KR20220013816A - Apparatus and method for analysing device function - Google Patents

Abstract

According to one embodiment of the present invention, provided is a device for measuring performance of an element, which includes: a vacuum chamber in which a target element to be measured is provided; a radiation member irradiating radiation to the target element to be measured; a wiring part electrically connecting a measuring member outside a vacuum chamber to the target element to be measured; and a feed adapter provided on one side of the vacuum chamber to maintain a vacuum state inside the vacuum chamber and provide the wiring part into the vacuum chamber, wherein the wiring part supplies electric power to the target element to be measured and transmits a change in electrical characteristics of the target element to be measured when exposed to radiation emitted from the radiation member to the device for measuring performance of the element.

Description

Device performance measuring device and device performance measuring method {APPARATUS AND METHOD FOR ANALYSING DEVICE FUNCTION}

The present invention relates to an apparatus for measuring device performance and a method for measuring device performance.

Recently, stability of electronic devices against protons, which accounts for the largest proportion of radiation in the space environment, has emerged, and many related studies are being conducted accordingly.

For example, in 2008, Sandia National Laboratory in the United States found that a total ionizing dose of radiation generates an electric charge in the transistor insulator layer, which causes a shift in the threshold voltage and an increase in leakage current. Also, in 2015, a research team at Penn State University in the United States investigated the effect of gamma rays on ZnO-based transistors. They confirmed that the electric field remaining in the thin film transistor back channel attracts ions or electrons of radiation as the cause of device performance degradation. It has been tried to improve radiation resistance.

However, in most of these existing studies, device measurement was performed after all radiation was irradiated. If the device is measured after all radiation is irradiated, there is a problem in that the effect of radiation irradiation on the operating state of the device cannot be accurately grasped. However, there is no field measurement research on proton irradiation, which is a particle beam, and it is difficult to measure the effect of radiation irradiation on device performance in real time because an experimental device capable of such a measurement has not been developed. Accordingly, in the present invention, an experimental apparatus capable of measuring an electronic device in real time in various radiation environments including a proton beam was invented.

An object of the present invention is to provide a device performance measuring device and device performance measuring method capable of confirming the effect of radiation on device performance.

Another object of the present invention is to provide an apparatus and method for measuring in real time the effect of radiation irradiation on device performance during device operation.

According to an embodiment of the present invention, a vacuum chamber in which a measurement target element is provided; a radiation member irradiating radiation to the measurement target element; a wiring part electrically connecting the measuring member outside the vacuum chamber to the measuring target device; and a feed adapter provided on one side of the vacuum chamber to maintain a vacuum state inside the vacuum chamber and provide the wiring part into the vacuum chamber, wherein the wiring part supplies power to the measurement target device and at the same time, the radiation An apparatus for measuring device performance is provided, which transmits, to the measurement member, a change in electrical characteristics of the device to be measured when exposed to radiation emitted from the member.

According to an embodiment of the present invention, the feed adapter includes a feed adapter case having a feed adapter inlet and a feed adapter outlet; a feed adapter holder provided between the feed adapter inlet and the feed adapter outlet of the feed adapter case, the feed adapter holder extending in a direction from the feed adapter inlet to the feed adapter outlet; and a feed adapter pin passing through the feed adapter holder.

According to an embodiment of the present invention, the wiring unit includes an internal wiring and an external wiring, the internal wiring connects one side of the feed adapter pin and the measurement target device, and the external wiring is the other side of the feed adapter pin and an element performance measuring device connecting the measuring member.

According to an embodiment of the present invention, at least one side of the wiring portion is provided with an alligator clip that is physically coupled to at least a portion of the element to be measured by a pivot movement, an apparatus for measuring device performance is provided.

According to an embodiment of the present invention, the device to be measured includes a source electrode provided on a substrate; a drain electrode provided to be spaced apart from the source electrode; an active layer provided between the source electrode and the drain electrode to connect the source electrode and the drain electrode; and a gate electrode provided to be spaced apart from the active layer.

According to an embodiment of the present invention, each of the source electrode and the drain electrode is connected to the wiring part, and the radiation member irradiates the active layer with radiation, an apparatus for measuring device performance is provided.

According to an embodiment of the present invention, there is provided an apparatus for measuring device performance, further comprising a carbon tape and a polyimide tape provided between the device to be measured and an inner wall of the vacuum chamber.

According to an embodiment of the present invention, there is provided an apparatus for measuring device performance, wherein the wiring part is provided along an inner wall of the vacuum chamber.

According to an embodiment of the present invention, a first step of providing a measurement target element in a vacuum chamber; a second step of measuring electrical characteristics of the measurement target device; and a third step of irradiating radiation to the measurement target device in a vacuum state using a radiation member, wherein the second step is continuously performed before and after the third step is performed, the device performance measurement method is provided do.

According to an embodiment of the present invention, the device to be measured includes a source electrode provided on a substrate; a drain electrode provided to be spaced apart from the source electrode; an active layer provided between the source electrode and the drain electrode to connect the source electrode and the drain electrode; and a gate electrode provided spaced apart from the active layer, and irradiating a change in electrical properties of the active layer when the active layer is irradiated with radiation, a device performance measurement method is provided.

According to an embodiment of the present invention, the device performance measuring device provides an electrical connection to the device while providing a stable and safe environment for irradiating radiation, so that the effect of radiation irradiation on device performance during device operation can be measured in real time .

In addition, according to an embodiment of the present invention, since the device measuring device has a structure capable of providing a simple and stable electrical connection to the device to be measured, the convenience of measuring operation is excellent.

1 is a perspective view showing a device measuring device according to an embodiment of the present invention.
2 is an enlarged cross-sectional view of a feed adapter according to an embodiment of the present invention.
3 is a plan view of the feed adapter according to FIG. 2 ;
4 is an enlarged cross-sectional view of a feed adapter according to an embodiment of the present invention.
5 is a cross-sectional view illustrating a connection relationship between a wiring unit, a feed adapter, and a measuring member according to an embodiment of the present invention.
6 is a cross-sectional view illustrating a measurement target device and a wiring unit according to an embodiment of the present invention.
7 is a flowchart illustrating a method for measuring device performance according to an embodiment of the present invention.
8 is a graph illustrating a device performance measurement result according to an embodiment of the present invention.

Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

According to an embodiment of the present invention, it is possible to simultaneously irradiate radiation while providing an electrical connection to the measurement target device provided in the vacuum chamber. Accordingly, it is possible to check and measure in real time how the device performance changes when the device to be measured is irradiated with radiation during operation.

1 is a perspective view showing a device measuring device according to an embodiment of the present invention.

The device measuring device is a device for measuring the performance, particularly, the electrical properties of the device to be measured. Since the device measuring device uses radiation, it may be provided with safety measures to prevent radiation leakage. For example, the device measuring device may be provided inside a radiation shielded space and may be operated remotely. In addition, the members used in the device measuring device can be safely processed according to the rules for technical standards such as radiation safety management.

The device measuring device includes a vacuum chamber 200 in which the measurement target device 100 is provided, a radiation member 300 irradiating radiation to the measurement target device, and a measurement member 600 outside the vacuum chamber 200 to measure the measurement target device ( 100) is provided on one side of the wiring unit 400 and the vacuum chamber 200 to electrically connect to the vacuum chamber 200 to maintain a vacuum state inside the vacuum chamber 200 and to provide the wiring unit 400 into the vacuum chamber 200 A feed adapter 500 is included.

The measurement target device 100 may be an electronic device used for various purposes by exhibiting specific electrical characteristics. For example, the measurement target device 100 may be a semiconductor device whose electrical conductivity varies depending on conditions. In some cases, the measurement target device 100 may be a composite device including both a semiconductor device and a conductor device. For example, the measurement target device 100 may be a thin film transistor (TFT).

When the measurement target device 100 is a thin film transistor, an electrical connection may be provided on a source electrode, a drain electrode, and a gate electrode that are conductors. In a state in which the electrical connection is provided to the measurement target device 100 in the above-described form, radiation is irradiated onto the measurement target device 100 , and the radiation irradiation affects the electrical properties of the measurement target device 100 , particularly the electrical properties of the active layer This can be investigated. The device 100 to be measured in the form of a thin film transistor described above may be of various types, such as an a-Si TFT, an LTPS TFT, and an oxide TFT.

The device to be measured 100 is provided inside the vacuum chamber 200 for performance measurement.

The vacuum chamber 200 provides a space in which the measurement target device 100 and the like can be provided, and isolates the measurement target device 100 from the outside. The size and shape of the vacuum chamber 200 may vary. The size and shape of the vacuum chamber 200 may vary depending on the purpose of the device performance measuring device.

The inside of the vacuum chamber 200 may be maintained in a vacuum state. Accordingly, it is possible to prevent the measurement result from being affected by the impurity gas inside the vacuum chamber 200 when the element 100 to be measured is irradiated with radiation. The vacuum chamber 200 may be further provided with a vacuum filtration device for making and maintaining the inside of the vacuum state as described above. The vacuum filtration device may filter the sucked gas so that the radiation particles inside the vacuum chamber 200 do not leak to the outside while performing suction so that the internal pressure of the vacuum chamber 200 is about 0.001 mmHg or less.

A wall forming the vacuum chamber 200 may shield radiation. Accordingly, there is no risk of radiation irradiated from the inside of the vacuum chamber 200 leaking out of the vacuum chamber 200 during device performance measurement. For example, the wall of the vacuum chamber 200 may include lead (Nb) or concrete. The vacuum chamber 200 may be provided in a form in which a wall is formed of lead, or a lead is coated on the inside of the wall.

At least some surfaces of the vacuum chamber 200 may be opened and closed. Accordingly, the user may open the vacuum chamber 200 , provide the measurement target device 100 into the vacuum chamber 200 , and then close the vacuum chamber 200 again. At this time, before and after opening and closing the vacuum chamber 200, the measurement of the radiation dose inside the vacuum chamber 200 may be preceded. In addition, when the amount of radiation inside the vacuum chamber 200 is greater than or equal to the standard, an electronic opening/closing device for controlling the vacuum chamber 200 not to be opened may be further provided in the vacuum chamber 200 .

A fixing member for fixing the measurement target device 100 may be further provided on the wall surface of the vacuum chamber 200 . The fixing member may be, for example, a carbon tape and a polyimide tape. By using the carbon tape and the polyimide tape together, it is possible to mechanically and stably fix the measurement object 100 while preventing a short circuit between the measurement object 100 and the vacuum chamber 200 from occurring.

A radiation member 300 for irradiating radiation to the measurement target device 100 is provided inside the vacuum chamber 200 .

The radiation member 300 is a member for emitting radiation. The radiation emitted from the radiation member 300 may be a particle beam such as alpha rays, beta rays, gamma rays, or neutron rays. The type of radiation may vary depending on a device performance measurement method to be performed.

The radiation member 300 may include an isotope to emit radiation. Isotopes are, for example, gallium-67, gallium-68, copper-64, copper-67, gold-198, lead-210, nickel-63, dysprosium-165, radium-226, lanthanum-140, rhenium- 186, Rhenium-188, Rubidium-82, Rubidium-177, Manganese-54, Molybdenum-99, Fluorine-18, Bismuth-213, Samarium-153, Oxygen-15, Cesium-137, Selenium-75, Sodium-24, Scandium-46, Strontium-82, Strontium-85, Strontium-89, Strontium-90, Americium-241, Zinc-65, Erbium-169, Chlorine-36, Iodine-123, Iodine-123, Iodine-125, Iodine-129, Iodine-131, Uranium-234, Uranium-235, Uranium-238, Iridium-192, Ytterbium-169, Yttrium-90, Indium-111, Germanium-68, Xenon -133, cobalt-57, cobalt-60, krypton-81, krypton-85, carbon-11, carbon-14, tritium, thorium-229, thorium-230, thallium-201, thallium-204, etc. can do.

The radiation member 300 may be provided at a position facing the measurement target device 100 in the vacuum chamber 200 . For example, when the measurement target device 100 is provided on one wall surface of the vacuum chamber 200 in the form of a rectangular parallelepiped, the radiating member 300 is provided on the wall facing the wall surface on which the measurement target device 100 is provided. can be Accordingly, most of the particle beam having straightness is emitted from the radiation member 300 and then is incident on the measurement target device 100 .

The radiation member 300 may further include a member for controlling the radiation amount and radiation range of the particle beam, for example, an diaphragm. Accordingly, it is possible to control the radiation to be irradiated only to a desired area according to the size and shape of the measurement target device 100 . For example, when the measurement target device 100 is a thin film transistor, the radiation range may be controlled so that radiation may be intensively irradiated to the active layer of the thin film transistor. Accordingly, device performance measurement can be performed without adversely affecting the wiring unit 400 or the like.

The radiation member 300 may further include a member for controlling the irradiated radiation. For example, an aluminum block or the like may be mounted in front of the radiation member 300 in order to control the beam energy irradiated from the radiation member 300 .

An electrical connection is provided to the measurement target device 100 while the radiation member 300 is irradiating radiation. A wiring unit 400 is provided to provide an electrical connection to the measurement target device 100 .

The wiring unit 400 electrically connects the measurement target device 100 and the measurement member 600 outside the vacuum chamber 200 . In this case, the electrical connection means that the wiring unit 400 functions as a conductor through which a current flows, and the current may include a data signal and power. Accordingly, the wiring unit 400 supplies power to the measurement target device 100 and, at the same time, measures a change in electrical characteristics of the measurement target device 100 when exposed to radiation emitted from the radiation member 300 to the measurement member 600 . ) can be sent.

The wiring unit 400 may be made of a conductive material exhibiting electrical conductivity. For example, the wiring unit 400 may include at least one selected from gold, silver, platinum, copper, and aluminum. However, in addition to the above-described materials, any material having excellent electrical conductivity may be used to configure the wiring unit 400 .

The surface of the wiring unit 400 may be covered with an insulating material. Accordingly, there is no risk of a short circuit occurring between the wiring unit 400 , the vacuum chamber 200 , the feed adapter 500 , and the like.

The wiring unit 400 may be provided along the inner wall of the vacuum chamber 200 . Accordingly, the wiring unit 400 is provided between the radiation member 300 and the measurement target device 100 , so that there is no fear of blocking radiation.

The wiring unit 400 may include a plurality of independent conductor lines. For example, the plurality of conductor lines may be connected to different regions of the measurement target device 100 .

The measuring member 600 connected at the other end of the wiring unit 400 may measure, in particular, electrical characteristics among the physical properties of the measurement target device 100 . The measuring member 600 may measure, for example, a change in electrical conductivity of the measurement target device 100 . The measurement member 600 may also supply power to the measurement target device 100 . The measuring member 600 may be provided outside the vacuum chamber 200 and may be provided adjacent to or spaced apart from the vacuum chamber 200 . The measuring member 600 may be, for example, a keithley device measuring device.

The wiring unit 400 is connected to the inside of the vacuum chamber 200 through the feed adapter 500 .

The feed adapter 500 is provided on one side of the vacuum chamber 200 , and allows the vacuum chamber 200 to be maintained while delivering the wiring part 400 to the inside of the vacuum chamber 200 .

More details on the configuration of the feed adapter 500 will be described later.

According to an embodiment of the present invention, after the device to be measured 100 is provided in the vacuum chamber 200 , radiation may be irradiated while providing an electrical connection to the device to be measured 100 . Accordingly, it is possible to measure and confirm the change in the electrical characteristics of the measurement target device 100 in real time according to the radiation irradiation. In particular, in performing the above-described measurement, the feed adapter 500 may be used to maintain a vacuum state inside the vacuum chamber 200 without fear of leakage of radioactive particles, and at the same time provide an electrical connection to the measurement target device 100 . . Hereinafter, we will look at the structure of the feed adapter 500 for performing this function in more detail.

2 is an enlarged cross-sectional view of a feed adapter according to an embodiment of the present invention. 3 is a plan view of the feed adapter according to FIG. 2 ;

2 and 3 , the feed adapter 500 includes a feed adapter case 510 having a feed adapter inlet 511 and a feed adapter outlet 512 , and a feed adapter inlet 511 of the feed adapter case 510 . A feed adapter pin 530 provided between and the feed adapter outlet 512 and penetrating through the feed adapter holder 520 and the feed adapter holder 520 extending from the feed adapter inlet 511 to the feed adapter outlet 512 . ) is included.

The feed adapter 500 is provided on one side of the vacuum chamber as described above. Specifically, the feed adapter 500 is provided on the vacuum chamber wall in the form of penetrating one side wall of the vacuum chamber.

The feed adapter 500 maintains a vacuum state inside the vacuum chamber, and is provided in close contact with the vacuum chamber in such a way that the radiation particles irradiated into the vacuum chamber do not leak to the outside. In addition, the feed adapter 500 is provided in the above-described form, and at the same time, enables an electrical connection started from the measuring member outside the vacuum chamber to continue to the measurement target element inside the vacuum chamber.

The feed adapter 500 may first include a feed adapter case 510 in order to perform the above-described function. The feed adapter case 510 forms the exterior of the feed adapter 500 and has an empty space therein. Specifically, the feed adapter case 510 may have a feed adapter inlet 511 and a feed adapter outlet 512 , and an empty space between the feed adapter inlet 511 and the feed adapter outlet 512 may be provided.

The feed adapter case 510 may be provided in a form in which the feed adapter inlet 511 faces the inside of the vacuum chamber and the feed adapter outlet 512 faces the outside of the vacuum chamber.

The feed adapter case 510 may be provided in a form in close contact with an opening provided on a wall surface of the vacuum chamber. In some cases, an O-ring may be provided between the feed adapter case 510 and the vacuum chamber opening so that the opening on the vacuum chamber wall surface and the feed adapter case 510 can come into close contact with each other. Alternatively, the feed adapter case 510 may be manufactured in a flexible form. In this case, the feed adapter case 510 is compressed and provided in the vacuum chamber opening, and the feed adapter case 510 is returned to its original shape by using the property. The feed adapter case 510 may be closely attached to the vacuum chamber opening.

A feed adapter holder 520 may be provided in an empty space inside the feed adapter case 510 .

A feed adapter holder 520 may be provided between the feed adapter inlet 511 and the feed adapter outlet 512 . The feed adapter holder 520 may also have a shape extending from the feed adapter inlet 511 to the feed adapter outlet 512 .

The feed adapter holder 520 may be provided in close contact with the feed adapter case 510 or integrally with the feed adapter case 510 . The feed adapter holder 520 may also include an opening through the feed adapter holder 520 in a direction from the feed adapter inlet 511 to the feed adapter outlet 512 . A feed adapter pin 530 is provided in the opening of the feed adapter holder 520 .

The feed adapter pin 530 is provided in the opening of the feed adapter holder 520 , and thus passes through the feed adapter holder 520 . The feed adapter pin 530 is provided in a form in close contact with the feed adapter holder 520 . For example, the feed adapter pin 530 may have a larger diameter than the opening of the feed adapter holder 520 , and the feed adapter holder 520 may have elasticity. Accordingly, when the feed adapter pin 530 is inserted into the opening of the feed adapter holder 520 , the feed adapter pin 530 is in close contact with the opening of the feed adapter holder 520 by the restoring force of the feed adapter holder 520 . can be

The feed adapter pin 530 may thus have a shape corresponding to the shape of the opening of the feed adapter holder 520 . For example, when the opening of the feed adapter holder 520 has a circular cross-section, the feed adapter pin 530 may also have a cylindrical shape.

The feed adapter pin 530 is electrically conductive. Accordingly, the feed adapter pin 530 may be coupled to the wiring unit at both ends to relay the electrical connection. The feed adapter pin 530 may include, for example, at least one selected from gold, silver, platinum, copper, and aluminum. However, in addition to the above-mentioned materials, any material having excellent electrical conductivity may be used to configure the feed adapter pin 530 .

The feed adapter pin 530 may include a conductor having excellent electrical conductivity and a coating covering the conductor. Accordingly, even when the feed adapter holder 520 includes an electrically conductive material, a short circuit may not occur between the feed adapter holder 520 and the feed adapter pin 530 .

A plurality of feed adapter pins 530 may be provided as can be seen in the drawings. The plurality of feed adapter pins 530 may be independently connected to different wires of the wire unit. A plurality of feed adapter pins 530 are provided to be spaced apart from each other in the feed adapter holder 520 so as not to short-circuit each other. However, the form of, for example, the number and arrangement of the plurality of feed adapter pins 530 shown in the drawings are merely exemplary.

According to an embodiment of the present invention, a feed adapter 500 is provided through the wall of the vacuum chamber. The feed adapter 500 is provided in a form in which the feed adapter case 510, the feed adapter holder 520, and the feed adapter pin 530 are in close contact. It is possible to prevent the radiation particles inside the chamber from leaking to the outside.

Hereinafter, we will look at another form of the above-described feed adapter.

4 is an enlarged cross-sectional view of a feed adapter according to an embodiment of the present invention.

Referring to FIG. 4 , the feed adapter 500 has a form in which only a portion of the opening of the feed adapter holder 520 is provided with a feed adapter pin 530 .

Since the feed adapter pin 530 is not provided in some of the openings of the feed adapter holder 520 and is open, the feed adapter 500 may further include a feed adapter cover 540 . The feed adapter cover 540 may be provided on the side of the feed adapter inlet 511 to cover one side of the feed adapter case 510 . The feed adapter pin 530 is provided to pass through the feed adapter cover 540 .

As the feed adapter cover 540 is provided, the sealing force of the feed adapter 500 may be further strengthened. In addition, since the feed adapter cover 540 is provided, sealing force can be maintained even when the feed adapter pin 530 is provided only in a portion of the opening of the feed adapter holder 520 . Accordingly, the number of feed adapter pins 530 can be freely adjusted as necessary.

Hereinafter, the connection relationship between the feed adapter 500 and other components will be looked at in more detail.

5 is a cross-sectional view illustrating a connection relationship between a wiring unit, a feed adapter, and a measuring member according to an embodiment of the present invention.

Referring to FIG. 5 , the feed adapter pin 530 may be connected to an internal wire 421 in an area on the side of the feed adapter inlet 511 , and may be connected with an external wire 422 at an area on the side of the feed adapter outlet 512 .

The feed adapter is disposed such that the feed adapter inlet 511 faces the inside of the vacuum chamber, and the inner wiring 421 is provided inside the vacuum chamber. In addition, the external wiring 422 is provided outside the vacuum chamber.

The internal wiring 421 is mechanically coupled to one end of the feed adapter pin 530 through a wiring connection member. In addition, the external wiring 422 is also mechanically coupled to the other end of the feed adapter pin 530 through a wiring connection member. In this case, there is no limitation on the type of wiring connection member provided to the internal wiring 421 and the external wiring 422 , and technical means used in the art may be used.

The internal wiring 421 is extended to connect one side of the feed adapter pin 530 and the device to be measured. In this case, the internal wiring 421 may extend to the measurement target device in a form in close contact with the wall of the vacuum chamber. Accordingly, there is no fear that the internal wiring 421 may block the radiation irradiated to the measurement target device.

An alligator clip 410 physically coupled to at least a portion of a measurement target element by a pivot movement may be provided on one side of the internal wiring 421 . Since the alligator clip 410 is mechanically very easy to operate, a user can easily provide an electrical connection to the device to be measured. In addition, as compared with wiring according to the prior art that forms an irreversible electrical connection by soldering or the like, the alligator clip 410 has an advantage in that it can provide a reversible electrical connection. Accordingly, an electrical connection is provided by using the alligator clip 410 when measuring device performance, and after measurement, only the device to be measured is removed and the alligator clip 410 can be reused.

The external wiring 422 extends to connect the other side of the feed adapter pin 530 and the measurement member 600 .

According to one embodiment of the present invention, by providing internal wiring and external wiring on both sides of the feed adapter pin fixed to the feed adapter, it is possible to maintain a vacuum and provide an electrical connection extending in and out of the vacuum chamber without worrying about leakage of radioactive particles. . In particular, by using a mechanical device on both sides of the feed adapter pins to connect the internal wiring and the external wiring, the operation convenience of the device is very excellent. In addition, since an alligator clip is provided on one side of the internal wiring, the internal wiring can be used multiple times and an electrical connection can be conveniently provided to the device to be measured.

In the above, the form of providing the feed adapter and the wiring unit has been reviewed. Hereinafter, the shape of the device to be measured will be examined.

6 is a cross-sectional view illustrating a measurement target device and a wiring unit according to an embodiment of the present invention.

Referring to FIG. 6 , the measurement target device 100 may be a thin film transistor.

The measurement target device 100 specifically includes a source electrode 104 provided on a substrate 101 , a drain electrode 105 provided to be spaced apart from the source electrode 104 , and a space between the source electrode 104 and the drain electrode 105 . It may include an active layer 103 that is provided to connect the source electrode 104 and the drain electrode 105 , and a gate electrode 102 that is provided spaced apart from the active layer 103 .

First, the substrate 101 is provided on the measurement target device 100 . There is no particular limitation on the material and thickness of the substrate 101 . Accordingly, a person skilled in the art can change the material and thickness of the substrate constituting the substrate as needed. The substrate 101 may be, for example, synthetic quartz, calcium fluoride, F-doped quartz, sodalime glass, non-alkali glass, or a polymer. It may be made of an insulating material such as resin. In addition, the substrate 101 may be made of a material having flexibility to be bent or folded, and may have a single-layer structure or a multi-layer structure.

For example, the substrate 101 may include polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide ( polyetherimide), polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, triacetate cellulose (triacetate cellulose) and cellulose acetate propionate may include at least one of (cellulose acetate propionate). However, the material constituting the substrate 101 may be variously changed, and may also be made of fiber glass reinforced plastic or the like.

A gate electrode 102 is provided on the substrate 101 .

The gate electrode 102 controls current flowing between the source electrode 104 and the drain electrode 105 through the active layer 103 . The gate electrode 102 includes at least one of aluminum (Al), copper (Cu), silver (Ag), molybdenum (Mo), chromium (Cr), tungsten (W), titanium (Ti), and alloys thereof. can do. However, the material capable of forming the gate electrode 102 is not limited to the above example. Accordingly, a person skilled in the art may appropriately select a material for forming the gate electrode 102 as needed, which includes indium tin oxide (ITO), indium zinc oxide (IZO), or a TCO-based alloy.

The active layer 103 is provided between the source electrode 104 and the drain electrode 105 , and exhibits electrical conductivity when an electric field is applied from the gate electrode 102 .

The active layer 103 may include an oxide semiconductor, an inorganic semiconductor, or an organic semiconductor. The oxide semiconductor is formed of zinc oxide (ZnO), indium oxide (InO), indium-gallium-zinc oxide (In-Ga-Zn-O), zinc-tin oxide (Zn-Sn-O), or zinc (Zn) , indium (In), gallium (Ga), tin (Sn), and may be formed of an oxide containing at least two or more elements of aluminum (Al). The inorganic semiconductor may include amorphous silicon, poly silicon, or the like.

The source electrode 104 and the drain electrode 105 are provided on the active layer 103 and are provided to be spaced apart from each other. The source electrode 104 and the drain electrode 105 are aluminum (Al), copper (Cu), silver (Ag), molybdenum (Mo), chromium (Cr), tungsten (W), titanium (Ti), and alloys thereof. It may have electrical conductivity by including at least one of them. However, materials for forming the source electrode 104 and the drain electrode 105 are not limited to the above example.

insulating layers 106a and 106b between the source electrode 104 and the drain electrode 105 and the gate electrode 102 , between the gate electrode 102 and the active layer 103 , and between the gate electrode 102 and the substrate 101 . can be provided.

The insulating layers 106a and 106b may be insulators that prevent short circuits between members having electrical conductivity. The insulating layers 106a and 106b are made of oxides such as Al2O3, HfO2, ZrO2, TiO2, SiO2, Ga2O3, Gd2O3, V2O3, Cr2O3, MnO, Li2O, MgO, CaO, Y2O3, Ta2O5, or nitrides such as SiON, SiNx, HfNx, etc. can be formed. However, the type of material forming the insulating layers 106a and 106b is not limited to the above-described example.

The device performance measuring device connects a wiring part to each of the source electrode 104 , the drain electrode 105 , and the gate electrode 102 , and the current from the drain electrode 105 is increased according to the presence or absence of a driving signal applied to the gate electrode 102 . By determining whether or not it is detected, the electrical characteristics of the device can be measured. The wiring unit may be connected to the source electrode 104 , the drain electrode 105 , and the gate electrode 102 simply and stably through the alligator clip 410 .

The wiring unit and the source electrode 104 , the drain electrode 105 , and the gate electrode 102 may be connected to each other in various ways. For example, an electric wire may be attached to the source electrode 104 , the drain electrode 105 , and the gate electrode 102 using a conductive adhesive such as conductive epoxy, and connected to the end of the electric wire with an alligator clip 410 . Accordingly, the measurement target device 100 may further include a member capable of physically coupling the source electrode 104, the drain electrode 105, and the gate electrode 102 to the alligator clip 410 as described above. have.

In measuring device performance, power may be applied to the device to be measured by the wiring unit connected to the source electrode 104 . Also, a driving signal may be applied to the device to be measured by the wiring unit connected to the gate electrode 102 . When a driving signal is applied to the gate electrode 102 , an electric field generated from the gate electrode 102 may be applied to the active layer 103 , and the active layer 103 may be electrically conductive. Accordingly, the current applied to the source electrode 104 may flow to the drain electrode 105 . The current flowing to the drain electrode 105 may be checked by the measuring member through a wiring part connected to the drain electrode 105 . On the other hand, when no driving signal is applied to the gate electrode 102 , current does not flow from the source electrode 104 to the drain electrode 105 because the active layer 103 does not have electrical conductivity.

As described above, in a normal state, the active layer 103 should exhibit electrical conductivity only when an electric field generated from the gate electrode 102 is applied. However, when the active layer 103 is deteriorated by radiation, the active layer 103 may exhibit electrical conductivity even when no electric field is applied from the gate electrode 102 . In this case, even if a driving signal is not applied to the gate electrode 102 , the current may be detected through the wiring part connected to the drain electrode 105 .

The device performance measuring apparatus may measure and confirm whether a current is detected in the drain electrode 105 while applying the radiation to the active layer 103 in order to check the effect of the radiation on the active layer 103 . In addition, in order to confirm the degree of radiation resistance of the active layer 103 , it is possible to investigate whether the active layer 103 deteriorates when the amount of radiation is irradiated.

In addition, when radiation is irradiated to the insulating layers 106a and 106b as well as the active layer 103 , whether a short circuit or leakage occurs, or the capacitance-voltage of the device 100 to be measured , capacitance-frequency) can be checked.

In the above, the device to be measured has a bottom-gate and top-contact structure in which the gate electrode 102 is positioned below and the source electrode 104 and the drain electrode 105 are positioned above. However, when the device to be measured has not only such a structure but also a top-gate, bottom-contact structure, or a top-gate, top-contact structure, etc. It is also possible to measure device performance in the same principle as described above.

For the above transistor measurement, not only the 3-terminal measurement that electrically connects the gate electrode 102, the source electrode 104, and the drain electrode 105, but also the inverter (inverter) that requires connection to four electrodes ), it is possible to measure device performance in the same principle as described above by increasing the number of feed adapter pins 530 even for measurements requiring the number of connections of 4-terminals or more.

In the above, an apparatus for measuring device performance according to an embodiment of the present invention has been described. Hereinafter, a method for measuring device performance using a device performance measuring device will be described.

7 is a flowchart illustrating a method for measuring device performance according to an embodiment of the present invention.

Referring to FIG. 7 , the device performance measurement method includes a first step ( S100 ) of providing a measurement target device in a vacuum chamber, a second step ( S200 ) of measuring electrical characteristics of the measurement target device, and a measurement target device in a vacuum state and a third step (S300) of irradiating the radiation using the radiation member. In performing the device performance measurement method, the second step ( S200 ) is continuously performed from before the third step ( S300 ) to after the performance.

In the first step ( S100 ), a measurement target device is first provided in a vacuum chamber. In order to provide the device to be measured, one side of the vacuum chamber may be opened and the device to be measured may be positioned. In this case, the measurement target device may be provided in the form of being attached to a designated wall surface of the vacuum chamber. Attachment of the device to be measured can be performed using a carbon tape or a polyimide tape.

In the first step ( S100 ), the device to be measured located in the vacuum chamber may be connected to the wiring unit. The wiring unit connects the measurement target element provided inside the vacuum chamber and the measurement member provided outside the vacuum chamber through the feed adapter. When the wiring unit includes the alligator clip, an electrical connection can be easily formed by mechanically fixing the alligator clip to the device to be measured. In addition, when the element to be measured is removed, the alligator clip may be mechanically separated and only the element to be measured may be removed. Thus, the wiring part and the alligator clip can be used multiple times.

In the first step (S100), prior to providing the measurement target device to the vacuum chamber, the operation of checking the radiation dose in the vacuum chamber may be performed. In addition, the vacuum chamber may be controlled to open only when the radiation dose is less than or equal to a reference value.

After positioning the device to be measured in the vacuum chamber in the first step ( S100 ), the vacuum chamber may be closed again and a vacuum environment may be created in the vacuum chamber. A vacuum environment may be created by sucking and removing air in the vacuum chamber.

Next, in the second step (S200), the electrical characteristics of the device to be measured may be measured. Electrical characteristic measurement may be performed in the form of checking a result value while applying power and/or a driving signal to the device to be measured.

Next, in the third step (S300), the radiation is irradiated to the measurement target element by using the radiation member.

The second step S200 and the third step S300 may be performed simultaneously. At this time, being performed at the same time means that the start and end of the second step (S200) and the start and end of the third step (S300) coincide, as well as the second step (S200) and the third step (S300) are performed together at the same time This means that there is a section where Accordingly, according to an embodiment of the present invention, it is possible to measure the electrical characteristics of the device to be measured while irradiating the radiation.

The device to be measured includes a source electrode provided on a substrate; a drain electrode provided to be spaced apart from the source electrode; an active layer provided between the source electrode and the drain electrode to connect the source electrode and the drain electrode; and a gate electrode provided to be spaced apart from the active layer. In this case, the device performance measurement method may be performed in the form of irradiating changes in electrical properties of the active layer when radiation is irradiated to the active layer.

8 is a graph illustrating a device performance measurement result according to an embodiment of the present invention.

As shown in FIG. 8, after measuring one cycle of the transfer curve of the Zinc indium tin oxide (ZITO) thin film transistor prior to irradiation with radiation, the measurement of the next transfer cycle can be continued at the same time as starting proton irradiation. As a result, Ids current and leakage current increased, and it was confirmed that device performance was recovered after irradiation was completed.

As described above, according to the present invention, it is possible to simultaneously perform radiation irradiation and electrical property irradiation, and it is also possible to continuously perform radiation irradiation and electric property irradiation multiple times.

Although the above has been described with reference to the preferred embodiment of the present invention, those skilled in the art or those with ordinary skill in the art will not depart from the spirit and scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention can be made without departing from the scope of the present invention.

Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

100: element to be measured 101: substrate
102: gate electrode 103: active layer
104: source electrode 105: drain electrode
106a, 106b: insulating layer 200: vacuum chamber
300: radiating member 400: wiring part
410: alligator clip 421: internal wiring
422: external wiring 500: feed adapter
510: feed adapter case 511: feed adapter inlet
512: feed adapter outlet 520: feed adapter holder
530: feed adapter pin 540: feed adapter cover
600: measurement member

Claims (10)

a vacuum chamber in which the device to be measured is provided;
a radiation member irradiating radiation to the measurement target element;
a wiring part electrically connecting the measuring member outside the vacuum chamber to the measuring target device; and
and a feed adapter provided on one side of the vacuum chamber to maintain a vacuum state inside the vacuum chamber and provide the wiring part into the vacuum chamber,
and the wiring unit supplies electric power to the element to be measured and transmits a change in electrical characteristics of the element to be measured when exposed to radiation emitted from the radiation member to the measurement member. According to claim 1,
The feed adapter is
a feed adapter case having a feed adapter inlet and a feed adapter outlet;
a feed adapter holder provided between the feed adapter inlet and the feed adapter outlet of the feed adapter case and extending from the feed adapter inlet to the feed adapter outlet; and
and a feed adapter pin passing through the feed adapter holder. 3. The method of claim 2,
The wiring unit includes an internal wiring and an external wiring,
The internal wiring connects one side of the feed adapter pin and the device to be measured,
The external wiring connects the other side of the feed adapter pin and the measuring member. The method of claim 1,
At least one side of the wiring unit is provided with an alligator clip that is physically coupled to at least a portion of the element to be measured by a pivot movement. According to claim 1,
The measurement target device is
a source electrode provided on the substrate;
a drain electrode provided to be spaced apart from the source electrode;
an active layer provided between the source electrode and the drain electrode to connect the source electrode and the drain electrode; and
and a gate electrode provided to be spaced apart from the active layer. 6. The method of claim 5,
each of the source electrode and the drain electrode is connected to the wiring part;
The radiation member irradiates radiation to the active layer, device performance measurement device. According to claim 1,
The device performance measuring device further comprising a carbon tape and a polyimide tape provided between the device to be measured and an inner wall of the vacuum chamber. According to claim 1,
and the wiring portion is provided along an inner wall of the vacuum chamber. A first step of providing a measurement target element in the vacuum chamber;
a second step of measuring electrical characteristics of the measurement target device; and
A third step of irradiating radiation using a radiation member to the element to be measured in a vacuum state,
The second step is continuously performed from before to after the third step is performed, the device performance measurement method. 10. The method of claim 9,
The measurement target device is
a source electrode provided on the substrate;
a drain electrode provided to be spaced apart from the source electrode;
an active layer provided between the source electrode and the drain electrode to connect the source electrode and the drain electrode; and
and a gate electrode provided to be spaced apart from the active layer,
A method for measuring device performance, for irradiating changes in electrical properties of the active layer when the active layer is irradiated with radiation.

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