KR20220149003A - Connector with embedded readout integrated circuit - Google Patents

Abstract

The present invention relates to a connector with an embedded readout integrated circuit (ROIC), which is connected to a wiring line connected to a microcontroller unit (MCU) to allow an electrical connection between a functional means connected to one side of the connector and the microcontroller unit. The connector comprises: a housing which has a predetermined accommodation space therein, and corresponds to a body allowing an electrical connection through an ROIC between the MCU and the functional means through a mechanical connection with the wiring line connected to the MCU; a substrate which is installed within the accommodation space of the housing and is patterned with a predetermined structure; and an ROIC which is connected to and installed at one side of the substrate, and which processes a signal received through communication with the MCU or the functional means and provides the processed signal. The wiring line includes a single communication line. A plurality of the connectors with the embedded readout integrated circuits are connected in series and fastened to share the same communication line along the single communication line constructed through the connection with the MCU, thereby constructing a communication network for bidirectional signal communication between the MCU and each of the functional means connected to the connectors with the embedded readout integrated circuits.

Description

Connector with integrated readout circuit {CONNECTOR WITH EMBEDDED READOUT INTEGRATED CIRCUIT}

The present invention can establish an electrical connection with a single communication line in a wiring line connected to a microcontroller unit (MCU), and a readout integrated circuit (ROIC) is built in the connector. it's about

A microcontroller unit (MCU, Micro Controller Unit) applied to electronic devices including various home appliances is a major component that performs control through input/output of signals in performing functions of various modules installed in the applied device. A communication network network of signals based on electrical connection is established between modules installed to implement various functions.

For example, the microcontroller unit receives signals generated or extracted by modules such as motors, LEDs, buttons, switches, etc. from various sensors mounted on home appliances, and based on these, the microcontroller unit generates control commands, Various means and structures have been used to mediate the mutual electrical connection between them in constructing a single signal communication network that transmits signals for operation control to the modules of the .

In the conventional case, the wiring structure between the microcontroller unit and the modules provided for performing each function is individually made and has a 1:1 connection structure, so the wiring structure becomes complicated, and when the number of connected modules increases, workability becomes gradually This heightened and difficulties arose.

Accordingly, various technical attempts have been made to facilitate the mediation of signals in the connection between the configuration of the integrated control through the connection of the connector and the configuration to be controlled more smoothly and systematically, and to improve the workability of the connection. have.

In this regard, in the prior art related to the prior art prepared to provide a connector coupling structure of an electronic control device with improved workability and waterproof airtightness in coupling the connector to the housing of the electronic control device, Korean Patent Publication No. 10-1856070 discloses " There is a connector coupling structure of an electronic control device" (hereinafter referred to as 'prior art').

However, in the case of the conventional connector including the prior art, as an individual serial connection method is adopted in the connection method between the configuration for performing integrated control and the configuration to be controlled, the wiring structure is changed when the configuration to be controlled increases. There was a problem in that the easiness of the connection work was significantly lowered as well as the complexity.

In addition, in the case of existing connectors including the prior art, even if the wiring connection structure is simplified away from the 1:1 correspondence method, the connector simply performs a function only for mutual electrical connection, and between the control target configuration and the connector. A separate Printed Circuit Board (PCB) board was additionally installed and designed to process signals, so structural complexity was high and ease of operation was significantly lacking.

The present invention was created to solve the above problems, and an object of the present invention is to control various functions based on a single communication line in a wiring line connected to a micro controller unit (MCU). It is to provide a connector that not only can connect the modules to be executed in succession on the same communication line, but also has a built-in IC configuration therein.

In order to achieve the above object, the present invention provides a read integrated circuit (ROIC) for making electrical connection between a functional means connected to one side and the microcontroller unit by forming a connection with a wiring line connected to a microcontroller unit (MCU). , Readout Integrated Circuit) A connector with a built-in connector having a predetermined accommodating space therein, and passing through a readout integrated circuit between the microcontroller unit and the functional means through a wiring line connected to the microcontroller unit and mechanical connection a housing corresponding to the body to be electrically connected; a substrate embedded in the housing space and patterned into a predetermined structure; and a read integrated circuit connected to one side of the substrate and configured to process a signal received through communication with the microcontroller unit or the functional means and provide the processed signal; (Single) a communication line, and a plurality of read integrated circuit embedded connectors are connected to each other so as to share the same communication line along the single communication line established through connection with the microcontroller unit, so that the microcontroller unit and the read integrated circuit are connected It is possible to establish a communication network for bidirectional signal communication between each of the functional means connected to the built-in circuit connector.

Here, the functional means may include at least one of a sensing module for sensing a specific sensed value, a driving module for driving a specific mechanical operation, and a signal input/output module for inputting or outputting a specific signal.

In addition, the readout integrated circuit built-in connector is provided on the other side of the board and identifies each readout integrated circuit built-in connector according to a potential value based on an electrical connection structure with an address setting pin provided in the readout integrated circuit. It further includes; an address setting unit that provides unique identification address information for.

In addition, at least one address setting pin provided in the read integrated circuit is provided, and the address setting unit is provided in the same number as the address setting pin, and GND, VDD ( 5V), SDA (Signal), and VIN (12V), including at least two or more address setting parts, and the address among at least two or more of the address setting parts in the address setting unit corresponding to each of the at least one or more address setting pins. The unique identification address information may be set differently according to the type of one address setting part electrically connected to the setting pin.

In addition, the electrical connection between at least one address setting pin and one of the at least two address setting parts in the address setting unit corresponding to the one or more address setting pins is a wire bonding method or a resistance soldering method. can be done

In addition, a protective film covering the read integrated circuit may be provided on the substrate through molding using a synthetic resin material.

And the wiring line further includes a power line and a ground line, and the read integrated circuit forms a terminal with each of the single communication line, the power line, and the ground line in the wiring line, and the electrical power between the different pins for each line is formed. connection can be made.

Here, the housing includes an upper body part and a lower body part that are coupled to each other and can be fixedly installed on the wiring line, and the single communication line, the power line and the ground line can be placed inside the upper body part by being recessed upward. A line arrangement portion providing a predetermined arrangement space is provided, and one side of the read integrated circuit is electrically connected to the inside of the lower body portion, and at a lower position that can correspond to the line arrangement portion in the vertical direction, conductive When a contact forming part is provided with at least one tip structure that is made of a material and protrudes sharply toward the upper side, and the upper body part and the lower body part are mutually fastened with the wiring line in the middle. In each of the single communication line, the power line and the ground line disposed in the line arrangement portion, a contact forming portion may be inserted into the line through a covering to form an electrical connection.

One side is electrically connected to the readout integrated circuit inside the lower body part, and at a lower position that can correspond to the line arrangement part in the vertical direction, at least one tip made of a conductive material and protruding sharply upward Contact forming part with (尖端) structure is provided

According to the present invention, there are the following effects.

First, a connector with a built-in readout integrated circuit (ROIC) that mediates signal transmission and reception between the microcontroller unit and modules that perform various functions, including sensors, and can perform signal processing in communication can provide

Second, as it becomes possible to connect modules that are subject to control based on a single communication line in the wiring line connected to the microcontroller unit (MCU) and perform various functions by sharing the same communication line, Even if the number of modules to be connected increases to a plurality, the wiring structure is not complicated and the easiness of operation can be maintained excellently.

Third, preset setting so that address information for identification of each module is distinguished even if multiple modules to be controlled are connected based on a single communication line in a wiring line connected to a microcontroller unit (MCU, Micro Controller Unit) Therefore, the control for each module can be managed efficiently and clearly.

Fourth, the upper side of the read integrated circuit connected to the board embedded in the connector is covered with a protective film so that the circuit can be protected and stable operation can be maintained at all times.

Fifth, since the connector is connected to the wiring line connected to the microcontroller unit (MCU, Micro Controller Unit), the contact forming part is provided so that it can be electrically connected directly to the inside of the wire through the coating of the wiring. Electrical connection can be made more simply and easily without the need to perform post-connection work.

1 is a diagram illustrating a connection structure between a microcontroller unit and functional means of a connector with a built-in readout integrated circuit according to the present invention.
2 is a diagram illustrating a connection structure between a microcontroller unit and functional means of a conventional connector.
3 is a view for explaining an electrical connection method with a wiring structure connected to a microcontroller unit of a readout integrated circuit embedded connector according to the present invention.
4 and 5 are diagrams illustrating a connection structure between detailed components in a readout integrated circuit embedded connector according to the present invention.
6 is a view showing a detailed cross-sectional structure of a housing provided to perform electrical connection with a wiring structure connected to a microcontroller unit of a readout integrated circuit embedded connector according to the present invention.

A preferred embodiment of the present invention will be described in more detail with reference to the accompanying drawings, but the already known technical parts will be omitted or compressed for the sake of brevity of description.

<Description of components and operation form of the integrated readout integrated circuit connector>

First, according to the present invention, functional means (S1, S1, S2, S3, S4, L, SW) and a readout integrated circuit (ROIC) for making an electrical connection between the microcontroller unit (M) relates to a built-in connector (100, Connector), Figures 1 to 6 It will be described in detail with reference to the configuration block diagram and circuit diagram of

First, the microcontroller unit M is a configuration that performs practical integrated control of various components connected to the installed device, and wiring lines L1, L2, and L3 are connected to one side as shown in FIG. 1, these wirings The configuration of the lines L1 , L2 , and L3 includes a power supply line L1 , a communication line L2 , and a ground line L3 .

And the power line (L1), the communication line (L2) and the ground line (L3) included in these wiring lines (L1, L2, L3) is the number of connection of the functional means (S1, S2, S3, S4, L, SW) Regardless, it is sufficient to have only one line, and in particular, the communication line L2 is preferably provided to build a network for transmitting and receiving signals according to a single communication line.

Next, the functional means can be variously applied according to the type of device target in which the microcontroller unit M is installed, for example, a temperature sensor S1, S2, a humidity sensor S3, or a water level sensor S4. From a sensing module that senses a specific sensed value and generates an output, to an input module such as a switch (SW) provided for signal input, and an output module such as an LED (L) provided for signal output, to perform or provide a specific function It corresponds to a modular configuration that works.

In addition, the functional means may be provided as a driving module for driving a specific mechanical operation according to implementation. For example, a configuration for performing control of a fan motor or a door corresponds to this.

In summary, the functional means is a sensing module (S1, S2, S3, S4) for sensing a specific sensed value, a driving module for driving a specific mechanical operation, and a signal input/output module (L, SW) for performing input or output of a specific signal ) may be provided at least one or more of.

Accordingly, the read integrated circuit 120 (ROIC) embedded connector 100 having one side coupled to the wiring lines L1, L2, L3 connected to the microcontroller unit M is at least one or more as shown in FIGS. 1 and 3 . The functional means and the other end are electrically connected.

To this end, the read integrated circuit (ROIC) embedded connector 100 according to the present invention includes a housing 110 , a board 115 , a read integrated circuit 120 , a function means connection unit 130 , an address setting unit 140 , It includes a second signal movement path connecting unit 150 and a protective film 160 .

The housing 110 has a predetermined accommodating space therein, and the microcontroller unit M and the functional means S1 and S2 are mechanically fastened to the wiring lines L1, L2, L3 connected to the microcontroller unit M. , S3, S4, L, SW) as a configuration corresponding to a body that allows electrical connection through the read integrated circuit 120 to be made, specifically divided into pieces that can be separated or fastened to each other as shown in FIG. It includes an upper body portion 111 and a lower body portion 112 .

Here, the upper body part 111 and the lower body part 112 are mutually fastened to have a structure that can be fixedly installed on the wiring lines L1, L2, and L3. Accordingly, when the mutual coupling structure is released, the microcontroller unit ( Electrical connection between the wiring lines L1, L2, and L3 connected to M) and the readout integrated circuit 120 (ROIC) embedded connector 100 is released.

In addition, the inner side of the upper body portion 111 (the lower end of the reference in the vertical direction in FIG. 6) is recessed upward as shown in FIG. A line arrangement portion 111a is provided which provides a predetermined arrangement space 111H to be placed so as to be immediately electrically coupled to the portion.

Specifically, it is preferable that the line arrangement portion 111a is provided in plurality so that the predetermined arrangement space 111H is divided by the power line L1, the single communication line L2, and the ground line L3, respectively.

In addition, one side is electrically connected to the read integrated circuit 120 on the inside of the lower body 112 (the upper part in the vertical direction in FIG. 6), and can correspond to the line arrangement part 111a in the vertical direction. In the contact installation portion (112a) corresponding to the lower position, the contact formation portion (112b) is provided with a conductive material and has at least one tip structure protruding sharply toward the upper side.

In addition, the contact installation portion 112a and the contact forming portion 112b having at least one tip structure formed thereon are divided by power line L1, single communication line L2 and ground line L3, respectively. It is preferable to be provided in plurality to correspond to each other.

The inner side of the upper body portion 111 and the inner side of the lower body portion 112 are adjacent to each other with all of the power line L1, the single communication line L2 and the ground line L3 interposed therebetween and are mechanically or structurally When the fastening is achieved, the contact forming portion 112b is formed in the center of the power line L1, the single communication line L2, and the ground line L3 by penetrating at least one tip structure through the coating on the wire structure of each. Since the electrical connection with the electric line is established, the need to perform a separate stripping operation for each wiring line (L1, L2, L3) is eliminated, and the easiness of the connection operation appears.

As a result, when performing mutual coupling between the upper body part 111 and the lower body part 112 with the wiring lines L1, L2, and L3 in the middle, a single communication line ( L2), the power line (L1), and the ground line (L3), respectively, the contact forming portion penetrates the coating and is inserted into the line to form an electrical connection.

Accordingly, functional means S1, S2, S3, S4, S1, S2, S3, S4, L, SW) will complete the communication network construction.

The substrate 115 is a carrier configuration for a separate IC chip, such as a PCB board, and is installed in the housing 110 in the receiving space, and is patterned in a predetermined structure to center the read integrated circuit 120 (ROIC). It is the basis for performing electrical connection between various pads, pin terminals, and components.

The read integrated circuit 120 (ROIC) is connected and installed on one side of the substrate 115, and a signal received through communication with the microcontroller unit M or the function means S1, S2, S3, S4, L, SW. It is a separate configuration independent from the microcontroller unit (M) in order to perform the processing and provision of the processed signal, and mediates transmission and reception of signals, commands, information values, etc. from digital conversion of analog signal values.

A plurality of read integrated circuit 120 built-in connectors 100 are connected in series and fastened as shown in FIGS. 1 and 3 to share the same communication line along a single communication line L2 built through the connection with the microcontroller unit M. A communication network for bidirectional signal communication between the microcontroller unit M and each of the functional means S1 , S2 , S3 , S4 , L and SW connected to the readout integrated circuit embedded connector 100 can be established.

In contrast to this, in the conventional case, as shown in FIG. 2, the functional means S1', S2', S3', S4' SW' are connected based on the microcontroller unit M', so each means is divided. Since the power line (L1') and the communication line (L2') are separately provided in a 1:1 ratio to form an interconnection structure, the number of functional means (S1', S2', S3', S4' SW') to be connected depends on the number of connections. A wiring line L1' and a communication line L2' are required to match, and as a result, the entire wiring structure becomes very complicated, and above all, easiness of operation is significantly reduced.

Next, the read integrated circuit (120, ROIC) has a plurality of terminal-type circuit pins (120P) exposed to the outside, and as the electrical connection structure with each of these circuit pins (120P) is specifically set, various It gives functionality.

Referring to the readout integrated circuit built-in connector 100A according to the first embodiment as shown in FIG. 3, pin 4 of the readout integrated circuit 120 (ROIC) is electrically connected to the functional means S1 corresponding to the temperature sensor. make a connection

Here, the functional means connection unit 130 corresponding to pin 4 itself of the read integrated circuit 120 (ROIC) or a separate terminal or pad electrically connected thereto is connected to one side of the wiring lines L1, L2, and L3 according to the first embodiment. The read integrated circuit built-in connector 100A according to the above is maintained in a pre-connected state before being fastened.

In addition, pin 3 of the read integrated circuit 120 (ROIC) in the read integrated circuit built-in connector 100A according to the first embodiment forms a terminal with a single communication line L2 and is electrically connected to each other, The pin forms a terminal with the power line L1 and is electrically connected to each other.

Alternatively, the read integrated circuit 120 (ROIC) in the read integrated circuit built-in connector 100B according to the second embodiment has a function means connection unit 130 corresponding to the fourth pin itself or a separate terminal or pad electrically connected thereto. is electrically connected to the functional means (S2) corresponding to the temperature sensor, and the functional means connection unit 130 corresponding to the pin 6 itself or a separate terminal or pad electrically connected thereto is the LED ( L) is electrically connected.

Furthermore, the read integrated circuit 120 (ROIC) in the read integrated circuit built-in connector 100C according to the third embodiment has a function means connection unit 130 corresponding to the fourth pin itself or a separate terminal or pad electrically connected thereto. It forms an electrical connection with the functional means (S3) corresponding to the humidity sensor, and the functional means connection part 130 corresponding to the 6th pin itself or a separate terminal or pad electrically connected thereto is a switch corresponding to the input module ( SW) and the functional means connecting part 130 corresponding to pin 7 itself or a separate terminal or pad electrically connected thereto is electrically connected to the functional means S4 corresponding to the water level sensor.

In addition, the inner side of the upper body portion 111 and the inner side of the lower body portion 112 are adjacent to each other with all of the power line L1, the single communication line L2 and the ground line L3 interposed therebetween and are mechanically or structurally When the fastening is achieved, the contact forming portion 112b is formed in the center of the power line L1, the single communication line L2, and the ground line L3 by penetrating at least one tip structure through the coating on the wire structure of each. When an electrical connection is made with an electric line, the readout integrated circuit 120 provides a single communication line (L2), a power line (L1), and a ground line (L3) in the wiring line, respectively, and a terminal (as shown in FIGS. 4 and 5) terminals) and make electrical connections between different pins for each line.

The address setting unit 140 is provided on the other side of the substrate 111 according to the potential value based on the electrical connection structure with the address setting pin (SEL, a selection terminal type pin) already provided in the read integrated circuit 120. It provides unique identification address information for each identification of the integrated readout integrated circuit connector 100 .

This is to share the same communication line along a single communication line L2 established through connection with the microcontroller unit M, so that a plurality of read integrated circuit 120 embedded connectors 100 are connected and fastened as shown in FIGS. 1 and 3 . This is to make it possible to classify each connector using unique identification information and to perform individual control in detail.

Here, at least one selection terminal type pin 123 referred to as SEL among the address setting pins 120P already provided in the read integrated circuit 120 is provided, and in addition, the address setting unit 140 is also provided for address setting. It is provided in the same number as the pins.

And each of the at least one address setting unit 140 includes at least two or more address setting units among GND, VDD (5V), SDA (Signal), and VIN (12V) provided with a terminal-type pad or pin therein in more detail. do.

As a result, at least one address setting pin 123 of at least two address setting parts in the address setting unit 140 corresponding to each of the at least one or more address setting pins (selection terminal type pins 123 referred to as SELs among 120P) and The unique identification address information is set differently according to the type of the electrically connected one address setting part.

For example, as shown in FIG. 4, when one pin 123 for address setting of the read integrated circuit 120 (ROIC) in the read integrated circuit built-in connector 100A according to the first embodiment is provided as one, address setting One unit 140 is also provided, and in connection therewith, a total of 4 corresponding to GND, VDD (5V), SDA (Signal), and VIN (12V) provided as terminal-type pads or pins in the address setting unit 140 . The address setting section of the dog appears.

In this case, the potential value changes depending on which part of the four address setting parts in the address setting unit 140 and the electrical connection is made by the address setting pin 123, and correspondingly, different unique identification address information is obtained. The setting is made of four types, followed by a read integrated circuit 120 built-in connector 100 that can be fastened to share the same communication line along a single communication line L2 established through connection with the microcontroller unit M is a maximum of 4.

As a more preferred example, when three pins 123 for address setting of the read integrated circuit 120 and ROIC in the read integrated circuit built-in connector 100B according to the second embodiment are provided as shown in FIG. 5, the address The setting unit 140 is also provided in three pieces, and in connection with this, a total of three addresses corresponding to GND, VDD (5V), and SDA (Signal) are provided as terminal pads or pins in each of the address setting units 140 . The setting section appears.

In this case, the potential value changes depending on which part of the three address setting parts in the address setting part 140 and each of the address setting pins 123 for setting an address makes an electrical connection, and corresponding to each other unique identification address The setting of information is made up of 27 (3X3X3) types, followed by a read integrated circuit 120 that can be fastened to share the same communication line along a single communication line L2 built through a connection with the microcontroller unit M The maximum number of built-in connectors 100 is 27.

Here, the electrical connection between at least one address setting pin 123 and at least one of the at least two address setting parts in the corresponding address setting unit 140 is a Factory Fix method according to Wire Bonding or It may be made by a backend fix method according to resistance soldering (R Soldering).

Specifically, an electrical connection is performed between the address setting pin 123 and one address setting part among at least two or more address setting parts in the address setting unit 140 corresponding to the address setting pin 123 through a Factory Fix method according to Wire Bonding. In this case, the second signal movement path connection unit 150 corresponds to a wire having bonding portions formed on both sides, and an address setting unit corresponding to the address setting pin 123 in a Backend Fix method according to resistance soldering (R Soldering). When an electrical connection between at least two of the address setting parts in 140 is performed, the second signal movement path connection part 150 corresponds to a resistor having soldered parts formed on both sides.

The factory fix method according to wire bonding cannot change the set unique identification address information, whereas the backend fix method according to resistance soldering (R Soldering) allows the set unique identification address information to be changed.

And on the substrate 115, as shown in FIGS. 4 and 5, a protective film 160 of a resin component for covering and protecting the read integrated circuit 120 through molding using a separate synthetic resin material is provided. can

The embodiments disclosed in the present invention are for explanation rather than limiting the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. The scope of protection should be construed by the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: readout integrated circuit built-in connector
110: housing
111: upper body part
111a: line arrangement part 111H: arrangement space
112: lower body part
112a: contact installation part 112b: contact forming part 115: board
120: readout integrated circuit
120P: Circuit pin 123: Address setting pin
125: first signal movement path connection part
130: function means connection part
140: address setting unit
150: second signal movement path connection part
160: Shield
M: microcontroller unit
L1: power line
L2: single communication line
L3: ground line
S1, S2, S3, S4, L, SW: means of function

Claims (8)

A readout integrated circuit (ROIC) built-in connector that forms an electrical connection between a functional means connected to one side and the microcontroller unit by forming a connection with a wiring line connected to a microcontroller unit (MCU) In
a housing having a predetermined accommodating space therein, the housing corresponding to a body through which an electrical connection through a read integrated circuit between the microcontroller unit and the functional means is made through a wiring line connected to the microcontroller unit and mechanical coupling;
a substrate embedded in the housing space and patterned into a predetermined structure; and
a read integrated circuit connected to one side of the substrate and configured to process a signal received through communication with the microcontroller unit or the functional means and provide the processed signal;
The wiring line includes a single communication line,
A plurality of read integrated circuit embedded connectors are connected in series to share the same communication line along the single communication line established through connection with the microcontroller unit, so that between the microcontroller unit and each of the functional means connected to the read integrated circuit embedded connector Characterized in that it is possible to establish a communication network for two-way signal communication
Connectors with integrated readout circuits.
According to claim 1,
The function means is characterized in that at least one or more of a sensing module for sensing a specific sensed value, a driving module for driving a specific mechanical operation, and a signal input/output module for inputting or outputting a specific signal are provided.
Connectors with integrated readout circuits.
According to claim 1,
The readout integrated circuit built-in connector comprises:
Address setting provided on the other side of the board and providing unique identification address information for identification for each readout integrated circuit built-in connector according to a potential value based on an electrical connection structure with an address setting pin provided in the readout integrated circuit Part; characterized in that it further comprises
Connectors with integrated readout circuits.
4. The method of claim 3,
At least one pin for address setting provided in the read integrated circuit is provided,
The address setting unit is provided with the same number of pins for address setting and includes at least two or more address setting parts of GND, VDD (5V), SDA (Signal), and VIN (12V) provided as a terminal-type pad, ,
The unique identification address information is different depending on the type of one address setting part electrically connected to the address setting pin among at least two or more address setting parts in the address setting unit corresponding to each of the at least one or more address setting pins. characterized in that
Connectors with integrated readout circuits.
5. The method of claim 4,
Electrical connection between at least one address setting pin and one of the at least two address setting units in the address setting unit corresponding to the address setting pin is a wire bonding method or a resistance soldering method. characterized
Connectors with integrated readout circuits.
5. The method of claim 4,
A protective film covering the read integrated circuit is provided on the substrate through molding using a synthetic resin material.
Connectors with integrated readout circuits.
According to claim 1,
The wiring line further includes a power line and a ground line,
Wherein the read integrated circuit forms an electrical connection between different pins for each line when a terminal is formed with each of the single communication line, the power line and the ground line in the wiring line.
Connectors with integrated readout circuits.
8. The method of claim 7,
The housing includes an upper body part and a lower body part that are fastened to each other and can be fixedly installed on the wiring line,
A line arrangement portion is provided inside the upper body portion that is recessed upward to provide a predetermined arrangement space in which each of the single communication line, the power line and the ground line can be placed,
One side is electrically connected to the read integrated circuit inside the lower body part, and at a lower position that can correspond to the line arrangement part in the vertical direction, at least one or more of which are made of a conductive material and sharply protrude upward. A contact forming part with a tip structure is provided,
When the interconnection between the upper body part and the lower body part is performed with the wiring line in the middle, the contact forming part penetrates the coating on each of the single communication line, the power supply line, and the ground line arranged in the line arrangement part. Characterized in that it is inserted into the inside to make an electrical connection
Connectors with integrated readout circuits.

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