KR20220108248A - Apparatus for transferring wafer - Google Patents

Abstract

A wafer transferring device comprises: a circulation type wafer transferring module; a wafer processing robot for a load lock; and a wafer processing robot for a process chamber. The circulation type wafer transferring module arranges the load lock in an outer direction of a first side, arranges a plurality of process chambers in outer directions of a second side and a third side, includes an opening area inside, and rotationally transfers a wafer. The wafer processing robot for a load lock is arranged in a firs position adjacent to the load lock in the opening area, and loads or unloads the wafer in the circulation type wafer transferring module from the load lock. The wafer processing robot for a process chamber is arranged in a second position which is continuously connected to the first position in the opening area, moves the wafer on the circulation type wafer transferring module to a corresponding process chamber, or moves a substrate on the circulation type wafer transferring module from the corresponding process chamber. The present invention can improve productivity.

Description

Wafer transfer device {APPARATUS FOR TRANSFERRING WAFER}

The present invention relates to a wafer transfer technology, and more particularly, to a wafer transfer apparatus capable of cyclically transferring a wafer and further expanding a process chamber.

In a semiconductor manufacturing process, a wafer transfer device for transferring a wafer is used to process a wafer, which is an object. In general, semiconductor devices are implemented by depositing and patterning various materials in the form of thin films on a wafer, which is a substrate. To this end, the wafer undergoes several process steps such as deposition, etching, cleaning, and drying.

In this case, in order to perform the above process, the wafer needs to be transferred or returned to the process chamber where the process is performed so that the process can be performed in an optimal environment.

As described above, the wafer transfer apparatus may include a load port, an equipment front end module (EFEM), a load lock module, a transfer module, and a process chamber to transfer the process chamber to the process chamber.

In a conventional wafer transfer apparatus, a plurality of processor chambers are coupled to surround one transfer module, so that a wafer processing process can be simultaneously performed in the plurality of processor chambers. That is, the robot included in the transfer module transfers the wafer to each process chamber in a manner that transfers the wafer from the load lock module to one of the plurality of processor chambers.

However, when a plurality of process chambers are installed to surround the transfer module, the number of process chambers that can be installed around the transfer module is inevitably limited.

As the number of process chambers that can be installed in one transfer module is limited in this way, when additional process chambers are to be installed, there is a problem in that a wafer transfer device needs to be additionally installed.

Korean Patent Publication No. 10-0935537 (2009.12.29.)

According to an embodiment of the present invention, it is an object of the present invention to provide a wafer transfer apparatus capable of cyclically transferring a wafer and further expanding a process chamber.

According to an embodiment of the present invention, a plurality of robots are disposed in the wafer transfer module to transfer wafers to a load lock or a corresponding process chamber in the area each robot is responsible for based on the corresponding position, and thus the processor chamber is moved. An object of the present invention is to provide a wafer transfer device that can be easily additionally disposed.

According to an embodiment of the present invention, it is an object of the present invention to provide a wafer transfer apparatus capable of reducing the time required for a process by shortening the time for moving a wafer on a transfer module once, and improving productivity.

In embodiments, the wafer transfer apparatus has a load lock disposed in a first side outward direction and a plurality of process chambers disposed in second and third side outward directions, and includes an opening area therein, and cyclically transfers the wafer. a cyclic wafer transfer module for transferring the wafer to or from a wafer processing robot for a load lock disposed at a first position adjacent to the load lock in the opening region and for loading or unloading the wafer from the load lock to the cyclic wafer transfer module; and In the opening region, a wafer disposed at a second position successively following the first position and placed on the circular wafer transfer module is moved to a corresponding process chamber or from the corresponding process chamber onto the circular wafer transfer module. and a wafer handling robot for a process chamber that moves the wafer.

The circular wafer transfer module may include first and second circular wafer transfer members connected in series in a direction opposite to the first side and a buffer member disposed therebetween.

The load lock wafer processing robot may unload the load lock wafer in the load lock and provide the load lock wafer with priority to a process chamber adjacent to the first position.

The load lock wafer processing robot may unload a chamber wafer in a process chamber adjacent to the first position and directly provide the chamber wafer to the load lock.

The load lock wafer processing robot may be in charge of process chambers facing each other in the circular wafer transfer module based on a corresponding position.

The load lock wafer processing robot may unload a chamber wafer unloaded from one of the process chambers facing each other to a corresponding area of the circular wafer transfer module.

The load lock wafer processing robot may unload a chamber wafer unloaded from one of the process chambers facing each other to a corresponding area opposite to the circular wafer transfer module.

The wafer processing robot for the process chamber may be implemented as the same robot as the wafer processing robot for the load lock and may be in charge of a plurality of process chambers facing each other in the circular wafer transfer module.

The disclosed technology may have the following effects. However, this does not mean that a specific embodiment should include all of the following effects or only the following effects, so the scope of the disclosed technology should not be construed as being limited thereby.

A wafer transfer apparatus according to an embodiment of the present invention may transfer wafers cyclically and further expand a process chamber.

A wafer transfer apparatus according to an embodiment of the present invention can transfer a wafer to a load lock or a corresponding process chamber in an area in charge of each robot based on a corresponding position by disposing a plurality of robots in the wafer transfer module. Additional processor chambers can be easily placed.

The wafer transfer apparatus according to an embodiment of the present invention can reduce the time required for the process by shortening the time for moving the wafer once on the transfer module, thereby improving productivity.

1 is a view for explaining a wafer transfer apparatus according to an embodiment of the present invention.
FIG. 2 is a view for explaining a first extension example of the wafer transfer apparatus shown in FIG. 1 .
FIG. 3 is a view for explaining a second extended example of the wafer transfer apparatus shown in FIG. 1 .
FIG. 4 is a view for explaining a third extended example of the wafer transfer apparatus shown in FIG. 1 .

Since the description of the present invention is merely an embodiment for structural or functional description, the scope of the present invention should not be construed as being limited by the embodiment described in the text. That is, since the embodiment is capable of various changes and may have various forms, it should be understood that the scope of the present invention includes equivalents capable of realizing the technical idea. In addition, since the object or effect presented in the present invention does not mean that a specific embodiment should include all of them or only such effects, it should not be understood that the scope of the present invention is limited thereby.

On the other hand, the meaning of the terms described in the present application should be understood as follows.

Terms such as “first” and “second” are for distinguishing one component from another, and the scope of rights should not be limited by these terms. For example, a first component may be termed a second component, and similarly, a second component may also be termed a first component.

When a component is referred to as being “connected” to another component, it may be directly connected to the other component, but it should be understood that other components may exist in between. On the other hand, when it is mentioned that a certain element is "directly connected" to another element, it should be understood that the other element does not exist in the middle. On the other hand, other expressions describing the relationship between elements, that is, "between" and "between" or "neighboring to" and "directly adjacent to", etc., should be interpreted similarly.

The singular expression is to be understood to include the plural expression unless the context clearly dictates otherwise, and terms such as "comprises" or "have" refer to the embodied feature, number, step, action, component, part or these It is to be understood that this is intended to indicate that a combination exists, and does not preclude the possibility of the presence or addition of one or more other features or numbers, steps, operations, components, parts, or combinations thereof.

Identifiers (eg, a, b, c, etc.) in each step are used for convenience of description, and the identification code does not describe the order of each step, and each step clearly indicates a specific order in context. Unless otherwise specified, it may occur in a different order from the specified order. That is, each step may occur in the same order as specified, may be performed substantially simultaneously, or may be performed in the reverse order.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Terms defined in commonly used dictionaries should be interpreted as being consistent with the meanings in the context of the related art, and cannot be interpreted as having ideal or excessively formal meanings unless explicitly defined in the present application.

1 is a view for explaining a wafer transfer apparatus according to an embodiment of the present invention.

Referring to FIG. 1 , the wafer transfer apparatus 100 may include a circular wafer transfer module 110 , a wafer processing robot 130 for a load lock, and a wafer processing robot 150 for a process chamber.

In the circular wafer transfer module 110 , the load lock 200 is disposed on the first side outward, and the plurality of process chambers 300 are disposed on the second side and the third side outward directions, and an opening area therein Including, it is possible to transfer the wafer 400 cyclically.

In an embodiment, the circular wafer transfer module 110 may serve to transfer the wafer 400 loaded in the load lock 200 to the plurality of process chambers 300 , respectively. To this end, the circular wafer transfer module 110 may have a circular shape like a conveyor belt. The circular wafer transfer module 110 may transfer the wafer 400 through the transfer rail, and may transfer the wafer 400 to the corresponding process chamber at each designated position by repeatedly performing stopping and moving at each designated position. In the circular wafer transfer module 110 , the load lock 200 may be disposed on a short side side, and a plurality of process chambers 300 may be disposed on a long side side to face each other. Here, the length of each side of the circular wafer transfer module 110 may vary depending on the size and number of the load lock 200 and the plurality of process chambers 300 to be disposed.

The inner space of the circulating wafer transfer module 110 is maintained in a sealed state with respect to the outside, and may be maintained in a vacuum state or filled with an inert gas as necessary. Accordingly, when the wafer 400 is provided into the circular wafer transfer module 110 or the wafer 400 is discharged therefrom, it passes through the load lock 200 . Since the wafer 400 on which the manufacturing process is performed is transferred, the internal space of the circular wafer transfer module 110 maintains a level of cleanliness above a predetermined level.

The load lock 200 is disposed between the Equipment Front End Module (EFEM) (not shown) and the circular wafer transfer module 110, and the wafer 400 transferred from the Equipment Front End Module (EFEM). load the In addition, the load lock 200 loads the wafer 400 transferred from the circular wafer transfer module 110 . To this end, the load lock 200 includes at least two chambers, in one chamber a wafer to be processed, that is, a wafer provided to the circular wafer transfer module 110, and a processed substrate in the other chamber; That is, the wafer that has completed the manufacturing process may stand by. At this time, since the load lock 200 is disposed between the equipment front end module EFEM in the standby state and the circulating wafer transfer module 110 in the vacuum state, it serves to switch between the atmospheric pressure state and the vacuum state. That is, when the wafer 400 is transferred from the equipment front end module EFEM in the atmospheric pressure state, the load lock 200 converts the atmospheric pressure state to a vacuum state. And the load lock 200 transfers or receives the wafer 400 to the cyclic wafer transfer module 110 in a vacuum state, and transfers the wafer 400 transferred from the cyclic wafer transfer module 110 to the equipment front end module ( EFEM) to convert the vacuum to atmospheric pressure.

The plurality of process chambers 300 may perform a deposition process on a wafer 400 , and the like. Each of the plurality of process chambers 300 may be driven independently. Processing of the wafer 400 is performed in each process chamber 300 . In this case, the same process may be performed for the processing of the wafer 400 performed in each process chamber 300 , and different processes may be performed as needed.

The load lock wafer processing robot 130 is disposed at a first position adjacent to the load lock 200 in the opening area inside the circular wafer transfer module 110 and is transferred from the load lock 200 to the circular wafer transfer module 110 . The wafer 400 may be loaded or unloaded. In one embodiment, the load lock wafer processing robot 130 may unload the load lock wafer in the load lock 200 and provide the load lock wafer with priority to the process chambers 300a and 300b adjacent to the first position. . The load lock wafer processing robot 130 may unload the chamber wafers from the process chambers 300a ′ and 300b ′ adjacent to the first position and directly provide the chamber wafers to the load lock 200 . Here, the load lock wafer processing robot 130 may be in charge of the process chambers 300a, 300a', 300b, and 300b' facing each other in the circular wafer transfer module 110 based on the corresponding position ( part "A" indicated by the dashed-dotted line).

In one embodiment, the wafer processing robot 130 for a load lock may be a transfer robot disclosed in Patent Nos. 1534524 and 1535068, which were previously applied and registered by the applicant of the present invention. The transfer robot disclosed in the patent documents has a body rotatable with respect to a vertical axis of rotation and is symmetrically disposed with respect to the axis of rotation of the body, and can transfer wafers in a straight line along the horizontal direction and in a vertical direction parallel to the axis of rotation of the body. and a pair of arm portions.

The wafer processing robot 150 for a process chamber is disposed at a second position continuously connected to the first position in the opening area inside the circular wafer transport module 110 and is disposed on the wafer 400 on the circular wafer transport module 110 . ) may be moved to the corresponding process chamber or the wafer 400 may be moved from the corresponding process chamber onto the circular wafer transfer module 110 . In an embodiment, the wafer processing robot 150 for a process chamber may be in charge of processor chambers facing each other in the circular wafer transfer module 110 based on a corresponding position. Here, the wafer processing robot 150 for a process chamber unloads a chamber wafer taken out from one of the process chambers facing each other to a corresponding area of the circular wafer transfer module 110 or unloads it to an opposite area. can The wafer processing robot 150 for a process chamber may determine an unloading area in consideration of a transfer distance of the unloaded chamber wafer from the corresponding area of the circular wafer transfer module 110 to the area of the load lock 200 . For example, when the wafer processing robot 150 for a process chamber needs to move more than half a turn from the area of the circular wafer transfer module 110 to the area of the load lock 200, the wafer processing robot 150 handles the unloaded chamber wafer correspondingly. By unloading in the opposite area, the moving time can be shortened.

The wafer processing robot 150 for a process chamber may be implemented as the same robot as the wafer processing robot 130 for a load lock and may be in charge of a plurality of process chambers 300 facing each other in the circular wafer transfer module 110 . have.

FIG. 2 is a view for explaining a first extension example of the wafer transfer apparatus shown in FIG. 1 .

Referring to FIG. 2 , the wafer transfer apparatus 100 may have the same configuration as that of FIG. 1 , but may include a plurality of load locks 200 and a wafer processing robot 130 for load locks.

The load lock 200 may include first and second load locks 200a and 200b in an outer direction of the first side of the circular wafer transfer module 110 . The first and second load locks 200a and 200b may be disposed vertically or horizontally. Each of the first and second load locks 200a and 200b has a length in which two wafers 400 can be horizontally spaced apart and loaded, and the wafers 400 can be loaded and unloaded. In one embodiment, a wafer to be processed may be placed in one of the first and second load locks 200a and 200b, and a processed wafer may be placed in the other load lock.

The load lock wafer processing robot 130 includes first and second load lock wafer processing robots ( 130a, 130b) may be included. The wafer processing robot 130a for the first load lock is disposed outside the first side of the circular wafer transfer module 110, that is, outside the circular wafer transfer module 110, and the first and second load locks 200a, The wafer 400 may be loaded or unloaded from the cyclic wafer transfer module 110 from 200b). Here, the wafer processing robot 130a for the first load lock unloads the wafer to be processed in one of the first and second load locks 200a and 200b to the corresponding area of the circular wafer transfer module 110 . can be unloaded, and the processed wafer that has been transferred to the corresponding area of the circular wafer transfer module 110 can be provided to another load lock. The second load lock wafer processing robot 130b is disposed in the first inward direction of the circular wafer transport module 110 , that is, inside the circular wafer transport module 110 , and is disposed on the circular wafer transport module 110 . The wafer is moved to the process chambers 300a, 300b (300a', 300b') adjacent to the load lock or from the process chambers 300a, 300b (300a', 300b') in the circular wafer transfer module 110 The wafer can be moved on the Here, the first load lock wafer processing robot 130a may be in charge of the first and second load locks 200a and 200b in the circular wafer transfer module 110 based on the corresponding position (A1), and 2 The wafer processing robot 130b for the load lock may be in charge of the process chambers 330a, 330a', 330b, and 330b' facing each other in the circular wafer transfer module 110 based on a corresponding position (A2) .

Accordingly, the wafer transfer apparatus 100 may additionally arrange the number of load locks in the outer direction of the first side of the circular wafer transfer module 110 .

FIG. 3 is a view for explaining a second extended example of the wafer transfer apparatus shown in FIG. 1 .

Referring to FIG. 3 , the wafer transfer apparatus 100 is configured the same as in FIG. 1 , but by extending the width of the circular wafer transfer module 110 , a plurality of load locks 200 , a wafer processing robot 130 for load locks, and A processing robot 150 for the process chamber may be included.

The load lock 200 may include first and second load locks 200a and 200b in an outer direction of the first side of the circular wafer transfer module 110 . The first and second load locks 200a and 200b may be disposed vertically or horizontally. Each of the first and second load locks 200a and 200b has a length in which two wafers 400 can be horizontally spaced apart and loaded, and the wafers 400 can be loaded and unloaded. In one embodiment, a wafer to be processed may be placed in one of the first and second load locks 200a and 200b, and a processed wafer may be placed in the other load lock.

The wafer processing robot for load lock 130 is a wafer processing robot for first and second load locks at first positions adjacent to the first and second load locks 200a and 200b in the opening area inside the circular wafer transfer module 110 . (130a', 130b') may be included. The wafer processing robots 130a ′ and 130b ′ for the first and second load locks may be disposed to face the first and second load locks 200a and 200b , respectively. In this case, the wafer processing robot 130a ′ for the first load lock may unload the wafer to be processed in the first load lock 200a and provide the unloaded wafer to the process chambers 300a and 300b adjacent to the first position. . The wafer processing robot 130b ′ for the second load lock may unload the processed wafers from the process chambers 300a ′ and 300b ′ adjacent to the first position and provide the wafers to the second load lock 200b ′.

The wafer processing robot 150 for the process chamber is a second position disposed adjacent to each of the first and second load lock wafer processing robots 130a ′ and 130b ′ in the opening area inside the circular wafer transfer module 110 . and wafer processing robots 150a and 150b for the first and second process chambers. The wafer processing robots 150a and 150b for the first and second process chambers are disposed to face each other and move the wafer 400 on the circular wafer transfer module 110 to the corresponding process chamber 300 or The wafer 400 may be moved from the process chamber 300 onto the circular wafer transfer module 110 . Here, the wafer processing robots 150a and 150b for the first and second process chambers are implemented as the same robot as the wafer processing robot 130 for a load lock, and a plurality of processes opposed to each other in the circular wafer transfer module 110 . Chambers can be in charge.

The wafer transfer apparatus 100 according to an embodiment may extend the width of the circular wafer transfer module 110 and, accordingly, add the number of load locks to the first side outward direction of the circular wafer transfer module 110 It can be arranged, and since robots can be additionally arranged inside the opening area, productivity can be improved by increasing the number of substrates processed per unit time.

FIG. 4 is a view for explaining a third extended example of the wafer transfer apparatus shown in FIG. 1 .

Referring to FIG. 4 , the wafer transfer apparatus 100 has the same configuration as that of FIG. 1 , but the number of the plurality of process chambers 300 may be increased by connecting a plurality of cyclic wafer transfer modules 110 .

To this end, the circular wafer transfer module 110 may include first and second circular wafer transfer members 410 and 420 connected in series in the opposite direction to the first side and a buffer member 430 disposed therebetween. have.

The first circular wafer transfer member 410 includes a load lock 200 disposed on a first side outward direction, a plurality of processor chambers disposed on a second side and a third side outward direction, and an opening area therein, , the wafer can be transferred cyclically.

The second circular wafer transport member 420 is connected in series in a direction opposite to the first side of the first circular wafer transport members 410 and a plurality of processor chambers are added to the second side and the third side outward directions. It is disposed and includes an opening area therein, and can transfer wafers cyclically.

The buffer member 430 has a space for accommodating the wafer, and the wafer transferred between the first and second circular wafer transfer members 410 and 420 may be placed therein. A wafer processing robot is disposed at a position adjacent to the buffer member 430 to load or unload wafers from the buffer member 430 to the corresponding circular wafer transfer member.

A wafer transfer apparatus according to an embodiment may transfer a plurality of wafers to improve the production speed of wafers. The wafer transfer apparatus may transfer a plurality of wafers at the same time by cyclically transferring wafers through a circular shape like a conveyor belt.

The wafer transfer apparatus according to an exemplary embodiment may process a plurality of wafers at the same time to improve the wafer processing speed and increase the wafer production rate.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that it can be done.

100: wafer transfer device
110: circular wafer transfer module
130: wafer processing robot for load lock
130a: wafer processing robot for first load lock
130b: wafer processing robot for second load lock
150: wafer handling robot for process chamber
200: load lock
200a, 200b: first and second load locks
300: a plurality of process chambers
400: wafer
410 and 420: first and second circular wafer transfer members
430: no buffer

Claims (8)

a circular wafer transfer module having a load lock disposed in a first side outward direction and a plurality of process chambers disposed in second and third outward directions, including an opening area therein, and cyclically transferring a wafer;
a wafer processing robot for a load lock disposed at a first position adjacent to the load lock in the opening area and for loading or unloading the wafer from the load lock to the circular wafer transfer module; and
In the opening region, a wafer disposed at a second position successively following the first position and placed on the circular wafer transfer module is moved to a corresponding process chamber or from the corresponding process chamber onto the circular wafer transfer module. and a wafer handling robot for a process chamber that moves the wafer.
According to claim 1, wherein the circular wafer transfer module is
and first and second circular wafer transfer members connected in series in a direction opposite to the first side and a buffer member disposed therebetween.
According to claim 1, wherein the load lock wafer processing robot
and discharging the load lock wafer from the load lock and providing the load lock wafer with priority to a process chamber adjacent to the first position.
The method of claim 3, wherein the load lock wafer processing robot is
and unloading a chamber wafer in a process chamber adjacent to the first position and providing the chamber wafer directly to the load lock.
According to claim 1, wherein the load lock wafer processing robot
Wafer transfer apparatus, characterized in that in charge of the process chambers facing each other in the circular wafer transfer module based on the corresponding position.
The method of claim 5, wherein the load lock wafer processing robot is
and unloading a chamber wafer unloaded from one of the process chambers facing each other to a corresponding area of the circular wafer transfer module.
The method of claim 5, wherein the load lock wafer processing robot is
and unloading a chamber wafer unloaded from one of the opposing process chambers to a corresponding area of the circular wafer transfer module.
According to claim 1, wherein the wafer processing robot for the process chamber
A wafer transfer apparatus, which is implemented as the same robot as the load lock wafer handling robot and is in charge of a plurality of process chambers facing each other in the circular wafer transfer module.

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