KR20210134204A - Capacitor module mounted horizontally and electronic circuit mounting the same - Google Patents

Abstract

A capacitor module according to an embodiment of the present invention includes: an electrolytic capacitor which includes a dielectric extended in a first direction, and first and second electrodes connected to one end of the dielectric; and a case which has first and second sides facing each other and is mounted on the electrolytic capacitor. The case includes: a first electrode pad which is mounted on the first electrode and connected to the first side; a second electrode pad which is mounted on the second electrode, is connected to the first side, and is spaced apart from the first electrode pad in a second direction perpendicular to the first direction; and a third electrode pad which is connected to the second side. The first to third electrode pads respectively include first to third contact surfaces provided on a plane defined by the first and second directions.

Description

Horizontally mounted capacitor module and electronic circuit on which it is mounted

The present invention relates to a capacitor module and an electronic circuit on which the capacitor module is mounted, and more particularly, to a capacitor module having an improved degree of integration of a mounting space by being mounted horizontally, and an electronic circuit on which the capacitor module is mounted.

A semiconductor device may include an electronic circuit on which components having various functions are mounted. For example, in order to implement a semiconductor device such as a solid state drive (SSD), components having various functions such as a controller, a flash memory, a buffer memory, an input/output port, and an electrolytic capacitor are one It can be mounted on a printed circuit board (PCB) of the.

Some components of a semiconductor device may have a certain size to ensure functions and physical properties. For example, an electrolytic capacitor can accumulate charge through a dielectric and can have a size corresponding to the maximum capacitance it can accumulate. Since this size is based on capacitance, it may be difficult to reduce. Accordingly, there is a problem in that miniaturization and high integration of the semiconductor device are limited.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a capacitor module mounted horizontally in order to improve the degree of integration of a mounting space and an electronic circuit in which the same is mounted.

A capacitor module according to an embodiment of the present invention includes an electrolytic capacitor including a dielectric extending in a first direction, and first and second electrodes connected to one end of the dielectric, and first and second sides facing each other. and a case mounted on the electrolytic capacitor, wherein the case is mounted on the first electrode, a first electrode pad connected to the first side surface, and mounted on the second electrode, the first side surface a second electrode pad connected to and spaced apart from the first electrode pad in a second direction perpendicular to the first direction, and a third electrode pad connected to the second side surface, wherein the first to third electrodes The pads each include first to third contact surfaces provided in a plane defined by the first and second directions.

A capacitor module according to an embodiment of the present invention includes: an electrolytic capacitor including a dielectric extending in a first direction, and first and second electrodes connected to one end of the dielectric; and a case having first and second sides connected to each other and mounted on the electrolytic capacitor, wherein the case is mounted on the first electrode and connected to the first electrode pad, the first electrode pad; A second electrode pad mounted on a second electrode, connected to the first side surface, and spaced apart from the first electrode pad in a second direction perpendicular to the first direction, and a third electrode pad connected to the second side surface and the first to third electrode pads include first to third contact surfaces provided on a plane defined by the first and second directions, respectively.

An electronic circuit according to an embodiment of the present invention includes a printed circuit board (PCB) including a mounting area, first to third contact terminals adjacent to the mounting area, and overlapping the mounting area of the PCB on the PCB. A mounted capacitor module, wherein the capacitor module has an electrolytic capacitor including a dielectric extending in a first direction, and first and second electrodes connected to one end of the dielectric, and first and second sides; , a case mounted on the electrolytic capacitor, wherein the case is mounted on the first electrode, a first electrode pad connected to the first side, and mounted on the second electrode, and on the first side a second electrode pad connected to and spaced apart from the first electrode pad in a second direction perpendicular to the first direction, and a third electrode pad connected to the second side surface, wherein the first to third electrode pads each includes first to third contact surfaces provided on a plane defined by the first and second directions, and the first to third contact surfaces are mounted on the first to third contact terminals of the PCB do.

According to an embodiment of the present invention, the capacitor module is mounted horizontally, so that the degree of integration of the mounting space is improved, and an electronic circuit on which the capacitor module is mounted are provided.

In addition, as an automated process such as Surface Mounted Technology (SMT) is applied, productivity is improved, and structural stability is improved by adding electrodes that physically support the capacitor module during mounting, and a capacitor module and its mounting An electronic circuit is provided.

1 is a diagram exemplarily showing a part of an electronic circuit according to an embodiment of the present invention.
FIG. 2 is a left side view of FIG. 1 .
3A to 3C are diagrams exemplarily showing an electronic circuit in which an electrolytic capacitor is mounted.
FIG. 4 is a diagram exemplarily illustrating the electronic circuit of FIG. 3A .
5 is a diagram exemplarily showing an electronic circuit on which a capacitor module is mounted according to an embodiment of the present invention.
FIG. 6A is a diagram exemplarily illustrating the electronic circuit of FIG. 5 .
6B is an exploded perspective view illustrating an electronic circuit according to an embodiment of the present invention.
6C is a diagram exemplarily illustrating contact surfaces of a capacitor module.
7A to 7C are diagrams exemplarily illustrating a capacitor module according to an embodiment of the present invention.
8A to 8C are diagrams exemplarily illustrating a capacitor module according to another embodiment of the present invention.
9A is a diagram exemplarily illustrating an electronic circuit on which a capacitor module is mounted according to an embodiment of the present invention.
Fig. 9B is a view showing the electronic circuit of Fig. 9A from another direction;
10 is a diagram exemplarily showing an electronic device including an electronic circuit according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described clearly and in detail to the extent that those skilled in the art can easily practice the present invention.

Components described with reference to terms such as unit or unit, module, layer, etc. used in the detailed description and functional blocks shown in the drawings are software, hardware, or a combination thereof. It can be implemented in the form Illustratively, the software may be machine code, firmware, embedded code, and application software. For example, hardware may include an electrical circuit, an electronic circuit, a processor, a computer, an integrated circuit, integrated circuit cores, a pressure sensor, an inertial sensor, a microelectromechanical system (MEMS), a passive element, or a combination thereof. .

In addition, unless otherwise defined, all terms including technical or scientific meanings used herein have meanings that can be understood by those of ordinary skill in the art to which the present invention belongs. In general, terms defined in the dictionary are interpreted to have the same meaning as the contextual meaning in the related technical field, and unless clearly defined in the text, they are not interpreted to have an ideal or excessively formal meaning.

Hereinafter, first to third directions D1 to D3 are referred to with reference to the drawings. The first direction D1 may be a direction in which the capacitor module is extended. The second direction D2 may be a direction perpendicular to the first direction D1 . The third direction D3 may be a direction perpendicular to a plane defined by the first direction D1 and the second direction D2 . A plane defined by the first direction D1 and the second direction D2 may be parallel to a circuit board (eg, a printed circuit board (PCB)). That is, the third direction D3 may be a direction connecting the electrode pad of the capacitor module and the contact terminal of the PCB.

1 is a diagram exemplarily showing a part of an electronic circuit according to an embodiment of the present invention. Referring to FIG. 1 , an electronic circuit may include a PCB and a capacitor module 100 . For example, the electronic circuit may be a circuit implemented based on a PCB on which the capacitor module 100 is mounted. In an exemplary embodiment, the electronic circuit may be a circuit including an electronic component such as a solid state drive (SSD), a main board, or the like.

The capacitor module 100 may be electrically connected to other units or modules included in the electronic circuit through the PCB. For example, when the electronic circuit is an SSD, the capacitor module 100 may be electrically connected to a controller, a buffer memory, a flash memory, an input/output port, and the like through a PCB.

The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The electrolytic capacitor 110 may be a device that stores electrical energy. For example, the electrolytic capacitor 110 may be an aluminum (Al) electrolytic capacitor. The electrolytic capacitor 110 may have an anode and a cathode for charging or discharging electrical energy.

The electrolytic capacitor 110 may include a dielectric for storing electrical energy. For example, the dielectric of the electrolytic capacitor 110 may include an aluminum thin film positioned in a cylindrical metal case extending in the first direction D1 . The dielectric of the electrolytic capacitor 110 may store electrical energy through aluminum oxide formed on the surface of the aluminum thin film.

The case 120 may be a component mounted on the electrolytic capacitor 110 . For example, the case 120 may be a component mounted on, attached to, coupled to, or in contact with the electrolytic capacitor 110 . The case 120 may protect the electrolytic capacitor 110 from external physical impact. The case 120 may physically fix the electrolytic capacitor 110 . The case 120 may include electrode pads respectively mounted on the anode and the cathode of the electrolytic capacitor 110 .

The case 120 may include a first electrode pad 121a , a second electrode pad 122b , and a frame 122 . The first electrode pad 121a may be mounted (eg, electrically connected) to one of the anode and the cathode of the electrolytic capacitor 110 . The second electrode pad 122b may be mounted (eg, electrically connected) to the other one of the anode and the cathode of the electrolytic capacitor 110 . The frame 122 may surround at least a portion of the surface of the electrolytic capacitor 110 .

The first electrode pad 121a and the second electrode pad 121b may physically support the capacitor module 100 on the PCB, in addition to transferring electrical energy to the anode and the cathode of the electrolytic capacitor 110, The capacitor module 100 can be stably fixed on the PCB.

In an exemplary embodiment, the capacitor module 100 may be electrically connected to the PCB through the first electrode pad 121a and the second electrode pad 121b. In more detail, the capacitor module 100 receives electrical energy from a device connected through the PCB or another device mounted on the PCB, or provides electrical energy to a device connected through the PCB or other device mounted on the PCB. can do. That is, the electrolytic capacitor 110 may be charged or discharged with electrical energy through the first electrode pad 121a and the second electrode pad 121b.

In an exemplary embodiment, the case 120 may further include at least one electrode pad for fixing the capacitor module 100 on the PCB. For example, the case 120 includes at least one physically supporting the capacitor module 100 on the PCB, in addition to the first and second electrode pads 121a and 121b connected to the anode and the cathode of the electrolytic capacitor 110 . It may further include a dummy electrode pad (not shown). The capacitor module 100 to which at least one dummy electrode pad is added will be described later with reference to FIG. 5 .

In an exemplary embodiment, the capacitor module 100 may be mounted on a PCB in an automated process using a surface mount technology (SMT). For example, the capacitor module 100 may be one in which the case 120 is mounted on the electrolytic capacitor 110 in an automated process. The electrode pads 121a and 121b of the case 120 of the capacitor module 100 may be mounted on a PCB in an automated process. As the electronic circuit on which the capacitor module 100 is mounted is manufactured by an automated process, the defect rate of the electronic circuit may be reduced, and the productivity of the electronic circuit may be improved.

In an exemplary embodiment, the electronic circuit may be an SSD conforming to a low-profile PCIe (PCI express) standard. For example, the electrolytic capacitor 110 may be a power supply configured to provide capacitance conforming to the low-profile PCIe specification. Other electronic components used in low-profile PCIe can be further mounted on the PCB.

The electrolytic capacitor 110 may have a constant volume. For example, the electrolytic capacitor 110 may be an aluminum charge capacitor. The electrolytic capacitor 110 may be manufactured at a low cost instead of having a larger size compared to capacitance compared to other types of capacitors such as multilayer ceramic capacitors and tantalum capacitors. That is, the electrolytic capacitor 110 may have a constant volume to accumulate charges corresponding to the capacitance. A technique for reducing the waste of mounting space by the electrolytic capacitor 110 having a constant volume may be required.

The electrolytic capacitor 110 according to an embodiment of the present invention may be mounted horizontally on the PCB in order to minimize waste of mounting space. For example, unlike that shown in FIG. 1 , a typical electrolytic capacitor may be mounted vertically on a PCB. In other words, the general electrolytic capacitor may be mounted on the PCB in the third direction D3. As the electrolytic capacitor is mounted on the PCB in a protruding shape, the physical volume of the electronic device (the device including the PCB on which the electrolytic capacitor is mounted) may increase as much as the volume of the electrolytic capacitor. In general, the volume of other components mounted on the PCB may be smaller than the volume of the electrolytic capacitor, and the mounting space may be wasted unnecessarily by the electrolytic capacitor having a relatively large volume. The structure of such a general electrolytic capacitor will be described later in conjunction with FIGS. 3A and 4 .

On the other hand, as shown in FIG. 1 , according to an embodiment of the present invention, as the capacitor module 100 including the electrolytic capacitor 110 is mounted horizontally on the PCB, the upper space of the PCB (eg, the third Since waste of the space in the direction D3) or the lower space (for example, the space in the direction opposite to the third direction D3) is reduced, the electronic circuit (ie, the capacitor module 100 including the PCB mounted thereon) is reduced. circuit) can be reduced in physical volume. In other words, as the capacitor module 100 mounted horizontally on the PCB is provided, the degree of integration of the electronic circuit including the capacitor module 100 may be improved.

FIG. 2 is a left side view of FIG. 1 . Referring to FIG. 2 , a view of the electronic circuit of FIG. 1 as viewed from a direction opposite to the first direction D1 is exemplarily shown. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The case 120 may include a first electrode pad 121a , a second electrode pad 121b , and a frame 122 .

According to an embodiment of the present invention, the capacitor module 100 may be mounted on the PCB to be positioned on the same plane as the PCB. For example, the capacitor module 100 may be mounted to overlap a portion of the PCB so as to occupy both the space in the third direction D3 of the PCB and the space in the opposite direction to the third direction D3 of the PCB.

Unlike the case where the capacitor module 100 is vertically mounted on the PCB, since the capacitor module 100 shares a space corresponding to the first length L1, which is the thickness of the PCB, with the PCB, the capacitor module 100 is mounted The physical size of the electronic circuit including the printed circuit board (PCB) is reduced, the degree of integration of the electronic circuit is improved, and unnecessary waste of mounting space can be suppressed.

The thickness of the PCB may be the first length L1. The frame 122 of the case 120 of the capacitor module 100 mounted on the PCB may protrude from the PCB by a second length L2 in the third direction D3. The electrolytic capacitor 110 of the capacitor module 100 mounted on the PCB may protrude from the PCB by a third length L3 in a direction opposite to the third direction D3. For example, the electrolytic capacitor 110 may include a cylindrical dielectric having a radius of a third length L3.

In an exemplary embodiment, the first length L1 may be about 1.0 mm. The second length L2 may be about 1.7 mm. And, the third length L3 may be about 2.6 mm. However, the scope of the present invention is not limited thereto, and the first to third lengths L1, L2, and L3 may increase or decrease according to the use, specification, and quantity of other electronic components mounted on the PCB. have.

3A to 3C are diagrams exemplarily showing an electronic circuit in which an electrolytic capacitor is mounted.

Referring to FIG. 3A , an electronic circuit in which electrolytic capacitors 10 are mounted on a PCB is illustrated by way of example. In an exemplary embodiment, the electrolytic capacitor 10 may be mounted vertically on a PCB. A space in a direction perpendicular to the PCB may be wasted as much as the height of the cylindrical shape corresponding to the electrolytic capacitor 10 . Accordingly, there are problems in that the physical size of the electronic circuit increases, the degree of integration of the electronic circuit decreases, and the mounting space is wasted unnecessarily.

Referring to FIG. 3B , an electronic circuit in which an electrolytic capacitor 20 is mounted on a PCB is illustrated by way of example. The electrolytic capacitor 20 may include a first electrode 21a , a second electrode 21b , and a dielectric 22 . One of the first electrode 21a and the second electrode 21b may be an anode, and the other of the first electrode 21a and the second electrode 21b may be a cathode. The dielectric 22 may be a medium for storing electrical energy.

In an exemplary embodiment, the first electrode 21a and the second electrode 21b of the electrolytic capacitor 20 may be connected to the PCB through soldering. For example, unlike the capacitor module 100 of FIG. 1 that is mounted on a PCB by an automated process such as a surface mounting technique, the electrolytic capacitor 20 of FIG. 3B is connected to the PCB by soldering, so it is manufactured by an automated process Compared to the case where the electrolytic capacitor 20 is mounted, the PCB on which the electrolytic capacitor 20 is mounted may have a high defect rate and low productivity. Accordingly, an electrolytic capacitor having a structure that can be designed by an automated process may be required.

Referring to FIG. 3C , an electronic circuit in which tantalum capacitors 30 are mounted on a PCB is illustrated by way of example. The tantalum capacitor 30 may be a device that stores electrical energy like other capacitors (eg, the electrolytic capacitor 10 ). The tantalum capacitor 30 may be mounted on a PCB. Unlike the capacitor module 100 of FIG. 1 in which mounting space is saved as much as the thickness of the PCB by being mounted in the concave region of the PCB (eg, the concave region in the second direction D2), the tantalum capacitor 30 is mounted on the PCB. Since it is mounted perpendicular to the tantalum capacitor 30 , a space in a direction perpendicular to the PCB may be wasted as much as the thickness of the tantalum capacitor 30 . Accordingly, the degree of integration of the electronic circuit may be reduced. In addition, the tantalum capacitor has a problem with a higher initial defect rate and a smaller capacity than other types of capacitors.

FIG. 4 is a diagram exemplarily illustrating the electronic circuit of FIG. 3A . Referring to FIG. 4 , a PCB, an electrolytic capacitor 10 , and an electronic circuit in which the electrolytic capacitor 10 is mounted on the PCB according to the embodiment shown in FIG. 3A are exemplarily shown.

The electrolytic capacitor 10 may include a first electrode 11a and a second electrode 11b. For example, the first electrode 11a may be an anode. The second electrode 11b may be a cathode. The electrolytic capacitor 10 may be mounted on a PCB using a surface mount technique. As the electrolytic capacitor 10 is mounted on the surface of the PCB, the space in the direction perpendicular to the PCB may be wasted by the height of the cylindrical shape corresponding to the electrolytic capacitor 10 .

5 is a view exemplarily showing an electronic circuit on which an electrolytic capacitor is mounted according to an embodiment of the present invention. Referring to FIG. 5 , an electronic circuit including a PCB on which the capacitor module 100 is mounted according to an embodiment of the present invention is illustrated by way of example. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The case 120 may include a first electrode pad 121a , a second electrode pad 121b , a third electrode pad 121c , and a frame 122 . Since the first electrode pad 121a, the second electrode pad 121b, and the frame 122 are similar to the first electrode pad 121a, the second electrode pad 121b, and the frame 122 of FIG. 1 , A detailed description thereof will be omitted.

The electrolytic capacitor 110 may be an aluminum electrolytic capacitor. The electrolytic capacitor 110 may be mounted on the PCB horizontally through the case 120 . Unlike the capacitors shown in FIGS. 3A and 3C , the electrolytic capacitor 110 is mounted in a concave area of the PCB (for example, a concave area in the direction in which the PCB is mounted), thereby saving mounting space as much as the thickness of the PCB, The degree of integration of the electronic circuit including the PCB on which the electrolytic capacitor 110 is mounted may be improved.

In an exemplary embodiment, the case 120 may include a dummy electrode pad. The dummy electrode pad has nothing to do with charging or discharging electrical energy to the electrolytic capacitor 110 , and may mean a structure that physically supports the electrolytic capacitor 110 mounted on the PCB. For example, the case 120 further includes a third electrode pad 121c that is a dummy electrode pad in addition to the first and second electrode pads 121a and 121b connected to the anode and the cathode of the electrolytic capacitor 110 . can do. However, the scope of the present invention is not limited thereto, and the case 120 may further include another dummy electrode pad, and the position of the dummy electrode pad may be changed.

In an exemplary embodiment, the dummy electrode pad of the case 120 may float. The floating dummy electrode pad may not be electrically connected to the anode and the cathode of the electrolytic capacitor 110 . For example, the third electrode pad 121c of the case 120 may float. The third electrode pad 121c may not be electrically connected to the first electrode pad 121a and the second electrode pad 121b.

In an exemplary embodiment, the dummy electrode pad of the case 120 may be connected to the ground. For example, the third electrode pad 121c of the case 120 may be connected to the ground. In an exemplary embodiment, the potential of the ground may be the same as the potential of the cathode of the electrolytic capacitor 110 . For example, one of the first electrode pad 121a and the second electrode pad 121b may be a negative electrode, and the third electrode pad 121c may be electrically connected to the negative electrode of the electrolytic capacitor 110 (eg, , through a separate electrical conductor included in the case 120 or the PCB).

FIG. 6A is a diagram exemplarily illustrating the electronic circuit of FIG. 5 . 6B is an exploded perspective view illustrating an electronic circuit according to an embodiment of the present invention. The exploded perspective view of FIG. 6B may show the electronic circuit of FIG. 6A . FIG. 6C is a diagram exemplarily illustrating contact surfaces CSa to CSc of the electrode pads 121a , 121b , and 121c of the case 120 . 6C may be a view of the capacitor module 100 of FIG. 6B in the third direction D3.

6A to 6C , an electronic circuit including a PCB and a capacitor module 100 is shown. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The electrolytic capacitor 110 may include a first electrode 111a , a second electrode 111b , and a dielectric 112 . One of the first electrode 111a and the second electrode 111b may be an anode. The other of the first electrode 111a and the second electrode 111b may be a cathode. The dielectric 112 may be a medium for storing electrical energy.

The case 120 may include a first electrode pad 121a , a second electrode pad 121b , a third electrode pad 121c , and a frame 122 . The case 120 may extend in the first direction D1 . The case 120 may have a first side surface SS1 and a second side surface SS2 facing each other in the first direction D1 . For example, the first side surface SS1 and the second side surface SS2 may correspond to a portion of the surface of the frame 122 .

The first electrode pad 121a may be connected to the first side surface SS1 of the case 120 . The first electrode pad 121a may be mounted on the first electrode 111a of the electrolytic capacitor 110 . The second electrode pad 121b may be connected to the first side surface SS1 of the case 120 and may be spaced apart from the first electrode pad 121a in the second direction D2. The second electrode pad 121b may be mounted on the second electrode 111b of the electrolytic capacitor 110 . The third electrode pad 121c may be connected to the second side surface SS2 of the case 120 . However, the scope of the present invention is not limited thereto, and the case 120 may further include another dummy electrode pad, and the positions of the electrode pads 121a , 121b , and 121c in the case 120 may be changed. have.

In an exemplary embodiment, each of the electrode pads 121a , 121b , and 121c may include a contact surface. For example, as shown in FIG. 6C , the first electrode pad 121a may include a first contact surface CSa. The second electrode pad 121b may include a second contact surface CSb. The third electrode pad 121c may include a third contact surface CSc. The first to third contact surfaces CSa to CSc may be provided on the same plane. The capacitor module 100 may be mounted on the PCB through the first to third contact surfaces CSa to CSc.

The PCB may include a mounting region RG and first to third contact terminals Ta to Tc. The mounting region RG may be a region in which the capacitor module 100 is horizontally mounted on the PCB. The mounting region RG may be wider than a cross-section of the capacitor module 100 . In the PCB, the first to third contact terminals Ta to Tc may be positioned adjacent to the mounting region RG.

In an exemplary embodiment, each of the first to third contact terminals Ta to Tc may have flat contact surfaces. For example, the first contact terminal Ta may have a contact surface protruding from the PCB and parallel to the PCB, a contact surface recessed from the PCB and parallel to the PCB, or a contact surface included in the same plane as the PCB. For example, the contact surface of the first contact terminal Ta may be connected to the first electrode pad 121a of the capacitor module 100 .

According to an embodiment of the present invention, the capacitor module 100 mounted on the PCB may be provided through coupling or connection between the contact terminals Ta to Tc and the contact surfaces CSa to CSc. For example, the first contact surface CSa of the first electrode pad 121a may be connected to face the first contact terminal Ta of the PCB. The second contact surface CSb of the second electrode pad 121b may be connected to face the second contact terminal Tb of the PCB. The third contact surface CSc of the third electrode pad 121c may be connected to face the third contact terminal Tc of the PCB. That is, the first to third contact surfaces CSa to CSc of the first to third electrode pads 121a to 121c may be parallel to the first to third contact terminals Ta to Tc of the PCB.

In this case, the connection between the first to third contact terminals Ta to Tc and the first to third contact surfaces CSa to CSc is not limited to any one of a physical connection and an electrical connection. For example, when the first electrode 111a is an anode, the first contact surface CSa of the first electrode pad 121a mounted on the first electrode 111a is electrically connected to the first contact terminal Ta of the PCB. can be physically connected at the same time. Electrically connected may mean connected to charge or discharge charges in the electrolytic capacitor 110 . Physically connected may mean physically supporting or stably fixing the capacitor module 100 mounted on the PCB.

The first to third contact terminals Ta to Tc of the PCB may be structures supporting the capacitor module 100 to be mounted on the PCB by being positioned on one surface of the PCB. Also, the first to third contact terminals Ta to Tc of the PCB may be terminals for implementing electrical connection with the capacitor module 100 to be mounted on the PCB.

However, the scope of the present invention is not limited thereto, and the PCB includes an additional structure (for example, the fourth contact terminal), and the capacitor module 100 may further include another dummy electrode pad. In addition, without departing from the technical spirit of the present invention, the position of the contact terminals Ta, Tb, Tc of the PCB and the electrode pad in the case 120 by those skilled in the art to which the present invention pertains. The positions of the fields 121a, 121b, and 121c may be changed.

In an exemplary embodiment, the PCB may be manufactured to be as small as the mounting region RG corresponding to the space in which the capacitor module 100 is to be mounted. The dielectric 112 of the electrolytic capacitor 110 may have a cylindrical shape having a specific width in height, and the width of the mounting region RG of the PCB may be wider than a specific width. As the PCB is manufactured to be as small as the mounting region RG, compared to the PCB on which the electrolytic capacitor of FIG. 4 is mounted, the degree of integration of the circuit may be improved.

7A to 7C are diagrams exemplarily illustrating a capacitor module according to an embodiment of the present invention. Hereinafter, first to fourth side surfaces SS1 to SS4 of the case 120 are referred to. The first to fourth side surfaces SS1 to SS4 may refer to a portion of the surface of the frame 122 of the case 120 . The first side surface SS1 may be positioned at one end in a direction in which the frame 122 extends (eg, the first direction D1 ). The second side surface SS2 may face the first side surface SS1 . The third side surface SS3 may connect the first side surface SS1 and the second side surface SS2. The fourth side surface SS4 connects the first side surface SS1 and the second side surface SS2 and may face the third side surface SS3.

Referring to FIG. 7A , a capacitor module 100 and a PCB on which the capacitor module 100 is mounted according to an embodiment are illustrated by way of example. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The case 120 may include a first electrode pad 121a , a second electrode pad 121b , a third electrode pad 121c , and a frame 122 . The first electrode pad 121a and the second electrode pad 121b may be connected to the first side surface SS1 of the case 120 . The third electrode pad 121c may be connected to the second side surface SS2 of the case 120 .

The PCB may include a mounting region RG, a first contact terminal Ta, a second contact terminal Tb, and a third contact terminal Tc. The first, second, and third contact terminals Ta, Tb, and Tc may be positioned adjacent to the mounting region RG. For example, the first contact terminal Ta and the second contact terminal Tb may be adjacent to the mounting region RG in a direction opposite to the first direction D1 . The third contact terminal Tc may be adjacent to the mounting region RG in the first direction D1 .

The capacitor module 100 may be horizontally mounted on the PCB to overlap the mounting region RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a may be connected to face the first contact terminal Ta of the PCB. The second contact surface CSb of the second electrode pad 121b may be connected to face the second contact terminal Tb of the PCB. The third contact surface CSc of the third electrode pad 121c may be connected to face the third contact terminal Tc of the PCB.

The first, second, and third contact surfaces CSa, CSb, and CSc of the first, second, and third electrode pads 121a, 121b, and 121c are disposed in a direction opposite to the third direction D3. can be identified. The positions of the first, second, and third contact surfaces CSa, CSb, and CSc will be clearly understood by those skilled in the art with reference to FIG. 5C described above.

In an exemplary embodiment, one of the first electrode pad 121a and the second electrode pad 121b may be connected to the anode of the electrolytic capacitor 110 , and the first electrode pad 121a and the second electrode pad 121b ), the other one may be connected to the cathode of the electrolytic capacitor 110 . The third electrode pad 121c may be a dummy electrode pad independent of the electrical connection of the electrolytic capacitor 110 .

Referring to FIG. 7B , a capacitor module 100 and a PCB on which the capacitor module 100 is mounted according to an embodiment are illustrated by way of example. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The case 120 may include a first electrode pad 121a , a second electrode pad 121b , a fourth electrode pad 121d , and a frame 122 . The first electrode pad 121a and the second electrode pad 121b may be connected to the first side surface SS1 of the case 120 . The fourth electrode pad 121d may be connected to the third side surface SS3 of the case 120 .

The PCB may include a mounting region RG, a first contact terminal Ta, a second contact terminal Tb, and a fourth contact terminal Td. The first, second, and fourth contact terminals Ta, Tb, and Td may be positioned adjacent to the mounting region RG. For example, the first contact terminal Ta and the second contact terminal Tb may be adjacent to the mounting region RG in a direction opposite to the first direction D1 . The fourth contact terminal Td may be adjacent to the mounting region RG in the second direction D2 .

The capacitor module 100 may be horizontally mounted on the PCB to overlap the mounting region RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a may be connected to face the first contact terminal Ta of the PCB. The second contact surface CSb of the second electrode pad 121b may be connected to face the second contact terminal Tb of the PCB. The fourth contact surface CSd of the fourth electrode pad 121d may be connected to face the fourth contact terminal Td of the PCB. The first, second, and fourth contact surfaces CSa, CSb, and CSd of the first, second, and fourth electrode pads 121a, 121b, and 121d are formed in a direction opposite to the third direction D3. can be identified.

In an exemplary embodiment, one of the first electrode pad 121a and the second electrode pad 121b may be connected to the anode of the electrolytic capacitor 110 , and the first electrode pad 121a and the second electrode pad 121b ), the other one may be connected to the cathode of the electrolytic capacitor 110 . The fourth electrode pad 121d may be a dummy electrode pad independent of the electrical connection of the electrolytic capacitor 110 .

That is, the capacitor module 100 of FIG. 7B is different from the capacitor module 100 of FIG. 7A in that the position of the dummy electrode pad is changed.

Referring to FIG. 7C , a capacitor module 100 and a PCB on which the capacitor module 100 is mounted according to an embodiment are illustrated by way of example. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The case 120 may include a first electrode pad 121a , a second electrode pad 121b , a third electrode pad 121c , a fourth electrode pad 121d , and a frame 122 . The first electrode pad 121a and the second electrode pad 121b may be connected to the first side surface SS1 of the case 120 . The third electrode pad 121c may be connected to the second side surface SS2 of the case 120 . The fourth electrode pad 121d may be connected to the third side surface SS3 of the case 120 .

The PCB may include a mounting region RG, a first contact terminal Ta, a second contact terminal Tb, a third contact terminal Tc, and a fourth contact terminal Td. The first, second, third, and fourth contact terminals Ta, Tb, Tc, and Td may be positioned adjacent to the mounting region RG. For example, the first contact terminal Ta and the second contact terminal Tb may be adjacent to the mounting region RG in a direction opposite to the first direction D1 . The third contact terminal Tc may be adjacent to the mounting region RG in the first direction D1 . The fourth contact terminal Td may be adjacent to the mounting region RG in the second direction D2 .

The capacitor module 100 may be horizontally mounted on the PCB to overlap the mounting region RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a may be connected to face the first contact terminal Ta of the PCB. The second contact surface CSb of the second electrode pad 121b may be connected to face the second contact terminal Tb of the PCB. The third contact surface CSc of the third electrode pad 121c may be connected to face the third contact terminal Tc of the PCB. The fourth contact surface CSd of the fourth electrode pad 121d may be connected to face the fourth contact terminal Td of the PCB. The first, second, third, and fourth contact surfaces CSa, CSb, CSc, and CSd of the first, second, third and fourth electrode pads 121a, 121b, 121c, and 121d are It can be identified in a direction opposite to the three directions (D3).

In an exemplary embodiment, one of the first electrode pad 121a and the second electrode pad 121b may be connected to the anode of the electrolytic capacitor 110 , and the first electrode pad 121a and the second electrode pad 121b ), the other one may be connected to the cathode of the electrolytic capacitor 110 . The third electrode pad 121c may be a dummy electrode pad independent of the electrical connection of the electrolytic capacitor 110 . The fourth electrode pad 121d may be a dummy electrode pad independent of the electrical connection of the electrolytic capacitor 110 .

That is, in that the capacitor module 100 of FIG. 7C includes all of the third and fourth electrode pads 121c and 121d that are dummy electrode pads, the capacitor module 100 of FIG. 7A and the capacitor module 100 of FIG. 7B ( 100) is different.

8A to 8C are diagrams exemplarily illustrating a capacitor module according to another embodiment of the present invention. Unlike the capacitor module 100 mounted in a direction perpendicular to the anode and the cathode of the electrolytic capacitor 110 in the embodiments of FIGS. 7A to 7C , according to the embodiments of FIGS. 8A to 8C , the capacitor module 100 Silver may be mounted in a direction parallel to the anode and the cathode of the electrolytic capacitor 110 .

Referring to FIG. 8A , a capacitor module 100 and a PCB on which the capacitor module 100 is mounted according to an embodiment are illustrated by way of example. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The case 120 may include a first electrode pad 121a , a second electrode pad 121b , a third electrode pad 121c , and a frame 122 . The first electrode pad 121a and the second electrode pad 121b may be connected to the first side surface SS1 of the case 120 . The third electrode pad 121c may be connected to the third side surface SS3 of the case 120 .

The PCB may include a mounting region RG, a first contact terminal Ta, a second contact terminal Tb, and a third contact terminal Tc. The first, second, and third contact terminals Ta, Tb, and Tc may be positioned adjacent to the mounting region RG. For example, the first contact terminal Ta and the second contact terminal Tb may be adjacent to the mounting region RG in the second direction D2 . The third contact terminal Tc may be adjacent to the mounting region RG in the first direction D1 .

The capacitor module 100 may be horizontally mounted on the PCB to overlap the mounting region RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a may be connected to face the first contact terminal Ta of the PCB. The second contact surface CSb of the second electrode pad 121b may be connected to face the second contact terminal Tb of the PCB. The third contact surface CSc of the third electrode pad 121c may be connected to face the third contact terminal Tc of the PCB. The first, second, and third contact surfaces CSa, CSb, and CSc of the first, second, and third electrode pads 121a, 121b, and 121c are disposed in a direction opposite to the third direction D3. can be identified.

In an exemplary embodiment, one of the first electrode pad 121a and the second electrode pad 121b may be connected to the anode of the electrolytic capacitor 110 , and the first electrode pad 121a and the second electrode pad 121b ), the other one may be connected to the cathode of the electrolytic capacitor 110 . The third electrode pad 121c may be a dummy electrode pad independent of the electrical connection of the electrolytic capacitor 110 .

Referring to FIG. 8B , a capacitor module 100 and a PCB on which the capacitor module 100 is mounted according to an embodiment are illustrated by way of example. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The case 120 may include a first electrode pad 121a , a second electrode pad 121b , a fourth electrode pad 121d , and a frame 122 . The first electrode pad 121a and the second electrode pad 121b may be connected to the first side surface SS1 of the case 120 . The fourth electrode pad 121d may be connected to the fourth side surface SS4 of the case 120 .

The PCB may include a mounting region RG, a first contact terminal Ta, a second contact terminal Tb, and a fourth contact terminal Td. The first, second, and fourth contact terminals Ta, Tb, and Td may be positioned adjacent to the mounting region RG. For example, the first contact terminal Ta and the second contact terminal Tb may be adjacent to the mounting region RG in the second direction D2 . The fourth contact terminal Td may be adjacent to the mounting region RG in a direction opposite to the first direction D1 .

The capacitor module 100 may be horizontally mounted on the PCB to overlap the mounting region RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a may be connected to face the first contact terminal Ta of the PCB. The second contact surface CSb of the second electrode pad 121b may be connected to face the second contact terminal Tb of the PCB. The fourth contact surface CSd of the fourth electrode pad 121d may be connected to face the fourth contact terminal Td of the PCB. The first, second, and fourth contact surfaces CSa, CSb, and CSd of the first, second, and fourth electrode pads 121a, 121b, and 121d are formed in a direction opposite to the third direction D3. can be identified.

In an exemplary embodiment, one of the first electrode pad 121a and the second electrode pad 121b may be connected to the anode of the electrolytic capacitor 110 , and the first electrode pad 121a and the second electrode pad 121b ), the other one may be connected to the cathode of the electrolytic capacitor 110 . The fourth electrode pad 121d may be a dummy electrode pad independent of the electrical connection of the electrolytic capacitor 110 .

That is, the capacitor module 100 of FIG. 8B is different from the capacitor module 100 of FIG. 8A in that the position of the dummy electrode pad is changed.

Referring to FIG. 8C , a capacitor module 100 and a PCB on which the capacitor module 100 is mounted according to an embodiment are illustrated by way of example. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120 . The case 120 may include a first electrode pad 121a , a second electrode pad 121b , a third electrode pad 121c , a fourth electrode pad 121d , and a frame 122 . The first electrode pad 121a and the second electrode pad 121b may be connected to the first side surface SS1 of the case 120 . The third electrode pad 121c may be connected to the third side surface SS3 of the case 120 . The fourth electrode pad 110d may be connected to the fourth side surface SS4 of the case 120 .

The PCB may include a mounting region RG, a first contact terminal Ta, a second contact terminal Tb, a third contact terminal Tc, and a fourth contact terminal Td. The first, second, third, and fourth contact terminals Ta, Tb, Tc, and Td may be positioned adjacent to the mounting region RG. For example, the first contact terminal Ta and the second contact terminal Tb may be adjacent to the mounting region RG in the second direction D2 . The third contact terminal Tc may be adjacent to the mounting region RG in the first direction D1 . The fourth contact terminal Td may be adjacent to the mounting region RG in a direction opposite to the first direction D1 .

The capacitor module 100 may be horizontally mounted on the PCB to overlap the mounting region RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a may be connected to face the first contact terminal Ta of the PCB. The second contact surface CSb of the second electrode pad 121b may be connected to face the second contact terminal Tb of the PCB. The third contact surface CSc of the third electrode pad 121c may be connected to face the third contact terminal Tc of the PCB. The fourth contact surface CSd of the fourth electrode pad 121d may be connected to face the fourth contact terminal Td of the PCB. The first, second, third, and fourth contact surfaces CSa, CSb, CSc, and CSd of the first, second, third and fourth electrode pads 121a, 121b, 121c, and 121d are It can be identified in a direction opposite to the three directions (D3).

In an exemplary embodiment, one of the first electrode pad 121a and the second electrode pad 121b may be connected to the anode of the electrolytic capacitor 110 , and the first electrode pad 121a and the second electrode pad 121b ), the other one may be connected to the cathode of the electrolytic capacitor 110 . The third electrode pad 121c may be a dummy electrode pad independent of the electrical connection of the electrolytic capacitor 110 . The fourth electrode pad 121d may be a dummy electrode pad independent of the electrical connection of the electrolytic capacitor 110 .

At this time, the arrangement of the first to fourth electrode pads 121a to 121d in the capacitor module 100 of FIG. 8C is the first to fourth electrode pads 121a to 121a in the capacitor module 100 of FIG. 7C . 121d) may be different. In addition, since the capacitor module 100 of FIG. 8C includes all of the third and fourth electrode pads 121c and 121d, which are dummy electrode pads, the capacitor module 100 of FIG. 8A and the capacitor module of FIG. 8B ( 100) is different.

9A is a diagram exemplarily showing an electronic circuit EC on which the capacitor module 100 is mounted according to an embodiment of the present invention. Referring to FIG. 9A , the electronic circuit EC as viewed from the third direction D3 is exemplarily illustrated. The electronic circuit EC may include a PCB on which a plurality of capacitor modules 100 are mounted.

In an exemplary embodiment, an electronic circuit EC including a PCB on which a plurality of capacitor modules 100 are mounted may be provided. For example, four capacitor modules 100 may be mounted on one PCB. However, the scope of the present invention is not limited thereto, and the number of capacitor modules 100 mounted on the PCB of the electronic circuit EC may increase or decrease depending on the purpose and use of the electronic circuit EC. .

In an exemplary embodiment, an electronic circuit EC including a PCB on which the capacitor module 100 and other electronic components are mounted according to a surface mounting technique may be provided. For example, in addition to the at least one capacitor module 100 being mounted on the PCB, other electronic components such as a resistor, a controller, a buffer memory, a flash memory, etc. may be further mounted on the PCB. Such another electronic component may be an integrated circuit (IC) in the form of a chip.

As described above, since the capacitor module 100 and other electronic components can be mounted on the PCB according to the surface mounting technique, the productivity of the electronic circuit (EC) compared to the case where an automated process is impossible (eg, soldering) This can be high. Also, the defective rate of the electronic circuit EC may be low.

Fig. 9B is a view showing the electronic circuit of Fig. 9A from another direction; Referring to FIG. 9B , the electronic circuit EC as viewed from a direction opposite to the third direction D3 is exemplarily illustrated. The electronic circuit EC shown in FIG. 9B may correspond to the electronic circuit EC of FIG. 9A . For example, FIG. 9B may show the electronic circuit of FIG. 9A by rotating 180 degrees clockwise about the first direction D1. The electronic circuit EC may include a PCB on which a plurality of capacitor modules 100 are mounted.

9A and 9B , the electronic circuit EC according to an embodiment of the present invention may include the capacitor module 100 . The capacitor module 100 may include an electrolytic capacitor having a volume corresponding to the capacitance. In this case, instead of being mounted in a direction perpendicular to the PCB, the capacitor module 100 is mounted horizontally on the PCB to be included on the same plane as the PCB, so that the electronic circuit EC with improved integration can be provided.

10 is a diagram exemplarily illustrating an electronic device ED including an electronic circuit EC according to an embodiment of the present invention. Referring to FIG. 10 , an electronic device ED according to an embodiment of the present invention is exemplarily shown. The electronic device ED may include an electronic circuit EC and a cover case CC. The electronic circuit EC may correspond to the electronic circuit EC described in FIGS. 9A and 9B . The electronic circuit EC may include a PCB and at least one capacitor module 100 mounted on the PCB.

Although FIG. 10 shows that four capacitor modules 100 are mounted on the PCB, the scope of the present invention is not limited thereto, and the number of capacitor modules 100 mounted on the PCB depends on the standard of the electronic device ED. , may be increased or decreased depending on the use, and purpose. In an exemplary embodiment, the electronic device ED may be an SSD.

In an exemplary embodiment, the cover case CC may protect the electronic circuit EC. For example, the electronic device ED may include the cover case CC in a direction opposite to the third direction D3 of the electronic circuit EC. Also, the electronic device ED may further include another cover case (not shown) in the third direction D3 of the electronic circuit EC. The cover case CC and the other cover case may be coupled to each other so that the electronic circuit EC is positioned therebetween. That is, the cover case CC and other cover cases may protect the electronic circuit EC from external physical impact.

In an exemplary embodiment, the cover case CC may have an externally exposed input/output port terminal to connect the PCB and a separate external device. The PCB and a separate external device can be connected by wire through the input/output port terminal.

The above are specific embodiments for carrying out the present invention. The present invention will include not only the above-described embodiments, but also simple design changes or easily changeable embodiments. In addition, the present invention will include techniques that can be easily modified and implemented using the embodiments. Accordingly, the scope of the present invention should not be limited to the above-described embodiments and should be defined by the claims and equivalents of the claims as well as the claims to be described later.

Claims (20)

an electrolytic capacitor including a dielectric extending in a first direction, and first and second electrodes connected to one end of the dielectric; and
A case having a first side and a second side facing each other and mounted on the electrolytic capacitor,
The case is:
a first electrode pad mounted on the first electrode and connected to the first side surface;
a second electrode pad mounted on the second electrode, connected to the first side surface, and spaced apart from the first electrode pad in a second direction perpendicular to the first direction; and
a third electrode pad connected to the second side;
The first to third electrode pads each include first to third contact surfaces provided on a plane defined by the first and second directions. The method of claim 1,
The first electrode is electrically connected to the first electrode pad,
The second electrode is electrically connected to the second electrode pad,
One of the first and second electrodes is an anode, and the other of the first and second electrodes is a cathode. The method of claim 1,
The first and second electrode pads are configured to physically support the capacitor module when the capacitor module is mounted on a printed circuit board (PCB). The method of claim 1,
wherein the third electrode pad is a dummy electrode pad configured to physically support the capacitor module when the capacitor module is mounted on a PCB. 5. The method of claim 4,
The third electrode pad is a capacitor module floating (floating). 5. The method of claim 4,
and the third electrode pad is connected to a ground. 7. The method of claim 6,
One of the first and second electrodes is a negative electrode, and the third electrode pad is electrically connected to the negative electrode. The method of claim 1,
The case further has a third side connecting the first side and the second side, and further comprising a fourth electrode pad connected to the third side,
and the fourth electrode pad includes a fourth contact surface provided on the plane defined by the first and second directions. 9. The method of claim 8,
The third and fourth electrode pads are dummy electrode pads configured to physically support the capacitor module when the capacitor module is mounted on a PCB. 10. The method of claim 9,
The third and fourth electrode pads are floating or connected to a ground. an electrolytic capacitor including a dielectric extending in a first direction, and first and second electrodes connected to one end of the dielectric; and
Comprising a case having a first side and a second side connected to each other and mounted on the electrolytic capacitor,
The case is:
a first electrode pad mounted on the first electrode and connected to the first side surface;
a second electrode pad mounted on the second electrode, connected to the first side surface, and spaced apart from the first electrode pad in a second direction perpendicular to the first direction; and
a third electrode pad connected to the second side;
The first to third electrode pads each include first to third contact surfaces provided on a plane defined by the first and second directions. 12. The method of claim 11,
The first electrode is electrically connected to the first electrode pad,
The second electrode is electrically connected to the second electrode pad,
One of the first and second electrodes is an anode, and the other of the first and second electrodes is a cathode. 12. The method of claim 11,
wherein the third electrode pad is a dummy electrode pad configured to physically support the capacitor module when the capacitor module is mounted on a PCB. 12. The method of claim 11,
The case further includes a third side connected to the first side and facing the second side, and a fourth electrode pad connected to the third side,
and the fourth electrode pad includes a fourth contact surface provided on the plane defined by the first and second directions. 15. The method of claim 14,
the third and fourth electrode pads are dummy electrode pads configured to physically support the capacitor module when the capacitor module is mounted on a PCB;
The third and fourth electrode pads are floating or connected to a ground. a printed circuit board (PCB) including a mounting area and first to third contact terminals adjacent to the mounting area; and
A capacitor module overlapping the mounting area of the PCB and mounted on the PCB,
The capacitor module comprises:
an electrolytic capacitor including a dielectric extending in a first direction, and first and second electrodes connected to one end of the dielectric; and
A case having a first side and a second side and mounted on the electrolytic capacitor,
The case is:
a first electrode pad mounted on the first electrode and connected to the first side surface;
a second electrode pad mounted on the second electrode, connected to the first side surface, and spaced apart from the first electrode pad in a second direction perpendicular to the first direction; and
a third electrode pad connected to the second side;
The first to third electrode pads include first to third contact surfaces provided on a plane defined by the first and second directions, respectively, and the first to third contact surfaces are the first of the PCB. to the electronic circuit mounted on the third contact terminals. 17. The method of claim 16,
the first side of the case faces the second side of the case,
The first and second contact terminals of the PCB are adjacent to the mounting area in the first direction,
The third contact terminal of the PCB is adjacent to the mounting area in a direction opposite to the first direction. 18. The method of claim 17,
The PCB further includes a fourth contact terminal adjacent to the mounting region in the second direction,
The case further has a third side connecting the first side and the second side, and further comprising a fourth electrode pad connected to the third side,
The fourth electrode pad includes a fourth contact surface provided on the plane defined by the first and second directions, the fourth contact surface being mounted on the fourth contact terminal of the PCB. 17. The method of claim 16,
The first side of the case is connected to the second side of the case,
The first and second contact terminals of the PCB are adjacent to the mounting area in the first direction,
The third contact terminal of the PCB is adjacent to the mounting area in the second direction. 20. The method of claim 19,
The PCB further includes a fourth contact terminal adjacent to the mounting region in a direction opposite to the second direction,
The case further includes a third side connected to the first side and facing the second side, and a fourth electrode pad connected to the third side,
The fourth electrode pad includes a fourth contact surface provided on the plane defined by the first and second directions, the fourth contact surface being mounted on the fourth contact terminal of the PCB.

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