KR20220020597A - Metal mesh structure, antenna device and touch sensor including the same - Google Patents

Abstract

A metal mesh structure according to one embodiment may comprise: first unit cells defined by a plurality of first conductive lines; and second unit cells defined by a plurality of second conductive lines having a line width wider than that of the first conductive line. Therefore, the present invention is capable of securing excellent visibility and transmittance.

Description

Metal mesh structure, and an antenna element and a touch sensor including the same {Metal mesh structure, antenna device and touch sensor including the same}

It relates to a metal mesh structure, an antenna element including the same, and a touch sensor.

A metal mesh is a fine mesh formed by using metal, and is spotlighted as a material that can replace Indium Tin Oxide (ITO) used as a transparent electrode material.

Since the metal mesh does not use rare earth, it is advantageous in terms of price compared to ITO, and has a fast response speed due to a low surface resistance value.

However, the metal mesh has disadvantages in that visibility is lowered due to the opaque mesh shape and is dark compared to ITO. In order to overcome this, it is key to reduce the area of the pattern forming the metal mesh to a minimum, but when the area of the pattern is reduced, resistance increases and the reaction rate decreases.

That is, although the reaction rate, transmittance, and visibility have a trade-off relationship with each other, attempts are being made to appropriately harmonize the reaction rate, transmittance, and visibility.

Korean Patent Publication No. 10-2016-0029311

An object of the present invention is to provide a metal mesh structure, an antenna element including the same, and a touch sensor.

1. first unit cells defined by a plurality of first conductive lines; and second unit cells defined by a plurality of second conductive lines having a line width wider than that of the first conductive line. Containing, a metal mesh structure.

2. The metal mesh structure according to the above 1, wherein the first unit cells are arranged in a first region, and the second unit cells are arranged in a second region.

3. The method of 1 above, wherein the third unit cells are defined by a plurality of third conductive lines having a line width wider than that of the second conductive line; further comprising: wherein the first unit cells are arranged in a first region, the second unit cells are arranged in a second region, and the third unit cells are arranged in a third region, wherein the first region, the The second region and the third region are sequentially arranged in a predetermined direction, a metal mesh structure.

4. The metal mesh structure according to 1 above, wherein the first unit cells and the second unit cells are randomly arranged.

5. The metal mesh structure according to the above 1, wherein at least one of the first unit cells and at least one of the second unit cells are randomly arranged to form an upper cell, and the upper cell is arranged in a predetermined pattern.

6. The metal mesh structure of 1 above, wherein the first conductive line and the second conductive line have a line width of 1.0 μm to 5.0 μm.

7. A radiation pattern comprising the metal mesh structure of any one of 1 to 6 above; Including, the antenna element.

8. The transmission line according to 7 above, wherein the transmission line has a metal mesh structure having a line width wider than that of the metal mesh structure of the radiation pattern or a solid structure; Further comprising, the antenna element.

9. Radiation pattern; and a dummy pattern disposed around the radiation pattern. Including, wherein at least one of the radiation pattern and the dummy pattern comprises the metal mesh structure of any one of claims 1 to 6, the antenna element.

10. A sensing electrode comprising the metal mesh structure of any one of 1 to 6 above; Including, a touch sensor.

11. sensing electrode; and a dummy pattern disposed around the sensing electrode. Including, at least one of the sensing electrode and the dummy pattern comprises the metal mesh structure of any one of claims 1 to 6, a touch sensor.

According to an embodiment, a metal mesh structure including unit cells of various line widths may be implemented. Accordingly, it is possible to ensure excellent visibility and transmittance while satisfying the electrical properties of the metal mesh structure.

1 is a view for explaining a unit cell of a metal mesh structure according to an embodiment.
2 is a view showing a metal mesh structure according to an embodiment.
3 is a view showing a metal mesh structure according to another embodiment.
4 is a view showing a metal mesh structure according to another embodiment.
5 is a view showing a metal mesh structure according to another embodiment.
6 is a schematic cross-sectional view illustrating an antenna element according to an embodiment.
7 is a schematic plan view illustrating an antenna element according to an embodiment.
8 is a schematic plan view illustrating an antenna element according to another embodiment.
9 is a schematic plan view illustrating a touch sensor according to an exemplary embodiment.
FIG. 10 is a schematic cross-sectional view taken along line AB of FIG. 9 .

Hereinafter, with reference to the drawings, embodiments of the present invention will be described in more detail. However, the following drawings attached to the present specification illustrate preferred embodiments of the present invention, and serve to further understand the technical spirit of the present invention together with the above-described contents of the present invention, so the present invention is described in such drawings It should not be construed as being limited only to the matters.

1 is a view for explaining a unit cell of a metal mesh structure according to an embodiment.

Referring to FIG. 1 , a unit cell of a metal mesh structure according to an embodiment may be defined by a plurality of conductive lines 10 .

The conductive line 10 may include a conductive material. According to an embodiment, the conductive line 10 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), and titanium (Ti). ), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn) ), a low-resistance metal such as molybdenum (Mo), calcium (Ca), or an alloy thereof may be included. These may be used alone or in combination of two or more. For example, the conductive line 10 may include silver (Ag) or a silver alloy (eg, silver-palladium-copper (APC) alloy) to realize low resistance. As another example, the conductive line 10 may include copper (Cu) or a copper alloy (eg, a copper-calcium (CuCa) alloy) in consideration of low resistance and fine line width patterning.

According to an embodiment, the conductive line 10 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), or zinc oxide (ZnOx).

According to an embodiment, the conductive line 10 may include a stacked structure of a transparent conductive oxide layer and a metal layer, for example, it may have a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. . In this case, while the flexible characteristic is improved by the metal layer, the signal transmission speed may be improved by lowering the resistance, and the corrosion resistance and transparency may be improved by the transparent conductive oxide layer.

The line width of the conductive line 10 may be determined in consideration of various factors such as visibility, transmittance, and resistance. According to an embodiment, the line width w of the conductive line 10 may be 1.0 μm to 5.0 μm.

The unit cell defined by the plurality of conductive lines 10 may be formed in a rhombus shape as shown in FIG. 1 . However, this is only an exemplary embodiment and there is no particular limitation on the shape of the unit cell. When the unit cell is formed in a rhombus shape, two diagonal lengths a and b of the unit cell may be 75 μm to 460 μm. Here, the diagonal may be defined as a line segment connecting two vertices facing each other.

The unit cell may have a predetermined inclination angle θ with respect to a vertical axis (eg, a y-axis). For example, a line segment connecting the upper vertex and the lower vertex of the unit cell may have a predetermined inclination angle with respect to the vertical axis. According to an embodiment, the predetermined inclination angle θ may be 0° to 45°.

Meanwhile, a plurality of such unit cells may be aggregated to define a metal mesh structure.

2 is a view showing a metal mesh structure according to an embodiment.

Referring to FIG. 2 , the metal mesh structure according to an embodiment may include a plurality of first unit cells 210 and a plurality of second unit cells 220 .

The first unit cell 210 may be defined by a plurality of first conductive lines 211 , and the second unit cell 220 may be defined by a plurality of second conductive lines 221 . Here, since the first conductive line 211 and the second conductive line 221 are substantially the same as the conductive line 10 described above with reference to FIG. 1 , a detailed description thereof will be omitted in the overlapping range.

The line width of the first conductive line 211 forming the first unit cell 210 may be different from the line width of the second conductive line 221 forming the second unit cell 220 . For example, the line width of the second conductive line 221 may be wider than that of the first conductive line 211 . The difference between the line width of the second conductive line 221 and the line width of the first conductive line 211 may be, for example, 1 μm or more.

According to an embodiment, the metal mesh structure may be divided into two regions 250 and 260 , the first unit cells 210 are arranged in the first region 250 , and the second unit cells 220 are It may be arranged in the second region 260 .

3 is a view showing a metal mesh structure according to another embodiment.

Referring to FIG. 3 , the metal mesh structure according to an embodiment may include a plurality of first unit cells 310 , a plurality of second unit cells 320 , and a plurality of third unit cells 330 .

The first unit cell 310 is defined by a plurality of first conductive lines 311 , the second unit cell 320 is defined by a plurality of second conductive lines 321 , and the third unit cell 330 is defined by a plurality of second conductive lines 321 . ) may be defined by a plurality of third conductive lines 331 . Here, the first conductive line 311 , the second conductive line 321 , and the third conductive line 331 are substantially the same as the conductive line 10 described above with reference to FIG. 1 , and thus detailed descriptions thereof in the overlapping range is to be omitted.

The line width of the first conductive line 311 forming the first unit cell 310 , the line width of the second conductive line 321 forming the second unit cell 320 , and the line width of the third unit cell 330 are formed. The line width of the third conductive line 331 may be different. For example, the line width of the third conductive line 331 may be wider than that of the second conductive line 321 , and the line width of the second conductive line 321 may be wider than that of the first conductive line 311 . The difference between the line width of the third conductive line 331 and the line width of the first conductive line 311 may be, for example, 1 μm or more. Alternatively, the difference between the line width of the third conductive line 331 and the line width of the second conductive line 321 and the difference between the line width of the second conductive line 321 and the first conductive line 311 are, for example, 1 μm, respectively. may be more than

According to an embodiment, the metal mesh structure may be divided into three regions 350 , 360 , and 370 , the first unit cells 310 are arranged in the first region 350 , and the second unit cells 320 . ) may be arranged in the second region 360 , and the third unit cells 330 may be arranged in the third region 370 . In this case, the first area 350 , the second area 360 , and the third area 370 may be sequentially disposed along a predetermined direction as shown in FIG. 3 . In this case, the metal mesh structure has a gradation structure in which the line widths of the conductive lines 311 , 321 , 331 forming the unit cells 310 , 320 , and 330 are widened from the first region 350 to the third region 370 . can have However, this is only an exemplary embodiment and is not limited thereto, and the arrangement of the first region 350 , the second region 360 , and the third region 370 may vary, and the arrangement method thereof is not particularly limited. .

Meanwhile, FIG. 3 shows an example including three types of unit cells 310 , 320 , 330 and three regions 350 , 360 , 370 , but this is only for convenience of description and is not limited thereto. . That is, the metal mesh structure may include four or more types of unit cells and/or four or more regions.

4 is a view showing a metal mesh structure according to another embodiment.

Referring to FIG. 4 , the metal mesh structure according to another embodiment includes a plurality of first unit cells 310 , a plurality of second unit cells 320 , and a plurality of third unit cells 330 . The first unit cells 310 , the second unit cells 320 , and the third unit cells 330 may be randomly arranged. Here, since the first unit cell 310 , the second unit cell 320 , and the third unit cell 330 are the same as those described above with reference to FIG. 3 , a detailed description thereof will be omitted.

Meanwhile, FIG. 4 shows an example including three types of unit cells 310 , 320 , and 330 , but this is only for convenience of description and is not limited thereto. That is, the metal mesh structure may include two types of unit cells, or may include four or more types of unit cells.

5 is a view showing a metal mesh structure according to another embodiment.

Referring to FIG. 5 , a metal mesh structure according to another embodiment may include a plurality of first unit cells 310 , a plurality of second unit cells 320 , and a plurality of third unit cells 330 . .

One or more first unit cells 310, one or more second unit cells 320, and one or more third unit cells 330 are randomly arranged to form one upper cell 510, and thus formed upper cell ( 510 may be arranged in a predetermined pattern to form a metal mesh structure.

Meanwhile, FIG. 5 shows an example in which three types of unit cells 310 , 320 , and 330 form one upper cell 510 , but this is only for convenience of description and is not limited thereto. That is, it is possible for two types of unit cells to form one upper cell 510 , and it is also possible for four or more types of unit cells to form one upper cell 510 .

According to the metal mesh structure of the various embodiments described above, it is possible to ensure excellent visibility and transmittance while satisfying the electrical properties of the metal mesh structure.

6 is a schematic cross-sectional view illustrating an antenna element according to an embodiment, and FIG. 7 is a schematic plan view illustrating an antenna element according to an embodiment.

6 and 7 , the antenna element according to an embodiment may include a dielectric layer 610 and an antenna pattern layer 620 .

The dielectric layer 610 may include an insulating material having a predetermined dielectric constant. According to an embodiment, the dielectric layer 610 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, or metal oxide, or an organic insulating material such as an epoxy resin, an acrylic resin, or an imide-based resin. The dielectric layer 610 may function as a film substrate of the antenna element on which the antenna pattern layer 620 is formed.

According to an embodiment, a transparent film may be provided as the dielectric layer 610 . In this case, the transparent film may include a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; Cellulose resins, such as a diacetyl cellulose and a triacetyl cellulose; polycarbonate-based resin; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrenic resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin-based resins such as polyethylene, polypropylene, polyolefin having a cyclo-based or norbornene structure, and an ethylene-propylene copolymer; vinyl chloride-based resin; amide-based resins such as nylon and aromatic polyamide; imide-based resin; polyether sulfone-based resin; sulfone-based resins; polyether ether ketone resin; sulfide polyphenylene-based resin; vinyl alcohol-based resin; vinylidene chloride-based resin; vinyl butyral-based resin; allylate-based resin; polyoxymethylene-based resins; and a thermoplastic resin such as an epoxy-based resin. These may be used alone or in combination of two or more. In addition, a transparent film made of a thermosetting resin such as (meth)acrylic, urethane, acrylic urethane, epoxy, or silicone or UV curable resin may be used as the dielectric layer 610 .

According to an embodiment, an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR) may be included in the dielectric layer 610 .

According to an embodiment, the dielectric layer 610 may be formed as a substantially single layer or a multilayer structure of at least two or more layers.

A capacitance or inductance is formed by the dielectric layer 610 , so that a frequency band in which the antenna element can be driven or sensed can be adjusted. When the dielectric constant of the dielectric layer 610 exceeds about 12, the driving frequency is excessively reduced, and driving in a desired high frequency band may not be realized. Accordingly, according to an embodiment, the dielectric constant of the dielectric layer 610 may be adjusted in a range of about 1.5 to 12, preferably, about 2 to 12.

According to an embodiment, an insulating layer (eg, an insulation layer, a passivation layer, etc. of a display panel) inside the display device on which the antenna element is mounted may be provided as the dielectric layer 610 .

The antenna pattern layer 620 may be disposed on the top surface of the dielectric layer 610 . As shown in FIG. 7 , the antenna pattern layer 620 may include a radiation pattern 710 , a transmission line 720 , and a pad electrode 730 .

The radiation pattern 710 may be electrically connected to the transmission line 720 to be fed through the pad electrode 730 .

According to an embodiment, the radiation pattern 710 includes the metal mesh structure of FIGS. 2 to 5 , and in this case, unit cells having a relatively wider line width of the conductive lines are arranged in a portion connected to the transmission line 720 . can be Through this, resistance in a portion connected to the transmission line 720 may be relatively reduced.

According to an embodiment, the radiation pattern 710 may be implemented in a rectangular shape as shown in FIG. 7 . However, this is only an exemplary embodiment and there is no particular limitation on the shape of the radiation pattern 710 . That is, the radiation pattern 710 may be implemented in various shapes, such as a rhombus and a circle.

The transmission line 720 may be disposed between the radiation pattern 710 and the signal pad 731 of the pad electrode 730 . The transmission line 720 may be branched from the central portion of the radiation pattern 610 to electrically connect the radiation pattern 710 and the signal pad 731 .

According to an embodiment, the transmission line 720 may include substantially the same conductive material as the radiation pattern 710 . In addition, the transmission line 720 may be integrally connected to the radiation pattern 710 and formed as a substantially single member, or may be formed as a member separate from the radiation pattern 710 .

According to an embodiment, the transmission line 720 includes the metal mesh structure of FIGS. 2 to 5 , wherein a unit cell having a relatively wider line width of the conductive lines is connected to the radiation pattern 710 and/or Alternatively, it may be arranged in a portion connected to the signal pad 731 . Through this, resistance in the portion connected to the radiation pattern 710 and/or the portion connected to the signal pad 731 may be relatively reduced.

According to another embodiment, in order to reduce signal resistance, the entire transmission line 720 has a wider line width than the metal mesh structure of the radiation pattern 710 (more specifically, the widest line width of the metal mesh structure of the radiation pattern 710 ). The branches may be formed in a metal mesh structure, or may be formed in a solid structure including the above-described metal or an alloy thereof. Since the transmission line 720 occupies a very small area compared to the entire area including the radiation pattern 710 , the transmission line 720 is somewhat free from the problem of visibility. Since the transmission line 720 is a part with a lot of signal loss, the antenna gain can be improved by forming the mesh line width of the transmission line 720 thicker than the mesh line width of the radiation pattern 710 or forming the transmission line 720 in a hollow structure. can

The pad electrode 730 may include a signal pad 731 and a ground pad 732 .

The signal pad 731 may be connected to an end of the transmission line 720 , and may be electrically connected to the radiation pattern 710 through the transmission line 720 . Through this, the signal pad 731 may electrically connect the driving circuit unit (eg, a radio frequency integrated circuit (RFIC), etc.) and the radiation pattern 710 . For example, a flexible printed circuit board (FPCB) may be bonded to the signal pad 731 , and a transmission line of the FPCB may be electrically connected to the signal pad 731 . For example, the signal pad 731 uses an anisotropic conductive film (ACF) to enable electrical conduction up and down and to insulate left and right using an ACF (Anisotropic Conductive Film) bonding technique, or a coaxial cable. (coaxial cable) may be electrically connected to the FPCB, but is not limited thereto. The driving circuit unit may be mounted on an FPCB or a separate Printed Circuit Board (PCB) and electrically connected to a transmission line of the FPCB. Accordingly, the radiation pattern 710 and the driving circuit unit may be electrically connected.

The ground pad 732 may be disposed to be electrically and physically separated from the signal pad 731 around the signal pad 731 . For example, a pair of ground pads 732 may be disposed to face each other with the signal pad 731 interposed therebetween.

According to an embodiment, the signal pad 731 and the ground pad 732 may be formed in a solid structure including the above-described metal or alloy to reduce signal resistance. In this case, the signal pad 731 and the ground pad 732 may have a multi-layer structure including the above-described metal or alloy layer and a transparent conductive oxide layer.

Meanwhile, the antenna element may further include a ground layer 630 . Since the antenna element includes the ground layer 630 , vertical radiation characteristics may be implemented.

The ground layer 630 may be formed on the bottom surface of the dielectric layer 610 . The ground layer 630 may be disposed to completely or partially overlap the antenna pattern layer 620 in a planar direction.

According to an embodiment, a conductive member of a display device or a display panel on which an antenna element is mounted may be provided as the ground layer 630 . For example, the conductive member may include electrodes or wirings such as gate electrodes, source/drain electrodes, pixel electrodes, common electrodes, data lines, scan lines, etc. of a thin film transistor (TFT) included in the display panel, and a metal plate ( For example, it may include a stainless steel (SUS) plate, a heat dissipation sheet, a digitizer, an electromagnetic wave shielding layer, a pressure sensor, a fingerprint sensor, and the like.

8 is a schematic plan view illustrating an antenna element according to another embodiment.

6 and 8, the antenna element according to another embodiment includes an antenna pattern layer 620 formed on the upper surface of the dielectric layer 610, and the antenna pattern layer 620 is a radiation pattern 710, transmission It may include a line 720 , a pad electrode 730 , and a dummy pattern 810 . Here, since the radiation pattern 710 , the transmission line 720 , and the pad electrode 730 are the same as those described above with reference to FIGS. 6 and 7 , a detailed description thereof will be omitted.

The dummy pattern 810 may be arranged around the radiation pattern 710 and the transmission line 720 .

The dummy pattern 810 may include substantially the same conductive material as the radiation pattern 710 or the transmission line 720 .

The dummy pattern 810 may be disposed to be electrically and physically separated from the radiation pattern 710 , the transmission line 720 , and the pad electrode 730 . For example, the separation region 811 may be formed along side lines of the radiation pattern 710 and the transmission line 720 to separate the dummy pattern 810 from the radiation pattern 710 and the transmission line 720 . there is.

According to an embodiment, the dummy pattern 810 may include the metal mesh structure of FIGS. 2 to 5 .

According to an embodiment, the metal mesh structure of the dummy pattern 810 may be formed in substantially the same structure (eg, the same pattern) as the metal mesh structure of the radiation pattern 710 or the transmission line 720 . According to an embodiment, in the case of the metal mesh structure of the dummy pattern 810, some conductive lines may be segmented. As some conductive lines of the dummy pattern 810 are segmented, disturbance with other electronic devices and generation of parasitic capacitance may be prevented, and visibility may be improved.

As described above, by arranging the dummy pattern 810 around the radiation pattern 710 and the transmission line 720, the antenna pattern is visually recognized by the user of the display device equipped with the antenna element according to the electrode arrangement difference for each location. can be prevented In addition, by applying the aforementioned metal mesh structure to the radiation pattern 710 and/or the dummy pattern 720 occupying a relatively large area, visibility may be further improved.

Meanwhile, although only one antenna element is illustrated in FIGS. 7 and 8 for convenience of description, a plurality of antenna elements may be arranged on the dielectric layer 610 in an array form.

9 is a schematic plan view showing a touch sensor according to an embodiment, and FIG. 10 is a schematic cross-sectional view taken along line A-B of FIG. 9 .

9 and 10 , the touch sensor may include a base layer 910 and a plurality of sensing electrodes 920 and 930 .

The substrate layer 910 may be used to encompass a film-type substrate used as a support layer to form the sensing electrodes 920 and 930 or an object on which the sensing electrodes 920 and 930 are formed. According to an embodiment, the base layer 910 may refer to a display panel in which the sensing electrodes 920 and 930 are directly formed.

According to an embodiment, the base layer 910 may include a substrate or a film material commonly used for a touch sensor without any particular limitation. For example, the base layer 910 may include glass, a polymer material, and/or an inorganic insulating material. In this case, the polymer material is a cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallyl Polyallylate, polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), polymethyl It may include methacrylate (PMMA), and the like, and the inorganic insulating material may include silicon oxide, silicon nitride, silicon oxynitride, metal oxide, and the like.

According to one embodiment, the base layer 910 may be formed in a multi-layer structure. For example, the base layer 910 may have a multilayer structure of an organic insulating layer and an inorganic insulating layer.

A layer or a film member of the image display device into which the touch sensor is inserted may be provided as the base layer 910 . For example, an encapsulation layer or a passivation layer included in a display panel of an image display device may be provided as the base layer 910 .

The sensing electrodes 920 and 930 may include first sensing electrodes 920 and second sensing electrodes 930 formed on the base layer 910 . For example, the sensing electrodes 920 and 930 may be arranged to be driven in a mutual capacitance method.

The first sensing electrodes 920 may be arranged, for example, in an x-direction (or a row direction). The first sensing electrodes 920 neighboring in the x-direction (or row direction) may be connected to each other by the connection unit 925 . The first sensing electrodes 920 and the connection part 925 may be integrally connected to each other and provided as a substantially single member. In this case, the first sensing electrodes 920 and the connection part 925 are formed by patterning together from the same conductive layer, and may be positioned on the same layer or on the same level. Accordingly, a first sensing channel row extending in the x-direction (or row direction) may be defined, and a plurality of first sensing channel rows may be arranged along the y-direction (or column direction).

The second sensing electrodes 930 are, for example, arranged along the y-direction (or column direction) and may have an independent island pattern shape. The second sensing electrodes 930 adjacent in the y-direction (or column direction) may be electrically connected to each other by the bridge electrode 950 . Accordingly, a second sensing channel column extending in the y-direction (or column direction) may be defined, and a plurality of second sensing channel columns may be arranged along the x-direction (or row direction).

According to an embodiment, the x-direction and the y-direction are parallel to the upper surface of the base layer 910 and may cross each other perpendicularly.

The bridge electrode 950 may connect the adjacent second sensing electrodes 930 to each other with a connection part 925 connecting the first sensing electrodes 920 interposed therebetween.

According to an embodiment, an insulating layer 940 covering the sensing electrodes 920 and 930 may be formed on the base layer 910 . The insulating layer 940 may include a contact hole 945 partially exposing top surfaces of the second sensing electrodes 930 . The bridge electrode 950 may be formed on the insulating layer 940 while filling the adjacent contact holes 945 .

According to an embodiment, the sensing electrodes 920 and 930 and/or the bridge electrode 950 may include the metal mesh structure of FIGS. 2 to 5 .

A dummy region 970 may be defined between the adjacent first sensing electrode 920 and the second sensing electrode 930 . The dummy region 970 may physically and electrically separate the first sensing electrode 920 and the second sensing electrode 930 from each other.

According to an embodiment, dummy patterns may be formed in the dummy region 970 . Due to the dummy patterns, it is possible to prevent or reduce electrode visibility due to a pattern deviation and a difference in optical characteristics in the dummy region 970 .

The dummy patterns may include substantially the same conductive material as the sensing electrodes 920 and 930 and/or the bridge electrode 950 .

According to an embodiment, the dummy patterns may include the metal mesh structure of FIGS. 2 to 5 .

According to an embodiment, the metal mesh structure of the dummy patterns may be formed in substantially the same structure (eg, the same pattern) as the metal mesh structure of the sensing electrodes 920 and 930 and/or the bridge electrode 950 . According to an embodiment, in the case of the metal mesh structure of the dummy patterns, some conductive lines may be segmented.

As described above, by arranging dummy patterns having substantially the same structure as at least one of the sensing electrodes 920 and 930 and the bridge electrode 950 around the sensing electrodes 920 and 930, the difference in electrode arrangement for each location Accordingly, it is possible to prevent the sensing electrodes 920 and 930, the bridge electrode 950, and the dummy pattern from being viewed by the user of the display device in which the touch sensor is mounted. In addition, visibility may be further improved by applying the above-described metal mesh structure to the sensing electrodes 920 and 930 , the bridge electrode 950 , and/or the dummy patterns occupying a relatively large area.

An insulating layer 940 may be formed on the base layer 910 and upper surfaces of the sensing electrodes 920 and 930 . As described above, the insulating layer 940 may include a contact hole 945 partially exposing top surfaces of the second sensing electrodes 930 .

According to an embodiment, the insulating layer 940 may be formed using an organic insulating material including a resin such as an acrylic resin, an epoxy resin, a urethane resin, or a siloxane resin. In this case, the resin composition is applied to the upper surfaces of the substrate layer 910 and the sensing electrodes 920 and 930 through a printing process or coating process such as inkjet fritting, nozzle printing, spin coating, slit coating, etc. to form a coating film. After curing, the insulating layer 940 may be formed through a development or etching process.

According to another embodiment, the insulating layer 940 may be formed using an inorganic insulating material such as silicon oxide, silicon oxynitride, or silicon nitride. In this case, an inorganic insulating material is deposited on the upper surfaces of the base layer 910 and the sensing electrodes 920 and 930 through a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, or the like, and then dry or wet. The insulating layer 940 may be formed through an etching process.

A passivation layer 960 covering the bridge electrode 950 may be further formed on the insulating layer 940 . The passivation layer 960 may include the aforementioned inorganic insulating material or the aforementioned organic insulating material.

So far, preferred embodiments have been focused on. Those of ordinary skill in the art will understand that it can be implemented in a modified form without departing from the essential characteristics of the invention. Accordingly, the scope of the invention is not limited to the above-described embodiments and should be construed to include various embodiments within the scope equivalent to the content described in the claims.

10: challenge line
210, 310: first unit cell
211, 311: first conductive line
220, 320: second unit cell
221, 322: second conductive line
330: third unit cell
331: third conductive line
250, 350: first area
260, 360: second area
370: third area
510: parent cell
610: dielectric layer
620: antenna pattern layer
630: ground layer
710: radiation pattern
720: transmission line
730: pad electrode
731: signal pad
732: ground pad
810: dummy pattern
910: base layer
920: first sensing electrode
930: second sensing electrode
925: connection
940: insulating layer
950: bridge electrode
960: passivation layer
970: dummy area

Claims (11)

first unit cells defined by a plurality of first conductive lines; and
second unit cells defined by a plurality of second conductive lines having a line width wider than that of the first conductive line; containing,
metal mesh structure. According to claim 1,
The first unit cells are arranged in a first area,
wherein the second unit cells are arranged in a second area;
metal mesh structure. According to claim 1,
third unit cells defined by a plurality of third conductive lines having a line width wider than that of the second conductive line; further comprising,
The first unit cells are arranged in a first area,
The second unit cells are arranged in a second area,
The third unit cells are arranged in a third area,
The first area, the second area and the third area are sequentially arranged in a predetermined direction,
metal mesh structure. According to claim 1,
the first unit cells and the second unit cells are randomly arranged,
metal mesh structure. According to claim 1,
At least one of the first unit cells and at least one of the second unit cells are randomly arranged to form an upper cell,
The upper cells are arranged in a certain pattern,
metal mesh structure. According to claim 1,
The line width of the first conductive line and the second conductive line is 1.0㎛ ~ 5.0㎛,
metal mesh structure. A radiation pattern comprising the metal mesh structure of any one of claims 1 to 6; containing,
antenna element. 8. The method of claim 7,
a transmission line formed of a metal mesh structure having a line width wider than that of the metal mesh structure of the radiation pattern or a solid structure; further comprising,
antenna element. radiation pattern; and
a dummy pattern disposed around the radiation pattern; including,
At least one of the radiation pattern and the dummy pattern comprises the metal mesh structure of any one of claims 1 to 6,
antenna element. A sensing electrode comprising the metal mesh structure of any one of claims 1 to 6; including,
touch sensor. sensing electrode; and
a dummy pattern disposed around the sensing electrode; including,
At least one of the sensing electrode and the dummy pattern comprises the metal mesh structure of any one of claims 1 to 6,
touch sensor.

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