KR20230033212A - Display module and method of manufacturing display device - Google Patents

Abstract

The present invention relates to a display device manufacturing method and a display module formed during a manufacturing procedure. In accordance with one embodiment, the display device manufacturing method includes the following steps of: providing a display substrate in which a cutting line is defined, and which includes a first area, a bending area extended from the first area, and a second area extended from the bending area; providing a lower film on the back of the display substrate; providing a first film on the front side of the display substrate to be overlapped with the first area; providing a second film on the front side of the display substrate to be overlapped with the second area; and forming a display panel by cutting the panel along the cutting line. One of the first and second films is provided to cover the bending area, and the lower film can support the display substrate in the step of providing the first and second films. Therefore, the present invention is capable of preventing damage to a display module during the procedure of attaching a film onto a bending area.

Description

Display module and display device manufacturing method {DISPLAY MODULE AND METHOD OF MANUFACTURING DISPLAY DEVICE}

The present invention relates to a display module and a method of manufacturing a display panel using the same, and more particularly, to a display module including a bending area and a method of manufacturing a display panel using the same.

Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation devices, and game machines may include display panels and display devices for generating and displaying images. The display panel may include a plurality of pixels generating an image and a driving chip for driving the pixels.

With the recent development of technology, a display device including a flexible display panel is being developed. Meanwhile, a bending area of the display panel that is bent with a predetermined curvature may be vulnerable to external impact or internally applied stress. Therefore, research on a method for manufacturing a display panel to prevent damage to a bending area of the display panel is required.

An object of the present invention is to provide a display module necessary for manufacturing a display panel whose bending area stiffness is supplemented, and a display device manufacturing method using the same.

An object of the present invention is to provide a method for manufacturing a display device capable of attaching a film on a bending area without damaging the display panel.

In one embodiment, a cutting line is defined and a display substrate including a first area, a bending area extending from the first area, and a second area extending from the bending area is provided; providing a film, providing a first film on the front surface of the display substrate to overlap the first area, providing a second film on the front surface of the display substrate to overlap the second area; and a cutting step of forming a display panel by cutting along the cutting line, wherein one of the first film and the second film is provided to cover the bending area, and the lower film is provided to cover the first film and the second film. A method of manufacturing a display device supporting the display substrate in the providing of the second film is provided.

The method of manufacturing the display device may further include forming an opening in the lower film, wherein the opening separates a portion of the lower film from the rear surface of the display substrate along a boundary of a removal region defined in the lower film. The lower film formed with the opening may include first portions overlapping the bending area and supporting an area outside the cutting line of the display substrate.

The removal region may extend to one end and the other end of the lower film, and the first parts of the lower film may be spaced apart from each other on a plane with the opening interposed therebetween.

The opening may be formed by a laser irradiated along the boundary of the removal area, and the laser may include a CO ₂ laser beam, a UV laser beam, or a femtosecond laser beam.

The opening forming step may be performed after the cutting step.

The step of forming the opening may be performed before the step of providing the first film.

The providing of the first film includes attaching the first film to cover the first area and the bending area by pressing the first film with a roller, and the second film is applied to the bending area. It is non-overlapping, and the lower film may support the first area and the bending area of the display substrate in the step of attaching the first film.

The providing of the second film includes attaching the second film to cover the second area and the bending area by pressing the second film with a roller, and the first film is applied to the bending area. It is non-overlapping, and the lower film may support the second area and the bending area of the display substrate in the step of attaching the second film.

The method of manufacturing the display device may further include providing a window on the first film after the cutting step.

The method of manufacturing the display device may further include providing a protective member on a rear surface of the lower film overlapping the first region after the providing of the window.

The method of manufacturing the display device may further include, after the providing of the window, bending the bending area such that the second area overlaps the first area on a plane.

Another embodiment provides a display substrate including a first area, a bending area extending from the first area, and a second area extending from the bending area, and a first film and a second film disposed on the front surface of the display substrate. and a lower film disposed on the rear surface of the display substrate and overlapping the first film and the second film. The display substrate includes a plurality of pixels disposed in the first area, a driving chip disposed in the second area, and conductive lines extending from the first area to the second area, and the first film comprises overlaps the plurality of pixels, the second film overlaps the driving chip, one of the first film and the second film covers the bending area, and the lower film covers at least a portion of the bending area can be nested in

The lower film may overlap the entire area of the bending area.

An opening may be defined in the lower film, and the opening may be surrounded by the lower film on a plane.

The lower film has openings extending to one end and the other end of the lower film, and the lower film includes a first portion overlapping the bending region, a second portion overlapping the first region, and the first portion overlapping the bending region. It may include a third portion overlapping the two regions, and the first portions may be spaced apart from the second portion and the third portion on a plane with the opening interposed therebetween.

The first parts may have a polygonal shape on a plane.

The first film covers the first area and the bending area, the second film does not overlap the bending area, and one end of the first film overlaps the second film on the second area. can

The second film covers the second area and the bending area, the first film does not overlap the bending area, and one end of the first film is on the one end of the second film and the first area. can face each other.

The first film may include at least one of a polarizing film and a protective film.

The second film may include a conductive material.

A display module according to an exemplary embodiment of the present invention for manufacturing a display panel includes a lower film supporting a bending area of the display substrate, so that the display module may be prevented from being damaged during the process of attaching the film to the bending area.

The display module and the method of manufacturing a display device using the display module according to an embodiment of the present invention can manufacture a display panel whose rigidity in a bending area is supplemented, and prevent damage to the structure of the display panel disposed in the bending area during the manufacturing process of the display panel. Reliability of the process can be improved.

1A is a perspective view of a display device according to an exemplary embodiment of the present invention.
1B is an exploded perspective view of a display device according to an exemplary embodiment of the present invention.
2 is a plan view of a display panel according to an exemplary embodiment of the present invention.
3 is a cross-sectional view of a display substrate according to an exemplary embodiment of the present invention.
4 is an enlarged cross-sectional view of a display substrate according to an exemplary embodiment of the present invention.
5A and 5B are cross-sectional views of a display device according to an exemplary embodiment of the present invention.
6 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment of the present invention.
7A and 7B are plan views corresponding to one step of a method of manufacturing a display device according to an exemplary embodiment of the present invention.
8A to 8G are cross-sectional views of one step of a method of manufacturing a display device according to an exemplary embodiment corresponding to the line II' of FIG. 7A.
9A to 9C are cross-sectional views of one step of a method of manufacturing a display device according to an exemplary embodiment corresponding to line II' of FIG. 7A.
10A and 10B are cross-sectional views of one step of a method of manufacturing a display device according to an exemplary embodiment corresponding to line II' of FIG. 7A.
11A and 11B are plan views corresponding to one step of a method of manufacturing a display device according to an exemplary embodiment.
12A and 12B are plan views corresponding to one step of a method of manufacturing a display device according to an exemplary embodiment of the present invention.
13 is a plan view of a display panel according to an exemplary embodiment formed after a cutting step.

Since the present invention may have various changes and various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, it should be understood that this is not intended to limit the present invention to the specific disclosed form, and includes all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In this specification, when an element (or region, layer, section, etc.) is referred to as being “on,” “connected to,” or “coupled to” another element, it is directly placed/placed on the other element. It means that they can be connected/combined or a third component may be placed between them.

Like reference numerals designate like components. Also, in the drawings, the thickness, ratio, and dimensions of components are exaggerated for effective description of technical content. “And/or” includes any combination of one or more that the associated elements may define.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In addition, terms such as "below", "lower side", "above", and "upper side" are used to describe the relationship between components shown in the drawings. The above terms are relative concepts and will be described based on the directions shown in the drawings.

Terms such as "include" or "have" are intended to indicate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but that one or more other features, numbers, or steps are present. However, it should be understood that it does not preclude the possibility of existence or addition of operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In addition, terms such as terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined herein, interpreted as too idealistic or too formal. It shouldn't be.

Hereinafter, a display module and a method of manufacturing a display device using the display module according to an exemplary embodiment of the present invention will be described with reference to the drawings.

1A is a perspective view of a display device according to an exemplary embodiment. 1B is an exploded perspective view of the display device shown in FIG. 1A.

The display device DD may be a device that is activated according to an electrical signal and displays the image IM. The display device DD may be included in various embodiments of electronic devices. For example, the display device DD may be included in large-sized devices such as televisions and billboards, as well as small and medium-sized devices such as monitors, mobile phones, tablet computers, navigation devices, and game machines. Meanwhile, the embodiments of the display device DD are illustrative, and are not limited to any one unless departing from the concept of the present invention. In this embodiment, a mobile phone is illustrated as an example of the display device DD.

Referring to FIG. 1A , the display device DD may have a rectangular shape having short sides extending in the first direction DR1 and long sides extending in the second direction DR2 on a plane. However, the display device DD is not limited thereto and may have various shapes such as a circular shape and a polygonal shape on a plane.

The display device DD may display the image IM in the third direction DR3 through the display surface IS parallel to the plane defined by the first and second directions DR1 and DR2 . The third direction DR3 may be substantially parallel to the normal direction of the display surface IS. The display surface IS on which the image IM is displayed may correspond to the front surface of the display device DD. The image IM may include a still image as well as a dynamic image. 1A illustrates a watch window and icon images as an example of an image IM.

In this embodiment, the front (or upper surface) and rear surface (or lower surface) of each member or unit may be defined based on the direction in which the image IM is displayed. The front surface and the rear surface may oppose each other in the third direction DR3, and a normal direction of each of the front surface and the rear surface may be substantially parallel to the third direction DR3. The separation distance between the front surface and the rear surface defined along the third direction DR3 may correspond to the thickness of the member (or unit).

In this specification, "on a plane" may be defined as a state viewed from the third direction DR3. In this specification, "on a cross section" may be defined as a state viewed from the first direction DR1 or the second direction DR2. Meanwhile, directions indicated by the first to third directions DR1 , DR3 , and DR3 may be converted into other directions as a relative concept.

1A illustrates a display device DD having a flat display surface IS as an example. However, the shape of the display surface IS of the display device DD is not limited thereto and may be a curved shape or a three-dimensional shape.

The display device DD may be flexible. “Flexible” means a property that can be bent, and may include everything from a completely foldable structure to a structure that can be bent at the level of several nanometers. For example, the flexible display device DD may include a curved display device or a foldable display device. However, it is not limited thereto, and the display device DD may be rigid.

The display surface IS of the display device DD may be divided into a transmissive area TA and a bezel area BZA. The transmission area TA may be an area where the image IM is displayed. The user may view the image IM through the transmission area TA. In this embodiment, the transmission area TA is shown as a quadrangular shape with rounded vertices, but this is an example and may have various shapes.

The bezel area BZA may be an area having a predetermined color and blocking light. The bezel area BZA may be adjacent to the transmission area TA. For example, the bezel area BZA may be disposed outside the transmission area TA to surround the transmission area TA. Accordingly, the shape of the transmission area TA may be substantially defined by the bezel area BZA. However, this is shown as an example, and the bezel area BZA may be adjacent to only one side of the transmission area TA or may be omitted. Also, the bezel area BZA may be disposed on a side surface of the display device DD instead of the front surface.

Meanwhile, the display device DD according to an exemplary embodiment may detect an external input applied from the outside. The external input may have various forms such as pressure, temperature, and light provided from the outside. The external input may include an input applied in close proximity to the display device DD (eg, hovering) as well as an input contacting the display device DD (eg, a user's hand or a pen contact). can

Referring to FIG. 1A , the display device DD may include a window WM and a case EDC. The window WM and the case EDC are coupled to each other to configure the exterior of the display device DD and to provide an internal space capable of accommodating the components of the display device DD.

Referring to FIG. 1B , the display device DD may include a display panel DP disposed between the window WM and the case EDC. The display panel DP may include a display substrate DS, a driving chip DIC, a printed circuit board FCB, and a plurality of films FI1 , FI2 , and LF.

The display panel DP according to an exemplary embodiment may be a light emitting display panel and is not particularly limited. For example, the display panel DP may be an organic light emitting display panel, an inorganic light emitting display panel, or a quantum dot light emitting display panel. The light emitting layer of the organic light emitting display panel may include an organic light emitting material, and the light emitting layer of the inorganic light emitting display panel may include an inorganic light emitting material. The light emitting layer of the quantum dot light emitting display panel may include quantum dots and quantum rods. Hereinafter, the display panel DP will be described as an organic light emitting display panel.

The display substrate DS may include a first area AA1 , a second area AA2 , and a bending area BA. The first area AA1 , the bending area BA and the second area AA2 may be arranged along the second direction DR2 . The bending area BA may extend from the first area AA1 along the second direction DR2, and the second area AA2 may extend from the bending area BA along the second direction DR2.

The width of the first area AA1 defined along the first direction DR1 may be smaller than the width of the bending area BA and the width of the second area AA2 . However, the shapes of the first area AA1, the bending area BA, and the second area AA2 are not limited to the illustrated embodiment.

The bending area BA may be a bending area having a predetermined curvature. In the process of manufacturing the display device DD, the bending area BA may be bent such that the second area AA2 overlaps the first area AA1 on a plane. That is, by bending the bending area BA, the second area AA2 may be disposed on the rear surface of the display substrate DS corresponding to the first area AA1.

The display substrate DS may include a display area DA and a non-display area NDA. The display area DA of the display substrate DS may be defined within the first area AA1.

The display area DA may be activated according to an electrical signal and output an image. The display area DA may correspond to the aforementioned transmission area TA. Meanwhile, in the present specification, “regions/parts and regions/parts correspond” means “overlap each other” and are not limited to having the same area and/or the same shape. An image displayed on the display area DA can be viewed from the outside through the transmission area TA.

The non-display area NDA may be adjacent to the display area DA. For example, the non-display area NDA may surround the display area DA. However, it is not limited thereto, and the non-display area NDA may be defined in various shapes. The non-display area NDA may correspond to the remaining area of the first area AA1 excluding the display area DA overlapping the first area AA1, the bending area BA, and the second area AA2. .

The non-display area NDA may be an area where driving circuits or driving wires for driving the display area DA, various signal lines providing electrical signals, and pads are disposed. The non-display area NDA defined in the first area AA1 may correspond to the aforementioned bezel area BZA. Elements of the display substrate DS disposed in the non-display area NDA may be prevented from being viewed externally by the bezel area BZA.

The driving chip DIC may be disposed in the second area AA2 of the display substrate DS. The driving chip DIC may be manufactured in the form of an integrated circuit chip and mounted on the second area AA2.

The printed circuit board FCB may be disposed adjacent to one end of the second area AA2 spaced apart from the bending area BA. The printed circuit board FCB may be disposed to be spaced apart from the driving chip DIC in the second direction DR2 . One end of the printed circuit board FCB overlapping the second area AA2 may be covered by the second film FI2.

The printed circuit board FCB may include electronic devices mounted on the board. Electronic elements may be electrically connected through circuit wires. The printed circuit board FCB may be electrically connected to the display board DS by being connected to the pads disposed in the second area AA2 . Meanwhile, although not separately illustrated, the printed circuit board FCB may be electrically connected to a motherboard of an electronic module constituting the display device DD through a connector.

The plurality of films FI1 , FI2 , and LF may include a first film FI1 , a second film FI2 , and a lower film LF disposed on the display substrate DS.

The first film FI1 may be disposed on the entire surface of the display substrate DS. The first film FI1 may overlap the first area AA1 of the display substrate DS and cover the first area AA1. The first film FI1 may extend from the first area AA1 to the second area AA2 to cover the bending area BA. The first film FI1 may overlap a portion of the second area AA2 adjacent to the boundary of the bending area BA. However, it is not limited thereto, and one end of the first film FI1 may substantially coincide with the boundary between the bending area BA and the second area AA2.

The first film FI1 may be spaced apart from the driving chip DIC disposed on the second area AA2 on a plane. That is, one end of the first film FI1 may extend between the boundary of the bending area BA and the driving chip DIC. However, the embodiment is not limited now, and the first film FI1 may contact the driving chip DIC.

The first film FI1 may be disposed on the bending area BA to supplement the stiffness of the bending area BA of the display substrate DS. The first film FI1 may prevent the display substrate DS from being damaged due to stress acting on the display substrate DS due to bending or external impact. Also, the first film FI1 may protect wires of the display substrate DS disposed in the bending area BA.

The first film FI1 may include a polarizing film. The polarization film may reduce reflectance of external light incident toward the display panel DP from the outside. The polarizing film may include a phase retarder and/or a polarizer. The phase retarder may include a λ/2 phase retarder and/or a λ/4 phase retarder. In one embodiment, the polarizing film may include a stretchable synthetic resin film.

The first film FI1 may include a protective film. The protective film may be a film that protects the display substrate DS by absorbing impact. The protective film may include a polymeric material. For example, the protective film may be made of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, cyclo-olefin polymer, polyethersulphone, polyarylate ( polyarylate), and polyimide. However, the material of the protective film is not limited to the above examples.

The first film FI1 may have a single-layer or multi-layer structure. The multi-layered first film FI1 may include a protective film disposed on the polarizing film. However, the embodiment of the first film FI1 is not necessarily limited thereto.

The second film FI2 may be disposed on the entire surface of the display substrate DS. The second film FI2 may overlap the second area AA2 of the display substrate DS. The second film FI2 may cover the driving chip DIC disposed in the second area AA2. Also, the second film FI2 may cover one end of the printed circuit board FCB overlapping the second area AA2.

The second film FI2 may contact the first film FI1 extending to the second area AA2. In one embodiment, the second film FI2 may overlap a portion of the first film FI1 on a plane, and in another embodiment, one end of the first film FI1 adjacent to each other and the second film FI2 may overlap each other. One end of the can face and contact. However, it is not limited thereto, and the first film FI1 and the second film FI2 may be spaced apart from each other on the second area AA2 .

The second film FI2 may be provided in a tape form. That is, the second film FI2 may have an adhesive layer on one surface and be attached to the display substrate DS.

The second film FI2 may be a film having conductivity or including a conductive layer. That is, the second film FI2 may include a conductive material. The second film FI2 may prevent the driving chip DIC and elements disposed adjacent to the driving chip DIC from being damaged by static electricity.

The lower film LF may be disposed on the rear surface of the display substrate DS. The lower film LF may be spaced apart from the first film FI1 and the second film FI2 with the display substrate DS interposed therebetween.

An opening OP-LF overlapping the bending area BA may be defined in the lower film LF. The opening OP-LF may be formed by removing a portion of the lower film LF. The opening OP-LF may extend from one end to the other end of the lower film LF in the first direction DR1. Accordingly, the lower film LF may include portions separated with the opening OP-LF interposed therebetween. One portion of the lower film LF may be disposed under the first area AA1 and another portion may be disposed under the second area AA2 . The lower film LF included in the manufactured display panel DP may not be disposed under the bending area BA.

When the lower film LF is disposed below the bending area BA, the thickness of the bending area BA of the display panel DP becomes thick, making bending difficult. However, since the opening OP-LF is defined in the lower film LF so that the lower film LF does not overlap the bending area BA, the bending area BA of the display substrate DS can be easily bent. .

The lower film LF may be disposed under the display substrate DS to protect the display substrate DS. The lower film LF may include a flexible polymer material. For example, the lower film LF may include at least one of polyethylene terephthalate and polyimide. However, the material of the lower film LF is not limited to the above example.

Meanwhile, the display device DD may further include an input sensor disposed on the display panel DP to detect an external input. In one embodiment, the input sensor may be disposed on the display substrate DS and the first film FI1.

The window WM may be disposed on the display panel DP. The window WM may protect the display panel DP from external impact. The front surface of the window WM may correspond to the display surface IS of the display device DD described above, and the front surface of the window WM will be described with the same reference numerals as the display surface IS. The front surface IS of the window WM may include the above-described transmission area TA and bezel area BZA.

The transmission area TA of the window WM may be an optically transparent area. The transmission area TA of the window WM may overlap the display area DA of the display panel DP. The transmission area TA of the window WM can transmit an image provided by the display panel DP, and the user can view the corresponding image.

The bezel area BZA of the window WM may be provided as an area where a material including a predetermined color is deposited, coated, or printed. The bezel area BZA of the window WM may prevent a component of the display panel DP disposed to overlap the bezel area BZA from being viewed externally.

The window WM may include an optically transparent insulating material. For example, the window WM may include glass, sapphire, or plastic. The window WM may have a single-layer or multi-layer structure. The window WM may further include functional layers such as an anti-fingerprint layer, a phase control layer, and a hard coating layer disposed on an optically transparent substrate.

The case EDC may be disposed under the display panel DP to accommodate the display panel DP. The case EDC can absorb shock applied from the outside and protect the display panel DP by preventing foreign substances/moisture from penetrating into the display panel DP. In one embodiment, the case EDC may be provided in a form in which a plurality of storage members are combined.

The display device DD includes an electronic module including various functional modules for operating the display panel DP, a power supply module supplying power necessary for the display device DD, the display panel DP and/or a case EDC. ) and may further include a bracket that divides the inner space of the display device DD.

The above-described display panel DP and display device DD may be manufactured using the display module according to an embodiment of the present invention in the manufacturing process of the display device according to an embodiment of the present invention. This will be described later through a description of the display device manufacturing method.

2 is a plan view of a display panel according to an exemplary embodiment. For convenience of description, FIG. 2 omits the first and second films FI1 and FI2 and briefly illustrates the configuration of the display board DS and the printed circuit board FCB.

Referring to FIG. 2 , the display substrate DS may include a plurality of pixels PX and a plurality of signal lines electrically connected to the pixels PX. The display substrate DS may include a plurality of pads PD disposed in the non-display area NDA, a scan driver (SDV), and an emission driver (EDV).

The pixels PX may be disposed in the display area DA defined in the first area AA1. Each of the pixels PX may include a light emitting element to be described later, a plurality of transistors (eg, a switching transistor, a driving transistor, etc.) connected to the light emitting element, and a pixel driving circuit including a capacitor. Each of the pixels PX may emit light in response to an applied electrical signal.

The plurality of signal lines include scan lines SL1 to SLm, data lines DL1 to DLn, light emitting lines EL1 to ELm, first and second control lines CSL1 and CSL2, and power lines ( PL) may be included. Here, m and n represent natural numbers. Each of the pixels PX may be connected to a corresponding scan line among the scan lines SL1 to SLm and a corresponding data line among the data lines DL1 to DLn. Meanwhile, more types of signal lines may be provided in the display panel DP according to the configuration of the pixel driving circuit of the pixels PX.

The scan driver SDV and the light emitting driver EDV may be disposed in the non-display area NDA. The scan driver SDV and the light emitting driver EDV may be disposed adjacent to long sides of the non-display area NDA of the first area AA1 , respectively.

The scan lines SL1 to SLm may extend in the first direction DR1 and be connected to the scan driver SDV. The data lines DL1 to DLn may extend in the second direction DR2 and be connected to the driving chip DIC via the bending area BA. The light emitting lines EL1 to ELm may extend in the first direction DR1 and be connected to the light emitting driver EDV.

The power line PL may extend in the second direction DR2 and be disposed between the display area DA and the light emitting driver EDV. However, it is not limited thereto, and the power line PL may be disposed between the display area DA and the scan driver SDV. The power line PL may extend to the second area AA2 via the bending area BA. The power line PL may receive a voltage by being connected to a corresponding pad PD among the pads PD disposed below the second area AA2 . The power line PL may provide a reference voltage to the pixels PX through connection lines.

The data lines DL1 to DLn may be connected to corresponding pads PD through the driving chip DIC. For example, the data lines DL1 to DLn may be connected to the driving chip DIC, and the driving chip DIC may be connected to pads PD corresponding to each of the data lines DL1 to DLn.

The pads PD may be arranged along one direction on the non-display area NDA of the second area AA2 . The pads PD may be disposed adjacent to an end extending in the first direction DR1 of the second area AA2 and may be arranged along the first direction DR1. The pads PD may be portions connected to the printed circuit board FCB. Each of the pads PD may be connected to a corresponding signal line among a plurality of signal lines.

The printed circuit board FCB may be connected to the pads PD to control operations of the scan driver SDV, the light emitting driver EDV, and the driving chip DIC. The printed circuit board (FCB) may be a board on which a timing controller provided in the form of an integrated circuit chip is mounted. The timing controller may generate a scan control signal, a data control signal, and an emission control signal in response to control signals received from the outside.

The scan driver SDV may generate a plurality of scan signals in response to a scan control signal. Scan signals may be applied to the pixels PX through the scan lines SL1 to SLm. The data driver of the driving chip DIC may generate a plurality of data voltages corresponding to image signals in response to a data control signal. Data voltages may be applied to the pixels PX through the data lines DL1 to DLn. The light emitting driver EDV may generate a plurality of light emitting signals in response to the light emitting control signal. The emission signals may be applied to the pixels PX through the emission lines EL1 to ELm.

The pixels PX may receive data voltages in response to scan signals. The pixels PX may display an image by emitting light having a luminance corresponding to the data voltages in response to the emission signals. The emission time of the pixels PX may be controlled by emission signals. Accordingly, the display substrate DS may output an image through the display area DA defined in the first area AA1 by the pixels PX.

A plurality of signal lines extending from the first area AA1 to the second area AA2 may be disposed on the bending area BA of the display substrate DS. Since the first film FI1 or the second film FI2 described above covers the bending area BA, it is possible to prevent the plurality of signal lines disposed on the bending area BA from being damaged by an external impact. .

3 is a cross-sectional view of a display substrate according to an exemplary embodiment. 4 is an enlarged cross-sectional view of a display substrate according to an exemplary embodiment. 3 shows a display area DA and a non-display area NDA corresponding to the first area AA1.

Referring to FIG. 3 , the display substrate DS may include a base layer BL, a circuit element layer DP-CL, a display element layer DP-OL, and an encapsulation layer TFL.

The base layer BL may include a first area AA1 , a second area AA2 , and a bending area BA. The bending area BA of the base layer BL may extend from the first area AA1 and be bent to have a predetermined curvature. The second area AA2 of the base layer BL may extend from the bending area BA and overlap the first area AA1 on a plane. Accordingly, the rear surface of the base layer BL corresponding to the first area AA1 may face the rear surface of the base layer BL corresponding to the second area AA2 .

The base layer BL may include a flexible polymer material. For example, the base layer BL may include acrylate-based resin, methacrylate-based resin, polyisoprene-based resin, vinyl-based resin, epoxy-based resin, or urethane. )-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, perylene-based resins, and polyimide-based resins. However, the material of the base layer BL is not limited to the above example.

The circuit element layer DP-CL may be disposed on the base layer BL. The circuit element layer DP-CL includes driving elements driving the pixels PX of FIG. 2 , scan lines SL1 to SLm, data lines DL1 to DLn, and emission lines EL1 to ELm. It may include signal lines and pads PD, and may include insulating layers.

The signal lines constituting the circuit element layer DP-CL may extend from the first area AA1 to the second area AA2 via the bending area BA. Insulating layers constituting the circuit element layer DP-CL may be disposed on the first area AA1 , the second area AA2 , and the bending area BA.

The display element layer DP-OL may be disposed on the circuit element layer DP-CL. The display element layer DP-OL may be disposed to overlap the first area AA1. The display element layer DP-OL may include light emitting elements disposed to overlap the display area DA of the first area AA1. The light emitting elements of the display element layer DP-OL are electrically connected to the driving elements of the circuit element layer DP-CL to output light through the display area DA in response to signals from the driving elements. .

The encapsulation layer TFL may be disposed on the display element layer DP-OL to encapsulate the light emitting elements. The encapsulation layer TFL may include a plurality of thin films. Thin films of the encapsulation layer TFL may be disposed to improve optical efficiency of the light emitting devices or to protect the light emitting devices.

FIG. 4 illustratively illustrates a cross section of the display substrate DS corresponding to one of the pixels PX (see FIG. 2 ). Referring to FIG. 4 , configurations of the circuit element layer DP-CL, the display element layer DP-OL, and the encapsulation layer TFL of the display substrate DS will be described in more detail. However, the stacked structure of the display substrate DS shown in FIG. 4 is exemplary and the embodiment is not necessarily limited thereto.

The base layer BL may provide a base surface on which the circuit element layer DP-CL is disposed. At least one inorganic layer may be disposed on the upper surface of the base layer BL. The inorganic layer may constitute a barrier layer and/or a buffer layer. FIG. 4 exemplarily illustrates the buffer layer BFL disposed on the base layer BL. The buffer layer BFL may improve bonding strength between the base layer BL and the semiconductor patterns of the circuit element layers DP-CL. The buffer layer BFL may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

The circuit element layer DP-CL may include semiconductor patterns, conductive patterns, signal lines, and insulating layers. In the manufacturing step of the display substrate DS, an insulating layer, a semiconductor layer, and a conductive layer may be formed by a coating or deposition process, and then the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by a photolithography process. can Through the above processes, semiconductor patterns, conductive patterns, signal lines, etc. constituting the circuit element layer DP-CL may be formed.

The semiconductor pattern of the circuit element layer DP-CL may be disposed on the buffer layer BFL. 4 shows a portion of a semiconductor pattern, and the semiconductor pattern may be arranged in a predetermined rule to correspond to pixels on a plane. The semiconductor pattern may include polysilicon. However, it is not limited thereto, and the semiconductor pattern may include amorphous silicon or metal oxide.

The semiconductor pattern may have different electrical properties depending on whether it is doped or not. The semiconductor pattern may include a first region having high conductivity and a second region having low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. The second region may be a non-doped region or a region doped at a lower concentration than the first region.

Conductivity of the first region is greater than that of the second region, and the first region may substantially serve as an electrode or a signal line. The second region may substantially correspond to the active region (or channel region) of the transistor. In other words, one portion of the semiconductor pattern may be an active region of the transistor, and another portion may be a source region or drain region of the transistor.

The circuit element layer DP-CL may include a transistor T1, a connection signal line SCL, and a plurality of insulating layers. Although one transistor T1 is illustratively shown in FIG. 4 , the pixel may substantially include a plurality of transistors for driving the light emitting element OL.

The source region S1, the active region A1, and the drain region D1 of the transistor T1 may be formed from a semiconductor pattern. The connection signal line SCL may be formed from a semiconductor pattern and may be disposed on the same layer as the source region S1, active region A1, and drain region D1 of the transistor T1. The connection signal line SCL may be electrically connected to the drain region D1 of the transistor T1 on a plane.

A plurality of insulating layers may be disposed on the buffer layer BFL. 4 illustrates first to sixth insulating films 10 to 60 as an example of a plurality of insulating films. The first to sixth insulating layers 10 to 60 may be inorganic or organic layers.

For example, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include a phenol-based polymer, an acryl-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, or a combination thereof. However, the material of the insulating films 10 to 60 is not limited to the above example.

The first insulating layer 10 may cover the semiconductor pattern of the circuit element layer DP-CL. A gate electrode G1 of the transistor T1 may be disposed on the first insulating layer 10 . The gate electrode G1 may be part of a conductive pattern. The gate electrode G1 may overlap the active region A1. The gate electrode G1 may function as a mask in a process of doping the semiconductor pattern.

The second insulating layer 20 is disposed on the first insulating layer 10 and may cover the gate electrode G1. The upper electrode UE may be disposed on the second insulating layer 20 . The upper electrode UE may overlap the gate electrode G1. The third insulating layer 30 is disposed on the second insulating layer 20 and may cover the upper electrode UE.

The first connection electrode CNE1 and the second connection electrode CNE2 are disposed between the transistor T1 and the light emitting element OL to electrically connect the transistor T1 and the light emitting element OL. The first connection electrode CNE1 may be disposed on the third insulating layer 30 . The first connection electrode CNE1 may be connected to the connection signal line SCL through the contact hole CNT- 1 passing through the first to third insulating layers 10 to 30.

The fourth insulating layer 40 may be disposed on the third insulating layer 30 . The fifth insulating layer 50 may be disposed on the fourth insulating layer 40 . In one embodiment, the fourth insulating layer 40 and the fifth insulating layer 50 may include an organic layer. However, it is not necessarily limited thereto.

The second connection electrode CNE2 may be disposed on the fifth insulating layer 50 . The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through the contact hole CNT- 2 penetrating the fourth insulating layer 40 and the fifth insulating layer 50 . The sixth insulating layer 60 is disposed on the fifth insulating layer 50 and may cover the second connection electrode CNE2 . In one embodiment, the sixth insulating layer 60 may include an organic layer and may provide a flat upper surface.

The display element layer DP-OL may include a plurality of light emitting elements OL and a pixel defining layer PDL, and FIG. 4 illustrates one light emitting element OL among the plurality of light emitting elements OL. Corresponding sections are shown, and will be described based on them.

The display element layer DP-OL may include an emission area PXA corresponding to the light emitting element OL and a non-emission area NPXA surrounding the emission area PXA. The light emitting element OL may include a first electrode AE, a hole control layer HCL, an emission layer EML, an electron control layer ECL, and a second electrode CE.

The first electrode AE may be disposed on the sixth insulating layer 60 . The first electrode AE may be connected to the second connection electrode CNE2 through the contact hole CNT- 3 penetrating the sixth insulating layer 60 .

The pixel defining layer PDL may be disposed on the sixth insulating layer 60 . A light emitting opening OP exposing a portion of the first electrode AE may be defined in the pixel defining layer PDL. The pixel defining layer PDL may cover a portion of the upper surface of the first electrode AE. In this embodiment, a portion of the first electrode AE exposed by the light emitting opening OP may correspond to the light emitting area PXA. An area where the pixel defining layer PDL is disposed may correspond to a non-emission area NPXA surrounding the emission area PXA.

The pixel defining layer PDL may include an organic material. The pixel defining layer (PDL) of one embodiment may have a predetermined color. For example, the pixel defining layer PDL may include a base resin and a black pigment and/or black dye mixed with the base resin. However, the embodiment of the pixel defining layer PDL is not limited thereto.

The hole control layer HCL may be disposed on the first electrode AE and the pixel defining layer PDL. The hole control layer HCL is commonly disposed in the pixels and may overlap the emission area PXA and the non-emission area NPXA. The hole control layer (HCL) may include at least one of a hole transport layer and a hole injection layer.

The light emitting layer EML may be disposed on the hole control layer HCL. The light emitting layer EML may be disposed in an area corresponding to the light emitting opening OP of the pixel defining layer PDL. The light emitting layer EML may include organic light emitting materials, inorganic light emitting materials, quantum dots, quantum rods, and the like.

The light emitting layer EML may be separately formed in each of the pixels. Each of the separately formed light emitting layers EML may emit light of at least one color of red, green, and blue. However, the present invention is not limited thereto, and the light emitting layer EML may be commonly provided to the pixels to emit blue or white light. In an embodiment, the light emitting layer EML may be provided as a plurality of layers corresponding to one light emitting area PXA, and the plurality of light emitting layers EML may be stacked along the third direction DR3 .

The electronic control layer ECL may be disposed on the light emitting layer EML. The electronic control layer ECL is commonly disposed in the pixels and may overlap the emission area PXA and the non-emission area NPXA. The electron control layer (ECL) may include at least one of an electron transport layer and an electron injection layer.

The second electrode CE may be disposed on the electronic control layer ECL. The second electrode CE is disposed in common with the pixels and may overlap the emission area PXA and the non-emission area NPXA. A common voltage provided to the pixels may be applied to the second electrode CE.

The encapsulation layer TFL may include a plurality of thin films. In one embodiment, the encapsulation layer TFL may include first to third thin films EN1 , EN2 , and EN3 . The first thin film EN1 may be disposed on the second electrode CE, and the second thin film EN2 and the third thin film EN3 may be sequentially stacked on the first thin film EN1.

The first and third thin films EN1 and EN3 may include an inorganic layer, and the second thin film EN2 may include an organic layer. Accordingly, the encapsulation layer TFL may include a plurality of inorganic layers and an organic layer disposed between the inorganic layers. However, the configuration of the encapsulation layer TFL is not limited to the illustrated one as long as it can protect the light emitting element OL.

The inorganic layer may protect the light emitting element OL from moisture and/or oxygen. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. However, the material of the inorganic film is not limited to the above example.

The organic layer may protect the light emitting element OL from foreign substances such as dust particles. The organic layer may include an acryl-based resin. However, the material of the organic layer is not limited to the above example.

5A and 5B are cross-sectional views of a display device according to an exemplary embodiment. 5A and 5B show cross-sections of the display device DD in which the bending area BA of the display panel DP is bent about an imaginary axis extending in the first direction DR1. The above description may be equally applied to each element of the display device DD shown in FIGS. 5A and 5B .

Referring to FIG. 5A , the window WM may include a base substrate WM-B and a bezel pattern WM-P. The base substrate WM-B may include an optically transparent insulating material. For example, the base substrate WM-B may include glass, sapphire, or plastic.

The bezel pattern WM-P may be a color layer formed on one surface of the base substrate WM-B. In one embodiment, the bezel pattern WM-P may be formed on the lower surface of the base substrate WM-B. The bezel pattern WM-P may be formed by depositing, printing, or coating a base material in which dyes or pigments are mixed on the base substrate WM-B. The bezel pattern WM-P may define the bezel area BZA (see FIG. 2 ) of the window WM. One area of the base substrate WM-B that does not overlap the bezel pattern WM-P may correspond to the transmission area TA of the window WM (refer to FIG. 2 ).

The bezel pattern WM-P may include a material having a predetermined color. For example, the bezel pattern WM-P may include a colored organic layer. The bezel pattern WM-P may have a single-layer or multi-layer structure. The multilayer bezel pattern WM-P may include a chromatic color layer and an achromatic color (eg, black) light blocking layer.

The bezel pattern WM-P may prevent components of the display device DD disposed to overlap the bezel pattern WM-P from being viewed from the outside. The bending area BA of the bent display substrate DS may overlap the bezel pattern WM-P on a plane. The bezel pattern WM-P may prevent the plurality of signal lines of the display substrate DS disposed on the bending area BA from being viewed from the outside due to reflection of external light.

The window WM may be coupled to the display panel DP by an adhesive layer AF disposed between the window WM and the first film FI1. The adhesive layer AF may include a transparent adhesive such as optically clear adhesive film (OCA), optically clear resin (OCR), or pressure sensitive adhesive film (PSA). . However, the type of adhesive included in the adhesive layer AF is not limited thereto.

The display device DD may further include a spacer SP and a protection member PP. The spacer SP and the protective member PP may be disposed on the rear surface of the lower film LF disposed to overlap the first area AA1 of the display substrate DS. As the bending area BA of the display substrate DS is bent, the lower film LF and the printed circuit board FCB disposed in the second area AA2 are bent to the spacer SP and the protective member PP, respectively. can be combined

The spacer SP may be disposed between portions of the lower film LF overlapping on a plane as the display substrate DS is bent. The spacer SP may be disposed between a portion of the lower film LF disposed in the first area AA1 and a portion of the lower film LF disposed in the second area AA2 . The spacer SP may be disposed in a spaced space between parts of the lower film LF to support the lower film LF and the second area AA2 of the display substrate DS.

As the display substrate DS is bent, the protection member PP may be disposed between the printed circuit board FCB and the lower film LF overlapping on a plane. The protection member PP may be disposed in a separation space between a portion of the lower film LF disposed in the first area AA1 and the printed circuit board FCB, and may support the printed circuit board FCB. there is. The protective member PP may support the rear surface of the display substrate DS and protect the display substrate DS and the lower film LF from external impact.

The protection member PP may include at least one functional layer. For example, the protection member may include at least one of an impact absorbing layer, a light blocking layer, and a heat dissipation layer.

The shock absorbing layer may include expanded foam. The shock absorbing layer may be provided as a synthetic resin layer containing a plurality of pores. For example, the synthetic resin layer may include acrylonitrile butadiene styrene copolymer (ABS), polyurethane (PU), polyethylene (PE), ethylene vinyl acetate (EVA) , And may include at least one of polyvinyl chloride (PVC). However, the material of the shock absorbing layer is not limited to the above examples. As the impact absorbing layer has a porous structure, an impact applied to the display device DD can be easily absorbed.

The light blocking layer may block light emitted to the rear surface of the display substrate DS. Accordingly, the light blocking layer may improve a problem in which elements disposed on the rear surface of the display substrate DS are reflected through the first area AA1 .

The heat dissipation layer can effectively dissipate heat generated from the display panel DP. The heat dissipation layer may include at least one of graphite, copper (Cu), and aluminum (Al) having good heat dissipation characteristics. However, the material of the heat dissipation layer is not limited to the above example. The heat dissipation layer not only improves heat dissipation characteristics, but may also have electromagnetic wave shielding or electromagnetic wave absorption characteristics.

In one embodiment, the spacer SP may be omitted, and the protection member PP may extend and overlap the second area AA2 of the display substrate DS. In this case, the protective member PP may support the lower film LF and the printed circuit board FCB disposed in the second area AA2 . If it is possible to support the space between the first area AA1 and the second area AA2 of the display substrate DS spaced apart from each other in the third direction DR3 by bending the display substrate DS, the protective member PP or spacer may be used. (SP) is not limited to any one embodiment.

An opening OP-LF overlapping the bending area BA may be defined in the lower film LF. Accordingly, the lower film LF may not receive stress applied to the display panel DP due to bending. Also, since the lower film LF does not overlap with the bending area BA of the display substrate DS due to the opening OP-LF, the bending area BA of the display substrate DS can be easily bent. .

The display device DD according to an exemplary embodiment of the present invention may include a first film FI1 or a second film FI2 covering the bending area BA of the display substrate DS. 5A illustrates a display device DD according to an exemplary embodiment including a first film FI1 covering the bending area BA. 5B illustrates a display device DD according to an exemplary embodiment including a second film FI2 covering the bending area BA.

Referring to FIG. 5A , as described with reference to FIG. 2 , the first film FI1 disposed on the first area AA1 of the display substrate DS extends toward the second area AA2 so that the display substrate ( The front surface of the bending area BA of the DS may be covered. The first film FI1 may cover the entire area of the bending area BA. The first film FI1 may supplement the rigidity of the bending area BA of the display substrate DS and protect the lines of the display substrate DS disposed in the bending area BA. The first film FI1 may prevent cracks from occurring in the display substrate DS due to stress acting on the display substrate DS due to bending.

Referring to FIG. 5B , the second film FI2 disposed on the second area AA2 of the display substrate DS extends toward the first area AA1 and forms a bending area BA of the display substrate DS. It can cover the front surface of The second film FI2 may cover the entire area of the bending area BA.

The second film FI2 may overlap a portion of the first area AA1 adjacent to the boundary of the bending area BA. However, it is not limited thereto, and one end of the second film FI2 may substantially coincide with the boundary between the bending area BA and the first area AA1. One end of the second film FI2 extending toward the first area AA1 may face one end of the first film FI1 in the first area AA1. In one embodiment, one end of the second film FI2 may contact one end of the first film FI1 and each other. However, it is not limited thereto, and one end of the second film FI2 may be spaced apart from each other in the second direction DR2 within the first film FI1 and the first area AA1.

The second film FI2 may supplement the rigidity of the bending area BA of the display substrate DS and protect the lines of the display substrate DS disposed in the bending area BA. When the second film FI2 overlaps the bending area BA, the first film FI1 may not overlap the bending area BA.

The second film FI2 may be disposed on the bending area BA to supplement the stiffness of the bending area BA of the display substrate DS. The second film FI2 may prevent cracks from occurring in the display substrate DS due to stress acting inside the display substrate DS due to bending. The second film FI2 may prevent damage to the display substrate DS from external impact. Also, the second film FI2 may protect wires disposed in the bending area BA.

Referring to FIG. 5A , when the first film FI1 overlaps the bending area BA, the second film FI2 may not overlap the bending area BA. Referring to FIG. 5B , when the second film FI2 overlaps the bending area BA, the first film FI1 may not overlap the bending area BA. As one of the first film FI1 and the second film FI2 is disposed on the bending area BA of the display substrate DS, the thickness of the film disposed on the bending area BA can be prevented from being increased. can Accordingly, the bending area BA of the display substrate DS can be easily bent, and at the same time, the stiffness of the bending area BA can be supplemented.

A separate layer for protecting the bending area BA of the display substrate DS by extending and covering the first film FI1 or the second film FI2, which is one component of the display panel DP, to the bending area BA. It is possible to omit attaching the member of . Also, if a separate member is attached to the bending area BA, a phenomenon in which an end of the separate member is lifted may occur due to a force acting on the member due to bending. However, the first film FI1 or the second film FI2 integrally extends from the first area AA1 or the second area AA2 to cover the bending area BA, so that within the bending area BA, It can prevent the phenomenon of floating.

6 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment. The above-described display panel DP and display device DD may be manufactured through the manufacturing method of FIG. 6 .

Referring to FIG. 6 , the method of manufacturing a display device according to an exemplary embodiment includes providing a display substrate (S10), providing a lower film (S20), providing a first film (S30), and providing a second film (S40). and a cutting step (S50). The manufacturing method of the display device according to an exemplary embodiment may further include steps of providing a spacer and/or a protection member and providing a window according to components included in the display device DD.

A method of manufacturing a display device according to an exemplary embodiment may include removing a lower film overlapping a bending region to form a final display panel. The step of completely removing the lower film overlapping the bending area may be performed after the cutting step ( S50 ). However, the present invention is not limited thereto, and the method of manufacturing the display device according to an exemplary embodiment may further include forming an opening in the lower film before the first film providing step ( S30 ). Accordingly, the lower film may be provided in a form overlapping a portion of the bending area on the display substrate. Then, in the cutting step ( S50 ), the lower film overlapping the bending area may be removed by cutting. Through the above steps, a display panel having a shape in which the lower film is not disposed in the bending area may be formed.

Hereinafter, with reference to the drawings, descriptions of each step of the display device manufacturing method and the display module of the present invention provided during the process of the display device manufacturing method of the present invention will be described in detail.

7A and 7B are plan views corresponding to one step of a method of manufacturing a display device according to an exemplary embodiment. 7A is a plan view of a display substrate DS according to an exemplary embodiment provided in the display substrate providing step ( S10 ). The display substrate DS provided in the display substrate providing step ( S10 ) may have substantially the same configuration as the display substrate DS of the display device DD described above, and there may be some differences in the shapes of the regions. .

The display substrate DS provided in the display substrate providing step ( S10 ) may include the above-described base layer, circuit element layer, display element layer, and encapsulation layer. The above description may be equally applied to the arrangement and structure of each component, and a description thereof will be omitted below.

Referring to FIG. 7A , the display substrate DS may include a first area AA1 , a second area AA2 , and a bending area BA. The bending area BA may extend from the first area AA1 and the second area AA2 may extend from the bending area BA. The first area AA1 and the second area AA2 may be arranged along the second direction DR2 with the bending area BA interposed therebetween.

The display substrate DS may have a rectangular shape including short sides extending along the first direction DR1 and long sides extending along the second direction DR2 on a plane. Therefore, before being cut along the cutting line CL, the first area AA1 , the second area AA2 , and the bending area BA of the display substrate DS are substantially the same as each other in the first direction DR1 . can have a width. However, the shape of the display substrate DS provided in the display substrate providing step ( S10 ) is not necessarily limited thereto.

A cutting line CL may be defined in the display substrate DS. The cutting line CL may correspond to a boundary of a portion to be cut to manufacture a display panel in a subsequent process step. The cutting line CL may be defined in various ways in the display substrate DS according to the shape of the finally formed display panel. The display substrate DS cut along the cutting line CL shown in FIG. 7A may correspond to the display substrate DS of FIG. 2 , which is one component of the display panel DP (refer to FIG. 2 ). The present invention is not limited thereto, and the cutting line CL may be omitted in the display device manufacturing method according to an exemplary embodiment.

7B is a plan view of the display substrate DS according to an exemplary embodiment corresponding to the step of providing a lower film ( S20 ). 7B is a plan view of the display substrate DS viewed from the rear surface of the display substrate DS provided with the lower film LF.

Referring to FIG. 7B , in the step of providing the lower film ( S20 ), the lower film LF may be provided on the rear surface of the display substrate DS. The lower film LF may cover the rear surface of the display substrate DS. The shape of the lower film LF on a plane may correspond to the shape of the display substrate DS provided in the step of providing the display substrate ( S10 ). In an exemplary embodiment, the lower film LF may be integrally provided to cover the first area AA1 , the second area AA2 , and the bending area BA of the display substrate DS. In one embodiment, the lower film LF provided in the lower film providing step ( S20 ) may overlap the entire area of the bending area BA.

8A to 8G are cross-sectional views of one step of a method of manufacturing a display device according to an exemplary embodiment corresponding to the line II' of FIG. 7A.

Figure 8a is a cross-sectional view corresponding to the lower film providing step (S20). Referring to FIG. 8A , the lower film LF may be attached to the rear surface of the display substrate DS to overlap the first area AA1 , the second area AA2 , and the bending area BA. In one embodiment, the lower film LF may be provided to cover the entire area of the bending area BA of the display substrate DS.

Figure 8b is a cross-sectional view corresponding to the first film providing step (S30). Referring to FIG. 8B , the first film FI1 may be provided on the entire surface of the display substrate DS. The first film FI1 may be provided to cover the first area AA1 and the bending area BA of the display substrate DS. The first film FI1 may cover a portion of the second area AA2 by extending from the first area AA1 and the bending area BA. Thus, one end of the first film FI1 may overlap the second area AA2. However, it is not limited thereto, and one end of the first film FI1 attached to the display substrate DS may coincide with the boundary between the bending area BA and the second area AA2.

Pressure PR1 may be applied on the upper surface of the first film FI1 by using the roller ROL, and the first film FI1 may be attached to the display substrate DS by the pressure PR1. The roller ROL may press the first film FI1 while moving along the second direction DR2 from one end of the first film FI1, and through this, the first film FI1 is applied to the first area ( It may be attached on the display substrate DS so as to overlap AA1) and the bending area BA. However, the pressing method by the roller ROL is one example of various methods of attaching the first film FI1, and the method of attaching the first film FI1 is not limited thereto.

In the process of attaching the first film FI1 on the display substrate DS through the pressure PR1 by the roller ROL, the lower film LF attached to the rear surface of the display substrate DS is the display substrate ( DS) can be supported. The lower film LF may be provided to overlap the first area AA1 and the bending area BA to which the first film FI1 is attached before the first film FI1 is provided, and may be provided on the display substrate ( The display substrate DS may be supported in a direction opposite to the direction of the pressure PR1 applied on the DS. Through this, it is possible to prevent the display substrate DS from being damaged in the process of attaching the first film FI1.

The first film FI1 may supplement the stiffness of the bending area BA by covering the bending area BA. In addition, the first film FI1 covers the first area AA1 and the bending area BA in the form of an integral film, thereby preventing the member from lifting when a separate member is attached to the bending area BA. It can be prevented.

If, as shown in FIG. 5A , in order to form a lower film LF that does not overlap the bending area BA, the lower film that is not disposed on the bending area BA before attaching the first film FI1 is removed. If it is provided on the rear surface of the display substrate DS, the lower film supporting the bending area BA of the display substrate DS does not exist in the process of attaching the first film FI1, so pressure is applied to the bending area BA. This may be concentrated, and thus the display substrate DS may be damaged. However, before attaching the first film FI1, the lower film LF provided on the display substrate DS overlaps the bending area BA, so that the lower film FI1 is attached during the process of attaching the first film FI1. The LF may support the bending area BA of the display substrate DS and prevent damage to the display substrate DS.

8C is a cross-sectional view corresponding to the second film providing step (S40). Referring to FIG. 8C , before providing the second film FI2 , the driving chip DIC and the printed circuit board FCB may be coupled to the display board DS. The driving chip DIC and the printed circuit board FCB may be disposed on the second area AA2 of the display substrate DS where the first film FI1 is not disposed. Therefore, the driving chip DIC and the printed circuit board FCB may be spaced apart from the first film FI1. However, it is not limited thereto, and the driving chip DIC coupled to the display substrate DS may contact one end of the first film FI1.

The second film FI2 may be provided on the entire surface of the display substrate DS. The second film FI2 may be provided to overlap the second area AA2 . The second film FI2 is formed after the driving chip DIC and the printed circuit board FCB are coupled to the display board DS, and the driving chip DIC and the printed circuit board are disposed on the second area AA2. It may be provided on the display substrate DS to cover a portion of (FCB). In one embodiment, the second film FI2 may cover one end of the first film FI1 disposed on the second area AA2. However, it is not limited thereto, and one end of the second film FI2 may be provided to be in contact with one end of the first film FI1 or provided to be spaced apart from one end of the first film FI1.

As the first film FI1 covers the bending area BA, the second film FI2 may be provided so as not to overlap the bending area BA. Accordingly, the thickness of the display module DM corresponding to the bending area BA may be relatively thin compared to other areas, and the bending area BA may be easily bent in a subsequent bending step for manufacturing the display device. .

Pressure PR2 may be applied on the top surface of the second film FI2 by using the roller ROL, and the second film FI2 may be attached to the display substrate DS by the pressure PR2. The roller ROL may press the second film FI2 while moving along the second direction DR2 from one end of the second film FI2, and through this, the second film FI2 is applied to the second area ( It may be attached on the display substrate DS so as to overlap AA2). However, the method of attaching the second film FI2 is not limited thereto.

The second film FI2 may be attached on the display substrate DS, the driving chip DIC, and the printed circuit board FCB. The second film FI2 may be attached to the display substrate DS to protect components of the display module DM covered by the second film FI2.

In the process of attaching the second film FI2 on the display substrate DS through the pressure PR2 by the roller ROL, the lower film LF attached to the rear surface of the display substrate DS is the display substrate ( DS) can be supported. While the second film FI2 is attached to the second area AA2 of the display substrate DS, the lower film LF may support the second area AA2 of the display substrate DS. Through this, the display substrate DS may be prevented from being damaged.

Meanwhile, the display module DM according to an exemplary embodiment of the present invention may be formed by attaching the lower film LF, the first film FI1 and the second film FI2 to the display substrate DS. In the present specification, the display module DM may be a module provided to manufacture a final display panel DP (eg, the display panel DP of FIG. 5A or 5B), and may be located in the bending area BA. This may correspond to a module in a stage before completely removing the disposed lower film LF.

The display module DM includes a display substrate DS including a first area AA1, a second area AA2, and a bending area BA, and a lower film LF disposed on the rear surface of the display substrate DS. and a first film FI1 and a second film FI2 disposed on the front surface of the display substrate DS. The display module DM may further include a printed circuit board FCB disposed on the second area AA2 of the display substrate DS.

As described above, the display substrate DS of the display module DM includes the plurality of pixels disposed in the first area AA1, the driving chip DIC disposed in the second area AA2, and the first area AA1. ) to the second area AA2 via the bending area BA. One of the first film FI1 and the second film FI2 of the display module DM may cover the bending area BA of the display substrate DS. For example, as shown in FIG. 8C , the first film FI1 of the display module DM may cover the first area AA1 and the bending area BA of the display substrate DS.

The second film FI2 of the display module DM may overlap a portion of the first film FI1 on the second area AA2. The second film FI2 may cover one end of the first film FI1 extending to the second area AA2. However, it is not limited thereto, and one end of the second film FI2 contacts one end of the first film FI1 and the second area AA2, or one end of the first film FI1 and the second area ( AA2) may be spaced apart from each other in the second direction DR2.

The lower film LF of the display module DM may overlap at least a portion of the bending area BA. In one embodiment, the lower film LF of the display module DM may overlap the entire area of the bending area BA, as shown in FIG. 8C .

While the first film FI1 is attached to cover the bending area BA in the process of forming the display module DM, the bending area BA of the display substrate DS overlaps the bending area BA with the lower portion disposed thereon. It can be supported by the film LF, and thus damage to the display substrate DS can be prevented. Through this, the display module DM with improved reliability can be manufactured, and the reliability of the display panel DP formed using the same can also be improved.

The cutting step ( S50 ) may include a process of cutting the display module (DM) along the cutting line (CL) of the display substrate (DS) of FIG. 7A . The display module DM may be cut as the laser is irradiated along the boundary of the cutting line CL (see FIG. 7A ). Meanwhile, when the cutting line CL is not defined on the display substrate DS, the cutting step S50 may be omitted.

The manufacturing method of the display device according to an exemplary embodiment may include forming an opening overlapping the bending area BA in the lower film LF after the cutting step ( S50 ). 8D is a cross-sectional view corresponding to a step of forming an opening by removing the lower film LF overlapping the bending area BA to manufacture the display panel.

Referring to FIG. 8D , in order to form an opening in the lower film LF, a laser may be irradiated on the rear surface of the lower film LF through the laser irradiation unit LS. The laser may include a CO ₂ laser, a UV laser or a femtosecond laser.

To form an opening in the lower film LF, a laser may be irradiated along a boundary of a portion of the lower film LF to be removed. In an embodiment, the laser may be irradiated along the boundary between the first area AA1 and the bending area BA and the boundary between the second area AA2 and the bending area BA. However, the laser is not limited thereto, and the laser irradiation point may vary according to the width of the opening to be formed.

8E is a cross-sectional view corresponding to the step of forming the opening OP-LF in the lower film LF. A portion of the lower film LF irradiated with the laser may be melted by the laser, and a portion of the lower film LF may be cut corresponding to the boundary irradiated with the laser. A portion of the cut lower film LF may be separated from the rear surface of the display substrate DS, and through this, an opening OP-LF may be formed in the lower film LF.

The opening OP-LF may overlap the bending area BA of the display substrate DS. As the opening OP-LF of the lower film LF overlaps the bending area BA, the film portion of the lower film LF may not overlap the bending area BA. The opening OP-LF may extend from one end to the end of the lower film LF extending in the second direction DR2 on a plane along the first direction DR1. Portions of the lower film LF remaining after forming the opening OP-LF may be spaced apart from each other with the opening OP-LF interposed therebetween.

After the cutting step ( S50 ), the display panel DP according to an exemplary embodiment may be formed by completely removing the lower film LF of the display module DM (refer to FIG. 8D ) overlapping the bending area BA. By removing the lower film LF disposed in the bending area BA, the thickness of the display panel DP corresponding to the bending area BA can be reduced, and the bending area BA can be easily bent. .

A method of manufacturing a display device according to an exemplary embodiment may further include providing a window WM. The manufacturing method of the display device according to an exemplary embodiment may further include providing a spacer SP and a protective member PP according to the configuration of the display device DD. 8F is a cross-sectional view corresponding to a stage in which the window WM, the spacer SP, and the protection member PP are provided.

Referring to FIG. 8F , in the step of providing the window WM, the adhesive layer AF and the window WM may be provided on the upper surface of the first film FI1 overlapping the first area AA1. The window WM may be attached on the first film FI1 by the adhesive layer AF. Accordingly, the adhesive layer AF may overlap the first area AA1 on a plane. The window WM may overlap at least a portion of the first area AA1 and the bending area BA on a plane.

Referring to FIG. 8F , in the step of providing the spacer SP and the protection member PP, the spacer SP and the protection member PP are placed on the rear surface of the lower film LF disposed to overlap the first area AA1. can be provided in However, it is not limited thereto, and the spacer SP may be provided on the rear surface of the lower film LF disposed to overlap the second area AA2 . Meanwhile, when the display device DD does not include the spacer SP or the protection member PP, the step of providing the spacer SP or the protection member PP may be omitted.

The method of manufacturing the display device according to an exemplary embodiment may further include bending the bending area BA so that the second area AA2 overlaps the first area AA1 on a plane. Referring to FIG. 8F , the display device DD may be manufactured by bending the bending area BA to have a predetermined curvature.

8G is a cross-sectional view of the display device DD according to an exemplary embodiment after a bending step. Referring to FIG. 8G , the bending area BA of the display substrate DS may be bent to have a predetermined curvature. The second area AA2 of the display substrate DS may overlap the first area AA1 on a plane. As the bending area BA is bent, the lower film LF disposed in the second area AA2 may be coupled to the spacer SP, and the printed circuit board FCB may be coupled to the protective member PP. can

The first film FI1 disposed to overlap the bending area BA may be bent to have a predetermined curvature. The first film FI1 may supplement the rigidity of the bending area BA of the display substrate DS and protect components of the display substrate DS disposed in the bending area BA.

The opening OP-LF of the lower film LF may overlap the bending area BA. Accordingly, the thickness of the display panel DP corresponding to the bending area BA may be relatively thin compared to the thickness of the display panel DP corresponding to the other areas, and the display panel DP may be easily bent. .

The bezel pattern WM-P of the window WM may overlap the bent area BA of the display substrate DS bent on a plane. The bezel pattern WM-P may prevent components of the display substrate DS disposed in the bending area BA from being viewed from the outside.

9A to 9C are cross-sectional views of one step of a method of manufacturing a display device according to an exemplary embodiment corresponding to line II' of FIG. 7A. 9A to 9C may correspond to steps for manufacturing the display panel DP including the second film FI2 covering the bending area BA.

9A is a cross-sectional view corresponding to the second film providing step (S40). Referring to FIG. 9A , before providing the second film FI2 , the first film FI1 may be attached to the upper surface of the display substrate DS through the step of providing the first film FI1 . The first film FI1 may overlap the first area AA1 of the display substrate DS and may not overlap the bending area BA.

When the first film FI1 does not overlap the bending area BA, the second film FI2 provided in the second film providing step S40 is applied to the second area AA2 of the display substrate DS and the bending area BA. It may be provided to cover the area BA. The second film FI2 may cover a portion of the first area AA1 by extending from the second area AA2 and the bending area BA. Thus, one end of the second film FI2 may overlap the first area AA1. However, it is not limited thereto, and one end of the second film FI2 may coincide with the boundary between the bending area BA and the first area AA1.

Pressure PR3 may be applied on the upper surface of the second film FI2 by using the roller ROL, and the second film FI2 may be attached to the display substrate DS. The roller ROL may press the second film FI2 while moving along the second direction DR2 from one end of the second film FI2, and the second film FI2 may be applied to the second area AA2. and attached on the display substrate DS so as to overlap the bending area BA. However, the method of attaching by the roller ROL is an example, and the method of attaching the second film FI2 is not limited thereto.

In the process of attaching the second film FI2 on the display substrate DS through the pressure PR3 by the roller ROL, the lower film LF attached to the rear surface of the display substrate DS is the display substrate ( DS) can be supported. The lower film LF may be provided to overlap the second area AA2 and the bending area BA to which the second film FI2 is to be attached before the second film FI2 is provided, and the display substrate ( The display substrate DS may be supported in a direction opposite to the direction of the pressure PR3 applied on the DS. Through this, it is possible to prevent the display substrate DS from being damaged in the process of attaching the second film FI2.

If the lower film LF that does not overlap the bending area BA is provided before attaching the second film FI2, the bending area of the display substrate DS in the process of attaching the second film FI2 ( Since the lower film supporting the BA does not exist, the bending area BA of the display substrate DS may be damaged. However, before attaching the second film FI2, the lower film LF provided on the display substrate DS is provided to overlap the bending area BA, so that the lower film LF may cover the second film FI2. During the attaching process, the bending area BA of the display substrate DS may be supported.

The second film FI2 may cover the second area AA2 and the bending area BA, and thus, the second film FI2 supplements the stiffness of the bending area BA of the display module DM. can do. In addition, by covering the second area AA2 and the bending area BA in the form of an integral film, it is possible to omit disposing a separate protection member on the bending area BA, and the separate protection member is applied to the bending area. (BA) It is possible to prevent the phenomenon of excitation on the phase.

In addition, as the first film FI1 is not disposed on the bending area BA and the second film FI2 is disposed on the bending area BA, the thickness of the display module DM corresponding to the bending area BA is higher than that of other areas. It can be relatively thin. Due to this, in the bending step, which is a subsequent process, the bending area BA can be easily bent while supplementing the rigidity of the bending area BA.

9B is a cross-sectional view corresponding to a step of forming an opening by removing the lower film LF overlapping the bending area BA to form the display panel.

A module in the step before forming the opening in the lower film LF so that the lower film LF does not overlap the entire area of the bending area BA may correspond to the display module DM according to an embodiment of the present invention. After forming the display module DM, the lower film LF overlapping the bending area BA may be removed to form the final display panel DP of FIG. 9C .

Referring to FIG. 9B , the first film FI1 of the display module DM may cover the first area AA1 of the display substrate DS, and the second film FI2 may cover the area AA1 of the display substrate DS. It may cover the second area AA2 and the bending area BA.

One end of the second film FI2 may be disposed on the first area AA1 and may face one end of the first film FI1. One end of the second film FI2 may contact one end of the first film FI1. However, it is not limited thereto, and one end of the second film FI2 and one end of the first film FI1 may be spaced apart from each other in the second direction DR2 on the first area AA1.

The lower film LF of the display module DM may overlap at least a portion of the first area AA1 , the second area AA2 , and the bending area BA on a plane. In one embodiment, the lower film LF of the display module DM may overlap the entire area of the bending area BA, as shown in FIG. 9B.

Since the display module DM includes the lower film LF overlapping the bending area BA, during the process of attaching the second film FI2 covering the bending area BA to the display substrate DS, the lower film The LF may support the bending area BA of the display substrate DS, and damage to the display substrate DS may be prevented. Accordingly, the reliability of the display module DM may be improved, and the reliability of the display panel DP finally formed using the display module DM may also be improved.

In order to form an opening in the lower film LF, a laser may be irradiated on the rear surface of the lower film LF using the laser irradiation unit LS. The process of irradiating the laser may be substantially the same as the process described above with reference to FIG. 8D except for the difference in the composition of the film covering the bending area BA.

9C is a cross-sectional view corresponding to the step of forming the opening OP-LF in the lower film LF. A portion of the lower film LF irradiated with the laser may be melted by the laser, and the lower film LF may be cut corresponding to the boundary irradiated with the laser. A portion of the cut lower film LF may be separated from the rear surface of the display substrate DS, and an opening OP-LF overlapping the bending area BA may be defined in the lower film LF. By removing the lower film LF disposed in the bending area BA, the thickness of the display panel DP corresponding to the bending area BA can be reduced, and the bending area BA can be easily bent. .

Meanwhile, in the manufacturing method of the display device according to an exemplary embodiment, the lower film LF included in the display module DM may overlap a portion of the bending area BA. In the display device manufacturing method according to an exemplary embodiment, the forming of the opening LF-OP in the lower film LF may be performed before the providing of the first film (S30), and the opening ( The lower film LF on which the LF-OP is formed may overlap the bending area BA. This will be described in detail with reference to the following drawings.

10A and 10B are cross-sectional views of one step of a method of manufacturing a display device according to an exemplary embodiment corresponding to line II' of FIG. 7A. 11A and 11B are plan views of one step of a method of manufacturing a display device according to an exemplary embodiment. 10A and 11A correspond to a step of irradiating a laser to form an opening in the lower film LF. 10B and 11B illustrate the lower film LF in which an opening OP-LF is formed.

10A and 11A , the lower film LF includes a first part L1 overlapping the bending area BA, a second part L2 overlapping the first area AA1, and a second area ( A third portion L3 overlapping AA2) may be included. Before the opening is formed, the first to third portions L1 to L3 of the lower film LF cover the rear surface of the display substrate DS and may be integrally formed.

Before providing the first film FI1 on the display substrate DS, a laser irradiator LS may be provided on the rear surface of the lower film LF to form an opening in the lower film LF. The laser may include a CO ₂ laser, a UV laser or a femtosecond laser.

A removal area EA corresponding to an area where an opening is to be formed may be defined in the first part L1 of the lower film LF. The removal area EA may be defined as an inner area of the bending area BA on a plane. The boundary of the removal area EA parallel to the first direction DR1 may correspond to the boundary between the bending area BA and the first area AA1 and the boundary between the bending area BA and the second area AA2. can A boundary of the removal area EA parallel to the second direction DR2 may be defined outside the cutting line CL defined in the bending area BA. That is, the boundary of the removal area EA parallel to the second direction DR2 may be defined between one end of the bending area BA and the cutting line CL. The laser may be irradiated along the boundary of the removal area EA.

Referring to FIGS. 10B and 11B , the boundary portion of the removal area EA of the lower film LF irradiated with the laser may be melted by the laser, and the lower film LF corresponding to the boundary of the removal area EA. ) can be cut off. A portion of the cut lower film LF may be separated from the rear surface of the display substrate DS, and through this, an opening OP-LF may be formed in the lower film LF.

After the opening OP-LF is formed, the lower film LF overlapping the bending area BA includes the first portions L1 spaced apart from each other in the first direction DR1 with the opening OP-LF interposed therebetween. It can be provided in a form containing. Therefore, the planar area of the first portions L1 of FIG. 11B included in the lower film LF after the opening OP-LF is formed is included in the lower film LF before the opening OP-LF is formed. It may be smaller than the planar area of the first part L1 of the lower film LF of FIG. 11A.

The opening OP-LF may be surrounded by the lower film LF on a plane. For example, as shown in FIG. 11B , the opening OP-LF is surrounded by the first parts L1, the second part L2, and the third part L3 of the lower film LF on a plane. can be As described above, the first portions L1 of the lower film LF are formed of the display substrate DS when the first film FI1 or the second film FI2 is attached to cover the bending area BA. The bending area BA may be supported. Also, while attaching the first film FI1 and the second film FI2, the second portion L2 of the lower film LF may support the first area AA1 of the display substrate DS, and , the third portion L3 may support the second area AA2 of the display substrate DS. Accordingly, the display substrate DS of the display module DM may be prevented from being damaged during the manufacturing process of the display panel by the lower film LF.

However, the shape in which the removal area EA is defined is not limited to that shown in FIG. 11A. In one embodiment, the removal area EA is parallel to the second direction DR2 of the lower film LF via an inner area of the bending area BA and an outer area of the cutting line CL from the inner area. It may be defined to include regions extending to one end and the other end. The opening OP-LF according to an exemplary embodiment formed through the removal area EA of the lower film LF defined as above is shown in FIGS. 12A and 12B, and will be described later with reference to FIGS. 12A and 12B.

12A and 12B are plan views corresponding to one step of a method of manufacturing a display device according to an exemplary embodiment. 12A and 12B are plan views of the lower film LF in which the openings OP-LF are formed.

Referring to FIGS. 12A and 12B , the opening OP-LF may overlap the inner region of the bending region BA and the cutting line CL defined in the bending region BA on a plane. A planar area of the opening OP-LF overlapping the bending area BA may be smaller than that of the bending area BA. That is, the opening OP-LF may be defined on a portion of the lower film LF overlapping the bending area BA, rather than on the entire area. After the opening OP-LF is formed, the lower film LF overlapping the bending area BA includes the first portions L1 spaced apart from each other in the first direction DR1 with the opening OP-LF interposed therebetween. It can be provided in a form containing.

The opening OP-LF may have a shape extending from an inner area of the bending area BA toward one end and the other end of the lower film LF on a plane. The opening OP-LF may be defined in the lower film LF overlapping the outer region of the cutting line CL and extend to one end and the other end of the lower film LF parallel to the second direction DR2. It can be. Accordingly, in one embodiment, a portion of the opening OP-LF may overlap the first area AA1 or the second area AA2. However, it is not necessarily limited thereto.

The first parts L1 of the lower film LF are formed by the openings OP-LF extending to one end and the other end of the lower film LF, in the second direction DR2, the second part L2 and the second part L2. It may be spaced apart from the third part (L3). A portion of the first portion L1 may be surrounded by the opening OP-LF.

In the step of providing the first film FI1 and the second film FI2, the first portions L1 of the lower film LF may support the bending area BA of the display substrate DS, The second portion L2 may support the first area AA1 of the display substrate DS, and the third portion L3 may support the second area AA2 of the display substrate DS.

Each of the first portions L1 of the lower film LF may have a polygonal shape on a plane. For example, the first parts L1 may have a triangular, quadrangular, or trapezoidal shape. However, the shape of the first portions L1 is not limited to the above example and may be variously modified according to the shape of the opening OP-LF.

The opening OP-LF may be defined such that the lower film LF overlaps at least a portion of the bending area BA. Accordingly, in the step of providing the first film FI1 and the second film FI2, the lower film LF can support the bending area BA of the display substrate DS, and the display substrate DS damage can be prevented.

If the entire area of the lower film LF overlapping the bending area BA is removed, in the step of providing the first film FI1 and the second film FI2, the lower film LF is formed in the bending area ( It is not disposed on BA, so the bending area BA of the display substrate DS cannot be supported. In this case, the lower film LF is spaced apart with the bending area BA therebetween, and a step occurs at the boundary of the bending area BA. Therefore, if the entire area of the lower film LF overlapping the bending area BA is removed, the display substrate DS is formed by the pressure provided in the process of attaching the first film FI1 and the second film FI2. Stress may be concentrated at the boundary of the bending area BA, and the display substrate DS may be easily damaged.

When the above-described removal area is defined by extending to one end and the other end of the lower film LF to form the opening OP-LF, the cut portion of the lower film LF can be easily removed. . The lower film LF may be cut corresponding to the boundary of the laser-radiated removal area. In one embodiment, the cut portion of the lower film LF may be removed by holding a boundary of the cut portion and peeling it downward from the rear surface of the display substrate DS. Therefore, the fact that the boundary of the cut portion of the lower film LF extends to the end of the lower film LF rather than being formed inside the lower film LF is the cut portion of the lower film LF. It can be easy to remove.

Meanwhile, the shapes of the opening OP-LF defined in the lower film LF shown in FIGS. 12A and 12B are exemplary, and any one implementation can be performed as long as the bending area BA of the display substrate DS can be supported. It is not limited to examples.

13 illustrates a plan view of a display panel according to an exemplary embodiment formed after the cutting step (S50). 13 schematically illustrates the cut display substrate DS of the display panel DP and the lower film LF viewed from the rear surface of the display substrate DS.

Referring to FIG. 13 , the lower film LF of the finally formed display panel DP may not overlap the bending area BA. The second part L2 of the lower film LF may be spaced apart from the third part L3 in the second direction DR2 with the opening OP-LF interposed therebetween.

The display panel DP of FIG. 13 includes a lower portion overlapping the bending area BA from a display module (DM, see FIGS. 8C and 9C ) including a lower film LF overlapping at least a portion of the bending area BA. It may be formed by completely removing the film LF.

In one embodiment, the display module may be formed by attaching the lower film LF, the first film FI1 and the second film FI2 to the display substrate DS. In this case, the lower film LF may overlap the entire area of the bending area BA of the display substrate DS. In the cutting step (S50), the display module may be cut along the cutting line (CL, see FIG. 7A). In this case, the lower film LF may overlap the first area AA1 , the second area AA2 , and the bending area BA corresponding to the inner area of the cutting line CL (refer to FIG. 7A ). After the cutting step (S50), the entire portion of the lower film LF overlapping the bending area BA is removed, and as shown in FIG. 13, the opening OP-LF overlapping the entire area of the bending area BA. ) may be formed on the lower film LF.

However, the display panel DP is not limited thereto, and as shown in FIGS. 11B, 12A, and 12B , the display module may include a lower film LF overlapping a portion of the bending area BA. . In this case, the lower film LF may not overlap the inner region of the cutting line CL (see FIG. 7A ) defined in the bending area BA, and may overlap the outer region of the cutting line CL (see FIG. 7A ). can do. That is, before attaching the first film FI1 and the second film FI2 and after attaching the lower film LF on the display substrate DS, the cutting line CL defined in the bending area BA is also shown. 7a), an opening OP-LF may be formed in the lower film LF so that portions of the lower film LF overlapping the outer region remain. Thereafter, the display panel DP of FIG. 13 may be formed through a step ( S50 ) of attaching the first film FI1 and the second film FI2 and cutting along the cutting line (CL, see FIG. 7A ). there is. In the cutting step ( S50 ), a portion of the lower film LF overlapping the bending area BA may be included in the display module to be cut and removed and removed together. Therefore, a separate process for removing the lower film LF overlapping the bending area BA after the cutting step S50 may be omitted.

A display module according to an embodiment may include a display substrate including a bending area, a film covering the bending area of the display substrate, and a lower film overlapping at least a portion of the bending area and disposed on the rear surface of the display substrate. The lower film of the display module may support a bending area of the display substrate during the process of attaching the film on the front surface of the display substrate, and thus damage to the display substrate may be prevented. The display module according to an embodiment may be provided in the process of manufacturing a display device, and a final display panel and a display device including the same may be manufactured using the display module. Reliability of a display module in which damage to a display substrate is prevented may be improved, and reliability of display panels and display devices manufactured using the display module may also be improved.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art or those having ordinary knowledge in the art do not deviate from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that the present invention can be variously modified and changed within the scope not specified.

Therefore, the technical scope of the present invention is not limited to the contents described in the detailed description of the specification, but should be defined by the claims.

DD: display device DP: display panel
DS: display substrate BA: bending area
AA1: first area AA2: second area
LF: lower film OP-LF: opening
FI1: first film FI2: second film
DP-CL: circuit element layer DP-OL: display element layer
WM: window DM: display module
PP: Protection element SP: Spacer
L1: first part L2: second part
L3: third part

Claims (20)

providing a display substrate including a first area, a bending area extending from the first area, and a second area extending from the bending area, wherein a cutting line is defined;
providing a lower film on the rear surface of the display substrate;
providing a first film on the entire surface of the display substrate to overlap the first area;
providing a second film on the front surface of the display substrate to overlap the second area; and
A cutting step of forming a display panel by cutting along the cutting line;
wherein one of the first film and the second film is provided to cover the bending area, and the lower film supports the display substrate in the step of providing the first film and the second film. According to claim 1,
Further comprising forming an opening in the lower film,
The opening is formed by separating a portion of the lower film from the rear surface of the display substrate along a boundary of a removal region defined in the lower film,
The lower film having the opening includes first portions overlapping the bending area and supporting an area outside the cutting line of the display substrate. According to claim 2,
The removal area extends to one end and the other end of the lower film,
The display device manufacturing method of claim 1 , wherein the first portions of the lower film are spaced apart from each other on a plane with the opening therebetween. According to claim 2,
The opening is formed by a laser irradiated along a boundary of the removal area, and the laser includes a CO ₂ laser beam, a UV laser beam, or a femtosecond laser beam. According to claim 2,
The step of forming the opening is performed after the step of cutting. According to claim 2,
The forming of the opening is performed before the providing of the first film. According to claim 1,
The first film providing step,
attaching the first film to cover the first area and the bending area by pressing the first film with a roller;
The second film does not overlap the bending area,
wherein the lower film supports the first area and the bending area of the display substrate in the step of attaching the first film. According to claim 1,
The second film providing step,
attaching the second film to cover the second area and the bending area by pressing the second film with a roller;
The first film does not overlap the bending area,
wherein the lower film supports the second area and the bending area of the display substrate in the step of attaching the second film. According to claim 1,
After the cutting step,
The method of manufacturing the display device further comprising providing a window on the first film. According to claim 9,
After the window providing step,
and providing a protective member on a rear surface of the lower film overlapping the first region. According to claim 9,
After the window providing step,
and bending the bending area so that the second area overlaps the first area on a plane. a display substrate including a first area, a bending area extending from the first area, and a second area extending from the bending area;
a first film and a second film disposed on the front surface of the display substrate; and
a lower film disposed on the rear surface of the display substrate and overlapping the first film and the second film;
The display substrate,
a plurality of pixels disposed in the first area;
a driving chip disposed in the second area; and
including conductive lines extending from the first region to the second region;
the first film overlaps the plurality of pixels, the second film overlaps the driving chip, and one of the first film and the second film covers the bending area;
The lower film overlaps at least a portion of the bending area. According to claim 12,
The lower film overlaps the entire area of the bending area. According to claim 12,
The lower film has an opening defined,
The display module of claim 1 , wherein the opening is surrounded by the lower film on a plane. According to claim 12,
The lower film defines an opening extending to one end and the other end of the lower film,
The lower film,
first parts overlapping the bending area;
a second portion overlapping the first area; and
A third portion overlapping the second area;
The first parts are spaced apart from the second part and the third part on a plane with the opening interposed therebetween. According to claim 15,
The display module of claim 1 , wherein the first portions have polygonal shapes on a plane. According to claim 12,
The first film covers the first area and the bending area,
The second film does not overlap the bending area,
One end of the first film overlaps the second film on the second area. According to claim 12,
The second film covers the second area and the bending area,
The first film does not overlap the bending area,
One end of the first film faces one end of the second film on the first area. According to claim 12,
The first film includes at least one of a polarizing film and a protective film. According to claim 12,
The display module of claim 1 , wherein the second film includes a conductive material.

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