KR20220161310A - Deposition mask, method for manufacturing deposition mask, and method for manufacturing display device - Google Patents

Abstract

The deposition mask is a mask frame, and includes a first surface, a first back surface opposite to the first surface, a main body portion having a first opening penetrating between the first surface and the first back surface, and a second surface. A frame portion having a front surface and a second back surface opposite to the second surface, comprising a frame portion having a second opening penetrating between the second surface and the second back surface, A mask frame configured to detachably attach the frame-shaped portion to the main body on the first back side so that the position of the second opening matches the position of the first opening on the first surface, and a plurality of mask holes A mask portion having a mask portion bonded to the second back surface so as to cover the second opening portion.

Description

Deposition mask, method for manufacturing deposition mask, and method for manufacturing display device

The present invention relates to a deposition mask, a method for manufacturing the deposition mask, and a method for manufacturing a display device.

BACKGROUND OF THE INVENTION [0002] In the manufacture of organic EL display devices, vacuum evaporation is used to form organic light emitting layers included in organic EL display elements. When forming an organic light emitting layer by vacuum deposition, a deposition mask is used in order to form an organic light emitting layer having a predetermined shape at a predetermined position in a deposition target. The deposition mask includes a plurality of mask portions and a mask frame. Each mask part is a metal foil in which a plurality of mask holes were formed. The plurality of mask holes have a shape and arrangement according to the shape and arrangement of the organic light-emitting layer. The mask frame has a frame hole through which the evaporation material reaches the mask portion attached to the mask frame. Each mask part is bonded to the mask frame so as to close one frame hole different from each other (for example, refer to Patent Literature 1).

International Publication No. 2019/054462

By the way, welding is used for bonding of the mask part to the mask frame, for example. In the case where welding is used for joining the mask portion, the mask frame is formed with a joining mark where the mask portion is joined. The joining mark is a dent formed in a portion where the mask portion was welded in the mask frame.

On the other hand, when vapor deposition using one deposition mask is performed a plurality of times, a part of the mask portion may be deformed or evaporation material may be deposited on a portion of the mask portion. In this respect, in the deposition mask described above, it is possible to remove only the mask portion that needs to be replaced from the mask frame and attach a new mask portion to the mask frame. However, since bonding scars are formed on the mask frame by bonding of the mask portion, in order to suppress the displacement of the mask portion relative to the mask frame or the mask portion not being bonded to the mask frame due to the bonding scar. , it is necessary to process the joint marks. Therefore, re-bonding of the mask portion to the mask frame is complicated by the amount of processing required for the bonding marks.

In addition, the above-mentioned subject is not limited to the case where welding is used for joining the mask portion, but is common even when adhesion is used for joining the mask portion. When bonding is used for bonding the mask portion, an adhesive layer is formed as a bonding trace.

An object of the present invention is to provide a deposition mask capable of facilitating re-bonding of a mask portion to a mask frame, a method for manufacturing the deposition mask, and a method for manufacturing a display device.

A deposition mask for solving the above problems is a mask frame comprising a first surface, a first back surface opposite to the first surface, and a first opening penetrating between the first surface and the first back surface. A frame-shaped portion including a main body portion and a second surface and a second back surface opposite to the second surface, comprising a second opening penetrating between the second surface and the second back surface. and a frame portion on the first back surface side such that the position of the second opening on the second surface matches the position of the first opening on the first surface. a mask frame configured to be detachably attached to the mask portion; and a mask portion having a plurality of mask holes, the mask portion bonded to the second back surface so as to cover the second opening portion.

A method of manufacturing a deposition mask for solving the above problems includes bonding a mask portion to a frame shape having a second opening penetrating between a second surface and a second back surface, and and mounting the frame-shaped portion to a body portion having a first opening penetrating therebetween. Bonding the mask part includes bonding the mask part to the second back surface so as to cover the second opening. Attaching the frame-shaped portion is to attach the frame-shaped portion to the first back side so that the position of the second opening on the second surface matches the position of the first opening on the first surface. Including detachably attaching to the main body.

A method of manufacturing a display device for solving the above problems includes forming a pattern on an object to be deposited using a deposition mask manufactured by the method for manufacturing a deposition mask.

According to the deposition mask, the method for manufacturing the deposition mask, and the method for manufacturing the display device, when the mask portion of the deposition mask is replaced with a new mask portion, the mask portion is included in the main body together with the detachable frame portion from the main body portion. It is possible to detach from wealth. Accordingly, the bonding marks formed on the frame-shaped portion by bonding of the mask portion to the frame-shaped portion are also removed from the main body portion. Therefore, it is possible to obtain a deposition mask by attaching a new frame portion to the main body portion and bonding a new mask portion to the new frame portion. In this way, when rejoining the mask part to the mask frame, processing of the bonding scars of the mask frame is unnecessary, so that the rejoining of the mask part to the mask frame can be facilitated.

1 is a perspective view showing the structure of a deposition mask in a first embodiment.
FIG. 2 is a cross-sectional view showing a part of the structure in the deposition mask shown in FIG. 1 .
Fig. 3 is a cross-sectional view showing a part of the structure of the deposition mask shown in Fig. 2;
FIG. 4 is a plan view showing the structure of a mask portion included in the deposition mask shown in FIG. 2 .
5 is an enlarged cross-sectional view showing the structure of a mask portion included in the deposition mask shown in FIG. 2 .
6 is a process chart for explaining a method for manufacturing a deposition mask.
7 is a process chart for explaining a method for manufacturing a deposition mask.
8 is a process chart for explaining a method for manufacturing a deposition mask.
9 is a process chart for explaining a method for manufacturing a deposition mask.
10 is a process chart for explaining a method for manufacturing a deposition mask.
11 is a process chart for explaining a method for manufacturing a deposition mask.
12 is a process chart for explaining a method for manufacturing a deposition mask.
Fig. 13 is an enlarged cross-sectional view of region A shown in Fig. 12 .
14 is a process chart for explaining a method for manufacturing a deposition mask.
15 is a process chart for explaining a method for manufacturing a deposition mask.
16 is a working diagram for explaining the working of the deposition mask.
Fig. 17 is an apparatus configuration diagram schematically showing the configuration of a deposition apparatus together with a deposition mask and an deposition target.
18 is a plan view showing the structure of a deposition mask in the second embodiment.
Fig. 19 is a cross-sectional view showing a structure taken along line XIX-XIX shown in Fig. 18;
Fig. 20 is a cross-sectional view showing the fixing part shown in Fig. 18 and the surrounding structure of the fixing part.
Fig. 21 is a cross-sectional view showing the structure along line XIX-XIX shown in Fig. 18;
Fig. 22 is a cross-sectional view showing the fixing part shown in Fig. 18 and the surrounding structure of the fixing part.
23 is a plan view showing the structure of the deposition mask in the third embodiment.
Fig. 24 is a cross-sectional view showing a structure along the line XXIV-XXIV shown in Fig. 23;
25 is a plan view showing the structure of the deposition mask in the fourth embodiment.
Fig. 26 is a cross-sectional view showing a structure along the line XXVI-XXVI shown in Fig. 25;
27 is a plan view showing the structure of a deposition mask in the fifth embodiment.
Fig. 28 is a cross-sectional view showing a structure along the line XXVIII-XXVIII shown in Fig. 27;

[First Embodiment]

Referring to Figs. 1 to 17, a first embodiment of a deposition mask, a method for manufacturing the deposition mask, and a method for manufacturing a display device will be described. Hereinafter, a deposition mask, a method for manufacturing the deposition mask, and a method for manufacturing the display device will be sequentially described.

[Vapor deposition mask]

The deposition mask includes a mask frame and a mask portion. The mask frame includes a body portion and a frame-shaped portion. The body portion includes a front surface, a rear surface opposite to the front surface, and a first through hole penetrating between the front surface and the rear surface. The frame portion includes a front surface, a rear surface opposite to the front surface, and a second through hole penetrating between the front surface and the rear surface. In the mask frame, on the back side of the body portion relative to the front surface of the body portion, the frame portion is attached to the body portion so that the opening of the surface of the second opening portion faces the opening of the surface of the first opening portion, and It is comprised so that the frame-shaped part can be removed from the body part. The mask portion has a plurality of mask holes and is bonded to the back surface of the frame-shaped portion so as to cover the second opening portion.

That is, the body portion includes a first surface, a first back surface opposite to the first surface, and a first opening penetrating between the first surface and the first back surface. The frame-shaped portion has a second surface and a second back surface opposite to the second surface. The frame-shaped portion has a second opening penetrating between the second surface and the second back surface. The mask frame can detachably attach the frame-shaped portion to the main body on the first back side so that the position of the second opening on the second surface matches the position of the first opening on the first surface. It is composed of

Hereinafter, the deposition mask of the first embodiment will be described with reference to FIGS. 1 to 5 . Fig. 1 shows a perspective structure of a deposition mask viewed from a viewpoint corresponding to the back surface of a main body of a mask frame of the deposition mask.

As FIG. 1 shows, the deposition mask 10 includes a mask frame 11 and a plurality of mask portions 12 . The mask frame 11 has a plurality of frame holes 11H. Each mask part 12 is bonded to the mask frame 11 so as to cover one frame hole 11H different from each other.

The outer shape of the mask frame 11 has, for example, a rectangular shape. The mask frame 11 includes a front surface 11F and a back surface 11R on the opposite side to the front surface 11F. When the deposition mask 10 is mounted on the deposition apparatus, the back surface 11R of the mask frame 11 faces the deposition target S, whereas the front surface 11F of the mask frame 11 faces the deposition source. confront Seen from a viewpoint facing the back surface 11R of the mask frame 11, the outer shape of the mask frame 11 is larger than the deposition target S. In the example shown in FIG. 1 , the outer shape of the mask frame 11 is larger than the object S for deposition, but the outer shape of the mask frame 11 may be smaller than the object S for deposition.

Each frame hole 11H has a rectangular shape when viewed from a viewpoint facing the back surface 11R. The plurality of frame holes 11H are arranged in a rectangular lattice shape at equal intervals in the first direction D1 and the second direction D2 orthogonal to the first direction D1. In addition, the frame hole 11H does not have to have a rectangular shape. For example, the frame hole 11H may have shapes such as a square shape, a circular shape, and an elliptical shape. Further, the plurality of frame holes 11H may include frame holes 11H having a first shape and frame holes 11H having a second shape. The plurality of frame holes 11H need not be arranged in a rectangular lattice shape. For example, the plurality of frame holes 11H may line up in a staggered shape. In addition, the plurality of frame holes 11H may be arranged irregularly in at least one of the first direction D1 and the second direction D2.

The mask portion 12 has a shape and a size capable of covering the frame hole 11H when viewed from a viewpoint facing the back surface 11R of the mask frame 11 . In this embodiment, the mask part 12 has a rectangular shape. The mask part 12 is attached one by one with respect to one frame hole 11H. Therefore, the deposition mask 10 is provided with the mask portion 12 of the same number as the frame hole 11H.

The mask frame 11 and the mask part 12 are made of metal. The metal forming the mask frame 11 and the metal forming the mask portion 12 are preferably the same. Accordingly, since the difference between the linear expansion coefficient of the deposition mask 10 and the linear expansion coefficient of the mask portion 12 is small, even if the deposition mask 10 is heated during use of the deposition mask 10, the mask portion 12 is deformed. being inhibited As a result, a decrease in accuracy at the position of a pattern formed using the deposition mask 10 is suppressed.

As the material forming the mask portion 12, an iron-nickel alloy, which is an alloy containing iron and nickel as main components, can be used. The material forming the mask portion 12 is, for example, an alloy containing 30% by mass or more of nickel and the balance of iron. The material forming the mask portion 12 is preferably invar, which is an alloy containing 36% by mass of nickel, among iron-nickel alloys. The material forming the mask portion 12 may be 42 alloy, which is an alloy containing 42% by mass of nickel. The mask part 12 may also contain additives, such as chromium, manganese, carbon, and cobalt, in addition to iron and nickel.

When the material forming the mask portion 12 is an iron-nickel-cobalt-based alloy, the material has iron, nickel, and cobalt as main components, and has, for example, 30 mass% or more of nickel, It is an alloy containing 3% by mass or more of cobalt and the balance of iron. Among the iron-nickel-cobalt alloys, an alloy containing 32% by mass of nickel and 4% by mass or more and 5% by mass or less of cobalt, ie, super invar, is preferable as a material for forming the mask portion 12 . In the super invar, the balance of 32% by mass of nickel and 4% by mass or more and 5% by mass or less of cobalt may contain additives other than iron as the main component. Additives are, for example, chromium, manganese, and carbon. Additives contained in the iron-nickel-cobalt-based alloy are at most 0.5% by mass or less.

In addition, it is preferable that the vapor deposition object S is a glass substrate. When the evaporation object S is a glass substrate, the increase in the difference between the linear expansion coefficient of the evaporation object S and the mask portion 12 is suppressed because the mask portion 12 is made of Invar. In addition, the evaporation object S may be a laminate of a glass substrate and a resin layer. In this case, a pattern may be formed on the resin layer of the deposition target S. Moreover, the vapor deposition object S may be a resin film. It is preferable that the material which forms a resin layer and a resin film is polyimide resin, for example.

2 shows a cross-sectional structure of the deposition mask 10 along a plane orthogonal to the back surface 11R of the mask frame 11 . 2 shows only the structure of a portion including one frame hole 11H and one mask portion 12 among the cross-sectional structures of the deposition mask 10 .

As FIG. 2 shows, the mask frame 11 is equipped with 11 A of main body parts, and the some frame-shaped part 11B. The body portion 11A includes a front surface 11AF, a rear surface 11AR opposite to the front surface 11AF, and a plurality of first openings 11AH. The front surface 11AF is an example of the first surface, and the rear surface 11AR is an example of the first rear surface. The first opening 11AH penetrates between the front surface 11AF and the rear surface 11AR. The body portion 11A has a stepped portion AH1 in which the opening in the back surface 11AR of the body portion 11A in the first opening portion 11AH is widened.

Each of the frame-shaped portions 11B is a frame shape fitted into the stepped portion AH1 so as to separate the opening of the surface 11AF in the first opening portion 11AH that is different from the other and the second opening portion 11BH facing each other. has In other words, the position on the surface 11BF of the second opening 11BH of each frame-shaped portion 11B matches the position on the surface 11BF of the other second openings 11BH. It matches the position on the surface 11AF of the first opening 11AH different from the position on the surface 11AF of the opening 11AH.

Each frame-shaped portion 11B has a front surface 11BF and a rear surface 11BR. The front surface 11BF is an example of the second surface, and the rear surface 11BR is an example of the second rear surface. The rear surface 11BR of the frame-shaped portion 11B is an example of an exposed surface exposed on the opposite side to the stepped portion AH1. Each frame-shaped portion 11B is configured to be removable from the stepped portion AH1 of the main body portion 11A.

Each mask section 12 has a plurality of mask holes 12H. Each mask portion 12 is bonded to the back surface 11BR of the frame portion 11B so as to cover the second opening portion 11BH of the one frame portion 11B different from each other. In other words, each mask portion 12 is bonded to the back surface 11BR of the frame portion 11B that is different from the frame portion 11B to which the other mask portions 12 are bonded. The mask part 12 is joined to the back surface 11BR of the frame-shaped part 11B by welding, for example.

When replacing the mask portion 12 provided in the deposition mask 10 with a new mask portion 12, the mask portion 12 together with the detachable frame portion 11B from the main body portion 11A It is possible to remove from the body part 11A. In this way, the bonding marks formed on the frame portion 11B by bonding of the mask portion 12 to the frame portion 11B are also removed from the main body portion 11A. Therefore, the deposition mask 10 is obtained by inserting a new frame portion 11B into the main body portion 11A and bonding a new mask portion 12 to the new frame portion 11B. It is possible. In this way, when rejoining the mask portion 12 to the mask frame 11, processing of the bonding marks of the mask frame 11 is unnecessary, so that the mask portion 12 to the mask frame 11 can facilitate recombination.

Since the frame-shaped portion 11B is located on the stepped portion AH1, compared to the case where the body portion 11A does not have the stepped portion AH1, the back surface 11AR of the body portion 11A and the mask portion 12 ) can be made small. Therefore, when the deposition mask 10 is in contact with the deposition target, it is necessary to reduce the difference in force acting on the portion of the deposition target in contact with the deposition mask 10 and the portion to which the deposition mask 10 is not in contact. It is possible.

When viewed from a plane facing the back surface 11AR of the body portion 11A, the outer shape of the frame portion 11B is rectangular, and the frame portion 11B defines a rectangular area. . The frame portion 11B includes a back surface 11BR to which the mask portion 12 is joined, and a surface 11BF on the opposite side to the back surface 11BR. The back surface 11BR is a surface located on the opposite side of the front surface 11BF to the front surface 11AF of the body portion 11A.

In a cross section orthogonal to the rear face 11AR of the body portion 11A, the second opening portion 11BH of the frame portion 11B has a trapezoidal shape. On the other hand, in a cross section orthogonal to the back surface 11AR of the body portion 11A, each first opening 11AH of the body portion 11A opens to the front surface 11AF and has a trapezoidal shape; It has a shape in which a portion having an opening in the back surface 11AR and a rectangular shape is connected. When the frame portion 11B is fitted into the stepped portion AH1 of the body portion 11A, the first opening portion 11AH of the body portion 11A and the second opening portion 11BH of the frame portion 11B ), one frame hole 11H is formed. In the cross section orthogonal to the rear face 11AR of the body portion 11A, the frame hole 11H has a trapezoidal shape.

In addition, in the cross section orthogonal to the back surface 11AR of the body portion 11A, the frame hole 11H may have a shape other than a trapezoidal shape. For example, the frame hole 11H may have a semicircular arc shape tapering from the front surface 11AF toward the rear surface 11AR, or may have a rectangular shape.

The frame hole 11H is a passage for an evaporation material vaporized or sublimated from an evaporation source. The frame hole 11H has a trapezoidal shape, in other words, a shape tapering along the direction from the front surface 11AF of the body portion 11A to the back surface 11AR, thereby providing a shadow effect by the mask frame 11 it is possible to suppress

In a cross section orthogonal to the back surface 11AR of the body portion 11A, the frame-shaped portion 11B has a thickness TB equal to or greater than the depth D of the stepped portion AH1 of the body portion 11A. In this embodiment, the depth D of the stepped portion AH1 of the main body portion 11A is equal to the thickness TB of the frame-shaped portion 11B. When the frame portion 11B is fitted into the stepped portion AH1 of the body portion 11A, the back surface 11BR of the frame portion 11B is flush with the back surface 11AR of the body portion 11A ( face one). Therefore, the back surface 11AR of the main body portion 11A is suppressed from protruding from the back surface 11BR of the frame-shaped portion 11B, thereby preventing a gap between the mask portion 12 and the deposition target S. The formation of gaps is suppressed.

Further, when the thickness TB of the frame portion 11B is greater than the depth D of the stepped portion AH1, the back surface 11BR of the frame portion 11B is the back surface 11AR of the body portion 11A. ) sticks out against. Therefore, similarly to the case where the rear surface 11BR of the frame portion 11B and the rear surface 11AR of the body portion 11A are flat, the rear surface 11AR of the body portion 11A is the same as that of the frame portion 11B. Protruding from the back surface 11BR is suppressed, and accordingly, formation of a gap between the mask portion 12 and the deposition target S is suppressed.

In a cross section orthogonal to the back surface 11AR of the body portion 11A, the thickness TB of the frame-shaped portion 11B is smaller than the thickness TA of the body portion 11A. The thickness TA of the body portion 11A may be, for example, 5 mm or more and 50 mm or less. The thickness TB of the frame-shaped portion 11B may be, for example, 100 μm or more and 10 mm or less.

The surface 11F of the mask frame 11 described above is the surface 11AF of the main body portion 11A. In contrast, the rear surface 11R of the mask frame 11 is formed by the rear surface 11AR of the body portion 11A and the rear surface 11BR of each frame portion 11B.

In addition, in the cross section orthogonal to the back surface 11AR of the body portion 11A, the side surface connecting the front surface 11BF and the back surface 11BR in the frame portion 11B is within the frame portion 11B, Alternatively, in the thickness direction of the frame portion 11B, the curvature may be such that the center of curvature is located on the side of the mask portion 12 relative to the frame portion 11B. In addition, when viewed from a viewpoint facing the rear surface 11AR of the body portion 11A, the corner portion of the opening of the rear surface 11BR in the second opening portion 11BH has a curvature such that the center of curvature is located within the opening. can also In addition, as seen from the viewpoint facing the back surface 11AR of the body portion 11A, the corner portion of the outer edge of the frame portion 11B may have a curvature such that the center of curvature is located within the frame portion 11B.

In addition, when viewed from the viewpoint facing the back surface 11AR of the body portion 11A, the corner portion of the inner edge of the stepped portion AH1 has a curvature whose center of curvature is located within the region surrounded by the inner edge of the stepped portion AH1. You can have it. In addition, as viewed from a viewpoint facing the surface 11AF of the main body portion 11A, the corner portion of the opening of the surface 11AF in the first opening portion 11AH has a curvature such that the center of curvature is located within the opening. can also

By having each corner portion curvature, compared to the case where each corner portion has no curvature, when the frame portion 11B is fitted into the body portion 11A, the corner portion of the body portion 11A is the frame portion. Damage due to contact of 11B and damage due to contact of main body portion 11A to the corner portion of frame-shaped portion 11B are suppressed.

The mask frame 11 can be equipped with a fixing part for fixing the frame-shaped part 11B to the main body part 11A. 3 schematically shows an example of a fixing part. The fixing portion fixes the frame-shaped portion 11B to the body portion 11A so that it can be removed from the body portion 11A.

In the case where the frame portion 11B is formed of a metal having magnetism, the body portion 11A can be detached from the body portion 11A, and the frame portion 11B is held by magnetic attraction. It is possible to provide a fixing part fixed to the body part 11A. As a result, since the frame portion 11B is magnetically attracted to the body portion 11A, compared to the case where the frame portion 11B is fixed to the body portion 11A using fastening members such as screws. , the accuracy of the position of the frame-shaped portion 11B relative to the body portion 11A is less likely to decrease.

For example, as FIG. 3 shows, 11 A of main-body parts can equip the inside of 11 A of main-body parts with magnet 11AM. The magnet 11AM is a permanent magnet, for example. The magnet 11AM can have a first state and a second state. The first state is a state in which the magnet 11AM is positioned along the plane partitioning the stepped portion AH1, whereby the magnet 11AM magnetically attracts the frame portion 11B to the body portion 11A. ) is fixed at On the other hand, the second state is a state in which the magnet 11AM is separated from the surface dividing the stepped portion AH1 compared to the first state, and when the magnet 11AM has the second state, the magnet 11AM , the fixation of the frame-shaped portion 11B to the body portion 11A is released.

Therefore, when the magnet 11AM is in the first state, it is possible to fix the frame-shaped portion 11B to the body portion 11A. Then, by changing the state of the magnet 11AM from the first state to the second state, it is possible to remove the frame-shaped portion 11B fixed to the body portion 11A from the body portion 11A.

4 schematically shows a planar structure of the mask portion 12 bonded to the frame portion 11B. 5 shows the structure of the mask portion 12 along a cross section orthogonal to the plane in which the mask portion 12 spreads.

As FIG. 4 shows, the mask part 12 is equipped with the mask area|region 12A in which the some mask hole 12H was formed, and the peripheral area|region 12B which does not have the mask hole 12H. The peripheral region 12B surrounds the mask region 12A. A part of the peripheral region 12B is joined to the frame-shaped portion 11B.

In the example shown in FIG. 4 , the mask section 12 includes only one mask region 12A. Moreover, the mask part 12 may be provided with 12 A of several mask areas. When the mask section 12 includes a plurality of mask regions 12A, mask regions 12A adjacent to each other are separated from each other by peripheral regions 12B. In all of the plurality of mask portions 12 included in the deposition mask 10, the number of mask regions 12A of each mask portion 12 may be the same. Alternatively, even if the plurality of mask portions 12 include mask portions 12 provided with the first number of mask regions 12A and mask portions 12 provided with the second number of mask regions 12A, do. The second number is different from the first number.

As FIG. 5 shows, the mask part 12 is equipped with the front surface 12F, and the back surface 12R on the opposite side to the front surface 12F. The surface 12F is a surface for facing an evaporation source in the evaporation apparatus by being exposed to a region partitioned by the frame hole 11H of the mask frame 11 . The back surface 12R is a surface for contacting the evaporation target S in the evaporation apparatus.

The mask section 12 may be formed of a single metal plate or may be formed of a plurality of metal plates. In the case where the mask portion 12 is formed of a plurality of metal plates, the plurality of metal plates are piled up in the thickness direction of the mask portion 12 . The side face of the hole that divides the mask hole 12H has a semicircular arc shape tapering from the front surface 12F to the back surface 12R in a cross section along the thickness direction of the mask portion 12 . Each mask hole 12H is separated from the adjacent mask hole 12H. In addition, each mask hole 12H may be connected to the mask hole 12H adjacent to each other.

The surface 12F is a surface bonded to the frame-shaped portion 11B of the mask frame 11 . The surface 12F includes a surface opening H1 that is an opening of the mask hole 12H. The back surface 12R includes a back surface opening H2 that is an opening of the mask hole 12H. The size of the front opening H1 is larger than that of the rear opening H2 when viewed from a viewpoint facing the front surface 12F. Each mask hole 12H is a passage through which vaporized or sublimated vaporized particles from the vapor source pass. Vapor deposition particles vaporized or sublimated from the deposition source enter the inside of the mask hole 12H from the front opening H1 toward the back opening H2. In the mask hole 12H, since the surface opening H1 is larger than the back surface opening H2, when the deposition target is viewed from the deposition particles flying toward the mask portion 12, the shadow is cast by the deposition mask 10. It is possible to reduce the portion that becomes , that is, to suppress the shadow effect.

The thickness of the mask part 12 is 1 micrometer or more and 15 micrometers or less, for example. With such a thin mask portion 12, it is possible to suppress a shadow effect on deposited particles entering from the surface opening H1.

[Method of manufacturing vapor deposition mask]

A method of manufacturing the deposition mask 10 will be described with reference to FIGS. 6 to 15 .

A method of manufacturing the deposition mask 10 includes bonding the mask portion 12 to a frame portion 11B having a second opening 11BH penetrating between the front surface 11BF and the back surface 11BR, and , attaching the frame-shaped portion 11B having the second opening portion 11BH to the main body portion 11A having the first opening portion 11AH penetrating between the front surface 11AF and the rear surface 11AR. . Bonding the mask portion 12 includes bonding the mask portion 12 to the back surface 11BR of the frame-shaped portion 11B so as to cover the second opening portion 11BH.

Attaching the frame-shaped portion 11B is on the back surface 11AR side of the body portion 11A relative to the front surface 11AF of the body portion 11A, and on the front surface 11BF of the second opening 11BH. is opposite to the opening of the surface 11AF in the first opening 11AH, and the frame-shaped portion 11B is attached so that it can be detached from the body portion 11A. That is, attaching the frame-shaped portion 11B to the first rear side so that the position of the second opening 11BH on the second surface matches the position of the first opening 11AH on the first surface. includes attaching the frame-shaped portion 11B to the body portion 11A in a detachable manner. Hereinafter, a method of manufacturing the deposition mask 10 will be described in more detail with reference to the drawings.

6 to 11 show steps from preparing a substrate for forming the mask portion 12 to forming the mask portion 12 . In addition, FIGS. 12 to 15 show steps from bonding the mask portion 12 to the mask frame 11 to the step of removing the support from the mask portion 12 . 12 to 15, for convenience of illustration, the mask frame 11 has only one frame hole 11H, and the deposition mask 10 has one mask portion 12. It is shown as a structure. .

As FIGS. 6 to 11 show, in the manufacturing method of the deposition mask 10, first, the substrate 20 for forming the mask portion 12 is prepared (see FIG. 6). The base material 20 of the mask part 12 is equipped with the metal plate 21 for forming the mask part 12, and the support body 22 for supporting the metal plate 21. The support body 22 is formed of the resin layer 22a and the glass substrate 22b. In the substrate 20, a resin layer 22a is sandwiched between a metal plate 21 and a glass substrate 22b.

As described above, the metal plate 21 may be formed of an iron-nickel alloy. The glass substrate 22b may be formed of any one selected from the group consisting of non-alkali glass, quartz glass, crystallized glass, borosilicate glass, high silica glass, porous glass, and soda lime glass.

Next, the thickness of the metal plate 21 is made thin by etching the metal plate 21 from the surface 21F. For example, it is possible to reduce the thickness of the metal plate 21 to a thickness of 1/2 or less of the thickness of the metal plate 21 before etching (see Fig. 7). Then, a resist layer PR is formed on the surface 21F of the metal plate 21 (see Fig. 8). By performing exposure and development to the resist layer PR, a resist mask RM is formed on the surface 21F (see Fig. 9).

Next, the metal plate 21 is wet etched from the surface 21F using the resist mask RM. Thereby, a plurality of mask holes 12H are formed in the metal plate 21 (see Fig. 10). In the wet etching of the metal plate 21, a surface opening H1 is formed in the front surface 21F, and then a back surface opening H2 smaller than the surface opening H1 is formed in the back surface 21R. Then, the resist mask RM is removed from the surface 21F, thereby manufacturing the mask portion 12 (see Fig. 11). In addition, the front surface 21F of the metal plate 21 corresponds to the front surface 12F of the mask part 12, and the back surface 21R of the metal plate 21 corresponds to the back surface 12R of the mask part 12. do.

In the step of preparing the substrate 20 (see FIG. 6 ), a resin layer 22a is sandwiched between the metal plate 21 and the glass substrate 22b, and the metal plate 21 and the resin layer 22a are interposed therebetween. The process of bonding the glass substrate 22b is included. When the metal plate 21, the resin layer 22a, and the glass substrate 22b are bonded, first, among the surfaces each of the metal plate 21 and the glass substrate 22b have, at least in contact with the resin layer 22a. CB (Chemical bonding) treatment is performed on the surface. The surface on which the CB process is performed in the metal plate 21 and the glass substrate 22b is the target surface. In the CB treatment, for example, a functional group having reactivity with respect to the resin layer 22a is imparted to the target surface by applying a chemical liquid to the target surface. In the CB treatment, for example, a Si-based compound or the like is applied to the target surface.

And after laminating the metal plate 21, the resin layer 22a, and the glass substrate 22b in the order of description, these are bonded by thermal compression. At this time, the target surface of the metal plate 21 and the target surface of the glass substrate 22b are brought into contact with the resin layer 22a. As a result, when the functional group provided to the target surface and the functional group located on the surface of the resin layer 22a react, the metal plate 21 and the resin layer 22a are bonded together, and furthermore, the glass substrate 22b and the resin layer (22a) is joined.

It is preferable that the resin layer 22a is made of polyimide. In this case, the linear expansion coefficient of the metal plate 21, the linear expansion coefficient of the resin layer 22a, and the linear expansion coefficient of the glass substrate 22b are about the same. Therefore, in the process of manufacturing the deposition mask 10, even if the laminate formed of the metal plate 21, the resin layer 22a, and the glass substrate 22b is heated, the linear expansion coefficient between the layers forming the laminate is heated. Warpage of the laminate due to the difference in is suppressed.

Electrolysis or rolling is used for the method of manufacturing the metal plate 21. As a post-processing of the metal plate 21 obtained by these methods, polishing, annealing, etc. are used suitably. When electrolysis is used for manufacture of the metal plate 21, the metal plate 21 is formed on the surface of the electrode used for electrolysis. After that, the metal plate 21 is released from the surface of the electrode. In this way, the metal plate 21 is manufactured. In the bonding process mentioned above, it is preferable to bond the metal plate 21 which has a thickness of 10 micrometers or more to the glass substrate 22b via the resin layer 22a. Moreover, when the metal plate 21 is manufactured by rolling, it is preferable that the thickness of the metal plate 21 is 15 micrometers or more. When the metal plate 21 is manufactured by electrolysis, it is preferable that the thickness of the metal plate 21 is 10 micrometers or more.

In the thinning process of reducing the thickness of the metal plate 21 before forming the resist mask RM on the metal plate 21 (see Fig. 7), wet etching can be used. As described above, in the thinning process, it is possible to reduce the thickness of the metal plate 21 after thinning to 1/2 or less of the thickness of the metal plate 21 before thinning. Therefore, it is possible to make the thickness of the metal plate 21 twice or more of the thickness in the mask part 12. Accordingly, even if the thickness required for the mask portion 12 is as thin as 15 μm or less as described above, before the metal plate 21 is bonded to the glass substrate 22b, the mask that the deposition mask 10 has A metal plate 21 having higher rigidity than the portion 12 can be used. Therefore, it is easier to bond the metal plate 21 to the glass substrate 22b than to bond the metal plate 21 having the same thickness as the mask portion 12 to the glass substrate 22b. In addition, the process of reducing the thickness of the metal plate 21 can be omitted.

An acidic etchant can be used for the etchant for thinning the metal plate 21 by wet etching. When the metal plate 21 is formed from invar, the etchant may be any etchant capable of etching the invar. The acidic etchant may be, for example, a solution obtained by mixing any of perchloric acid, hydrochloric acid, sulfuric acid, formic acid, and acetic acid with either of the ferric perchlorate solution and the mixed solution of the ferric perchlorate solution and the ferric chloride solution. do. As a method of etching the surface 21F, any of a dip method, a spray method, and a spin method can be used.

In the etching process for forming the plurality of mask holes 12H in the metal plate 21 (see Fig. 10), an acidic etchant can be used as the etchant. When the metal plate 21 is formed in bar, any of the etchants that can be used in the thinning process described above can be used for the etchant. As for the etching method for forming the mask hole 12H, any of the methods usable in the thinning process can be used.

In addition, in the step of preparing the substrate 20, before bonding the metal plate 21, the resin layer 22a, and the glass substrate 22b to each other, the metal plate 21 is removed from one surface of the metal plate 21. ) may include a process of thinning. In this case, the thinning process included in the process of preparing the substrate 20 is the first thinning process, and the thinning process performed after the process of preparing the substrate 20 is the second thinning process.

In the first thinning step, the metal plate 21 is thinned by being etched from the first surface. On the other hand, in the second thinning step, the metal plate 21 is thinned by being etched from a second surface different from the first surface. The surface obtained after the 1st surface is etched is a surface bonded to the resin layer 22a in the metal plate 21, and is also a surface on which the CB process is performed.

By etching both the first surface and the second surface of the metal plate 21, it is possible to adjust the residual stress of the metal plate 21 from both the first surface and the second surface. Thereby, compared with the case where only one surface is etched, the occurrence of bias in the residual stress of the metal plate 21 after etching is suppressed. Therefore, when the mask part 12 obtained from the metal plate 21 is joined to the mask frame 11, the generation of wrinkles in the mask part 12 is suppressed. In the metal plate 21, the surface obtained by etching the first surface corresponds to the back surface 12R of the mask plate, and the surface obtained by etching the second surface corresponds to the surface 12F of the mask section 12. do.

In addition, the etching amount at the time of etching the metal plate 21 from the 1st surface is a 1st etching amount, and the etching amount at the time of etching from the 2nd surface is a 2nd etching amount. The 1st etching amount and the 2nd etching amount may be same or different. When the 1st etching amount and the 2nd etching amount differ, the 1st etching amount may be larger than the 2nd etching amount, and the 2nd etching amount may be larger than the 1st etching amount. However, since the etching amount in the state in which the metal plate 21 is supported by the resin layer 22a and the glass substrate 22b is larger when the 2nd etching amount is larger than the 1st etching amount, handling of the metal plate 21 The properties are good, and as a result, the metal plate 21 is easily etched.

As FIGS. 12 to 15 show, a part of the mask frame 11 and a part of the mask part 12 are joined (see FIG. 12). At this time, a plurality of mask portions 12 are bonded to the single mask frame 11 so that each mask portion 12 covers the frame holes 11H that are different from each other one by one. And the glass substrate 22b is peeled off from the resin layer 22a (refer FIG. 14). Next, the resin layer 22a is removed from each mask portion 12 (see Fig. 15). In this way, the deposition mask 10 described above is obtained.

As FIG. 12 shows, in the process of joining a part of the mask frame 11 and a part of the mask part 12, the mask frame 11 is prepared first. At this time, the mask frame 11 is formed by inserting the frame-shaped portion 11B into the stepped portion AH1 of the main body portion 11A. The mask frame 11 may be made of invar or may be formed of a metal other than invar. A metal other than invar may be, for example, stainless steel. The metal for forming the body portion 11A and the metal for forming the frame-shaped portion 11B may be the same as or different from each other.

In the step of bonding the mask portion 12 to the frame portion 11B of the mask frame 11 (see Fig. 12), laser welding can be used as a bonding method. The 1st laser beam L1 is irradiated to the part included in the peripheral area|region 12B among the mask parts 12 through the glass substrate 22b and the resin layer 22a. Therefore, the glass substrate 22b and the resin layer 22a need to have transparency to the first laser beam L1. In other words, the first laser beam L1 needs to have a wavelength capable of transmitting through the glass substrate 22b and the resin layer 22a. By intermittently irradiating the first laser beam L1 along the edge of the second opening 11BH, an intermittent junction is formed. On the other hand, by continuously irradiating the first laser beam L1 along the edge of the second opening 11BH, a continuous junction is formed. In this way, the mask portion 12 is welded to the frame-shaped portion 11B of the mask frame 11 . The wavelength of the first laser beam L1 is preferably 355 nm.

FIG. 13 is an enlarged view of the area A shown in FIG. 12 . The region A includes junction scars formed by welding of the mask portion 12 to the frame-shaped portion 11B, and the junction scars are schematically shown in FIG. 13 .

As FIG. 13 shows, each frame-shaped part 11B is equipped with the welding mark 11BW formed by welding the mask part 12 with respect to the said frame-shaped part 11B. When the mask portion 12 is laser welded to the frame portion 11B, the mask portion 12 and the frame portion 11B are irradiated with a first laser beam L1. By irradiating the mask portion 12 with the first laser beam L1, the portion of the mask portion 12 to which the first laser beam L1 is irradiated is from the back surface 11BR to the front surface of the frame-shaped portion 11B. It is deformed so as to penetrate into the frame-shaped portion 11B along the direction toward 11BF. As a result, a recess is formed in the frame-shaped portion 11B by the amount that a part of the mask portion 12 is dug into. That is, the weld marks 11BW of the frame-shaped portion 11B are dents formed on the back surface 11BR.

The step of removing the support body 22 includes a first step (see Fig. 14) and a second step (see Fig. 15). In a 1st process, the 2nd laser beam L2 is irradiated to the interface of the resin layer 22a and the glass substrate 22b. The second laser beam L2 has a wavelength that is transmitted through the glass substrate 22b and absorbed by the resin layer 22a. In this way, the glass substrate 22b is removed from the resin layer 22a. The wavelength of the second laser beam L2 is preferably 308 nm or 355 nm.

In the first step, the resin layer 22a absorbs thermal energy from the second laser beam L2 by irradiating the second laser beam L2 to the interface between the resin layer 22a and the glass substrate 22b. Thereby, the strength of the chemical bond between the resin layer 22a and the glass substrate 22b is lowered by heating the resin layer 22a. Then, the glass substrate 22b is removed from the resin layer 22a. In the first step, it is preferable to irradiate the entire joint with the second laser beam L2, but to lower the strength of the bond between the glass substrate 22b and the resin layer 22a in the entire joint. If it is possible, you may irradiate a part of the joint part with the 2nd laser beam L2.

At the wavelength of the second laser beam L2, it is preferable that the transmittance of the glass substrate 22b is higher than that of the resin layer 22a. Thereby, compared with the case where the transmittance|permeability of the glass substrate 22b is lower than the transmittance|permeability of the resin layer 22a, the part which forms the interface of the glass substrate 22b and the resin layer 22a in the resin layer 22a is Heating efficiency can be increased.

As mentioned above, it is preferable that the resin layer 22a is made of polyimide. It is preferable that the resin layer 22a is formed of colored polyimide among polyimides. The glass substrate 22b is preferably transparent.

At the 2nd process, after the 1st process, the resin layer 22a is detached from the mask part 12 by melt|dissolving the resin layer 22a using chemical liquid LM. For the chemical liquid LM, a liquid capable of dissolving the material forming the resin layer 22a and having no reactivity to the material forming the mask portion 12 can be used. An alkaline solution can be used for the chemical liquid LM, for example. The alkaline solution may be, for example, an aqueous sodium hydroxide solution. In Fig. 15, a dip method is exemplified as a method of bringing the resin layer 22a into contact with the chemical liquid LM, but a spray method and a spin method are used for the method of bringing the resin layer 22a into contact with the chemical liquid LM. It is also possible to do

Thus, in the process of removing the support body 22 from the mask part 12, the glass substrate 22b is removed from the resin layer 22a in the first step, and the mask part 12 is removed in the second step. ) from which the resin layer 22a is removed. Therefore, compared with the case where the support body 22 is detached from the mask portion 12 by interface destruction by an external force applied to the laminate of the glass substrate 22b, the resin layer 22a, and the mask portion 12 Thus, the external force acting on the mask portion 12 can be reduced. Thereby, the deformation of the mask part 12 resulting from the removal of the support body 22, and consequently, the deformation of the mask hole 12H of the mask part 12 is suppressed.

Further, to the frame portion 11B, as described above, the mask portion 12 may be joined after the frame portion 11B is fitted into the stepped portion AH1 of the main body portion 11A, The mask portion 12 may be joined before the frame portion 11B is fitted into the stepped portion AH1 of the main body portion 11A.

[Action of deposition mask]

Referring to Fig. 16, the action of the deposition mask 10 to which the mask portion 12 is welded to the frame portion 11B will be described. Fig. 16 shows a step in which the mask section 12 is removed from the main body section 11A of the mask frame 11 together with the frame section 11B.

As FIG. 16 shows, when replacing the mask part 12 bonded to the mask frame 11 with a new mask part 12, the mask part 12, together with the frame-shaped part 11B, the body part ( 11A) is removed. Therefore, weld marks 11BW formed by welding the mask portion 12 to the mask frame 11 are removed from the main body portion 11A together with the frame portion 11B.

The weld mark 11BW formed on the mask frame 11 by welding the mask portion 12 is a dent formed on the surface of the mask frame 11 to which the mask portion 12 is joined. Therefore, in order to remove the welding scars 11BW from the mask frame 11, a process for removing the weld scars 11BW from the mask frame 11 or a process for embedding the weld scars 11BW is required. . It is difficult to perform these processes in a state where mask portions 12 other than the mask portion 12 requiring processing are bonded to the mask frame 11 . Therefore, when the mask part 12 is welded to the frame part 11B, the effect of joining the mask part 12 to the frame part 11B of the mask frame 11 is more remarkable. can be obtained

In addition, in order to remove the welding scar 11BW from the mask frame 11, when removing the part containing the welding scar 11BW in the mask frame 11 from other parts in the mask frame 11 In some cases, the second opening 11BH partitioned by the frame-shaped portion 11B is widened. As a result, the size of the second opening 11BH partitioned by the frame portion 11B changes when viewed from a viewpoint facing the front surface 11BF of the frame portion 11B.

When bonding the new mask part 12 to the mask frame 11, after fitting the frame part 11B into the body part 11A, even if the mask part 12 is joined to the frame part 11B. do. In this case, the glass substrate 22b and the resin layer 22a are removed from the mask portion 12 attached to the body portion 11A together with the frame portion 11B. Therefore, when removing the resin layer 22a from the mask portion 12, for example, fixing the mask frame 11 so that only the mask portion 12 and the resin layer 22a come into contact with the chemical liquid LM. need something

Alternatively, after bonding the mask portion 12 to the frame portion 11B, the frame portion 11B may be fitted into the main body portion 11A. In this case, the glass substrate 22b and the resin layer 22a are removed from the mask portion 12 bonded to the frame portion 11B. Therefore, when removing the resin layer 22a from the mask portion 12, the frame portion 11B is fixed so that, for example, only the mask portion 12 and the resin layer 22a come into contact with the chemical liquid LM. it is necessary to do

In either case, welding marks 11BW are formed in the frame portion 11B by welding the mask portion 12 to the frame portion 11B. However, since the weld marks 11BW of the frame-shaped portion 11B are removed from the body portion 11A together with the mask portion 12 to be replaced, rejoining of the mask portion 12 to the mask frame 11 is It's easy. In addition, by rejoining the mask portion 12 to the mask frame 11 in this way, it is possible to reuse one mask frame 11 .

[Method of manufacturing display device]

Referring to FIG. 17 , a method of manufacturing a display device will be described.

The manufacturing method of the display device includes forming a pattern on the deposition target S using the deposition mask 10 manufactured by the deposition mask 10 manufacturing method. Hereinafter, a process of forming a pattern will be described along with an example of a deposition apparatus.

As FIG. 17 shows, the vapor deposition apparatus 30 is equipped with the deposition mask 10 and the accommodation tank 31 which accommodates the deposition target S. The storage tank 31 is configured to hold the deposition target S and the deposition mask 10 at predetermined positions within the storage tank 31 . In the accommodating tank 31, the holding part 32 which holds the evaporation material Mvd, and the heating part 33 which heats the evaporation material Mvd are located. The evaporation material Mvd held by the holding portion 32 is, for example, an organic light emitting material. In the accommodation tank 31, the deposition mask 10 is positioned between the deposition target S and the deposition mask 10, and the deposition target S and the holding portion 32, and furthermore, the deposition mask 10 and It is placed in the container 31 so that the holding portions 32 face each other. The deposition mask 10 is disposed in the accommodation tank 31 in a state where the back surface 12R of the mask portion 12 is in close contact with the deposition target S.

In the process of forming a pattern, the vapor deposition material (Mvd) vaporizes or sublimes by being heated by the heating part 33. The vaporized or sublimated evaporation material Mvd passes through the mask hole 12H of the mask portion 12 of the deposition mask 10 and adheres to the evaporation target S. As a result, an organic layer having a shape corresponding to the shape and position of the mask hole 12H of the deposition mask 10 is formed at a predetermined position in the deposition target S. In addition, the evaporation material Mvd may be, for example, a metal material for forming a pixel electrode included in a pixel circuit of the display layer.

As described above, according to the first embodiment of the deposition mask, the method for manufacturing the deposition mask, and the method for manufacturing the display device, the effects described below can be obtained.

(1-1) When rejoining the mask portion 12 to the mask frame 11, processing of the bonding marks of the mask frame 11 is unnecessary, so the mask portion to the mask frame 11 ( 12) can be easily rejoined.

(1-2) Since the rear surface 11BR of the frame portion 11B is flush with the rear surface 11AR of the body portion 11A, the rear surface 11AR of the body portion 11A is the same as that of the frame portion 11B. Protruding from the back surface 11BR is suppressed, and accordingly, formation of a gap between the mask portion 12 and the deposition target S is suppressed.

(1-3) When the frame portion 11B is fixed to the body portion 11A using fastening members such as screws because the frame portion 11B is magnetically attracted to the body portion 11A. In contrast, the precision in the position of the frame-shaped portion 11B relative to the body portion 11A is less likely to decrease.

(1-4) When the mask portion 12 is welded to the frame portion 11B, the mask portion is joined to the frame portion 11B of the mask frame 11, thereby recombination of the mask portion 12 The effect of facilitating the can be obtained more remarkably.

(1-5) Since the frame-shaped portion 11B is located at the stepped portion AH1, the gap between the back surface 11AR of the main body portion 11A and the mask portion 12 is reduced, thereby evaporating It is possible to reduce a difference in force acting on a portion of the object in contact with the deposition mask 10 and a portion not in contact with the deposition mask 10 .

[Example of modification of the first embodiment]

In addition, 1st Embodiment mentioned above can be implemented with a change as follows.

[fixed part]

· The fixing part does not need to be provided with a permanent magnet, and may be provided with, for example, an electromagnet. Alternatively, the fixing portion may fix the frame portion 11B to the main body portion 11A not by magnetic attraction, but by, for example, electrostatic force and vacuum attraction. Alternatively, the fixing portion may fix the frame portion 11B to the main body portion 11A with a fastening member. Alternatively, the fixing portion may be a bonding material containing indium.

- 11 A of main body parts do not need to have a fixing part. Even in this case, by bonding the mask portion 12 to the frame portion 11B fitted into the stepped portion AH1 of the main body portion 11A, the effect similar to (1-1) described above can be obtained. can

[Frame shape part]

In a cross section orthogonal to the back surface 11AR of the body portion 11A, the thickness TB of the frame-shaped portion 11B is greater than the depth D of the stepped portion AH1 of the body portion 11A. It can be small. Even in this case, by bonding the mask portion 12 to the frame portion 11B fitted into the stepped portion AH1 of the main body portion 11A, the effect similar to (1-1) described above can be obtained. can

In this case, it is preferable that the back surface 12R of the mask part 12 protrudes from the back surface 11AR of the main body part 11A in a cross section orthogonal to the back surface 11AR of the body part 11A. . Accordingly, formation of a gap between the mask portion 12 and the deposition target S is suppressed, and as a result, the accuracy of the shape of the pattern formed on the deposition target S is increased.

[Body part]

• The body portion 11A may include only one first opening 11AH. In this case, the deposition mask 10 should just be equipped with one frame-shaped part 11B and one mask part 12. Even in this case, by bonding the mask portion 12 to the frame portion 11B fitted into the stepped portion AH1 of the main body portion 11A, the effect similar to (1-1) described above can be obtained. can

- 11 A of main-body parts do not need to have step part AH1. In this case, the frame-shaped portion 11B can be positioned on the flat back surface 11AR of the body portion 11A. Even in this case, since the mask frame 11 includes the body portion 11A and the frame-shaped portion 11B, the effect similar to (1-1) described above can be obtained.

[join]

• The bonding of the mask part 12 to the frame-shaped part 11B is not limited to laser welding, and resistance welding, ultrasonic welding, etc. may be used, for example. In any of these cases, when the mask portion 12 is joined to the frame portion 11B fitted into the stepped portion AH1 of the main body portion 11A, the effect similar to (1-1) described above is obtained. can be obtained.

• Bonding of the mask portion 12 to the frame-shaped portion 11B is not limited to welding, and bonding may be used. In this case, an adhesive layer is formed as a bonding trace of bonding the mask portion 12 to the frame-shaped portion 11B. By adhering the mask portion 12 to the frame portion 11B and then inserting the frame portion 11B into the main body portion 11A, the frame portion 11B formed with the adhesive layer, which is a joining mark, is replaced with a new frame. By replacing with the shaped portion 11B, it is possible to remove the adhesive layer from the body portion 11A.

In addition, when adhesion is used for joining the frame-shaped portion 11B and the mask portion 12, it is preferable that the vapor deposition apparatus on which the vapor deposition mask 10 is mounted has a cooling portion for cooling the vapor deposition mask 10. do. Further, from the viewpoint of increasing the strength and heat resistance of the bonding between the frame portion 11B and the mask portion 12, the mask portion 12 is preferably joined to the frame portion 11B by welding. do.

[Second Embodiment]

Referring to FIGS. 18 to 22 , a second embodiment of a deposition mask, a method for manufacturing the deposition mask, and a method for manufacturing a display device will be described. In 2nd Embodiment, compared with 1st Embodiment, the structure which fixes a frame-shaped part to a body part is different. Therefore, in the following, while these differences are described in detail, the same reference numerals as those in the first embodiment are assigned to structures common to those of the first embodiment in the second embodiment, and detailed descriptions of the structures are omitted.

[Vapor deposition mask]

Fig. 18 shows the structure of the deposition mask seen from the viewpoint facing the back surface of the mask frame. 18 shows only one first opening and a structure around the first opening in the deposition mask.

As FIG. 18 shows, the deposition mask 40 includes a mask frame 41 and a mask portion 12 . The mask frame 41 is equipped with the main body part 41A and the frame-shaped part 41B similarly to the mask frame 11 of 1st Embodiment. The mask frame 41 is equipped with 41 C of fixing parts. The fixing part 41C fixes the frame part 41B to the body part 41A. In the example shown in FIG. 18, the mask frame 41 is provided with 41 C of three fixing parts. Since the frame portion 41B is fixed to the main body portion 41A by the three fixing portions 41C, the position of the frame portion 41B on the plane where the mask portion 12 spreads can be determined with high precision. it is possible

In the example shown in Fig. 18, the outer shape of the frame-shaped portion 41B has a rectangular shape. The fixing part 41C is respectively located at the end part of one side and the center part of the other side, among a pair of opposing sides of the frame-shaped part 41B. The fixing part is an example of the first position adjusting part.

FIG. 19 is a cross section taken along line XIX-XIX shown in FIG. 18 . The line XIX-XIX is a line segment passing through the two fixing parts 41C.

As FIG. 19 shows, 41 A of main body parts are equipped with the 1st opening part 41AH and step part AH1 similarly to 11 A of main body parts of 1st Embodiment. The first opening 41AH penetrates between the front surface 41AF and the rear surface 41AR. The stepped portion AH1 of the main body portion 41A is a recess located on the back surface 41AR, and surrounds the first opening 41AH when viewed from a plane facing the rear surface 41AR.

The frame portion 41B is provided with a second opening portion 41BH similar to the frame portion 11B of the first embodiment. The second opening 41BH penetrates between the front surface 41BF and the rear surface 41BR. The second opening 41BH is positioned within the region partitioned by the first opening 41AH when viewed from a viewpoint facing the front surface 41AF of the body portion 41A. The frame-shaped portion 41B is further equipped with a fixing hole BH1. The frame portion 41B of the present embodiment is provided with the same number of fixing holes BH1 as the fixing portion 41C. Each fixing hole BH1 is configured so that one fixing portion 41C can be located. The fixing part 41C fixes the frame-shaped part 41B to the main body part 41A so that it can be removed from the main body part 41A.

A mask portion 12 is bonded to the rear face 41BR of the frame portion 41B. In either of the first embodiment and the method of bonding the mask portion 12 to the frame portion 41B in the modified example of the first embodiment, the mask portion 12 is configured to form the frame portion 41B. is connected to

20 shows one fixing part 41C in the mask frame 41 and the peripheral structure of the fixing part 41C.

As FIG. 20 shows, 41 C of fixing parts are equipped with the screw part 41C1 and the suction part 41C2. A groove (not shown) into which the threaded portion 41C1 is screwed is formed on the surface partitioning the fixing hole BH1. The outer circumferential surface of the threaded portion 41C1 has a shape capable of being screwed into the groove of the fixing hole BH1. The threaded portion 41C1 has a rod shape extending along a direction from the back surface 41BR of the frame-shaped portion 41B toward the front surface 41BF. In the case where the entire threaded portion 41C1 is positioned within the fixing hole BH1, in the threaded portion 41C1, the end with a small distance from the back surface 41BR is the base end, and the end opposite to the base end is the tip. The suction part 41C2 is located at the tip of the screw part 41C1.

The adsorption unit 41C2 is formed of a magnet. The body portion 41A is formed of a ferromagnetic material. Alternatively, a portion of the main body portion 41A, including a region in contact with the adsorption portion 41C2, is made of a ferromagnetic material. Accordingly, when the suction portion 41C2 is in contact with the body portion 41A, the suction portion 41C2 is fixed to the body portion 41A, and thus the frame-shaped portion 41B is attached to the body portion 41A. It is fixed. 19 and 20 show a state in which the adsorbing portion 41C2 is separated from the body portion 41A, and the frame portion 41B is not fixed to the body portion 41A.

[fixation method]

Referring to FIGS. 19 to 22, a method of fixing the frame-shaped portion 41B to the body portion 41A will be described.

As shown in Figs. 19 and 20, in a state where the frame portion 41B is not fixed to the body portion 41A, the fixing portion 41C is prevented from coming into contact with the suction portion 41C2 to the body portion 41A. ) is attached to the frame-shaped portion 41B. By rotating the fixing part 41C in the first rotational direction, the position of the fixing part 41C with respect to the frame-shaped part 41B so as to bring the suction part 41C2 close to the surface 41BF of the frame-shaped part 41B. Change the By rotating the fixed portion 41C until the suction portion 41C2 is flush with the surface 41BF of the frame-shaped portion 41B, it is possible to bring the suction portion 41C2 into contact with the body portion 41A. Accordingly, it is possible to fix the frame-shaped portion 41B to the main body portion 41A by the magnetic force of the suction portion 41C2.

As Fig. 21 shows, by further rotating the fixing part 41C in the first rotational direction, it is possible to project the tip of the threaded part 41C1 from the surface 41BF of the frame-shaped part 41B.

As Fig. 22 shows, the distance between the surface 41BF of the frame-shaped portion 41B and the tip of the threaded portion 41C1 is the amount of protrusion of the fixing portion 41C. The smaller the amount of protrusion, the smaller the distance between the rear surface 41BR of the frame-shaped portion 41B and the rear surface 41AR of the body portion 41A. In other words, the larger the protruding amount, the larger the distance between the rear surface 41BR of the frame-shaped portion 41B and the rear surface 41AR of the body portion 41A. Thus, according to the fixing part 41C, in the thickness direction of the body part 41A, the position of the frame-shaped part 41B with respect to the body part 41A is changed between the first position and the second position. it is possible Therefore, it is possible to suppress positional displacement of the mask portion 12 due to variation in thickness between the plurality of frame-shaped portions 41B by the fixing portion 41C.

In addition, what is necessary is just to rotate the fixing part 41C in the 2nd rotation direction, when detaching the frame part 41B from the body part 41A. The second rotation direction is opposite to the first rotation direction. Accordingly, it is possible to form a gap between the suction portion 41C2 and the main body portion 41A by locating the tip of the threaded portion 41C1 in the fixing hole BH1. As a result, it is possible to release the fixation of the frame-shaped portion 41B to the body portion 41A.

In this way, according to the vapor deposition mask 40 of this embodiment, it is possible to fix the frame-shaped portion 41B to the body portion 41A by the fixing portion 41C. Furthermore, it is possible to change the distance between the rear surface 41BR of the frame-shaped portion 41B and the rear surface 41AR of the body portion 41A by the fixing portion 41C. In other words, it is possible to change the position of the frame-shaped portion 41B in the thickness direction of the mask portion 12 by the fixing portion 41C.

As described above, according to the second embodiment of the deposition mask, the method for manufacturing the deposition mask, and the method for manufacturing the display device, the above-described (1-1), (1-3), and (1-4) In addition, the effects described below can be obtained.

(2-1) With the fixing part 41C, it is possible to fix the frame-shaped part 41B to the body part 41A.

(2-2) It is possible to change the position of the frame-shaped portion 41B in the thickness direction of the mask portion 12 by the fixing portion 41C. Therefore, it is possible to suppress positional displacement of the mask portion 12 due to variation in thickness between the plurality of frame-shaped portions 41B by the fixing portion 41C.

(2-3) By fixing the frame portion 41B to the main body portion 41A with the three fixing portions 41C, the position of the frame portion 41B on the plane where the mask portion 12 spreads is adjusted. It is possible to determine with high precision.

[Modified Example of the Second Embodiment]

2nd Embodiment demonstrated above can be implemented with a change as follows.

[fixed part]

• The mask frame 41 may be provided with 4 or more fixing parts 41C. For example, in the case where the mask frame 41 includes four fixing parts 41C, the fixing parts 41C may be respectively located at the corners of the frame-shaped part 51B.

• The mask frame 41 may be provided with only two fixing parts 41C. In this case, fixing part 41C may be respectively located in the corner part located on the same diagonal line among the corner parts of frame-shaped part 41B.

[Third Embodiment]

Referring to FIGS. 23 and 24 , a third embodiment of a deposition mask, a method for manufacturing the deposition mask, and a method for manufacturing a display device will be described. In the third embodiment, compared to the first embodiment, the structure for fixing the frame-shaped portion to the main body is different. Therefore, in the following, while these differences are described in detail, the same reference numerals as those in the first embodiment are assigned to structures common to those of the first embodiment in the third embodiment, and detailed descriptions of the structures are omitted.

[Vapor deposition mask]

Fig. 23 shows the structure of the deposition mask seen from the viewpoint facing the back surface of the mask frame. 23 shows only one first opening and a structure around the first opening in the deposition mask.

As FIG. 23 shows, the deposition mask 50 includes a mask frame 51 and a mask portion 12 . Like the mask frame 11 of the first embodiment, the mask frame 51 includes a body portion 51A and a frame portion 51B. The main body portion 51A has a first opening portion 51AH. In the example shown in FIG. 23 , the outer shape of the first opening part 51AH has a rectangular shape. The main body portion 51A is provided with a plurality of supports 51A1 protruding into the first opening portion 51AH from the side surface defining the first opening portion 51AH. The support base 51A1 protrudes from the back surface 51AR of the main body portion 51A toward the front surface 51AF, in the first opening 51AH.

In the example shown in Fig. 23, the main body portion 51A is provided with a plurality of support bases 51A1 per one first opening portion 51AH. In this example, the body portion 51A is provided with three support bases 51A1 per one first opening portion 51AH. As seen from a viewpoint facing the back surface 51AR, among the corner portions of the first opening portion 51AH, the support base 51A1 is respectively located at two corner portions adjacent to each other in the X axis. The remaining support stand 51A1 is located at the center of the side surface that faces the side surface on which the two corners are located, among the side surfaces extending along the X axis. Seen from a viewpoint facing the back surface 51AR, each support base 51A1 has a quadrangular shape.

The main body portion 51A further includes a plurality of fixing pieces 51A2 protruding into the first opening portion 51AH from the side surface defining the first opening portion 51AH. Each fixing piece 51A2 projects from the back surface 51AR of the body portion 51A toward the front surface 51AF (see Fig. 24) in the first opening 51AH. In the example shown in FIG. 23 , a pair of fixing pieces 51A2 protrude into the first opening 51AH from each of the side surfaces extending along the Y-axis among the side surfaces defining the first opening 51AH. In addition, as a side surface extending along the X-axis among the side surfaces defining the first opening portion 51AH, a pair of fixing pieces 51A2 are positioned from the center of the side surface on which the support base 51A1 is not located, and the first opening portion 51AH ) protrudes from within.

The frame-shaped portion 51B is positioned on an XY plane defined by an X axis and a Y axis orthogonal to the X axis. An axis orthogonal to the XY plane is the Z axis. The frame-shaped portion 51B includes a frame main body 51B1 and a plurality of projecting pieces 51B2. The frame main body 51B1 has a rectangular frame shape. The frame-shaped portion 51B is positioned within the first opening 51AH. Each protruding piece 51B2 is located on the surface 51BF (see Fig. 24) of the frame-shaped portion 51B. Each protruding piece 51B2 extends downward from the frame body 51B1 toward the front surface 51AF of the body portion 51A. In the example shown in Fig. 23, the frame-shaped portion 51B is provided with three projecting pieces 51B2. When viewed from the viewpoint facing the rear surface 51BR of the frame-shaped portion 51B, one protruding piece 51B2 is positioned between the pair of fixing pieces 51A2. In addition, in FIG. 23, the 2nd opening part partitioned by the frame-shaped part 51B is covered by the mask part 12. As shown in FIG.

Fig. 24 shows a cross section along the line XXIV-XXIV shown in Fig. 23 .

As Fig. 24 shows, the mask frame 51 is further equipped with 51 C of screws for X-axis adjustment, 51E of fixing screws, and 51F of screws for Z-axis adjustment. In the X-axis, the protruding piece 51B2 of the frame-shaped portion 51B is sandwiched between a pair of fixing pieces 51A2, and also between the X-axis adjusting screw 51C and the fixing screw 51E. is plugged in The screw 51C for X-axis adjustment attaches the projecting piece 51B2 to one of the pair of fixing pieces 51A2. The fixing screw 51E attaches the projecting piece 51B2 to the other of the pair of fixing pieces 51A2. It is possible to change the position of the frame portion 51B in the X axis by changing the tightening amount of the screw 51C for X axis adjustment to the projecting piece 51B2.

Moreover, the mask frame 51 is further equipped with two Y-axis adjusting screws 51D and two fixing screws 51E (see Fig. 23). The remaining projecting pieces 51B2 are each sandwiched between a pair of fixing pieces 51A2 in the Y axis, and are also sandwiched between the Y axis adjusting screw 51D and the fixing screw 51E. The Y-axis adjusting screw 51D attaches the protruding piece 51B2 to one of the pair of fixing pieces 51A2. The fixing screw 51E attaches the projecting piece 51B2 to the other of the pair of fixing pieces 51A2. It is possible to change the position of the frame portion 51B in the Y-axis by changing the tightening amount of the Y-axis adjusting screw 51D to the projecting piece 51B2.

That is, in this embodiment, an example of the 2nd position adjustment part is comprised by 51 C of X-axis adjusting screws, 51 D of Y-axis adjusting screws, and the fixing screw 51E. According to the second position adjusting unit, the position of the frame portion 51B with respect to the main body portion 51A is changed between the third position and the fourth position in the plane where the frame portion 51B spreads. It is possible. Therefore, it is possible to suppress the displacement of the second opening between the plurality of frame-shaped portions 51B by the second position adjusting portion.

The screw 51F for Z-axis adjustment has a rod shape extending along the Z-axis. The screw 51F for Z-axis adjustment is passed through the through-hole passing through the support stand 51A1 along the Z-axis, and thereby the screw 51F for Z-axis adjustment is attached to the body portion 51A. In the state where the Z-axis adjusting screw 51F is in contact with the frame portion 51B, the end portion of the Z-axis adjusting screw 51F in contact with the frame portion 51B is the front end, and the end portion on the opposite side to the front end is the air mass. At the tip of the Z-axis adjusting screw 51F, a suction portion (not shown) is located. The adsorbing portion is formed of a magnet. The frame main body 51B1 of the frame-shaped portion 51B is formed of a ferromagnetic material. Alternatively, as part of the frame body 51B1, a portion including a region where the Z-axis adjusting screw 51F contacts is made of a ferromagnetic material. Thereby, when the Z-axis adjustment screw 51F contacts the frame body 51B1, the frame body 51B1 is fixed to the Z-axis adjustment screw 51F. By changing the amount by which the tip of the Z-axis adjusting screw 51F protrudes from the support base 51A1, it is possible to change the position of the frame portion 51B in the Z-axis. That is, in the present embodiment, the screw 51F for Z-axis adjustment is an example of the first position adjusting unit. According to the Z-axis adjusting screw 51F, in the thickness direction of the body portion 51A, that is, in the Z-axis, there is a positional displacement of the mask portion 12 due to variation in thickness among the plurality of frame-shaped portions 51B. can be suppressed by the Z-axis adjusting screw 51F.

[fixation method]

Hereinafter, a method of fixing the frame-shaped portion 51B to the body portion 51A will be described. Further, when fixing the frame portion 51B to the main body portion 51A, it is possible to use a holder holding the frame portion 51B. The holder can be located, for example, in a region inside the support table 51A1 in the first opening part 51AH when viewed from the viewpoint facing the back surface 51AR of the main body portion 51A. The holding table has a mounting unit and a lifting unit. The frame-shaped portion 51B is mounted on the mounting portion. The lifting part is configured to be able to move the mounting part up and down so as to change the position of the frame-shaped part 51B with respect to the main body part 51A in the Z axis.

In the vapor deposition mask 50 of the present embodiment, when fixing the frame portion 51B to the main body portion 51A, first, in a state where the frame portion 51B is held on the holder, three Z-axis adjustments are performed. The screw 51F determines the position of the frame-shaped portion 51B in the Z axis. At this time, the amount by which each Z-axis adjusting screw 51F protrudes from the support base 51A1 is set to a predetermined size, and then the frame-shaped portion 51B is fixed to the Z-axis adjusting screw 51F. Then, each protruding piece 51B2 is fixed to the fixing piece 51A2 using a fixing screw 51E. Next, while fixing the protruding piece 51B2 of the frame portion 51B to the fixing piece 51A2 of the body portion 51A using the X-axis adjusting screw 51C, the frame portion 51B in the X axis ) to determine the location of Further, while fixing the projecting piece 51B2 to the fixing piece 51A2 using the Y-axis adjustment screw 51D, the position of the frame portion 51B in the Y-axis is determined. Accordingly, the frame portion 51B is fixed to the main body portion 51A at a predetermined position on the XY plane and on the Z axis.

Further, by removing the X-axis adjusting screw 51C, the Y-axis adjusting screw 51D, and the Z-axis adjusting screw 51F from the frame-shaped portion 51B, the frame portion 51B relative to the body portion 51A ) can be unlocked.

As described above, the deposition mask, the manufacturing method of the deposition mask, and the manufacturing method of the display device have the effects described below in addition to the above-described (1-1), (1-3), and (1-4). can be obtained.

(3-1) It is possible to adjust the position of the frame portion 51B on the XY plane using the X-axis adjusting screw 51C and the Y-axis adjusting screw 51D. In this way, it is possible to suppress positional displacement of the second opening portion between the plurality of frame-shaped portions 51B.

(3-2) Using the Z-axis adjusting screw 51F, it is possible to adjust the position of the frame-shaped portion 51B in the Z-axis. Accordingly, it is possible to suppress positional displacement of the mask portion 12 due to variations in thickness among the plurality of frame-shaped portions 51B by means of the Z-axis adjusting screws 51F.

[Modified example of the third embodiment]

3rd Embodiment demonstrated above can be implemented with a change as follows.

[support fixture]

- 51 A of main-body parts may be provided with 4 or more support bases 51 A1. For example, when main-body part 51A has four support bases 51A1, each support base 51A1 may protrude from the corner part of 1st opening part 51AH. In addition, when main-body part 51A is equipped with 4 or more support base 51A1, the mask frame 51 may be equipped with the same number of Z-axis adjustment screws 51F as support base 51A1.

• The support base 51A1 of the main body portion 51A may have a shape protruding from the first opening portion 51AH over the entire circumference of the first opening portion 51AH. That is, the body portion 51A may include a stepped portion in which the opening of the rear face 51AR of the body portion 51A in the first opening portion 51AH is widened.

[cover]

• The vapor deposition mask 50 may be provided with a cover covering the support base 51A1, the fixing piece 51A2, and the projecting piece 51B2. The cover covers the support base 51A1, the fixing piece 51A2, and the protruding piece 51B2 when viewed from a viewpoint facing the front surface 51AF of the body portion 51A. Accordingly, when the deposition mask 50 is mounted on the deposition apparatus, the cover is positioned between the deposition source, the support base 51A1, the fixing piece 51A2, and the protruding piece 51B2. Therefore, adhesion of the evaporation material to the support 51A1, the fixing piece 51A2, and the projecting piece 51B2 is suppressed by the cover. Accordingly, adhesion of evaporation material to the X-axis adjusting screw 51C, the Y-axis adjusting screw 51D, the fixing screw 51E, and the Z-axis adjusting screw 51F is also suppressed by the cover.

[Fourth Embodiment]

Referring to Figs. 25 and 26, a fourth embodiment of a deposition mask, a method for manufacturing the deposition mask, and a method for manufacturing a display device will be described. In 4th Embodiment, compared with 1st Embodiment, the structure which fixes a frame-shaped part to a body part is different. Therefore, in the following, while these differences are described in detail, the same reference numerals as those in the first embodiment are assigned to structures common to those of the first embodiment in the fourth embodiment, and detailed descriptions of the structures are omitted.

[Vapor deposition mask]

Fig. 25 shows the structure of the deposition mask seen from the viewpoint facing the back surface of the mask frame. 25 shows only one first opening and a structure around the first opening in the deposition mask.

As FIG. 25 shows, the deposition mask 60 includes a mask frame 61 and a mask part 12 . The mask frame 61 is equipped with the body part 61A and the frame shape part 61B similarly to the mask frame 11 of 1st Embodiment. The frame-shaped portion 61B includes a frame main body 61B1 and a plurality of projecting pieces 61B2. The frame main body 61B1 has a rectangular frame shape and is configured to be able to support the mask portion 12 . The frame main body 61B1 is positioned on the XY plane defined by the X axis and the Y axis orthogonal to the X axis. An axis orthogonal to the XY plane is the Z axis.

The projecting piece 61B2 protrudes outward from the edge of the frame body 61B1. In the example shown in Fig. 25, the frame-shaped portion 61B is provided with three projecting pieces 61B2. The frame-shaped portion 61B is provided with a protruding piece 61B2 extending along the Y-axis from a side extending along the X-axis among the edges of the frame main body 61B1. The frame-shaped portion 61B includes a protruding piece 61B2 extending along the X axis from one side extending along the Y axis among the edges of the frame body 61B1, and along the Y axis among the edges of the frame body 61B1. A protruding piece 61B2 extending along the X axis from the other extending side is provided.

61 A of main-body parts are provided with support part 61A1 and several fixing piece 61A2. The support part 61A1 has a plurality of first openings 61AH. Each fixing piece 61A2 is supported by the support part 61A1. The fixing piece 61A2 is positioned around the first opening 61AH. One protruding piece 61B2 is fixed to each fixing piece 61A2. When viewed from a viewpoint facing the XY plane, in a state where the frame portion 61B is fixed to the body portion 61A, each fixing piece 61A2 is a protruding piece 61B2 fixed to the fixing piece 61A2. ) has a U-shape surrounding it. By fixing projecting piece 61B2 to fixing piece 61A2, support part 61A1 supports frame main body 61B1.

The mask frame 61 is further equipped with 61 C of X-axis adjusting screws, 61 D of Y-axis adjusting screws, and 61E of fixing screws. In the example shown in FIG. 25 , the mask frame 61 includes one X-axis adjusting screw 61C, two Y-axis adjusting screws 61D, and three fixing screws 61E.

The screw 61C for X-axis adjustment fixes the protruding piece 61B2 extending along the Y-axis to the fixing piece 61A2 surrounding the protruding piece 61B2 together with one fixing screw 61E. The X-axis adjusting screw 61C and the fixing screw 61E fix the protruding piece 61B2 to the fixing piece 61A2 in a state where the protruding piece 61B2 is sandwiched along the X-axis. Both the X-axis adjusting screw 61C and the fixing screw 61E are screws having a shape capable of being screwed into the side surface defining the through hole formed in the fixing piece 61A2. By changing the tightening amount of the X-axis adjusting screw 61C, it is possible to change the position of the protruding piece 61B2 in the X-axis and, consequently, the position of the frame portion 61B.

Each Y-axis adjusting screw 61D fixes the protruding piece 61B2 extending along the X axis to the fixing piece 61A2 surrounding the protruding piece 61B2 together with one fixing screw 61E. The Y-axis adjusting screw 61D and the fixing screw 61E fix the protruding piece 61B2 to the fixing piece 61A2 in a state where the protruding piece 61B2 is sandwiched in the Y-axis. Both the Y-axis adjusting screw 61D and the fixing screw 61E are screws that can be screwed into the side surface defining the through hole formed in the fixing piece 61A2. By changing the tightening amount of the Y-axis adjusting screw 61D, it is possible to change the position of the protruding piece 61B2 in the Y-axis and, consequently, the position of the frame portion 61B.

That is, in this embodiment, an example of the 2nd position adjustment part is comprised by 61 C of X-axis adjusting screws, 61 D of Y-axis adjusting screws, and the fixing screw 61E.

The mask frame 61 is further equipped with a plurality of Z-axis adjusting screws 61F. In the example shown in Fig. 25, three Z-axis adjusting screws 61F are provided. Seen from a viewpoint facing the XY plane, one Z-axis adjustment screw 61F is located near a portion of the edge of the frame body 61B1 where the fixing piece 61A2 extending along the Y-axis is located. The remaining Z-axis adjusting screws 61F are two corner portions adjacent to each other in the X axis among the corner portions of the frame body 61B1, and the above-described one Z-axis adjusting screw 61F is located. Each of them is located at the top of the triangle forming a triangle.

Fig. 26 shows a cross section along the line XXVI-XXVI shown in Fig. 25 .

As Fig. 26 shows, each Z-axis adjusting screw 61F is attached to a through hole formed in the support part 61A1. Each Z-axis adjusting screw 61F includes a screw portion 61F1 and a suction portion 61F2. The threaded portion 61F1 has a rod shape extending along the Z axis. In the state where the Z-axis adjustment screw 61F is attached to the support portion 61A1, among the ends of the screw portion 61F1, the end having a small distance from the frame-shaped portion 61B is the tip, and the end on the opposite side to the tip is it is a base The suction part 61F2 is located at the tip of the screw part 61F1.

The adsorbing portion 61F2 is formed of a magnet. The frame main body 61B1 of the frame-shaped portion 61B is formed of a ferromagnetic material. Alternatively, a portion of the frame main body 61B1 including a region in contact with the adsorption portion 61F2 is made of a ferromagnetic material. Thereby, when the adsorption part 61F2 touches the frame main body 61B1, the adsorption part 61F2 is fixed to the frame main body 61B1. By changing the amount by which the Z-axis adjustment screw 61F protrudes from the support portion 61A1, it is possible to change the position of the frame portion 61B in the Z-axis. That is, in this embodiment, the screw 61F for Z-axis adjustment is an example of the 1st position adjusting part.

[fixation method]

Hereinafter, the fixing method of the frame-shaped part 61B to the body part 61A is explained. Further, in the fourth embodiment, when fixing the frame-shaped portion 61B to the body portion 61A, it is possible to use a holder equivalent to the holder described in the third embodiment.

In the vapor deposition mask 60 of the present embodiment, when fixing the frame portion 61B to the main body portion 61A, first, in a state where the frame portion 61B is held on the holder, the Z-axis adjusting screw ( 61F) adjusts the protruding amount from the support portion 61A1, and the suction portion 61F2 located at the tip of the Z-axis adjusting screw 61F is attracted to the frame-shaped portion 61B. Accordingly, the position of the frame portion 61B in the Z axis is determined by the three Z axis adjusting screws 61F. And each projecting piece 61B2 is fixed to fixing piece 61A2 using the fixing screw 61E. Next, the position of the frame-shaped portion 61B on the XY plane is determined using one X-axis adjusting screw 61C and two Y-axis adjusting screws 61D. Thereby, the frame-shaped portion 61B is fixed to the main body portion 61A at predetermined positions on the XY plane and on the Z axis. Further, by removing the X-axis adjusting screw 61C, the Y-axis adjusting screw 61D, and the Z-axis adjusting screw 61F from the frame-shaped portion 61B, the frame portion 61B relative to the body portion 61A ) can be unlocked.

As described above, according to the fourth embodiment of the deposition mask, the method for manufacturing the deposition mask, and the method for manufacturing the display device, the above-described (1-1), (1-3), and (1-4) In addition, the effects described below can be obtained.

(4-1) It is possible to adjust the position of the frame portion 61B on the XY plane using the X-axis adjusting screw 61C and the Y-axis adjusting screw 61D. In this way, it is possible to suppress positional displacement of the second opening portion between the plurality of frame-shaped portions 61B.

(4-2) Using the Z-axis adjusting screw 61F, it is possible to adjust the position of the frame-shaped portion 61B in the Z-axis. Accordingly, it is possible to suppress positional displacement of the mask portion 12 due to variations in thickness among the plurality of frame-shaped portions 61B by means of the Z-axis adjustment screws 61F.

[Modified Example of the 4th Embodiment]

4th Embodiment demonstrated above can be implemented with a change as follows.

[Frame shape part]

• The frame-shaped portion 61B may include four or more projecting pieces 61B2. For example, in the case where the frame portion 61B includes four protruding pieces 61B2, the frame portion 61B is one of a pair of edges extending along the X axis among the edges of the frame body 61B1. You may provide protruding pieces 61B2 protruding from each two at a time. In this case, the body portion 61A may be provided with the same number of fixing pieces 61A2 as the protruding pieces 61B2.

[Screw for Z-axis adjustment]

• The mask frame 61 may be provided with 4 or more screws 61F for Z-axis adjustment. For example, when the mask frame 61 is provided with four Z-axis adjusting screws 61F, the Z-axis adjusting screws are positioned overlapping the corners of the frame body 61B1 when viewed from a viewpoint facing the XY plane. 61F may be located respectively.

[Fifth Embodiment]

27 and 28, a fifth embodiment of a deposition mask, a method for manufacturing the deposition mask, and a method for manufacturing a display device will be described. In the fifth embodiment, compared to the first embodiment, the structure for fixing the frame-shaped portion to the main body is different. Therefore, in the following, while these differences are described in detail, the same reference numerals as those in the first embodiment are assigned to structures common to the first embodiment in the fifth embodiment, and detailed descriptions of the structures are omitted.

[Vapor deposition mask]

Fig. 27 shows the structure of the deposition mask seen from the viewpoint facing the back surface of the mask frame. 27 shows only one first opening and a structure around the first opening in the deposition mask.

As FIG. 27 shows, the deposition mask 70 includes a mask frame 71 and a mask portion 12 . Like the mask frame 11 of the first embodiment, the mask frame 71 includes a body portion 71A and a frame portion 71B. The frame-shaped portion 71B has a rectangular frame shape. The frame-shaped portion 71B is positioned on the XY plane defined by the X axis and the Y axis orthogonal to the X axis. An axis orthogonal to the XY plane is the Z axis.

The body portion 71A has a first opening 71AH. When viewed from a viewpoint facing the back surface 71AR of the body portion 71A, the outer shape of the first opening part 71AH has a rectangular shape. The frame-shaped portion 71B described above is positioned within the first opening 71AH when viewed from a viewpoint facing the back surface 71AR. The main body portion 71A is provided with a plurality of recesses 71A1 per first opening 71AH. The plurality of recesses 71A1 include two pairs of recesses 71A1 sandwiching the first opening 71AH along the X axis and two pairs of recesses 71A1 sandwiching the first opening 71AH along the Y axis. contains In the two pairs of recesses 71A1 sandwiching the first opening 71AH along the X-axis, each recess 71A1 is adjacent to a different corner portion of the first opening 71AH. In the two pairs of recesses 71A1 sandwiching the first opening 71AH along the Y-axis, each recess 71A1 is adjacent to a mutually different corner portion of the first opening 71AH.

The mask frame 71 is further equipped with 71 C of X-axis adjustment screws, 71 D of Y-axis adjustment screws, and 71 E of Z-axis adjustment parts. In the example shown in FIG. 27 , the mask frame 71 is provided with four screws 71C for X-axis adjustment.

71 C of screws for X-axis adjustment are attached one by one to the corner part of frame-shaped part 71B. Each X-axis adjusting screw 71C has a rod shape extending from the corner of the frame portion 71B toward the outside of the frame portion 71B. In the X-axis adjustment screw 71C, the end attached to the frame-shaped portion 71B is the front end, and the end opposite to the front end is the base end. The tip (not shown) of the X-axis adjusting screw 71C has a spherical shape and is held in a groove formed in the frame-shaped portion 71B. Therefore, the tip of the X-axis adjustment screw 71C is not fixed to the frame-shaped portion 71B. The screw 71C for X-axis adjustment passes through the through hole formed between the first opening part 71AH and the recess 71A1, and thereby the screw 71C for X-axis adjustment is supported by the body portion 71A. . The base end of 71 C of screws for X-axis adjustment is located in recess 71A1. By changing the amount by which the X-axis adjusting screw 71C protrudes into the recess 71A1, it is possible to change the position of the frame-shaped portion 71B in the X-axis. The amount by which the X-axis adjusting screw 71C protrudes can be changed by the tightening amount of the X-axis adjusting screw 71C.

The mask frame 71 is provided with four Y-axis adjusting screws 71D. Each Y-axis adjusting screw 71D is attached to a corner of the frame-shaped portion 71B. Each Y-axis adjusting screw 71D has a rod shape extending from the corner of the frame portion 71B toward the outside of the frame portion 71B. In the Y-axis adjusting screw 71D, the end attached to the frame-shaped portion 71B is the front end, and the end opposite to the front end is the base end. The tip (not shown) of the Y-axis adjusting screw 71D has a spherical shape and is held in a groove formed in the frame-shaped portion 71B. Therefore, the tip of the Y-axis adjusting screw 71D is not fixed to the frame-shaped portion 71B. The Y-axis adjusting screw 71D passes through a through hole formed between the first opening part 71AH and the recess 71A1, and thus the Y-axis adjusting screw 71D is supported by the body portion 71A. . The base end of the Y-axis adjusting screw 71D is located in the recess 71A1. It is possible to change the position of the frame-shaped portion 71B in the Y-axis by changing the amount by which the Y-axis adjusting screw 71D protrudes into the recess 71A1. The amount by which the Y-axis adjusting screw 71D protrudes can be changed by the tightening amount of the Y-axis adjusting screw 71D.

That is, in this embodiment, an example of the 2nd position adjustment part is comprised by 71 C of X-axis adjustment screws and 71 D of Y-axis adjustment screws.

FIG. 28 is a cross section along the line XXVIII-XXVIII shown in FIG. 27 .

As Fig. 28 shows, the body portion 71A has a stepped portion AH1 in which the opening of the back surface 71AR of the body portion 71A in the first opening portion 71AH is widened. The mask frame 71 is provided with four Z-axis adjustment units 71E. In the Z-axis, one Z-axis adjusting portion 71E is positioned between the side surface that divides the step portion AH1 and the corner portion of the frame-shaped portion 71B.

Each Z-axis adjustment unit 71E is an elastic body, such as a spring. The Z-axis adjusting portion 71E is reduced according to the load applied from the frame-shaped portion 71B by placing the frame portion 71B on the Z-axis adjusting portion 71E. Therefore, the position of the frame portion 71B in the Z axis is determined by the elastic force of the Z axis adjusting portion 71E and the load applied to the Z axis adjusting portion 71E by the frame portion 71B. In addition, the load applied to the Z-axis adjustment unit 71E may include not only a load due to the weight of the frame portion 71B, but also a load due to an evaporation target placed on the frame portion 71B. As described above, the vapor deposition target is, for example, a glass substrate. In the glass substrate, on a surface in contact with the frame-shaped portion 71B, a bank is formed to separate a pixel formed on the glass substrate from other pixels. Therefore, when a glass substrate is placed on the frame-shaped portion 51B, a load due to the glass substrate is applied to the Z-axis adjusting portion 71E through the bank of the glass substrate.

[fixation method]

Hereinafter, a method of fixing the frame-shaped portion 71B to the body portion 71A will be described. Further, in the fifth embodiment, when fixing the frame portion 71B to the body portion 71A, it is possible to use a holding table equivalent to the holding table described in the third embodiment.

In the vapor deposition mask 70 of the present embodiment, when fixing the frame portion 71B to the body portion 71A, first, in a state where the frame portion 71B is held on the holder, the body portion 71A The X-axis adjusting screw 71C and the Y-axis adjusting screw 71D attached thereto are held by the frame-shaped portion 71B. Next, at least one of the protruding amount of the X-axis adjusting screw 71C and the protruding amount of the Y-axis adjusting screw 71D in the recess 71A1 is adjusted. Thereby, at a predetermined position on the XY plane, the frame-shaped portion 71B is fixed to the body portion 71A. Then, by removing the holder from the frame portion 71B, the load of the frame portion 71B is applied to the Z-axis adjusting portion 71E. Accordingly, the frame-shaped portion 71B is supported by the Z-axis adjusting portion 71E at a predetermined position along the Z-axis. Further, by removing the X-axis adjusting screw 71C and the Y-axis adjusting screw 71D from the frame portion 71B, it is possible to release the fixation of the frame portion 71B to the main body portion 71A. do.

As described above, according to the fifth embodiment of the deposition mask, the manufacturing method of the deposition mask, and the manufacturing method of the display device, in addition to the above-mentioned (1-1) and (1-4), the effect described below can be obtained.

(5-1) It is possible to adjust the position of the frame portion 61B on the XY plane using the X-axis adjusting screw 71C and the Y-axis adjusting screw 71D. In this way, it is possible to suppress positional displacement of the second opening portion between the plurality of frame-shaped portions 71B.

[Modified Example of the Fifth Embodiment]

In addition, 5th Embodiment mentioned above can be implemented with a change as follows.

[Screw for X-axis adjustment]

• The mask frame 71 may have only three screws 71C for X-axis adjustment. In this case, any of the four X-axis adjusting screws 71C of the mask frame 71 described above may be omitted.

[Screw for Y-axis adjustment]

• The mask frame 71 may have only three Y-axis adjusting screws 71D. In this case, any of the four Y-axis adjusting screws 71D of the mask frame 71 described above may be omitted.

10, 40, 50, 60, 70: deposition mask
11, 41, 51, 61, 71: mask frame
11A, 41A, 51A, 61A, 71A: main body
11AF, 11BF, 11F, 12F, 41AF, 41BF, 51AF, 51BF: surface
11AH, 41AH, 51AH, 61AH, 71AH: 1st opening
11AR, 11BR, 11R, 12R, 41AR, 41BR, 51AR, 51BR, 71AR: back side
11B, 41B, 51B, 61B, 71B: frame shape
11BH, 41BH: 2nd opening
12: mask part
12H: mask hole

Claims (9)

As a deposition mask,
As a mask frame,
A body portion having a first surface, a first back surface opposite to the first surface, and a first opening penetrating between the first surface and the first back surface;
A frame-shaped portion having a second surface and a second back surface opposite to the second surface, comprising a frame-shaped portion having a second opening penetrating between the second surface and the second back surface;
The frame-shaped part is detachably attached to the main body on the first back side so that the position of the second opening on the second surface matches the position of the first opening on the first surface. A mask frame configured to be able to do;
A mask portion having a plurality of mask holes, comprising the mask portion bonded to the second back surface so as to cover the second opening portion.
deposition mask. According to claim 1,
The mask part is one of a plurality of mask parts,
The body portion includes a plurality of first openings, and the first opening is one of the plurality of first openings;
The mask frame includes a plurality of frame-shaped parts, and the frame-shaped part is one of the plurality of frame-shaped parts,
The position of the second opening of each frame-shaped part on the second surface matches the position of the first opening on the first surface matching the position of the other second openings on the second surface; matches the position on the first surface of the different first apertures,
Each mask part is joined by welding to the second back surface of the frame part different from the frame part to which the other mask parts are joined,
Each frame-shaped portion has a weld scar formed by welding the mask portion to the frame-shaped portion, and the weld scar is a recess formed on the second back surface.
deposition mask. According to claim 1 or 2,
The frame-shaped portion is formed of a metal having magnetism,
The mask frame further includes a fixing portion for fixing the frame-shaped portion to the body portion by magnetic adsorption so that it can be detached from the body portion.
deposition mask. According to any one of claims 1 to 3,
The mask frame includes a first position adjusting unit configured to be able to change the position of the frame-shaped portion relative to the body portion between a first position and a second position in the thickness direction of the body portion.
deposition mask. According to any one of claims 1 to 4,
The mask frame includes a second position adjusting unit configured to be able to change the position of the frame-shaped portion relative to the main body between a third position and a fourth position in a plane in which the frame-shaped portion spreads.
deposition mask. According to any one of claims 1 to 5,
The body portion has a stepped portion in which an opening in the first back surface of the first opening portion is widened,
The frame shape is configured to be located in the stepped portion
deposition mask. According to claim 6,
The frame-shaped portion, in a cross section orthogonal to the second back surface, has a thickness equal to or greater than the depth of the stepped portion of the body portion.
deposition mask. Bonding a mask portion to a frame shape having a second opening penetrating between a second surface and a second back surface, and
Mounting the frame-shaped portion to a body portion having a first opening penetrating between the first surface and the first back surface;
Bonding the mask part includes bonding the mask part to the second back surface so as to cover the second opening,
Attaching the frame-shaped portion is to attach the frame-shaped portion to the first back side so that the position of the second opening on the second surface matches the position of the first opening on the first surface. Including detachably attaching to the main body
A method for manufacturing a deposition mask. Forming a pattern on a deposition target using a deposition mask manufactured by the method for manufacturing a deposition mask according to claim 8
A method for manufacturing a display device.

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