KR20220069272A - Flexible tape with EMI Reduction ability - Google Patents

Flexible tape with EMI Reduction ability Download PDF

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Publication number
KR20220069272A
KR20220069272A KR1020200156228A KR20200156228A KR20220069272A KR 20220069272 A KR20220069272 A KR 20220069272A KR 1020200156228 A KR1020200156228 A KR 1020200156228A KR 20200156228 A KR20200156228 A KR 20200156228A KR 20220069272 A KR20220069272 A KR 20220069272A
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South Korea
Prior art keywords
emi
reduction
electronic tape
emi reduction
heat dissipation
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KR1020200156228A
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Korean (ko)
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박이형
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박이형
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Priority to KR1020200156228A priority Critical patent/KR20220069272A/en
Publication of KR20220069272A publication Critical patent/KR20220069272A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The present invention relates to electronic tape having an EMI reducing effect, which includes: a double-sided or single-sided adhesive film which is obtained by performing extrusion, casting, or foam molding on at least one of polyurethane, polyethylene, and polypropylene; electronic tape which is fixed to the inside of the film, has EMI reduction performance, and includes a metal net structure made of at least one of copper, iron, and aluminum to which a Faraday cage structure is applied; and a hole which is formed in an extra space except for a metal net structure space, to be advantageous for heat dissipation.

Description

EMI저감기능을 갖는 플렉서블 부착체{Flexible tape with EMI Reduction ability}Flexible tape with EMI reduction ability

본 발명은 전도체에서 전자기 유도때 발생하는 전자기력 에니기 중, 전기(전자) 기 우발적으로 발생하여 전파되는 원치 않는 전자기력 에너지, 즉 전자기 장해로부터 받는 장해를 적정수준 이하로 낮출 수 있고(저감), 사용자가 부착이 요구되는 위치를 보고 직접 부착할 수 있어 용이한 테이프를 의미한다. The present invention can lower the interference received from unwanted electromagnetic force energy, that is, electromagnetic interference, which is accidentally generated and propagated by the electric (electromagnetic) phase, to an appropriate level or less (reduction), and the user It means an easy tape because it can be directly attached by looking at the location where it is required to be attached.

위의 예시된 특허명세서 기술분야. 예시된 명세서는 기술분야를 작성할 때 전제부에 발명의 명칭을 먼저 기재하고(본 발명은 (명칭)에 관련된 것으로), 후반부에 해당 발명의 특징적인 기능이나 효과를 간략하게 기재(더욱 상세하게는 (~의 효과가 있는, ~의 성능이 있는))하는 방식으로 작성되었다. The above illustrated patent specification technical field. In the exemplified specification, the name of the invention is first described in the preamble (the present invention is related to (name)), and the characteristic function or effect of the invention is briefly described in the second half (more specifically, when writing the technical field) (Has the effect of, has the performance of)).

전자기 유도는 전위차가 발생하여 전자가 이동할 때 발생하며, 이 전자효과가 우발적으로 발생하여 전파되어 원치 않는 전자기 장해가 발생하는 현상을 전자파 간섭(EMI)라고 한다. 전자파 간섭(이후로 모두 EMI라 명칭한다)은 특히 신뢰성이 중요시되는 전자기기의 정상적인 회로 작동에 있어(레이더, 통신장비 등) 치명적이며, 심할 경우 영구적인 작동이 불가능한 경우도 발생한다.Electromagnetic induction occurs when electrons move due to a potential difference, and the phenomenon of accidental propagation and unwanted electromagnetic interference is called electromagnetic interference (EMI). Electromagnetic interference (hereinafter referred to as EMI) is particularly fatal for the normal circuit operation of electronic devices (radars, communication equipment, etc.) where reliability is important, and in severe cases, permanent operation may not be possible.

전자기기의 입력 전원을 변환하여 인버터(Inv.), 컨버터(Conv.) 등을 포함하는 전력 변환 장치가 사용되는데, 이에는 전력용 스위칭 소자(SCR, IGBT등)이 사용된다. 이때 전력 변환 장치는 노이즈를 발생시키게 된다. 이에 정상적인 작동을 보장하고자 각 국가는 전자파 장애((Electromagnetic Interference, EMI) 규제를 두고 있다.A power conversion device including an inverter (Inv.), a converter (Conv.), etc. is used by converting the input power of the electronic device, and a switching device (SCR, IGBT, etc.) for power is used. At this time, the power converter generates noise. To ensure normal operation, each country has regulations on electromagnetic interference (EMI).

전도성 노이즈는 공통모드(CM : Common Mode) 전류 성분에 의한 공통모드 노이즈(Common Mode Noise)와 차동 모드(DM : Differential Mode) 전류 성분에 의한 차동 모드 노이즈를 포함한다.Conductive noise includes common mode noise due to a common mode (CM) current component and differential mode noise due to a differential mode (DM) current component.

보통 전력 변환 장치에 있어 Noise를 줄이기 위하여 코먼 쵸크(Common Choke), 차동 쵸크, X 커페시터(X-capacitor), Y 커페시터(Y-capacitor)의 부속들이 사용되어 EMI감소 효과를 만들어낸다. Common choke, differential choke, X-capacitor, and Y-capacitor parts are used to reduce noise in power conversion devices to create an EMI reduction effect.

패러데이 새장(Faraday cage)는 패러데이 실드(Faraday shield) 또는 호프만 상자(hoffman Box)라고도 불리며, 도체 혹은 도체 그물로 둘러쌓인 구조를 말한다. 그러하게 둘러쌓인 구조는 외부의 정전기장을 저감하며, 전도되는 에너지의 절대량 혹은 방식, 패러데이 새장의 구조 또는 소재에 따라서 저감의 정도가 변동된다.A Faraday cage, also called a Faraday shield or a hoffman box, refers to a structure surrounded by conductors or conductor nets. Such an enclosed structure reduces the external electrostatic field, and the degree of reduction varies depending on the absolute amount or method of the conducted energy, the structure or material of the Faraday cage.

완충, 방열, 및 EMI 차단 성능을 가지는 전자 테잎, 및 완충 및 EMI 차단 성능을 가지는 전자 테잎(10-2015-0129994)Electronic tape having cushioning, heat dissipation, and EMI blocking performance, and electronic tape having cushioning and EMI blocking performance (10-2015-0129994)

본 발명의 주 목적은 EMI감소 성능을 가지는 전자 테이프를 제공하는 것이다.It is a main object of the present invention to provide an electronic tape having EMI reduction performance.

본 발명의 다른 목적은, 대부분의 환경에서 능동적인 사용을 위한 높은 수준으로 유연한 플렉서블 전자 테이프를 제공하는 것이다.Another object of the present invention is to provide a highly flexible flexible electronic tape for active use in most environments.

상기한 과제를 실현하기 위한 EMI 감소 성능을 가지는 전자 테이프는, 폴리 에틸렌, 폴리 우레탄, 폴리 프로필렌 중 적어도 하나가 압출, 캐스팅, 또는 발포 성형된 Vinyl 필름에 부착되며, 금속 그물 구조를 Vinyl 필름과 Vinyl 필름 사이에 내부에 포함한다.The electronic tape having EMI reduction performance for realizing the above problem is attached to a vinyl film in which at least one of polyethylene, polyurethane, and polypropylene is extruded, cast, or foamed, and a metal network structure is formed between the vinyl film and the vinyl film. Included inside between the films.

상기의 전자테이프는 높은 유연성을 바탕으로 사용자가 원하는 만큼의 부착가능성을 기대할 수 있다. 규칙적으로 배열된 홀(hole)이 장착될 전자기기의 열 배출에 용이함을 기대할 수 있다.The electronic tape can be expected to be attached as much as a user wants based on its high flexibility. It can be expected that the regularly arranged holes are easy to dissipate the heat of the electronic device to be mounted.

도1은 해당 발명품의 단면을 보여주는 도면이다.
도2는 해당 발명품을 위에서 본 도면이다.1 is a view showing a cross-section of the invention.
2 is a view of the invention as viewed from above.

후술하는 본 발명에 대한 상세한 설명은, 본 발명이 실시될 수 있는 특정 실시예를 예시로서 도시한다. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description set forth below shows by way of illustration specific embodiments in which the present invention may be practiced.

도1의 금속 그물(100)은 EMI가 유발되는 곳에서의 EMI저감을 기대시키는 기술이다. The metal net 100 of FIG. 1 is a technology that expects EMI reduction where EMI is induced.

도1의 접착 성분(110)은 해당 EMI저감 전자테이프가 접착하고자 하는 면에 접착할 수 있도록 해주는 역활을 한다.The adhesive component 110 of FIG. 1 serves to enable the EMI reduction electronic tape to be adhered to the surface to be adhered.

도2의 방열용 홀(130)은 방열 능력을 향상시키고자 만들어놓은 방열 구멍(홀)의 역활을 한다.The heat dissipation hole 130 of FIG. 2 serves as a heat dissipation hole (hole) made to improve heat dissipation capability.

다음의 EMI저감테이프는 상기 2가지의 산업 현장에서 유용하게 사용될 수 있다.The following EMI reduction tape can be usefully used in the above two industrial sites.

1. 차단이 아닌 어느수준의 전자파 통과가 필요하여 EMI감소를 유도하려는 경우1. In case of inducing EMI reduction because a certain level of electromagnetic wave passage is required rather than blocking

2. EMI를 감소하여야 하나 열해소적 측면에 대해서 기대점이 있어야 할 경우2. When EMI should be reduced, but there should be expectations in terms of heat dissipation

100: 금속 그물망
110: 점착 성분
130: 방열용 홀(구멍)100: metal mesh
110: adhesive component
130: heat dissipation hole (hole)

Claims (3)

폴리 우레탄, 폴리 에틸렌, 및 폴리 프로필렌 중 적어도 하나가 압출, 캐스팅, 또는 발포 성형되어 양면 또는 단면의 접착성을 가지는 필름 및
상기 필름 내부에 고정되어, 패러데이 새장 구조를 응용한 구리, 철, 알루미늄 중 적어도 하나의 재질인 금속제 그물구조를 포함하는, EMI 저감(감소) 성능을 가지는 전자테이프 및
금속 그물 구조공간을 제외한 여분의 공간에 홀(hole)이 있어 열배출에 유리한 EMI 감소 효과를 가지는 전자 테이프A film in which at least one of polyurethane, polyethylene, and polypropylene is extruded, cast, or foam-molded to have double-sided or single-sided adhesiveness; and
An electronic tape having an EMI reduction (reduction) performance, which is fixed inside the film, and includes a metal net structure that is at least one material of copper, iron, and aluminum to which the Faraday cage structure is applied; and
Electronic tape with EMI reduction effect beneficial for heat dissipation because there is a hole in the extra space except for the metal structure space 제 1항에 있어서,
상기 패러데이 새장 구조를 응용한 금속제 그물구조에 있어 마름모, 정사각형, 직사각형, 원, 타원, 삼각형 또는 이를 혼합한 구조에 있어, 이중 하나의 구조를 가지며 EMI저감(감소) 효과를 가지는 전자 테이프The method of claim 1,
In a metal net structure to which the Faraday cage structure is applied, a rhombus, a square, a rectangle, a circle, an ellipse, a triangle, or a mixture thereof, an electronic tape having one of the structures and having an EMI reduction (reduction) effect 제 1항에 있어서,
상기 열 배출을 위한 홀 구조 또는 도형 모양에 있어 마름모, 정사각형, 원, 타원, 삼각형 또는 이를 혼합한 구조에 있어, 이중 하나의 구조를 가지며 EMI저감(감소) 효과를 가지는 전자 테이프The method of claim 1,
In the hole structure for heat dissipation or the shape of the figure, in the rhombus, square, circle, ellipse, triangle, or a mixed structure thereof, the electronic tape has one of the structures and has an EMI reduction (reduction) effect.
KR1020200156228A 2020-11-20 2020-11-20 Flexible tape with EMI Reduction ability KR20220069272A (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150129994A (en) 2014-05-13 2015-11-23 가드넥(주) Electronic tape having buffering, heat radiating, and emi shielding function, electronic tape having buffering and emi shielding function, and electronic tape having buffering, emi shielding, and waterproof function

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150129994A (en) 2014-05-13 2015-11-23 가드넥(주) Electronic tape having buffering, heat radiating, and emi shielding function, electronic tape having buffering and emi shielding function, and electronic tape having buffering, emi shielding, and waterproof function

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