KR20210101422A - Electronic device inclucing infrared emitter - Google Patents

Abstract

According to various embodiments of the present disclosure, an electronic device includes: a housing including a plurality of light transmission regions provided on one surface of the housing; a first circuit board accommodated in the housing; a second circuit board accommodated in the housing, and electrically connected to the first circuit board; a first component disposed on the first circuit board, and disposed to correspond to a first light transmission region among the light transmission regions to emit an infrared light through the first light transmission region; a second component mounted on the second circuit board disposed to correspond to a second light transmission region among the light transmission regions; and a printed layer formed to correspond to at least the first light transmission region between a rear surface of the housing and an infrared light source, and configured to block a visible light while transmitting the infrared light, wherein the second component is configured to receive the infrared light emitted from the first component and reflected by a subject. Various other embodiments are possible. Accordingly, an infrared output is improved.

Description

Electronic device comprising an infrared light source {ELECTRONIC DEVICE INCLUCING INFRARED EMITTER}

Various embodiments disclosed in this document relate to an electronic device, for example, to an electronic device including an infrared light source (and/or an infrared receiver).

With the development of electronics, information, and communication technologies, various functions are being integrated into one electronic device. For example, a smart phone includes a function of a sound reproducing device, an imaging device, or an electronic notebook as well as a communication function, and more various functions may be implemented in the smart phone through additional installation of an application. As various functions are implemented in one electronic device, electronic devices with specialized functions, such as an electronic notebook, a multimedia player, and a small digital camera, are being replaced by multi-function electronic devices such as a smart phone.

As various functions are implemented within a single electronic device and are carried and used on a daily basis, users may demand comfortable use, portability, and high performance (eg, fast information processing or high-quality image and sound) of electronic devices. . For example, electronic devices can provide high-quality images and sounds by including more advanced displays and speakers, and the performance of programs or integrated circuit chips for processing image signals or sound signals is increasing.

In a miniaturized electronic device such as a smart phone, it may be difficult to improve the quality of a captured image or video. For example, a camera mounted in an electronic device can improve the quality of a captured image or video by including a high-pixel image sensor, but a lens (or lens assembly) that simultaneously satisfies telephoto performance, wide-angle performance, or close-up performance can be made into a miniaturized electronic device. There may be limitations on placement on the device. By disposing a plurality of cameras (eg, a telephoto camera, a wide-angle camera, a close-up camera, or a portrait camera) in one electronic device, it is possible to realize a miniaturized electronic device while improving the quality of a captured image or video. For example, a lens (or lens assembly) that is difficult to mount in a miniaturized electronic device is required to implement a camera with good telephoto characteristics, wide-angle characteristics, and/or close-up characteristics, but a telephoto camera, a wide-angle camera and/or a close-up camera are required. When combined, it may be easy to mount on a miniaturized electronic device.

Recently, by utilizing distance to a subject, for example, depth information, even a miniaturized electronic device may improve the quality of a captured image or video, or may be equipped with a security function such as user face recognition. In an embodiment, the electronic device may emit a light beam (eg, infrared light) to receive a light beam reflected by a subject, and detect depth information based on a time from the emission time to the reception time. For example, the electronic device may detect distance information about a subject by including an infrared light source and an infrared receiver.

In a miniaturized electronic device, when a plurality of cameras are mounted and an infrared light source and an infrared receiver are mounted, a plurality of light transmitting areas may be required. For example, light transmitting areas corresponding to a plurality of cameras and light transmitting areas corresponding to an infrared light source and an infrared receiver may be disposed. can be identified. However, it may be difficult to harmoniously arrange the light transmitting area(s) identified by the user's naked eye on the exterior of the electronic device.

In another embodiment, it is possible to reliably measure distance information (eg, depth) when the infrared light source has sufficient power. Higher power can be supplied. However, as higher power is supplied, infrared light sources can generate more electromagnetic waves than other electronic components.

Various embodiments disclosed in this document may provide an electronic device capable of making the appearance of the electronic device beautiful while disposing a light source and/or a receiver for detecting distance information about a subject.

Various embodiments disclosed in this document may provide an electronic device capable of suppressing or alleviating the generation of electromagnetic waves while supplying stable power to a light source for detecting distance information about a subject.

According to various embodiments disclosed herein, an electronic device includes a housing including a plurality of light transmitting regions provided on one surface, a first circuit board accommodated in the housing, and a first circuit board accommodated in the housing. a second circuit board electrically connected to a second circuit board, a first component disposed on the first circuit board, disposed to correspond to a first light transmitting area among the plurality of light transmitting areas, and emitting infrared rays through the first light transmitting area , a second component mounted on the second circuit board disposed to correspond to a second light transmitting area among the plurality of light transmitting areas, and at least in the first light transmitting area between the rear surface of the housing and the first component Correspondingly formed and comprising a printed layer that blocks visible light and transmits infrared light, the second part may be configured to detect infrared rays emitted from the first part and reflected by the subject have.

According to various embodiments disclosed herein, an electronic device includes a housing including a plurality of light transmitting regions provided on one surface, a first circuit board accommodated in the housing, a processor disposed on the first circuit board, and the first circuit board An infrared light source mounted on a circuit board and disposed to correspond to a first light transmitting area among the plurality of light transmitting areas, an infrared receiver disposed to correspond to a second light transmitting area among the plurality of light transmitting areas, and the housing. A printed layer formed to correspond to at least the first light transmitting area between the rear surface and the infrared light source, and an infrared blocking film disposed to correspond to at least a portion of the circumference of the first light transmitting area between one surface of the housing and the infrared light source including, wherein the infrared receiver detects infrared rays emitted from the infrared light source and reflected by the subject, and the infrared blocking film receives infrared rays passing through the first light transmission area to the second light transmission area. interference can be prevented.

In the electronic device according to various embodiments disclosed in this document, a light source for detecting distance information about a subject is disposed on a first circuit board (eg, a main circuit board) to receive high power, so that infrared output can be improved. and suppression or alleviation of electromagnetic wave generation. In an electronic device according to an embodiment, a filter (eg, a printed layer) that blocks visible light and transmits infrared rays is disposed in a region that transmits infrared rays emitted from the infrared light source, so that the infrared light source is transmitted from the outside of the electronic device. By blocking identification with the user's naked eye, the degree of freedom in designing the appearance of the electronic device may be improved. In another embodiment, the electronic device may include a blocking film that blocks infrared rays emitted from an infrared light source from interfering with infrared rays incident to the infrared receiver, so that accuracy of measuring distance information with respect to a subject may be improved. By providing the infrared blocking film, the infrared light source and the infrared receiver are disposed adjacent to each other and can be easily installed even in a narrow space. .

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2 is a cross-sectional configuration diagram illustrating a part of an electronic device according to various embodiments disclosed in this document.
3 is an exploded perspective view illustrating a part of an electronic device according to various embodiments disclosed herein.
4 is a perspective view illustrating a part of an electronic device according to various embodiments disclosed herein.
FIG. 5 is a cross-sectional view illustrating a part of an electronic device taken along line A-A' of FIG. 4 .
6 is a plan view illustrating an arrangement of electronic components in an electronic device according to various embodiments of the present disclosure;
7 is a plan view illustrating an arrangement of light transmitting regions in an electronic device according to various embodiments disclosed herein.
8 is a perspective view illustrating a front surface of an electronic device according to various embodiments of the present disclosure;
9 is a perspective view illustrating a rear surface of the electronic device shown in FIG. 8 .

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1 , in a network environment 100 , the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 . According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or in conjunction with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). there is.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101 . The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. there is.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module may be a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or infrared data association (IrDA)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197 .

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the electronic devices 102 and 104 may be the same or a different type of the electronic device 101 . According to an embodiment, all or part of the operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited. that one (e.g., first) component is "coupled" or "connected" to another (e.g., second) component with or without the terms "functionally" or "communicatively" When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of one or more instructions stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2 is a cross-sectional configuration diagram illustrating a part of the electronic device 200 (eg, the electronic device 101, 102, 104 of FIG. 1) according to various embodiments disclosed herein.

Referring to FIG. 2 , the electronic device 200 includes a housing (eg, a camera window 255 ), a first circuit board 240 , a first component provided as a light source, and a second component provided as an optical receiver (eg, an infrared light source). 241 and an infrared receiver 243) and/or a printed layer 255b. In one embodiment, as will be seen with reference to FIG. 3 , the housing may be defined as a structure including a side structure, a front plate and/or a back plate, and according to an embodiment, the housing may be viewed from the external appearance of the electronic device by the user. It may be construed to include all structures identified as (or contactable by a user). The housing may include a plurality of light transmitting areas TA1 , TA2 , and TA3 provided on one surface, for example, the camera window 255 . In various embodiments disclosed herein, the term "light transmitting region" may refer to a region that transmits not only visible light but also non-visible light (eg, ultraviolet or infrared), and in some embodiments, non- It may refer to a region that transmits visible light but blocks visible light.

According to various embodiments, the first circuit board 240 is accommodated in the housing and may be used as a main circuit board of the electronic device 200 . For example, various circuit devices or integrated circuit chips such as the processor 120 , the communication module 190 , the power management module 188 , the memory 130 , and the interface 177 described with reference to FIG. 1 are the first It may be mounted on the circuit board 240 . The first circuit board 240 may be a multi-layered printed circuit board, and in another embodiment, two or three or more multi-layered circuit boards may be mechanically coupled to face each other. .

According to various embodiments, the infrared light source 241 may be mounted on the first circuit board 240 and may be disposed to correspond to the first light transmitting area TA1 among the plurality of light transmitting areas. For example, the infrared light source 241 is electrically connected to a processor or a power management module (eg, the processor 120 or the power management module 188 of FIG. 1 ) through a wiring inside the first circuit board 240 , and is controlled It may be supplied with a signal or power. The infrared light source 241 outputs infrared rays using the supplied power, and the output infrared rays may be radiated to the outside of the electronic device through the first light transmitting area TA1.

According to various embodiments, the infrared receiver 243 is disposed to correspond to the second light transmission area TA2 among the plurality of light transmission areas, and may receive infrared rays incident from the outside. For example, after infrared light output from the infrared light source 241 is reflected by the subject, at least a portion may be incident on the infrared receiver 243 . According to an embodiment, the processor of the electronic device 200 (eg, the processor 120 of FIG. 1 ) emits infrared rays from the infrared light source 241 based on the infrared rays received by the infrared receiver 243 , for example. Distance information about the subject may be detected or generated based on a time from when the light is emitted to the time point when the infrared is received by the infrared receiver 243 after being reflected by the subject. If the electronic device 200 includes at least one camera (eg, the camera module 180 of FIG. 1 ), a more improved captured image may be obtained by combining image information detected through the camera and distance information about the subject. have.

According to various embodiments, the infrared receiver 243 may be mounted on the second circuit board 243a electrically connected to the first circuit board 240 . In some embodiments, the second circuit board 243a may be described as extending from the infrared receiver 243 and electrically connected to the first circuit board 240 . In one embodiment, the second circuit board 243a may include a flexible printed circuit board, and a first connector 243b provided at one end is coupled to the first circuit board 240 , thereby providing an infrared receiver 243 . may be electrically connected to the first circuit board 240 through the second circuit board 243a and/or the first connector 243b. The infrared receiver 243 is for receiving infrared rays incident from the outside, and may provide a data signal based on the received infrared rays to a processor (eg, the processor 120 of FIG. 1 ). Compared to the infrared light source 241 , the infrared receiver 243 may operate at a relatively low power. For example, even if it is connected to the first circuit board 240 through a separate wiring (eg, the second circuit board 243a), it is generated in the infrared receiver 243 or its connection wiring (eg, the second circuit board 243a) The resulting electromagnetic wave may be low.

According to various embodiments, the printed layer 255b is formed on the inner surface of the housing, for example, the camera window 255 , and is disposed to correspond to at least the infrared light source 241 or the first light transmitting area TA1 . can In one embodiment, the printing layer 255b may be formed of an ink that blocks visible light and transmits infrared light. For example, the printed layer may transmit visible light of about 15% or less even though it completely blocks or transmits visible light, and may have a transmittance of about 70% or more and about 99% or less for infrared rays. The printed layer 255b substantially blocks visible light, thereby preventing the first light transmitting area TA1 or the internal space of the electronic device 200 adjacent to the first light transmitting area TA1 from being visually exposed to the outside. can For example, the position of the infrared light source 241 or the first light transmitting area TA1 may not substantially affect the exterior design of the electronic device, and thus the design freedom of the electronic device 200 may be improved. In another embodiment, the printed layer 255b may have a shape or size that matches that of the first light transmitting area TA1, and in another embodiment, the printed layer 255b may be larger than the first light transmitting area TA1. could be bigger

According to various embodiments, the electronic device 200 may further include a decoration layer 255a formed on the inner surface of the camera window 255 . The decoration layer 255a substantially blocks visible light, thereby preventing the structures in the space inside the camera window 255a from being exposed to the outside of the electronic device 200 , but corresponding to the light transmitting areas TA1 , TA2 , and TA3 . The part may be removed. For example, visible light or infrared light may be transmitted through the portion from which the decorative layer 255a is removed. Note that although the printed layer 255b and the decorative layer 255b are separately described in the present embodiment, the present invention is not limited thereto. For example, the decorative layer 255a may be printed with ink that blocks visible light and transmits infrared light, and the printed layer 255b refers to a portion of the decorative layer 255a corresponding to the first light transmitting area TA1. can

According to various embodiments, the electronic device 200 may further include a first infrared blocking film 271a. In the thickness direction Z, the first infrared blocking film 271a is disposed between one surface of the housing (eg, the outer surface or inner surface of the camera window 255) and the infrared light source 241 (or one surface of the housing and the infrared receiver ( 243), and may be disposed to correspond to at least a portion of the circumference of the first light transmitting area TA1 (and/or the printed layer 255b). In an embodiment, in the thickness direction Z, the first infrared blocking film 271a may be disposed to overlap the first light transmitting area TA1 and/or the printed layer 255b. For example, an area to which infrared rays output from the infrared light source 241 may be radiated to the outside may be defined by any one of the first light transmitting area TA1 and the first infrared blocking film 271a.

According to various embodiments, the infrared ray output from the infrared light source 241 transmits the printed layer 255b or the camera window 255 (eg, the first light transmitting area TA1), and the difference in refractive index at the interface(s) can be reflected, refracted, or scattered. Here, the "boundary surface(s)" refers to the lower surface of the printed layer 255b in FIG. 2, the interface between the printed layer 255b and the camera window 255, and the upper surface of the camera window 255 (eg: outer surface) may be included. In a structure in which the infrared light source 241 and the infrared receiver 243 are disposed adjacent to each other, when reflected, refracted or scattered infrared rays are directly incident on the infrared receiver 243, interference with the infrared rays reflected by the subject may occur. have. For example, information based on infrared rays received by the infrared receiver 243 , for example, distance information about a subject may be distorted. The first infrared blocking film 271a may suppress or prevent reflection, refraction, or scattering of infrared rays by setting an angular range or direction in which infrared rays output from the infrared light source are emitted. “Setting the angular range in which infrared rays are emitted” may mean that the incident angle of infrared rays with respect to the boundary surfaces formed by the printed layer 255b or the camera window 255 is limited to a certain angular range. The “direction in which infrared rays are emitted” may mean a direction toward a subject or a direction in which the cameras (eg, the first to third cameras 331 , 332 , 333 of FIG. 3 ) are directed.

According to various embodiments, the electronic device 200 may further include a second infrared blocking film 273a. The second infrared blocking film 273a is disposed between one surface of the housing (eg, an outer surface or an inner surface of the camera window 255 ) and the infrared receiver 243 , and at least a portion of the circumference of the second light transmitting area TA2 . may be arranged to correspond to In an embodiment, at least a portion of the first infrared blocking film 271a is an area between the first optically transparent area TA1 and the second light transmitting area TA1 and the second light transmitting area TA2 It may be disposed to correspond to the optically transparent area TA2). In this case, the second infrared blocking film 273a is an area between another area, corresponding to the first optically transparent area, between an area corresponding to the first infrared blocking film 271a and the second light transmitting area TA2 . TA1, and the second optically transparent area TA2). By disposing the second infrared blocking film 273a, it is possible to block reflected, refracted, or scattered infrared rays and substantially prevent interference with received infrared rays.

According to various embodiments, the electronic device 200 may further include an electromagnetic shielding member 241a disposed to at least partially surround the infrared light source 241 . The electromagnetic shielding member 241a may be mounted on the first circuit board 240 and may be electrically connected to a ground conductor (not shown) provided inside the first circuit board 240 . Compared with the infrared receiver 243 or other electronic components around it (eg, the cameras 331 , 332 , 333 of FIG. 3 ), the infrared light source 241 receives relatively high power and generates infrared rays. As a result, a strong electromagnetic field can be generated. For example, an error may occur in the operation of other electronic components due to the operation of the infrared light source 241 . The electromagnetic shielding member 241a may electromagnetically isolate the infrared light source 241 from the external environment.

In one embodiment, the first infrared blocking film 271a may be attached to the electromagnetic shielding member 241a. For example, the first infrared blocking film 271a may be at least partially disposed on one surface of the housing and/or between the printed layer 255b and the electromagnetic shielding member 241a. In some embodiments, the infrared light source 241 and/or the electromagnetic shielding member 241a may be mounted on the first circuit board 240 . The first infrared blocking film 271a may have a shape corresponding to the upper surface of the electromagnetic shielding member 241a and may be attached to the upper surface of the electromagnetic shielding member 241a.

According to various embodiments, the electronic device 200 may further include an elastic layer 271b laminated on the first infrared blocking film 271a. For example, the elastic layer 271b may be disposed between one surface of the housing (eg, the camera window 255) and/or the first infrared blocking film 271a, and the first infrared blocking film 271a may be applied to the printed layer ( 255b) and/or may be used as a first adhesive member attached to the decorative layer 255a. By providing the elastic layer 271b, in the thickness direction Z, the camera window 255 (and/or the printed layer 255b), the first infrared blocking film 271a, the electromagnetic shielding member 241a and/or the second One circuit board 240 may be combined with each other to form a stable fixed structure. In one embodiment, when using the elastic layer 271b as the first adhesive member, a general double-sided tape or poron tape may be used. In another embodiment, the elastic layer 271b is made of polyurethane foam, so that heat resistance of the first infrared blocking film 271a and/or the elastic layer 271b may be secured. For example, after the heating operation involved in the surface mounting process, shrinkage or expansion of the first infrared blocking film 271a and/or the elastic layer 271b may be suppressed. [Table 1] below illustrates the change in length after the heating operation compared to before the heating operation accompanying the surface mounting process. In [Table 1], "Example 1" refers to a configuration in which a poron tape is utilized as the elastic layer 271b, and "Example 2" refers to a configuration in which polyurethane foam is utilized as the elastic layer 271b. It can mean configuration.

Change in length after heating compared to before heating horizontal Vertical Example 1 0.57% shrinkage 1.56% swelling Example 2 0.15% shrinkage 0.78% swelling

As described through [Table 1], by forming the elastic layer 271b using a polyurethane foam, the first infrared blocking film 271a and/or the elastic body before and after heating of the surface mounting process while providing an adhesive structure It can be seen that the length change of the layer 271b is suppressed. For example, by suppressing the length change due to the heating operation, the change in shape or position after heating is suppressed to facilitate the design of the first infrared blocking film 271a or the elastic layer 271b, and the product or component after the surface mounting process. Uniform quality can be ensured.

According to various embodiments, the electronic device may further include a second adhesive member 273b. The second adhesive member 273b attaches the infrared receiver 243, other structures (not shown) around the infrared receiver 243 and/or the second infrared blocking film 273a to the inner surface (or decorative layer) of the camera window 255 . (255a)) can be attached. In some embodiments, an adhesive may be applied to both surfaces of the synthetic resin film (eg, PET film) to form the second adhesive member 273b. The second adhesive member 273b may have a shape corresponding to the decorative layer 255a. For example, portions corresponding to at least the light transmitting areas TA1 , TA2 , and TA3 of the second adhesive member 273b may be removed.

According to various embodiments, the electronic device 200 may include a flicker detection sensor 245 disposed to correspond to the third light transmitting area TA3 among the plurality of light transmitting areas. The flicker detection sensor 245 may detect flickering of the artificial light through the third light transmission area TA3 . Flickering of artificial light may cause deterioration of the captured image quality. The flicker of the artificial light can hardly be identified with the naked eye, and the flicker detection sensor 245 detects the flicker of the artificial light, so that distortion or image caused by the flicker of the artificial light in the process of processing the detected image data defects can be eliminated. The third light transmitting area TA3 may be disposed adjacent to the second light transmitting area TA2 with the first light transmitting area TA1 interposed therebetween. For example, the infrared light source 241 may be disposed between the flicker detection sensor 245 and the infrared receiver 243 .

As described above, the electronic device 200 (eg, the electronic devices 101 , 102 , 104 of FIG. 1 ) according to various embodiments disclosed herein uses an infrared light source 241 and an infrared receiver 243 . Thus, distance information about the subject may be detected, or flickering of artificial light may be detected using the flicker detection sensor 245 . When the electronic device 200 is used as an imaging device, the quality of a photographed image (or a moving picture) may be improved by detecting distance information about a subject or blinking of artificial lighting. In disposing the infrared light source 241 , the infrared receiver 243 , or the flicker detection sensor 245 , the infrared light source 241 is mounted on a main circuit board (eg, the first circuit board 240 ), so that other electronic components are provided. More stably, it is possible to output infrared rays of sufficient power by receiving higher power. As the output of the infrared light source 241 is increased, even if the printed layer 255b that blocks visible light is formed, infrared light having sufficient power required to measure the distance to the subject can be output. The printed layer 255b substantially hides the internal structure of the electronic device 200 (eg, the infrared light source 241 or other structures around it), so that the design freedom of the electronic device 200 may be improved. For example, the position of the infrared light source 241 or the position of the first light transmitting area TA1 corresponding thereto may be easily selected.

3 is an exploded perspective view illustrating a part of the electronic device 300 (eg, the electronic device 101 , 102 , 104 , 200 of FIG. 1 or 2 ) according to various embodiments disclosed herein. 4 is a perspective view illustrating a part of an electronic device 300 according to various embodiments disclosed herein. FIG. 5 is a cross-sectional view illustrating a part of the electronic device 300 taken along the line A-A' of FIG. 4 .

In FIG. 5 , the light transmitting area(s) TA, TA1, TA2, TA3, the printed layer 255b, or the decorative layer 255a are omitted for the sake of brevity, but when referring to FIGS. 2 to 4 , , the arrangement of the light transmitting area(s) (TA, TA1, TA2, TA3), the printed layer 255b or the decorative layer 255a in FIG. 5 will be readily understood by those skilled in the art.

3 to 5 , the electronic device 300 (eg, the electronic devices 101 and 200 of FIGS. 1 and 2 ) may include a housing 301 , and the housing 301 includes a front plate. 320 , the rear plate 380 , and the side structure 310 surrounding the space between the front plate 320 and the rear plate 380 may be interpreted as including. In some embodiments, the housing 301 includes, in addition to the front plate 320 , the back plate 380 , and the side structure 310 , a component exposed by the exterior of the electronic device 300 (eg, the camera window 355 ) or a user may be interpreted as meaning including a configuration that can be directly contacted.

According to various embodiments, at least a portion of the front plate 320 may be substantially transparent, and may be formed of a glass plate or a polymer plate including various coating layers. The back plate 380 may be formed by a coated or tinted glass, ceramic, polymer, metal, or optional combination of the materials listed above and may be substantially opaque. The side structure 310 is coupled to the front plate 320 and the back plate 380 and may be formed of metal and/or polymer. In one embodiment, the side structure 310 is integrally formed with the rear plate 380 and may be formed of the same material.

According to various embodiments, various hardware or electronic components described in FIG. 1 may be accommodated inside the electronic device 300 , and some of the hardware or electronic components may be visually or spatially outside the electronic device 300 . may be exposed. For example, the display 330 (eg, the display device 160 of FIG. 1 ) is disposed on the inner surface of the front plate 320 and accommodated inside the electronic device 300 (eg, the housing 301 ). , may be visually exposed to the outside of the electronic device through a significant portion of the front plate 310 .

According to various embodiments, the electronic device 300 may include a support member 311 connected to the side structure 310 and disposed inside the electronic device 300 . The support member 311 may be formed of a metal material and/or a non-metal material, and may be formed integrally with the side structure 310 . The display 330 may be coupled to one surface of the support member 311 , and a first circuit board 340 (eg, the first circuit board 240 of FIG. 2 ) may be disposed on the other surface. A processor, a memory, and/or an interface (eg, the processor 120 , the memory 130 and/or the interface 177 of FIG. 1 ) may be mounted on the first circuit board 340 .

According to various embodiments, the electronic device 300 includes a camera module 303 including a plurality of cameras 331, 332, and 333, an infrared light source 341 disposed inside the electromagnetic shielding member 341a, and an infrared receiver ( 343 ) and/or a flicker detection sensor 345 . The camera module 303 may include a first camera 331 , a second camera 332 , and/or a third camera 333 arranged along the longitudinal direction Y of the electronic device 300 , and includes a housing. It may be arranged to face the subject from one side (eg, the rear side) of 301 . In one embodiment, the camera module 303 may include a second connector 335 disposed on one side. For example, the second connector 335 may be coupled to the first circuit board 340 to electrically connect the camera module 303 to the first circuit board 340 .

According to various embodiments, the electromagnetic shielding member 341a (eg, the electromagnetic shielding member 241a of FIG. 2 ) may be mounted on the first circuit board 340 while substantially surrounding the infrared light source 341 . For example, the electromagnetic shielding member 341a may electromagnetically isolate the infrared light source 341 from the external environment. Although no separate reference number is given, the electromagnetic shielding member 341a may include an opening or a hole for propagating infrared rays output from the infrared light source 341 . The electromagnetic shielding member 341a may be electrically connected to a ground conductor (not shown) provided on the first circuit board 340 . The infrared light source 341 (eg, the infrared light source 241 of FIG. 2 ) may be mounted on the first circuit board 340 inside the electromagnetic shielding member 341a. For example, the infrared light source 341 may receive an electromagnetically isolated environment from the external environment by the electromagnetic shielding member 341a, and may receive a control signal or power through the internal wiring of the first circuit board 340 . have.

According to various embodiments, the infrared receiver 343 (eg, the infrared receiver 243 of FIG. 2 ) is connected to a first circuit via a second circuit board 343a (eg, the second circuit board 243a of FIG. 2 ). It may be electrically connected to the substrate 340 . In the completed electronic device 300, the infrared light source 341 and the infrared receiver 343 may be disposed adjacent to each other, and after the infrared light output from the infrared light source 341 is reflected by the subject, the infrared receiver 343 can be entered into The infrared receiver 343 may be set to receive incident infrared rays, and the processor of the electronic device 300 (eg, the processor 120 of FIG. 1 ) emits infrared rays from the infrared light source 341 and is reflected by the subject. Then, distance information about the subject may be generated or detected based on the time it takes to reach the infrared receiver 343 .

According to various embodiments, the flicker detection sensor 345 (eg, the flicker detection sensor 245 of FIG. 2 ) may be mounted on the first circuit board 340 and disposed adjacent to the infrared light source 241 . In one embodiment, inside the completed electronic device 300 , the infrared light source 341 may be disposed between the flicker detection sensor 345 and the infrared receiver 343 , and the flicker detection sensor 345 and the infrared receiver 343 (and/or the infrared light source 341 ) may be arranged in the longitudinal direction Y of the electronic device 300 . The flicker detection sensor 345 may detect flickering of artificial light, and the electronic device 300 (eg, an image signal processor) may distort or defect image data based on information detected through the flicker detection sensor 345 . can be removed.

According to various embodiments, the camera module 303 , the infrared light source 341 , the infrared receiver 343 , and/or the flicker detection sensor 345 are disposed inside the housing 301 to receive or output light. As the optical component(s), they may be arranged adjacent to each other. For example, the electronic device 300 may include a plurality of light transmitting areas TA for optical component(s). In an embodiment, the light transmitting area(s) TA may be disposed in an opening portion 381 formed in the back plate 380 . The electronic device 300 may further include a decorative structure 305 providing the light transmitting area(s) TA while closing the opening 381 .

According to various embodiments, the decorative structure 305 may include a fixing frame 351 , an adhesive member 353 (eg, the second adhesive member 273b of FIG. 2 ) and/or a camera window 355 . and may be coupled to the rear plate 380 to close the opening 381 . Even when the opening 381 is closed, the decorative structure 305 may include a plurality of light transmitting areas TA, thereby providing an environment in which optical components may receive or output light. In some embodiments, the camera window 355 may be directly mounted or fixed to the rear plate 380 , omitting the fixing frame 351 or the adhesive member 353 . For example, it should be noted that although in the present embodiment, the configuration in which the decorative structure 305 includes the fixing frame 351 or the adhesive member 353 is exemplified, the present invention is not limited thereto.

According to various embodiments, the fixing frame 353 may be at least partially mounted or fixed to an internal structure (eg, the support member 311 ) of the housing 301 . In another embodiment, the fixing frame 351 may be partially accommodated in the opening 381 while being mounted and fixed to the inner surface of the rear plate 380 . The fixed frame 351 is a camera module 303 (eg, first to third cameras 331, 332, 333), an infrared light source 341, an infrared receiver 343 and / or a flicker detection sensor 345 corresponding to the corresponding It may include first openings 351a and second openings 351b. In one embodiment, the first openings 351a may be disposed to correspond to any one of the first to third cameras 331 , 332 , 333 and the infrared receiver 343 , and the first to third cameras 331 , 332 and 333 and the infrared receiver 343 may be partially accommodated in one of the first openings 351a. The second opening 351b may be disposed to correspond to the infrared light source 341 and the flicker detection sensor 345 , and a portion of the infrared light source 341 and/or a portion of the flicker detection sensor 345 may be disposed in the second opening ( 351b).

According to various embodiments, the adhesive member 353 (eg, the second adhesive member 273b of FIG. 2 ) may attach the camera window 355 to the outer surface of the fixing frame 351 . The adhesive member 353 may include a plurality of first through-holes 353a and second through-holes 353b corresponding to the first openings 351a and/or the second opening 351b. For example, the fixing frame 351 and the adhesive member 353 include at least the camera module 305 (eg, first to third cameras 331 , 332 , 333 ), an infrared light source 341 , an infrared receiver 343 , and / or light emitted or received through the flicker detection sensor 345 may be transmitted.

According to various embodiments, the camera window 355 is made of a transparent glass plate or a polymer plate, and may include a decoration layer (eg, the decoration layer 255a of FIG. 2 ) formed on an inner surface. When the camera window 355 is coupled to the fixing frame 351 , the opening 381 , the first openings 351a , or the second opening 351b may be substantially closed. For example, the opening 381 passing through the rear plate 380 may be closed, and a waterproof or dustproof structure may be formed around the opening 381 , the first openings 351a , or the second opening 351b . The decorative layer (eg, the decorative layer 255a of FIG. 2 ) may substantially block visible light, and may be utilized for exterior decoration of the electronic device 300 by including various colors or patterns.

According to various embodiments, the housing 301 , for example, the camera window 355 may include a plurality of light transmitting areas TA. The light transmitting areas TA are regions from which a portion of the decorative layer 255a of FIG. 2 is substantially removed, and include a camera module 303 (eg, first to third cameras 331 , 32 , 333 ), an infrared light source ( 341 ), the infrared receiver 343 , and/or the flicker detection sensor 345 may be disposed to correspond to each other. For example, the camera window 355 substantially isolates the inner space of the housing 301 from the outer space, but includes some electronic components (eg, the first to third cameras 331 ) adjacent to the light transmitting areas TAs. , 332 , 333 , the infrared light source 341 , the infrared receiver 343 and/or the flicker detection sensor 345 ) may be partially exposed to the outside of the housing 301 through the light transmission areas TA. have.

According to various embodiments, the first infrared blocking film 371a and/or the elastic layer 371b may be disposed on the electromagnetic shielding member 341a. For example, the first infrared blocking film 371a and/or the elastic layer 371b may be disposed between the electromagnetic shielding member 341a and the camera window 355 . The first infrared blocking film 371a may be substantially attached to the upper surface of the electromagnetic shielding member 341a, and a surface mounting process may be utilized in attaching the first infrared blocking film 371a to the electromagnetic shielding member 341a. can The first infrared blocking film 371a may set the radiation angle range or direction of the light output from the infrared light source 341 , and through this, the infrared rays are reflected and refractioned in the process of passing through the camera window 355 and radiating to the outside. Or it can suppress scattering. The elastic layer 371b may be laminated with the first infrared blocking film 371a in a shape substantially corresponding to the first infrared blocking film 371a. In one embodiment, a portion of the adhesive member 353 may be removed to form the second through hole 353b, and the elastic layer 371b may be formed on the inner surface of the camera window 355 (or the decorative layer in FIG. 2 ). 255a) or the printed layer 255b).

According to various embodiments, the second adhesive member 373b (eg, the adhesive member 353) is formed around the light transmitting area corresponding to the infrared receiver 343 (eg, the second light transmitting area TA2 of FIG. 2 ). part) or a second infrared blocking film 373a may be provided. The second adhesive member 373b may be substantially a part of the adhesive member 353 , and support between the camera window 355 and the infrared receiver 343 or the camera window 355 together with the second infrared blocking film 373a . It may be attached between the structures 311a (eg, the fixing frame 351 ) between the members 311 . The second adhesive member 373b or the adhesive member 353 including the second adhesive member 373b may seal between the fixing frame 351 and the camera window 355 to form a waterproof or dustproof structure. In one embodiment, the second infrared blocking film 373b has a shape corresponding to the area around the light transmitting area (eg, the second light transmitting area TA2 in FIG. 2 ), and has a shape corresponding to the light reflected by the subject (eg, infrared rays). ) while allowing the incident of the infrared light output from the infrared light source 341 and reflected, refracted, or scattered while passing through the camera window 355 may be blocked from entering the infrared receiver 343 .

6 is a plan view illustrating an arrangement of electronic components in an electronic device (eg, the electronic devices 101 , 102 , 104 , 200 , and 300 of FIGS. 1 to 5 ) according to various embodiments disclosed herein. 7 is a plan view illustrating an arrangement of light transmitting areas (eg, light transmitting area TA of FIG. 3 or 4 ) in an electronic device according to various embodiments of the present disclosure;

The infrared light source 341 is accommodated in the electromagnetic shielding member 341a, and although not shown in FIG. 6, the infrared light source 341, the infrared receiver 343, and the flicker detection sensor 345 are related to the arrangement of electronic components. In the following description, the position of the electromagnetic shielding member 341a may be understood as the position of the infrared light source 341 . Although the first light transmitting area TA1 is directly illustrated in FIG. 7 , this is for ease of explanation, and as described with reference to FIGS. 2 to 5 , a printed layer (eg, the printed layer 255b of FIG. 2 ) ), the first light transmitting area TA1 may not be visually identified.

6 and 7, the infrared receiver 343 and the flicker detection sensor 345 may be arranged adjacent to each other with the infrared light source 341 interposed therebetween (hereinafter, 'first arrangement (A1)'). have. For example, the first arrangement A1 may be substantially parallel to the longitudinal direction (eg, the Y direction of FIG. 3 ) of the electronic device (eg, the electronic device 300 of FIG. 3 ). According to an embodiment, the electronic device 300 may further include a microphone 349 , and the microphone 349 is disposed adjacent to the infrared receiver 343 and positioned on an extension line of the first arrangement A1 . can In another embodiment, a distance between the electromagnetic shielding member 341a and the flicker detection sensor 345 may be set to approximately 0.22 mm, and a first circuit board (eg, the first circuit board 240 of FIG. 2 or 3 ) may be set. , 340)), the electromagnetic shielding member 341a may be disposed at a distance of about 0.33 mm from the edge.

According to various embodiments, the camera module 303 may include at least one pair of cameras 331 and 332 , and in this embodiment, the three cameras 331 , 332 , and 333 are the length of the electronic device 300 . A configuration arranged in the direction Y (hereinafter, 'second arrangement (A2)') is exemplified. For example, the first arrangement A1 and the second arrangement A2 may be substantially parallel. Among the cameras, a first camera 331 is disposed adjacent to the flicker detection sensor 345 , and the first camera 331 and the flicker detection sensor 345 are disposed in the width direction of the electronic device 300 (eg, in FIG. 3 ). It may be arranged in the X direction (hereinafter, 'third arrangement (A3)'). For example, the third arrangement A3 may mean an arrangement in a direction perpendicular to the first arrangement A1 or the second arrangement A2 . Among the cameras, the second camera 332 may be disposed adjacent to the first camera 331 and/or the infrared receiver 341 , and the second camera 332 and the infrared receiver 343 are the electronic device 300 . may be arranged in the width direction (eg, the X direction of FIG. 3 ) (hereinafter, 'fourth arrangement (A4)'). For example, the fourth arrangement A4 may refer to an arrangement in a direction parallel to the third arrangement A3 and perpendicular to the first arrangement A1 or the second arrangement A2 . Among the cameras, the third camera 333 may be disposed adjacent to the second camera 332 and/or the microphone 349 , and the third camera 333 and the microphone 349 may have a width of the electronic device 300 . direction can be arranged. The arrangement of the third camera 333 and the microphone 349 is parallel to the third arrangement A3 or the fourth arrangement A4 and perpendicular to the first arrangement A1 or the second arrangement A2. can mean

In this embodiment, the 'first to fourth arrays (A1, A2, A3, A4)' are the infrared receiver 343 , the flicker detection sensor 345 and/or the light reception of the cameras 331 , 332 , 333 . It may be defined based on an area (eg, an area indicated by 'RA' in the case of an infrared receiver). For example, a straight line passing through the center of the light receiving area of the flicker detection sensor 345 and the center of the light receiving area RA of the infrared receiver 343 may be defined as the 'first arrangement A1'.

According to various embodiments, the first light transmitting area TA1 is a region in which a portion of the decoration layer (eg, the decoration layer 255a of FIG. 2 ) is removed from the inner surface of the camera window 355 , and the first light transmitting area TA1 is a region from which the first light transmitting area TA1 is removed. A printed layer (eg, the printed layer 255b of FIG. 2 ) may be formed in the area TA1 . For example, it should be noted that the first light transmitting area TA1 or an internal structure adjacent thereto may not be visually identified from the outside of the camera window 355 , and is directly illustrated in FIG. 7 for ease of description. The first light transmitting area TA1 may be positioned slightly shifted from the first arrangement A1 , but may not be substantially identified with the naked eye of a user. The first light transmitting area TA1 is positioned to correspond to the infrared light source 341 , and an infrared blocking film 371a (eg, between the camera window 355 and the infrared light source 341 (or the electromagnetic shielding member 341a )) : The first infrared blocking film 271a of FIG. 2) may be disposed. The infrared blocking film 371a may define an infrared radiation area EA output from the infrared light source 341 . In one embodiment, if the centers of the first light transmission area TA1 and the emission area EA are aligned along the thickness direction (eg, the Z direction of FIG. 2 ), the first light transmission area TA1 and the emission area Infrared rays may be radiated to the outside of the electronic device 300 through a region having a smaller area among (EA).

According to various embodiments, the second light transmission area TA2 may be disposed to correspond to the infrared receiver 343 , and the third light transmission area TA3 may be disposed to correspond to the flicker detection sensor 345 . For example, the third light transmitting area TA3 may be disposed adjacent to the second light transmitting area TA2 with the first light transmitting area TA1 interposed therebetween. The second light transmitting area TA2 and the third light transmitting area TA3 may be arranged parallel to the longitudinal direction (eg, the Y direction of FIG. 2 or 3 ) of the electronic device 300 . In one embodiment, the camera window 355 may further include an acoustic hole AH formed to penetrate from the inner surface to the outer surface. For example, an external sound may be input to the microphone 349 through the sound hole AH. The acoustic hole AH is formed along with the second light transmitting area TA2 (and/or the third light transmitting area TA3) in the longitudinal direction of the electronic device 300 (eg, the Y direction of FIG. 2 or 3 ). They may be arranged in parallel.

According to various embodiments, among the plurality of light transmitting areas formed on one surface of the housing (eg, the housing 301 of FIG. 3 ), for example, the camera window 355 , the fourth light transmitting area TA4 and the fifth The light transmitting area TA5 and/or the sixth light transmitting area TA6 may be disposed to correspond to one of the first camera 331 , the second camera 332 , and/or the third camera 333 . For example, the fourth light transmitting area TA4 may be disposed to correspond to the first camera 331 and may be disposed adjacent to the third light transmitting area TA3 . The arrangement of the third light transmitting area TA3 and the fourth light transmitting area TA4 may be substantially parallel to the width direction of the electronic device 300 (eg, the X direction of FIG. 3 ), and the third arrangement A3 . ) can match. The fifth light transmitting area TA5 may be disposed to correspond to the second camera 332 , and may be disposed adjacent to the second light transmitting area TA2 and the fourth light transmitting area TA4 . For example, the arrangement of the fifth light transmitting area TA5 and the second light transmitting area TA2 may coincide with the fourth arrangement A4 , and the fourth light transmitting area TA4 and the fifth light transmitting area TA2 may be arranged The arrangement of (TA5) may coincide with the second arrangement (A2). The sixth light transmitting area TA6 may be disposed to correspond to the third camera 333 , and may be disposed adjacent to the fifth light transmitting area TA5 and the acoustic hole AH. For example, the arrangement of the sixth light transmitting area TA6 and the acoustic hole AH may be parallel to the width direction of the electronic device 300 .

According to various embodiments, the second to sixth light transmitting areas TA2 , TA3 , TA4 , TA5 , and TA6 and/or the acoustic hole AH excluding the first light transmitting area TA1 are generally in the electronic device 300 . ) may be arranged parallel to the longitudinal direction (Y) or the width direction (X). For example, it is easy to arrange a transparent region or a through-hole structure that is visually recognized from the exterior of the electronic device 300 at a location intended by a designer, so that it can be arranged in harmony with the shape of the electronic device 300 . In another embodiment, the first light transmitting area TA1 may be disposed at an arbitrary position because it is hidden by a printed layer (eg, the printed layer 255b of FIG. 2 ) and thus is not visually identified. For example, the degree of freedom in design regarding the position of the infrared light source 341 or the first light transmitting area TA1 may be improved. The printed layer 255b may block visible light and transmit infrared rays, and infrared rays passing through the printed layer 255a or the camera window 355 may transmit the boundary surface (eg, the printed layer 255b or the surface of the camera window 355). Reflection, refraction or scattering may occur in (s)). The electronic device 300 according to various embodiments may include an infrared blocking film (eg, the first infrared blocking film 271a or the second infrared blocking film 273a of FIG. 2 ) to reduce reflection, refraction or scattering of infrared rays. suppression, and may block the already reflected, refracted, or scattered infrared rays from entering the infrared receiver 343 . For example, interference with infrared rays incident to the infrared receiver 343 may be suppressed, and reception accuracy of the infrared receiver 343 may be improved.

8 is a perspective view illustrating a front surface of an electronic device 400 (eg, the electronic devices 200 and 300 of FIG. 2 or 3 ) according to various embodiments of the present disclosure. FIG. 9 is a perspective view illustrating a rear surface of the electronic device 400 illustrated in FIG. 8 .

8 and 9 , an electronic device 400 according to an exemplary embodiment has a first side (or front side) 410A, a second side (or back side) 410B, and a first side 410A. and a housing 410 including a side surface 410C surrounding the space between the second surfaces 410B. In another embodiment (not shown), the housing may refer to a structure that forms part of the first surface 410A of FIG. 8 , the second surface 410B of FIG. 9 , and the side surface 410C. According to one embodiment, the first side 410A is at least a portion of a substantially transparent front plate 402 (eg, the front plate 320 of FIG. 3 , a glass plate comprising various coating layers, or a polymer plate). can be formed by In another embodiment, the front plate 402 may be coupled to the housing 410 to form an inner space together with the housing 410 . In various embodiments, the term 'internal space' may mean a space accommodating at least a portion of the display 401 as an internal space of the housing 410 .

According to various embodiments, the second surface 410B may be formed by a substantially opaque rear plate 411 (eg, the rear plate 380 of FIG. 3 ). The back plate 411 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. can be The side surface 410C is coupled to the front plate 402 and the rear plate 411 and may be formed by a side bezel structure (or "side member") 418 including a metal and/or a polymer. In various embodiments, the back plate 411 and the side bezel structure 418 are integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 402 includes two first regions 410D (eg, curved regions) extending seamlessly by bending from the first surface 410A toward the rear plate 411 . ) may be included at both ends of the long edge of the front plate 402 . In the illustrated embodiment, the rear plate 411 includes two second regions 410E (eg, curved regions) that are bent from the second surface 410B toward the front plate 402 to extend seamlessly. It can be included at both ends of the edge. In various embodiments, the front plate 402 (or the back plate 411 ) may include only one of the first regions 410D (or the second regions 410E). In another embodiment, some of the first regions 410D or the second regions 410E may not be included. In the above embodiments, when viewed from the side of the electronic device 400 , the side bezel structure 418 has a side (eg, the first area 410D or the second area 410E) not included. A side (eg, a key input device 417 ) having a first thickness (or width) and including the first area 410D or the second area 410E is disposed on the side where the connector hole 408 is formed. side) side may have a second thickness thinner than the first thickness.

According to an embodiment, the electronic device 400 includes a display 401 , audio modules 403 , 407 , 414 , a sensor module 404 , camera modules 405 and 455 , a key input device 417 , and light emission. element 406 , and at least one or more of connector holes 408 , 409 . In various embodiments, the electronic device 400 may omit at least one of the components (eg, the key input device 417 or the light emitting device 406 ) or additionally include other components.

The display 401 may be exposed through a substantial portion of the front plate 402 , for example. In various embodiments, at least a portion of the display 401 may be exposed through the front plate 402 forming the first area 410D of the first surface 410A and the side surface 410C. In various embodiments, the edge of the display 401 may be formed to be substantially the same as an adjacent outer shape of the front plate 402 . In another embodiment (not shown), in order to expand the area to which the display 401 is exposed, the distance between the outer periphery of the display 401 and the outer periphery of the front plate 402 may be substantially the same.

In another embodiment (not shown), a recess or opening is formed in a portion of a screen display area (eg, an active area) or an area outside the screen display area (eg, an inactive area) of the display 401; and at least one of an audio module 414 , a sensor module 404 , a camera module 405 , 455 , and a light emitting device 406 aligned with the recess or the opening. In another embodiment (not shown), at least one of an audio module 414 , a sensor module 404 , a camera module 405 , 455 , and a light emitting element 406 on the rear surface of the screen display area of the display 401 . may include more than one. In another embodiment (not shown), the display 401 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed. In some embodiments, at least a portion of the sensor module 404, and/or at least a portion of a key input device 417, is disposed in the first areas 410D and/or the second areas 410E can be

The audio modules 403 , 407 , and 414 may include a microphone hole 403 and speaker holes 407 and 414 . In the microphone hole 403 , a microphone for acquiring an external sound may be disposed therein, and a plurality of microphones may be disposed to sense the direction of the sound in various embodiments. The speaker holes 407 and 414 may include an external speaker hole 407 and a call receiver hole 414 . In various embodiments, the speaker holes 407 and 414 and the microphone hole 403 may be implemented as a single hole, or a speaker may be included without the speaker holes 407 and 414 (eg, a piezo speaker).

The sensor module 404 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 400 or an external environmental state. The sensor module 404 may include, for example, a first sensor module 404 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on a first surface 410A of the housing 410 ( Example: a fingerprint sensor), and/or another sensor module (not shown) disposed on the second surface 410B of the housing 410 (eg, an HRM sensor or a fingerprint sensor). The fingerprint sensor may be disposed on the second surface 410B as well as the first surface 410A (eg, the display 401 ) of the housing 410 . The electronic device 400 includes a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor 404 .

The camera modules 405 and 455 include the first camera device 405 disposed on the first surface 410A of the electronic device 400 and the second camera device 455 disposed on the second surface 410B of the electronic device 400 . may include The second camera device 455 includes, for example, a first component (eg, infrared light sources 241 and 341 ) and a second component (eg, an infrared receiver 243 ), which have been described with reference to FIGS. 2 to 5 . 343)), flicker detection sensors 245 and 345 , and/or a plurality of cameras (eg, first to third cameras 331 , 332 , 333 ). The camera module 405, 455 may include one or more lenses, an image sensor and/or an image signal processor. A flash (not shown) may be disposed on the second surface 410B. The flash 413 may include, for example, a light emitting diode or a xenon lamp. In various embodiments, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 400 .

The key input device 417 may be disposed on the side surface 410C of the housing 410 . In another embodiment, the electronic device 400 may not include some or all of the above-mentioned key input devices 417 and the not included key input devices 417 are displayed on the display 401 as soft keys or the like. It may be implemented in other forms.

The light emitting device 406 may be disposed, for example, on the first surface 410A of the housing 410 . The light emitting device 406 may provide, for example, state information of the electronic device 400 in the form of light. In another embodiment, the light emitting device 406 may provide a light source that is interlocked with the operation of the camera module 405 , for example. The light emitting element 406 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 408 and 409 are a first connector hole 408 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 409 capable of accommodating a connector for transmitting and receiving audio signals.

As described above, according to various embodiments disclosed herein, an electronic device (eg, the electronic devices 101 , 102 , 104 , 200 , and 300 of FIGS. 1 to 5 ) includes a plurality of light transmitting areas provided on one surface. A housing (eg, housing 301 of FIG. 3 ) comprising (eg, light transmitting areas TA, TA1, TA2, TA3, TA4, TA5, TA6 of FIG. 2 , 3 or 7 ), the housing A first circuit board accommodated in the interior of (eg, the first circuit boards 240 and 340 of FIG. 2 or FIG. 3 ), a second circuit board accommodated in the housing and electrically connected to the first circuit board (eg, the first circuit boards 240 and 340 of FIG. 3 ) : the second circuit boards 243a and 343a of FIG. 2 or 3 ), mounted on the first circuit board, and a first light transmitting area (eg, the first light transmitting area of FIG. 2 or 7 ) among the plurality of light transmitting areas A first component (eg, the infrared light sources 241 and 341 of FIG. 2 or 3 ) disposed to correspond to the light transmitting area TA1 and emitting infrared rays through the first light transmitting area, the plurality of light transmitting areas A second component (eg, FIG. 2 or FIG. 3 ) disposed to correspond to the second light transmitting area (eg, the second light transmitting area TA2 of FIG. 2 or FIG. 7 ) among the areas and mounted on the second circuit board (eg, FIG. 2 or 3 ) of infrared receivers 243 and 343), and a printed layer ( Example: the printed layer 255b of FIG. 2), and the second part may be configured to receive infrared rays emitted from the first part and reflected by the subject.

According to various embodiments, the printed layer may have a visible light transmittance of 1% to 15%, and an infrared transmittance of 70% to 99%.

According to various embodiments, the electronic device as described above is disposed to correspond to at least a portion of a circumference of the first light transmitting region between one surface of the housing and the first component or between one surface of the housing and the second component A first infrared blocking film (eg, the first infrared blocking films 271a and 371a of FIG. 2 or 5) may be further included.

According to various embodiments, the first infrared blocking film may be disposed to partially overlap an edge of the first light transmitting area.

According to various embodiments, at least a portion of the first infrared blocking film may be disposed to correspond to an area between the first light transmitting area and the second light transmitting area.

According to various embodiments, in the electronic device as described above, between one surface of the housing and the second component, a second infrared blocking film (eg, FIG. 2 ) disposed to correspond to at least a portion of the periphery of the second light transmitting region Alternatively, the second infrared blocking films 273a and 373a of FIG. 5) may be further included.

According to various embodiments, the second circuit board may include a flexible printed circuit board.

According to various embodiments, in the electronic device as described above, an electromagnetic shielding member (eg, the electromagnetic shielding member 241a of FIG. 2 or 3 , 341a)) may be further included.

According to various embodiments, the electronic device as described above further includes a first infrared blocking film attached to the electromagnetic shielding member, wherein the first infrared blocking film is at least partially between one surface of the housing and the electromagnetic shielding member can be placed in

According to various embodiments, the electronic device as described above further includes a first infrared blocking film attached to the electromagnetic shielding member, wherein the first infrared blocking film corresponds to at least a portion of the circumference of the first light transmitting region can be placed.

According to various embodiments, the electronic device as described above further includes an elastic layer disposed between one surface of the housing and the first infrared blocking film (eg, the elastic layer 371b and 371b of FIG. 2 or 3 ). can do.

According to various embodiments, the electronic device as described above detects flicker disposed to correspond to a third light transmitting area (eg, the third light transmitting area TA3 of FIG. 2 or 7 ) among the plurality of light transmitting areas. A flicker detecting sensor (eg, the flicker detecting sensors 245 and 345 of FIG. 2 , 3 , 5 or 6 ), a fourth light transmission area (eg, FIG. 2 or FIG. 2 or FIG. A first camera (eg, the first camera 331 of FIG. 3 or 6 ) disposed to correspond to the fourth light transmitting area TA4 of FIG. 7 , and a fifth light transmitting area of the plurality of light transmitting areas ( For example, a second camera (eg, the second camera 332 of FIG. 3 or 6 ) disposed to correspond to the fifth light transmitting area TA5 of FIG. 2 or FIG. 7 , and the first light The transmissive region may be disposed between the second light transmissive region and the third light transmissive region.

According to various embodiments, the arrangement of the second component and the flicker detection sensor (eg, the first arrangement A1 in FIG. 6 ) is the arrangement of the first camera and the second camera (eg, the arrangement of the second camera in FIG. 6 ) It may be arranged parallel to the arrangement A2).

According to various embodiments, the arrangement of the flicker detection sensor and the first camera (eg, the third arrangement A3 in FIG. 6 ) may include the arrangement of the second component and the second camera (eg, the arrangement of the second camera in FIG. 6 ). It may be arranged parallel to the arrangement A4).

According to various embodiments, the electronic device as described above further includes a processor (eg, the processor 120 of FIG. 1 ), wherein the processor provides distance information on the subject based on the infrared rays received through the second component. can be set to create

According to various embodiments disclosed herein, an electronic device includes a housing including a plurality of light transmitting regions provided on one surface, a first circuit board accommodated in the housing, a processor disposed on the first circuit board, and the first circuit board An infrared light source mounted on a circuit board and disposed to correspond to a first light transmitting area among the plurality of light transmitting areas, an infrared receiver disposed to correspond to a second light transmitting area among the plurality of light transmitting areas, and the housing. A printed layer formed to correspond to at least the first light transmitting area between the rear surface and the infrared light source, and an infrared blocking film disposed to correspond to at least a portion of the circumference of the first light transmitting area between one surface of the housing and the infrared light source including, wherein the infrared receiver receives infrared rays emitted from the infrared light source and reflected by the subject, and the infrared blocking film receives infrared rays passing through the first light transmission area to the second light transmission area. interference can be prevented.

According to various embodiments, the printed layer may have a visible light transmittance of 1% to 15%, and an infrared transmittance of 70% to 99%.

According to various embodiments, the electronic device as described above further includes an electromagnetic shielding member mounted on the first circuit board and disposed to at least partially surround the infrared light source, wherein the infrared blocking film is attached to the electromagnetic shielding member can be

According to various embodiments, the electronic device as described above further includes a second circuit board accommodated in the housing and electrically connected to the first circuit board, wherein the infrared receiver is mounted on the second circuit board. can

According to various embodiments, the second circuit board may include a flexible printed circuit board.

As mentioned above, although specific embodiments have been described in the detailed description of this document, it will be apparent to those of ordinary skill in the art that various modifications are possible without departing from the scope of the present invention. For example, in the above-described embodiment, "a configuration in which a microphone (eg, the microphone 349 in FIG. 6 ) is disposed adjacent to the infrared receiver and positioned on an extension line of the first arrangement A1" was exemplified, Note that the present invention is not limited thereto. A duct structure or waveguide for sound guide may be provided between the microphone and the acoustic hole (eg, the acoustic hole AH in FIG. 7 ), and the position of the microphone may vary depending on the acoustic path provided by the duct structure or the waveguide. can be variously changed.

101, 200, 300 electronic device 301 housing
240, 340 circuit board 241, 341 infrared light source
243, 343: infrared receiver 271a, 371a: first infrared blocking film
271b, 371b: elastomer layer

Claims (20)

In an electronic device,
a housing including a first surface facing a first direction and a second surface facing a direction opposite to the first direction;
a plurality of light transmitting regions disposed on the second surface;
a first circuit board disposed between the first surface and the second surface;
a second circuit board accommodated in the housing and electrically connected to the first circuit board;
a first component disposed on the first circuit board and disposed to correspond to a first light transmitting area among the plurality of light transmitting areas and emitting infrared rays through the first light transmitting area;
a second component mounted on the second circuit board disposed to correspond to a second light transmitting area among the plurality of light transmitting areas; and
A printed layer disposed between the second surface and the first part, at least a portion of which is formed to correspond to the first light transmitting area, and comprising the printed layer that blocks visible light and transmits infrared light; ,
The second component is configured to receive infrared rays emitted from the first component and reflected by the subject.
The electronic device of claim 1 , wherein the printed layer has a visible light transmittance of 2% to 15% and an infrared transmittance of 70% to 99%.
The method of claim 1,
and a first infrared blocking film disposed between one surface of the housing and the first component or between one surface of the housing and the second component to correspond to at least a portion of the circumference of the first light transmitting area.
The electronic device of claim 3 , wherein the first infrared blocking film partially overlaps an edge of the first light transmitting region.
The electronic device of claim 3 , wherein at least a portion of the first infrared blocking film is disposed to correspond to an area between the first light transmitting area and the second light transmitting area.
4. The method of claim 3,
and a second infrared blocking film disposed between one surface of the housing and the second sub-boom to correspond to at least a portion of the periphery of the second light transmitting area.
The electronic device of claim 1 , wherein the second circuit board comprises a flexible printed circuit board.
The method of claim 1,
and an electromagnetic shielding member mounted on the first circuit board and disposed to at least partially surround the first component.
9. The method of claim 8,
Further comprising a first infrared blocking film attached to the electromagnetic shielding member,
The first infrared blocking film is at least partially disposed between the one surface of the housing and the electromagnetic shielding member.
9. The method of claim 8,
Further comprising a first infrared blocking film attached to the electromagnetic shielding member,
The first infrared blocking film is disposed to correspond to at least a portion of the circumference of the first light transmitting area.
The method of claim 1,
The electronic device further comprising an elastic layer disposed between one surface of the housing and the first infrared blocking film.
The method of claim 1,
a flicker detecting sensor disposed to correspond to a third light transmitting area among the plurality of light transmitting areas;
a first camera disposed to correspond to a fourth light transmitting area among the plurality of light transmitting areas; and
Further comprising a second camera disposed to correspond to a fifth light transmitting area among the plurality of light transmitting areas,
The first light transmitting area is disposed between the second light transmitting area and the third light transmitting area.
The electronic device of claim 12 , wherein the arrangement of the second component and the flicker detection sensor is parallel to the arrangement of the first camera and the second camera.
The electronic device of claim 12 , wherein the arrangement of the flicker detection sensor and the first camera is parallel to the arrangement of the second component and the second camera.
The method of claim 1,
further comprising a processor;
The processor is configured to generate distance information about the subject based on the infrared rays received through the second component.
In an electronic device,
a housing including a plurality of light transmitting areas provided on one surface;
a first circuit board accommodated in the housing;
a processor disposed on the first circuit board;
an infrared light source mounted on the first circuit board and disposed to correspond to a first light transmitting area among the plurality of light transmitting areas;
an infrared receiver disposed to correspond to a second light transmitting area among the plurality of light transmitting areas;
a printed layer formed to correspond to at least the first light transmitting area between the rear surface of the housing and the infrared light source; and
and an infrared blocking film disposed between one surface of the housing and the infrared light source to correspond to at least a portion of the periphery of the first light transmitting region,
The infrared receiver receives infrared rays emitted from the infrared light source and reflected by the subject,
The infrared blocking film blocks infrared rays passing through the first light transmitting region from interference with infrared rays being received through the second light transmitting region.
The electronic device of claim 16 , wherein the printed layer has a visible light transmittance of 1% to 15% and an infrared transmittance of 70% to 99%.
17. The method of claim 16,
and an electromagnetic shielding member mounted on the first circuit board and disposed to at least partially surround the infrared light source;
The electronic device in which the infrared blocking film is attached to the electromagnetic shielding member.
17. The method of claim 16,
A second circuit board accommodated in the housing and electrically connected to the first circuit board,
The electronic device in which the infrared receiver is mounted on the second circuit board.
The electronic device of claim 19 , wherein the second circuit board comprises a flexible printed circuit board.

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