KR20220075886A - Solvent-free type water soluble epoxy flooring - Google Patents

Abstract

Disclosed is a solvent-free, water-soluble epoxy flooring material having excellent mechanical strength during curing, excellent adhesion, permeability, abrasion resistance, water resistance and chemical resistance, and excellent storage and precipitation prevention properties.
Solvent-free water-soluble epoxy flooring according to the present invention is the main subject; and a curing agent; wherein the subject includes bisphenol A diglycidyl ether, 1,4-butanediol diglycidyl ether, and the curing agent includes calcium carbonate, poly(oxypropylene)diamine, bisphenol A-bisphenol A diglycidyl ether polymers.

Description

Solvent-free water-soluble epoxy flooring {SOLVENT-FREE TYPE WATER SOLUBLE EPOXY FLOORING}

The present invention relates to a solvent-free water-soluble epoxy flooring.

In general, for the floor of a building, an appropriate flooring material is selected in consideration of the dust prevention function, abrasion resistance, durability, and flame retardancy. As such a floor finishing method, conventional epoxy and urethane coatings, solvent-free epoxy, urethane and epoxy resin mortar, etc. are used.

In this regard, cement-based acrylic inorganic flooring materials and cement-based urethane inorganic flooring materials have been developed and used.

However, organic paints that are commonly used in addition to inorganic flooring materials are very vulnerable to fire, and their use is gradually restricted, such as emitting toxic gas in case of fire.

In addition, all of the above prior arts are oil-based products containing VOCs (volatile organic compounds), and in order to improve workability during construction, a thinner should be used after diluting from 2-3% to 30-40% as much as possible. It is not only harmful to the environment, but also causes environmental damage.

On the other hand, inorganic flooring materials, which have recently been spotlighted, are recognized as environmentally friendly products by supplementing the problems of existing organic paints, but the product standards have not yet been established, so the quality is unstable. In addition, the use of excessive materials more than necessary, the price is high, and the construction is difficult, so professional construction personnel are required.

An object of the present invention is to provide a solvent-free water-soluble epoxy flooring material having excellent mechanical strength upon curing, and excellent adhesion, permeability, abrasion resistance, water resistance and chemical resistance.

It is also an object of the present invention to provide a solvent-free water-soluble epoxy flooring material that is environmentally friendly and has excellent dust resistance, storability and precipitation prevention properties.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention not mentioned can be understood by the following description, and will be more clearly understood by the examples of the present invention. It will also be readily apparent that the objects and advantages of the present invention may be realized by the means and combinations thereof indicated in the appended claims.

Solvent-free water-soluble epoxy flooring according to the present invention is the main subject; and a curing agent; wherein the subject includes bisphenol A diglycidyl ether, 1,4-butanediol diglycidyl ether, and the curing agent includes calcium carbonate, poly(oxypropylene)diamine, bisphenol A-bisphenol A diglycidyl ether polymers.

The solvent-free water-soluble epoxy flooring material according to the present invention has excellent mechanical strength when cured, has excellent adhesion, permeability, abrasion resistance, water resistance, and chemical resistance, and has a beautiful surface due to excellent gloss.

In addition, the solvent-free water-soluble epoxy flooring is easy to work in a closed space and is environmentally friendly.

In addition, the solvent-free water-soluble epoxy flooring material has excellent dust resistance.

In addition, the solvent-free water-soluble epoxy flooring material has excellent storage properties and precipitation prevention properties.

In addition to the above-described effects, the specific effects of the present invention will be described together while describing specific details for carrying out the invention below.

The above-described objects, features and advantages will be described below in detail with reference to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the present invention pertains will be able to easily implement the technical idea of the present invention. In describing the present invention, if it is determined that a detailed description of a known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

Also, when it is described that a component is "connected", "coupled" or "connected" to another component, the components may be directly connected or connected to each other, but other components are "interposed" between each component. It should be understood that “or, each component may be “connected,” “coupled,” or “connected,” through another component.

Hereinafter, a solvent-free water-soluble epoxy flooring according to some embodiments of the present invention will be described.

The solvent-free water-soluble epoxy flooring material of the present invention is a flooring material that requires excellent mechanical properties as well as abrasion resistance, chemical resistance, and a beautiful surface. can be used as

The solvent-free water-soluble epoxy flooring of the present invention includes a main agent and a curing agent.

The subject includes bisphenol A diglycidyl ether, 1,4-butanediol diglycidyl ether.

Bisphenol A diglycidyl ether is the main component of the subject and has a major influence on physical properties. Bisphenol A diglycidyl ether is also called 2,2''-((1-METHYLETHYLIDENE)BIS(4,1-PHENYLENEOXYMETHYLENE))BIS-OXIRANE, CAS number 1675-54-3.

1,4-Butanedioldiglycidyl ether is also called 2,2'-(1,4-butanediylbis(oxymethylene))bis-oxirane, CAS number 2425-79-8.

The subject includes 20 to 40 parts by weight of 1,4-butanediol diglycidyl ether based on 100 parts by weight of bisphenol A diglycidyl ether.

When the content of 1,4-butanediol diglycidyl ether is out of 20 to 40 parts by weight, it may be difficult to exhibit required physical properties during curing.

The curing agent includes calcium carbonate, poly(oxypropylene)diamine, and bisphenol A-bisphenol A diglycidyl ether polymer.

Calcium carbonate is preferably added to the curing agent to prevent precipitation of the epoxy flooring material.

Specifically, calcium carbonate includes calcium carbonate having different diameters for storage stability and prevention of precipitation.

The calcium carbonate includes primary calcium carbonate having a diameter of D1, secondary calcium carbonate having a diameter of D2, and tertiary calcium carbonate having a diameter of D3.

In this case, if the diameter is compared, it may be D1 < D2 < D3.

For example, D1 may be 0.1 to 3 μm, D2 may be 4 to 8 μm, and D3 may be 9 to 15 μm.

When the content of the first calcium carbonate is A, the content of the second calcium carbonate is B, and the content of the third calcium carbonate is C, A < B < C.

For example, calcium carbonate may contain 20 to 50 parts by weight of calcium carbonate, 0.1 to 10 parts by weight of calcium carbonate, and 0.1 to 10 parts by weight of calcium carbonate, based on 100 parts by weight of calcium tertiary.

As the content of the first calcium carbonate, the second calcium carbonate, and the third calcium carbonate is satisfied, it may be advantageous to secure mechanical strength as well as hardenability and water resistance.

Poly(oxypropylene)diamine is CAS number 9046-10-0.

The bisphenol A-bisphenol A diglycidyl ether polymer is CAS number 25036-25-3.

The curing agent includes 15 to 40 parts by weight of poly(oxypropylene)diamine and 1 to 15 parts by weight of bisphenol A-bisphenol A diglycidyl ether polymer based on 100 parts by weight of calcium carbonate.

When the content of poly(oxypropylene)diamine and bisphenol A-bisphenol A diglycidyl ether polymer is out of the above range, it may be difficult to exhibit physical properties required during curing.

The viscosity of the subject may be 1000 ~ 1500 cps at 25 ℃, the specific gravity may be 1.0 ~ 1.2.

The viscosity of the curing agent may be 1500 ~ 3000cps at 25 ℃, specific gravity may be 1.3 ~ 1.4.

The curing agent may further include 2,4,6-tris(dimethylaminomethyl)phenol as a curing accelerator. The 2,4,6-tris(dimethylaminomethyl)phenol is included in the curing agent to control the curing time.

The curing agent may further include 0.1 to 15 parts by weight of 2,4,6-tris(dimethylaminomethyl)phenol based on 100 parts by weight of calcium carbonate.

When the content of the 2,4,6-tris(dimethylaminomethyl)phenol is out of 0.1 to 15 parts by weight, it is difficult to control the curing time and the pot life, and workability may be deteriorated.

Additionally, the curing agent may further include a pigment.

The pigment may be used without limitation as long as it is a raw material input to express color.

Solvent-free water-soluble epoxy flooring resin of the present invention: curing agent is included in an equivalent ratio of 1: 0.8 to 1: 1.2. In this case, the curing agent refers to a curing agent that does not contain a calcium carbonate filler.

And the subject: the curing agent is included in a weight ratio of 1:1 to 1:3.

Since the curing agent contains a filler called calcium carbonate, the content of the curing agent may be larger than that of the main agent. Depending on the ratio of the curing agent, the physical properties may change during hardening of the flooring, and excellent physical properties may be secured in the range of 1:1 to 1:3.

The solvent-free water-soluble epoxy flooring material according to the present invention can be prepared as follows.

First, bisphenol A diglycidyl ether and 1,4-butanediol diglycidyl ether are mixed in the indicated ranges to prepare a main ingredient.

Then, calcium carbonate, poly(oxypropylene)diamine, and bisphenol A-bisphenol A diglycidyl ether polymer are mixed in the indicated ranges to prepare a curing agent.

A solvent-free water-soluble epoxy flooring material can be prepared by mixing the prepared main material and a curing agent in a weight ratio.

Pot life using the solvent-free water-soluble epoxy flooring may be approximately 10 to 60 minutes, dry to touch time may be 4 to 5 hours, and curing time may be at least 24 hours or longer.

In addition, the cured product of the solvent-free water-soluble epoxy flooring material may exhibit a shore hardness of D 70 or more.

As such, the solvent-free water-soluble epoxy flooring material according to the present invention has excellent mechanical strength during curing by mixing a bisphenol A-based main component with a curing agent containing calcium carbonate as a main component in an equivalent ratio, adhesion, permeability, abrasion resistance, It has excellent water resistance and chemical resistance.

In addition, solvent-free water-soluble epoxy flooring is eco-friendly and has excellent dust resistance, storability and precipitation prevention properties.

As described above, a specific example of the solvent-free water-soluble epoxy flooring material will be described as follows.

1. Preparation of solvent-free water-soluble epoxy flooring

Example 1

With respect to 100 parts by weight of bisphenol A diglycidyl ether, 20 parts by weight of 1,4-butanediol diglycidyl ether was mixed to prepare a main agent.

With respect to 100 parts by weight of calcium carbonate, 15 parts by weight of poly(oxypropylene)diamine and 5 parts by weight of bisphenol A-bisphenol A diglycidyl ether polymer were mixed to prepare a curing agent.

The calcium carbonate is based on 100 parts by weight of tertiary calcium carbonate having a diameter of 9 to 15 μm, 5 parts by weight of first calcium carbonate having a diameter of 0.1 to 3 μm, and 20 parts by weight of second calcium carbonate having a diameter of 4 to 8 μm. included.

A solvent-free water-soluble epoxy flooring was prepared by mixing the prepared main material and curing agent in a weight ratio of 1:2.

Example 2

A solvent-free water-soluble epoxy flooring material was prepared under the same conditions as in Example 1, except that 40 parts by weight of 1,4-butanediol diglycidyl ether was mixed in the subject matter.

Example 3

A solvent-free water-soluble epoxy flooring was prepared under the same conditions as in Example 1, except that 40 parts by weight of poly(oxypropylene)diamine and 15 parts by weight of bisphenol A-bisphenol A diglycidyl ether polymer were mixed in the curing agent.

Example 4

A solvent-free water-soluble epoxy flooring was prepared under the same conditions as in Example 1, except that 10 parts by weight of 2,4,6-tris(dimethylaminomethyl)phenol was further included with respect to 100 parts by weight of calcium carbonate in the curing agent.

Comparative Example 1

A solvent-free water-soluble epoxy flooring material was prepared under the same conditions as in Example 1, except that 50 parts by weight of 1,4-butanediol diglycidyl ether was mixed in the subject matter.

Comparative Example 2

A solvent-free water-soluble epoxy flooring was prepared under the same conditions as in Example 1, except that 50 parts by weight of poly(oxypropylene)diamine and 20 parts by weight of bisphenol A-bisphenol A diglycidyl ether polymer were mixed in the curing agent.

Comparative Example 3

A solvent-free water-soluble epoxy flooring was prepared under the same conditions as in Example 1, except that only calcium carbonate having a diameter of 9 to 15 μm was included in the curing agent.

Comparative Example 4

A solvent-free water-soluble epoxy flooring was prepared under the same conditions as in Example 1, except that the main agent and the curing agent were mixed in a weight ratio of 1:0.5.

2. Methods for evaluating physical properties and their results

Using the solvent-free water-soluble epoxy flooring prepared in Examples 1 to 4 and Comparative Examples 1 to 4, physical properties were evaluated as follows.

Hardness (Sh.D) was measured according to KSM ISO 868, compressive strength (N/mm ² ), bending strength (N/mm ² ), impact strength (J/m), tensile strength (N/mm ² ) was measured according to KSM 3015.

[Table 1]

Referring to Table 1, the cured products of Examples 1 to 4 of the solvent-free water-soluble epoxy flooring according to the present invention exhibit excellent mechanical strength.

Compressive strength is 100~120N/mm ² , bending strength is 50~60N/mm ² , impact strength is 17~30 J/m, and tensile strength is 36~50N/mm ² .

Examples 1 to 4 exhibit physical properties equal to or greater than those of conventional oil-based flooring materials, and do not generate volatile organic compounds, so they can be used as eco-friendly products.

Therefore, in order to exhibit excellent mechanical strength and be environmentally friendly at the same time, a main agent containing bisphenol A diglycidyl ether and 1,4-butanediol diglycidyl ether, calcium carbonate, poly(oxypropylene)diamine, and bisphenol A - Preference is given to including a curing agent comprising a bisphenol A diglycidyl ether polymer.

As described above, the present invention has been described with reference to the illustrated embodiments, but the present invention is not limited by the embodiments disclosed herein, and various modifications can be made by those skilled in the art within the scope of the technical spirit of the present invention. It is obvious that this can be done. In addition, although the effects according to the configuration of the present invention have not been explicitly described and described while describing the embodiments of the present invention, it is natural that the effects predictable by the configuration should also be recognized.

Claims (6)

topic; and a curing agent; and
the subject is
bisphenol A diglycidyl ether, 1,4-butanediol diglycidyl ether;
The curing agent is a solvent-free water-soluble epoxy flooring material comprising calcium carbonate, poly (oxypropylene) diamine, bisphenol A-bisphenol A diglycidyl ether polymer.
The method of claim 1,
The subject contains 20 to 40 parts by weight of 1,4-butanediol diglycidyl ether based on 100 parts by weight of bisphenol A diglycidyl ether,
The curing agent, based on 100 parts by weight of calcium carbonate, poly (oxypropylene) diamine 15 to 40 parts by weight, bisphenol A-bisphenol A diglycidyl ether polymer 1 to 15 parts by weight of a solvent-free water-soluble epoxy flooring containing.
The method of claim 1,
The above subject: a solvent-free water-soluble epoxy flooring material containing a curing agent in a weight ratio of 1:1 to 1:3.
The method of claim 1,
The calcium carbonate includes first calcium carbonate having a diameter of D1, secondary calcium carbonate having a diameter of D2, and tertiary calcium carbonate having a diameter of D3,
Solvent-free water-soluble epoxy flooring with D1<D2< D3.
The method of claim 1,
The calcium carbonate includes first calcium carbonate, second calcium carbonate, and third calcium carbonate having different diameters,
A solvent-free water-soluble epoxy flooring material with A < B < C when the content of primary calcium carbonate is A, the content of secondary calcium carbonate is B, and the content of tertiary calcium carbonate is C.
The method of claim 1,
The curing agent, based on 100 parts by weight of calcium carbonate, 2,4,6-tris (dimethylaminomethyl) phenol solvent-free water-soluble epoxy flooring further comprising 0.1 to 15 parts by weight.