KR20210157596A - Method for multi-material joining using mechanical joint and multi-material joining body prepared by the same - Google Patents

Abstract

Provided is a dissimilar material joining method and a dissimilar material joining body prepared therethrough. The dissimilar material joining method comprises the following steps of: disposing a second piece on one surface of a first piece; forming a groove on the second piece while the second piece is disposed on the first piece; and disposing a rivet to be overlap the groove of the second piece and inserting the rivet from a side of the second piece. The present invention provides the joining method of the dissimilar materials, which can be utilized in various ways regardless of restriction in types, properties, characteristics, and other process conditions of the dissimilar materials.

Description

Dissimilar material bonding method using mechanical fastening and dissimilar material bonding body prepared through it

The present invention relates to a method for bonding dissimilar materials and a dissimilar material bonding body prepared through the same, and more particularly, to a method for bonding dissimilar materials using mechanical fastening, and a dissimilar material bonding body prepared through the bonding method. More particularly, it relates to a method for bonding different materials that can be used regardless of the type of material to be joined, and a dissimilar material joined body prepared through this method.

In general, bonding of heterogeneous materials or bonding of multiple materials means bonding or bonding a plurality of materials having different types, physical properties, and characteristics. Bonding of heterogeneous materials in a broad sense may be used to include bonding technology between materials, molding technology, surface treatment technology, and the like. Recently, as light weight and high strength of materials are required, various materials other than conventional metals have been used, and accordingly, various studies related to dissimilar material bonding technology are being conducted.

However, the existing melt-based welding technology for steel materials (eg, resistance spot welding, arc welding, laser welding, etc.) cannot be applied to joining dissimilar materials with different properties, so adhesive bonding Non-welding techniques such as adhesive bonding and mechanical joint have been proposed.

Mechanical fastening technology is a generic term for technology that maintains physical boundaries between joining materials and mechanically joins dissimilar materials using separate fastening members. Conventional mechanical fastening methods, such as bolt-nut coupling and blind riveting, require prior hole processing of the joint member, and require alignment of holes and holes and holes and rivets. It has the disadvantages of being complicated and difficult to automate. Therefore, recently, mechanical fastening methods that do not require hole processing such as self-piercing riveting (SPR), flow drill screwing (FDS), and clinching are in the spotlight.

The dissimilar material bonding method may have various limitations depending on the type and physical properties of the material to be joined, the form and shape to be joined, the thickness, the direction in which the bonding process and the process are performed, and the like. Therefore, it is necessary to select an appropriate bonding method in consideration of the type and shape of the material to be joined.

For example, welding is a method of applying heat and pressure to a metallic material to induce a direct bond between solids. Welding cannot be applied to non-metallic materials because it uses the partial melting of metallic materials. Also, in the case of a metal material on which a surface oxide film is easily formed, such as aluminum, there is a limit to its application.

International Patent Publication No. WO/2014/013232 A1 (2014.01.23) (Patent Document 2) US Patent Publication 2018/0117666 A1 (2018.05.03)

Self-piercing riveting (SPR) is one of the representative mold-based spot joining technologies as a mechanical fastening technology. In the case of self-piercing riveting, it is a widely used mechanical fastening method because the material does not undergo large deformation and can exhibit very strong bonding strength in a relatively simple way. Self-piercing riveting has been disclosed in Patent Literature 1 and Patent Literature 2, and the like.

Compared to bolt-nut fastening, self-piercing riveting has the advantages of high productivity, relatively low thermal deformation, and applicable to different materials and coating materials because the process is simple and automation is possible compared to bolt-nut fastening. In addition, it is evaluated as the most realistic alternative to spot bonding of dissimilar materials because it can be used for bonding different materials between non-ferrous metals and steel, and has excellent bonding strength and is environmentally friendly.

Self-piercing riveting is performed by inserting a rivet of a special shape from one side of two materials to be joined. In general, the material on the side into which the rivet is inserted may be referred to as an upper material or upper plate, and the material on the opposite side may be referred to as a lower material or lower plate. In self-piercing riveting, the rivet passes through the upper material, and the shape of the rivet is called flaring according to the shape of the forming table (or die) located below the lower material. The material and the lower material are strongly engaged and combined. Therefore, it may be difficult to apply the self-piercing riveting when the ductility of the lower material is low or the strength of the upper material is too large.

On the other hand, in the case of the internal combustion engine automobile industry, fuel economy and environmental regulations and collision safety regulations are being strengthened at the same time, so materials that can satisfy both weight reduction and durability are being made. In the case of electric vehicles, the development of materials for electric vehicles is required due to the gradual ban on sales of internal combustion engine vehicles and the increase in demand for electric vehicles. Since electric vehicles have a heavier body weight than internal combustion engine vehicles due to their batteries, it is essential to use materials with high strength and light weight in order to improve fuel efficiency (or secure mileage).

Recently, carbon fiber reinforced plastic (CFRP) is attracting attention as a material that can achieve high strength and weight reduction. However, since melt welding cannot be applied to carbon fiber reinforced plastics, adhesives or mechanical fastening methods have been proposed. In addition, in the mechanical fastening method, carbon fiber reinforced plastic has very low ductility, so it is difficult to apply it as a lower material for self-piercing riveting.

On the other hand, when a high-strength metal material or a thick metal material is used as the upper material, a defect in which the rivet does not penetrate the upper material and is damaged may occur. For example, if the upper material is a high-strength steel-based material exceeding 1.2 GPa, or the thickness is too thick (eg, greater than 3.0 mm), the rivet cannot penetrate the upper material, making it difficult to apply self-piercing riveting . In addition, it may be difficult to apply self-piercing riveting when the lower material is a composite material without moldability, the strength of the base material exceeds 590 MPa, or aluminum of 6000 series or higher.

However, as described above, as the application of ultra-high strength steel, high-strength aluminum, and composite materials increases, economical bonding technology development is required to respond to this. As one way to overcome this, a process of forming a pre-hole in the upper material in advance and then performing self-piercing riveting may be considered. However, when the pre-hole is formed, a number of aligning processes are involved, such as aligning the upper and lower materials, aligning the adhesive and the pre-hole, and aligning the rivet with the pre-hole, thereby reducing process efficiency. .

As another method for minimizing the alignment process, it may be considered to form the pre-hole in a state in which the upper material and the lower material are aligned. However, when the hole is formed in a state in which the upper material and the lower material are aligned, adhesive is applied to the drill for forming the hole, thereby reducing the durability of the drill and lowering the process precision in a continuous process.

Accordingly, the problem to be solved by the present invention is to provide a bonding method of dissimilar materials that can be used in various ways in the self-piercing riveting process despite limitations of types, properties, properties, and other process conditions of bonding materials.

Another object of the present invention is to provide a bonding method of dissimilar materials with excellent process efficiency while minimizing defects.

Another object to be solved by the present invention is to provide a dissimilar material bonded body having excellent bonding strength and being variously applicable despite restrictions on types, physical properties, properties, and other process conditions of bonding materials.

The problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

A bonding method of dissimilar materials according to an embodiment of the present invention for solving the above problems comprises: disposing a second piece on one surface of the first piece; forming a groove in the second piece with the second piece disposed on the first piece; and disposing the rivet to overlap the groove of the second piece and inserting the rivet from the side of the second piece.

The disposing of the second piece may include disposing the second piece with an adhesive layer interposed between the first piece and the second piece.

The dissimilar material bonding method may further include, before inserting the rivet, arranging a third piece on the other surface of the first piece.

Here, the groove of the second piece may overlap the third piece.

Further, the shank of the rivet may penetrate the first piece, and the shank of the rivet may at least partially penetrate the third piece.

At the base of the groove of the second piece, a thickness of a center in a plan view may be greater than a thickness of an edge in a plan view.

A maximum thickness of the first piece may be smaller than a maximum thickness of the second piece.

In addition, a maximum thickness of a base portion of the groove of the second piece may be smaller than a maximum thickness of the first piece.

In addition, the maximum thickness of the first piece may be 3.0 mm or less.

For example, the strength of the first piece may be 1.2 Pa or more, the strength of the second piece may be 1.5 GPa or more, and the strength of the third piece may be 500 MPa or less.

The first piece may be a carbon fiber reinforced plastic, and the second piece may be a metal material.

The bonding method of dissimilar materials according to another embodiment of the present invention for solving the above problems comprises: disposing a second piece on one surface of the first piece, and disposing a reinforcing piece on the other surface of the first piece; and inserting a rivet from the second piece side, wherein the rivet completely penetrates the first piece and at least partially penetrates the reinforcing piece.

In the bonding method of the dissimilar materials, a groove or a through hole is formed in the second piece from the second piece side between the steps of arranging the first piece, the second piece and the reinforcing piece and the step of inserting the rivet. It may further include the step of forming.

The dissimilar material bonding body according to an embodiment of the present invention for solving the other problem is a dissimilar material bonding body including a first piece and a second piece coupled using a self-piercing rivet, wherein the rivet is the second piece side inserted from, in cross-section, a cavity between the head of the rivet and the first piece.

In a cross-sectional view, a residual layer of the same material as that of the second piece may be present between the cavity and the first piece, and a maximum thickness of the residual layer may be smaller than a maximum thickness of the second piece.

In addition, on the cross-section, between the residual layer and the first piece, an adhesive layer in contact with the first piece may further exist.

In some embodiments, the dissimilar material bonding body may further include a third piece spaced apart from and coupled to the second piece with the first piece interposed therebetween, and may further include a third piece having greater ductility than the first piece. have.

wherein the shank of the rivet may completely penetrate the first piece and at least partially penetrate the third piece.

Details of other embodiments are included in the detailed description.

According to embodiments of the present invention, it is possible to provide a bonding method of dissimilar materials that can be used in various ways and a dissimilar material bonding body prepared therefrom despite restrictions on types, properties, properties, and other process conditions of bonding materials.

In addition, it is possible to provide a bonding method of dissimilar materials that has excellent process efficiency while minimizing the defect rate, and can increase the lifespan of the perforated member in particular.

Effects according to the embodiments of the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a flowchart illustrating a bonding method of dissimilar materials according to an embodiment of the present invention.
2 to 5 are cross-sectional views sequentially illustrating the bonding method of FIG. 1 .
6 is a cross-sectional perspective view of the rivet.
7 is a flowchart illustrating a bonding method of dissimilar materials according to another embodiment of the present invention.
8 to 11 are cross-sectional views sequentially illustrating the bonding method of FIG. 7 .
12 is a flowchart illustrating a bonding method of dissimilar materials according to another embodiment of the present invention.
13 to 16 are cross-sectional views sequentially illustrating the bonding method of FIG. 12 .
17 is a flowchart illustrating a bonding method of dissimilar materials according to another embodiment of the present invention.
18 to 21 are cross-sectional views sequentially illustrating the bonding method of FIG. 17 .
22 is a flowchart illustrating a bonding method of dissimilar materials according to another embodiment of the present invention.
23 to 26 are cross-sectional views sequentially illustrating the bonding method of FIG. 22 .
27 to 30 are flowcharts illustrating a bonding method of dissimilar materials according to another embodiment of the present invention.
31 and 32 are flowcharts illustrating a bonding method of dissimilar materials according to another embodiment of the present invention.
33 is a cross-sectional view illustrating a dissimilar material bonded body prepared according to a bonding method according to another embodiment of the present invention.
34 is a cross-sectional view illustrating a dissimilar material bonded body prepared according to a bonding method according to another embodiment of the present invention.
35 is a cross-sectional view illustrating a dissimilar material bonded body prepared according to a bonding method according to another embodiment of the present invention.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only the embodiments allow the disclosure of the present invention to be complete, and those of ordinary skill in the art to which the present invention pertains. It is provided to fully inform the person of the scope of the invention, and the present invention is only defined by the scope of the claims. That is, various changes may be made to the embodiments presented by the present invention. It should be understood that the embodiments described below are not intended to limit the embodiments, and include all modifications, equivalents, and substitutes thereto.

The size, thickness, width, length, etc. of the components shown in the drawings may be exaggerated or reduced for convenience and clarity of description, so that the present invention is not limited to the illustrated form.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used with the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless clearly defined in particular.

Spatially relative terms 'above', 'upper', 'on', 'below', 'beneath', 'lower', etc. As illustrated, it may be used to easily describe a correlation between one element or components and another device or components. Spatially relative terms should be understood as terms including different orientations of the device when used in addition to the orientations shown in the drawings. For example, when an element shown in the drawing is turned over, an element described as 'below or beneath' of another element may be placed 'above' of the other element. Accordingly, the exemplary term 'down' may include both the direction of the bottom and the top.

In this specification, 'and/or' includes each and every combination of one or more of the recited items. The singular also includes the plural, unless the phrase specifically states otherwise. As used herein, 'comprises' and/or 'comprising' does not exclude the presence or addition of one or more other components in addition to the stated components. Numerical ranges indicated using 'to' indicate numerical ranges including the values stated before and after them as lower and upper limits, respectively. 'About' or 'approximately' means a value or numerical range within 20% of the value or numerical range recited thereafter.

In addition, in this specification, the first direction (X) means an arbitrary direction in the plane, and the second direction (Y) means another direction intersecting the first direction (X) in the plane. In addition, the third direction Z means a direction perpendicular to the plane. Unless otherwise defined, 'plane' means a plane to which the first direction (X) and the second direction (Y) belong. In addition, unless otherwise defined, 'overlapping' means that the components overlap in the third direction (Z) in the plane view.

As used herein, the term 'piece' means any one (or any group) of a plurality of objects to be joined, and may be used interchangeably with terms such as 'plate' depending on the shape of the object to be joined. can The term 'strength' as used herein means tensile strength unless otherwise specified, and means measured under general measurement conditions or standard measurement conditions recognized by those skilled in the art.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart illustrating a bonding method of dissimilar materials according to an embodiment of the present invention. 2 to 5 are cross-sectional views sequentially illustrating the bonding method of FIG. 1 . 6 is a cross-sectional perspective view of the rivet 400 .

1 to 6 , the bonding method of dissimilar materials according to an exemplary embodiment of the present invention includes forming a through hole in a second piece ( S110 ), aligning and disposing the first piece and the second piece with each other. It may include a step of doing (S120), aligning and arranging the rivet, the forming table and the third piece (S130), and the step of joining (joining, bonding) using the rivet (S140).

First, a through hole 210h is formed in the second piece 210 (S110). The through hole 210h may have a shape that completely penetrates the second piece 210 in the third direction Z. 2 illustrates a case in which the inner wall of the through hole 210h is vertical, that is, parallel to the third direction Z, but in another embodiment, the inner wall of the through hole 210h may have a predetermined inclination. have. A method of forming the through-hole 210h is not particularly limited, but may be performed using a perforated member 1 such as a drill or a drill bit. A planar shape of the through hole 210h may be approximately circular.

In a dissimilar material bonding body to be described later, the second piece 210 may be located on the uppermost side of the bonding body. That is, the second piece 210 may correspond to the upper piece or the upper plate. The second piece 210 may be made of a material including a metal material or a non-metal material. As a non-limiting example, the second piece 210 is a metal material such as iron (Fe), chromium (Cr), nickel (Ni) or an alloy thereof, such as stainless steel, steel, aluminum, etc. can be

Next, align and arrange the second piece 210 on the first piece 100 (S120). In this step (S120), the second piece 210 may have already formed a through hole 210h. The second piece 210 may be directly disposed on one surface (the upper surface of FIG. 3 ) of the first piece 100 . That is, the first piece 100 may be disposed in contact with the second piece 210 . Alignment of the first piece 100 and the second piece 210 may use a jig (jig) or a clamp (clamp) or the like. The first piece 100 may correspond to a lower piece or a lower plate in a dissimilar material assembly to be described later. The first piece 100 may be made of a material including a metal material or a non-metal material. As a non-limiting example, the first piece 100 is reinforced with a high-strength metal material such as iron (Fe), chromium (Cr), nickel (Ni), aluminum (Al), magnesium (Mg), or alloys thereof or carbon fiber. It may be a hardenable high-strength plastic material such as plastic (Carbon Fiber Reinforced Plastic, CFRP). More specific examples of the metal material of the first piece 100 include an aluminum-magnesium (Al-Mg) alloy, an aluminum-magnesium-silicon (Al-Mg-Si) alloy, and an aluminum-zinc-magnesium (Al-Zn-) alloy. an aluminum alloy such as Mg) alloy, an iron-chromium (Fe-Cr) alloy, or an iron-nickel-chromium (Fe-Ni-Cr) alloy, and the like. In some embodiments, the ductility of the first piece 100 may be less than the ductility of the second piece 210 . This will be described later.

Next, the rivet 400, the third piece 300 and the forming table (anvil) (2) are aligned and arranged (S130). The through hole 210h of the second piece 210 , the rivet 400 , the third piece 300 , and the forming table 2 may be disposed to overlap in the third direction (Z).

The rivet 400 may be a self piercing rivet. As shown in FIG. 6 , the rivet 400 may include a head 410 and a shank 420 . The head 410 has a substantially circular shape in plan view, and may include an annular protrusion 410a at an outer peripheral edge thereof. The shank 420 may protrude from the lower surface (the upper surface of FIG. 6 ) of the head 410 . In addition, although FIG. 6 shows a cross-sectional perspective view, the shank 420 may have an internal space and have a substantially cylindrical shape. The maximum diameter of the protrusion 410a of the head 410 is greater than the maximum diameter of the outer peripheral surface of the shank 420 , and the protrusion 410a may function as a stopper while the rivet 400 is inserted.

In some embodiments, the inner surface of the shank 420 of the rivet 400 may have a predetermined slope. For example, the inner surface of the shank 420 includes a first surface 420a and a second surface 420b, wherein the inclination of the first surface 420a is smaller than the inclination of the second surface 420b, The inclination of the two surfaces 420b may be approximately 90 degrees. In this specification, the inclination of the inner surface of the shank 420 means an angle formed with the surface of the head 410 of the rivet 400 . Although the inner surface of the shank 420 of the rivet 400 is at least partially inclined, the rivet 400 is configured to be formed of portions having different inclination angles, even when the first piece 100 has a relatively small ductility. ) of the shank 420 can be easily deformed, that is, flaring.

The third piece 300 may be disposed on the other surface (the lower surface of FIG. 4 ) of the first piece 100 . The third piece 300 may be disposed in contact with the first piece 100 . In a dissimilar material bonding body to be described later, the third piece 300 may be located at the lowermost side of the bonding body. The third piece 300 may correspond to a reinforcing piece or a reinforcing plate. The third piece 300 may have a smaller planar area than the first piece 100 and/or the second piece 210 . For example, in self-piercing riveting corresponding to spot bonding, the third piece 300 may be partially disposed only in the spot coupled by the rivet 400 , but the present invention is not limited thereto. In addition, the planar size of the third piece 300 may be larger than the planar size of the through hole 210h. That is, the through hole 210h may be completely covered by the third piece 300 .

The third piece 300 may be a material including a metal material. As a non-limiting example, the third piece 300 may be a metal material such as aluminum (Al), magnesium (Mg), copper (Cu), silicon (Si), manganese (Mg), or an alloy thereof. As a more specific example, the third piece 300 is pure aluminum (Al), or an aluminum-copper-magnesium (Al-Cu-Mg) alloy, or an aluminum-manganese (Al-Mn) alloy, or aluminum-silicon. It may be an (Al-Si) alloy, or mild steel having a carbon content of 0.15% or more.

The third piece 300 may have greater ductility and less strength than the first piece 100 and/or the second piece 210 . The third piece 300 is deformed in shape by the flaring of the rivet 400 and the shank 420 and is engaged with the upper layer (or piece) and the like and surrounds in a planar view, through which the coupling between the pieces and with the rivet 400 bonding can be performed.

The forming table 2 may be spaced apart from the rivet 400 with the first piece 100 , the second piece 210 and the third piece 300 interposed therebetween. A separation space may be formed between the shaping table 2 and the third piece 300 . The upper surface of the forming table 2 may have a shape for inducing flaring of the shank 420 of the rivet 400 . 4 illustrates a case in which the upper surface of the base of the forming table 2 is flat, but the present invention is not limited thereto, and the upper surface of the forming table 2 may have a designed shape.

Next, the rivet 400 is press-inserted into the through hole 210h of the second piece 210 to form the bonding body 11 (S140). Insertion of the rivet 400 may be performed using a punch or the like. The shank 420 of the rivet 400 inserted into the through hole 210h of the second piece 210 may penetrate the first piece 100 and at least partially penetrate the third piece 300 . While the rivet 400 passes through the first piece 100 and the third piece 300 , the shank 420 of the rivet 400 may be deformed to spread outward. At the same time, at least the third piece 300 is ductilely deformed to correspond to the shape of the upper surface of the forming table 2, through which the first piece 100, the second piece 210, the third piece 300, and the rivet 400 Together, the heterogeneous material assembly 11 can be formed.

In some embodiments, a cavity V may remain between the head 410 of the rivet 400 and the first piece 100 . That is, the lower surface of the rivet 400 head 410 may be at least partially spaced apart from the first piece 100 and the like.

The bonding method of dissimilar materials according to the present embodiment and the bonding body 11 prepared therefrom may be relatively free from restrictions on materials of respective bonding objects. For example, in the conventional case, self-piercing riveting can be applied when the upper piece (eg, the second piece) is too thick, has high strength, or the lower piece (eg, the first piece) does not have sufficient ductility. There were no limits. However, according to this embodiment, the thickness of the second piece 210 by forming a pre-hole (ie, through-hole 210h) in the second piece 210 in advance and inserting the rivet 400 into the through-hole 210h. It is possible to overcome the limitations according to the strength and strength, and by disposing a reinforcing piece (ie, the third piece 300) that induces substantial ductile deformation and flaring of the rivet 400 under the first piece 100, the first Even if the piece 100 has a relatively small ductility, it is possible to perform a strong bonding and fastening.

_{In some embodiments, the thickness T 210} , such as the maximum thickness, of the second piece 210 may be at least 3.2 mm, or at least about 3.4 mm, or at least about 3.6 mm, or at least about 3.8 mm, or at least about 4.0 mm. have. According to the present invention, excellent mechanical fastening may be possible even when the second piece 210 has a level of thickness that cannot be achieved through conventional self-piercing riveting.

In addition, the thickness T ₁₀₀ of the first piece 100 , for example, the maximum thickness may be smaller than the maximum thickness of the second piece 210 . For example, the maximum thickness of the first piece 100 may be about 3.2 mm or less, or about 3.0 mm or less, or about 2.0 mm or less, or about 1.0 mm or less. If the first piece 100 is too thick, the rivet 400 does not completely penetrate the first piece 100 and partially penetrates the first piece 100, or penetrates the first piece 100 and buckling (buckling) ), or even completely penetrating the first piece 100 may not sufficiently penetrate the third piece 300 .

Further, the strength of the second piece 210 , such as compressive strength or tensile strength, may be about 1.5 GPa or more, or about 1.6 GPa or more, or about 1.7 GPa or more. The upper limit of the strength of the second piece 210 is not particularly limited, but may be, for example, about 1.8 GPa.

Further, the strength of the first piece 100, for example, tensile strength, is about 500 Mpa or more, or about 600 Mpa or more, or about 700 Mpa or more, or about 800 Mpa or more, or about 900 Mpa or more, or about 1.0 Gpa or more, or about 1.2 Gpa or more. , or about 1.4 Gpa or more, or about 1.6 Gpa or more. The upper limit of the strength of the first piece 100 is not particularly limited, but may be, for example, about 1.8 GPa. According to the present invention, excellent mechanical fastening may be possible even when the first piece 100 has a high level of strength that cannot be achieved through conventional self-piercing riveting. As a non-limiting example, the first piece 100 may be a curable carbon fiber reinforced plastic having a tensile strength of 1.0 GPa or more.

Also, the strength of the third piece 300 , such as tensile strength, may be about 500 MPa or less, or about 400 MPa or less, or about 300 MPa or less, or about 200 MPa or less, or about 100 MPa or less. Since the third piece 300 has sufficiently low strength and high ductility, shape deformation may be induced by flaring of the rivet 400 , and the joined body 11 may exhibit strong bonding strength and durability.

Hereinafter, a bonding method of dissimilar materials and a dissimilar material bonding body according to another embodiment of the present invention will be described. However, the description of the same or extremely similar configuration to the above-described embodiment will be omitted, and this will be easily understood by those skilled in the art from the accompanying drawings.

7 is a flowchart illustrating a bonding method of dissimilar materials according to another embodiment of the present invention. 8 to 11 are cross-sectional views sequentially illustrating the bonding method of FIG. 7 .

First, referring to FIG. 7, the bonding method of dissimilar materials according to the present embodiment includes the steps of forming a through hole in the second piece (S210), aligning and arranging the first piece and the second piece with each other (S220), Disposing the adhesive composition in the through hole (S230), arranging and arranging the rivet, the molding table and the third piece (S240), and the step of joining (joining, bonding) using the rivet (S250) may include have.

Referring further to FIG. 8 , a second piece 210 having a through hole 210h formed thereon is disposed on the first piece 100 ( S210 and S220 ). Since this step has been described above, a redundant description will be omitted.

Next, with further reference to FIG. 9 , the adhesive composition 500 is provided in the through hole 210h ( S230 ). The adhesive composition 500 may be provided in the form of droplets using a precision applicator such as the dispenser 3 . The adhesive composition 500 may be disposed in the through hole 210h to come into contact with the upper surface of the first piece 100 and the inner wall of the through hole 210h of the second piece 210 .

In an exemplary embodiment, the adhesive composition 500 may be a high temperature curable adhesive that is cured at about 180° C. or more, or about 190° C. or more, or about 200° C. or more. For example, the adhesive composition 500 may be a one-part epoxy-based adhesive composition, but the present invention is not limited thereto. For another example, the adhesive composition 500 may be a two-component room temperature curing adhesive.

Next, referring further to FIG. 10 , the rivet 400 , the third piece 300 and the forming table 2 are aligned and arranged ( S240 ). Since this step has been described above, a redundant description will be omitted.

Next, further referring to FIG. 11 , the rivet 400 is press-inserted into the through hole 210h of the second piece 210 to form the bonding body 12 ( S250 ). The shank of the rivet 400 inserted into the through hole 210h of the second piece 210 may penetrate the first piece 100 and at least partially penetrate the third piece 300 . In the process of the rivet 400 passing through the first piece 100 and the third piece 300 , the shank of the rivet 400 is deformed to spread outward, and the third piece 300 is formed of the molding table 2 . It may be ductilely deformed to correspond to the shape of the top surface. Through this, the first piece 100 , the second piece 210 , the third piece 300 , the adhesive 500 , and the rivet 400 may form the dissimilar material bonding body 12 together. Although the present invention is not limited thereto, in some embodiments, the adhesive composition 500 maintains an uncured state while the rivet 400 penetrates the first piece 100 and the third piece 300 , and subsequent The bonding body 12 including the finally cured adhesive 500 may be formed by curing in a heating process or the like.

The bonding method of dissimilar materials according to the present embodiment and the bonding body 12 prepared therefrom may further include an adhesive 500 to enable more robust bonding. The adhesive 500 may fill the space between the head of the rivet 400 and the first piece 100 , but the present invention is not limited thereto. In addition, although not represented in the drawings, the adhesive 500 is not only between the rivet 400 and the first piece 100 , but also the interface between the second piece 210 and the rivet 400 shank, the first piece 100 and It may be cured while filling the interface between the shank of the rivet 400 and/or the interface between the third piece 300 and the shank of the rivet 400 .

For example, when a composite material such as carbon fiber-reinforced plastic is applied as the second piece 210 or the like, minute damage such as cracks may occur on the processed surface. In this case, the adhesive 500 is effective in preventing defects by filling the cracks.

The thickness and strength of the other first piece 100 , second piece 210 , and third piece 300 are the same as described above, and thus overlapping descriptions will be omitted.

12 is a flowchart illustrating a bonding method of dissimilar materials according to another embodiment of the present invention. 13 to 16 are cross-sectional views sequentially illustrating the bonding method of FIG. 12 .

First, referring to FIG. 12 , the bonding method of dissimilar materials according to the present embodiment includes the steps of forming a through hole in a second piece (S310), forming an adhesive layer on the first piece (S320), the first piece, Aligning and arranging the second piece and the adhesive layer with each other (S330), aligning and arranging the rivet, the molding table, and the third piece (S340), and the step of joining (joining, bonding) using the rivet (S350) may include For convenience of explanation, the step of forming a through hole in the second piece (S310) is shown before the step of forming the adhesive layer on the first piece (S320), but the step of forming the adhesive layer (S320) passes through the second piece It may be performed prior to the step of forming the hole (S310).

Referring further to FIG. 13 , an adhesive layer 510 is formed on the first piece 100 ( S320 ). The adhesive layer 510 may be applied over the entire surface of the first piece 100 , or may be applied only to a partial region of the first piece 100 . The adhesive layer 510 may be a one-component high temperature curing adhesive such as an epoxy-based adhesive.

Next, further referring to FIG. 14 , a second piece 210 having a through hole 210h formed on the adhesive layer 510 is disposed ( S310 and S330 ). The second piece 210 may be directly disposed on one surface (the upper surface of FIG. 14 ) of the adhesive layer 510 . That is, the second piece 210 may be disposed in contact with the adhesive layer 510 . The adhesive layer 510 may be at least partially exposed through the through hole 210h of the second piece 210 .

Next, referring further to FIG. 15 , the rivet 400 , the third piece 300 and the forming table 2 are aligned and disposed ( S340 ). Since this step has been described above, a redundant description will be omitted.

Next, further referring to FIG. 16 , the rivet 400 is press-inserted into the through hole 210h of the second piece 210 to form the bonding body 13 ( S350 ). The shank of the rivet 400 inserted into the through hole 210h of the second piece 210 may penetrate the adhesive layer 510 and the first piece 100 and at least partially penetrate the third piece 300 . have. In the process of the rivet 400 passing through the first piece 100 and the third piece 300 , the shank of the rivet 400 is deformed to spread outward, and the third piece 300 is formed of the molding table 2 . It may be ductilely deformed to correspond to the shape of the top surface. Through this, the first piece 100 , the second piece 210 , the third piece 300 , the adhesive layer 510 , and the rivet 400 may form a dissimilar material bonding body 13 together.

Although the present invention is not limited thereto, in some embodiments, the adhesive layer 510 maintains an uncured state while the rivet 400 penetrates the first piece 100 and the third piece 300, and subsequent The bonding body 13 including the finally cured adhesive layer 510 may be formed by curing in a heating process or the like.

In some embodiments, a cavity V may remain between the head of the rivet 400 and the first piece 100 , specifically, between the head of the rivet 400 and the adhesive layer 510 . That is, the lower surface of the head of the rivet 400 may be at least partially spaced apart from the first piece 100 and the adhesive layer 510 . In addition, although not represented in the drawings, the adhesive layer 510 is not only between the rivet 400 and the first piece 100, but also the interface between the second piece 210 and the rivet 400 shank, the first piece 100 and the rivet ( 400) It may be cured while filling the interface between the shank and/or the interface between the third piece 300 and the rivet 400 shank.

In the bonding method of dissimilar materials according to this embodiment, the process can be further simplified by not applying the adhesive layer 510 only in the through hole, but already interposed between the first piece 100 and the second piece 210 . . That is, when the first piece 100 and the second piece 210 are aligned and disposed as in the above-described embodiment, and the adhesive composition is applied in the through hole 210h, the dispenser for application of the adhesive composition is aligned. should be However, as in the present embodiment, the alignment process may be omitted by forming the adhesive layer 510 in advance. In addition, the bonding area between the adhesive layer 510 and the first piece 100 or the second piece 210 may be increased to improve bonding strength.

The thickness and strength of the other first piece 100 , second piece 210 , and third piece 300 are the same as described above, and thus overlapping descriptions will be omitted.

17 is a flowchart illustrating a bonding method of dissimilar materials according to another embodiment of the present invention. 18 to 21 are cross-sectional views sequentially illustrating the bonding method of FIG. 17 .

First, referring to FIG. 17 , the bonding method of dissimilar materials according to the present embodiment includes aligning and arranging a first piece, a second piece, and an adhesive layer with each other (S410), and forming a through hole in the second piece (S420). ), aligning and arranging the rivets, the forming table, and the third piece (S430) and using the rivets to join (joining, bonding) (S440).

Referring further to FIG. 18 , an adhesive layer 510 is formed on the first piece 100 , and the second piece 200 is disposed on the adhesive layer 510 ( S410 ). In this step (S410), the second piece 200 may be in a state that does not have a through hole.

Next, further referring to FIG. 19 , a through hole 210h is formed in the second piece 210 ( S420 ). That is, the through hole 210h may be formed using the perforated member 1 or the like in a state in which the second piece 210 is in contact with the adhesive layer 510 . The through hole 210h may completely penetrate the second piece 210 in the third direction Z and partially expose the top surface of the adhesive layer 510 .

Next, further referring to FIG. 20 , the rivet 400 , the third piece 300 and the forming table 2 are aligned and disposed ( S430 ). Since this step has been described above, a redundant description will be omitted.

Next, further referring to FIG. 21 , the rivet 400 is press-inserted into the through hole 210h of the second piece 210 to form the bonding body 14 ( S440 ). The shank of the rivet 400 inserted into the through hole 210h of the second piece 210 may penetrate the adhesive layer 510 and the first piece 100 and at least partially penetrate the third piece 300 . have. In the process of the rivet 400 passing through the first piece 100 and the third piece 300 , the shank of the rivet 400 is deformed to spread outward, and the third piece 300 is formed of the molding table 2 . It may be ductilely deformed to correspond to the shape of the top surface. Through this, the first piece 100 , the second piece 210 , the third piece 300 , the adhesive layer 510 , and the rivet 400 may form a dissimilar material bonding body 14 together.

Although the present invention is not limited thereto, in some embodiments, the adhesive layer 510 maintains an uncured state while the rivet 400 penetrates the first piece 100 and the third piece 300, and subsequent The bonding body 14 including the finally cured adhesive layer 510 may be formed by curing in a heating process or the like.

In the bonding method of dissimilar materials according to the present embodiment, the first piece 100 and the first piece 100 are not aligned and disposed with the first piece 100 after forming the through hole 210h in advance in the second piece 210 . The point of forming the through-hole 210h in the second piece 210 after aligning and arranging the two pieces 210 is different from the bonding method of dissimilar materials according to FIG. 12 . That is, when the through-hole 210h is formed in the second piece 210 as in the above-described embodiment and then aligned with the first piece 100, the position of the through-hole 210h and the position where the spot bonding is to be performed Sorting must be involved. However, as in this embodiment, the alignment process can be omitted by interposing the adhesive layer 510 between the first piece 100 and the second piece 210 and then forming the through hole 210h in the second piece 210. have.

The thickness and strength of the other first piece 100 , second piece 210 , and third piece 300 are the same as described above, and thus overlapping descriptions will be omitted.

22 is a flowchart illustrating a bonding method of dissimilar materials according to another embodiment of the present invention. 23 to 26 are cross-sectional views sequentially illustrating the bonding method of FIG. 22 .

Referring first to FIG. 22 , the bonding method of dissimilar materials according to the present embodiment includes the steps of aligning and arranging a first piece, a second piece, and an adhesive layer with each other ( S510 ), and a groove (or blind hole) in the second piece. )) forming a step (S520), aligning and arranging the rivet, the forming table and the third piece (S530), and the step of joining (joining, bonding) using the rivet (S540). That is, the bonding method of dissimilar materials according to the present embodiment is different from the bonding method of dissimilar materials according to the embodiment of FIG. 17 in that a groove, not a through hole, is formed in the second piece.

Referring further to FIG. 23 , an adhesive layer 510 is formed on the first piece 100 , and the second piece 200 is disposed on the adhesive layer 510 ( S510 ). In this step ( S510 ), the second piece 200 may have no through-holes and/or grooves.

Next, referring further to FIG. 24 , a groove 220g is formed in the second piece 220 ( S520 ). That is, in a state in which the second piece 220 is in contact with the adhesive layer 510 , the groove 220g may be formed using the perforated member 1 or the like. The groove 220g may not completely penetrate the second piece 220 in the third direction Z, but may leave the remaining portion 220a of the second piece 220 . Accordingly, the upper surface of the adhesive layer 510 may not be exposed. The planar shape of the groove 220g may be approximately circular, but the present invention is not limited thereto.

_{The thickness T 220a} of the remaining portion 220a, for example, the maximum thickness may vary depending on the material of the second piece 220, but for example, about 3.0 mm or less, or about 2.0 mm or less, or about 1.0 mm or less, or about 0.8 mm or less, or about 0.6 mm or less, or about 0.4 mm or less. In some embodiments, the maximum thickness of the remaining portion 220a may be less than the maximum thickness of the first piece 100 .

Next, referring further to FIG. 25 , the rivet 400 , the third piece 300 and the forming table 2 are aligned and disposed ( S530 ). The groove 220g, the rivet 400, the third piece 300, and the forming table 2 of the second piece 220 may be disposed to overlap in the third direction (Z). Since this step has been described above, a redundant description will be omitted.

Next, referring further to FIG. 26 , the rivet 400 is press-inserted into the groove 220g of the second piece 220 to form the bonding body 15 ( S540 ). The shank of the rivet 400 inserted into the groove 220g of the second piece 220 penetrates the remaining portion 220a, the adhesive layer 510 and the first piece 100, and is at least in the third piece 300. It can be partially penetrated. In the process of the rivet 400 passing through the first piece 100 and the third piece 300 , the shank of the rivet 400 is deformed to spread outward, and the third piece 300 is formed of the molding table 2 . It may be ductilely deformed to correspond to the shape of the top surface. Through this, the first piece 100 , the second piece 220 , the third piece 300 , the adhesive layer 510 , and the rivet 400 may form a dissimilar material bonding body 15 together.

Although the present invention is not limited thereto, in some embodiments, the adhesive layer 510 maintains an uncured state while the rivet 400 penetrates the first piece 100 and the third piece 300, and subsequent The bonding body 15 including the finally cured adhesive layer 510 may be formed by curing in a heating process or the like.

In some embodiments, between the head of the rivet 400 and the first piece 100 , specifically between the head of the rivet 400 and the adhesive layer 510 , more specifically between the head of the rivet 400 and the second piece A cavity V may remain between the remaining portions 220a of 220 . The remaining portion 220a may be completely removed from the second piece 220 and may exist in contact with the adhesive layer 510 . In addition, although not represented in the drawings, the adhesive layer 510 is not only between the rivet 400 and the first piece 100, but also the interface between the second piece 220 and the rivet 400 shank, the first piece 100 and the rivet ( 400) It may be cured while filling the interface between the shank and/or the interface between the third piece 300 and the rivet 400 shank.

In the bonding method of dissimilar materials according to the present embodiment, in a state in which the first piece 100 and the second piece 220 are aligned and disposed to minimize the alignment process, the perforated member 1 is placed in the region where the rivet 400 is to be inserted. ), but may leave some remaining parts without completely penetrating the second piece 220 . When forming a through hole completely penetrating the second piece 220 as in the above-described embodiment, an uncured adhesive layer 510 composition is smeared on the lower end of the perforated member 1 due to process errors, etc., so that the perforated member 1 ) may deteriorate, causing an increase in process cost, and lowering of process precision.

However, as in this embodiment, when only the groove 220g is formed without completely penetrating the second piece 220, the problem that the perforated member 1 comes into contact with the adhesive layer 510 can be prevented in advance, and the perforated member ( 1) can increase the lifespan of

The thickness, strength, etc. of the other first piece 100 , second piece 220 , and third piece 300 are the same as described above, and thus overlapping descriptions will be omitted.

27 to 30 are flowcharts illustrating a bonding method of dissimilar materials according to another embodiment of the present invention. The bonding method of dissimilar materials according to the present embodiment is different from the bonding method of dissimilar materials according to the embodiment of FIG. 22 in that the base surface of the groove 230g of the second piece 230 is not flat.

Referring to FIG. 27 , an adhesive layer 510 is formed on the first piece 100 , and the second piece 200 is disposed on the adhesive layer 510 . In this step, the second piece 200 may have no through-holes and/or grooves.

Next, referring further to FIG. 28 , a groove 230g is formed in the second piece 230 . The groove 230g may not completely penetrate the second piece 230 in the third direction Z, but may leave a remaining portion 230a of the second piece 230 . The planar shape of the groove 230g may be approximately circular, but the present invention is not limited thereto.

In an exemplary embodiment, the bottom of the groove 230g, that is, the top surface of the remaining portion 230a may not be flat. For example, the thickness of the center of the groove 230g may be greater than the thickness of the edge in the plan view. In this case, the thickness of the edge of the base of the groove 230g, for example, the minimum thickness of the remaining portion 230a is about 3.0 mm or less, or about 2.0 mm or less, or about 1.0 mm or less, or about 0.8 mm or less, or about 0.6 mm or less, or about 0.4 mm or less. The shape of the base of the groove 230g may be controlled through the shape and processing method of the perforated member 1 .

Next, referring further to FIG. 29 , the rivet 400 , the third piece 300 and the forming table 2 are aligned and disposed. Since this step has been described above, a redundant description will be omitted.

Next, further referring to FIG. 30 , the rivet 400 is press-inserted into the groove 230g of the second piece 230 to form the bonding body 16 . The shank of the rivet 400 inserted into the groove 230g of the second piece 230 penetrates the remaining portion 230a, the adhesive layer 510 and the first piece 100, and is at least in the third piece 300. Partial penetration is possible. In the process of the rivet 400 passing through the first piece 100 and the third piece 300 , the shank of the rivet 400 is deformed to spread outward, and the third piece 300 is formed of the molding table 2 . It may be ductilely deformed to correspond to the shape of the top surface. Through this, the first piece 100 , the second piece 230 , the third piece 300 , the adhesive layer 510 , and the rivet 400 may form a dissimilar material bonding body 16 together.

In some embodiments, between the head of the rivet 400 and the first piece 100 , specifically between the head of the rivet 400 and the adhesive layer 510 , more specifically between the head of the rivet 400 and the second piece A cavity V may remain between the remaining portions 230a of 230 . The remaining portion 230a may be completely removed from the second piece 230 and may exist in contact with the adhesive layer 510 .

In the bonding method of dissimilar materials according to this embodiment, a groove 230g, not a through hole, is formed in the second piece 230 to prevent damage to the perforated member 1, but the shape of the base of the groove 230g is changed. By controlling the rivet 400 can be more easily penetrated under pressure. That is, since the shank of the rivet 400 has an empty interior, it may be the outer edge portion of the remaining portion 230a that affects the penetration characteristics of the rivet 400 . Therefore, although the central portion has a sufficient thickness, it is possible to facilitate penetration of the rivet 400 even though the second piece 230 is made of a material having high strength due to the shape of the base of the groove 230g. In addition, since the central portion of the remaining portion 230a has a sufficient thickness, the cavity V of the joined body 16 can be reduced, and it can also contribute to improving the bonding strength of the joined body 16 .

The thickness, strength, etc. of the other first piece 100 , second piece 230 , and third piece 300 are the same as described above, and thus overlapping descriptions will be omitted.

31 and 32 are flowcharts illustrating a bonding method of dissimilar materials according to another embodiment of the present invention. The bonding method of dissimilar materials according to the present embodiment is different from the bonding method of dissimilar materials according to the embodiment of FIG. 22 in that the third piece is not disposed.

Referring to FIG. 31 , an adhesive layer 510 is formed on the first piece 100 , a second piece 220 is disposed on the adhesive layer 510 , and then a groove 220g is formed in the second piece 220 . to form The groove 220g may not completely penetrate the second piece 220 in the third direction Z, but may leave the remaining portion 220a of the second piece 220 . And align and arrange the rivet 400 and the forming table (2). Since this step has been described above, a redundant description will be omitted.

Next, referring further to FIG. 32 , the rivet 400 is press-inserted into the groove 220g of the second piece 220 to form the bonding body 17 . The shank of the rivet 400 inserted into the groove 220g of the second piece 220 may penetrate the remaining portion 220g and the adhesive layer 510 , and may at least partially penetrate the first piece 100 . In the process of the rivet 400 passing through the first piece 100 , the shank of the rivet 400 is deformed to spread outward, and the first piece 100 is ductilely deformed to correspond to the shape of the upper surface of the forming table 2 . can be Through this, the first piece 100 , the second piece 220 , the adhesive layer 510 , and the rivet 400 may form a dissimilar material bonding body 17 together.

33 is a cross-sectional view showing a dissimilar material bonding body 18 prepared according to a bonding method according to another embodiment of the present invention.

Referring to FIG. 33 , in the dissimilar material bonding body 18 according to the present embodiment, the dissimilar material bonding body 16 according to the embodiment of FIG. 30 is that the first piece 110 and the second piece 240 are bent and deformed. is different from

In addition to the third piece 310 , the first piece 110 , the second piece 240 , and the adhesive layer 520 are subjected to downward pressure while the rivet 400 is inserted and may be partially bent downwardly. . In addition, the remaining portion 240a dropped from the second piece 240 may also have an edge bent downward and be in close contact with the shank of the rivet 400 .

In addition, the thickness, strength, etc. of the first piece 110 , the second piece 240 , and the third piece 310 , and the bonding method of the dissimilar material bonding body are the same as described above, and thus overlapping descriptions will be omitted.

34 is a cross-sectional view showing a dissimilar material bonded body 19 prepared according to a bonding method according to another embodiment of the present invention.

Referring to FIG. 34, in the dissimilar material bonding body 19 according to the present embodiment, the dissimilar material bonding body 19 according to the embodiment of FIG. 33 in which the remaining portion 250a of the second piece 250 is surrounded by the adhesive layer 520 ( 18) is different.

In some embodiments, while the rivet 400 is inserted, the adhesive layer 520 is formed between the remaining portion 250a and the first piece 110 as well as on the side surface of the remaining portion 250a and the top surface of the remaining portion 250a. may exist in Also, a cavity V may remain between the adhesive layer 520 and the head of the rivet 400 .

Although not shown in the drawings, the adhesive layer 520 is the interface between the second piece 250 and the rivet 400 shank, the interface between the first piece 110 and the rivet 400 shank, and/or the third piece 310 and The rivet 400 may be cured while filling the interface between the shank.

In addition, the thickness, strength, etc. of the first piece 110 , the second piece 250 , and the third piece 310 , and the bonding method of the dissimilar material bonding body are the same as described above, and thus overlapping descriptions will be omitted.

35 is a cross-sectional view showing a dissimilar material bonding body 20 prepared according to a bonding method according to another embodiment of the present invention.

Referring to FIG. 35 , the dissimilar material bonding body 20 according to the present embodiment includes a first piece 120 , a second piece 260 and a third piece 310 , but the first piece 120 and / Alternatively, the second piece 260 is different from the dissimilar material assembly 19 according to the embodiment of FIG. 34 in that each of the plurality of layers is configured.

In an exemplary embodiment, the first piece 120 may include a 1-1 sub-piece 121 , a 1-2 sub-piece 122 , and a 1-3 sub-piece 123 . The 1-1 sub-piece 121 , the 1-2 sub-piece 122 , and the 1-3 sub-piece 123 are made of substantially the same material, and may be stacked to abut against each other. That is, in the present embodiment, the 'piece' may be used to mean a division of layers having substantially the same physical properties and characteristics, rather than a physically separated individual layer.

Also, the second piece 260 may include a 2-1 sub-piece 261 , a 2-2 sub-piece 262 , and a 2-3 sub-piece 263 . The 2-1 th sub-piece 261 , the 2-2 sub-piece 262 , and the 2-3 th sub-piece 263 may be made of substantially the same material and may be stacked to contact each other. Although the present invention is not limited thereto, the remaining portion 260a of the second piece 260 may be derived from the second-first sub-piece 261 .

In addition, the thickness, strength, etc. of the first piece 120 , the second piece 260 , and the third piece 310 , and the bonding method of the dissimilar material bonding body are the same as described above, and thus overlapping descriptions will be omitted.

In the above, the embodiment of the present invention has been mainly described, but this is only an example and does not limit the present invention. It will be appreciated that various modifications and applications not exemplified above are possible.

Therefore, it should be understood that the scope of the present invention includes changes, equivalents or substitutes of the technical idea exemplified above. For example, each component specifically shown in the embodiment of the present invention may be implemented by modification. And differences related to such modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

110: first piece
240: second piece
240a: residual layer
310: third piece
400: rivet
520: adhesive layer
V: cavity

Claims (13)

disposing a second piece on one side of the first piece;
forming a groove in the second piece with the second piece disposed on the first piece; and
and disposing a rivet to overlap the groove of the second piece and inserting the rivet from a side of the second piece. According to claim 1,
The disposing of the second piece may include interposing an adhesive layer between the first piece and the second piece and disposing the second piece. According to claim 1,
Prior to the step of inserting the rivet, further comprising the step of placing a third piece on the other surface of the first piece,
the groove of the second piece overlaps the third piece;
the shank of the rivet passes through the first piece;
wherein the shank of the rivet at least partially penetrates the third piece. 4. The method of claim 3,
A method of joining dissimilar materials in which the bottom of the groove of the second piece has a center thickness greater than a planar edge thickness. 4. The method of claim 3,
The maximum thickness of the first piece is less than the maximum thickness of the second piece,
the maximum thickness of the base of the groove of the second piece is less than the maximum thickness of the first piece;
The maximum thickness of the first piece is a bonding method of dissimilar materials of 3.0 mm or less. 4. The method of claim 3,
The strength of the first piece is at least 1.2 Pa,
The strength of the second piece is 1.5 GPa or more,
The strength of the third piece is 500 MPa or less bonding method of dissimilar materials. The method of claim 1,
The first piece is a carbon fiber-reinforced plastic, and the second piece is a metal material. disposing a second piece on one side of the first piece and disposing a reinforcing piece on the other side of the first piece; and
inserting a rivet from the side of the second piece;
wherein the rivet completely penetrates the first piece and at least partially penetrates the reinforcing piece. 9. The method of claim 8,
Between the step of disposing the first piece, the second piece and the reinforcing piece and the step of inserting the rivet, further comprising the step of forming a groove or a through-hole in the second piece from the second piece side The bonding method of dissimilar materials. A dissimilar material assembly including a first piece and a second piece joined using a self-piercing rivet, wherein the rivet is inserted from the side of the second piece,
In a cross-section, a dissimilar material assembly having a cavity between the head of the rivet and the first piece. 11. The method of claim 10,
In a cross-sectional view, a residual layer of the same material as that of the second piece exists between the cavity and the first piece, wherein a maximum thickness of the residual layer is smaller than a maximum thickness of the second piece. 12. The method of claim 11,
On a cross-section, between the residual layer and the first piece, an adhesive layer in contact with the first piece is further present. 11. The method of claim 10,
A third piece spaced apart from and coupled to the second piece with the first piece interposed therebetween, further comprising a third piece having greater ductility than the first piece,
The shank of the rivet completely penetrates the first piece and at least partially penetrates the third piece.

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