KR20230010742A - Human-Computer Interface System - Google Patents

Abstract

One variant of the system includes a first layer comprising a first helical trace wound in a first direction; a second layer disposed below the first layer, including a second helical trace wound in a second direction, and cooperating with the first helical trace to form a multilayer inductor; and a substrate comprising a sensor layer comprising an array of driving and sensing electrode pairs. The system also includes a cover layer disposed over the substrate and defining a touch sensor surface; and a first magnetic element arranged below the substrate and defining a first polarity facing the multilayer inductor. The system further includes a controller configured to drive an oscillating voltage across the multilayer inductor to vibrate the substrate in response to detecting an input on the touch sensor surface based on electrical values from the array of drive and sense electrode pairs. .

Description

Human-Computer Interface System

CROSS REFERENCES TO RELATED APPLICATIONS

This application claims priority to Ser. No. 63/048,071, filed July 3, 2020, which is incorporated in its entirety by this reference.

This application is based on U.S. Provisional Patent Application No. 62/984,448, filed on March 3, 2020, U.S. Provisional Patent Application No. 63/040,433, filed on June 17, 2020, and filed on August 7, 2020. It is a continuation-in-part of U.S. Patent Application Serial No. 17/191,631, filed March 3, 2021, claiming the benefit of U.S. Provisional Patent Application No. 63/063,168, each of which is incorporated herein by reference in its entirety.

This application is a continuation of U.S. Patent Application Serial No. 16/297,426 filed on March 8, 2019, which claims the benefit of U.S. Provisional Application No. 62/640,138, filed on March 8, 2018, filed on November 6, 2020. 17/092,002, each of which is incorporated herein by reference in its entirety.

In addition, U.S. Patent Application Serial No. 16/297,426 is a 2017 patent claiming the benefit of U.S. Provisional Application No. 62/316,417, filed on March 31, 2016, and U.S. Provisional Application No. 62/343,453, filed on May 31, 2016. A continuation-in-part of U.S. Patent Application Serial No. 15/476,732, filed on March 31, 2017, and a continuation-in-part of U.S. Patent Application No. 15/845,751, filed on December 18, 2017, each of which is incorporated herein by reference in its entirety. is included

In addition, this application is related to US Patent Application Serial No. 17/191,631, filed March 3, 2021, and US Patent Application Serial No. 14/499,001, filed September 26, 2014, each of which is incorporated herein by reference. includes all of them.

The present invention relates generally to new and useful human-computer interface systems in the field of touch sensors, and more particularly in the field of touch sensors.

1 is a schematic representation of the system.
2 is a schematic representation of one variant of the system.
3 is a schematic representation of one variant of the system.
4A and 4B are flowchart representations of variations of the system.
5A and 5B are flow chart representations of one variant of the system.
6 is a schematic representation of one variant of the system.
7 is a schematic representation of one variant of the system.
8 is a schematic representation of one variant of the system.
9A and 9B are schematic representations of one variant of the system.
10A and 10B are schematic representations of one variant of the system.
11A-11D are schematic representations of one variant.
12 is a schematic representation of one variant of the system.
13 is a schematic representation of one variant of the system.
14 is a schematic representation of one variant of the system.
15A-15C are schematic representations of one variant of the system.
16 is a flowchart representation of one variant of the system.
17 is a flowchart representation of one variation of the system.
18 is a flowchart representation of one variant of the system.
19 is a flowchart representation of one variation of the system.
20 is a schematic representation of one variant of the system.
21 is a schematic representation of one variant of the system.
22 is a flowchart representation of one variant of the system.
23 is a schematic representation of one variant of the system.

The following description of embodiments of the present invention is not intended to limit the present invention to these embodiments, but is intended to enable those skilled in the art to make and use the present invention. The variations, configurations, implementations, example implementations, and examples described herein are optional and not limited to the variations, configurations, implementations, example implementations, and examples they describe. The invention described herein may include all permutations of these variations, configurations, implementations, example implementations, and examples.

1. System

As shown in FIG. 1 , system 100 includes a substrate 102; cover layer 170; first magnetic element 181; and a controller 190. The substrate 102 includes a first layer 110 comprising a first spiral trace 111 wound in a first direction; second layer 120; and a sensor layer including an array of drive and sense electrode pairs (105). the second layer 120 is arranged below the first layer 110; wound in a second direction opposite to the first direction, coupled to the first helical trace 111 by a via between the first layer 110 and the second layer 120, and cooperating with the first helical trace and a second helical trace 122 forming the multilayer inductor 150. A cover layer 170 is arranged over the substrate and defines a touch sensor surface 172 . A first magnetic element 181 is arranged below the substrate 102 and defines a first polarity facing the multilayer inductor 150 . Controller 190 reads a set of electrical values from a set of drive and sense electrode pairs 105; detect a first input on the touch sensor surface 172 based on the series of electrical values; In response to detecting the first input, an oscillating voltage is driven across the multilayer inductor 150 to form an alternating magnetic coupling between the multilayer inductor 150 and the first magnetic element 181 ( It is configured to induce an alternating magnetic coupling and vibrate the cover layer 170 and substrate 102 relative to the chassis 192 .

One variation on the system 100 shown in FIG. 2 includes a substrate 102; cover layer 170; a set of deflection spacers 160; first magnetic element 181; and a controller 190. In this variant, the substrate 102 defines a unitary structure and includes a first layer 110 , a second layer 120 and a bottom layer 140 . The first layer 110 is arranged below the top layer 104; It includes a first helical trace 111 wound in a first direction and defining a first end and a second end. the second layer 120 is arranged below the first layer 110; defining a third end and a fourth end wound in a second direction opposite to the first direction, electrically coupled to the second end of the first helical trace 111, and cooperating with the first helical trace 111 to and a second helical trace 122 forming a multilayer inductor 150 defining a primary axis. The bottom layer 140 is arranged below the second layer 120 opposite the first layer 110; and a set of sensor traces 146 disposed proximal to the perimeter of the substrate 102 . A series of deflection spacers 160 are coupled to the second series of sensor traces 146 and support the substrate 102 on the chassis 192 of the device. A cover layer 170 is arranged over the substrate opposite the series of deflection spacers 160 and defines a touch sensor surface 172 . The first magnetic element 181 is arranged in the chassis 192 below the substrate 102; define a first polarity facing the multilayer inductor (150); It extends parallel to the primary axis of multilayer inductor 150. Controller 190 reads a series of electrical values from a series of sensor traces 146; interpret the force magnitude of the first input on the touch sensor surface 172 based on the series of electrical values; In response to detecting a force magnitude exceeding the threshold force, an oscillating voltage is driven across the multilayer inductor 150 during a haptic feedback cycle to form the first magnetic element 181 and the multilayer inductor 150 and to induce an alternating magnetic coupling between the substrate 102 and the cover layer 170 relative to the first magnetic element 181 .

Another variation on the system 100 shown in FIG. 3 is a substrate 102; cover layer 170; first magnetic element 181; a second magnetic element 182; and a controller 190. In this variant, the substrate 102 defines an integrated structure and includes a top layer 104 , a first layer 110 and a bottom layer 140 . The top layer 104 includes an array 105 of drive and sense electrode pairs. The first layer 110 is arranged below the uppermost layer 104; It includes a first helical trace 111 wound in a first direction and defining a first end and a second end. the second layer 120 is arranged below the first layer 110 opposite the top layer 104; Defining a third end and a fourth end wound in a second direction opposite to the first direction and electrically coupled to the second end of the first helical trace 111, in cooperation with the first helical trace 111 and a second helical trace 122 forming a multilayer inductor defining a primary axis and a secondary axis. A cover layer 170 is arranged over top layer 104 and defines a touch sensor surface 172 . The first magnetic element 181 is arranged below the substrate 102; define a first polarity facing the multilayer inductor (150); extends along the primary axis of multilayer inductor 150; A multilayer inductor 150 is arranged on the first side of the primary axis. The second magnetic element 182 is arranged under the substrate 102 adjacent to the first magnetic element 181; define a second polarity, opposite the first polarity, facing the multilayer inductor 150; extends along the primary axis of multilayer inductor 150; A multilayer inductor 150 is arranged on the second side of the primary axis. The controller 190 reads a series of electrical values from the series of drive and sense electrode pairs 105; detect a first input on the touch sensor surface 172 based on the series of electrical values; In response to detecting the first input, an oscillating voltage is driven across the multilayer inductor 150 during the haptic feedback period to generate a voltage between the first magnetic element 181 and the second magnetic element 182 and the multilayer inductor 150. and to cause the substrate 102 and the cover layer 170 to vibrate relative to the first magnetic element 181 and the second magnetic element 182.

Another variation of the system 100 includes a substrate 102; first magnetic element 181; and a controller 190. In this variant, the substrate 102 includes a first layer defining an integrated structure and including a first helical trace wound in a first direction and defining a first end and a second end; defining a third end disposed under the first layer, wound in a second direction opposite the first direction, electrically coupled to the second end of the first helical trace, defining a fourth end, and defining a fourth end; and a second layer including a second helical trace that cooperates with the traces to form a multilayer inductor defining a primary axis and a secondary axis. The first magnetic element is arranged below the substrate; defining a first polarity facing the multilayer inductor; extends along the primary axis of the multilayer inductor; Arranged on the first side of the multilayer inductor primary axis. a second magnetic element is arranged below the substrate adjacent to the first magnetic element; defining a second polarity, opposite the first polarity, facing the multilayer inductor; extends along the primary axis of the multilayer inductor; Arranged on the second side of the multilayer inductor primary axis. wherein the controller induces an alternating magnetic coupling between the first magnetic element and the second magnetic element and the multilayer inductor by driving an oscillating voltage across the multilayer inductor during a haptic feedback period in response to an input at the touch sensor surface arranged on the substrate; ; configured to vibrate the substrate relative to the first magnetic element and the second magnetic element.

Another variation of the system 100 includes a substrate 102; a series of deflection spacers 160; array of spring elements; first magnetic element 181; and a controller 190. In this variant, the substrate 102 includes a first layer defining an integrated structure and including a first helical trace wound in a first direction and defining a first end and a second end; and a multilayer inductor winding in a second direction opposite the first direction and defining a third end electrically coupled to the second end of the first helical tray and defining a fourth end and cooperating with the first helical trace to define a primary axis. and a bottom layer arranged below the first layer and comprising a second helical trace forming a . Each deflection spacer of the series of deflection spacers is arranged over an individual deflection spacer location of the series of individual deflection spacer locations on the bottom layer of the substrate. An array of spring elements couples a series of biasing spacers to the chassis of the computing device; supporting a substrate on a chassis; It is configured to yield to vibration of the substrate. a first magnetic element is arranged in the chassis below the substrate; defining a first polarity facing the multilayer inductor; It extends parallel to the primary axis of the multilayer inductor. In response to an input on the touch sensor surface arranged over the substrate, the controller drives an oscillating voltage across the multilayer inductor during a haptic feedback period to induce alternating magnetic coupling between the first magnetic element and the multilayer inductor; configured to vibrate the substrate relative to the first magnetic element and against a series of spring elements.

2. Applications

1-3, a system 100 for human-computer interface includes a touch sensor; multilayer inductor 150; and a controller 190. The touch sensor includes a substrate 102; drive and sense electrode pair array 105 patterned across substrate 102; a cover layer 170 defining a touch sensor surface 172; and a force comprising a material disposed between the substrate 102 and the cover layer 170 that exhibits a change in local contact resistance (and/or change in local bulk resistance) in response to a change in the magnitude of a force applied to the touch sensor surface 172. and a sensing layer (174). As shown in FIGS. 8, 9A, 10A, 10B, 11A, 11B, 11C and 11D, the substrate 102 moves within the chassis 192 during the haptic feedback period. (ie, oscillation, vibration) is flexibly mounted within a receptacle 194 (eg, touchpad receptacle 194) of the chassis 192 of the computing device.

A set of magnetic elements is arranged within (eg, rigidly coupled to, adhered to) receptacle 194 (eg, touchpad receptacle 194) within receptacle 194. . Within each of the several adjacent layers of the substrate 102 - beneath the drive and sense electrode pairs 105 - a series of helical traces are fabricated and connected by vias to form a multilayer inductor 150 arranged over the magnetic elements. do.

During the scan period, the controller 190 reads electrical values from the drive and sense electrode pair 105 during the scan period; Based on these electrical values, the position and force magnitude of the input on the touch sensor surface 172 is interpreted. In response to detecting a new input - exceeding a threshold force magnitude - on the touch sensor surface 172, the controller 190 outputs a command based on the position and/or force magnitude of the input; Selectively drive the multilayer inductor 150 with an oscillating voltage (or oscillating current) to induce an alternating magnetic field through the multilayer inductor 150, magnetically couple the multilayer inductor 150 to a magnetic element, , vibrates the touch sensor surface 172 and substrate 102 relative to the chassis 192 of the device by creating an alternating force between the multilayer inductor 150 and the magnetic element.

2.1 Integrated Induction Coil

In this variant, multilayer inductor 150 and series of magnetic elements may cooperate to form an integrated vibrator configured to vibrate substrate 102 within chassis 192 . For example, multilayer inductor 150 is formed by a series of planar coil traces etched or fabricated into each of multiple layers within substrate 102 and interconnected by vias through these layers to form multiple turns. It may form a continuous inductor having one or more turns, one or more cores, and/or one or more windings arranged over a series of magnetic elements.

For example, multilayer inductor 150 may include a first trace helical inwardly in a first winding direction in bottom layer 140 of substrate 102; a second trace spiraling outward in a first winding direction in the second layer 120 of the substrate 102; a third trace helical inwardly in the first winding direction in the third layer 130 of the substrate 102; and a fourth trace that spirals outward in the first winding direction - between adjacent loops of the second trace - in the second layer 120 of the substrate 102 . The vias connect the end of the first helical trace 111 of the first layer 110 to the beginning of the second helical trace 122 of the second layer 120; the end of the second helical trace 122 of the second layer 120 to the beginning of the third helical trace 133 of the third layer 130; the end of the third helical trace 133 of the third layer 130 to the beginning of the fourth helical trace 144 of the second layer 120; and the end of the fourth helical trace 144 of the second layer 120 may be connected to the bottom layer 140 near the start of the first helical trace 111 .

Thus, in this example, the multilayer inductor 150 spans several layers of the substrate 102 and is brought into close proximity (eg, within 2 mm) of the bottom layer 140 of the substrate 102. It may include multiple helical traces connected to form a continuous induction coil with two terminals.

A series of magnetic elements may be glued, fixed, mounted, and/or integrated within the chassis 192 of the device beneath the multilayer inductor 150, and a voltage may be applied across the multilayer inductor 150 by the controller 190. When it becomes, it can be magnetically coupled to the multilayer inductor 150. In particular, controller 190 may supply an oscillating voltage (and thus alternating current) to multilayer inductor 150 (e.g., via a drive circuit coupled to and triggered by controller 190) and , which induces an alternating magnetic field through the multilayer inductor 150; by inducing an alternating magnetic coupling between the multilayer inductor 150 and a series of magnetic elements; The substrate 102 is vibrated.

2.2 Unitary Substrate with Integral Input and Output Components

Generally, in this variation, system 100 functions as a touch sensor with integrated haptic actuators, pressure sensing, and shielding within a thin (eg, 4 mm thick) package. For example, system 100 may be applied to touchpad receptacle 194 (hereinafter “receptacle 194”) of a laptop computer (shown in FIGS. 13, 14, 15A, 15B, and 15C), 16), in the touchpad receptacle 194 of a peripheral user input device, or under the display of a tablet or smartphone.

As shown in Figures 5A, 5B, 6 and 7, system 100 includes drive and sense electrodes of a touch sensor; drive and sensing electrodes of a series of secondary force or pressure sensors; and a thin (eg, 2.5 mm thick) substrate 102 defining a series of thin (or “2.5D”) traces that form an inductor configured to magnetically couple to adjacent magnetic elements. In particular, multilayer inductor 150 is integrated into substrate 102 in the form of a number of interconnected helical traces etched or otherwise fabricated across multiple layers of substrate 102; It is configured to magnetically couple to magnetic elements integrated into chassis 192 (eg, disposed within and held by chassis 192 ). Accordingly, the series of magnetic elements and the multilayer inductor 150 cooperate to form a multilayer inductor configured to vibrate the touch sensor surface 172 in response to polarization of the multilayer inductor 150 (by the drive circuit or controller 190). 150), thereby enabling system 100 to output real-time haptic feedback in response to input on touch sensor surface 172.

Thus, system 100 uses the same process for forming a capacitive or resistive pressure sensor across the bottom of substrate 102 and a touch sensor electrode trace to form a capacitive or resistive touch sensor across the top of substrate 102. A series of planar and interconnected circuits fabricated across multiple conductive (e.g., copper) layers of substrate 102 to form a multilayer inductor 150 fabricated simultaneously with and disposed entirely within substrate 102. It may contain spiral traces.

More specifically, a dense grid array of drive and sense electrode pairs 105 forms a touch sensor configured to detect the x position, y position and/or force magnitude of an input on the touch sensor surface 172. It can be fabricated simultaneously over the entire top layer 104 of the substrate 102 to do so. Additionally or alternatively, the series of sensor traces 146 may intermittently flow around the circumference of the substrate 102 to form a sparse array of force sensors configured to detect the force magnitude of an input on the touch sensor surface 172. It can be fabricated simultaneously on the bottom layer 140 of the substrate 102 at intermittent locations. Thus, the electrical traces that form these sensors can then be completely contained within the substrate 102 . Thin cover layer 170 (e.g., 0.5 mm thick glass or polymer panel for capacitive touch sensors; 0.5 mm thick for resistive touch sensors arranged throughout top layer 104 of substrate 102). A force sensing layer) may be disposed over the top layer 104 of the substrate 102 to surround the touch sensor and form a touch sensor surface 172 . A series of force sensing coupons and/or low durometer spacers (e.g., having an overall thickness of 1 mm) configured to support the substrate 102 along with the receptacle 194 of the substrate 102. to form the deflection spacer 160 of the touch sensor surface 172, to transmit forces input on the touch sensor surface 172 to the chassis 192, and for the controller 190 to respond to the input on the touch sensor surface 172 to these Over each sensor trace on the bottom of the substrate 102 to output a signal corresponding to the force transmitted by the individual sensor traces 146, which can be converted to individual and total forces transmitted by the deflection spacer 160. can be installed A thin, non-conductive, non-magnetic buffer layer (e.g., a polyimide film less than 0.2 mm thick) is provided to maintain a minimum gap between the multilayer inductor 150 and a series of magnetic elements arranged in the receptacle 194 below. may be applied over the bottom spiral trace of the multilayer inductor 150. Thus, the overall height of system 100 with cover layer 170 and series of deflection spacers 160 may be less than 4 mm.

In addition, the chassis 192 of the device (eg, laptop computer, peripheral input device) may define a thin (eg, 4 mm deep) receptacle 194, and the system 100 may have a chassis 192 It can be installed in receptacle 194 - together with biasing spacer 160 in contact with the base of receptacle 194 - to enable touch sensing, pressure sensing and haptic feedback functionality in the device without or with a limited increase in thickness. there is. In one implementation, the chassis 192 of the device further includes a concave cavity below the receptacle 194, and a series of magnetic elements are installed within the cavity below the multilayer inductor 150 on the substrate 102 ( For example, glued, planted). Alternatively, a thinner magnetic element (e.g., 0.8 mm thick) may be placed between the bottom of the substrate 102 and the base of the cavity (e.g., a buffer arranged over the first helical trace 111 of the multilayer inductor 150). It may be installed in the receptacle 194 between the floor and the base of the cavity.

Accordingly, system 100 including substrate 102, touch sensor, and/or deflection spacer 160, etc. may have a small gap (eg, substrate 102) between receptacle 194 and bottom layer 140 of substrate 102. (less than 300 μm instead of several millimeters) to accommodate the individual inductors installed on 102), and thereby limiting the overall assembled height of the device and system 100. do. Additionally, incorporating multilayer inductor 150 into substrate 102 may reduce and/or eliminate the possibility of fatigue or other damage to multilayer inductor 150 due to repeated cycling, and may cause multilayer inductor 150 and Enabling a consistent offset between a series of magnetic elements may allow for looser tolerances for the vertical separation distance between the substrate 102 and the receptacle 194.

As shown in FIGS. 13, 14, 15A, 15B, and 15C and described above, system 100 forms a force-sensitive trackpad or keyboard surface configured to provide real-time haptic feedback to a user interfacing with a computing device. and to detect the position and/or force of input applied on a keyboard surface or trackpad. Additionally and/or alternatively, as shown in FIG. 16 , the system 100 may provide a real-time force sensing and haptic feedback capability of these portable electronic devices - eg, ambient tracks. Can be integrated - under the display of a pad and/or keyboard device or smartphone or smartwatch.

3. Substrate and Touch Sensor

As shown in FIGS. 6 and 12 , system 100 includes a set of (eg, six) conductive layers that are etched to form a set of conductive traces; a series of (eg, five) substrate layers interleaved between the stack of conductive layers; and a substrate 102 comprising a series of vias connecting a series of conductive layers through a series of substrate layers. For example, substrate 102 may include a six-layer rigid fiberglass PCB.

In particular, the top conductive layer and/or the second conductive layer of the substrate 102 cooperate to form an array (eg, grid array) of drive and sense electrode pairs 105 within the touch sensor. Can contain a series of traces. Subsequent conductive layers of the substrate 102 underlying the touch sensor may include interconnected helical traces that cooperate to form a multilayer inductor 150 of single core or multi core, single turn or multi turn. Additionally, the bottom conductive layer and/or the penultimate conductive layer of substrate 102 is a set of interdigitated electrodes distributed around the perimeter of substrate 102 to form a sparse array of force sensors. ) may be included.

3.1 Resistive Touch Sensor

In one implementation, the first and second conductive layers of the substrate 102 are drive electrode rows and sense electrode columns terminating in a grid array of drive and sense electrode pairs 105 in the topmost layer 104 of the substrate 102. (or vice versa) In this implementation, the system 100 is arranged over the top conductive layer of the substrate 102 (eg, sandwiched between the cover layer 170 and the top layer 104 of the substrate 102) and on the cover layer (170). ) (i.e., on the touch sensor surface 172) a force sensing layer that exhibits local changes in contact resistance across the series of drive and sense electrode pairs 105 in response to the local application of force ( 174) is further included.

Thus, during the scan period, the controller 190 sequentially drives columns of drives electrodes; sequentially reading an electrical value (eg, voltage) from the rows of sense electrodes, representing the electrical resistance across the drive and sense electrode pairs 105; Based on deviations of the electrical values, read from the subset of drive and sense electrode pairs 105 adjacent to the first location, from the stored baseline resistance-based electrical values for this subset of drive and sense electrode pairs 105 to detect a first input at a first location on the touch sensor surface 172 (eg, (x,y) location); Based on the size of the deviation, the size of the force of the first input may be analyzed. As described below, the controller 190 may then drive an oscillating voltage across the multilayer inductor 150 of the substrate 102 during the haptic feedback period in response to the force magnitude of the first input exceeding the threshold input force. .

Thus, the array of drive and sense electrode pairs 105 on the force sensing layer 174 and the first and second conductive layers of the substrate 102 cooperate to input (e.g., a finger) on the touch sensor surface 172. , stylus, palm) to form a resistive touch sensor readable by the controller 190 to detect the horizontal position, the vertical position, and the amount of force (or pressure).

3.2 Capacitive Touch Sensor

In another implementation, the first and second conductive layers of the substrate 102 are a grid of drive and sense electrode pairs 105 in the top conductive layer (or both the top conductive layer and the second conductive layer) of the substrate 102. It includes rows of drive electrodes and columns of sense electrodes (or vice versa) that end in an array.

During the scan period, the controller 190 sequentially drives the driving electrode rows; sequentially reading electrical values (e.g., voltage, capacitance rise time, capacitance fall time, resonant frequency)—indicative of capacitive coupling between the drive and sense electrode pairs 105—from the sense electrode train; Based on the deviation of the electrical values - read from the subset of drive and sense electrode pairs 105 adjacent to the first location - from the stored baseline capacitance based electrical values for this subset of drive and sense electrode pairs 105. to detect a first input at a first location on the touch sensor surface 172 (eg, (x,y) location). For example, the controller 190 may implement a mutual capacitance technique to read the capacitance values between these drive and sense electrode pairs 105 and interpret the input on the touch sensor surface 172 based on these capacitance values. can

Thus, the array of drive and sense electrode pairs 105 on the force sensing layer 174 and the first and second conductive layers of the substrate 102 cooperate to input (eg, a finger, a stylus) on the touch sensor surface 172. , palm) to form a capacitive touch sensor readable by the controller 190 to detect the horizontal and vertical position.

3.3 Touchscreen

In one variation, the system includes a digital display; touch sensors arranged throughout the display; and a cover layer arranged over the display and defining a touch sensor surface 172 and comprising or (interfacing with) a touchscreen 196 arranged over the substrate. Accordingly, in this variation, the controller is configured to drive an oscillating voltage across the multilayer inductor during a haptic feedback period in response to the touchscreen 196 detecting an input on the touch sensor surface.

In particular, in this variant, substrate 102 may house or incorporate a touchscreen (ie, an integrated display and touch sensor) and, in cooperation with first magnetic element 181 and controller 190 , touchscreen 196 ) may vibrate the touch sensor surface on the touch screen 196 in response to an input on the touch sensor surface, as detected by a separate controller coupled to the touch sensor surface.

4. Multi-layer Inductor

As discussed above, system 100 includes multilayer inductor 150 formed by a set of interconnected spiral traces fabricated directly into a conductive layer in substrate 102.

In general, the total inductance of a single helical trace can be limited by the conductive layer thickness. Accordingly, system 100 is a multi-layer, multi-turn, and/or multi-core inductor that exhibits a greater inductance and thus greater magnetic coupling to a series of magnetic elements on a single conductive layer of substrate 102 than a single helical trace. may include stacks of overlapping interconnected helical traces fabricated on a series of adjacent layers of the substrate 102 to form a . These helical traces are electrically interconnected by a series of vias through an intermediate substrate layer of substrate 102 and can be coaxially aligned about a common vertical axis (e.g., centered over a series of magnetic elements). can be placed).

Additionally, the substrate 102 may include conductive layers of different thicknesses. Thus, a helical trace in a thicker conductive layer of substrate 102 can be fabricated with a narrower trace width and more turns, and a helical trace in a thinner conductive layer of substrate 102 can be made on the same coil footprint. can be fabricated with wider trace widths and fewer turns to achieve similar electrical resistance within each helical trace of . For example, the bottom conductive layers in substrate 102 may be made of a heavier conductive material (e.g., approximately 35 μm thick 1 μm) to accommodate narrower trace widths and more turns within the coil footprint in these conductive layers. oz copper), thereby increasing the inductance of each helical trace and creating a greater magnetic coupling between the series of magnetic elements and the multilayer inductor 150 during the haptic feedback period. Conversely, in this example, the top layer of the substrate 102 that contains the many (eg, thousands) of driving and sensing electrode pairs 105 of the touch sensor may include a thinner layer of conductive material.

4.1 Single Core + Even Quantity of Coil Layers

In one implementation shown in FIG. 2, substrate 102 includes an even number of helical traces fabricated in an even number of substrate layers within substrate 102 to form a single coil inductor.

In one example, the substrate 102 includes a top layer 104 and an intermediate layer 106 including an array of drive and sense electrode pairs 105; first layer 110; second layer 120; a third layer 130; and a fourth (eg bottom) layer. In this example, the first layer 110 includes a first helical trace 111 wound in a first direction and defining a first end and a second end. In particular, the first helical trace 111 may define a first planar coil that spirals inward in a clockwise direction from a first end around the first planar coil to a second end proximal to the center of the first planar coil. The second layer 120 is wound in a second direction opposite to the first direction, and defines a fourth end and a third end electrically coupled to the second end of the first helical trace 111. (122). In particular, the second helical trace 122 can define a second helical coil that spirals outward in a clockwise direction from a third end proximal to the second planar coil center to a fourth end around the second planar coil. .

Similarly, the third layer 130 has a third helical trace 133 wound in a first direction and defining a sixth end and a fifth end electrically coupled to the fourth end of the second helical trace 122 . include In particular, the third helical trace 133 may define a third helical coil that spirals inward in a clockwise direction from a fifth end at the periphery of the third planar coil to a sixth end proximal to the center of the third planar coil. The fourth layer also includes a fourth helical trace 144 wound in a second direction and defining an eighth end and a seventh end electrically coupled to the sixth end of the first helical trace 111 . In particular, fourth helical trace 144 may define a fourth planar coil that spirals outward in a clockwise direction from a seventh end proximal to the fourth planar coil center to an eighth end around the fourth planar coil. .

Thus, the second end of the first helical trace 111 can be coupled to the third end of the second helical trace 122 by a first via; The fourth end of the second helical trace 122 may be coupled to the fifth end of the third helical trace 133 by a second via; The sixth end of the third helical trace 133 may be coupled to the seventh end of the fourth helical trace 144 by a third via; The first helical trace 111 , the second helical trace 122 , the third helical trace 133 and the fourth helical trace 144 may cooperate to form a single core, four layer inductor. The controller 190 (or driver) may be electrically connected to the first end of the first helical trace 111 and the eighth end of the fourth helical trace 144 (or the “terminal” of the multilayer inductor 150); ; These terminals of the multilayer inductor 150 may be driven with an oscillating voltage during the haptic feedback period to induce an alternating magnetic field through the multilayer inductor 150, which vibrates the substrate 102 within the chassis 192 and couples to the magnetic elements. there is. In particular, when the controller 190 drives the multilayer inductor 150 in the first polarity, the current flows through the first spiral trace 111, the second spiral to induce a magnetic field in a first direction around the multilayer inductor 150. Through trace 122 , third helical trace 133 and fourth helical trace 144 may flow in a continuous clockwise direction. When the controller 190 reverses the polarity across the terminals of the multilayer inductor 150, the current reverses direction and runs through the first helical trace 111 to induce a magnetic field in the second, opposite direction in the multilayer inductor 150. ), the second spiral trace 122, the third spiral trace 133, and the fourth spiral trace 144 may flow continuously in a counterclockwise direction.

Also, in this implementation, since the multilayer inductor 150 spans an even number of conductive layers within the substrate 102, the terminals of the multilayer inductor 150 will be placed around the first and last layers of the substrate 102. can, and thus be directly connected to the controller 190 (or driver).

4.2 Single Core + Odd Quantity of Coil Layers

In another implementation shown in FIG. 1 , multilayer inductor 150 spans an odd number of conductive layers (eg, three or five) of substrate 102 . In this implementation, the conductive layer of substrate 102 is the other spiral of multilayer inductor 150 to place the terminals of multilayer inductor 150 around multilayer inductor 150 for direct connection to controller 190 or driver. It may include two parallel and offset helical traces cooperating with the traces.

In one example, the substrate 102 includes a top layer 104 and an intermediate layer 106 comprising an array of drive and sense electrode pairs 105; first layer 110; second layer 120; a third layer 130; and a fourth (eg bottom) layer. In this example, the first layer 110 spans the footprint of the array of drive and sense electrode pairs 105 in the top layer 104 and middle layer 106; driven to a reference potential by the controller 190; and a ground electrode (eg, continuous trace) configured to shield drive and sense electrode pair 105 from electrical noise generated by multilayer inductor 150 .

In this example, the third layer 130 includes a first helical trace 111 wound in a first direction and defining a first end and a second end. In particular, the first helical trace 111 may define a first planar coil that spirals inward in a clockwise direction from a first end around the first planar coil to a second end proximal to the center of the first planar coil. The second layer 120 is wound in a second direction opposite to the first direction, and has a fourth end and a third end electrically coupled to the second end of the first helical trace 111 of the third layer 130. It includes a second helical trace 122 defining a. In particular, second helical trace 122 can define a second planar coil that spirals outward in a clockwise direction from a third end proximal to the center of the second planar coil to a fourth end around the second planar coil. .

The third layer 130 is wound in a first direction and defines a sixth end and a fifth end electrically coupled to the fourth end of the second spiral trace 122 of the second layer 120. It further includes a trace 133. In particular, the third helical trace 133 spirals inward clockwise from the fifth end at the periphery of the third planar coil to the sixth end proximal to the center of the third planar coil and clockwise within the third layer 130. It is possible to define a third planar coil superimposed within the first planar coil which is an inward sailing spiral.

The fourth layer also includes a fourth helical trace 144 wound in a second direction and defining an eighth end and a seventh end electrically coupled to the sixth end of the first helical trace 111 . In particular, fourth helical trace 144 may define a fourth planar coil that spirals outward in a clockwise direction from a seventh end proximal to the fourth planar coil center to an eighth end around the fourth planar coil. .

Thus, the second end of the first helical trace 111 in the third layer 130 will be coupled to the third end of the second helical trace 122 in the second layer 120 by a first via. can; the fourth end of the second helical trace 122 in the second layer 120 may be coupled to the fifth end of the third helical trace 133 in the third layer 130 by a second via; ; the sixth end of the third helical trace 133 in the third layer 130 may be coupled to the seventh end of the fourth helical trace 144 in the fourth layer by a third via; The first helical trace 111 , the second helical trace 122 , the third helical trace 133 and the fourth helical trace 144 may cooperate to form a single core three-layer inductor. The controller 190 controls the first end of the first helical trace 111 in the third layer 130 and the eighth end of the fourth helical trace 144 in the fourth layer (or the "terminal" of the multilayer inductor 150). ) can be electrically connected to; These terminals of the multilayer inductor 150 may be driven with an oscillating voltage during the haptic feedback period to induce an alternating magnetic field through the multilayer inductor 150, which vibrates the substrate 102 within the chassis 192 and couples to the magnetic elements. there is. In particular, when the controller 190 drives the multilayer inductor 150 in the first polarity, the current flows through the second layer, the third layer of the substrate 102 to induce a magnetic field in the first direction around the multilayer inductor 150. and through the first helical trace 111 , the second helical trace 122 , the third helical trace 133 and the fourth helical trace 144 in the layer and the fourth layer in a continuous clockwise direction. When the controller 190 reverses the polarity across the terminals of the multilayer inductor 150, the current reverses direction and runs through the first helical trace 111 to induce a magnetic field in the second, opposite direction in the multilayer inductor 150. ), the second spiral trace 122, the third spiral trace 133, and the fourth spiral trace 144 may flow continuously in a counterclockwise direction.

Accordingly, in this implementation, the substrate 102 includes an odd number of two coil layers and an even number of single coil layers selectively connected to form a multilayer inductor 150 comprising two terminals disposed around the multilayer inductor 150. can include

4.3 Double Core + Even Quantity of Coil Layers

In another implementation, shown in Figures 3 and 7, substrate 102 is fabricated in an even number of substrate layers within substrate 102 to form a dual core inductor (i.e., two separate single core inductors connected in series). contains an even number of helical traces.

In one example, the substrate 102 includes a top layer 104 and an intermediate layer 106 comprising an array of drive and sense electrode pairs 105; first layer 110; second layer 120; a third layer 130; and a second (eg bottom) layer.

In this example, the first layer 110 includes a first helical trace 111 wound in a first direction and defining a first end and a second end. In particular, the first helical trace 111 may define a first planar coil that spirals inward in a clockwise direction from a first end around the first planar coil to a second end proximal to the center of the first planar coil. The second layer 120 is wound in a second direction opposite to the first direction, and defines a fourth end and a third end electrically coupled to the second end of the first helical trace 111. (122). In particular, second helical trace 122 can define a second planar coil that spirals outward in a clockwise direction from a third end proximal to the center of the second planar coil to a fourth end around the second planar coil. . The third layer 130 includes a third helical trace 133 wound in a first direction and defining a sixth end and a fifth end electrically coupled to the fourth end of the second helical trace 122. . In particular, the third helical trace 133 may define a third planar coil that spirals inward in a clockwise direction from a fifth end at the periphery of the third planar coil to a sixth end proximal to the center of the third planar coil. The fourth layer also includes a fourth helical trace 144 wound in a second direction and defining an eighth end and a seventh end electrically coupled to the sixth end of the first helical trace 111 . In particular, fourth helical trace 144 may define a fourth planar coil that spirals outward in a clockwise direction from a seventh end proximal to the fourth planar coil center to an eighth end around the fourth planar coil. .

Thus, the second end of the first helical trace 111 can be coupled to the third end of the second helical trace 122 by a first via; The fourth end of the second helical trace 122 may be coupled to the fifth end of the third helical trace 133 by a second via; The sixth end of the third helical trace 133 may be coupled to the seventh end of the fourth helical trace 144 by a third via; The first helical trace 111 , the second helical trace 122 , the third helical trace 133 and the fourth helical trace 144 may cooperate to form a first single core four layer inductor.

Also in this example, the first layer 110 has a first helical trace 111, wound in a second direction, defining a tenth end and a ninth end coupled to the first end of the first planar coil. and a fifth helical trace adjacent to. In particular, the fifth helical trace may define a fifth planar coil that spirals inward in a clockwise direction from a ninth end around the fifth planar coil to a tenth end proximal to the center of the fifth planar coil. The second layer 120 is wound in a first direction and defines a twelfth end and an eleventh end electrically coupled to the tenth end of the fifth helical coil, adjacent to the second helical trace 122, the sixth. Include spiral traces. In particular, the sixth helical trace may define a sixth planar coil that spirals outward in a clockwise direction from an eleventh end proximal to the sixth planar coil center to a twelfth end around the sixth planar coil. A third layer 130 is wound in the second direction and defines a fourteenth end and a thirteenth end electrically coupled to the twelfth end of the sixth helical coil, the seventh adjacent the third helical trace 133. Include spiral traces. In particular, the seventh helical trace may define a seventh planar coil that spirals inward in a clockwise direction from a thirteenth end around the seventh planar coil to a fourteenth end proximal to the center of the seventh planar coil. The fourth layer also has an eighth helical adjacent to the fourth helical trace 144, wound in the first direction, and defining a sixteenth end and a fifteenth end electrically coupled to the fourteenth end of the seventh helical coil. contains the trace In particular, the eighth helical trace may define an eighth planar coil that spirals outward in a clockwise direction from a fifteenth end proximal to the eighth planar coil center to a sixteenth end around the eighth planar coil.

Thus, the tenth end of the fifth helical trace may be coupled to the seventh end of the sixth helical trace by a fourth via; the twelfth end of the sixth helical trace may be coupled to the thirteenth end of the seventh helical trace by a fifth via; the fourteenth end of the seventh helical trace may be coupled to the fifteenth end of the eighth helical trace by a sixth via; The fifth helical trace, sixth helical trace, seventh helical trace and eighth helical trace may cooperate to form a second single core four layer inductor.

Also, the first end of the first helical trace 111 can be coupled to the ninth end of the fifth helical trace in the first conductive layer (eg, forming a continuous trace with the ninth end). ). Therefore, the four-layer inductor of the first single core and the four-layer inductor of the second single core are connected to the eighth end and the sixteenth end of the fourth spiral trace and the eighth spiral trace respectively forming the terminals of the four-layer dual-core inductor. It can be fabricated in series to form a 4-layer double core inductor. Therefore, when these first multilayer inductors and the second multilayer inductors are driven with the first polarity, current flows through both the first multilayer inductor and the second multilayer inductor so that they generate magnetic fields in the same phase and in the same direction. can flow in a continuous circular direction through

A controller 190 (or driver) can be electrically connected to these terminals; First alternating magnetic field through the four-layer inductor of the first single core (formed by the first helical trace 111, the second helical trace 122, the third helical trace 133 and the fourth helical trace 144) ; and a second alternating magnetic field - in phase with the first alternating magnetic field - through a four-layer inductor of a second single core (formed by the fifth helical trace, the sixth helical trace, the seventh helical trace, and the eighth helical trace). It is possible to drive these terminals with an oscillating voltage during the haptic feedback period to induce In particular, when the controller 190 drives the four-layer dual-core inductor at the first polarity, the current flows through the first spiral trace 111 to induce a magnetic field in a first direction around the first single-core four-layer inductor. , in a continuous clockwise direction through the second helical trace 122, the third helical trace 133 and the fourth helical trace 144; and a continuous clockwise flow through the fifth spiral trace, the sixth spiral trace, the seventh spiral trace, and the eighth spiral trace to induce a magnetic field in the first direction around the four-layer inductor of the second single core. When the controller 190 reverses the polarity across the terminals of the dual-core, four-layer inductor, the current reverses direction to induce a magnetic field in a second, opposite direction around the first single-core, four-layer inductor. in a continuous counterclockwise direction through the helical trace 111, the second helical trace 122, the third helical trace 133 and the fourth helical trace 144; and a continuous counterclockwise flow through the fifth spiral trace, the sixth spiral trace, the seventh spiral trace, and the eighth spiral trace to induce a magnetic field in the second direction around the four-layer inductor of the second single core. .

4.4 Double Core + Odd Quantity of Coil Layers

In a similar implementation, substrate 102 includes an odd number of helical traces fabricated within an odd number of substrate layers within substrate 102 to form a dual core inductor.

For example, in this implementation, the dual core inductor may comprise a three-layer inductor of two single coils connected in series. In this example, each single coil three-layer inductor has an even number of single coil layers, and, as described above, to form a single coil three-layer inductor comprising two terminals disposed around the single coil three-layer inductor. It comprises an odd number of 2 coil layers which are selectively connected.

5. Magnetic element

Generally, system 100 is rigidly coupled to chassis 192 underlying multilayer inductor 150; By including a set of magnetic elements configured to magnetically couple to the multilayer inductor 150 during a haptic feedback period, an oscillating force is applied to the multilayer inductor 150 and during this haptic feedback period Vibrates the substrate 102 in the receptacle 194 - and thus the touch sensor surface 172 .

In particular, the helical traces within multilayer inductor 150 are rectangular with long sides parallel to the primary axis of multilayer inductor 150 and short sides parallel to the secondary axis of multilayer inductor 150. or over a coil footprint, such as an elliptical footprint. For example, substrate 102 may be 5 inches wide and 3 inches long; The touch sensor surface 172 may span an area of approximately 5 inches by 3 inches over the substrate 102; The coil footprint of each single core multilayer inductor 150 in the substrate 102 is approximately 1.5 inches long and 0.5 inches with the primary axis of the single core multilayer inductor 150 extending laterally across the entire width of the substrate 102. can be wide.

5.1 Horizontal Oscillation: Single-core Multi-layer Inductor

In one implementation, a series of magnetic elements cause the substrate 102 to vibrate horizontally in a plane parallel to the touch sensor surface 172 during a haptic feedback period, as shown in FIGS. 2 and 4A . 172)—between the magnetic element and the multilayer inductor 150—is arranged relative to the multilayer inductor 150 to induce an oscillating force.

In this implementation, system 100 is arranged in a receptacle 194 defined by a chassis 192 of the device; define a first magnetic polarity facing the multilayer inductor (150); It may include a first magnetic element 181 extending along a first side of the primary axis. In this implementation, system 100 is likewise arranged in receptacle 194; define a second magnetic polarity facing the multilayer inductor (150); It may include a second magnetic element 182 extending along a second side of the primary axis adjacent to the first magnetic element 181 . In particular, the first magnetic element 181 can be arranged directly adjacent to the second magnetic element. The first magnetic element 181 and the second magnetic element 182 may be arranged directly below the multilayer inductor 150 and may face the multilayer inductor 150 having opposite polarities as shown in FIG. 4A. there is. When controller 190 drives multilayer inductor 150 with an alternating voltage (or current), multilayer inductor 150 moves vertically through substrate 102 (e.g., perpendicular to touch sensor surface 172). ) and can generate a magnetic field that interacts with the opposing magnetic fields of the first magnetic element 181 and the second magnetic element 182. More specifically, when the controller 190 drives the multilayer inductor 150 with a positive voltage during the haptic feedback period, the multilayer inductor 150 generates a magnetic field extending vertically through the substrate 102 in a first vertical direction. can generate, which attracts the first magnetic element 181 (arranged with the first polarity facing the multilayer inductor 150); push out the second magnetic element (arranged with the second polarity facing the multilayer inductor 150); generating a first lateral force in a first lateral direction; The substrate is moved in the lateral direction in the first lateral direction. Then, when controller 190 reverses the voltage across multilayer inductor 150 during this haptic feedback period, multilayer inductor 150 will generate a magnetic field that extends vertically through substrate 102 in the opposite vertical direction. can push the first magnetic element 181 out; attracting the second magnetic element 182; generating a second lateral force in a second, opposite lateral direction; The substrate 102 is moved in the lateral direction in the second lateral direction.

Thus, by oscillating the polarity of the multilayer inductor 150, the controller 190 creates an oscillating interaction (i.e., alternating attractive and repulsive forces) - parallel to the touch sensor surface 172 - between the multilayer inductor 150 and the magnetic element. ); This can vibrate the substrate 102 and the touch sensor surface 172 horizontally (eg, in a plane parallel to the touch sensor surface 172 ).

Accordingly, in this implementation, the helical trace of the single core multilayer inductor 150 has a first length along the primary axis of the multilayer inductor 150 (eg, 1.5 inches); and a first width (eg, 0.5 inch), less than the first length, along the secondary axis of the multilayer inductor 150 . Also, the first magnetic element 181 has a length comparable to the first length of the helical trace and parallel to and offset from the primary axis; and about half of the first width of the helical trace and a second width parallel to the secondary axis of the multilayer inductor 150 . Similarly, the second magnetic element 182 has a length comparable to the first length of the helical trace and parallel to and offset from the primary axis; and about half the first width of the helical trace and a width parallel to the secondary axis of the multilayer inductor 150 . The first magnetic element 181 and the second magnetic element 182 may be abutted and arranged adjacent to each side of the primary axis of the multilayer inductor 150 .

For example, a series of magnetic elements are arranged in a receptacle 194 of the device and a permanent centered under multilayer inductor 150 such that the two poles of the series of magnetic elements are disposed on opposite sides of the primary axis of multilayer inductor 150. Dipole magnets may be included. As noted above, the series of magnetic elements may also include a series of permanent dipole magnets arranged in a semi-polar configuration (eg, a Halbach array).

Thus, the controller 190 (or driver) applies an alternating voltage across the first and second terminals of the multilayer inductor 150 to induce an alternating current through the series of helical traces, perpendicular to the touch sensor surface. Multilayer by inducing an alternating magnetic field, inducing an oscillatory magnetic coupling between a series of magnetic elements and the multilayer inductor 150, thereby vibrating the substrate 102 in a plane parallel to the touch sensor surface 172 during the haptic feedback period. The inductor 150 can be polarized.

5.2 Horizontal Oscillation: Dual-core Multi-layer Inductor

Similarly, in the implementation described above in which the substrate 102 includes two adjacent single-core multilayer inductors 150 connected in series, the system 100 is arranged in a receptacle 194, as shown in FIG. a first magnetic element (181) extending along a first side of a first primary axis of the first single-core multilayer inductor (150) and defining a first magnetic polarity facing the first single-core multilayer inductor (150); A second, arranged in the receptacle 194 and defining a second magnetic polarity facing the first single core multilayer inductor 150 , extending along a second side of the first primary axis adjacent the first magnetic element 181 . magnetic element 182; a second magnetic polarity arranged in the receptacle 194 and defining a second magnetic polarity facing the second single-core multilayer inductor 150 and extending along a first side of a second primary axis of the second single-core multilayer inductor 150; 3 magnetic elements; and a fourth magnetic element arranged in the receptacle 194, defining a first magnetic polarity facing the second single core multilayer inductor 150, and extending along a second side of the second primary axis adjacent the third magnetic element. can include

Thus, by oscillating the polarities of the first and second single-core multilayer inductors 150, which include traces that spirally move in the same direction and are thus in phase, the controller 190 causes the first single-core multilayer inductor 150 to , oscillating parallel to the touch sensor surface 172 between the first magnetic element 181 and the second magnetic element 182 and between the second single core multilayer inductor 150, the third magnetic element and the fourth magnetic element. An interaction can be induced to vibrate the substrate 102 and the touch sensor surface 172 horizontally (eg, in a plane parallel to the touch sensor surface 172 ).

5.3 Vertical Oscillation

In another implementation, a series of magnetic elements are coupled perpendicular to the touch sensor surface 172 to cause substrate 102 to vibrate vertically within chassis 192 during a haptic feedback period, as shown in FIGS. 1 and 4B. Between the multi-layer inductor 150 and the magnetic element - arranged relative to the multi-layer inductor 150 to induce a vibratory force.

In the above implementation in which the substrate 102 includes the single core multilayer inductor 150, the system 100 is arranged in the receptacle 194 of the chassis 192; define a first magnetic polarity facing the single core multilayer inductor (150); centered approximately below the multilayer inductor 150; The multilayer inductor 150 may include a first magnetic element 181 extending in a lateral direction over the entire primary axis. Thus, the first magnetic element 181 preferentially extends vertically towards the multilayer inductor 150 and can generate a magnetic field centered approximately below the multilayer inductor 150 . More specifically, the first magnetic element 181 may generate a magnetic field that preferentially extends perpendicular to the touch sensor surface 172 proximal to the center of the multilayer inductor 150 . As shown in FIG. 4B, when the controller 190 drives the multilayer inductor 150 with a positive voltage during the haptic feedback period, the multilayer inductor 150 runs vertically through the substrate 102 in a first vertical direction. may create an extending magnetic field, which repels the first magnetic element 181 (arranged with the first polarity facing the multilayer inductor 150); generating a first vertical force in a first vertical direction; The substrate 102 is lifted vertically from the first magnetic element 181 . Then, when controller 190 reverses the voltage across multilayer inductor 150 during this haptic feedback period, multilayer inductor 150 generates a magnetic field extending perpendicularly through substrate 102 in a second, opposite perpendicular direction. , which attracts the first magnetic element 181; generating a vertical force in a second, opposite vertical direction; It draws the substrate 102 back and down toward the first magnetic element 181 .

Thus, by oscillating the polarity of the multilayer inductor 150, the controller 190 creates an oscillating interaction between the multilayer inductor 150 and the first magnetic element 181—perpendicular to the touch sensor surface 172—(i.e., by inducing alternating attractive and repulsive forces); Vibrate substrate 102 and touch sensor surface 172 vertically (eg, perpendicular to touch sensor surface 172 ).

In addition, the system 100 is a multilayer inductor with minimal or no other modifications to the system 100 and for a pair of opposing magnetic elements arranged below the multilayer inductor 150, as shown in FIG. In each primary axis of the multilayer inductor 150), reconfiguration for vertical and horizontal vibration of the touch sensor surface 172 by exchanging a single magnetic element centered under the multilayer inductor 150 and spanning the entire width of the multilayer inductor 150. It can be.

5.4 Vertical Oscillation: Dual-core Multi-layer Inductor

Similarly, in the implementation described above where the substrate 102 includes two adjacent single core multilayer inductors 150 connected in series and in phase (i.e., phased by 0°), the system is arranged in the receptacle 194; define a first magnetic polarity facing the first single core multilayer inductor (150); centered approximately below the first single core multilayer inductor 150; The first single-core multilayer inductor 150 may include a first magnetic element 181 extending in a lateral direction over the entire primary axis. Likewise, system 100 is arranged in receptacle 194 adjacent to first magnetic element 181, as shown in FIGS. 3 and 4B; define a first magnetic polarity facing the second single core multilayer inductor (150); centered approximately below the second single core multilayer inductor 150; The second single-core multilayer inductor 150 may include a second magnetic element 182 extending in a lateral direction over the entire primary axis.

Thus, by oscillating the polarities of the first and second single-core multilayer inductors 150 in the same phase, the controller 190 controls the relationship between the first single-core multilayer inductor 150 and the first magnetic element 181 and the second induce an oscillatory interaction perpendicular to the touch sensor surface 172 between the single core multilayer inductor 150 and the second magnetic element 182; Vibrate substrate 102 and touch sensor surface 172 vertically (eg, perpendicular to touch sensor surface 172 ).

6. Chassis Integration

As described above, substrate 102 is coupled to (e.g., by chassis 192) to vibrate substrate 102 horizontally or vertically relative to chassis 192 during a haptic feedback period. It is flexibly mounted (in or on the defined receptacle 194).

6.1 Deflection Spacers

In one configuration shown in FIGS. 2, 8 and 10A and as described in US patent application Ser. No. 17/191,631, which is incorporated in its entirety by this reference, the top layer 104 of the substrate 102 is an array of drive and sense electrode pairs (105) arranged in a grid array in a mutual capacitance configuration and with a first density; Bottom layer 140 of substrate 102 includes a second series of sensor traces 146 (e.g., interdigitated drive and sense electrode pairs) disposed proximately around substrate 102 at a second density that is less than the first density. (105). In this implementation, the system 100 includes a series of deflection spacers 160 ( eg, short elastic columns or buttons, adhesive films). In particular, each deflection spacer 160 is arranged across the sensor traces of the second series of sensor traces 146; and a force sensing layer 174 that exhibits a change in contact resistance across the sensor in response to a load on the touch sensor surface 172 compressing the deflection spacer against the substrate 120 .

Accordingly, in this implementation, the controller 190 reads a first series of electrical values—representing capacitive coupling between the drive and sense electrode pairs 105—from the series of drive and sense electrode pairs 105; Based on the deviation of the electrical value—read from the subset of drive and sense electrode pairs 105 adjacent to the first location—from the stored baseline capacitance values for this subset of drive and sense electrode pairs 105, touch A first input may be detected at a first location on the sensor surface 172 . During this same scan period, the controller 190 also outputs a second series of sensor traces 146 from the second series of sensor traces 146, representing compression of the series of deflection spacers 160 relative to the second series of sensor traces 146. read an electrical value (eg, electrical resistance); interpreting the force magnitude of the first input based on the magnitude of the deviation of the electrical (eg, resistance) value from the baseline electrical value across the series of sensor traces 146; The vibration voltage may be driven across the multilayer inductor 150 during the haptic feedback period in response to the magnitude of the force of the first input exceeding the threshold input force.

Generally, in this configuration, a series of deflection spacers 160 are inserted between the base of the receptacle 194 and the bottom layer 140 of the substrate 102; The substrate 102 is supported vertically within the receptacle 194 .

In one implementation, each deflection spacer 160 is bonded to the base of receptacle 194 and to the bottom surface of substrate 102; deflects (or shears) in a lateral direction to allow substrate 102 to change laterally within receptacle 194 in response to alternating magnetic coupling between a series of magnetic elements and multilayer inductor 150 during a haptic feedback cycle. ) includes a coupon formed of a low hardness or elastic material. In another implementation, each deflection spacer 160 is a coupon bonded to the bottom surface of the substrate 102; and a bottom configured to slide across the base of the receptacle 194 to vertically support the substrate 102 over the receptacle 194 while allowing the substrate 102 to change laterally in the receptacle 194 during the haptic feedback period. It includes a bottom surface that includes a friction material or is coated with a low friction material. In another implementation, and as described below, each deflection spacer 160 supports the substrate 102 vertically within the receptacle 194 while allowing the deflection spacer 160 to move laterally within the receptacle 194. which is mounted on a spring or flexure element - which is mounted on the chassis 192 .

In such an implementation, the bottom conductive layer of the substrate 102 may include a pair of interdigitated drive and sense electrodes at each deflection spacer position around the perimeter of the substrate 102 as shown in FIG. 2 . Additionally, each deflection spacer 160 may include a layer of force sensing material - as described above - facing a pair of interdigitated driving and sensing electrodes at these deflection spacer locations on the substrate 102 . Thus, the controller 190 reads the electrical resistance (or voltage representative of the electrical resistance) across the pair of sensor traces 146 at the deflection spacer locations; This resistance can be converted to the magnitude of the force transferred from the touch sensor surface 172 to the substrate 102 and to the adjacent deflection spacer 160 . In particular, system 100 may include multiple deflection spacers 160, and controller 190 reads an electrical value from sensor trace 146 at each deflection spacer 160 location; convert these electrical values to the magnitude of the force transmitted by each deflection spacer 160; These force magnitudes can be added to the total force magnitude of the input on the touch sensor surface 172 .

Accordingly, in this configuration, the substrate 102 includes a dense array of drive and sense electrode pairs 105 forming a touch sensor, a column of helical traces forming a multilayer inductor 150, and a chassis 192 on top. An integrated structure comprising a sparse array of drive and sense electrode pairs 105 forming a series of force sensors supporting a substrate 102 may be defined.

6.1.1 Capacitive Deflection Spacer

Alternatively, the bottom layer 140 of the substrate 102 may have each of these sensor traces 146 to the chassis 192; to adjacent deflection spacers 160; to the spring element 162 supporting the substrate 102 at this deflection spacer location; or a sparse array of sensor traces 146 (e.g., interdigitated drive and sense electrode pairs 105 arranged in a capacitive sensing configuration at each deflection spacer location to capacitively couple to another fixed metal element at such deflection spacer location). )) may be included. Thus, during the scan period, controller 190 reads the capacitance value from sensor trace 146 at these deflection spacer locations; converting these capacitance values into the magnitude of force transmitted by each deflection spacer 160 during the scan period; These force magnitudes can be added to the total force magnitude of the input on the touch sensor surface 172 .

6.1.2 Inductor Integration with Deflection Spacers

Also, in this configuration, the multilayer inductor 150 may be incorporated in regions of the substrate 102 that are offset from the deflection spacer 160 locations (i.e., the substrate occupied by the sensor traces 146 at these deflection spacer locations). (102). For example, an array of deflection spacers 160 may be disposed proximately around the substrate 102, and the helical traces forming the multilayer inductor 150 may be rotated over the multilayer inductor 150 during a haptic feedback period as shown in FIG. ) to the sensor traces 146 of these deflection spacers 160 may be arranged near the transverse and longitudinal centers of the substrate 102 .

6.2 Spring-loaded Chassis Interface

Additionally or alternatively, as shown in FIGS. 2, 3 and 22 and as described in U.S. patent application Ser. No. 17/191,631, the system 100 is configured to be mounted to a chassis 192 of the device and ; configured to deflect out of the plane of chassis interface 166 in response to actuation of multilayer inductor 150 and/or in response to input on touch sensor surface 172 during a haptic feedback period (e.g., a series of deflection spacers); and chassis interface 166 defining a series of spring elements coupled to substrate 102 (via 160).

In this implementation, the chassis 192 of the computing device has a depth comparable to (or slightly greater than) the thickness of the series of deflection spacers 160 (e.g., a 1.2 mm chassis for a 1.0 mm thick deflection spacer 160). It may include a chassis receptacle 194 defining a receptacle 194 depth). A deflection spacer 160 is bonded to the chassis interface 166 at each spring element 162 . Chassis interface 166 may then be rigidly mounted to chassis 192 over receptacle 194 via a series of threaded fasteners or adhesives or the like. Thus, the substrate 102 and series of biasing spacers 160 are directed into the chassis receptacle 194 and with those spring elements 162 biasing inwardly below the plane of the chassis interface 166 - to the touch sensor surface 172. applied - capable of transmitting force;

(In the foregoing configuration where the substrate 102 includes sensor traces at these deflection spacer locations, each spacer also compresses between the adjacent spring element 162 and the substrate 102 when a force is applied to the touch sensor surface 172. and thus exhibits a change in its local contact resistance across the adjacent sensor traces proportional to the force transferred to the adjacent spring element 162. Accordingly, the controller 190 can determine the electrical value ( resistance) and convert these electrical values into a fraction of the input force delivered by each sensor trace).

In one implementation, chassis interface 166 and spring element 162 define an integrated structure. In one example, chassis interface 166 is a thin wall structure (e.g., stainless steel 20 gauge or 0.8 mm thick sheet) that is punched, etched or laser cut to form aligned flextures at each deflection spacer location. ). Thus, in this example, each spring element 162 is configured to bias inwardly and outwardly from a nominal plane defined by the thin-walled structure and extends system 100 over chassis 192 in transverse and longitudinal directions. A flexure can be defined, such as a multi-arm helical flexture configured to deploy in a direction. More specifically, in this example, chassis interface 166 may include an integrated metal sheet structure defining a nominal plane and arranged between substrate 102 and chassis 192 . Each spring element 162 may be formed (eg, fabricated) from an integrated metal structure; may define a stage coupled to a spacer opposite the bottom layer 140 of the substrate 102; may include a bent portion made of an integrated metal structure; The touch sensor surface 172 may be configured to return to approximately the nominal plane in response to the absence of a touch input applied thereto.

Also in this implementation, a magnetic element may be arranged in the receptacle 194 and the spring element 162 may be coupled to the bottom layer 140 of the substrate 102 at a nominal gap (eg, 1 mm) above the magnetic element. can be placed in However, application of input on touch sensor surface 172 causes multilayer inductor 150 to come closer to the magnetic element by compressing spring element 162, as shown in FIG. can increase the magnetic coupling between the magnetic elements, increase the peak-to-peak force between the multilayer inductor 150 and the magnetic element, and increase the vibration amplitude of the substrate 102 during the haptic feedback period can increase Thus, the spring element 162 can be compressed during application of an input on the touch sensor surface 172, thereby a) closing the gap between the multilayer inductor 150 and the magnetic element and b) proportional to the magnitude of the force of the input - In response to the input - may increase the vibration amplitude of the substrate 102 during the haptic feedback period.

Thus, a low force input on the touch sensor surface 172 can minimally compress the spring element and minimize the gap between the multilayer inductor 150 and the magnetic element, thereby responding to this low force input. Thus, a low-amplitude vibration can be generated during the haptic feedback period. Conversely, a high force input on the touch sensor surface 172 can compress the spring element by a greater distance and greatly reduce the gap between the multilayer inductor 150 and the magnetic element, thus reducing the response to such a high force input. In response, it may generate a higher amplitude vibration during the haptic feedback period.

Thus, in this configuration, system 100 supports substrate 102 within receptacle 194 with multilayer inductor 150 disposed over first magnetic element 181 and second magnetic element 182; A series of spring elements 162 biasing the substrate 102 within the receptacle 194 to place the multilayer inductor 150 at a nominal offset distance above the first magnetic element 181 and the second magnetic element 182 can include In particular, the spring element 162 compresses in response to the application of an input on the touch sensor surface 172 so that the second magnetic element 181 and the second magnetic element 182, less than the nominal offset distance, compress. placing a multilayer inductor (150) at an offset distance; During the haptic feedback period, magnetic coupling between the multilayer inductor 150, the first magnetic element 181, and the second magnetic element 182 may be increased.

For example, a series of spring elements 162 may be coupled to a multilayer inductor 150 (or a multilayer inductor in bottom layer 140 of substrate 102) at a nominal offset distance—between 400 μm and 600 μm—over the magnetic elements. The substrate 102 may be deflected within the receptacle 194 to place the bottom spiral trace of 150). Further, the spring elements 162 may cooperate to create a spring constant of 800 g/mm to 1200 g/mm across the touch sensor surface 172 . Thus, applying a force greater than approximately 500 g to the touch sensor surface 172 can fully compress the series of spring elements 162 . However, the system 100 also measures the amplitude of vibration of the substrate 102 during a haptic feedback period as a function of the magnitude of the force applied on the touch sensor surface 172, e.g., from a minimum threshold force of 5 g to a maximum force of 500 g. may indicate an increase.

(In similar implementations shown in FIGS. 11A, 11B, 11C, and 11D, the substrate 102 is vertical and/or horizontal to allow the substrate 102 to vibrate within the receptacle 194 during the haptic feedback period. It can be mounted to chassis 192 via a series of flexible grommets that conform in direction.)

6.3 Spring Elements and Chassis Interface

In a similar variation shown in Figures 20 and 21, the system includes a series of deflection spacers 160, each deflection spacer in the set being a series of individual deflections - on the bottom surface (e.g., bottom layer) of an underlying substrate. of the spacer positions - arranged above the individual deflection spacer positions. The system couples a series of deflection spacers 160 to a computing device chassis; supporting a substrate on a chassis; and a spring element array 162 configured to yield to vibration of the substrate (e.g., vertically or horizontally) in response to an oscillating voltage driven across the multilayer inductor by the controller 190 during the haptic feedback period. can

In one implementation shown in Figure 20, the system is arranged between the substrate and the chassis; define an aperture under the multilayer inductor; and a chassis interface 166 defining an array of spring elements 162 (eg, bends) and defining an integrated metal structure comprising a series of bends arranged around the hole. In this implementation, the system may also include a magnetic yoke 184 arranged in the aperture of the integrated metal structure; The first magnetic element and the second magnetic element may be arranged on a magnetic yoke below the multilayer inductor. Thus, the magnetic yoke 184 can limit the permeability path for magnetic field lines between the back surfaces of the first and second magnetic elements opposite the substrate.

6.3.1 Chassis Interface

More specifically, in this variant, system 100 is coupled to a series of deflection spacers 160 in an array of support locations; configured to support a substrate 102 on a chassis of a computing device; and a spring element array 162 configured to yield to displacement of the substrate 102 downward toward the chassis in response to a force applied to the touch sensor surface 172 .

In one implementation, system 100 is configured to be mounted on a chassis of a computer system; define a series of spring elements 162 supported by each spacer 160; and a chassis interface 166 configured to deflect out of the plane of the chassis interface 166 in response to an input on the touch sensor surface 172 .

In such an implementation, the chassis of the computing device has a chassis receptacle that defines a depth similar to (or slightly larger than) the thickness of the deflection spacer 160 (eg, 1.2 mm deep for a 1.0 mm thick spacer 160). can include A deflection spacer 160 is bonded to the chassis interface 166 at each spring element 162 . Chassis interface 166 may then be rigidly mounted to the chassis over the receptacle, for example via a series of threaded fasteners or adhesive. The substrate 102 and series of deflection spacers 160 thus transfer the force applied to the touch sensor surface 172 to these spring elements 162, which inwardly into the chassis receptacle and below the plane of the chassis interface 166. biased At the same time, each spacer 160 is compressed between the substrate 102 and an adjacent spring element, thereby exhibiting a change in its local bulk resistance proportional to the force transmitted by this adjacent spring element 162.

6.3.2 Unitary Spring Elements and Chassis Interface Structure

In one implementation, chassis interface 166 and spring element 162 define an integrated structure (eg, "spring plate"). In one example, chassis interface 166 is aligned to each support location. thin wall structure (e.g., 20 gauge stainless steel, or 0.8 mm thick sheet) that is punched, etched or laser cut to form curved bends Thus, in this example, each spring element 162 is A flexure, such as a multi-arm spiral flexure, configured to deflect inwardly and outwardly from a nominal plane defined by the wall structure and configured to laterally and longitudinally position system 100 over a chassis. can define

More specifically, in this example, the chassis interface 166 may include an integrated metal sheet structure arranged between the substrate 102 and the chassis and defining a nominal plane. Each spring element 162 may be formed (eg, fabricated) from an integrated metal structure; may include a bent portion made of an integrated metal structure; The touch sensor surface 172 may be configured to return to approximately the nominal plane in response to the absence of a touch input applied thereto.

6.3.3 Spring Element Locations

In one implementation, substrate 102 defines a rectangular geometry with support locations proximal around such a rectangular geometry. Thus, the bias spacer 160 and the series of spring elements 162 may cooperate to support the circumference of the substrate 102 relative to the chassis of the computing device.

In such an implementation, the substrate 102 and cover layer can cooperate to form a semi-rigid structure that resists deflection between supported locations. For example, around the substrate 102 supported by a series of spring elements 162, the substrate 102 and the cover layer exert a force of -1.6 Newtons (165 g, equal to the "click" input force threshold). may exhibit a deflection of less than 0.3 mm out of the nominal plane when applied to the center of the touch sensor surface 172 . Thus, the substrate 102 and the cover layer may cooperate to transmit this applied force around the substrate 102 and thus to the deflection spacer 160 and spring element 162 underneath.

In this implementation, the inclusion of the spring element 162 supporting the center of the substrate 102 provides a relatively high ratio of applied force to vertical displacement of the substrate 102 near both the center and circumference of the substrate 102; and a relatively low ratio of applied force to vertical displacement of the substrate 102 inserted from the perimeter of the substrate 102 and in an intermediate region around its center. Thus, in order to avoid a non-linear change in the ratio of applied force to vertical displacement of the substrate 102 that could cause confusion or discomfort to a user interfacing with the system 100, the system 100 moves the substrate 102 supporting the circumference of; except for the spring element 162 supporting the substrate 102 proximal to its center; It may include a spring element 162 comprising a substrate 102 and a cover layer forming a substantially rigid structure.

More specifically, the series of spring elements 162 can support the circumference of the substrate 102, and the substrate 102 and cover layer vary linearly or nearly linearly over the entire area of the touch sensor surface 172. A substantially rigid structure may be formed to achieve a consistent ratio of applied force to vertical displacement of the substrate 102 .

6.3.4 Resistive Force Sensor

In this variant and as described above, the substrate is arranged under the second layer opposite the first layer; and a bottom layer comprising a series of sensor traces arranged at a series of discrete deflection spacer locations. Each deflection spacer in the series of deflection spacers 160 may include a force sensitive material that exhibits a change in local contact resistance in response to a change in applied force.

More specifically, in this variant, the spring element array 162 may include an integrated metal structure arranged between the substrate and the chassis and defining a nominal plane. Each spring element may be formed as an integrated metal structure; Opposite the bottom layer of the substrate, a series of deflection spacers 160 may define stages coupled to the deflection spacers; It can be configured to return towards the nominal plane in response to an input member applied to the touch sensor surface. Each deflection spacer can electrically couple adjacent sensor traces—in a series of sensor traces on the bottom layer of the substrate—with a resistance that varies with the magnitude of the force applied to the touch sensor surface and transmitted to the deflection spacer.

Thus, the controller 190 reads the resistance values from the series of sensor traces; interpreting the force magnitude of the input applied to the touch sensor surface based on the resistance values read from the series of sensor traces; An oscillating voltage may be driven across the multilayer inductor during a haptic feedback period in response to a force magnitude of the input exceeding a threshold force.

For example, a first spring element in spring element array 162 may yield to an input applied to a first region of the touch sensor surface proximate to the first spring element at a first time. A first deflection spacer in the series of deflection spacers 160 may then compress between a first spring element and a first support position, of the support position array, on the bottom layer of the substrate; It can represent a decrease in local contact resistance in proportion to the magnitude of the force of the input. Accordingly, the controller 190 detects, at a first time, a first change in resistance value across the first sensor trace, adjacent to the first deflection spacer; Based on the first change in the resistance value, it is possible to interpret the magnitude of the force of the input partially transmitted by the first spring element.

6.3.4.1 Capacitive Touch + Resistive Force

More specifically, in a variation of system 100 described above that includes an array of drive and sense electrodes forming a capacitive touch sensor across the topmost layer of substrate 102, controller 190 may perform a series of read the resistance value from the pressure sensor and the capacitance value from the capacitive touch sensor; These data can be fused to the position and force magnitude of the touch input on the touch sensor surface 172 during this scan period.

For example, during the scan period, controller 190 reads a series of capacitance values (eg, capacitance charge time, discharge time, or RC circuit resonance frequency) between the drive and sense electrodes of the capacitive touch sensor and ; read a series of resistance values across the electrode pairs 105 in the array of electrode pairs 105; Touch sensor based on a set of capacitance values (e.g., based on changes in capacitance values between the drive and sense electrodes at known transverse and longitudinal locations across the top layer of the substrate 102) detect the horizontal and vertical positions of the touch input on surface 172; As described above, interpret the magnitude of the force of the touch input based on the series of resistance values; For example, the horizontal position, vertical position, and force magnitude of the touch input may be output in the form of a touch image with force annotations.

Thus, in this example, if controller 190 detects a single touch input on touch sensor surface 172 during this scan period based on a series of capacitance values, controller 190 calculates the total applied force as the value of this single touch. You can see it as a result of input. Accordingly, controller 190 implements the methods and techniques described above to read resistance values from adjacent electrode pairs 105, stored baseline resistance values for those electrode pairs 105, and stored forces on these spring elements. Calculate the individual force transmitted by each spring element based on the model; sum these individual forces to calculate the total force applied to the touch sensor surface 172 during this scan period; With this total force - derived from a series of capacitance values - we can indicate the touch input position.

6.3.5 Capacitive Force Sensor

In this variant and as described above, the substrate is arranged under the second layer opposite the first layer; It may alternatively include a bottom layer comprising a series of sensor traces arranged at a series of individual deflection spacer positions. System 100 also couples to a chassis adjacent to the array of spring elements; Bonding plate 168 configured to affect (eg, modify, change) the capacitance values of (eg, within) a series of sensor traces in response to displacement of the substrate toward bonding plate 168. can include

In this variant, the spring element array and coupling plate 168 are arranged between the substrate and the chassis; define a nominal plane; An integrated metal structure can be formed defining an array of capacitive coupling regions adjacent to a series of individual deflection spacer positions. Thus, each spring element can be formed as an integrated metal structure; may extend from the capacitive coupling region of the array of capacitive coupling regions; It can be configured to return towards the nominal plane in response to the absence of input applied to the touch sensor surface. Additionally, each sensor trace can capacitively couple to an adjacent capacitive coupling region in an array of capacitive coupling regions of an integrated metal structure; In response to application of an input on the touch sensor surface proximate to the sensor trace, it may move towards the adjacent capacitive coupling area.

Thus, in this variant, the controller reads capacitance values from a series of sensor traces; interpret the force magnitude of the input applied to the touch sensor surface based on the capacitance values read from the series of sensor traces; An oscillating voltage may be driven across the multilayer inductor during a haptic feedback period in response to a force magnitude of the input exceeding a threshold force. For example, a first spring element in an array of spring elements may yield to a touch input applied to a first region of the touch sensor surface proximate to the first spring element at a first time. Thus, the first sensor trace adjacent to the first area of the touch sensor surface moves toward the first capacitive coupling area by a distance proportional to the magnitude of the force of the input. Accordingly, the controller detects a first change in the capacitance value of the first sensor trace at a first time; interpreting a force magnitude of the input based on the first change in capacitance value; A haptic feedback cycle is executed in response to the force magnitude of the input exceeding the threshold force.

In another example, a controller reads capacitance values from a series of sensor traces at a scan frequency during a first period of time; The magnitude of the force of the input applied to the touch sensor surface may be analyzed based on the capacitance value read from the driving and sensing electrode pair during the first period. Then, in response to the force magnitude of the input exceeding the threshold force, the controller drives the oscillating voltage across the multilayer inductor for a haptic feedback period following the first period; The step of reading electrical values from the series of drive and sense electrode pairs can be paused during the haptic feedback period. The controller can then resume reading the capacitance value from the sensor trace after the haptic feedback period is complete.

6.3.5.1 Mutual-Capacitance Sensors

In this variant, each sensor trace at a deflection spacer location on the bottom layer of the substrate may form a capacitance sensor arranged in a mutual capacitance configuration as shown in FIG. 23 .

For example, each sensor trace 146 includes a drive electrode arranged on a bottom layer of the substrate 102 adjacent to a first side of the support location; and a sensing electrode arranged on the bottom layer of the substrate 102 adjacent to the second side of the support location opposite the drive electrode. In this example, the drive and sensing electrodes in the sensor trace may be capacitively coupled, and the air gap between the substrate 102 and the coupling plate 168 may provide an air dielectric between the drive and sensing electrodes. can form When touch sensor surface 172 is pressed onto sensor trace 146, adjacent spring element 162 yields, moving the drive and sensing electrodes of sensor trace 146 closer to mating plate 168 and their drive electrodes and the air gap between the sensing electrode may be reduced. Because the coupling plate 168 represents a larger-than-air dielectric, thus reducing the distance between the coupling plate 168 and the substrate 102 increases the effective dielectric between the drive and sensing electrodes, and thus the drive and Increase the capacitance of the sensing electrode. Thus, the capacitance value of sensor trace 146 increases when touch sensor surface 172 is pressed over sensor trace 146—increases the charge time of sensor trace 146, increases the discharge time of sensor trace 146, or In the form of a reduction in the resonant frequency of (146) - it can deviate from the baseline capacitance value.

Thus, in this implementation, the controller 190 drives the coupling plate 168 to a reference (eg, ground) potential during the scan period; drive each drive electrode of sensor trace 146 (in series) with an alternating voltage at a specific frequency, or for a target time interval, equal to the target voltage; read a series of capacitance values - from the sense electrode of the sensor trace array 146 - representing mutual capacitance measurements between the drive and sense electrodes of these sensor traces 146; As discussed below, the distribution of force applied to the touch sensor surface 172 can be interpreted based on the known spring constant and the set of capacitance values of the spring element array 162 .

6.3.5.2 Self-Capacitance Sensors

In another implementation, sensor traces 146 are arranged in a self-capacitance configuration adjacent to each supporting location.

For example, each sensor trace 146 may include a single electrode arranged on a bottom layer of the substrate 102 adjacent to (eg, surrounding) the supporting location, and the bonding plate 168 is a coupling plate 168 for each sensor It can serve as a common second electrode for trace 146. In this example, a single electrode within bond plate 168 and sensor trace 146 may be capacitively coupled, and the air gap between substrate 102 and bond plate 168 may be between bond plate 168 and sensor trace. An air dielectric may be formed between (146). When touch sensor surface 172 is pressed onto sensor trace 146, adjacent spring element 162 yields, moving sensor trace 146 closer to engagement plate 168; reducing the air gap between the coupling plate 168 and the sensor trace 146; The capacitance between the coupling plate 168 and the sensor trace 146 can be increased. Thus, the capacitance value of sensor trace 146 increases when touch sensor surface 172 is pressed over sensor trace 146—increases the charge time of sensor trace 146, increases the discharge time of sensor trace 146, or In the form of a reduction in the resonant frequency of (146) - it can deviate from the baseline capacitance value.

Thus, in this implementation, the controller 190 drives the coupling plate 168 to a reference (eg, ground) potential during the scan period; drive each sensor trace 146 (in series) with an alternating voltage at a specific frequency or with a target voltage for a target time interval; read a series of capacitance values—from sensor trace array 146—that represent measurements of self-capacitance between coupling plate 168 and sensor trace 146; As discussed below, the distribution of force applied to the touch sensor surface 172 can be interpreted based on the known spring constant and the set of capacitance values of the spring element array 162 .

6.3.5.3 Separate Coupling Plate Between Spring Plate and Substrate

coupling plate 168 couples to the chassis adjacent spring element array 162; It is configured to affect the capacitance value of the sensor trace array 146 in response to displacement of the substrate 102 toward the bonding plate 168 .

In one implementation shown in FIG. 21 , bonding plate 168 is inserted between substrate 102 and chassis interface 166 and defines a discrete structure rigidly mounted to the chassis of the computing device.

Generally, in this implementation, the coupling plate 168 may be inserted between the substrate 102 and the spring element array 162; may include a plurality of perforations defining a geometry similar to (and slightly larger than) a stage on spring element 162 and aligned with (eg, coaxial with) the spring element array 162 and support location array; ; An array of capacitive coupling regions may be defined adjacent to (eg, surrounding) a number of perforations. For example, bonding plate 168 may comprise a thin wall structure (eg, stainless steel 20 gauge, or 0.8 mm thick sheet) that is punched, etched or laser cut to form multiple perforations. In this implementation, each sensor trace 146 (eg, a drive electrode and a sense electrode in a mutual capacitance configuration, a single electrode in a self-capacitance configuration) is configured so that the sensor trace 146 is connected to a bonding plate instead of an adjacent spring element 162 . may extend around a support location on the bottom layer of substrate 102, such as to the periphery of adjacent perforations in coupling plate 168 to capacitively couple (preferentially) to adjacent capacitive coupling regions on 168.

Further, in this implementation, system 100 may further include a series of deflection spacers 160, each deflection spacer 160 extending through a perforation in mating plate 168; It is (slightly) smaller in size than perforation; Coupling adjacent support locations on the bottom layer of substrate 102 to adjacent spring elements 162 of chassis interface 166 . For example, each deflection spacer 160 may comprise a silicone coupon bonded (with pressure sensitive adhesive) to an adjacent stage of spring element 162 on one side and to an adjacent support location on the substrate 102 on the opposite side.

Thus, in this implementation, each sensor trace 146 capacitively couples to an adjacent capacitive coupling region of coupling plate 168; In response to the application of a force on the touch sensor surface 172 proximate to the sensor trace 146, it may move towards an adjacent capacitive coupling area on the coupling plate 168, which is a portion of the force of this input transmitted to the adjacent spring element 162. Produces a change in the capacitance value of the sensor trace 146 representing More specifically, because the coupling plate 168 is rigid and mechanically separated from the substrate 102 and the spring element 162, the capacitive coupling area of the coupling plate 168 exerts a force on the touch sensor surface 172. The application compresses all or a subset of the spring elements 162, moves all or a subset of the sensor traces 146 closer to their corresponding capacitive coupling regions, and the controller 180 then measures these force magnitudes. , the magnitude of the force transmitted by the spring element 162 that can be interpreted to accurately estimate the magnitude of the total force applied to the touch sensor surface 172 and/or the individual touch input applied to the touch sensor surface 172. To repeatedly change the capacitance values of these sensor traces 146 as a function (or proportionally), they can be maintained in consistent positions offset above the chassis receptacles.

Further, in such an implementation, the deflection spacer 160 may define a height comparable to (or slightly greater than) the maximum vertical compression height of the adjacent spring element 162 corresponding to the target dynamic range of the adjacent sensor trace 146. there is. For example, a target dynamic range of 2 Newtons (e.g., 200 g) for a pressure sensor given a maximum vertical displacement of the touch sensor surface 172 and thus a maximum 1 mm compression of the adjacent spring element 162 For , the spring element 162 can be adjusted for a spring constant of 2000 N/m. Further, the deflection spacer 160 may have a height of about 1 mm, and a thickness and/or stack tolerance (eg, of 10%, 0.1 mm) of the coupling plate 168.

In such an implementation, the coupling plate 168 and chassis interface 166 may be directly secured to the chassis of the computing device. Alternatively, mating plate 168 and chassis interface 166 may be mounted (eg, fixed, riveted, welded, crimped) to separate interface plates that are secured or otherwise mounted to the chassis. System 100 also has a non-conductive device disposed between chassis interface 166 and bonding plate 168, as shown in FIG. 21, to electrically isolate chassis interface 166 from bonding plate 168. A buffer layer may be included.

6.3.5.4 Integral Coupling Plate and Spring Plate

In another implementation, bonding plate 168 and chassis interface 166 form one integrated (eg, metal) structure arranged between substrate 102 and chassis, as shown in FIGS. 20 and 21 . define.

Generally, in such an implementation, the integrated metal structure is a nominal plane between the chassis receptacle and the substrate 102; and an array of capacitive coupling regions adjacent to (eg aligned with, coaxial with) the array of support locations on the substrate 102 . In this implementation, each spring element 162 may be formed (eg, by etching, laser cutting) into an integrated metal structure; may extend from its adjacent capacitive coupling region; may define a stage coupled to a corresponding support location on the bottom layer of the substrate 102 (eg, via deflection spacer 160 as described above); The touch sensor surface 172 may be configured to return to approximately the nominal plane in response to the absence of a touch input applied thereto.

When the integrated structure is rigidly mounted to the chassis of the computing device, the integrated structure may thus rigidly dispose the capacitive coupling region in (or parallel to) a nominal plane and relative to the chassis, and the spring element ( The stage of 162) is movable vertically relative to the nominal plane and the capacitive coupling area.

Thus, each sensor trace 146 on the substrate 102 capacitively couples to an adjacent capacitive coupling region on the integrated metal structure; In response to the application of a force on the touch sensor surface 172 proximate to the sensor trace 146, it moves toward the adjacent capacitive coupling area, proportional to and thus transmitted by the spring element 162 to the compression of the adjacent spring element 162. The capacitance value of sensor trace 146 may change in proportion to a fraction of the applied force.

Additionally, in such an implementation, the integrated metal structure may be directly secured to the chassis of the computing device. Alternatively, the integrated metal structure may be mounted (eg, fixed, riveted, welded, crimped) to a separate chassis interface 190 that is secured or otherwise mounted to the chassis.

6.4 Sliding Interface

In another implementation, shown in FIG. 10B, the substrate 102 has a continuous planar bearing surface; discontinuous planar bearing surfaces (eg, planar with relief channels to reduce stiction between the substrate 102 and the bearing surface); or a receptacle 194 such as a series of bushings (eg, polymer pads) or bearings (eg, steel ball bearings) distributed throughout the base of the receptacle 194 and offset thereon. It rests on the bearing surface in the base and slides over it.

In one example, receptacle 194 defines a planar base surface parallel to the vibration plane; A series of magnetic elements are held at the base of the receptacle 194 below the planar base surface; The substrate (102) is arranged on a planar base surface, is configured to contact the planar base surface, slide over the planar base surface parallel to the vibration plane, and is configured to transmit a normal force applied to the touch sensor surface (172) to the chassis (192). It includes a rigid (eg, fiberglass) PCB.

In this configuration, a series of magnetic elements may be embedded in the receptacle 194 base; System 100 may further include a low friction layer interposed between substrate 102 and receptacle 194 base. In particular, the low-friction layer prevents direct contact between the magnetic element and the bottom spiral trace of the multilayer inductor 150 on the bottom layer 140 of the substrate 102; and to enable gentle vibration of the substrate 102, more generally the touch sensor assembly, over the base of the receptacle 194. For example, the low friction layer may include polytetrafluoroethylene (or "PTFE") disposed between the multilayer inductor 150 and a series of magnetic elements. Alternatively, the low friction layer may be arranged over the entire inner surface of the substrate 102 and over the multilayer inductor 150 .

Also in this configuration, system 100 includes spring element 162 configured to center substrate 102 within receptacle 194 in response to depolarization of multilayer inductor 150 during a haptic feedback period. can include In another example, system 100 is coupled to or physically coextensive with substrate 102, extends onto and remains on chassis 192, thereby generating a series upon completion of a haptic feedback cycle. It may include a bent portion that functions to re-center the touch sensor assembly based on the magnetic element of the. In yet another example, in this configuration (and in the configurations described above), system 100 is disposed proximate to the periphery of touch sensor surface 172, interposed between the inner wall of receptacle 194 and the touch sensor, and moisture and/or a flexible membrane (eg, seal) configured to seal the gap between the receptacle 194 and the touch sensor from dust ingress and the like.

7. Ground Plane Geometry and Shielding

Substrate 102 may further include shielding traces fabricated in the conductive layer and configured to shield the touch sensor from electrical noise generated by multilayer inductor 150 , for example, during and after the haptic feedback period.

In one implementation, the substrate 102 has a first layer 110 of the substrate 102 comprising the highest spiral trace of the multilayer inductor 150 and a top layer 104 comprising the drive and sense electrode pairs 105. ) and an intermediate layer 106 interposed between. In this implementation, the middle layer 106 provides a series of driving and sensing electrode pairs 105 of the touch sensor from the electrical noise generated by the multilayer inductor 150 when driven to an oscillating voltage by the controller 190 during the haptic feedback period. ) may include an adjacent trace region defining an electrical shield 107 configured to shield . In particular, controller 190 may, for example, continuously throughout operation; or intermittently, such as during and/or slightly after a haptic feedback period, to drive the electrical shield 107 of the intermediate layer 106 to a reference voltage potential (e.g., to ground, to an intermediate voltage). there is. Thus, when driven with a reference potential, the electrical shield 107 can shield the driving and sensing electrode pair 105 of the touch sensor on the top layer 104 from electrical noise.

Also, as shown in Fig. 1, the electrical shield 107 can generate noise in the drive and sense electrode pair 105 in the overlying touch sensor; and/or within the electrical shield 107, capable of inducing a second magnetic field that opposes the magnetic field generated by the multilayer inductor 150, which can damp vibration of the substrate 102 during the haptic feedback period. A cleft, such as a serpentine break, spanning the entire width of the electrical shield 107 may be included to prevent eddy current circulation.

Additionally or alternatively, in the configuration described above where system 100 includes sensor traces 146 at deflection spacer locations on bottom layer 140 of substrate 102, first helical traces of multilayer inductor 150 ( 111) and arranged under the uppermost layer 104 and/or the middle layer 106, the first layer 110 of the substrate 102 is separated from the first helical trace 111 and the first helical trace 111 It may include an electrical shield 107 surrounding the . In this implementation, controller 190 shields these sensor traces 146 from electrical noise from outside system 100; and/or to a reference voltage potential (e.g., beyond the range of the haptic feedback period) to shield the drive and sense electrode pairs 105 in the touch sensor from electrical noise generated by these sensor traces 146. to ground, to an intermediate voltage) to drive both the multi-layer inductor 150 and this electrical shield 107 in the first layer 110. Thus, in this implementation, the first layer 110 of the substrate 102, including the first helical trace 111 of the multilayer inductor 150, is adjacent to the first helical trace 111 and the first helical trace ( 111) may further include a shield electrode trace 112; When reading electrical values from these sensor traces 146, the controller 190 connects the first helical trace 111 to a reference potential to shield the second series of sensor traces 146 - at the deflection spacer locations - from electrical noise. and the shield electrode trace 112 .

For example, in this implementation, the controller 190 scans and receives resistance (or capacitance) data from the drive and sense electrode pairs 105 of the touch sensor in the top conductive layer(s) of the substrate 102 during the scan period. It is possible to hold multilayer inductor 150 (or a virtual high spiral trace of multilayer inductor 150) at virtual ground potential during processing. The controller 190 then detects an input on the touch sensor surface 172 based on the change in the resistance (or capacitance) value read from the drive and sense electrode pair 105 of the touch sensor; release the multilayer inductor 150 from the virtual reference potential; Responsive to detecting input on touch sensor surface 172 may polarize multilayer inductor 150 via a time-varying current signal during a haptic feedback period. More specifically, the controller 190 grounds the multilayer inductor 150 and the electrical shield 107 during the scan period to shield the touch sensor from electrical noise; Scanning of the touch sensor may be paused during the haptic feedback period (eg, while multilayer inductor 150 is polarizing) to avoid generating and reacting to noisy touch images during the haptic feedback period.

Thus, in this variant, the power electronics (e.g., multilayer inductor 150) and the sensor electronics of both the high-resolution and low-resolution sensors (e.g., the touch sensor's drive and sense electrode pairs, each at a deflection spacer location) 105) and sensor traces 146) are fabricated on one integrated substrate 102, thereby omitting the fabrication and assembly of multiple separate substrates for different haptic feedback and touch sensing functions, and system 100 can further It is possible to perform touch sensing, force sensing, and haptic feedback functions in a thin package.

8. Controller

During operation, the controller 190 measures the electrical (e.g., capacitance or resistance, etc.) detect application of an input on the touch sensor surface 172 based on a change in ; based on electrical values read from sensor traces 146 of deflection spacers 160 integrated into bottom layer(s) 140 of substrate 102 and/or based on those electrical values read from a touch sensor. to characterize the force magnitude of the input; and/or interpret the input as a “click” input if the force magnitude of the input exceeds a threshold force magnitude (eg, 160 g). Then, in response to detecting the input and interpreting the input as a "click" input, the controller 190 induces an alternating magnetic coupling between the multilayer inductor 150 and the series of magnetic elements within the chassis 192. a multilayer inductor to vibrate the substrate 102 at , to provide haptic feedback to the user, and to provide the user with a tactile perception of downward movement of the touch sensor surface 172 similar to pressing a mechanical momentary switch, button, or key. haptic feedback cycles such as momentarily polarizing 150.

8.1 Controller Mounted to Substrate

In the configuration described above, the controller 190 (and/or driver) is mounted to the substrate 102 as opposed to the touch sensor (on the inner surface of the substrate 102); System 100 further includes a flexible circuit extending between chassis 192 and substrate 102 and electrically coupled to a power supply arranged in chassis 192 . Thus, in this configuration, the controller 190 reads the electrical value between the drive and sense electrode pair 105 of the touch sensor or directly samples an adjacent touch sensor; generating a series of touch images based on these electrical values between the driving and sensing electrode pairs 105 of the touch sensor; A series of touch images may be output to a processor arranged in the chassis 192 through a flexible circuit. Additionally, the driver may intermittently source current from the power supply to the multilayer inductor 150 through the flexible circuit in response to a trigger from an adjacent controller 190 . Thus, in this configuration, the touch sensor assembly may include the substrate 102, touch sensor, (touch sensor surface 172), controller 190, driver, multilayer inductor 150, and flexible circuit as independent units. there is. This independent unit can then be installed over the receptacle 194 of the chassis 192, and the flexible circuit can be connected to the power and data ports of the receptacle 194 to complete the assembly of the system 100 into such a device. .

9. Haptic Feedback Cycle

In this variant, multilayer inductor 150 integrated into substrate 102 and a series of magnetic elements housed within chassis 192 below multilayer inductor 150 cooperate to control the multilayer inductor 150 by controller 190. A miniature integrated multilayer inductor configured to vibrate the touch sensor surface 172 and the substrate 102 in response to polarization (eg, in response to detecting a touch input on the touch sensor surface 172). 150) is defined. More specifically, the controller 190 along with the drive circuit supplies an alternating (i.e., time-varying) drive current to the multilayer inductor 150 during the haptic feedback period, thereby periodically changing the direction of the multilayer inductor. A time-varying magnetic field can be generated through (150). Thus, the controller 190 and/or drive circuitry creates a magnetic force between the multilayer inductor 150 and the series of magnetic elements to form a magnetic force between the multilayer inductor 150 (and thus the substrate ( 102) and touch sensor surface 172) temporarily connect multilayer inductor 150 to cause touch sensor surface 172 to vibrate relative to chassis 192 and to be alternately attracted and repelled by a series of poles of magnetic elements. can be polarized.

In particular, in response to detecting a touch input - on touch sensor surface 172 - exceeding a threshold force (or pressure) magnitude, controller 190 causes a mechanical snap, as shown in FIGS. 16 and 17 . It drives the multi-layer inductor 150 during a "haptic feedback period" for a tactile mimic operation of a button. For example, in response to such a touch input, controller 190 drives multilayer inductor 150 with a square-wave alternating voltage for a target click duration (eg, 250 ms), causing a magnetic field in a series of magnetic elements. to induce an oscillating force between the multilayer inductor 150 and the magnetic element, and to induce an alternating magnetic field through the multilayer inductor 150 that vibrates the substrate 102 relative to the chassis 192 of the device. Motor drivers can be triggered.

9.1 Paused Scanning During Haptic Feedback Cycle

In one implementation, the controller 190 reads electrical values from the series of drive and sense electrode pairs 105 during a scan period at a scan frequency (eg, 200 Hz) during operation; The inputs (and their force magnitudes) on the touch sensor surface 172 are interpreted based on the series of electrical values read from the drive and sense electrode pairs 105 during each scan period. Then, in response to detecting an input on the touch sensor surface 172 during the current scan period (or detecting an input of a force magnitude greater than a threshold force on the touch sensor surface 172), the controller 190 drives an oscillation voltage across the multilayer inductor 150 during a haptic feedback period after the current scan period; Pausing the reading of electrical values from the series of drive and sense electrodes during the haptic feedback cycle, then reading the electrical values from the series of drive and sense electrodes and after completion of the haptic feedback cycle - based on their electrical values The process of interpreting the input on the touch sensor surface 172 resumes.

Generally, in such an implementation, the controller 190 executes a series of scan cycles to detect and characterize the magnitude of the input applied over the touch sensor surface 172 during these scan cycles; Pausing scanning of the touch sensor (and/or deflection spacer 160) during execution of a haptic feedback cycle in response to detecting an input exceeding a threshold force magnitude and then resuming scanning of the touch sensor upon completion of the haptic feedback cycle. can be resumed

More specifically, during the scan period, the controller 190 drives the multilayer inductor 150 to ground potential; sampling the capacitance (or resistance) value between the driving and sensing electrode pairs in the touch sensor; convert these values to the position (and force magnitude) of the input applied on the touch sensor surface 172 during the scan period; sampling the resistance (or capacitance) values from the series of deflection spacers 160; interpret the force magnitude of these inputs on the touch sensor surface 172; It may generate a touch image representing both the position and force magnitude of these inputs on the touch sensor surface 172 .

Then, in response to a detected input force magnitude that exceeds the threshold force magnitude (eg, a “click” force of 160 g), controller 190 releases multilayer inductor 150 from ground potential; according to a specific AC waveform (e.g., selected based on a threshold force magnitude) to induce vibration of the touch sensor surface 172 relative to the chassis 192 during a haptic feedback period (or “haptic feedback period”). A driving circuit may be triggered to polarize the multilayer inductor 150 . Additionally, controller 190 can pause scanning of the touch sensor during or before the haptic feedback period. Controller 190 then resumes executing scan cycles on the touch sensor and/or deflection spacer after completion of the haptic feedback cycle (e.g., when multilayer inductor 150 polarizes and/or returns to ground potential). can do.

9.2 Interleaved Scanning and Haptic Feedback Cycle

Alternatively, after detecting an input on the touch sensor surface 172 during the current scan period (or after detecting an input of a force magnitude greater than a threshold force on the touch sensor surface 172), the controller 190 may drive multilayer inductor 150 with an oscillating voltage at 1 frequency (eg, 50 Hz); A higher frequency (eg, 200 Hz) may be interleaved between the spacing of the peak magnetic field coupling between the magnetic element and the multilayer inductor 150 during this haptic feedback period. For example, in this implementation, the controller 190 continues to capture electrical values from the drive and sense electrode pairs 105 of the touch sensor, and during these haptic feedback cycles, between voltage reversals across the multilayer inductor 150, the controller 190 detects a touch Interleaving the scan cycles at the sensor may detect and track input on the touch sensor surface 172 during the haptic feedback cycle.

In this implementation, the controller 190 reads electrical values from the series of drive and sense electrode pairs 105 during a scan period at a scan frequency (eg, 200 Hz) during operation; Based on the series of electrical values read from the drive and sense electrode pairs 105 during each scan period, the inputs on the touch sensor surface 172 (and their force magnitudes) can be interpreted. Then, in response to detecting an input on the touch sensor surface 172 during the current scan period (or detecting an input of a force magnitude greater than a threshold force on the touch sensor surface 172), the controller 190 drives an oscillating voltage, at a feedback frequency less than the scan frequency (eg, 50 Hz), across the multilayer inductor 150 during the haptic feedback period; intermittently reading electrical values from the series of drive and sense electrodes at the scan frequency - between voltage reversals across the multilayer inductor 150 at the feedback frequency - during the haptic feedback period; interpret the input on the touch sensor surface 172 during the haptic feedback period based on these intermittent electrical values; and reading electrical values from the series of drive and sense electrode pairs 105 at the scan frequency after completion of the haptic feedback period.

9.3 Preset Force Threshold

As noted above, controller 190 may execute a haptic feedback cycle in response to detecting a touch input on touch sensor surface 172 that meets or exceeds one or more preset force thresholds at block S120. For example, the controller 190 may include mechanical buttons of an end user input device, such as 165g (e.g., mechanical key keyboard, mechanical volume and home buttons on a smart phone, buttons on a physical computer mouse, mechanical trackpad buttons, or A haptic feedback cycle may be initiated in response to detecting a touch input on the touch sensor surface 172 that exceeds a threshold force (or pressure) corresponding to the adjusted braking force (or pressure) of the snap dome. Accordingly, controller 190 may selectively execute a haptic feedback cycle in response to detecting a touch input on touch sensor surface 172 exceeding this threshold force to mimic the haptic feedback of such a mechanical button.

9.4 User-elected Force Threshold

Alternatively, controller 190 may be configured for a lower input sensitivity (corresponding to a higher force threshold) set through a graphical user interface running on a computing device coupled to or coupled to system 100. A custom force threshold may be implemented to trigger a haptic feedback cycle, such as based on a user preference or based on a user preference for a higher input sensitivity (corresponding to a lower force threshold).

9.5 Variable Force Threshold

In other implementations, controller 190 may divide touch sensor surface 172 into two or more active and/or inactive regions, such as based on the current mode or orientation of system 100, as described below. , the controller 190 initiates a haptic feedback cycle in response to detecting a touch input of sufficient force within an active area of the touch sensor surface 172 and an input on an inactive area of the touch sensor surface 172. can be discarded.

In this implementation, the controller 190 additionally or alternatively assigns unique threshold force (or pressure) magnitudes to individual regions of the touch sensor surface 172, and assigns unique threshold force (or pressure) magnitudes to these individual regions of the touch sensor surface 172. It may optionally trigger a haptic feedback cycle in response to input—in various regions of the touch sensor surface 172—that exceeds a threshold force magnitude. For example, controller 190 assigns a first threshold size to the left click area of touch sensor surface 172; A right click area of the touch sensor surface 172 may be assigned a second threshold size - greater than the first threshold size - to reject an anomalous right click on the touch sensor surface 172 . In this example, controller 190 may also assign a third threshold size greater than the first threshold size to the central scroll region of touch sensor surface 172 to reject anomalous scrolling inputs on touch sensor surface 172 . and also connect the central scroll region to a fourth threshold size, less than the first threshold size, for a continuous scroll event.

9.6 Standard Click and Deep Click

In one variation shown in FIG. 19 , controller 190 responds to application of a force that exceeds a first force magnitude and remains below a second force threshold (hereinafter “standard click input”) at blocks S110 and S120. A "standard click haptic feedback cycle" is executed; a "deep haptic feedback cycle" is executed in block S114 and block S124 in response to the application of a force exceeding the second force threshold (hereinafter referred to as "deep click input"). In this variant, during the deep haptic feedback period, controller 190 is configured to tactilely indicate to the user that a deep click input has been detected on touch sensor surface 172 (e.g., at a higher peak-to-peak voltage). Driving the haptic feedback period may drive the multilayer inductor 150 for an extended duration (eg, 750 ms) at a higher amplitude and/or at a different (eg, lower) frequency.

In one example, controller 190 outputs a left click control command in response to detecting input of a force magnitude between a low "standard force threshold and a high" "dip" force threshold and sets a standard click haptic feedback cycle. and output a right-click control command and execute a deep haptic feedback cycle in response to detecting an input of a force magnitude greater than a high "dip" force threshold. Accordingly, system 100 may operate on a touch sensor surface ( 172) by detecting inputs of different force magnitudes; assigning input types to the inputs based on the magnitudes; and driving the multilayer inductor 150 according to different schemas based on the types of detected inputs. Provide different haptic feedback to the user; output different control functions based on the type of input detected.

9.7 hysteresis

In one variation shown in FIG. 18 , controller 190 implements a hysteresis technique to trigger a haptic feedback cycle during the application and cancellation of a single input on touch sensor surface 172 . In particular, in this variant, the controller 190 optionally generates a haptic signal in response to detecting a new input—of a force greater than a high force threshold (e.g., 165 g)—applied to the touch sensor surface 172. drive the multilayer inductor 150 according to the “down click” vibration profile during the feedback period; After tracking these inputs that come into contact with the touch sensor surface 172 over several scan cycles; In response to detecting that the force magnitude of this input drops below a low force threshold (e.g., 60 g), during a later haptic feedback cycle, driving the multilayer inductor 150 according to an “up click” vibration profile. can Thus, system 100 replicates the tactile "feel" of a mechanical snap button being depressed and then released; It may prevent “bouncing” haptic feedback when the force magnitude of the input on the touch sensor surface 172 varies around the force threshold.

More specifically, when the force magnitude of the input on the touch sensor surface 172 reaches a high force threshold, the controller 190 stops pressing the mechanical button - until the input is released on the touch sensor surface 172. Conjure - can trigger a single "down click" haptic feedback cycle. However, controller 190 may also execute an “up click” haptic feedback cycle—reminiscent of the release of a depressed mechanical button—when the force magnitude of this input falls below a second, lower threshold magnitude. Thus, the controller 190 implements a hysteresis technique to haptically respond to input on the touch sensor surface 172 to prevent "bouncing," and the force applied to the touch sensor surface 172 registers via haptic feedback. (i.e., a first threshold magnitude has been reached), and that the user's selection has been cleared and that the force applied to the touch sensor surface 172 has registered (i.e., has been applied) via additional haptic feedback. may indicate to the user that the force has fallen below a second threshold magnitude.

10. Multiple Multi-layer Inductors

In one variation, system 100 may also include multiple multilayer inductors 150 and pairs of magnetic elements. In one example, system 100 includes a first multilayer inductor 150 arranged proximate to a first edge of a substrate; and a first magnetic element 181 arranged in the chassis 192 below the first multilayer inductor 150 and thus near the first edge of the substrate. In this example, system 100 also includes a second magnetic element 182 offset from first magnetic element 181 and rigidly coupled to chassis 192; and coupled to the substrate 172 under the touch sensor surface 172, arranged proximate a second edge of the substrate 102 opposite the first edge, and magnetically coupled to a second magnetic element 182. A configured second inductor may be included. Also in this example, the controller 190 may be used to vibrate the substrate 102 in a plane of vibration relative to the chassis 192 with a peak energy perceived proximate the first edge of the substrate 102. selectively polarize the first multilayer inductor (150) in response to detection of a touch input on the touch sensor surface (172) proximate the first edge; and a touch sensor surface proximate the second edge of the substrate 102 to vibrate the substrate 102 in a vibration plane relative to the chassis 192 with a perceived peak energy proximate the second edge of the substrate 102 ( 172) to selectively polarize the second inductor in response to detection of a second touch input.

In a similar implementation, system 100 may include first multilayer inductor 150 as described above and a second inductor/magnetic element pair that cooperates with the first inductor-magnetic element pair to vibrate substrate 102. there is. In this variation, the first inductor-magnetic element pair may include a coil mounted to the substrate 102 offset to the right of the center of mass of the substrate 102 by a first distance. Additionally, the first inductor-magnetic element pair may include a plurality of magnets arranged in a row below the multilayer inductor 150 . A plurality of magnets may cooperate with the multilayer inductor 150 of the first inductor-magnetic element pair to define an axis of oscillation of the first inductor-magnetic element pair. The second inductor-second magnetic element 182 pair may include a coil mounted on the substrate 102 offset to the left of the center of mass of the substrate 102 by a second distance. Additionally, the second inductor-second magnetic element 182 pair may include a plurality of magnets arranged in a row. A plurality of magnets may cooperate with the multilayer inductor 150 of the second inductor-second magnetic element 182 pair to define an axis of oscillation of the second inductor-second magnetic element 182 pair.

In one implementation, the plurality of magnets of the first inductor-magnetic element pair is such that the axis of oscillation of the first inductor-magnetic element pair is parallel to the axis of oscillation of the second inductor-second magnetic element 182 pair. A plurality of magnets of a pair of second magnetic elements 182 may be arranged in parallel rows. In this implementation, the multilayer inductor 150 of the first inductor-magnetic element pair is moved by a first distance equal to the second distance between the center of mass and the multilayer inductor 150 of the second inductor-second magnetic element pair 182. It can be mounted on the substrate 102 offset from the center of mass of the substrate 102 . Accordingly, a midpoint between the multilayer inductor 150 of the first inductor-magnetic element pair and the multilayer inductor 150 of the second inductor-second magnetic element pair 182 may be coaxial with the center of mass. Thus, the first inductor-magnetic element pair and the second inductor-second magnetic element 182 pair extend through the center of mass of the substrate 102 and parallel to the oscillation axis of the second magnet and the oscillation axis of the first magnet. may cooperate to oscillate the substrate 102 along the entire oscillation axis.

The controller 190 includes a second inductor-second magnetic element 182 pair to oscillate at a frequency that is in phase with the oscillation of the first multilayer inductor 150 and a first to oscillate the substrate 102 at the first frequency. It can drive inductor-magnetic element pairs. Thus, the first and second multilayer inductors 150 can cooperate to oscillate the substrate 102 linearly along the entire oscillation axis. However, the controller 190 may be configured to oscillate the second multilayer inductor 150 and the substrate ( The first multilayer inductor 150 may additionally or alternatively be driven to oscillate 102 . Thus, the first and second multilayer inductors 150 can cooperate to rotate the substrate 102 about its center of mass - in a plane parallel to the touch sensor surface 172 .

Additionally or alternatively, the controller 190 can selectively drive the first multilayer inductor 150 or the second multilayer inductor 150 to oscillate at a specific time. The controller 190 can selectively (and exclusively) drive the first multilayer inductor 150 to mimic the click feel for a section of the substrate 102 adjacent to the first multilayer inductor 150 . The controller 190 is configured to mimic the click feel of the section of the substrate 102 adjacent to the second multilayer inductor 150 while minimizing vibration for the section of the substrate 102 adjacent to the first multilayer inductor 150. 2 Multilayer inductor 150 can be driven alternatively. For example, controller 190 may trigger a haptic feedback period to mimic the feeling of a click (or "right" click) on the right side of substrate 102 while second multilayer inductor 150 remains inactive. It is possible to selectively drive the first multilayer inductor 150 to perform.

However, the controller 190 can also drive the first multilayer inductor 150 to oscillate according to a specific vibration waveform. At the same time, the controller 190 may drive the second multilayer inductor 150 to vibrate according to a vibration waveform that is out of phase with the specific vibration waveform of the first multilayer inductor 150 (eg, 180° out of phase). there is. For example, the second multilayer inductor 150 may output a vibration waveform having an amplitude smaller than the amplitude of a specific vibration waveform. In this example, the vibration waveform of the second multilayer inductor 150 may also be out of phase with the specific vibration waveform of the first multilayer inductor 150 by 180°. Accordingly, the second multilayer inductor 150 may be configured to cancel (reduce the amplitude or) of a specific vibration waveform output by the first multilayer inductor 150 .

11. Separate Inductor

In one variation, regions of the substrate 102 are routed or otherwise removed to form shallow recesses through a subset of the layers of the substrate 102 . For example, a three-layer thick region of the substrate 102 near the horizontal and vertical centers of the substrate 102 may be removed from the bottom surface of the substrate 102 . Since a separate coil of thin wire can be soldered to a series of vias exposed at the base of the recess and then installed (eg glued, potted) into the recess, the exposed side of the coil is at the bottom of the substrate 102. It is approximately coplanar with the surface (eg, within 100 μm).

Additionally or alternatively, system 100 may include a first integrated inductor fabricated across multiple layers of substrate 102, as described; and a second coil disposed over the first integrating inductor, electrically coupled to the first integrating inductor, and configured to cooperate with the first integrating inductor to form a larger inductor exhibiting greater magnetic coupling to adjacent magnetic elements. can do. For example, the second coil may be a multi-loop wire coil; Alternatively, it may include a second integrated inductor fabricated over the entire multilayer of the second substrate 102 and bonded and/or soldered to the substrate 102 adjacent to the first integrated inductor.

12. Waterproofing

In one variation shown in FIGS. 9A and 9B , a waterproofing membrane 164 is applied over the touch sensor; extends outward from the periphery of the substrate 102; Glued, clamped, or otherwise secured near the perimeter of receptacle 194 and cooperates with chassis 192 to seal the touch sensor, substrate 102, and deflection spacer 160 within receptacle 194. This prevents moisture and particulates from infiltrating on the substrate 102 and into the receptacle 194 .

For example, the waterproof membrane 164 may include silicon or PTFE (eg, expanded PTFE) bonded to the touch sensor using an adhesive. System 100 may also include a glass or other cover layer 170 that is adhered over waterproof membrane 164 and extends around substrate 102 .

Additionally, chassis 192 may define a flange (or “shelf” undercut) that extends inwardly toward the transverse and longitudinal centers of receptacle 194 . An outer section of the waterproof member extending beyond the substrate may be inserted into the receptacle 194 and contact the underside of the flange. Thereafter, the circumferential fixing bracket or secondary chassis 192 member and the circumferential fixing bracket or 2 are clamped to seal the waterproof membrane 164 around the receptacle 194 by clamping the waterproof member 164 between the chassis 192. A car chassis 192 member may be secured to the chassis 192 over (completely) around the receptacle 194 and below the flange.

In one implementation, the waterproof membrane 164 includes a convolution around the substrate 102 and between the receptacle 194 . In such an implementation, the helical corrugations may be configured to deflect or deform to accommodate vibrations of the substrate 102 during the haptic feedback period. For example, the waterproof film 164 may include a polyimide film having a semicircular ridge extending along the gap between the outer circumference of the substrate 102 and the inner circumference of the receptacle 194 .

In a similar implementation, the touch sensor assembly as the substrate 102 and the touch sensor are arranged over the waterproof membrane 164, which is sealed to the chassis 192 along the underside of the receptacle 194 by a retaining bracket as described above. is completely disposed over the watertight barrier throughout the receptacle 194, and when the multilayer inductor 150 is actuated, the watertight film vibrates the touch sensor assembly.

The systems and methods described herein may be embodied and/or implemented as a machine configured to receive a computer readable medium having computer readable instructions stored thereon, at least in part. The instructions are computer executed integrated with an application, applet, host, server, network, website, communication service, communication interface, hardware/firmware/software element of a user's computer or mobile device, wristband, smart phone, or any suitable combination thereof. It can be executed by possible components. Other systems and methods of the embodiments may be embodied and/or implemented as a machine configured to receive a computer readable medium having computer readable instructions stored thereon, at least in part. Instructions may be executed by computer-executable components integrated with devices and networks of the type described above. The computer readable medium may be stored in any suitable computer readable medium such as RAM, ROM, flash memory, EEPROM, optical device (CD or DVD), hard drive, floppy drive, or any suitable device. A computer-executable component may be a processor, but any suitable dedicated hardware device may (alternatively or additionally) execute instructions.

As those skilled in the art will appreciate from the foregoing detailed description and from the drawings and claims, modifications and variations may be made to the embodiments of the invention without departing from the scope of the invention as defined in the claims that follow.

Claims (40)

As a system,
comprising a substrate, a first magnetic element, a second magnetic element and a controller;
The substrate defines a unitary structure and includes a first layer and a second layer,
The first layer is
a first helical trace, the first helical trace comprising:
wound in a first direction; and
define a first end and a second end; and
the second layer is
arranged below the first layer; and
a second helical trace, the second helical trace comprising:
winding in a second direction opposite to the first direction;
defining a third end and a fourth end, the third end electrically coupled to the second end of the first helical trace; and
forming a multi-layer inductor defining a primary axis and a secondary axis in cooperation with the first helical trace;
The first magnetic element is
arranged under the substrate;
define a first polarity facing the multilayer inductor;
extends along the primary axis of the multilayer inductor; and
arranged on a first side of the primary axis of the multilayer inductor;
The second magnetic element is
arranged under the substrate adjacent to the first magnetic element;
define a second polarity, opposite the first polarity, facing the multilayer inductor;
extends along the primary axis of the multilayer inductor; and
arranged on a second side of the primary axis of the multilayer inductor, and
wherein the controller drives an oscillating voltage across the multilayer inductor during a haptic feedback period in response to an input on a touch sensor surface arranged over the substrate;
induce alternating magnetic coupling between the first magnetic element and the second magnetic element and the multilayer inductor; and
vibrate the substrate relative to the first magnetic element and the second magnetic element;
configured system. According to claim 1,
further comprising a set of deflection spacers and an array of spring elements;
each deflection spacer of the series of deflection spacers is arranged over an individual deflection spacer location, at a series of individual deflection spacer locations on the bottom surface of the substrate below the first layer; and
The spring element array is
coupling the series of deflecting spacers to a chassis of a computing device;
supporting the substrate on the chassis; and
configured to yield to vibration of the substrate in response to the oscillating voltage across the multilayer inductor during the haptic feedback period;
system. According to claim 2,
Further comprising an integrated metal structure, the integrated metal structure comprising:
arranged between the substrate and the chassis;
define an aperture under the multilayer inductor; and
defining the spring element array and including a set of flexures arranged around the aperture; and
further comprising a magnetic yoke arranged in the aperture of the integrated metal structure; and
wherein the first magnetic element and the second magnetic element are arranged on the magnetic yoke below the multilayer inductor. According to claim 2,
The substrate is
Further comprising a bottom layer, the bottom layer comprising:
arranged under the second layer opposite the first layer; and
a series of sensor traces arranged at said series of individual deflection spacer locations;
each deflection spacer in the series of deflection spacers includes a force-sensitive material that exhibits a change in local contact resistance in response to a change in applied force; and
The controller
read resistance values from the series of sensor traces;
interpret the force magnitude of the input applied to the touch sensor surface based on the resistance values read from the series of sensor traces; and
drive the oscillating voltage across the multilayer inductor during the haptic feedback period in response to the force magnitude of the input exceeding a threshold force;
configured system. According to claim 4,
the spring element array includes an integrated metal structure defining a nominal plane and arranged between the substrate and the chassis;
In the spring element array, each spring element is
formed with the integrated metal structure;
define a stage coupled to a deflection spacer, of the series of deflection spacers, opposite the bottom layer of the substrate; and
configured to return toward the nominal plane in response to an absence of input applied to the touch sensor surface; and
wherein each deflection spacer in the series of deflection spacers electrically couples an adjacent sensor trace of the series of sensor traces with a resistance that varies with a magnitude of a force applied to the touch sensor surface and transmitted to the deflection spacer. According to claim 4,
In the spring element array, a first spring element yields to the input applied to a first area of the touch sensor surface proximate to the first spring element at a first time;
In the series of deflection spacers, the first deflection spacer is
compressing, at the bottom layer of the substrate, between a first support location and the first spring element, of an array of support locations; and
represents a decrease in local contact resistance proportional to the magnitude of the force of the input; and
The controller
at the first time, detecting a first change in resistance value across a first sensor trace adjacent the first deflection spacer; and
Interpret the magnitude of the force of the input, transmitted in part by the first spring element, based on the first change in the resistance value.
configured system. According to claim 2,
the substrate further comprises a bottom layer;
the bottom layer
arranged under the second layer opposite the first layer; and
a series of sensor traces arranged at said series of individual deflection spacer locations;
Further comprising a coupling plate, wherein the coupling plate
engages the chassis adjacent to the spring element array; and
to affect the capacitance values of the series of sensor traces in response to displacement of the substrate towards the bonding plate.
consists of, and
The controller
read capacitance values from the series of sensor traces;
interpret the force magnitude of the input applied to the touch sensor surface based on the capacitance values read from the series of sensor traces; and
drive the oscillating voltage across the multilayer inductor during the haptic feedback period in response to the force magnitude of the input exceeding a threshold force.
The system, which is further configured. The method of claim 4, wherein the controller
read capacitance values from the series of sensor traces at a scan frequency during a first period;
interpreting the force magnitude of the input applied to the touch sensor surface based on the capacitance value read from the driving and sensing electrode pair during the first period;
In response to the force magnitude of the input exceeding the threshold force,
following the first period, driving the oscillation voltage across the multilayer inductor during the haptic feedback period; and
pause reading electrical values from the series of drive and sense electrode pairs during the haptic feedback period; and
to resume reading the capacitance value from the sensor trace after completion of the haptic feedback period;
configured system. According to claim 7,
The spring element array and the coupling plate include an integrated metal structure, the integrated metal structure comprising:
arranged between the substrate and the chassis;
define a nominal plane; and
defining an array of capacitive coupling regions adjacent to the series of individual deflection spacer locations;
In the spring element array, each spring element is
formed with the integrated metal structure;
in the capacitive coupling region array, extending from the capacitive coupling region; and
configured to return toward the nominal plane in response to an absence of input applied to the touch sensor surface; and
In the series of sensor traces, each sensor trace is
capacitively coupled to an adjacent capacitive coupling region in the array of capacitive coupling regions of the integrated metal structure; and
moving toward the adjacent capacitive coupling region in response to the application of an input on the touch sensor surface proximate the sensor trace;
system. According to claim 7,
In the spring element array, a first spring element yields to a touch input applied to a first area of the touch sensor surface proximate to the first spring element at a first time;
in the array of sensor traces adjacent to the first area of the touch sensor surface, a first sensor trace moves towards a first capacitive coupling area in the array of capacitive coupling areas by a distance proportional to a force magnitude of the input; and
The controller
detect a first change in the capacitance value of the first sensor trace at the first time; and
to interpret the force magnitude of the input based on the first change in the capacitance value;
configured system. According to claim 1,
Further comprising a touch screen arranged on the substrate, the touch screen
digital display;
a touch sensor arranged over the entirety of the display; and
a cover layer defining the touch sensor surface and arranged over the display; and
wherein the controller is configured to drive the oscillating voltage across the multilayer inductor during the haptic feedback period in response to the touchscreen detecting the input on the touch sensor surface.
system. According to claim 1,
The substrate further comprises a top layer, the top layer comprising:
arranged above the first layer opposite the second layer; and
an array of driving and sensing electrode pairs;
further comprising a cover layer defining the touch sensor surface and arranged over the uppermost layer; and
The controller
read a series of electrical values from the series of drive and sense electrode pairs;
detect the input on the touch sensor surface based on the series of electrical values; and
drive the oscillating voltage across the multilayer inductor during the haptic feedback period in response to the input on the touch sensor surface;
configured system. According to claim 12,
The controller
read a series of electrical values from the series of drive and sense electrode pairs, representative of capacitive coupling between the drive and sense electrode pairs; and
at a first location on the touch sensor surface based on a deviation of the subset of electrical values, in the series of electrical values, from a baseline capacitance value across a subset of drive and sense electrode pairs proximate to the first location; to detect the input;
made up; and
further comprising an intermediate layer, wherein the intermediate layer comprises
inserted between the first layer and the uppermost layer; and
a continuous trace region defining an electrical shield configured to shield the series of drive and sense electrode pairs from electrical noise generated by the multilayer inductor when driven by the controller to an oscillating voltage;
system. According to claim 1,
the first helical trace defines a first planar coil that spirals inward in a clockwise direction within the first layer; and
The second helical trace defines a second planar coil that spirals outward in a counterclockwise direction within the second layer and cooperates with the first helical trace to cause current to flow in a common direction about the center of the multilayer inductor. do, the system. According to claim 1,
the first helical trace defines a first planar coil that spirals outward within the first layer from the first end to the second end, ending at a periphery of the first helical trace;
The second helical trace extends within the second layer from the third end coupled to the second end proximate the periphery of the second helical trace to the fourth end ending proximate the center of the second helical trace. defining a second planar coil that spirals inwards;
The first layer further includes a third helical trace defining a third planar coil, the third planar coil comprising:
a fifth end and a sixth end;
parallel to the first helical trace; and
The sixth helical trace coupled to the first end of the first helical trace, ending proximate the center of the second helical trace, and ending at the periphery of the first helical trace, from the fifth end in the first layer. spiral inward to the end; and
wherein the controller drives the oscillating voltage across the fourth end of the second helical trace and the sixth end of the third helical trace during the haptic feedback period in response to the input on the touch sensor surface.
system. According to claim 1,
The first layer further comprises a third helical trace, the third helical trace comprising:
adjacent to the first helical trace;
winding in the second direction; and
defining a fifth end and a sixth end, the fifth end being electrically coupled to the first end of the first helical trace;
The second layer further comprises a fourth helical trace, the fourth helical trace comprising:
adjacent to the second helical trace;
winding in the first direction;
defining a seventh end and an eighth end, the seventh end electrically coupled to the sixth end of the third helical trace; and
forming the multilayer inductor in cooperation with the first spiral trace, the second spiral trace, and the third spiral trace; and
wherein the controller, in response to the input on the touch sensor surface, drives the oscillating voltage across the eighth end of the fourth helical trace and the fourth end of the second helical trace;
induce an alternating magnetic coupling between the first magnetic element and the second magnetic element and the multilayer inductor; and
vibrate the substrate relative to the first magnetic element and the second magnetic element;
configured system. According to claim 1,
the substrate further comprises a third layer and a bottom layer;
The third layer is
arranged under the second layer opposite the first layer; and
a third helical trace, the third helical trace comprising:
winding in the first direction; and
defining a fifth end and a sixth end, the fifth end electrically coupled to the fourth end of the second helical trace; and
the bottom layer
arranged below the third layer opposite the second layer; and
a fourth helical trace, the fourth helical trace comprising:
winding in the second direction;
defining a seventh end and an eighth end, the seventh end electrically coupled to the sixth end of the third helical trace; and
forming the multi-layer inductor in cooperation with the first helical trace, the second helical trace, and the third helical trace; and
wherein the controller drives the oscillating voltage across the first end of the first helical trace and the eighth end of the fourth helical trace in response to the input on the touch sensor surface;
induce an alternating magnetic coupling between the first magnetic element and the second magnetic element and the multilayer inductor; and
vibrate the substrate and the cover layer relative to the first magnetic element and the second magnetic element;
configured system. As a system,
a substrate, a series of deflection spacers, an array of spring elements, a first magnetic element and a controller;
The substrate defines an integrated structure and includes a first layer and a bottom layer,
The first layer includes a first helical trace, the first helical trace comprising
wound in a first direction; and
defining a first end and a second end;
the bottom layer
arranged below the first layer; and
a second helical trace, the second helical trace comprising:
winding in a second direction opposite to the first direction;
defining a third end and a fourth end, the third end electrically coupled to the second end of the first helical trace; and
forming a multilayer inductor defining a primary axis in cooperation with the first helical trace;
each deflection spacer of the series of deflection spacers is arranged over an individual deflection spacer location, at a series of individual deflection spacer locations, on the bottom layer of the substrate;
The spring element array is
coupling the series of deflection spacers to a chassis of a computing device;
supporting the substrate on the chassis; and
configured to yield to vibration of the substrate.
The first magnetic element is
arranged on the chassis below the substrate;
define a first polarity facing the multilayer inductor; and
extends parallel to the primary axis of the multilayer inductor; and
wherein the controller drives an oscillating voltage across the multilayer inductor during a haptic feedback period in response to an input on a touch sensor surface arranged over the substrate;
induce an alternating magnetic coupling between the first magnetic element and the multilayer inductor; and
to oscillate the substrate relative to the series of spring elements and relative to the first magnetic element;
configured system. According to claim 18,
The substrate further comprises a bottom layer, the bottom layer comprising:
arranged above the first layer opposite the bottom layer; and
a third helical trace, the third helical trace comprising:
winding in the second direction;
defining a fifth end and a sixth end, the fifth end being electrically coupled to the first end of the first helical trace; and
Forming the multilayer inductor in cooperation with the first helical trace and the second helical trace,
system. According to claim 18,
said bottom layer further comprising a series of sensor traces arranged at said series of individual deflection spacer locations;
Further comprising a coupling plate, wherein the coupling plate
engages the chassis adjacent to the spring element array; and
to affect the capacitance values of the series of sensor traces in response to displacement of the substrate toward the coupling plate;
made up; and
The controller
read capacitance values from the series of sensor traces;
interpret the force magnitude of the input applied to the touch sensor surface based on the capacitance values read from the series of sensor traces; and
drive the oscillating voltage across the multilayer inductor during the haptic feedback period in response to the force magnitude of the input exceeding a threshold force;
The system, which is further configured. As a system,
a substrate, a cover layer, a first magnetic element, a second magnetic element and a controller;
the substrate defines an integrated structure and includes a top layer, a first layer and a second layer;
the uppermost layer contains an array of driving and sensing electrode pairs;
The first layer is
arranged below the uppermost layer; and
a first helical trace, the first helical trace comprising:
wound in a first direction; and
define a first end and a second end; and
the second layer is
arranged below the first layer opposite the uppermost layer; and
a second helical trace, the second helical trace comprising:
winding in a second direction opposite to the first direction;
defining a third end and a fourth end, the third end electrically coupled to the second end of the first helical trace; and
forming a multilayer inductor defining a primary axis and a secondary axis in cooperation with the first helical trace;
the cover layer is arranged over the top layer and defines a touch sensor surface;
The first magnetic element is
arranged under the substrate;
define a first polarity facing the multilayer inductor;
extends along the primary axis of the multilayer inductor; and
arranged on a first side of the primary axis of the multilayer inductor;
The second magnetic element is
arranged under the substrate adjacent to the first magnetic element;
define a second polarity, opposite the first polarity, facing the multilayer inductor;
extends along the primary axis of the multilayer inductor; and
arranged on a second side of the primary axis of the multilayer inductor;
The controller
read a series of electrical values from the series of drive and sense electrode pairs;
detect a first input on the touch sensor surface based on the series of electrical values;
in response to detecting the first input, driving an oscillating voltage across the multilayer inductor during a haptic feedback period;
induce alternating magnetic coupling between the first magnetic element and the second magnetic element and the multilayer inductor; and
vibrate the substrate and the cover layer relative to the first magnetic element and the second magnetic element;
configured system. According to claim 21,
the first helical trace defines a first planar coil that spirals inward in a clockwise direction within the first layer; and
The second helical trace spirals outward in a counter-clockwise direction within the second layer and defines a second planar coil that cooperates with the first helical trace to cause current to flow in a common direction about the center of the multilayer inductor. system to do. According to claim 21,
the first helical trace defines a first planar coil that spirals outward within the first layer from the first end to the second end ending at a periphery of the first helical trace;
The second helical trace extends within the second layer from the third end coupled to the second end proximate the periphery of the second helical trace to the fourth end proximate the center of the second helical trace. define a second planar coil helical inward to ;
The first layer further comprises a third helical trace defining a third planar coil, the third helical trace comprising:
a fifth end and a sixth end;
parallel to the first helical trace; and
spirals inwardly within the first layer from the fifth end to the sixth end, the sixth end being joined to the first end of the first helical trace and proximal to the center of the second helical trace; and the sixth end ends at the periphery of the first helical trace; and
wherein the controller drives the oscillating voltage across the fourth end of the second helical trace and the sixth end of the third helical trace during the haptic feedback period in response to detecting the first input. system. According to claim 21,
The first layer further comprises a third helical trace, the third helical trace comprising:
adjacent to the first helical trace;
winding in the second direction; and
defining a fifth end and a sixth end, the fifth end being electrically coupled to the first end of the first helical trace;
The second layer further comprises a fourth helical trace, the fourth helical trace comprising:
adjacent to the second helical trace;
winding in the first direction;
defining a seventh end and an eighth end, the seventh end electrically coupled to the sixth end of the third helical trace; and
forming the multi-layered contact area in cooperation with the first helical trace, the second helical trace, and the third helical trace; and
wherein the controller, in response to detecting the first input, drives the oscillating voltage across the fourth end of the second helical trace and the eighth end of the fourth helical trace;
induce an alternating magnetic coupling between the first magnetic element and the second magnetic element and the multilayer inductor; and
vibrate the cover layer and the substrate relative to the first magnetic element and the second magnetic element;
configured system. According to claim 24,
the first magnetic element is arranged below the first helical trace and the second helical trace;
the second magnetic element is arranged below the third helical trace and the fourth helical trace; and
The controller, in response to detecting the first input, controls the control of the fourth end of the second helical trace and the fourth helical trace to vibrate the cover layer and the substrate perpendicular to the touch sensor surface. and drive the oscillating voltage across the eighth end. According to claim 24,
the first magnetic element is arranged below the first helical trace and the second helical trace;
the second magnetic element is arranged below the third helical trace and the fourth helical trace;
further comprising a third magnetic element and a second magnetic element;
The third magnetic element is
arranged under the first helical trace and the second helical trace adjacent to the first magnetic element; and
define the second polarity facing the multilayer inductor; and
The second magnetic element is
arranged below the third helical trace and the fourth helical trace adjacent to the second magnetic element; and
define the first polarity facing the multilayer inductor; and
wherein the controller, in response to detecting the first input, drives the oscillating voltage across the fourth end of the second helical trace and the eighth end of the fourth helical trace;
induce an alternating magnetic coupling between the first helical trace, the second helical trace, the first magnetic element and the third helical trace;
induce an alternating magnetic coupling between the third helical trace, the fourth helical trace, the third magnetic element and the fourth helical trace; and
to vibrate the cover layer and the substrate parallel to the touch sensor surface;
configured system. According to claim 21,
the substrate further comprises a third layer and a bottom layer;
The third layer is
arranged under the second layer opposite the first layer; and
a third helical trace, the third helical trace comprising:
winding in the first direction; and
defining a fifth end and a sixth end, the fifth end being electrically coupled to the fourth end of the second helical trace;
the bottom layer
arranged below the third layer opposite the second layer; and
a fourth helical trace, the fourth helical trace comprising:
winding in the second direction;
defining a seventh end and an eighth end, the seventh end electrically coupled to the sixth end of the third helical trace; and
cooperate with the first helical trace, the second helical trace, and the third helical trace to form the multilayer inductor; and
wherein the controller, in response to detecting the first input, drives the oscillating voltage across the first end of the first helical trace and the eighth end of the fourth helical trace;
induce an alternating magnetic coupling between the first magnetic element and the second magnetic element and the multilayer inductor; and
vibrate the substrate and the cover layer relative to the first magnetic element and the second magnetic element;
configured system. According to claim 21,
The first helical trace is
a first length along the primary axis; and
a first width, less than the first length, along the secondary axis;
define,
The first magnetic element is
a second length comparable to the first length and parallel and offset from the primary axis; and
a second width substantially half of the first width and parallel to the secondary axis;
define, and
wherein the controller is configured to, in response to detecting the first input, drive the oscillating voltage across the multilayer inductor to oscillate the cover layer and the substrate perpendicular to the touch sensor surface. According to claim 21,
Further comprising a force sensing layer, the force sensing layer comprising:
interposed between the cover layer and the uppermost layer of the substrate;
exhibit a local change in contact resistance across the series of drive and sense electrode pairs in response to a local application of force on the touch sensor surface; and
The controller
read the series of electrical values from the series of drive and sense electrode pairs, representative of electrical resistance across the drive and sense electrode pairs;
at the first location on the touch sensor surface based on a deviation of the subset of electrical values of the series of electrical values from a baseline electrical value across a subset of drive and sense electrode pairs proximate the first location; detect the first input;
interpreting the force magnitude of the first input based on the magnitude of the deviation; and
drive the oscillating voltage across the multilayer inductor during the haptic feedback period in response to the force magnitude of the first input exceeding a threshold input force;
configured system. According to claim 21,
The controller
read the series of electrical values from the series of drive and sense electrode pairs, indicative of capacitive coupling between the drive and sense electrode pairs; and
at the first location on the touch sensor surface based on a deviation of the subset of electrical values of the series of electrical values from a baseline capacitance value across a subset of drive and sense electrode pairs proximate to the first location; to detect the first input;
consists of, and
further comprising an intermediate layer, wherein the intermediate layer comprises
inserted between the uppermost layer and the first layer; and
a continuous trace area defining an electrical shield configured to shield the series of drive and sense electrode pairs from electrical noise generated by the multilayer inductor when driven with an oscillating voltage by the controller;
system. According to claim 21,
the uppermost layer includes the array of drive and sense electrode pairs arranged in a grid array at a first density;
The substrate further comprises a bottom layer, the bottom layer comprising:
arranged below the second layer opposite the uppermost layer; and
a second series of sensor traces disposed proximately around the substrate at a second density less than the first density;
a series of deflection spacers supporting the substrate on a chassis of the device and coupled to the second series of sensor traces; and
The controller
read the series of electrical values from the series of drive and sense electrode pairs, indicative of capacitive coupling between the drive and sense electrode pairs;
at the first location on the touch sensor surface based on a deviation of the subset of electrical values of the series of electrical values from a baseline capacitance value across a subset of drive and sense electrode pairs proximate to the first location; detect the first input;
read a second series of electrical values from the second series of sensor traces, indicative of compression of the series of deflection spacers relative to the second series of sensor traces;
interpret a force magnitude of the first input based on the second series of electrical values; and
drive the oscillating voltage across the multilayer inductor during the haptic feedback period in response to the force magnitude of the first input exceeding a threshold input force;
configured system. According to claim 31,
the first layer of the substrate further comprises a shield electrode trace adjacent and offset from the first helical trace; and
The controller sets the shielding electrode trace and the first helical trace as a reference potential to shield the second series of sensor traces from electrical noise when reading the second series of electrical values from the second series of sensor traces. driving system. According to claim 31,
In the series of deflection spacers, each deflection spacer includes a force sensing layer, the force sensing layer comprising:
arranged across sensor traces of the second series of sensor traces; and
exhibit a change in contact resistance across the sensor trace in response to a load on the touch sensor surface compressing the deflection spacer against the substrate; and
The controller
read the second series of electrical values, including electrical resistance, from the second series of sensor traces;
interpret the force magnitude of the first input based on a magnitude of deviation of a resistance value, at the second series of electrical values, from a baseline electrical value across the second series of sensor traces;
configured system. 22. The method of claim 21, wherein the controller
read electrical values from the series of drive and sense electrode pairs at a scan frequency during a first period;
In response to detecting the first input based on the series of electrical values read from the drive and sense electrode pair during the first period, the entire multilayer inductor during the haptic feedback period after the first period drive the oscillating voltage across;
pause reading electrical values from the series of drive and sense electrode pairs during the haptic feedback period; and
to resume reading electrical values from the series of drive and sense electrode pairs after completion of the haptic feedback period;
configured system. 22. The method of claim 21, wherein the controller
read electrical values from the series of drive and sense electrode pairs at a scan frequency during a first period;
In response to detecting the first input based on the series of electrical values read from the drive and sense electrode pair during the first period, the entire multilayer inductor during the haptic feedback period after the first period driving the oscillating voltage at a feedback frequency less than the scan frequency over
intermittently read electrical values from the series of drive and sense electrodes at the scan frequency between voltage reversals across the multilayer inductor at the feedback frequency during the haptic feedback period; and
to read electrical values from the series of drive and sense electrode pairs at the scan frequency after completion of the haptic feedback period;
system to be configured. According to claim 21,
the first magnetic element and the second magnetic element are arranged in a cavity within a chassis of a device; and
further comprising a series of spring elements, said series of spring elements comprising:
support the substrate within the cavity with the multilayer inductor disposed over the first magnetic element and the second magnetic element;
deflecting the substrate within the cavity to place the multilayer inductor at a nominal offset distance above the first magnetic element and the second magnetic element; and
by compressing in response to application of the first input on the touch sensor surface;
disposing the multilayer inductor at a second offset distance above the first magnetic element and the second magnetic element, less than the nominal offset distance; and
increase magnetic coupling between the multilayer inductor, the first magnetic element, and the second magnetic element during the haptic feedback period;
configured system. 37. The method of claim 36, wherein the series of spring elements
deflecting the substrate within the cavity to place the multilayer inductor at the nominal offset distance, between 400 μm and 600 μm, above the first magnetic element and the second magnetic element; and
Systems that cooperate to create a spring constant of 800 g/mm to 1200 g/mm across the touch sensor surface. As a system,
a substrate, a series of deflection spacers, a cover layer, a first magnetic element and a controller;
The substrate defines an integrated structure and includes a first layer, a second layer and a bottom layer,
The first layer includes a first helical trace, the first helical trace comprising
wound in a first direction; and
defining a first end and a second end;
the second layer is
arranged below the first layer; and
a second helical trace, the second helical trace comprising:
winding in a second direction opposite to the first direction;
defining a third end and a fourth end, the third end electrically coupled to the second end of the first helical trace; and
forming a multilayer inductor defining a primary axis in cooperation with the first helical trace;
the bottom layer
arranged under the second layer opposite the first layer; and
a series of sensor traces disposed proximate the periphery of the substrate;
the series of deflecting spacers is coupled to the second series of sensor traces and supports the substrate on a chassis of a device;
the cover layer defines a touch sensor surface and is arranged on the substrate opposite the series of deflection spacers;
The first magnetic element is
arranged on the chassis below the substrate;
define a first polarity facing the multilayer inductor; and
extends parallel to the primary axis of the multilayer inductor; and
The controller
read a series of electrical values from the series of sensor traces;
interpret the force magnitude of the first input on the touch sensor surface based on the series of electrical values; and
in response to detecting the force magnitude exceeding a threshold force, driving an oscillating voltage across the multilayer inductor during a haptic feedback period;
induce an alternating magnetic coupling between the multilayer inductor and the first magnetic element;
vibrate the cover layer and the substrate relative to the first magnetic element;
configured system. 39. The method of claim 38,
The first helical trace is
defining the first end proximal to the circumference of the first helical trace; and
defining the second end proximal to the center of the first helical trace;
The second helical trace is
defining the third end proximal to the center of the second helical trace; and
defining the fourth end proximal to the circumference of the second helical trace; and
wherein the third end of the second helical trace is coupled to the second end of the first helical trace by a via through the first layer of the substrate. As a system,
a substrate, a cover layer, a first magnetic element and a controller;
The substrate includes a first layer, a second layer, and a sensor layer,
the first layer includes a first helical trace wound in a first direction;
the second layer is
arranged below the first layer; and
a second helical trace, the second helical trace comprising:
winding in a second direction opposite to the first direction;
coupled to the first helical trace by a via between the first layer and the second layer; and
forming a multi-layer inductor in cooperation with the first helical trace; and
the sensor layer includes an array of driving and sensing electrode pairs;
the cover layer is arranged over the substrate and defines a touch sensor surface;
the first magnetic element is arranged below the substrate and defines a first polarity facing the multilayer inductor;
The controller
read a series of electrical values from the series of drive and sense electrode pairs;
detect a first input on the touch sensor surface based on the series of electrical values; and
In response to detecting the first input, driving an oscillating voltage across the multilayer inductor,
induce an alternating magnetic coupling between the multilayer inductor and the first magnetic element; and
vibrate the cover layer and the substrate relative to the first magnetic element;
configured system.

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