KR20220053464A - An electronic device including display - Google Patents

Abstract

Disclosed is an electronic device, which comprises: a display panel having foldable and unfoldable states; a glass disposed in a first direction facing a front surface of the display panel; a protection layer disposed in the first direction of the glass; a first printing layer disposed between the glass and the protection layer; and a second printing layer disposed in a second direction in which the rear surface of the glass faces. The first printing layer is spaced apart from an edge of the glass in a third direction facing an active area of the display panel, and one end of the second printing layer corresponds to an edge of the display panel. Various other embodiments identified by the specification are possible. The present invention can inspect whether cracks or chipping have occurred on the edge of the glass.

Description

An electronic device including display

Various embodiments disclosed in this document relate to an electronic device including a display.

The electronic device may include a display that displays a screen. The display may include an active area that is an area for displaying a screen and a non-display area surrounding the active area. A printed layer may be disposed along the edge of the active area to reduce visibility of the inside of the edge of the active area when the display is viewed from the front side. The printed layer may be made of a material that blocks light.

The display may be formed of a plurality of layers including a display panel in which pixels are disposed. Recently, an electronic device capable of changing an electronic device and a display into a folded state and an unfolded state, such as a foldable electronic device, has emerged. A plurality of layers may be implemented so that the display can be folded or unfolded multiple times. For example, the plurality of layers may be made of a flexible material. As another example, the thickness of the plurality of layers may be reduced.

A plurality of layers constituting the display may include glass. The glass may be disposed between the display panel and the protective layer for protecting the front surface of the display panel. Glass can improve the visibility, aesthetics, and tactile feel of the front surface of the display. In order to fold or unfold the display a plurality of times, the thickness of the glass disposed in the foldable electronic device may be reduced. As the thickness of the glass decreases, cracks or chipping may occur at the edge of the glass.

It may be necessary to inspect the front of the display for cracks or chipping on the edge of the glass. When the printed layer is disposed along the edge of the activation region, it may not be easy to inspect whether cracks or chipping have occurred on the edge of the glass.

Various embodiments disclosed in this document are intended to provide an electronic device including a display in which a printed layer is disposed so that it can be checked whether cracks or chipping have occurred on the edge of the glass.

An electronic device according to an embodiment disclosed in this document includes a display panel having a folded state and an unfolded state, a glass disposed in a first direction toward which a front surface of the display panel faces, and a protection disposed in the first direction of the glass layer, a first printed layer disposed between the glass and the protective layer, and a second printed layer disposed in a second direction in which the rear surface of the glass faces, wherein the first printed layer is formed from an edge of the glass. The display panel may be spaced apart from each other in a third direction toward the active area, and one end of the second printed layer may be disposed to correspond to an edge of the display panel.

In addition, the electronic device according to another exemplary embodiment disclosed in this document includes a display panel having a folded state and an unfolded state, a glass disposed in a first direction of the display panel, and a protective layer disposed in the first direction of the glass. , a first printed layer disposed between the glass and the protective layer, and a second printed layer disposed in a second direction in which a rear surface of the glass faces, wherein the first printed layer is formed from the edge of the glass. It is disposed spaced apart by a first distance in a third direction that is a direction toward the active area of the display panel, and one end of the second printed layer is disposed to correspond to an edge of the display panel, and when viewed from the first direction The first printed layer and the second printed layer may overlap by a second distance.

According to the embodiments disclosed in this document, by disposing the first printing layer disposed on the upper portion of the glass to be spaced apart from the edge of the glass, whether cracks or chipping occurs at the edge of the glass may be inspected.

In addition, according to the embodiments disclosed in this document, it is possible to reduce a phenomenon in which the structure of the edge of the display is visually recognized by disposing the second printed layer under the glass to at least partially overlap the first printed layer.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;
2 is a block diagram of a display module according to various embodiments of the present disclosure;
3 is a diagram illustrating an unfolded state of an electronic device according to an exemplary embodiment.
4 is a diagram illustrating a folded state of an electronic device according to an exemplary embodiment.
5 is an exploded perspective view of an electronic device according to an embodiment.
6 is a side view of a display of an electronic device according to an exemplary embodiment.
7 is a side view of a display of an electronic device according to an exemplary embodiment.
8 is a side view of a display of an electronic device according to an exemplary embodiment.
9 is a side view of a display of an electronic device according to an exemplary embodiment.
10 is a side view of a display of an electronic device according to an exemplary embodiment.
11 is a front view of an electronic device according to an exemplary embodiment.
12 is a cross-sectional view taken along line BB′ of an electronic device according to an exemplary embodiment.
13 is a front view of an electronic device according to an exemplary embodiment.
14 is a cross-sectional view taken along CC` of an electronic device according to an exemplary embodiment.
15 is a cross-sectional view of BB′ of an electronic device according to an exemplary embodiment.
16A is a front view of an electronic device according to an exemplary embodiment.
16B is a front view of an electronic device according to an exemplary embodiment.
17 is a front view of a first inspection area of an electronic device according to an exemplary embodiment.
18 is a cross-sectional view taken along line DD` of FIG. 17 .
19A is a front view of a mechanism part of an electronic device according to an exemplary embodiment;
19B is a cross-sectional view taken along line EE` of FIG. 19A.
20A is a front view of a second printed layer of an electronic device according to an exemplary embodiment.
20B is a cross-sectional view taken along line FF` of FIG. 20A.
21 is a front view of an electronic device according to an exemplary embodiment.
22 is a cross-sectional view taken along line GG` of FIG. 21 .
23 is a front view of an electronic device according to an exemplary embodiment.
24 is a front view of a first mechanism portion of an electronic device according to an exemplary embodiment.
25 is a front view of a second mechanism part of an electronic device according to an exemplary embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that various modifications, equivalents, and/or alternatives of the embodiments of the present invention are included.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, driving unit 181, rotating unit 183, power management module 188, battery 189, communication module 190 , a subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 may use less power than the main processor 121 or may be set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the co-processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The driving unit 181 may move the display module 160 into and/or out of the electronic device 101 . The driving unit 181 may control the display module 160 to be converted into a normal mode disposed inside the electronic device 101 and an expanded mode extended to the outside of the electronic device 101 . there is. The driving unit 181 may be a slide-type rail structure and/or a motor disposed inside the electronic device 101 , but is not limited thereto.

The rotating unit 183 moves the display module 160 into and/or out of the electronic device 101 , or when the display module 160 moves into and/or out of the electronic device 101 , the display device It may serve as a support for supporting the 160 . The rotating unit 183 may be inserted into the rollable display module 160 while being rolled or extended to the outside of the electronic device 101 while the display module 160 is unfolded. The rotating unit 183 may be a cylinder-shaped rotating body disposed on a side surface of the electronic device 101 .

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a block diagram 200 of a display module 160, according to various embodiments. Referring to FIG. 2 , the display module 160 may include a 210 and a display driver IC (DDI) 230 for controlling the same. The DDI 230 may include an interface module 231 , a memory 233 (eg, a buffer memory), an image processing module 235 , or a mapping module 237 . The DDI 230 receives, for example, image data or image information including an image control signal corresponding to a command for controlling the image data from other components of the electronic device 101 through the interface module 231 . can do. For example, according to one embodiment, the image information is the processor 120 (eg, the main processor 121 (eg, an application processor) or the auxiliary processor 123 (eg, an application processor) operated independently of the function of the main processor 121 ( For example, a graphic processing device) The DDI 230 may communicate with the touch circuit 250 or the sensor module 176 through the interface module 231. In addition, the DDI 230 is the At least a portion of the received image information may be stored in the memory 233, for example, in units of frames, for example, the image processing module 235 may store at least a portion of the image data, Pre-processing or post-processing (eg, resolution, brightness, or size adjustment) may be performed based on at least the characteristics of the display 210. The mapping module 237 may perform pre-processing or post-processing through the image processing module 135. A voltage value or a current value corresponding to the image data may be generated. According to an exemplary embodiment, the generation of the voltage value or the current value may include, for example, a property of pixels of the display 210 (eg, an arrangement of pixels). RGB stripe or pentile structure), or the size of each sub-pixel) At least some pixels of the display 210 may be at least partially based on, for example, the voltage value or the current value. By being driven, visual information (eg, text, image, or icon) corresponding to the image data may be displayed through the display 210 .

According to an embodiment, the display module 160 may further include a touch circuit 250 . The touch circuit 250 may include a touch sensor 251 and a touch sensor IC 253 for controlling the touch sensor 251 . The touch sensor IC 253 may control the touch sensor 251 to sense, for example, a touch input or a hovering input for a designated position of the display 210 . For example, the touch sensor IC 253 may detect a touch input or a hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or electric charge amount) for a designated position of the display 210 . The touch sensor IC 253 may provide information (eg, location, area, pressure, or time) regarding the sensed touch input or hovering input to the processor 120 . According to an embodiment, at least a part of the touch circuit 250 (eg, the touch sensor IC 253 ) is disposed as a part of the display driver IC 230 , or the display 210 , or outside the display module 160 . may be included as a part of another component (eg, the coprocessor 123).

According to an embodiment, the display module 160 may further include at least one sensor (eg, a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module 176 , or a control circuit therefor. In this case, the at least one sensor or a control circuit therefor may be embedded in a part of the display module 160 (eg, the display 210 or the DDI 230 ) or a part of the touch circuit 250 . For example, when the sensor module 176 embedded in the display module 160 includes a biometric sensor (eg, a fingerprint sensor), the biometric sensor provides biometric information related to a touch input through a partial area of the display 210 . (eg fingerprint image) can be acquired. For another example, when the sensor module 176 embedded in the display module 160 includes a pressure sensor, the pressure sensor may acquire pressure information related to a touch input through a part or the entire area of the display 210 . can According to an embodiment, the touch sensor 251 or the sensor module 176 may be disposed between pixels of the pixel layer of the display 210 , or above or below the pixel layer.

3 is a diagram illustrating a flat state of the electronic device 101 according to an exemplary embodiment. The electronic device 101 according to an embodiment may be a foldable electronic device 101 capable of changing the electronic device 101 and the display 210 into a folded state and an unfolded state.

In an embodiment, the electronic device 101 is disposed in a space formed by a housing 300 , a hinge cover 330 covering a folded portion of the housing 300 , and the housing 300 . A display 210 may be included. In this document, a surface on which the display 210 is disposed is defined as a first surface or a front side of the electronic device 101 . In addition, in this document, the opposite surface of the front surface is defined as the second surface or the rear surface of the electronic device 101 . In addition, a surface surrounding the space between the front surface and the rear surface is defined as a third surface or a side surface of the electronic device 101 .

In one embodiment, the housing 300 may include a first front housing 310 , a second front housing 320 , a first rear cover 380 , and a second rear cover 390 . The housing 300 may not be limited to the shape and combination shown in FIGS. 3 and 4 . The housing 300 may be implemented by a combination and/or combination of different shapes or parts. For example, in another embodiment, the first front housing 310 and the first rear cover 380 may be integrally formed. Also, in another embodiment, the second front housing 320 and the second rear cover 390 may be integrally formed.

In an embodiment, the first front housing 310 and the second front housing 320 may be disposed on both sides about a folding axis (axis A), which is a boundary line on which the electronic device 101 and the display 210 are folded. there is. The first front housing 310 and the second front housing 320 may have an overall symmetrical shape with respect to the folding axis (A-axis). The first front housing 310 and the second front housing 320 have different angles or distances depending on whether the electronic device 101 and the display 210 are in an unfolded state, a folded state, or an intermediate state. may vary.

In an embodiment, the first front housing 310 and the second front housing 320 may together form a recess for accommodating the display 210 . At least a portion of the first front housing 310 and the second front housing 320 may be formed of a metallic material or a non-metallic material having a rigidity greater than or equal to a threshold value specified to support the display 210 .

In an embodiment, the display 210 may be disposed on a space formed by the housing 300 . For example, the display 210 may be seated on a recess formed by the housing 300 . The display 210 may constitute most of the front surface of the electronic device 101 .

In an embodiment, at least a portion of the display 210 may be deformed into a flat surface or a curved surface. The display 210 includes a folding area 213 that is an area to be folded or unfolded, and a second display 210 disposed on one side (eg, the left side of the folding area 213 shown in FIG. 3 ) with respect to the folding area 213 . It may include a first area 211 and a second area 212 disposed on the other side of the folding area 213 (the right side of the folding area 213 shown in FIG. 3 ). The division of regions of the display 210 illustrated in FIG. 3 is exemplary, and the display 210 may be divided into a plurality of regions according to a structure or function. For example, as in the display 210 shown in FIG. 3 , the area of the display 210 may be divided by a folding area 213 elongated in the vertical direction of the display 210 or a folding axis (axis A). . As another example, a region of the display 210 may be divided based on a folding region elongated in the horizontal direction of the display 210 or another folding axis. The first area 211 and the second area 212 may have an overall symmetrical shape with respect to the folding area 213 . However, when the sensor region 524 is included in the display 210 , the first region 211 and the second region 212 may have an asymmetrical shape.

In one embodiment, the display 210 may further include a sensor area 214 . The sensor area 214 may be formed to occupy a predetermined area within the second area 212 of the display 210 . However, the present invention is not limited thereto, and the sensor area 214 may be formed in the first area 211 or divided into the first area 211 and the second area 212 .

In one embodiment, the sensor area 214 may be adjacent to one edge of the first front housing 310 and/or the second front housing 320 . For example, the sensor area 214 may be adjacent a top corner of the second front housing 320 . The arrangement, shape, and size of the sensor region 214 are not limited to the illustrated examples. For example, the sensor region 214 may be formed at the bottom corner of the second front housing 320 or any region between the top and bottom corners. The sensor area 214 may be disposed at a lower end of the first area 211 and/or the second area 212 of the display 210 . In the display 210 of FIG. 3 , the entire portion except for the front camera and the sensor hole is implemented as a display area, so that the sensor area 214 including the front camera is the first area 211 and/or the display 210 . It may be an Infinity-O Display implemented integrally with the second area 212 .

In an embodiment, the pixel structure of the first region 211 and/or the second region 212 disposed on the upper end of the sensor region 214 may include the remaining first region 211 and/or the second region. It may be different from the pixel structure of 212 . For example, the first region 211 and/or the second region 212 disposed on top of the sensor region 214 has a lower pixel density than the remaining first region 211 and/or the second region 212 . can have As another example, the pixels disposed in the first area 211 and/or the second area 212 disposed on the top of the sensor area 214 may be disposed in the remaining first area 211 and/or the second area 212 . It may have a smaller size than the arranged pixels. As another example, the shape and/or shape of the pixel disposed in the first area 211 and/or the second area 212 disposed on the upper end of the sensor area 214 may be different from that of the remaining first area 211 and/or the second area 212 . The width may be narrower or longer than that of the pixels disposed in the second region 212 .

In an embodiment, components for performing various functions embedded in the electronic device 101 are electronically provided through the sensor area 214 or through one or more openings provided in the sensor area 214 . A front surface of the device 101 may be visually exposed. In various embodiments, the components may include various types of sensors (eg, the sensor module 176 of FIG. 1 ). The sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

In an embodiment, the first rear cover 380 may be disposed on the rear surface of the electronic device 101 . The first rear cover 380 may be disposed on one side about the folding axis (axis A). The first back cover 380 may have a substantially rectangular periphery. An edge of the first rear cover 380 may be surrounded by the first front housing 310 .

In an embodiment, the second rear cover 390 may be disposed on the rear surface of the electronic device 101 . The second rear cover 390 may be disposed on the opposite side of the first rear cover 380 with respect to the folding axis (A axis). The second back cover 390 may have a substantially rectangular edge. An edge of the second rear cover 390 may be surrounded by the second front housing 320 .

In an embodiment, the first rear cover 380 and the second rear cover 390 may have a substantially symmetrical shape with respect to the folding axis (A-axis). However, the first back cover 380 and the second back cover 390 do not necessarily have symmetrical shapes, and in another embodiment, the electronic device 101 includes the first back cover 380 and the A second rear cover 390 may be included. In another embodiment, the first rear cover 380 may be integrally formed with the first front housing 310 , and the second rear cover 390 may be integrally formed with the second front housing 320 . there is.

In an embodiment, the front surface of the electronic device 101 may include the display 210 and a partial area of the first front housing 310 adjacent to the display 210 and a partial area of the second front housing 320 . . A rear surface of the electronic device 101 has a first rear cover 380 , a partial region of the first front housing structure 310 adjacent to the first rear cover 380 , a second rear cover 390 , and a second rear cover and a portion of the second front housing 320 adjacent to 390 .

In an embodiment, the first front housing 310 , the second front housing 320 , the first rear cover 380 , and the second rear cover 390 may include various components of the electronic device 101 (eg: A space in which a printed circuit board (PCB) or battery) can be disposed may be formed.

In an embodiment, one or more components may be disposed or visually exposed on the rear surface of the electronic device 101 . For example, at least a portion of the sub-display 382 may be visually exposed through the first rear cover 380 . As another example, at least a portion of the rear sensor module 392 (eg, the sensor module 176 of FIG. 1 ) may be visually exposed through the second rear cover 390 . The rear sensor module 392 may include a proximity sensor and/or a rear camera.

In an embodiment, when the electronic device 101 is in an unfolded state, the first front housing 310 and the second front housing 320 may form an angle of about 180 degrees and may be disposed to face the same direction. When the display 210 is in the unfolded state, the surface of the first area 211 and the surface of the second area 212 of the display 210 may form an angle of about 180 degrees with each other. When the display 210 is in the unfolded state, the first area 211 and the second area 212 of the display 210 may face the same direction (eg, the front direction of the electronic device 101 ). ) in the unfolded state, the folding area 213 may form the same plane as the first area 211 and the second area 212 .

4 is a diagram illustrating a folded state of the electronic device 101 according to an exemplary embodiment.

In an embodiment, the hinge cover 330 may be disposed between the first front housing 310 and the second front housing 320 . The hinge cover 330 may cover between the first front housing 310 and the second front housing 320 . The hinge cover 330 may cover a hinge structure between the first front housing 310 and the second front housing 320 . The hinge cover 330 may be covered by a portion of the first front housing 310 and the second front housing 320 when the electronic device 101 is in an unfolded state. The hinge cover 330 may be exposed to the outside when the electronic device 101 is in a folded state. The hinge cover 530 may include a curved surface.

In an embodiment, when the electronic device 101 is in a folded state, the first front housing 310 and the second front housing 320 may be disposed to face each other. When the display 210 is in the folded state, the surface of the first area 211 and the surface of the second area 212 of the display 210 may form a narrow angle (eg, between 0 degrees and about 10 degrees) with each other. can When the display 210 is in the folded state, the first area 211 and the second area 212 of the display 210 may face each other. When the display 210 is in the folded state, at least a portion of the folding area 213 may change to a curved surface having a first curvature.

In an embodiment, when the electronic device 101 is in an intermediate state between the unfolded state and the folded state, the first front housing 310 and the second front housing 320 have an angle greater than or equal to 0 degrees and less than or equal to 180 degrees. It can be placed while forming When the display 210 is in an intermediate state, the surface of the first region 211 and the surface of the second region 212 of the display 210 may form an angle greater than that of the folded state and smaller than that of the unfolded state. When the display 210 is in an intermediate state, at least a portion of the folding area 213 may change to a curved surface having a second curvature. The second curvature may be smaller than the first curvature.

5 is an exploded perspective view of the electronic device 101 according to an exemplary embodiment. The electronic device 101 according to an embodiment includes a display 210 , a bracket assembly 400 , a substrate 500 , a first front housing 310 , a second front housing 320 , and a first It may include a rear cover 380 and a second rear cover 390 .

In an embodiment, the display 210 may include a first area 211 , a second area 212 , a folding area 213 , a sensing area 214 , and a layer structure 215 . there is.

In one embodiment, the layer structure 215 may seat the display 210 in a recess in the housing 330 . The layer structure 215 may consist of one or more plates. The layer structure 215 may be disposed on the bracket assembly 400 .

In an embodiment, the bracket assembly 400 may be disposed between the layer structure 215 and the substrate unit 500 . The bracket assembly 400 includes a first bracket 410 , a second bracket 420 , a hinge cover 330 disposed between the first bracket 410 and the second bracket 420 , and a first bracket 410 . and a wiring member 430 crossing the second bracket 420 and the second bracket 420 .

In an embodiment, the first bracket 410 may be disposed between the first region 211 of the display 210 and the first substrate 510 of the substrate unit 500 . The second bracket 420 may be disposed between the second region 212 of the display 210 and the second substrate 520 of the substrate unit 500 .

In an embodiment, the wiring member 430 may be disposed in a direction (eg, an x-axis direction) crossing the first bracket 410 and the second bracket 420 . The wiring member 430 may be disposed in a direction (eg, the x-axis direction) perpendicular to the folding axis (eg, the y-axis or the folding axis (A-axis) of FIG. 3 ) of the folding area 213 of the electronic device 101 . can The wiring member 430 may be a flexible printed circuit board (FPCB).

In an embodiment, the substrate unit 500 may include a first substrate 510 disposed on the side of the first bracket 410 and a second substrate 520 disposed on the side of the second bracket 420 . The first substrate 510 and the second substrate 520 include the bracket assembly 400 , the first front housing 310 , the second front housing 320 , the first rear cover 380 , and the second rear cover ( 390) may be disposed inside the space formed by. Components for implementing various functions of the electronic device 101 may be disposed on the first substrate 510 and the second substrate 520 .

In one embodiment, the first front housing 310 and the second front housing 320 are to be assembled to each other so as to be coupled to both sides of the bracket assembly 400 while the display 210 is coupled to the bracket assembly 400 . can The first front housing 310 and the second front housing 320 may be coupled to the bracket assembly 400 by sliding from both sides of the bracket assembly 400 .

In an embodiment, the first front housing 310 may include a first rotational support surface 312 . The second front housing 320 may include a second rotation support surface 322 corresponding to the first rotation support surface 312 . The first rotation support surface 312 and the second rotation support surface 322 may include curved surfaces corresponding to the curved surfaces included in the hinge cover 330 .

In an embodiment, the first rotation support surface 312 and the second rotation support surface 322 are hinged covers 330 when the electronic device 101 is in an unfolded state (eg, the electronic device 101 of FIG. 3 ). can cover Accordingly, when the electronic device 101 is in an unfolded state, the hinge cover 330 may not be exposed to the rear surface of the electronic device 101 or may be exposed to a minimum.

In an embodiment, the first rotation support surface 312 and the second rotation support surface 322 are hinged covers 330 when the electronic device 101 is in a folded state (eg, the electronic device 101 of FIG. 4 ). It can be rotated along a curved surface included in Accordingly, when the electronic device 101 is in a folded state, the hinge cover 530 may be maximally exposed to the rear surface of the electronic device 101 .

6 is a side view 600 of a display (eg, the display 210 of FIGS. 2 to 5 ) of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an embodiment. . The display 210 of the electronic device 101 according to an embodiment includes a metal layer 610 , a lower panel protective layer 620 , a display panel 630 , an adhesive layer 640 , a glass 650 , and a protective layer 660 . , a first printed layer 601 , and a second printed layer 602 .

In an embodiment, the metal layer 610 may form a rearmost layer based on a first direction (+Z-axis direction) that is a direction toward the front of the display 210 . When the first direction (+Z-axis direction) faces upward, the metal layer 610 may be disposed at the lowermost end of the display 210 . The metal layer 610 may be disposed in the second direction (-Z-axis direction) of the lower protective layer 620 of the panel. A lower surface of the metal layer 610 may be seen in a second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction). The second direction (-Z-axis direction) may be a direction toward the rear surface of the display 210 . The metal layer 610 may contact the bracket assembly (eg, the bracket assembly 400 of FIG. 5 ) disposed in the second direction (-Z-axis direction) of the display 210 . The metal layer 610 may be electrically connected to the substrate unit (eg, the substrate unit 500 of FIG. 5 ). The metal layer 610 may have a lattice structure. The metal layer 610 may apply a driving voltage for driving pixels included in the display 210 . The thickness of the metal layer 610 may be greater than the thickness of the display panel 630 . The thickness of the metal layer 610 may be about 150 μm or more and about 200 μm or less. As another example, the metal layer 610 may be electrically connected to a ground layer (not shown) of the substrate unit (eg, the substrate unit 500 of FIG. 5 ).

In an embodiment, the lower protective layer 620 of the panel may be disposed in the first direction (+Z-axis direction) of the metal layer 610 . When the first direction (+Z-axis direction) is directed upward, the lower protective layer 620 may be disposed on the metal layer 610 . The lower panel protective layer 620 may be disposed in the second direction (-Z-axis direction) of the display panel 630 . The lower panel protective layer 620 may be disposed between the metal layer 610 and the display panel 630 . The edge of the lower protective layer 620 may be formed to be spaced apart from the edge of the metal layer 610 in a third direction (-X-axis direction) perpendicular to the first direction (+Z-axis direction). The third direction (-X-axis direction) may be a direction toward an active area displaying a screen on the display 210 . The lower panel protective layer 620 may connect the metal layer 610 and the display panel 630 . The lower protective layer 620 of the panel may be collectively referred to as a C-panel. The thickness of the lower protective layer 620 may be greater than or equal to about 60 µm and less than or equal to about 100 µm.

In an embodiment, the lower protective layer 620 of the panel may include an emboss layer, a cushion layer, a polyethylene terephthalate (PET) layer, and/or a composite sheet. The PET layer may be a colored layer such as a black layer.

In an embodiment, the display panel 630 may be disposed in the first direction (+Z-axis direction) of the lower panel protective layer 620 . When the first direction (+Z-axis direction) is directed upward, the display panel 630 may be disposed on the lower protective layer 620 of the panel. The edge of the display panel 630 may be formed to be spaced apart from the edge of the lower protective layer 620 in the +X-axis direction, which is a direction opposite to the third direction (-X-axis direction). The edge of the display panel 630 may be formed to correspond to the edge of the metal layer 610 . A thickness of the display panel 630 in the first direction (+Z-axis direction) may be greater than a thickness of the lower panel protective layer 620 in the first direction (+Z-axis direction). The thickness of the display panel 630 may be about 800 μm or more and about 120 μm or less. The display panel 630 may include an active area displaying a screen in the first direction (+Z-axis direction) and a non-display area surrounding the active area. The display panel 630 may include one or more layers for displaying a screen.

In an embodiment, one or more layers included in the display panel 630 may be manufactured in a 1:1 cutting method. Edges of one or more layers included in the display panel 630 may be cut at a time. Accordingly, edges of one or more layers included in the display panel 630 may be formed to correspond to each other.

In an embodiment, the display panel 630 may include a film layer 631 , an emission layer 632 , a panel adhesive layer 633 , and a polarization layer 634 .

In an embodiment, the film layer 631 may constitute a lower portion of the display panel 630 . The film layer 631 may allow the display panel 630 to be flexibly folded. The film layer 631 may be made of polyimide and/or polyethylene terephthalate (PET).

In an embodiment, the emission layer 632 may be disposed in the first direction (+Z-axis direction) of the film layer 631 . The light emitting layer 632 may display a screen by emitting light according to a driving voltage.

In an embodiment, the panel adhesive layer 633 may be disposed in the first direction (+Z-axis direction) of the light emitting layer 632 . The panel adhesive layer 633 may couple the polarization layer 634 on the light emitting layer 632 . The panel adhesive layer 633 may be formed of a pressure-sensitive adhesive.

In an embodiment, the polarization layer 634 may be disposed in the first direction (+Z-axis direction) of the panel adhesive layer 633 . The polarization layer 634 may block at least a portion of light incident from the outside from being reflected by the display panel 630 . The polarization layer 634 may increase visibility of a screen displayed by the emission layer 632 .

In an embodiment, the polarization layer 634 may be included in the emission layer 632 . When the emission layer 632 includes the role of the polarization layer 634 , the polarization layer 634 and the panel adhesive layer 633 may be omitted. However, when the black adhesive layer 635 of FIG. 8 is included, the polarization layer 634 and the panel adhesive layer 633 may be required.

In an embodiment, the adhesive layer 640 may be disposed in the first direction (+Z-axis direction) of the display panel 630 . When the first direction (+Z-axis direction) faces upward, the adhesive layer 640 may be disposed on the display panel 630 . The adhesive layer 640 may be disposed between the display panel 630 and the glass 650 . The edge of the adhesive layer 640 may be formed to be spaced apart from the edge of the display panel 630 in a third direction (-X-axis direction). A thickness of the adhesive layer 640 in the first direction (+Z-axis direction) may be thinner than a thickness of the display panel 630 in the first direction (+Z-axis direction). The thickness of the adhesive layer 640 may be about 40 μm or more and about 60 μm or less. The adhesive layer 640 may attach the glass 650 to the upper surface of the display panel 630 . The adhesive layer 640 may be a pressure sensitive adhesive (PSA). For example, the adhesive layer 640 may include an optically clear adhesive (OCA).

In an embodiment, the glass 650 may be disposed in the first direction (+Z-axis direction) of the adhesive layer 640 . When the first direction (+Z-axis direction) is directed upward, the glass 650 may be disposed on the adhesive layer 640 . The edge of the glass 650 may be formed to be spaced apart from the edge of the display panel 630 in the third direction (-X-axis direction). The edge of the glass 650 may be spaced apart from the edge of the adhesive layer 640 in a direction opposite to the third direction (-X-axis direction) (+X-axis direction). The thickness of the glass 650 in the first direction (+Z-axis direction) may be thinner than the thickness of the adhesive layer 640 in the first direction (+Z-axis direction). The thickness of the glass 650 may be about 25 μm or more and about 40 μm or less. The glass 650 may improve visibility and/or aesthetics of a screen displayed on the display panel 630 when viewed from the first direction (+Z-axis direction). The glass 650 may improve tactile sensation when the user performs a touch input on the display panel 630 in the first direction (+Z-axis direction). The glass 650 may be ultra-thin glass (UTG). The glass 650 may have a first strength.

In an embodiment, the protective layer 660 may be disposed in the first direction (+Z-axis direction) of the glass 650 . When the first direction (+Z-axis direction) is directed upward, the protective layer 660 may be disposed on the glass 650 . An edge of the protective layer 660 may be formed to correspond to an edge of the display panel 630 . The edge of the protective layer 660 may be formed to be spaced apart from the edge of the glass 650 in a direction opposite to the third direction (-X-axis direction) (+X-axis direction). A thickness of the protective layer 660 in the first direction (+Z-axis direction) may be greater than a thickness of the glass 650 in the first direction (+Z-axis direction). The protective layer 660 may have a thickness of about 40 μm or more and about 80 μm or less. The protective layer 660 may protect the glass 650 from an impact from the first direction (+Z-axis direction). The protective layer 660 may have a second strength. The second intensity may be lower than the first intensity. The protective layer 660 may be formed of a flexible non-metal material, plastic, and/or a polymer material. For example, the protective layer 660 may include polyimide.

In an embodiment, the thickness of the glass 650 in the first direction (+Z-axis direction) may be set to fold or unfold the display 210 a plurality of times. As the thickness of the glass 650 in the first direction (+Z-axis direction) decreases, cracks or chipping may occur at the edge of the glass 650 . Whether cracks or chipping occurs at the edge of the glass 650 in the first direction (+Z-axis direction) that is the front surface of the display 210 may be checked.

In an embodiment, the first printed layer 601 may be disposed in a first direction (+Z-axis direction) of the glass 650 . When the first direction (+Z-axis direction) is directed upward, the first printed layer 601 may be disposed on the glass 650 . The first printed layer 601 may be disposed between the glass 650 and the protective layer 660 . The first printed layer 601 may be printed on the lower portion of the protective layer 660 . Alternatively, the first printed layer 601 may be printed on the glass 650 at the top. The first printed layer 601 may be made of a material that blocks light. The first printing layer 601 may be formed by applying a black material or a colored material that blocks light to the lower portion of the protective layer 660 or the upper portion of the glass 650 in an ink-jet method. The first printed layer 601 may be formed by curing a light-blocking material on the lower portion of the protective layer 660 or on the upper portion of the glass 650 in an ultraviolet (UV) curing method.

In an embodiment, the first printed layer 601 may reduce a phenomenon in which at least a portion of the non-display area of the display panel 630 is viewed in the first direction (+Z-axis direction). For example, the first printed layer 601 may reduce a phenomenon in which a color is visible in a lower portion of an area adjacent to the active area among the non-display areas of the display panel 630 . For example, the first printed layer 601 may include a black matrix.

In an embodiment, the first printed layer 601 may be disposed to be spaced apart from the edge of the glass 650 in a third direction (-X-axis direction). The third direction (-X-axis direction) may be a direction toward the active area of the display panel 630 . The first printed layer 601 may be disposed to be spaced apart from the edge of the glass 650 by a first distance D1 in the third direction (-X-axis direction).

In an embodiment, the first distance D1 may be set to check whether cracks or chipping occurs at the edge of the glass 650 in the first direction (+Z-axis direction). The first distance D1 may be set to secure an inspection area in which cracks or chipping occurring at the edge of the glass 650 can be inspected using an inspection device disposed in the first direction (+Z-axis direction). . For example, the first distance D1 may be within 2 mm.

In an embodiment, the first distance D1 may be set to be longer than the distance at which the edge of the adhesive layer 640 is spaced apart from the edge of the display panel 630 in the third direction (-X-axis direction). The first printed layer 601 may be disposed to be spaced apart from the adhesive layer 640 in the third direction (-X-axis direction). When the first printed layer 601 is disposed to be spaced apart from the adhesive layer 640 in the third direction (-X-axis direction), the edge of the adhesive layer 640 may be inspected in the first direction (+Z-axis direction). Accordingly, it may be inspected whether defects such as bubbles are generated at the edge of the adhesive layer 640 .

In an embodiment, the second printed layer 602 may be disposed in the second direction (-Z-axis direction) of the glass 650 . When the first direction (+Z-axis direction) is directed upward, the second printed layer 602 may be disposed under the glass 650 .

In an embodiment, the second printed layer 602 may be disposed on the display panel 630 . The second printed layer 602 may be disposed between the display panel 630 and the adhesive layer 640 . The second printed layer 602 may be made of a material that blocks light.

In an embodiment, one end of the second printed layer 602 may be disposed to correspond to an edge of the display panel 630 . The second printed layer 602 may be disposed in a non-display area of the display panel 630 , except for an area in which the first printed layer 601 is disposed. The second printed layer 602 may reduce the phenomenon in which the non-display area of the display panel 630 except for the area in which the first printed layer 601 is disposed is visible in the first direction (+Z-axis direction). there is. For example, in the second printed layer 602 , in the outermost area of the non-display area of the display panel 630 , an area without wiring is colored in a color different from that of the first printed layer 601 (eg, yellow). It is possible to reduce the visible phenomenon.

In an embodiment, when viewed in the first direction (+Z-axis direction), the first printed layer 601 and the second printed layer 602 may at least partially overlap. Accordingly, a phenomenon in which the non-display area of the display panel 630 is visually recognized may be further reduced. When viewed in the first direction (+Z-axis direction), the first printed layer 601 and the second printed layer 602 may overlap by a second distance D2. The second distance D2 may be set in consideration of the internal structure of the non-display area of the display panel 630 of the first printed layer 601 and the second printed layer 602 and/or the degree of visible light leakage. can The second distance D2 may be set in consideration of an arrangement design error of the first printed layer 601 and the second printed layer 602 .

7 is a side view 700 of a display (eg, the display 210 of FIGS. 2 to 5 ) of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an embodiment. . The metal layer 610 , the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , the protective layer 660 , and the first printed layer 601 of the display 210 of FIG. 7 . ) is the metal layer 610, the lower panel protective layer 620, the display panel 630, the adhesive layer 640, the glass 650, the protective layer 660, and the first printed layer of the display 210 of FIG. (601).

In an embodiment, the second printed layer 602 may be disposed in the second direction (-Z-axis direction) of the display panel 630 . When the first direction (+Z-axis direction) is directed upward, the second printed layer 602 may be disposed under the display panel 630 . The second printed layer 602 may be disposed between the display panel 630 and the lower protective layer 620 of the panel.

8 is a side view 800 of a display (eg, the display 210 of FIGS. 2 to 5 ) of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an embodiment. . The metal layer 610, the lower panel protective layer 620, the adhesive layer 640, the glass 650, the protective layer 660, and the first printed layer 601 of the display 210 of FIG. The metal layer 610 of 210 , the lower panel protective layer 620 , the adhesive layer 640 , the glass 650 , the protective layer 660 , and the first printed layer 601 may be substantially the same.

In an embodiment, the panel adhesive layer 633 may include a black adhesive layer 635 . Edges of the black adhesive layer 635 may be disposed to correspond to edges of the film layer 631 , the emission layer 632 , and the polarization layer 634 . The black adhesive layer 635 may include a light-blocking material. The black adhesive layer 635 may couple the emission layer 632 and the polarization layer 634 to each other.

In an embodiment, the black adhesive layer 635 may be disposed in a non-display area of the display panel 630 , excluding the area in which the first printed layer 601 is disposed. The black adhesive layer 635 may reduce a phenomenon in which an area of the non-display area of the display panel 630 except for the area in which the first printed layer 601 is disposed is visible in the first direction (+Z-axis direction). For example, in the black adhesive layer 635 , in the outermost non-display area of the display panel 630 , an area without wiring is visually recognized as a color different from that of the first printed layer 601 (eg, yellow). phenomenon can be reduced. The black adhesive layer 635 may perform substantially the same function as the second printed layer 602 of FIG. 6 . Accordingly, the second printed layer 602 may be replaced with the black adhesive layer 635 disposed inside the display panel 630 . When the second printed layer 602 is replaced with the black adhesive layer 635 disposed inside the display panel 630 , the process of separately printing the second printed layer 602 may be omitted.

In an embodiment, when viewed in the first direction (+Z-axis direction), the first printed layer 601 and the black adhesive layer 635 may at least partially overlap. Accordingly, a phenomenon in which the non-display area of the display panel 630 is visually recognized may be further reduced. When viewed in the first direction (+Z-axis direction), the first printed layer 601 and the black adhesive layer 635 may overlap by a second distance D2 . The second distance D2 may be set in consideration of a design error of the first printed layer 601 and the black adhesive layer 635 and/or a degree of visibility of the non-display area of the display panel 630 .

9 is a side view 900 of a display (eg, the display 210 of FIGS. 2 to 5 ) of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an embodiment. . The metal layer 610 , the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , the protective layer 660 , and the first printed layer 601 of the display 210 of FIG. 9 . ) is the metal layer 610, the lower panel protective layer 620, the display panel 630, the adhesive layer 640, the glass 650, the protective layer 660, and the first printed layer of the display 210 of FIG. (601).

In an embodiment, the second printed layer 602 may be disposed between the metal layer 610 and the lower protective layer 620 of the panel. The second printed layer 602 may be disposed in a first direction (+Z-axis direction) of the metal layer 610 . One end of the second printed layer 602 may be disposed to correspond to an edge of the metal layer 610 .

10 is a side view 1000 of a display (eg, the display 210 of FIGS. 2 to 5 ) of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an embodiment. . The metal layer 610 , the display panel 630 , the adhesive layer 640 , the glass 650 , the protective layer 660 , and the first printed layer 601 of the display 210 of FIG. 10 is the display 210 of FIG. 6 . ) may be substantially the same as the metal layer 610 , the display panel 630 , the adhesive layer 640 , the glass 650 , the protective layer 660 , and the first printed layer 601 .

In an embodiment, the black panel lower protective layer 1010 may be disposed in the first direction (+Z-axis direction) of the metal layer 610 . The black panel lower protective layer 1010 may be disposed in the second direction (-Z-axis direction) of the display panel 630 . The black panel lower protective layer 1010 may be disposed between the metal layer 610 and the display panel 630 . The black panel lower protective layer 1010 may include a material that blocks light. The black panel lower protective layer 1010 may perform substantially the same function as the second printed layer 602 of FIG. 6 . Accordingly, the second printed layer 602 may be replaced with the black panel lower protective layer 1010 disposed under the display panel 630 . When the second printed layer 602 is replaced with the black panel lower protective layer 1010 disposed inside the display panel 630 , the process of separately printing the second printed layer 602 may be omitted.

In an embodiment, the edge of the black panel lower protective layer 1010 may be formed to correspond to the edge of the display panel 630 . The black panel lower protective layer 1010 and the display panel 630 may be manufactured in a 1:1 cutting method. Edges of the black panel lower protective layer 1010 and the display panel 630 may be cut at once. Accordingly, the black panel lower protective layer 1010 may be disposed such that the edge of the black panel lower protective layer 1010 and the edge of the display panel 630 correspond to each other.

11 is a front view 1100 of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an embodiment. 12 is a cross-sectional view taken along line B-B' 1200 of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an embodiment. The metal layer 610 , the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , and the protective layer 660 of FIG. 12 is the metal layer 610 of the display 210 of FIG. 6 . ), the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , and the protective layer 660 may be substantially the same.

In an embodiment, the display 210 of the electronic device 101 may include a first area 211 , a second area 212 , a folding area 213 , and a sensor area 214 . The display 210 may be surrounded by a first front housing (eg, the first front housing 310 of FIG. 3 ) and a second front housing (eg, the second front housing 320 of FIG. 3 ).

In one embodiment, a first printed layer (eg, first printed layer 601 of FIGS. 6-10 ) in an area of display 210 adjacent to first front housing 310 and second front housing 320 . and a second printed layer (eg, the second printed layer 602 of FIGS. 6, 7, and/or 9) may be disposed.

In an embodiment, the first edge 1110 and the second edge 1120 may be formed on the folding area 213 of the display 210 adjacent to the first front housing 310 and the second front housing 320 . can The first edge 1110 and the second edge 1120 may be repeatedly folded and unfolded. A possibility that cracks or chipping occurs at the first edge 1110 and the second edge 1120 may increase. It may be checked whether cracks or chipping have occurred in the first edge 1110 and the second edge 1120 .

In an embodiment, the first printed layer 601 and the second printed layer 602 may not be disposed on the first edge 1110 and the second edge 1120 . A first printed layer 601 is formed on an area of the edge of the display panel 630 except for the first edge 1110 and the second edge 1120 overlapping the folding area 213 in which the display panel 630 is folded or unfolded. and a second printed layer 602 may be disposed. Cracks at the first edge 1110 and the second edge 1120 when the first printed layer 601 and the second printed layer 602 are not disposed on the first edge 1110 and the second edge 1120 , or It can be more easily checked whether chipping has occurred.

13 is a front view 1300 of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an embodiment.

In an embodiment, the display 210 of the electronic device 101 may include a sensor area 214 . The display 210 may be surrounded by the first front housing 310 and the second front housing 320 .

In an embodiment, an opening may be provided in the sensor area 214 . For example, a hole such as a front camera hole and/or a sensor hole may be provided in the sensor area 214 in the first direction (+Z-axis direction). The sensor region 214 may maintain a fixed state without being folded or unfolded. The possibility of cracking or chipping of the glass 650 may be reduced in the opening provided in the sensor region 214 .

14 is a cross-sectional view taken along line C-C' of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an exemplary embodiment. The metal layer 610, the lower panel protective layer 620, the display panel 630, the adhesive layer 640, the glass 650, the protective layer 660, and the first printed layer 601 of FIG. The metal layer 610 , the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , the protective layer 660 , and the first printed layer 601 of the display 210 and substantially can be the same as

In an embodiment, a second printed layer (eg, the second printed layer 602 of FIGS. 6 , 7 , and/or 9 ) may not be disposed in the sensor area 214 . The first printed layer 601 and the second printed layer 602 may be disposed on the edge of the display panel 630 except for the sensor area 214 . When the second printed layer 602 is not disposed in the sensor area 214 , a separate process for disposing the second printed layer 602 in the sensor area 214 may be omitted.

15 is a cross-sectional view taken along line B-B′ of an electronic device (eg, the electronic device 101 of FIGS. 1 and 3 to 5 ) according to an embodiment. The metal layer 610 , the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , and the protective layer 660 of FIG. 15 is the metal layer 610 of the display 210 of FIG. 6 . ), the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , and the protective layer 660 may be substantially the same.

In an embodiment, the shielding member 1510 may be disposed on the first edge (eg, the first edge 1110 of FIG. 11 ) and the second edge (eg, the second edge 1120 of FIG. 11 ). The shielding member 1510 may be disposed to integrally surround the edges of the metal layer 610 , the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , and the protective layer 660 . can The shielding member 1510 may be a deco. The shielding member 1510 may be made of a material that blocks light. The shielding member 1510 may reduce a phenomenon in which the inside of the first edge 1110 and the second edge 1120 is visually recognized.

16A is a front view 1600 of the electronic device 101 according to an exemplary embodiment. 16B is a front view 1650 of the electronic device 101 according to an exemplary embodiment. 17 is a front view of the first inspection area 1621 of the electronic device 101 according to an exemplary embodiment. 18 is a cross-sectional view 1800 taken along line D-D` of FIG. 17 . The metal layer 610 , the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , and the protective layer 660 of FIG. 18 is the metal layer 610 of the display 210 of FIG. 6 . ), the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , and the protective layer 660 may be substantially the same. The decoration 1510 of FIG. 18 may be substantially the same as the decoration 1510 of FIG. 15 .

In an embodiment, the printed layer 1610 may be disposed to surround the display 210 of the electronic device 101 . The printed layer may include a first printed layer 601 and a second printed layer 602 .

In an embodiment, the inspection area 1620 may be formed in an outer portion of the printed layer 1610 disposed outside the display 210 in contact with the folding area (eg, the folding area 213 of FIG. 11 ). . The examination area 1620 may include a first examination area 1621 and a second examination area 1622 .

In an embodiment, as shown in FIG. 16A , the print layer 1610 may not be printed on the inspection area 1620 . In the inspection area 1620 , the printed layer 1610 may be removed. The inspection region 1620 may be an inspection region of glass such as UTG (eg, the glass 650 of FIG. 6 ). Accordingly, it is possible to remove the printing of the folding (folding) portion where cracks are concentrated.

In an embodiment, as shown in FIG. 16B , the printed layer 1610 disposed in the inspection area 1620 may have a smaller width than the remaining printed layer 1610 . At least a portion of the printed layer 1610 disposed in the inspection area 1620 may be cut. For example, at least a portion of the printed layer 1610 may be cut so that the printed layer 1610 disposed in the inspection area 1620 does not overlap with the devices disposed at the upper center and lower center of the display 210 . At least a portion of the printing layer 1610 may be cut to offset printing only in the area of the folding portion. Accordingly, it is possible to implement a structure capable of inspecting the glass 650 such as the UTG of the edge portion.

In an embodiment, the print layer 1610 may be disposed outside the display 210 so that characteristics printed for each area are different. The inspection area 1620 may be an area on which a printed layer is printed so as to have an offset in the folding part (eg, the folding area 213 ) where cracks are concentrated. The inspection area 1620 may be an area in which the glass 650 such as UTG is inspected.

In an embodiment, the inspection area 1620 may be an area including a folding part. The inspection area 1620 may be disposed to be close to an active area (AA) by comparing an offset on the print layer 1610 with an area to which the offset is not applied. The inspection area 1620 may have a cut-off portion 1710 from which the printed layer 1610 is removed.

In an embodiment, carbon fiber reinforced plastic (CFRP) may be visually recognized from the first edge 1810 of the display panel 630 .

19A is a front view 1900 of an instrument portion of the electronic device 101 according to an exemplary embodiment. 19B is a cross-sectional view 1950 taken along line E-E′ of FIG. 19A .

In an embodiment, the upper central region and the lower central region of the electronic device 101 may include an instrument portion. The instrument part may be an area in which the instruments of the electronic device 101 are disposed in the upper center and lower center of the electronic device. For example, the instrument part may be an area in which a receiver and a microphone of the electronic device 101 are disposed.

In one embodiment, the instrument portion may include a capacitor region 1910 and a cover member 1920 . The capacitor region 1910 may include a projected capacitive (P-CAP) device. The cover member 1920 may include a dust cover that blocks foreign substances such as dust.

In one embodiment, the instrument portion may include an examination area (eg, examination area 1620 of FIG. 16 ). A cross-section D-D′ of the instrument portion including the inspection region 1620 may be substantially the same as the cross-section illustrated in FIG. 18 .

In one embodiment, the instrument portion may include a grid pattern area 1960 . As shown in the cross section E-E′ of FIG. 19B , the grid pattern area 1960 may include a plurality of grid patterns 1961 . The plurality of grid patterns 1961 included in the grid pattern area 1960 may be patterns formed of the first printed layer 601 .

In one embodiment, the instrument portion may include a region where the first printed layer 601 is offset. Grid patterns 2011 may be disposed on the instrument part along an area in which the folding axis extends. The grid pattern region 1960 of the instrument part may be formed at a position corresponding to the capacitor region 1910 and the cover member 1920 .

In an embodiment, the offset width 1970 at which the first printed layer 601 is offset in the mechanism portion may be greater than the width of the grid pattern region 1960 . In the instrument portion, the first printed layer 601 may be removed wider than the grid pattern area 1960 . Accordingly, in the mechanism part, the first printed layer 601 may not overlap the grid pattern area 1960 .

In an embodiment, the second printed layer (eg, the second printed layer 602 of FIG. 18 ) may be disposed on the display panel 630 , for example, the polarizing layer 634 . The second printed layer 602 may be visually recognized in a black state when viewed by a user in the +Z-axis direction. The second print layer 602 may be disposed in a non-active area (eg, the non-active area NA of FIG. 18 ) outside the active area (eg, the active area AA of FIG. 18 ). . The second printed layer 602 may not have a dividing point such as an offset of the folding part or other regions.

20A is a front view 2000 of a second printed layer (eg, the second printed layer 602 of FIG. 17 ) of the electronic device 101 according to an exemplary embodiment. FIG. 20B is a cross-sectional view 2050 taken along line F-F` of FIG. 20A.

In an embodiment, a plurality of pixels 2010 may be disposed in a portion of the electronic device 101 where the second printed layer 602 is disposed. The plurality of pixels 2010 may include a red sub-pixel 2011 , a green sub-pixel 2012 , and a blue sub-pixel 2013 .

In an embodiment, a first black matrix (BM) 2020 may be disposed in a portion where the plurality of pixels 2010 are disposed. The first black matrix 2020 may be disposed between the plurality of pixels 2010 . Each of the plurality of pixels 2010 may be arranged to be separated from each other by the first black matrix 2020 .

In an embodiment, the second black matrix 2030 may be disposed in a portion other than a portion in which the plurality of pixels 2010 are disposed. The second black matrix 2030 may block a portion except for a portion in which the plurality of pixels 2010 are disposed.

In an embodiment, the lowermost layer in the portion F-F′ of FIG. 20A may be the transistor layer 2051 . The transistor layer 2051 may be made of low-temperature polycrystalline silicon (LTPS).

In an embodiment, an anode 2053 and a Black Pixel Define Layer (Black PDL) 2055 may be disposed on the transistor layer 2051 . The anode 2053 may constitute a first electrode of a pixel (eg, the pixel 2010 of FIG. 20A ). The black pixel definition layer 2055 may separate each of the plurality of pixels 2010 .

In an embodiment, an organic emission layer 2060 may be disposed on the anode 2053 . The organic emission layer 2060 may include a first organic emission layer 2061 emitting light of a first color and a second organic emission layer 2062 emitting light of the first color.

In an embodiment, the cathode 2065 may cover the black pixel defining layer 2055 and the organic emission layer 2060 . The cathode 2065 may constitute the second electrode of the pixel 2010 .

In an embodiment, the thin film encapsulation layer 2070 may cover the cathode 2065 . The thin film encapsulation layer 2070 may block foreign substances from penetrating into the pixel 2010 .

In an embodiment, the color filter layer 2080 may be formed on the thin film encapsulation layer 2070 . The color filter layer 2080 transmits the light of the first color and blocks the light of the first color except for the light of the first color filter 2081, the light of the second color and transmits the light except the light of the second color A second color filter 2082 and a black matrix 2083 for blocking may be included.

In an embodiment, an upper cover 2090 may be disposed on the color filter layer 2080 . The upper cover 2090 may be a transparent and flexible polyimide window (PI Window).

In an embodiment, the second printed layer 602 is a black matrix 2083 and a black pixel defining layer ( 2055) can be configured. The second printed layer 602 may have a Pol-less structure.

21 is a front view 2100 of the electronic device 101 according to an exemplary embodiment. 22 is a cross-sectional view 2200 taken along line G-G` of FIG. 21 . The metal layer 610 , the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , and the protective layer 660 of FIG. 20 is the metal layer 610 of the display 210 of FIG. 6 . ), the lower panel protective layer 620 , the display panel 630 , the adhesive layer 640 , the glass 650 , and the protective layer 660 may be substantially the same.

In one embodiment, the second printed layer 602 may be disposed along three edge portions of the display 210 . For example, the second printed layer 602 may be disposed along an upper edge portion, a lower edge portion, and a right edge portion of the display 210 .

In an embodiment, the first printed layer 601 and the second printed layer 602 may be disposed along one edge portion of the display 210 . For example, the first printed layer 601 and the second printed layer 602 may be disposed along the left edge portion of the display 210 . A width of the second printed layer 602 disposed along one edge portion of the display 210 may be thinner than a width of the second printed layer 602 disposed along three edge portions of the display 210 . A display driver IC (eg, the display driver IC 230 of FIG. 2 ) may be disposed on one edge portion of the display 210 .

In an embodiment, the second printed layer 602 under the glass 650 such as UTG may be disposed along three edge portions except for the edge portion on which the display driver IC 230 is disposed. The second printed layer 602 may be disposed at an edge portion where the display driver IC 230 is disposed to have a smaller width than the remaining edge portions. Accordingly, a physical size in which the display driver IC 230 can be arranged can be secured.

In an embodiment, the first printed layer 601 may be additionally disposed along one edge portion of the display 210 . When the first printed layer 601 is additionally disposed and the second printed layer 602 is disposed with a thin width on the edge portion where the display driver IC 230 is disposed, the display panel 630 is exposed and visually recognized to the outside phenomenon can be prevented. Since only the folding part inspects the cracks of the glass 650 , the printed layer may be disposed to the end where the polyimide (PL) of the display panel 630 is disposed in the folding part.

In an embodiment, when the size of an area in which the display driver IC 230 can be disposed is small, the second printed layer 602 may be disposed only on three edge portions of the display 210 . The first printed layer 601 may be disposed on an edge portion on which the display driver IC 230 is disposed. The first printed layer 601 may be printed to overlap the glass 650 at least partially.

In one embodiment, the second printed layer 602 may be disposed on the adhesive layer 640 to be disposed on the damping layer (damping layer) 2211 to absorb the impact. The damping layer 2211 may be made of a material capable of absorbing an impact, such as PET.

In an embodiment, an adhesive layer 2213 , a metal layer 2215 , and a cushion layer 2217 may be additionally disposed under the metal layer 610 . A sensor hole 2219 may be formed to penetrate the lower panel protective layer 620 , the metal layer 610 , the adhesive layer 2213 , the metal layer 2215 , and the cushion layer 2217 .

In an embodiment, a bending protection layer (BPL) 2220 may be disposed on one side of the display panel 630 . The bending part 2225 may be connected to the bending protection layer 2220 .

In an embodiment, the bending part 2225 is formed on the lower surface of the display panel 630 through the film layer 2231 , the first column spacer 2233 , the graphene layer 2235 , and the second column spacer 2237 . It can have a fixed state while maintaining a predetermined distance from the.

In an embodiment, one side of the bending unit 2225 may be connected to the FPCB 2240 . The FPCB 2240 may be connected to the lower portion of the display panel 630 through the conductive tape 2245 .

23 is a front view 2300 of the electronic device 101 according to an exemplary embodiment. 24 is a front view of the first instrument portion 2321 of the electronic device 101 according to an exemplary embodiment. 25 is a front view of the second instrument portion 2322 of the electronic device 101 according to an embodiment.

In an embodiment, the outer edge of the display 210 of the electronic device 101 may be surrounded by a single printed layer 2310 . The single printed layer 2310 may be disposed on an outer portion of the display 210 excluding the instrument portion 2320 . Instrument portion 2320 can include a first instrument portion 2321 and a second instrument portion 2322 . A multi printed layer (eg, the first printed layer 601 and the second printed layer 602 of FIG. 6 ) may be disposed on the first instrument portion 2321 and the second instrument portion 2322 .

In an embodiment, a difference in the print structure may occur for each region according to the mechanical structure of the upper end of the display 210 . For example, in the case of the first instrument part 2321 on which the cover member 1920 is disposed, even if the decor (eg, the decor 1510 of FIG. 15 ) and the printed layers 601 and 602 are designed to correspond one-to-one, the tension Accordingly, the amount of blocking light generated by the display 210 may be reduced. Accordingly, as shown in FIG. 24 , a problem in which the unprinted portion 2410 is visually recognized may occur. In the case of the second mechanism part 2322, when the printed layers 601 and 602 are designed to protrude compared to the deco 1510, the problem that the unprinted part is visually recognized as shown in FIG. 25 can be solved, but when folding There is an influence and there is a step difference in appearance, which can be disadvantageous in terms of design.

In an embodiment, only the area of the cover member 1920 may apply a multi-printing structure. The multi-printing structure may be implemented using the first printed layer 601 and the second printed layer 602 . The second printed layer 602 may be located in several layers as described in the detailed description of the present invention. For example, the second printed layer 602 may be disposed above the panel (eg, the display panel 630 of FIG. 6 ), inside the panel 630 , or below the panel 630 .

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store™) or on two user devices ( It can be distributed online (eg download or upload), directly between smartphones (eg smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

Claims (25)

In an electronic device,
a display panel having a folded state and an unfolded state;
a glass disposed in a first direction toward which the front surface of the display panel faces;
a protective layer disposed in the first direction of the glass;
a first printed layer disposed between the glass and the protective layer; and
and a second printed layer disposed in a second direction toward which the rear surface of the glass faces,
The first printed layer is disposed spaced apart from the edge of the glass in a third direction, which is a direction toward the active area of the display panel,
One end of the second printed layer is disposed to correspond to an edge of the display panel. The method according to claim 1,
When viewed from the first direction, the first printed layer and the second printed layer are at least partially overlapped. The method according to claim 1,
The second printed layer is disposed on the display panel. The method according to claim 1,
The electronic device further comprising an adhesive layer disposed between the display panel and the glass. 5. The method according to claim 4,
The second printed layer is disposed between the display panel and the adhesive layer. The method according to claim 1,
The electronic device further comprising a panel lower protective layer disposed in the second direction of the display panel. 7. The method of claim 6,
The second printed layer is disposed between the display panel and the lower protective layer of the panel. The method according to claim 1,
The second printed layer is a black adhesive layer disposed inside the display panel. 7. The method of claim 6,
Further comprising a metal layer disposed in the second direction of the lower protective layer of the panel,
The second printed layer is disposed between the metal layer and the lower protective layer of the panel. The method according to claim 1,
The second printed layer is a black printed layer disposed inside the display panel. 11. The method of claim 10,
The black panel lower protective layer is formed to correspond to an edge of the display panel. The method according to claim 1,
The electronic device in which the first printed layer and the second printed layer are disposed on an area of the display panel except for first and second edges overlapping a folding area in which the display panel is folded or unfolded. The method according to claim 1,
The first printed layer and the second printed layer are disposed on an area of the edge of the display panel except for a sensor area in which a sensor is provided,
The electronic device in which the first printed layer is disposed in the sensor area. 13. The method of claim 12,
The electronic device further comprising a shielding member disposed on the first edge and the second edge. In an electronic device,
a display panel having a folded state and an unfolded state;
a glass disposed in a first direction of the display panel;
a protective layer disposed in the first direction of the glass;
a first printed layer disposed between the glass and the protective layer; and
and a second printed layer disposed in a second direction toward which the rear surface of the glass faces,
The first printed layer is disposed to be spaced apart from the edge of the glass by a first distance in a third direction, which is a direction toward the active area of the display panel,
One end of the second printed layer is disposed to correspond to the edge of the display panel,
When viewed in the first direction, the first printed layer and the second printed layer overlap by a second distance. 16. The method of claim 15,
A thickness of the protective layer in the first direction is greater than a thickness of the glass in the first direction. 16. The method of claim 15,
The first distance is set to be capable of inspecting in the first direction whether a crack or chipping has occurred at the edge of the glass. 16. The method of claim 15,
The electronic device further comprising an adhesive layer disposed between the display panel and the glass. 19. The method of claim 18,
The first distance is set such that an edge of the adhesive layer is longer than a distance spaced apart from an edge of the display panel in the third direction. 16. The method of claim 15,
The second distance is set in consideration of the internal structure of the non-display area of the display panel and/or the degree of visible light leakage in the first direction. 16. The method of claim 15,
An inspection area is formed in an outer portion of the first printed layer or the second printed layer disposed outside the display panel in contact with a folding area in which the display panel is folded, and
The first printed layer or the second printed layer disposed in the inspection area has a width smaller than that of the first printed layer or the second printed layer disposed in the remaining portion. 17. The method of claim 16,
At least a portion of the first printed layer or the second printed layer disposed in the inspection area is cut off. 16. The method of claim 15,
Further comprising an instrument portion in an upper central region and a lower central region of the electronic device;
and the mechanism portion includes a grid pattern area including a plurality of grid patterns made of the first printed layer. 24. The method of claim 23,
An offset width at which the first printed layer is offset in the mechanism portion is greater than a width of the grid pattern region. 16. The method of claim 15,
The second printed layer is disposed along three edge portions of the display panel except for an edge portion on which a display driver IC for driving the display panel is disposed among the edge portions of the display panel.

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