KR20220007004A - Phase modulator and phase modulator array including the same - Google Patents

Abstract

The present invention is to provide a phase modulator and a phase modulator array which can reliably maintain an over-coupling state. The phase modulator comprises: an antenna pattern; a guide layer spaced, in a first direction, from the antenna pattern; a spacer provided between the antenna pattern and the guide layer; and a phase change pattern inserted in the spacer. The phase change pattern includes a phase change material.

Description

PHASE MODULATOR AND PHASE MODULATOR ARRAY INCLUDING THE SAME

The present disclosure relates to phase modulators and phase modulator arrays.

An optical modulation device that changes transmission/reflection/scattering characteristics, phase, amplitude, polarization, intensity, path, etc. of light is used in various optical devices. In order to control the properties of light in a desired manner in an optical system, various structures of light modulation devices have been proposed. For example, a liquid crystal having optical anisotropy or a microelectromechanical system (MEMS) structure using micro-mechanical movement of a light blocking/reflecting element is used in a general light modulation device. These optical modulation devices have a limit in their operation response time due to the characteristics of the driving method. In the case of the MEMS structure, it is necessary to correct the nonlinearity of the voltage-displacement characteristic, and an optimized driving voltage profile must be secured to correct the effect of vibration of the motion system.

Recently, an attempt has been made to utilize a meta-structure using a surface plasmon or a gap plasmon for incident light in an optical modulation device.

An object to be solved is to provide a phase modulator and a phase modulator array stably maintaining an over-coupling state.

An object to be solved is to provide a phase modulator and a phase modulator array having improved light reflection characteristics.

An object to be solved is to provide a phase modulator and a phase modulator array having a degree of freedom with respect to a distance between an antenna pattern and a phase change material pattern.

However, the problem to be solved is not limited to the above disclosure.

In one aspect, the antenna pattern; a guide layer spaced apart from the antenna pattern in a first direction; a spacer provided between the antenna pattern and the guide layer; and a phase change pattern inserted into the spacer, wherein the phase change pattern may include a phase modulator including a phase change material.

The phase change pattern may be surrounded by the spacer.

A thickness of a portion of the spacer disposed between the phase-change pattern and the antenna pattern in the first direction may be determined by the first direction of another portion of the spacer disposed between the phase-change pattern and the guide layer. It may be thicker than the following thickness.

The phase change pattern may overlap the antenna pattern along the first direction.

The phase change pattern may be disposed in an effective resonator region in the spacer where a gap plasmon is generated.

A width of the antenna pattern along a second direction crossing the first direction may be smaller than a width of the effective resonator region along the second direction.

A width of the phase change pattern along a second direction crossing the first direction may be the same as a width of the antenna pattern along the second direction.

A power supply element for applying a voltage to the antenna pattern may be further included, wherein heat may be generated in the antenna pattern by applying the voltage to the antenna pattern.

The phase change pattern may be spaced apart from the antenna pattern such that a difference between a maximum temperature and a minimum temperature of the phase change pattern when the heat is generated in the antenna pattern is minimized.

The phase change pattern may be spaced apart from the antenna pattern so that, when the heat is generated in the antenna pattern, a minimum temperature of the phase change pattern is 280 degrees (°C) or more.

The antenna pattern may include a plurality of antenna patterns arranged along a second direction intersecting the first direction, and the phase change pattern may include a plurality of phase change patterns provided between the plurality of antenna patterns and the guide layer. Including these patterns, the plurality of antenna patterns may have the same shape, and the plurality of phase change patterns may be arranged along the second direction.

It further includes a power supply element for applying the same voltages to the plurality of antenna patterns, respectively, wherein heat may be generated in the plurality of antenna patterns by applying the voltage to the plurality of antenna patterns.

In one aspect, there is provided a first phase modulator; a second phase modulator spaced apart from the first phase modulator in a first direction; and a power supply element for applying a voltage to the first phase modulator and the second phase modulator, wherein each of the first phase modulator and the second phase modulator includes antenna patterns arranged in the first direction , a guide layer spaced apart from the antenna patterns in a second direction intersecting the first direction, a spacer provided between the antenna patterns and the guide layer, and a spacer inserted into the spacer and arranged along the first direction A phase modulator array including phase change patterns may be provided, wherein the phase change patterns include a phase change material.

The power element applies a first voltage to the antenna patterns of the first phase modulator and applies a second voltage to the antenna patterns of the second phase modulator, the first voltage and the second voltage may be independent of each other.

The number of the phase change patterns of the first phase modulator may be the same as the number of the phase change patterns of the second phase modulator.

The spacer of the first phase modulator and the spacer of the second phase modulator may be different portions of one dielectric layer.

A trench may be provided between the first phase modulator and the second phase modulator, wherein the trench may extend along the second direction to expose the guide layer.

A thermal insulation pattern provided in the trench; further including, wherein the thermal insulation pattern may have a lower thermal conductivity than that of the spacer.

In each of the first phase modulator and the second phase modulator, the phase change patterns may be surrounded by the spacer.

In each of the first phase modulator and the second phase modulator, a thickness of a portion of the spacer disposed between the phase-change patterns and the antenna patterns in the second direction may be equal to that of the phase-change patterns and A thickness of another portion of the spacer disposed between the guide layers in the second direction may be thicker.

The present disclosure may provide a phase modulator and a phase modulator array stably maintaining an over-coupling state.

The present disclosure may provide a phase modulator and a phase modulator array having improved light reflection characteristics.

The present disclosure may provide a phase modulator and a phase modulator array having degrees of freedom for a distance between an antenna pattern and a phase-change material pattern.

However, the effect of the invention is not limited to the above disclosure.

1 is a perspective view of a phase modulator according to an exemplary embodiment;
FIG. 2 is a cross-sectional view taken along line II′ of FIG. 1 .
3A is a graph illustrating a real part of a refractive index of the phase change pattern of FIG. 1 .
3B is a graph illustrating an imaginary part of a refractive index of the phase change pattern of FIG. 1 .
4A is a graph illustrating reflectance of a phase modulator according to the phase of the phase change pattern of FIG. 1 .
4B is a graph illustrating a modulation phase of the phase modulator according to the phase of the phase change pattern of FIG. 1 .
5 is a graph illustrating a range of a modulation phase of the phase modulator of FIG. 1 .
6 is a perspective view of a phase modulator according to an exemplary embodiment.
7 is a cross-sectional view taken along line II-II' of FIG. 6 .
8 is a perspective view of a phase modulator array according to an exemplary embodiment.
9 is a perspective view of a phase modulator array according to an exemplary embodiment.
10 is a perspective view of a phase modulator array according to an exemplary embodiment.
11 is a conceptual diagram for explaining a beam steering device according to an exemplary embodiment.
12 is a conceptual diagram for explaining a beam steering device according to an exemplary embodiment.
13 is a block diagram illustrating an electronic device according to an exemplary embodiment.
14 and 15 are conceptual views illustrating a case in which a LiDAR device according to an exemplary embodiment is applied to a vehicle.
16 is a conceptual diagram for explaining a holographic display device according to an exemplary embodiment.
17 is a block diagram showing a schematic configuration of an electronic device according to an exemplary embodiment.
18 is a block diagram illustrating a schematic configuration of a camera module included in the electronic device of FIG. 17 .
19 is a block diagram illustrating a schematic configuration of a 3D sensor provided in the electronic device of FIG. 17 .
20 is a block diagram showing a schematic configuration of an electronic device according to an exemplary embodiment.
21 is a block diagram illustrating a schematic configuration of a gaze tracking sensor provided in the electronic device of FIG. 20 .

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following drawings, the same reference numerals refer to the same components, and the size of each component in the drawings may be exaggerated for clarity and convenience of description. Meanwhile, the embodiments described below are merely exemplary, and various modifications are possible from these embodiments.

Hereinafter, what is referred to as "on" may include those directly over in contact as well as over non-contact.

The singular expression includes the plural expression unless the context clearly dictates otherwise. Also, when a part "includes" a certain component, it means that other components may be further included, rather than excluding other components, unless otherwise stated.

In addition, terms such as “…unit” described in the specification mean a unit that processes at least one function or operation.

1 is a perspective view of a phase modulator according to an exemplary embodiment; FIG. 2 is a cross-sectional view taken along line II′ of FIG. 1 . 3A is a graph illustrating a real part of a refractive index of the phase change pattern of FIG. 1 . 3B is a graph illustrating an imaginary part of a refractive index of the phase change pattern of FIG. 1 . 4A is a graph illustrating reflectance of a phase modulator according to the phase of the phase change pattern of FIG. 1 . 4B is a graph illustrating a modulation phase of the phase modulator according to the phase of the phase change pattern of FIG. 1 . 5 is a graph illustrating an adjustment range of a modulation phase of the phase modulator of FIG. 1 .

1 and 2 , a phase modulator 10 may be provided. The phase modulator 10 may include a guide layer 100 , an antenna pattern 200 , a spacer 300 , a phase change pattern 400 , and a power supply element 500 . The guide layer 100 may extend in a first direction DR1 and a second direction DR2 crossing each other. The guide layer 100 may include an electrically conductive material. For example, the guide layer 100 includes at least one metal selected from the group consisting of Cu, Al, Ni, Fe, Co, Zn, Ti, Ru, Rh, Pd, Pt, Os, Ir, Ag, Au, etc. It may include, and may include an alloy having at least one of them. Alternatively, the guide layer 100 is a thin film in which metal nanoparticles such as Ag and Au are dispersed, a carbon nanostructure such as graphene or CNT (carbon nanotube), PEDOT (poly(3,4-ethylenedioxythiophene)), A conductive polymer such as polypyrrole (PPy) or poly(3-hexylthiophene) (P3HT) may be included, or a conductive oxide may be included. The guide layer 100 may resonate a gap plasmon to be described later in the phase modulator 10 . The guide layer 100 may dissipate heat.

An antenna pattern 200 may be provided on the guide layer 100 . The antenna pattern 200 may be spaced apart from the guide layer 100 by a first distance d1 in a third direction DR3 perpendicular to the first direction DR1 and the second direction DR2 . The antenna pattern 200 may have a first width w1 and a first thickness t1. The first width w1 may be the size of the antenna pattern 200 in the first direction DR1 . The first thickness t1 may be the size of the antenna pattern 200 in the third direction DR3 . The first width w1 and the first thickness t1 may be smaller than the wavelength of the electromagnetic wave incident on the phase modulator 10 . For example, the first width w1 and the first thickness t1 may be tens to hundreds of nanometers (nm). The antenna pattern 200 may have a first side surface 201 facing the first direction DR1 and a second side surface 202 facing a fourth direction DR4 opposite to the first direction DR1 . The antenna pattern 200 may include a conductive material. For example, the antenna pattern 200 includes at least one metal selected from the group consisting of Cu, Al, Ni, Fe, Co, Zn, Ti, Ru, Rh, Pd, Pt, Os, Ir, Ag, Au, etc. may be employed, and may be made of an alloy including at least one of them. Alternatively, the antenna pattern 200 is a thin film in which metal nanoparticles such as Ag and Au are dispersed, a carbon nanostructure such as graphene or CNT (carbon nanotube), PEDOT (poly(3,4-ethylenedioxythiophene)), A conductive polymer such as polypyrrole (PPy) or poly(3-hexylthiophene) (P3HT) may be included, or a conductive oxide may be included. In one example, the antenna pattern 200 may include the same material as the guide layer 100 . The antenna pattern 200 may be configured to receive electromagnetic waves of a required wavelength. The antenna pattern 200 may generate heat by a voltage applied from the power element 500 .

A spacer 300 may be provided between the guide layer 100 and the antenna pattern 200 . The spacer 300 may include a dielectric. For example, the spacer 300 may be formed of a dielectric silicon compound (eg, silicon oxide (SiOx), silicon nitride (SixNy), silicon oxynitride (SiON)) or a dielectric metal compound (eg, aluminum oxide (Al2O3). , hafnium oxide (HfO), zirconium oxide (ZrO), hafnium silicon oxide (HfSiO)).

A first reflection boundary 301 and a second reflection boundary 302 in the spacer 300 may be determined by the antenna pattern 200 . The first reflection boundary 301 may be a boundary where gap plasmons traveling in the first direction DR1 within the spacer 300 are reflected in the fourth direction DR4 . The gap plasmon will be described later. The second reflection boundary 302 may be a boundary where gap plasmons traveling in the fourth direction DR4 within the spacer 300 are reflected in the first direction DR1 . The first reflection boundary 301 may be arranged at a position spaced apart from the first side surface 201 of the antenna pattern 200 in the first direction DR1 . The second reflection boundary 302 may be arranged at a position spaced apart from the second side surface 202 of the antenna pattern 200 in the fourth direction DR4 . In one example, the first reflective boundary 301 and the second reflective boundary 302 are in the width direction of the antenna pattern 200 from the first side 201 and the second side 202 of the antenna pattern 200 , respectively. may be aligned at positions spaced apart by the same distance. The region between the first reflective boundary 301 and the second reflective boundary 302 may be referred to as an effective resonator region. The first reflective boundary 301 and the second reflective boundary 302 may be spaced apart from each other by a second distance d2 in the first direction DR1 . The second distance d2 may be referred to as an effective resonator length. The second distance d2 may be greater than the first width w1.

The guide layer 100 , the spacer 300 , and the antenna pattern 200 may form a gap plasmon resonator having a metal-dielectric-metal (MIM) structure. Gap plasmon is a combination of resonance of photons and electrons resonating inside a dielectric of a metal-dielectric-metal structure. The resonance condition of the gap plasmon resonator including the guide layer 100 , the antenna pattern 200 , and the spacer 300 for generating the gap plasmon may be as follows.

: 입사 전자기파의 파장,

: 안테나 패턴(200)의 길이,

: 갭 플라즈몬에 대한 유효 굴절률,

: 갭 플라즈몬이 제1 반사 경계(301) 및 제2 반사 경계(302)에서 반사될 때 느끼는 위상,

=1)(

: the wavelength of the incident electromagnetic wave,

: the length of the antenna pattern 200;

: effective refractive index for gap plasmons,

: the phase felt when the gap plasmon is reflected from the first reflection boundary 301 and the second reflection boundary 302;

=1)

A phase change pattern 400 may be provided in the spacer 300 . The phase change pattern 400 may be inserted into the spacer 300 . The phase change pattern 400 may be surrounded by the spacer 300 . In other words, the spacers 300 may be provided on the upper surface, the lower surface, and both side surfaces of the phase change pattern 400 . The phase change pattern 400 may overlap the antenna pattern 200 along the third direction DR3 . The phase change pattern 400 may be spaced apart from the guide layer 100 by a third distance d3 in the third direction DR3 . The phase change pattern 400 and the antenna pattern 200 may be spaced apart from each other by a fourth distance d4 along the third direction DR3 . The fourth distance d4 may be greater than the third distance d3. The phase change pattern 400 may be located within the first reflection boundary 301 and the second reflection boundary 302 . The phase change pattern 400 may have a second width w2 and a second thickness t2 . The second width w2 may be the size of the phase change pattern 400 in the first direction DR1 . The second width w2 may be the size of the phase change pattern 400 along the third direction DR3 . The second width w2 may be equal to or larger than the first width w1, but may be equal to or smaller than the second distance d2. The phase change pattern 400 may include a phase change material. For example, the phase change pattern 400 may include GeSbTe or VO ₂ . A phase of the phase change pattern 400 may be changed by heat provided from the antenna pattern 200 .

The power element 500 may be electrically connected to the antenna pattern 200 . The power element 500 may apply an AC voltage to both ends of the antenna pattern 200 . For example, both ends of the antenna pattern 200 may be spaced apart from each other in the second direction DR2 . When the power element 500 applies an AC voltage to the antenna pattern 200 , heat may be generated in the antenna pattern 200 . Heat generated from the antenna pattern 200 may reach the phase change pattern 400 to change the temperature of the phase change pattern 400 . Accordingly, the power element 500 may adjust the temperature of the phase change pattern 400 .

When the antenna pattern 200 generates heat, the temperature of the phase-change pattern 400 may change differently for each part of the phase-change pattern 400 . For example, a portion of the phase-change pattern 400 that is relatively close to the antenna pattern 200 has a relatively fast temperature rise, and another portion of the phase-change pattern 400 that is relatively far from the antenna pattern 200 has a higher temperature. The temperature can rise relatively slowly. The fourth distance d4 may be determined to optimize the phase modulator 10 . For example, the fourth distance d4 may be determined such that, when heat is generated from the antenna pattern 200 , the difference between the maximum temperature and the minimum temperature of the phase change pattern 400 is the lowest. The lowest temperature of the phase change pattern 400 may be about 280 degrees (°C). Since the phase modulator 10 of the present disclosure may adjust the fourth distance d4 using the spacer 300 during manufacturing, it may have a degree of freedom with respect to the fourth distance d4 .

3A and 3B , when the phase change pattern 400 includes GST, the refractive index of the phase change pattern 400 may be determined according to a phase of the phase change pattern 400 . Graphs A1 and C1 of the real part of the refractive index according to the phase of the phase change pattern 400 are shown in FIG. 3A , and the graphs A2 and C2 of the imaginary part of the refractive index are shown in FIG. 3B . The phase of the phase change pattern 400 may be determined according to the temperature of the phase change pattern. For example, it may have an amorphous phase, a crystalline phase, and an intermediate phase thereof depending on the temperature of the phase change pattern 400 . A real part graph A1 of the refractive index of the phase change pattern 400 having an amorphous phase and a real part graph C1 of the refractive index of the phase change pattern 400 having a crystalline phase are shown in FIG. 3A . The imaginary part graph A2 of the refractive index of the phase change pattern 400 having an amorphous phase and the imaginary part graph C2 of the refractive index of the phase change pattern 400 having the crystalline phase are illustrated in FIG. 3B . The real part and the imaginary part of the refractive index of the phase change pattern 400 having an intermediate phase are the values between the real parts and the imaginary parts of the refractive index of the phase change pattern 400 having an amorphous phase and the phase change pattern 400 having a crystalline phase can have

The difference in the real part of the refractive index according to the phase of the phase change pattern 400 may be related to the degree of movement along the wavelength axis of the phase modulation profile according to the wavelength of the phase modulator 10 . The larger the real part of the refractive index, the more the phase modulation profile of the phase modulator can shift along the wavelength axis. For example, as shown in FIG. 3A , when the phase change pattern 400 includes GST, the difference in the real part of the refractive index in the mid-infrared wavelength band (about 1550 nanometer (nm) band) is 1 to 1.1 days can Referring to FIG. 4B , the phase modulation profile C4 when the phase change pattern 400 has a crystalline phase moves along the wavelength axis from the phase modulation profile A4 when the phase change pattern 400 has an amorphous phase it may have been In other words, if the phase modulation profile A4 when the phase change pattern 400 has an amorphous phase in FIG. 4B moves to the right along the wavelength axis, the phase modulation profile when the phase change pattern 400 has an amorphous phase ( C4) can be Referring to FIG. 5 , the phase modulator 10 of the present disclosure may modulate a phase in a range of about 260 degrees (°) in a mid-infrared wavelength band. Accordingly, the present disclosure can provide the phase modulator 10 having a large phase modulation width.

The size of the imaginary part of the refractive index according to the phase of the phase change pattern 400 may be related to the light absorptivity of the phase change pattern 400 . As the imaginary part of the refractive index is smaller, the light absorptivity of the phase change pattern 400 may also be smaller. For example, as illustrated in FIG. 3B , the imaginary part of the refractive index of the phase change pattern 400 may be about 0.1 in the amorphous phase and about 0.5 to 2 in the crystalline phase, and may have a small value.

The phase change pattern 400 of the present disclosure may be surrounded by the spacer 300 . Since the spacer 300 includes a dielectric, the imaginary part of the refractive index may be smaller than the imaginary part of the refractive index of the phase change pattern 400 . Accordingly, the imaginary part of the refractive index between the guide layer 100 and the antenna pattern 200 may have a small value. Referring to FIG. 4A , a reflectance graph A3 when the phase change pattern 400 has an amorphous phase and a reflectance graph C3 when the phase change pattern 400 has an amorphous phase are illustrated. The phase modulator 10 of the present disclosure may have a high reflectance of 40% or more in a mid-infrared wavelength band (about 1550 nanometers (nm) band). In other words, the phase modulator 10 of the present disclosure may have a low light absorptivity.

In the phase modulator 10 , a photon and an electron may have an over-coupling state. In this case, the phase modulation profile of the phase modulator 10 may be gradually changed in a range of about 360 degrees (°). When the photon and the electron have an under-coupling state rather than an over-coupling state, the maximum phase difference may be about 180°. As the light absorption rate of the phase modulator 10 is lower, the over-coupling state of photons and electrons in the phase modulator 10 may be stably maintained. Since the present disclosure uses the phase change pattern 400 with a small imaginary part of the refractive index and the spacer 300 surrounding the phase change pattern 400 , the light absorption rate of the phase modulator 10 can be reduced. Accordingly, photons and electrons in the phase modulator 10 may stably have an over-coupling state.

6 is a perspective view of a phase modulator according to an exemplary embodiment. 7 is a cross-sectional view taken along line II-II' of FIG. 6 . For brevity of description, contents substantially the same as those described with reference to FIGS. 1 and 2 may not be described.

6 and 7 , the guide layer 100 , the antenna patterns 200 , the spacer 300 , the phase change patterns 400 , and the power supply element 500 may be provided. Guide layer 100 , spacer 300 , and power element 500 may be substantially the same as described with reference to FIGS. 1 and 2 .

The antenna patterns 200 may be provided on the spacer 300 . Each of the antenna patterns 200 may be substantially the same as the antenna pattern 200 described with reference to FIGS. 1 and 2 . The antenna patterns 200 may be arranged along the first direction DR1 . For example, the antenna patterns 200 may be arranged at a constant period ap. The antenna patterns 200 may have substantially the same shape and size. Accordingly, the surface plasmon resonators each including the antenna patterns 200 may receive electromagnetic waves of substantially the same wavelength to form gap plasmons. The same AC voltages may be applied to the antenna patterns 200 . Accordingly, the antenna patterns 200 may generate the same level of heat.

The phase change patterns 400 may be provided in the spacer 300 . Each of the phase change patterns 400 may be substantially the same as the phase change pattern 400 described with reference to FIGS. 1 and 2 . The phase change patterns 400 may be arranged along the first direction DR1 . For example, the phase change patterns 400 may be arranged at a constant period. The phase change patterns 400 may overlap the antenna patterns 200 along the third direction DR3, respectively. The phase change patterns 400 may be respectively disposed between the first reflection boundaries 301 and the second reflection boundaries 302 corresponding to the antenna patterns 200 . The third distances ( d3 of FIG. 2 ) and the fourth distances ( d4 of FIG. 2 ) may be substantially the same for each of the phase change patterns 400 . Since the antenna patterns 200 generate the same level of heat and the fourth distances (d4 of FIG. 2 ) are the same, the temperature change of the phase change patterns 400 may be the same.

8 is a perspective view of a phase modulator array according to an exemplary embodiment. For brevity of description, contents substantially the same as those described with reference to FIGS. 6 and 7 may not be described.

Referring to FIG. 8 , a phase modulator array 12 may be provided. The phase modulator array 12 may include the phase modulators 10 arranged in two dimensions. For example, the phase modulator array 12 may include phase modulators 12a arranged in a first direction DR1 and phase modulators 12a arranged in a second direction DR2 therefrom, respectively. . Each of the phase modulators 12a may be substantially the same as the phase modulator 11 described with reference to FIGS. 6 and 7 . The guide layers 100 and the spacers 300 of the phase modulators 12a may be connected to each other. In other words, the guide layers 100 may be different portions of one guide layer 100 , and the spacers 300 may be different portions of one spacer 300 . AC voltages may be applied to the phase modulators 12a by mutually independent power supply elements (not shown). Each of the power elements may be substantially the same as the power element 500 of FIGS. 1 and 6 shown in FIG. 1 or FIG. 6 . The alternating voltages may be independent of each other. For example, a first AC voltage may be applied to one of the phase modulators 12a, and a second AC voltage equal to or different from the first AC voltage may be applied to the other phase modulator 12a.

Each of the phase modulators 12a may include sub-phase modulators 12a. Each of the sub-phase modulators 12a may be substantially the same as the phase modulator 12a described with reference to FIGS. 1 and 2 . The AC voltage applied to each of the phase modulators 12a may be applied to the antenna patterns 200 of the sub-phase modulators 12a included in the phase modulator 12a. The antenna patterns 200 of the sub-phase modulators 12a included in one phase modulator 12a may generate heat at the same level. The phase modulators 12a may have optical modulation characteristics independent of each other.

The phase modulator array 12 is not limited to including the phase modulators 12a arranged in two dimensions. In another example, the phase modulator array 12 may include the phase modulators 12a arranged in one dimension (eg, arranged in the first direction DR1 or the second direction DR2 ).

9 is a perspective view of a phase modulator array according to an exemplary embodiment. For brevity of description, contents substantially the same as those described with reference to FIG. 8 may not be described.

Referring to FIG. 9 , a phase modulator array 13 may be provided. The phase modulator array 13 may include phase modulators 13a arranged in two dimensions. Unlike described with reference to FIG. 8 , trenches TR may be provided between the spacers 300 of the phase modulators 13a. The trenches TR may separate the spacers 300 from each other. The trenches TR may extend in the first direction DR1 and the second direction DR2 between the spacers 300 . The trenches TR may be connected to each other. The trenches TR may expose the guide layer 100 . The trenches TR may be filled with air. Since air has a lower thermal conductivity than the spacer, the adjacent phase modulators 13a may be thermally isolated from each other. In other words, heat generated from the antenna patterns 200 in one phase modulator 13a affects the phase change patterns 400 in another phase modulator 13a adjacent to the one phase modulator 13a. impact can be reduced or prevented.

The phase modulator array 13 is not limited to including the phase modulators 13a arranged in two dimensions. In another example, the phase modulator array 13 may include the phase modulators 13a arranged in one dimension (eg, arranged in the first direction DR1 or the second direction DR2 ).

10 is a perspective view of a phase modulator array according to an exemplary embodiment. For brevity of description, contents substantially the same as those described with reference to FIG. 9 may not be described.

Referring to FIG. 10 , a phase modulator array 14 may be provided. The phase modulator array 14 may include two-dimensionally arranged phase modulators 14a. Unlike described with reference to FIG. 9 , heat insulation patterns 14b may be provided in the trenches TR. For example, the heat insulation patterns 14b may fill the trenches TR. The heat insulation patterns 14b may extend in the first direction DR1 and the second direction DR2 to be connected to each other. The heat insulating patterns 14b may include a dielectric material having lower thermal conductivity than the spacers 300 . For example, when the spacers 300 _{include Al 2} O ₃ , the heat insulation patterns 14b may include amorphous SiO2 having lower thermal conductivity than _{Al 2} O _{3 .} Accordingly, the adjacent phase modulators 14a may be thermally isolated from each other. In other words, heat generated from the antenna patterns 200 in one phase modulator 14a affects the phase change patterns 400 in another phase modulator 14a adjacent to the one phase modulator 14a. impact can be reduced or prevented.

The phase modulator array 14 is not limited to including the phase modulators 14a arranged in two dimensions. In another example, the phase modulator array 14 may include phase modulators 14a arranged in one dimension (eg, arranged in a first direction DR1 or a second direction DR2 ).

11 is a conceptual diagram for explaining a beam steering device according to an exemplary embodiment.

Referring to FIG. 11 , a beam steering apparatus 1000A may be provided. The beam steering apparatus 1000A may be a non-mechanical beam scanning apparatus. A beam may be steered in a one-dimensional direction using the beam steering apparatus 1000A. The beam steering apparatus 1000A may steer the beam toward the subject OBJ along the first adjustment direction DD1 . The beam steering apparatus 1000A may include one of the one-dimensionally arranged phase modulator arrays 12 , 13 , and 14 described with reference to FIGS. 10 to 12 .

12 is a conceptual diagram for explaining a beam steering device 1000B according to an exemplary embodiment.

Referring to FIG. 12 , a beam steering apparatus 1000B may be provided. The beam steering apparatus 1000B may be a non-mechanical beam scanning apparatus. A beam may be steered in a two-dimensional direction using the beam steering apparatus 1000B. In other words, the beam steering apparatus 1000B may steer the beam toward the subject OBJ along the first adjustment direction DD1 and the second adjustment direction DD2 intersecting the first adjustment direction DD1. The beam steering apparatus 1000A may include one of the two-dimensionally arranged phase modulator arrays 12 , 13 , and 14 described with reference to FIGS. 10 to 12 .

13 is a block diagram illustrating an electronic device according to an exemplary embodiment.

Referring to FIG. 13 , an electronic device A1 may be provided. The electronic device A1 may include the beam steering device 1000 . The beam steering apparatus 1000 may be substantially the same as the beam steering apparatuses 1000A and 1000B illustrated in FIGS. 13 and 14 . The electronic device A1 may include a light source unit in the beam steering apparatus 1000 or a light source unit provided separately from the beam steering apparatus 1000 .

The electronic device A1 may include a detection unit 1100 for detecting light steered by the beam steering apparatus 1000 reflected by a subject (not shown). The detection unit 1100 may include a plurality of light detection elements, and may further include other optical members. Also, the electronic device A1 may further include a circuit unit 1200 connected to at least one of the beam steering apparatus 1000 and the detection unit 1100 . The circuit unit 1200 may include an arithmetic unit that obtains and calculates data, and may further include a driving unit and a control unit. Also, the circuit unit 1200 may further include a power supply unit, a memory, and the like.

13 illustrates a case in which the electronic device A1 includes the beam steering device 1000 and the detector 1100 in one device, but the beam steering device 1000 and the detector 1100 are not provided as one device. Instead, it may be provided separately in a separate device. In addition, the circuit unit 1200 may be connected to the beam steering apparatus 1000 or the detection unit 1100 through wireless communication rather than by wire. In addition, the configuration of FIG. 15 may be variously changed.

The beam steering apparatus according to the above-described embodiment may be applied to various electronic devices. For example, the beam steering apparatus may be applied to a LiDAR (Light Detection And Ranging, LiDAR) apparatus. The LiDAR device may be a phase-shift device or a time-of-flight (TOF) device. In addition, the phase modulator or the beam steering device including the same according to the embodiment is a smart phone, a wearable device (such as augmented reality and virtual reality glasses-type device), an Internet of Things (IoT) device, a home appliance, a tablet PC (Personal Computer), PDA (Personal Digital Assistant), PMP (portable multimedia player), navigation, drone, robot, driverless vehicle, autonomous vehicle, advanced driver assistance system (ADAS) It may be mounted on an electronic device, such as.

14 and 15 are conceptual views illustrating a case in which a LiDAR device according to an exemplary embodiment is applied to a vehicle.

14 and 15 , the LiDAR device 51 may be applied to the vehicle 50 , and information on the subject 60 may be obtained using the LiDAR device 51 . The vehicle 50 may be a vehicle having an autonomous driving function. The LiDAR device 51 may detect an object or person in a direction in which the vehicle 50 travels, that is, the subject 60 . The LiDAR device 51 may measure the distance to the subject 60 using information such as a time difference between the transmission signal and the detection signal. As illustrated in FIG. 15 , the LiDAR device 51 may acquire information about a nearby subject 61 and a distant subject 62 within a scan range.

16 is a conceptual diagram for explaining a holographic display device according to an exemplary embodiment.

Referring to FIG. 16 , a holographic display device 70 may be provided. The holographic display device 70 may include a backlight unit 71 , a Fourier lens 72 , a phase modulation device 73 , and an image processor 74 . The phase modulation device 73 may include a plurality of two-dimensionally arranged pixels. The phase modulation device 73 may include any one of the phase modulation arrays 12 , 13 , and 14 illustrated in FIGS. 8 to 10 . In an example, the phase modulators 12a , 13a , and 14a included in the phase modulation arrays 12 , 13 and 14 may correspond to pixels of the phase modulation device 73 , respectively. In another example, the phase modulators 12a , 13a , 14a included in the phase modulation arrays 12 , 13 and 14 are classified into phase modulator groups, and the phase modulator groups are the pixels of the phase modulation device 73 . may correspond to each. Each of the phase modulator groups may include phase modulators adjacent to each other.

The image processor 74 may be connected to the phase modulator 73 by wire or wirelessly. The phase modulator 73 may receive a hologram data signal from the image processor 74 . The phase modulator 73 may control the phase of light according to the hologram data signal from the image processor 74 .

The backlight unit 71 may emit coherent light. For example, the backlight unit 71 may include a laser diode to provide light having high coherence. In addition to the laser diode, the backlight unit 71 may include any other light source as long as it emits light having spatial coherence. Also, although not shown, the backlight unit 71 may further include an optical system for generating collimated parallel light having a uniform intensity distribution by magnifying light emitted from the laser diode. Accordingly, the backlight unit 71 may provide parallel coherent light having a spatially uniform intensity distribution to the entire area of the phase modulation device 73 .

The Fourier lens 72 may focus a holographic image or image in space. For example, a holographic image is reproduced on a focal plane of the Fourier lens 72 , and the user's eye E is disposed on the focal plane to view the holographic image. Although the Fourier lens 72 is shown to be disposed on the light incident surface of the phase modulation device 73, that is, between the backlight unit 71 and the phase modulation device 73, the position of the Fourier lens 72 is limited to this. it is not going to be For example, the Fourier lens 72 may be disposed on the light exit surface of the phase modulation device 73 .

17 is a block diagram showing a schematic configuration of an electronic device according to an exemplary embodiment.

Referring to FIG. 17 , in a network environment 2200 , an electronic device 2201 communicates with another electronic device 2202 through a first network 2298 (such as a short-range wireless communication network) or a second network 2299 . It may communicate with another electronic device 2204 and/or the server 2208 via (a long-distance wireless communication network, etc.). The electronic device 2201 may communicate with the electronic device 2204 through the server 2208 . The electronic device 2201 includes a processor 2220 , a memory 2230 , an input device 2250 , an audio output device 2255 , a display device 2260 , an audio module 2270 , a sensor module 2210 , and an interface 2277 . ), a haptic module 2279 , a camera module 2280 , a power management module 2288 , a battery 2289 , a communication module 2290 , a subscriber identification module 2296 , and/or an antenna module 2297 . can In the electronic device 2201 , some of these components (eg, the display device 2260 ) may be omitted or other components may be added. Some of these components may be implemented as one integrated circuit. For example, the fingerprint sensor 2211 of the sensor module 2210, an iris sensor, or an illuminance sensor may be implemented by being embedded in the display device 2260 (display, etc.).

The processor 2220 may control one or a plurality of other components (hardware, software components, etc.) of the electronic device 2201 by executing software (eg, a program 2240 ), and may process or operate various data can be performed. As part of data processing or computation, the processor 2220 loads commands and/or data received from other components (sensor module 2210, communication module 2290, etc.) into the volatile memory 2232, and It may process commands and/or data stored in 2232 , and store the resulting data in non-volatile memory 2234 . The processor 2220 includes a main processor 2221 (central processing unit, application processor, etc.) and a secondary processor 2223 (graphic processing unit, image signal processor, sensor hub processor, communication processor, etc.) that can be operated independently or together therewith. may include The auxiliary processor 2223 may use less power than the main processor 2221 and may perform a specialized function.

The secondary processor 2223 is configured to replace the main processor 2221 while the main processor 2221 is in the inactive state (sleep state), or to the main processor 2221 while the main processor 2221 is in the active state (the application execution state). Together with the processor 2221 , functions and/or states related to some of the components of the electronic device 2201 (display device 2260 , sensor module 2210 , communication module 2290 , etc.) may be controlled. can The auxiliary processor 2223 (image signal processor, communication processor, etc.) may be implemented as a part of other functionally related components (camera module 2280, communication module 2290, etc.).

The memory 2230 may store various data required by components of the electronic device 2201 (the processor 2220 , the sensor module 2276 , etc.). Data may include, for example, input data and/or output data for software (such as program 2240) and instructions related thereto. The memory 2230 may include a volatile memory 2232 and/or a non-volatile memory 2234 .

The program 2240 may be stored as software in the memory 2230 , and may include an operating system 2242 , middleware 2244 , and/or applications 2246 .

The input device 2250 may receive commands and/or data to be used in a component (eg, the processor 2220 ) of the electronic device 2201 from an external (eg, a user) of the electronic device 2201 . The input device 2250 may include a microphone, a mouse, a keyboard, and/or a digital pen (such as a stylus pen).

The sound output device 2255 may output a sound signal to the outside of the electronic device 2201 . The sound output device 2255 may include a speaker and/or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call. The receiver may be integrated as a part of the speaker or may be implemented as an independent separate device.

The display device 2260 may visually provide information to the outside of the electronic device 2201 . The display device 2260 may include a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. The display device 2260 may include a touch circuitry configured to sense a touch, and/or a sensor circuitry configured to measure the intensity of force generated by the touch (such as a pressure sensor).

The audio module 2270 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. The audio module 2270 obtains a sound through the input device 2250 or other electronic device (such as the electronic device 2102 ) directly or wirelessly connected to the sound output device 2255 and/or the electronic device 2201 . ) through the speaker and/or headphones.

The sensor module 2210 detects an operating state (power, temperature, etc.) of the electronic device 2201 or an external environmental state (user state, etc.), and generates an electrical signal and/or data value corresponding to the sensed state. can do. The sensor module 2210 may include a fingerprint sensor 2211 , an acceleration sensor 2212 , a position sensor 2213 , a 3D sensor 2214 , and the like, in addition to an iris sensor, a gyro sensor, a barometric pressure sensor, and a magnetic sensor. , a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and/or an illuminance sensor.

The 3D sensor 2214 irradiates a predetermined light to the object and analyzes the light reflected from the object to sense the shape and movement of the object, and may include any one of the phase modulators according to the above-described embodiments. have.

The interface 2277 may support one or more designated protocols that may be used by the electronic device 2201 to directly or wirelessly connect with another electronic device (such as the electronic device 2102 ). The interface 2277 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and/or an audio interface.

The connection terminal 2278 may include a connector through which the electronic device 2201 may be physically connected to another electronic device (eg, the electronic device 2102 ). The connection terminal 2278 may include an HDMI connector, a USB connector, an SD card connector, and/or an audio connector (such as a headphone connector).

The haptic module 2279 may convert an electrical signal into a mechanical stimulus (vibration, movement, etc.) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. The haptic module 2279 may include a motor, a piezoelectric element, and/or an electrical stimulation device.

The camera module 2280 may capture still images and moving images. The camera module 2280 may include a lens assembly including one or more lenses, image sensors, image signal processors, and/or flashes. The lens assembly included in the camera module 2280 may collect light emitted from a subject, which is an image capturing object, and the lens assembly may include any one of the phase modulators according to the above-described embodiments.

The power management module 2288 may manage power supplied to the electronic device 2201 . The power management module 2288 may be implemented as part of a Power Management Integrated Circuit (PMIC).

The battery 2289 may supply power to components of the electronic device 2201 . Battery 2289 may include a non-rechargeable primary cell, a rechargeable secondary cell, and/or a fuel cell.

Communication module 2290 establishes a direct (wired) communication channel and/or wireless communication channel between the electronic device 2201 and other electronic devices (electronic device 2102, electronic device 2104, server 2108, etc.); and performing communication through an established communication channel. The communication module 2290 may include one or more communication processors that operate independently of the processor 2220 (such as an application processor) and support direct communication and/or wireless communication. The communication module 2290 may include a wireless communication module 2292 (a cellular communication module, a short-range wireless communication module, a Global Navigation Satellite System (GNSS, etc.) communication module) and/or a wired communication module 2294 (Local Area Network (LAN) communication). module, power line communication module, etc.). Among these communication modules, the corresponding communication module may be a first network 2298 (a short-range communication network such as Bluetooth, WiFi Direct, or Infrared Data Association (IrDA)) or a second network 2299 (a cellular network, the Internet, or a computer network (LAN). , WAN, etc.) through a telecommunication network) and may communicate with other electronic devices. These various types of communication modules may be integrated into one component (single chip, etc.) or implemented as a plurality of components (plural chips) separate from each other. The wireless communication module 2292 may use subscriber information stored in the subscriber identification module 2296 (such as an International Mobile Subscriber Identifier (IMSI)) within a communication network, such as the first network 2298 and/or the second network 2299 . may identify and authenticate the electronic device 2201 .

The antenna module 2297 may transmit or receive signals and/or power to the outside (eg, other electronic devices). The antenna may include a radiator having a conductive pattern formed on a substrate (PCB, etc.). The antenna module 2297 may include one or a plurality of antennas. When a plurality of antennas are included, an antenna suitable for a communication method used in a communication network such as the first network 2298 and/or the second network 2299 is selected from among the plurality of antennas by the communication module 2290 . can Signals and/or power may be transmitted or received between the communication module 2290 and another electronic device through the selected antenna. In addition to the antenna, other components (such as RFIC) may be included as part of the antenna module 2297 .

Some of the components are connected to each other through communication methods between peripheral devices (bus, GPIO (General Purpose Input and Output), SPI (Serial Peripheral Interface), MIPI (Mobile Industry Processor Interface), etc.) and signals (commands, data, etc.) ) are interchangeable.

The command or data may be transmitted or received between the electronic device 2201 and the external electronic device 2204 through the server 2108 connected to the second network 2299 . The other electronic devices 2202 and 2204 may be the same or different types of devices as the electronic device 2201 . All or some of the operations executed in the electronic device 2201 may be executed in one or more of the other electronic devices 2202 , 2204 , and 2208 . For example, when the electronic device 2201 needs to perform a function or service, it requests one or more other electronic devices to perform part or all of the function or service instead of executing the function or service itself. can One or more other electronic devices that have received the request may execute an additional function or service related to the request, and transmit a result of the execution to the electronic device 2201 . To this end, cloud computing, distributed computing, and/or client-server computing technologies may be used.

18 is a block diagram illustrating a schematic configuration of a camera module included in the electronic device of FIG. 17 .

Referring to FIG. 18 , the camera module 2280 includes a lens assembly 2310 , a flash 2320 , an image sensor 2330 , an image stabilizer 2340 , a memory 2350 (such as a buffer memory), and/or an image signal. A processor 2360 may be included. The lens assembly 2310 may collect light emitted from a subject, which is an image capturing object, and may include any one of the above-described phase modulators. The lens assembly 2310 may include one or more refractive lenses and a phase modulator. The phase modulator provided therein may be designed as a lens having a predetermined phase profile and a compensation structure to reduce phase discontinuity. The lens assembly 2310 having such a phase modulator may realize a desired optical performance and have a short optical length.

The camera module 2280 may further include an actuator. The actuator may drive a position of lens elements constituting the lens assembly 2310 for zooming and/or autofocus (AF) and may adjust a separation distance between the lens elements, for example.

The camera module 2280 may include a plurality of lens assemblies 2310 . In this case, the camera module 2280 may be a dual camera, a 360 degree camera, or a spherical camera. Some of the plurality of lens assemblies 2310 may have the same lens property (angle of view, focal length, auto focus, F number, optical zoom, etc.) or may have different lens properties. The lens assembly 2310 may include a wide-angle lens or a telephoto lens.

The flash 2320 may emit light used to enhance light emitted or reflected from the subject. The flash 2320 may include one or more light emitting diodes (RGB (Red-Green-Blue) LED, White LED, Infrared LED, Ultraviolet LED, etc.), and/or a Xenon Lamp. The image sensor 2330 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 2310 into an electrical signal. The image sensor 2330 may include one or a plurality of sensors selected from image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor. Each of the sensors included in the image sensor 2330 may be implemented as a CCD (Charged Coupled Device) sensor and/or a CMOS (Complementary Metal Oxide Semiconductor) sensor.

In response to the movement of the camera module 2280 or the electronic device 2301 including the same, the image stabilizer 2340 moves one or a plurality of lenses or image sensors 2330 included in the lens assembly 2310 in a specific direction. Alternatively, the negative influence due to movement may be compensated for by controlling the operating characteristics of the image sensor 2330 (adjustment of read-out timing, etc.). The image stabilizer 2340 detects the movement of the camera module 2280 or the electronic device 2301 using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 2280. can The image stabilizer 2340 may be implemented optically.

The memory 2350 may store some or all data of an image acquired through the image sensor 2330 for a next image processing operation. For example, when a plurality of images are acquired at high speed, the acquired original data (Bayer-Patterned data, high-resolution data, etc.) is stored in the memory 2350, only the low-resolution image is displayed, and then selected (user selection, etc.) It may be used to cause the original data of the image to be transmitted to the image signal processor 2360 . The memory 2350 may be integrated into the memory 2230 of the electronic device 2201 or may be configured as a separate memory operated independently.

The image signal processor 2360 may perform one or more image processing on an image acquired through the image sensor 2330 or image data stored in the memory 2350 . One or more image processing may be performed by generating a depth map, 3D modeling, creating a panorama, extracting feature points, synthesizing an image, and/or compensating an image (noise reduction, resolution adjustment, brightness adjustment, blurring), sharpening ( sharpening), softening (Softening, etc.) may be included. The image signal processor 2360 may perform control (exposure time control, readout timing control, etc.) on components (such as the image sensor 2330 ) included in the camera module 2280 . The image processed by the image signal processor 2360 is stored back in the memory 2350 for further processing or external components of the camera module 2280 (memory 2230, display device 2260, electronic device 2202) , the electronic device 2204 , the server 2208 , etc.). The image signal processor 2360 may be integrated into the processor 2220 or configured as a separate processor operated independently of the processor 2220 . When the image signal processor 2360 is configured as a processor 2220 and a separate processor, the image processed by the image signal processor 2360 is subjected to additional image processing by the processor 2220 and then displayed on the display device 2260 . can be displayed through

The electronic device 2201 may include a plurality of camera modules 2280 each having different properties or functions. In this case, one of the plurality of camera modules 2280 may be a wide-angle camera, and the other may be a telephoto camera. Similarly, one of the plurality of camera modules 2280 may be a front camera and the other may be a rear camera.

19 is a block diagram illustrating a schematic configuration of a 3D sensor provided in the electronic device of FIG. 17 .

Referring to FIG. 19 , the 3D sensor 2214 senses the shape, movement, etc. of the object by irradiating a predetermined light to the object and receiving and analyzing the light reflected from the object. The 3D sensor 2214 includes a light source 2420 , a phase modulator 2410 , a light detector 2430 , a signal processor 2440 , and a memory 2450 . Any one of the phase modulators according to the above-described embodiments may be employed as the phase modulator 2410 , and a target phase delay profile may be set to function as a beam deflector or a beam shaper.

The light source 2420 irradiates light to be used to analyze the shape or position of the object. The light source 2420 may include a light source that generates and irradiates light of a small wavelength. The light source 2420 is a laser diode (LD), light emitting diode (LED), or super luminescent diode (SLD) that generates and irradiates light of a wavelength band suitable for analyzing the position and shape of an object, for example, light of an infrared band wavelength. It may include a light source, such as. The light source 2420 may be a tunable laser diode. The light source 2420 may generate and irradiate light of a plurality of different wavelength bands. The light source 2420 may generate and irradiate pulsed light or continuous light.

The phase modulator 2410 modulates the light irradiated from the light source 2420 and transmits the modulated light to the object. When the phase modulator 2410 is a beam deflector, the phase modulator 2410 may deflect incident light in a predetermined direction to direct it toward the object. When the phase modulator 2410 is a beam shaper, the phase modulator 2410 modulates the incident light so that the incident light has a distribution having a predetermined pattern. The phase modulator 2410 may form structured light suitable for 3D shape analysis.

/∂λ)을 0 또는 양수, 음수로 설정하고, 연속적인 위상 지연 프로파일을 구현할 수 있다. 따라서, 파장에 따른 편차가 없는(achromatic) 광 변조를 수행할 수 있다. 또는 반대로, 파장에 따른 편차가 강화되게 하여, 파장별로 편향 방향을 달리하거나, 파장별로 다른 빔 패턴을 형성하여 대상체에 조사할 수도 있다. The phase modulator 2410, as described above, the phase delay dispersion (∂

/∂λ) can be set to 0 or a positive or negative number, and a continuous phase delay profile can be implemented. Accordingly, it is possible to perform achromatic light modulation according to wavelength. Or, conversely, the deviation according to the wavelength may be strengthened, so that the deflection direction may be changed for each wavelength, or a different beam pattern may be formed for each wavelength and irradiated to the object.

The photodetector 2430 receives the reflected light of the light irradiated to the object via the phase modulator 2410 . The photodetector 24430 may include an array of a plurality of sensors for sensing light, or may consist of only one sensor.

The signal processing unit 2440 may process the signal sensed by the photodetector 2430 to analyze the shape of the object. The signal processing unit 2440 may analyze a 3D shape including the depth position of the object.

For the 3D shape analysis, an operation for measuring the optical time of flight may be performed. Various arithmetic methods can be used for optical time-of-flight measurement. For example, in the direct time measurement method, a distance is obtained by projecting pulsed light onto an object and measuring the time it takes for the light to return after being reflected by the object with a timer. In the correlation method, a pulsed light is projected onto an object, and a distance is measured from the brightness of the reflected light reflected from the object. The phase delay measurement method is a method of projecting continuous wave light, such as a sine wave, onto an object, detecting the phase difference of the reflected light and converting it into a distance.

When the structured light is irradiated to the object, the depth position of the object may be calculated based on a change in the pattern of the structured light reflected from the object, that is, a result of comparison with the incident structured light pattern. Depth information of the object may be extracted by tracking the pattern change for each coordinate of structured light reflected from the object, and 3D information related to the shape and movement of the object may be extracted therefrom.

The memory 2450 may store programs and other data necessary for the operation of the signal processing unit 2440 .

The operation result of the signal processing unit 2440 , that is, information on the shape and position of the object may be transmitted to another unit in the electronic device 2200 or to another electronic device. For example, this information may be used by the application 2246 stored in the memory 2230 . Another electronic device to which the result is transmitted may be a display device or a printer that outputs the result. In addition, autonomous driving devices such as unmanned vehicles, autonomous vehicles, robots, drones, etc., smart phones, smart watches, mobile phones, personal digital assistants (PDAs), laptops, PCs, and various wearable devices (wearable) devices, other mobile or non-mobile computing devices, and Internet of Things devices.

20 is a block diagram showing a schematic configuration of an electronic device according to an exemplary embodiment.

Referring to FIG. 20 , an electronic device 3000 may be provided. The electronic device 3000 may be an augmented reality (AR) device. For example, the electronic device 3000 may be a glasses-type augmented reality device. The electronic device 3000 includes a display engine 3400 , a processor 3300 , an eye tracking sensor 3100 , an interface 3500 , and a memory 3220 .

The processor 3300 may control the overall operation of the augmented reality device including the display engine 3400 by driving an operating system or an application program, and may perform various data processing and operations including image data. For example, the processor 3300 may process image data including a left-eye virtual image and a right-eye virtual image rendered to have binocular disparity.

The interface 3500 is an input/output of data or operation commands from the outside, and may include, for example, a user interface such as a touch pad, a controller, and an operation button that can be operated by a user. The interface 3500 may include a wired communication module such as a USB module or a wireless communication module such as Bluetooth, and may receive user manipulation information or virtual image data transmitted from an interface included in an external device through these.

The memory 3200 may include an embedded memory such as a volatile memory or a non-volatile memory. The memory 3200 may store various data, programs, or applications for driving and controlling the augmented reality device under the control of the processor 3300 , and data of input/output signals or virtual images.

The display engine 3400 is configured to receive image data generated by the processor 3300 to generate light of a virtual image, and includes a left eye optical engine 3410 and a right eye optical engine 3420 . Each of the left eye optical engine 3410 and the right eye optical engine 3420 includes a light source that outputs light and a display panel that forms a virtual image using the light output from the light source, and has a function like a small projector. The light source may be implemented as, for example, an LED, and the display panel may be implemented as, for example, LCoS (Liquid Crystal on Silicon).

The eye tracking sensor 3100 may be mounted at a position where the pupil of the user wearing the augmented reality device can be tracked, and may transmit a signal corresponding to the user's gaze information to the processor 3100 . Such a gaze tracking sensor 3100 may detect gaze information such as a gaze direction toward which the user's eye is directed, a pupil position of the user's eye, or coordinates of a central point of the pupil. The processor 3300 may determine an eye movement type based on the user's gaze information detected by the gaze tracking sensor 3100 . For example, based on the gaze information obtained from the gaze tracking sensor, the processor 3300 may perform a fixation of gazing at a certain place, a pursuit of chasing a moving object, and a rapid movement from one gaze point to another gaze point. It is possible to determine various types of gaze movements, including a saccade in which the gaze moves.

21 is a block diagram illustrating a schematic configuration of a gaze tracking sensor provided in the electronic device of FIG. 20 .

The eye tracking sensor 3100 includes an illumination optical unit 3110 , a detection optical unit 3120 , a signal processing unit 3150 , and a memory 3160 . The illumination optical unit 3110 may include a light source that irradiates light, for example, infrared light, to the position of the object (user's eye). The detection optical unit 3150 detects the reflected light, and may include a meta lens 3130 and a sensor unit 3140 . The signal processing unit 3150 calculates the pupil position of the user's eye from the result sensed by the detection optical unit 3120 .

As the meta lens 3130, any one, combination, or modified example of the phase modulators and the phase modulator arrays according to the above-described embodiments may be used. The meta lens 3130 may focus the light from the object on the sensor unit 3140 . An incident angle of light incident on the sensor unit 3140 from the eye tracking sensor 3100 positioned very close to the user's eye may be, for example, 30 degrees or more, or more. The meta lens 3130 has a structure having a compensation area, and the efficiency degradation is reduced even for light having a large incident angle. Accordingly, the accuracy of eye tracking may be increased.

The electronic device may be used not only as an augmented reality (AR) but also as a virtual reality (VR) device, so that it may be possible to track a user's gaze on a virtual reality image provided from the device.

The above description of embodiments of the technical idea of the present disclosure provides examples for the description of the technical idea of the present disclosure. Therefore, the technical spirit of the present disclosure is not limited to the above embodiments, and within the technical spirit of the present disclosure, a person skilled in the art may perform various modifications and changes such as combining the above embodiments. It is clear that this is possible.

Claims (20)

antenna pattern;
a guide layer spaced apart from the antenna pattern in a first direction;
a spacer provided between the antenna pattern and the guide layer; and
A phase change pattern inserted into the spacer; including,
The phase change pattern includes a phase change material. The method of claim 1,
The phase change pattern is surrounded by the spacer. The method of claim 1,
A thickness of a portion of the spacer disposed between the phase-change pattern and the antenna pattern in the first direction may correspond to the first direction of another portion of the spacer disposed between the phase-change pattern and the guide layer. A phase modulator thicker than the thickness it follows. The method of claim 1,
The phase change pattern overlaps the antenna pattern along the first direction. The method of claim 1,
The phase change pattern is disposed in an effective resonator region in the spacer where a gap plasmon is generated. 6. The method of claim 5,
A width of the antenna pattern along a second direction crossing the first direction is smaller than a width of the effective resonator region along the second direction. The method of claim 1,
A width of the phase-change pattern along a second direction crossing the first direction is the same as a width of the antenna pattern along the second direction. The method of claim 1,
Further comprising; a power element for applying a voltage to the antenna pattern;
A phase modulator in which heat is generated in the antenna pattern by applying the voltage to the antenna pattern. 9. The method of claim 8,
The phase change pattern is spaced apart from the antenna pattern such that a difference between a maximum temperature and a minimum temperature of the phase change pattern when the heat is generated in the antenna pattern is minimized. 9. The method of claim 8,
The phase change pattern is a phase modulator that is spaced apart from the antenna pattern such that, when the heat is generated in the antenna pattern, a minimum temperature of the phase change pattern is 280 degrees (℃) or more. The method of claim 1,
The antenna pattern includes a plurality of antenna patterns arranged along a second direction intersecting the first direction,
The phase change pattern includes a plurality of phase change patterns provided between the plurality of antenna patterns and the guide layer,
The plurality of antenna patterns have the same shape as each other,
The plurality of phase change patterns are arranged along the second direction. 12. The method of claim 11,
A power supply element for applying the same voltages to the plurality of antenna patterns, respectively;
A phase modulator in which heat is generated in the plurality of antenna patterns by applying the voltage to the plurality of antenna patterns. a first phase modulator;
a second phase modulator spaced apart from the first phase modulator in a first direction; and
a power supply element for applying a voltage to the first phase modulator and the second phase modulator;
Each of the first phase modulator and the second phase modulator includes antenna patterns arranged in the first direction, a guide layer spaced apart from the antenna patterns in a second direction crossing the first direction, and the antenna a spacer provided between the patterns and the guide layer, and phase change patterns inserted in the spacer and arranged in the first direction,
The phase change patterns are a phase modulator array including a phase change material. 14. The method of claim 13,
The power element applies a first voltage to the antenna patterns of the first phase modulator and applies a second voltage to the antenna patterns of the second phase modulator,
The first voltage and the second voltage are independent of each other in a phase modulator array. 14. The method of claim 13,
A phase modulator array wherein the number of the phase change patterns of the first phase modulator is the same as the number of the phase change patterns of the second phase modulator. 14. The method of claim 13,
wherein the spacer of the first phase modulator and the spacer of the second phase modulator are different portions of one dielectric film. 14. The method of claim 13,
a trench provided between the first phase modulator and the second phase modulator;
and the trenches extend along the second direction to expose the guide layer. 18. The method of claim 17,
Further comprising; a thermal insulation pattern provided in the trench;
wherein the insulating pattern has a lower thermal conductivity than that of the spacer. 14. The method of claim 13,
in each of the first phase modulator and the second phase modulator, wherein the phase change patterns are surrounded by the spacer. 20. The method of claim 19,
In each of the first phase modulator and the second phase modulator, a thickness of a portion of the spacer disposed between the phase-change patterns and the antenna patterns in the second direction may be equal to that of the phase-change patterns and A phase modulator array greater than a thickness along the second direction of another portion of the spacer disposed between the guide layers.

Images