KR20220098460A - Coil member and camera module having the same - Google Patents

Abstract

A coil member according to an embodiment comprises: a substrate which includes a first surface and a second surface opposite to the first surface; and a circuit pattern which is disposed on at least one of the first surface and the second surface, and includes a wiring pattern, a plating pattern, and a dummy pattern. The distance between adjacent circuit patterns increases as the width of the circuit pattern increases.

Description

Coil member and camera module including the same

The embodiment relates to a coil member and a camera module including the same.

As various types of portable terminals are widely distributed and wireless Internet services are commercialized, consumer demands related to portable terminals are also diversifying. Accordingly, various types of additional devices are being installed in portable terminals.

Among them, a camera module is a representative example that can take a photo or video of a subject, store the image data, and edit and transmit it as needed.

In recent years, the demand for compact camera modules is increasing for use in various multimedia fields such as notebook personal computers, camera phones, PDA, smart devices, toys, etc., and for image input devices such as information terminals of surveillance cameras and video tape recorders. .

Conventional camera modules may be roughly classified into camera modules such as a fixed focus (F.F) type, an auto focus (A.F) type, and an optical image stabilization (OIS) type.

Meanwhile, in the case of the OIS type, a coil member disposed on a circuit board may be included as a component for implementing an anti-shake function.

Such a coil member may be formed by disposing a plurality of circuit patterns on a substrate. In detail, the circuit pattern may include a wiring pattern through which signals and currents are transmitted, a plating pattern for forming a plating layer of the circuit pattern, and a dummy pattern disconnected from other patterns.

These wiring patterns, circuit patterns, and dummy patterns may have different pattern sizes and shapes. Also, a plurality of wiring patterns, a plurality of circuit patterns, and a plurality of dummy patterns may have different pattern sizes and shapes.

Meanwhile, the circuit patterns may be connected to a plating line, and a plating layer may be formed through electrolytic plating. In this case, the size of the plating layer formed by the plating process may vary according to the width of the circuit pattern. Accordingly, when all the intervals between the circuit patterns are formed to be the same, there is a problem in that the adjacent circuit patterns are connected to each other due to the difference in the size of the plating layer of the circuit pattern, thereby causing a short circuit.

Accordingly, there is a need for a coil member capable of solving the above problems and a camera module including the same.

An embodiment is to provide a coil member having improved reliability and a camera module including the same.

A coil member according to an embodiment includes: a substrate including a first surface and a second surface opposite to the first surface; a circuit pattern disposed on at least one of the first surface and the second surface and including a circuit pattern including a wiring pattern, a plating pattern, and a dummy pattern, wherein an interval between adjacent circuit patterns is a size of a width of the circuit pattern increases as is larger.

The coil member according to the embodiment may have different intervals between the circuit patterns according to the width of the circuit pattern including the wiring pattern, the dummy pattern, and the plating pattern.

That is, the interval between the circuit patterns having a large width may be formed to be larger than the interval between the circuit patterns having a small width.

Accordingly, when the circuit pattern of the wiring pattern, the dummy pattern, and the plating pattern is formed, it is possible to prevent a short circuit between the circuit patterns according to the plating process.

In detail, the size of the plating layer formed by the plating process may vary depending on the size of the seed layer serving as the seed. That is, as the size of the seed layer increases, that is, the width, thickness, and area of the plating layer may be proportionally increased.

Accordingly, when all circuit patterns have the same or similar spacing, the plating layer formed on the circuit patterns having a large width, thickness, and area is formed to be larger than other regions, so that adjacent circuit patterns are connected to each other so that the circuit patterns are can be shorted.

Accordingly, the coil member according to the embodiment may prevent a short circuit of a circuit pattern due to a difference in the size of the circuit pattern by adjusting the spacing between the adjacent circuit patterns according to the size of the circuit patterns.

Accordingly, the coil member according to the embodiment may prevent short circuiting of the circuit pattern and thus have improved reliability.

1 is a view showing a bottom view of a coil member according to an embodiment.
2 is a view showing a top view of a coil member according to an embodiment.
FIG. 3 is an enlarged view showing an enlarged area A of FIG. 1 .
FIG. 4 is a view showing a cross-sectional view taken along region BB′ of FIG. 3 .
5 to 7 are cross-sectional views illustrating a manufacturing process of a circuit pattern of a coil member according to an embodiment.
FIG. 8 is a view showing an enlarged view of region C of FIG. 1 .
FIG. 9 is a cross-sectional view illustrating a region DD′ of FIG. 8 .
FIG. 10 is an enlarged view showing an enlarged area E of FIG. 1 .
11 is a view illustrating a cross-sectional view taken along a region FF′ of FIG. 10 .
12 is a diagram illustrating a perspective view of a camera module including a coil member according to an embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical spirit of the present invention is not limited to some embodiments described, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of the components may be selected between embodiments. It can be combined and substituted for use.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be generally understood by those of ordinary skill in the art to which the present invention belongs, unless specifically defined and described explicitly. It may be interpreted as a meaning, and generally used terms such as terms defined in advance may be interpreted in consideration of the contextual meaning of the related art.

In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In the present specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as “at least one (or more than one) of A and (and) B, C”, it can be combined with A, B, and C. It may include one or more of all possible combinations.

In addition, in describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the component from other components, and are not limited to the essence, order, or order of the component by the term.

And, when it is described that a component is 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also with the component It may also include a case of 'connected', 'coupled' or 'connected' due to another element between the other elements.

In addition, when it is described as being formed or disposed on "above (above) or under (below)" of each component, the top (above) or bottom (below) is one as well as when two components are in direct contact with each other. Also includes a case in which another component as described above is formed or disposed between two components.

In addition, when expressed as “up (up) or down (down)”, it may include the meaning of not only the upward direction but also the downward direction based on one component.

Hereinafter, a coil member according to an embodiment will be described with reference to the drawings.

1 is a view showing a bottom view of the coil member according to the embodiment, Figure 2 is a view showing a top view of the coil member according to the embodiment.

The coil member 1000 may include a substrate 100 and a circuit pattern disposed on the substrate 100 .

The substrate 100 may be a flexible substrate. That is, the substrate 100 may include a flexible plastic. For example, the substrate 100 may be a polyimide (PI) substrate. However, the embodiment is not limited thereto, and may be a substrate made of a polymer material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).

The substrate 100 may be an insulating substrate. That is, the substrate 100 may be an insulating substrate supporting various circuit patterns.

The substrate 100 may have a thickness of 20 μm to 100 μm. For example, the substrate 100 may have a thickness of 25 μm to 75 μm. For example, the substrate 100 may have a thickness of 30 μm to 40 μm. When the thickness of the substrate 100 exceeds 100 μm, the overall thickness of the coil member may increase. In addition, when the thickness of the substrate 100 is less than 20 μm, the substrate 100 may be vulnerable to heat/pressure, etc. in the process of forming the coil electrode of the substrate 100 .

A layer h may be formed on the substrate 100 . In detail, a hole h passing through the substrate 100 may be formed in the central region of the substrate 100 . When the coil member 1000 is applied to the camera module, the hole h may serve as a driving of the camera module, for example, a sensing hole.

The circuit pattern may be disposed on the substrate 100 . In detail, the circuit pattern may be disposed on both surfaces of the substrate 100 . That is, the circuit pattern may be disposed on the first surface 1S of the substrate 100 and the second surface 2S opposite to the first surface 1S. That is, the circuit pattern may include a first circuit pattern disposed on the first surface 1S and a second circuit pattern disposed on the second surface 2S.

Alternatively, the circuit pattern may be disposed on the first surface 1S of the substrate 100 or on the second surface 2S opposite to the first surface 1S. That is, the circuit pattern may be disposed on at least one of the first surface 1S of the substrate 100 and the second surface 2S opposite to the first surface 1S.

The circuit pattern may include a plurality of types of patterns. In detail, the circuit pattern may include a plurality of types of patterns according to roles, positions, and connection relationships of the patterns. In detail, the circuit pattern may include a wiring pattern, a plating pattern, and a dummy pattern.

In addition, the circuit patterns may be formed in different sizes and shapes. For example, the circuit patterns may have different lengths, different areas, and different thicknesses. For example, the wiring patterns, the plating patterns, and the dummy patterns may have different sizes and shapes. Alternatively, the wiring pattern, the plating pattern, and the dummy pattern may be formed in different sizes and shapes.

The circuit pattern may be disposed at different intervals between the patterns according to the size of the circuit pattern. For example, the spacing between patterns having different sizes may be formed differently from the spacing between patterns having the same or similar sizes.

The spacing between the circuit patterns will be described in detail below.

The wiring patterns 210 and 220 may include a first wiring pattern 210 and a second wiring pattern 220 . In detail, the wiring patterns 210 and 220 are disposed on the first wiring pattern 210 disposed on the first surface 1S of the substrate 100 and on the second surface 2S of the substrate 100 . A second wiring pattern 220 may be included.

Here, the first surface 1S of the substrate 100 may be defined as a surface facing the printed circuit board of the camera module on which the coil member 1000 is disposed, and the second surface of the substrate 100 ( 2S) may be defined as a surface opposite to the first surface 1S.

The first wiring pattern 210 may be disposed on a lower surface of the coil member 1000 . The first wiring pattern 210 may be disposed in a coil shape of a closed loop shape on the first surface 1S of the substrate 100 . That is, the first wiring pattern 210 may be a first coil pattern disposed on the first surface 1S of the substrate 100 .

The first wiring pattern 210 may include a wiring part 211 and a pad part 212a 212b. The first wiring pattern 210 may be electrically connected to a printed circuit board disposed under the coil member 1000 through the pad part 212a 212b. The pad parts 212a 212b may be formed in plurality, and the embodiment is not limited to the number of pad parts shown in FIGS. 1 and 2 .

The second wiring pattern 220 may be disposed on the upper surface of the coil member 1000 . The second wiring pattern 220 may be disposed in a coil shape of a closed loop shape on the second surface 2S of the substrate 100 . That is, the second wiring pattern 220 may be a second coil pattern disposed on the second surface 2S of the substrate 100 .

The first wiring pattern 210 and the second wiring pattern 220 may be connected to each other. In detail, the first wiring pattern 210 and the second wiring pattern 220 may be connected to each other through via holes formed in the substrate 100 .

In detail, the first wiring pattern 210 may include a 1-1 connection region and a 1-2 connection region. A first via hole V1 may be formed in the 1-1 connection region, and a second via hole V2 may be formed in the 1-2 connection region.

Also, the second wiring pattern 220 may include a 2-1 th connection region and a 2-2 th connection region. The first via hole V1 may be formed in the 2-1 connection region, and the second via hole V2 may be formed in the 2-2 connection region.

One or two or more of the first via hole V1 or the second via hole V2 may be formed, respectively. When a plurality of the first via hole v1 or the second via hole V2 is formed, even if a connection defect occurs in any one of the via holes during the process, it can be connected in the other via hole, thereby minimizing the characteristic defect of the coil member. can

Also, in order to form a plurality of via holes, the wiring pattern of the connection region may be formed to be wider than the wiring pattern forming the loop. Accordingly, when the first wiring pattern and the second wiring pattern are connected through the connection region, an alignment defect in which the first wiring pattern, the connection region, and the second wiring pattern are not connected can be prevented.

The first wiring pattern 210 may include a first pad part 212a and a second pad part 212b. When a signal is transmitted from the first pad part 212a on the first surface 1S of the substrate 100 connected to the printed circuit board, the signal is transmitted from the outside along the first wiring pattern 210 to the inside. is transmitted to the 1-1 connection area in a coil shape, and is transmitted from the 1-1 connection area to the 2-1 connection area of the second surface 2S through the first via hole V1. can

Subsequently, the signal is transmitted from the inside to the outside in a coil shape along the second wiring pattern 220 to the 2-2 connection area, and is formed on the first surface 1S through the second via hole V2. It may be transferred to the 1-2 connection area. Subsequently, the signal may be transmitted to the second pad part 212b along the first wiring pattern 220 , and the signal may be transmitted back to the printed circuit board.

Each of the first pad part 212a or the second pad part 212b may be formed of one or two or more pad parts. In other words, the first pad part 212a or the second pad part 212b may be formed in plurality. Through this, it is possible to prevent contact failure that may occur when the pad part and the printed circuit board are connected.

The plating pattern may be connected to the wiring pattern. The plating pattern may be a portion of the plating line remaining on the substrate 100 after the coil member is manufactured. The plating pattern may transmit a current to the wiring pattern to form a plating layer of the wiring pattern.

The plating pattern may include a first plating pattern and a second plating pattern. The plating pattern is disposed on the first surface 1S of the substrate 100 and includes a first plating pattern including a 1-1 plating pattern 311 and a 1-2 plating pattern 312 and the substrate. A second plating pattern disposed on the second surface 2S of ( 100 ) and including a 2-1 th plating pattern 321 and a 2 - 2 th plating pattern 322 may be included.

Alternatively, the plating pattern is disposed on the first surface 1S of the substrate 100 and includes at least one of a 1-1 plating pattern 311 and a 1-2 plating pattern 312 . a plating pattern or a second plating pattern disposed on the second surface 2S of the substrate 100 and including at least one of a 2-1 plating pattern 321 and a 2-2 plating pattern 322; may include That is, the plating pattern may include at least one of a first plating pattern and a second plating pattern.

The 1-1 plating pattern 311 and the 1-2 plating pattern 312 may be connected to the first wiring pattern 210 . In detail, the 1-1 plating pattern 311 and the 1-2 plating pattern 312 may be connected to a first wiring pattern 210 disposed at an outermost portion of the first wiring patterns 210 . Accordingly, the first wiring pattern 210 includes a plating layer formed through an electrolytic plating process using a current transmitted through the 1-1 plating pattern 311 and the 1-2 plating pattern 312 . can do.

In addition, the 2-1 th plating pattern 321 and the 2-2 th plating pattern 322 may be connected to the second wiring pattern 220 . In detail, the 2-1 th plating pattern 321 and the 2-2 th plating pattern 322 may be connected to a second wiring pattern 220 disposed at an outermost portion of the second wiring patterns 220 . Accordingly, the second wiring pattern 220 includes a plating layer formed through an electrolytic plating process using a current transmitted through the 2-1 plating pattern 321 and the 2-2 plating pattern 322 . can do.

The first plating pattern may be disposed to extend to an end of the substrate 100 . Alternatively, the first plating pattern may be disposed to extend to further protrude from the end of the substrate 100 .

In addition, the second plating pattern may be disposed to extend to an end of the substrate 100 . Alternatively, the second plating pattern may be disposed to extend to further protrude from the end of the substrate 100 .

The dummy patterns 410 and 420 may include a first dummy pattern 410 and a second dummy pattern 420 . In detail, the dummy patterns 410 and 420 are disposed on the first dummy pattern 410 disposed on the first surface 1S of the substrate 100 and the second surface 2S of the substrate 100 . A second dummy pattern 420 may be included.

The first dummy pattern 410 and the second dummy pattern 420 are the wiring patterns 210 and 220 and the plating on the first surface 1S and the second surface 2S of the substrate 100, respectively. It may be disposed on an area where the pattern is not disposed. That is, the first dummy pattern 410 and the second dummy pattern 420 may be disposed to be spaced apart from the wiring patterns 210 and 220 and the plating pattern.

Also, the first dummy pattern 410 and the second dummy pattern 420 may be disconnected from other patterns and may be disposed. That is, a signal may not be transmitted to the first dummy pattern 410 and the second dummy pattern 420 . That is, no signal is transmitted to the first dummy pattern 410 and the second dummy pattern 420 , and the first dummy pattern 410 and the second dummy pattern 420 are connected to the substrate 100 . It is disposed on both sides of the to prevent disconnection between the wiring patterns, and can serve as an alignment mark when forming the wiring patterns.

Protective layers 510 and 520 may be disposed on the wiring patterns 210 and 220 , the plating patterns 310 and 320 , and the dummy patterns 410 and 420 , respectively. The protective layers 510 and 520 may be disposed while surrounding the wiring patterns 210 and 220 , the plating patterns 310 and 320 , and the dummy patterns 410 and 420 . Accordingly, it is possible to prevent oxidation of the wiring pattern by external moisture, air, or the like, and to prevent film removal of the wiring pattern.

The protective layers 510 and 520 may be disposed to partially expose the wiring pattern. In detail, the protective layers 510 and 520 may be disposed on the wiring part 211 , but may not be disposed on the pad parts 212a and 212b. That is, the protective layer 300 may be disposed to expose the pad portions 212a and 212b. Accordingly, the wiring pattern disposed on the first surface 1S of the substrate 100, that is, the lower surface of the coil member, is a printed circuit of the camera module on which the coil member is disposed through the pad parts 212a and 212b. It may be connected to the terminal of the board. That is, the protective layers 510 and 520 are formed as the entire surface on the second surface 2S of the substrate, and on the first surface 1S on the region except for the pad portions 212a and 212b of the wiring pattern. All can be placed.

The passivation layers 510 and 520 may include a first passivation layer 510 and a second passivation layer 520 . In detail, the protective layers 510 and 520 are disposed on the first protective layer 510 disposed on the first surface 1S of the substrate 100 and the second surface 2S of the substrate 100 . A second protective layer 520 may be included.

The first passivation layer 510 and the second passivation layer 520 may be disposed to have different thicknesses. For example, the first passivation layer 510 may be disposed to have a thickness smaller than that of the second passivation layer 520 . That is, the first protective layer 510 disposed on the one surface 1S of the substrate on which the pad part of the wiring pattern is disposed is the second protective layer 520 to connect the pad part and the terminal of the printed circuit board. ) may be disposed with a thinner thickness.

For example, the thickness of the protective layers 510 and 520 may be 10 μm to 40 μm, and in the above range, the first protective layer 510 may be disposed to have a thickness smaller than that of the second protective layer 520 . can

However, the embodiment is not limited thereto, and the thickness of the second passivation layer 520 of the substrate may be reduced to have the same or similar thicknesses of the first passivation layer and the second passivation layer.

When the thickness of the protective layers 510 and 520 exceeds 40 μm, the thickness of the coil member may increase. When the thickness of the protective layers 510 and 520 is less than 10 μm, the reliability of the wiring pattern of the coil member may be deteriorated.

The protective layers 510 and 520 may include an insulating material. The protective layers 510 and 520 may include various materials that may be applied to protect the surface of the wiring pattern and then cured by heating.

The protective layers 510 and 520 may be resist layers. For example, the protective layers 510 and 520 may be a solder resist layer including an organic polymer material. For example, the protective layers 510 and 520 may include an epoxy acrylate-based resin. In detail, the protective layers 510 and 520 may include a resin, a curing agent, a photoinitiator, a pigment, a solvent, a filler, an additive, an acryl-based monomer, and the like. However, embodiments are not limited thereto, and the protective layers 510 and 520 may be any one of a photo-solder resist layer, a cover-lay, and a polymer material.

As described above, the circuit patterns may have different sizes and may be spaced apart from each other at different intervals. In detail, the circuit patterns may be formed to have different widths, thicknesses, and areas, and the circuit patterns may include regions having different intervals.

That is, an interval between adjacent circuit patterns among circuit patterns according to the embodiment may vary according to widths of the circuit patterns. In detail, in the coil member according to the embodiment, the interval between adjacent circuit patterns may increase as the width of the circuit patterns increases. That is, in the coil member according to the embodiment, a distance between adjacent circuit patterns may be proportional to a width of the circuit patterns.

Hereinafter, intervals between circuit patterns will be described in detail with reference to FIGS. 3 to 11 .

FIG. 3 is an enlarged view of area A of FIG. 1 . That is, FIG. 3 is an enlarged view of one region of the first wiring pattern 210 in FIG. 1 . Hereinafter, the first wiring pattern 210 will be mainly described, but the following description may be equally applied to the second wiring pattern 220 .

Referring to FIG. 3 , the first wiring patterns 210 may be disposed to be spaced apart from each other. In detail, since one wiring pattern is disposed in a coil shape in the first wiring pattern 210 , the first wiring pattern 210 may include a spaced region for forming a coil shape.

Referring to FIG. 3 , the first wiring pattern may include a 1-1 wiring pattern 201 and a 1-2 wiring pattern 202 disposed to be spaced apart from each other. The 1-1 wiring pattern 201 and the 1-2 wiring pattern 202 are connected to each other on the substrate 100, but since the first wiring pattern is entirely arranged in a coil shape, they may be spaced apart from each other. can

The 1-1 wiring pattern 201 and the 1-1 wiring pattern 202 may have different sizes. In detail, the 1-1 wiring pattern 201 and the 1-2 wiring pattern 102 may be formed to have different widths. For example, the 1-1 wiring pattern 201 may have a first width w1 , the 1-2 wiring pattern 202 may have a second width, and the first width w1 may be provided. may be smaller than the second width w2.

The first wiring pattern 210 may include a region having a first width w1 and a region having a second width w2. That is, the width of the first wiring pattern 210 may be variably changed while extending in the coil direction. Although only the first width w1 and the second width w2 are illustrated in FIG. 3 , the embodiment is not limited thereto, and the first wiring pattern 210 may be changed to various widths while extending in the coil direction. can

Since the first wiring pattern 210 has a width of various sizes and extends in the coil direction, the first wiring pattern 210 may have various intervals according to the sizes of the patterns.

In detail, the first wiring pattern 210 may have a first interval s1 and a second interval s2. In detail, the first wiring pattern 210 includes a first interval s1 between the 1-1 wiring patterns 202 having the first width w1 and a first interval s1 having the first width w1. A second interval s2 may be provided between the −1 wiring pattern 201 and the first and second wiring patterns 202 having the second width w2.

In this case, the sizes of the first interval s1 and the second interval s2 may be different. In detail, the size of the first interval s1 may be smaller than the size of the second interval s2. That is, an interval between wiring patterns having different widths may be greater than an interval between wiring patterns having the same width.

Accordingly, it is possible to prevent the wiring patterns spaced apart from each other from being in contact with each other to prevent a short circuit between the wiring patterns.

The first interval s1 and the second interval s2 of the first wiring pattern 210 may be related to the layer structure of the first wiring pattern 210 .

FIG. 4 is a cross-sectional view taken along region B-B' of FIG. 3 , and FIGS. 5 to 7 are views for explaining a manufacturing process of the first wiring pattern 210 .

Referring to FIG. 4 , the first wiring pattern 210 may include a plurality of layers. In detail, the first wiring pattern 210 may include a plurality of conductive layers. For example, the first wiring pattern 210 may include a first layer (L1), a second layer (L2), a third layer (L3), and a fourth layer (L3) sequentially stacked on the substrate 100 . L4) may be included. In FIG. 4 , the first wiring pattern 210 has been mainly described, but the embodiment is not limited thereto, and the second wiring pattern 220 , the plating pattern, and the dummy pattern are also the first wiring pattern 210 . It may include a first layer (L1), a second layer (L2), a third layer (L3), and a fourth layer (L4) as in the layer structure of the.

The first layer L1 may be disposed on the substrate 100 . In detail, the first layer L1 may be disposed in direct contact with the substrate 100 .

The first layer L1 may be formed in multiple layers. For example, the first layer L1 may include at least one of nickel, chromium, and titanium. That is, the first layer L1 may include at least one of a nickel layer, a chromium layer, and a titanium layer. For example, the first layer L1 may include a nickel layer and a chromium layer on the nickel layer.

The first layer L1 may be formed through an electroless plating or sputtering process. The first layer L1 may be disposed to have a thin thickness. In detail, the first layer L1 may be disposed to a thickness of 20 nm or less.

The first layer L1 may be a layer that improves adhesion between the second layer L2 disposed on the first layer L1 and the substrate 100 . For example, the nickel layer may have good adhesion to the substrate 100 , and the chromium layer may have good adhesion to the nickel layer and the second layer L2 . Accordingly, the adhesion of the second layer L2 disposed on the substrate 100 may be improved.

The second layer L2 may be disposed on the first layer L1 . The second layer L2 may include the same or different material as the first layer L1 . Specifically, the second layer L2 may include a metal material having excellent conductivity. For example, the second layer L2 may be copper (Cu), aluminum (Al), chromium (Cr), nickel (Ni), silver (Ag), or molybdenum (Mo). It may include a metal layer including at least one of gold (Au), titanium (Ti), and alloys thereof. Preferably, the second layer L2 may include copper. That is, the second layer L2 may be a copper layer.

The second layer L2 may be formed through electroless plating. The second layer L2 may be disposed to have a thickness greater than that of the first layer L1 . In detail, the second layer L2 may be disposed to have a thickness of 0.1 μm to 1 μm.

The third layer L3 may be disposed on the second layer L2 . The third layer L3 may include the same material as the second layer L2 . For example, both the second layer L2 and the third layer L3 may include copper. That is, the third layer L3 may be a copper layer. In the wiring patterns 210 and 220 , the second layer L2 and the third layer L3 including the same material may be distinguished by a difference in the grains of the respective layers.

The third layer L3 may be formed through electrolytic plating using the second layer L2 as a seed layer. That is, the second layer L2 may be a seed layer for electrolytic plating of the third layer L3 , and the third layer L3 may be a plating layer formed through the electrolytic plating. The third layer L3 may be disposed to have a thickness greater than that of the first layer L1 and the second layer L2 . In detail, the third layer L3 may be disposed to have a thickness of 20 μm to 50 μm.

The fourth layer L4 may be disposed on the third layer L3 . In detail, the fourth layer L4 may be disposed in contact with side surfaces and upper surfaces of the third layer L3 . In detail, the fourth layer L4 may be disposed while being spaced apart from the substrate 100 and in contact with the side and top surfaces of the third layer L3 . That is, the fourth layer L4 may be disposed to be spaced apart from the substrate 100 .

Accordingly, the protective layers 510 and 520 described above may also be disposed inside the wiring patterns 210 and 220 , the plating patterns 310 and 320 , and the dummy patterns 410 and 420 . In detail, the protective layers 510 and 520 may also be disposed between the substrate 100 and the wiring patterns 210 and 220 , the plating patterns 310 and 320 , and the dummy patterns 410 and 420 . In more detail, the protective layers 510 and 520 are the fourth layers L4 of the substrate 100 , the wiring patterns 210 and 220 , the plating patterns 310 and 320 , and the dummy patterns 410 and 420 . ) can also be placed between

A fourth layer L4 of the wiring patterns 210 and 220, the plating patterns 310 and 320, and the dummy patterns 410 and 420 is spaced apart from the substrate 100, and the third layer L3 ), the protective layers 510 and 520, the protective layers 510 and 520, the substrate 100, the wiring patterns 210 and 220, and the plating patterns 310 and 320. and between the fourth layer L4 of the dummy patterns 410 and 420 , in contact with the third layer L3 and the fourth layer L4 .

Accordingly, the area of the passivation layers 510 and 520 can be improved, and the passivation layers 510 and 520 are arranged in a structure supported by the circuit pattern, that is, the fourth layer L4. It is possible to prevent film removal of the protective layers 510 and 520 .

The fourth layer L2 may include the same material as the second layer L2 and the third layer L3. For example, the second layer L2 , the third layer L3 , and the fourth layer L4 may all include copper. That is, the fourth layer L4 may be a copper layer.

The fourth layer L4 may be a plating layer formed through the electrolytic plating. In detail, after the third layer L3 is formed, a current may be applied again through the plating line to form the fourth layer L4 . The fourth layer L4 may be formed through one or more plating processes, and a plurality of layers having different textures may be formed on the fourth layer L4 according to the number of plating processes.

The fourth layer L4 may be disposed to have a smaller thickness than the third layer L3 . In detail, the fourth layer L4 may be disposed to have a thickness of 5 μm to 15 μm.

Meanwhile, among the circuit patterns, the wiring patterns 210 and 220 may further include a fifth layer. In detail, the fifth layer may be disposed on the pad portions 212a and 212b of the wiring pattern. The fifth layer may be disposed on the fourth layer L4. The fifth layer may be disposed on the pad part to facilitate adhesion when the coil member and the terminal of the printed circuit board are connected.

The fifth layer may include the same or different material from the second to fourth layers. In detail, the fifth layer L5 may include tin (Sn). That is, the fifth layer may include a tin layer. Alternatively, the fifth layer may include both copper and tin. For example, the fifth layer may have an increased content of tin while extending from the fourth layer L4 to the upper surface direction of the fifth layer L5.

The fifth layer may be smaller than the thickness of the second to fourth layers. In detail, the thickness of the fifth layer may be 0.3 μm to 0.8 μm.

Among the layer structures of the first wiring pattern 210 , the third layer L3 and the fourth layer L4 may be formed through electrolytic plating. That is, the third layer L3 and the fourth layer L4 may be plating layers.

In this case, both the thickness and the width of the first wiring pattern 210 are increased through the plating process, and thus, adjacent first wiring patterns 210 may be connected to each other and short-circuited during the plating process.

In detail, the 1-1 wiring pattern 201 and the 1-2 wiring pattern 202 may have different widths and thicknesses. That is, since the 1-1 wiring pattern 201 and the 1-2 wiring pattern 202 have different widths, the width of the wiring pattern when the fourth layer L4 is formed by a plating process is According to the difference, the thickness of the wiring pattern may also be changed.

That is, since the width of the third layer L3 of the 1-2 wiring pattern 202 is greater than the width of the third layer of the 1-1 wiring pattern 201, the width of the first 1-2 wiring pattern ( 202), the fourth layer may be formed to have a greater width and thickness than the fourth layer on the 1-1 wiring pattern 201 .

Accordingly, in the region where patterns having different widths are adjacent to each other, the adjacent patterns may be shorted when the fourth layer is formed due to the difference in the size of the plating layer.

Accordingly, in the coil member according to the embodiment, the spacing between the patterns having different widths may be larger than the spacing between the patterns having the same width, thereby preventing a short circuit.

5 to 7 are views for explaining a manufacturing process of the first wiring pattern.

Referring to FIG. 5 , a first layer L1 and a second layer L2 may be disposed on the substrate 100 . The first layer L1 and the second layer L2 may be disposed on the entire surface of the substrate 100 by plating and sputtering processes.

Subsequently, referring to FIG. 6 , a third layer L3 may be formed on the substrate 100 . In detail, the third layer L3 may be disposed on the second layer L2 . The third layer L3 may be formed through electroplating. In detail, the third layer L3 may be formed as a plating layer by passing a current through the plating pattern and using the second layer L2 as a seed layer.

After the third layer L3 is formed, the third layer L3 may be formed in a coil pattern shape through exposure, development, and flash etching (removing the second layer). That is, the first wiring pattern 210 is a coil pattern having a 1-1 wiring pattern 201 having a first width w1 and a 1-2 wiring pattern 202 having a second width w2. can be formed into a shape.

In detail, the first wiring pattern 210 disposed in a coil shape may include one or at least two or more regions having different widths depending on the position of the first wiring pattern and the direction of the first wiring pattern.

In this case, the first wiring patterns 210 may be formed to have different intervals according to the widths of the wiring patterns. In detail, the first wiring pattern 210 includes a first interval s1 between the 1-1 wiring patterns 201 and the 1-1 wiring pattern 201 and the 1-2 wiring patterns ( 202) may have a second interval s2 between them. The second interval s2 may be greater than the first interval s1.

Accordingly, when the fourth layer L4 to be described below is formed, the 1-1 wiring is caused by a difference in the width of the plating layer of the 1-1 wiring pattern 201 and the 1-2 wiring pattern 202 . It is possible to prevent a short circuit from occurring in the pattern 201 and the first and second wiring patterns 202 .

In detail, referring to FIG. 7 , the fourth layer L4 may be formed on the third layer L3 . In detail, the fourth layer L4 may be disposed while surrounding the third layer L3. The fourth layer L4 may be formed by the same process as the third layer L3 . That is, the fourth layer L4 may be formed through electroplating.

The fourth layer L4 may be formed to have a different width according to the width of the first wiring pattern. In detail, since the 1-1 wiring pattern 201 and the 1-2 wiring pattern 202 have different widths, the width of the fourth layer L4, which is a plating layer formed by electroplating, may also be different. . That is, since the 1-2 wiring pattern 202 has a larger width than the 1-1 wiring pattern 201, the amount of current applied through the plating pattern is large, and thus the 1-1 wiring pattern ( 201), a plating layer having a larger width may be formed.

That is, since the fourth layer of the 1-2 wiring pattern 202 is formed of a larger plating layer than the fourth layer of the 1-1 wiring pattern 201 , the width and thickness of the wiring pattern may be larger.

That is, the 1-1 wiring pattern 201 has a first width w1 and a first thickness T1, and the 1-2 wiring pattern 202 has a first width greater than the first width w1. It may have a second width w2 and a second thickness T2 greater than the first thickness T1 .

Accordingly, when the first interval s1 and the second interval s2 are formed to be the same, the formation of the guide layer having different sizes in the second interval s2 between patterns having different widths is formed. A short circuit may occur because adjacent wiring patterns are connected to each other.

Accordingly, by forming the second gap s2 to be larger than the first gap s1, when the fourth layer L4 is formed, adjacent wiring patterns having different widths are prevented from being shorted. can be prevented

Accordingly, when the coil member according to the embodiment forms a circuit pattern, it is possible to prevent short circuiting of patterns due to a difference in plating layer size in patterns having different line widths. Accordingly, the coil member according to the embodiment may prevent short circuiting of circuit patterns, thereby improving electrical characteristics and reliability of the coil member.

FIG. 8 is an enlarged view of region C of FIG. 1 . That is, FIG. 8 is an enlarged view of an area where the first wiring pattern 210 and the first dummy pattern 410 are adjacent to each other in FIG. 1 . Hereinafter, the first wiring pattern 210 and the first dummy pattern 410 will be mainly described, but the following description will be equally applied to the second wiring pattern 220 and the second dummy pattern 420 . can

Referring to FIG. 8 , the first wiring pattern 210 and the first dummy pattern 410 may be disposed to be spaced apart from each other. That is, the first wiring pattern 210 and the first dummy pattern 410 may be physically spaced apart from each other so as not to be electrically connected to each other.

The first wiring pattern 210 and the first dummy pattern 410 may be disposed in different shapes. The first wiring pattern 210 and the first dummy pattern 410 may have different sizes. That is, the first wiring pattern 210 and the first dummy pattern 410 may have different widths and thicknesses.

Referring to FIG. 9 , the first wiring pattern 210 may have a third width w3 , and the first dummy pattern 410 may have a fourth width w4 . The third width w3 and the fourth width w4 may be different from each other. In detail, the third width w3 may be smaller than the fourth width w4. That is, the width of the first dummy pattern 410 may be greater than the width of the first wiring pattern.

Also, the first wiring pattern 210 may have a third thickness T3 , and the first dummy pattern 410 may have a fourth thickness T4 . The third thickness T3 and the fourth thickness T4 may be different from each other. In detail, the third thickness T3 may be smaller than the fourth thickness T4 . That is, the thickness of the first dummy pattern 410 may be greater than the thickness of the first wiring pattern.

Also, the interval s3 between the first wiring patterns 210 and the interval s4 between the first wiring patterns 210 and the first dummy pattern 410 may be different from each other. In detail, the third interval s3 may be smaller than the fourth interval s4. That is, the interval between the first wiring pattern 210 and the first dummy pattern 410 may be greater than the interval between the first wiring patterns 210 .

Accordingly, the coil member according to the embodiment may prevent short circuiting of patterns due to a difference in plating layer size in patterns having different line widths when forming the wiring pattern and the dummy pattern. Accordingly, the coil member according to the embodiment may prevent a short circuit between the wiring pattern and the dummy pattern, thereby improving electrical characteristics and reliability of the coil member.

Meanwhile, the fourth interval s4 may be larger than the second interval s2. Also, the first interval s1 and the third interval s3 may be the same or similar.

That is, since the width of the first dummy pattern 410 is greater than the width of the first wiring pattern 210 , the plating layer of the first dummy pattern 410 formed by the fourth layer L4 is It may be larger than the plating layer of the first wiring pattern.

Accordingly, the spacing between adjacent patterns may vary according to the width of the circuit pattern. That is, as the width of the circuit pattern increases, the interval between adjacent patterns also increases, so that the fourth interval s4 is formed to be larger than the third interval S3, thereby forming a space between the adjacent circuit patterns. short circuit can be prevented.

FIG. 10 is an enlarged view of region E of FIG. 1 , and FIG. 11 is a cross-sectional view taken along region F-F′ of FIG. 10 . That is, FIG. 10 is an enlarged view of an area adjacent to the first dummy patterns 410 in FIG. 1 . Hereinafter, the first dummy pattern 410 will be mainly described, but the following description may be equally applied to the second dummy pattern 420 .

10 and 11 , adjacent first dummy patterns 410 may be disposed to be spaced apart from each other. Since the first dummy patterns 410 are appropriately spaced apart from each other, thickness uniformity of other circuit patterns adjacent to the first dummy pattern 410 may be improved.

Accordingly, the first dummy pattern 410 may include a 1-1 dummy pattern 401 and a 1-2 dummy pattern 402 spaced apart from each other.

The 1-1 dummy pattern 401 may have a fifth width w5 , and the 1-2 dummy pattern 402 may have a sixth width w6 . Also, the 1-1 dummy pattern 401 may have a fifth thickness T5 , and the 1-2 dummy pattern 402 may have a sixth thickness T6 .

On the other hand, the first arc worm 510 is disposed on the 1-1 dummy pattern 401 and the 1-2 dummy pattern 402, and in this case, the first protective layer 510 covers regions having different thicknesses. may include In detail, the thickness T7 of the first protective layer 510 between the 1-1 dummy pattern 401 and the 1-2 dummy pattern 402 in which the dummy pattern is not disposed is the first in the other region. A thickness of the protective layer 510 may be smaller than that of the protective layer 510 . Accordingly, the first protective layer 510 between the 1-1 dummy pattern 401 and the 1-2 dummy pattern 402 may be formed in a concave shape.

The fifth width w5 and the sixth width w6 may be greater than at least one of the first width w1 to the third width w3. Also, the fifth thickness T5 and the sixth thickness T6 may be greater than at least one of the first thickness T1 to the third thickness T3 .

Also, the 1-1 dummy pattern 401 and the 1-2 dummy pattern 402 may be spaced apart from each other by a fifth interval s5.

The fifth interval s5 may be greater than at least one of the first interval s1, the second interval s2, the third interval s3, and the fourth interval s4.

That is, an interval between the dummy patterns having a width greater than that of the first wiring pattern 210 may be greater than an interval between other circuit patterns.

Accordingly, the coil member according to the embodiment may prevent shorting of the dummy patterns due to a difference in the size of the plating layer formed on the dummy patterns when forming the plurality of dummy patterns. In detail, since the dummy patterns have a greater width than other circuit patterns, the width and thickness of the fourth layer may be larger than those of the other circuit patterns.

Accordingly, by forming the fifth interval between the dummy patterns to be larger than other intervals, it is possible to prevent shorting of adjacent dummy patterns when forming the dummy patterns.

Accordingly, the coil member according to the embodiment may prevent a short circuit between the dummy patterns, thereby further improving the thickness uniformity of the circuit pattern of the coil member.

The coil members according to the embodiment may have different spacings according to widths of the wiring pattern, the dummy pattern, and the plating pattern.

That is, the interval between the patterns having a large width may be formed to be larger than the interval between the patterns having a small width.

Accordingly, when a circuit pattern of the wiring pattern, the dummy pattern, and the plating pattern is formed, it is possible to prevent a short circuit between the patterns according to the plating process.

In detail, the size of the plating layer formed by the plating process may vary depending on the size of the seed layer serving as the seed. That is, as the size of the seed layer increases, that is, the width, thickness, and area of the plating layer may be proportionally increased.

Accordingly, when all circuit patterns have the same or similar spacing, the plating layer formed on the circuit patterns having a large width, thickness, and area is formed to be larger than other regions, so that the adjacent patterns are connected to each other so that the circuit patterns are short-circuited. can be

Accordingly, the coil member according to the embodiment may prevent a short circuit of a circuit pattern due to a difference in the size of the circuit pattern by adjusting the spacing between the adjacent circuit patterns according to the size of the circuit patterns.

Accordingly, the coil member according to the embodiment may prevent short circuiting of the circuit pattern and thus have improved reliability.

Hereinafter, a camera module including a coil member according to an embodiment will be described with reference to FIG. 12 . 12 is a view showing a combined perspective view of a camera module according to an embodiment.

12 , the camera module 10 according to the embodiment includes a cover can 1100 , a first mover 1200 , a second mover 1300 , a stator 1400 , a base 1500 , and an elastic unit. (1600). In addition, although not shown in FIG. 15 , the camera module 10 according to the embodiment may further include a printed circuit board, an IR filter, an image sensor, and the like.

The cover can 1100 accommodates the elastic unit 1600 , the first mover 1200 , the stator 1400 and the second mover 1300 , and is mounted on the base 1500 to drive a lens. Forms the exterior of the motor. Specifically, the cover can 1100 is mounted on the base 1500 in close contact with a part or all of the side surface of the cover can 1100, and protects internal components from external impacts and at the same time external contaminants It has anti-penetration function.

In addition, the cover can 1100 should also perform a function of protecting the lens driving motor or the components of the camera module from external interference generated by a mobile phone or the like. Therefore, the cover can 1100 is preferably formed of a metal material.

The cover can 1100 may be implemented as a yoke unit itself, which will be described below, or may be fixed by molding the yoke unit on the inside. In addition, an opening 1110 through which a lens unit (not shown) is exposed is formed on the upper side of the cover can 1100 , and the lower end of the upper side of the cover can 1100 is bent inside the cover can 1100 . An inner yoke (not shown) may be formed. This inner yoke may be located in the concave portion 1213 formed in the bobbin 1210 . In this case, the inner yoke may be disposed at a corner around the opening on the upper side of the yoke portion or may be disposed on the side, and the concave portion of the bobbin may be formed at a corresponding position.

In addition, the cover can 1100 may have at least one fastening piece 1120 extending on each side of the lower end thereof, and the base 1500 has a fastening groove 1520 into which the fastening piece 1120 is inserted. By forming this, it is possible to implement a more robust sealing function and fastening function of the lens driving motor. In addition, the fastening piece and the fastening groove may not be separate, or only one of the two may be formed.

Meanwhile, the first mover 1200 is disposed on the side of the lens unit to move the lens unit (not shown). The first mover 1200 includes a bobbin 1210 for fixing the lens unit, and a first coil member 1220 provided on an outer circumferential surface of the bobbin 1210 .

The lens unit (not shown) may be a lens barrel provided with one or more lenses (not shown), but is not limited thereto, and any holder structure capable of supporting the lens may be included.

An inner circumferential surface of the bobbin 1210 is coupled to an outer circumferential surface of the lens unit to fix the lens unit. In addition, the bobbin 1210 may have a guide portion 1211 guiding the winding or mounting of the first coil member 1220 may be formed on an outer circumferential surface of the bobbin 1210 . The guide part 1211 may be integrally formed with the outer surface of the bobbin 1210 , and may be formed continuously along the outer surface of the bobbin 1210 or may be formed to be spaced apart from each other at predetermined intervals.

In addition, on the upper and lower surfaces of the bobbin 1210 , an upper spring 1710 or a lower spring 1720 provided on the upper side of the base 1500 to support the bobbin 1210 or a spring fastening protrusion to which the lower spring 1720 is fastened. 1212 may be formed.

In addition, in the bobbin 1210 , the inner yoke of the cover can 1000 may be positioned between the bobbin 1210 and the first coil unit 1220 wound around the bobbin 1210 . (1213) may be further included.

In addition, the first coil member 1220 may be guided by the guide part 1211 and wound on the outer surface of the bobbin 1210 , but four individual coils are positioned at 90° to the outer surface of the bobbin 210 . They may be arranged at intervals. The first coil member 220 may receive power applied from a printed circuit board (not shown) to be described later to form an electromagnetic field.

Meanwhile, the second mover 300 is positioned opposite to the first mover 200 on a side surface of the first mover 200 , and a magnet disposed to face the first coil member 1220 . It may include a unit 1310 and a housing 1320 to which the magnet unit 1310 is fixed.

Specifically, the magnet part 1310 is mounted on the housing 1320 with an adhesive or the like so as to be disposed at a position corresponding to the outer surface of the first coil member 1220, and is It is mounted at equal intervals on the corners of the dog to promote efficient use of the internal volume.

The housing 1320 may be formed in a shape corresponding to the inner surface of the cover can 1100 forming the exterior of the lens driving motor. In addition, the housing 1320 is formed of an insulating material, and may be made as an injection molding product in consideration of productivity, and the housing 1320 is a moving part for OIS driving and is spaced apart from the cover can 1100 by a certain distance. can be

In an embodiment, the housing 1320 is formed in a hexahedral shape spaced apart by a predetermined distance corresponding to the shape of the cover can 1100 , and the upper and lower sides are opened to support the first mover 1200 . In addition, the housing 1320 may include a magnet part fastening hole 1311 or a magnet part fastening groove formed in a shape corresponding to the magnet part 1310 on the side surface.

In addition, at least two stoppers 1312 that are formed to protrude at a predetermined interval from the upper surface of the housing 1320 so as to be in contact with the upper surface of the cover can 1100 in case of external impact to absorb the impact may be formed. . The stopper 1312 may be integrally formed with the housing 1320 .

In addition, an upper spring 1710 or a lower spring 1720 provided to support the housing 320 on the upper side of the base 500 to be described later is fastened to the upper and lower surfaces of the housing 320 . A fastening protrusion 1313 may be formed.

On the other hand, the stator 1400 is positioned opposite to the lower side of the second mover 1300 in order to move the second mover 1300, and has through-holes 1411 and 1421 corresponding to the lens unit. formed in the center

Specifically, in the stator 1400, the second coil member 1410 positioned opposite to the lower side of the magnet unit 1310 and the second coil member 1410 are disposed on the upper side to apply power and , and a board on which the OIS chip is mounted, and the board may be a printed circuit board (Printed Circuit Board, 1420). That is, the second coil member 1410 may be the coil member described above with reference to FIGS. 1 to 13 .

The second coil member 1410 may be mounted on a printed circuit board 1420 provided on an upper side of the base 1500 or formed on a flexible printed circuit board or a substrate, and the light of the lens unit (not shown) A through hole 1411 is formed in the center to pass the signal. On the other hand, when considering the miniaturization of the lens driving motor, specifically, the lowering of the height in the z-axis direction, which is the optical axis direction, the second coil member 1410 is a FP (Fine Pattern) coil that is a patterned coil. It may be formed and disposed on the flexible printed circuit board.

The flexible printed circuit board 1420 may be provided on the upper surface of the base 1500 to apply power to the second coil member 1410 , and a through hole 1411 of the second coil member 410 . ) and corresponding through-holes 1421 are formed. In addition, the printed circuit board 1420 includes a terminal portion 1422 having one end or opposite ends bent and protruding downward from the base 1500 , and external power may be supplied through the terminal portion 1422 .

In addition, the embodiment may further include a hall sensor unit (not shown) mounted on the lower or upper surface of the printed circuit board 1420 to correspond to the position of the magnet unit 1310 .

The hall sensor unit senses the strength and phase of the voltage applied to detect the movement of the magnet unit 310 and the current flowing through the coil, and interacts with the printed circuit board 1420 to precisely control the actuator. provided

The hall sensor unit may be provided on a straight line with respect to the magnet unit 1310 and the optical axis direction, and has to detect displacements in the x-axis and y-axis, so that the hall sensor unit is adjacent to the edge of the printed circuit board 1420. It may include two Hall sensors provided at two corners, respectively, and a Hall sensor accommodating groove 1540 capable of accommodating the Hall sensor may be formed in the base 1500 . In addition, one or more Hall sensors may be provided.

Although the hall sensor unit is provided closer to the second coil member 1410 than the magnet unit 1310, considering that the strength of the magnetic field formed in the magnet unit is several hundred times greater than the strength of the electromagnetic field formed in the coil, the magnet unit The influence of the second coil member 410 in detecting the movement of the 1310 is not considered.

The lens unit is moved in all directions by the independent or organic interaction of the first mover 1200, the second mover 1300, and the stator 1400, so that the first mover 1200 and the second mover The image focus of the subject is focused through the interaction of 1300 , and hand shake and the like can be corrected by the interaction of the second mover 1300 and the stator 1400 .

Meanwhile, the base 1500 supports the stator 1400 and the second mover 1300 , and a hollow hole 1510 corresponding to the through holes 1411 and 1421 is formed in the center.

The base 1500 may function as a sensor holder to protect an image sensor (not shown) and may be provided to simultaneously position an IR filter (not shown). In this case, the IR filter may be mounted in the hollow hole 510 formed in the center of the base 1500, and an infrared filter may be provided. In addition, the IR filter may be formed of, for example, a film material or a glass material, and an infrared blocking coating material may be disposed on a plate-shaped optical filter such as a cover glass for protecting an imaging surface or a cover glass. In addition, in addition to the base, a separate sensor holder may be positioned under the base.

In addition, the base 1500 may be formed with one or more fixing protrusions 530 protruding from the upper corner to face or combine with the inner surface of the cover can 1100, and these fixing protrusions 1530 are It facilitates the fastening of the cover can 1100 and at the same time makes it possible to achieve firm fixation after fastening. In addition, two or more fixing protrusions may be formed.

In addition, the base 1500 may be formed with a fastening groove 1520 into which the fastening piece 1120 of the cover can 1100 is inserted. The fastening groove 520 is formed locally on the outer surface of the base 1500 in a shape corresponding to the length of the fastening piece 1120 , or a predetermined bottom of the cover can 1100 including the fastening piece 1120 . It may be formed entirely on the outer surface of the base 1500 so that the part can be inserted.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. Furthermore, features, structures, effects, etc. illustrated in each embodiment can be combined or modified for other embodiments by those of ordinary skill in the art to which the embodiments belong. Accordingly, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

In addition, although the embodiments have been described above, these are merely examples and do not limit the present invention, and those of ordinary skill in the art to which the present invention pertains are exemplified above in a range that does not depart from the essential characteristics of the present embodiment. It can be seen that various modifications and applications that have not been made are possible. For example, each component specifically shown in the embodiments may be implemented by modification. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Claims (10)

a substrate comprising a first surface and a second surface opposite to the first surface;
and a circuit pattern disposed on at least one of the first surface and the second surface, the circuit pattern including a wiring pattern, a plating pattern, and a dummy pattern;
An interval between adjacent circuit patterns increases as the width of the circuit pattern increases. The method of claim 1,
The wiring pattern includes adjacent 1-1 wiring patterns and 1-2 wiring patterns,
A first width of the 1-1 wiring pattern is smaller than a second width of the 1-2 wiring pattern;
A second interval between the 1-1 wiring pattern and the 1-2 wiring pattern is greater than a first interval between the 1-1 wiring patterns. 3. The method of claim 2,
The 1-1 wiring pattern has a first thickness, and the 1-2 wiring pattern has a second thickness,
The second thickness is greater than the first thickness of the coil member. 3. The method of claim 2,
The wiring pattern and the dummy pattern are disposed to be spaced apart from each other,
a first width of the 1-1 wiring pattern is smaller than a fourth width of the dummy pattern;
A fourth interval between the wiring pattern and the dummy pattern is greater than a first interval between the 1-1 wiring patterns. 5. The method of claim 4,
The fourth gap is greater than the second gap. 3. The method of claim 2,
The 1-1 wiring pattern has a first thickness, and the dummy pattern has a fourth thickness,
The fourth thickness is greater than the first thickness of the coil member. 5. The method of claim 4,
The dummy pattern includes a 1-1 dummy pattern and a 1-2 dummy pattern disposed to be spaced apart from each other,
The 1-1 dummy pattern and the 1-2 dummy pattern are spaced apart from each other at a fifth interval,
The fifth interval is greater than at least one of the first interval, the second interval, the third interval, and the fourth interval. 8. The method of claim 7,
The 1-1 dummy pattern has a fifth width and a fifth thickness,
The 1-2 dummy patterns have a sixth width and a sixth thickness,
The fifth width and the sixth width are greater than at least one of the first width, the second width, and the third width;
The fifth thickness and the sixth thickness are greater than at least one of the first thickness, the second thickness, and the third thickness. a first mover disposed on a side surface of the lens unit to move the lens unit;
a second mover positioned opposite to the first mover on a side surface of the first mover;
a stator positioned opposite to a lower side of the second mover to move the second mover and having a through-hole corresponding to the lens unit formed in the center;
and a base supporting the stator and the second mover and having a hollow hole in the center corresponding to the through hole of the second mover;
The stator includes a circuit board and a coil member disposed on the circuit board,
The coil member,
a substrate comprising a first surface and a second surface opposite to the first surface;
and a circuit pattern disposed on at least one of the first surface and the second surface, the circuit pattern including a wiring pattern, a plating pattern, and a dummy pattern;
The interval between adjacent circuit patterns increases as the width of the circuit pattern increases. 10. The method of claim 9,
The wiring pattern includes adjacent 1-1 wiring patterns and 1-2 wiring patterns,
A first width of the 1-1 wiring pattern is smaller than a second width of the 1-2 wiring pattern;
a second interval between the 1-1 wiring pattern and the 1-2 wiring pattern is greater than a first interval between the 1-1 wiring patterns;
The wiring pattern and the dummy pattern are disposed to be spaced apart from each other,
a first width of the 1-1 wiring pattern is smaller than a fourth width of the dummy pattern;
a fourth interval between the wiring pattern and the dummy pattern is greater than a first interval between the 1-1 wiring patterns;
The dummy pattern includes a 1-1 dummy pattern and a 1-2 dummy pattern disposed to be spaced apart from each other,
The 1-1 dummy pattern and the 1-2 dummy pattern are spaced apart from each other at a fifth interval,
The fifth interval is greater than at least one of the first interval, the second interval, the third interval, and the fourth interval.

Images