KR20230010551A - Led module - Google Patents

Abstract

The present invention relates to an LED module. The LED module includes: a light emitting part; a substrate part electrically connected to the light emitting part in a front region; and a heat dissipation part disposed below the light emitting part and the substrate part. The heat dissipation part includes: the body of a heat dissipation part having an upper surface for seating the substrate and the protrusion of the heat dissipating part protruding upward from the body. The protrusion may be provided to face the front region of the substrate part.

Description

LED module {LED MODULE}

The present invention relates to an LED module.

LED modules are used in various fields such as vehicle lamps. Among LED modules, conventionally used SMD type LED modules have a problem in that heat dissipation efficiency is relatively low because heat generated from LEDs is transferred to the air through a PCB substrate and heat dissipation components. The low heat dissipation efficiency may lead to an increase in the amount of heat generated by the LED, which may cause deformation and chromaticity problems of optical components.

Accordingly, recently, a top electrode LED module is mainly used. The phase electrode LED module directly attaches the phase electrode LED to the heat dissipation component (H/Sink, H/Plate, etc.) to increase heat dissipation efficiency, and supplies power to the LED board through a wire connecting a separate PCB board and the upper electrode part of the LED. structure that conveys

In the case of the upper electrode LED module, the heat dissipation efficiency is significantly increased compared to the existing SMD type LED module, but when the heat dissipation part is in the form of a plate (H/Plate), the shape and size are secured to meet the required heat dissipation area, and the assembly of peripheral devices is restricted. I had a problem with this. Therefore, a structure capable of further securing heat dissipation efficiency is required.

In addition, since a separate wire for supplying current is structurally exposed to the outside as it is, and a PCB substrate for wires, connectors, and other elements is separately required, there is a problem in that an assembly structure for this is required.

An object of the present invention is to provide an LED module capable of increasing heat dissipation performance and reducing size and weight.

In addition, an object of the present invention is to provide an LED module that is easy to assemble and does not require a separate structure for assembly.

In addition, an object of the present invention is to provide an LED module capable of protecting a wire for supplying current.

In one example, the LED module includes a light emitting part, a substrate part electrically connected to the light emitting part in a front area, and a heat radiating part disposed below the light emitting part and the substrate part, wherein the heat radiating part is installed on the upper surface of the substrate part. The heat dissipation unit may include a body of the heat dissipation unit and protrusions of the dissipation unit protruding upward from the body of the dissipation unit, and the protrusions of the dissipation unit may be provided to face a front area of the substrate unit.

In another example, the heat dissipation part protrusions may be provided as a pair, and the substrate part may be disposed between the pair of heat dissipation part protrusions.

In another example, the substrate unit may include a first substrate area electrically connected to the light emitting unit and extending backward, and a second substrate area integrally formed with the first substrate area and protruding left and right from the first substrate area. The substrate area may include a substrate area, the first substrate area may be disposed on the pair of heat dissipation unit protrusions, and the second substrate area may be disposed behind the pair of heat dissipation unit protrusions.

In another example, the substrate unit may further include a third substrate area that protrudes to the left and right from the first substrate area and is spaced apart from the second substrate area to the rear.

In another example, the third substrate area may include a rearward protruding area compared to the first substrate area when viewed from above.

In another example, the LED module may further include a wire part electrically connecting the light emitting part and the board part, and an upper end of the heat dissipation part protrusion may be provided higher than an upper end of the wire part.

In another example, when an imaginary surface simultaneously in contact with the front end of the heat dissipation part and the protrusion of the heat dissipation part is referred to as a first reference plane, the wire part may be spaced downward from the first reference plane.

In another example, the LED module further includes an extension portion further including a rear extension region extending upward from a rear end of the heat dissipation portion and having a vertical length longer than a vertical length of the heat dissipation portion protrusion, wherein the rear extension portion includes: When an imaginary plane simultaneously contacting the upper end of the region and the protrusion of the heat dissipation part is referred to as a second reference plane, the wire portion may be spaced downward from the second reference plane.

In another example, the wire portion may have an upwardly convex shape.

In another example, the LED module may further include a seating portion disposed between the light emitting portion and the heat dissipating portion.

In another example, the thickness of the substrate part in the vertical direction may correspond to the sum of thicknesses of the light emitting part and the seating part in the vertical direction.

In another example, when viewed from the top, an area of the seating portion may be larger than an area of the light emitting portion.

According to the present invention, it is possible to protect the wire for supplying current through the heat dissipation protrusion protruding upward from the heat dissipation unit, so that the lifespan of the LED module can be increased.

In addition, according to the present invention, the surface area of the heat dissipation unit is increased, the heat dissipation performance is increased, and accordingly, the size and weight of the heat dissipation unit can be reduced.

In addition, according to the present invention, since a structure for assembling the heat dissipation unit and the substrate unit is formed in the heat dissipation unit, assembly is simple and a separate structure for assembly is not required, so productivity can be increased.

In addition, according to the present invention, since the substrate unit can be attached to the heat dissipation unit, assembly is simple, and productivity can be increased because a separate structure for assembly is not required.

In addition, according to the present invention, the exterior of the heat dissipation unit is surface-treated to increase heat dissipation performance, and accordingly, the size and weight of the heat dissipation unit can be reduced.

1 is a perspective view showing an LED module according to a first embodiment of the present invention.
FIG. 2 is an enlarged view of FIG. 1 .
Figure 3 is a top view of Figure 1;
Figure 4 is a bottom view of Figure 1;
Figure 5 is a side view of Figure 1;
Figure 6 is a rear view of Figure 1;
7 is a perspective view showing an LED module according to a second embodiment of the present invention.
8 is a perspective view showing an LED module according to a third embodiment of the present invention.
9 is a table comparing required heat dissipation area and heat dissipation part weight when surface treatment is not applied and when anodizing is performed.

Hereinafter, some embodiments of the present invention will be described in detail through exemplary drawings. In adding reference numerals to components of each drawing, the same components are to have the same numerals as much as possible even if they are displayed in different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment of the present invention, the detailed description thereof will be omitted.

Basic components of the LED module according to Example 1

The LED module according to the first embodiment of the present invention relates to a top electrode LED module. 1 is a perspective view showing an LED module according to a first embodiment of the present invention. FIG. 2 is an enlarged view of FIG. 1 . Figure 3 is a top view of Figure 1; Figure 4 is a bottom view of Figure 1; Figure 5 is a side view of Figure 1; Figure 6 is a rear view of Figure 1;

<Light emitting part 100, substrate part 200, heat dissipation part 300>

As shown in FIG. 1 , the LED module according to the first embodiment of the present invention may include a light emitting part 100 , a substrate part 200 and a heat radiation part 300 . The light emitting unit 100 may be an LED. The light emitting unit 100 may include an electrode 101 for electrical connection with an external component. The substrate unit 200 may be electrically connected to the light emitting unit 100 . For example, the board unit 200 may be a FR-4 PCB. The board unit 200 may include an electrode terminal 201 provided to be electrically connected to the electrode 101 and a connector terminal 202 provided to be connected to a connector. The heat dissipation unit 300 may be disposed below the light emitting unit 100 and the substrate unit 200 . The heat dissipation unit 300 may dissipate heat generated from the substrate unit 200 . The heat dissipation unit 300 may be disposed in close contact with the light emitting unit 100 and the substrate unit 200 .

<Specific shape of heat dissipation unit 300>

As shown in FIG. 1 , the heat dissipation part 300 may include a heat dissipation part body 310 and a heat dissipation part protrusion 320 . The heat dissipation unit body 310 may be provided so that the substrate unit 200 and the light emitting unit 100 are seated on the upper surface. The heat dissipation unit protrusion 320 may protrude upward from the heat dissipation unit body 310 . The heat dissipation unit protrusion 320 may be provided to face the front area of the substrate unit 200 .

As shown in FIG. 1 , the heat dissipation part protrusions 320 are provided as a pair, and the substrate part 200 may be disposed between the pair of heat dissipation part protrusions 320 . In order to explain the arrangement in more detail, the shape of the substrate unit 200 will be described in detail.

<Shape of Substrate Part 200>

As shown in FIG. 1 , the substrate portion 200 may include a first substrate area 220 and a second substrate area 230 . The first substrate region 220 is electrically connected to the light emitting unit 100 and may extend backward. The second substrate area 230 is integrally formed with the first substrate area 220 and may protrude left and right from the first substrate area 220 . As shown in FIG. 1 , the first substrate area 220 is disposed between the pair of heat dissipation protrusions 320, and the second substrate area 230 is disposed behind the pair of heat dissipation protrusions 320. can be placed. Meanwhile, a region of the substrate 200 facing the heat dissipation protrusion 320 may have a shape corresponding to the heat dissipation protrusion 320 and may have a shape recessed inward.

Also, the substrate portion 200 may include a third substrate area. The third substrate area protrudes to the left and right from the first substrate area 220 and may be spaced apart from the second substrate area 230 backward. When viewed from the top, the third substrate area may include a rearward protruding area compared to the first substrate area 220 .

<The role of the protrusion 320 of the heat dissipation part-Protection of the wire part 500>

As shown in FIG. 1 , the LED module according to the first embodiment of the present invention may further include a wire unit 500 . The wire unit 500 may electrically connect the substrate unit 200 and the light emitting unit 100 . One side of the wire unit 500 may be fixed to the electrode 101 and the other side of the wire unit 500 may be fixed to the electrode terminal 201 . The wire unit 500 may have an upwardly convex shape.

The heat dissipation unit protrusion 320 may serve to protect the wire unit 500 . As the protrusion 320 of the heat dissipation part protects the electric wire part 500, the possibility of occurrence of problems such as disconnection is reduced, and the lifespan of the LED module can be increased.

This will be described in detail with reference to FIG. 5 . As shown in FIG. 5 , the upper end of the heat dissipation part protrusion 320 may be provided higher than the upper end of the wire part 500 . As the upper end of the heat radiation protrusion 320 is higher than the upper end of the wire part 500, objects approaching from the upper side of the wire part 500 are prevented from touching the wire part 500, thereby protecting the wire part 500. can do.

Also, the wire unit 500 may be spaced downward from the first reference plane S1. The first reference plane S1 may be an imaginary surface that simultaneously contacts the front end of the heat dissipation part 300 and the protrusion 320 of the heat dissipation part.

Also, the wire unit 500 may be spaced downward from the second reference plane S2. The second reference surface S2 may be an imaginary surface that simultaneously contacts the upper end of the rear extension region 632 and the protrusion 320 of the heat dissipation part, which will be described later. Through this, it is possible to protect the wire part 500 by preventing objects approaching the wire part 500 from touching the wire part 500 .

<Fastening part 400>

As shown in FIG. 1 , the LED module according to the first embodiment of the present invention may include a fastening part 400 . The fastening part 400 may fasten the heat dissipating part 300 and the substrate part 200 . In detail, the substrate part 200 may include a through hole 210 through which the fastening part 400 passes.

As shown in FIGS. 5 and 6 , the fastening part 400 may include a fastening part body 410 and a fastening part head 420 . The fastening part body 410 may pass through the through hole 210 and be connected to the heat dissipation part 300 . The through hole 210 may be a hole provided in the substrate 200 through which the fastening part body 410 passes.

The fastening part head 420 is connected to the upper side of the fastening part body 410, is located on the upper side of the substrate part 200, and may have a larger diameter than the diameter of the through hole 210. Also, the diameter of the fastening part head 420 may be larger than the diameter of the fastening part body 410 . As the coupling head 420 has a larger diameter than the through hole 210 , the substrate 200 can be constrained between the coupling head 420 and the heat dissipation unit 300 .

The fastening part 400 may be integrally formed with respect to the heat dissipation part 300 . For example, the fastening part 400 may be produced by extrusion molding together with the heat dissipating part 300 . Alternatively, the fastening part 400 may be produced by injection molding together with the heat dissipating part 300 . As the fastening part 400 is integrally formed with the heat dissipating part 300, a separate component (for example, a rivet) for fastening the heat dissipating part 300 and the substrate part 200 is not required, and productivity is improved. It can be expanded, and there is an effect that the cost can be reduced.

<Method of manufacturing LED module according to Example 1>

Hereinafter, the manufacturing method of the LED module according to the first embodiment will be described in detail. Details to be described below may be understood as a method of fastening the substrate unit 200 to the heat dissipation unit 300 . The manufacturing method of the LED module according to Example 1 may include a disposing step and a processing step.

The arranging step is to position the board unit 200 above the heat dissipation unit 300 and pass the fastening unit 400 integrally formed with the heat dissipation unit 300 through the through hole 210 of the substrate unit 200. may be a step. In this case, the diameter of the coupling head 420 may correspond to or be smaller than the diameter of the through hole 210 .

The processing step may be a step of compressing the fastening part 400 to form the fastening part head 420 formed on the upper side of the through hole 210 and having a larger diameter than the through hole 210 . As an example, the processing step may include caulking. Or in another example, the machining step may include driving.

As described in the foregoing, in the manufacturing method of the LED module according to the first embodiment, the shape of the coupling head 420 may be changed. Before the LED module is manufactured and before the fastening part head 420 is pressed, the diameter of the fastening part head 420 may correspond to or be smaller than the diameter of the through hole 210, and the fastening part body 410 may have a through hole ( 210 ), as the coupling head 420 is pressed, the diameter of the coupling head 420 may be greater than the diameter of the through hole 210 .

As shown in FIG. 3 , the through hole 210 may include a first through hole 211 and a second through hole 212 . The second through hole 212 may be disposed rearwardly spaced from the first through hole 211 . The fastening part 400 may include a first fastening part 401 and a second fastening part 402 . The first fastening part 401 may pass through the first through hole 211 . The second fastening part 402 may pass through the second through hole 212 .

<Extension 600>

As shown in FIG. 1 , the LED module according to the first embodiment of the present invention may include an extension part 600 . The extension part 600 may extend downward or upward from an end of the heat dissipation part 300 . The extension part 600 may be integrally formed with the heat dissipation part 300 . Since the surface area of the LED module according to the first embodiment of the present invention is increased by having the extension part 600, there is an effect that the heat dissipation area can be further secured. Hereinafter, the extension part 600 will be described in detail.

The extension part 600 may include a front bending area 611 and a front extension area 612 . The front bending region 611 may be a region that is bent downward from the front end of the heat dissipation part 300 and extends. The front bending area 611 may be spaced apart in the left and right directions with the protrusion area 311 interposed therebetween. The protrusion area 311 may be an area protruding from a portion of the front end of the heat dissipation unit body 310 .

The front extension region 612 may be a region extending downward from the lower end of the front bending region 611 . In addition, the width of the front extension region 612 may be longer than that of the heat dissipation body 310 .

In addition, the extension part 600 may include a first side bending region 621 and a first side extension region 622 . The first side bending region 621 may be bent and extended downward from at least one end of the left or right side of the heat dissipation unit 300 . 1 shows a state in which the first side bending region 621 extends from both the left and right sides of the heat dissipation unit 300 .

The first side extension area 622 may extend downward from the lower end of the first side bending area 621 . Lengths of the front bending area 611 and the first side bending area 621 in the vertical direction may correspond to each other. In addition, lengths of the front extension region 612 and the first side extension region 622 along the vertical direction may correspond to each other.

The extension part 600 may include a second side bending region 623 and a second side extension region 624 . The second side bending region 623 may extend while being bent inward from the lower end of the first side extension region 622 . Here, the inner side may mean the left side when extending from the right end of the heat dissipating unit body 310, and the right side when extending from the left end. An overall shape connecting the first side bending region 621 , the first side extension region 622 , and the second side bending region 623 may have a shape similar to that of a C-shape or U-shape.

The second side extension region 624 may extend inwardly from an inner end of the second side bending region 623 . The width of the second side extension region 624 may be shorter than half of the width of the heat dissipation part 300 .

The first side bending area 621 may include a 1-1 side bending area 621a and a 1-2 side bending area 621b. The 1-1 side bending area 621a may be an area disposed adjacent to the front end of the heat dissipation unit 300 . The 1-2nd side bending area 621b may be a region spaced apart from the 1-1st side bending area 621a.

The 1-1 side bending area 621a may be connected to the 1-1 side bending area, the 2-1 side bending area, and the 2-1 side extending area, and the 1-2 side bending area 621b may be It may be connected to the 1-2 side extension area, the 2-2 side bending area, and the 2-2 side extension area. Detailed descriptions thereof are omitted since they correspond to descriptions of the first side extension region 622 , the second side bending region 623 , and the second side extension region 624 .

The extension part 600 may include a rear bending area 631 and a rear extension area 632 . The rear bending region 631 may be bent and extended upward from the rear end of the heat dissipation unit 300 . As shown in FIG. 1 , the rear bending area 631 may protrude in the left and right directions compared to the substrate portion 200 . The rear extension region 632 may extend upward from an upper end of the rear bending region 631 .

<Seat part 700>

As shown in FIG. 1 , the LED module according to the first embodiment of the present invention may further include a seating portion 700 . The seating part 700 may be disposed between the light emitting part 100 and the heat dissipating part 300 . As shown in FIG. 3 , when viewed from the top, the area of the seating portion 700 may be greater than that of the light emitting portion 100 . As shown in FIG. 5 , the vertical thickness of the substrate part 200 may correspond to the sum of the thicknesses of the light emitting part 100 and the mounting part 700 in the vertical direction.

LED module according to Example 2

7 is a perspective view showing an LED module according to a second embodiment of the present invention. Hereinafter, the LED module of the second embodiment of the present invention will be described with reference to FIGS. 7 and 1 to 6 .

The LED module according to the second embodiment of the present invention is different from the LED module according to the first embodiment in the type of the substrate part 200' and the method of coupling the heat dissipation part and the substrate part. In addition, as a result, there is a difference from the LED module according to the first embodiment in the presence or absence of the fastening part and the presence or absence of the seating part. The same or equivalent reference numerals are assigned to components identical to or equivalent to those of the LED module according to Example 1, and detailed descriptions are omitted.

The LED module according to the second embodiment of the present invention may include a light emitting part 100, a substrate part 200', and a heat radiation part 300. The board unit 200' may be a flexible printed circuit board (PCB). In the case of the LED module according to the second embodiment of the present invention, as the flexible printed circuit board is used, the thickness of the board portion 200 'has a thin thickness (0.1T to 0.2T) compared to the thickness of a general FR-4 PCB. As a result, thermal conductivity is increased and heat dissipation performance can be secured.

More specifically, the flexible printed circuit board uses Flexible Copper Clad Laminate (FCCL) as a main material, and is a combination of an insulating film, a conductor, and a protective film. In other words, it may have a thin thickness of 0.1T to 0.2T because it is in the form of putting a copper foil layer for a circuit pattern/element mounting part on a material such as a thin film.

For example, the flexible printed circuit board may be coupled to the base plate. The base plate may be coupled to the flexible printed circuit board to prevent burnout of the device. In addition, as the base plate is coupled to the flexible printed circuit board, the flat state of the flexible printed circuit board can be well maintained, and heat dissipation performance can be further secured.

The heat dissipation unit 300 may be attached to the lower side of the substrate unit 200'. For example, the substrate part 200 ′ may be attached to the upper side of the heat dissipation part 300 through a thermal curing process. As another example, the substrate unit 200 ′ may be attached to the upper side of the heat dissipation unit 300 through a pressure-sensitive attachment method.

According to the LED module according to the second embodiment of the present invention, as the substrate part 200' is attached to the heat dissipation part 300, the assembly process for fastening the substrate part 200' and the heat dissipation part 300 is eliminated. This can increase productivity.

As shown in FIG. 7 , the second substrate area 230 ′ may overlap an inner portion of the pair of heat dissipation unit protrusions 320 . In addition, the thickness of the substrate portion 200 ′ in the vertical direction may be smaller than the thickness of the light emitting unit 100 in the vertical direction.

<Method of manufacturing LED module according to Example 2>

Hereinafter, the manufacturing method of the LED module according to the second embodiment of the present invention will be described in detail. Details to be described below may be understood as a method of attaching the substrate part 200' to the heat dissipation part 300. The manufacturing method of the LED module according to Example 2 may include an attaching step of attaching the substrate part 200 ′ to the upper side of the heat dissipation part 300 . The attaching step may be a step of attaching the substrate part 200 ′ to the upper side of the heat dissipating part 300 through a thermal curing process. As another example, the attaching step may be a step of attaching the substrate part to the upper side of the heat dissipating part 300 through a pressure-sensitive attaching method.

The thermal curing treatment step may be a step of attaching the substrate portion 200 ′ to the upper side of the heat dissipating portion 300 through a thermal curing treatment using a thermal curable tape. After the thermal curing process, OSP surface treatment, device mounting process through SMT reflow process, etc. may be performed.

The pressure-sensitive attachment method may be a step of attaching the substrate part 200' to the upper side of the heat radiation part 300 using a general pressure-sensitive double-sided adhesive tape.

According to the manufacturing method of the LED module according to the second embodiment of the present invention, due to the thin thickness of the substrate portion 200 ', instead of a separate complicated fastening process, the substrate portion 200 through a heat curing treatment or a pressure-sensitive attachment method. can be directly attached to the heat dissipation unit 300, thereby improving the efficiency of the process.

LED module according to Example 3

8 is a perspective view showing an LED module according to a third embodiment of the present invention. 9 is a table comparing required heat dissipation area and heat dissipation part weight when surface treatment is not applied and when anodizing is performed. Hereinafter, the LED module of the third embodiment of the present invention will be described with reference to FIGS. 8 to 9 and 1 to 6 .

The LED module according to the third embodiment of the present invention is different from the LED module according to the first embodiment in surface treatment of the heat dissipation unit 300'. The same or equivalent reference numerals are assigned to components identical to or equivalent to those of the LED module according to Example 1, and detailed descriptions are omitted.

Surface treatment may be applied to the heat dissipation unit 300' of the LED module according to the third embodiment of the present invention. The surface treatment of the heat dissipation part 300' can be equally applied to the fastening part 400', the extension part 600', and the mounting part 700' which can be integrally formed with the heat dissipation part 300'. .

For example, the surface treatment may be anodizing. As another example, the surface treatment may be thermal coating. 9 is a table comparing required heat dissipation area and heat dissipation part weight when surface treatment is not applied and when anodizing is performed.

As shown in FIG. 9 , as the heat dissipation unit is subjected to surface treatment, the heat dissipation efficiency is increased and the required heat dissipation area is reduced by 30% or more. As the required heat dissipation area is minimized, the overall size of the LED module can be minimized, and there is an effect of reducing weight by more than 30%.

In addition, as heat dissipation performance is increased by surface treatment, a higher specification light emitting unit may be accommodated in a heat dissipating unit having the same shape. For example, a radiator used in a 2-chip light emitting part can be applied to a 3-chip light emitting part after surface treatment. As a result, there is no need to separately manufacture a mold according to the specifications of the light emitting unit, and thus the mold can be unified and a cost reduction effect can occur.

As another example, the outer surface of the heat dissipation unit 300' may be surface-treated in black. As another example, the outer surface of the heat dissipation unit 300 ′ may be surface-treated to be matte.

In the case of a general LED module, if the LED position and its surrounding area become a vulnerable part depending on the angle of sunlight irradiation, damage and durability such as deformation and discoloration due to condensed light and heat of the LED module and its surrounding fixtures (due to reflection) degradation may occur. The LED module according to the third embodiment of the present invention can prevent damage such as deformation and discoloration and deterioration in durability by adjusting the surface color and reflectivity.

The above description is merely an example of the technical idea of the present invention, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: light emitting part
101: electrode
200, 200': board part
201: electrode terminal
202: connector terminal
210: through hole
211: first through hole
212: second through hole
220: first substrate area
230, 230': second substrate area
300, 300': heat sink
310: heat sink body
311: projection area
320: protrusion of heat sink
400, 400': fastening part
401: first fastening part
402: second fastening part
410: fastening body
420: joint head
500: wire part
600, 600': extension
611: front bending area
612: front extension area
621: first side bending area
621a: 1-1 side bending area
621b: first-second side bending area
622: first side extension area
623: second side bending area
624: second side extension area
631: rear bending area
632: rear extension area
700, 700': seating part
S1: first reference plane
S2: second reference plane

Claims (12)

light emitting part;
a substrate portion electrically connected to the light emitting portion in a front area;
A heat dissipation part disposed below the light emitting part and the substrate part,
the heat sink,
a heat dissipation unit body provided to seat the substrate unit on an upper surface; and
A heat radiating part protrusion protruding upward from the heat radiating part body,
The heat dissipation unit protrusion is provided to face the front area of the substrate unit, the LED module. The method of claim 1,
The heat dissipation unit protrusions are provided in pairs,
The board part,
Disposed between the pair of heat dissipation protrusions, the LED module. The method of claim 2,
The board part,
a first substrate region electrically connected to the light emitting unit and extending backward; and
A second substrate area formed integrally with the first substrate area and protruding left and right from the first substrate area;
The first substrate region is disposed on the pair of heat dissipation unit protrusions;
The second substrate area is disposed behind the pair of heat dissipation unit protrusions. The method of claim 3,
The board part,
The LED module further comprises a third substrate area protruding to the left and right from the first substrate area and spaced apart from the second substrate area to the rear. The method of claim 4,
The third substrate area,
An LED module comprising an area protruding backward compared to the first substrate area when viewed from above. The method of claim 1,
Further comprising a wire portion electrically connecting the light emitting portion and the substrate portion,
The upper end of the protrusion of the heat dissipation part is provided higher than the upper end of the wire part, the LED module. The method of claim 6,
When the imaginary surface simultaneously contacting the front end of the heat dissipation part and the protrusion of the heat dissipation part is referred to as the first reference plane,
Wherein the wire portion is spaced downward from the first reference surface, the LED module. The method of claim 6,
An extension portion further comprising a rear extension region extending upward from a rear end of the heat dissipation portion and having a length in a vertical direction longer than a length in a vertical direction of the protrusion of the heat dissipation portion;
When an imaginary surface simultaneously in contact with the upper end of the rear extension region and the heat dissipation part protrusion is referred to as a second reference plane,
Wherein the wire portion is spaced downward from the second reference plane, the LED module. The method of claim 6,
The wire portion is convex upwardly, the LED module. The method of claim 1,
Further comprising a seating portion disposed between the light emitting portion and the heat dissipating portion, the LED module. The method of claim 10,
The thickness of the substrate portion in the vertical direction corresponds to the sum of the thicknesses of the light emitting portion and the mounting portion in the vertical direction, the LED module. The method of claim 10,
When viewed from above,
The area of the seating portion is larger than the area of the light emitting portion, the LED module.

Images