KR20230067318A - Composition for epoxy-based structural adhesive - Google Patents
Composition for epoxy-based structural adhesive Download PDFInfo
- Publication number
- KR20230067318A KR20230067318A KR1020210153291A KR20210153291A KR20230067318A KR 20230067318 A KR20230067318 A KR 20230067318A KR 1020210153291 A KR1020210153291 A KR 1020210153291A KR 20210153291 A KR20210153291 A KR 20210153291A KR 20230067318 A KR20230067318 A KR 20230067318A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- epoxy
- epoxy resin
- structural adhesive
- adhesive composition
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 50
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 50
- 239000000203 mixture Substances 0.000 title claims abstract description 50
- 239000004593 Epoxy Substances 0.000 title claims abstract description 31
- 239000003822 epoxy resin Substances 0.000 claims abstract description 57
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 57
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 36
- 239000012745 toughening agent Substances 0.000 claims abstract description 34
- 229920001971 elastomer Polymers 0.000 claims abstract description 30
- 239000005060 rubber Substances 0.000 claims abstract description 30
- 239000002245 particle Substances 0.000 claims abstract description 27
- 239000011258 core-shell material Substances 0.000 claims abstract description 24
- 239000000654 additive Substances 0.000 claims abstract description 10
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 9
- -1 polytetramethylene Polymers 0.000 claims description 30
- 150000002009 diols Chemical class 0.000 claims description 23
- 229920005862 polyol Polymers 0.000 claims description 22
- 150000003077 polyols Chemical class 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 14
- 239000005062 Polybutadiene Substances 0.000 claims description 12
- 229920002857 polybutadiene Polymers 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 11
- 229920001451 polypropylene glycol Polymers 0.000 claims description 11
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 10
- 230000000996 additive effect Effects 0.000 claims description 6
- 229920001610 polycaprolactone Polymers 0.000 claims description 6
- 239000004632 polycaprolactone Substances 0.000 claims description 6
- 229920002367 Polyisobutene Polymers 0.000 claims description 5
- 239000003085 diluting agent Substances 0.000 claims description 5
- 239000005056 polyisocyanate Substances 0.000 claims description 5
- 229920001228 polyisocyanate Polymers 0.000 claims description 5
- 229920000562 Poly(ethylene adipate) Polymers 0.000 claims description 4
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 8
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 17
- 230000000903 blocking effect Effects 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 11
- 239000012299 nitrogen atmosphere Substances 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 10
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 9
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- SDXAWLJRERMRKF-UHFFFAOYSA-N 3,5-dimethyl-1h-pyrazole Chemical compound CC=1C=C(C)NN=1 SDXAWLJRERMRKF-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000539 dimer Substances 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 6
- 229940106691 bisphenol a Drugs 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 150000004982 aromatic amines Chemical class 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 125000005647 linker group Chemical group 0.000 description 4
- 229920005903 polyol mixture Polymers 0.000 description 4
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 229910021485 fumed silica Inorganic materials 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 229920000921 polyethylene adipate Polymers 0.000 description 3
- NODLZCJDRXTSJO-UHFFFAOYSA-N 1,3-dimethylpyrazole Chemical compound CC=1C=CN(C)N=1 NODLZCJDRXTSJO-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- YOHJBUSNVWWMDP-BQYQJAHWSA-N (e)-2,3-bis(2-isocyanatoethyl)but-2-enedioic acid Chemical compound O=C=NCC/C(C(=O)O)=C(/CCN=C=O)C(O)=O YOHJBUSNVWWMDP-BQYQJAHWSA-N 0.000 description 1
- GFNDFCFPJQPVQL-UHFFFAOYSA-N 1,12-diisocyanatododecane Chemical compound O=C=NCCCCCCCCCCCCN=C=O GFNDFCFPJQPVQL-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical group O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- YQMXOIAIYXXXEE-UHFFFAOYSA-N 1-benzylpyrrolidin-3-ol Chemical compound C1C(O)CCN1CC1=CC=CC=C1 YQMXOIAIYXXXEE-UHFFFAOYSA-N 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical group C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- RQBUVIFBALZGPC-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanatophenyl)benzene Chemical group C1=CC(N=C=O)=CC=C1C1=CC=C(N=C=O)C=C1 RQBUVIFBALZGPC-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- JDYWKAYETKZYIF-UHFFFAOYSA-N 2,4,4-trimethylpentane-2,3-diol Chemical compound CC(C)(C)C(O)C(C)(C)O JDYWKAYETKZYIF-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- DBTGFWMBFZBBEF-UHFFFAOYSA-N 2,4-dimethylpentane-2,4-diol Chemical compound CC(C)(O)CC(C)(C)O DBTGFWMBFZBBEF-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- JPEGUDKOYOIOOP-UHFFFAOYSA-N 2-(hexoxymethyl)oxirane Chemical compound CCCCCCOCC1CO1 JPEGUDKOYOIOOP-UHFFFAOYSA-N 0.000 description 1
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical group CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 1
- ANOPCGQVRXJHHD-UHFFFAOYSA-N 3-[3-(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]propan-1-amine Chemical compound C1OC(CCCN)OCC21COC(CCCN)OC2 ANOPCGQVRXJHHD-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- XYUINKARGUCCQJ-UHFFFAOYSA-N 3-imino-n-propylpropan-1-amine Chemical compound CCCNCCC=N XYUINKARGUCCQJ-UHFFFAOYSA-N 0.000 description 1
- BYKCDFISEUWPEA-UHFFFAOYSA-N 3-isocyanato-n-(oxomethylidene)benzenesulfonamide Chemical compound O=C=NC1=CC=CC(S(=O)(=O)N=C=O)=C1 BYKCDFISEUWPEA-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- HMJBXEZHJUYJQY-UHFFFAOYSA-N 4-(aminomethyl)octane-1,8-diamine Chemical compound NCCCCC(CN)CCCN HMJBXEZHJUYJQY-UHFFFAOYSA-N 0.000 description 1
- CYCBPQPFMHUATH-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)butan-1-ol Chemical compound OCCCCOCC1CO1 CYCBPQPFMHUATH-UHFFFAOYSA-N 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- GZMIALBAZYTSFI-UHFFFAOYSA-N 7-isocyanato-2-(isocyanatomethyl)heptanoic acid Chemical compound O=C=NCC(C(=O)O)CCCCCN=C=O GZMIALBAZYTSFI-UHFFFAOYSA-N 0.000 description 1
- NIJZFHNDUJXJMR-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethanol Chemical compound C1C(CO)CCC2OC21 NIJZFHNDUJXJMR-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- PMMYEEVYMWASQN-DMTCNVIQSA-N Hydroxyproline Chemical compound O[C@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-DMTCNVIQSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- DZYFUUQMKQBVBY-UHFFFAOYSA-N bis(2-isocyanatoethyl) carbonate Chemical compound O=C=NCCOC(=O)OCCN=C=O DZYFUUQMKQBVBY-UHFFFAOYSA-N 0.000 description 1
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- WWNGFHNQODFIEX-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;styrene Chemical compound C=CC=C.COC(=O)C(C)=C.C=CC1=CC=CC=C1 WWNGFHNQODFIEX-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- JXCHMDATRWUOAP-UHFFFAOYSA-N diisocyanatomethylbenzene Chemical compound O=C=NC(N=C=O)C1=CC=CC=C1 JXCHMDATRWUOAP-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000003916 ethylene diamine group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- SXCBDZAEHILGLM-UHFFFAOYSA-N heptane-1,7-diol Chemical compound OCCCCCCCO SXCBDZAEHILGLM-UHFFFAOYSA-N 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011499 joint compound Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- JKXONPYJVWEAEL-UHFFFAOYSA-N oxiran-2-ylmethyl acetate Chemical compound CC(=O)OCC1CO1 JKXONPYJVWEAEL-UHFFFAOYSA-N 0.000 description 1
- XRQKARZTFMEBBY-UHFFFAOYSA-N oxiran-2-ylmethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1CO1 XRQKARZTFMEBBY-UHFFFAOYSA-N 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- XLMFDCKSFJWJTP-UHFFFAOYSA-N pentane-2,3-diol Chemical compound CCC(O)C(C)O XLMFDCKSFJWJTP-UHFFFAOYSA-N 0.000 description 1
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
본 발명은 에폭시계 구조용 접착제 조성물에 관한 것으로, 보다 상세하게는 코어-쉘 고무 입자를 함유하는 말단 이소시아네이트 기를 갖는 탄성중합체성 강인화제를 함유하는 이액형 에폭시계 구조용 접착제 조성물에 관한 것이다.The present invention relates to epoxy-based structural adhesive compositions, and more particularly to two-part epoxy-based structural adhesive compositions containing an elastomeric toughening agent having terminal isocyanate groups containing core-shell rubber particles.
구조용 접착제는 목재, 복합체 또는 금속과 같은 고강도 재료들을 서로 접착시킬 수 있는 특성을 갖는 재료로, 특히 자동차나 항공우주 산업, 선박 등 고기능성을 필요로 하는 산업분야에 사용되고 있다. 용접 및 기계적 방법으로 구조물을 결합하는 것보다 접착제를 이용하여 결합하면 작업속도가 빨라지고 비용이 절감되며, 재료 간 전위차로 인하여 부식이 발생하는 문제점이 발생하지 않아 더욱 선호되고 있다. Structural adhesives are materials having properties capable of bonding high-strength materials such as wood, composites, or metals to each other, and are particularly used in industries requiring high functionality, such as automobiles, aerospace industries, and ships. Rather than joining structures by welding or mechanical methods, bonding using adhesives increases work speed, reduces costs, and is more preferred because there is no problem of corrosion due to potential difference between materials.
특히, 자동차 등의 운송 산업 분야에 사용되는 구조용 접착제는 기계적 결합 방법보다 구조용 접착제를 사용함으로써 경량화 할 수 있다는 점이 가장 큰 이점이다. 이와 같이 자동차 분야에 적용되는 구조용 접착제는 차량 충돌과 같은 큰 충격을 견딜 수 있는 내구성이 요구된다. 또한, 광범위한 온도 범위에서도 접착력, 충격박리강도, 탄성 등의 물성이 우수하게 유지될 수 있어야 한다.In particular, the greatest advantage of structural adhesives used in transportation industries such as automobiles is that they can be reduced in weight by using structural adhesives rather than mechanical bonding methods. As such, structural adhesives applied to the automobile field require durability capable of withstanding large impacts such as vehicle collisions. In addition, physical properties such as adhesive strength, impact peel strength, and elasticity should be excellently maintained even in a wide temperature range.
에폭시 수지 접착제(epoxide resin adhesive)는 접착성, 내구성, 물성 등이 우수하고, 주제와 경화제의 조합에 따라 그 특성을 비교적 용이하게 바꿀 수 있기 때문에 전기, 토목, 건축 등의 분야에서 다양하게 사용되고 있다.Epoxide resin adhesive has excellent adhesion, durability, physical properties, etc., and its properties can be changed relatively easily depending on the combination of the main agent and the curing agent, so it is widely used in fields such as electricity, civil engineering, and construction. .
기존 자동차 구조용 접착제는 고온 경화형 1액형으로 스틸(steel) 소재 접착에 사용되었으나, 최근 차체 경량화로 인한 알루미늄(Al) 등의 이종소재 접합에서 기존 1액형 구조용 접착제를 적용하면 차체 소재와 접착제간의 열팽창 계수 차이가 커서 고온 경화 시 외관 변형이 심한 문제가 발생한다.Existing automotive structural adhesives are high-temperature curing, one-component adhesives used for bonding steel materials. However, when the existing one-component structural adhesives are applied to the bonding of heterogeneous materials such as aluminum (Al) due to the recent weight reduction of automobile bodies, the thermal expansion coefficient between the vehicle body material and the adhesive is applied. Due to the large difference, severe external deformation occurs during high temperature curing.
이에, 상온경화형인 2액형의 구조용 접착제가 활발히 연구 개발되고 있으나, 여전히 알루미늄과 복합소재간의 고강도 접착력 구현과 기존의 충격강도 구현이 가능한 소재가 필요한 실정이다.Accordingly, two-component structural adhesives cured at room temperature are being actively researched and developed, but there is still a need for a material capable of realizing high-strength adhesion between aluminum and composite materials and realizing conventional impact strength.
상기와 같은 문제를 해결하기 위하여, 본 발명의 목적은 코어-쉘 고무 입자를 함유하는 말단 이소시아네이트 기를 갖는 탄성중합체성 강인화제를 포함하는 에폭시계 구조용 접착제 조성물을 제공하는 데에 있다.In order to solve the above problems, an object of the present invention is to provide an epoxy-based structural adhesive composition comprising an elastomeric toughener having terminal isocyanate groups containing core-shell rubber particles.
상기의 목적을 달성하기 위하여, 본 발명은 a) 하나 이상의 에폭시 수지 50 내지 70 중량%, b) 코어-쉘 고무 입자가 분산된 말단 이소시아네이트 기를 갖는 탄성중합체성 강인화제 15 내지 25 중량%, 및 c) 첨가제 15 내지 25 중량%를 포함하는 주제부; 및 경화제부;를 포함하는, 에폭시계 구조용 접착제 조성물을 제공한다.In order to achieve the above object, the present invention provides a) 50 to 70% by weight of one or more epoxy resins, b) 15 to 25% by weight of an elastomeric toughener having terminal isocyanate groups in which core-shell rubber particles are dispersed, and c ) a main part containing 15 to 25% by weight of additives; And a curing agent unit; provides an epoxy-based structural adhesive composition comprising a.
상기 에폭시 수지는 비스페놀형 에폭시 수지 30 내지 40 중량% 및 상기 비스페놀형 에폭시 수지에 고무 입자가 분산된 변성 에폭시 수지 20 내지 30 중량%를 포함할 수 있다.The epoxy resin may include 30 to 40% by weight of a bisphenol-type epoxy resin and 20 to 30% by weight of a modified epoxy resin in which rubber particles are dispersed in the bisphenol-type epoxy resin.
상기 강인화제는 폴리부타디엔, 폴리에틸렌옥사이드(PEO), 폴리테트라메틸렌옥사이드(PTMO), 폴리프로필렌옥사이드(PPO), 폴리이소부틸렌, 폴리에틸렌 에딕페이트(poly(ethylene adipate)) 또는 폴리카프로락톤(polycaprolactone)의 다이올(diol), 트리올(triol) 및 테트라올(tetraol)로 이루어진 군에서 선택되는 하나의 폴리올 또는 둘 이상의 폴리올 혼합물에 코어-쉘 고무 입자를 분산시킨 후, 폴리이소시아네이트 계 화합물을 첨가하여 반응시킨 것일 수 있다.The toughening agent is polybutadiene, polyethylene oxide (PEO), polytetramethylene oxide (PTMO), polypropylene oxide (PPO), polyisobutylene, polyethylene adipate (poly(ethylene adipate)) or polycaprolactone (polycaprolactone) After dispersing the core-shell rubber particles in one polyol or a mixture of two or more polyols selected from the group consisting of a diol, a triol, and a tetraol, a polyisocyanate-based compound is added to may have reacted.
상기 첨가제는 필러, 반응성 희석제, 무기 충진제 및 커플링제로 이루어진 군에서 선택되는 하나 이상일 수 있다.The additive may be one or more selected from the group consisting of a filler, a reactive diluent, an inorganic filler, and a coupling agent.
상기 주제부 및 경화제부는 1 : (0.3 내지 0.7)의 중량비로 포함될 수 있다.The main part and the curing agent part may be included in a weight ratio of 1: (0.3 to 0.7).
본 발명에 따른 코어-쉘 고무 입자를 함유하는 말단 이소시아네이트 기를 갖는 탄성중합체성 강인화제를 사용함으로써, 접착력, 충격강도 등 기계적 물성이 향상된 2액형 에폭시계 구조용 접착제 조성물을 제공할 수 있다.By using the elastomeric toughener having a terminal isocyanate group containing core-shell rubber particles according to the present invention, a two-component epoxy-based structural adhesive composition having improved mechanical properties such as adhesive strength and impact strength can be provided.
상기 2액형 에폭시계 구조용 접착제 조성물을 사용함으로써, 기존 1액형 접착제 조성물에서 발생한 문제를 해결하여, 보다 효과적으로 자동차 구조용 접착제로 활용할 수 있다.By using the two-component epoxy-based structural adhesive composition, problems occurring in existing one-component adhesive compositions can be solved and more effectively utilized as automotive structural adhesives.
이하, 본 발명을 상세하게 설명하기로 한다.Hereinafter, the present invention will be described in detail.
본 발명에서 사용되는 용어는 본 발명에서의 기능을 고려하면서 가능한 현재 널리 사용되는 일반적인 용어들을 선택하였으나, 이는 당 분야에 종사하는 기술자의 의도 또는 판례, 새로운 기술의 출현 등에 따라 달라질 수 있다. 따라서 본 발명에서 사용되는 용어는 단순한 용어의 명칭이 아닌, 그 용어가 가지는 의미와 본 발명의 전반에 걸친 내용을 토대로 정의되어야 한다.The terms used in the present invention have been selected from general terms that are currently widely used as much as possible while considering the functions in the present invention, but these may vary depending on the intention of a person skilled in the art or precedent, the emergence of new technologies, and the like. Therefore, the term used in the present invention should be defined based on the meaning of the term and the overall content of the present invention, not simply the name of the term.
명세서 전체에서 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있음을 의미한다.When it is said that a certain part "includes" a certain component throughout the specification, it means that it may further include other components without excluding other components unless otherwise stated.
본 발명은 에폭시계 구조용 접착제 조성물을 제공한다.The present invention provides an epoxy-based structural adhesive composition.
본 발명에 따른 에폭시계 구조용 접착제 조성물은 주제부 및 경화제부를 포함하는 이액형 접착제 조성물일 수 있다.The epoxy-based structural adhesive composition according to the present invention may be a two-component adhesive composition including a main part and a curing agent part.
본 발명에 따른 에폭시계 구조용 접착제 조성물에 있어서, 상기 주제부는 a) 하나 이상의 에폭시 수지 50 내지 70 중량%, b) 말단 이소시아네이트 기를 갖는 탄성중합체성 강인화제 15 내지 25 중량%, 및 c) 첨가제 15 내지 25 중량%를 포함할 수 있다.In the epoxy-based structural adhesive composition according to the present invention, the main part comprises a) 50 to 70% by weight of at least one epoxy resin, b) 15 to 25% by weight of an elastomeric toughener having terminal isocyanate groups, and c) 15 to 70% by weight of an additive 25% by weight.
상기 에폭시 수지는 에폭시기를 함유하는, 경화 가능한 에폭시 수지를 사용할 수 있다. 상기 에폭시 수지는 그 종류에 제한되지 않고 통상적으로 에폭시 접착제에 사용되는 에폭시 수지를 사용할 수 있다. 예를 들어, 모노 에폭시 화합물, 다가 에폭시 화합물, 또는 이들의 혼합물을 사용할 수 있다.As the epoxy resin, a curable epoxy resin containing an epoxy group may be used. The epoxy resin is not limited to its type, and an epoxy resin commonly used in epoxy adhesives may be used. For example, a monoepoxy compound, a multivalent epoxy compound, or a mixture thereof may be used.
상기 모노 에폭시 화합물은, 예를 들어 부틸글리시딜에테르(butyl glycidyl ether), 헥실글리시딜에테르(hexyl glycidyl ether), 페닐글리시딜에테르(phenyl glycidyl ether), 알릴글리시딜에테르(allyl glycidyl ether), 파라-부틸페닐글리시딜에테르(para-butyl glycidyl ether), 파라-크실릴글리시딜에테르(para-xylyl glycidyl ether), 글리시딜아세테이트(glycidyl acetate), 글리시딜부티레이트(glycidyl butyrate), 글리시딜헥소에이트(glycidyl hexoate), 글리시딜벤조에이트(glycidyl benzoate) 또는 이들의 혼합물 등을 들 수 있다.The mono-epoxy compound, for example, butyl glycidyl ether, hexyl glycidyl ether, phenyl glycidyl ether, allyl glycidyl ether ether), para-butylphenyl glycidyl ether, para-xylyl glycidyl ether, glycidyl acetate, glycidyl butyrate butyrate), glycidyl hexoate, glycidyl benzoate, or mixtures thereof.
상기 다가 에폭시 화합물은, 예를 들어 비스페놀형 에폭시 수지, 다가 페놀형을 글리시딜화한 에폭시 수지, 노볼락형 에폭시 수지, 지방족 에테르형 에폭시 수지, 에테르에스테르형 에폭시 수지, 에스테르형 에폭시수지, 아민형 에폭시수지, 지환족 에폭시 수지 또는 이들의 혼합물 등을 들 수 있다.Examples of the polyhydric epoxy compound include bisphenol-type epoxy resins, polyhydric phenol-type epoxy resins obtained by glycidylation, novolak-type epoxy resins, aliphatic ether-type epoxy resins, ether ester-type epoxy resins, ester-type epoxy resins, and amine-type epoxy resins. Epoxy resins, alicyclic epoxy resins, or mixtures thereof.
상기 비스페놀형 에폭시 수지로는, 예를 들어 비스페놀 A, 비스페놀 F, 비스페놀 AD, 비스페놀 S, 테트라메틸비스페놀 A, 테트라메틸비스페놀 F, 테트라메틸비스페놀 AD, 테트라메틸비스페놀 S, 테트라브로모비스페놀 A, 테트라클로로비스페놀 A, 테트라플루오로비스페놀 A 또는 이들의 혼합물 등을 들 수 있다. 상기 비스페놀형 에폭시 수지는 상온에서 액상 또는 고체 상태의 에폭시 수지 모두 사용 가능하다.As said bisphenol type epoxy resin, for example, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, tetramethylbisphenol A, tetramethylbisphenol F, tetramethylbisphenol AD, tetramethylbisphenol S, tetrabromobisphenol A, tetra Chlorobisphenol A, tetrafluorobisphenol A, or mixtures thereof; and the like. The bisphenol-type epoxy resin may be used in a liquid or solid state at room temperature.
상기 다가 페놀형을 글리시딜화한 에폭시 수지로는, 예를 들어 비페놀(Biphenol), 디히드록시나프탈렌, 9,9-비스(4-히드록시페닐)플루오렌 등의 2가 페놀형을 글리시딜화한 에폭시 수지나 1,1,1-트리스(4-히드록시페닐)메탄 등의 트리스페놀형을 글리시딜화한 에폭시 수지, 1,1,2, 2-테트라키스(4-히드록시페닐)에탄 등의 테트라키스페놀형을 글리시딜화한 에폭시 수지 또는 이들의 혼합물 등을 들 수 있다.As the epoxy resin obtained by glycidylating the polyhydric phenol type, for example, a dihydric phenol type such as biphenol, dihydroxynaphthalene, 9,9-bis(4-hydroxyphenyl)fluorene, etc. Cydylated epoxy resins, glycidylated epoxy resins of trisphenol type such as 1,1,1-tris(4-hydroxyphenyl)methane, 1,1,2,2-tetrakis(4-hydroxyphenyl) ) Epoxy resin obtained by glycidylating a tetrakisphenol type such as ethane or a mixture thereof; and the like.
상기 노볼락형 에폭시 수지는, 예를 들어 페놀 노볼락형, 크레졸 노볼락형, 비스페놀 A 노볼락형, 브롬화 페놀 노볼락형, 브롬화 비스페놀 A 노볼락형 등의 노볼락형을 글리시딜화한 에폭시 수지 또는 이들의 혼합물 등을 들 수 있다.The novolak-type epoxy resin is, for example, an epoxy obtained by glycidylating a novolak type such as a phenol novolak type, a cresol novolak type, a bisphenol A novolak type, a brominated phenol novolak type, or a brominated bisphenol A novolak type. resins or mixtures thereof; and the like.
상기 지방족 에테르형 에폭시 수지로는, 예를 들어 글리세린이나 폴리에틸렌글리콜 등의 다가 알코올을 글리시딜화한 에폭시 수지 또는 이들의 혼합물 등을 들 수 있다.As said aliphatic ether-type epoxy resin, the epoxy resin which glycidylated polyhydric alcohol, such as glycerol and polyethylene glycol, or mixtures thereof, etc. are mentioned, for example.
상기 에테르에스테르형 에폭시 수지는, 예를 들어 파라옥시 안식향산 등의 히드록시카르복시산을 글리시딜화한 에폭시 수지 또는 이들의 혼합물 등을 들 수 있다.Examples of the ether ester type epoxy resin include epoxy resins obtained by glycidylating hydroxycarboxylic acids such as paraoxybenzoic acid, or mixtures thereof.
상기 에스테르형 에폭시 수지로는, 예를 들어 프탈산, 테레프탈산 등의 폴리카르복시산을 글리시딜화한 에폭시 수지 또는 이들의 혼합물 등을 들 수 있다.As said ester type epoxy resin, the epoxy resin which glycidylated polycarboxylic acid, such as phthalic acid and terephthalic acid, or mixtures thereof, etc. are mentioned, for example.
상기 아민형 에폭시 수지는, 예를 들어 4, 4-디아미노디페닐메탄, m-아미노페놀 등의 아민 화합물을 글리시딜화한 에폭시 수지 또는 이들의 혼합물 등을 들 수 있다.Examples of the amine type epoxy resin include epoxy resins obtained by glycidylating amine compounds such as 4,4-diaminodiphenylmethane and m-aminophenol, or mixtures thereof.
상기 지환족 에폭시 수지로는, 예를 들어 3,4-에폭시시클로헥실메틸-3', 4'-에폭시시클로헥산카르복실레이트, 1,2-에폭시-4-비닐시클로헥산, 비스(3, 4-에폭시시클로헥실메틸)아디페이트, 1-에폭시에틸-3, 4-에폭시시클로헥산, 리모넨디에폭시드, 3, 4-에폭시시클로헥실메탄올 또는 이들의 혼합물 등을 들 수 있다.Examples of the alicyclic epoxy resin include 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, and bis(3,4). -Epoxycyclohexylmethyl) adipate, 1-epoxyethyl-3,4-epoxycyclohexane, limonene diepoxide, 3,4-epoxycyclohexylmethanol, or mixtures thereof.
상기 에폭시 수지는 코어-쉘 고무 입자가 분산되어 있는 변성 에폭시 수지를 포함할 수 있다.The epoxy resin may include a modified epoxy resin in which core-shell rubber particles are dispersed.
본 발명의 일 실시예에 따르면, 상기 에폭시 수지는 비스페놀형 에폭시 수지 및 변성 에폭시 수지를 모두 포함할 수 있고, 상기 에폭시 수지는 50 내지 70 중량% 포함될 수 있다.According to one embodiment of the present invention, the epoxy resin may include both a bisphenol-type epoxy resin and a modified epoxy resin, and the epoxy resin may be included in an amount of 50 to 70% by weight.
보다 상세하게는, 상기 비스페놀형 에폭시 수지는 비스페놀 A형 에폭시 수지일 수 있으며, 상기 비스페놀 A형 에폭시 수지는 30 내지 40 중량%, 바람직하게는 35 중량%일 수 있으나, 이에 제한되는 것은 아니다. 상기 비스페놀 A형 에폭시 수지의 함량이 지나치게 적으면 부착 및 접착제 내의 결합력에 문제가 있을 수 있고, 반대로 지나치게 많으면 오히려 부착을 저하시키는 문제가 발생할 수 있기에, 상기 범위가 바람직하다.More specifically, the bisphenol-type epoxy resin may be a bisphenol A-type epoxy resin, and the bisphenol-A type epoxy resin may be 30 to 40% by weight, preferably 35% by weight, but is not limited thereto. If the content of the bisphenol A-type epoxy resin is too small, there may be problems with adhesion and bonding strength in the adhesive, and if the content is too large, a problem of deteriorating adhesion may occur, so the above range is preferable.
보다 상세하게는, 상기 변성 에폭시 수지는 비스페놀 A형 에폭시 수지; 및 고무 입자가 메틸 메타크릴레이트-스티렌 중합체 매트릭스 전체에 분산되어 있는 메틸 메타크릴레이트 부타디엔 스티렌(methyl methacrylate butadiene styrene, MBS)계;와의 혼합물일 수 있고, 바람직하게는 상기 비스페놀 A형 에폭시 수지 60 내지 70 중량% 및 상기 MBS계는 30 내지 40 중량%가 혼합된 것일 수 있으며, 상기 변성 에폭시 수지는 20 내지 30 중량%, 바람직하게는 25 중량% 포함될 수 있으나, 이에 제한되는 것은 아니다.More specifically, the modified epoxy resin is a bisphenol A type epoxy resin; and a methyl methacrylate butadiene styrene (MBS) system in which rubber particles are dispersed throughout the methyl methacrylate-styrene polymer matrix. 70% by weight and 30 to 40% by weight of the MBS system may be mixed, and the modified epoxy resin may be included in 20 to 30% by weight, preferably 25% by weight, but is not limited thereto.
상기 강인화제는 폴리올 또는 서로 다른 둘 이상의 폴리올을 혼합하여 제조한 폴리올 혼합물에 코어-쉘 고무 입자를 고속 분산시킨 후, 폴리이소시아네이트 계 화합물을 첨가하여 반응시켜 제조된 것일 수 있다.The toughening agent may be prepared by rapidly dispersing core-shell rubber particles in a polyol or a polyol mixture prepared by mixing two or more different polyols, and then adding and reacting with a polyisocyanate-based compound.
상기 폴리올은 지방족 폴리올(aliphtic polyol) 또는 방향족 폴리올(aromatic polyol)에서 선택될 수 있다. 이는 각각 연결기로 지방족 연결기 또는 방향족 연결기를 포함하고, 히드록실기(-OH)를 둘 이상 포함하는 화합물을 의미하며, 당업계에서 통상적으로 사용되는 것이라면 특별히 제한되지 않고 사용될 수 있다.The polyol may be selected from an aliphatic polyol or an aromatic polyol. This refers to a compound each including an aliphatic linking group or an aromatic linking group as a linking group and including two or more hydroxyl groups (—OH), and any one commonly used in the art may be used without particular limitation.
보다 구체적으로, 상기 지방족 폴리올은 2,4-펜탄다이올(pentanediol), 2,3-펜탄다이올, 2-메틸-2,4-펜탄다이올, 2,4-디메틸-2,4-펜탄다이올, 2,4,4-트리메틸-2,3-펜탄다이올, 1,5-펜탄다이올, 1,4-부탄다이올, 1,6-헥산다이올, 3-메틸펜탄-1,5-다이올, 1,7-헵탄다이올, 1,8-옥탄다이올, 1,9-노난다이올, 1,10-데칸다이올, 1,12-도데칸다이올, 1,6-헥산다이올의 올리고머, 에틸렌 글리콜 및 프로필렌 글리콜 및 이로부터 축중합된 중합체일 수 있으나, 이에 제한되는 것은 아니다.More specifically, the aliphatic polyol is 2,4-pentanediol, 2,3-pentanediol, 2-methyl-2,4-pentanediol, 2,4-dimethyl-2,4-pentane diol, 2,4,4-trimethyl-2,3-pentanediol, 1,5-pentanediol, 1,4-butanediol, 1,6-hexanediol, 3-methylpentane-1, 5-diol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonandiol, 1,10-decanediol, 1,12-dodecanediol, 1,6-hexane oligomers of diols, ethylene glycol and propylene glycol, and polycondensation polymers therefrom, but are not limited thereto.
상기 방향족 폴리올은 방향족 연결기를 포함하는 폴리올로써, 예를 들면 나프탈렌 구조를 포함하는 것일 수 있으나, 이에 제한하는 것은 아니다.The aromatic polyol is a polyol containing an aromatic linking group, and may include, for example, a naphthalene structure, but is not limited thereto.
상기 코어-쉘 고무 입자는 부타디엔계 고무 입자일 수 있으나, 이에 제한되는 것은 아니다.The core-shell rubber particles may be butadiene-based rubber particles, but are not limited thereto.
상기 폴리이소시아네이트 계 화합물은 이소시아네이트기(-NCO)를 2개 이상 포함하는 반응성 단량체로서 당업계에서 통상적으로 사용되는 것이라면 특별히 제한되지 않고 사용될 수 있다. 구체적으로 예를 들면, 방향족 디이소시아네이트 화합물, 지방족 디이소시아네이트 및 지환족 디이소시아네이트 등에서 선택되는 어느 하나 또는 둘 이상의 혼합물인 것일 수 있다.The polyisocyanate-based compound is a reactive monomer containing two or more isocyanate groups (-NCO) and may be used without particular limitation as long as it is commonly used in the art. Specifically, for example, it may be any one or a mixture of two or more selected from aromatic diisocyanate compounds, aliphatic diisocyanates, and alicyclic diisocyanates.
상기 지환족 디이소시아네이트 화합물을 사용하는 경우 접착제용 에폭시 조성물에 적용 시 높은 유연성을 발현할 수 있는 점에서 선호될 수 있으나, 이에 제한되는 것은 아니다.In the case of using the alicyclic diisocyanate compound, it may be preferred in that it can express high flexibility when applied to an epoxy composition for adhesives, but is not limited thereto.
예를 들면, 상기 방향족 디이소시아네이트는 1,3-페닐렌디이소시아네이트, 1,4-페닐렌디이소시아네이트, 2,4-톨릴렌디이소시아네이트(TDI), 2,6-톨릴렌디이소시아네이트, 4,4'-디페닐메탄디이소시아네이트(MDI),2,4-디페닐메탄디이소시아네이트, 4,4'-디이소시아나토비페닐, 3,3'-디메틸-4,4'-디이소시아나토비페닐, 3,3'-디메틸-4,4'-디이소시아나토디페닐메탄, 1,5-나프틸렌디이소시아네이트, 4,4',4"-트리페닐메탄트리이소시아네이트, m-이소시아나토페닐술포닐이소시아네이트 및 p-이소시아나토페닐술포닐이소시아네이트 등을 것일 수 있으나, 이에 제한되는 것은 아니다.For example, the aromatic diisocyanate is 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate (TDI), 2,6-tolylene diisocyanate, 4,4'-di Phenylmethane diisocyanate (MDI), 2,4-diphenylmethane diisocyanate, 4,4'-diisocyanatobiphenyl, 3,3'-dimethyl-4,4'-diisocyanatobiphenyl, 3,3 '-Dimethyl-4,4'-diisocyanatodiphenylmethane, 1,5-naphthylene diisocyanate, 4,4',4"-triphenylmethanetriisocyanate, m-isocyanatophenylsulfonylisocyanate and p -Isocyanatophenylsulfonylisocyanate and the like, but is not limited thereto.
지방족 디이소시아네이트는 에틸렌디이소시아네이트, 테트라메틸렌디이소시아네이트, 헥사메틸렌디이소시아네이트(HDI), 도데카메틸렌디이소시아네이트, 1,6,11-운데칸트리이소시아네이트, 2,2,4-트리메틸헥사메틸렌디이소시아네이트, 리신디이소시아네이트, 2,6-디이소시아나토메틸카프로에이트, 비스(2-이소시아나토에틸)푸마레이트, 비스(2-이소시아나토에틸)카르보네이트 및 2-이소시아나토에틸-2,6-디이소시아나토헥사노에이트 등인 것일 수 있으며, 이에 제한되는 것은 아니다.Aliphatic diisocyanates include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate (HDI), dodecamethylene diisocyanate, 1,6,11-undecane triisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, Lysine diisocyanate, 2,6-diisocyanatomethylcaproate, bis(2-isocyanatoethyl)fumarate, bis(2-isocyanatoethyl)carbonate and 2-isocyanatoethyl-2,6 - It may be diisocyanatohexanoate or the like, but is not limited thereto.
상기 지환족 디이소시아네이트 이소포론 디이소시아네이트(IPDI), 4,4'-디시클로헥실메탄디이소시아네이트(수소 첨가 MDI), 시클로헥실렌디이소시아네이트, 메틸시클로헥실렌디이소시아네이트(수소 첨가 TDI), 비스(2-이소시아나토에틸)-4-디클로헥센-1,2-디카르복실레이트, 2,5-노르보르난디이소시아네이트 및 2,6-노르보르난디이소시아네이트 등인 것일 수 있으며, 이에 제한되는 것은 아니다.The alicyclic diisocyanate isophorone diisocyanate (IPDI), 4,4'-dicyclohexylmethane diisocyanate (hydrogenated MDI), cyclohexylene diisocyanate, methylcyclohexylene diisocyanate (hydrogenated TDI), bis( 2-isocyanatoethyl) -4-dichlorohexene-1,2-dicarboxylate, 2,5-norbornane diisocyanate, 2,6-norbornane diisocyanate, and the like, but is not limited thereto. .
본 발명의 일 실시예에 따르면, 바람직하게는 상기 강인화제는 히드록실기(-OH)가 2 내지 4개인 폴리올, 예를 들어, 폴리부타디엔, 폴리에틸렌옥사이드(PEO), 폴리테트라메틸렌옥사이드(PTMO), 폴리프로필렌옥사이드(PPO), 폴리이소부틸렌, 폴리에틸렌 에딕페이트(poly(ethylene adipate)) 또는 폴리카프로락톤(polycaprolactone)의 다이올(diol), 트리올(triol) 및 테트라올(tetraol)로 이루어진 군에서 선택되는 하나의 폴리올 또는 둘 이상의 폴리올 혼합물, 보다 바람직하게는 다이머 다이올로 만들어진 폴리에스터 폴리올 및 폴리부타디엔 다이올의 혼합물에 부타디엔계 코어-쉘 고무 입자를 고속 분산시킨 후, 지방족 디이소시아네이트, 바람직하게는 1,6-헥사메틸렌디이소시아네이트를 첨가하여 반응시켜 제조된 것일 수 있고, 상기 강인화제는 15 내지 25 중량%, 바람직하게는 20 중량% 포함될 수 있다.According to one embodiment of the present invention, preferably, the toughening agent is a polyol having 2 to 4 hydroxyl groups (—OH), for example, polybutadiene, polyethylene oxide (PEO), polytetramethylene oxide (PTMO) consisting of diols, triols and tetraols of polypropylene oxide (PPO), polyisobutylene, poly(ethylene adipate) or polycaprolactone. After high-speed dispersion of butadiene-based core-shell rubber particles in one polyol or a mixture of two or more polyols selected from the group, more preferably a mixture of polyester polyol and polybutadiene diol made of dimer diol, aliphatic diisocyanate, Preferably, it may be prepared by adding and reacting 1,6-hexamethylene diisocyanate, and the toughening agent may be included in an amount of 15 to 25% by weight, preferably 20% by weight.
상기 첨가제는 필러, 반응성 희석제, 무기 충진제 및 커플링제로 이루어진 군에서 선택되는 하나 이상일 수 있다.The additive may be one or more selected from the group consisting of a filler, a reactive diluent, an inorganic filler, and a coupling agent.
상기 필러는 주제부 또는 경화제부의 점도를 조절하고, 나아가 에폭시계 접착제 조성물의 흐름성을 개선하여 작업성을 개선할 수 있다. 예를 들어, 상기 필러는 실리카, 알루미나, 황산 바륨, 탈크, 진흙, 운모가루, 수산화 알루미늄, 수산화 마그네슘, 탄산 칼슘, 탄산 마그네슘, 산화 마그네슘, 질화 붕소, 붕산 알루미늄, 티탄산바륨, 티탄산 칼슘, 티탄산 마그네슘, 티탄산 비스머스, 산화 티탄, 지르콘산 바륨, 지르콘산 칼슘 또는 이들의 혼합물 등을 들 수 있으나, 이에 제한되는 것은 아니며, 상기 실리카는 구체적으로 흄드 실리카일 수 있다.The filler may improve workability by adjusting the viscosity of the main part or the curing agent part and further improving the flowability of the epoxy-based adhesive composition. For example, the filler is silica, alumina, barium sulfate, talc, mud, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, calcium titanate, magnesium titanate , bismuth titanate, titanium oxide, barium zirconate, calcium zirconate, or a mixture thereof, but is not limited thereto, and the silica may specifically be fumed silica.
본 발명의 일 실시예에 따르면, 상기 필러는 상기 주제부에서 10 내지 15 중량% 포함될 수 있다.According to one embodiment of the present invention, the filler may be included in 10 to 15% by weight in the main part.
상기 반응성 희석제는 네오페닐 글리콜 디글리시딜 에테르, 네오펜틸 글라이콜 디글리시딜 에테르, 1,4- 부탄디올 글리시딜 에테르, 에틸렌 글리콜 디글리시딜 에테르, 1,6- 헥산디올 글리시딜 에테르, 1,4-싸이클로헥산 다이메탄올 디글리시딜 에테르, 폴리프로필렌 글라이콜 디글리시딜 에테르 등일 수 있으나, 이에 제한되는 것은 아니다.The reactive diluent is neophenyl glycol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,4-butanediol glycidyl ether, ethylene glycol diglycidyl ether, 1,6-hexanediol glycidyl diyl ether, 1,4-cyclohexane dimethanol diglycidyl ether, polypropylene glycol diglycidyl ether, and the like, but is not limited thereto.
본 발명의 일 실시예에 따르면, 상기 반응성 희석제는 상기 주제부에서 1 내지 10 중량% 포함될 수 있다.According to one embodiment of the present invention, the reactive diluent may be included in an amount of 1 to 10% by weight in the main part.
이외에도 상기 조성물은 안정화제, 계면활성제, 유동 개질제, 안료, 염료, 소광제, 탈기제, 충전제, 난연제, 경화 개시제, 경화 억제제, 습윤제, 착색제, 안료, 열가소제, 가공 보조제, 자외선(UV) 차단 화합물, 형광 화합물, UV 안정제, 산화 방지제 또는 이형제에서 선택되는 어느 하나 또는 둘 이상의 첨가제를 더 포함할 수 있으며, 이는 에폭시계 접착제 조성물의 물성을 저해하지 않는 범위로 사용될 수 있다.In addition, the composition is a stabilizer, a surfactant, a flow modifier, a pigment, a dye, a matting agent, a degassing agent, a filler, a flame retardant, a curing initiator, a curing inhibitor, a wetting agent, a colorant, a pigment, a thermoplastic agent, a processing aid, and ultraviolet (UV) blocking It may further include any one or two or more additives selected from compounds, fluorescent compounds, UV stabilizers, antioxidants, and release agents, which may be used within a range that does not impair physical properties of the epoxy-based adhesive composition.
본 발명에 따른 에폭시계 구조용 접착제 조성물에 있어서, 상기 경화제부는 ⅰ) 하나 이상의 경화제 55 내지 65 중량%, 및 ⅱ) 첨가제 35 내지 45 중량%를 포함할 수 있다.In the epoxy-based structural adhesive composition according to the present invention, the curing agent part may include i) 55 to 65 wt% of one or more curing agents, and ii) 35 to 45 wt% of additives.
상기 경화제는 에폭시 수지를 경화하는 것으로서 당업계에 공지된 것이라면 제한되지 않고 사용될 수 있다. 구체적으로 예를 들면, 상기 경화제는 무수물계 경화제, 페놀계 경화제, 디시안 디아미드계 경화제, 아민계 경화제 및 고무계 경화제를 포함할 수 있고, 단독 또는 2종 이상을 혼합하여 사용할 수 있다.The curing agent as curing an epoxy resin may be used without limitation as long as it is known in the art. Specifically, for example, the curing agent may include an anhydride-based curing agent, a phenol-based curing agent, a dicyan diamide-based curing agent, an amine-based curing agent, and a rubber-based curing agent, and may be used alone or in combination of two or more.
바람직하게는 상기 경화제는 아민계 경화제로, 보다 상세하게는 지방족 아민, 지방족 폴리아민, 방향족 폴리아민, 폴리아미드 폴리아민, 변성 방향족 아민 또는 이들의 혼합물이 사용 가능하며, 구체적으로 예를 들면, 상기 지방족 아민 경화제는 에틸렌디아민, 디에틸렌트리아민, 트리에틸렌테트라민, 테트라에틸렌펜타민, 이미노비스프로필아민, 비스(헥사메틸렌)트리아민, 1,3,6-트리스아미노메틸헥산, 폴리메틸렌디아민, 트리메틸헥사메틸렌디아민 및 폴리에테르디아민 등에서 선택되는 하나 이상일 수 있으나, 이에 제한되는 것은 아니다. Preferably, the curing agent is an amine-based curing agent, and more specifically, an aliphatic amine, an aliphatic polyamine, an aromatic polyamine, a polyamide polyamine, a modified aromatic amine, or a mixture thereof may be used. Specifically, for example, the aliphatic amine curing agent is ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, iminobispropylamine, bis(hexamethylene)triamine, 1,3,6-trisaminomethylhexane, polymethylenediamine, trimethylhexamethylene It may be at least one selected from diamine and polyether diamine, but is not limited thereto.
지환족 아민 경화제는 이소포론디아민, 멘탄디아민, N-아미노에틸피페라진, 3,9-비스(3-아미노프로필) 2,4,8,10-테트라옥사스피로(5,5)운데칸 어덕트, 비스(4-아미노-3-메틸시클로헥실)메탄, 비스(4-아미노시클로헥실)메탄 등에서 선택되는 하나 이상일 수 있다. 방향족 아민 경화제는 페닐렌디아민, 자일렌디아민, 디아미노디페닐메탄, 디아미노디페닐술폰, 벤질디메틸아민 및 디메틸아미노메틸벤젠 등에서 선택되는 하나 이상일 수 있다. 이때, 방향족 아민 경화제는 메타(m-), 오르소(o-) 또는 파라(p-) 형태 중 어떤 형태도 가질 수 있다. 상기 변성 방향족 아민은 4,4-디아미노디페닐메탄, 메타 페닐렌 디아민 및 디아미노디페닐 설폰으로 이루어진 군에서 선택된 하나 이상의 혼합물을 사용할 수 있으나, 이에 제한되는 것은 아니다.The cycloaliphatic amine curing agent is isophoronediamine, menthandiamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl) 2,4,8,10-tetraoxaspiro(5,5)undecane adduct , bis(4-amino-3-methylcyclohexyl)methane, bis(4-aminocyclohexyl)methane, and the like. The aromatic amine curing agent may be at least one selected from phenylenediamine, xylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, benzyldimethylamine, and dimethylaminomethylbenzene. In this case, the aromatic amine curing agent may have any form of meta (m-), ortho (o-) or para (p-) form. The modified aromatic amine may be a mixture of one or more selected from the group consisting of 4,4-diaminodiphenylmethane, meta-phenylene diamine, and diaminodiphenyl sulfone, but is not limited thereto.
상기 아민계 경화제는 15 내지 25 중량% 포함될 수 있고, 상기와 같은 범위로 아민계 경화제를 포함하는 경우 에폭시 수지의 경화 속도를 조절할 수 있고, 우수한 기계적 강도를 확보할 수 있다.The amine-based curing agent may be included in an amount of 15 to 25% by weight, and when the amine-based curing agent is included in the above range, the curing rate of the epoxy resin may be adjusted and excellent mechanical strength may be secured.
또한, 상기 경화제는 당해 기술분야의 통상적인 고무계 경화제를 포함할 수 있고, 본 발명에 따른 에폭시계 접착제 조성물의 강인성 및 유연성을 부여함으로써, 접착력 향상 및 저온에서의 기계적 물성을 향상시키는 효과를 제공할 수 있다.In addition, the curing agent may include a conventional rubber-based curing agent in the art, and by imparting toughness and flexibility to the epoxy-based adhesive composition according to the present invention, it will provide an effect of improving adhesive strength and improving mechanical properties at low temperatures. can
바람직하게는, 상기 고무계 경화제는 아민-말단 반응성 액상 고무일 수 있고, 보다 바람직하게는 아민-말단 부타디엔 아크릴로니트릴(amine-terminated butadiene acrylonitrilem, ATBN)일 수 있으며, 35 내지 45 중량% 포함될 수 있으나, 이에 제한되는 것은 아니다Preferably, the rubber-based curing agent may be an amine-terminated reactive liquid rubber, more preferably amine-terminated butadiene acrylonitrilem (ATBN), and may be included in an amount of 35 to 45% by weight. , but not limited to
..
상기 첨가제는 경화 촉진제 또는 필러에서 선택되는 하나 이상일 수 있고, 35 내지 45 중량% 포함될 수 있으나, 이에 제한되는 것은 아니다.The additive may be one or more selected from a curing accelerator or filler, and may be included in an amount of 35 to 45% by weight, but is not limited thereto.
상기 경화 촉진제는 경화제와 함께 사용하여 경화속도를 조절하기 위하여 사용되는 것으로, DMP-30과 같은 3급 아민류를 사용할 수 있으며, 1 내지 5 중량% 포함될 수 있다. 상기 경화제부 내 상기 경화 촉진제의 함량이 지나치게 적으면 저온에서의 경화시간이 길어지는 문제가 있을 수 있고, 반대로 지나치게 많으면 경화시간이 너무 빨라져서 가사시간 즉, 적절한 오픈 타임을 확보하는데 문제가 발생할 수도 있다.The curing accelerator is used together with a curing agent to control the curing rate, and tertiary amines such as DMP-30 may be used, and may be included in an amount of 1 to 5% by weight. If the content of the curing accelerator in the curing agent unit is too small, there may be a problem in that the curing time at low temperature becomes long. .
상기 필러는 상기 경화제부에서 34 내지 40 중량% 포함될 수 있으나, 이에 제한되는 것은 아니다.The filler may be included in an amount of 34 to 40% by weight in the curing agent part, but is not limited thereto.
이에 상응하는 특징들은 상술된 부분에서 대신할 수 있다.Corresponding features may be substituted in the foregoing.
본 발명에 따른 에폭시계 구조용 접착제 조성물에 있어서, 상기 주제부 및 경화제부는 1 : (0.3 내지 0.7)의 중량비로 포함될 수 있고, 바람직하게는 1 : 0.5의 중량비로 포함될 수 있으나, 이에 제한되는 것은 아니다.In the epoxy-based structural adhesive composition according to the present invention, the main part and the curing agent part may be included in a weight ratio of 1: (0.3 to 0.7), preferably 1: 0.5, but are not limited thereto. .
또한, 본 발명은 코어-쉘 고무 입자가 분산된 말단 이소시아네이트 기를 갖는 탄성중합체성 강인화제의 제조방법을 제공한다.The present invention also provides a method for preparing an elastomeric toughener having terminal isocyanate groups in which core-shell rubber particles are dispersed.
본 발명에 따른 강인화제 제조방법은 히드록실기(-OH)가 2 내지 4개인 폴리올, 예를 들어, 폴리부타디엔, 폴리에틸렌옥사이드(PEO), 폴리테트라메틸렌옥사이드(PTMO), 폴리프로필렌옥사이드(PPO), 폴리이소부틸렌, 폴리에틸렌 에딕페이트(poly(ethylene adipate)) 또는 폴리카프로락톤(polycaprolactone)의 다이올(diol), 트리올(triol) 및 테트라올(tetraol)로 이루어진 군에서 선택되는 하나의 폴리올 또는 둘 이상의 폴리올 혼합물을 제조하는 단계;The toughening agent manufacturing method according to the present invention is a polyol having 2 to 4 hydroxyl groups (-OH), for example, polybutadiene, polyethylene oxide (PEO), polytetramethylene oxide (PTMO), polypropylene oxide (PPO) One polyol selected from the group consisting of a diol, a triol, and a tetraol of polyisobutylene, polyethylene adipate, or polycaprolactone or preparing a mixture of two or more polyols;
상기의 폴리올 또는 폴리올 혼합물에 코어-쉘 고무 입자를 고속 분산시킨 후, 폴리이소시아네이트 계 화합물을 첨가하여 예비중합체(pre-polymer)를 제조하는 단계; 및preparing a pre-polymer by adding a polyisocyanate-based compound after high-speed dispersing core-shell rubber particles in the polyol or polyol mixture; and
상기 제조된 예비중합체를 블로킹한 후, 진공에서 탈포하는 단계를 포함할 수 있다.After blocking the prepared prepolymer, degassing in vacuum may be included.
상기 폴리올 또는 폴리올 혼합물을 제조하는 단계는 상기 폴리부타디엔, 폴리에틸렌옥사이드(PEO), 폴리테트라메틸렌옥사이드(PTMO), 폴리프로필렌옥사이드(PPO), 폴리이소부틸렌, 폴리에틸렌 에딕페이트(poly(ethylene adipate)) 또는 폴리카프로락톤(polycaprolactone)의 다이올(diol), 트리올(triol) 및 테트라올(tetraol)로 이루어진 군에서 선택되는 하나의 폴리올을 준비하거나 또는 둘 이상의 서로 다른 폴리올을 100 내지 200℃ 질소 분위기에서 10 내지 60분 동안 혼합함으로써 수행될 수 있다.The step of preparing the polyol or polyol mixture is the polybutadiene, polyethylene oxide (PEO), polytetramethylene oxide (PTMO), polypropylene oxide (PPO), polyisobutylene, polyethylene adipate (poly(ethylene adipate)) Alternatively, one polyol selected from the group consisting of a diol, a triol, and a tetraol of polycaprolactone is prepared, or two or more different polyols are prepared in a nitrogen atmosphere at 100 to 200 ° C. It may be performed by mixing for 10 to 60 minutes in
본 발명의 일 실시예에 따르면, 다이머 다이올 또는 이로 제조된 폴리에스터 폴리올 35 내지 70 중량% 및 폴리부타디엔 다이올 10 내지 20 중량%를 100 내지 200℃ 질소 분위기에서 10 내지 60분 동안 혼합함으로써 수행될 수 있다.According to an embodiment of the present invention, 35 to 70% by weight of dimer diol or polyester polyol prepared therefrom and 10 to 20% by weight of polybutadiene diol are mixed in a nitrogen atmosphere at 100 to 200 ° C. for 10 to 60 minutes. It can be.
상기 예비중합체를 제조하는 단계는, 상기 제조된 폴리올 혼합물에 부타디엔계 코어-쉘 고무 입자를 10 내지 40 중량% 고속 분산시킨 후, 폴리이소시네아네이트 계 화합물 5 내지 15 중량%를 첨가하여 60 내지 100분 동안 반응시킴으로써 수행될 수 있다.In the step of preparing the prepolymer, 10 to 40% by weight of butadiene-based core-shell rubber particles are dispersed at high speed in the polyol mixture prepared above, and then 5 to 15% by weight of a polyisocineanate-based compound is added to form a 60 to 60 to 40% by weight polyisocineanate compound. It can be carried out by reacting for 100 minutes.
상기 블로킹은 상기 제조된 예비중합체에 1,3-디메틸피라졸을 첨가하여 80 내지 100℃에서 50 내지 70분 동안 반응시킴으로써 수행될 수 있다.The blocking may be performed by adding 1,3-dimethylpyrazole to the prepared prepolymer and reacting at 80 to 100° C. for 50 to 70 minutes.
이에 상응하는 특징들은 상술된 부분에서 대신할 수 있다.Corresponding features may be substituted in the foregoing.
이하, 본 발명의 이해를 돕기 위하여 실시예를 들어 상세하게 설명하기로 한다. 다만 하기의 실시예는 본 발명의 내용을 예시하는 것일 뿐 본 발명의 범위가 하기 실시예에 한정되는 것은 아니다. 본 발명의 실시예는 당업계에서 평균적인 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위해 제공되는 것이다.Hereinafter, examples will be described in detail to aid understanding of the present invention. However, the following examples are merely illustrative of the contents of the present invention, but the scope of the present invention is not limited to the following examples. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.
<실시예 1> 강인화제 1의 제조<Example 1> Preparation of toughening agent 1
66 중량%의 1000 분자량의 다이머 다이올(dimer diol)(Priplast™ 1837, Croda) 및 17 중량%의 폴리부타디엔 다이올(polybutadiene diol)(R-45HT, SATOMER)을 100℃ 질소 분위기에서 30분 동안 혼합한 다음, 12 중량%의 1,6-헥사메틸렌디이소시아네이트를 첨가하여 80분 동안 반응시켜 3.0 ~ 3.5 중량% NCO 예비중합체를 제조하고, 5 중량%의 1,3-디메틸피라졸을 첨가하여 90℃ 조건에서 60분 동안 블록킹 반응이 되도록 하였다. 생성된 강인화제를 진공 조건에서 탈포하였다.66% by weight of 1000 molecular weight dimer diol (Priplast™ 1837, Croda) and 17% by weight of polybutadiene diol (R-45HT, SATOMER) were mixed at 100°C in a nitrogen atmosphere for 30 minutes. After mixing, 12 wt% of 1,6-hexamethylene diisocyanate was added and reacted for 80 minutes to prepare a 3.0 to 3.5 wt% NCO prepolymer, and 5 wt% of 1,3-dimethylpyrazole was added to The blocking reaction was allowed to occur at 90° C. for 60 minutes. The resulting toughening agent was degassed under vacuum conditions.
<실시예 2> 강인화제 2의 제조<Example 2> Preparation of toughening agent 2
53 중량%의 1000 분자량의 다이머 다이올 및 17 중량%의 폴리부타디엔 다이올을 150℃ 질소 분위기에서 30분 동안 혼합한 다음, 부타디엔계 코어-쉘 고무 입자 15 중량%을 고속 분산시켰다. 이 후 상기 온도를 100℃로 내리고, 11 중량%의 1,6-헥사메틸렌디이소시아네이트를 첨가하여 80분 동안 반응시켜 3.0 ~ 3.5 중량% NCO 예비중합체를 제조하고, 4 중량%의 1,3-디메틸피라졸을 첨가하여 90℃ 조건에서 60분 동안 블록킹 반응이 되도록 하였다. 생성된 강인화제를 진공 조건에서 탈포하였다.53% by weight of 1000 molecular weight dimer diol and 17% by weight of polybutadiene diol were mixed in a nitrogen atmosphere at 150° C. for 30 minutes, and then 15% by weight of butadiene-based core-shell rubber particles were dispersed at high speed. Thereafter, the temperature was lowered to 100° C., and 11 wt% of 1,6-hexamethylene diisocyanate was added and reacted for 80 minutes to prepare a 3.0 to 3.5 wt% NCO prepolymer, and 4 wt% of 1,3-hexamethylene diisocyanate was added. Dimethylpyrazole was added to allow a blocking reaction at 90° C. for 60 minutes. The resulting toughening agent was degassed under vacuum conditions.
<실시예 3> 강인화제 3의 제조<Example 3> Preparation of toughening agent 3
40 중량%의 1000 분자량의 다이머 다이올 및 17 중량%의 폴리부타디엔 다이올을 150℃ 질소 분위기에서 30분 동안 혼합한 다음, 부타디엔계 코어-쉘 고무 입자 30 중량%을 고속 분산시켰다. 이 후 상기 온도를 100℃로 내리고, 9 중량%의 1,6-헥사메틸렌디이소시아네이트를 첨가하여 80분 동안 반응시켜 3.0 ~ 3.5 중량% NCO 예비중합체를 제조하고, 4 중량%의 1,3-디메틸피라졸을 첨가하여 90℃ 조건에서 60분 동안 블록킹 반응이 되도록 하였다. 생성된 강인화제를 진공 조건에서 탈포하였다.40% by weight of 1000 molecular weight dimer diol and 17% by weight of polybutadiene diol were mixed in a nitrogen atmosphere at 150° C. for 30 minutes, and then 30% by weight of butadiene-based core-shell rubber particles were dispersed at high speed. Thereafter, the temperature was lowered to 100° C., and 9 wt% of 1,6-hexamethylene diisocyanate was added and reacted for 80 minutes to prepare a 3.0 to 3.5 wt% NCO prepolymer, and 4 wt% of 1,3-hexamethylene diisocyanate was added. Dimethylpyrazole was added to allow a blocking reaction at 90° C. for 60 minutes. The resulting toughening agent was degassed under vacuum conditions.
<실시예 4> 강인화제 4의 제조<Example 4> Preparation of toughening agent 4
40 중량%의 2000 분자량의 다이머 다이올(Priplast™ 1838, Croda) 및 17 중량%의 폴리부타디엔 다이올을 150℃ 질소 분위기에서 30분 동안 혼합한 다음, 부타디엔계 코어-쉘 고무 입자 30 중량%을 고속 분산시켰다. 이 후 상기 온도를 100℃로 내리고, 9 중량%의 1,6-헥사메틸렌디이소시아네이트를 첨가하여 80분 동안 반응시켜 3.0 ~ 3.5 중량% NCO 예비중합체를 제조하고, 4 중량%의 1,3-디메틸피라졸을 첨가하여 90℃ 조건에서 60분 동안 블록킹 반응이 되도록 하였다. 생성된 강인화제를 진공 조건에서 탈포하였다.40% by weight of 2000 molecular weight dimer diol (Priplast™ 1838, Croda) and 17% by weight of polybutadiene diol were mixed in a nitrogen atmosphere at 150° C. for 30 minutes, and then 30% by weight of butadiene-based core-shell rubber particles were mixed. dispersed at high speed. Thereafter, the temperature was lowered to 100° C., and 9 wt% of 1,6-hexamethylene diisocyanate was added and reacted for 80 minutes to prepare a 3.0 to 3.5 wt% NCO prepolymer, and 4 wt% of 1,3-hexamethylene diisocyanate was added. Dimethylpyrazole was added to allow a blocking reaction at 90° C. for 60 minutes. The resulting toughening agent was degassed under vacuum conditions.
<실시예 5> 강인화제 5의 제조<Example 5> Preparation of toughening agent 5
40 중량%의 3000 분자량의 다이머 다이올(Priplast™ 3196, Croda) 및 17 중량%의 폴리부타디엔 다이올을 150℃ 질소 분위기에서 30분 동안 혼합한 다음, 부타디엔계 코어-쉘 고무 입자 30 중량%을 고속 분산시켰다. 이 후 상기 온도를 100℃로 내리고, 9 중량%의 1,6-헥사메틸렌디이소시아네이트를 첨가하여 80분 동안 반응시켜 3.0 ~ 3.5 중량% NCO 예비중합체를 제조하고, 4 중량%의 1,3-디메틸피라졸을 첨가하여 90℃ 조건에서 60분 동안 블록킹 반응이 되도록 하였다. 생성된 강인화제를 진공 조건에서 탈포하였다.40% by weight of 3000 molecular weight dimer diol (Priplast™ 3196, Croda) and 17% by weight of polybutadiene diol were mixed in a nitrogen atmosphere at 150° C. for 30 minutes, and then 30% by weight of butadiene-based core-shell rubber particles were mixed. dispersed at high speed. Thereafter, the temperature was lowered to 100° C., and 9 wt% of 1,6-hexamethylene diisocyanate was added and reacted for 80 minutes to prepare a 3.0 to 3.5 wt% NCO prepolymer, and 4 wt% of 1,3-hexamethylene diisocyanate was added. Dimethylpyrazole was added to allow a blocking reaction at 90° C. for 60 minutes. The resulting toughening agent was degassed under vacuum conditions.
<비교예 1> 강인화제 A의 제조<Comparative Example 1> Preparation of toughening agent A
40 중량%의 2000 분자량의 에테르 다이올 및 17 중량%의 에스테르 다이올을 150℃ 질소 분위기에서 30분 동안 혼합한 다음, 부타디엔계 코어-쉘 고무 입자 30 중량%을 고속 분산시켰다. 이 후 상기 온도를 100℃로 내리고, 9 중량%의 1,6-헥사메틸렌디이소시아네이트를 첨가하여 80분 동안 반응시켜 3.0 ~ 3.5 중량% NCO 예비중합체를 제조하고, 4 중량%의 1,3-디메틸피라졸을 첨가하여 90℃ 조건에서 60분 동안 블록킹 반응이 되도록 하였다. 생성된 강인화제를 진공 조건에서 탈포하였다.40% by weight of 2000 molecular weight ether diol and 17% by weight of ester diol were mixed in a nitrogen atmosphere at 150° C. for 30 minutes, and then 30% by weight of butadiene-based core-shell rubber particles were dispersed at high speed. Thereafter, the temperature was lowered to 100° C., and 9 wt% of 1,6-hexamethylene diisocyanate was added and reacted for 80 minutes to prepare a 3.0 to 3.5 wt% NCO prepolymer, and 4 wt% of 1,3-hexamethylene diisocyanate was added. Dimethylpyrazole was added to allow a blocking reaction at 90° C. for 60 minutes. The resulting toughening agent was degassed under vacuum conditions.
<비교예 2> 강인화제 B의 제조<Comparative Example 2> Preparation of toughening agent B
40 중량%의 2000 분자량의 폴리카보나이트 다이올 및 17 중량%의 에스테르 다이올을 150℃ 질소 분위기에서 30분 동안 혼합한 다음, 부타디엔계 코어-쉘 고무 입자 30 중량%을 고속 분산시켰다. 이 후 상기 온도를 100℃로 내리고, 9 중량%의 1,6-헥사메틸렌디이소시아네이트를 첨가하여 80분 동안 반응시켜 3.0 ~ 3.5 중량% NCO 예비중합체를 제조하고, 4 중량%의 1,3-디메틸피라졸을 첨가하여 90℃ 조건에서 60분 동안 블록킹 반응이 되도록 하였다. 생성된 강인화제를 진공 조건에서 탈포하였다.40% by weight of 2000 molecular weight polycarbonate diol and 17% by weight of ester diol were mixed in a nitrogen atmosphere at 150° C. for 30 minutes, and then 30% by weight of butadiene-based core-shell rubber particles were dispersed at high speed. Thereafter, the temperature was lowered to 100° C., and 9 wt% of 1,6-hexamethylene diisocyanate was added and reacted for 80 minutes to prepare a 3.0 to 3.5 wt% NCO prepolymer, and 4 wt% of 1,3-hexamethylene diisocyanate was added. Dimethylpyrazole was added to allow a blocking reaction at 90° C. for 60 minutes. The resulting toughening agent was degassed under vacuum conditions.
<비교예 3> 강인화제 C의 제조<Comparative Example 3> Preparation of toughening agent C
40 중량%의 2000 분자량의 폴리 테트라 메틸렌 에테르 글리콜 다이올 및 17 중량%의 에스테르 다이올을 150℃ 질소 분위기에서 30분 동안 혼합한 다음, 부타디엔계 코어-쉘 고무 입자 30 중량%을 고속 분산시켰다. 이 후 상기 온도를 100℃로 내리고, 9 중량%의 1,6-헥사메틸렌디이소시아네이트를 첨가하여 80분 동안 반응시켜 3.0 ~ 3.5 중량% NCO 예비중합체를 제조하고, 4 중량%의 1,3-디메틸피라졸을 첨가하여 90℃ 조건에서 60분 동안 블록킹 반응이 되도록 하였다. 생성된 강인화제를 진공 조건에서 탈포하였다.40% by weight of 2000 molecular weight polytetramethylene ether glycol diol and 17% by weight of ester diol were mixed in a nitrogen atmosphere at 150° C. for 30 minutes, and then 30% by weight of butadiene-based core-shell rubber particles were dispersed at high speed. Thereafter, the temperature was lowered to 100° C., and 9 wt% of 1,6-hexamethylene diisocyanate was added and reacted for 80 minutes to prepare a 3.0 to 3.5 wt% NCO prepolymer, and 4 wt% of 1,3-hexamethylene diisocyanate was added. Dimethylpyrazole was added to allow a blocking reaction at 90° C. for 60 minutes. The resulting toughening agent was degassed under vacuum conditions.
<제조예 1> 이액형 에폭시 구조용 접착제 배합물 제조<Preparation Example 1> Preparation of two-component epoxy structural adhesive formulation
하기 표 1은 에폭시 구조용 접착제를 제조하기 위한 배합물 성분 및 중량을 나타낸 것이다.Table 1 below shows formulation components and weights for preparing epoxy structural adhesives.
PART A
PART A
PART B
PART B
* 1) 65 중량%의 비스페놀 A의 다이글리시딜 에테르와 35 중량%의 MBS계 코어-쉘 입자가 분산되어 있는 혼합물* 1) A mixture in which 65% by weight of diglycidyl ether of bisphenol A and 35% by weight of MBS-based core-shell particles are dispersed
* 2) Hypro 1300x16 - Huntsman사에서 생산 중인 아민 말단 부타디엔 아크릴로니트릴(amine terminated butadiene acrylonitrile)* 2) Hypro 1300x16 - Amine terminated butadiene acrylonitrile produced by Huntsman
<분석예 1> 물성분석<Analysis Example 1> Physical property analysis
1. 전단강도(MPa)1. Shear strength (MPa)
냉간 압연 강판(Cole Rolled steel sheet, CR)은 이소프로필알코올 또는 톨루엔을 사용하여 탈지 및 건조시킨 후 깨끗한 천으로 표면의 용제를 제거하였고, 알루미늄(Al) 시편은 깨끗한 천으로 표면의 먼지만 제거하였다. 시편의 크기는 CR 강판은 100mm x 25mm x 1.6T, Al 시편은 100mm x 25mm x 2.0T 크기로 제작되었다. CR 및 Al 시편의 한쪽 면에 상기 실시예 또는 비교예에서 제조된 접착제를 도포하고 오버랩 12.5mm에서 접합시켰다. 접합부 클립(clip)으로 고정(압축력 약 0.3kg)한 후, 22℃에서 72시간 경화시킨 후, 22℃, 및 상대습도 65%의 표준상태에서 시험을 진행하였다. 상기 전단강도 시험편을 만능재료시험기(SHIMADZU, AG-X plus)에서 5mm/min의 인장속도로 180°방향으로 인장하중을 가하였다. 상기 전단강도는 만능재료시험기 부속 자동기록장치의 하중-변위 곡선으로부터 극대치를 구하였으며, 3회 테스트한 평균값을 기재하였다.Cold rolled steel sheet (Cole Rolled steel sheet, CR) was degreased and dried using isopropyl alcohol or toluene, then the surface solvent was removed with a clean cloth, and only the dust on the surface of the aluminum (Al) specimen was removed with a clean cloth. . The size of the specimen was 100mm x 25mm x 1.6T for the CR steel plate and 100mm x 25mm x 2.0T for the Al specimen. The adhesive prepared in Examples or Comparative Examples was applied to one side of the CR and Al specimens and bonded at an overlap of 12.5 mm. After fixing with a joint clip (compressive force of about 0.3 kg), curing at 22° C. for 72 hours, the test was conducted under standard conditions of 22° C. and 65% relative humidity. A tensile load was applied to the shear strength test piece in a 180° direction at a tensile speed of 5 mm/min in a universal testing machine (SHIMADZU, AG-X plus). The maximum value of the shear strength was obtained from the load-displacement curve of the automatic recording device attached to the universal testing machine, and the average value of three tests was described.
2. 박리강도(T-peel strength)(N/25mm)2. T-peel strength (N/25mm)
150mm x 300mm x 0.8T 크기의 CR 및 Al 강판을 이소프로필알코올 또는 톨루엔으로 탈지 및 건조시킨 후 깨끗한 천으로 표면의 용제를 제거하였다. 시험 시편 한쪽 면에 상기 실시예 또는 비교예에서 제조된 접착제를 25mm x 220mm 도포한 후, 다른 한쪽 강판을 접합시켰다. 접합부는 클립으로 고정(압축력 약 0.3kg)한 후 22℃에서 72시간 경화시킨 후, 22℃, 및 상대습도 65%의 표준상태에서 시험을 진행하였다. 상기 박리강도 시험편은 만능재료시험기(SHIMADZU, AG-X plus)에서 50mm/min 인장속도 180°방향으로 인장하중을 가하였다. 상기 박리강도는 인장시험기 부속 자동 기록장치의 하중-변위 곡선으로부터 최초의 극대치 후의 50mm 길이의 평균치이며, 3회에 걸쳐 테스트한 평균값을 기입하였다.CR and Al steel sheets with a size of 150mm x 300mm x 0.8T were degreased and dried with isopropyl alcohol or toluene, and then the surface solvent was removed with a clean cloth. After applying 25 mm x 220 mm of the adhesive prepared in Example or Comparative Example to one side of the test specimen, the other steel plate was bonded. The joint was fixed with a clip (compressive force of about 0.3 kg), cured at 22° C. for 72 hours, and then tested under standard conditions of 22° C. and 65% relative humidity. The peel strength test piece was subjected to a tensile load in the direction of 180 ° at a tensile speed of 50 mm / min in a universal testing machine (SHIMADZU, AG-X plus). The peel strength is the average value of the 50 mm length after the first maximum value from the load-displacement curve of the automatic recording device attached to the tensile tester, and the average value tested three times was entered.
3. 충격강도(N/mm)3. Impact strength (N/mm)
90mm x 20mm x 1.6T 크기의 강판을 이소프로필알코올 또는 톨루엔으로 탈지, 건조 후 깨끗한 천으로 잔류 용제를 제거한 다음 CR 강판의 한쪽 면에 상기 실시 예에서 제조된 접착제를 20mm x 30mm 도포한 후 다른 한쪽 강판을 접합시켰다. 접합부는 클립으로 고정(압축력 약 0.3kg)한 후 22℃에서 72시간 경화시킨 후, 22℃, 및 상대습도 65%의 표준상태에서 시험을 진행하였다. 시험편은 충격강도 시험기(Instron 9250HV)를 사용하여 다음의 조건; 드롭 웨이트(drop weight)(45kg), 드롭 하이트(drop height)(0.2m), 드롭 속도(2m/sec)에 의해 충격을 가하였다. 충격 강도 수치는 3회에 걸쳐 테스트한 평균값을 기입하였다.After degreasing and drying a 90mm x 20mm x 1.6T steel sheet with isopropyl alcohol or toluene, removing residual solvent with a clean cloth, 20mm x 30mm of the adhesive prepared in the above example was applied to one side of the CR steel sheet, and then the other side steel plates were joined. The joint was fixed with a clip (compressive force of about 0.3 kg), cured at 22° C. for 72 hours, and then tested under standard conditions of 22° C. and 65% relative humidity. The test piece was tested using an impact strength tester (Instron 9250HV) under the following conditions; The impact was applied according to the drop weight (45 kg), drop height (0.2 m), and drop speed (2 m/sec). The impact strength value was the average value tested three times.
하기 표 2는 상기 실시예 1 내지 5 및 비교예 1 내지 3에 따라 제조된 강인화제에 따른 접착제의 물성을 확인한 것이다.Table 2 below confirms the physical properties of the adhesives according to the toughening agents prepared according to Examples 1 to 5 and Comparative Examples 1 to 3.
No.
No.
강인화제
toughening agent
/파괴모드Shear strength (MPa)
/destroy mode
/파괴모드normal temperature
/destroy mode
/파괴모드-40℃
/destroy mode
(* CF : 응집성 파절, AF : 접착성 파절)(* CF: cohesive fracture, AF: adhesive fracture)
실시예 1 내지 5 및 비교예 1 내지 3의 측정 실험에서 실시예의 접착제는 대부분 CR 표면과 Al 표면과의 파괴모드가 CF 상태로 경향이 확인되었고, 전단강도, 충격강도 및 박리강도에 대한 모든 물성치가 우수하게 시험 측정 결과를 얻을 수 있었다.In the measurement experiments of Examples 1 to 5 and Comparative Examples 1 to 3, most of the adhesives in the examples showed a tendency for the failure mode of the CR surface and the Al surface to be in the CF state, and all physical properties for shear strength, impact strength and peel strength was able to obtain excellent test measurement results.
그러나 비교예 1 내지 3의 경우 전단강도, 박리강도, 충격강도가 AF 파괴모드 경향을 보이며, 실시예 대비 매우 취약한 결과를 보였다.However, in the case of Comparative Examples 1 to 3, shear strength, peel strength, and impact strength showed a tendency to AF failure mode, and showed very weak results compared to Examples.
이상으로 본 발명의 특정한 부분을 상세히 기술한 바, 당업계의 통상의 지식을 가진 자에게 있어서 이러한 구체적인 기술은 단지 바람직한 구현 예일 뿐이며,이에 본 발명의 범위가 제한되는 것이 아닌 점은 명백하다. 따라서, 본 발명의 실질적인 범위는 첨부된 청구항과 그의 등가물에 의하여 정의된다고 할 것이다. 본 발명의 범위는 후술하는 청구범위에 의하여 나타내어지며, 청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.Having described specific parts of the present invention in detail above, it is clear that these specific techniques are merely preferred embodiments for those skilled in the art, and the scope of the present invention is not limited thereto. Accordingly, the substantial scope of the present invention will be defined by the appended claims and equivalents thereof. The scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be interpreted as being included in the scope of the present invention.
Claims (5)
경화제부;를 포함하는, 에폭시계 구조용 접착제 조성물.a) 50 to 70% by weight of at least one epoxy resin, b) 15 to 25% by weight of an elastomeric toughening agent having terminal isocyanate groups in which core-shell rubber particles are dispersed, and c) 15 to 25% by weight of an additive. wealth; and
An epoxy-based structural adhesive composition comprising a; curing agent unit.
상기 에폭시 수지는,
비스페놀형 에폭시 수지 30 내지 40 중량% 및 상기 비스페놀형 에폭시 수지에 고무 입자가 분산된 변성 에폭시 수지 20 내지 30 중량%를 포함하는 것을 특징으로 하는, 에폭시계 구조용 접착제 조성물.According to claim 1,
The epoxy resin,
An epoxy-based structural adhesive composition comprising 30 to 40% by weight of a bisphenol-type epoxy resin and 20 to 30% by weight of a modified epoxy resin in which rubber particles are dispersed in the bisphenol-type epoxy resin.
상기 강인화제는,
폴리부타디엔, 폴리에틸렌옥사이드(PEO), 폴리테트라메틸렌옥사이드(PTMO), 폴리프로필렌옥사이드(PPO), 폴리이소부틸렌, 폴리에틸렌 에딕페이트(poly(ethylene adipate)) 또는 폴리카프로락톤(polycaprolactone)의 다이올(diol), 트리올(triol) 및 테트라올(tetraol)로 이루어진 군에서 선택되는 하나의 폴리올 또는 둘 이상의 폴리올 혼합물에 코어-쉘 고무 입자를 분산시킨 후, 폴리이소시아네이트 계 화합물을 첨가하여 반응시킨 것을 특징으로 하는, 에폭시계 구조용 접착제 조성물.According to claim 1,
The toughening agent,
Diols of polybutadiene, polyethylene oxide (PEO), polytetramethylene oxide (PTMO), polypropylene oxide (PPO), polyisobutylene, poly(ethylene adipate) or polycaprolactone After dispersing core-shell rubber particles in one polyol or a mixture of two or more polyols selected from the group consisting of diol, triol, and tetraol, a polyisocyanate-based compound is added and reacted. To, an epoxy-based structural adhesive composition.
상기 첨가제는,
필러, 반응성 희석제, 무기 충진제 및 커플링제로 이루어진 군에서 선택되는 하나 이상인 것을 특징으로 하는, 에폭시계 구조용 접착제 조성물. According to claim 1,
The additive is
An epoxy-based structural adhesive composition, characterized in that at least one selected from the group consisting of a filler, a reactive diluent, an inorganic filler and a coupling agent.
상기 주제부 및 경화제부는,
1 : (0.3 내지 0.7)의 중량비로 포함되는 것을 특징으로 하는, 에폭시계 구조용 접착제 조성물.According to claim 1,
The subject part and the curing agent part,
1: characterized in that it is included in a weight ratio of (0.3 to 0.7), epoxy-based structural adhesive composition.
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