KR20230078436A - Infrared lens mold device with non-dicing type wafer mask and infrared lens manufactureing method using same - Google Patents

Abstract

The present invention relates to an infrared lens mold apparatus with a non-dicing wafer mask and an infrared lens manufacturing method using the same. More specifically, the infrared lens mold apparatus, in a mold apparatus configured to mold a subject in a spherical shape, comprises: a lower core unit including a lower core body and one or more molding grooves formed on the upper side of the lower core body; an upper core unit located and elevated on the upper side of the lower core body, and pressing a subject input between the lower core body and the upper core body, and letting the subject be molded; and a disc-shaped wafer mask including a plurality of dicing grooves in a polygonal shape, and forming an outer line for a plurality of subjects molded between the lower core body and the upper core body. According to the present invention, a subject is input between the lower core unit and the upper core unit and an infrared lens is manufactured. An outer line is formed for the subject by the wafer mask input between the lower core unit and the upper core unit, and no separate dicing process is required after a lens is molded.

Description

Infrared lens mold device having a non-dicing type wafer mask and infrared lens manufacturing method using the same

The present invention relates to an infrared lens mold apparatus provided with a non-dicing type wafer mask and an infrared lens manufacturing method using the same.

More specifically, the object to be molded is inserted between the lower core and the upper core so that the infrared lens is manufactured, but the outer line for the object is formed by the wafer mask inserted between the lower and upper cores By doing so, it relates to an infrared lens mold apparatus provided with a non-dicing type wafer mask that does not require a separate dicing operation after lens molding and an infrared lens manufacturing method using the same.

In general, an infrared lens refers to a lens that collects infrared rays, and such an infrared lens is widely used in infrared cameras and infrared telescopes.

These infrared lenses can be manufactured mainly through optical materials such as silicon (Si), germanium (Ge), zinc sulfide (ZnS), and zinc selenide (ZnSe), and the optical materials have a large change in refractive index according to temperature. , the dispersing power of the material is relatively small compared to materials used in the visible light region.

Among the methods for manufacturing an infrared lens, the manufacturing method using a mold presses an object to be molded between a pair of lower core and upper core by the upper core, so that the object is formed by the molding groove of the lower core. to be formed, and a dicing process is performed along a separately engraved circular dicing key.

However, since the method of manufacturing an infrared lens using such a conventional mold is configured to proceed with dicing based on a circle during the dicing process, there is no problem at the beginning of the dicing process, but gradually the lens size becomes inconsistent. there is

Republic of Korea Patent Registration No. 10-0327976 (2003.09.16.) Republic of Korea Patent Registration No. 10-0217995 (2001.01.12.)

The present invention has been made to solve the above problems, and the problem to be solved in the present invention is that the object to be molded is injected between the lower core part and the upper core part to produce an infrared lens, but the lower core part and the upper part An infrared lens mold device equipped with a non-dicing type wafer mask that does not require a separate dicing operation after lens molding by forming an external line for an object to be molded by a wafer mask inserted between core parts, and an infrared lens mold device using the same It is to provide a method for manufacturing an infrared lens.

In the infrared lens mold apparatus provided with the non-dicing type wafer mask according to the present invention for solving the above problems, in the mold apparatus configured to mold a spherical object to be molded, the lower core body and the upper part of the lower core body A lower core portion including one or a plurality of molded grooves formed therein; an upper core portion including an upper core body located above the lower core body and pressurizing and molding an object to be molded between the lower core body and the lower core body while being moved up and down; and a disc-shaped wafer mask having a plurality of dicing grooves formed in polygonal shapes to form external lines for a plurality of objects to be molded between the lower core body and the upper core body.

In addition, a holder body, a processing hole formed inside the holder body to set the position of the lower core body and the upper core body and guiding the elevation of the upper core body, and formed in a shape penetrating the processing hole and the outside Characterized in that the holder portion including the holder discharge port is included.

In addition, the lower core part includes a lower step formed along the outer periphery of the lower core body to guide gas generated between the lower core part and the upper core part during lens molding to be discharged to the holder outlet of the holder part. characterized by

In addition, the upper core portion includes an upper step formed along the outer circumference of the upper core body to guide gas generated between the lower core portion and the upper core portion during lens molding to be discharged to the holder outlet of the holder portion. characterized by

In addition, the dicing groove is at least larger than the plurality of shaping grooves formed in the lower core body, so that the dicing groove is configured to be disposed inside the plurality of dicing grooves.

In addition, the wafer mask is characterized in that it is configured to deposit a metal or carbon thin film on each surface using plasma to form a release coating.

In addition, a press plate unit which presses the upper core body downward from the top of the upper core body so that an object to be molded disposed between the lower core body and the upper core body is molded; and a stopper portion positioned outside the upper core body and the lower core body to limit a pressing range by the press plate portion.

On the other hand, a method for manufacturing an infrared lens using an infrared lens mold apparatus provided with a non-dicing type wafer mask according to the present invention for solving the above problems is a first fixing step of fixing the lower core body; an align step of arranging spherical objects to be molded in one or a plurality of molding grooves formed in the lower core body; a second fixing step of positioning the wafer mask on the upper part of the lower core body and fixing the upper core body on the upper part of the wafer mask so that the object to be molded is located in the dicing groove of the wafer mask; and a pressing step of pressurizing the upper part of the upper core body to press and mold an object positioned between the lower core body and the upper core body.

According to the infrared lens mold apparatus having a non-dicing type wafer mask according to the present invention and the method for manufacturing an infrared lens using the same, the object to be molded is inserted between the lower core part and the upper core part to make the infrared lens, but the lower core By forming an external line for the object to be molded by the wafer mask inserted between the part and the upper core part, there is an effect of not requiring a separate dicing operation after molding the lens.

In addition, according to the present invention, the holder portion including the processing hole and the holder outlet is configured to be coupled to the outside of the lower core body and the upper core body, thereby guiding the upper core body to be easily moved, and the lower core body and the upper core body There is an effect of allowing the gas generated between the to be easily discharged.

In addition, according to the present invention, the lower step is formed along the outer periphery of the lower core body and the upper step is formed along the outer periphery of the upper core body, so that the gas generated between the lower core body and the upper core body is discharged from the holder portion of the holder. It has the effect of guiding it to be discharged through the outlet.

In addition, according to the present invention, by being configured so that the release coating is formed on the wafer mask configured to form an external line other than the object to be molded, it can be configured to prevent the object from being fused to the wafer mask during molding of the object to be molded.

In addition, according to the present invention, a press plate portion configured to press the upper core body downward from the top of the upper core body and a stopper portion configured to limit the pressing range of the press plate portion are further included, thereby providing an upper core by the press plate portion. It is possible to prevent excessive pressurization of the body and maintain an appropriate range of pressurization, and thus has an effect of enabling the manufacture of a high-quality infrared lens.

1a and 1b are views showing an infrared lens mold apparatus provided with a non-dicing type wafer mask according to the present invention.
2 is a view showing a wafer mask of an infrared lens mold apparatus provided with a non-dicing type wafer mask according to the present invention.
3 is a view showing a state in which an external line is formed on an object to be molded by a wafer mask of an infrared lens mold apparatus equipped with a non-dicing type wafer mask according to the present invention.
4a and 4b are diagrams showing a holder of an infrared lens mold apparatus provided with a non-dicing type wafer mask according to the present invention.
5A and 5B are diagrams showing a press plate part and a stopper part of an infrared lens mold apparatus equipped with a non-dicing type wafer mask according to the present invention.
6 is a view showing a method for manufacturing an infrared lens using an infrared lens mold apparatus provided with a non-dicing type wafer mask according to the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, or substitutes included in the spirit and technical scope of the present invention.

It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be.

On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle.

Terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "include" or "have" are intended to designate that there is a feature, number, process, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, processes, operations, components, parts, or combinations thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings in the context of the related art, and unless explicitly defined in this application, they should not be interpreted in ideal or excessively formal meanings. don't

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. Prior to this, the terms or words used in this specification and claims should not be construed as being limited to ordinary or dictionary meanings, and the inventor appropriately uses the concept of terms in order to explain his/her invention in the best way. Based on the principle that it can be defined, it should be interpreted as meaning and concept consistent with the technical spirit of the present invention. In addition, unless there is another definition in the technical terms and scientific terms used, they have meanings commonly understood by those of ordinary skill in the art to which this invention belongs, and the gist of the present invention is described in the following description and accompanying drawings. Descriptions of well-known functions and configurations that may be unnecessarily obscure are omitted. The drawings introduced below are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the present invention may be embodied in other forms without being limited to the drawings presented below. Also, like reference numerals denote like elements throughout the specification. It should be noted that like elements in the drawings are indicated by like numerals wherever possible.

In the present invention, the object to be molded is inserted between the lower core part and the upper core part so that the infrared lens is manufactured, but the outer line for the object is formed by the wafer mask inserted between the lower core part and the upper core part. , It relates to an infrared lens mold apparatus provided with a non-dicing type wafer mask that does not require a separate dicing operation after lens molding, and an infrared lens manufacturing method using the same.

Hereinafter, an infrared lens mold apparatus having a non-dicing type wafer mask according to the present invention and an infrared lens manufacturing method using the same will be described in detail with reference to the accompanying drawings.

1A and 1B are diagrams showing an infrared lens mold apparatus equipped with a non-dicing type wafer mask according to the present invention, and FIG. 2 shows a wafer mask of an infrared lens mold apparatus equipped with a non-dicing type wafer mask according to the present invention. 3 is a view showing a state in which an external line is formed on an object to be molded by a wafer mask of an infrared lens mold apparatus equipped with a non-dicing type wafer mask according to the present invention, and FIGS. 4a and 4b are according to the present invention It is a view showing the holder part of the infrared lens mold apparatus provided with the non-dicing type wafer mask according to FIG.

According to the attached FIGS. 1A to 4B, the infrared lens mold apparatus provided with the non-dicing type wafer mask according to the present invention includes a lower core part 100, an upper core part 200 and a wafer mask 300. .

The infrared lens mold apparatus provided with the wafer mask 300 of the present invention is configured to mold the spherical object 10, provided between the lower core part 100 and the upper core part 200. By being configured so that the outer line 11 of the object to be molded 10 is formed by the wafer mask 300 to be formed, a separate dicing operation is not required after molding the lens.

At this time, the external line 11 may be understood to mean the external shape of the infrared lens in which the object 10 is molded.

That is, the lower surface of the object to be molded 10 is formed in an external shape by the lower core portion 100, and the upper surface of the object to be molded 10 is formed in an external shape by the upper core portion 200. And, the circumference of the side of the object to be molded 10 is molded into an external shape by the wafer mask 300.

The infrared lens mold apparatus having the non-dicing type wafer mask according to the present invention further includes a lower plate part 700 formed in a disk shape to fix the lower core part 100 and the holder part 400 to be described later. can

The lower plate part 700 is formed in a groove shape along the circumferential direction of the lower plate part 700 so that the lower core body 110 of the lower core part 100 to be described later is inserted and fixed thereto. (710) may be formed.

In addition, a lift hole 720 may be formed in the center of the lower plate part 700 corresponding to the position of the lower core part 100, and the lift hole 720 is formed in the lower core part 100 After manufacturing the infrared lens by the upper core part 200, a separate lift pin (not shown) is raised to take out the manufactured infrared lens.

The lower core part 100 includes a lower core body 110 and one or a plurality of molding grooves 120 formed on the upper part of the lower core body 110 .

The lower core part 100 may be positioned above the lower plate part 700 to form an aspheric surface of an object to be molded 10 injected between the upper core part 200 to be described later.

The upper core part 200 includes an upper core body 210 that is located on the upper part of the lower core body 110 and pressurizes and molds the object to be molded between the lower core body 110 while being moved up and down. .

The upper core body 210 is configured to be moved up and down by the processing hole 420 of the holder unit 400 in a state in which at least a part thereof is inserted into the holder unit 400 to be described later, so that the lower core unit 100 It is configured to manufacture an infrared lens by pressing the object to be molded 10 together.

A plurality of dicing grooves 310 having polygonal shapes are formed in the wafer mask 300, and the wafer mask 300 has a plurality of dicing grooves formed between the lower core body 110 and the upper core body 210. As configured to form an external line 11 for the object to be molded 10, it is most preferable that the dicing groove 310 is formed in a square shape.

As described above, the wafer mask 300 is configured to form an external line 11 on the object 10 to be molded between the lower core body 110 and the upper core body 210.

At this time, in the wafer mask 300, in a state in which the spherical object 10 is put into the molding groove 120 of the lower core body 110, the dicing groove 310 is formed of the object 10 to be molded. It can be arranged to be located outside, and when pressed by the upper core body 210, the outer line 11 of the object to be molded 10 is formed.

That is, the infrared lens mold apparatus provided with the non-dicing type wafer mask of the present invention converts one spherical object 10 inserted between the lower core body 110 and the upper core body 210 into one infrared lens. It is configured to be molded into a lens, and the wafer mask 300 is configured to form the outer line 11 of the infrared lens on which the spherical object 10 is molded.

For example, when 25 molding grooves 120 are formed on the upper part of the lower core body 110, 25 dicing grooves 310 may also be formed on the wafer mask 300, and the non-dicing of the present invention An infrared lens mold apparatus provided with a type wafer mask may be configured to mold 25 spherical objects 10 into 25 infrared lenses.

In addition, the wafer mask 300 is configured to deposit a metal or carbon thin film on the surface using plasma to form a release coating, so that during molding of the object 10, the object 10 is formed on the wafer. It may be configured to prevent defects from being fused to the mask 300 .

In the infrared lens mold apparatus provided with a non-dicing type wafer mask according to the present invention, a heating heater configured to apply heat to the lower core body 110 and the upper core body 210 configured to mold the object 10 (not shown) may be further included, and the heating heater applies heat to the object to be molded 10 so that the object to be molded 10 can be easily molded (deformed).

In addition, in the infrared lens mold apparatus provided with the non-dicing type wafer mask of the present invention, the holder body 410 is formed inside the holder body 410 to form the lower core body 110 and the upper core body 210 The holder part 400 includes a processing hole 420 for setting the position of the upper core body 210 and guiding the elevation of the upper core body 210 and a holder outlet 430 formed in a shape penetrating the processing hole 420 and the outside. ) may be included.

The holder part 400 sets the position of the lower core body 110 inserted into the processing hole 420, guides the elevation of the upper core body 210, and moves the lower core body 110 and It is configured to discharge combustion gas generated during processing of the object to be molded 10 in the upper core body 210 .

At this time, the holder discharge port 430 formed in the holder body 410 and configured to pass through the processing hole 420 and the outside is configured in plurality along the circumferential direction of the holder body 410 and is spaced apart from each other at regular intervals. can be formed.

In addition, the holder portion 400 may be configured to be coupled to the outside of the lower core body 110 coupled to the core coupling groove 710 of the lower plate portion 700 as described above, and the holder portion ( The processing hole 420 of 400 and the outer periphery of the lower core body 110 may be formed in a circular shape corresponding to each other.

To this end, the lower core part 100 is formed along the outer periphery of the lower core body 110, and combustion gas generated between the lower core part 100 and the upper core part 200 during lens molding is formed. A lower step 130 guiding the holder unit 400 to be discharged to the holder discharge port 430 may be included, and the upper core unit 200 is formed along the outer periphery of the upper core body 210 so that the lens An upper step 220 guiding combustion gas generated between the lower core part 100 and the upper core part 200 during molding to be discharged to the holder discharge port 430 of the holder part 400 may be included.

The lower step 130 and the upper step 220 are formed by deforming the outer circumferential shapes of the lower core body 110 and the upper core body 210, rather than adding a separate configuration. The step 130 and the upper step 220 are formed so that a space is formed between the processing hole 420 of the holder part 400 and the lower core body 110 and the upper core body 210 through the space. The combustion gas generated between them is moved and discharged through the holder discharge port 430 .

That is, the lower outer surface of the lower core body 110 has the same diameter as the inner surface of the processing hole 420 of the holder part 400 and is configured to be inscribed with each other, and the upper part of the lower core body 110 has the lower step difference. 130 is formed stepwise in the inner direction of the lower core body 110 to form a space between the inner surface of the processing hole 420 of the holder part 400, and the upper core body 210 The upper outer surface of has the same diameter as the inner surface of the processing hole 420 of the holder part 400 and is configured to be inscribed with each other, and the lower part of the upper core body 210 is formed by the upper step 220 to the upper core body ( 210) is formed stepwise in the inner direction so that a space between the inner surface of the processing hole 420 of the holder part 400 is formed.

5A and 5B are diagrams showing a press plate part and a stopper part of an infrared lens mold apparatus provided with a non-dicing type wafer mask according to the present invention.

According to the attached FIGS. 5A and 5B, in the infrared lens mold apparatus provided with the non-dicing type wafer mask of the present invention, the upper core body 210 is pressed downward from the upper part of the upper core body 210 The press plate part 500 for molding the object 10 disposed between the lower core body 110 and the upper core body 210 and the upper core body 210 and the lower core body 110 A stopper part 600 located outside and configured to limit the pressurization range by the press plate part 500 may be further included.

That is, the press plate part 500 is installed on the upper part of the upper core body 210, and the upper core body 210 is pressed in a downward direction to prevent the object 10 to be injected between the lower core bodies 110. It is configured to mold, and the stopper part 600 limits the pressurization range of the press plate part 500 so that defects occur in the object to be molded 10 due to excessive pressurization by the press plate part 500 It is to prevent this and to maintain an appropriate level of pressure range so that a high-quality infrared lens can be manufactured.

In particular, the stopper part 600 is configured so that the protruding part of the holder part 400 comes into contact with the press plate part 500 in a state coupled to the outside of the holder part 400, so that the press plate It may be configured to limit the pressure range by the unit 500.

6 is a diagram showing a method for manufacturing an infrared lens using an infrared lens mold apparatus provided with a non-dicing type wafer mask according to the present invention.

According to the attached FIG. 6, in the infrared lens manufacturing method using the infrared lens mold device provided with the non-dicing type wafer mask of the present invention, the first fixing step (S10), the aligning step (S20), the second fixing step ( S30) and a pressing step (S40) are included.

The first fixing step (S10) is a step of fixing the lower core body 110.

At this time, the lower core body 110 may be configured to be fixed to the upper part of the lower plate part 700 by a separate fixing means, and the shape and fixing method of the fixing means can be changed as much as possible depending on the implementation environment. can

The aligning step (S20) is a step of arranging the spherical object 10 in one or a plurality of molding grooves 120 formed in the lower core body 110.

Due to the characteristic that the object to be molded 10 is formed in a spherical shape and consists of a plurality, it may be formed in a size and number corresponding to the molding groove 120 of the lower core part 100.

In the second fixing step (S30), the wafer mask 300 is placed on top of the lower core body 110 so that the object 10 is positioned in the dicing groove 310 of the wafer mask 300. , This is a step of fixing the upper core body 210 to the top of the wafer mask 300.

As described above, the wafer mask 300 is disposed so that the dicing grooves 310 of the wafer mask 300 correspond to one or a plurality of molding grooves 120 of the lower core part 100. It may be configured, and the upper core body 210 may be configured to be positioned on top of the wafer mask 300.

In addition, when the holder part 400 is included in the infrared lens mold apparatus provided with the non-dicing type wafer mask of the present invention, at least a part of the upper core body 210 is inserted into the holder part 400. By being configured, the lower core body 110 and the upper core body 210 may be configured to be disposed at positions corresponding to each other.

In the pressing step (S40), the upper part of the upper core body 210 is pressed to press the object to be molded 10 located between the lower core body 110 and the upper core body 210 to form an infrared lens. It is a step to

In the infrared lens manufacturing method using the infrared lens mold device provided with the non-dicing type wafer mask of the present invention, the molding of the object can be easily performed by applying heat to the lower core body 110 and the upper core body 210 A heating step may be further included.

According to the present invention, the object to be molded is injected between the lower core part and the upper core part so that the infrared lens is manufactured, but the outer line for the object is formed by the wafer mask inserted between the lower core part and the upper core part By forming it, there is an effect of not requiring a separate dicing operation after molding the lens.

In the above description, various embodiments of the present invention have been presented and described, but the present invention is not necessarily limited thereto. It can be seen that branch substitutions, modifications and alterations are possible.

10: object to be molded 11: external line
100: lower core part
110: lower core body 120: molding groove
130: lower step
200: upper core part
210: upper core body 220: upper step difference
300: wafer mask 310: dicing groove
400: holder part
410: holder body 420: processing hole
430: holder outlet
500: press plate part 600: stopper part
700: lower plate part
710: core coupling groove 720: lift hole

Claims (8)

In the mold apparatus configured to mold a spherical object to be molded,
a lower core portion 100 including a lower core body 110 and one or a plurality of molding grooves 120 formed on the upper portion of the lower core body 110;
An upper core portion 200 including an upper core body 210 located above the lower core body 110 and pressurizing and molding an object to be molded inserted between the lower core body 110 while being moved up and down; and
A plurality of dicing grooves 310 formed in polygonal shapes are formed to form external lines 11 for a plurality of objects 10 molded between the lower core body 110 and the upper core body 210. The disk-shaped wafer mask 300 configured;
Infrared lens mold apparatus provided with a non-dicing type wafer mask, characterized in that it is included.
According to claim 1,
The holder body 410, a processing hole formed inside the holder body 410 to set the positions of the lower core body 110 and the upper core body 210 and to guide the elevation of the upper core body 210 420 and a holder portion 400 including a holder outlet 430 formed in a shape passing through the processing hole 420 and the outside;
Infrared lens mold apparatus provided with a non-dicing type wafer mask, characterized in that it is included.
According to claim 2,
In the lower core part 100,
Gas formed along the outer periphery of the lower core body 110 and generated between the lower core part 100 and the upper core part 200 during lens molding is passed through the holder outlet 430 of the holder part 400 A lower step 130 guiding to be discharged to;
Infrared lens mold apparatus provided with a non-dicing type wafer mask, characterized in that it is included.
According to claim 2,
In the upper core part 200,
It is formed along the outer periphery of the upper core body 210 and the gas generated between the lower core part 100 and the upper core part 200 during lens molding passes through the holder outlet 430 of the holder part 400. An upper step 220 guiding to be discharged to;
Infrared lens mold apparatus provided with a non-dicing type wafer mask, characterized in that it is included.
According to claim 1,
The wafer mask 300,
In a state in which the spherical object 10 is put into the molding groove 120 formed in the lower core portion 100, the dicing groove 310 of the wafer mask 300 is outside the object 10 to be molded. It is configured to be disposed on the infrared lens provided with a non-dicing type wafer mask, characterized in that configured to prevent the object to be molded 10 from being separated from the dicing groove 310 when pressed by the upper core body 210 mold device.
According to claim 1,
In the wafer mask 300,
Infrared lens mold apparatus provided with a non-dicing type wafer mask, characterized in that configured to deposit a metal or carbon thin film on each surface using plasma to form a release coating.
According to claim 1,
The upper core body 210 is pressed downward from the top of the upper core body 210 so that the object 10 disposed between the lower core body 110 and the upper core body 210 is molded. A press plate portion 500 to; and
a stopper part 600 located outside the upper core body 210 and the lower core body 110 and configured to limit the pressing range by the press plate part 500;
Infrared lens mold apparatus provided with a non-dicing type wafer mask, characterized in that further included.
In the infrared lens manufacturing method using an infrared lens mold apparatus provided with a non-dicing type wafer mask comprising any one of claims 1 to 7,
A first fixing step (S10) of fixing the lower core body 110;
an aligning step (S20) of arranging the spherical object to be molded 10 in one or a plurality of molding grooves 120 formed in the lower core body 110;
The wafer mask 300 is placed on the upper part of the lower core body 110 so that the object to be molded 10 is positioned in the dicing groove 310 of the wafer mask 300, and the upper part of the wafer mask 300 A second fixing step (S30) of fixing the upper core body 210 to; and
A pressing step (S40) of pressurizing the upper part of the upper core body 210 to pressurize and mold the object 10 positioned between the lower core body 110 and the upper core body 210;
Infrared lens manufacturing method characterized in that it is included.

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