KR20210158573A - Pressure Sensor Package Using One Mold Package - Google Patents

Abstract

The present invention relates to a pressure sensor package, and more specifically, to a pressure sensor package which senses pressure of fluid by using a semiconductor device. The pressure sensor package according to one embodiment of the present invention comprises: a pressure sensor (100) including a sensor main body (110), an upper extension unit (120), a lower extension unit (130), a receiving hole (140), and a strain gauge (150); and a guide (200) formed in a hollow cylindrical shape, wherein the upper extension unit (120) is contained and an IC package (400) is fixed in an inner side of a lower part thereof. The IC package (400) may be wire-bonded to the strain gauge (150). The pressure sensor package is easy to be assembled and reduces cost while maintaining performance of the pressure sensor.

Description

Pressure Sensor Package Using One Mold Package

The present invention relates to a pressure sensor package, and more particularly, to a pressure sensor package for sensing the pressure of a fluid using a semiconductor device.

The pressure sensor refers to an element that outputs an electrical signal corresponding to a sensing factor called pressure. When measuring pressure, there are many different types of pressure sensor designs because there are so many different conditions, ranges, and materials that must be measured. Often, pressure is converted into an intermediate form such as displacement. The sensor then converts the displacement into an electrical output such as voltage or current. The three most common types of pressure transducers of this type are strain gauge transducers, variable capacitance transducers, and piezoelectric transducers.

The most common of all pressure sensors is the Wheatstone bridge (strain-based) sensor, which offers a variety of accuracy, size, robustness, and cost options. Bridge sensors are used in high and low pressure applications to measure absolute pressure, gauge pressure, differential pressure, etc. All bridge sensors utilize strain gauges and diaphragms.

A change in pressure causes the membrane to deflect and the resistance of the strain gage changes. This change is measured with a data acquisition (DAQ) system. There are several types of strain gauge pressure transducers like this one. That is, there are adhesive strain gages, sputtered strain gages, and semiconductor strain gages.

1. Korean Patent Publication No. 10-2011-0075377 (published date: 2011.07.06., title of invention: pressure sensor package)

An object of the present invention is to provide a pressure sensor package that maintains the performance of the pressure sensor but has excellent assembly and cost reduction.

A pressure sensor package according to a preferred embodiment of the present invention is a pressure sensor ( 100); and a guide 200 formed in a hollow cylindrical shape, the upper extension part 120 is accommodated inside the lower part, and the IC package 400 is fixed, wherein the IC package 400 is the strain gauge. It may be wire-bonded to 150 .

Here, the upper surface of the upper extension part 120 may form a diaphragm 121 , and the IC package 400 may be spaced apart from the diaphragm 121 .

In addition, a second support groove 220 is formed in an area facing the front of the guide 200 , and the IC package 400 includes a mold case 410 , a lower lead terminal 420 , and an upper lead terminal 430 . and a support protrusion 440 , wherein the support protrusion 440 protrudes outward from at least one side of the mold case 410 , and the support protrusion 440 is inserted into the second support groove 220 . can be fixed.

In addition, a first support groove 210 is formed in an area facing the front of the guide 200 , and the first support groove 210 is formed under the second support groove 220 , and the first The support 300 may be inserted and fixed in the support groove 210 , and the lower lead terminal 420 may be supported by the support 300 .

In addition, the front of the guide 200 may be opened, and the open area of the guide 200 may expose the upper portion of the upper extension part 120 .

In the present invention, since the IC package manufactured in the form of a single mold package is connected to the strain gauge through wire bonding while the IC package is fixed to the guide, the manufacturing process can be simplified and the manufacturing cost can be reduced.

In the present invention, since the IC package and the strain gauge are exposed through the open front of the guide, wire bonding between the IC package and the strain gauge may be very easy.

In the present invention, since the lower lead terminal is supported by the support, the IC package can be firmly fixed.

1 is a perspective view of a pressure sensor package according to a preferred embodiment of the present invention.
FIG. 2 is an exploded perspective view of the pressure sensor package of FIG. 1 .
3 is a bottom perspective view of the pressure sensor of FIG. 1 .
4 is an upper perspective view of the pressure sensor of FIG. 2 .
FIG. 5 is a cross-sectional view of the pressure sensor of FIG. 2 .
FIG. 6 is a state diagram of the pressure sensor, the guide, the support, and the IC package in FIG. 2 .
7 is a perspective view of the support of FIG. 2 .
8 is a perspective view of the IC package of FIG. 2 .
9 is a plan view, a front view, a rear view, a left view, a right view, and a bottom view of the coupled state diagram of FIG.
10 is a perspective view of the lower spring case of FIG.
11 is an upper perspective view of the upper spring case of FIG. 2 ;
12 is a bottom perspective view of the upper spring case of FIG. 2 .
13 is a state diagram of a coupling state of a pressure sensor, a guide, a support, an IC chip, an upper spring case, a lower spring case, and a spring.
14 is a cross-sectional view of the coupled state diagram of FIG. 13 .
15 is a plan view, a front view, a rear view, a left view, a right view, and a bottom view of the coupled state diagram of FIG. 14 .
16 is a perspective view of the case of FIG. 2 ;

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In describing each figure, like reference numerals have been used for like elements. In describing the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component.

and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention.

The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Hereinafter, a pressure sensor package according to a preferred embodiment of the present invention will be described with reference to the accompanying FIGS. 1 to 16 . In order to clarify the gist of the present invention, descriptions of previously known matters will be omitted or simplified.

Referring to FIG. 1 , the pressure sensor package 1 may include a pressure sensor 100 , a spring 700 , and a case 800 . An electronic circuit for activating the pressure sensor 100 may be built in the case 800 . The spring 700 may provide an electrical connection between the pressure sensor package and an external circuit. The number of springs 700 may be plural. The spring 700 may have a power terminal function for starting the pressure sensor 100 and a signal terminal function for transmitting an output corresponding to a sensing value of the pressure sensor as an electrical signal to the outside of the pressure sensor package.

Hereinafter, a specific structure of the pressure sensor package will be described.

Referring to FIG. 2 , the pressure sensor package 1 includes a pressure sensor 100 , a guide 200 , a support 300 , an IC package 400 , a lower spring case 500 , an upper spring case 600 , and a spring 700 and a case 800 may be included.

3, 4 and 5 , the pressure sensor 100 includes a sensor body 110 , an upper extension 120 , a lower extension 130 , a receiving hole 140 , and a strain gauge 150 , strain Gauges) and support jaws 160 may be included.

The sensor body 110 may have a cylindrical shape. The support jaw 160 may be formed to protrude upward from the inner side of the upper surface of the sensor body 110 . The upper extension part 120 may be formed to protrude upward from the inside of the upper surface of the support jaw 160 . The upper surface of the upper extension 120 may form a diaphragm 121 (diaphragm, diaphragm). The diaphragm 121 may be manufactured in the form of a thin film. The sensor body 110 , the upper extension part 120 , the lower extension part 130 , and the receiving hole 140 may integrally form a diaphragm. The lower extension 130 may be formed to protrude downward from the inner side of the lower surface of the sensor body 110 . From the lower surface of the lower extension 130 to the diaphragm 121 , a receiving hole 140 penetrating the lower extension 130 , the sensor body 110 and the upper extension 120 may be formed. Through the receiving hole 140 , the pressure of the fluid may be transmitted to the diaphragm 121 . A strain gauge 150 may be installed on one side of the upper surface of the diaphragm 121 . The strain gauge 150 may be, for example, a semiconductor strain gauge of a semiconductor chip type. In this structure, the diaphragm 121 may generate a displacement according to the pressure of the fluid received through the receiving hole 140 , and by the displacement, the electrical characteristics of the strain gauge 150 (eg, , resistance) can be changed. As such, the pressure of the fluid may be sensed by reading the change in the electrical characteristics of the strain gauge 150 according to the pressure of the fluid. In this case, the sensed fluid pressure may be an absolute pressure, a gauge pressure, a differential pressure, or the like.

6 to 9 , the guide 200 may be a hollow cylinder. The front of the guide 200 may be opened. The upper extension 120 may be accommodated inside the lower portion of the guide 200 . The open region of the guide 200 may expose the upper portion of the upper extension 120 . The strain gauge 150 may be positioned in the open area of the guide 200 . The lower inner surface of the guide 200 may be in close contact with the outer peripheral surface of the upper extension part 120 . The lower end of the guide 200 may be supported by the support jaw 160 . A first support groove 210 and a second support groove 220 may be formed in a region facing the front of the guide 200 . The second support groove 220 may be formed in an upper portion of the first support groove 210 . The first support groove 210 may be formed at an upper portion of the diaphragm 121 to be spaced apart from the diaphragm 121 . The support 300 may be inserted and fixed in the first support groove 210 . The support 300 may be made of an insulating material. The support 300 may be, for example, a PCB substrate. When the support 300 is formed of the PCB substrate, a separate circuit may not be printed on the support 300 .

The IC package 400 may be manufactured as a single mold package type. The IC package 400 may include a mold case 410 , a lower lead terminal 420 , an upper lead terminal 430 , and a support protrusion 440 . The lower lead terminal 420 and the upper lead terminal 430 may be electrically connected. The support protrusion 440 is only fixed to the mold case 410 , and may be electrically separated from the lower lead terminal 420 , the upper lead terminal 430 , and the IC chip (not shown) inside the mold case 410 . .

The mold case 410 may be manufactured by a well-known IC chip molding method. An IC chip may be mounted inside the mold case 410 . For example, a semiconductor device for signal processing, such as an amplifier, may be embedded in the IC chip. The IC chip may be mounted on a leadframe and wire-bonded to the leadframe, as is well known.

The lower lead terminal 420 may protrude below the mold case 410 . The lower lead terminal 420 may be bent in a 'L' shape toward the front. The lower lead terminal 420 may include a lower horizontal portion 421 and a lower bent portion 422 . The lower horizontal portion 421 may extend downward from the lower portion of the mold case 410 . The lower bent portion 422 may extend from the lower end of the lower horizontal portion 421 toward the front. The lower surface of the lower bent part 422 may be seated on the upper surface of the support 300 and supported by the upper surface of the support 300 . The strain gauge 150 may be positioned in front of the lower lead terminal 420 . The strain gauge 150 may be wire-bonded to the lower lead terminal 420 using a conductive wire W.

The support protrusion 440 may protrude outward from at least one side surface of the mold case 410 . The support protrusion 4400 may be inserted and fixed in the second support groove 220 .

The upper lead terminal 430 may protrude above the mold case 410 . The upper lead terminal 430 may be bent in a 'L' shape toward the front. The upper lead terminal 420 may include an upper horizontal portion 431 and an upper bent portion 432 . The upper horizontal portion 431 may extend upward from the upper portion of the mold case 410 . The upper bent portion 432 may extend from the upper end of the upper horizontal portion 421 toward the front.

The IC package 200 is supported by the support 300 that is an insulating material, the lower lead terminal 420 extends downward of the mold case 410 and is bent forward, and the upper lead terminal 430 is the mold case (410) Through a structure in which the side of the mold case 410 is supported by a support protrusion 440 that is extended upward and is bent forward and electrically separated from the upper and lower lead terminals 420 and 430, IC The package 200 may be fixed on the guide 200 in a state electrically separated from the guide 200 .

10 to 15 , the lower spring case 500 may include a lower case body 510 and a case extension part 520 . The lower case body 510 has a cylindrical shape and may include at least one spring insertion hole 511 penetrating from the top to the bottom.

As a portion of the lower surface of the lower case body 510 extends downward, the case extension 520 may be formed. The case extension part 520 may be formed by a portion extending downward from the outer peripheral surface of the lower surface of the lower case body 510 . With this structure, an open area S open toward the front may be formed on the lower part of the lower case body 510 and the front of the case extension part 520 . At least one fixing groove 512 may be formed on the side of the lower case body 510 . The lower surface of the case extension 520 may be closely fixed to the upper surface of the guide 200 .

The upper spring case 600 may include an upper case body 610 and a fixing protrusion 620 . In the upper case body 610 , a spring exposure hole 611 penetrating from the upper part to the lower part of the upper case body 610 may be formed. The fixing protrusion 620 may be located under the upper case body 610 . The fixing protrusion 620 may be inserted and fixed in the fixing groove 512 . The upper spring case 600 and the lower spring case 500 may be coupled to each other by the coupling of the fixing protrusion 620 and the fixing groove 512 . An upper case outer wall 630 formed integrally with the upper spring case 600 under the upper spring case 600 and surrounding the fixing protrusion 620 may be provided. The spring exposure hole 611 may face the spring insertion hole 511 .

The spring 700 may be a cylindrical spring. The radius of the central region of the spring 700 may be greater than that of the upper region and the lower region. The spring 700 may be provided as many terminals as necessary to connect to an external device or circuit in the pressure sensor package.

The spring insertion hole 511 may have a cylindrical shape. The spring insertion hole 511 may be divided into a first area 511a and a second area 511b. The first region 511a may be positioned above the second region 511b. The first region 511a may have a larger radius than the second region 511b. Due to the difference in radius between the first area 511a and the second area 511b, a chin may be formed in the boundary area between the first area 511a and the second area 511b. The central region of the spring 700 may be accommodated in the first region 511a. The lower region of the spring 700 may be accommodated in the second region 511b. The lower region of the spring 700 may be exposed under the second region 511b after passing through the second region 511b. A region exposed under the second region 511b in the lower region of the spring 700 may be in close contact with the upper lead terminal 430 . When there are three or more springs 700 , a plurality of springs 700 may be radially disposed in order to minimize the space in which the springs 700 are installed. At this time, some of the plurality of springs 700 are located behind the upper horizontal portion 431 of the upper lead terminal 430 as shown in FIG. 14(a), and some of the plurality of springs 700 are shown in FIG. 14(b). ), it may be located in front of the upper bent portion 432 of the upper lead terminal 430 . Among the plurality of springs, the lower region of the spring 700 located at the rear of the upper horizontal portion 431 of the upper lead terminal 430 may be closely fixed to the rear surface of the upper horizontal portion 431 of the upper lead terminal 430 . . Among the plurality of springs, a lower region of the spring 700 located in front of the upper bent portion 432 of the upper lead terminal 430 may be closely fixed to the upper bent portion 432 of the upper lead terminal 430 . Since the lower region of the spring 700 exposed downward in the second region 511b of the spring insertion hole 511 is exposed by the open region of the guide 200 , the spring 700 is connected to the upper lead terminal 430 . It can be easy to connect to.

The upper region of the spring 700 may be exposed to the upper portion of the upper spring case 600 through the spring exposure hole 611 .

The radius of the spring exposure hole 611 may be smaller than the central area of the spring 700 . With this structure, in a state in which the lower spring case 500 and the upper spring case 600 are coupled, the spring 700 may be stably fixed inside the lower spring case 500 .

Referring to FIG. 16 , the case 800 may be a hollow cylinder with both sides open. The case 800 may accommodate the guide 200 , the lower spring case 500 , and the upper spring case 600 inside. In this case, the inner peripheral surface of the case 800 may be in close contact with the outer peripheral surfaces of the guide 200 , the lower spring case 500 and the upper spring case 600 . The lower surface of the case 800 is the upper surface of the sensor body 110 . can be supported on The lower inner surface of the case 800 may be closely fixed to the support jaw 160 . The upper portion of the case 800 may expose the spring 700 to the upper portion.

The pressure sensor package of the present invention may be installed, for example, on a vehicle brake side and used as a brake pressure sensor. The pressure sensor package of the present invention may be installed in a region in contact with a fluid to sense the pressure of the corresponding fluid itself or an external pressure applied to the fluid.

1: Pressure sensor package
100: pressure sensor
200 : guide
300: support
400: IC package
500: lower spring case
600: upper spring case
700: spring
800: case

Claims (5)

a pressure sensor 100 including a sensor body 110 , an upper extension 120 , a lower extension 130 , a receiving hole 140 , and a strain gauge 150 ; and
It is formed in a hollow cylindrical shape, the upper extension part 120 is accommodated inside the lower part, and includes a guide 200 to which the IC package 400 is fixed,
The IC package 400 is a pressure sensor package using a single mold package, characterized in that wire bonding to the strain gauge 150 .
The method of claim 1,
The upper surface of the upper extension part 120 forms a diaphragm 121,
The IC package 400 is a pressure sensor package using a single mold package, characterized in that spaced apart from the diaphragm (121).
The method of claim 1,
A second support groove 220 is formed in the area facing the front of the guide 200,
The IC package 400 includes a mold case 410 , a lower lead terminal 420 , an upper lead terminal 430 , and a support protrusion 440 ,
The support protrusion 440 protrudes outward from at least one side of the mold case 410,
The pressure sensor package using a single mold package, characterized in that the support protrusion (440) is inserted and fixed in the second support groove (220).
The method of claim 1,
A first support groove 210 is formed in the area facing the front of the guide 200,
The first support groove 210 is formed under the second support groove 220,
The support 300 is inserted and fixed in the first support groove 210,
The lower lead terminal (420) is a pressure sensor package using a single mold package, characterized in that supported by the support (300).
The method of claim 1,
The front of the guide 200 is open,
The pressure sensor package using a single mold package, characterized in that the open area of the guide (200) exposes the upper portion of the upper extension (120).

Images