KR20210110146A - Semiconductor device including recessed interconnect structure - Google Patents

Abstract

A semiconductor device includes a first gate structure extended along a first lateral direction. The semiconductor device includes a first interconnect structure disposed over a first gate structure that is extended along a second lateral direction perpendicular to the first lateral direction. The first interconnect structure includes a first portion and a second portion that are electrically isolated from each other by a first dielectric structure. The semiconductor device includes a second interconnect structure disposed between the first gate structure and the first interconnect structure that electrically couples the first gate structure to the first portion of the first interconnect structure. The second interconnect structure includes a recessed portion substantially aligned with the first gate structure and the dielectric structure along a vertical direction.

Description

A semiconductor device comprising a recessed interconnect structure.

The semiconductor integrated circuit (IC) industry has experienced exponential growth. In semiconductor ID design, standard cell methodologies are commonly used for the design of semiconductor devices on a chip. Standard cell methodology uses a standard cell as an abstract representation of a given function to integrate millions or billions of devices on a single chip. As ICs continue to shrink, more and more devices are integrated onto a single chip. This scaling down process generally provides advantages by increasing production efficiency and lowering associated costs.

Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It is noted that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or decreased for clarity of discussion.
1 illustrates a cross-sectional view of an example semiconductor device including a recessed interconnect structure, in accordance with some embodiments.
2 illustrates a cross-sectional view of another example semiconductor device including a recessed interconnect structure, in accordance with some embodiments.
3 illustrates a circuit diagram of an example circuit, in accordance with some embodiments.
4 illustrates an example layout design of a standard cell representing the circuit of FIG. 3 , in accordance with some embodiments.
5 illustrates a cross-sectional view of a semiconductor device formed by at least a portion of the layout design of FIG. 4 including a recessed interconnect structure, in accordance with some embodiments.
6A and 6B illustrate an example layout design of a standard cell representing the circuit of FIG. 3 , in accordance with some embodiments.
7 illustrates a perspective view of a semiconductor device formed by at least a portion of the layout design of FIGS. 6A and 6B including a recessed interconnect structure, in accordance with some embodiments.
8 illustrates a flowchart of a method of manufacturing a semiconductor device, in accordance with some embodiments.
9 illustrates a block diagram of a system for generating an IC layout design, in accordance with some embodiments.
10 illustrates a block diagram of an IC manufacturing system, and associated IC manufacturing flow, in accordance with some embodiments.
11 illustrates a flowchart of an example method for forming a semiconductor device including a recessed interconnect structure, in accordance with some embodiments.
12A, 12B, 12C, 12D, 12E, 12F, 12G, 12H, 12I, 12J, 12K, 12L, and 12M are the method of FIG. 11 , in accordance with some embodiments. Illustrates cross-sectional views of an exemplary semiconductor device during various fabrication steps fabricated by

The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. To simplify the present disclosure, specific examples of components and arrangements are described below. These are, of course, examples only and are not intended to be limiting. For example, in the description that follows, forming a first feature on or on a second feature may include embodiments in which the first and second features are formed in direct contact, and also include the first feature and the second feature. Additional features may be formed between the two features, including embodiments in which the first and second features may not be in direct contact as a result. In addition, this disclosure may repeat reference numbers and/or letters in the various examples. This repetition is for simplicity and clarity, and, in itself, does not indicate a relationship between the various embodiments and/or configurations being discussed.

Furthermore, for ease of explanation describing the relationship of one element or feature to another element(s) or feature(s) as illustrated in the figures, “beneath”, “below” Spatially relative terms such as , "lower", "above", "upper" and the like may be used herein. The spatially relative terms are intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

With the tendency to shrink the IC, in general, the area of a standard cell will shrink accordingly. The area of a standard cell may be reduced by reducing the cell width of the cell and/or the cell height of the cell. Cell width is typically proportional to the number of gate structures or features (eg, commonly known as “POLY”) extending along the vertical direction that the cell may contain; The cell height is typically proportional to the number of signal tracks that the cell can contain, extending along the horizontal direction. While reducing the cell height (eg, by reducing the number of signal tracks), the cell width (number of gate structures) may be increased, which may not effectively reduce the overall area. Although the number of gate structures can be forced unchanged (eg, only reducing the number of signal tracks), manufacturing semiconductor devices based on such cell designs may encounter various routing issues. For example, one or more interconnect structures may be formed (eg, cut) to have a relatively shorter width, in part due to the shortened cell width. It can become quite difficult in the case of landing an interconnect structure (eg, via structure) on such a shortened interconnect structure, which may cause malfunction (eg, short circuit) of the cell. There may be a possibility.

The present disclosure provides various embodiments of a semiconductor device that can be represented by (or formed based on) a standard cell. The area of a standard cell can be reduced by simultaneously reducing the cell height and cell width of the standard cell, without being affected by the issues encountered by existing technologies. For example, a semiconductor device includes a plurality of transistors, each including a respective gate structure and a source/drain structure. A gate structure may be defined by a plurality of gate features of a cell, each associated with a cell width of the cell. The gate structure and the source/drain structure may be connected by a plurality of interconnect structures each defined by the number of signal tracks in the cell. A semiconductor device, as disclosed herein, includes one or more recessed interconnect structures each disposed between at least one corresponding gate structure and at least one corresponding interconnect structure. In some embodiments, the recessed interconnect structure may include a partially or fully recessed portion filled with a dielectric material. For example, a recessed interconnect structure comprising a partially recessed portion may laterally extend or shift a connection point of a corresponding gate structure, which may include: Causes the struct to shift accordingly. Accordingly, other interconnect structures (eg, interconnect structures adjacent to an interconnect structure connected to a gate structure) will not be cut to have a shortened lateral width. As such, in spite of reducing the number of gate features and the number of signal tracks of a cell (and thereby reducing the overall area of the cell), the above-identified issues facing the existing technology cannot be solved. can In some other embodiments, a recessed interconnect structure comprising a fully recessed portion is a corresponding conductive structure (eg, one or more interconnect structures coupled to a dummy gate structure and/or a dummy source/drain structure). can vertically shift the connection point of , which allows the interconnect structure in the interconnect layer to be formed over the recessed interconnect structure. As such, the routing resources of the interconnection layer can be advantageously saved.

1 , a cross-sectional view of a portion of a semiconductor device 100 including a recessed interconnect structure is depicted, in accordance with some embodiments. The semiconductor device 100 is simplified for purposes of illustration, as shown in FIG. 1 , and thus the semiconductor device 100 may include any of a number of suitable features while remaining within the scope of the present disclosure. It is understood that there is For example, semiconductor device 100 may include a plurality of transistors (eg, planar complementary metal-oxide-semiconductor field-effect transistors (NMOSFETs), fin-based field-effect transistors). (fin-based field-effect transistor; FinFET), nanosheet field effect transistor, nanowire field effect transistor), each of which has respective gate structures and source/drain structures (or source/drain regions) Although formed by , the illustrated embodiment of FIG. 1 may include a portion of the structure.

As shown, the semiconductor device 100 includes a first gate structure 102 , a second gate structure 104 , and a third gate structure 106 formed over a substrate (not shown). In some embodiments, gate structures 102 - 106 may include a conductive material, such as, for example, one or more metallic materials, polysilicon materials, and the like. Although not shown in FIG. 1 , each of the gate structures 102 - 106 includes one or more active regions (eg, one or more active regions having a corresponding source/drain structure/region disposed on a side of the gate structure to function as a respective transistor). For example, it is understood that over one or more conducting channels). The source/drain structure may source/drain conduction current through the active region gated (eg, regulated) by the gate structure. For example, each of the gate structures 102 - 106 may be formed over (eg, across) the active region of the FinFET to regulate current conduction through the FinFET. Such functional structures of transistors (and other active devices, eg, resistors, capacitors, etc.) are collectively referred to as front-end-of-line (FEOL) structures. Gate structures 102 - 106 are embedded in dielectric layer 108 . Dielectric layer 108 may include a dielectric material, such as, for example, a low-k dielectric material, an ultra-low-k dielectric material. Such dielectric layer 108 is commonly referred to as an inter-layer dielectric (ILD) layer.

The semiconductor device 100 further includes an interconnect structure 116 formed over the dielectric layer 108 . In some embodiments, interconnect structure 116 may include a conductive material, such as, for example, one or more metallic materials. A layer comprising such an interconnect structure 116 that is formed directly over the gate structure is sometimes referred to as a “M0” layer. Typically, structures formed in and over the M0 layer (eg, M1 layer, M2 layer, etc.) are collectively referred to as a back-end-of-line (BEOL) structure. To enable the intended functionality of the semiconductor device 100 , each of the gate structures 102 - 106 may be electrically coupled to one or more BEOL structures. For example, gate structure 102 is electrically coupled to interconnect structure 116 - 1 of interconnect structure 116 ; The gate structure 104 is electrically coupled to the interconnect structure 116 - 2 of the interconnect structure 116 . Interconnect structures 116 - 1 and 116 - 2 may be formed along the same signal track and may be isolated (eg, isolated) from each other by dielectric structure 118 .

The gate structure 102 may be electrically coupled to the interconnect structure 116 - 1 through the interconnect structure 110 extending through the dielectric layer 108 ; The gate structure 104 may be electrically coupled to the interconnect structure 116 - 2 through an interconnect structure 112 that extends through the dielectric layer 108 . In some embodiments, interconnect structure 110 may be formed as a via interconnect structure. Such a via interconnect structure 110 that connects the gate structure to the interconnect structure of the M0 layer that is vertically aligned with the gate structure is sometimes referred to as "VG".

In accordance with various embodiments of the present disclosure, an interconnect structure connecting a gate structure to an interconnect structure of the M0 layer that is not vertically aligned with the gate structure (eg, laterally displaced from the gate structure) 112 may be formed to include a recessed portion 112-1 and a non-recessed portion 112-2. As such, interconnect structure 112 may be referred to as a partially recessed interconnect structure. Recessed portion 112-1 and non-recessed portion 112-2 may be formed as respective via structures abutting (or otherwise adjacent to) each other. The location of the recessed portion 112-1 may be used to form a via structure (commonly referred to as “VG”) for connecting the gate structure 104 to the interconnect structure of the M0 layer; The location of the non-recessed portion 112 - 2 is a via structure (commonly referred to as “VD”) for connecting the source/drain interconnect structure (commonly referred to as “MD”) to the interconnect structure of the M0 layer. ) may be used to form A source/drain interconnect structure MD (shown by dashed lines in FIG. 1 ) connects a source/drain structure (eg, a source/drain structure formed on one of the sides of the gate structure 104 ) to a higher level. may be formed for coupling to an interconnect structure (eg, 116-2). Such interconnect structures, eg, VG, VD, MD, may be collectively referred to as a line middle-end-of-line (MEOL) structure. In some embodiments, the combination of recessed portion 112-1 and non-recessed portion 112-2 is sometimes referred to as “VG+VD”.

Still referring to FIG. 1 , more particularly, recessed portion 112-1 is recessed relative to non-recessed portion 112-2 to define recess 113 . In some embodiments, the recess 113 may be defined by a misalignment or displacement of the upper boundary of each of the recessed portion 112-1 and the non-recessed portion 112-2. Recess 113 is filled with a dielectric material to form dielectric recess structure 114 . Each of the two portions 112-1 and 112-2 is directly connected to either the gate structure 104 or the interconnect structure 116-2. For example, the recessed portion 112-1 is only in direct contact with the gate structure 104; The non-recessed portion 112 - 2 is in direct contact only with the interconnect structure 116 - 2 . In some other embodiments, the recessed portion 112-1 may be coupled to the gate structure 104 with one or more conductive layers (eg, TaN layers) interposed therebetween. Similarly, the non-recessed portion 112 - 2 may be coupled to the interconnect structure 116 - 2 with one or more conductive layers (eg, TaN layers) interposed therebetween.

By forming such a recessed interconnect structure 112 , as shown in FIG. 1 , the connection point (or via structure landing point) of the gate structure 104 is from point “X” to point “Y”. It can be shifted laterally. This allows the gate structure 104 to be electrically connected to an interconnect structure 116 - 2 that is laterally displaced from the gate structure 104 . Furthermore, by forming the dielectric recess structure 114 over the recessed portion 112-1, the gate structure 104 can be formed with any other interconnect structure (eg, the interconnect structure 116-2) except for the interconnect structure 116-2. For example, it can be electrically isolated from 116-1). As such, the lateral width of the interconnect structure 116 - 2 can be made large enough, which can be made to " The possibility of failure in landing to the next top interconnect layer, the via structure connecting to the M1 layer, commonly referred to as VIAO" can be significantly reduced. In existing technology, at least an end portion of interconnect structure 116-2 is formed to connect gate structures 102 and 104 to interconnect structures 116-1 and 116-2, respectively. Often formed to be vertically aligned with 104 , which can significantly shorten or compress the lateral width of interconnect structure 116 - 1 . Accordingly, there may be a possibility that the misalignment of VIAO may occur, which may not reach the original functionality of the semiconductor device 100 .

Referring to FIG. 2 , a cross-sectional view of a portion of a semiconductor device 200 including a recessed interconnect structure is depicted, in accordance with some embodiments. The semiconductor device 200 is simplified for purposes of illustration, as shown in FIG. 2 , and thus the semiconductor device 200 may include any of a number of suitable features while remaining within the scope of the present disclosure. It is understood that there is For example, semiconductor device 100 may include a plurality of transistors (eg, planar complementary metal oxide semiconductor field effect transistors (planar MOSFETs), fin-based field effect transistors (FinFETs), nanosheet field effect transistors, nanowires). field-effect transistors, complementary field-effect transistors (CFETs), each formed by a respective gate structure and a source/drain structure (or source/drain region), The illustrated embodiment of FIG. 2 includes a portion of a structure.

As shown, the semiconductor device 200 includes a first gate structure 202 , a second gate structure 204 , and a third gate structure 206 formed over a substrate (not shown). In some embodiments, the gate structures 202-206 may include a conductive material, such as, for example, one or more metallic materials, polysilicon materials, and the like. Although not shown in FIG. 2 , each of the gate structures 202-206 is formed over one or more active regions (eg, one or more conducting channels) for conditioning the respective transistor(s). For example, each of the gate structures 202-206 may be formed over (eg, across) the active region of the FinFET to regulate current conduction through the FinFET.

The semiconductor device 200 further includes a plurality of source/drain interconnect structures (MDs) 212 , 214 , 216 , and 218 over the substrate. Although not shown in FIG. 2 , each of MDs 212 - 218 has an active region (eg, an epitaxially grown source/drain structure/region) for sourcing or draining a respective transistor. formed on top For example, MDs 212 and 214 may be coupled to a source structure and a drain structure of a first transistor gated by gate structure 202 to source and drain the first transistor, respectively; MDs 214 and 216 may be coupled to source and drain structures of a second transistor gated by gate structure 204 to source and drain the second transistor, respectively; MDs 216 and 218 may be coupled to the source and drain structures of a third transistor gated by gate structure 206 to source and drain the third transistor, respectively.

Gate structures 202-206 and MDs 212-218 are embedded in dielectric layer 208 . The dielectric layer 208 may include a dielectric material such as, for example, a low-k dielectric material, an ultra-low-k dielectric material. Such dielectric layer 208 is commonly referred to as an interlayer dielectric (ILD) layer. An interconnect structure 210 may be formed over the dielectric layer 208 to couple one or more of the gate structures 202-206 and/or the MDs 212-218. Similar to interconnect structure 116 , the layer comprising interconnect structure 210 is commonly referred to as the M0 layer.

In some cases, the second transistor constituted by gate structure 204 , source/drain structures 214 - 216 may function as a dummy transistor in semiconductor device 200 . The dummy transistor may not have an active function during operation of the semiconductor device 200 . As such, gate structure 204 and source/drain structures 214 - 216 may be coupled to each other via interconnect structure 220 . In this regard, according to some embodiments, interconnect structure 220 may include (or be coupled to) a recess, eg, 221 . Recess 221 is filled with a dielectric material to form dielectric recess structure 222 . MD 212 may be electrically coupled to interconnect structure 210 via interconnect structure 232 (hereinafter “VD 232 ”) that extends through dielectric layer 208 ; The MD 218 may be electrically coupled to the interconnect structure 210 via an interconnect structure 238 (hereinafter “VD 238 ”) that extends through the dielectric layer 208 .

Interconnect structure 220 may be formed to include one or more recessed portions 220 - 1 , 220 - 2 , and 220 - 3 . As such, interconnect structure 220 may be referred to as a fully recessed interconnect structure. According to some embodiments, the recessed portions 220 - 1 - 220 - 3 may be formed as respective via structures that abut (or alternatively adjacent to) each other. The location of the recessed portion 220 - 1 may be used to form a VD for connecting the MD 214 to the interconnect structure 210 ; The location of the recessed portion 220 - 2 may be used to form a VG for connecting the gate structure 204 to the interconnect structure 210 ; The location of the recessed portion 220 - 3 may be used to form a VD for coupling the MD 216 to the interconnect structure 210 . In some embodiments, the combination of recessed portions 220-1 through 220-3 is sometimes referred to as “VD+VG+VD”.

In the existing technology, the gate structure 204 and the source/drain structures 214 - 216 constituting the dummy transistor are connected to each other through a cut portion of the interconnect structure 210 . Thus, in order to connect MDs 212 and 218, at least one interconnect structure of an interconnect layer next above layer M0 (eg, layer M1) is required, which provides routing resources at layer M1. It can be quite wasteful. In contrast, connection of one or more interconnect structures (eg, 220-1, 220-2, 220-3), as shown in FIG. 2 , by forming recessed interconnect structures 220 . A point may be shifted vertically from point “X” to point “Y”. This allows the MDs 212 and 218 to be connected directly to each other via the interconnect structure 210 , which may save routing resources in the next upper interconnect layer.

As discussed above, by forming the disclosed recessed interconnect structure (eg, 112 in FIG. 1 ) for connecting the FEOL conductive structure (eg, 104 in FIG. 1 ), a FEOL conductive structure The connection points of the s may be laterally shifted to allow the BEOL interconnect structures corresponding to the FEOLs to be shifted laterally accordingly. Consequently, adjacent BEOL interconnect structure(s) can be formed to have a sufficiently large landing width. This alleviates various routing issues currently faced by existing technologies, for example when the dimensions of standard cells are increasingly reduced. Below are various exemplary layout designs of circuits constructed based on the adoption of recessed interconnect structures.

를 수행하도록 구성되는 하나의 출력 ZN을 갖는다. 함수를 수행하기 위해, 회로(300)는 서로 전기적으로 커플링되는 여덟 개의 트랜지스터(302, 304, 306, 308, 310, 312, 314, 및 316)를 포함할 수 있다. 트랜지스터(302-308)는 각각 p 타입 MOS 트랜지스터로서 구현될 수 있으며; 트랜지스터(310-316)는 각각 n 타입 MOS 트랜지스터로서 구현될 수 있다. 그러나, 트랜지스터(302-316)의 각각은 다양한 다른 타입의 트랜지스터 중 임의의 것으로서 구현될 수 있다는 것이 이해된다.Referring first to FIG. 3 , a circuit diagram of an exemplary circuit 300 is depicted. Circuit 300 includes AND-OR-Invert (AOI) logic circuitry. AOI logic circuits are generally constructed from a combination of one or more AND gates followed by NOR gates. As shown in Figure 3, circuit 300 has four inputs: A1, A2, B1 and B2; and the following Boolean function:

It has one output ZN that is configured to perform To perform the function, circuit 300 may include eight transistors 302 , 304 , 306 , 308 , 310 , 312 , 314 , and 316 electrically coupled to each other. Transistors 302-308 may each be implemented as a p-type MOS transistor; Transistors 310-316 may each be implemented as an n-type MOS transistor. However, it is understood that each of transistors 302-316 may be implemented as any of a variety of other types of transistors.

In one embodiment, the drain of transistor 302 is connected to the source of transistor 304 ; The drain of transistor 306 is connected to the source of transistor 308 . transistor 302 is gate controlled by an interconnect structure configured to receive input B1 and sourced by a first supply voltage (eg, VDD); transistor 304 is gated by an interconnect structure configured to receive an input A1 and drained to an interconnect structure configured to provide an output ZN; transistor 306 is gate controlled by an interconnect structure configured to receive input B2 and sourced by a first supply voltage (eg, VDD); Transistor 308 is gated by an interconnect structure configured to receive input A2 and drained to an interconnect structure configured to provide output ZN. a drain of transistor 310 is coupled to the drain of transistor 304 and also drained into an interconnect structure configured to provide an output ZN; A drain of transistor 314 is coupled to the drain of transistor 308 and also drained into an interconnect structure configured to provide an output ZN. transistor 310 is gate controlled by an interconnect structure configured to receive input A1; Transistor 314 is gate controlled by an interconnect structure configured to receive input B1. the source of the first transistor 310 is connected to the drain of the transistor 312 ; The source of transistor 314 is connected to the drain of transistor 316 . transistor 312 is gate controlled by an interconnect structure configured to receive input A2 and sourced by a second supply voltage (eg, VSS); Transistor 316 is gate controlled by an interconnect structure configured to receive input B2 and sourced by a second supply voltage (eg, VSS).

4 , an exemplary layout design 400 of a standard cell is depicted, in accordance with some embodiments. The layout design 400 may be used to fabricate at least a portion of a semiconductor device (eg, 500 of FIG. 5 ) that functions as the circuit 300 of FIG. 3 . By employing the recessed interconnect structures disclosed herein, the dimensions (eg, area) of the layout design 400 (or standard cells) can be reduced without being affected by the routing issues identified above. can For example, the cell width of a standard cell may be reduced proportionally to a relatively small number of gate structures (eg, no more than 5 gate structure spaces), and the cell height of a standard cell has a relatively small number of signal tracks. (eg, no more than 3 M0 interconnect structure spaces) may be reduced proportionally.

A semiconductor device corresponding to layout design 400 may be fabricated based on forming respective active features of transistors 302-316 along a single level of active area. Such active regions may be fin-shaped regions of one or more three-dimensional field effect transistors (eg, gate-all-around (GAA) transistors including FinFETs, nanosheet transistors, and nanowire transistors), or one or more It may be an oxide-definition (OD) region of a planar metal oxide semiconductor field effect transistor (MOSFET), wherein the active region may serve as a source feature or drain feature of each transistor(s). In some embodiments of the present disclosure, the term “single level” of multiple active regions may refer to the active regions being formed along a single lateral plane.

In FIG. 4 , layout design 400 includes patterns 402 and 404 . On the substrate, patterns 402 and 404 configured to form active regions hereinafter referred to as “active regions 402” and “active regions 404”, respectively, may extend along the X direction. Active region 402 may be characterized as a first conduction type, and active region 404 may be characterized as a second conduction type. For example, active region 402 includes a p-type doped region, and active region 404 includes an n-type doped region. Layout design 400 may be used to form transistors 302-316 in various configurations. In one example where transistors 302-316 are to be formed as a FinFET, active region 402 may be formed over a substrate as a p-type fin-based structure, and active region 404 as an n-type fin-based structure over a substrate. may be formed. In another example where transistors 302-316 are to be formed as nanosheet transistors, active region 402 may be formed as one or more p-type nanosheets stacked on top of each other over a substrate, active region 404 being the substrate. It may also be formed as one or more n-type nanosheets stacked on top of each other from above. In another example in which transistors 302-316 are to be formed as planar MOSFETs, active region 402 may be formed as a p-type region recessed in the substrate, and active region 404 is n-type recessed in the substrate. It may be formed as a region.

Layout design 400 includes patterns 406 , 408 , 410 , 412 , 414 , and 416 . Hereinafter, "gate structure 406", "gate structure 408", "gate structure 410", "gate structure 412", "gate structure 414", and "gate structure 416," respectively The patterns 406 , 408 , 410 , 412 , 414 , and 416 configured to form a gate structure of )" may extend along the Y direction. The gate structure 406 may be disposed along or over a first boundary of the layout design 400 (or cell), and the gate structure 416 along a second boundary of the layout design 400 (or cell). Or it may be disposed on it. The gate structures 406 and 416 may not provide an electrical or conductive path, and may prevent or at least reduce/minimize current leakage across the component between which the gate structures 406 and 416 are positioned. Gate structures 406 and 416 may include dummy polysilicon lines sometimes referred to as PODEs. Each of the remaining gate structures 408 - 414 formed of one or more conductive materials (eg, polysilicon(s), metal(s)) overlay a respective portion of active regions 402 and 404 to form a transistor One of (302-316) can be defined.

For example, the portion of gate structure 408 overlying active region 402 may define a gate of transistor 308 , active region 402 disposed on the left and right sides of gate structure 408 . Portions of may define the source and drain of transistor 308 , respectively. The portion of the gate structure 410 overlying the active region 402 may define a gate of the transistor 304 , and the portion of the active region 402 disposed on the left and right sides of the gate structure 410 is a transistor. The drain and source of 304 may be defined respectively. The portion of the gate structure 412 overlying the active region 402 may define the gate of the transistor 302 , and the portion of the active region 402 disposed on the left and right sides of the gate structure 412 is the transistor. The drain and source of 302 may be defined respectively. The portion of the gate structure 414 overlying the active region 402 may define a gate of the transistor 306 , and the portion of the active region 402 disposed on the left and right sides of the gate structure 414 is a transistor. The source and drain of 306 may be defined respectively. The portion of the gate structure 408 overlying the active region 404 may define a gate of the transistor 312 , and the portion of the active region 404 disposed on the left and right sides of the gate structure 408 is a transistor. The source and drain of 312 may be defined respectively. The portion of the gate structure 410 overlying the active region 404 may define a gate of the transistor 310 , and the portion of the active region 404 disposed on the left and right sides of the gate structure 410 is a transistor. The source and drain of 310 may be defined, respectively. The portion of the gate structure 412 overlying the active region 404 may define a gate of the transistor 314 , and the portion of the active region 404 disposed on the left and right sides of the gate structure 412 is a transistor. The drain and source of 314 may be defined respectively. The portion of the gate structure 414 overlying the active region 404 may define a gate of the transistor 316 , and the portion of the active region 404 disposed on the left and right sides of the gate structure 414 is a transistor. The drain and source of 316 may be defined respectively.

Layout design 400 includes patterns 420 , 422 , 424 , 426 , 428 , 430 , 432 , 434 , and 436 . Hereinafter, “MD 420”, “MD 422”, “MD 424”, “MD 426”, “MD 428”, “MD 430”, “MD 432”” , “MD 434 ,” and “MD 436 .” 434 and 436 may extend along the Y direction. Each of MDs 420 - 436 may electrically couple a source or drain of a corresponding transistor to an interconnect structure through a via interconnect structure.

Layout design 400 includes patterns 440 , 442 , 444 , 446 , 448 , 450 , 452 , 454 , and 456 . The patterns 440 , 442 , 444 , 446 , 448 , 450 , 452 , 454 , and 456 are hereinafter referred to as “VD(440)”, “VD(442)”, “VD(444)”, “VD(446)” )", "VD 448", "VD 450", "VD 452", "VD 454", and "VD 456" via interconnect structures (eg, VDs). It may be configured to form Each of VDs 440 - 456 , except for VD 452 , along a vertical direction (eg, a direction perpendicular to the X and Y directions) to electrically couple the corresponding MD to the interconnect structure. It may extend by each height.

Layout design 400 includes patterns 458 , 460 , 462 , and 464 . Patterns 458 , 460 , 462 , and 464 are via interconnect structures (eg, “VG 458 ,” “VG 460 ,” “VG 462 ,” and “VG 464 )” hereinafter. , VG). Each of VGs 458-464 except for VG 460 is each along a vertical direction (eg, a direction perpendicular to the X and Y directions) to couple a corresponding gate structure to the interconnect structure. It may be extended by the height of In some embodiments, patterns 452 and 460 may partially overlap each other to form a combination of VD and VG, hereinafter “VD+VG 491 ”. In addition, the layout design 400 includes a pattern (hereinafter, "recess 461") to form a dielectric recess structure (hereinafter "recess 461") by filling the recessed upper portion of VD+VG 491 with a dielectric material. and a pattern 461 overlapping respective portions of 452 and 460 .

Layout design 400 includes patterns 470 , 472 , 474 , 476 , and 478 . Over the substrate, interconnect structures hereinafter referred to as “power rail 470 ,” “MO track 472 ,” “MO track 474 ,” “MO track 476 ,” and “power rail 478 ,” respectively, Patterns 470 , 472 , 474 , 476 , and 478 configured to form (eg, an M0 signal track or power rail) may extend along the X direction. In some embodiments, a power rail 470 disposed along or over a third boundary of the layout design (cell) may be configured to carry a first supply voltage (eg, VDD); A power rail 478 disposed along or above the fourth boundary of the layout design (cell) may be configured to carry a second supply voltage (eg, VSS). To connect transistors 302-316 as shown in FIG. 3 , some of the M0 tracks may be “cut” into a plurality of portions by one or more M0 cut patterns. For example, the M0 track 474 may be cut into the M0 track portions 474-1 and 474-2 by a cut pattern 465 (hereinafter “cut M0 465”) and ; The M0 track 476 is formed by the M0 track portion 476-1, by a cut pattern 467 (hereinafter “truncated M0 467”) and a cut pattern 463 (hereinafter “truncated M0 463”). 476-2, and 476-3), respectively. In some embodiments, the cut M0s 463 , 465 , and 467 may be filled or refilled with a dielectric material to electrically isolate the corresponding M0 track portions from each other.

The relationship between layout design 400 ( FIG. 4 ) and circuit 300 ( FIG. 3 ) may be further illustrated through the following discussion. For example, a portion of active region 402 on the right side of gate structure 412 (source of transistor 302 ) and a portion of active region 402 on the left side of gate structure 414 (source of transistor 306 ). ) are both electrically coupled to power rail 470 (VDD) by MD 426 and VD 446 . The portion of active region 404 (drain of transistor 310) on the right side of gate structure 410 and the portion of active region 404 (drain of transistor 314) on the left side of gate structure 412 are MD( 432 ) and VD 454 , electrically coupled to an M0 signal track 474 , which is then disposed in an upper interconnect layer (eg, M1 layer) output ZN ) to an interconnect structure configured to provide A portion of active region 404 (source of transistor 312 ) on the left side of gate structure 408 is electrically coupled to VSS (power rail 478 ) by MD 436 and VD 456 .

Referring to FIG. 5 , a cross-sectional view of a portion of the aforementioned semiconductor device 500 manufactured according to a layout design 400 is depicted, in accordance with some embodiments. It is understood that the semiconductor device 500 shown in FIG. 5 is not a complete semiconductor device that functions as the circuit 300 ( FIG. 3 ). For example, the cross-sectional view of FIG. 5 depicts a portion of a semiconductor device 500 that is fabricated according to a portion 400 ′ of a layout design. As shown in FIG. 5 , gate structures 410 , 412 , and 414 are over active region 404 to form a gate of transistor 310 , a gate of transistor 314 , and a gate of transistor 316 , respectively. a source of transistor 310 (hereinafter, “source/drain region 502”), a drain of transistor 310 and a drain of transistor 314 (hereinafter “source/drain region 504”); and A source of transistor 314 and a drain of transistor 316 (hereinafter, “source/drain region 506 ”) are formed in active region 404 . Corresponding to layout design 400' of FIG. 4 , MD 434 coupled to source/drain region 502 is disposed on the left side of gate structure 410 . MD 434 may be vertically aligned with truncated M0 467 . Gate structure 410 is coupled to M0 track portion 476 - 2 through VG 462 . MD 432 coupled to source/drain region 504 is disposed on the right side of gate structure 410 but not coupled to M0 track portion 476-2. Gate structure 412 is connected to M0 track portion 476-3 via a combination of VG 460 and VD 452 (VD+VG 491), recess 461 having VD+VG 491 ) to fill the upper part of the combination. In some embodiments, at least a portion of the recess 461 is vertically aligned with the cut M0 463 (filled with dielectric material) and the gate structure 412 . As such, gate structure 412 can be electrically coupled to M0 track portion 476-3 while being electrically isolated from one or more other M0 track portions (eg, 476-2). In addition, VD+VG 491 is electrically isolated from source/drain regions 506 by dielectric features 508 .

By recessing VD+VG 491 , the connection point of gate structure 412 is laterally from approximately where gate structure 412 is formed to approximately where source/drain regions 506 are formed. can be shifted. The truncated M0 463 may thus shift from approximately where the MD 432 is formed to approximately where the gate structure 412 is formed. As such, the lateral width "W" of the M0 track portion 476-2 will not be compressed. In some embodiments, the width W may be maintained at least 1.5 times the distance “D” between adjacent ones of the gate structures (eg, between 410 and 412).

Referring back to FIG. 4 , layout design 400 includes patterns 481 , 483 , 485 , 487 , and 489 . Patterns 481, 483, 485, 487, and 489 are above each M0 track, below, respectively, "VIA0(481)", "VIA0(483)", "VIA0(485)", "VIA0(487)" “, and “VIA0 489 ” may be configured to form a via interconnect structure (eg, VIAO). Each of VIAOs 481-489 may be configured in a vertical direction (eg, X direction) to electrically couple a corresponding M0 track to an interconnect structure in the next upper interconnect layer (eg, M1 layer). and a direction perpendicular to the Y direction).

Layout design 400 includes patterns 480 , 482 , 484 , 486 , and 488 . Patterns 480, 482, 484, 486, and 488 are hereinafter referred to as “M1 track 480”, “M1 track 482”, “M1 track 484”, and “M1 track 486”, respectively. and an interconnect structure (eg, M1 track) that is “M1 track 488 ” in the next upper interconnect layer M1 . Each of M1 tracks 480 - 488 may be configured to receive one of inputs A1 , A2 , B1 , and B2 ( FIG. 3 ), or to provide an output ZN ( FIG. 3 ). For example, M1 track 480 is configured to receive input B2. From M1 track 480 , via VIA0 481 , also via M0 track 474 , and then via VG 458 , input B2 is connected to the gate structure 414 (the gates of transistors 306 and 316 ). ) can be coupled to In another example, M1 track 482 is configured to receive input B1. From M1 track 482 , also via M0 track 476 , and then via VD+VG 491 , input B1 is to be coupled to gate structure 412 (the gates of transistors 302 and 314 ). can

6A and 6B , exemplary layout designs 600A and 600B of a standard cell are depicted, respectively, in accordance with some embodiments. Layout designs 600A and 600B may be used to fabricate at least a portion of a semiconductor device that functions as circuit 300 of FIG. 3 (eg, 700 of FIG. 7 ). By employing the recessed interconnect structures disclosed herein, the dimensions (e.g., area) of the layout designs 600A and 600B (or standard cells) are not affected by the routing issues identified above, can be reduced For example, the cell width of a standard cell may be reduced proportionally to a relatively small number of gate structures (eg, no more than 5 gate structure spaces), and the cell height of a standard cell has a relatively small number of signal tracks. (eg, no more than 3 M0 interconnect structure spaces) may be reduced proportionally.

A semiconductor device corresponding to layout designs 600A and 600B includes, along a first level of an active region, each active feature of transistors 302-308 having a first conductivity type, and a second level of the active region, respectively. may be fabricated based on forming each active feature of transistors 310 - 316 , having a second conductivity type. The first level and the second level may be aligned perpendicular to each other. A structure/configuration for placing transistors of different conduction types in two vertically aligned levels is sometimes referred to as a complementary field effect transistor (CFET) configuration. In some embodiments, the power rails of such CFETs are disposed above an upper level in which one of the transistors of the first or second conductivity type is formed or below a lower level in which the other of the transistors of the first or second conduction type is formed. can be When placing the power rails below the lower level, the CFET is commonly referred to as a CFET with buried power. By embedding the power rails, the area (eg, cell height) of the corresponding cell can be further reduced, for example, by approximately 30-40%. Semiconductor device 700 provides an example of such a CFET with buried power, as shown in FIG. 7 .

7 provides a perspective view of a semiconductor device 700 fabricated based on layout designs 600A and 600B, in accordance with some embodiments. Accordingly, layout designs 600A and 600B will be discussed in conjunction with FIG. 7 . The semiconductor device 700 of FIG. 7 is simplified for purposes of illustration, and thus, it is understood that some of the features/regions/structures included in the layout designs 600A and 600B may not be shown in FIG. 7 .

In FIG. 6A , layout design 600A includes pattern 604 . At a lower level, a pattern 604 configured to form an active region over the substrate, hereinafter "active region 604 ," may extend along the X-direction. Active region 604 may be characterized as a first conductivity type. For example, active region 604 includes an n-type doped region. Active region 604 may form transistors 310 - 316 in various configurations, such as, for example, FinFETs, nanosheet transistors, and the like.

Layout design 600A includes patterns 612 , 614 , 616 , 618 , 620 , and 622 . At a lower level, hereinafter, “gate structure 612”, “gate structure 614”, “gate structure 616”, “gate structure 618”, “gate structure 620”, and “gate structure 614”, respectively The patterns 612 , 614 , 616 , 618 , 620 , and 622 configured to form a gate structure that are "gate structure 622 ," may extend along the Y direction. Gate structure 612 may be disposed along or over a first boundary of layout design 600A (or cell), and gate structure 622 along a second boundary of layout design 600A (or cell). Or it may be disposed on it. Gate structures 612 and 622 may not provide an electrical or conductive path, and may prevent or at least reduce/minimize current leakage across the component between which gate structures 612 and 622 are positioned. Gate structures 612 and 622 may include dummy polysilicon lines sometimes referred to as PODEs. Each of the remaining gate structures 614-620 formed of one or more conductive materials (eg, polysilicon(s), metal(s)) overlays a respective portion of the active region 604 to form the transistor 310 . -316) can be defined.

For example, the portion of gate structure 614 overlying active region 604 may define the gate of transistor 316 , active region 604 disposed on the left and right sides of gate structure 614 . Portions of may define the source and drain of transistor 316, respectively. The portion of the gate structure 616 overlying the active region 604 may define the gate of the transistor 314 , and the portion of the active region 604 disposed on the left and right sides of the gate structure 616 is the transistor. The source and drain of 314 may be defined respectively. The portion of the gate structure 618 overlying the active region 604 may define the gate of the transistor 310 , and the portion of the active region 604 disposed on the left and right sides of the gate structure 618 is the transistor. A drain and a source of 310 may be defined, respectively. The portion of the gate structure 620 that overlays the active region 604 may define a gate of the transistor 312 , and the portion of the active region 604 disposed on the left and right sides of the gate structure 620 is a transistor. The source and drain of 312 may be defined respectively.

Layout design 600A includes patterns 601 and 603 . On the substrate, patterns 601 and 603 configured to form power rails hereinafter referred to as “power rails 601” and “power rails 603”, respectively, may extend along the X-direction. In some embodiments, a power rail 601 disposed along a third boundary of the layout design (cell) may be configured to carry a first supply voltage (eg, VDD); A power rail 603 disposed along a fourth boundary of the layout design (cell) may be configured to carry a second supply voltage (eg, VSS). In some embodiments, power rails 601 and 603 may be disposed below active area 604 .

Layout design 600A includes patterns 624 , 626 , 628 , 630 , and 632 . At a lower level, source/drain interconnect structures (e.g., "MD 624", "MD 626", "MD 628", "MD 630", and "MD 632" hereinafter) For example, patterns 624 , 626 , 628 , 630 , and 632 configured to form MD may extend along the Y direction. Each of MDs 624 , 628 , and 632 may electrically couple a source or drain of a corresponding transistor to an interconnect structure through a via interconnect structure.

Layout design 600A includes patterns 634 , 636 , 638 , and 640 . Patterns 634 , 636 , 638 , and 640 are hereinafter referred to as "VD 634", "VD 636", "VD 638", and "VD 640" via interconnect structures (eg, For example, it may be configured to form VD). Each of the VDs 634-640 has a respective one along a vertical direction (eg, a direction perpendicular to the X and Y directions) to electrically couple a corresponding MD to an interconnect structure, or power rail. It may be extended by the height. For example, in the perspective view of FIG. 7 , VD 634 is (eg, along the Z direction) to electrically couple MD 624 to power rail 603 (not shown in FIG. 7 ). may extend vertically; VD 638 is configured to electrically couple power rail 601 (not shown in FIG. 7 ) to an interconnect structure at an upper level (eg, MD 662 ) (eg, in the Z direction). along) may extend vertically; VD 636 may extend vertically (eg, along the Z direction) to electrically couple MD 632 to power rail 603 (not shown in FIG. 7 ).

In FIG. 6B , the layout design 600B includes a pattern 644 . At a lower level, a pattern 644 configured to form an active region over the substrate, hereinafter referred to as “active region 644 ,” may extend along the X direction. Active region 644 may be characterized as a second conductivity type. For example, active region 644 includes a p-type doped region. Active region 644 may form transistors 302-308 in various configurations, such as, for example, FinFETs, nanosheet transistors, and the like.

Layout design 600B includes patterns 646 , 648 , 650 , 652 , 654 , and 656 . At a higher level, hereinafter, “gate structure 646”, “gate structure 648”, “gate structure 650”, “gate structure 652”, “gate structure 654”, and “gate structure 654”, respectively The patterns 646 , 648 , 650 , 652 , 654 , and 656 configured to form a gate structure that are “gate structure 656 ” may extend along the Y direction. In some embodiments, gate structures 646 , 648 , 650 , 652 , 654 , and 656 are, respectively, with gate structures 612 , 614 , 616 , 618 , 620 , and 622 , as illustrated in FIG. 7 . may be vertically aligned (and/or electrically coupled to). In some embodiments, gate structures 646 , 648 , 650 , 652 , 654 , and 656 may be integrally incorporated with gate structures 612 , 614 , 616 , 618 , 620 , and 622 , respectively. Accordingly, gate structures 646 and 656 may be formed as PODEs. Each of the remaining gate structures 648 - 654 formed of one or more conductive materials (eg, polysilicon(s), metal(s)) overlay a respective portion of the active region 644 to thereby overlay the transistor 302 - 308) can be defined.

For example, the portion of gate structure 648 overlying active region 644 may define a gate of transistor 306 , and active region 644 disposed on the left and right sides of gate structure 648 . ) may define the drain and source of transistor 306 , respectively. The portion of the gate structure 650 that overlays the active region 644 may define the gate of the transistor 302 , and the portion of the active region 644 disposed on the left and right sides of the gate structure 650 is a transistor. The source and drain of 314 may be defined respectively. The portion of the gate structure 652 overlying the active region 644 may define the gate of the transistor 304 , and the portion of the active region 644 disposed on the left and right sides of the gate structure 652 is the transistor. The source and drain of 304 may be defined respectively. The portion of the gate structure 654 overlaying the active region 644 may define a gate of the transistor 308 , and the portion of the active region 644 disposed on the left and right sides of the gate structure 654 is the transistor. The drain and source of 308 may be defined respectively.

Layout design 600B includes patterns 660 , 662 , 664 , 666 , and 668 . At a lower level, source/drain interconnect structures (eg, "MD 660", "MD 662", "MD 664", "MD 666", and "MD 668" hereinafter) For example, patterns 660 , 662 , 664 , 666 , and 668 configured to form MD may extend along the Y direction. Each of MDs 660 , 662 , 664 , 666 , and 668 may electrically couple a source or drain of a corresponding transistor to an interconnect structure through a via interconnect structure.

Layout design 600B includes patterns 670 , 672 , 674 , 676 , and 678 . Patterns 670 , 672 , 674 , 676 , and 678 are hereinafter referred to as "VD 670", "VD 672", "VD 674", "VD 676", and "VD 678". )" may be configured to form a via interconnect structure (eg, VD). Each of the VDs 670-678 except for VD 672 is along a vertical direction (eg, a direction perpendicular to the X and Y directions) to electrically couple the corresponding MD to the interconnect structure. It may extend by each height.

Layout design 600B includes patterns 680 , 682 , 684 , and 686 . Patterns 680 , 682 , 684 , and 686 are via interconnect structures (eg, “VG 680 ,” “VG 682 ,” “VG 684 ,” and “VG 686 ,” hereinafter) For example, it may be configured to form VG). Each of VGs 680-686, except for VG 682, is respectively along a vertical direction (eg, a direction perpendicular to the X and Y directions) to couple a corresponding gate structure to the interconnect structure. It may be extended by the height of In some embodiments, patterns 672 and 682 may partially overlap one another to form a combination of VD and VG, hereinafter “VD+VG 691 ”. Furthermore, the layout design 600B includes a pattern (hereinafter, "recess 683") to form a dielectric recess structure (hereinafter "recess 683") by filling the recessed upper portion of VD+VG 691 with a dielectric material. pattern 683 overlapping each portion of 672 and 682 .

Layout design 600B includes patterns 6888 , 689 , and 690 . to form an interconnect structure (eg, M0 signal track) over active region 644 , which is hereinafter “M0 track 688 ,” “M0 track 689 ,” and “M0 track 690 ,” respectively. The configured patterns 6888 , 689 , and 690 may extend along the X direction. To connect transistors 302-316 as shown in FIG. 3 , some of the M0 tracks may be “cut” into a plurality of portions by one or more M0 cut patterns. For example, the M0 track 688 may be cut into the M0 track portions 688-1 and 688-2 by a cut pattern 693 (hereinafter “cut M0 693”); M0 track 690 includes the same truncated M0 693; and M0 track portions 690-1, 690-2, and 690-3, respectively, by a cut pattern 463 (hereinafter “cut M0 463”). In some embodiments, the cut M0 693 and 694 may be filled or refilled with a dielectric material to electrically isolate the corresponding M0 track portions from each other.

The relationship between the layout designs 600A and 600B ( FIGS. 6A and 6B ) and the circuit 300 ( FIG. 3 ) can be further illustrated through discussion of the semiconductor device 700 of FIG. 7 , as follows. . For example, gate structure 650 (the gate of transistor 302 ) is electrically coupled to M0 track portion 690 - 1 via VD+VG 691 . Gate structure 652 (the gate of transistor 304 ) is electrically coupled to M0 track portion 690 - 2 via VG 684 . As yet another representative example, gate structure 654 (gate of transistor 308 ) is electrically coupled to M0 track portion 690 - 3 via VG 686 . Gate structure 648 (the gate of transistor 306 ) is electrically coupled to M0 track portion 688 - 1 via VG 680 . The portion of active region 644 on the right side of gate structure 652 (drain of transistor 304) and the portion of active region 644 on the left side of gate structure 654 (drain of transistor 308) are MD( 666 ) and VD 676 , electrically coupled to M0 track portion 688 - 2 . The portion of active region 604 (drain of transistor 314) on the right side of gate structure 616 and the portion of active region 604 (drain of transistor 310) on the left side of gate structure 618 are MD( 628) and via VD 640 electrically coupled to M0 track portion 688-2.

In some embodiments, by recessing VD+VG 691 , the connection point of gate structure 650 is approximately (on the left side of gate structure 302 ) from approximately from where gate structure 650 is formed. The source of transistor 302 may be shifted laterally to where it is formed. The truncated M0 693 may thus shift from approximately where MD 662 is formed to approximately where gate structure 650 is formed. As such, the lateral width of the M0 track portion 690 - 2 will not be compressed and may be characterized as a sufficiently large landing width (eg, at least 1.5 times the distance between adjacent ones of the gate structures). .

Referring again to FIG. 6B , layout design 600B includes patterns 671 , 673 , 675 , 677 , and 679 . Patterns 671, 673, 675, 677, and 679 are above each M0 track, below, respectively, "VIA0(671)", "VIA0(673)", "VIA0(675)", "VIA0(677)" “, and “VIA0 679” may be configured to form a via interconnect structure (eg, VIAO). Each of VIAOs 671 , 673 , 675 , 677 , and 679 is vertically oriented to electrically couple a corresponding M0 track to an interconnect structure in the next upper interconnect layer (eg, layer M1 ). (eg, a direction perpendicular to the X-direction and the Y-direction) may extend by respective heights.

Layout design 600B includes patterns 681 , 683 , 685 , 687 , and 689 . Patterns 681, 683, 685, 687, and 689 are hereinafter referred to as "M1 track 681", "M1 track 683", "M1 track 685", and "M1 track 687", respectively. and an interconnect structure (eg, M1 track) that is “M1 track 689 ” in the next upper interconnect layer M1 . Each of M1 tracks 681 , 683 , 685 , 687 , and 689 may be configured to receive one of the inputs A1 , A2 , B1 , and B2 ( FIG. 3 ), or to provide an output ZN ( FIG. 3 ). . For example, M1 track 683 is configured to receive input B2. From M1 track 683 , via VIAO 673 , also via M0 track 688 , and then via VG 680 , input B2 is connected to a gate structure 648 (the gate of transistor 306 ) and may be coupled to a gate structure 614 (the gate of the transistor 316 ). In another example, M1 track 681 is configured to receive input B1. From M1 track 681 and via VD+VG 691 , input B1 is to be coupled to gate structure 650 (gate of transistor 302 ) and gate structure 616 (gate of transistor 314 ). can

8 is a flowchart of a method 800 of forming or fabricating a semiconductor device, in accordance with some embodiments. It is understood that additional operations may be performed before, during, and/or after the method 800 depicted in FIG. 8 . In some embodiments, method 800 may be used to form a semiconductor device, according to various layout designs as disclosed herein.

In operation 810 of method 800 , a layout design of a semiconductor device is generated. Operation 810 is performed by a processing device (eg, processor 902 ( FIG. 9 )) configured to execute instructions for generating the layout design. In one approach, the layout design is created by placing the layout design of one or more standard cells through a user interface. In one approach, the layout design is automatically generated by a processor executing a synthesis tool that converts a logic design (eg, Verilog) into a corresponding layout design. In some embodiments, the layout design is rendered in a graphical database system (GDSII) file format.

In an operation 820 of the method 800 , a semiconductor device is fabricated based on the layout design. In some embodiments, operation 820 of method 800 includes manufacturing at least one mask based on the layout design, and manufacturing a semiconductor device based on the at least one mask. A number of exemplary manufacturing operations of operation 820 will be discussed in connection with the method 1100 of FIG. 11 below.

9 is a schematic diagram of a system 900 for designing and manufacturing an IC layout design, in accordance with some embodiments. System 900 creates or deploys one or more IC layout designs described herein. In some embodiments, system 900 fabricates one or more semiconductor devices based on one or more IC layout designs described herein. System 900 includes hardware processor 902 and computer program code 906 , eg, non-transitory computer readable storage that encodes, eg, stores, a set of executable instructions. medium 904 . The computer-readable storage medium 904 is configured to interface with a manufacturing machine for producing a semiconductor device. The processor 902 is electrically coupled to the computer readable storage medium 904 via a bus 908 . The processor 902 is also electrically coupled to the I/O interface 910 by a bus 908 . Network interface 912 is also electrically coupled to processor 902 by bus 908 . Network interface 912 is coupled to network 914 such that processor 902 and computer-readable storage medium 904 are connectable to external elements via network 914 . The processor 902 provides computer program code 906 encoded in the computer-readable storage medium 904 to enable the system 900 to perform some or all of the operations described in the method 800 . ) is configured to run

In some embodiments, processor 902 is a central processing unit (CPU), multiple processors, distributed processing system, application specific integrated circuit (ASIC), and/or suitable processing unit.

In some embodiments, computer-readable storage medium 904 is an electronic, magnetic, optical, electromagnetic, infrared, and/or semiconductor system (or apparatus or device). For example, computer readable storage medium 904 may include semiconductor or solid state memory, magnetic tape, removable computer diskette, random access memory (RAM), read-only memory (ROM), rigid magnetic disks, and/or optical disks. In some embodiments using optical disks, the computer readable storage medium 904 is a compact disk-read only memory (CD-ROM), compact disk-read/write; CD-R/W), and/or digital video disc (DVD).

In some embodiments, storage medium 904 stores computer program code 906 configured to cause system 900 to perform method 800 . In some embodiments, storage medium 904 may also include information required to perform method 800 as well as information generated during performance of method 800 , such as layout design 916 , user interface 918 , manufacturing Stores an executable set of instructions for performing the operations of unit 920 , and/or method 800 .

In some embodiments, storage medium 904 stores instructions (eg, computer program code 906 ) for interfacing with a manufacturing machine. The instructions (eg, computer program code 906 ) enable the processor 902 to generate manufacturing instructions readable by a manufacturing machine to effectively implement the method 800 during a manufacturing process.

System 900 includes I/O interface 910 . I/O interface 910 is coupled to external circuitry. In some embodiments, I/O interface 910 includes a keyboard, keypad, mouse, trackball, trackpad, and/or cursor direction keys for passing information and commands to processor 902 .

System 900 also includes a network interface 912 coupled to processor 902 . Network interface 912 allows system 900 to communicate with a network 914 to which one or more other computer systems are connected. The network interface 912 may include a wireless network interface such as Bluetooth (BLUETOOTH), Wi-Fi (WIFI), WiMAX, GPRS, or WCDMA; or Ethernet (ETHERNET), USB or wired network interfaces such as IEEE-13154. In some embodiments, method 800 is implemented in two or more systems 900 , and information such as layout design, user interfaces, and manufacturing units are exchanged between different systems 900 by network 914 .

System 900 is configured to receive information related to layout design via I/O interface 910 or network interface 912 . Information is sent by bus 908 to processor 902 to determine a layout design for creating the IC. The layout design is then stored on computer readable medium 904 as layout design 916 . System 900 is configured to receive information related to a user interface via I/O interface 910 or network interface 912 . Information is stored in computer readable medium 904 as user interface 918 . System 900 is configured to receive information related to a manufacturing unit via I/O interface 910 or network interface 912 . The information is stored in the computer readable medium 904 as the manufacturing unit 920 . In some embodiments, manufacturing unit 920 includes manufacturing information utilized by system 900 .

In some embodiments, method 800 is implemented as a standalone software application for execution by a processor. In some embodiments, method 800 is implemented as a software application that is part of an additional software application. In some embodiments, method 800 is implemented as a plug-in to a software application. In some embodiments, method 800 is implemented as a software application that is part of an EDA tool. In some embodiments, method 800 is implemented as a software application used by an EDA tool. In some embodiments, the EDA tool is used to create a layout design of an integrated circuit device. In some embodiments, the layout design is stored on a non-transitory computer-readable medium. In some embodiments, the layout design is created using a tool such as VIRTUOSO® available from CADENCE DESIGN SYSTEMS, Inc., or other suitable layout creation tool. In some embodiments, the layout design is generated based on a netlist that is generated based on the schematic design. In some embodiments, method 800 is implemented by a manufacturing device to fabricate an integrated circuit using a set of masks that are fabricated based on one or more layout designs generated by system 900 . In some embodiments, system 900 includes a fabrication device (eg, fabrication tool 922 ) for fabricating an integrated circuit using a set of masks fabricated based on one or more layout designs of the present disclosure. . In some embodiments, the system 900 of FIG. 9 produces a layout design of an IC that is smaller than other approaches. In some embodiments, the system 900 of FIG. 9 creates a layout design of a semiconductor device that occupies less area than other approaches.

10 is a block diagram of an integrated circuit (IC)/semiconductor device manufacturing system 1000 , and an associated IC manufacturing flow, in accordance with at least one embodiment of the present disclosure.

In FIG. 10 , an IC manufacturing system 1000 includes a design house 1020 , a mask house 1030 , interacting with each other in design, development, and manufacturing cycles and/or services related to manufacturing an IC device 1700 . ), and entities such as IC manufacturers/fabricators (“fabs”) 1040 . Entities within system 1000 are connected by a communication network. In some embodiments, the communication network is a single network. In some embodiments, the communication network is several different networks, such as an intranet and the Internet. Communication networks include wired and/or wireless communication channels. Each entity interacts with, provides services to, and/or receives services from, one or more of the other entities. In some embodiments, two or more of the design house 1020 , the mask house 1030 , and the IC fab 1040 are owned by a single company. In some embodiments, two or more of the design house 1020 , the mask house 1030 , and the IC fab 1040 coexist in a common facility and use common resources.

A design house (or design team) 1020 creates an IC design layout 1022 . IC design layout 1022 includes various geometric patterns designed for IC device 1060 . The geometric pattern corresponds to the pattern of the metal, oxide, or semiconductor layers that make up the various components of the IC device 1060 to be fabricated. The various layers are combined to form various IC features. For example, some of the IC design layout 1022 may include various IC features, such as active regions to be formed on a semiconductor substrate (eg, a silicon wafer), gate electrodes, source and drain electrodes, metal lines of interlayer interconnections. or via contacts, and openings for bonding pads, and various material layers disposed on the semiconductor substrate. The design house 1020 implements appropriate design procedures for forming the IC design layout 1022 . Design procedures include one or more of logic design, physical design, or place and route. The IC design layout 1022 is presented in one or more data files containing geometrical pattern information. For example, the IC design layout 1022 may be expressed in a GDSII file format or a DFII file format.

Mask house 1030 includes data preparation 1032 and mask preparation 1034 . The mask house 1030 uses the IC design layout 1022 to fabricate one or more masks that will be used to fabricate the various layers of the IC device 1060 according to the IC design layout 1022 . The mask house 1030 performs mask data preparation 1032 , in which case the IC design layout 1022 is converted into a representative data file (“RDF”). Mask data preparation 1032 provides RDF to mask fabrication 1034 . Mask fabrication 1034 includes a mask writer. A mask exposure machine converts the RDF into an image on a substrate such as a mask (reticle) or semiconductor wafer. The design layout is manipulated by the mask data preparation 1032 to conform to the specific characteristics of the mask exposure machine and/or the requirements of the IC fab 1040 . In FIG. 10 , mask data preparation 1032 and mask manufacturing 1034 are illustrated as separate elements. In some embodiments, mask data preparation 1032 and mask preparation 1034 may be collectively referred to as mask data preparation.

In some embodiments, mask data preparation 1032 employs optical proximity correction (OPC) using lithography enhancement techniques to compensate for image errors such as may arise from diffraction, interference, other process effects, and the like. includes The OPC coordinates the IC design layout 1022 . In some embodiments, mask data preparation 1032 may be combined with off-axis illumination, sub-resolution assist features, phase shifting masks, other suitable techniques, and the like, or combinations thereof. such as additional resolution enhancement techniques (RET). In some embodiments, inverse lithography technology (ILT) is also used, which treats OPC as an inverse imaging problem.

In some embodiments, mask data preparation 1032 provides mask generation rules that include certain geometric and/or connectivity constraints, to ensure sufficient margins, to account for variability in the semiconductor manufacturing process, and the like, and the like. and a mask rule checker (MRC) that checks the IC design layout that has gone through the OPC process with a set of . In some embodiments, the MRC modifies the IC design layout to compensate for limitations during mask fabrication 1034 , which may undo some of the modifications performed by the OPC to meet the mask generation rules.

In some embodiments, mask data preparation 1032 includes lithography process checking (LPC) that simulates processing to be implemented by IC fab 1040 to fabricate IC device 1060 . The LPC simulates this processing based on the IC design layout 1022 to create a simulated manufactured device, such as the IC device 1060 . The processing parameters in the LPC simulation may include parameters related to various processes of the IC manufacturing cycle, parameters related to the tools used to manufacture the IC, and/or other aspects of the manufacturing process. LPC can be combined with aerial image contrast, depth of focus (“DOF”), mask error enhancement factor (“MEEF”), other suitable factors, and the like or combinations thereof. Consider a variety of factors such as In some embodiments, after a simulated manufacturing device is created by LPC, if the simulated device is not close enough in shape to satisfy a design rule, OPC and/or MRC are repeated to construct the IC design layout 1022 . It can be further refined.

It should be understood that the above description of mask data preparation 1032 has been simplified for purposes of clarity. In some embodiments, mask data preparation 1032 includes additional features, such as logic operations (LOPs) to modify the IC design layout according to manufacturing rules. Additionally, the processes applied to the IC design layout 1022 during mask data preparation 1032 may be executed in several different orders.

After mask data preparation 1032 and during mask fabrication 1034, a mask or group of masks is fabricated based on the modified IC design layout. In some embodiments, a mechanism of an electron-beam (e-beam) or multiple e-beams is used to form a pattern on a mask (photomask or reticle) based on a modified IC design layout. The mask can be formed in a variety of techniques. In some embodiments, the mask is formed using binary techniques. In some embodiments, the mask pattern includes opaque regions and transparent regions. A beam of radiation, such as an ultraviolet (UV) beam, used to expose a layer of image sensitive material (eg, photoresist) coated on the wafer is blocked by the opaque region and transmitted through the transparent region. In one example, a binary mask includes a transparent substrate (eg, molten quartz) and an opaque material (eg, chromium) that is coated on an opaque region of the mask. In another example, the mask is formed using a phase shift technique. In a phase shift mask (PSM), various features of a pattern formed on the mask are configured to have an appropriate phase difference to improve resolution and imaging quality. In various examples, the phase shift mask may be an attenuated PSM or an alternating PSM. The mask(s) created by mask fabrication 1734 are used in various processes. For example, such mask(s) are used in an ion implantation process to form various doped regions in a semiconductor wafer, in an etch process to form various etch regions in a semiconductor wafer, and/or in other suitable processes.

IC fab 1040 is an IC manufacturing entity that includes one or more manufacturing facilities for the manufacture of several different IC products. In some embodiments, the IC fab 1040 is a semiconductor foundry. For example, there may be a manufacturing facility for front-end manufacturing (line front-end (FEOL) manufacturing) of a plurality of IC products, while a second manufacturing facility may have a back-end manufacturing (back-end) manufacturing facility for wiring and packaging of IC products. of Line (BEOL) manufacturing), or a third-party manufacturing facility may provide other services for the foundry entity.

IC fab 1040 uses a mask (or mask) manufactured by mask house 1030 to fabricate IC device 1060 . Accordingly, the IC fab 1040 uses, at least indirectly, the IC design layout 1022 to fabricate the IC device 1060 . In some embodiments, semiconductor wafer 1042 is fabricated by IC fab 1040 using a mask (or mask) to form IC device 1060 . The semiconductor wafer 1042 includes a silicon substrate or other suitable substrate on which a layer of material is formed. The semiconductor wafer further includes one or more of various doped regions, dielectric features, multi-level interconnects, and the like (formed in subsequent fabrication steps).

System 1000 is shown having a design house 1020 , a mask house 1030 , or an IC fab 1040 as separate components or entities. However, it is understood that one or more of design house 1020 , mask house 1030 , or IC fab 1040 are part of the same component or entity.

11 is a flowchart illustrating a method 1100 for manufacturing a semiconductor device 1200 in accordance with various aspects of the present disclosure. Method 1100 may be part of operation 820 of method 800 of FIG. 8 , as noted above. As such, the semiconductor device 1200 may be made based on at least a portion of the design layout disclosed herein. For example, the layout design 400 ′ of FIG. 4 may be used to fabricate the semiconductor device 1200 . Accordingly, semiconductor device 500 of FIG. 5 may share some substantially similar features/structures with semiconductor device 1200 .

12A, 12B, 12C, 12D, 12E, 12F, 12G, 12H, 12I, 12J, 12K, 12L, and 12M are implementations of the method 1100 of FIG. It shows a schematic cross-sectional view of a semiconductor device 1200 at various stages of manufacture according to form. Accordingly, each of the operations of the method 1100 will be discussed in connection with a corresponding one of the cross-sectional views of the semiconductor device 1200 shown in FIGS. 12A-12M .

The semiconductor device 1200 may be included in a microprocessor, memory cell, and/or other integrated circuit (IC). Note that the method of FIG. 11 does not produce a finished semiconductor device 1200 . The completed semiconductor device 1200 may be fabricated using complementary metal-oxide-semiconductor (CMOS) technology processing. Accordingly, it is understood that additional operations may be provided before, during, and after the method 1100 of FIG. 11 , and that some other operations may only be briefly described herein. Also, FIGS. 12A-12M are simplified for better understanding of the present disclosure. For example, although the figures illustrate semiconductor device 1200 , it is understood that semiconductor device 1200 may include many other devices including transistors, resistors, capacitors, inductors, fuses, and the like.

11 and 12A , the method 1100 includes an operation 1102 in which at least a first transistor 1204 - 1 and a second transistor 1204 - 2 are formed over a substrate 1202 , in accordance with some embodiments. ) starts at Substrate 1202 may include a crystalline silicon substrate (eg, a wafer). In some other embodiments, the substrate 1202 may include any other suitable elemental semiconductor, such as diamond or germanium; suitable compound semiconductors such as gallium arsenide, silicon carbide, indium arsenide, or indium phosphide; Alternatively, it may be made of a suitable alloy semiconductor such as silicon germanium carbide, gallium arsenic phosphide, or gallium indium phosphide. In addition, the substrate 1202 may include an epitaxial layer (epi-layer), it may be deformed to enhance performance, and/or a silicon-on-insulator (SOI) structure. may include.

Each of the transistors 1204 - 1 and 1204 - 2 may include one or more respective features/structures formed over and/or in the substrate 1202 . For example, the transistor 1204-1 includes a gate structure 1206-1, a gate sacrificial layer 1208-1 overlying the gate structure 1206-1, a gate structure 1206-1, and a gate sacrificial layer ( A gate spacer 1210-1 having two portions each disposed along sidewalls of 1208-1, a first source/drain structure (or region) 1212-1, and a second source/drain structure (or region) ) (1214-1); The transistor 1204-2 includes a gate structure 1206-2, a gate sacrificial layer 1208-2 overlying the gate structure 1206-2, a gate structure 1206-2, and a gate sacrificial layer 1208-2. a gate spacer having two portions 1210 - 2 each disposed along sidewalls of a first source/drain structure (or region) 1212-2, and a second source/drain structure (or region) 1214 - 2) is included. In some embodiments, source/drain structures 1214 - 1 of transistor 1204 - 1 and source/drain structures 1212 - 2 of transistor 1204 - 2 may be formed in the same region (eg, , may be merged with each other). Each of the transistors 1204 - 1 and 1204 - 2 is formed as a planar MOSFET in the illustrated embodiment of FIG. 12A (and subsequent figures). That is, each active region (eg, source/drain structures, conduction channels) of transistors 1204 - 1 and 1204 - 2 is formed by recessing from the upper boundary of substrate 1202 . However, it is understood that each of transistors 1204 - 1 and 1204 - 2 may be formed as any of a variety of other transistor configurations (eg, CFETs, FinFETs, nanosheet transistors) while remaining within the scope of the present disclosure. .

Each of the gate sacrificial layers 1208-1 and 1208-2 uses, for example, low-pressure chemical vapor deposition (LPCVD) or plasma enhanced chemical vapor deposition (PECVD). Thus, it is formed of silicon nitride, polysilicon, silicon oxide, etc., or a combination thereof. Each of the gate sacrificial layers 1208-1 and 1208-2 is used as a hard mask (sometimes referred to as a hardmask layer) during a subsequent photolithography process. Gate sacrificial layers 1208 - 1 and 1208 - 2 may later be replaced by respective interconnect structures (eg, portions of VG, VD+VG) discussed below. Gate spacers 1210 - 1 and 1210 - 2 may include silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), or other suitable material. Each of the gate spacers 1210 - 1 and 1210 - 2 may include a single layer or a multilayer structure. In some embodiments, the gate spacer 1210-1 is formed by depositing a blanket layer of the gate spacer 1210-1 by CVD, PVD, ALD, or other suitable technique, and relative to the blanket layer. An anisotropic etching process is performed to perform an anisotropic etching process, so that the gate spacers each follow the sidewalls of the gate structure 1206 - 1 (and the gate sacrificial layer 1208 - 1 ), as shown in the illustrated embodiment of FIG. 12A . It may be formed by forming a pair of (1210-1). The gate spacers 1210 - 2 may be formed by a similar process, as discussed above.

In some embodiments, subsequent to forming transistors 1204 - 1 and 1204 - 2 , at least some of the structures of transistors 1204 - 1 and 1204 - 2 are separated from respective isolation structures (eg, shallow trench isolation). overlaid (or embedded) by a shallow trench isolation (STI) structure. For example, source/drain structures 1212-1, 1214-1/1212-2, and 1214-2 may be overlaid by isolation structures 1212-1, 1212-2, and 1212-3, respectively. have. Such an isolation structure may include a dielectric material selected from at least one of: silicon oxide, a low dielectric constant (low-k) material, or a combination thereof. The low dielectric constant material is fluorinated silica glass (FSG), phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), carbon doped silicon oxide (SiO _x C _y ) , Black Diamond® (Applied Materials, Santa Clara, CA), Xerogel, Aerogel, amorphous fluorinated carbon, Parylene, bis-benzocyclobutenes (BCB), SiLK (Dow Chemical, Midland, MI), polyimides, and/or other future developments It may also include a low-k dielectric material.

11 and 12B , method 1100 proceeds to operation 1104 where MDs 1214 - 1 and 1214 - 2 are formed, in accordance with some embodiments. The MD in contact with the formed source/drain structure is generally configured to electrically couple the source/drain structure to an interconnect structure (eg, M0 track, or M0 track portion). For example, MD 1214 - 1 contacts source/drain structure 1212-1 to electrically couple source/drain structure 1212-1 to a corresponding M0 track portion, as will be shown below. will be. Similarly, MD 1214-2 contacts source/drain structures 1212-2/1214-1 to electrically couple source/drain structures 1212-2/1214-1 to corresponding M0 track portions. However, this will also be shown below.

In some embodiments, MDs 1214 - 1 and 1214 - 2 may be formed by replacing isolation structures overlying corresponding source/drain structures with a conductive material. In addition, MDs 1214 - 1 and 1214 - 2 may be formed in locations where recessed interconnect structures will not be formed, as disclosed herein. In locations where the recessed interconnect structures are to be formed, the isolation structures overlaying the corresponding source/drain features may be maintained at the current stage. For example, MDs 1214 - 1 and 1214 - 2 may be formed by performing at least some of the following processes: at least isolation structures 1212 - 3 (where recessed interconnect structures are to be formed). ) to form a mask layer 1215 covering the; forming holes by removing (eg, etching) the isolation structures 1212-1 and 1212-2 using the mask layer 1215 serving as a mask; filling the hole with one or more conductive materials; and performing a polishing process (eg, a chemical-mechanical polishing (CMP) process) to remove excess conductive material and mask layer 1215 . The conductive material may include at least one material selected from the group consisting of: cobalt (Co), ruthenium (Ru), tantalum (Ta), titanium (Ti), tungsten (W), molybdenum (Mo) , zinc (Zn), aluminum (Al), and manganese (Mn). Filling holes is, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), low pressure CVD (LPCVD), atomic layer deposition (ALD), other widely It may include one or more deposition techniques, such as known deposition techniques.

11 and 12C , the method 1100 proceeds to an operation 1106 in which an upper portion of the retained isolation structure 1212 - 3 is recessed, in accordance with some embodiments. In some embodiments, an upper portion of the isolation structure 1212 - 3 may be partially removed to have a height approximately equal to the height of the gate structure 1206 - 2 . In some other embodiments, upon removal of the upper portion of the isolation structure 1212 - 3 , the height of the isolation structure 1212 - 3 may be lower or higher than the height of the gate structure 1206 - 2 . For example, an upper portion of isolation structure 1212 - 3 may be removed by performing at least some of the following processes: at least MDs 1214 - 1 and 1214 - 2 , gate structure 1206 - 1 and forming a mask layer 1217 covering 1206-2; and partially removing (eg, etching) the isolation structure 1212 - 3 using the mask layer 1217 serving as a mask.

11 and 12D , method 1100 proceeds to operation 1108 in which MDs 1214 - 1 and 1214 - 2 are recessed, in accordance with some embodiments. In some embodiments, each upper portion of MDs 1214 - 1 and 1214 - 2 may be removed simultaneously. For example, upper portions of MDs 1214 - 1 and 1241 - 2 may be removed by performing at least some of the following processes: at least the recessed isolation structure 1213 - 3 , and the gate structure ( 1213 - 3 ). forming a mask layer 1219 covering 1206-2; and partially removing (eg, etching) the MDs 1214-1 and 1214-2 using the mask layer 1219 serving as a mask.

11 and 12E , method 1100 proceeds to operation 1110 in which source/drain sacrificial layers 1220-1, 1220-2, and 1220-3 are formed, in accordance with some embodiments. . Each of the source/drain sacrificial layers 1220-1, 1220-2, and 1220-3 is formed to overlay a corresponding MD or isolation structure. For example, a source/drain sacrificial layer 1220-1 is formed overlying the MD 1214-1; A source/drain sacrificial layer 1220 - 2 is formed overlying the MD 1214 - 2 ; The source/drain sacrificial layer 1220 - 3 is formed to overlay the isolation structure 1212 - 3 . Each of the source/drain sacrificial layers 1220-1, 1220-2, and 1220-3 is formed of silicon nitride, poly silicon, silicon oxide, etc., or a combination thereof. Each of the source/drain sacrificial layers 1220-1, 1220-2, and 1220-3 is used as a hard mask (sometimes referred to as a hard mask layer) during a subsequent photolithography process. The source/drain sacrificial layers 1220-1, 1220-2, and 1220-3 may later be replaced by respective interconnect structures (eg, portions of VD, VD+VG) discussed below. . In some embodiments, the source/drain sacrificial layers 1220-1, 1220-2, and 1220-3 may have an etch rate different from the etch rate of the gate sacrificial layers 1208-1 and 1208-2.

11 and 12F , the method 1100 proceeds to operation 1112 in which one of the source/drain sacrificial layers 1220 - 3 is removed, in accordance with some embodiments. In some embodiments, method 1100 includes removing a source/drain sacrificial layer formed at a location where a recessed interconnect structure will be formed. For example, the location of the source/drain sacrificial layer 1220-3 (FIG. 12E) occupies a portion of the area where the recessed interconnect structure will be formed, and thus the source/drain sacrificial layer 1220-3 (FIG. 12E). is removed In some embodiments, the source/drain sacrificial layer 1220-3 is removed by performing at least some of the following processes: at least the source/drain sacrificial layers 1220 - 1 and 1220 - 2 and the gate sacrificial layer ( forming a mask layer 1221 covering 1208-1); and removing (eg, etching) the source/drain sacrificial layer 1220-3 using the mask layer 1221 serving as a mask. As mentioned above, the etch rates of the gate sacrificial layer 1208-2 and the source/drain sacrificial layer 1220-3 for a given etchant are different. In one embodiment, the source/drain sacrificial layer 1220 - 3 may be characterized with a higher etch rate than the gate sacrificial layer 1208 - 2 . As such, while etching the source/drain sacrificial layer 1220-3 using the mask layer 1221 that does not substantially cover the gate sacrificial layer 1208-2, the gate sacrificial layer 1208-2 is It may remain substantially intact.

11 and 12G , the method 1100 includes an operation 1114 in which the gate sacrificial layer 1208 - 2 for the transistor 1204 - 2 is removed to form a trench 1224 , in accordance with some embodiments. ) to proceed. In some embodiments, trench 1224 may be formed by performing at least some of the following processes: at least source/drain sacrificial layers 1220-1 and 1220-2 and gate sacrificial layer 1208-1. forming a mask layer 1225 covering the and removing (eg, etching) an upper portion of one of the gate sacrificial layer 1208 - 2 and the pair of gate spacers 1210 - 2 using the mask layer 1225 serving as a mask. The mask layer 1225 may be the same as the mask layer 1221 . In such a case, the gate sacrificial layer 1208-2 (FIG. 12F) and the source/drain sacrificial layer 1220-3 (FIG. 12E) may be removed simultaneously or separately using the same mask layer. In some embodiments, the mask layer 1221 (and mask layer 1225 ) covers at least the source/drain sacrificial layers 1220 - 1 and 1220 - 2 and the gate sacrificial layer 1208 - 1 but the gate sacrificial layer. It may include a pattern exposing the layer 1208-2 and the source/drain sacrificial layer 1220-3 (FIG. 12E). In an example in which the semiconductor device 1200 (or a part of the semiconductor device 1200 shown in FIGS. 12A to 12M ) is manufactured based on the design layout 400 ′, the mask layer 1221 is formed in the pattern shown in FIG. 4 . It may correspond to a combination of (452 and 460).

As noted above with respect to FIG. 12C , in some embodiments, the remaining isolation structure 1212 - 3 may have the same height as the gate structure 1206 - 2 . In such a case, upon removal of the gate sacrificial layer 1208 - 2 overlying the gate structure 1206 - 2 (and upon removal of the upper portion of the gate spacer 1210 - 2 ), the The upper boundary and the upper boundary of the remaining isolation structure 1212 - 3 may be substantially aligned with each other, which defines a substantially flat bottom boundary for the trench 1224 .

11 and 12H , the method 1100 proceeds to an operation 1116 in which the trench 1224 is filled with a conductive material to form an interconnect structure 1226 , in accordance with some embodiments. As such, interconnect structure 1226 may inherit the geometry of trench 1224 having, for example, a substantially flat lower boundary. In some embodiments, the interconnect structure 1226 includes a first portion 1226 - 1 , which may overlap the location of VG that may have been formed to connect the gate structure 1206 - 2 , and a source/drain structure. and a second portion 1226-2 that may overlap the location of the VD that may have been formed to couple 1214-2. Accordingly, interconnect structure 1226 may be referred to as “VD+VG 1226” hereinafter. In some embodiments, VD+VG 1226 may be formed by performing at least some of the following processes: filling trench 1224 with one or more conductive materials; and performing a polishing process (eg, a CMP process) to remove excess conductive material. The conductive material may include at least one material selected from the group consisting of: cobalt (Co), ruthenium (Ru), tantalum (Ta), titanium (Ti), tungsten (W), molybdenum (Mo) , zinc (Zn), aluminum (Al), and manganese (Mn). Filling holes is, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), low pressure CVD (LPCVD), atomic layer deposition (ALD), other widely It may include one or more deposition techniques, such as known deposition techniques.

11 and 12I , method 1100 proceeds to operation 1118 in which a portion of VD+VG 1226 is removed to form recess 1228 , in accordance with some embodiments. Recess 1228 may be vertically aligned with gate structure 1206 - 2 , or overlay a portion of gate structure 1206 - 2 along a direction perpendicular to the direction in which gate structure 1206 - 2 extends. You may. Specifically, the recess 1228 may be vertically aligned with the first portion 1226 - 1 . As such, the first portion 1226 - 1 may have an upper boundary that is vertically lower than the upper boundary of the second portion 1226 - 2 , and a lower boundary in direct contact with the gate structure 1206 - 2 . have. In addition, the lower boundary of the second portion 1206 - 2 may extend from the lower boundary of the first portion 1226 - 1 . In some embodiments, the recess 1228 may be formed by performing at least some of the following processes: Form the mask layer 1227 using a pattern that exposes where the recess 1228 is to be formed. to do; and removing (eg, etching) a portion of VD+VG 1226 using the mask layer 1227 serving as a mask. In some embodiments, the pattern of mask layer 1227 may partially overlap with VD+VG 1226 . In an example in which the semiconductor device 1200 (or a portion of the semiconductor device 1200 shown in FIGS. 12A to 12M ) is manufactured based on the design layout 400 ′, the mask layer 1227 has the pattern shown in FIG. 4 . It may correspond to (461).

11 and 12J , the method 1100 proceeds to an operation 1120 in which the recess 1228 is filled with a dielectric material, in accordance with some embodiments. Upon filling of the recess 1228 with a dielectric material, a dielectric recess structure 1230 may be formed. In some embodiments, the dielectric recess structure 1230 may be formed by performing at least some of the following processes: depositing a dielectric material over the semiconductor device 1200 ; and performing a polishing process (eg, a CMP process) to remove excess dielectric material. The dielectric material may include a material selected from at least one of: silicon oxide, a low dielectric constant (low dielectric constant) material, or a combination thereof. The low-k materials include fluorinated silica glass (FSG), phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), carbon doped silicon oxide (SiO _x C _y ), Black Diamond® (Santa Clara, CA, USA). from Applied Materials), zerogels, aerogels, amorphous carbon fluoride, parylene, BCB (bis-benzocyclobutene), SiLK (Dow Chemical, Midland, MI), polyimides, and/or other futures. It may also include low-k dielectric materials to be developed.

11 and 12K , the method 1100 proceeds to operation 1122 in which one or more sacrificial layers are removed, in accordance with some embodiments. In an example in which semiconductor device 1200 (or a portion of semiconductor device 1200 shown in FIGS. 12A-12M ) is fabricated based on design layout 400', operation 1122 includes a source/drain sacrificial layer ( It may include removing the gate sacrificial layer 1208-1 (FIG. 12J) while maintaining the 1220-1 and 1220-2. Upon removal of the gate sacrificial layer 1208 - 1 , the gate structure 1206 - 1 may be exposed. In some embodiments, the gate sacrificial layer 1208 - 1 may be removed by performing at least some of the following processes: Covering at least the recessed VD+VG 1226 and the dielectric recessed structure 1230 . forming a mask layer 1231 to and performing an etching process to remove the gate sacrificial layer 1208 - 1 . In some embodiments, the etching process may selectively etch the gate sacrificial layer 1208 - 1 , but may leave the source/drain sacrificial layers 1220 - 1 and 1220 - 2 intact.

11 and 12L , method 1100 proceeds to operation 1124 in which one or more interconnect structures (VD(s) and/or VG(s)) are formed, in accordance with some embodiments. Following the example above in which the semiconductor device 1200 (or the portion of the semiconductor device 1200 shown in FIGS. 12A-12M ) is fabricated based on the design layout 400 ′, operation 1124 is a gate structure forming VG 1232 that electrically connects 1206 - 1 . In some embodiments, VG 1232 may be formed by performing at least some of the following processes: filling the hole in which the gate sacrificial layer 1208 - 1 is formed using one or more conductive materials; and performing a polishing process (eg, a chemical mechanical polishing (CMP) process) to remove excess conductive material. The conductive material may include at least one material selected from the group consisting of: cobalt (Co), ruthenium (Ru), tantalum (Ta), titanium (Ti), tungsten (W), molybdenum (Mo) , zinc (Zn), aluminum (Al), and manganese (Mn). Filling the holes is, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), low pressure CVD (LPCVD), atomic layer deposition (ALD), other well known deposition techniques. It may include one or more deposition techniques such as

11 and 12M , method 1100 proceeds to operation 1126 in which respective M0 track portions 1240-1 and 1240-2 are formed, in accordance with some embodiments. M0 track portions 1240 - 1 and 1240 - 2 may be segments of M0 interconnect structure 1240 that are divided (or truncated) by cut pattern 1241 . Such cut pattern 1241 may be vertically aligned with dielectric recess structure 1230 . Following the above example in which the semiconductor device 1200 (or the portion of the semiconductor device 1200 shown in FIGS. 12A-12M ) is manufactured based on the design layout 400', the cut pattern 1241 is shown in FIG. 4 It may correspond to the pattern 463 shown in . As such, gate structure 1206 - 2 is electrically coupled to M0 track portion 1240 - 2 via recessed VD+VG 1226 while being electrically isolated from M0 track portion 1240 - 1 . can be ringed. Specifically, the recessed VD+VG 1226 connects the gate structure 1206 - 2 through the lower boundary of the first portion 1226 - 1 and M0 through the upper boundary of the second portion 1226 - 2 . The track portion 1240 - 2 may be electrically connected.

In one aspect of the present disclosure, a semiconductor device is disclosed. The semiconductor device includes a first gate structure. A semiconductor device includes a first interconnect structure disposed in an interconnect layer. An interconnect layer is disposed over the first gate structure, wherein the first interconnect structure is laterally displaced from the first gate structure. The semiconductor device includes a second interconnect structure disposed between the first gate structure and the interconnect layer. The second interconnect structure includes a first portion and a second portion. A first portion and a second portion of the second interconnect structure are laterally adjacent to each other, and the first portion is vertically shorter than the second portion by a recess. The first gate structure is electrically coupled to the first interconnect structure by contacting only a first portion of the second interconnect structure to the first gate structure and contacting only a second portion of the second interconnect structure to the first interconnect structure. ring is

In another aspect of the present disclosure, a semiconductor device is disclosed. The semiconductor device includes a first gate structure extending along a first lateral direction. The semiconductor device includes a first interconnect structure disposed over a first gate structure that extends along a second lateral direction perpendicular to the first lateral direction. The first interconnect structure includes a first portion and a second portion that are electrically isolated from each other by a first dielectric structure. The semiconductor device includes a second interconnect structure disposed between the first gate structure and the first interconnect structure that electrically couples the first gate structure to a first portion of the first interconnect structure. The second interconnect structure includes a recessed portion substantially aligned with the first gate structure and the dielectric structure along a vertical direction.

In yet another aspect of the present disclosure, a method for manufacturing a semiconductor device is disclosed. The method includes forming a gate structure overlaid by a first sacrificial layer and a source/drain structure overlaid by a second sacrificial layer. The method includes replacing upper portions of the first sacrificial layer and the second sacrificial layer with a first interconnect structure. The method includes recessing a portion of the first interconnect structure, wherein the recessed portion is vertically aligned with the gate structure. The method includes filling the recessed portion with a dielectric material to form a recessed dielectric structure. The method includes forming a second interconnect structure over the first interconnect structure, the second interconnect structure cut into a plurality of portions by the dielectric structure vertically aligned with the recessed dielectric structure.

The above description outlines features of various embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art will recognize that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. have to recognize Those skilled in the art will also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and modifications herein without departing from the spirit and scope of the present disclosure. have to recognize

Examples

Embodiment 1. A semiconductor device comprising:

a first gate structure;

a first interconnect structure disposed in an interconnect layer, the interconnect layer disposed over the first gate structure, the first interconnect structure being laterally displaced from the first gate structure - ; and

a second interconnect structure disposed between the first gate structure and the interconnect layer, the second interconnect structure comprising a first portion and a second portion;

a first portion and a second portion of the second interconnect structure are laterally adjacent to each other, the first portion being vertically shorter than the second portion by a recess;

The first gate structure is formed by contacting only a first portion of the second interconnect structure to the first gate structure and contacting only a second portion of the second interconnect structure to the first interconnect structure. and electrically coupled to the connection structure.

Embodiment 2. The first interconnect structure of Embodiment 1, wherein the first portion of the second interconnect structure is disposed in the interconnect layer by at least a dielectric structure filling the recess and any and electrically isolated from other interconnect structures.

Embodiment 3. The first portion of embodiment 1, wherein the first portion of the second interconnect structure has a first top boundary and a first bottom boundary, wherein the first upper boundary includes the first and vertically and laterally spaced apart from the interconnect structure, wherein the first lower boundary is in direct contact with the upper boundary of the first gate structure.

Embodiment 4. The second portion of embodiment 3, wherein the second portion of the second interconnect structure has a second upper boundary and a second lower boundary, wherein the second upper boundary is in direct contact with the first interconnect structure; , wherein the second lower boundary is laterally displaced from an upper boundary of the first gate structure.

Embodiment 5. The method of embodiment 1, wherein a first portion of the second interconnect structure is vertically aligned with the recess and the first gate structure, and wherein a second portion of the second interconnect structure comprises the first and vertically aligned with an end portion of the interconnect structure.

Example 6. The method of Example 1,

a second gate structure laterally spaced apart from the first gate structure;

a third interconnect structure disposed in the interconnect layer, the third interconnect structure laterally spaced from the first interconnect structure; and

and a fourth interconnect structure disposed between the second gate structure and the interconnect layer, the fourth interconnect structure connecting the second gate structure to the third interconnect structure.

Embodiment 7. The method of Embodiment 6, wherein the first gate structure and the second gate structure are laterally spaced apart from each other at a distance, and at least one of the first interconnect structure or the third interconnect structure is lateral A width extending in the direction is at least 1.5 times the distance.

Embodiment 8 The gate structure of Embodiment 6, wherein the first gate structure and the second gate structure are adjacent two gate structures among a plurality of gate structures constituting a standard cell, and the number of gate structures is 5 or less, the semiconductor device.

Embodiment 9 The semiconductor device according to embodiment 1, wherein the first interconnect structure is included in one signal track of a plurality of signal tracks disposed in the interconnect layer, and the number of signal tracks is three or less. .

Embodiment 10. The method of embodiment 1, wherein a second portion of the second interconnect structure is vertically spaced from a source/drain structure by an isolation structure, wherein the source/drain structure is laterally from the first gate structure. spaced apart, the semiconductor device.

Embodiment 11. A semiconductor device comprising:

a first gate structure extending along a first lateral direction;

a first interconnect structure disposed over the first gate structure extending along a second lateral direction perpendicular to the first lateral direction, wherein the first interconnect structure is a first interconnect structure electrically isolated from each other by a first dielectric structure. comprising a first part and a second part;

a second interconnect structure disposed between the first gate structure and the first interconnect structure, the second interconnect structure electrically coupling the first gate structure to a first portion of the first interconnect structure;

and the second interconnect structure includes a recessed portion aligned with the first gate structure and the dielectric structure along a vertical direction.

Embodiment 12. The method of embodiment 11, wherein the recessed portion of the second interconnect structure is directly coupled to the first gate structure, and wherein the second interconnect structure comprises a first portion of the first interconnect structure. and a non-recessed portion directly coupled to the portion.

Example 13. The method of Example 12,

a source/drain structure disposed on one of the two sides of the first gate structure along the second lateral direction;

The source/drain structures are substantially aligned with the non-recessed portion of the second interconnect structure along the vertical direction, and electrically from the non-recessed portion of the second interconnect structure by a second dielectric structure. is isolated.

Example 14. The method of Example 13,

a second gate structure disposed on a side opposite to the first gate structure from the source/drain structure along the second lateral direction;

and the second gate structure is electrically coupled to the second portion of the first interconnect structure through a third interconnect structure.

Embodiment 15 The semiconductor device of embodiment 14, wherein the second interconnect structure and the third interconnect structure are disposed in the same interconnect layer.

Embodiment 16. The method of embodiment 14, wherein the first gate structure and the second gate structure are spaced apart from each other along the second lateral direction, at least a first portion or a second of the first interconnect structure and a width at which a portion extends along the second lateral direction is at least 1.5 times the distance.

Embodiment 17. The method of embodiment 14, wherein the first gate structure and the second gate structure are adjacent two gate structures among a plurality of gate structures constituting a standard cell, and the number of the gate structures is 5 or less. , semiconductor devices.

Embodiment 18 The semiconductor device according to embodiment 11, wherein the first interconnect structure is included in one of the plurality of signal tracks disposed in the interconnect layer, and the number of the signal tracks is three or less.

Example 19. A method for manufacturing a semiconductor device, comprising:

forming a gate structure overlaid by a first sacrificial layer and a source/drain structure overlaid by a second sacrificial layer;

replacing upper portions of the first sacrificial layer and the second sacrificial layer with a first interconnect structure;

recessing a portion of the first interconnect structure, wherein the recessed portion is vertically aligned with the gate structure;

filling the recessed portion with a dielectric material to form a recessed dielectric structure; and

forming a second interconnect structure over the first interconnect structure, the second interconnect structure cut into a plurality of portions by a dielectric structure vertically aligned with the recessed dielectric structure - A method for manufacturing a semiconductor device comprising:

Embodiment 20. The method of embodiment 19, wherein a portion of an upper boundary portion of the first interconnect structure directly contacts one of the plurality of portions of the second interconnect structure, and a lower portion of the first interconnect structure and a portion of the boundary is in direct contact with the gate structure.

Claims (10)

A semiconductor device comprising:
a first gate structure;
a first interconnect structure disposed in an interconnect layer, the interconnect layer disposed over the first gate structure, the first interconnect structure being laterally displaced from the first gate structure - ; and
a second interconnect structure disposed between the first gate structure and the interconnect layer, the second interconnect structure comprising a first portion and a second portion;
a first portion and a second portion of the second interconnect structure are laterally adjacent to each other, the first portion being vertically shorter than the second portion by a recess;
The first gate structure is formed by contacting only a first portion of the second interconnect structure to the first gate structure and contacting only a second portion of the second interconnect structure to the first interconnect structure. and electrically coupled to the connection structure. The first interconnect structure and any other interconnect structure of claim 1 , wherein a first portion of the second interconnect structure is disposed in the interconnect layer by at least a dielectric structure filling the recess. is electrically isolated from the semiconductor device. 5. The method of claim 1, wherein the first portion of the second interconnect structure has a first top boundary and a first bottom boundary, the first upper boundary being separated from the first interconnect structure. spaced apart vertically and laterally, wherein the first lower boundary is in direct contact with the upper boundary of the first gate structure. 4. The method of claim 3, wherein the second portion of the second interconnect structure has a second upper boundary and a second lower boundary, the second upper boundary being in direct contact with the first interconnect structure, the second and a lower boundary is laterally displaced from an upper boundary of the first gate structure. 2. The method of claim 1, wherein a first portion of the second interconnect structure is vertically aligned with the recess and the first gate structure, and a second portion of the second interconnect structure is a portion of the first interconnect structure. and vertically aligned with an end portion. According to claim 1,
a second gate structure laterally spaced apart from the first gate structure;
a third interconnect structure disposed in the interconnect layer, the third interconnect structure laterally spaced from the first interconnect structure; and
and a fourth interconnect structure disposed between the second gate structure and the interconnect layer, the fourth interconnect structure connecting the second gate structure to the third interconnect structure. The semiconductor device according to claim 1, wherein the first interconnect structure is included in one of a plurality of signal tracks disposed in the interconnect layer, and the number of signal tracks is three or less. The method of claim 1 , wherein a second portion of the second interconnect structure is vertically spaced from a source/drain structure by an isolation structure, and wherein the source/drain structure is laterally spaced from the first gate structure. , semiconductor devices. A semiconductor device comprising:
a first gate structure extending along a first lateral direction;
a first interconnect structure disposed over the first gate structure extending along a second lateral direction perpendicular to the first lateral direction, wherein the first interconnect structure is a first interconnect structure electrically isolated from each other by a first dielectric structure. comprising a first part and a second part;
a second interconnect structure disposed between the first gate structure and the first interconnect structure, the second interconnect structure electrically coupling the first gate structure to a first portion of the first interconnect structure;
and the second interconnect structure includes a recessed portion aligned with the first gate structure and the dielectric structure along a vertical direction. A method for manufacturing a semiconductor device, comprising:
forming a gate structure overlaid by a first sacrificial layer and a source/drain structure overlaid by a second sacrificial layer;
replacing upper portions of the first sacrificial layer and the second sacrificial layer with a first interconnect structure;
recessing a portion of the first interconnect structure, wherein the recessed portion is vertically aligned with the gate structure;
filling the recessed portion with a dielectric material to form a recessed dielectric structure; and
forming a second interconnect structure over the first interconnect structure, the second interconnect structure cut into a plurality of portions by a dielectric structure vertically aligned with the recessed dielectric structure - A method for manufacturing a semiconductor device comprising:

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