KR20230077583A - Camera module and electronic device including the same - Google Patents

Abstract

According to various embodiments of the present disclosure, a camera module and/or an electronic device including the same may include a sensor substrate, an image sensor disposed on one surface of the sensor substrate, and a sensor substrate in a state surrounding at least a portion of the image sensor. a sensor enclosure disposed thereon, and an optical element disposed in the sensor enclosure in a state facing the image sensor, wherein the image sensor is set to detect incident light passing through the optical element; A sensor enclosure may be attached at least partially to an edge of one side of the image sensor facing the optical element. In addition, various embodiments are possible.

Description

Camera module and electronic device including the same {CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME}

Various embodiments of the present disclosure relate to an electronic device, for example, a camera module and/or an electronic device including the same.

An electronic device refers to a device that performs a specific function according to an installed program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, a video/audio device, a desktop/laptop computer, or a vehicle navigation system, from home appliances. can mean For example, these electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and ultra-high-speed, large-capacity wireless communication becomes common, recently, a single electronic device such as a mobile communication terminal may be equipped with various functions. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, etc., or schedule management or electronic wallet functions are integrated into one electronic device. .

As digital camera manufacturing technology develops, electronic devices equipped with small and lightweight camera modules have been commercialized. As the camera module is installed in electronic devices (eg, mobile communication terminals) that are usually carried at all times, users can easily utilize various functions such as video calls or augmented reality as well as taking pictures or videos.

Recently, electronic devices including a plurality of cameras are becoming popular. The electronic device may include, for example, a camera module including a wide-angle camera and a telephoto camera. The electronic device may acquire a wide-angle image by photographing a scene in a wide range around the electronic device using a wide-angle camera, or obtain a telephoto image by photographing a scene corresponding to a scene relatively far from the electronic device using a telephoto camera. can In this way, miniaturized electronic devices such as smart phones include a plurality of camera modules or lens assemblies, thereby invading the compact camera market, and are expected to replace high-performance cameras such as single-lens reflex cameras in the future. .

The foregoing information may be provided as background technology for the purpose of assisting in the understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in connection with the present disclosure.

In mounting a plurality of camera modules, it may be difficult to secure a space for arranging the camera modules in a miniaturized electronic device such as a smart phone. For example, in consideration of portability, the number of camera modules that can be mounted in an electronic device may be limited in the trend of miniaturization, light weight, and/or thinning, and there is a limit to securing a space or range in which the lens(s) can maneuver. Therefore, there may be difficulties in implementing the continuous zoom function.

A folded camera may be useful for extending the range of adjustment of focal length. For example, in a folded camera, since a reflective member such as a prism or a mirror is disposed, the design or arrangement of the direction in which the lenses are arranged may be free regardless of the direction in which external light is incident. As the degree of freedom in the design of the arrangement direction of the lenses in the folded camera is improved, a miniaturized telephoto camera can be implemented, and it can be combined with a wide-angle camera and mounted in an electronic device.

In general, according to a method in which a user holds an electronic device or a general configuration of the electronic device, when photographing a subject, external light may be incident into the electronic device substantially parallel to a thickness direction of the electronic device. When a folded camera is disposed in such a general holding method or electronic device, a direction in which external light is incident on the electronic device and a direction in which light is incident to the image sensor may be different. For example, since the width or length of an image sensor or imaging surface may affect the thickness of an electronic device, it may be difficult to place a folded camera in a miniaturized or thinned electronic device such as a smart phone.

Various embodiments of the present disclosure may provide a miniaturized camera module and/or an electronic device including the same to solve at least the above-described problems and/or disadvantages and provide at least the following advantages.

Various embodiments of the present disclosure may provide a camera module that can be easily mounted in a miniaturized electronic device while contributing to improved telephoto performance by having a folded camera structure.

Various embodiments of the present disclosure may provide an electronic device having improved optical performance by including a plurality of camera modules while being miniaturized.

Additional aspects according to various embodiments will be presented through the detailed description that follows, and may be apparent in part from the description or understood through examples of a presented implementation.

According to various embodiments of the present disclosure, a camera module and/or an electronic device including the same may include a sensor substrate, an image sensor disposed on one surface of the sensor substrate, and a sensor substrate in a state surrounding at least a portion of the image sensor. a sensor enclosure disposed thereon, and an optical element disposed in the sensor enclosure in a state facing the image sensor, wherein the image sensor is set to detect incident light passing through the optical element; A sensor enclosure may be attached at least partially to an edge of one side of the image sensor facing the optical element.

According to various embodiments of the present disclosure, an electronic device may include a housing including a first surface and a second surface facing the opposite direction of the first surface, and any one of the first surface and the second surface. and at least one camera module configured to detect incident light, wherein the at least one camera module surrounds a sensor substrate, an image sensor disposed on one surface of the sensor substrate, and at least a portion of the image sensor. A sensor enclosure disposed on a sensor substrate, an infrared cut filter disposed in the sensor enclosure in a state facing the image sensor, and external light incident through one of the first surface and the second surface in a first optical axis direction. a reflective member configured to refract or reflect light in a direction of a second optical axis intersecting the first optical axis, and disposed between the reflective member and the image sensor in the direction of the second optical axis, and refracted or reflected by the reflective member. and at least one lens configured to guide or focus light to the image sensor, wherein the image sensor is set to detect incident light passing through the infrared cut filter, and the image sensor facing the infrared cut filter At least a portion of the sensor enclosure may be attached to an edge of one surface.

A camera module and/or electronic device according to various embodiments of the present disclosure protects an image sensor from an external environment by using a sensor enclosure, and is at least partially attached to a surface of the image sensor, so that it can be easily miniaturized. For example, the camera module according to various embodiments of the present disclosure may be easily disposed in a miniaturized or thinned electronic device, and may be usefully utilized even in a structure in which an electronic device includes a plurality of camera modules. In one embodiment, when the camera module according to various embodiments of the present disclosure has a folded structure including a reflective member, telephoto performance of the electronic device is improved while being easily placed in a miniaturized or thinned electronic device. can make it In addition, various effects identified directly or indirectly through this document may be provided.

The above-described or other aspects, configurations and/or advantages of various embodiments of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.
1 is a block diagram illustrating an electronic device in a network environment according to various embodiments disclosed herein.
2 is a perspective view illustrating the front of an electronic device according to various embodiments disclosed herein.
FIG. 3 is a perspective view illustrating a rear side of the electronic device shown in FIG. 2 .
FIG. 4 is an exploded perspective view illustrating the electronic device shown in FIG. 2 .
5 is a plan view illustrating a rear surface of an electronic device according to various embodiments disclosed herein.
FIG. 6 is a cross-sectional view of a portion of the electronic device taken along line AA' of FIG. 5 .
7 is a perspective view illustrating a camera module according to various embodiments of the present disclosure.
8 is a perspective view illustrating a sensor assembly of a camera module according to various embodiments of the present disclosure.
9 is an exploded perspective view illustrating a sensor assembly of a camera module according to various embodiments of the present disclosure.
10 is a plan view illustrating an image sensor of a camera module according to various embodiments of the present disclosure.
11 is a cross-sectional view illustrating a sensor assembly of a camera module according to various embodiments of the present disclosure by cutting along line BB′ in FIG. 8 .
FIG. 12 is a cross-sectional perspective view illustrating a sensor assembly of a camera module according to various embodiments of the present disclosure by cutting along line BB′ of FIG. 8 .
13 is a cross-sectional view illustrating a sensor assembly of a camera module according to another embodiment of the present disclosure by cutting along line BB′ in FIG. 8 .
FIG. 14 is a cross-sectional perspective view illustrating a sensor assembly of a camera module according to another embodiment of the present disclosure by cutting along line BB′ of FIG. 8 .
15 is a cross-sectional view illustrating a sensor assembly of a camera module according to various embodiments of the present disclosure by cutting along line C-C′ in FIG. 8 .
Throughout the accompanying drawings, like reference numbers may be assigned to like parts, components and/or structures.

The following description of the accompanying drawings may be provided to facilitate a comprehensive understanding of various implementations of the disclosure defined by the claims and equivalents. Although specific embodiments disclosed in the following description contain various specific details to aid understanding, they are considered to be one of various embodiments. Accordingly, it is obvious to those skilled in the art that various changes and modifications of the various implementations described in this disclosure can be made without departing from the scope and spirit of the disclosure. Also, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to their referenced meanings and may be used to clearly and consistently describe various embodiments of the present disclosure. Accordingly, it will be apparent to those skilled in the art that the following descriptions of various implementations of the disclosures are provided for explanatory purposes only and not for purposes of limiting the scope of rights and the disclosures equating thereto.

It should be understood that the singular forms of "a", "an", and "the" include plural meanings, unless the context clearly dictates otherwise. Thus, for example, "component surface" may be meant to include one or more of the surfaces of a component.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphics processing unit, a neural network processing unit) that may operate independently of or together with the main processor 121 . (NPU; neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg : Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It is possible to support the establishment of and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, a legacy communication module). It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined by the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. there is.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal (e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external devices among the external electronic devices 102 , 104 , and 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC) or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited. A (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document are software (eg, a program) including one or more instructions stored in a storage medium (eg, internal memory or external memory) readable by a machine (eg, an electronic device). can be implemented as For example, a processor (eg, a processor) of a device (eg, an electronic device) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smartphones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of objects, and some of the plurality of objects may be separately disposed from other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

In the following detailed description, the length direction, width direction and/or thickness direction of the electronic device may be referred to, the length direction being 'Y-axis direction', the width direction being 'X-axis direction', and/or the thickness direction. may be defined as 'Z-axis direction'. In some embodiments, 'negative/positive (-/+)' may be referred to together with the Cartesian coordinate system illustrated in the drawing regarding the direction in which the component is directed. For example, the front of the electronic device or housing may be defined as 'the surface facing the +Z direction' and the rear surface may be defined as 'the surface facing the -Z direction'. In some embodiments, the side of the electronic device or housing may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and/or an area facing the -Y direction. In another embodiment, 'X-axis direction' may mean including both '-X direction' and '+X direction'. Note that this is based on the Cartesian coordinate system described in the drawings for brevity of description, and the description of these directions or components does not limit various embodiments disclosed in this document.

2 is a perspective view showing the front of an electronic device 200 according to various embodiments disclosed in this document. FIG. 3 is a perspective view illustrating a rear side of the electronic device 200 shown in FIG. 2 .

2 and 3, the electronic device 200 according to an embodiment includes a first side (or front side) 210A, a second side (or back side) 210B, and a first side 210A and It may include a housing 210 including a side surface 210C surrounding a space between the second surfaces 210B. In another embodiment (not shown), the housing may refer to a structure forming some of the first face 210A, the second face 210B, and the side face 210C of FIG. 2 . According to one embodiment, the first surface 210A may be formed by a front plate 202 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent. The second surface 210B may be formed by the substantially opaque back plate 211 . The rear plate 211 is formed, for example, of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be. The side surface 210C is coupled to the front plate 202 and the back plate 211 and may be formed by a side structure (or “side structure”) 218 comprising metal and/or polymer. In some embodiments, back plate 211 and side structure 218 may be integrally formed and include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 202 includes two first regions 210D that are curved from the first surface 210A toward the rear plate 211 and extend seamlessly, the front plate 210D. (202) on both ends of the long edge. In the illustrated embodiment (see FIG. 3 ), the rear plate 211 has two second regions 210E that are curved and seamlessly extended from the second surface 210B toward the front plate 202 at a long edge. Can be included at both ends. In some embodiments, the front plate 202 (or the rear plate 211 ) may include only one of the first regions 210D (or the second regions 210E). In another embodiment, some of the first regions 210D or the second regions 210E may not be included. In the above embodiments, when viewed from the side of the electronic device 200, the side structure 218 is the first area 210D or the second area 210E as described above is not included in the side side. 1 thickness (or width), and may have a second thickness thinner than the first thickness at a side surface including the first regions 210D or the second regions 210E.

According to an embodiment, the electronic device 200 includes a display 201, audio modules 203, 207, and 214, sensor modules 204, 216, and 219, camera modules 205, 212, and 213, and key input. At least one of the device 217, the light emitting element 206, and the connector holes 208 and 209 may be included. In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or the light emitting device 206) or may additionally include other components.

The display 201 may be exposed through a substantial portion of the front plate 202, for example. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first area 210D of the first surface 210A and the side surface 210C. In some embodiments, a corner of the display 201 may be substantially identical to an adjacent outer shape of the front plate 202 . In another embodiment (not shown), in order to expand the area where the display 201 is exposed, the distance between the periphery of the display 201 and the periphery of the front plate 202 may be substantially the same.

In another embodiment (not shown), a recess or opening is formed in a part of the screen display area of the display 201, and the audio module 214, the sensor aligned with the recess or the opening It may include at least one or more of the module 204 , the camera module 205 , and the light emitting device 206 . In another embodiment (not shown), on the back of the screen display area of the display 201, the audio module 214, the sensor module 204, the camera module 205, the fingerprint sensor 216, and the light emitting element 206 ) may include at least one of them. In another embodiment (not shown), the display 201 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic stylus pen. can be placed. In some embodiments, at least a portion of the sensor modules 204 and 219 and/or at least a portion of the key input device 217 may be located in the first regions 210D and/or the second region 210E. can be placed in the field.

The audio modules 203 , 207 , and 214 may include microphone holes 203 and speaker holes 207 and 214 . A microphone for acquiring external sound may be disposed inside the microphone hole 203, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for communication. In some embodiments, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or a speaker may be included without the speaker holes 207 and 214 (eg, a piezo speaker).

The sensor modules 204 , 216 , and 219 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 200 or an external environmental state. The sensor modules 204, 216, and 219 may include, for example, a first sensor module 204 (eg, a proximity sensor) and/or a second sensor module (eg, a proximity sensor) disposed on the first surface 210A of the housing 210. (not shown) (eg, a fingerprint sensor), and/or a third sensor module 219 (eg, an HRM sensor) and/or a fourth sensor module 216 disposed on the second surface 210B of the housing 210. ) (eg, a fingerprint sensor). The fingerprint sensor may be disposed on the second surface 210B as well as the first surface 210A (eg, the display 201 ) of the housing 210 . The electronic device 200 includes the sensor module 176 of FIG. 1 , for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a bio sensor, At least one of a temperature sensor, a humidity sensor, and an illuminance sensor may be further included.

The camera modules 205, 212, and 213 include a first camera device 205 disposed on the first surface 210A of the electronic device 200 and a second camera device 212 disposed on the second surface 210B. ), and/or flash 213. The camera devices 205 and 212 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .

The key input device 217 may be disposed on the side surface 210C of the housing 210 . In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217, and the key input devices 217 that are not included may include other key input devices such as soft keys on the display 201. can be implemented in the form In some embodiments, the key input device may include a sensor module 216 disposed on the second side 210B of the housing 210 .

The light emitting device 206 may be disposed on, for example, the first surface 210A of the housing 210 . The light emitting element 206 may provide, for example, state information of the electronic device 200 in the form of light. In another embodiment, the light emitting device 206 may provide, for example, a light source interlocked with the operation of the camera module 205 . The light emitting element 206 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 208 and 209 include a first connector hole 208 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, an earphone jack) 209 capable of accommodating a connector for transmitting and receiving an audio signal.

FIG. 4 is an exploded perspective view illustrating the electronic device 200 shown in FIG. 2 .

Referring to FIG. 4 , the electronic device 300 (eg, the electronic device 101 or 200 of FIGS. 1 to 3 ) includes a side structure 310, a first support member 311 (eg, a bracket), a front surface Plate 320 (eg, front plate 202 in FIG. 2 ), display 330 (eg, display 201 in FIG. 2 ), printed circuit board 340 (eg, printed circuit board (PCB), PBA) (printed board assembly), flexible PCB (FPCB) or rigid-flexible PCB (RFPCB)), battery 350, second support member 360 (eg rear case), antenna 370 and rear plate 380 (eg, the rear plate 211 of FIG. 3). In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360) or may additionally include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 2 or 3, and duplicate descriptions will be omitted below.

The first support member 311 may be disposed inside the electronic device 300 and connected to the side structure 310 or integrally formed with the side structure 310 . The first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The display 330 may be coupled to one surface of the first support member 311 and the printed circuit board 340 may be coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 340 . The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

Memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed on a substantially coplanar surface with the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 or may be disposed detachably from the electronic device 300 .

The antenna 370 may be disposed between the rear plate 380 and the battery 350 . The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side structure 310 and/or the first support member 311 or a combination thereof.

In the detailed description below, reference may be made to the electronic devices 101, 102, 104, 200, and 300 of the preceding embodiments, and the same reference numerals are assigned to components that can be easily understood through the preceding embodiments. or omitted, and the detailed description may also be omitted.

FIG. 5 is a plan view illustrating a rear surface of an electronic device 400 (eg, the electronic devices 101 , 102 , 104 , 200 , and 300 of FIGS. 1 to 4 ) according to various embodiments disclosed herein. FIG. 6 is a cross-sectional view of a portion of the electronic device 400 taken along line AA' of FIG. 5 . 7 is a perspective view illustrating a camera module 500 (eg, the camera module 405 of FIG. 6 ) according to various embodiments of the present disclosure.

5 to 7 , the electronic device 400 according to various embodiments disclosed in this document may include a camera window 385 disposed on one surface (eg, the second surface 210B of FIG. 3 ). can In some embodiments, camera window 385 may be part of back plate 380 . In one embodiment, the camera window 385 may be coupled to the rear plate 380 through a decorative member 389, and when viewed from the outside, the decorative member 389 surrounds the camera window 385. can be exposed in the form According to one embodiment, the camera window 385 may include a plurality of transparent areas 387, and the camera module 500 is disposed inside the camera window 385 to at least one of the transparent areas 387. can receive external light. In another embodiment, the electronic device 400 may emit light to the outside by including at least one light source (eg, an infrared light source) disposed to correspond to another one of the transparent regions 387 . For example, the camera modules 405 and 500 or a light source may be disposed to receive external light through one of the transparent regions 387 or emit light to the outside of the electronic device 400 .

According to various embodiments, the electronic device 400 may include at least one of the camera modules 405 and 500 or a wide-angle camera, an ultra-wide-angle camera, a close-up camera, a telephoto camera, or an infrared photodiode as a light receiving device, and may include a light source or a light emitting device. It may include a flash as an element (e.g., flash 213 in FIG. 3) or an infrared laser diode. In some embodiments, the electronic device 400 may emit an infrared laser toward an object using an infrared laser diode and an infrared photodiode, and detect a distance or depth to the object by receiving the infrared laser reflected by the object. can In another embodiment, the electronic device 400 may photograph a subject by using any one or a combination of two or more of the camera modules, and may provide illumination toward the subject using a flash, if necessary.

According to various embodiments, a wide-angle camera, an ultra-wide-angle camera, or a close-up camera among camera modules may have a smaller length in the optical axis direction of the lens(s) when compared to a telephoto camera (eg, the camera modules 405 and 500). can For example, a telephoto camera (eg, the camera modules 405 and 500) having a relatively large focal length adjustment range may have a larger forward and backward movement range of the lenses 453a, 453b, and 453c. In one embodiment, the wide-angle camera, the ultra-wide-angle camera, or the close-up camera substantially increases the thickness of the electronic device 400 (eg, the thickness measured in the Z-axis direction of FIG. 4 or 6) even when the lens(s) are arranged along the direction. An effect on the thickness of the electronic device 400 may be small. For example, a wide-angle camera, an ultra-wide-angle camera, or a close-up camera may be disposed in the electronic device 400 in a state in which a direction in which light is incident on the electronic device 400 from the outside and an optical axis direction of the lens(s) are substantially the same.

According to various embodiments, compared to a wide-angle camera, an ultra-wide-angle camera, or a macro camera, the camera modules 405 and 500 (eg, a telephoto camera) have a small angle of view, but may be useful for photographing a subject at a greater distance, More lenses 453a, 453b, 453c may be included or the movement distance of the lens 453a, 453b, 453c(s) may be greater in adjusting the focal length. For example, when the lenses 453a, 453b, and 453c of the camera modules 405 and 500 are arranged in the thickness direction (eg, Z-axis direction) of the electronic device 400, the thickness of the electronic device 400 is increase, or the camera modules 405 and 500 may protrude to the outside of the electronic device 400.

According to various embodiments, the camera modules 405 and 500 are folded cameras including an optical member such as a prism or a mirror (eg, a reflective member 455), and include a direction in which external light is incident (eg, FIG. 6 ). The direction in which the lenses 453a, 453b, and 453c are arranged (eg, the direction of the second optical axis O2 in FIG. 6) may be freely designed or arranged regardless of the direction of the first optical axis O1 of FIG. For example, the reflective member 455 may refract or reflect light incident from the outside, thereby changing a traveling direction of light and guiding the light to the lenses 453a, 453b, and 453c. The lenses 453a, 453b, and 453c may guide or focus light refracted or reflected by the reflective member 455 between the reflective member 455 and the image sensor 451 to the image sensor 451 .

According to various embodiments, the direction of the first optical axis O1 may be substantially parallel to the thickness direction of the electronic device 400, and the direction of the second optical axis O2 may reflect light refracted or reflected by the reflective member 455. As the moving direction, it may be a direction crossing the direction of the first optical axis O1. In some embodiments, the direction of the second optical axis O2 may be substantially perpendicular to the direction of the first optical axis O1 , and may be substantially perpendicular to the direction of the electronic device 400 or the housing (eg, the width direction of the housing 210 of FIG. 2 ). : may be substantially parallel to the X-axis direction of FIG. 4) or the longitudinal direction (eg, the Y-axis direction of FIG. 4). In another embodiment, the second optical axis O2 may be substantially parallel to the XY plane while crossing the width direction or length direction of the housing.

The camera module 405 illustrated in FIG. 6 is an example of a folded camera or a telephoto camera, and the lenses 453a, 453b, and 453c (s) are aligned in the width direction (eg, parallel to the X axis) of the electronic device 400. direction) or may be arranged to enable forward and backward movement along the width direction. According to an embodiment, the camera module 405 includes a reflective member 455 that receives external light and refracts or reflects it, and a lens system 453 that injects light refracted or reflected by the reflective member 455 into an image sensor. ) (eg, a lens assembly), and/or an image sensor 451 aligned on an optical axis (eg, the second optical axis O2 ) of the lens system 453 . For example, the image sensor 451 may receive external light through the reflective member 455 and the lens system 453 . In some embodiments, external light is incident to the reflective member 455 along the first optical axis O1 direction, is reflected or refracted by the reflective member 455, and propagates along the second optical axis O2 direction to the lens system. It may be incident to the image sensor 451 through 453.

According to various embodiments, the reflective member 455 may include, for example, a prism or a mirror, and transmit light incident in the direction of the first optical axis O1 to another direction (eg, the direction of the second optical axis O2). ) can be reflected or refracted. In this embodiment, a configuration in which the direction of the first optical axis O1 and the direction of the second optical axis O2 are substantially perpendicular to each other is exemplified, but various embodiments of the present disclosure are not limited thereto, and the electronic device 400 or the housing (eg: An angle at which the direction of the first optical axis O1 and the direction of the second optical axis O2 intersect may vary according to the structure of the housing 210 of FIG. 2 . In one embodiment, the lens system 453 is an assembly including at least one lens 453a, 453b, and 453c, wherein the lenses 453a, 453b, and 453c(s) are arranged along the direction of the second optical axis O2. can In some embodiments, the direction of the first optical axis O1 may be substantially parallel to the thickness direction (eg, Z-axis direction) of the electronic device 400, and the direction of the second optical axis O2 may be substantially parallel to the width direction (eg, the Z-axis direction) of the electronic device 400. eg X-axis direction) or longitudinal direction (eg Y-axis direction).

According to various embodiments, the electronic device 400 may include a first camera support member 381 or a second camera support member 383 . The first camera support member 381 or the second camera support member 383 may be the camera module 405 or 500 and/or another camera module adjacent to the camera module 405 or 500 (eg, a wide-angle camera, an ultra-wide-angle camera, or At least one of the macro cameras) may be disposed or fixed inside the rear plate 380 or the camera window 385 . In some embodiments, the first camera support member 381 or the second camera support member 383 may be substantially the second support member (eg, the second support member 360 of FIG. 4 ) or the first support member (eg, the second support member 360 in FIG. 4 ). : It may be part of the first support member 311 of FIG. 4 .

Referring to FIG. 7 , a camera module 500 may include a camera housing 501 and/or a sensor assembly 505 . The camera housing 501, for example, accommodates the reflective member 455 and/or the lens system 453 and includes an opening 517 so that external light can be received therein. For example, the opening 517 may be disposed corresponding to one of the transparent regions 387 of FIG. 5 or 6 on the first optical axis O1. In some embodiments, the opening 517 may transmit light but isolate the inner space of the camera housing 501 from the outer space. In one embodiment, the reflective member 455 may be disposed facing the opening 517 within the camera housing 501 . The sensor assembly 505 may include, for example, an image sensor (eg, the image sensors 451 and 551 of FIG. 6 or 9), a sensor substrate 553, a sensor enclosure 555 (eg, a sub-housing, a holder). and/or a wiring board 557, and may be coupled to the camera housing 501 at a position spaced apart from the opening 517 by a designated distance. The sensor assembly 505 will be described in more detail with further reference to the embodiments of FIG. 8 or FIG. 9 .

Although reference numerals or detailed descriptions in the drawings are omitted, the camera module 405 or 500 or the electronic device 400 is a lens barrel structure for arranging the lenses 453a, 453b, or 453c(s) at designated positions, or focus adjustment. , a driving device for adjusting the focal length and/or compensating for hand shake may be further included. In some embodiments, the camera module 405 or 500 or the electronic device 400 may further include a driving device that moves the image sensor 451 in a plane substantially perpendicular to the direction of the second optical axis O2. , a hand shake correction operation may be performed by moving the image sensor 451 . In another embodiment, the hand shake compensation operation may be implemented by rotating or tilting the reflective member 455 (eg, a prism). In the hand shake correction operation, the reflective member 455 may be rotated or tilted within an angle range of approximately 1.5 degrees.

According to various embodiments, when combined with a first camera module such as a wide-angle camera, an ultra-wide-angle camera, or a close-up camera, the second camera module (eg, the camera modules 405 and 500 of FIG. 6 or 7) implementing a telephoto function may function as a tracking or scan camera that tracks a subject within an area of an image captured by the first camera module or scans a partial area of an image. In an operation of tracking a subject or scanning a part of an image area, an angular range in which the reflective member 455 rotates or tilts may be greater than that in an image stabilization operation.

8 is a perspective view illustrating a sensor assembly 505 of a camera module (eg, the camera module 500 of FIG. 7 ) according to various embodiments of the present disclosure. 9 is an exploded perspective view illustrating the sensor assembly 505 of the camera module 500 according to various embodiments of the present disclosure. 10 is a plan view illustrating an image sensor 551 of a camera module 500 according to various embodiments of the present disclosure.

8 to 10 , the image sensor 551 is disposed on one surface of the sensor substrate 553 and may be electrically connected to the sensor substrate 553 by wire bonding. According to an embodiment, a surface receiving external light of the image sensor 551 may include an active region 551a and an inactive region 551b disposed on at least a part of the circumference of the active region 551a. "Active area 551a" is an area in which sensors (eg, pixels) for receiving or detecting light are arranged, and is defined by a specified distance from the edge of the image sensor 551 (eg, inactive area 551b). It may be formed to be spaced apart by the width (W). In one embodiment, the image sensor 551 (eg, the active area 551a) may be substantially aligned on the second optical axis O2. The inactive area 551b may protect the active area 551a by, for example, providing a specified gap between the edge of the image sensor 551 and the active area 551a, and in some embodiments placing electrical wiring therein. It can be used as an area for An “region for disposing an electric wire” may be understood as an area in which, for example, electrode pad(s) (not shown) for wire bonding are disposed.

According to various embodiments, the image sensor 551 may include an active region 551a on one surface having a substantially rectangular shape. For example, one surface on which the image sensor 551 or the active region 551a is disposed may include a pair of long sides LS1 and LS2 and a pair of short sides SS1 and SS2 at the edge, and the long side (LS1, LS2) and short sides (SS1, SS2) may be disposed substantially perpendicular to each other. According to an embodiment, a first long side LS1 of the pair of long sides LS1 and LS2 extends in a first direction (eg, a horizontal direction in FIG. 10 ) and has a first length L1 in the first direction. can Among the pair of short sides SS1 and SS2, the first short side SS1 extends from one end of the first long side LS1 in a second direction crossing the first direction (eg, the vertical direction in FIG. It may have a second length L2 smaller than the length L1. Among the pair of long sides LS1 and LS2, a second long side LS2 may extend from one end of the first short side SS1 in the first direction and have a first length L1. In one embodiment, the second long side LS2 may be spaced apart from the first long side LS1 by a second length L2 and may be substantially parallel to the first long side LS1. Of the pair of short sides SS1 and SS2, the second short side SS2 extends from the other end of the second long side LS2 in the second direction, is connected to the other end of the first long side LS1, and has a second length L2. ) can have. In another embodiment, the second short side SS2 may be spaced apart from the first short side SS1 by a first length L1 and may be substantially parallel to the first short side SS1 .

According to various embodiments, the first length L1 may be understood as a horizontal length of the image sensor 551 , and the second length L2 may be understood as a vertical length of the image sensor 551 . As will be described later, a part of the sensor enclosure 555 may be attached to an edge of one side of the image sensor 551 (eg, the side where the active region 551a is disposed). According to one embodiment, a part of the sensor enclosure 555 may be attached to one surface of the image sensor 551 at the edge of the first long side LS1 and/or the second long side LS2. For example, when viewed in the direction of the second optical axis O2, the sensor assembly may have a substantially rectangular shape, and even when the sensor enclosure is disposed, the vertical length of the sensor assembly 505 is substantially equal to the second length L2. can be the same According to one embodiment, when the camera module 500 or sensor assembly 505 is disposed in the electronic device 400, the second length L2 is in the thickness direction of the electronic device 400 (eg, FIGS. 2 to 6 ). By being disposed parallel to the Z-axis direction of ), the influence of the size of the camera module 500 or the sensor assembly 505 on the size (eg, thickness) of the electronic device 400 can be reduced. For example, as the short sides SS1 and SS2 of the image sensor 551 are disposed parallel to the thickness direction of the electronic device 400, the camera module 500 (or sensor assembly 505 )) can be easily mounted. In some embodiments, the short sides SS1 and SS2 of the image sensor 551 may extend from the first surface (eg, the first surface 210A of FIG. 2 ) to the second surface (eg, the second surface of FIG. 3 ( 210A) of the housing). 210B))). In this arrangement structure, the first long side LS1 and the second long side LS2 are disposed to cross each other in the thickness direction (eg, Z-axis direction) or the first optical axis O1 direction of the electronic device 400 . It may be sequentially arranged along the thickness direction of 400 or the direction of the first optical axis O1.

According to various embodiments, even if the first length L1 and the second length L2 of the image sensor 551 are the same, the sensor enclosure 555 at the edge corresponding to the first length L1 is the image sensor 551 ), the sensor assembly 505 viewed from the direction of the second optical axis O2 may have a substantially rectangular shape. For example, even if the image sensor 551 has a substantially square shape, the vertical length of the sensor assembly 505 may be reduced according to the arrangement of the sensor enclosure 555 .

According to various embodiments, in a state where the image sensor 551 is disposed on the sensor substrate 553, an electrical connection (eg, wire bonding) between the image sensor 551 and the sensor substrate 553 is substantially It may be made on the short sides (SS1, SS2) (s) of (551). For example, wire bonding may electrically connect the sensor substrate 553 and the image sensor 551 across short sides SS1 and SS2(s) of the image sensor 551 . In some embodiments, in the width direction (eg, X-axis direction of FIGS. 2 and 3 ) or length direction (eg, Y-axis direction of FIGS. 2 and 3 ) of the electronic device 400 , the image sensor 551 A gap between the active regions 551a from the edge (eg, the width W of the inactive region 551b) may be sufficiently secured. For example, the degree of freedom in designing the size of the image sensor 551 may be higher in the width direction or the length direction than in the thickness direction of the electronic device 400 . According to one embodiment, in a structure in which a portion of the sensor enclosure 555 is disposed on one side of the image sensor 551 on the long side (LS1, LS2)(s) side, on the short side (SS1, SS2) side of the image sensor 551 A sufficient width (W) of the non-active region 551b may be secured so that wire bonding may be facilitated.

According to various embodiments, the sensor enclosure 555 may be disposed to surround at least a portion of the image sensor 551 on one surface of the sensor substrate 553 . For example, the sensor substrate 553 and the sensor enclosure 555 may protect the image sensor 551 from contamination by foreign substances while providing a space for accommodating the image sensor 551 . In one embodiment, the sensor enclosure 555 may provide an opening area 555c to allow external light to enter the image sensor 551, and the camera module 500 or sensor assembly 505 may provide a sensor An optical element 559 (eg, an infrared cut filter) disposed in the opening area 555c of the enclosure 555 and at least partially facing the image sensor 551 may be further included. For example, the optical element 559 may seal a space provided by the sensor substrate 553 and the sensor enclosure 555 while allowing external light to be incident on the image sensor 551 . For example, the image sensor 551 may detect light incident by substantially passing through the optical element 559, and a part of the sensor enclosure 555 substantially faces the optical element 559 and the image sensor ( 551) may be attached to one side. In one embodiment, the optical element 559 may include an infrared cut-off filter, and may block light (eg, infrared rays) in a wavelength band detected by the image sensor 551 without being visually identified.

According to various embodiments, another part of the sensor enclosure 555 may be disposed or attached to the sensor substrate 553 at a position adjacent to the short sides SS1 and SS2 (s) of the image sensor 551 . For example, the sensor enclosure 555 may be mechanically or physically coupled or fixed to the sensor substrate 553, and the sensor enclosure 555 may be positioned adjacent to the long sides LS1 and LS2(s) to form an image sensor. One surface of 551 may not be in direct contact. In one embodiment, the camera module 500 or sensor assembly 505 further includes a sealing member 555a between the sensor enclosure 555 and the image sensor 551 and/or between the sensor enclosure 555 and the sensor substrate. At least a part between (553) can be sealed. In some embodiments, a portion of the sensor enclosure 555 may be connected to, attached to, or disposed on one side of the image sensor 551 through a sealing member 555a. In another embodiment, the sealing member 555a may be formed of an adhesive in a liquid or gel state. For example, although the sealing member 555a is illustrated in a designated shape in FIG. 9 , various embodiments of the present disclosure may not be limited thereto. In one embodiment, a sealing structure (eg, a sealing member) is formed between the sensor enclosure 555 and the image sensor 551 and/or between the sensor enclosure 555 and the sensor substrate 553 by applying a liquid or gel adhesive. (555a)) may be formed or disposed.

According to various embodiments, in a location or region where a portion of the sensor enclosure 555 is disposed on one surface of the image sensor 551, a portion of the side surface of the image sensor 551 (eg, indicated as 'SF1' in FIG. 11 ) portion) to the outside between the side of the sensor substrate 553 (e.g., the portion indicated as 'SF2' in FIG. 11) and the side surface of the sensor enclosure 555 (e.g., the portion indicated as 'SF3' in FIG. 11). may be exposed. For example, a side portion of the image sensor 551 corresponding to (or adjacent to) the first long side LS1 or the second long side LS2 may be exposed to the outside of the sensor enclosure 555 . For example, when viewed from a direction perpendicular to the second optical axis O2, or from the second surface of the housing (eg, the second surface 210B in FIG. 3) to the first surface (eg, the first surface in FIG. 2). 210A), some of the sides of the image sensor 551 may be visually visible. In some embodiments, the camera module 500 or sensor assembly 505 further includes at least one adhesive tape 555b to conceal or protect a portion (eg, side) of the image sensor 551 exposed to the outside. can do. A configuration in which a portion of the side of the image sensor 551 is exposed to the outside or a configuration in which the image sensor 551 is protected with an adhesive tape 555b will be described in more detail through the embodiments of FIGS. 11 to 14. .

According to various embodiments, the wiring board 557 substantially extends from the sensor board 553 and is coupled to a main circuit board (eg, the printed circuit board 340 of FIG. 4 ) and is at least partially a flexible printed circuit board. can include For example, the sensor assembly 505 may be electrically connected to a main circuit board through a wiring board 557 . In one embodiment, the wiring board 557 includes a first flexible region 557a extending from the sensor substrate 553 (eg, a first flexible printed circuit board), of the first flexible region 557a. A rigid region 557b connected to one end (eg, a rigid printed circuit board), and a second flexible region 557c connected to one end of the rigid region 557b (eg, a second flexible printed circuit board). , and/or a connection member 557d (eg, a connector) disposed at one end of the second flexible region 557c. The rigid region 557b may be used as a structure for standardizing the arrangement of the wiring board 557 . For example, as illustrated in FIG. 7 , a rigid region 557b may be disposed on a side surface different from the sensor substrate 553 on the camera housing 501, and the first flexible region 557a is the sensor substrate ( 553) and the rigid region 557b to provide a stable electrical wire by being deformed into an appropriate shape. The connection member 557d is substantially coupled to the main circuit board (eg, the printed circuit board 340 of FIG. 4 ) and electrically connected to the main circuit board, and the second flexible region 557c is connected to the rigid region 557b. It can be deformed into an appropriate shape between the main circuit boards to provide a stable electric wiring.

According to various embodiments, the camera module 500 or sensor assembly 505 is in a state where the long sides LS1 and LS2 are substantially parallel to the X or Y axis and cross the Z axis or the first optical axis O1. It may be disposed on the electronic device 101 , 102 , 104 , 200 , 300 , or 400 . According to one embodiment, the camera module 500 or the sensor assembly 505 is electronic devices 101, 102, while the short sides SS1 and SS2 are substantially parallel to the Z-axis and cross the X-axis or Y-axis. 104, 200, 300, 400). For example, the long sides LS1 and LS2 are disposed parallel to each other in the width direction or the length direction of the electronic devices 101, 102, 104, 200, 300, and 400, thereby increasing the width of the sensor assembly 505 or the image sensor 551. The design freedom for the electronic device 101 may be high, and the camera module 500 is thinned by arranging the short sides SS1 and SS2 in parallel to the thickness direction of the electronic device 101 , 102 , 104 , 200 , 300 , and 400 . , 102, 104, 200, 300, 400) can be easily mounted. In some embodiments, the camera module 500 has a folded structure (eg, the reflective member 455 in FIG. 6 ) to allow movement of the lens (eg, the lenses 453a, 453b, and 453c in FIG. 6 )(s). Since it is easy to secure a range or space, a telescopic function can be easily implemented.

FIG. 11 is a cross-sectional view illustrating a sensor assembly 505 of a camera module (eg, the camera module 500 of FIG. 7 ) according to various embodiments of the present disclosure by cutting along line BB′ of FIG. 8 . FIG. 12 is a cross-sectional perspective view illustrating the sensor assembly 505 of the camera module 500 according to various embodiments of the present disclosure by cutting along line BB′ of FIG. 8 .

11 and 12, the short sides SS1 and SS2(s) of the image sensor 551 are shown, and both ends of the short sides SS1 and SS2(s) substantially correspond to the positions of the long sides LS1 and LS2. can Referring to FIGS. 11 and 12 , a portion of the sensor enclosure 555 may not directly contact the image sensor 551 while being disposed at an edge of one surface of the image sensor 551 . In one embodiment, a portion SF1 of the side surface of the image sensor 551 (eg, a portion adjacent to the long side in FIG. 10 ) is a side surface SF2 of the sensor substrate 553 and a side surface SF3 of the sensor enclosure 555 . ) can be exposed to the outside space. In some embodiments, a sealing member 555a may be disposed between the sensor enclosure 555 and one surface of the image sensor 551 and/or between the sensor enclosure 555 and the sensor substrate 553 to form a sealing structure; In some embodiments, the sealing member 555a may attach the sensor enclosure 555 to the image sensor 551 or the sensor substrate 553. In FIG. 11, a part of the sensor enclosure 555 on the left side is illustrated in a state off from the image sensor 551, and in this case, the sealing member 555a is disposed between the sensor enclosure 555 and the sensor substrate 553 while The side of the image sensor 551 may be concealed. For example, when viewed from the outside, the surfaces of the sensor enclosure 555, the sealing member 555a, the image sensor 551, and/or the sensor substrate 553 are sequentially arranged on one side of the sensor assembly 505. The surface of the sensor enclosure 555, the sealing member 555a, and/or the sensor substrate 553 may be sequentially arranged on the other side of the sensor assembly 505.

FIG. 13 is a cross-sectional view illustrating a sensor assembly 505 of a camera module (eg, the camera module 500 of FIG. 7 ) according to another embodiment of the present disclosure, cut along line BB' in FIG. 8 . FIG. 14 is a cross-sectional perspective view illustrating the sensor assembly 505 of the camera module 500 according to another embodiment of the present disclosure by cutting along line BB′ in FIG. 8 .

13 and 14, a portion of the sensor enclosure 555 may be substantially disposed on one surface of the image sensor 551, and a long side (eg, the long side of FIG. 10 ( A portion corresponding to LS1 and LS2) may be substantially exposed to the external space through a gap between the sensor enclosure 555 and the sensor substrate 553 . In this embodiment, the sealing member 555a may seal the sensor enclosure 555 and the image sensor 551 . In another embodiment, the adhesive tape 555b may be attached from at least one side of the sensor enclosure 555 to the side of the sensor substrate 553, and a portion of the adhesive tape 555b is attached to the image sensor 551. It can conceal the side or be attached to the side of the image sensor 551. In the embodiment of FIG. 14 , the adhesive tape 555b is attached to a portion of the side surface of the image sensor 551 exposed to the outside, but note that various embodiments of the present disclosure are not limited thereto. For example, even if exposed to the outside of the sensor enclosure 555, the side of the image sensor 551 may be completely concealed from the outside of the sensor assembly 505 by attaching the adhesive tape 555b.

FIG. 15 is a cross-sectional view illustrating a sensor assembly 505 of a camera module (eg, the camera module 500 of FIG. 7 ) according to various embodiments of the present disclosure, cut along line C-C' in FIG. 8 .

In FIG. 15 , the long sides LS1 and LS2(s) of the image sensor 551 are shown, and both ends of the long sides LS1 and LS2(s) may substantially correspond to the positions of the short sides SS1 and SS2. Referring to FIG. 15 , the sensor enclosure 555 may be substantially disposed or fixed on one surface of the sensor substrate 553 at a position adjacent to at least one of short sides SS1 and SS2 of the image sensor 551 . For example, a structure for substantially disposing or fixing the sensor enclosure 555 may be implemented on the sensor substrate 553 . In one embodiment, the sensor enclosure 555 may not substantially contact the image sensor 551 while sealing or sealing a space in which the image sensor 551 is accommodated. In a structure in which a part of the sensor enclosure 555 is disposed on one side of the image sensor 551, a sealing member 555a is provided to form a sealing structure between the sensor enclosure 555 and the image sensor 551 or make direct contact therewith. Without doing so, the sensor enclosure 555 may be attached to the image sensor 551 .

As such, a camera module (eg, the camera module 500 of FIG. 7 ) or a sensor assembly (eg, the sensor assembly 505 of FIG. 8 or 9 ) according to various embodiments of the present disclosure is directed toward a high degree of design freedom. (eg, in the X-axis direction or Y-axis direction of FIG. 4) or by providing a wire bonding area of the image sensor 551 in the area, the electronic device (eg, the electronic device 101, 102, 104, 200, 300, 400)) in the thickness direction (eg, the Z-axis direction of FIG. 4 or 6), the image sensor or camera module may be miniaturized in a portion (or direction) subject to size limitations. For example, no wire bonding area is disposed in the thickness direction of the electronic device 400 (eg, the upper side or lower side of the active region 551a), and the electronic device 400 has a width direction or a length on the electronic device 400. Along the direction, the wire bonding region and the active region 551a may be disposed on one side of each other. In another embodiment, the sensor enclosure 555 is disposed on one side of the image sensor 551 in a portion or direction subject to size limitations (eg, the thickness direction of the electronic device 400 or the Z-axis direction in FIG. 6), The camera module 500 may be further miniaturized. For example, the camera module 500 according to various embodiments of the present disclosure may provide an environment in which a plurality of camera modules are easily disposed in one electronic device. In another embodiment, when the camera module 500 has a folded structure including a reflective member (eg, the reflective member 455 of FIG. 6 ), the telescopic function of the miniaturized or thinned electronic device 400 can be achieved. It can be easy to improve.

As described above, according to various embodiments of the present disclosure, a camera module (eg, the camera module 180, 405, or 500 of FIGS. 1, 6, or 7) and/or an electronic device including the camera module (eg, the camera module 180, 405, or 500 of FIG. 1, 6, or 7) The electronic devices 101, 102, 104, 200, 300, and 400 of 1 to 6 may include a sensor substrate (eg, the sensor substrate 553 of FIGS. 7 to 9 or 11 to 15), the sensor substrate An image sensor (for example, the image sensors 451 and 551 of FIGS. 6, 9, 10 or 11 to 15) disposed on one surface of the image sensor, and disposed on the sensor substrate in a state of surrounding at least a part of the image sensor. a sensor enclosure (e.g., sensor enclosure 555 of FIGS. 8, 9, or 11-15), and an optical element disposed in the sensor enclosure facing the image sensor (e.g., FIG. 8, FIG. 9, or optical element 559 of FIG. 15), wherein the image sensor is configured to detect light incident through the optical element, the sensor enclosure at least partially facing the optical element. A view may be attached to the edge of one surface of the image sensor (eg, the surface where the active region 551a of FIG. 10 is disposed).

According to various embodiments of the present disclosure, the image sensor has a first long side (eg, FIG. 10 ) extending from an edge of one surface in a first direction and having a first length (eg, the first length L1 of FIG. 10 ). a first long side LS1), and a second length extending from one end of the first long side in a second direction crossing the first direction and smaller than the first length (eg, the second length L2 of FIG. 10 ). )), and a second long side extending from one end of the first short side in the first direction and having the first length (eg, the first short side SS1 of FIG. 10). a second long side LS2), and a second short side extending from one end of the second long side in the second direction and connected to the other end of the first long side and having the second length (eg, in FIG. 10 ). A second short side SS2), and a part of the sensor enclosure on one surface of the image sensor may be attached to at least one of the first long side and the second long side.

According to various embodiments of the present disclosure, another part of the sensor enclosure may be attached to one surface of the sensor substrate at a position adjacent to the first short side or the second short side.

According to various embodiments of the present disclosure, the camera module and/or an electronic device including the camera module as described above may include a sealing member disposed between a part of the sensor enclosure and one surface of the image sensor (eg, FIG. 8, FIG. 9 or 11 to 14), wherein the sealing member bonds a part of the sensor enclosure to one surface of the image sensor or a gap between a part of the sensor enclosure and one surface of the image sensor. It can be configured to seal.

According to various embodiments of the present disclosure, a portion corresponding to the first long side or the second long side (eg, a portion indicated by 'SF1' in FIG. 11 ) of a side surface of the image sensor is a side surface of the sensor substrate (eg : It may be exposed between the portion indicated by 'SF2' in FIG. 11) and the side of the sensor enclosure (eg, the portion indicated by 'SF3' in FIG. 11).

According to various embodiments of the present disclosure, the camera module and/or electronic device including the camera module may include an adhesive tape (eg, FIGS. 8 and 9, An adhesive tape 555b of FIG. 13 or 14) may be further included, and a portion of the adhesive tape may be attached to a side surface of the image sensor.

According to various embodiments of the present disclosure, the first long side and the first short side may be disposed perpendicular to each other.

According to various embodiments of the present disclosure, the camera module and/or an electronic device including the camera module receives external light in a first optical axis direction and refracts or reflects it in a second optical axis direction crossing the first optical axis. A reflective member (eg, the reflective member 455 of FIG. 6) disposed between the reflective member and the image sensor in the direction of the second optical axis, and the light refracted or reflected by the reflective member is reflected in the image It may further include at least one lens (eg, at least one of the lenses 453a, 453b, and 453c(s) of FIG. 6) configured to guide or focus the sensor.

According to various embodiments of the present disclosure, the image sensor may include a first long side extending in a first direction and having a first length from an edge of one surface, and a second long side intersecting the first direction from one end of the first long side. a first short side extending in the direction and having a second length smaller than the first length, a second long side extending from one end of the first short side in the first direction and having the first length, and a second short side extending from one end in the second direction, connected to the other end of the first long side, and having the second length; It may be attached to at least one of the second long sides.

According to various embodiments of the present disclosure, the first long side and the second long side may extend in a direction crossing the first optical axis and be sequentially arranged along the first optical axis direction.

According to various embodiments of the present disclosure, the first short side and the second short side may be disposed parallel to the first optical axis.

According to various embodiments of the present disclosure, when viewed from a direction perpendicular to the second optical axis, a portion of a side surface of the image sensor corresponding to the first long side or the second long side is the side surface of the sensor substrate and the sensor substrate. It can be placed between the sides of the enclosure.

According to various embodiments of the present disclosure, the optical element may include an infrared cut filter.

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101, 102, 104, 200, 300, or 400 of FIGS. 1 to 6) may have a first surface (eg, the first surface of FIG. 1 ). (210A)), a housing (eg, housing 210 of FIG. 2) including a second surface facing the opposite direction of the first surface (eg, second surface 210B of FIG. 3), and the first surface. At least one camera module (eg, the camera module 405 or 500 of FIG. 6 or 7) configured to detect light incident through one of the first surface and the second surface, and the at least one camera module The module includes a sensor substrate (eg, the sensor substrate 553 of FIGS. 7 to 9 or 11 to 15) and an image sensor disposed on one surface of the sensor substrate (eg, FIGS. 6, 9, 10 or 15). 11 to 15 image sensors 451 and 551), a sensor enclosure disposed on the sensor substrate in a state surrounding at least a portion of the image sensor (eg, the sensor enclosure of FIGS. 8, 9 or 11 to 15) 555), an infrared cut-off filter disposed in the sensor enclosure facing the image sensor (e.g., the optical element 559 of FIG. 8, 9, or 15), and a first optical axis (e.g., FIG. 6). A second optical axis (e.g., the second optical axis of FIG. 6 (eg, the second optical axis of FIG. A reflective member configured to refract or reflect in the O2)) direction (eg, the reflective member 455 of FIG. 6 ), and disposed between the reflective member and the image sensor in the second optical axis direction, by the reflective member and at least one lens configured to guide or focus refracted or reflected light to the image sensor (eg, at least one of the lens 453a, 453b, and 453c(s) of FIG. 6 ), wherein the image sensor detects the infrared rays At least a portion of the sensor enclosure may be attached to an edge of one surface of the image sensor that is configured to detect incident light passing through the cut-off filter, and faces the infrared cut-off filter.

According to various embodiments of the present disclosure, it may be set to perform focal distance adjustment or focus adjustment by moving the at least one lens along the second optical axis direction.

According to various embodiments of the present disclosure, the electronic device as described above further includes a display disposed on the first surface (eg, the display 201 or 330 of FIG. 2 or 4 ), and the camera module is the first surface. It can be set to detect the light incident through the 2 planes.

According to various embodiments of the present disclosure, the image sensor has a first long side (eg, FIG. 10 ) extending from an edge of one surface in a first direction and having a first length (eg, the first length L1 of FIG. 10 ). a first long side LS1), and a second length extending from one end of the first long side in a second direction crossing the first direction and smaller than the first length (eg, the second length L2 of FIG. 10 ). )), and a second long side extending from one end of the first short side in the first direction and having the first length (eg, the first short side SS1 of FIG. 10). a second long side LS2), and a second short side extending from one end of the second long side in the second direction and connected to the other end of the first long side and having the second length (eg, in FIG. 10 ). and a second short side SS2), and on one surface of the image sensor, a portion of the sensor enclosure may be attached to at least one of the first long side and the second long side.

According to various embodiments of the present disclosure, the first short side or the second short side may extend in a direction from the first surface toward the second surface.

According to various embodiments of the present disclosure, when viewed in a direction from the second surface toward the first surface, a portion of a side surface of the image sensor corresponding to the first long side or the second long side of the sensor substrate It may be disposed between the side and the side of the sensor enclosure.

According to various embodiments of the present disclosure, another part of the sensor enclosure may be attached to the sensor substrate at a position adjacent to the first short side or the second short side.

Although the present disclosure has been described by way of example with respect to various embodiments, it will be understood that the various embodiments are for illustrative purposes rather than limiting the present invention. It will be apparent to those skilled in the art that various changes can be made in the form and detailed configuration without departing from the overall scope of the present disclosure, including the appended claims and equivalents thereof. For example, the shape of the wiring board, the sealing member, and/or the adhesive tape may be appropriately selected or changed according to the actually manufactured camera module or the space where the camera module is to be placed. In some embodiments, the sealing member may be omitted and the adhesive tape may provide a structure for concealing or sealing the image sensor, and in other embodiments, the adhesive tape may be omitted and the sealing member may substantially cover the image sensor. In another embodiment, the camera module may be configured or arranged to receive light incident through either the front or rear surface of the housing, and when a plurality of camera modules are disposed, at least one of the camera modules covers the front surface of the housing. Light incident through the housing may be received, and the other at least one may receive light incident through the rear surface of the housing.

101, 102, 104, 200, 300, 400: electronic device
500: camera module 501: camera housing
505: sensor assembly 551: image sensor
553: sensor board 555: sensor enclosure
557 wiring board 559 optical element
555a: sealing member

Claims (20)

In the camera module,
sensor substrate;
an image sensor disposed on one surface of the sensor substrate;
a sensor enclosure disposed on the sensor substrate in a state of enclosing at least a portion of the image sensor; and
An optical element disposed in the sensor enclosure facing the image sensor,
The image sensor is set to detect incident light passing through the optical element, and the sensor enclosure is at least partially attached to an edge of one side of the image sensor facing the optical element.
The method of claim 1, wherein the image sensor is at an edge of one surface,
a first long side extending in a first direction and having a first length;
a first short side extending from one end of the first long side in a second direction crossing the first direction and having a second length smaller than the first length;
a second long side extending in the first direction from one end of the first short side and having the first length; and
A second short side extending from one end of the second long side in the second direction and connected to the other end of the first long side and having the second length;
A camera module in which a part of the sensor enclosure is attached to at least one of the first long side and the second long side on one surface of the image sensor.
The camera module of claim 2 , wherein another part of the sensor enclosure is attached to one surface of the sensor substrate at a position adjacent to the first short side or the second short side.
According to claim 2,
Further comprising a sealing member disposed between a portion of the sensor enclosure and one surface of the image sensor,
The sealing member is configured to bond a part of the sensor enclosure to one surface of the image sensor or to seal a gap between a part of the sensor enclosure and one surface of the image sensor.
The camera module of claim 2 , wherein a portion of a side surface of the image sensor corresponding to the first long side or the second long side is exposed between the side surface of the sensor substrate and the side surface of the sensor enclosure.
According to claim 5,
Further comprising an adhesive tape attached from the side of the sensor enclosure to the side of the sensor substrate,
A camera module in which a portion of the adhesive tape is attached to a side surface of the image sensor.
The camera module of claim 2 , wherein the first long side and the first short side are disposed perpendicular to each other.
According to claim 1,
a reflective member configured to receive external light in a direction of a first optical axis and refract or reflect light in a direction of a second optical axis crossing the first optical axis; and
The camera module further includes at least one lens disposed between the reflective member and the image sensor in the second optical axis direction and configured to guide or focus light refracted or reflected by the reflective member to the image sensor.
The method of claim 8, wherein the image sensor at an edge of one surface,
a first long side extending in a first direction and having a first length;
a first short side extending from one end of the first long side in a second direction crossing the first direction and having a second length smaller than the first length;
a second long side extending in the first direction from one end of the first short side and having the first length; and
A second short side extending from one end of the second long side in the second direction and connected to the other end of the first long side and having the second length;
A camera module in which a part of the sensor enclosure is attached to at least one of the first long side and the second long side on one surface of the image sensor.
The camera module of claim 9 , wherein the first long side and the second long side extend in a direction crossing the first optical axis and are sequentially arranged along the first optical axis direction.
The camera module of claim 9 , wherein the first short side and the second short side are disposed parallel to the first optical axis.
10. The method of claim 9, When viewed in a direction perpendicular to the second optical axis, a portion of a side surface of the image sensor corresponding to the first long side or the second long side is a side surface of the sensor substrate and a side surface of the sensor enclosure. Camera modules placed between them.
The camera module of claim 1 , wherein the optical element includes an infrared cut-off filter.
In electronic devices,
a housing including a first surface and a second surface facing the opposite direction of the first surface; and
At least one camera module configured to detect light incident through one of the first surface and the second surface,
The at least one camera module,
sensor substrate;
an image sensor disposed on one surface of the sensor substrate;
a sensor enclosure disposed on the sensor substrate in a state of enclosing at least a portion of the image sensor;
an infrared cut-off filter disposed in the sensor enclosure while facing the image sensor;
a reflective member configured to receive external light through one of the first surface and the second surface in a first optical axis direction and refract or reflect light in a second optical axis direction crossing the first optical axis; and
At least one lens disposed between the reflective member and the image sensor in the second optical axis direction and configured to guide or focus light refracted or reflected by the reflective member to the image sensor;
The electronic device of claim 1 , wherein the image sensor is set to detect incident light passing through the infrared cut filter, and at least a portion of the sensor enclosure is attached to an edge of one surface of the image sensor facing the infrared cut filter.
15. The electronic device of claim 14, configured to perform focal distance adjustment or focus adjustment by moving the at least one lens along the second optical axis direction.
According to claim 14,
Further comprising a display disposed on the first surface,
The camera module is configured to detect light incident through the second surface.
15. The method of claim 14, wherein the image sensor at an edge of one surface,
a first long side extending in a first direction and having a first length;
a first short side extending from one end of the first long side in a second direction crossing the first direction and having a second length smaller than the first length;
a second long side extending in the first direction from one end of the first short side and having the first length; and
A second short side extending from one end of the second long side in the second direction and connected to the other end of the first long side and having the second length;
On one side of the image sensor, a part of the sensor enclosure is attached to at least one of the first long side and the second long side.
18 . The electronic device of claim 17 , wherein the first short side or the second short side extends from the first surface toward the second surface.
18. The method of claim 17, when viewed in a direction from the second surface toward the first surface, a portion of a side surface of the image sensor corresponding to the first long side or the second long side is the side surface of the sensor substrate and the side surface of the image sensor. Electronics placed between the sides of the sensor enclosure.
18. The electronic device of claim 17, wherein another part of the sensor enclosure is attached to the sensor board at a position adjacent to the first short side or the second short side.

Images