KR20210147327A - electronic device having microphone - Google Patents

Abstract

An electronic device according to one embodiment includes: a housing; an assembly frame inside the housing; a printed circuit board disposed on the assembly frame; a transducer disposed on the printed circuit board and including a diaphragm; a shield can including a top plate disposed in a direction in which a first surface of the diaphragm of the transducer faces, and a side wall extending from the top plate to the printed circuit board and surrounding the transducer at least; a first chamber defined by the top plate and the side wall of the shield can and the printed circuit board; a second chamber defined by a first through-hole formed in the printed circuit board and aligned on a second surface of the diaphragm, and a second through-hole formed in the assembly frame and aligned in the first through-hole; and at least one damping member in which at least a portion thereof is disposed inside the second chamber, wherein at least one of the first chamber and the second chamber may be connected to the outside the housing, and the diaphragm may vibrate in response to sound outside of the housing propagating through at least one of the first chamber and the second chamber. According to the present disclosure, the frequency characteristics of a microphone may be adjusted or tuned through the damping member acoustically connected to the diaphragm of the microphone.

Description

Electronic device having microphone

The present disclosure relates to an electronic device including a microphone.

The microphone package is mounted on various electronic devices such as smartphones and tablet computers. Recently, such electronic devices have a trend of being miniaturized and thinned. Accordingly, various components mounted thereon, including the microphone, also tend to be miniaturized.

The microphone package may include an acoustic chamber formed as a housing, and a transducer that converts an acoustic signal into an electrical signal in the acoustic chamber. The acoustic signal enters the acoustic chamber in the package through the acoustic port of the housing. The introduced acoustic signal vibrates the diaphragm of the transducer, and the transducer senses the vibration to generate an electrical signal.

Meanwhile, as MEMS technology has recently been applied to microphones, it has become possible to develop high-performance, small-sized microphones. MEMS microphones offer high signal to noise ratio (SNR), low power consumption, excellent sensitivity, and are available in an ultra-small package that is fully compatible with surface mount assembly processes. In addition, the MEMS microphone has little change in performance after reflow soldering and has excellent temperature characteristics.

However, as the electronic device including the microphone is manufactured to be small and thin, the space occupied by the microphone package is insufficient, and thus the SNR or sensitivity of the microphone may be reduced. For example, in order to smoothly vibrate the diaphragm of the transducer, a back chamber of a certain volume is required, and it is difficult to secure the volume of the back chamber as the electronic device becomes thinner.

An object of the present disclosure is to provide a microphone having excellent performance while having a thin thickness. Another object of the present disclosure is to provide a means for adjusting the frequency characteristics of a microphone. Furthermore, an object of the present disclosure is to provide a structure capable of protecting a microphone disposed under a window or a housing (eg, a bezel) from external impact.

The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the description below. There will be.

In an embodiment, an electronic device includes: a housing; an assembly frame within the housing; a printed circuit board disposed on the assembly frame; a transducer disposed on the printed circuit board and including a diaphragm; a shield can disposed in a direction in which the first surface of the diaphragm of the transducer faces and including a top plate including a first acoustic port, a shield can extending from the top plate to the printed circuit board and including a sidewall surrounding at least the transducer; a first chamber defined by the upper plate, the sidewall, and the printed circuit board of the shield can; a second chamber defined by a first through hole formed in the printed circuit board and aligned with a second surface of the diaphragm, and a second through hole formed in the assembly frame and aligned with the first through hole; and at least one damping member, at least a portion of which is disposed in the second chamber, wherein at least one of the first chamber or the second chamber is connected to the outside of the housing, and the diaphragm is disposed in the first chamber or the second chamber The second chamber may vibrate by sound propagating through at least one of the second chambers.

In one embodiment, the microphone module includes an assembly frame; a printed circuit board disposed on the assembly frame; a transducer disposed on the printed circuit board and including a diaphragm; an upper plate disposed in a direction in which the first surface of the diaphragm of the transducer faces and including a first acoustic port, a side wall extending from the upper plate to the printed circuit board and surrounding at least the transducer, and on the printed circuit board a first chamber defined by; a second chamber defined by a first through hole formed in the printed circuit board and aligned with a second surface of the diaphragm, and a second through hole formed in the assembly frame and aligned with the first through hole; and at least one damping member, at least a portion of which is disposed in the second chamber.

According to the present disclosure, the frequency response of the microphone can be adjusted. For example, you can increase the SNR or increase the sensitivity of the microphone. According to the present disclosure, the frequency characteristic of the microphone may be adjusted or tuned through the damping member acoustically connected to the diaphragm of the microphone. Additionally, according to the present disclosure, the microphone may be protected from external impact by a structure connected to the microphone.

Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. will be.

1 illustrates an electronic device including a microphone according to an embodiment.
Figure 2 shows a microphone module disposed inside the housing in one embodiment.
3 shows a microphone module disposed under a window or housing in one embodiment.
4 illustrates a microphone module attached to a housing in one embodiment.
5 illustrates a conductive pad disposed on a contact surface of a first printed circuit board and a second printed circuit board according to an embodiment.
6 shows a microphone including a damping member in a first embodiment;
7 is a graph illustrating the sensitivity of a microphone according to an exemplary embodiment.
8 shows a microphone module including a damping member in a second embodiment.
9 shows a microphone module including a damping member in a third embodiment.
10 illustrates a microphone module including a second chamber further extended by a recess formed in the housing in one embodiment.
11 illustrates a microphone module including a damping member positioned in a recess in a housing in one embodiment;
12 shows a structure for protecting a microphone module according to an embodiment.
13 illustrates an electronic device including a camera and a microphone according to an embodiment.
14 is a block diagram of components included in an electronic device according to an embodiment.
15 is a flowchart for receiving an audio signal based on a type of a microphone according to an embodiment.

1 illustrates an electronic device 100 including a microphone according to an embodiment.

In an embodiment, the electronic device 100 may include a housing that can be folded or unfolded. In an embodiment, the housing may include a first housing 111 and a second housing 112 pivotably coupled through a hinge structure 113 of the first housing 111 . When the housing is folded, a portion of the first housing 111 and a portion of the second housing 112 are not visible from the outside. When the housing is unfolded, the first housing 111 and the second housing 112 form a predetermined angle, and in the folded state, a portion that is not visually recognized from the outside may be exposed.

In an embodiment, the electronic device 100 may include the display 120 as a display device. The display 120 is assembled to the housing and can be viewed from the outside of the electronic device 100 . In an embodiment, the display 120 is assembled to the first housing 111 and may be visually recognized from the outside when the housing is unfolded. In an embodiment, the display 120 may be disposed under a window or a housing (eg, a bezel) constituting one surface of the first housing 111 .

In another embodiment, the electronic device 100 may include a plurality of displays. For example, the electronic device 100 may include a dual display. The electronic device 100 may include at least one additional display in addition to the display 120 illustrated in FIG. 1 . For example, the additional display may be assembled to the second housing. The electronic device 100 illustrated in FIG. 1 includes the input device in the second housing, but a separate display may be disposed in the second housing in addition to or as an alternative to the input device.

In an embodiment, the electronic device 100 may include an input device. The input device may be assembled to the second housing 112 . For example, the input device may include a keyboard 130 and a touch pad 150 . When the housing is folded, the keyboard 130 and the touch pad 150 may be covered by the first housing 111 so that they cannot be visually recognized from the outside. As another example, the input device may include a digitizer. The digitizer may be configured to sense on which portion of the face of the digitizer the external device is positioned when the device is proximate or proximate to the face of the digitizer. The digitizer may be integrally formed with at least one display provided in the electronic device. In an embodiment, the electronic device may include a stylus pen that can be recognized by a digitizer therein. For example, the stylus pen may be removably accommodated in a space within the first housing or the second housing, or may be detachably seated on the first housing or the second housing.

According to an embodiment, the electronic device 100 may include various sensors. For example, a camera, a proximity sensor, a time of flight (TOF) sensor, and/or a microphone may be included in the upper portion 140 of the display 120 . In an embodiment, the sensors may collect signals from the outside through a hole or a transparent part at the top of the display 120 . For example, the camera may photograph an external subject through a transparent portion disposed on a portion of the housing. As another example, the microphone may receive an external sound through a hole formed in the housing.

According to an embodiment, the electronic device 100 may provide an audio recording function. The electronic device 100 may provide an audio recording function through an audio program. In an embodiment, when an audio program is executed, a user interface 170 related to the corresponding program may be displayed on the display 120 . Referring to FIG. 1 , the electronic device 100 may visually provide a waveform of an audio signal received through a microphone through the interface 170 .

2 illustrates a microphone module 200 disposed inside a housing in one embodiment. The embodiment of FIG. 2 may be understood as a cross-section taken along line I-I of FIG. 1 .

In one embodiment, the microphone module 200 includes a first printed circuit board 211 , a transducer 220 mounted on the first printed circuit board 211 , at least one electronic device 230 , and a shield can ( 240) may be included.

In an embodiment, the transducer 220 may include a diaphragm 221 and convert the vibration of the diaphragm 221 into an electrical signal. In an embodiment, the at least one electronic device 230 may be electrically connected to the transducer 220 , and may receive an electrical signal from the transducer 220 and transmit it to another electronic device (eg, a processor).

In an embodiment, the shield can 240 may provide a first chamber 251 connected to the diaphragm 221 . In an embodiment, the shield can 240 may include a top plate and a sidewall. The upper plate may be spaced apart from the first printed circuit board 211 and disposed to face the upper surface 211U of the first printed circuit board 211 . The side wall may extend from the outer edge of the upper plate toward the upper surface 211U of the first printed circuit board 211 by a length in which the upper plate and the first printed circuit board 211 are spaced apart. The first chamber 251 may be defined as a space surrounded by the upper plate of the shield can 240 , the sidewall of the shield can 240 , and the first printed circuit board 211 .

In an embodiment, the shield can 240 may include a first acoustic port 241 . Sound may be transmitted to the diaphragm 221 through the first sound port 241 . For example, the upper plate of the shield can 240 may include a through hole connecting the inside and the outside of the shield can 240 , and the through hole may function as the first acoustic port 241 .

In an embodiment, the microphone module 200 may further include a shield can 240 disposed on the first printed circuit board 211 . The shield can 240 may block radio wave interference between the electronic devices 230 disposed on the printed circuit board and protect the electronic device 230 from external impact. For example, the shield can 240 may protect the electronic components inside the shield can 240 from electromagnetic waves propagating from the outside of the shield can 240 toward the inside of the shield can 240 . Conversely, in the shield can 240 , an electromagnetic wave generated from an electronic component positioned inside the shield can 240 may minimize an effect on other electronic components positioned outside the shield can 240 .

In an embodiment, the microphone module 200 may include a second printed circuit board 212 on which the first printed circuit board 211 can be mounted. In an embodiment, the electronic device 100 may include a camera 260 mounted on the second printed circuit board 212 . In an embodiment, the direction in which the camera 260 faces and the direction in which the first sound port 241 of the microphone is opened may coincide. For example, the direction in which the field of view (FOV) of the lens of the camera 260 faces may coincide with the direction in which the first acoustic port 241 of the microphone is opened. In an embodiment, the first printed circuit board 211 and/or the second printed circuit board 212 may include a rigid material or a flexible material. For example, the second printed circuit board 212 may include a conductive pattern and polyimide layers laminated to the conductive pattern.

In an embodiment, the microphone module 200 may include an assembly frame 213 to which the second printed circuit board 212 is attached. In an embodiment, the assembly frame 213 may have a flat plate shape having a predetermined thickness.

In an embodiment, the microphone module 200 may include a first chamber 251 and a second chamber 252 that are spatially separated based on the diaphragm 221 of the transducer 220 . In an embodiment, a space connected to the upper surface (or the first surface) of the diaphragm 221 and surrounded by the shield can 240 may be defined as the first chamber 251 . In addition, the space connected to the lower surface (or the second surface) of the diaphragm 221 may be defined as the second chamber 252 . In an embodiment, the second chamber 252 may be connected to the second acoustic port 255 . Sound propagated to the second acoustic port 255 may vibrate the diaphragm 221 through the second chamber 252 . In an embodiment, the first chamber 251 connected to the upper surface of the diaphragm 221 may be defined by the shield can 240 and the upper surface of the first printed circuit board 211 . The first chamber 251 may be connected to the first acoustic port 241 of the shield can 240 . Sound propagated to the first chamber 251 through the first acoustic port 241 may vibrate the diaphragm 221 .

In an embodiment, the first acoustic port 241 and the second acoustic port 255 may be aligned on different axes. However, embodiments of the present disclosure are not limited thereto, and may be aligned on the same axis in other embodiments.

In an embodiment, the second chamber 252 connected to the lower surface of the diaphragm 221 may include a space open downward of the diaphragm 221 . In an embodiment, the second chamber 252 may include through holes 253 and 254 formed in the printed circuit board and the assembly frame 213 and aligned with the diaphragm 221 . In an embodiment, each of the first printed circuit board 211 and the second printed circuit board 212 may include a first through hole 253 aligned with the diaphragm 221 . In the illustrated embodiment, the first through-hole 253 has the same size in the first printed circuit board 211 and the second printed circuit board 212 , but the embodiment of the present disclosure is not limited thereto. In , the first through hole 253 may have different sizes in the first printed circuit board 211 and the second printed circuit board 212 . For example, the size of the first through hole 253 in the second printed circuit board 212 may be larger than the size of the first through hole 253 in the first printed circuit board 211 .

In an embodiment, the second chamber 252 may include a second through hole 254 formed in the assembly frame 213 and aligned with the diaphragm 221 or the first through hole 253 . As the assembly frame 213 includes the second through-hole 254 connected to the first through-hole 253 , the volume of the second chamber 252 may increase. If the amount of air in the second chamber 252 increases as the volume of the second chamber 252 increases, the diaphragm 221 may move more easily in response to sound waves. This is because as the volume of the second chamber 252 increases, the air inside the second chamber 252 can be easily compressed or expanded.

second chamber Volume SNR Includes only the first through hole 0.006cc 69 dB Second through-hole additionally included 0.01cc 70dB

In an embodiment, the second chamber 252 may improve performance of the microphone, for example, SNR or sensitivity. SNR indicates how high the level of a signal containing meaningful information is relative to the level of noise. It can be said that the larger the SNR, the better the signal. Table 1 shows that in an embodiment, the SNR of the microphone is higher when the second chamber 252 includes more second through-holes 254 than when the second chamber 252 includes only the first through-holes 253 . In an embodiment, when only the first through-hole 253 is included, the volume of the second chamber 252 is 0.006 cc, and the SNR of the microphone is 69 decibels. When the second through-hole 254 is added to the second chamber 252, the volume of the second chamber 252 increases to 0.01 cc, and the SNR of the microphone is 70 decibels. In an embodiment, the diameter D2 of the second through hole 254 may be greater than the diameter D1 of the first through hole 253 . In another embodiment, the diameter D2 of the second through hole 254 may be equal to or smaller than the diameter D1 of the first through hole 253 .

On the other hand, unlike the first through-hole 253, which must have a smaller size than the transducer 220, the second through-hole 254 does not have this limitation, and thus has a relatively wide range of sizes. Accordingly, the designer may improve the performance of the microphone by adjusting the size of the second through hole 254 . For example, when the volume of the second chamber 252 required to improve the performance of the microphone is determined, the designer may adjust the size of the second through hole 254 so that the second chamber 252 has the determined volume. can

In an embodiment, the first printed circuit board 211 may be surface mounted on the second printed circuit board 212 . For example, the first printed circuit board 211 includes a first conductive pad 214 disposed on a surface facing the second printed circuit board 212 , and the second printed circuit board 212 includes the first A second conductive pad 215 disposed on a surface facing the printed circuit board 211 may be included. In an embodiment, a solder layer may be disposed between the first conductive pad 214 and the second conductive pad 215 . The conductive pad may be implemented as a part of a conductive layer constituting a printed circuit board, for example. The first conductive pad 214 and the second conductive pad 215 may include a dummy pad or a ground pad independent of power transmission or signal transmission. The first printed circuit board 211 may be fixedly mounted on the second printed circuit board 212 through coupling between the conductive pads 214 and 215 . In an embodiment, the first printed circuit board 211 may be referred to as an interposer printed circuit board.

In an embodiment, the boundary of the conductive pad 214 and/or 251 may include a closed curve surrounding the first through hole 253 . For example, the conductive pads 214 and/or 251 may have a donut shape having an inner diameter surrounding the periphery of the first through hole 253 . A solder layer disposed between the first conductive pad 214 and the second conductive pad 215 may seal between the lower surface of the first printed circuit board 211 and the upper surface of the second printed circuit board 212 . For example, the solder layer fills the gap between the first conductive pad 214 and the second conductive pad 215 , and the air in the first through hole 253 at least the lower surface of the first printed circuit board 211 ( 211L) and the second printed circuit board 212 can be prevented from escaping between the upper surface 212U.

In an embodiment, the printed circuit boards 211 and 212 may include a conductive path for supplying power to a microphone circuit or transmitting a microphone signal. For example, the printed circuit boards 211 and 212 may include conductive vias passing through both surfaces of the substrate. The microphone element may be connected to a connector (not shown) through a conductive pattern (or trace) formed on the second printed circuit board 212 . The microphone element may be electrically connected to other electronic components (eg, an application processor, an audio processor (CODEC), a power supply circuit) through a connector.

3 illustrates a microphone module 200 disposed under a window 121 or a housing (eg, a bezel) in one embodiment.

In an embodiment, the microphone module 200 may be disposed under the window 121 or a housing (eg, a bezel). Hereinafter, parts described by taking a window as an example may be equally applied to a housing (eg, a bezel). In order to prevent electronic components disposed under the window 121 from being seen from the outside, the window 121 may include an opaque portion 121a. For example, the opaque portion 121a may be formed by applying black ink to one surface of the window 121 or attaching an opaque member. However, when the electronic component disposed under the window 121 (eg, the camera 260) collects or emits light, light must be allowed to enter and exit through the window 121. Therefore, the Black ink or an opaque member may be omitted in the portion 121b overlapping the movement path.For example, when the camera 260 is disposed under the window 121, the black ink is applied to at least the camera ( 260 may not be applied to the portion 121b corresponding to the angle of view.

In an embodiment, the electronic device 100 may include a support frame 122 disposed on the rear surface of the window 121 . In general, since the window 121 has a thin thickness, it may be easily deformed by an external force. The support frame 122 may be attached to one surface of the window 121 to prevent the window 121 from being easily deformed. In an embodiment, the support frame 122 may include an opening corresponding to the angle of view of the camera 260 . In an embodiment, the support frame 122 may be formed in the form of injection or metal plate.

In an embodiment, the window 121 and/or the support frame 122 attached to the rear surface of the window 121 may include an acoustic inlet 123 . Sound from the outside of the electronic device 100 may be propagated to the diaphragm 221 through the inlet 123 of the window 121 . On the other hand, if there is a large amount of air in the space between the inlet 123 and the diaphragm 221 formed in the window 121 , it may be difficult for external sound to vibrate the diaphragm 221 , or response performance to high-frequency sound may be reduced. have.

Referring to FIG. 3 , the electronic device 100 may include a sound collecting structure 270 between the microphone module 200 and the window 121 . In an embodiment, the sound collecting structure 270 may be configured to guide sound from the outside of the electronic device 100 to the transducer 220 of the microphone module 200 . For example, the sound collecting structure 270 may include a side wall surrounding the microphone module 200 and an upper plate disposed on the side wall. The upper plate may include a guide hole 271 connected to the inlet 123 of the window 121 . A range in which the sound passing through the inlet 123 of the window 121 can propagate may be limited to the space 257 surrounded by the sound collecting structure 270 . For example, the sound collecting structure 270 may minimize sound from escaping into the space 258 outside the sound collecting structure 270 . In an embodiment, the sound collecting structure 270 may include an elastic material (eg, rubber, silicone, or an adhesive member). When the sound collecting structure 270 has elasticity, when the microphone module 200 and the window 121 are assembled, the sound collecting structure 270 may be deformed while being pressed by the window 121 or the support frame 122 . This prevents or minimizes a gap that may occur between the guide hole 271 of the sound collecting structure 270 and the inlet 123 of the window 121 , and thus the sound entering through the inlet 123 is outside the sound collecting structure 270 . Escape into space 258 may be minimized.

4 shows a microphone module 200 attached to a housing 216 in one embodiment. The housing 216 of FIG. 4 may be understood as a part of the housings 111 and 112 of FIG. 1 .

In an embodiment, a window (eg, the window 121 of FIG. 3 ) may be disposed on the microphone module 200 of FIG. 4 . The first acoustic port 241 of the microphone module 200 may be connected to the outside of the electronic device through a through hole formed in the window (eg, the inlet 123 of FIG. 3 ). For example, the second acoustic port 255 may not be connected to the outside of the electronic device. In another embodiment, the second acoustic port 255 may be connected to the outside of the electronic device, and the first acoustic port 241 may be separated from the outside of the electronic device.

In an embodiment, a housing (eg, a bezel) may be disposed on the microphone module 200 of FIG. 4 . The first acoustic port 241 of the microphone module 200 may be connected to the outside of the electronic device through a through hole (not shown) formed in a housing (eg, a bezel).

In an embodiment, the first adhesive member 281 may be disposed between the second printed circuit board 212 and the assembly frame 213 . The first adhesive member 281 may include an opening aligned with the second through hole 254 . In one embodiment, the adhesive member is attached between the second printed circuit board 212 and the assembly frame 213, which may seal a gap between the two. The first adhesive member 281 may prevent the air of the second chamber 252 from escaping between the lower surface 212L of the second printed circuit board 212 and the upper surface 213U of the assembly frame 213 .

In an embodiment, the second adhesive member 282 may be disposed between the assembly frame 213 and the housing 216 . The second adhesive member 282 may include an opening aligned with the first through hole 253 or the second through hole 254 . In an embodiment, the second adhesive member 282 is attached between the assembly frame 213 and the housing 216 , and may seal the boundary between the two. The second adhesive member 282 may prevent the air of the second chamber 252 from escaping between the lower surface 213L of the assembly frame 213 and the inner surface 216U of the housing 216 . In the illustrated embodiment, the second acoustic port 255 is blocked by the housing 216 , but in another embodiment, the second acoustic port 255 is connected to the electronic device 100 through an inlet provided in the housing 216 . It can be connected externally.

5 illustrates conductive pads 214 and 215 disposed on contact surfaces of the first printed circuit board 211 and the second printed circuit board 212 in one embodiment.

In an embodiment, the conductive pads 214 and 215 may be disposed on the first printed circuit board 211 and the second printed circuit board 212 while surrounding the through hole. The first conductive pad 214 and the second conductive pad 215 are coupled to each other through a conductive adhesive member (eg, solder), which is formed between the first printed circuit board 211 and the second printed circuit board 212 . A portion surrounding the first through hole 253 among the contact surfaces may be sealed.

In an embodiment, the conductive pads 214 and 215 may surround an outer boundary of the first through hole 253 . In an embodiment, the conductive pads 214 and 215 may have a donut shape. For example, the inner boundary of the conductive pads 214 and 215 may have a first diameter φ1 larger than the through hole, and the outer boundary may have a second diameter φ2 larger than the first diameter φ1 . In the illustrated embodiment, the inner boundary of the conductive pads 214 and 215 is spaced apart from the outer boundary of the first through hole 253 by a predetermined distance, but the embodiment of the present disclosure is not limited thereto, and in another embodiment, the conductive pad An inner boundary of the 214 and 215 may coincide with an outer boundary of the first through hole 253 . For example, referring to FIG. 2 , the conductive pads 214 and 215 may have inner diameters matching the outer diameter of the first through hole 253 .

In an embodiment, the first printed circuit board 211 may include a signal pad 219 . The signal pad 219 may be electrically connected to the electrical device 230 mounted on the other surface of the first printed circuit board 211 . For example, the electrical element 230 may be electrically connected to the opposite signal pad 219 through a conductive via penetrating the first printed circuit board 211 . In one embodiment, the signal pad 219 may be responsible for power transmission, audio signal communication, and/or microphone control signal.

In an embodiment, the printed circuit boards 211 and 212 may include recessed portions surrounded by the conductive pads 214 and 215 . In an embodiment, the portion surrounded by the first conductive pad 214 of the first printed circuit board 211 may have a surface recessed from the remaining portion. In an embodiment, the portion surrounded by the second conductive pad 215 of the second printed circuit board 212 may have a surface recessed from the remaining portion. For example, a portion surrounded by inner boundaries of the conductive pads 214 and 215 may be etched to have a lower surface than other portions. The volume of the second chamber 252 may increase by a depression defined by the first printed circuit board 211 and/or the second printed circuit board 212 .

6 shows a microphone including damping members 291 and 292 in the first embodiment. 7 is a graph illustrating the sensitivity of a microphone according to an exemplary embodiment.

Referring to FIG. 6 , the electronic device 100 may include at least one damping member 291 and 292 in an acoustic path of a microphone. In an embodiment, the electronic device 100 may include a first damping member 291 mounted on the first acoustic port 241 of the shield can 240 . In an embodiment, the first damping member 291 may include a mesh member made of a soft material (eg, Gore-Tex), a sponge member made of an elastic material, a grill member made of a rigid material, and a glass fiber member. At least one may be formed. In another embodiment, the first damping member 291 may be located inside the first acoustic port 241 .

In an embodiment, the electronic device 100 may include a second damping member 292 , at least a portion of which is located in the second chamber 252 . In an embodiment, the second damping member 292 may be disposed between the first through hole 253 and the second through hole 254 . Due to the second damping member 292 , the second chamber 252 may be divided into a first portion corresponding to the first through hole 253 and a second portion corresponding to the second through hole 254 . However, the first part and the second part are not completely acoustically separated due to the second damping member 292 , and the vibration of air in the first part causes the vibration of the second part through the second damping member 292 . It can vibrate the air.

In an embodiment, the second damping member 292 may include a mesh member made of a soft material (eg, Gore-Tex), a sponge member made of an elastic material, a grill member made of a rigid material, and a glass fiber member. can be formed into one. In an embodiment, the second damping member 292 may include the same or different material as that of the first damping member 291 . For example, the first damping member 291 may include a mesh member, and the second damping member 292 may include a sponge member.

The electronic device 100 may adjust a frequency response characteristic of an audio signal received through the acoustic ports 241 and 255 through the damping members 291 and 292 . In an embodiment, when the damping members 291 and 292 are of the same type, the electronic device may adjust the first frequency response characteristic Sd1 of the microphone module 200 .

In one embodiment, the diaphragm of the microphone module 200 may be connected to the second chamber space 252 in addition to the first chamber space 251 and the frequency of the microphone through the second damping member 292 located in the second chamber space. properties can be adjusted.

In the illustrated embodiment, the combination or position of the damping members 291 and 292 is merely an example, and the embodiment of the present disclosure is not limited thereto. In another embodiment, at least one of the first damping member 291 and the second damping member 292 may be omitted. In another embodiment, the second damping member 292 may be disposed at a position different from the illustrated embodiment. In the illustrated embodiment, the second acoustic port 255 is blocked by the housing 216 , but in another embodiment, the second acoustic port 255 is connected to the electronic device 100 through an inlet provided in the housing 216 . It can be connected externally.

In FIG. 7 , the dotted line indicates the sensitivity when the microphone module 200 includes only the first damping member 291 , and the solid line indicates the sensitivity when the microphone module 200 additionally includes the second damping member 292 . indicates Microphone sensitivity is an index indicating how high a voltage can be converted to sound, and the sensitivity of a digital microphone can be expressed in decibels versus full scale output (FSO) (dB FS) of the microphone. In the graph, the lower the number, the higher the sensitivity. Referring to FIG. 8 , the sensitivity may be improved in the vicinity of 10,000 Hz by including the second damping member 292 positioned in the second chamber 252 .

8 shows a microphone module 200 including a damping member in the second embodiment.

Referring to FIG. 8 , in an embodiment, the second damping member 292 may be positioned in the second through hole 254 of the assembly frame 213 . In an embodiment, a thickness of the second damping member 292 may correspond to a distance between the second printed circuit board 212 and the housing 216 . For example, an upper surface of the damping member may be in contact with a lower surface of the second printed circuit board 212 , and a lower surface of the damping member may be in contact with an upper surface of the housing 216 .

In an embodiment, the second damping member 292 absorbs audio vibrations, but may be configured in a form capable of transmitting an audio signal. For example, the second damping member 292 may include an air pocket soft material. In an embodiment, the electronic device 100 may adjust a frequency response characteristic of an audio signal received through the acoustic ports 241 and 255 through the damping members 291 and 292 . In an embodiment, when the damping members 291 and 292 are of different types, the electronic device may adjust the second frequency response characteristic Sd2 of the microphone module 200 .

In an embodiment, each of the first adhesive member 281 and the second adhesive member 282 may include an opening corresponding to the second through hole 254 . In an embodiment, the damping member may occupy a space defined by a combination of the second through hole 254 and the openings of the adhesive members 281 and 282 . In another embodiment, the first adhesive member 281 includes an opening corresponding to the second through hole 254 , and the second adhesive member 282 does not include an opening corresponding to the second through hole 254 . it may not be

In an embodiment, the outer peripheral surface of the second damping member 292 may coincide with the outer peripheral surface of the second through hole 254 of the assembly frame 213 . For example, the second damping member 292 may have a cylindrical shape corresponding to the second through hole 254 .

In the illustrated embodiment, the combination or position of the damping members 291 and 292 is merely an example, and the embodiment of the present disclosure is not limited thereto. In another embodiment, at least one of the first damping member 291 and the second damping member 292 may be omitted. In another embodiment, the second damping member 292 may be disposed in a position different from the illustrated embodiment in the second chamber 252 . In the illustrated embodiment, the second acoustic port 255 is blocked by the housing 216 , but in another embodiment, the second acoustic port 255 is connected to the electronic device 100 through an inlet provided in the housing 216 . It can be connected externally.

9 shows a microphone module 200 including damping members 291 and 292 in the third embodiment.

Referring to FIG. 9 , the electronic device 100 may include a protrusion structure 293 extending from the inner surface of the housing 216 . For example, the protrusion structure 293 may have a hemispherical shape. When the assembly frame 213 is coupled to the housing 216 , the protruding structure 293 may be aligned with the second through hole 254 of the assembly frame 213 . The protruding structure 293 of the housing 216 may help the assembly frame 213 to be easily aligned with the housing 216 while the assembly frame 213 is coupled to the housing 216 .

In an exemplary embodiment, the protrusion structure 293 may provide a function of assisting alignment between the assembly frame 213 and the housing 216 as well as a function of the assembly frame 213 and a damping member. In an embodiment, the protrusion structure 193 may provide damping for an audio signal by being made of a material different from that of the assembly frame 213 . For example, when the assembly frame 213 is an injection plate, the protruding structure 293 may be made of a soft rubber material. In an embodiment, the protrusion structure 293 has a hemispherical shape, so that a reflection coefficient for an audio signal may be adjusted. In this case, the electronic device may adjust the fifth frequency response characteristic Sd5 of the microphone module 200 in response to the protrusion structure 293 that changes the volume and shape of the second chamber 252 .

The volume of the second chamber 252 is reduced by the volume occupied by the protrusion structure 293 , and accordingly, the frequency response of the microphone may vary. Accordingly, the designer may improve the performance (eg, SNR, sensitivity) of the microphone by changing the shape or volume of the protruding structure 293 .

In the illustrated embodiment, the combination or position of the damping members 291 and 292 is merely an example, and the embodiment of the present disclosure is not limited thereto. In another embodiment, at least one of the first damping member 291 and the second damping member 292 may be omitted. In another embodiment, the second damping member 292 may be disposed in a position different from the illustrated embodiment in the second chamber 252 . In the illustrated embodiment, the second acoustic port 255 is blocked by the housing 216 , but in another embodiment, the second acoustic port 255 is connected to the electronic device 100 through an inlet provided in the housing 216 . It can be connected externally.

10 shows the second chamber 252 further expanded by a recess formed in the housing 216 in one embodiment. 11 illustrates a microphone module 200 including a damping member positioned in a recess in a housing 216 in one embodiment.

Referring to FIG. 10 , the housing 216 may include a recess 256 aligned with the second through hole 254 . In an embodiment, a cross-section of the recess 256 viewed from the vibration direction of the diaphragm 221 may be larger than a cross-section of the second through-hole 254 . For example, the recess 256 may include a hole having a third diameter D3 greater than the second diameter D2 of the second through hole 254 .

In an embodiment, the frequency characteristics of the microphone module may vary depending on the material constituting the housing 216 . For example, the housing 216 may be made of a material having a hardness different from that of the assembly frame 213 and the printed circuit boards 211 and 213 . For example, the housing 216 may include a metal material or an injection material. The electronic device may adjust the fourth frequency response characteristic Sd4 of the microphone module 200 in response to the recess 256 of the housing 216 and the second damping member 292 disposed in the second chamber 252 . have.

In one embodiment, the microphone may include a second damping member 292 at least partially positioned within the second chamber 252 . Referring to FIG. 10 , the microphone module 200 includes a first damping member 291 disposed on the shield can 240 , and a second damping member disposed between the second printed circuit board 212 and the assembly frame 213 . member 292 . When viewed from the vibration direction of the vibration plate 221 , the second damping member 292 may have a larger size than the second through hole 254 . In an embodiment, the second damping member 292 and the first adhesive member 281 may be configured not to overlap each other. For example, the opening of the second adhesive member may have a shape surrounding the edge of the second damping member 292 .

Referring to FIG. 11 , the microphone module 200 includes a first damping member 291 disposed on the shield can 240 , and a second damping member 292 positioned in the recess 256 of the housing 216 . may include When viewed from the vibration direction of the vibration plate 221 , the second damping member 292 may have a larger size than the second through hole 254 . In an embodiment, the electronic device may adjust the third frequency response characteristic Sd3 of the microphone module 200 in response to the damping member 292 positioned in the recess 256 .

12 shows a structure for protecting the microphone module 200 in an embodiment.

In an embodiment, the inlet 218 of the microphone module 200 may be formed on a side surface of the housing 216 . In one embodiment, the housing 216 may include a side part 216a extending towards the window 121 , and the inlet 218 may be formed in a portion of the side part 216a.

In one embodiment, when the inlet 218 is formed in the housing 216 , the assembly frame 213 and the sound collecting structure 270 may include an opening aligned with the inlet 218 . In an embodiment, the assembly frame 213 may include a through hole 213a aligned with the inlet 218 , and the sound collecting structure 270 may include a guide hole 271 connected to the through hole 213a. According to the embodiment shown in FIG. 12 , the guide hole 271 may be located on the sidewall instead of the top plate of the sound collecting structure 270 , unlike the embodiments shown in FIGS. 6 to 11 . Sound from outside the electronic device 100 may be propagated to the diaphragm 221 of the transducer 220 through the inlet 218 , the through hole 213a , the guide hole 271 , and the first sound port 241 . have.

In the above-described embodiments, the second chamber 252 may be used as a passage for sound input. In an embodiment, the second chamber 252 may be acoustically connected to the outside of the electronic device 100 through at least one acoustic path (eg, a duct). For example, the housing 216 may include a first microphone hole and a second microphone hole, and the electronic device 100 includes a first acoustic path connecting the first microphone hole and the first chamber 251 , and A second acoustic path connecting the second microphone hole and the second chamber 252 may be included.

In an embodiment, the first acoustic path connected to the first chamber 2510 may have a different direction from the vibration plane of the diaphragm 221. For example, the first chamber 251 may include a side part 216a of the housing 216. ), and the direction in which the inlet 218 is opened may be perpendicular to the direction in which the vibrating surface of the diaphragm 221 faces. In one embodiment, the second sound connected to the second chamber 252 The path may have substantially the same direction as the vibration surface of the vibration plate 221 .

In one embodiment, the inlet 218 is disposed on the side of the housing 216 so that the path of the audio signal may be lengthened. Accordingly, the reflection coefficient may increase or the microphone performance may deteriorate. In an embodiment, the electronic device 100 provides the second chamber space 252 and/or the second damping member 292 positioned in the second chamber space 252 to decrease microphone performance as the length of the audio path increases. can be minimized.

In an embodiment, the electronic device 100 may adjust a frequency response characteristic of an audio signal received through the acoustic ports 241 and 255 through the damping members 291 and 292 . In an embodiment, the electronic device may adjust the sixth frequency response characteristic Sd6 of the microphone module 200 in response to the damping members 291 and 292 .

Although not shown, in an embodiment, a camera module (eg, the camera 260 of FIG. 2 ) may be mounted on the second printed circuit board 212 . In an embodiment, the angle of view of the camera may face the same direction as the second sound port 241 of the shield can 240 . In an embodiment, the angle of view of the camera may face the same direction as the inlet 218 of the side part 216a.

Meanwhile, referring to FIG. 1 , the first housing 111 including the window 121 and the microphone module 200 disposed under the window 121 includes other components (eg, the keyboard 130 , the touch pad 150 ). ))), and can pivot about a second housing 112 . When the first housing 111 contacts the second housing 112 while the electronic device 100 is folded, the window 121 of the first housing 111 may be impacted by the second housing 112 . . The impact applied to the window 121 may be transmitted to the microphone module 200 disposed under the window 121 and the microphone module 200 may be damaged.

Referring to FIG. 12 , in an embodiment, the electronic device 100 may further include a protection structure 217 protruding outside the window 121 . In an embodiment, the protective structure 217 may be configured to receive, instead of, the window 121 that is impacted by the other structure when the window 121 approaches another structure. The protection structure 217 may protect the window 121 and the microphone disposed under the window 121 . In another embodiment, the protective structure 217 may be omitted.

In an embodiment, the protection structure 217 may be connected to the assembly frame 213 or may be formed integrally with the assembly frame 213 . For example, the protective structure 217 may extend from a portion of the assembly frame 213 .

In an embodiment, the protection structure 217 may include a protruding part 217a that protrudes from the window 121 . When the window 121 approaches another structure (eg, the second housing 112 of FIG. 1 ), the protruding part 217a may contact the structure and the window 121 may not directly contact the structure. The impact applied to the protruding part 217a due to the second housing 112 bypasses the window 121 along the protective structure 217 and is transmitted to the first housing 111 , which impacts the microphone module 200 . can be protected from

In an embodiment, the protruding part 217a may include a material suitable for shock absorption. For example, the protruding part 217a may include rubber or silicone. The protruding part 217a may be adhered to the protection structure 217 through an adhesive member (eg, a double-sided tape, a bond) or may be coupled to a bonding structure formed in the protection structure 217 .

13 illustrates a rear view and a side view of an electronic device 300 including a camera 310 and a microphone according to an embodiment.

In an embodiment, the electronic device 300 may include a camera 310 and microphone holes 320 and 340 disposed on one surface of the housing. In an embodiment, the rear cover 301 and the camera window 302 may constitute one surface (eg, a rear surface) of the electronic device 300 . In an embodiment, the camera window 302 may be disposed over the camera 310 . In an embodiment, the first microphone hole 320 passes through the camera window 302 and may function as a sound port for a microphone module disposed inside the electronic device 300 . In an embodiment, the second microphone hole 330 may pass through the side housing 303 and function as a sound port for a microphone module disposed inside the electronic device 300 . In another embodiment, either the first microphone hole 320 or the second microphone hole 330 may be omitted.

The microphone module connected to the camera 310 and the microphone hole 320 of the electronic device 300 may be implemented in substantially the same manner as in the embodiments illustrated in FIGS. 1 to 11 .

For example, the camera 310 and the diaphragm of the microphone (eg, the diaphragm 221 of FIG. 2 ) are on a printed circuit board (eg, the second printed circuit board 211 of FIG. 2 ) so as to face the same direction. can be mounted. For another example, the microphone may include a first chamber 251 and a second chamber 252 that are divided based on the diaphragm 221 , and a damping member may be positioned in the second chamber 252 . As another example, the electronic device 300 includes an assembly frame 213 therein, and a printed circuit board on which the transducer 220 is mounted may be disposed on the assembly frame 213 , and the assembly frame ( 213 ) and the printed circuit board may include through-holes aligned with the diaphragm 221 . As another example, the electronic device 300 may include a structure to which the assembly frame 213 is attached therein, and the structure may include a recess 256 or a hole aligned with the diaphragm 221 .

14 is a block diagram of components included in the electronic devices 100 and 300 according to an embodiment.

In an embodiment, the electronic devices 100 and 300 may include a processor 410 . The processor 410 may transmit a command to components included in the electronic device 100 or 300 or receive a signal from the components to perform a specified operation. For example, when the audio recording program is executed, the processor 410 may receive an external sound through a microphone in response to a user input from the input device.

In an embodiment, the electronic device 100 or 300 may include a user interface unit 411 , an audio interface unit 412 , an image interface unit 413 , and/or an application management unit 414 .

In an embodiment, the user interface unit 411 of the processor 410 may receive a user input from the input device 420 . The input device 420 may include, for example, a keyboard, a mouse, or a touch pad. In an embodiment, the user interface unit 411 may be connected to an input device through a separate input controller MCU.

In an embodiment, the electronic devices 100 and 300 may control the microphone 430 through the audio interface unit 412 . For example, the electronic device 100 or 300 may activate the audio interface unit 412 in response to a user's command to record audio. The audio interface unit 412 may collect external sound through the microphone 430 . In an embodiment, the audio interface unit 412 may be configured in the form of a separate audio processor (codec). According to an embodiment, the microphone 430 may correspond to the microphone module 200 illustrated in FIGS. 2 to 12 .

In an embodiment, the electronic devices 100 and 300 may control the camera 440 through the image interface unit 413 . For example, the image interface unit 413 may receive image data obtained by the camera 440 from the camera 440 .

In an embodiment, the display 120 may be used as an input device. For example, the display 120 may include a touch sensor or a digitizer 461 . The electronic devices 100 and 300 may detect a user input touched or hovered on the display 120 using a touch sensor, and may perform an operation corresponding to the user input. Alternatively, the electronic device 100 or 300 may detect a stylus close to the display 120 using a digitizer.

In an embodiment, the application management unit 414 may perform an application-related function using instructions stored in the memory 450 . For example, audio recording data converted through the audio interface unit 413 may be stored in the memory 450 .

15 is a flowchart for receiving an audio signal based on a type of a microphone (eg, the microphone 430 of FIG. 14 ) according to an embodiment.

According to an embodiment, the electronic devices 100 and 300 may activate the audio interface unit 411 in operation 510 . For example, the electronic device 100 or 300 may activate the audio interface unit 411 in response to an application related to audio collection being executed. For example, the electronic device 100 or 300 may receive an audio recording or video recording input from a user, and may activate a corresponding audio interface unit 411 in response thereto.

In an embodiment, when capturing a video, an audio file may be converted into a video file through a codec and stored. Audio files can be converted to a different file format than when audio alone is recorded. When shooting a video, an audio signal may be recorded with low sound quality.

In an embodiment, the electronic device 100 or 300 may call a frequency response characteristic parameter related to a microphone included in the electronic device 100 or 300 in operation 530 . In an embodiment, the electronic devices 100 and 300 may identify the type of microphone connected to the audio interface unit 412 . In an embodiment, the electronic device 100 or 300 determines how many acoustic ports the microphone has, or what type of damping member (eg, the first damping member 291 or the second damping member 292 of FIG. 6 ). It can be determined whether or not For example, whether the microphone includes a single acoustic port (eg, first acoustic port 241 in FIG. 2 ), or two acoustic ports (eg, first acoustic port 241 and second acoustic port in FIG. 2 ) 255)) can be determined. In an embodiment, the electronic devices 100 and 300 provide frequency response characteristic parameters (eg, a first frequency response characteristic Sd1 of FIG. 6 , and a second frequency response characteristic Sd2 of FIG. 8 ) based on the identified microphone type. , the fifth frequency response characteristic (Sd5) of FIG. 9, the fourth frequency response characteristic (Sd4) of FIG. 10, the third frequency response characteristic (Sd3) of FIG. 11, or the sixth frequency response characteristic (Sd6) of FIG. 12) can be called

In an embodiment, the electronic devices 100 and 300 may receive an audio signal from a microphone based at least on the frequency response characteristic parameter in operation 550 . For example, the electronic devices 100 and 300 may generate an acoustic signal of better quality by transforming an acoustic signal received through a microphone using a frequency response characteristic parameter. According to an embodiment, the electronic device may call an optimal codec in response to the called frequency response characteristic parameter and store the received audio signal in a specific audio file format.

In an embodiment, an electronic device includes: a housing; an assembly frame within the housing; a printed circuit board disposed on the assembly frame; a transducer disposed on the printed circuit board and including a diaphragm; a shield can disposed in a direction in which the first surface of the diaphragm of the transducer faces and including a top plate including a first acoustic port, a shield can extending from the top plate to the printed circuit board and including a sidewall surrounding at least the transducer; a first chamber defined by the upper plate, the sidewall, and the printed circuit board of the shield can; a second chamber defined by a first through hole formed in the printed circuit board and aligned with a second surface of the diaphragm, and a second through hole formed in the assembly frame and aligned with the first through hole; and at least one damping member, at least a portion of which is disposed in the second chamber, wherein at least one of the first chamber or the second chamber is connected to the outside of the housing, and the diaphragm is disposed in the first chamber or the second chamber The second chamber may vibrate by sound propagating through at least one of the second chambers.

In an embodiment, the printed circuit board includes a first printed circuit board and a second printed circuit board disposed on the first printed circuit board, and the first through hole includes the first printed circuit board and the second printed circuit board. 2 It can penetrate the printed circuit board.

In an embodiment, the first printed circuit board includes a first conductive pad surrounding the first through hole on a surface in contact with the second printed circuit board, and the second printed circuit board is connected to the first printed circuit board a second conductive pad surrounding the first through hole on a contact surface, the second conductive pad being disposed between the first conductive pad and the second conductive pad, and a space between the first printed circuit board and the second printed circuit board It may further include an adhesive member configured to seal.

In an embodiment, the electronic device may further include a camera module disposed on the second printed circuit board, and the angle of view of the camera may face the same direction as the first sound port.

In an embodiment, a diameter of the second through hole may be greater than a diameter of the first through hole.

In an embodiment, the electronic device includes: a window disposed on the shield can and including an acoustic inlet; and a sound collecting structure disposed between the window and the shield can and including a guide hole aligned with the inlet.

In an embodiment, a portion of the window corresponding to the sound collecting structure may be opaque.

In an embodiment, the damping member may be disposed between the printed circuit board and the assembly frame.

In an embodiment, the damping member may have a shape corresponding to the second through hole and be disposed in the second through hole.

In an embodiment, it may include another damping member mounted on the first acoustic port.

In an embodiment, the housing may include a recess aligned with the second through hole, and the second chamber may further include a space defined by the recess.

In an embodiment, the recess may have a width greater than that of the second through hole.

In an embodiment, the damping member may be disposed in the recess.

In an embodiment, the electronic device may further include a protrusion structure extending from the housing and aligned with the second through hole.

In an embodiment, the electronic device may further include a window disposed on the shield can, and the assembly frame may include a protruding part extending from a portion of the assembly frame and protruding toward the outside of the electronic device than the window. have.

In one embodiment, the microphone module includes an assembly frame; a printed circuit board disposed on the assembly frame; a transducer disposed on the printed circuit board and including a diaphragm; an upper plate disposed in a direction in which the first surface of the diaphragm of the transducer faces and including a first acoustic port, a side wall extending from the upper plate to the printed circuit board and surrounding at least the transducer, and on the printed circuit board a first chamber defined by; a second chamber defined by a first through hole formed in the printed circuit board and aligned with a second surface of the diaphragm, and a second through hole formed in the assembly frame and aligned with the first through hole; and at least one damping member, at least a portion of which is disposed in the second chamber.

In an embodiment, the printed circuit board includes a first printed circuit board and a second printed circuit board disposed on the first printed circuit board, and the first through hole includes the first printed circuit board and the second printed circuit board. 2 It can penetrate the printed circuit board.

In an embodiment, the microphone module may further include a camera module disposed on a second printed circuit board, and the angle of view of the camera may face the same direction as the first sound port.

In an embodiment, the microphone module may further include a sound collecting structure that surrounds the upper plate and the sidewall and includes a guide hole acoustically connected to the first sound port.

In an embodiment, the microphone module may further include another damping member mounted on the first sound port.

The electronic devices 100 and 300 according to various embodiments of the present disclosure may have various types of devices. The electronic devices 100 and 300 may include, for example, a portable communication device (eg, a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic devices 100 and 300 according to an embodiment of the present disclosure are not limited to the above-described devices.

The various embodiments of the present disclosure and terms used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. In this disclosure, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. that one (eg first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively” When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

Claims (20)

In an electronic device,
housing;
an assembly frame within the housing;
a printed circuit board disposed on the assembly frame;
a transducer disposed on the printed circuit board and including a diaphragm;
a shield can disposed in a direction in which the first surface of the diaphragm of the transducer faces and including a top plate including a first acoustic port, a shield can extending from the top plate to the printed circuit board and including a sidewall surrounding at least the transducer;
a first chamber defined by the upper plate, the sidewall, and the printed circuit board of the shield can;
a second chamber defined by a first through hole formed in the printed circuit board and aligned with a second surface of the diaphragm, and a second through hole formed in the assembly frame and aligned with the first through hole; and
at least one damping member, at least a portion of which is disposed within the second chamber;
At least one of the first chamber or the second chamber is connected to the outside of the housing, and the diaphragm vibrates to a sound outside the housing propagating through at least one of the first chamber or the second chamber, electronic device. According to claim 1,
The printed circuit board includes a first printed circuit board and a second printed circuit board disposed on the first printed circuit board, and the first through hole includes the first printed circuit board and the second printed circuit board. Through the electronic device. 3. The method of claim 2,
The first printed circuit board includes a first conductive pad surrounding the first through hole on a surface in contact with the second printed circuit board,
a second conductive pad surrounding the first through hole on a surface of the second printed circuit board in contact with the first printed circuit board;
The electronic device further comprising an adhesive member disposed between the first conductive pad and the second conductive pad and configured to seal between the first printed circuit board and the second printed circuit board. 3. The method of claim 2,
Further comprising a camera module disposed on the second printed circuit board,
The electronic device, wherein the angle of view of the camera faces in the same direction as the first sound port. According to claim 1,
and a diameter of the second through hole is greater than a diameter of the first through hole. According to claim 1,
a window disposed on the shield can and including an acoustic inlet; and
The electronic device further comprising a sound collecting structure disposed between the window and the shield can and including a guide hole aligned with the inlet. 7. The method of claim 6,
A portion of the window corresponding to the sound collecting structure is opaque. According to claim 1,
and the damping member is disposed between the printed circuit board and the assembly frame. 9. The method of claim 8,
and the damping member has a shape corresponding to the second through hole and is disposed in the second through hole. 9. The method of claim 8,
and another damping member mounted on the first acoustic port. 9. The method of claim 8,
the housing includes a recess aligned with the second through hole;
and the second chamber further comprises a space defined by the recess. 12. The method of claim 11,
The recess has a width greater than that of the second through hole. 12. The method of claim 11,
and the damping member is disposed within the recess. According to claim 1,
The electronic device of claim 1, further comprising a protruding structure extending from the housing and aligned with the second through hole. According to claim 1,
Further comprising a window disposed on the shield can,
and the assembly frame includes a protruding part extending from a portion of the assembly frame and protruding toward the outside of the electronic device from the window. In the microphone module,
assembly frame;
a printed circuit board disposed on the assembly frame;
a transducer disposed on the printed circuit board and including a diaphragm;
an upper plate disposed in a direction in which the first surface of the diaphragm of the transducer faces and including a first acoustic port, a side wall extending from the upper plate to the printed circuit board and surrounding at least the transducer, and on the printed circuit board a first chamber defined by;
a second chamber defined by a first through hole formed in the printed circuit board and aligned with a second surface of the diaphragm, and a second through hole formed in the assembly frame and aligned with the first through hole; and
and at least one damping member, at least a portion of which is disposed within the second chamber. 17. The method of claim 16,
The printed circuit board includes a first printed circuit board and a second printed circuit board disposed on the first printed circuit board, and the first through hole includes the first printed circuit board and the second printed circuit board. Through the microphone module. 17. The method of claim 16,
Further comprising a camera module disposed on the second printed circuit board,
The angle of view of the camera is directed in the same direction as the first sound port, the microphone module. 17. The method of claim 16,
The microphone module further comprising a sound collecting structure surrounding the upper plate and the sidewall and including a guide hole acoustically connected to the first sound port. 17. The method of claim 16,
The microphone module further comprising another damping member mounted on the first acoustic port.

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