KR20210128227A - Antenna device and image display device including the same - Google Patents

Abstract

Provided is an antenna element, which includes: a base layer comprising a main substrate portion and an extension portion having a width smaller than that of the main substrate portion; an antenna pattern disposed on the main substrate portion of the substrate layer; and a circuit wire formed together with the antenna pattern on the base layer, directly connected to the antenna pattern, and extending on the extension portion of the base layer. Provided is the antenna element, in which the circuit wire and an antenna pattern are integrated and a bending characteristic is improved.

Description

Antenna element and image display device including the same

The present invention relates to an antenna element and an image display device including the same. More particularly, it relates to an antenna element including a base layer and an antenna pattern, and an image display device including the same.

With the recent development of an information society, wireless communication technologies such as Wi-Fi and Bluetooth are combined with an image display device and implemented in the form of, for example, a smartphone. In this case, an antenna may be coupled to the image display device to perform a communication function.

As mobile communication technology evolves in recent years, for example, an antenna for performing communication in a high-frequency or ultra-high frequency band corresponding to 3G to 5G needs to be coupled to the image display device.

However, when the driving frequency of the antenna increases, signal loss may increase, and as the length of the transmission path increases, the degree of signal loss may further increase.

In addition, when an intermediary circuit structure such as a flexible printed circuit board (FPCB) is used to electrically connect the driving integrated circuit chip and the antenna for antenna feeding/driving control, additional signal loss may occur. .

As the image display device becomes thinner and the display area increases, the space in which the antenna can be mounted may decrease. In addition, when the intermediate circuit structure is added, the volume and thickness of the display device may be increased.

For example, Korean Patent Laid-Open Publication No. 2003-0095557 discloses an antenna structure built into a portable terminal, but therefore, an antenna design capable of preventing signal loss in a limited space and implementing high-frequency driving is required.

Korean Patent Publication No. 2003-0095557

An object of the present invention is to provide an antenna element having improved operational reliability and structural efficiency.

An object of the present invention is to provide an image display device including an antenna element having improved operational reliability and structural efficiency.

1. A substrate layer comprising a main substrate and an extension having a smaller width than the main substrate; An antenna pattern disposed on the main substrate portion of the substrate layer; and a circuit wiring disposed together with the antenna pattern on the base layer and directly connected to the antenna pattern and extending on the extension portion of the base layer.

2. The above 1, wherein a plurality of the antenna patterns are arranged on the main substrate portion, and the circuit wiring is a merge wire coupling a predetermined number of antenna patterns among the antenna patterns, and is connected to the merge wire and a driving signal wire extending on the extension of the base layer.

3. The antenna element according to 2 above, wherein the merged wiring is disposed together with the antenna patterns on the main substrate.

4. The antenna element according to the above 2, wherein a part of the merged wiring is disposed on the main base part, and the other part of the merged wiring is disposed on the extension together with the driving signal wire.

5. The method of 4 above, wherein the merging wiring includes a first merging interconnection directly connected to the antenna pattern to define antenna groups and a second merging interconnection connected to the first merging interconnection and coupling the antenna groups. , the antenna element.

6. The antenna element according to the above 5, wherein the first merging wiring is disposed on the main substrate part, and the second merging wiring is disposed on the extension part together with the driving signal wiring.

7. The antenna element according to the above 1, wherein a plurality of the antenna patterns are arranged on the main substrate portion, and the circuit wiring includes a plurality of individual wirings independently connected to each of the antenna patterns.

8. The antenna element according to 7 above, wherein the plurality of individual wires are disposed only on the extension portion.

9. The antenna element according to the above 7, wherein the circuit wiring is partially disposed on the main substrate portion, and the circuit wiring portion disposed on the main substrate portion includes a bent portion.

10. The antenna element according to the above 1, wherein the circuit wiring is disposed only on the extension part.

11. The antenna element according to 1 above, wherein the extension includes a first extension portion and a second extension portion having different widths.

12. The antenna element according to the above 11, wherein the main base part, the first extension part, and the second extension part are connected to each other so that the widths are sequentially reduced.

13. The antenna element according to the above 1, wherein the extension portion of the base layer is bent together with the circuit wiring.

14. The antenna element according to the above 13, further comprising an antenna driving integrated circuit chip electrically connected to the distal end of the circuit wiring.

15. The antenna element according to 1 above, further comprising a dielectric layer disposed under the extension of the base layer.

16. The antenna element according to 15 above, further comprising a ground layer disposed under the dielectric layer and facing the circuit wiring.

17. The antenna element according to 1 above, further comprising a dummy mesh electrode formed around the antenna pattern on the main substrate, wherein the antenna pattern has a mesh structure.

18. a display panel comprising a display area and a peripheral area; and the antenna element of the above-described embodiments disposed on the display panel.

19. The image display device according to the above 18, wherein the extension portion of the base layer of the antenna element is bent along a side of the display panel in the peripheral region together with the circuit wiring.

According to embodiments of the present invention, a circuit wiring directly connected to the antenna pattern may be formed together with the antenna pattern on the base layer on which the antenna pattern is disposed. The base layer may include an extension portion extending together with the circuit wiring, and the extension portion may function as an intermediary structure for connection to an antenna driving integrated circuit integrated circuit (IC) chip.

Accordingly, by omitting an intermediate circuit structure such as a flexible printed circuit board (FPCB) for connecting the antenna driving IC chip and the antenna pattern, signal loss may be reduced or substantially eliminated. In addition, it is possible to provide a shortened signal path with the antenna driving IC chip without causing misalignment between the pad of the antenna pattern and the substrate circuit that occurs when the flexible printed circuit board is used.

In some embodiments, the extension portion of the base layer is provided as a bent portion bent under the display panel, so that, for example, an electrical connection with a rigid printed circuit board may be easily implemented.

1 is a schematic plan view showing an antenna element according to exemplary embodiments.
2 is a schematic plan view illustrating an antenna element according to some exemplary embodiments.
3 is a schematic plan view illustrating an antenna element according to some exemplary embodiments.
4 to 6 are schematic plan views illustrating an antenna element according to some exemplary embodiments.
7 is a schematic cross-sectional view illustrating a coupling structure of an antenna element and an image display device according to example embodiments.
8 is a schematic plan view for explaining an image display apparatus according to example embodiments.

Embodiments of the present invention provide an antenna element including a base layer used together as a base for antenna pattern arrangement and circuit connection. For example, the antenna element may be a microstrip patch antenna manufactured in the form of a transparent film. The antenna element may be applied to, for example, a communication device for high-frequency or ultra-high frequency (eg, 3G, 4G, 5G or higher) communication.

Further, embodiments of the present invention provide an image display device including the antenna element. An application target of the antenna element is not limited to a display device, and may be applied to various objects or structures such as vehicles, home appliances, and buildings.

Hereinafter, with reference to the drawings, embodiments of the present invention will be described in more detail. However, the following drawings attached to the present specification illustrate preferred embodiments of the present invention, and serve to further understand the technical spirit of the present invention together with the above-described content of the present invention, so the present invention is described in such drawings It should not be construed as being limited only to the matters.

The terms "upper", "lower", "top", "bottom" and the like used in this application do not designate an absolute position, but are used to distinguish a relative position between components.

1 is a schematic plan view showing an antenna element according to exemplary embodiments.

Referring to FIG. 1 , the antenna element may include an antenna pattern 110 disposed on a base layer 100 . The circuit wiring 130 connected to the antenna pattern 110 may be disposed on the base layer 100 together.

The substrate layer 100 is used to encompass a support layer or a film-type substrate for forming the antenna pattern 110 . For example, the base layer 100 may include glass, a polymer, and/or an inorganic insulating material. Examples of the polymer include cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), poly Allylate (polyallylate), polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), poly Methyl methacrylate (PMMA), etc. are mentioned. Examples of the inorganic insulating material include glass, silicon oxide, silicon nitride, silicon oxynitride, and metal oxide.

The base layer 100 may function as a dielectric layer for the antenna pattern 110 . For example, capacitance or inductance is formed by the base layer 100 through antenna driving or impedance matching, so that a frequency band in which the antenna element can be driven or sensed can be adjusted. In some embodiments, the dielectric constant of the base layer 100 may be adjusted in the range of about 1.5 to 12. When the dielectric constant exceeds about 12, the driving frequency is excessively reduced, so that driving in a desired high frequency band may not be realized.

Preferably, the base layer 100 may include a COP to improve flexural properties in the extension portion 103 as will be described later.

The base layer 100 may include a main base part 101 and an extension part 103 . The antenna pattern 110 may be formed on the main substrate 101 of the substrate layer 100 . The main substrate 101 may be substantially provided as a dielectric layer of the antenna pattern 110 .

The extension portion 103 is a single member integrally connected to the main substrate portion 101 , and thus the entire substrate layer 100 may be provided as a single dielectric layer or a single substrate.

The antenna pattern 110 may include a radiation electrode 112 and a transmission line 114 . The radiation electrode 112 may have, for example, a polygonal plate shape, and the transmission line 114 may have a line shape extending from one side of the radiation electrode 112 . According to exemplary embodiments, the radiation electrode 112 and the transmission line 114 may be a single member substantially integrally connected.

The antenna pattern 110 includes silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), and tungsten (W). , niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo) , a metal such as calcium (Ca), or an alloy thereof may be included. These may be used alone or in combination of two or more.

In an embodiment, the antenna pattern 110 may include silver (Ag) or a silver alloy (eg, silver-palladium-copper (APC) alloy) to realize low resistance. In an embodiment, the antenna pattern 110 may include copper (Cu) or a copper alloy (eg, copper-cal (CuCa) alloy) in consideration of low resistance and fine line width patterning.

The antenna pattern 110 includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), aluminum doped zinc oxide (AZO), gallium doped zinc oxide (GZO), It may include a transparent conductive oxide such as zinc tin oxide (ZTO), indium gallium oxide (IGO), tin oxide (SnO ₂ ), copper oxide (CuOx), or the like.

The antenna patterns 110 may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the antenna patterns 110 may have a three-layer structure of a transparent conductive oxide layer, a metal layer, and a transparent conductive oxide layer. In this case, while the flexible characteristic is improved by the metal layer, the signal transmission speed may be improved by lowering the resistance, and corrosion resistance and transparency may be improved by the transparent conductive oxide layer.

As shown in FIG. 1 , a plurality of antenna patterns 110 may be arranged on the main substrate portion 101 of the substrate layer 100 in a row direction to form an antenna array. .

According to exemplary embodiments, the circuit wiring 130 is formed together on the antenna pattern 110 and the base layer 100 , and may be directly connected to the antenna pattern 110 .

The circuit wiring 130 may include a driving signal wiring 135 and merge wirings 131 and 133 . The driving signal wiring 135 is formed on the extension portion 103 of the substrate layer 100 , and the merge wirings 131 and 133 are the main substrate portion 101 together with the antenna pattern 110 of the substrate layer 100 . may be formed on the

One end of the driving signal wiring 135 is disposed adjacent to, for example, an antenna driving integrated circuit (IC) chip 190 mounted on a printed circuit board (PCB) 180 , so as to form an antenna driving integrated circuit (IC). The chip 190 may receive power and driving signals directly from the chip 190 .

For example, the printed circuit board 180 is disposed on the extension part 103 of the base layer 100 , the one end of the driving signal wire 135 and an IC pad or IC in the antenna driving IC chip 190 . Pins may be electrically connected to each other through a circuit included in the printed circuit board 180 .

The printed circuit board 180 includes a core layer, and the circuits may be distributed inside and/or on the surface of the core layer. In example embodiments, the core layer may include a material having a higher strength and a glass transition temperature than that of the base layer 100 . For example, the core layer may include a resin (eg, prepreg) impregnated with an inorganic material such as glass fiber.

In one embodiment, the printed circuit board 180 may be a rigid PCB. Accordingly, sufficient thermal and mechanical stability may be secured even when the antenna driving IC chip 190 is stacked on the printed circuit board 180 through, for example, surface mounting technology (SMT).

In some embodiments, the antenna driving IC chip 190 may be directly mounted on the extension portion 103 of the base layer 100 . In this case, the printed circuit board 180 may be omitted.

The driving signal wire 135 extends in substantially the same direction as the extension 103 on the extension 103 of the base layer 100 , and the other end of the driving signal wire 135 is the main portion of the base layer 100 . It may be connected to the merge wirings 131 and 133 on the base unit 101 .

In some embodiments, a plurality of antenna patterns 110 are arranged in an array form on the main substrate 101 , and a predetermined number of antenna patterns 110 are merged wires 131 and 133 . can be coupled by

For example, as shown in FIG. 1 , two antenna patterns 110 are coupled by a first merge wire 131 to define an antenna group, and the two antenna groups are formed by a second merge wire ( 133) can be coupled. The driving signal line 135 may be connected to the second merged line 133 to extend on the extension part 103 .

The first merged wiring 131 includes a plurality of unit wirings, and each of the unit wirings may directly contact and be connected to the transmission line 114 of the antenna pattern 110 . Accordingly, the merged wirings 131 and 133 may directly transmit the feed power and the driving signal from the driving signal wiring 135 to the antenna pattern 110 .

The coupling shape of the antenna pattern 110 shown in FIG. 1 is exemplary, and may be appropriately changed in consideration of the size and radiation shape of the antenna element.

According to exemplary embodiments, both the antenna pattern 110 and the circuit wiring 130 may be connected to each other on the same plane (eg, the upper surface of the base layer 100 ).

In some embodiments, the transmission line 114 and the circuit wiring 130 are substantially single members and may be one integral line.

In some embodiments, the transmission line 114 and the circuit wiring 130 may have different widths or thicknesses, and may include different materials. For example, the transmission line 114 may be designed to have a size for impedance matching set according to a resonant frequency implemented in the radiation electrode 112 .

According to the above-described exemplary embodiments, the antenna patterns 110 and the circuit wiring 130 may be formed together on the base layer 100 . Accordingly, a separate intermediate circuit structure such as a flexible printed circuit board (FPCB) used to connect the antenna driving IC chip 190 and the antenna pattern 110 may be omitted.

In addition, an intermediate conductive structure such as a separate signal pad, a ground pad, and an anisotropic conductive film (ACF) for connecting the transmission line 114 of the antenna pattern 110 and the flexible printed circuit board (FPCB) to each other may be omitted. have. Accordingly, the circuit wiring 130 and the transmission line 114 may be substantially directly connected.

Therefore, it is possible to improve the power feeding/radiation efficiency by preventing the signal/feeding loss and signal resistance increase due to the intervention of the flexible printed circuit board. In addition, since the circuit wiring 130 is directly connected to the transmission line 114 of the antenna pattern 110, misalignment occurring during the bonding process for connecting the flexible printed circuit board on the antenna pattern, the substrate layer 100 and Mechanical defects such as thermal damage to the antenna pattern 110 may also be prevented.

As described above, the extension portion 103 of the substrate layer 100 on which the driving signal wiring 135 connected to the antenna driving IC chip 190 is disposed may have a smaller width than the main substrate portion 101 . Therefore, as will be described later with reference to FIG. 7 , the base layer 100 can be easily bent together with the driving signal wiring 135 , and thus the circuit connection with the antenna driving IC chip 190 can be easily implemented. have.

According to the embodiment shown in FIG. 1 , the width of the extension part 103 formed in the same direction as the driving signal wiring 135 may be reduced so that it may be easily bent together with the driving signal wiring 135 .

2 is a schematic plan view illustrating an antenna element according to some exemplary embodiments. Detailed descriptions of configurations and structures that are substantially the same as or similar to those described with reference to FIG. 1 will be omitted.

Referring to FIG. 2 , the circuit wiring 132 may include individual wirings independently connected to each antenna pattern 110 . Accordingly, power/driving control may be independently performed for each of the plurality of antenna patterns 110 .

For example, different phase signals may be applied to the antenna patterns 110 through the circuit wires 132 respectively connected to the plurality of antenna patterns 110 .

In this case, the circuit wiring 132 may extend linearly on the extension portion 103 of the substrate layer 100 , and may be bent on the main substrate portion 101 to be connected to each antenna pattern 110 . For example, the circuit wiring 132 may include a bent portion as indicated by a dotted line in FIG. 2 , and the bent portions included in each circuit wiring 132 may be disposed on the main substrate 101 .

3 is a schematic plan view illustrating an antenna element according to some exemplary embodiments.

Referring to FIG. 3 , the radiation electrode 112 and the transmission line 114 of the antenna pattern 110 may include a mesh structure. In this case, the dummy mesh electrode 140 may be formed around the radiation electrode 112 and the transmission line 114 .

In some embodiments, the dummy mesh electrode 140 and the antenna pattern 110 may include the same mesh structure (eg, the same line width and the same pitch). For example, the dummy mesh electrode 140 and the antenna pattern 110 are formed from the same conductive layer, and are separated and defined from each other by the separation region 145 formed together while forming a mesh structure from the conductive layer through an etching process. can be

The radiation electrode 112 and the transmission line 114 may be disposed in a display area of the display device, as will be described later. In this case, since the radiation electrode 112 and the transmission line 114 include the mesh structure, transmittance on the display area may be improved. In addition, the electrode pattern structure around the antenna pattern 110 is uniformed through the dummy mesh electrode 140 , so that it is possible to prevent the electrodes of the antenna element from being recognized by the user.

In some embodiments, the circuit wiring 130 may be formed of a solid metal pattern or a metal line to reduce power supply resistance and prevent signal loss.

4 to 6 are schematic plan views illustrating an antenna element according to some exemplary embodiments. Detailed description of structures and configurations substantially the same as or similar to those described with reference to FIG. 1 will be omitted.

Referring to FIG. 4 , the extension 103 of the base layer 100 may extend to substantially cover the entire circuit wiring 130 .

In example embodiments, the merged wirings 131 and 133 of the circuit wiring 130 and the driving signal wiring 135 may be disposed on the extension 103 . In this case, the antenna pattern 110 is substantially disposed on the main substrate 101 , and the circuit wiring 130 may not extend onto the main substrate 101 .

According to the embodiment of FIG. 4 , the circuit wiring 130 may be bent as a whole together with the extension part 103 , and accordingly, the area of the antenna element exposed on the front part of the display device may be further reduced.

In some embodiments, even when the circuit wiring 132 includes a plurality of individual wirings independently connected to each antenna pattern 110 as shown in FIG. 2 , the individual wirings are disposed on the extension part 103 . It is disposed only on the , and may not extend onto the main substrate 101 .

Referring to FIG. 5 , a portion of the merge wirings 131 and 133 may be formed along with the driving circuit wiring 135 on the extension 103 of the base layer 100 .

For example, the first merged interconnection 131 may be substantially formed on the main substrate 101 , and the second merged interconnection 133 may be formed substantially on the extension 103 .

According to the embodiment of FIG. 5 , by dispersing the merged wirings 131 and 133 in the main substrate 101 and the extension 103 , stress generated when the extension 103 is bent is reduced to the beauty of the circuit wiring 130 . It can be properly cushioned through the curved part.

Referring to FIG. 6 , the extension of the above-described base layer 100 may include portions having a plurality of different widths.

For example, a first extension portion 103a and a second extension portion 103b that sequentially decrease in width may be formed from the main substrate portion 101 .

In an embodiment, at least a portion of the merged interconnections 131 and 133 may be disposed on the first extension 103a. A driving signal line 135 may be disposed on the second extension portion 103b.

According to the embodiment illustrated in FIG. 6 , it is possible to improve bending characteristics together with the second extension 103b while securing a sufficient area for forming the merged wiring 103a through the first extension 103a.

7 is a schematic cross-sectional view illustrating a coupling structure of an antenna element and an image display device according to example embodiments.

Referring to FIG. 7 , the image display device may include a display layer 205 stacked on the display panel 200 . The display layer 205 may include, for example, an organic light emitting layer or a liquid crystal display layer. The display panel 200 may include a panel substrate and a thin film transistor (TFT) array disposed on the panel substrate.

The panel substrate may include, for example, a flexible resin such as polyimide, and the image display device may be provided as a flexible or foldable display device.

The antenna pattern 110 of the antenna element according to the above-described exemplary embodiments may be disposed on the display layer 205 together with the main substrate 101 of the substrate layer 100 . For example, the main substrate 101 of the substrate layer 100 may be attached on the display layer 205 through the first adhesive layer 210 .

In some embodiments, the optical functional layer 230 and the cover window 240 may be sequentially stacked on the antenna pattern 110 . The optical function layer 230 may include, for example, a polarizer or a polarizing plate. The cover window 240 may include, for example, glass (eg, ultra-thin glass (UTG)) or a transparent resin film.

For example, the second adhesive layer 220 may be formed between the optical functional layer 230 and the antenna pattern 110 . Through the second adhesive layer 220 and the first adhesive layer 210, the antenna element may be attached to the image display device in the form of, for example, a patch.

The circuit wiring 130 of the antenna element may be bent along the side of the display panel 200 together with the extension 103 of the base layer 100 . For example, the driving signal wiring 135 and the extension portion 103 of the substrate layer 100 are displayed by bending from the portion where the merge wirings 133 and 135 are formed among the main substrate portion 101 of the substrate layer 100 . It may be bent together along the side of the panel 200 .

7 , the side portion of the display panel 200 may have a curved shape, and a curved portion of the antenna element may also be curved along the curved surface. Alternatively, the side of the display panel 200 may have a vertical side, and the curved portion of the antenna element may also have a curved profile along the vertical side.

In some embodiments, the printed circuit board 180 and the antenna driving IC chip 190 may be disposed under the display panel 200 . The distal end of the driving signal wiring 135 of the antenna element is bent under the display panel 200 together with the distal end of the extension 103 of the base layer 100 , so that the printed circuit board 180 and the antenna driving IC chip 190 are bent. ) can be electrically connected to.

For example, the antenna driving IC chip 190 and the driving signal wiring 135 of the antenna element are electrically connected through the connection wiring 185 disposed on the printed circuit board 180, so that power supply and driving control are performed. can be performed.

In some embodiments, the dielectric layer 95 may be formed under the portion where the circuit wiring 130 is formed of the base layer 100 . As described above, when the antenna element according to the embodiments of the present invention is used, an intermediate circuit structure such as a flexible printed circuit board may be omitted. Accordingly, the dielectric layer 95 may be additionally formed for impedance matching corresponding to the intermediate circuit structure.

A ground layer 90 may be formed under the dielectric layer 95 . The ground layer 90 may face the circuit wiring 130 with the base layer 100 and the dielectric layer 95 interposed therebetween. Noise and signal interference around the circuit wiring 130 may be absorbed or shielded through the ground layer 90 . In addition, generation of an electric field from the circuit wiring 130 may be facilitated by the ground layer 90 , thereby improving signal transmission efficiency.

The dielectric layer 95 may include a transparent resin material having flexibility to be folded. For example, the dielectric layer 95 may include a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; Cellulose resins, such as a diacetyl cellulose and a triacetyl cellulose; polycarbonate-based resin; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrenic resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin-based resins such as polyethylene, polypropylene, polyolefin having a cyclo-based or norbornene structure, and an ethylene-propylene copolymer; vinyl chloride-based resin; amide resins such as nylon and aromatic polyamide; imide-based resin; polyether sulfone-based resin; sulfone-based resins; polyether ether ketone resin; sulfide polyphenylene-based resin; vinyl alcohol-based resin; vinylidene chloride-based resin; vinyl butyral-based resin; allylate-based resin; polyoxymethylene-based resins; epoxy resin; It may include a urethane-based resin, a silicone-based resin, and the like. These may be used alone or in combination of two or more.

In some embodiments, an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR) may be included in the dielectric layer 95 . The dielectric layer 95 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, silicon oxynitride, or the like.

The circuit wiring 130 and the ground layer 90 may include the above-described metal or alloy.

In some embodiments, a passivation layer 150 covering the circuit wiring 130 may be additionally formed on the dielectric layer 100 . The passivation layer 150 may be selectively formed on the bent portion of the antenna element or the dielectric layer 100 to function as a protective film protecting the circuit wiring 130 .

The passivation layer 150 may include an insulating material substantially the same as or similar to the dielectric layer 95 .

The stacked form on the display panel 200 or the display layer 205 illustrated in FIG. 7 is exemplary and not necessarily limited thereto. For example, a touch sensor or touch panel may be laminated on the display layer 205 . The stacking order of the touch panel, the antenna element, and the optical functional layer 230 may be appropriately adjusted in consideration of touch sensing sensitivity, radiation efficiency, electrode visibility prevention, and the like.

8 is a schematic plan view illustrating an image display apparatus according to example embodiments.

Referring to FIG. 8 , the image display device may be implemented in the form of, for example, a smart phone, and FIG. 8 shows a front part or a window surface of the image display device. The front portion of the image display device may include a display area DA and a peripheral area PA. The peripheral area PA may correspond to, for example, a light blocking part or a bezel part of the image display device.

The antenna pattern 110 included in the aforementioned antenna element may at least partially overlap the display area DA. In this case, the radiation electrode 112 may include a mesh structure, and deterioration of transmittance and image quality due to the radiation electrode 112 may be prevented.

In some embodiments, the circuit wiring 130 of the antenna element may be disposed in the peripheral area PA. For example, the circuit wiring 130 is bent together with the extension portion 103 of the base layer 100 , and is bent along the side of the image display device to be electrically connected to the antenna driving IC chip 180 disposed on the rear surface. can

In some embodiments, a portion of the transmission line 114 may also be disposed in the peripheral area PA together with the circuit wiring 130 .

100: base layer 110: antenna pattern
112: radiation electrode 114: transmission line
130: circuit wiring 131, 133: merge wiring
135: distribution wiring 140: dummy mesh electrode
180: printed circuit board 190: antenna driving IC chip

Claims (19)

a base layer including a main base part and an extension having a smaller width than the main base part;
An antenna pattern disposed on the main substrate portion of the substrate layer; and
The antenna element comprising a circuit wiring disposed on the base layer with the antenna pattern directly connected to the antenna pattern and extending on the extension portion of the base layer. The method according to claim 1, wherein a plurality of the antenna patterns are arranged on the main substrate,
The circuit wiring includes a merge wire coupling a predetermined number of antenna patterns among the antenna patterns, and a driving signal wire connected to the merge wire and extending on the extension portion of the base layer. The antenna element according to claim 2, wherein the merged wiring is disposed together with the antenna patterns on the main substrate. The antenna element of claim 2 , wherein a portion of the merged wiring is disposed on the main substrate portion, and the remaining portion of the merged wiring is disposed on the extension along with the driving signal line. The antenna of claim 4 , wherein the merging wiring includes a first merging interconnection that is directly connected to the antenna pattern to define antenna groups and a second merging interconnection that is connected to the first merging interconnection and couples the antenna groups. device. The antenna element of claim 5 , wherein the first merged wire is disposed on the main base part, and the second merged wire is disposed on the extension together with the driving signal wire. The method according to claim 1, wherein a plurality of the antenna patterns are arranged on the main substrate,
The circuit wiring includes a plurality of individual wirings independently connected to each of the antenna patterns. The antenna element according to claim 7, wherein the plurality of individual wires are disposed only on the extension portion. The method according to claim 7, wherein the circuit wiring is partially disposed on the main substrate,
The circuit wiring portion disposed on the main substrate portion includes a bent portion, the antenna element. The antenna element according to claim 1, wherein the circuit wiring is disposed only on the extension portion. The antenna element according to claim 1, wherein the extension part includes a first extension part and a second extension part having different widths from each other. The antenna element according to claim 11, wherein the main base part, the first extension part, and the second extension part are connected to each other so that the widths are sequentially reduced. The antenna element according to claim 1, wherein the extension portion of the base layer is bent together with the circuit wiring. 14. The antenna element of claim 13, further comprising an antenna driving integrated circuit chip electrically connected to a distal end of the circuit wiring. The antenna element according to claim 1, further comprising a dielectric layer disposed under the extension of the base layer. 16. The antenna element of claim 15, further comprising a ground layer disposed under the dielectric layer and facing the circuit wiring. The antenna element according to claim 1, further comprising a dummy mesh electrode formed around the antenna pattern on the main substrate, wherein the antenna pattern has a mesh structure. a display panel including a display area and a peripheral area; and
An image display device comprising the antenna element of claim 1 disposed on the display panel. The image display device according to claim 18, wherein the extension portion of the base layer of the antenna element is bent along a side of the display panel in the peripheral region together with the circuit wiring.

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