KR20230009792A - Gel pad - Google Patents

Abstract

One aspect of the present invention provides a gel pad as an adhesive means that is sandwiched between a device for forming a reactive gas atmosphere inside and a component provided at the inside of the device to make the component adhere to the inside of the device. The gel pad comprises: an outer pad attached to the outer peripheral surface of the component and having an inner hole including a screw hole through which a screw is fastened to the component; an inner pad attached while separated from the outer pad at the inside of the outer pad; and an inner slit separating the outer pad and the inner pad. The outer pad includes an air discharge passage that extends from the inner hole in the direction of the inner pad, connects the inner hole and the inner slit, and has a width narrower than the diameter of the inner hole. Excellent adhesion can be secured.

Description

Gel pad {Gel pad}

One aspect of the present invention relates to a gel pad for bonding an upper component and a lower component to each other, and more specifically, it can be used to bond a silicon ring to an electrostatic chuck (ESC) in a plasma etching device It's about gel pads.

A plasma etching method is widely used as a method of processing substrates such as semiconductor substrates used in IC manufacturing or glass panels used in flat panel display manufacturing. The plasma etching method is a method in which a target substrate is placed inside a plasma processing chamber, then plasma is generated therein, and etching is performed using the reactivity of the plasma at a desired location.

Inside the plasma processing chamber, a set of inlet gas ports are generally provided to facilitate introduction of a gaseous source material, eg, an etchant source gas, into the RF-induced plasma region between the dielectric window and the substrate. A substrate is guided into the chamber and placed on an electrostatic chuck to be secured. In general, an electrostatic chuck serves as a lower electrode for plasma generation, and is operably connected to a second RF power source together with a first RF power source provided thereon, and the second RF power source includes an RF generator and an RF matching network. It is done by

Meanwhile, a process source gas is introduced into the chamber through a set of inlet gas ports to create a plasma. Next, power is supplied to the induction coil using the first RF power source, and power is supplied to the electrostatic chuck using the second RF power source. RF energy supplied from the first RF power source coupled through the dielectric window excites the process source gas to generate plasma.

A technology in which a silicon ring is provided on the upper part of the electrostatic chuck of the plasma etching device has been used. In the plasma processing technology, a silicon ring (or focus ring) made of silicon or ceramic material helps to focus ions from plasma on the surface of the substrate. , for example, to improve the uniformity of the process. In addition, the silicon ring serves to protect a part of the electrostatic chuck from being damaged during the plasma etching process, thereby improving the lifespan of the device, thereby providing an effect of improving process efficiency.

Recently, a technique for forming a separate plasma along the outer circumferential surface of the electrostatic chuck has been studied in order to improve yield by controlling external etching of the silicon wafer, and at this time, an adhesive means may be considered to bond the electrostatic chuck and the silicon ring. . The adhesive means is provided in a circular shape along the portion where the silicone ring is located on the electrostatic chuck, and it is also possible that the adhesive means is positioned so as to include the portion where the coupling hole to which the screw is coupled is located. An arcing phenomenon in which an arc is generated due to accumulation of impurities or charges has been observed, and methods for solving this phenomenon are being studied.

Republic of Korea Patent No. 10-0993161

An object of the present invention is to prevent an arcing phenomenon in a screw coupling hole while bonding an electrostatic chuck (ESC) substrate and a coupling ring to a silicon ring, and to provide an electrostatic chuck and It is an object of the present invention to provide a gel pad capable of performing a role of excellent adhesion and heat transfer between silicone rings.

In addition, an object of the present invention is to block the inflow path of the plasma to prevent the plasma generated inside the plasma etching device from flowing into the coupling gap between the parts and etching the coupling screw 32 fastening the coupling ring with the silicon ring It is to provide a gel pad that can prevent etching, corrosion and deformation of the coupling screw 32 to increase the life of the coupling screw 32 and improve the work economy of the plasma etching device.

A preferred example of the present invention is an adhesive means for bonding the component to the inside of the device by being interposed between a component provided inside the device for forming a reactive gas atmosphere therein and the device,

a synthetic resin comprising a first silicone polymer including polysiloxane having at least two vinyl groups and a second silicone polymer including polysiloxane or organohydrogen polysiloxane having at least one Si-H bond; and

Dispersed in the synthetic resin, at least one ceramic selected from the group consisting of alumina (Al ₂ O ₃ ), boron nitride (BN, boron nitride), graphite, graphene, carbon nanotubes, charcoal, and silicon carbide (SiC) It is preferable that it is a gel pad containing; particles.

In addition, it is preferable to include a silane coupling agent for improving interfacial adhesion between the synthetic resin and the ceramic particles.

Also, the weight ratio of the first silicone polymer to the second silicone polymer is preferably 1:3 to 3:1.

Here, it is preferable that the ceramic particles are included in an amount of 60 to 93% by weight based on the total weight of the synthetic resin and the ceramic particles.

In addition, it is preferable that the thermal conductivity of the gel pad is 2.0 W/m·K or more.

In addition, the silane coupling agent,

trimethoxysilyl benzoic acid, γ methacryloxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ isocyanate propyl triethoxysilane, γ glycidoxy propyl trimethoxysilane, β epoxycyclohexyl ) Ethyltrimethoxysilane, vinylchlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane , 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropyltrie Toxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (Aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyltriethoxysilane , 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltri Methoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide and 3-isocyanatepropyltrie It is preferable that it is 1 type(s) or 2 or more types selected from the group which consists of toxysilanes.

In addition, the polysiloxane containing at least two or more vinyl groups preferably has a structure of any one of Formulas 1 to 3 below.

(Formula 1)

(Formula 2)

(Formula 3)

(Here, n and m are integers from 100 to 300, x, y and z are integers from 0 to 200, respectively, and x+y+z is from 100 to 400.)

In addition, the first silicone polymer and the second silicone polymer preferably have a weight average molecular weight of 100,000 to 120,000 g/mol.

In addition, the content of the vinyl group of the polysiloxane including at least two or more vinyl groups is preferably 0.01 to 0.1 mol%.

At this time, the ceramic particles,

It is also good to include at least two or more ceramic particles having different average particle diameters.

In addition, the ceramic particles,

It includes a mixture of at least two or more ceramic particles selected from the group consisting of first ceramic particles having a particle size of 10 to 100 μm, second ceramic particles having a particle size of 1 to 10 μm, and third ceramic particles having a particle size of 1 μm or less. desirable.

At this time, the ceramic particles,

Including the first ceramic particle and the second ceramic particle,

A weight fraction of the first ceramic particles and the second ceramic particles is 5:3 to 10:7 gel pad.

Another aspect of the present invention is an adhesive means for bonding the component to the inside of the device by being sandwiched between a component provided inside the device for forming a reactive gas atmosphere therein and the device,

An outer pad including an inner hole provided therein, an air discharge passage having a narrower width than the diameter of the inner hole and extending inwardly from the inner hole, an inner pad provided on the inner side of the outer pad, and the outer pad An inner slit separating the pad and the inner pad and connected to the air discharge passage;

The outer pad and the inner pad,

a synthetic resin comprising a first silicone polymer including polysiloxane having at least two vinyl groups and a second silicone polymer including polysiloxane or organohydrogen polysiloxane having at least one Si-H bond; and

Dispersed in the synthetic resin, at least one ceramic selected from the group consisting of alumina (Al ₂ O ₃ ), boron nitride (BN, boron nitride), graphite, graphene, carbon nanotubes, charcoal, and silicon carbide (SiC) It is a gel pad set comprising; particles.

At this time, the gel pad set,

It is preferable to include the outer pad, the inner pad, and a pair of films adhered to upper and lower portions of the outer pad and the inner pad.

In addition, it is preferable to include a silane coupling agent for improving interfacial adhesion between the synthetic resin and the ceramic particles.

Also, the weight ratio of the first silicone polymer to the second silicone polymer is preferably 1:3 to 3:1.

In addition, the ceramic particles are preferably included in an amount of 60 to 93% by weight based on the total weight of the synthetic resin and the ceramic particles.

In addition, it is preferable that the thermal conductivities of the outer pad and the inner pad be 2.0 W/m·K or more.

In addition, the ceramic particles,

It is preferable to include at least two or more ceramic particles having different average particle diameters.

In addition, the ceramic particles,

It includes a mixture of at least two or more ceramic particles selected from the group consisting of first ceramic particles having a particle size of 10 to 100 μm, second ceramic particles having a particle size of 1 to 10 μm, and third ceramic particles having a particle size of 1 μm or less. desirable.

The gel pad according to one aspect of the present invention has a structure including an open inner hole at a position of a screw coupling hole to which a screw is coupled while ensuring good adhesion between the electrostatic chuck and the silicon ring on the electrostatic chuck, It is possible to prevent an arcing phenomenon that may occur at the location.

In addition, the gel pad according to one aspect of the present invention can solve the problem of air being trapped in the inner hole or bubbles being formed by including an air discharge path to discharge air from the inner hole provided in the outer pad.

Furthermore, in the gel pad according to one aspect of the present invention, the direction in which the air discharge path is connected is from the inner hole of the outer pad toward the inner pad, so that plasma from the outside of the outer pad passes through the air discharge path. It is possible to prevent the inflow, thereby solving the problem that the coupling screw provided at the position of the inner hole is etched, corroded, or deformed by plasma.

1 and 2 are cross-sectional views schematically illustrating a cross-section of an internal structure of a plasma etching device and generation of plasma.
3 is a view showing a state in which the coupling screw 32, the power pin 33, and the temperature sensor 34 are fastened to the coupling ring.
4 is a diagram showing an example of a silicon ring used in a plasma etching apparatus.
5 to 9 are diagrams showing the structure of a preferred embodiment of the present invention.
10 is a view showing the structure of a conventional means for bonding an electrostatic chuck and a silicon ring.
11 and 12 are diagrams showing the structure of a comparative example of the present invention.
13 is a photograph of a corrosion and deformed coupling screw as a result of an experiment in a comparative example.
14 to 16 are diagrams showing changes in thermal conductivity with respect to the amount of the filler and the silane coupling agent.

Prior to describing the present invention in detail below, it is understood that the terms used herein are intended to describe specific embodiments and are not intended to limit the scope of the present invention, which is limited only by the appended claims. shall. All technical and scientific terms used herein have the same meaning as commonly understood by a person of ordinary skill in the art unless otherwise specified.

Throughout this specification and claims, the terms "comprise", "comprise" and "comprising", unless stated otherwise, are meant to include a stated object, step or group of objects, and steps, and any other object However, it is not used in the sense of excluding a step or a group of objects or a group of steps.

On the other hand, various embodiments of the present invention can be combined with any other embodiments unless clearly indicated to the contrary. Any feature indicated as being particularly desirable or advantageous may be combined with any other features and characteristics indicated as being particularly desirable or advantageous.

In the drawings, the width, length, thickness, etc. of components may be exaggerated for convenience. When describing the drawings as a whole, it is described from the observer's point of view, and when one component is said to be "above/below" or "above/below" another component, this is not only the case of being "directly above/below" another component. , including the case where there is another component in the middle.

Gel pad 1 according to one aspect of the present invention is a ring-shaped component provided inside a device for forming a reactive gas atmosphere in an internal space and an adhesive means for bonding the corresponding component inside the device by being sandwiched between the device. , More specifically, it is used to bond a silicon ring (or focus ring) on an electrostatic chuck (ESC) or ESC substrate included in the device inside the plasma etching device, and to bond the coupling ring to the silicon ring. it could be

The gel pad 1 includes an outer pad 100, an inner pad 200, and an inner slit 300, and adhesion between the silicone ring 30 and the electrostatic chuck 20 and the silicone ring 30 Adhesion between the coupling ring 25 may be obtained through the gel pad 1.

FIG. 1 is a diagram showing the structure of a plasma etching apparatus 10 by way of example. A silicon wafer 40 to be etched may be disposed on an electrostatic chuck 20, and a silicon ring 30 is formed on the electrostatic chuck 20. It is provided around the periphery of and fixes the silicon wafer 40 placed on the top, and has a structure coupled with the coupling ring 25 at the bottom.

In the plasma etching apparatus shown in FIG. 1, high frequency RF power of 60 MHz is supplied to the upper electrode, an electrostatic chuck 20 and a silicon ring can be used as the lower electrode, and low frequency RF power of about 400 kHz conduction is applied to the lower electrode. Features supplied.

At this time, the silicon ring 30 receives RF and generates plasma along the outer circumferential surface of the electrostatic chuck 20 to control the edge of the silicon wafer 40 or etching of the edge. The yield of the etching step can be obtained excellently.

2 is a cross-sectional view showing a coupling structure of a plasma etching device in more detail. A coupling ring 25 is provided along the outer circumferential surface of the electrostatic chuck 20 provided at the center, a silicon ring 30 is coupled to the outer circumferential surface of the electrostatic chuck 20 and an upper portion of the coupling ring 25, and the silicon ring (30) is preferably in contact with a part of the upper surface of the electrostatic chuck 20 and the upper surface of the coupling ring 25 at the same time. It may be provided between the contact surface of the ) and the contact surface of the silicon ring 30 and the coupling ring 25.

Here, it is preferable that the silicone ring 30 and the coupling ring 25 are fastened by a coupling screw, and the silicon ring 30 and the coupling ring 25 have a screw coupling hole 31 for fastening the coupling screw, or It is preferable to have a female groove, and it can be seen in FIG. 3 that the silicone ring 30 and the coupling ring 25 are provided with a screw coupling hole 31 or a female groove.

4 is a photograph showing a state in which three coupling screws 32 and power pins 33 are coupled at symmetric positions in the radial direction, and at least one temperature sensor 34 is coupled. The power pins 33 are used as electrodes for supplying RF to generate plasma to the outside of the electrostatic chuck 20 and as components for protecting the electrodes, and the number or coupling position thereof is not limited, but two or more power pins are preferred. It is desirable to have a symmetrical structure.

Reactive gas molecules are injected into the inside of the plasma etching device and the reactive gas molecules can be plasmaized by the applied electric field. In this process, internal parts are exposed to the reactive gas atmosphere, causing corrosion or etching. The pad 1 has an effect of preventing the coupling screw 32, the power pin 33, and the like from being etched by blocking the penetration path of plasma penetrating along the gap where the parts are coupled while having excellent plasma resistance. In particular, as described above, when additionally supplying RF for edge etching of a silicon wafer, plasma penetration can occur more actively at the edge, so a method for preventing plasma etching and corrosion such as a coupling screw has a more advantageous effect.

5 is a diagram schematically showing the structure of a silicon ring 30, which is a component installed inside the plasma etching apparatus. The silicon ring 30 may be formed of a ring-shaped silicon carbide (SiC) material, and has a screw coupling hole 31 or a female groove into which a coupling screw 32 can be fastened.

The gel pad 1 of the present invention is at least a portion of the silicone ring 30 in order to firmly bond and fix a silicone ring in the form of a ring (ring) having a circular outer circumferential surface and an empty space concentric with the outer circumferential surface therein. It has a shape corresponding to and preferably includes an outer pad 100 provided along the outer circumferential surface of the silicon ring 30 and an inner pad 200 provided along the inner circumferential surface of the silicon ring 30.

The outer pad and the inner pad may be classified according to the object to be bonded, and it is preferable that the inner pad is provided at a portion bonded to the electrostatic chuck and the outer pad is provided at a portion bonded to the coupling ring.

More specifically, the gel pad has a curved outer and inner circumferential surface with respect to the ring-shaped silicon ring 30, and has side surfaces connecting the outer and inner circumferential surfaces on both sides. Here, the gel pad has an outer circumferential surface, which is a part of the arc of the outer circle, and an arc of an inner circle concentric with the outer circle constituting the outer circumferential surface, as an inner circumferential surface, corresponding to an area divided into n equal parts based on the center of the outer circle and the inner circle. , where n is a natural number of 2 or greater and is 3 to 12 or 4 to 12, for example, 4, 6, 8, 9, or 12.

The outer and inner pads 100 and 200 of the gel pad 1 are made of a composition containing a synthetic resin containing silicon and ceramic particles (or fillers).

The synthetic resin containing silicone allows the gel pad 1 to have excellent adhesive properties. The synthetic resin containing silicon may include a silicon-oxygen bond (-Si-O-), which is a chemical bond with strong bonding strength, has the advantage of combining inorganic and organic properties, and is bonded to a silicon ring, which is a bonding target. It can have excellent characteristics.

Si-containing polymers or silicone rubbers commonly used in the synthetic resin technology field for bonding the ceramic material may be used as the silicone-containing synthetic resin of the gel pad, and two or more different silicone polymers are used as the synthetic resins. A mixed mixture may be used, and for example, a two-liquid silicone mixture in which different liquid silicone polymers are mixed is preferably used.

In addition, when the silicone polymer is mixed in a two-liquid phase, it can be divided into an addition type and a condensation type depending on the type of crosslinking and polymerization formation reaction. It is preferable to use a two-liquid silicone mixture of the addition type.

In the case of the addition type, it has a longer pot life compared to the condensation type and has good deep curing properties, and the curing speed tends to depend on the curing temperature, but has the advantage of not generating VOC due to no by-products during curing, and has excellent electrical insulation and thermal conductivity. It has stable advantages.

In addition, as the synthetic resin containing silicone used in the present invention, it is preferable to use a heat-curable silicone polymer because it has excellent adhesive properties and excellent physical properties.

The silicone polymer for preparing the addition-type two-liquid silicone mixture preferably includes polyorganosiloxane or polydiorganosiloxane containing at least one alkenyl group in the molecule, for example, polysiloxane containing at least two or more vinyl groups. It is good to use

More specifically, the addition-type two-liquid silicone mixture is a mixture containing a first silicone polymer and a second silicone polymer, wherein the first silicone polymer is polysiloxane containing at least two vinyl groups, and the second silicone polymer is at least one Si. -It is possible to cross-link polysiloxane or organohydrogen polysiloxane having an H bond by addition reaction, and after mixing two types of polysiloxane compounds containing at least two or more vinyl groups as the first and second silicone polymers, at least one or more Si It can be obtained by cross-linking by additionally adding a small amount of polysiloxane or organohydrogen polysiloxane having a -H bond.

Here, the addition-type two-liquid silicone mixture containing polysiloxane containing at least two or more vinyl groups as the first silicone polymer and polysiloxane or organohydrogen polysiloxane having at least one Si-H bond as the second silicone polymer contains at least It is preferable to mix the first silicone polymer, which is a polysiloxane containing two or more vinyl groups, and the second silicone polymer, which is a liquid silicone polymer having a different structure, in a weight ratio of 1:3 to 3:1, preferably 1:1 in a weight ratio. It is good to mix with

Here, the polysiloxane including at least two or more vinyl groups preferably has a structure of any one of Formulas 1 to 3 below.

(Formula 1)

(Formula 2)

(Formula 3)

(At this time, n and m are integers from 100 to 300, x, y and z are integers from 0 to 200, respectively, and x+y+z is from 100 to 400.)

If the values of n, m, x, y, z, and x+y+z are too small, the properties as a polymer may be weakened and the viscosity may decrease or the adhesive properties may deteriorate. There may be issues that cannot be supported.

When a two-liquid silicone mixture containing the first and second silicone polymers is used as a gel pad material, the chemical stability is excellent and the surface is not easily reacted or etched in a plasma atmosphere, and a silicone polymer mixture with addition-type crosslinking is used. By doing so, there is an advantage suitable for bonding of parts used in plasma conditions.

The first and second silicone polymers included in the two-liquid silicone mixture are preferably polymers having a weight average molecular weight of 100,000 to 120,000 g/mol, preferably 105,000 to 110,000 g/mol, and contain two or more vinyl groups. It is preferable that the content of the vinyl group is 0.01 to 0.1 mol%, preferably 0.03 to 0.09 mol%.

If the average molecular weight is too low, curing properties and adhesive properties may be poor during crosslinking. If the average molecular weight is too high, moldability may be poor. If the content of vinyl groups is too low or high, crosslinking may be difficult. There may be a problem in that physical properties are deteriorated during curing due to insufficient or excessive formation.

In addition, the viscosity of the silicone before curing is preferably 200 to 230 Pa·s, preferably 210 to 220 Pa·s. If the viscosity is too low, the adhesive strength may decrease, and if the viscosity is too high, there may be a problem in that molding is difficult.

In addition, the thermal conductivity of the synthetic resin itself is relatively low, less than 0.5 W/m·K, and ceramic particles having higher thermal conductivity than the synthetic resin are preferably dispersed in order to improve the thermal conductivity of the gel pad.

Ceramic particles, one of the components included in the gel pad, are blended with a synthetic resin containing silicon, and may also be referred to as a filler. The ceramic particles can play a role in improving physical properties such as heat conduction, adhesive strength, compression rate, release property, etc. of the gel pad at the junction.

The type of ceramic particles is not limited, but as long as the particles are made of a ceramic material that can be uniformly dispersed in a synthetic resin containing silicon and has excellent thermal conductivity, various materials that can be inferred by a person skilled in the art can be used, for example At least one or more selected from the group consisting of alumina (Al ₂ O ₃ ), boron nitride (BN, boron nitride), carbon powder (C), and silicon carbide (SiC) is preferably used. Here, the carbon powder includes graphite, graphene, carbon nanotubes, charcoal, and the like.

The particle diameter of the ceramic particles may vary depending on the type and function of the particles. In the case of using alumina particles, the first ceramic particles having a particle diameter of 10 to 100㎛, the second ceramic particles having a particle diameter of 1 to 10㎛, and the particle diameter of 1 At least one ceramic particle or a mixture of ceramic particles selected from the group consisting of third ceramic particles having a size of ㎛ or less may be used.

In a preferred embodiment of the present invention, powder having a particle diameter of 70 μm, 7 μm, 0.2 μm, etc. is used individually or mixed as the first to third ceramic particles, and ultrafine ceramic particles having a particle diameter of 0.2 μm or less are used. There is also

When ceramic particles with a small particle size are used, the thermal conductivity of the gel pad increases, but the physical properties such as resin releasability may deteriorate and the cost increases. Therefore, the gel pad has a high thermal conductivity of 5 W/m K or more. In case of manufacturing, ultra-fine alumina may be required as ceramic particles, and in the case of targeting thermal conductivity of 3 W/m·K or more, it is possible not to include ultra-fine alumina as ceramic particles.

When alumina is used as the ceramic particle, the ratio of the first ceramic particle having a particle diameter of 70 μm to the second ceramic particle having a particle diameter of 7 μm is preferably 5:3 to 10:7, preferably 3: 2 is good. When the particle diameter ratio between alumina particles satisfies the corresponding range, thermal conductivity is relatively improved, and formability and mold release characteristics are also excellent.

In the case of using SiC particles as ceramic particles, powder having a particle diameter of 8 μm may be used.

The ceramic particles are preferably included in 60 to 93% by weight based on the total amount of the composition, for example, 63 to 92% by weight, preferably 63.77 to 91.99% by weight. If the content of the ceramic particles is too low, thermal conductivity may be lowered, resulting in a problem of not effectively transferring internal heat, and if the content of the ceramic particles is too high, problems such as poor formability, elasticity, and adhesive properties may occur.

On the other hand, when ceramic particles are mixed with synthetic resin and used, mixing with the synthetic resin containing silicon may be difficult depending on the polarity or structure of the ceramic particles. To overcome this problem, a silane coupling agent is used. may be added together, and silicone oil or a release agent may be additionally added.

One side of the silane coupling agent can bind to the surface of the inorganic filler or filler mixed with the polymer, and the other side has affinity with the matrix resin to improve the dispersibility of the filler and the matrix resin, and the interface between the filler and the resin polymer. It is a compound that can improve adhesion and improve strength after mixing.

Examples of the silane coupling agent include trimethoxysilyl benzoic acid, γ methacryloxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ isocyanate propyl triethoxysilane, γ glycidoxy propyl tree Methoxysilane, β-epoxycyclohexyl) ethyltrimethoxysilane, vinylchlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3- glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-meta

Cryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-acryloxypropyltrimethoxysilane , N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyl Methyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl- 3-aminopropyltrimethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide, 3 -Isocyanate propyltriethoxysilane etc. are mentioned, These can be used individually or in mixture of 2 or more types.

The silane coupling agent may be included in an amount of 0.001 to 0.1% by weight based on the total amount of the total composition constituting the gel pad.

Since the silane coupling agent can participate in hydrolysis and condensation reactions, it can improve dispersibility when mixing the synthetic resin containing the liquid silicone polymer and the ceramic particles.

Silicone oil is physically and chemically stable, has excellent heat resistance, cold resistance and electrical properties, and has unique interface properties, so it is used in various fields. For example, dimethyl silicone oil, methylphenyl silicone oil, methyl hydrogen oil and organic modified silicone One or more selected from the group consisting of oil may be used, and a preferred embodiment of the present invention uses polydimethylsiloxane.

The thermal conductivity of silicone oil is lower than that of ceramic particles, and preferably lower than or equal to that of synthetic resin, and for example, a material having 0.1 to 0.15 W/m·K may be used. If the thermal conductivity of silicone oil is too low, the thermal conductivity of the gel pad is weakened and the proportion of ceramic particles increases, resulting in a decrease in adhesiveness.

In addition, silicone oil has a heat resistance limit of 170 to 200 ° C., and if the heat resistance limit is too low, it is difficult to utilize the gel pad for devices operating under high temperature conditions.

The gel pad can be manufactured by mixing a synthetic resin containing silicone, a filler, and silicone oil, and then curing the synthetic resin containing silicone through heat treatment. And it is also possible to be prepared by mixing with silicone oil.

Meanwhile, the gel pad of the present invention has a thermal conductivity of 2.0 W/m K or more, preferably 2.5 W/m K, more preferably 2.9 W/m K or more, for example, 3.5 W It is also preferable that it is /m·K or more.

The higher the thermal conductivity of the gel pad, the faster the temperature of the electrostatic chuck 20, the silicon ring 30, and the coupling ring 25 to which RF is supplied for plasma generation can be cooled, so a good effect can be expected.

When the gel pad 1 is attached to the silicon ring 30, the screw coupling hole 31 to which the coupling screw 32 for fixing the silicon ring 30 in the plasma etching device is fastened is not blocked or shielded. It is characterized by comprising a hole 110.

Conventionally, when coupling the silicone ring, an adhesive or adhesive material was used regardless of the presence or location of the screw connection hole 31, and this causes the screw connection hole 31 to be clogged, and the clogged screw connection hole 31 is an adhesive material. Impurities or charges are accumulated due to clogging by , and an arcing phenomenon in which an arc is generated sometimes occurs.

The inner hole 110 has a hole shape having a diameter slightly larger than the diameter of the screw hole 31 so as not to cover the screw hole 31 . For example, the diameter of the inner hole 110 may be 3 to 3.5 mm, preferably 3.2 to 3.4 mm, may be 3.37 mm, and 1.05 to 1.2 times the diameter of the screw coupling hole 31. It is good.

If the diameter of the inner hole is too small, the gel pad is damaged or the coupling is hindered when parts are coupled to the coupling hole, and if the diameter of the inner hole is too large, the adhesive effect may be reduced or the plasma blocking effect may be weakened. .

The inner hole 110 is preferably provided on the outer pad 100, which may vary depending on the position, number, and size of the screw coupling holes 31 provided on the silicon ring 30.

The outer pad 100 preferably has at least one inner hole 110, but it is also possible that the outer pad 100 has two or more inner holes 110. In a preferred embodiment of the present invention, nine gel pads 1 having one inner hole 110 on the outer pad 100 to join the silicone ring 30 having nine screw holes 31 have the required structure.

In addition, the gel pad 1 according to a preferred embodiment of the present invention extends from the inner hole 110 of the outer pad 100 toward the inner pad 200 to fill the empty space inside the inner hole 110 with the outer pad. An air outlet 120 connected to the inner slit 300 between the 100 and the inner pad 200 is included.

The air discharge path 120 is a means for removing air bubbles generated in the inner hole 110 when the silicone ring is bonded using the gel pad 1, and the air trapped inside the inner hole 110 is discharged. It can be discharged through the furnace 120 through the inner slit 300 provided between the outer pad 100 and the inner pad 200, thereby preventing the problem of air bubbles forming at the joint in the gel pad 1.

In addition, the air discharge path 120 extends from the inner hole 110 toward the inner pad 200 and is connected to the inner slit 300, and the air discharge path 120 is connected to the outer peripheral surface of the outer pad 100. Due to this, it is possible to prevent a problem in which the plasma generated inside the device penetrates between the silicon ring and the coupling ring 20 and penetrates to the coupling screw 32 along the air discharge path 120. When the plasma flows into the inner hole 110 through the air discharge path 120, the coupling screw 32 exposed by the plasma may be etched, corroded, or deformed, reducing the lifespan of the coupling screw 32. In addition, the maintenance of the plasma etching device becomes difficult, and the parts replacement cycle becomes longer, which may reduce economic feasibility.

The air discharge path can perform an air discharge function while adjusting the degree of etching of the coupling screw 32 provided in the inner hole according to the width. For example, the width of the air discharge path is preferably smaller than the diameter of the inner hole, and may be 1.2 to 1.5 mm, preferably 1.43 to 1.45 mm.

If the width of the air discharge path is too narrow, there is a problem in that the air discharge is not smooth, and if the width of the air discharge path is too wide, the penetration rate of plasma increases, which can quickly corrode the coupling screw 32 or deteriorate the adhesive strength of the gel pad. there is.

On the other hand, the width of the inner slit of the gel pad to which the air discharge passage is connected is preferably 0.9 to 1.1 times the width of the air discharge passage, and preferably provided with the same width as the air discharge passage.

The inner slit is characterized in that the air discharged from the inner hole through the bone discharge path is naturally dispersed so as not to cause a defect, and can communicate with the inner slit of the adjacent gel pad at the end. At this time, the internal slits of the gel pads arranged in an annular shape are integrally connected to each other to appropriately disperse the gas generated inside to effectively prevent problems such as deformation of the gel pad or deterioration of adhesion due to pressure, while preventing plasma penetration from the outside. Since the inflow can be effectively prevented, it is possible to form an annular storage space that collects gas on its own and separates it from the outside.

6 to 10 are views showing a state in which the gel pad 1 according to a preferred embodiment of the present invention is attached to the silicone ring 30. 6 to 10 (a) schematically shows the structure of the outer pad 100 and the inner pad 200 of the gel pad 1, and the (b) drawing of FIGS. 6 to 10 shows the outer pad 100 It is a view showing a state in which the inner pad 200 is attached to the silicon ring 30.

The air discharge passage 120 may include a straight line or a curved line, and preferably has a constant width.

When the air discharge path 120 is in the form of a straight line, it may be provided as a path having one or more bent points, and it is also possible to use a curved line including a part of a spiral or a curved line including a part of a spherical surface.

Meanwhile, FIG. 11 is a view showing another type of pad shape usable for attaching the silicon ring 30 to the electrostatic chuck 20 . In FIG. 8, the same reference numerals are used to compare the prior art and the gel pad of the present invention, but components with the same reference numerals do not mean that they are the same components in the prior art and the present invention. The same reference numerals are indicated.

11 (a) and (b) show conventional outer pads or inner pads, respectively, and it can be seen that the inner hole 110 is not provided and the air discharge path 120 is not included.

In (c) of FIG. 11 , it can be seen that a partially recessed section is included on the inner circumferential side of the outer pad 100 . This is completely different from the inner hole 110 and the air discharge path 120 in shape, configuration, and size, and there is a difference in that the entire junction area is relatively reduced.

12 and 13 are diagrams showing the structure of a gel pad 1 corresponding to a comparative example. 10(a) is a view showing a gel pad 1 provided with an outer pad 100 having an inner hole 110 but not including an air outlet 120, and FIG. b) is a view showing the gel pad 1 including a structure in which the air discharge path 120 extending from the inner hole 110 extends outwardly of the outer pad 100 and is connected to the outer circumferential surface.

FIG. 14 is a reference view showing the change of the coupling screw 32 after bonding the silicon ring 30 using the gel pad 1 and performing plasma etching. It can be seen that the existing coupling screw 32 on the left is in need of replacement due to etching, corrosion, and deformation after being used in the plasma etching device.

It is preferable that the outer pad 100 and the inner pad 200 are separated from each other by an inner slit 300, and the interval is preferably constant. If there is no inner slit 300, it is difficult for the operator to bond the gel pad 1 to the silicone ring 30, so there is a high possibility of human error and a high possibility of not attaching with a uniform thickness. there is.

In addition, when there is an internal slit 300, when the gel pad 1 thermally expands due to a change in temperature, the internal slit 300 narrows and can buffer the thermal expansion, so that the gel pad is externally exposed due to thermal expansion. (1) can prevent the problem of coming out or pushing the silicon ring 30 to apply pressure.

Another aspect of the present invention is a gel pad set comprising the aforementioned gel pad.

The gel pad set is an example of an application for utilizing the above-described gel pad, to make it easy to store or distribute the above-described gel pad, and to prevent the surface of the outer and inner pads from being contaminated with foreign substances and deteriorating adhesive strength. In order to do so, a pair of films adhered to the top and bottom of the outer pad and the inner pad are included.

The pair of films used herein is preferably a release film having release properties on at least one surface, and preferably has release properties on surfaces in close contact with the outer pad and the inner pad.

It is recommended that the pair of films have a larger area than the outer and inner pads to cover all surfaces of the outer and inner pads, and the handle protrudes further out of the outer and inner pads so that users can easily remove the films. It is good to include wealth.

9 and 10 show a film having a larger area than the outer pad and the inner pad, although not indicated by reference numerals.

The pair of films may be transparent films or translucent films, and an opaque film may be used, but preferably a transparent film.

In the case of a gel pad set including a release film, after the user removes one side of the film, the surface of the gel pad set from which the film is removed is brought into contact with the adhesive surface of the part to which the gel pad is to be attached, and the remaining film is removed. The component and the device can be bonded by adhering the component to a location where the device is provided.

Hereinafter, the contents of the present invention will be described in detail through examples.

<Example>

Examples 1 to 22

The gel pad of the embodiment is a silicone containing polysiloxane (first silicone polymer) containing vinyl groups at both ends and organohydrogen polysiloxane (second silicone polymer) having a Si-H bond in a weight ratio of 1:1. A two-liquid silicon mixture (SL7220, KCC) obtained by mixing was prepared, and alumina (particle diameter: 70 μm, 7 μm, 0.2 μm), SiC, carbon powder, etc. were selected and used as ceramic particles, additionally a silane coupling agent, A gel pad was prepared by adding dimethyl silicone oil.

The thermal conductivity of the sample was measured in three ways using QTM710 and TPS-2500S equipment.

Adhesive strength was measured in the following way. 1) Attach a specimen measuring 25 mm in width and length on a Si bulk jig. 2) A weight of 500 g was placed on the specimen and waited for 5 minutes. 3) The jig was fastened to the upper and lower grips. 4) The adhesive strength of the specimen between the weight and the jig was measured while pulling the grip at a speed of 0.5 mm/min.

The thermal conductivity of the gel pad can vary depending on the content (ratio) of the ceramic particles and the content (ratio) of the silane coupling agent added together, and it has been confirmed that the content of the filler has the highest effect on the thermal conductivity, It was confirmed that the silane coupling agent also had a significant effect on the thermal conductivity. Specifically, as the ratio of ceramic particles increased, the thermal conductivity increased, and as the silane coupling agent decreased, the thermal conductivity increased.

division Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 First silicone polymer (g) 3.38g 3.38g 2.25 2.25 3.38 2.25 3.38 2.25 Second silicone polymer (g) 3.28g 3.38g 2.25 2.25 3.38 2.25 3.38 2.25 Al ₂ O ₃
(70um) 47.45g 47.45g 48.74 48.74 47.45 48.74 47.45 48.74 Al ₂ O ₃
(7um) 31.64g 31.64g 32.49 32.49 31.64 32.49 31.64 32.49 Al ₂ O ₃
(0.2um) 4.16g 4.16g 4.28 4.28 4.16 4.28 4.16 4.28 silicon
oil 7.2g 7.2g 7.2g 7.2g 7.2g 7.2g 7.2g 7.2g Silane Coupling Agent 0.46 0.23 0.23 0.46 0.46 0.46 0.23 0.23 Thickness (mm) 0.53 0.53 0.52 0.52 0.53 0.52 0.53 0.52 Thermal conductivity (W/m K) 2.391 2.745 3.645 2.807 2.520 3.116 2.854 3.493 Filler content (% by weight) 91.38 90.52 91.99 90.78 87.45 88.90 85.85 87.29 evaluation Poor formability Poor formability Poor formability Poor formability Poor formability Poor formability Poor formability Poor formability

Figs. 12 to 14 show graphs showing changes in thermal conductivity according to the contents of the ceramic particles and the silane coupling agent, which are factors influencing the thermal conductivity of the gel pad, using the results of Table 1.

Tables 2 and 3 are tables summarizing the results after testing the molding characteristics of Examples 9 to 22. As a result of the experiment, it was found that the moldability improved as the proportion of the filler decreased, and the moldability improved as the proportion of the silane coupling agent increased.

division Example 9 Example 10 Example 11 Example 12 Example 13 Example 14 Example 15 First silicone polymer (g) 9g 6.75g 11.25g 11.25g 6.75g 9g 9g Second silicone polymer (g) 9g 6.75g 11.25g 11.25g 6.75g 9g 9g Al ₂ O ₃
(70um) 40.5g 43.2g 37.8g 37.8g 43.2g 40.5g 40.5g Al ₂ O ₃
(7um) 27g 28.8g 25.2g 25.2g 28.8g 27g 27g Al ₂ O ₃
(0.2um) 4.5g 4.5g 4.5g 4.5g 4.5g 4.5g 4.5g silicon
oil 7.2g 7.2g 7.2g 7.2g 7.2g 7.2g 7.2g Silane
coupling agent 0.56g 0.23g 0.23g 0.9g 0.9g 0.56g 0.56g Thickness (mm) 0.55 0.53 0.52 0.52 0.52 0.5 0.55 Thermal conductivity (W/m K) 2.230 2.972 1.582 1.301 2.513 2.062 2.350 Filler content (% by weight) 73.65 78.52 69.28 68.81 77.98 75.21 74.39 evaluation Good formability Good formability Good formability Good formability Good formability Good formability Good formability

division Example 16 Example 17 Example 18 Example 19 Example 20 Example 21 Example 22 First silicone polymer (g) 9g 9 9g 9g 5.82g 12.18g 9g Second silicone polymer (g) 9g 9g 9g 9g 5.82g 12.18g 9g Al ₂ O ₃
(70um) 40.5g 40.5g 40.5g 40.5g 44.32g 36.68g 40.5g Al ₂ O ₃
(7um) 27g 27g 27g 27g 29.54g 24.45g 27g Al ₂ O ₃
(0.2um) 4.5g 4.5g 4.5g 4.5g 4.5g 4.5g 4.5g silicon
oil 7.2g 7.2g 7.2g 7.2g 7.2g 7.2g 7.2g Silane
coupling agent 0.56g 1.04g 0.56g 0.56g 0.56g 0.56g 0.085g Thickness (mm) 0.55 0.52 0.52 0.52 0.52 0.52 0.55 Thermal conductivity (W/m K) 1.878 2.448 1.912 2.156 1.751 2.263 2.673 Filler content (% by weight) 73.65 73.09 73.25 72.38 76.43 63.77 71.37 evaluation Good formability Good formability Good formability Good formability Good formability Good formability Good formability

Examples 23 and 24

After preparing 23.6 g of a mixture of the same first and second silicone polymers in a weight ratio of 1:1 as in Example 1, 126.9 g of alumina was prepared as ceramic powder, but powder having average particle diameters of 70 and 7 μm, respectively 70.5 and 56.6g, 88.83 and 38.07g, and the weight ratio was 5:4 and 7:3, and then SiC, carbon powder, silicon oil, and silane coupling agent were added to prepare a gel pad, and thermal conductivity and Formation and release characteristics were observed and shown in Table 4.

division Example 23 Example 24 First silicone polymer (g) 11.8 11.8 Second silicone polymer (g) 11.8 11.8 Al ₂ O ₃ 70um (g) 70.5 88.83 Al ₂ O ₃ 7um (g) 56.4 38.07 SiC powder (g) 0.6 0.6 Al ₂ O ₃ 0.2 μm (g) - - Carbon powder (g) 0.01 0.01 Silicon Oil (g) 7.2 7.2 Silane coupling agent (g) 0.15 0.15 Thermal conductivity 1st 1.684 2.190 Secondary thermal conductivity 1.753 2.471 Thermal conductivity 3rd - 2.165 Thermal conductivity average 1.718 2.275 evaluation -. Good formability
-. well done -. Good formability
-. well done

Example 23 Example 24 TC-50TXS2
(Shin-Etsu 5W) COH-3114VO4 3.1W (5W) COH-5051 5W (7W) Cross-sectional area (cm2) 6.25 6.25 6.25 6.25 6.25 Max Load (Kpa) 108 204 150 173 86 99 386 209 99 111 98 156 162 139 78 64 90 90 184 274 56 290 307 221 347 155 213 257 345 62 98 216 154 280 103 Max Load Average. 96.86 222.14 189.86 205.86 151.57

Table 5 is an adhesion test performed on Examples 23 and 24 and commercially available competitor products. In the case of Example 24, the average adhesive force was evaluated as 222 kPa or more, which was confirmed to be excellent.

The features, structures, effects, etc. illustrated in each of the above-described embodiments can be combined or modified with respect to other embodiments by those skilled in the art in the field to which the embodiments belong. Therefore, contents related to these combinations and variations should be construed as being included in the scope of the present invention.

1 : Gel pad
10: plasma etching device
20: electrostatic chuck
25: Coupling
30: silicon ring
31: screw joint
32: combination screw
33: power pin
34: temperature sensor
40: silicon wafer
100: outer pad
110: inner hole
120: air discharge path
200: inner pad
300: internal slit

Claims (20)

An adhesive means for adhering the component to the inside of the device by being interposed between a component provided inside the device for forming a reactive gas atmosphere therein and the device,
a synthetic resin comprising a first silicone polymer including polysiloxane having at least two vinyl groups and a second silicone polymer including polysiloxane or organohydrogen polysiloxane having at least one Si-H bond; and
Dispersed in the synthetic resin, at least one ceramic selected from the group consisting of alumina (Al ₂ O ₃ ), boron nitride (BN, boron nitride), graphite, graphene, carbon nanotubes, charcoal, and silicon carbide (SiC) Particles; gel pad containing. According to claim 1,
A gel pad comprising a silane coupling agent for improving interfacial adhesion between the synthetic resin and the ceramic particles. According to claim 2,
The weight ratio of the first silicone polymer to the second silicone polymer is 1:3 to 3:1. According to claim 3,
The ceramic particles are included in an amount of 60 to 93% by weight based on the total weight of the synthetic resin and the ceramic particles. According to claim 4,
The gel pad has a thermal conductivity of 2.0 W / m K or more. According to claim 5,
The silane coupling agent,
trimethoxysilyl benzoic acid, γ methacryloxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ isocyanate propyl triethoxysilane, γ glycidoxy propyl trimethoxysilane, β epoxycyclohexyl ) Ethyltrimethoxysilane, vinylchlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane , 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropyltrie Toxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (Aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyltriethoxysilane , 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltri Methoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide and 3-isocyanatepropyltrie One or two or more gel pads selected from the group consisting of toxysilanes. According to claim 6,
The polysiloxane containing at least two or more vinyl groups has a structure of any one of Formulas 1 to 3 below.
(Formula 1)

(Formula 2)

(Formula 3)

(Here, n and m are integers from 100 to 300, x, y and z are integers from 0 to 200, respectively, and x+y+z is from 100 to 400.) According to claim 7,
The first silicone polymer and the second silicone polymer have a weight average molecular weight of 100,000 to 120,000 g / mol. According to claim 8,
The gel pad wherein the polysiloxane containing at least two vinyl groups has a vinyl group content of 0.01 to 0.1 mol%. According to claim 9,
The ceramic particles,
A gel pad comprising at least two or more ceramic particles having different average particle diameters. According to claim 10,
The ceramic particles,
A gel comprising a mixture of at least two ceramic particles selected from the group consisting of first ceramic particles having a particle size of 10 to 100 μm, second ceramic particles having a particle size of 1 to 10 μm, and third ceramic particles having a particle size of 1 μm or less pad. According to claim 11,
The ceramic particles,
Including the first ceramic particle and the second ceramic particle,
A weight fraction of the first ceramic particles and the second ceramic particles is 5:3 to 10:7 gel pad. An adhesive means for adhering the component to the inside of the device by being interposed between a component provided inside the device for forming a reactive gas atmosphere therein and the device,
An outer pad including an inner hole provided therein, an air discharge passage having a narrower width than the diameter of the inner hole and extending inwardly from the inner hole, an inner pad provided on the inner side of the outer pad, and the outer pad An inner slit separating the pad and the inner pad and connected to the air discharge passage;
The outer pad and the inner pad,
a synthetic resin comprising a first silicone polymer including polysiloxane having at least two vinyl groups and a second silicone polymer including polysiloxane or organohydrogen polysiloxane having at least one Si-H bond; and
Dispersed in the synthetic resin, at least one ceramic selected from the group consisting of alumina (Al ₂ O ₃ ), boron nitride (BN, boron nitride), graphite, graphene, carbon nanotubes, charcoal, and silicon carbide (SiC) Particles; gel pad set comprising a. According to claim 13,
The gel pad set,
A gel pad set comprising the outer pad, the inner pad, and a pair of films adhered to upper and lower portions of the outer pad and the inner pad. According to claim 14,
A gel pad set comprising a silane coupling agent for improving interfacial adhesion between the synthetic resin and the ceramic particles. According to claim 15,
A weight ratio of the first silicone polymer to the second silicone polymer is 1:3 to 3:1. According to claim 16,
The ceramic particles are contained in an amount of 60 to 93% by weight based on the total weight of the synthetic resin and the ceramic particles. According to claim 17,
The gel pad set wherein the outer pad and the inner pad have thermal conductivity of 2.0 W/m K or more. According to claim 18,
The ceramic particles,
A gel pad comprising at least two or more ceramic particles having different average particle diameters. According to claim 19,
The ceramic particles,
A gel comprising a mixture of at least two ceramic particles selected from the group consisting of first ceramic particles having a particle size of 10 to 100 μm, second ceramic particles having a particle size of 1 to 10 μm, and third ceramic particles having a particle size of 1 μm or less pad.

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