KR20210143095A - Display panel module and electronic device comprising display panel modules - Google Patents

Abstract

The present invention provides a display panel module and an electronic device including a plurality of display panel modules, which can reduce the thickness of a display device. The electronic device comprises: a housing; cover glass; a plurality of display panels arranged on the rear surface of the cover glass in the housing; a plurality of first heat radiation plates arranged on the rear surfaces of the plurality of display panels in the housing; a plurality of power/data receiving circuit boards arranged on the rear surfaces of the plurality of first heat radiation plates in the housing; a support member to support at least a portion of the plurality of power/data receiving circuit boards; and a power/data transmitting circuit board at least partially supported in contact with the support member, and separated from the plurality of power/data receiving circuit boards to be arranged in a space provided by the support member. The power/data transmitting circuit board has a plurality of first antennas corresponding to a plurality of second antennas included in the plurality of power/data receiving circuit boards, and includes a transmitting resonator corresponding to a plurality of receiving resonators included in the plurality of power/data receiving circuit boards. Various other embodiments can be applied to the electronic device of the present invention.

Description

Electronic device including a display panel module and a plurality of display panel modules

Various embodiments of the present disclosure relate to a display panel module and an electronic device including a plurality of display panel modules.

With the development of semiconductor technology, various types of display devices are being developed. For example, various types of display devices constitute a display screen by forming a matrix with a light emitting diode (LED), a liquid crystal display (LCD) device, or a similar device. With the development of technology, the size of the display is getting larger, and products that provide better picture quality and resolution are being released.

As a type of display, micro LED (μLED) display is a rapidly growing display field, and a plurality of display panels can be connected in various forms to constitute one large display screen.

The micro LED display has an assembly form of a multi-layer structure, and a thick wired cable and multiple connectors can be used to transmit power and data.

For example, in order to transmit the display image data and power from one transmission circuit board that supplies display image data and power to the plurality of display panels, a large number of wired cables are required, which complicates the configuration of the display and the display of the display. thickness will increase. In addition, since the single transmission circuit board and the plurality of display panel modules must be connected by wire, it may be difficult to modularize the display panel, and it may be difficult to efficiently utilize space.

In various embodiments of the present disclosure, including a transmission resonator capable of wirelessly transmitting power to a transmission circuit board, and by wirelessly transmitting power from one transmission resonator to a plurality of reception resonators included in each of a plurality of display panels It is possible to provide a display panel module capable of reducing the thickness of the display device and an electronic device including a plurality of display panel modules.

In addition, in various embodiments of the present disclosure, a plurality of transmit antennas capable of wirelessly transmitting data to a transmitting circuit board are included, and each transmit antenna transmits an image to each of a plurality of receive antennas included in each of the plurality of display panels. It is possible to provide a display panel module capable of reducing the thickness of a display device by wirelessly transmitting data, and an electronic device including a plurality of display panel modules.

An electronic device according to an embodiment for solving the above or other problems includes: a housing; cover glass; a plurality of display panels disposed on a rear surface of the cover glass in the housing; a plurality of first heat dissipation plates disposed on rear surfaces of the plurality of display panels in the housing; a plurality of power/data receiving circuit boards disposed on rear surfaces of the plurality of first heat dissipation plates in the housing; a support member for supporting at least a portion of the plurality of power/data receiving circuit boards; and a power/data transmission circuit board, at least a portion of which is in contact with and supported by the support member, and disposed to be spaced apart from the plurality of power/data reception circuit boards by a predetermined distance in a space provided by the support member, wherein The power/data transmission circuit board includes a plurality of first antennas corresponding to a plurality of second antennas included in each of the plurality of power/data reception circuit boards, and each of the plurality of power/data reception circuit boards It may include a transmission resonator corresponding to the plurality of reception resonators included in the .

A display panel module according to any one of various embodiments may include a display panel; a first heat dissipation plate disposed on a rear surface of the display panel; and a power/data reception circuit board disposed on a rear surface of the first heat dissipation plates, wherein the power/data reception circuit board may include an antenna and a reception resonator.

A display panel module and an electronic device including a plurality of display panel modules according to various embodiments reduce the thickness of a display by wirelessly transmitting power and data from a transmission circuit board constituting a micro display to a plurality of display panels state, and the space within the display can be efficiently utilized.

1 is a diagram illustrating an electronic device according to various embodiments of the present disclosure;
2 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;
3 is a cross-sectional view of an electronic device, according to various embodiments of the present disclosure;
4 is a cross-sectional view of an electronic device, according to various embodiments of the present disclosure;
5 is a cross-sectional view of an electronic device, according to various embodiments of the present disclosure;
6 is a block diagram of an electronic device according to various embodiments of the present disclosure;
7 is a circuit diagram of an electronic device according to various embodiments of the present disclosure;
8 is a diagram illustrating a power/data reception circuit board according to various embodiments of the present disclosure;
9 is a diagram illustrating a power/data transmission circuit board according to various embodiments of the present disclosure;
10A is a diagram illustrating a transmit resonator and a receive resonator according to various embodiments of the present disclosure;
10B is a diagram illustrating a transmit resonator and a receive resonator according to various embodiments of the present disclosure;
11 is a diagram illustrating a method of transmitting data from a transmitting circuit board to a receiving circuit board according to various embodiments of the present disclosure;
12 is a diagram illustrating a method of transmitting data from a transmitting circuit board to a receiving circuit board according to various embodiments of the present disclosure;
13 is a diagram illustrating a method of manufacturing a display panel module according to various embodiments of the present disclosure;
14 is a diagram illustrating a configuration example of image data according to various embodiments of the present disclosure;
15 is a diagram illustrating a configuration example of image data according to various embodiments of the present disclosure;
16 is a diagram illustrating a configuration example of image data according to various embodiments of the present disclosure;
17 is a diagram illustrating a configuration example of image data according to various embodiments of the present disclosure;

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. It should be noted that the same components in the drawings are denoted by the same reference numerals wherever possible. Detailed descriptions of well-known functions and configurations that may unnecessarily obscure the gist of the present invention in the following description and accompanying drawings will be omitted.

1 is a diagram illustrating an electronic device 10 according to various embodiments of the present disclosure. Referring to FIG. 1 , an electronic device 10 (eg, a display device) according to various embodiments of the present disclosure may be a multi-display device (or modular display) that implements a screen by connecting a plurality of display panels. The multi-display device may be a device in which a large screen is realized by connecting a plurality of display panels. According to an embodiment, the multi-display device connects a plurality of flat panel display panels, such as a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP), and an organic light-emitting diode (OLED), to You can configure the dialog. For example, as the multi-display device, a large-sized TV for exhibition in which a large screen is made by connecting a plurality of CRTs may be applicable. In addition, small portable devices such as mobile phones, smart phones, and personal digital assistants (PDAs) as well as home TVs may correspond to multi-display devices when a plurality of panels are connected. Electronic devices according to various embodiments of the present disclosure include, in addition to the aforementioned TV, mobile phone, smartphone, and PDA, an electronic book, an electronic picture frame, an electronic blackboard, an electronic table, a large format display (LFD), a tablet, a desktop, a notebook computer, and a kiosk. Various electronic devices including

The electronic device 10 may display one content or a plurality of content simultaneously on the entire screen. The electronic device 10 according to various embodiments may support a multi-view (or multi-vision) mode as well as a normal mode. Here, the normal mode may display one content, and the multi-view mode may be a mode that displays a plurality of different content.

1, an electronic device 10 according to an embodiment of the present invention physically connects a plurality of display modules 100-1, 100-2, 100-3, 100-4.... It can be implemented in a connected form. A plurality of display modules (100-1, 100-2, 100-3, 100-4...) are arranged and connected to constitute one large screen, each individually or selectively operated unit display panel It can be composed of modules. Here, each of the plurality of display modules 100-1, 100-2, 100-3, 100-4.... may include a plurality of pixels. In particular, each of the plurality of pixels included in each display module (100-1, 100-2, 100-3, 100-4....) may be implemented as a micro LED (μLED) pixel, but is limited thereto. it is not For example, the display module may be implemented as a liquid crystal display (LCD), an organic LED (OLED), an active-matrix OLED (AMOLED), a plasma display panel (PDP), or a quantum dot (QD) module. However, in the following, for convenience of explanation, it is assumed that each of the multiple display modules (100-1, 100-2, 100-3, 100-4....) is implemented as a micro LED module.

According to the embodiment shown in FIG. 1, the number of the plurality of display 　 modules (100-1, 100-2, 100-3, 100-4....) or the plurality of display 　 modules (100-1, 100-) 2, 100-3, 100-4....) is only an example, and does not limit the scope of the various embodiments of the present disclosure. The plurality of display modules included in the electronic device 10 (100-1, 100-2, 100-3, 100-4...) may include a larger number or a smaller number unlike in FIG. 1 . It may include a number.

2, which will be described later, among the plurality of display modules 100-1, 100-2, 100-3, 100-4...., a plurality of display modules arranged in a 2 X 2 array are one module set can be explained with an example. However, it should be noted that this also does not limit the scope of the various embodiments of the present disclosure. For example, in the embodiment shown in the drawings below in FIG. 2 , a plurality of display modules in a 2 X 2 array form one display module set, and the one display module set is configured on one side of the electronic device 10 . A power/data transmission circuit board (eg, the power/data transmission circuit board 400 of FIG. 2 to be described below) and a support member (eg, to be described below) at positions corresponding to a plurality of display modules in a 2 X 2 array It can be seen that the support member 300 of FIG. 2 is disposed. However, the present invention is not limited thereto, and although not shown in the drawings, a plurality of display modules in a 1 X 4 or NXM arrangement may constitute one display module set, and a power/data transmission circuit board and a support member are positioned corresponding thereto. may be placed. According to an embodiment, the electronic device 10 may include a plurality of display module sets. In addition, various embodiments may be applied.

The electronic device 10 includes a housing 20 providing a space in which the plurality of display modules 100-1, 100-2, 100-3, 100-4.... It may include a cover glass 30 for protecting the display modules. According to an embodiment, the housing 20 may surround at least a portion of the plurality of display modules 100-1, 100-2, 100-3, 100-4.... It can accommodate a support member, a power/data transmission circuit board, and various electronic components. The cover glass 30 may be disposed on the front surface of the electronic device 10 to protect electronic components inside the electronic device 10 from external physical, chemical, or electrical shock.

2 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

Referring to FIG. 2 , an electronic device (eg, the electronic device 10 of FIG. 1 ) may include a display panel module set 200 , a support member 300 , and a power/data transmission circuit board 400 . The display panel module set 200 is disposed adjacent to the rear surface of the cover glass (eg, the cover glass 30 of FIG. 1 ), and the support member 300 and the power/data transmission circuit are followed by the display panel module set 200 . The substrate 400 may be sequentially disposed.

The display panel module set 200 may be configured to be connected to the power/data transmission circuit board 400 to transmit/receive power and/or data between the two.

The 'connection' between the display panel module set 200 and the power/data transmission circuit board 400 may include a network connection. A network connection may refer to a state in which data may be transmitted/received or resources may be shared between two components. That is, the network connection may refer to a state in which two components are connected through wired/wireless communication. To this end, two components communicate directly (Device-to-Device) (D2D) or indirectly through another device (e.g., access point (AP), router, etc.) Depending on the method, it may be connected to a network.

In addition, the 'connection' between the display panel module set 200 and the power/data transmission circuit board 400 may include a contactless connection. A detailed description of the contactless connection will be described later in detail with reference to FIG. 3 .

The display panel module set 200 may include a plurality of components for data and/or power transmission/reception, and the plurality of components may be configured as a module. The power/data transmission circuit board 400 may also include a plurality of components for data and/or power transmission/reception, and the plurality of components may also be configured as a module. Here, a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.

The display panel module set 200 includes a plurality of display panel modules (eg, a first display panel module 201 , a second display panel module 202 , a third display panel module 203 , and a fourth display panel module ( 204)) may be included. Each of the display panel modules 201 , 202 , 203 , and 204 may include a display module 210 , a first heat dissipation plate 220 , and a power/data reception circuit board 240 . The display module 210 , the first heat dissipation plate 220 , and the power/data receiving circuit board 240 may be sequentially disposed adjacent to a rear surface of a cover glass (eg, the cover glass 30 of FIG. 1 ). According to various embodiments, some of the above-mentioned components may be omitted or one or more other components may be further added to the display panel module set 200 . For example, a second heat dissipation plate 230 may be additionally provided between the display module 210 and the first heat dissipation plate 220 .

The display panel module set 200 may include a plurality of display panel modules 201 , 202 , 203 , and 204 as sub-modules. For example, as shown in Fig. 2, the display panel module set 200 includes a first display panel module 201, a second display panel module 202, a third display panel module 203, and a fourth display. A panel module 204 may be included. Although sub-modules of a 2 X 2 arrangement are disclosed herein, it should be noted that the arrangement may vary according to embodiments. The first display panel module 201 may include a first display module 211 , a 1-1 heat dissipation plate 221 , and a first power/data reception circuit board 241 . The second display panel module 202 may include a second display module 212 , a 1-2 heat dissipation plate 222 , and a second power/data receiving circuit board 242 . The third display panel module 203 may include a third display module 213 , a 1-3 th heat dissipation plate 223 , and a third power/data receiving circuit board 243 . The fourth display panel module 204 may include a fourth display module 214 , a 1-4 heat dissipation plate 224 , and a fourth power/data receiving circuit board 244 . Elements constituting each display panel module as a sub-module may be stacked on each other and electrically connected to each other to operate. The plurality of display panel modules 201 , 202 , 203 , and 204 may be arranged and connected to constitute one large screen. The plurality of display panel modules 201 , 202 , 203 , and 204 are interlocked with each other by a processor included in the electronic device 10 to display one content on the entire screen, or are individually or selectively driven to display a plurality of content can be displayed.

The plurality of display panel modules 201 , 202 , 203 , 204 or each component constituting each display panel module is physically separated from, or physically separated from, another adjacent display panel module or other adjacent components. and can be integrally connected.

However, the display panel modules 201 , 202 , 203 , 204 or each component constituting the display panel module may be functionally separated from each other and independently or selectively controlled by the processor provided in the electronic device 10 . have.

Hereinafter, each component constituting the module centered on the first display panel module 201 will be described in detail.

The first display panel module 201 may include a first display module 211 , a 1-1 heat dissipation plate 221 , and a first power/data reception circuit board 241 .

The first display module 211 corresponds to a main load that consumes power of the electronic device 10 and may include at least one light emitting device (eg, a pixel). The first display module 211 may include a display panel and a display driver IC (DDI) for controlling the display panel. The DDI may receive, for example, image data or image information including an image control signal corresponding to a command for controlling the image data from another component of the electronic device 10 through an interface. At least one light emitting device (eg, a pixel) included in the first display module 211 is driven based at least in part on a voltage value or a current value corresponding to the image data, so that the visual data corresponding to the image data is driven. Information (eg, text, image, or icon) may be displayed through the display 210 .

The 1-1 heat dissipation plate 221 may be disposed on the rear surface of the first display module 211 and may be provided to dissipate heat generated from the light emitting device of the first display module 211 . According to an embodiment, the 1-1 heat dissipation plate 221 may be disposed on the rear surface of the first display module 211 by an adhesive member (not shown) or the like. The 1-1 heat dissipation plate 221 may be formed of any thermally conductive material having good heat transfer efficiency, for example, aluminum (Al) or an aluminum alloy. The 1-1 heat dissipation plate 221 may be formed in the shape of a flat plate (or thin film, or sheet) having a large area. According to an embodiment, at least a portion of the first-first heat dissipation plate 221 may be in contact with the housing of the electronic device 10 (eg, the housing 20 of FIG. 1 ) or at least a portion of the support member 300 . In addition, heat generated from the light emitting device of the first display panel module 211 may be radiated through the housing 20 or the support member 300 .

The first power/data reception circuit board 241 is disposed on the rear surface of the 1-1 heat dissipation plate 221 , and performs data transmission/reception and power transmission/reception with the power/data transmission circuit board 400 . can A detailed description of the first power/data receiving circuit board 241 will be described later in detail through the embodiment of FIG. 3 .

The first display panel module 201 may be connected together with other display panel modules (eg, 202 , 203 , 204 ) to configure the display panel module set 200 . The above description of each configuration of the first display panel module 201 may be applied mutatis mutandis to each configuration of the other display panel modules (eg, 202 , 203 , 204 ).

The support member 300 may be disposed on the rear surface of the display panel module set 200 and may be configured to contact and support at least a portion of the display panel module set 200 . According to an embodiment, the support member 300 may constitute at least a portion of a housing (eg, the housing 20 of FIG. 1 ). According to an embodiment, the support member 300 may serve as a kind of bracket inside the housing (eg, the housing 20 of FIG. 1 ). According to an embodiment, the support member 300 may be configured in a wide and flat plate shape as shown in FIG. 2 or a combination of at least two members physically spaced apart from each other, although not shown in the drawing.

The support member 300 includes a space ( ) surrounded by the support member 300 and other components inside the electronic device 10 , for example, the display panel module set 200 , and the power/data transmission circuit board 400 . For example, the first space 301 and the second space 302) may be defined. At least some components of the display panel module set 200 and/or the power/data transmission circuit board 400 may be disposed on the spaces 301 and 302 .

As will be described later in detail, the support member 300 supports the display panel module set 200 and the power/data transmission circuit board 400 between the display panel module set 200 and the power/data transmission circuit board 400, respectively. a first support member (eg, the first support member 310 of FIG. 3 ) and a second support member (eg, the second support member ( 320)) may be included.

The power/data transmission circuit board 400 may be disposed on the rear surface of the support member 300 . The power/data transmission circuit board 400 may include components (eg, a resonator, an antenna, and various electronic components) for data transmission/reception and power transmission/reception between the display panel module set 200 . For example, the power/data transmission circuit board 400 includes a display panel module set 200 on the substrate and a transmission resonator 410 (eg, a coil) for transmitting/receiving power and transmitting/receiving data. A first antenna 430 may be provided.

According to an embodiment, the transmission resonator 410 included in the power/data transmission circuit board 400 of the present disclosure may be formed to be coupled to a plurality of reception resonators included in the display panel module set 200 . . That is, according to various embodiments of the present disclosure, a structure in which one transmit resonator is coupled to a plurality of receive resonators may be disclosed. According to some embodiments, the power consumption may be different for each display panel module 201 , 202 , 203 , 204 constituting the display panel module set 200 , and thus the display panel module 201 , 202 , 203 , 204 . It can be important to effectively supply or distribute power to A detailed description of the power supply or distribution will be described later in detail with reference to FIGS. 10A and 10B.

3 is a cross-sectional view of an electronic device, according to various embodiments of the present disclosure; A contactless connection between the display panel module set 200 and the power/data transmission circuit board 400 according to various embodiments of the present disclosure will be described in more detail with reference to FIG. 3 . 'Non-contact connection' means that when the display panel module set 200 and the power/data transmission circuit board 400 implement a certain function (eg, data and/or power transmission), the connection structure for implementing the function is physically may mean being implemented in a state spaced apart from each other.

Referring to FIG. 3 , a second space 302 surrounded by a support member 300 and other components inside the electronic device, for example, a display panel module set 200 , and a power/data transmission circuit board 400 . At least some components of the display panel module set 200 and at least some components of the power/data transmission circuit board 400 may be disposed thereon. For example, the reception resonances 251 and 252, the second shielding members 261 and 262, the second antennas 271 and 272, the reception modules 281 and 282, included in the display panel module set 200, Electronic components 291 and 292 may be disposed on the second space 302 . Also, for example, the transmission resonator 410, the first shielding member 420, the first antennas 431 and 432, and the transmission modules 441 and 442 included in the power/data transmission circuit board 400 are It may be disposed on the second space 302 .

The electronic device 10 uses antennas (eg, first antennas 431 and 432 and second antennas 271 and 272 ) included in the display panel module set 200 and the power/data transmission circuit board 400 . In various embodiments of the present disclosure, the second antennas 271 and 272 of the display panel module set 200 and the first antenna of the power/data transmission circuit board 400 ( 431 and 432 may be configured to operate in a very high frequency band of several GHz to several tens of GHz bands to implement functions such as short-distance transmission, securing a wide bandwidth, and data security.

The electronic device 10 according to various embodiments of the present disclosure may be configured to enable data transmission/reception as well as power transmission/reception. The electronic device 10 uses the reception resonators 251 and 252 included in the display panel module set 200 and the transmission resonator 410 included in the power/data transmission circuit board 400 to generate power in a contactless connection structure. can be sent/received.

The reception resonators 251 and 252 are disposed to face the power/data transmission circuit board 400 in the space 302 provided by the support member 300 , and the transmission resonators 410 are provided by the support member 300 . It may be arranged to face the display panel module set 200 in the space 302 .

The reception resonators 251 and 252 and the transmission resonator 410 are based on an inductive coupling method based on an electromagnetic induction phenomenon generated by a wireless power signal and an electromagnetic resonance phenomenon generated by a wireless power signal of a specific frequency. Power may be transferred to the wireless power receiver using one or more of the electromagnetic resonance coupling schemes. The wireless power transmission method by electromagnetic induction is a technology for wirelessly transmitting power using a primary conductive pattern and a secondary conductive pattern. Power is transmitted by inducing a current to the pattern side. The wireless power transmission method using the resonance coupling method refers to electromagnetic resonance generated in an electronic device by a wireless power signal transmitted from the wireless power transmitter, and power is transferred from the wireless power transmitter to the electronic device by the resonance phenomenon .

A magnetic shield member (e.g., a second shielding member (e.g., a second shielding member (e.g., a second shielding member) 261) and a first shielding member 420) may be disposed. The second antenna 271 for data reception not only increases the efficiency of power transmission through the magnetic shield members 261 and 420 but also prevents leakage of a magnetic field generated between the reception resonators 251 and 252 and the transmission resonator 410 . , 272) and the first antennas 431 and 432 for data transmission, it is possible to prevent a decrease in data transmission/reception efficiency.

Power transmission using the reception resonators 251 and 252 and the transmission resonator 410 is performed simultaneously with or different from data transmission using the second antennas 271 and 272 for data reception and the first antennas 431 and 432 for data transmission. It may be performed in time, independently or dependently.

According to various embodiments of the present disclosure, the display panel module set 200 includes receiving modules 281 and 282 including a drive IC for data transmission/reception, and various electronic components 291 and 292 (eg, rectification). circuits, DC/DC converters, power management ICs (PMICs), etc.). The power/data transmission circuit board 400 may include transmission modules 441 and 442 including a drive IC for data transmission/reception and various electronic components 520 (eg, a power amplifier, a PMIC, etc.).

According to various embodiments of the present disclosure, in addition to the electronic components described above, the electronic device 10 includes a power circuit board 510 provided on one side (eg, the second support member 320 ) of the electronic device 10 . and various electronic components 520 (eg, BOM, GaN, inductor, etc.) mounted on the power circuit board 510 .

4 is a cross-sectional view of an electronic device, according to various embodiments of the present disclosure; Referring to FIG. 4 , as described above in FIG. 3 , the transmission resonator 410 and the reception resonator 251 are spaced apart by a predetermined distance by the first support member 310 (eg, 4.0 mm). spaced apart from each other) can be arranged. The transmit resonator 410 may wirelessly supply power to the receive resonator 251 . A magnetic shielding member (eg, the second shielding member 261 and the first shielding member 420) may be disposed on a rear surface or an adjacent side surface of the transmitting resonator 410 and/or the receiving resonator 251, respectively. The second antenna 271 for data reception not only increases the efficiency of power transmission through the magnetic shield members 261 and 420 but also prevents leakage of a magnetic field generated between the reception resonators 251 and 252 and the transmission resonator 410 . ) and the first antenna 431 for data transmission, it is possible to prevent a decrease in data transmission/reception efficiency.

The first antenna 431 for data transmission and the second antenna 271 for data reception may be disposed to be spaced apart by a predetermined distance (eg, spaced apart by a distance within 1.0 mm) by the first support member 310 . . The first antenna 431 for transmission may transmit data (eg, image data and/or control data) to the second antenna 271 for reception.

According to various embodiments, the electronic device 10 (eg, the display device) may reduce the thickness of the display device by wirelessly transmitting power and data without a cable connection. For example, when a cable is used to transmit/receive data or power between the power/data transmission circuit board 400 and the display panel module set 200 in the display device 10, a separate bridge for connecting the cable and the connector A bridge board is required, and it may be necessary to secure a separate space for this. According to various embodiments, when power and/or data are wirelessly transmitted without a cable, the thickness of the display device may be minimized as shown in FIG. 4 .

5 is a cross-sectional view of an electronic device, according to various embodiments of the present disclosure; Referring to FIG. 5 , a plurality of transmission first antennas 431a and 431b may be disposed on the transmission circuit board 400 , and a transmission signal to be transmitted through the first antennas 431a and 431b is processed. A transmission module 441 for A plurality of receiving second antennas 271a and 271b may be disposed on the receiving circuit board 241 , and a receiving module 281 for processing a received signal received through the second antennas 271a and 271b. ) can be placed.

When using the short-distance ultra-high-speed data transmission method of the ultra-high frequency band (eg, 60 GHz) in the transmitting module 441 and the receiving module 281, the first antenna 431a, 431b and the second antenna 271a, 271b The distance can be maintained at a super close range of 20mm or less. As shown in FIG. 5, image data can be transmitted/received at a high speed (eg, 2 Gbps or higher) by using the short-distance communication method of the ultra-high frequency band, and at the same time, the thickness of the display device can be minimized.

6 is a block diagram of an electronic device according to various embodiments of the present disclosure; Referring to FIG. 6 , the transmission circuit unit 600 (eg, the power/data transmission circuit board 400 ) includes an AC/DC converter 601 , a first DC/DC converter 602 , and a second DC/DC converter ( 606 , a power amplifier 603 , a transmit coil 604 (eg, a transmit resonator 410 ), and a transmit antenna 605 (eg, a first antenna 430 ). The display panel module 610 (eg, the display panel module 201 ) includes a receiving coil 611 (eg, a receiving resonator 251 ), a receiving antenna 612 (eg, a second antenna 271 , and a rectifier 613 ). ), a PMIC 614 , and a display module 617 (eg, a display module 211 ).

The transmission circuit unit 600 may convert the received AC power into a DC signal through the AC/DC converter 601 . For example, the first AC/DC converter 601 may convert the received 220V AC signal into a 100V DC signal. The first DC/DC converter 602 may convert the signal converted from the AC/DC converter 601 into a signal having a required power level. The power amplifier 603 may receive the DC power output from the first DC/DC converter 602 and convert it into AC power amplified to a desired size (eg, 100W). According to various embodiments, the AC power converted through the power amplifier 601 may be wirelessly transmitted through the transmission coil 604 . According to various embodiments, the second DC/DC converter 606 may convert the signal converted from the AC/DC converter 601 into a signal (eg, 1.8V or 3.3V) of a required power level and output the converted signal. . According to various embodiments, the DC power output from the second DC/DC converter 606 may be supplied to the transmit antenna 605 .

The reception coil 611 of the display panel module 610 receives the AC signal transmitted from the transmission coil 604 of the transmission circuit unit 600 and converts the received AC signal to a DC signal (eg, through a rectifier 613 ). , a DC signal of 5V to 24V) can be rectified. The signal rectified into a DC signal through the rectifier 613 is DC/DC converted to a desired voltage level (eg, 17V, 14.6V, 2V, 1.8V) in the PMIC 614 to each component of the display module 617 . can be transmitted. Although not shown in FIG. 6, a DC/DC converter is added in addition to the PMIC 614 to convert DC/DC to a desired voltage level (eg, 5V, 12V), or a low drop-out (LDO) regulator is added to the desired voltage level. DC/DC conversion to voltage magnitudes (eg, 12V, 6V) is possible.

According to various embodiments, as shown in FIG. 6 , the power transmitted through one transmitting coil 604 of one transmitting circuit unit 600 is power of a size required by each of the plurality of display panel modules 610 . as much can be supplied.

7 is a circuit diagram of an electronic device according to various embodiments of the present disclosure; Referring to FIG. 7 , the transmission board 710 (eg, the transmission circuit unit 600 of FIG. 6 ) includes a pulse generator 713 , a power amplifier 714 , a matching circuit 715 , and a resonance coil for transmission. A transmit circuit including 716 (e.g., transmit resonator 410), AC/DC converter 711, DC/DC converter 712, and transmit antenna 717 (e.g., first antenna 431) (e.g., first antenna 431) 718) may be included.

The pulse generator 713 may generate a signal of a frequency (eg, 6.78 MHz) (eg, a carrier frequency) set to transmit power through the resonance coil 716 for transmission. The signal generated through the pulse generator 713 may be amplified into a signal of a desired size through the power amplifier 714 . The power amplifier 714 may amplify a signal generated through the pulse generator 713 input by the voltage generated through the AC/DC converter 711 and the DC/DC converter 712 by a set amount. . The signal amplified by the power amplifier 714 may be transmitted through a resonant coil 716 for transmission through a matching circuit 715 . Power generated through the AC/DC converter 711 and the DC/DC converter 712 may be supplied as driving power of the transmission circuit 718 . According to various embodiments, the image transmission controller 730 temporarily stores data (eg, image data) to be transmitted to the reception board 241 (eg, the display panel module 610 of FIG. 6 ) in the buffer 731 . After that, it can be transmitted to the transmitting circuit 718 . The transmission circuit 718 may be driven by power supplied from the DC/DC converter 712 (eg, 1.8V power) to transmit data provided from the image transmission controller 730 through the transmission antenna 717 . have. The image transmission controller 730 may transmit a control signal output from the transmission control circuit 732 to the transmission board 710 to control a power transmission/reception operation and/or a data transmission/reception operation of the transmission board 710 . The image transmission controller 730 may be implemented as a field programmable gate array (FPGA), and the transmission control circuit 732 may be implemented as programmable logic.

Each of the receiving boards 241 , 242 , 243 , 244 (eg, the display panel modules 201 , 202 , 203 , 204 of FIG. 6 ) includes a receiving resonant coil 721 (eg, receiving resonator 251 ). , a receiving circuit 726 including a matching circuit 722 , a rectifier 723 , a PMIC 724 , and a receive antenna 725 (eg, a second antenna 271 ). Accordingly, the power transmitted through the resonance coil 716 for transmission may be received through the resonance coil 721 for reception. It may be transmitted to the rectifier 723. The rectifier 723 may rectify the received AC signal into a DC signal. The PMIC 724 receives the rectified DC signal through the rectifier 723 and receives a desired size ( For example, it may output a signal of 1.8 V, 2 V, 14.6 V, 17 V. For example, the PMIC 724 may supply a signal of 1.8 V to the receiving circuit 726. The receiving circuit 726 may It is driven by power (eg, a 1.8V signal) transmitted from the PMIC 724 , and after processing a signal received through the reception antenna 725 into image data, it may be transmitted to the image reception controller 740 . The image reception controller 740 may transmit the image data received from the reception circuit 726 to the corresponding display module 211. The image reception controller 740 includes a control signal output from the reception control circuit 742 . to the reception board 241 to control the power transmission/reception operation and/or data transmission/reception operation of the reception board 241. The image reception controller 740 may be implemented as a field programmable gate array (FPGA). In addition, the reception control circuit 742 may be implemented with programmable logic.

8 is a diagram illustrating a power/data reception circuit board according to various embodiments of the present disclosure; Referring to FIG. 8 , each display panel module 201 may include a display module 211 , a first heat dissipation plate 221 , a reception resonator 251 , a second antenna 271 , and an electronic component 291 . have. According to various embodiments, it may be configured as one integrated integrated module of the display panel module 201 .

9 is a diagram illustrating a power/data transmission circuit board according to various embodiments of the present disclosure; Referring to FIG. 9 , the transmission circuit board 400 may include a transmission resonator 410 and a first antenna 430 , and may be disposed adjacent to the first support member 310 .

8 and 9 together, the transmit resonator 410 may simultaneously supply power to the plurality of receive resonators 251 , 252 , 253 , and 254 . According to various embodiments, the transmit resonator 410 is configured to have the same size and/or shape as the plurality of receive resonators 251 , 252 , 253 , and 254 to reduce electromagnetic interference (EMI) and increase power transmission efficiency. can be Image data transmitted in real time may be different for each display module 211 , 212 , 213 , and 214 . Since the power consumed by each display module 211 , 212 , 213 , and 214 may be different as the image data is different, a plurality of reception resonators 251 , 252 , 253 , 251 , 252 , 253 in one transmission resonator 410 , 254), when wireless power is simultaneously transmitted, power can be effectively distributed for each module in various embodiments. A detailed description thereof will be provided later.

10A and 10B are diagrams illustrating a transmit resonator and a receive resonator according to various embodiments of the present disclosure; 10A is a circuit diagram illustrating the transmit resonator and the receive resonator described with reference to FIGS. 8 and 9 . According to various embodiments, power supplied from the current source 1000 may be transmitted to the transmission resonator 410 . The transmission resonator 410 may include a plurality of series-connected resonance coils 411 , 412 , 413 , and 414 . The first resonant coil 411 of the transmitting resonator 410 may transmit power to the first receiving resonator 1011, and the second resonant coil 412 may transmit power to the second receiving resonator 1012. , the third resonant coil 413 may transmit power to the third receiving resonator 1013 , and the fourth resonant coil 414 may transmit power to the fourth receiving resonator 1014 .

Referring to FIG. 10B , power supplied from the current source 1000 may be transmitted to a plurality of transmission resonators 1021 , 1022 , 1023 , and 1024 through a loop-shaped feeding coil 1020 . Each of the transmission resonators 1021 , 1022 , 1023 , and 1024 may include at least one coil 1031 , 1032 , 1033 , 1034 and at least one capacitor 1041 , 1042 , 1043 , 1044 . For example, the first transmitting resonator 1021 may transmit power to the first receiving resonator 1011 through the first coil 1031 , and the second transmitting resonator 1022 may transmit power to the second through the second coil 1032 . Power may be transmitted to the receiving resonator 1012 , the third transmitting resonator 1023 may transmit power to the third receiving resonator 1013 through the third coil 1033 , and the fourth transmitting resonator 1024 may be Power may be transmitted to the fourth reception resonator 1014 through the fourth coil 1034 . When the feeding coil 1020 is added as shown in FIG. 10B , the coupling coefficient between the transmitting resonator and the receiving resonator may be increased, and the power transmission efficiency may be increased due to low EMI.

According to various embodiments, the display modules 211 , 212 , 213 , and 214 may require a pulse-type current having the same voltage at a repetitive cycle such as 60 fps or 120 fps. Since the load impedance of each display module varies in a wide range with time, the transmit resonator 410 may be designed to cover a wide range of load variations according to various embodiments. As described above in FIGS. 2 and 3 , since the thickness of the display device is reduced, long-distance wireless communication between the transmitting circuit board and the display module is not easy, so it may not be easy to control the load variation through a separate wireless communication module. .

In various embodiments, the transmit resonator 410 transmits power based on a constant current (CC) mode, and each receive resonator among the plurality of receive resonators 251 , 252 , 253 and 254 has a constant voltage (CV) ) can be configured to receive power based on the mode. As the transmission resonator 410 is set to the CC mode, the current is constant and the voltage may vary according to the load impedance. On the other hand, as each of the reception resonators 251 , 252 , 253 , and 254 operates in the CV mode, the voltage may be constant and the current may be automatically changed. According to the circuit characteristics as described above, a constant current can be supplied to the transmission resonator 410 regardless of the load impedance, and when a constant current is supplied to the transmission resonator 410, each reception resonator 1021, 1022, 1023, 1024 ) can appear constant regardless of the load impedance. For example, when the current supplied to the transmit resonator 410 is constant at 1A, the mutual inductance is 955n, and the resonant frequency fs is 6.78MHz, each of the receive resonators 1021, 1022, 1023, 1024 The voltage of can be calculated as in Equation 1 below.

Referring to <Equation 1>, when the current supplied to the transmission resonator 410 is constant at 1A by operating in the CC mode, the voltage of each reception resonator 1021, 1022, 1023, 1024 is constant at 40V and CV It can be seen that the mode works. According to various embodiments, the average power consumed by the display module corresponding to each reception resonator may be about 30 W, but since the waveform of the required load current appears in the form of a non-constant pulse, the impedance in the display panel is the It can have a wide variable impedance range of 0.6[=12V/20A] ~ ∞) ohm depending on the operating time. When power is supplied in the form shown in FIGS. 8 and 9, power corresponding to an impedance rapidly changing with time for each display module should be supplied. For example, when the loss of the resonator and the power converter is excluded, the current source 1000 for supplying power to the transmission resonator 410 must be able to supply power in the range of 12V * 20A = 240W to 0W without a separate control signal. According to various embodiments, when the current supplied to the transmission resonator 410 is constant by operating in the CC mode, power corresponding to the rapidly changing impedance in each display module may be supplied without a separate control signal.

11 and 12 are diagrams illustrating a method of transmitting data from a transmitting circuit board to a receiving circuit board according to various embodiments of the present disclosure; Referring to FIG. 11 , as described above, required power may be supplied from the transmission resonator 410 to the reception circuit board 240 of each display panel module 200 . According to various embodiments, image data may be transmitted from the first antenna 431 to the second antenna 271 , and the control data for controlling the image data may be transmitted using a separate short-range communication method (eg, NFC, Bluetooth, BLE). ) can be transmitted via For example, as shown in FIG. 11 , the control data may be simultaneously transmitted in parallel with the image data by a separate short-distance communication method.

According to various embodiments, referring to FIG. 12 , when the image data and the control data are transmitted, the image data and the control data may be sequentially transmitted through a serializer 1210 . Upon reception, image data and control data may be separated and processed in parallel through a deserializer 1220 .

13 is a diagram illustrating a method of manufacturing a display panel module according to various embodiments of the present disclosure; Referring to FIG. 13 , the display panel module 201 may be manufactured in the form of glass. According to various embodiments, the display panel module 201 includes glass 1310 , a heat dissipation plate 1320 , a printed circuit board (PCB) 1330 , and flexible printed circuit boards (FPCBs) 1341 , 1342 , and 1343 . It can be made by gluing. For example, the glass 1310 and the PCB 1330 may be coupled through the FPCBs 1341 , 1342 , and 1343 , and an anisotropic conductive film (ACF) ultrasonic bonding method or a solder ball bonding method may be used. can

14 , 15 , 16 , and 17 are diagrams illustrating configuration examples of image data according to various embodiments of the present disclosure. Referring to FIG. 14 , image data supplied to each display module 210 may be 60 fps (frame per second) or 120 fps video. The image data transmission processing operation may be performed by repeatedly constructing image data for every image frame, transmitting the image data to the display module, and displaying the image data. According to various embodiments, image data constituting each image frame may have a matrix structure of a two-dimensional array. For example, in the case of a full HD screen, image data may include RGB information for pixels in a 1920×1080 array. The control data may include information for adjusting the image data in addition to the image data. For example, the control data may include flag, gamma, and contrast information for discriminating data formats.

According to various embodiments, with reference to FIG. 15 , synchronization data may be transmitted between every frame of image data. Referring to FIG. 16 , one image frame may be transmitted separately for each of a plurality of display modules. Referring to FIG. 17 , image data received from each display module may be sequentially transmitted according to time. As described above, since the image data received from each display module is different according to time, the amount of power consumed by each display module may also vary according to each time.

According to various embodiments, as described above in FIGS. 8 and 9 , power variably consumed in each of the reception resonators 251 , 252 , 253 , and 254 as one transmission resonator 410 operates in the CC mode is separately separated. It can distribute effectively without the control signal of

An electronic device according to any one of various embodiments may include a housing; cover glass; a plurality of display panels disposed on a rear surface of the cover glass in the housing; a plurality of first heat dissipation plates disposed on rear surfaces of the plurality of display panels in the housing; a plurality of power/data receiving circuit boards disposed on rear surfaces of the plurality of first heat dissipation plates in the housing; a support member for supporting at least a portion of the plurality of power/data receiving circuit boards; and a power/data transmission circuit board, at least a portion of which is in contact with and supported by the support member, and disposed to be spaced apart from the plurality of power/data reception circuit boards by a predetermined distance in a space provided by the support member, wherein The power/data transmission circuit board includes a plurality of first antennas corresponding to a plurality of second antennas included in each of the plurality of power/data reception circuit boards, and each of the plurality of power/data reception circuit boards It may include a transmission resonator corresponding to the plurality of reception resonators included in the .

According to various embodiments, the plurality of display panels, the plurality of first heat dissipation plates, and the plurality of power/data receiving circuit boards may constitute a display panel module set.

According to various embodiments, at least one display panel, at least one first heat dissipation plate, and at least one power/data receiving circuit board may constitute one display panel module.

According to various embodiments, the transmit resonator may be coupled to the plurality of receive resonators to wirelessly transmit power to the plurality of receive resonators.

According to various embodiments, the transmit resonator may transmit power based on a constant current (CC) mode, and each receive resonator among the plurality of receive resonators may receive power based on a constant voltage (CV) mode. .

According to various embodiments, the shape of the transmission resonator may be configured to correspond to the shape of the plurality of reception resonators.

According to various embodiments, each first antenna among the plurality of first antennas may transmit image data to each second antenna among the plurality of second antennas.

According to various embodiments, each first antenna among the plurality of first antennas may transmit control data for controlling the output of the image data to each second antenna among the plurality of second antennas.

According to various embodiments, the power/data transmission circuit board includes a first short-range communication module, each of the plurality of power/data reception circuit boards includes a plurality of second short-range communication modules, and the first short-range communication module Control data for controlling the output of the image data may be transmitted from the communication module to the plurality of second short-range communication modules.

According to various embodiments, the display device may further include a plurality of second heat dissipation plates disposed between the plurality of display panels and the plurality of first heat dissipation plates.

According to various embodiments, a first shielding member disposed adjacent to the transmission resonator may be further included.

According to various embodiments, a plurality of second shielding members disposed adjacent to each reception resonator among the plurality of reception resonators may be further included.

According to various embodiments, each display panel of the plurality of display panels may include a micro light emitting diode (LED) panel.

A display panel module according to any one of various embodiments may include a display panel; a first heat dissipation plate disposed on a rear surface of the display panel; and a power/data reception circuit board disposed on a rear surface of the first heat dissipation plates, wherein the power/data reception circuit board may include an antenna and a reception resonator.

According to various embodiments, the reception resonator may be coupled to the transmission resonator to wirelessly receive power.

According to various embodiments, the reception resonator may receive power based on a constant voltage (CV) mode.

According to various embodiments, the antenna may receive image data.

According to various embodiments, the antenna may receive control data for controlling the output of the image data.

According to various embodiments, the power/data receiving circuit board may include short-range communication modules, and the short-range communication module may receive control data for controlling the output of the image data.

According to various embodiments, a second heat dissipation plate disposed between the display panel and the first heat dissipation plate may be further included.

It should be understood that the various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 1436 or external memory 1438) readable by a machine (eg, electronic device 1401). may be implemented as software (eg, a program 1440) including For example, a processor (eg, processor 1420 ) of a device (eg, electronic device 1401 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

20: housing 30: cover glass
100: display module 200: display panel module set
201, 202, 203, 204: display panel module
210: display module 20: housing 30: cover glass
100: display module 200: display panel module set
201, 202, 203, 204: display panel module
210: display module set 211, 212, 213, 214: display module
220: first heat dissipation plate 230: second heat dissipation plate
240: receiving circuit board 251, 252: receiving resonator
261, 262: second shielding member 271, 272: second antenna
281, 282: receiving module 291, 292: electronic component
300: support member 301: first space
302: second space 310: first support member
320: second support member 400: transmission circuit board
410: transmit resonator 420: first shielding member
431, 432: first antenna 441, 442: transmission module
510: power circuit board 520: electronic components

Claims (20)

housing;
cover glass;
a plurality of display panels disposed on a rear surface of the cover glass in the housing;
a plurality of first heat dissipation plates disposed on rear surfaces of the plurality of display panels in the housing;
a plurality of power/data receiving circuit boards disposed on rear surfaces of the plurality of first heat dissipation plates in the housing;
a support member for supporting at least a portion of the plurality of power/data receiving circuit boards; and
a power/data transmission circuit board, at least a portion of which is in contact with and supported by the support member, and disposed to be spaced apart from the plurality of power/data reception circuit boards by a predetermined distance in a space provided by the support member;
The power/data transmission circuit board includes a plurality of first antennas corresponding to a plurality of second antennas included in each of the plurality of power/data reception circuit boards, and An electronic device including a transmission resonator corresponding to a plurality of reception resonators included in each.
According to claim 1,
The plurality of display panels, the plurality of first heat dissipation plates, and the plurality of power/data receiving circuit boards constitute a display panel module set.
According to claim 1,
At least one display panel, at least one first heat dissipation plate, and at least one power/data receiving circuit board constitute one display panel module.
According to claim 1,
and the transmit resonator is coupled to the plurality of receive resonators to wirelessly transmit power to the plurality of receive resonators.
5. The method of claim 4,
The transmit resonator transmits power based on a constant current (CC) mode, and each receive resonator among the plurality of receive resonators receives power based on a constant voltage (CV) mode.
5. The method of claim 4,
and a shape of the transmit resonator is configured to correspond to a shape of the plurality of receive resonators.
According to claim 1,
Each first antenna of the plurality of first antennas transmits image data to each second antenna of the plurality of second antennas.
8. The method of claim 7,
Each first antenna of the plurality of first antennas transmits control data for controlling an output of the image data to each second antenna of the plurality of second antennas.
8. The method of claim 7,
The power/data transmission circuit board includes a first short-range communication module,
Each of the plurality of power/data receiving circuit boards includes a plurality of second short-range communication modules,
Control data for controlling the output of the image data is transmitted from the first short-range communication module to the plurality of second short-range communication modules.
According to claim 1,
The electronic device further comprising a plurality of second heat dissipation plates disposed between the plurality of display panels and the plurality of first heat dissipation plates.
According to claim 1,
The electronic device of claim 1, further comprising a first shielding member disposed adjacent to the transmit resonator.
According to claim 1,
The electronic device further comprising a plurality of second shielding members disposed adjacent to each of the plurality of reception resonators.
According to claim 1,
and each display panel of the plurality of display panels includes a micro light emitting diode (LED) panel.
display panel;
a first heat dissipation plate disposed on a rear surface of the display panel; and
and a power/data receiving circuit board disposed on a rear surface of the first heat dissipation plates.
The power/data reception circuit board includes an antenna and a reception resonator.
15. The method of claim 14,
The receive resonator is coupled to the transmit resonator to receive power wirelessly, a display panel module.
16. The method of claim 15,
The receiving resonator receives power based on a constant voltage (CV) mode.
15. The method of claim 14,
The antenna receives image data, a display panel module.
18. The method of claim 17,
The antenna receives control data for controlling the output of the image data, the display panel module.
18. The method of claim 17,
The power/data receiving circuit board includes short-range communication modules,
The short-range communication module receives control data for controlling the output of the image data, the display panel module.
15. The method of claim 14,
The display panel module further comprising a second heat dissipation plate disposed between the display panel and the first heat dissipation plate.

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