KR20210090494A - Motor operated compressor - Google Patents

Abstract

Disclosed is a compressor in which a semiconductor device is disposed in contact with an inner wall of an inverter apparatus. The semiconductor device provided in the compressor according to an embodiment of the present invention is in contact with a portion of the inner wall of the inverter apparatus having a relatively high heat conduction efficiency. Accordingly, the semiconductor device can be efficiently dissipated, so that a cooling efficiency of the semiconductor device can be improved. In addition, a plurality of semiconductor devices are provided, and the plurality of semiconductor devices are spaced apart from each other at a predetermined distance. Thereby, a fluid inside an inverter chamber can flow more efficiently between the semiconductor devices, so that the semiconductor device can be efficiently dissipated. As a result, the cooling efficiency of the semiconductor device may be improved. The electric compressor of the present invention comprises: a casing; a rotation shaft; an inverter device; a heat exchange unit; and the semiconductor device.

Description

Electric Compressor {MOTOR OPERATED COMPRESSOR}

The present invention relates to an electric compressor.

A compressor that compresses a refrigerant in an air conditioning system for a vehicle has been developed in various forms. In recent years, the development of an electric compressor driven by electricity using a motor has been actively carried out in accordance with the trend toward electricization of automobile parts.

A scroll compression method suitable for high compression ratio operation is mainly applied to electric compressors. Such a scroll type electric compressor (hereinafter, referred to as an "electric compressor") is composed of an electric part, a compression part, a rotation shaft connecting the electric part and the compression part, and an inverter part controlling the electric part.

Specifically, the electric part is provided with a rotating motor or the like and is installed in a motor room formed inside the casing. The compression part is located on one side of the transmission part, and consists of a fixed scroll and an orbiting scroll. The rotating shaft is configured to transmit the rotational force of the transmission unit to the compression unit. A refrigerant flows into the motor chamber, and the introduced refrigerant is moved to a compression unit and compressed by the compression unit.

In addition, the rotation speed of the above-described electric compressor is controlled by the inverter unit. The inverter unit is installed in an inverter chamber formed inside the casing. The inverter unit includes a plurality of heat generating elements that generate heat during operation. Therefore, according to the operation of the electric compressor, a large amount of heat may be generated in the inverter unit.

However, the heating elements provided in the inverter part have low durability against heat, so there is a risk of being damaged by heat.

In order to cool the heating element, some of the conventional electric compressors arrange the heating elements in contact with a member dividing the motor chamber and the inverter chamber.

A member dividing the motor room and the inverter room receives heat generated by being in direct contact with the heating elements. The heat transferred to the member is transferred to the outer surface of the casing and transferred to the external air, or transferred to the refrigerant flowing in the motor compartment. Thereby, the heating elements can be cooled.

However, a portion that does not come into contact with the refrigerant may be generated in the member, and when the heat generating element is in contact with the member from the opposite side of the portion, the heat dissipation efficiency of the heat generating element may be reduced.

In the case of a heating element, especially a power semiconductor (IGBT, Insulated Gate BipAar Transitor), characteristics such as allowable current value are determined according to temperature. In general, a power semiconductor has a high allowable current value at a low temperature. That is, as the power semiconductor is maintained at a lower temperature, the performance of the power semiconductor is improved.

Of course, power semiconductors that can exhibit high performance even at high temperatures have been developed. However, since such a high-performance power semiconductor is very expensive, it causes an increase in the price of a vehicle equipped with an inverter, an electric compressor, and furthermore, an electric compressor.

In addition, the plurality of power semiconductors form a plurality of pairs, and each pair of power semiconductors supplies polyphase power to the electric unit. A printed circuit for supplying power to each phase from each pair of power semiconductors to the electric part is formed on the printed circuit board, respectively.

However, when the lengths of each printed circuit are different, a difference in inductance or resistance component occurs due to the difference in the length of the printed circuits.

Thereby, a difference in the electric power of each phase supplied to the electric part may be generated.

Accordingly, there is an increasing demand for an electric compressor capable of effectively dissipating heat from the heating element provided in the inverter unit and uniformly generating electric power of each phase supplied to the electric unit.

Korean Patent Laid-Open Publication No. 10-2018-0007297 discloses an inverter in which the area occupied by power semiconductors on a printed circuit board is reduced. Specifically, the power semiconductors constituting the power semiconductor pair are arranged in two rows in the center of the inverter unit, and the distance between the power semiconductors arranged in the first column and the distance between the power semiconductor elements arranged in the second column are arranged differently.

However, when the bearing portion for accommodating the rotating shaft is formed in the central portion of the member dividing the motor chamber and the inverter chamber, the central portion of the member may not come into contact with the refrigerant. Accordingly, there may be a problem in that the efficiency of the power semiconductors in transferring heat to the member is lowered.

In addition, while the heat generated from the power semiconductor is radiated in all directions, since the power semiconductors are dense with each other, there may be a problem in that the heat dissipation efficiency between the power semiconductors is lowered.

In addition, since each distance between the power semiconductors forming each pair is formed differently, there is a difference in the length of the printed circuit, which may cause a problem in that the uniformity of the electric power supplied to each phase is lowered.

Korean Patent Publication No. 10-2018-0007297 (2018.01.22.)

It is an object of the present invention to provide an electric compressor having a structure capable of solving the above-described problems.

First, an object of the present invention is to provide an electric compressor having a structure in which a heating element provided inside an inverter unit can be effectively cooled.

Another object of the present invention is to provide an electric compressor having a structure in which the heating element can be effectively cooled by bringing the heating element into contact with a heat exchange unit dividing the inverter chamber and the motor chamber.

Another object of the present invention is to provide an electric compressor having a structure in which the heating element can be effectively cooled by bringing the heating element into contact with a portion having a relatively high heat conduction efficiency among parts of a heat exchange unit.

Another object of the present invention is to provide an electric compressor having a structure in which the heating elements can be effectively cooled by securing a gap between the heating elements.

In addition, an object of the present invention is to provide an electric compressor in which the power of each phase supplied to the electric part can be uniformly formed by forming the same length of the pattern circuit for applying the power to each phase.

In order to achieve the above object, an electric compressor according to the present invention includes a casing having a motor chamber in which the motor is accommodated; a rotating shaft coupled to the motor to rotate; an inverter device positioned on one side of the casing and having an inverter chamber in which a printed circuit board is accommodated; a heat exchange unit provided in the casing or the inverter device to partition the motor room and the inverter room, and configured to exchange heat with the motor room and the inverter room, respectively; and a semiconductor device positioned between the printed circuit board and the heat exchange unit, and connected to the printed circuit board to be energized.

In addition, the heat exchange unit includes a bearing part protruding from one side facing the motor chamber to support one side of the rotation shaft, and a part of the other side surface of the heat exchange unit facing the inverter chamber is in the axial direction with the bearing unit. overlapped

In addition, the semiconductor element is in contact with another part of the other surface of the heat exchange unit.

In addition, the semiconductor device is provided in plurality, and the plurality of semiconductor devices are disposed adjacent to a boundary between the part of the other surface of the heat exchange part and the other part.

In addition, the plurality of semiconductor devices are spaced apart from each other by a predetermined distance to partially surround the boundary.

A plurality of bus bars operably connected to the motor are disposed between the printed circuit board and the heat exchange unit, the semiconductor devices are provided in plurality, and the plurality of semiconductor devices include the plurality of bus bars and the plurality of bus bars, respectively. A plurality of pairs of semiconductor elements connected to be energized are provided.

In addition, the plurality of pairs of the semiconductor elements are disposed adjacent to the boundary between the part and the other part of the other side of the heat exchange part, and the plurality of pairs of semiconductor devices are spaced apart from each other by a predetermined distance to partially surround the boundary.

In addition, the two semiconductor devices constituting the pair of semiconductor devices are disposed adjacent to each other.

In addition, the two semiconductor devices constituting the pair of semiconductor devices are disposed to be spaced apart from each other by a predetermined distance.

In addition, a plurality of printed circuits are formed on the printed circuit board to electrically connect the plurality of pairs of the semiconductor elements and the plurality of bus bars, respectively.

In addition, the plurality of printed circuits are formed in the same pattern as each other.

In addition, the plurality of printed circuits are formed to have the same length as each other.

In addition, the electric compressor according to the present invention, a casing having a motor chamber in which the motor is accommodated; a rotating shaft coupled to the motor to rotate; an inverter device positioned on one side of the casing and having an inverter chamber in which a printed circuit board is accommodated; a heat exchange unit provided in the casing or the inverter device to partition the motor room and the inverter room, and configured to exchange heat with the motor room and the inverter room, respectively; and a semiconductor device positioned between the printed circuit board and the heat exchange unit, and connected to the printed circuit board to be energized.

In addition, a portion of the one side surface of the heat exchange unit is formed to be in contact with the refrigerant flowing into the motor chamber, and the semiconductor element is, among portions of the other side surface opposite to the one side surface of the heat exchange unit, the one side surface of the heat exchange unit is in contact with a portion overlapping in the axial direction with a portion of

A plurality of bus bars operably connected to the motor are disposed between the printed circuit board and the heat exchange unit, the semiconductor devices are provided in plurality, and the plurality of semiconductor devices include the plurality of bus bars and the plurality of bus bars, respectively. A plurality of pairs of semiconductor elements connected to be energized are provided.

In addition, the plurality of semiconductor device pairs are disposed to be spaced apart from each other by a predetermined distance.

In addition, the two semiconductor devices constituting the pair of semiconductor devices are disposed to be spaced apart from each other by a predetermined distance.

The effects according to the present invention are as follows.

First, the semiconductor element is brought into contact with a heat exchange unit that partitions the motor chamber and the inverter chamber. In addition, heat generated from the semiconductor element is transferred to the heat exchange unit, and the heat transferred to the heat exchange unit is transferred to the outer surface of the casing or the refrigerant in the motor compartment. Thereby, the semiconductor element can be cooled efficiently.

In addition, the semiconductor element is in contact with a portion of the heat exchange portion having a relatively thin axial thickness and smoothly contacting the refrigerant. Thereby, heat conduction efficiency between the semiconductor element and the refrigerant may be improved, and heat dissipation and cooling efficiency of the semiconductor element may be improved.

In addition, a plurality of semiconductor devices are disposed to be spaced apart from each other. Thereby, the fluid in the inverter chamber can flow more smoothly into the space between the plurality of semiconductors, so that heat dissipation efficiency can be improved. As a result, the semiconductor element can be efficiently cooled.

Furthermore, since the plurality of semiconductor elements are disposed to be spaced apart from each other, heat may be smoothly transferred to a portion of the heat exchange unit positioned between the semiconductor elements. Thereby, the heat dissipation efficiency of a semiconductor element improves. As a result, the semiconductor element can be efficiently cooled.

In addition, the plurality of pairs of semiconductor elements and the electric part are electrically connected by a plurality of printed circuits. Furthermore, each printed circuit is formed to have a uniform length with respect to each other. As a result, the electric power of each phase supplied to the electric part can be formed uniformly with each other.

1 is a perspective view of an electric compressor according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view illustrating a configuration provided in the electric compressor of FIG. 1 .
3 is an exploded perspective view of an inverter device provided in the electric compressor of FIG. 1 .
FIG. 4 is a cross-sectional view showing an inverter device of the electric compressor of FIG. 1 .
FIG. 5 is a perspective view showing the inverter housing from the motor room side of FIG. 4 .
Fig. 6 is a perspective view showing the inverter housing from the inverter room side of Fig. 4;
FIG. 7 is a plan view of the inverter unit of FIG. 4 .
8 is a plan view illustrating another embodiment of the inverter unit of FIG. 7 .
9 is a perspective view of a semiconductor device and a power connector provided in an electric compressor according to another embodiment of the present invention.
FIG. 10 is an exploded perspective view of the semiconductor device and the power connector of FIG. 9 .
11 is a plan view of the sub printed circuit board of FIG. 10 .

Hereinafter, an electric compressor according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the following description, in order to clarify the characteristics of the present invention, descriptions of some components may be omitted.

First, terms used in the following description are defined.

The term "printed circuit board" (PCB, Printed Circuit Board) used in the following description refers to fixing electronic components such as integrated circuits, resistors, and capacitors to the surface of a printed wiring board, and connecting between the components with wires. It means a substrate on which an electronic circuit is formed.

The term "semiconductor device" used in the following description means an electronic circuit device using a semiconductor. In an embodiment, the semiconductor device may be a switching device.

That is, in an embodiment, the semiconductor element may refer to a component or device provided as a switching element and having a function of opening and closing a circuit without using a contact point. In the above embodiment, the switching element is a Silicon Carbide (SIC), Gallium Nitride (GaN), Insulated Gate BipAar Transistor (IGBT), Matel-Oxide Semiconductor Field-Effect Transistor (MOSFET), metal oxide semiconductor field effect transistor) and the like.

When a component is referred to as being “connected” or “connected” to another component, it is understood that the other component may be directly connected or connected to the other component, but other components may exist in between. it should be

On the other hand, when it is mentioned that a certain element is "directly connected" or "directly connected" to another element, it should be understood that the other element does not exist in between.

As used herein, the singular expression includes the plural expression unless the context clearly dictates otherwise.

The terms “front side”, “rear side”, “left”, “right”, “top” and “bottom” used in the following description are shown in FIGS. 1 , 3 , 4 , 5 and 9 . It will be understood with reference to the coordinate system.

Next, the configuration of the electric compressor 10 according to an embodiment of the present invention will be described.

1 and 2 , the electric compressor 10 according to an embodiment of the present invention includes a casing 100 , an inverter device 200 , a motor 300 , a compression unit 400 , and a fastening unit 500 . include

The inverter device 200 includes an inverter unit 600 configured to control the motor 300 . The inverter unit 600 will be described in detail later.

Hereinafter, an electric compressor 10 according to the illustrated embodiment will be described with reference to FIGS. 1 and 2 .

The casing 100 forms the exterior of the electric compressor. In addition, a predetermined space is formed inside the casing 100 , and various components for performing the function of the electric compressor may be mounted.

The casing 100 is preferably formed of a material having sufficient rigidity so as not to be damaged even when the internal pressure increases as the refrigerant is compressed.

In the illustrated embodiment, the casing 100 includes a main housing 110 and a rear housing 120 .

In addition, the inverter housing 210 of the inverter device 200 to be described later is coupled to the main housing 110 of the casing 100 and may be referred to as a front housing.

A motor 300 to be described later is accommodated in the main housing 110 . In addition, the rear housing 120 and the inverter housing 210 to be described later are coupled to one side and the other side of the main housing 110 .

Specifically, the main housing 110 is partitioned from the inverter device 200 to be described later by the inverter housing 210 . In addition, the main housing 110 is fluidly coupled to the rear housing 120 .

The main housing 110 is coupled to the rear housing 120 and the inverter housing 210 by a fastening part 500 to be described later.

Specifically, a plurality of inverter fastening holes 520 to be described later are formed on one side of the main housing 110 in contact with the inverter housing 210 . An inverter fastening pin 510 to be described later is inserted and coupled to the inverter fastening hole 520 .

In addition, a plurality of rear fastening holes 540 to be described later are formed on one side of the main housing 110 in contact with the rear housing 120 . A rear fastening pin 530 to be described later is coupled to the rear fastening hole 540 .

In the illustrated embodiment, the main housing 110 is provided in a cylindrical shape. Diameters of one side and the other side opposite to one side of the main housing 110 are formed to be larger than the diameter of a portion located therebetween.

That is, the main housing 110 is generally cylindrical, but is configured in the form of dumbbells in which the diameters of both ends are larger. In addition, the main housing 110 may include a hollow part therein, so that a motor chamber S1 in which a motor 300 to be described later is accommodated may be defined.

The shape of the main housing 110 may be formed in any structure capable of accommodating the motor 300 therein. However, as described above, the pressure inside the main housing 110 increases according to the compression of the refrigerant.

Therefore, the shape of the main housing 110 is preferably formed in a structure having a circular cross-section that can have the highest rigidity with respect to internal pressure.

Although not shown, a suction space constituting the motor chamber S1 to be described later may be formed inside the main housing 110 . In addition, a compression unit 400 to be described later may be accommodated in the suction space.

In addition, a back pressure space provided with a main bearing (not shown) may be formed inside the main housing 110 .

An intake port 112 is formed in the main housing 110 . In addition, the motor room S1 is defined by the space formed inside the main housing 110 .

The intake port 112 is a passage through which the refrigerant flows from the outside of the main housing 110 to the inside of the main housing 110 . The intake port 112 is configured to communicate with the inside and outside of the main housing 110 . In one embodiment, the intake port 112 may be formed as a through hole.

In the illustrated embodiment, the intake port 112 is formed on one side of the main housing 110 adjacent to the inverter housing 210 to be described later. That is, the intake port 112 is formed as a circular through hole on the circumferential surface of one side adjacent to the inverter housing 210 , which has a larger diameter than the central portion of the main housing 110 .

The position and shape of the intake port 112 may be determined as any position and shape through which an external refrigerant can be introduced into the inside of the casing 100 .

The motor room S1 is a space in which a motor 300 to be described later is accommodated. The motor room S1 is defined by the inner space of the main housing 110 . In other words, the motor room S1 is a part or all of the space formed inside the main housing 110 .

The size of the motor room S1 , that is, the cross-section and height of the motor room S1 may be determined according to the shape of the main housing 110 . As described above, since the main housing 110 is configured in a cylindrical shape, the motor chamber S1 may also be formed in a cylindrical shape.

The size of the motor chamber S1 is preferably formed to a size sufficient to accommodate the motor 300 to be described later.

The motor chamber S1 communicates with the rear housing 120 . Accordingly, the refrigerant introduced into the main housing 110 through the intake port 112 may flow to the rear housing 120 through the motor chamber S1 .

In an embodiment not shown, a refrigerant passage member (not shown) may be provided inside the motor room S1. The refrigerant passage member (not shown) forms a passage through which the refrigerant introduced through the intake port 112 flows toward the exhaust port 122 .

A plurality of rear fastening holes 540 are formed through one side of the main housing 110 adjacent to the rear housing 120 . A plurality of rear fastening holes 540 are formed in the circumferential direction of the one side of the main housing 110 . A rear fastening pin 530 to be described later is inserted and coupled to the rear fastening hole 540 .

Accordingly, the main housing 110 and the rear housing 120 may be coupled.

In addition, a plurality of inverter fastening holes 520 are formed through the other side of the main housing 110 adjacent to the inverter housing 210 . A plurality of inverter fastening holes 520 are formed in the circumferential direction of the other side of the main housing 110 . An inverter fastening pin 510 to be described later is inserted and coupled to the inverter fastening hole 520 .

Accordingly, the main housing 110 and the inverter housing 210 may be coupled.

The rear housing 120 is located on one side of the main housing 110 . In the illustrated embodiment, the rear housing 120 is located on the front side of the main housing 110 . The rear housing 120 is communicatively coupled to the main housing 110 .

The rear housing 120 is hermetically coupled to the main housing 110 by a fastening part 500 to be described later. To this end, a plurality of fastening through holes (not shown) are formed in the rear housing 120 .

One side of each rear fastening pin 530 is inserted into a plurality of fastening through holes (not shown). The other side of each rear fastening pin 530 is inserted into the rear fastening hole 540 of the main housing 110 .

The rear housing 120 includes an exhaust port 122 .

The exhaust port 122 is formed on the circumferential surface of the rear housing 120 . The exhaust port 122 is configured to communicate with the inside and outside of the rear housing 120 . In one embodiment, the exhaust port 122 may be formed as a through hole.

The refrigerant compressed in the compression unit 400 to be described later may be discharged to the outside of the rear housing 120 , that is, the casing 100 through the exhaust port 122 .

The exhaust port 122 may be provided with an oil separator (not shown) for separating oil used for smooth rotation and cooling of the motor 300 to be described later.

Next, the inverter device 200 will be described.

The inverter device 200 applies a control signal to a motor 300 to be described later to control whether or not the electric compressor 10 is operated and a rotational speed, and the like. As a result, the compression amount and pressure of the refrigerant may be controlled by the inverter device 200 .

The inverter device 200 is coupled to the casing 100 from one side of the casing 100 , in the illustrated embodiment, from the rear side. Specifically, the inverter device 200 is located on the other side of the main housing 110 facing the rear housing 120 .

In an embodiment not shown, the inverter device 200 may include a cooling hole (not shown) communicating with the main housing 110 . In this case, the refrigerant introduced into the main housing 110 may flow into the inverter device 200 , and thus cooling efficiency may be improved.

Power may be supplied to the inside of the inverter device 200 . In order to prevent unnecessary energization with the outside, the inverter device 200 is preferably formed of an insulating material, for example, synthetic resin.

The inverter device 200 includes an inverter housing 210 and an inverter cover 220 .

The inverter housing 210 forms the outer shape of the inverter device 200 together with the inverter cover 220 . In addition, the inverter housing 210 is a portion in which the inverter device 200 is coupled to the casing 100 . That is, the inverter housing 210 is coupled to the main housing 110 of the casing 100 .

The inverter housing 210 includes a bearing unit 212 , a communication connector 214 , and a power connector 216 . Also, although not shown, a pin coupling hole (not shown) may be formed in the inverter housing 210 .

One side of the inverter fastening pin 510 of the fastening part 500 to be described later is inserted into the pin coupling hole (not shown). The other side of the inverter fastening pin 510 is inserted into the inverter fastening hole 520 of the main housing 110 . Accordingly, the inverter housing 210 and the main housing 110 may be coupled.

Preferably, the number and arrangement of the pin coupling holes (not shown) are determined to correspond to the number and arrangement of the inverter fastening holes 520 .

On one side of the inverter housing 210 , a bearing part 212 protruding toward the motor chamber S1 is formed. A rotation shaft 340 of the motor 300 to be described later is rotatably coupled to the bearing unit 212 . The coupled rotation shaft 340 is supported in the radial and axial directions by the bearing portion 212 .

In the illustrated embodiment, the bearing unit 212 is located on the center of a circle having a rounded portion located on the lower side of the inverter housing 210 as a part of the arc.

The bearing portion 212 is preferably aligned with the central axes of the main housing 110 and the rear housing 120 . Accordingly, the motor 300 accommodated in the main housing 110 can be rotated stably.

The communication connector 214 and the power connector 216 receive power required for the operation of the electric compressor 10 and a control signal required for control, respectively. The control signal input to the communication connector 214 is transmitted to the motor 300 to be described later by a separate electrical connection means (not shown) through a printed circuit board 610 and a semiconductor device 620 to be described later.

In the illustrated embodiment, the communication connector 214 and the power connector 216 are positioned to the left of the upper side of the inverter housing 210 . Each of the connectors 214 and 216 may be located at an arbitrary position to receive a control signal without affecting the rotation of the motor 300, which will be described later.

The communication connector 214 and the power connector 216 may be provided in any structure capable of input/output of power and control signals.

The inverter cover 220 is located on one side of the inverter housing 210 facing the main housing 110 . In the illustrated embodiment, the inverter cover 220 is located on the rear side of the inverter housing 210 .

The inverter cover 220 is coupled to the inverter housing 210 to form an outer shape of the inverter device 200 . An inverter chamber S2 is formed between the inverter cover 220 and the inverter housing 210 , in which an inverter unit 600 to be described later is accommodated.

In order to fasten the inverter cover 220 and the inverter housing 210, an inverter coupling pin (not shown) may be provided. A coupling hole (not shown) into which an inverter coupling pin (not shown) can be inserted may be formed in each of the inverter cover 220 and the inverter housing 210 .

The printed circuit board 610 is a part that substantially performs the role of the inverter device 200 . Specifically, the printed circuit board 610 generates a control signal for controlling the motor 300 to be described later, and transmits it to the motor 300 . That is, the printed circuit board 610 operates as an inverter.

Various electrical and electronic components (not shown) for controlling the motor 300 may be electrically connected to the printed circuit board 610 . That is, a connection pin 622 of a semiconductor device 620 to be described later is connected to the printed circuit board 610 to be energized.

To this end, a plurality of connection pin coupling holes 612 may be formed through the printed circuit board 610 .

The connection pins 622 of the semiconductor device 620 are electrically connected to the connection pin coupling holes 232 , respectively. Accordingly, the switching signal of the semiconductor device 620 may be transmitted to the printed circuit board 610 .

Since the operating principle of the printed circuit board 610 is a well-known technology, an additional detailed description thereof will be omitted.

Next, the motor 300 will be described.

The motor 300 is accommodated in the motor chamber S1 of the main housing 110 . The motor 300 provides power for the compression unit 400 to be described later to compress the refrigerant. The motor 300 may be controlled by a control signal applied by the printed circuit board 610 and a semiconductor device 620 to be described later.

A rotation shaft 340 is coupled through the motor 300 . The rotation shaft 340 may rotate integrally with the motor 300 . The rotation shaft 340 is rotatably coupled to the shaft portion 212 of the inverter housing 210 .

The motor 300 includes a stator 310 and a rotor 330 .

A plurality of coils 320 (see FIG. 4 ) are wound around the stator 310 , and the plurality of coils 320 form a magnetic field when power is applied.

The stator 310 may be fixed to the inner circumferential surface of the main housing 110 . That is, the stator 310 may be fixed to the outer surface of the motor room S1 inside the main housing 110 .

In addition, a cylindrical hollow portion is formed inside the stator 310 , and the rotor 330 may be coupled to the stator 310 at a predetermined distance from the inside of the stator 310 .

The rotor 330 includes a plurality of magnets (not shown). When a control signal is applied from the inverter device 200, the rotor 330 is rotated by the interaction of the magnetic field formed by the coil and the magnetic field formed by the magnet.

The rotor 330 is coupled to the rotation shaft 340 and rotates together with the rotation shaft 340 .

The rotor 330 may be rotatably disposed inside the stator 310 . Specifically, the rotor 330 is rotated by being spaced apart from the inner circumferential surface of the stator 310 by a predetermined distance.

Since the process of operating the motor 300 according to the driving principle of the motor 300 and the application of the control signal is a well-known technique, a detailed description thereof will be omitted.

Next, the compression unit 400 will be described.

The compression unit 400 substantially performs the role of the electric compressor 10 compressing the refrigerant introduced into the intake port 112 . The electric compressor 10 according to the embodiment of the present invention corresponds to a scroll compressor using a scroll. Accordingly, the compression unit 400 includes the orbiting scroll 410 and the fixed scroll 420 .

The orbiting scroll 410 is eccentrically coupled to a rotation shaft 340 coupled to the rotor 330 of the motor 300 . Accordingly, when the rotor 330 rotates, the orbiting scroll 410 orbits with respect to the fixed scroll 420 .

Due to the orbiting motion of the orbiting scroll 410, the orbiting scroll 410 and the fixed scroll 420 are compressed as a pair of a suction chamber (not shown), an intermediate pressure chamber (not shown), and a discharge chamber (not shown). A thread (not shown) is formed.

Since the process of compressing the refrigerant using the orbiting scroll 410 and the fixed scroll 420 is a well-known technique, a detailed description thereof will be omitted.

Next, the fastening unit 500 will be described.

The fastening part 500 is a member for coupling the main housing 110 , the rear housing 120 , and the inverter device 200 . In an embodiment, the fastening part 500 may be provided with any member capable of coupling a plurality of members, such as pins, rivets, or screws.

The fastening part 500 includes an inverter fastening pin 510 , an inverter fastening hole 520 , a rear fastening pin 530 , and a rear fastening hole 540 .

In addition, as described above, an inverter coupling pin (not shown) coupling the inverter housing 210 and the inverter cover 220 and a fixing member (not shown) or a fastening member (not shown) coupling the semiconductor device 620 are also It may be included in the fastening part 500 .

The inverter fastening pin 510 couples the main housing 110 and the inverter housing 210 . An inverter fastening hole 520 is formed in the main housing 110 , and a pin coupling hole (not shown) is formed in the inverter housing 210 .

One side of the inverter fastening pin 510 is inserted into the inverter fastening hole 520 and the other side of the inverter fastening pin 510 is inserted and coupled to a pin coupling hole (not shown). Accordingly, the main housing 110 and the inverter housing 210 may be coupled.

The rear fastening pin 530 couples the main housing 110 and the rear housing 120 . A rear fastening hole 540 is formed in the main housing 110 , and a fastening through hole (not shown) is formed in the rear housing 120 .

One side of the rear fastening pin 530 is inserted into the rear fastening hole 540 and the other side of the rear fastening pin 530 is inserted and coupled to the fastening through hole (not shown). Accordingly, the main housing 110 and the rear housing 120 may be coupled.

In addition, as described above, the inverter housing 210 and the inverter cover 220 may be coupled by an inverter coupling pin (not shown).

The inverter fastening pin 510, the inverter fastening hole 520, and the pin coupling hole (not shown) described above are provided in plurality, but may be provided in the same number.

A plurality of rear fastening pins 530 , rear fastening holes 540 and fastening through holes (not shown) are also provided, but may be provided in the same number.

Next, the inverter unit 600 will be described.

3 is an exploded perspective view of an inverter device provided in the electric compressor of FIG. 1 .

Referring to FIG. 3 , an inverter unit 600 is provided between the inverter housing 210 and the inverter cover 220 . Specifically, as described above, the inverter housing 210 and the inverter cover 220 are coupled to form an inverter chamber S2 therein, and the inverter unit 600 is disposed in the inverter chamber S2 .

The inverter unit 600 includes a printed circuit board 610 and a semiconductor device 620 .

The printed circuit board 610 is formed in a plate shape.

One side of the printed circuit board 610 is formed in an approximately arc shape, and the other side is formed in an approximately rectangular shape. In the illustrated embodiment, the one side is the front side and the other side is the rear side.

A plurality of connection pin coupling holes 612 are formed through the printed circuit board 610 . A connection pin 622 of the semiconductor device 620 is inserted through the connection pin coupling hole 612 , whereby the semiconductor device 620 and the printed circuit board 610 are electrically connected to each other.

The connection pin coupling hole 612 is formed in a portion that does not overlap in the axial direction with the first region A, which will be described later.

The description of the function of the printed circuit board 610 is replaced with the above-mentioned bar.

A semiconductor device 620 is disposed between the printed circuit board 610 and one side of the inverter housing 210 . In the illustrated embodiment, the one side surface refers to the lower surface of the inverter housing 210 .

The semiconductor device 620 includes a semiconductor body 621 , a connection pin 622 , and a semiconductor coupling member 623 .

The semiconductor body 621 has a substantially rectangular cross section. In addition, a semiconductor coupling hole 621a is formed through the central portion of the semiconductor body 621 in one direction. In the illustrated embodiment, the one direction means an up-down direction.

The semiconductor coupling member 623 passes through the semiconductor coupling hole 621a and is coupled to a semiconductor coupling groove (not shown) formed on the lower surface of the inverter housing 210 . Accordingly, the semiconductor coupling member 623 is fixed in a state in which the inverter housing 210 is in contact with the lower surface.

A connection pin 622 is positioned on one side of the semiconductor body 621 . In addition, a plurality of connection pins 622 are provided.

The connection pin 622 extends from the side of the semiconductor body 621 and is bent toward the printed circuit board 610 to extend upward. An end of the connection pin 622 is inserted into and coupled to the connection pin coupling hole 612 .

In the lower surface of the inverter housing 210, a terminal withdrawal hole 211a is formed to penetrate in the vertical direction. The terminal lead-out hole 211a is energably connected to the semiconductor element 620 , and a connection terminal (not shown) for applying power to the coil 320 is inserted and coupled thereto.

FIG. 4 is a cross-sectional view showing an inverter device of the compressor of FIG. 1 . FIG. 5 is a perspective view showing the inverter housing from the motor room side of FIG. 4 .

Referring to FIG. 4 , a heat exchange unit 211 dividing the motor room S1 and the inverter room S2 is shown. The heat exchange unit 211 exchanges heat with the motor chamber S1 and the inverter chamber S2, respectively.

The heat exchange unit 211 refers to a portion covering an open side of the casing 100 among portions of a plate on one side of the inverter housing 210 facing the casing 100 . The heat exchange unit 211 is provided in a substantially circular shape.

In the illustrated embodiment, the heat exchange unit 211 is provided in the inverter housing 210 , but this may vary depending on the shape of the casing 100 and the inverter device 200 . For example, one side of the casing 100 facing the inverter chamber S2 may be closed, and one side of the inverter device 200 facing the motor chamber S1 may be formed open. In this case, the heat exchange unit 211 dividing the motor chamber S1 and the inverter chamber S2 may be a plate of one side of the casing 100 .

A terminal withdrawal hole 211a may be formed through the heat exchange unit 211 . Although not shown, a lead-out terminal (not shown) for energably connecting the semiconductor device 620 and the coil 320 is inserted through the terminal lead-out hole 211a. In addition, the withdrawal terminal may include a sealing member (not shown) for suppressing the refrigerant from flowing into the inverter chamber (S2) through the terminal withdrawal hole (211a).

The semiconductor element 620 is surface-contacted and coupled to the first surface 2111 of the heat exchange unit 211 facing the inverter chamber S2. Heat generated from the semiconductor element 620 is transferred to the heat exchange unit 211 in contact with the semiconductor element 620 , and the heat transferred to the heat exchange unit 211 is transferred to the outer surface of the casing 100 or the motor room S1 . ) is transferred to the refrigerant introduced into it.

Specifically, the refrigerant flowing into the motor compartment S1 may come into contact with the second surface 2113 of the heat exchange unit 211 facing the motor compartment S1, so that the heat transferred to the heat exchange unit 211 moves to the refrigerant. can be

Accordingly, the semiconductor device 620 may be efficiently dissipated. As a result, the semiconductor element 620 is efficiently cooled, and deterioration of the performance of the semiconductor element 620 caused by overheating is suppressed.

The heat exchange efficiency between the semiconductor element 620 and the refrigerant may be affected by the axial thickness of the heat exchange unit 211 that transfers heat between the semiconductor element 620 and the refrigerant.

Specifically, when the axial thickness of the heat exchange unit 211 positioned between the semiconductor element 620 and the refrigerant is relatively thick, the length through which heat moves is increased, so that thermal conductivity may be reduced. That is, the heat exchange efficiency between the semiconductor device 620 and the refrigerant may be reduced.

On the other hand, when the axial thickness of the heat exchange unit 211 positioned between the semiconductor element 620 and the refrigerant is relatively thin, the length of heat movement may be reduced, so that thermal conductivity may be improved. That is, heat exchange efficiency between the semiconductor device 620 and the refrigerant may be improved.

In addition, the heat exchange efficiency between the semiconductor element 620 and the refrigerant may be affected by whether the refrigerant is in contact with the heat exchange unit 211 opposite to the semiconductor element 620 .

Specifically, if the refrigerant does not smoothly contact the heat exchange unit 211 from the opposite side of the semiconductor element 620 , thermal conductivity between the semiconductor element 620 and the refrigerant may be reduced. On the other hand, if the refrigerant contacts the heat exchange unit 211 from the opposite side of the semiconductor element 620 , thermal conductivity between the semiconductor element 620 and the refrigerant may be improved.

In consideration of this point, the heat dissipation efficiency of the semiconductor device 620 may vary depending on a position at which the semiconductor device 620 contacts the first surface 2111 .

When the distance between the first surface 2111 and the second surface 2113 in the axial direction in the portion in which the semiconductor element 620 is in contact is relatively increased, heat dissipation efficiency may be reduced, and the first surface 2111 and When the distance between the second surfaces 2113 is relatively close, heat dissipation efficiency may be improved.

In addition, in the portion where the semiconductor element 620 is in contact, if the refrigerant does not smoothly contact the opposite second surface 2113 , heat dissipation efficiency may be reduced, and if the refrigerant smoothly contacts the opposite second surface 2113 , Heat dissipation efficiency can be improved.

That is, the semiconductor device 620 is preferably disposed in a portion where the distance between the first surface 2111 and the second surface 2113 in the axial direction is relatively short and the coolant can be smoothly contacted.

Most of the heat exchange unit 211 has a uniform thickness in the axial direction. However, a portion of the heat exchange unit 211 may be formed to have a relatively thick thickness.

For example, referring to FIG. 5 , a shaft bearing part 212 rotatably coupled to the rotation shaft 340 is formed to protrude from a portion of the second surface 2113 of the heat exchange part 211 .

The bearing part 212 is formed in a cylindrical shape, and a coupling space into which the rotation shaft 340 and the bearing rotatably supporting the rotation shaft 340 are inserted is recessed in the central part.

The outer peripheral surface of the bearing is coupled to the inner peripheral surface of the coupling space, and the inner peripheral surface of the bearing and the outer peripheral surface of the rotating shaft are coupled to each other. Accordingly, the refrigerant is not smoothly introduced into the coupling space.

In addition, the outer peripheral surface of the bearing portion 212 may be in contact with the refrigerant, but the outer peripheral surface of the bearing portion 212 is relatively more than a portion of the first surface 2111 that overlaps the bearing portion 212 in the axial direction. far apart

That is, in the bearing unit 212 , the distance between the first surface 2111 and the second surface 2113 in the axial direction is relatively increased or the refrigerant does not contact smoothly.

As a result, when the semiconductor element 620 comes into contact with a portion overlapping the bearing portion 212 in the axial direction of the first surface 2111 of the heat exchange portion 211 , the heat dissipation efficiency and cooling efficiency of the semiconductor element 620 . This can be reduced.

Referring back to FIG. 4 , the coolant does not flow smoothly to the inner circumferential surface of the bearing unit 212 , and the distance through which the heat generated by the semiconductor device 620 moves is relatively increased on the outer circumferential surface of the bearing unit 212 . . Accordingly, when the semiconductor device 620 is positioned on a portion of the first surface 2111 that overlaps the bearing portion 212 in the axial direction, heat dissipation and cooling efficiency of the semiconductor device 620 may be reduced.

Hereinafter, a portion in which the semiconductor device 620 axially overlaps the bearing part 212 among the first surfaces 2111 of the heat exchange part 211 is defined as a first region A. In addition, a portion of the first surface 2111 of the heat exchange part 211 that does not overlap the bearing part 212 in the axial direction is defined as a second region B. As shown in FIG.

In the illustrated embodiment, the semiconductor device 620 is adjacent to the first region A on the outside of the boundary of the first region A and comes into contact with one side 2113 of the heat exchange unit 211 .

In other words, a portion of the first surface 2111 of the heat exchange unit 211 facing the inverter chamber S2 overlaps the bearing unit 212 in the axial direction, and the semiconductor element 620 is the heat exchange unit 211 . It is in contact with another part of the first surface 2111 .

Accordingly, the heat dissipation efficiency and cooling efficiency of the semiconductor device 620 may be increased compared to the case where the semiconductor device 620 is disposed in the first region A. That is, the semiconductor device 620 may be efficiently radiated and cooled.

Fig. 6 is a perspective view showing the inverter housing from the inverter chamber side of Fig. 4;

Referring to FIG. 6 , a first area A overlapping the bearing part 212 in the axial direction is formed on the first surface 2111 of the heat exchange part 211 facing the inverter chamber S2 .

The plurality of semiconductor devices 620 are fixed in contact with the first surface 2111 outside the first region A. As shown in FIG.

The plurality of semiconductor devices 620 are fixed in contact with a portion of the first surface 2111 excluding the first region A. As shown in FIG.

The plurality of semiconductor devices 620 are disposed adjacent to the first area A outside the boundary between the first area A and the second area B.

The plurality of semiconductor devices 620 are fixed in contact with a portion of the second region (B).

In the illustrated embodiment, the plurality of semiconductor devices 620 include a plurality of semiconductor device pairs P. Each of the semiconductor device pairs P is fixed in contact with the first surface 2111 on the right side, the front side, and the left side of the first region A. As shown in FIG.

That is, the plurality of semiconductor device pairs P are spaced apart from each other by a predetermined distance to partially surround the boundary of the first region A. As shown in FIG.

That is, the semiconductor device 620 is in contact with a portion of the second region (B) except for the upper first region (A).

Accordingly, the semiconductor device 620 is in contact with a portion having a relatively thin axial thickness. In addition, a portion of the second surface 2113 positioned opposite to the surface to which the semiconductor device 620 is in contact smoothly contacts the refrigerant. Accordingly, heat exchange efficiency between the semiconductor device 620 and the refrigerant may be improved.

As a result, heat dissipation efficiency and cooling efficiency of the semiconductor device 620 may be improved.

FIG. 7 is a plan view of the inverter unit of FIG. 4 .

Referring to FIG. 7 , the inverter unit 600 as viewed from the first surface 2111 of the heat exchange unit 211 is shown.

A plurality of semiconductor devices 620 are disposed to partially surround the boundary between the first region A and the second region B. Referring to FIG.

In the illustrated embodiment, two semiconductor devices 620 are disposed on the left, right, and lower sides of the first region A, respectively.

In detail, the plurality of semiconductor device pairs P are disposed to partially surround the boundary between the first region A and the second region B. Referring to FIG.

In the illustrated embodiment, the plurality of semiconductor device pairs P are disposed on the left, right, and lower sides of the first region A. As shown in FIG.

Since the portion in which the plurality of semiconductor element pairs P are disposed does not overlap the shaft bearing portion 212 in the axial direction, the axial thickness of the heat exchange unit 211 is relative in the portion where the plurality of semiconductor element pairs P are disposed. is formed thinly with In addition, the refrigerant smoothly contacts the second surface 2113 opposite to the portion where the plurality of semiconductor element pairs P are disposed.

Thereby, heat conduction efficiency between the plurality of semiconductor element pairs P and the refrigerant may be increased, so that the plurality of semiconductor element pairs P may be efficiently dissipated.

As a result, cooling efficiency of the plurality of semiconductor device pairs P may be improved.

The description of the increase/decrease in cooling efficiency according to the contact position of the semiconductor element 620 has been described above, and a detailed description thereof will be provided instead.

In addition, since each semiconductor element pair P is disposed to be spaced apart from each other at a predetermined distance, the size of a space between each semiconductor element pair P may be increased.

Therefore, since the fluid inside the inverter chamber S2 can flow smoothly between the semiconductor element pair P, heat exchange between the semiconductor element pair P and the fluid inside the inverter chamber S2 can be made more smoothly. .

That is, the efficiency of transferring the heat generated in the semiconductor element pair P to the fluid inside the inverter chamber S2 is improved, so that the heat dissipation efficiency of the semiconductor element pair P may be improved.

As a result, the semiconductor element pair P can be effectively cooled.

In addition, since the distance between the semiconductor element pair P increases, the size of a portion of the heat exchange unit 211 positioned between the semiconductor element pair P may increase.

Accordingly, the efficiency of transferring heat generated in the semiconductor element pair P to a portion of the heat exchange unit 211 positioned between the semiconductor element pair P may be increased.

As a result, the semiconductor element pair P may be effectively dissipated to improve cooling efficiency.

As the cooling efficiency of the semiconductor device 620 is increased, high-spec equipment capable of outputting a high level of performance even at a high temperature is not required. Accordingly, the manufacturing cost of the electric compressor 10 can be reduced.

The distance between the two semiconductor devices 620 constituting one semiconductor device pair P among the plurality of semiconductor device pairs P is the distance between the two semiconductor devices 620 constituting the other semiconductor device pair P. It may be formed similarly to the distance.

In an embodiment, a distance between two semiconductor devices 620 constituting one semiconductor device pair P among a plurality of semiconductor device pairs P is two semiconductor devices constituting the other semiconductor device pair P. It may be formed equal to the distance between the 620 .

Through this, each of the printed circuits 653 (see FIG. 11 ) to be described later may be formed to have the same length. In this regard, it will be described in detail later.

8 is a plan view illustrating another embodiment of the inverter unit of FIG. 7 .

Referring to FIG. 8 , the inverter unit 600 as viewed from the first surface 2111 of the heat exchange unit 211 is shown.

A plurality of semiconductor devices 620 are disposed to partially surround the boundary between the first region A and the second region B. Referring to FIG.

The description of the increase/decrease in cooling efficiency according to the contact position of the semiconductor element 620 has been described above, and a detailed description thereof will be provided instead.

Compared with the inverter unit according to the above-described embodiment, the inverter unit 600 according to the present embodiment has the following differences.

The two semiconductor devices 620 constituting the plurality of semiconductor device pairs P according to the present embodiment are disposed to be spaced apart from each other by a predetermined distance.

Specifically, the inverter unit 600 includes a plurality of semiconductor device pairs P disposed to partially surround the boundary between the first region A and the second region B, and the plurality of semiconductor device pairs P is disposed to be spaced apart from each other by a predetermined interval, and the two semiconductor devices 620 constituting the plurality of semiconductor device pairs P are disposed to be spaced apart from each other by a predetermined interval.

The plurality of semiconductor devices 620 partially surround the circumference of the first area A and are radially disposed with respect to the center of the first area A.

Accordingly, the space between the two semiconductor device pairs P adjacent to each other increases, and at the same time, the size of the space between the two semiconductor devices 620 constituting the semiconductor device pair P increases.

That is, the size of the space between the plurality of semiconductor devices 620 is increased.

Through this, since the fluid inside the inverter chamber S2 can flow more smoothly into the space between the semiconductor elements 620 adjacent to each other, heat exchange between the plurality of semiconductor elements 620 and the fluid inside the inverter chamber S2 This can be done more smoothly.

That is, the efficiency of transferring the heat generated by the plurality of semiconductor devices 620 to the fluid inside the inverter chamber S2 may be improved, so that the heat dissipation efficiency of the plurality of semiconductor devices 620 may be improved.

As a result, the plurality of semiconductor devices 620 may be effectively cooled.

Also, since the distance between the plurality of semiconductor devices 620 is increased, the size of a portion of the heat exchange unit 211 positioned between the plurality of semiconductor devices 620 may be increased.

Accordingly, the efficiency of transferring heat generated by the plurality of semiconductor elements 620 to a portion of the heat exchange unit 211 positioned between the plurality of semiconductor elements 620 may be increased.

As a result, the plurality of semiconductor devices 620 may be effectively dissipated to improve cooling efficiency.

As the cooling efficiency of the semiconductor device 620 is increased, high-spec equipment capable of outputting a high level of performance even at a high temperature is not required. Accordingly, the manufacturing cost of the electric compressor 10 can be reduced.

That is, since the total size of the space between the plurality of semiconductor elements 620 is increased in the inverter unit 600 according to the present embodiment compared to the inverter unit according to the above-described embodiment, heat dissipation and cooling of the semiconductor element 620 is more effective. can be done efficiently.

In an embodiment, a distance between two semiconductor devices 620 constituting one semiconductor device pair P among a plurality of semiconductor device pairs P is two semiconductor devices constituting the other semiconductor device pair P. It may be formed equal to the distance between the 620 .

Through this, each of the printed circuits 653 (see FIG. 11 ) to be described later may be formed to have the same length. In this regard, it will be described in detail later.

9 is a perspective view of a semiconductor device and a power connector provided in an electric compressor according to another embodiment of the present invention. FIG. 10 is an exploded perspective view of the semiconductor device and the power connector of FIG. 9 .

The inverter unit 600 provided in the electric compressor 10 according to another embodiment of the present invention may include a power connection unit for energizing the semiconductor element 620 and the motor 300 .

The power connector according to this embodiment includes a power connector body 630 , a power connector cover 640 , and a sub printed circuit board 650 .

The power connector body 630 includes a first body 631 that has a substantially rectangular ring-shaped cross-section and supports the sub printed circuit board 650 .

Left, right and front side surfaces of the first body 631 are formed to be recessed toward the inside. Accordingly, the connection pins 622 of the semiconductor device 620 are disposed adjacently to the left, right, and front sides of the first body 631 .

The inner side of the first body 631 also includes a power connection body 630 having a second body 632 extending to one side from the first body 631 .

The second body 632 is formed so that the width of one side connected to the first body 631 is smaller than the width of the other side opposite to the one side. For example, the second body 632 is formed in the form of a dumbbell cut in the middle.

Bus-bar seating spaces 632a, 632b, and 632c in which a plurality of bus-bars 633, 634, and 635 are disposed are formed in the second body 632, respectively.

Each of the bus bars 633 , 634 , and 635 is formed to extend forward and backward.

For example, the plurality of bus bars 633 , 634 , and 635 include a first bus bar 633 , a second bus bar 634 , and a third bus bar 635 .

At each front end of each of the bus bars 633 , 634 , and 635 , the bus bar connection pins 633a , 634a , and 635a that are energably connected to the sub printed circuit board 650 are formed to extend upwards.

Specifically, a first bus bar connection pin 633a is formed at a front end of the first bus bar 633 , and a second bus bar connection pin 634a is formed at a front end of the second bus bar 634 . A third bus bar connection pin 635a is formed at the front end of the third bus bar 635 .

In addition, terminal insertion portions 633b, 634b, and 635b are formed at rear end portions of each of the bus bars 633, 634, and 635, and a connection terminal (not shown) passes through the terminal extraction hole 211a to insert the terminal. It is electrically coupled to the portions 633b, 634b, and 635b.

Through this, the motor 300 and each of the bus bars 633, 634, and 635 are electrically connected to each other.

A sub printed circuit board 650 is disposed and supported on the upper surface of the first body 631 .

The sub printed circuit board 650 includes a base 651 formed in a quadrangular shape and a plurality of connection parts 652 protruding from each side of the base 651 .

The plurality of connection parts 652 are formed in a quadrangle and are spaced apart from each other by a predetermined interval. The plurality of connection parts 652 may be formed in a number corresponding to the number of connection pins 622 of the semiconductor device 620 . In the illustrated embodiment, a total of 18 connection parts 652 may be provided, 6 on each side of the base 651 .

Connection pin through-holes 652a penetrated by the connection pins 622 of the semiconductor device 620 are formed through the plurality of connection portions 652 .

The connection pin 622 passes through the connection pin through hole 652a of the sub printed circuit board 650 and is then inserted into the connection pin coupling hole 612 of the printed circuit board 610 to be coupled.

In addition, a plurality of bus bar connection pin coupling holes 651a, 651b, and 651c into which the bus bar connection pins 633a, 634a, and 635a are inserted and coupled are formed in the central portion of the base 651. The bus bar connection pin coupling holes 651a, 651b, and 651c may be formed in a number corresponding to the bus bar connection pins 633a, 634a, and 635a. In the illustrated embodiment, the plurality of bus bar connection pin coupling holes 651a, 651b, and 651c include a first bus bar connection pin coupling hole 651a, a second bus bar connection pin coupling hole 651b, and a first bus bar. A connection pin coupling hole 651c is included.

A power connector cover 640 is disposed above the sub printed circuit board 650 . The power connector cover 640 is formed in a shape that can cover the power connector body 630 , and is coupled to the power connector body 630 with the sub printed circuit board 650 interposed therebetween.

The printed circuit board 610 , the semiconductor device 620 , the sub printed circuit board 650 , the bus bar 633 , the connection terminal (not shown) and the motor 300 are energably connected by the above-described structure.

11 is a plan view of the sub printed circuit board of FIG. 10 .

A plurality of printed circuits 653 are formed on the sub printed circuit board 650 according to the present embodiment to connect the plurality of semiconductor terminal pairs P and the plurality of bus bars 633 , 634 , and 635 to be energized.

The plurality of printed circuits 653 includes a first printed circuit 653U, a second printed circuit 653V, and a third printed circuit 653W.

The first printed circuit 653U is configured to electrically connect the semiconductor element pair P positioned on the left side of the base 651 and the first bus bar 633 .

The second printed circuit 653V is configured to electrically connect the semiconductor element pair P positioned on the right side of the base 651 and the second bus bar 634 .

The third printed circuit 653W is configured to electrically connect the semiconductor element pair P positioned below the base 651 and the third bus bar 635 .

Each of the printed circuits 653U, 653V, and 653W is composed of a pair of circuits.

Taking the first printed circuit 653U as an example, the first printed circuit 653U includes a first partial circuit 653U1 and a second partial circuit 653U2.

The connection pin 622 of the semiconductor device includes a source connection pin 6221 , a drain connection pin 6222 , and a gate connection pin 6222 .

The first partial circuit 653U1 is configured to energize the source connection pin 6221 and the first bus bar connection pin 633a of any one semiconductor element 620 constituting the semiconductor terminal pair P. .

The first partial circuit 653U1 connects between the second through hole 652a among the six connection pin through holes 652a provided on one side of the base 651 and the first bus bar connection pin coupling hole 651a1. configured to do

The second partial circuit 653U2 is configured to electrically connect the drain connection pin 6222 and the first bus bar connection pin 633a of the other semiconductor element 620 constituting the semiconductor terminal pair P. .

The second partial circuit 653U2 connects between the fourth through hole 652a among the six connection pin through holes 652a provided on one side of the base 651 and the first bus bar connection pin coupling hole 651a1. configured to do

In the illustrated embodiment, the first partial circuit 653U1 and the second partial circuit 653U2 are formed in a straight line, and the first partial circuit 653U1 and the second partial circuit 653U2 are connected at an acute angle to each other. . However, the present invention is not limited thereto, and the first partial circuit 653U1 and the second partial circuit 653U2 may be formed in various patterns.

Here, the first partial circuit 653U1 is formed to extend a first length L1 , and the second partial circuit 653U2 is formed to extend a second length L2 .

The second printed circuit 653V includes a first partial circuit 653V1 and a second partial circuit 653V2, and the third printed circuit 653W includes a first partial circuit 653W1 and a second partial circuit 653W2. to provide

Each partial circuit of each printed circuit 653 may be formed in the same pattern shape.

For example, the first partial circuit 653U1 of the first printed circuit 653U and the first partial circuit 653V1 of the second printed circuit 653V are formed identically to each other, and The second partial circuit 653U2 and the second partial circuit 653V2 of the second printed circuit 653V may be formed to be identical to each other.

Also, each of the partial circuits of the printed circuit 653 may be formed to have the same length.

For example, the length of the first partial circuit 653U1 of the first printed circuit 653U and the length of the first partial circuit 653V1 of the second printed circuit 653V are both formed with the first length L1, , both the length of the second partial circuit 653U2 of the second printed circuit 653U and the length of the second partial circuit 653V2 of the second printed circuit 653V may be formed to have the second length L2.

Since the respective partial circuits of the plurality of printed circuits 653U, 653V, and 653W are formed with the same pattern and length, the inductance and resistance components resulting from the plurality of printed circuits 653U, 653V, and 653W may be formed to be identical to each other. have. As a result, the electric power of each phase supplied to the electric part can be formed uniformly with each other.

Although the above has been described with reference to the preferred embodiment of the present invention, those of ordinary skill in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention described in the claims below. You will understand that you can.

10: electric compressor
100: casing
110: main housing
112: intake port
114: motor room
120: rear housing
122: exhaust port
200: inverter device
210: inverter housing
211: heat exchange unit
211a: terminal lead-out hole
2111: first side
2113: second side
212: shaft part
214: communication connector
216: power connector
220: inverter cover
300: motor
310: stator
320: coil
330: rotor
340: rotation axis
400: compression unit
410: orbiting scroll
420: fixed scroll
500: fastening part
510: inverter fastening pin
520: inverter fastening hole
530: rear fastening pin
540: rear fastening hole
600: inverter unit
610: printed circuit board
612: connection pin coupling hole
620: semiconductor device
621: semiconductor body portion
621a: semiconductor coupling hole
622: connection pin
6221: source (source) connection pin
6222: drain (drain) connection pin
6223: gate (gate) connection pin
623: semiconductor bonding member
630: power connection body
631: first body
632: second body
633: first bus bar
634: second bus bar
635: third bus bar
633a: first bus bar connection pin
634a: second bus bar connection pin
635a: third bus bar connection pin
633b: first terminal insertion unit
634b: second terminal insertion unit
635b: third terminal insertion part
640: power connection cover
650: sub printed circuit board
651: base
651a: first bus bar connection pin coupling hole
651b: second bus bar connection pin coupling hole
651c: third bus bar connection pin coupling hole
652: connection part
652a: connection pin through hole
653: printed circuit
653U: first printed circuit
653U1: first partial circuit
653U2: second partial circuit
653V: second printed circuit
653V1: first partial circuit
653V2: second partial circuit
653W: third printed circuit
653W1: first partial circuit
653W2: second partial circuit
A: first area
B: second area

Claims (14)

a casing having a motor chamber in which the motor is accommodated;
a rotating shaft coupled to the motor to rotate;
an inverter device positioned on one side of the casing and having an inverter chamber in which a printed circuit board is accommodated;
a heat exchange unit provided in the casing or the inverter device to partition the motor room and the inverter room, and configured to exchange heat with the motor room and the inverter room, respectively; and
and a semiconductor device positioned between the printed circuit board and the heat exchange unit and connected to the printed circuit board so as to be energized,
The heat exchange unit includes a bearing unit protruding from one side facing the motor chamber to support one side of the rotating shaft,
A portion of the other side surface of the heat exchange unit facing the inverter chamber overlaps the bearing unit in the axial direction,
The semiconductor element is in contact with another part of the other side of the heat exchange unit,
electric compressor. According to claim 1,
The semiconductor device is provided in plurality,
A plurality of the semiconductor elements are disposed adjacent to a boundary between the part of the other side of the heat exchange part and the other part,
electric compressor. 3. The method of claim 2,
A plurality of the semiconductor elements,
Spaced apart from each other by a predetermined distance to partially surround the boundary,
electric compressor. According to claim 1,
A plurality of bus bars are disposed between the printed circuit board and the heat exchange unit to be electrically connected to the motor,
The semiconductor device is provided in plurality,
A plurality of the semiconductor elements,
A plurality of pairs of semiconductor elements each electrically connected to the plurality of bus bars,
electric compressor. 5. The method of claim 4,
The plurality of pairs of the semiconductor elements are disposed adjacent to a boundary between the part of the other side of the heat exchange part and the other part,
A plurality of the semiconductor device pairs are spaced apart from each other at a predetermined distance to partially surround the boundary,
electric compressor. 6. The method of claim 5,
Two semiconductor elements constituting the semiconductor element pair are disposed adjacent to each other,
electric compressor. 6. The method of claim 5,
The two semiconductor elements constituting the semiconductor element pair are disposed to be spaced apart from each other by a predetermined distance,
electric compressor. 8. The method of claim 6 or 7,
A plurality of printed circuits are formed on the printed circuit board to connect the plurality of pairs of the semiconductor elements and the plurality of bus bars to be energized, respectively,
electric compressor. 9. The method of claim 8,
A plurality of the printed circuits are formed in the same pattern as each other,
electric compressor. 9. The method of claim 8,
A plurality of the printed circuits are formed to have the same length as each other,
electric compressor. a casing having a motor chamber in which the motor is accommodated;
a rotating shaft coupled to the motor to rotate;
an inverter device positioned on one side of the casing and having an inverter chamber in which a printed circuit board is accommodated;
a heat exchange unit provided in the casing or the inverter device to partition the motor room and the inverter room, and configured to exchange heat with the motor room and the inverter room, respectively; and
A semiconductor device positioned between the printed circuit board and the heat exchange unit and configured to apply or cut off power to the printed circuit board,
The heat exchange unit includes a bearing unit protruding from one side facing the motor chamber to support one side of the rotating shaft,
A portion of the one side surface of the heat exchange unit is formed to be in contact with the refrigerant introduced into the motor chamber,
The semiconductor device is
Among the parts of the other side opposite to the one side of the heat exchange unit,
in contact with a portion overlapping a portion of the one side surface of the heat exchange unit in the axial direction,
electric compressor. 12. The method of claim 11,
A plurality of bus bars are disposed between the printed circuit board and the heat exchange unit to be electrically connected to the motor,
The semiconductor device is provided in plurality,
A plurality of the semiconductor elements,
A plurality of pairs of semiconductor elements each electrically connected to the plurality of bus bars,
electric compressor. 13. The method of claim 12,
A plurality of the semiconductor device pairs are spaced apart from each other at a predetermined interval,
electric compressor. 14. The method of claim 13,
The two semiconductor elements constituting the semiconductor element pair are disposed to be spaced apart from each other by a predetermined distance,
electric compressor.

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