bracket according to an embodiment of the present invention.
5 is a view showing an example of forming a guide part according to an embodiment of the present invention.
6 is a view showing an example of forming a bumper unit according to an embodiment of the present invention.
7 is a diagram illustrating a form in which a camera module and a ground line of a target device are electrically connected according to an embodiment of the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, or substitutes included in the spirit and technical scope of the present invention.

Terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "include" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

In addition, in the description with reference to the accompanying drawings, the same or related reference numerals are given to the same components regardless of reference numerals, and overlapping descriptions thereof will be omitted. In describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

1 is a view showing an anti-static camera module according to the prior art.

Referring to FIG. 1 , in the antistatic camera module according to the prior art, a holder 20 having an opening for exposing an image sensor 11 is mounted on an upper surface of a PCB substrate 40 .

An IR filter 12 is attached in the form of a film to the opening formed in the holder 20 to block infrared rays coming from the outside. In addition, a connector for transmitting an optical signal generated by the image sensor 11 to the main board is connected to the PCB board 40 .

The holder 20 extends vertically upward in the peripheral area of the opening formed in the holder 20, and the barrel 14 for fixing the lens 13 is fixed to the inner circumferential surface of the holder 20.

As illustrated in (b) of FIG. 1 , a plurality of discharge lines 21 for dissipating static electricity are provided on the outer surface of the holder 20 made of a non-conductive plastic material by injection molding.

The emission line 21 is formed of a metallic material such as a metallic thin film or metallic tape. The lower end of the emission line 21 is placed in contact with a ground pad (not shown) of the PCB board 40, so that the static electricity flowing into the camera module is discharged along the emission line 21 to the ground pad of the PCB board 40. It flows into (41) and is discharged.

In this way, the anti-static camera module according to the prior art arranges the release line 21 on the outer surface of the holder 20 so as to contact the ground pad of the PCB substrate 40, thereby inadvertently causing static electricity to the camera module from the outside. There is an advantage in preventing the performance of the camera module from being affected even when the inflow of .

However, the anti-static camera module according to the prior art requires an additional process for arranging the emission line 21 on the surface of the holder 20, and the holder 20 allows the emission line 21 to contact the ground pad. ) and the PCB substrate 40 had to be precisely coupled.

Figure 2 is a view showing the configuration of a camera module according to an embodiment of the present invention, Figure 3 is a view for explaining a manufacturing technique of an integrated bracket according to an embodiment of the present invention, Figure 4 is one of the present invention A cross-sectional view of the integrated bracket according to the embodiment. 5 is a view showing an example of forming a guide part according to an embodiment of the present invention, Figure 6 is a view showing an example of forming a bumper part according to an embodiment of the present invention, and FIG. 7 is an embodiment of the present invention. A diagram illustrating a form in which the camera module according to the example and the ground line of the target device are electrically connected.

Referring to FIG. 2 , the camera module may include a lens unit 110 , an image sensor 11 , a PCB substrate 40 and an integrated bracket 100 .

The lens unit 110 includes one or more lenses for passing light and a barrel for arranging and fixing the one or more lenses in an optical axis direction so that the light is incident. The lens may be made of, for example, glass or a transparent plastic material, and the barrel may be made of, for example, an aluminum alloy material.

The image sensor 11 outputs an electrical signal corresponding to light introduced through one or more lenses. The image sensor 11 is mounted on the central portion of the PCB board 40, and the PCB board 40 has a connector for transmitting an electrical signal output from the image sensor 11 to a receiving end (eg, a main board, etc.) is connected

The integrated bracket 100 is formed of a body having a central opening penetrating in the vertical direction.

The integrated bracket 100 supports the mounted lens unit 110 from the outside by using the circumferential surface of the central opening. Although not shown, the integrated bracket 100 and/or the lens unit 110 may include an actuator that moves the lens unit 110 in an optical axis direction for auto focusing.

In addition, an accommodating space for accommodating the image sensor 11 is formed under the body of the integrated bracket 100, and the image sensor 11 is positioned in the accommodating space so that light passing through one or more lenses is introduced. The central opening formed in the integrated bracket 100 may be closed by the IR filter 12 to block infrared rays passing through the lens from entering the image sensor 11 .

One or more fastening parts may be formed in the body of the integrated bracket 100, and through fastening holes 105 may be formed in each fastening part. As will be described later, the camera module may be fixedly coupled to the body of the target device 610 using the metallic fastening member 620 inserted into the fastening hole 105 (see FIG. 7 ).

As illustrated in FIG. 3, the integrated bracket 100 is a heterogeneous injection molding method using different materials, and the lens housing part 210 and the bracket part 220 are sequentially injection-molded by injection molding. can be made in this way.

The lens housing unit 210 is formed of a first sub-body having a central opening penetrating in the vertical direction, and the first sub-body is formed so that a circumferential surface area of the central opening is maintained by a predetermined length in the vertical direction, The lower part of the sub body extends outward to form an accommodation space for accommodating the image sensor 11 . The barrel 14 of the lens unit 110 may be mounted using an area maintained by a predetermined length in the vertical direction.

In order to shield the image sensor 11 accommodated in the accommodation space when static electricity is generated in the camera module, the lens housing 210 is injection-manufactured with a non-conductive plastic material.

The bracket part 220 is injection-manufactured using a conductive thermoplastic resin mixture to form a second sub-body in a shape surrounding the outside of the lens housing part 210 while maintaining the central opening formed in the lens housing part 210. . One or more fastening parts through which fastening holes 105 are formed may be formed in the second sub-body of the bracket part 220 .

The conductive thermoplastic resin mixture, which is the injection material for forming the bracket portion 220, may be, for example, a mixture of a non-conductive thermoplastic resin and a conductive material, and may be further mixed with a wear resistance enhancing material.

Here, the non-conductive thermoplastic resin is a general-purpose plastic (eg, polyethylene resin, polypropylene resin, acrylic resin, styrene-based resin, vinyl resin, etc.) or engineering plastic (eg, polycarbonate resin, polyphenylene resin, etc.) ether resin, polyamide resin, polyester resin, polyimide resin, etc.), or a combination thereof.

The conductive material may be, for example, one or more of carbon black, graphite, carbon fiber, metal powder, metal-coated inorganic powder, and metal fiber for imparting electrical conductivity by being mixed with a non-conductive thermoplastic resin.

The wear resistance improving material may be a whisker capable of reinforcing physical properties by forming a network in a thermoplastic resin. The wear resistance improving materials include, for example, zinc oxide whiskers, calcium carbonate whiskers, titanium dioxide whiskers, silicon oxide whiskers, silicon carbide whiskers, aluminum borate whiskers, magnesium borate whiskers, potassium titanate whiskers, silicon nitride whiskers, silicon carbide whiskers and alumina whiskers. It may be any one or a combination thereof.

As an injection material for forming the integrated bracket 100, the mixing ratio, weight ratio, etc. of each of the non-conductive thermoplastic resin, the conductive material, and the wear resistance improving material constituting the conductive thermoplastic resin mixture are required (for example, the integrated bracket ( 100) can be adjusted in various ways depending on the strength, conductivity size, etc.).

In the integrated bracket 100, as illustrated in FIG. 4, the lens housing portion 210 injection-molded of a non-conductive injection-molded material is located relatively inside, and the bracket portion 220 injection-molded of a conductive injection-molded material is It is injection-manufactured by a double injection molding method in a shape surrounding the lens housing part 210 from the outside.

In this way, the lens housing part 210 forming the accommodation space in which the image sensor 11 is to be accommodated is insulated, and the bracket part 220 located outside the lens housing part 210 is an integral bracket to have conductivity ( 100) is formed.

As a result, when static electricity is generated in the camera module, the static electricity flows along the surface of the bracket unit 220 located outside, and is electrically shielded by the insulated lens housing unit 210 (i.e. EMC (Electro Magnetic compatibility)). and EMI (Electro Magnetic Interference) countermeasures), the image sensor 11 is prevented from deteriorating the performance of the camera module by being excluded from the influence of electrical noise.

In addition, the generated static electricity may be transferred through the outer surface of the integrated bracket 100 and discharged through a ground line that is subsequently discharged.

5 illustrates a case where the guide part 410 is formed on the lower surface of the bracket part 220 of the integrated bracket 100, and in FIG. 6, the bumper part 510 is formed on the lower surface of the bracket part 220 A case of formation is exemplified.

One or more guide parts 410 may be formed by protruding downward from the lower surface of the bracket part 220 . For example, the guide part 410 may be formed in a guide shape in which a protruding shape or a protruding shape extends in a horizontal direction by a predetermined length.

When two or more guide parts 410 are formed on the lower surface of the bracket part 220, the integrated bracket 100 and the PCB board 40 on which the image sensor 11 is mounted are coupled vertically or sideways. At this time, the guide unit 410 may be arranged in a positional relationship such as L, C, or ㅁ, so as to guide coupling paths between each other.

At this time, the formation height of the guide portion 410 may be formed to a length corresponding to the thickness of the PCB substrate 40 (see (b) in FIG. 5), through which the integral bracket 100 and the PCB substrate 40 Interference by the guide unit 410 may be avoided when the coupled camera module is mounted on the target device 610 .

As another case, as illustrated in (a) of FIG. 6, instead of the guide portion 410, the bumper portion 510 formed relatively longer than the thickness of the PCB substrate 40 is the bracket of the integrated bracket 100. It may be formed on the lower surface of portion 220. For example, the bumper unit 510 may be formed in a guide shape in which a protruding shape or a protruding shape extends in a horizontal direction by a predetermined length.

Like the guide part 410, the bumper part 510 provides a mutual coupling path when the integrated bracket 100 and the PCB board 40 on which the image sensor 11 is mounted are coupled in a vertical or lateral direction. To guide, each bumper part 510 may be arranged in a positional relationship such as L, C, or ㅁ.

As shown in Figure 6 (a). Since the formation height of the bumper portion 510 is relatively longer than the thickness of the PCB substrate 40, when the integrated bracket 100 and the PCB substrate 40 are combined to form a camera module, the bumper portion 510 It extends to the lower side of the PCB substrate 40 and is exposed.

As illustrated in (b) of FIG. 6 , the bumper portion 510 exposed and extending downward of the PCB substrate 40 may collide with the floor relatively first when the camera module is dropped, and through this An impact applied to the image sensor 11, which is the weakest part of the camera module, may be alleviated and/or absorbed.

By mitigating and/or absorbing shock by the bumper unit 510, the camera module is manufactured to complete the delivery of the camera module to a customer who manufactures a target device (eg, a portable device to which the camera module is mounted). During the period until, physical damage or damage to the image sensor 11 caused by unintentional dropping of the camera module may be prevented.

As illustrated in FIG. 7 , the camera module has a metal fastening member 620 inserted into the fastening hole 105 formed in the fastening part of the integrated bracket 100 and a fastening groove formed in the body of the target device 610 (not shown). not), it can be fixedly mounted on the target device 610.

A ground pad (not shown) is disposed in the fastening groove formed in the body of the target device 610 to correspond to the installation location of the camera module, and the ground pad is electrically connected to the ground provided in the target device 610 in advance. It consists of

If the metallic fastening member 620 inserted into the fastening hole 105 formed in the fastening part of the integrated bracket 100 is inserted into the fastening groove and fixed in order to mount the camera module to a predetermined position of the target device 610, , The ground unit provided in the target device 610 is electrically connected to the integrated bracket 100 of the camera module (ie, the bracket portion 220 of the integrated bracket 100) through the ground pad of the fastening groove and the metallic fastening member 620. connected to

Therefore, the camera module and the ground line of the target device 610 can be connected only by fixing the camera module to the designated location of the target device 610 using the metallic fastening member 620, and through this, the camera module The generated static electricity may be transmitted through the bracket portion 220 of the integrated bracket 100 and the metallic fastening member 620 and discharged to the ground portion of the target device 610 .

Although the above has been described with reference to the embodiments of the present invention, those skilled in the art will variously modify and change the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. You will understand that it can be done.

11: image sensor 12: IR filter
13: lens 14: barrel
20: holder 21: release line
40: PCB substrate 100: integral bracket
105: fastening hole 110: lens unit
210: lens housing part 220: bracket part
410: guide part 510: bumper part
610: target device 620: metallic fastening member

Claims (6)

a lens unit equipped with one or more lenses;
It is formed of a body having a central opening penetrating in a vertical direction, the lens unit is mounted using a circumferential surface of the central opening, and the image passing through the lens is introduced to an image sensor in a lower area of the body. an integrated housing in which an accommodation space for accommodating a sensor is formed; and
A printed circuit board on which the image sensor is mounted and coupled to the integrated housing so that the image sensor is accommodated in the accommodating space,
The integrated housing includes a lens housing portion formed of a first sub-body having a central opening and an accommodating space in which the lens unit is mounted, and a shape surrounding the outside of the lens housing unit while maintaining the central opening. 2 It is manufactured by a double injection molding method to include a bracket formed of sub-body,
The second sub-body constituting the bracket part is injection-manufactured using a conductive thermoplastic resin mixture to function as a discharge path of static electricity, and the first sub-body constituting the lens housing part shields the image sensor in the accommodating space from static electricity. A camera module with an electrostatic protection function characterized in that it is manufactured by injection using a non-conductive plastic material to
According to claim 1,
A camera module with an electrostatic protection function, characterized in that the conductive thermoplastic resin mixture for injection-manufacturing the bracket part is a mixture of a non-conductive thermoplastic resin, a conductive material, and a wear resistance improving material.
According to claim 1,
One or more fastening holes are formed in the second sub-body of the bracket part,
A camera module with an electrostatic protection function, characterized in that the metallic fastening member inserted into the fastening hole is inserted and fixed into the fastening groove formed in the body of the target device so that the camera module is fixedly mounted on the target device.
According to claim 3,
A ground pad electrically connected to a ground unit provided in the target device is disposed in the fastening groove,
When the metallic fastening member inserted into the fastening hole is inserted and fixed into the fastening groove, the bracket part, the metallic fastening member, the ground pad, and the grounding part are electrically connected to form an electrostatic discharge path. Camera module with functions.
According to claim 1,
One or more guide parts are formed on the lower surface of the bracket part to guide the combination of the integrated housing and the printed circuit board,
The camera module having an electrostatic protection function, characterized in that the guide portion is formed to have a height corresponding to the thickness of the printed circuit board.
According to claim 1,
At least one bumper part is formed on the lower surface of the bracket part to guide the combination of the integrated housing and the printed circuit board and to mitigate an impact applied to the image sensor,
In order to expose the bumper portion to the lower side of the printed circuit board, the camera module having an electrostatic protection function, characterized in that the height of the bumper portion is set greater than the thickness of the printed circuit board.

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