KR20210149724A - double-sided grinding device - Google Patents

Abstract

The present invention is provided rotatably about a rotational shaft, and is provided with a lower surface having a polishing pad attached to the upper surface, and vertically movable upward and downward of the lower surface, and is provided rotatably about the rotational axis, and a polishing pad is attached to the lower surface. In the double-sided polishing apparatus having a suspended top plate and a suspended top plate provided above the upper plate, a connection part connecting the suspended top plate and the upper plate, and between the suspended top plate and the upper plate, a position different from the connection part It is provided and is a double-sided polishing apparatus characterized in that it is provided with an actuator capable of deforming the shape of the base plate. Accordingly, in the suspended double-sided polishing apparatus, there is provided a movable mechanism for the surface plate that does not promote thermal deformation of the surface plate and can deform the surface plate shape into various forms.

Description

double-sided grinding device

The present invention relates to a double-sided polishing apparatus of a suspended type.

The double-sided polishing apparatus employing a low thermal expansion material for the surface plate was excellent in the stability of the surface plate shape precision during polishing, and consequently the processing precision of the wafer, in that it was able to suppress the deformation of the surface plate due to the processing heat of polishing (see Patent Document 1). However, since the polishing pad (cloth) attached to the surface plate is worn by dress and polishing while being affected by the shape precision of the surface plate, the shape changes. In this case, the processing precision of the wafer could not be kept constant.

For example, Fig. 5 shows an example of a polishing pad that has become non-parallel due to the influence of plate shape precision, and Fig. 6 shows an example in which the pad is unevenly worn.

5 and 6, 101 is a lower surface plate, 102 is an upper surface plate, 103 and 104 are polishing pads, 105 is a sun gear, 106 is an internal gear, and 107 is a carrier. As shown in these figures, the polishing pads 103 and 104 are in a non-parallel state due to a decrease in precision of the lower platen 101 and the upper platen 102 . In this state, when the carrier 107 is disposed between the lower platen 101 and the upper platen 102, uneven wear occurs because the contact between the carrier 107 and the polishing pads 103 and 104 is not uniform, and the wafer It was not possible to keep the processing precision of

Japanese Patent Laid-Open No. 2001-79756 Japanese Patent Laid-Open No. 2008-44098

Accordingly, in order to suppress the uneven wear of the polishing pad as described above, it is recalled that the shape of the surface is deformed according to the shape of the polishing pad (such as the precision of the shape of the surface or the state in which it is already unevenly worn). However, in the existing technology, a metal disk holding the surface plate is required in order to deform the surface plate shape, and the thermal deformation of the disk is transmitted to the surface plate, so that the advantage of using a low thermal expansion material for the surface plate cannot be fully utilized (patent) Literature 2).

For example, Fig. 7 shows an example of a conventional double-sided polishing apparatus provided with a movable mechanism of a surface plate.

In the same figure, 102 is an upper plate, 108 is a suspended top plate, and 109 is a disk. By generating a force P to move the disk 109 with an input pressure IN of air, The inclination of the disk 109, that is, the shape of the slab is changed. However, since the disk 109 is made of metal, the disk 109 is likely to be thermally deformed, and as the thermal deformation is transmitted to the upper platen 102 , the upper platen 102 is also easily deformed. In addition, in the example of the same figure, since the shape of the upper plate can be deformed only in one direction, it is not possible to cope with various types of pad shapes.

In this regard, it can be applied to a suspended double-sided polishing apparatus on the premise of a surface plate of a low thermal expansion material, without impairing the advantages of the surface plate of this low thermal expansion material, and can also transform the surface plate shape into various shapes according to various types of pad shapes A movable mechanism of the surface plate was required.

The present invention has been made to solve the above problems, and in a double-sided polishing apparatus of a suspended type, without encouraging thermal deformation of the surface plate, and also to propose a movable mechanism of the surface plate capable of deforming the surface plate shape into various forms. do.

In order to achieve the above object, in the present invention, a lower platen that is provided rotatably about a rotating shaft and has a polishing pad attached to an upper surface thereof, and can vertically move upwardly of the lower platen, and is provided rotatably about the rotating shaft, , A double-sided polishing apparatus comprising an upper plate having a polishing pad attached to a lower surface thereof, and a suspended top plate provided above the upper plate, a connection part connecting the suspended top plate and the upper plate, and between the suspended top plate and the upper plate It provides a double-sided polishing apparatus, which is provided at a different position from the connection part as a, and is provided with an actuator capable of deforming the shape of the upper plate.

According to this double-sided polishing apparatus, the upper plate and the suspended top plate are connected by the connecting part, and the upper plate shape is deformed by the actuator provided at a position different from the connecting part. That is, since the connection part and the actuator are independent of each other, the metal disk used in the existing technology is unnecessary. In addition, it is possible to transform the shape of the base plate into various forms by the actuator. Accordingly, it is possible to provide a hanging type double-sided polishing apparatus having a movable mechanism of the surface that can be deformed into various shapes without encouraging thermal deformation of the surface.

Also, for example, by repeating dress and polishing while being influenced by the shape precision of the surface plate, even if the polishing pad is worn out, it becomes possible to change the shape of the surface plate according to the shape of the pad. It becomes possible to keep the processing precision of

The connection part is made of a plurality of hanging support pillars disposed on the same circumference in the radial direction of the upper plate, and the actuator is positioned on the same circumference in the radial direction of the upper plate and is different from the plurality of hanging support columns. It is preferable to arrange at least one.

In this way, when the axis of rotation is the center, by arranging the actuator on the circumference of the PCD (pitch circle diameter) different from the PCD (pitch circle diameter) of the circle drawn by the plurality of hanging support columns (the center point of), the shape of the base plate is transformed into various shapes. Possible movable mechanisms can be provided.

It is preferable that the actuator deforms the upper plate shape by using the plurality of suspended support pillars as a point.

In this way, by using the suspended support column as a fulcrum, according to the seesaw principle, at least one actuator is operated and a repulsive force is generated between the suspended top plate and the upper plate, thereby easily controlling the inclination (shape of the upper plate) of the upper plate. can do.

A floating joint connecting the actuator and the upper plate is further provided, and the actuator is preferably fixed to the suspended top plate.

In this way, by connecting the actuator and the upper plate by a floating joint, the eccentricity and deflection generated between the actuator and the upper plate can be absorbed, and the high-precision axial alignment of both becomes unnecessary.

It is preferable that the upper plate is made of a low thermal expansion material having a coefficient of thermal expansion of 6×10 ^{-6 /K or less.}

In this way, if the upper plate is a low thermal expansion material, the advantage of the suspended shape that the upper plate is difficult to thermally deform can be utilized. That is, since the upper plate is supported by a connecting portion (eg, a suspended support column), by making this connecting portion the minimum number and the minimum size, the thermal deformation of the connecting portion is not transmitted to the upper plate, and the low thermal expansion material It can exhibit its original function (it is difficult to deform due to frictional heat between the wafer and the polishing pad).

As described above, according to the present invention, it is possible to provide a movable mechanism for a surface plate capable of deforming the surface plate shape into various forms without promoting thermal deformation of the surface plate in the suspended double-sided polishing apparatus. Therefore, in the case of polishing both surfaces of a wafer using this double-side polishing apparatus, it becomes possible to stabilize the shape of the wafer for a long period of time.

1 is a partially enlarged view schematically showing a double-sided polishing apparatus of the present invention.
2 is a view showing the details of the double-sided polishing apparatus of the present invention.
It is a figure which shows the structural example of an actuator.
4 is a diagram showing the relationship between Closlife and GBIR for Examples and Comparative Examples.
5 is a view showing an example of a polishing pad that is not parallel due to the influence of the plate shape precision.
6 is a view showing an example in which the polishing pad is unevenly worn.
7 is a view showing an example of a conventional double-sided polishing apparatus provided with a movable mechanism of a surface plate.

As described above, in the prior art, in order to keep the processing precision of the wafer constant in the long term, the uneven abrasion of the polishing pad caused by repeated dress and polishing while being influenced by the shape precision of the surface plate depends on the shape of the surface plate. It was responding by deforming the shape. However, in the existing technology, there is a problem such that the shape of the surface plate, which is transmitted to the disk by thermal deformation of the metal disk holding the surface plate, can only be deformed in one direction.

As a result of intensive studies on the above problem, the inventors of the present invention provide an actuator at a position different from the connecting portion between the suspended top plate and the upper plate separately from the connecting portion connecting the suspended top plate and the upper plate, and assumed by this actuator. It has been discovered that, by deforming the platen shape, it is possible to deform the platen shape into various shapes without encouraging thermal deformation of the platen. In other words, since the connecting portion only needs to connect the suspended top plate and the upper plate, if the minimum number and the minimum size of the connecting portions are configured, the thermal deformation of this connecting portion does not affect the upper plate, on the other hand, the upper plate The present inventors have found that the shape of the upper plate can be deformed into various forms when the shape is deformed by an actuator provided independently of the connection part, and thus the present invention has been completed.

That is, the present invention is provided rotatably about a rotating shaft, a lower plate having a polishing pad attached to an upper surface thereof, and vertically movable upward and downward of the lower plate, and is provided rotatably about the rotating shaft, and a polishing pad on the lower surface In the double-sided polishing apparatus comprising an upper plate attached to the upper plate and a suspended top plate provided above the upper plate, a connection part connecting the suspended top plate and the upper plate, and between the suspended top plate and the upper plate, different from the connection part It is a double-sided polishing apparatus provided in a position, characterized in that it is provided with an actuator capable of deforming the shape of the base plate.

EMBODIMENT OF THE INVENTION Hereinafter, although embodiment of this invention is concretely described based on an accompanying drawing, this invention is not limited to these.

Fig. 1 schematically shows the double-sided polishing apparatus of the present invention.

The lower surface plate 1 is provided rotatably about the rotation shaft AX, and the polishing pad 7b is affixed on the upper surface. The upper table 2 is provided so as to be movable vertically above the lower table 1 and rotatably about the rotation shaft AX, and a polishing pad 7a is affixed to its lower surface. A carrier (changed to, for example, a dresser when dressing) 8 holding a wafer is disposed between the lower platen 1 and the upper platen 2 .

The suspended top plate 3 is provided above the upper plate 2 and is held by the support pillar 6 . The connecting portion 4 connects the suspended top plate 3 and the upper plate 2 . Therefore, by vertically moving the suspended top plate 3, the upper plate 2 can be vertically moved in conjunction with this.

The actuator 5 is provided at a position different from the connection part 4 between the suspended top plate 3 and the upper plate 2 , and can change the inclination (the shape of the upper plate) of the upper plate 2 . In this example, although the number of actuators 5 is two, what is necessary is just one or more. In addition, if the position of the actuator 5 is also a different position from the connection part 4, it will not specifically limit.

In this example, the two actuators 5 are arranged side by side in the radial direction perpendicular to the rotation axis AX. In this case, it becomes possible to change the inclination of the upper plate 2 in a radial direction by driving either one of the two actuators 5. As shown in FIG.

For example, in a state in which the two actuators 5 are not being driven (a state in which the upper plate 2 is simply connected between the top plate 3 and the upper plate 2 suspended in a state in which it can be stretched and contracted in the vertical direction), the lower plate ( When the upper surface of 1) and the lower surface of the upper plate 2 are parallel, the actuator 5 on the inner side (the side close to the rotation axis AX) extends, that is, the suspended top plate 3 and the upper plate 2 When driven in a direction to increase the distance of . As a result, the upper plate 2 is inclined in a state where the inner side in the radial direction is lower than the outer side.

On the other hand, when the inner actuator 5 is reduced, that is, driven in a direction that narrows the distance between the suspended top plate 3 and the upper plate 2, according to the principle of the seesaw, the outer actuator 5 is the suspended top plate It increases in the direction of increasing the distance between (3) and the upper plate (2). As a result, the upper plate 2 is inclined in a state where the inner side in the radial direction is higher than the outer side.

On the other hand, the shape of the upper plate, that is, the inclination of the upper plate 2, is by changing the position of the actuator 5, or between the suspended top plate 3 and the upper plate 2, a plurality of actuators 5 are provided. And, by driving a predetermined actuator (5), it can be deformed into various forms.

Therefore, even if the polishing pads 7a and 7b are unevenly worn by repeating dress and polishing while being influenced by the shape precision of the lower platen 1 and the upper platen 2, it is better to deform the upper platen shape according to the pad shape. Therefore, it becomes possible to keep the processing precision of the wafer constant in a long-term point of view such as repeating polishing batches.

In addition, since the connection part 4 just needs to connect the suspended top plate 3 and an upper plate, what is necessary is just to comprise the connection part 4 with a minimum number and a minimum size. For this reason, the thermal deformation of the connection part 4 does not give influence to the upper platen 2, and it disappears.

Fig. 2 shows the details of the double-sided polishing apparatus of the present invention. Fig. (a) is a plan view showing the positional relationship between the upper platen 2, the connecting portion 4, and the actuator 5, and Fig. (b) is a cross-sectional view of the double-sided polishing apparatus. Fig. 3 shows a structural example of the actuator.

The double-sided polishing apparatus described below assumes, for example, a four-way type having respective driving units of the lower wheel 1, the upper wheel 2, the sun gear, and the internal gear. However, for simplicity of explanation, the sun gear and the internal gear (refer to FIGS. 5 and 6 ) are omitted here.

The lower plate 1, the upper plate 2, the suspended top plate 3, the connection part 4, the actuator 5, the support column 6, and the polishing pads 7a and 7b are, respectively, the lower table of FIG. It corresponds to the board 1, the upper plate 2, the suspended top plate 3, the connection part 4, the actuator 5, the support post 6, and the polishing pads 7a and 7b. The suspended top plate 3 has a disk shape centering on the rotation shaft AX, and the upper plate 2 has a ring shape centering on the rotation shaft AX. The lower surface plate 1 is disposed between a sun gear and an internal gear (not shown), and has a disk shape capable of rotation around the sun gear (rotation shaft AX).

The connecting portion 4 is made of a plurality of suspended support posts disposed on the same radial direction C0 of the upper plate 2 . In this example, although the connecting part 4 consists of six hanging support posts arranged on the same circumference C0, the number of these hanging support posts is not limited to this. However, since one of the purposes of the connection part 4 is to support the upper plate 2 , it is preferable to arrange three or more on the same circumference C0 in order to stably support the upper plate 2 .

Although the material of the connection part 4 is not specifically limited, For example, it is made of metal. However, in order that the thermal deformation of the connection part 4 does not affect the upper plate 2, it is preferable to set the minimum number of connection parts 4 and the minimum size.

The connection part 4 functions as a point when the shape of the base plate is deformed according to the principle of the seesaw when the actuator 5, which will be described later, is driven. Therefore, it is preferable that the connection part 4 is cylindrical, for example so that it may function as this point.

The actuator 5 is disposed on the same circumference C1, C2 in the radial direction of the upper plate 2, and on the same circumference C0 on which a plurality of hanging support pillars as the connection part 2 are disposed. do. In this example, although the same circumference|circumference C1, C2 on which the actuator 5 is arrange|positioned is made into two, this same circumference|circumference may be one, for example, only either one of C1 and C2 may be sufficient. In addition, although the number of the actuators 5 should just be one or more, it is preferable that it is three or more.

In this example, the number of actuators 5 arranged on the same circumference C1 is 10, and the number of actuators 5 arranged on the same circumference C2 is also 10. In this way, when there are two identical circumferences C1 and C2 on which the actuators 5 are arranged, the number of actuators 5 disposed on the same circumference C1 inside the connection portion 4 and the connection portions 4 ), the number of actuators 5 arranged on the same circumference C2 on the outside can be set to be the same. However, the number of both may be mutually different.

In this way, when the axis of rotation AX is the center, by arranging the actuator 5 on the circumference of the PCD different from the PCD of the circle drawn by (the center point of) of the suspended support column as the connection part 4, the upper plate shape is obtained It is possible to provide a movable mechanism deformable in various forms.

Specifically, the actuator 5 deforms the shape of the base plate by using the hanging support column as the connecting portion 4 as a fulcrum. That is, in the state in which the actuator 5 is not driven, the upper surface of the lower platen 1 and the lower surface of the upper platen 2 are mutually parallel. In this state, when at least one of the actuators 5 is driven in a direction to widen or narrow the distance between the suspended top plate 3 and the upper plate 2, it is assumed according to the seesaw principle with the connecting part 4 as a point. The half 2 is tilted so that the upper surface of the lower plate 1 and the lower surface of the upper plate 2 are not parallel to each other.

Here, the structural example of the actuator 5 is demonstrated.

The actuator 5 is not particularly limited in its power source as long as it is a mechanism capable of locally changing the distance (interval in the vertical direction) between the suspended top plate 3 and the upper plate 2 . For example, as the power source of the actuator 5, gas pressure, such as pneumatic pressure, liquid pressure, such as hydraulic pressure, electric power, etc. can be used. In addition, the power supply to the actuator 5 may be performed from the outside of a double-sided grinding|polishing apparatus, or the inside of a double-sided grinding|polishing apparatus, for example, using a rotary connector, can also be performed via a surface rotating shaft.

Hereinafter, an example in which the actuator 5 is an air cylinder using air pressure as a power source will be described.

As shown in FIG. 3 , the actuator 5 is an air cylinder and includes a cylinder tube 9 and a piston 10 movable in the vertical direction in the cylinder tube 9 . The upper surface of the cylinder tube (9) is fixed to the lower surface of the suspended top plate (3). The piston 10 is coupled to the upper plate 2 via a floating joint 11 .

Then, when the pressure of the air 12 in the cylinder tube 9 increases, the piston 10 moves downward, thereby generating a force for pressing the upper plate 2 downward. In addition, when the pressure of the air 12 in the cylinder tube 9 is lowered, the piston 10 moves upward, thereby generating a force pulling the upper plate 2 upward. At this time, the floating joint 11 absorbs the eccentricity when the axis of the piston 10 is deviated from the central axis X, or the deflection angle when the axis of the piston 10 is inclined from the central axis X. .

In this way, by using the air cylinder as the actuator 5, the shape of the upper plate, that is, the inclination of the upper plate 2 can be controlled.

On the other hand, it is preferable that the upper plate 2 is made of a low thermal expansion material (eg, a metal material) having a coefficient of thermal expansion of 6×10 ^{-6 /K or less.} On the other hand, the lower the coefficient of thermal expansion, the better, and although there is no particular lower limit ^{, it can be, for example, 0.1 x 10 -6} /K or more. In this case, by setting the minimum number and minimum size of the connecting portions 4, the thermal deformation of the connecting portions 4 is not transmitted to the upper plate, and the original function of the low thermal expansion material (by the frictional heat between the wafer and the polishing pad) It is difficult to deform).

According to the above-described double-sided polishing apparatus, it is possible to provide a movable mechanism for a surface plate that is applicable to a suspended-type double-sided polishing apparatus, does not promote thermal deformation of the surface plate, and can deform the surface plate shape into various forms. Therefore, in the case of polishing both surfaces of a wafer using this double-side polishing apparatus, it becomes possible to stabilize the shape of the wafer for a long period of time.

Example

Hereinafter, the present invention will be described in detail with reference to examples of the present invention, but these are not intended to limit the present invention.

(Example)

Using the double-sided polishing apparatus shown below, the close life (life of the polishing pad) capable of realizing a predetermined GBIR (Global Backside Ideal Range) was verified. Here, GBIR is one of the indices indicating the flatness of the wafer, and is the difference between the maximum value and the minimum value of the distance from the back reference plane to the wafer surface.

・Details of double-sided grinding device

A double-sided grinding machine of size 20B was used in a 4-way type showing each driving unit of the lower wheel, upper wheel, sun gear, and internal gear. The upper plate and the suspended top plate were connected by six hanging support posts arranged on the same circumference, and the material of each hanging support post was made of SUS (stainless steel). Hajeong half and the estimated half material, and a small thermal expansion coefficient-environment in the vicinity of room temperature (coefficient of thermal expansion ^{= 1.5 × 10 -6 /K~4.0×10 -6 /} K).

For a co-circumferential PCD on which 6 hanging support posts are arranged, 10 The actuator was placed. In addition, with respect to the co-circumferential PCD in which the six hanging support columns are arranged, on the same circumference having a PCD 300 mm larger than that, that is, on the same circumference 150 mm away from the same circumference in which the six hanging support columns are arranged, Ten actuators were placed.

The actuator was an air cylinder using compressed air as a driving source, and when adjusting the inclination of the upper plate, compressed air was supplied from an external supply source of the double-sided polishing apparatus to the actuator in the double-sided polishing apparatus to operate the actuator.

Then, in repeatedly polishing and dressing the wafer, the shape of the top plate, that is, the inclination of the plate plate, was changed according to the shape of the pad. However, the inclination of the lower platen and the upper plate was calculated from the measured radius profiles, and adjusted so that the difference between the inclination of the lower plate and the inclination of the upper plate was 0.020 µm/mm or less.

・Experiment contents

The wafer processing (polishing) and measurement conditions are as follows.

As the wafer, a P-type silicon single crystal wafer having a diameter of 300 mm was used.

As the polishing pad, a polyurethane foam pad having a Shore A hardness of 85 was used.

As the carrier, FRP in which glass fiber was impregnated with an epoxy resin was used as an insert on a titanium substrate. A carrier was set in a set of 5 sheets in the double-sided polishing apparatus, and a wafer was set in a set of 5 sheets per carrier.

As the slurry, silica abrasive grain-containing, average particle diameter 35 nm, abrasive concentration 1.0 wt%, pH 10.5, KOH base was used.

The machining load was set to ^{180gf/cm 2 .}

The processing time was set by calculating backwards from the polishing rate so that the batch average value of the center thickness of the wafers fell within 775±0.5 μm.

The rotational speed of each drive unit was set to an upper plate: -13.4 rpm, a lower plate: 35 rpm, a sun gear: 25 rpm, and an internal gear: 7 rpm.

Dressing of the polishing pad was performed by slidingly contacting the upper and lower polishing pads while flowing pure ^{water at 120 gf/cm 2} of the dress plate on which the diamond grains were electrodeposited. The sliding contact time was 5 min, and the frequency was every 5 batches.

For the wafer after processing, SC-1 cleaning was performed under the conditions (NH ₄ OH:H ₂ O ₂ :H ₂ O=1:1:15).

・Output of GBIR

Under the above experimental contents, polishing and dressing of the wafer were repeatedly performed, and the flatness of the wafer after cleaning was measured, and the GBIR was calculated. On the other hand, flatness was measured using KLA Tencor's WaferSight for the wafer after cleaning. GBIR was calculated by excluding an area of 2 mm from the edge of the wafer.

(Comparative example)

・Details of double-sided grinding device

In the comparative example, in the double-sided polishing apparatus of the said Example, the thing which does not have an actuator (air cylinder) was used. That is, a double-sided polishing apparatus was used in which the upper surface of the lower surface and the lower surface of the upper surface were always parallel to each other without changing the shape of the upper surface.

・Experiment contents

The wafer processing and measurement conditions were the same as the experimental contents of the above examples.

・Output of GBIR

GBIR was calculated according to the same calculation method as in the above example.

(verification result)

4 shows the relationship between Closlife and GBIR for Examples and Comparative Examples.

In the figure, the horizontal axis represents the cloth life and corresponds to the number of batches (integrated value). The vertical axis represents GBIR. In addition, in both an Example and a comparative example, 1 plot is an average value of 5 sheets per batch.

Here, both GBIR and Closlife were standardized on the basis of the comparative example, so that the effect in the Example was made clear. That is, the GBIR gradually increases as the number of batches (integrated value) increases. Therefore, in the comparative example, the time point when the GBIR of the wafer reaches the predetermined value is the standard value 1, and the number of batches (integrated value) when the GBIR is the standard value 1 is the standard value of the close life (average life) 1 was set.

Incidentally, in the Examples, the number of batches (integrated value) at the time when the GBIR reaches the standard value 1 is the close life (average life) in the Examples, and the close life in the Examples is to some extent It has been verified that

As is clear from the same figure, the monitoring transition of GBIR is around 0.4 at the stage where the number of batches (integrated value) is small in both Examples and Comparative Examples. However, with respect to the cloth life of the comparative example (standard value 1), the cloth life of the Example was set to about 1.4. That is, in the Example, it was confirmed that the cloth life entering the GBIR standard value 1 or less was improved by about 1.4 times with respect to the comparative example.

As can be seen from the above results, in the Examples, it was demonstrated that it is possible to stabilize the shape of the wafer over a long period of time when both surfaces of the wafer are polished using the double-side polishing apparatus.

As described above, according to the present invention, it is possible to provide a movable mechanism for a surface plate that is capable of deforming the shape of the surface plate into various forms without promoting thermal deformation of the surface plate in the suspended double-sided polishing apparatus. Therefore, in the case of polishing both surfaces of a wafer using this double-side polishing apparatus, it becomes possible to stabilize the shape of the wafer for a long period of time.

In addition, this invention is not limited to the said embodiment. The above-mentioned embodiment is an illustration, and any thing which has substantially the same structure as the technical idea described in the claim of this invention, and shows the same effect is included in the technical scope of this invention.

Claims (5)

a lower platen rotatably provided about a rotational axis and having a polishing pad attached to an upper surface thereof; an upper platen capable of moving up and down upwards of the lower platen, and rotatably provided about the rotational shaft, and having a polishing pad attached to a lower surface thereof; In the double-sided polishing apparatus having a suspended top plate provided above the upper plate,
a connection part connecting the suspended top plate and the upper plate;
and an actuator provided between the suspended top plate and the upper plate at a different position from the connection part, and an actuator capable of deforming the upper plate shape.
According to claim 1,
The connection part is made of a plurality of hanging support pillars disposed on the same circumference in the radial direction of the top plate, and the actuator is on the same circumference in the radial direction of the top plate, and at a position different from the plurality of hanging support pillars. Double-sided polishing device, characterized in that one or more is disposed.
3. The method of claim 2,
The actuator is a double-sided polishing apparatus, characterized in that the plurality of suspended support pillars to deform the shape of the upper plate.
4. The method according to any one of claims 1 to 3,
A floating joint connecting the actuator and the upper plate is additionally provided,
The actuator is a double-sided polishing apparatus, characterized in that fixed to the suspended top plate.
5. The method according to any one of claims 1 to 4,
The upper plate is a double-sided polishing apparatus, characterized in that it is made of a low thermal expansion material having a coefficient of thermal expansion of 6 × 10 ^{-6 /K or less.}

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