KR20210151698A - Multi input and multi output antenna apparatus - Google Patents

Abstract

The present invention relates to a multiple input/output antenna device. More particularly, the antenna device includes a main board in which an accommodation space is formed in at least one area in the form of a predetermined space, and a sub-board which is stacked on the rear side of the main board, and on which a plurality of heating elements are mounted on a front portion facing the accommodation space. The heat generated from the heating elements is provided to radiate heat toward the rear side of the sub-board, so that the heat dissipation performance of the antenna device is improved, and the frequency filtering performance of the antenna device is improved.

Description

MULTI INPUT AND MULTI OUTPUT ANTENNA APPARATUS

The present invention relates to a multiple input/output antenna device, and more particularly, to a multiple input/output antenna device capable of improving antenna performance by efficiently dissipating heat generated from an RF element and heat generated from an RF filter to the rear of a main housing it's about

A wireless communication technology, for example, MIMO (Multiple-Input Multiple-Output) technology, is a technology that uses multiple antennas to dramatically increase data transmission capacity, and the transmitter transmits different data through each transmit antenna and , it is a spatial multiplexing technique that separates transmitted data through appropriate signal processing in the receiver.

Accordingly, as the number of transmit/receive antennas is simultaneously increased, the channel capacity increases, allowing more data to be transmitted. For example, in order to increase the number of antennas to 10, about 10 times the channel capacity is secured by using the same frequency band compared to the current single antenna system. In the case of a transceiver to which the MIMO technology is applied, as the number of antennas increases, the number of transmitters and filters also increases.

In particular, in the main housing, a plurality of substrates (eg, a printed board assembly (PBA) closely disposed on the rear side in the installation space of the main housing, an antenna board and a PBA or antenna board stacked at a predetermined distance apart from the front side of the PBA) A PSU substrate disposed on one side of the ) is stacked, and a plurality of RF power supply network elements and RF filters that generate a large amount of driving heat during operation are installed.

However, in the case of the conventional multiple input/output antenna device, a large amount of driving heat generated inside the main housing during operation must be effectively dissipated to the outside (especially the rear) of the main housing. For this purpose, a heating element is mounted on the front side of the PBA Then, a structure for dissipating heat is adopted by processing a plurality of via holes penetrating to the rear of the PBA, which is the mounting surface of the heating element, or by installing a heat transfer coin at positions corresponding to the plurality of via holes.

However, since PBA is generally made of a substrate material with low thermal conductivity, the structure for discharging heat through the via hole has a small contact area between the heating element and the via hole, so the heat dissipation efficiency is small, while the structure using a heat transfer coin also has a heating element and There is a problem in that a predetermined heat dissipation effect decreases due to the contact tolerance of the contact surface of the

The present invention has been devised to solve the above technical problem, and it is an object of the present invention to provide a multiple input/output antenna device capable of maximizing heat dissipation performance through a sub-board separated from the main board so as to be in direct contact with the rear side of the main housing. do it with

In addition, the present invention provides a multi-input/output antenna device that not only expands the ground area but also enables impedance matching with the ground pattern of the sub-board by distributing heat generating elements such as RF power supply network elements on the front and rear surfaces of the sub-board. to provide another purpose.

In addition, a clamshell part is integrally formed at the rear end of the multi-band filter, and the integrated clamshell part is used to shield between Tx/Rx and Tx/Tx in the same multi-band filter to ensure isolation, thereby reducing signal interference. It is another object to provide a multi-input/output antenna device that can

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

In one embodiment of the multiple input/output antenna device according to the present invention, a main board having an accommodation space formed in a predetermined space form in at least one area, and a plurality of stacked portions on the rear side of the main board, and a plurality of front portions facing the accommodation space It includes a sub-board on which heating elements are mounted, and heat generated from the heating elements is radiated toward a rear surface of the sub-board.

Here, the main board is disposed in a relatively front part of the sub board, and the sub board is stacked so that the front part is in close contact with a part of the rear part of the main board, and is in a range in which the front part is not in contact with the rear part of the main board. The accommodating space may be formed, and the plurality of heating elements may be mounted on a front portion corresponding to the accommodating space.

In addition, the main board is an integrated one-board in which the multi-layer layers stacked in the front and rear are integrally bonded, and forms an accommodating space in which at least a part of the multi-layers are removed in some areas of the rear part, and the sub-board, Among the multi-layer layers, the plurality of heating elements may be stacked on the rear side of the rearmost layer of the main board, and the plurality of heating elements may be mounted on the front portion facing the accommodation space.

In addition, the amount of thermal expansion of the sub-board according to the temperature increase due to the driving of the heating elements may be smaller than the amount of thermal expansion of the main board.

In addition, the front and rear thicknesses of the sub board may be smaller than the front and rear thicknesses of the main board.

In addition, first heating elements are disposed on the front part of the main board, and second heating elements are disposed on the front part of the sub-board, and the output power of the second heating elements is higher than the output power of the first heating elements. can be large

In addition, the first heating elements may be Rx elements (LNA), and the second heating elements may be Tx elements (PA and DA).

In addition, third heating elements may be further disposed on the rear side of the sub-board.

In addition, the third heating elements may include an FPGA.

In addition, digital semiconductors are mounted on a rear surface of the main board that does not overlap with the front surface of the sub-board, and heat generated from the digital semiconductors of the main board is generated from a plurality of heat generating elements of the sub-board together with heat. It may be characterized in that heat is radiated toward the rear side of the sub-board.

In addition, the main board and the sub-board may be made of an epoxy resin material.

Also, the main board may include a plurality of sections having a plurality of transmission/reception channels, and the sub-board may be formed in a number corresponding to each of the plurality of sections.

In addition, the sub-board may further include an oscillation prevention circuit for preventing oscillation of the heating elements.

Also, the sub-board may be a multi-layer substrate having at least two layers.

In addition, an active element as a part of the heating elements is mounted on a layer layer corresponding to the front surface of the sub-board, and a passive element as the rest of the heating elements is arranged on a layer layer corresponding to the rear surface of the sub-board, , the heat generated from the active element and the passive element may be radiated to the rear side of the sub-board.

In addition, a ground pattern (GND pattern) is formed between the heating elements among the layer layers corresponding to the rear surface of the sub-board, and the ground pattern is in contact with the inner surface of the main board and the antenna housing in which the sub-board is installed. Thus, it is possible to increase the shielding area of electromagnetic waves generated by the sub-board.

Also, in the sub-board, the at least two layer layers may be bonded and formed in the same manner as the multi-layer layer of the main board.

In addition, at least one heat transfer bridge hole for discharging heat generated from the heat generating elements to the rear may be formed in the sub-board.

In addition, the heat transfer bridge hole may be filled with a heat conductive material.

In addition, the sub-board may be a metal PCB.

In addition, the front part is provided with a mounting space in which the main board and the sub-board are installed, and the rear part of the antenna housing part is integrally formed with a plurality of heat sink fins that receive heat generated from the heating elements and radiate heat to the outside. may include more.

Also, the rear surface of the sub board and the inner surface of the antenna housing may be in surface thermal contact so that heat generated from the heating elements is transferred to the rear surface of the sub board and radiated through the plurality of heat sink fins.

In addition, an accommodation space for accommodating the resonator is provided, a plurality of filters seated on the front part of the main board, and a plurality of filters stacked on the front part of the plurality of filters, a predetermined electrical signal line is constructed through the plurality of filters A plurality of antenna elements may further include an antenna board mounted on the front side.

In addition, at the rear end of the plurality of filters, a clamshell portion for shielding signal interference with the electrical signal line may be integrally formed.

In addition, a plurality of transmission channels and reception channels corresponding to the electrical signal lines are provided on the front surface of the main board, and the clamshell unit includes a transmission/reception partition for shielding regions of the transmission and reception channels to be spatially partitioned. It may include ribs.

In addition, the clamshell unit may further include a transmission unit partitioning rib provided as a pair of the transmission channels to shield the transmission circuit patterns spaced apart from each other by a predetermined distance in space.

In addition, at least one position fixing protrusion protruding toward the main board is formed at the rear end of the plurality of filters, and the clamshell part has at least one position fixing protrusion formed at a position corresponding to the main board. When seated in one positioning groove, the transmission channel and the reception channel area and the transmission circuit pattern can be completely partitioned by the transmission/reception partition rib and the transmission unit partition rib.

In addition, at the rear end of the plurality of filters, a pair of mainboard-side RF connectors electrically connected to the main board are provided, and at the front end of the plurality of filters, stacked on the front end of the plurality of filters A pair of antenna board-side RF connectors for electrically connecting to the antenna board may be provided.

According to the multiple input/output antenna device according to the present invention, various effects as follows can be achieved.

First, it has the effect of improving the heat dissipation performance by more easily dissipating the heat generated from the heat generating elements to the outside of the antenna housing by using the sub board separately from the main board.

Second, by configuring the sub-board as two layers, it is possible to improve the ground shielding effect between the antenna housing and the sub-board.

Third, by integrally forming the clamshell part at the rear end of the multi-band filter, the space in which the resonator is installed is expanded, so that the filter performance can be improved.

Fourth, by using the clamshell unit formed integrally with the multi-band filter, a plurality of sections composed of a plurality of transmission/reception channels included in the main board can be individually shielded from electromagnetic waves by one assembly action.

The effects of the present invention are not limited to the above-mentioned effects, and other problems not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a perspective view showing an embodiment of a multiple input/output antenna device according to the present invention;
Figure 2 is an exploded perspective view of Figure 1,
3 is an exploded perspective view of FIG. 1, showing a state in which a sub-board and a multi-band filter are separated from the main board;
4 is a partial cross-sectional view taken along line AA of FIG. 3;
5A and 5B are exploded perspective views of FIG. 1 , a downward perspective view and an upward perspective view showing a state in which the multi-band filter is separated from the main board;
6 is a bottom perspective view and an upward perspective view showing a multi-band filter in the configuration of FIG. 1;
7 is a cross-sectional view showing a plurality of section regions of the main board partitioned by the clamshell part in the configuration of the multi-band filter;
8 is a front view and a rear view showing a sub-board in the configuration of FIG. 1;
9 is a cross-sectional view taken along line BB of FIG. 3 in a state in which the multi-band filter is mounted in the configuration of FIG. 1;
10 is a schematic diagram of various embodiments in which the heat dissipation structure of FIG. 9 is detailed.

Hereinafter, a multiple input/output antenna device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in describing the embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function interferes with the understanding of the embodiment of the present invention, the detailed description thereof will be omitted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms. In addition, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

1 is a perspective view showing an embodiment of a multiple input/output antenna device according to the present invention, FIG. 2 is an exploded perspective view of FIG. 1, and FIG. 3 is an exploded perspective view of FIG. It is an exploded perspective view showing the separated state.

One embodiment (1) of the multiple input/output antenna device according to the present invention is formed in a rectangular parallelepiped shape having a long and thin front and rear accommodation width in an approximately vertical direction, forming a mounting space opened to the front (upper side in the drawing in FIG. 1) The first stacked assembly 100 primarily stacked inside the mounting space of the antenna housing unit (not shown), the second stacked assembly 200 mounted and fixed to the front surface of the first stacked assembly 100 , and the second and a third stacked assembly 300 stacked on the front end of the stacked assembly 200 .

In addition, one embodiment (1) of the multiple input/output antenna device according to the present invention is disposed at one end (lower end) in the longitudinal direction of the first stacked assembly 100 as shown in FIGS. 1 and 2 , and the first A power supply unit (hereinafter, abbreviated as 'PSU') 50 for supplying power to a plurality of RF power supply network components provided in the stacked assembly to the third stacked assembly 100 to 300 is further added. may include

The PSU 50 serves to control the supply of power to a plurality of RF power supply network components provided in the first to third stacked assemblies 100 to 300 to perform calibration feed control and frequency filtering. do.

The first stacked assembly 100 may include a main board 110 and a sub-board 150 as shown in FIGS. 2 and 3 .

On the front and rear surfaces of the main board 110 and the front and rear surfaces of the sub-board 150, the plurality of RF power supply network components described above, and the heating elements 111, 151, and 181 that emit predetermined heat during operation according to the application of power are dispersed. can be mounted.

The main board 110 and the sub-board 150 may each be provided with an F4 resin-based substrate made of an epoxy resin material. However, the main board 100 and the sub-board 150 do not necessarily have to be made of an epoxy resin material, and different materials may be adopted according to the main function of the substrate. For example, the sub-board 150 may be made of a metal PCB material in that the heat dissipation function is prioritized, as will be described later.

The main board 110 has a predetermined thickness, and, as described above, may be formed of a thin rectangular plate made of an epoxy resin material.

Here, at least one low noise amplifier (LNA), which is an Rx element, may be mounted on the front surface of the main board 110 as a first heating element among the above-described heating elements. In addition, digital semiconductor devices such as a Filed Programmable Gate Array (FPGA) may be mounted on the rear surface of the main board 110 as the third heating element among the aforementioned heating elements. The FPGA is mounted on the rear surface of the main board 110, is mounted on the rear surface of the main board 110 exposed to the rear without overlapping with the sub-board 150, and is in surface thermal contact with the inner surface of the mounting space of the antenna housing unit. The generated heat may be directly radiated through a plurality of heat sink fins (not shown) integrally formed on the rear surface of the antenna housing.

The main board 110 may include a plurality of sections having a plurality of transmission/reception channels. Here, the plurality of transmit/receive channels may include a transmitter channel and a receiver channel, and each transmitter channel and receiver channel may be patterned to be spaced apart from each other by a predetermined distance in the left and right width direction of the main board 110 . A plurality of sections having such a plurality of transmission/reception channels may be provided to be spaced apart from each other by a predetermined distance in the vertical and longitudinal direction of the main board 110 .

Here, each section is formed in the number of columns corresponding to the unit multi-band filter 210 in the configuration of the second stacked assembly 200 to be described later, and 16 Tx elements and 16 Rx elements are mounted in one section range. and by having 4 such sections, a Massive MIMO technology with a transmission capacity of 64T/R can be applied.

For reference, in one unit multi-band filter 210, as will be described later, two cavities 205 are partitioned inside by a partition wall (reference numerals not indicated), and the resonator 215 in each cavity 205 is provided. Two Rx elements (LNA), which are the first heating elements 111 among the heating elements, in the region corresponding to one unit multi-band filter 210 in that frequency filtering of the transmission channel and the reception channel is possible using And two Tx elements (transistor (TR) and power amplifier (PA)), which are second heating elements, may be mounted and disposed in corresponding regions of the main board 110 and the sub-board 150 .

Meanwhile, the sub-board 150 may serve as an auxiliary substrate closely coupled to the rear surface of the main board 110 . Here, it is preferable that the thickness of the sub-board 150 is relatively smaller than the thickness of the main board 110 . In addition, in that the sub-board 150 is in direct thermal contact with the inner surface of the mounting space of the antenna housing part and additionally performs a function of transferring heat generated from the plurality of heating elements 111, 151, 181, heat transfer is better than that of the epoxy resin material. It is preferable to be provided with an easy metal PCB.

On the front surface of the sub-board 150 , as described above, a pattern circuit in which two Tx elements, which are the second heating elements 151 among the heating elements, are mounted, may be printed. In each of the pattern circuits, one second heating element 151 is mounted, respectively, and a transmission channel and a reception channel can be completed by the two pattern circuits. The transmit channel and the receive channel may be electrically connected to a pair of mainboard-side RF connectors 233 provided in a unit multi-band filter 210 to be described later, respectively.

4 is a partial cross-sectional view taken along line AA of FIG. 3, and FIGS. 5A and 5B are exploded perspective views of FIG. 1, showing a state in which the multi-band filter is separated from the main board. 1 is a bottom perspective view and an upward perspective view showing the multi-band filter, and FIG. 7 is a cross-sectional view showing a plurality of section regions of the main board divided by the clamshell part in the configuration of the multi-band filter.

The second stacked assembly 200 is disposed between the main board 110 of the first stacked assembly 100 and the antenna board 310 of the third stacked assembly 300 as shown in FIGS. 4 to 6 . It may include a filter 210 that performs frequency filtering. Here, the filter 210 may be employed as any one of a cavity filter, a wave-guide filter, and a dielectric filter. In addition, the filter herein does not exclude a multi-band filter (MBF) that covers multiple frequency bands.

As described above, a plurality of filters 210 are fixed to cover an area corresponding to a plurality of sections provided on the main board 110, and a pair of transmit and receive channels may be included in the corresponding area. have.

In more detail, in the filter 210, two cavities 205 are partitioned left and right by a partition wall, and frequency filtering through a transmission channel and a reception channel by a plurality of resonators 215 provided in each cavity 205 can be performed.

The filter 210 may be provided such that its inner cavity 205 and external noise (such as a signal due to electromagnetic waves) are shielded, and its inner surface is plated in the form of a metal thin film, and as will be described later, the filter ( The clamshell part 250 integrally formed at the rear end of the 210 may also be the same.

On the other hand, the main board 110, at least one positioning groove (115a, 115b) for designating each installation position of the unit MBF (210) may be formed. Here, also at the rear end of the unit filter 210, at least one positioning protrusion ( 215a, 215b) may be formed.

In addition, a clamshell part 250 for shielding signal interference with an electrical signal line may be integrally formed at the rear end of the filter 210 .

The clamshell unit 250 is shielded so that the regions of the transmission channel 253 ″ and the reception channel 251 ′ included in the main board 110 are spatially partitioned, as shown in FIGS. 5A and 5B and FIG. 7 . Transmitting unit partition ribs 253a and 253b provided as a pair of the transmission/reception partitioning rib 251 and the transmission channel 253″ to shield the transmission circuit patterns spaced apart from each other by a predetermined distance are partitioned in space.

Here, the transmission/reception partitioning rib 251 of the clamshell unit 250 serves to spatially partition and shield a pair of Rx elements, which are the first heating elements 111 mounted on the front surface of the main board 110 . do.

In addition, the transmitter division ribs 253a and 253b of the clamshell unit 250 spatially partition and shield the two Tx elements, which are the second heating elements 151 mounted on each pattern circuit of the sub-board 110 . play a role

In this way, by using each partition rib 251,253 of the clamshell part 250 integrally formed at the rear end of the filter 210, the influence of electromagnetic waves between the Rx elements and the Tx elements is maximally shielded, and at the same time, a pair of By shielding the signal influence between the Tx elements, the frequency filter performance can be greatly improved.

In addition, by integrally forming the clamshell part 250 at the rear end of the filter 210, the cavity 205 space of the filter 210 is further expanded to the rear side, thereby making the spaced space of the plurality of resonators 215 wider. As a result, it is possible to secure an additional advantage of minimizing the amount of heat generated during operation by improving the Q value.

On the other hand, when the clamshell part 250 of the filter 210 is seated in the positioning grooves 115a and 115b of the main board 210 at least one positioning protrusion 215a, 215b formed at the rear end thereof, The rear ends of the transmission/reception partition rib 251 and the transmission part partition rib 253 are provided to completely partition the transmission channel and the reception channel area and the transmission circuit pattern with an operation in close contact with the front surface of the main board 110 . Here, the filter 210 may be assembled to the main board 210 with a predetermined assembly force through an assembly screw (not shown) passing through the positioning protrusions 215a and 215b and the positioning grooves 115a and 115b.

In addition, at the rear end of the filter 210, as shown in FIGS. 5A and 5B , a pair of mainboard-side RF connectors 230 electrically connected to the main board 110 are provided, and the filter 210 is provided. ) at the front end of the filter 210, a pair of antenna board-side RF connectors 240 electrically connected to the antenna board 310 among the configurations of the third stacked assembly 300 stacked on the front end of the filter 210 to be provided. can

A pair of mainboard-side RF connectors 230 are provided with one connector 230a and the other connector 230b connected to each cavity 205 side of the filter 210 so as to take charge of a transmission channel and a reception channel, respectively, The pair of antenna board side RF connectors 240 may also include one connector 240a and the other connector 240b connected to each cavity 205 side of the filter 210 so as to take charge of a transmission channel and a reception channel, respectively. .

Here, the main board-side RF connector 230 is, as shown in FIG. 4 , a connecting boss 231 , a connecting terminal pin 233 disposed to pass through the inside of the connecting boss 231 and a filter 210 . It may include an elastic ground washer 235 that serves as a ground while absorbing the assembly tolerance between the and the main board 110 .

In the main board 110 , the connecting part 140 for inserting and fastening the connecting terminal pin 233 may be provided in the form of a hole, and a dielectric 130 for impedance matching is embedded around the connecting part 140 . (imbeded) may be provided in the form. The connecting terminal pin 233 may pass through the dielectric 130 to be electrically signal-connected to the sub-board 150 laminated to the rear side of the main board 110 . Conventionally, the sub-board 150 is not provided, and the connecting part 140 is provided on the front side of the main board 110, so that the dielectric 130 for impedance matching with respect to the periphery of the connecting part 140 is formed. Although it was impossible to install, in the case of an embodiment of the present invention, the sub-board 150 is separated and stacked on the rear surface of the main board 110 and the dielectric 130 can be installed as much as the thickness of the main board 110 in an embedded form. , the above-described impedance matching design between the sub-board 150 and the ground layer has the advantage of being very easy.

On the other hand, the RF connector 240 on the antenna board side, as shown in FIG. 4 , a contact terminal pin 243 that is in contact with a contact part (not shown) provided on the rear side of the antenna board 310, and a contact point To absorb the assembly tolerance between the dielectric block 241 and the filter 210 and the antenna board 310 for fixing the terminal pin 243 to the filter 210 while maintaining the impedance matching, as well as serving as a ground It may include an elastic ground washer 245 .

In the multiple input/output antenna device 1 according to an embodiment of the present invention having the above configuration, during the signal reception process, a signal received through the antenna element 320 of the third stacked assembly 300 is transmitted to the second stacked assembly. In the configuration of 200 , it is filtered to a predetermined frequency band through the filter 210 , and then is inputted to the main board 110 of the first stacked assembly 100 for data processing. At this time, the signal passes through the receiver channel, but the Rx element and the Tx element are driven to generate heat, and the driving heat generated therefrom passes through the sub-board 150 provided with a metal PCB to facilitate rear heat dissipation. have.

Conversely, during the signal transmission process, the signal transmitted from the main board 110 of the first stacked assembly 100 is filtered to a predetermined frequency band through the filter 210 during the configuration of the second stacked assembly 200 and then It may be oscillated through the antenna element 320 of the three-layered assembly 300 . Likewise at this time, the signal passes through the transmitter channel, but the Rx element and the Tx element are driven to generate heat, and the driving heat generated therefrom is rearwardly radiated via the sub-board 150 provided with the metal PCB. have.

In addition, the reception channel part and the transmission channel part are spaced apart and shielded by the clamshell part 250 integrally formed at the rear end of the filter 210, so that signal interference can be prevented in advance.

As shown in FIGS. 1 to 7 , the third stacked assembly 300 includes an antenna board 310 stacked on the front end of the filter 210 , and a plurality of mounted and fixed antenna boards on the front surface of the antenna board 310 . may include an antenna element 320 of

8 is a front view and a rear view showing a sub-board in the configuration of FIG. 1, and FIG. 9 is a cross-sectional view taken along line BB of FIG. 3 with a multi-band filter mounted in the configuration of FIG. 1, FIG. It is a schematic diagram of various embodiments in which the heat dissipation structure of FIG. 9 is detailed.

The multiple input/output antenna device 1 according to an embodiment of the present invention includes a first heating element 111 and a third heating element 181 of a main board 110 that receives power from a PSU 50 and operates; , a considerable amount of driving heat may be generated from the second heat generating element 151 of the sub-board 150 .

Conventionally, the plurality of heating elements 111, 151, 181 are dispersedly mounted on the front and rear surfaces of the main board 110, and heat generated from the heating elements 111, 151, 181 is radiated to the rear of the main board 110, and the main A structure for dissipating heat through a plurality of heat sink fins of the antenna housing portion disposed to be in thermal contact with the rear surface of the board 110 is adopted.

However, the amount of heat generated by the Tx element, which is the second heating element 151 among the plurality of heating elements 111, 151, 181, is very large, whereas it is mounted on the front surface of the main board 110 formed of a substrate material with low thermal conductivity. There is a problem in that the heat transfer efficiency (ie, heat dissipation performance) to the rear of the main board 110 is very low.

The multiple input/output antenna device 1 according to an embodiment of the present invention proposes various design methods as follows in order to solve the above-described problems.

As a first embodiment, in the multiple input/output antenna device 1 according to the present invention, as shown in FIG. A plurality of heating elements (eg, second heating elements 151) are mounted on the board 110a and the back side of the main board 110a, and are stacked on the front side facing the receiving space 110s-1. and a sub-board 150 .

In addition, as a second embodiment, in the multiple input/output antenna device 1 according to the present invention, as shown in FIG. A plurality of heating elements 151 are mounted on the front part so as to have a range (refer to reference numeral '110s-2') in contact with the rear part of the main board 110b and are stacked in close contact with a part of the rear part of the 110b. and a sub-board 150 .

On the other hand, as a third embodiment, the multiple input/output antenna device 1 according to the present invention is an integrated one-board in which the multi-layer layers stacked in the front and rear are integrally bonded, as shown in FIG. On the rear side of the main board 110c having the accommodating space 110s-3 from which at least some of the multi-layer layers are removed in a part of the rear portion and the layer layer located at the rearmost side of the main board 110c among the multi-layer layers The stacked sub-board 150 may include a plurality of heating elements mounted on the front portion facing the receiving space 110s-3.

Here, the heat dissipation structure according to the first to third exemplary embodiments is characterized in that heat generated from the heat generating elements 151 is radiated toward the rear surface of the sub-board 150 .

To this end, at least one heat transfer bridge hole 153 for discharging heat generated from the heat generating elements 151 to the rear may be formed in the sub-board 150 .

Here, the heat transfer bridge hole 153 may be processed in a hole shape to discharge heat generated from the heat generating elements 151 to the rear, and may be filled with a metal material having excellent thermal conductivity.

Accordingly, heat generated from the heating elements 151 mounted on the front side of the sub-board 150 may be smoothly transferred to the rear side of the sub-board 150 via the heat transfer bridge hole 153 .

On the other hand, it is preferable that the amount of thermal expansion of the sub-board 150 according to the temperature rise due to the driving of the heating elements 151 is smaller than the amount of thermal expansion of the main board 110 . This is by designing the sub-board 150 on which the second heating elements 151, which are expected to generate substantially the most heat among the heating elements 111, 151, and 181, to have a small amount of thermal expansion, thereby minimizing thermal deformation and increasing thermal contact resistance. to prevent doing

For the same reason, the front and rear thicknesses of the sub board 150 may be designed to be smaller than the front and rear thicknesses of the main board 110 .

In general, the main board 110 is provided in a form in which a plurality of multi-layer layers are integrally bonded, and a pattern not shown is designed along each layer layer. There are physical limitations.

In the heat dissipation structure newly proposed in the multiple input/output antenna device 1 according to an embodiment of the present invention, the thickness of the main board 110 is maintained as the existing design value, but the sub-board 150 is substantially improved in heat dissipation performance. ) is proposed.

Circuit patterns corresponding to the transmission channel and the reception channel may be printed on the front surface of the sub-board 150 so that the second heating elements 151, which are expected to generate the most heat among the heating elements 111, 151, and 181, are mounted.

The main board 110, the second heating elements 151 mounted on the above-described sub-board 150 are exposed to the front, or at least in the above-described receiving spaces 110s-1 and 110s-3, the main board 110 and may be formed to be accommodated in a non-contact range (110s-2).

Referring to FIG. 10A , the accommodating space 110s-1 may be provided in the form of an opening through which the main board 110a is penetrated in the front and rear.

In addition, as shown in (b) of FIG. 10 , the non-contact range 110s - 2 may be provided in a form in which a portion of the rear surface of the main board 110b is cut rearward.

In addition, as shown in (c) of FIG. 10 , the accommodation space 110s-3 is in a form in which at least a portion of the multi-layer layer is removed from a portion of the multi-layer layer provided on the main board 110c. It is also possible to be provided. In this case, the sub-board 150 has a different name from the main board 110c, but is not physically separated, and is provided in two layers as the same layer as the main board 110c, so that the second heating elements are provided. 151 may be integrally bonded to the rear surface of the main board 110 so as to be accommodated in the accommodation space 110s-3 in a state in which the 151 is mounted on the front portion.

On the other hand, when the first heating elements 111 are disposed on the front part of the main board 110 and the second heating elements 151 are disposed on the front part of the sub-board 150, the second heating elements The output power (ie, amount of heat) of 151 is preferably set to be greater than the output power (ie, amount of heat) of the first heat generating elements 111 . This is to maximize heat dissipation performance by locating the second heat generating elements 151 having high output power closer to the plurality of heat sink fins of the antenna housing. Therefore, in the multiple input/output antenna device according to an embodiment of the present invention, the Tx element, which is the second heating element 151 having the largest amount of heat relatively among the heating elements 111 , 151 , and 181 , is mounted on the front surface of the sub-board 150 . The layout design was adopted.

In addition, digital semiconductors such as FPGAs are mounted on the rear surface of the main board 110 , which does not overlap the front surface of the sub-board 150 , as the third heating elements 181 , and the third of the main board 110 . The heat generated from the heat generating elements 181 may be radiated toward the rear side of the sub board 150 together with the heat generated from the plurality of second heat generating elements 151 of the sub board 150 .

In this case, since the third heating elements 181 are mounted on the rear surface of the main board 110 in a range where the sub-board 181 and the main board 110 do not overlap each other, the surface thermal contact is directly on the inner surface of the antenna housing. It is also possible for heat conduction to occur.

On the other hand, as shown in FIG. 10C , when the sub-board 150 is provided as a multi-layer substrate having two layer layers, a layer layer corresponding to the front surface of the sub-board 150 includes one of the heating elements. An active element may be mounted as a part, and a passive element may be disposed as the rest of the heat generating elements in a layer layer corresponding to the rear surface of the sub-board 150 . Here, it is natural that heat generated from the active element and the passive element is radiated to the rear side of the sub-board 150 .

Here, a ground pattern (GND pattern) (not shown) may be formed between the heating elements (passive elements) among the layer layers corresponding to the rear surface of the sub-board 150 . The ground pattern is in contact with the inner surface of the antenna housing on which the main board 110 and the sub-board 150 are installed, and functions to shield electromagnetic waves generated from the sub-board 150 . In this way, by distributing the above-described heating elements on the front and rear portions of the sub-board 150 disposed on the rear portion of the main board 110, respectively, the ground pattern (GND pattern) that can be formed between the heating elements An area may be increased, and an increase in the area of the ground pattern may increase a contact area with the inner surface of the antenna housing part, thereby achieving a more improved electromagnetic wave shielding rate.

In addition, although not shown in the drawings, the sub-board 150 may further include an oscillation prevention circuit for preventing oscillation of the heating elements. The oscillation prevention circuit minimizes the driving heat by pre-blocking the high-frequency oscillation of the heat generating elements according to the circuit configuration, and can easily radiate the minimized driving heat to the rear side of the sub-board 150 as described above.

As described above, in the multiple input/output antenna device according to an embodiment of the present invention, the heating elements that were intensively mounted on the main board 110 of the conventional one-board type are divided into the sub-board 150 and mounted to prevent heat concentration, and , has the advantage of improving the overall heat dissipation performance by effectively dissipating rear heat through a plurality of heat sink fins of the antenna housing provided on the rear side of the sub-board 150 .

In the above, an embodiment of the multiple input/output antenna device according to the present invention has been described in detail with reference to the accompanying drawings. However, the embodiment of the present invention is not necessarily limited by the above-described embodiment, and it is natural that various modifications and implementations within an equivalent range are possible by those skilled in the art to which the present invention pertains. will be. Therefore, the true scope of the present invention will be determined by the claims to be described later.

1: multiple input/output antenna device 100: first stacked assembly
110: main board 150: sub board
200: second stacked assembly 210: multi-band filter
250: clamshell part 300: third stacked assembly
310: antenna board 320: antenna element

Claims (28)

a main board having an accommodation space formed in at least one area in a predetermined space shape; and
a sub-board stacked on the rear side of the main board and having a plurality of heating elements mounted on the front portion facing the accommodation space; including,
The heat generated from the heating elements is characterized in that the heat is radiated toward the rear side of the sub-board, multiple input/output antenna device. The method according to claim 1,
The main board is disposed in a relatively front portion of the sub-board,
In the sub-board, the front part is stacked in close contact with a part of the rear part of the main board, the accommodating space is formed in a range that is not in contact with the rear part of the main board, and the plurality of heat generators are formed in the front part corresponding to the accommodating space. A multiple input/output antenna device in which elements are mounted. The method according to claim 1,
The main board is an integrated one-board in which the multi-layer layers stacked in the front and rear are integrally bonded, and at least a portion of the multi-layer layers are removed in some areas of the rear part to form the accommodation space,
The sub-board is stacked on the rear side of the layer layer located at the rearmost side of the main board among the multi-layer layers, and the plurality of heating elements are mounted on the front side facing the accommodation space. The method according to claim 1,
The amount of thermal expansion of the sub-board according to the temperature increase due to the driving of the heating elements is smaller than the amount of thermal expansion of the main board, the multiple input/output antenna device. The method according to claim 1,
The thickness of the front and rear of the sub board is smaller than the thickness of the front and rear of the main board, the multiple input/output antenna device. The method according to claim 1,
First heating elements are disposed on the front part of the main board, and second heating elements are disposed on the front part of the sub board,
The output power of the second heating elements is greater than the output power of the first heating elements, multiple input/output antenna device. 7. The method of claim 6,
The first heating elements are Rx elements (LNA), and the second heating elements are Tx elements (PA and DA). 7. The method of claim 6,
A third heating element is further disposed on the rear side of the main board, the multiple input/output antenna device. 9. The method of claim 8,
The third heating elements, including an FPGA, multiple input/output antenna device. The method according to claim 1,
Digital semiconductors are mounted on a rear surface of the main board that does not overlap with the front surface of the sub-board,
The multiple input/output antenna device, characterized in that the heat generated from the digital semiconductors of the main board is radiated to the rear side of the sub board together with the heat generated from the plurality of heat generating elements of the sub board. The method according to claim 1,
The main board and the sub-board are made of an epoxy resin material, a multiple input/output antenna device. The method according to claim 1,
The main board includes a plurality of sections having a plurality of transmission and reception channels,
The sub-board is composed of a number corresponding to each of the plurality of sections, a multiple input/output antenna device. The method according to claim 1,
The sub-board further includes an oscillation prevention circuit for preventing oscillation of the heating elements. 4. The method according to claim 3,
The sub-board is a multi-layer substrate having at least two layer layers, the multiple input/output antenna device. 15. The method of claim 14,
An active element as a part of the heating element is mounted on the layer layer corresponding to the front surface of the sub-board,
A passive element as the rest of the heating elements is disposed on the layer layer corresponding to the rear surface of the sub-board,
The heat generated from the active element and the passive element is radiated to the rear side of the sub-board, a multiple input/output antenna device. 16. The method of claim 15,
A ground pattern (GND pattern) is formed between the heating elements among the layer layers corresponding to the rear surface of the sub-board,
The ground pattern is in contact with the inner surface of the antenna housing in which the main board and the sub-board are installed to increase a shielding area of electromagnetic waves generated from the sub-board. 15. The method of claim 14,
In the sub-board, the at least two layer layers are bonded and formed in the same manner as the multi-layer layer of the main board, the multiple input/output antenna device. The method according to claim 1,
At least one heat transfer bridge hole for discharging heat generated from the heat generating elements to the rear is formed in the sub-board, the multiple input/output antenna device. 19. The method of claim 18,
The heat transfer bridge hole is filled with a thermally conductive material, a multiple input/output antenna device. 19. The method of claim 18,
The sub-board is a metal PCB, a multiple input/output antenna device. The method according to claim 1,
an antenna housing part having a mounting space in which the main board and the sub-board are installed in a front part, and a plurality of heat sink fins integrally formed with heat generated from the heating elements and radiating heat to the outside; Further comprising a, multiple input and output antenna device. 22. The method of claim 21,
The rear surface of the sub board and the inner surface of the antenna housing are in surface thermal contact so that heat generated from the heating elements is transferred to the rear surface of the sub board and radiated through the plurality of heat sink fins. The method according to claim 1,
a plurality of filters provided with an accommodating space for accommodating the resonator and seated on a front portion of the main board; and
an antenna board stacked on the front part of the plurality of filters, and on which a plurality of antenna elements for constructing a predetermined electrical signal line through the plurality of filters are mounted on the front side; Further comprising a, multiple input and output antenna device. 24. The method of claim 23,
A clamshell unit for shielding signal interference with the electrical signal line is integrally formed at the rear end of the plurality of filters, the multiple input/output antenna device. 25. The method of claim 24,
A plurality of transmission channels and reception channels corresponding to the electrical signal lines are provided on the front surface of the main board,
The clamshell unit may include: a transmission/reception partitioning rib for shielding the transmission channel and a region of the reception channel to be spatially partitioned; Including, multiple input and output antenna device. 26. The method of claim 25,
The clamshell unit may include: a transmission unit partitioning rib provided as a pair of the transmission channels to shield transmission circuit patterns spaced apart from each other in space; Further comprising a, multiple input and output antenna device. 27. The method of claim 26,
At least one positioning protrusion protruding toward the main board is formed at the rear end of the plurality of filters,
The clamshell unit may include, when the at least one positioning protrusion is seated in at least one positioning groove formed at a corresponding position of the main board, the transmission channel and the reception channel by the transmission/reception partition rib and the transmission part partition rib A multiple input/output antenna device that completely partitions the area of and the transmission circuit pattern. 25. The method of claim 24,
A pair of main board-side RF connectors for electrically connecting to the main board are provided at rear ends of the plurality of filters,
In the front end of the plurality of filters, a pair of antenna board-side RF connectors for electrically connecting to the antenna board stacked on the front end of the plurality of filters are provided, a multiple input/output antenna device.

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