KR20210069434A - Apparatus for steam emission lid and container comprising the same - Google Patents

Abstract

A steam vent lid and a packaging container including the same are disclosed. The steam vent lid may comprise a first film layer provided to seal the receiving space of the container and a second film layer laminated on the first film layer and including a cut part. In the packaging container, when the steam pressure inside the container rises, a part of the steam vent lid is broken and opened and the steam pressure can be discharged. Since the packaging container has the steam vent lid, there is no risk of bursting due to internal steam pressure when heated and leakage of contents can be prevented.

Description

Vapor evacuation lead and packaging container containing same {APPARATUS FOR STEAM EMISSION LID AND CONTAINER COMPRISING THE SAME}

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following description relates to a vapor evacuation lead and a packaging container including the same.

Home meal replacement (HMR) is a food that a user can easily cook and eat in a short time. Home-cooked alternative foods are sold in sealed containers and pouches in a partially cooked state so that users can easily cook them. A user can easily cook food and eat fresh food by heating a container and pouch containing food in a microwave oven.

On the other hand, when home-cooked substitute food contained in an airtight container is cooked in a microwave oven, the internal vapor pressure of the container increases due to water vapor. Due to this, the container may inflate, and when the pressure exceeds a certain level, the container or lid of the container may burst. If the container or lid of the container bursts, the sealed food leaks out and the inside of the microwave becomes dirty.

In order to prevent such a problem, the user opens a part of the lid of the sealed container in advance and cooks in a microwave oven. However, opening the container in advance may be an inconvenient operation for the user. For example, even if the container is opened by holding the unsealed portion, the lid sealing the container may not be completely opened, and only the outermost film may be opened. Also, there is a problem that the cooking quality of the food inside the container may not be constant due to the difference in the degree of opening the container depending on the user.

Therefore, there is a need for a container to solve these inconveniences and problems. Even if the user does not open the lid portion of the sealed container in advance, as the internal vapor pressure rises, a portion of the lid is automatically opened, and there is a need for a container in which steam can be discharged.

An object of the embodiment is to provide a vapor outlet lid in which a portion of the container lid is broken and opened as the internal vapor pressure rises, without the user previously opening the portion of the container lid.

The problems to be solved in the embodiments are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A vapor discharge lead according to an embodiment and a packaging container including the same will be described.

A packaging container according to an embodiment is configured to include a container having an accommodating space and a vapor discharge lid sealing the container.

The vapor discharge lead according to an embodiment may be laminated on the first film layer and the first film layer provided to seal the accommodation space of the container, and may include a second film layer including a cutout. The cutout may be formed from the upper surface to the lower surface of the second film layer, and the first film layer may be in contact with the outside air through the cutout.

According to one side, the vapor discharge lead, may further include a barrier layer between the first film layer and the second film layer, the barrier layer is a transparent deposition film or EVOH (ethylene vinyl alcohol), PVDC (polyvinylidene chloride), It may be formed as a coated film including at least any one of the group consisting of polyvinyl acetate (PVA). The laser irradiated to the second film layer may form a cutout so as to penetrate only the second film layer.

According to one side, the cutout may be formed in the center of the second film layer. The cutout may be formed in a straight shape. The length of the incision may be 3 to 10 cm, and the width of the incision may be 190 to 230 μm. In addition, the cutout may be formed in a plurality of locations in the second film layer, or may be formed in a form in which a plurality of lines intersect.

According to one side, the thickness of the first film layer may be 30 to 100 μm, and the thickness of the second film layer may be 15 to 25 μm.

According to one side, the first film layer of the vapor discharge lead may be attached in the form of an easy peel along the rim of the container. The first film layer, as the internal vapor pressure of the container rises, the cut-out portion may be formed of a breakable material. The first film layer may be formed to include at least one selected from the group consisting of polyethylene (PE), polypropylene (PP), and casting polypropylene (CPP).

According to one side, the vapor discharge lead may further include a porous layer capable of tearing in multiple directions on the upper surface of the first film layer. The porous layer may be formed between the first film layer and the second film layer. In addition, the vapor discharge lead, further comprising a barrier layer to prevent deterioration of the contents accommodated in the container, the first film layer, the porous layer, the barrier layer, it may be formed by sequentially stacking the second film layer.

According to one side, the second film layer includes at least one selected from the group consisting of nylon, PET (polyethylene terephthalate), OPP (oriented polypropylene), PE (polyethylene), PP (polypropylene), and PO (polyolefin). can be formed by The second film layer may include a guide line indicating the position of the cutout.

According to one side, the first film layer and the second film layer may be laminated by at least one of an extrusion method, a coating method, a spraying method, and a deposition method.

As seen above, according to embodiments,

As the internal vapor pressure of the vessel rises, a portion of the vessel lid ruptures and opens, allowing the vapor inside the vessel to escape.

In addition, the container provided with the vapor discharge lid, there is no risk of bursting when heated in a microwave oven or boiling water, it is possible to prevent the contents from leaking.

Effects of the vapor discharge lead and the packaging container including the same according to an embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a cross-sectional view of a packaging container having a vapor discharge lid according to an embodiment.
2 is a plan view of a vapor exhaust reed according to an embodiment.
3 is a cross-sectional view of a vapor exhaust lead according to another embodiment.
FIG. 4 is a cross-sectional view of a packaging container having a vapor discharge lid according to a modified embodiment of FIG. 1 .

Hereinafter, embodiments will be described in detail with reference to exemplary drawings. In adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in the description of the embodiment, if it is determined that a detailed description of a related known configuration or function interferes with the understanding of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the component from other components, and the essence, order, or order of the component is not limited by the term. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but another component is between each component. It will be understood that may also be "connected", "coupled" or "connected".

Components included in one embodiment and components having a common function will be described using the same names in other embodiments. Unless otherwise stated, a description described in one embodiment may be applied to another embodiment, and a detailed description in the overlapping range will be omitted.

Hereinafter, with reference to the accompanying drawings, the vapor discharge lead 10 and the packaging container 1 including the same according to embodiments will be described.

1 is a cross-sectional view of a packaging container 1 having a vapor discharge lid 10 according to an embodiment. Referring to FIG. 1 , a packaging container 1 is configured to include a container 20 and a vapor discharge lead 10 .

The container 20 has an accommodation space therein. In the accommodation space of the container 20, Home Meal Replacement (HMR) can be accommodated. Here, the home-cooked alternative food refers to a retort food, and refers to a food that a user can easily cook and eat in a short time.

The vapor discharge lid 10 is provided to close the container 20 . The vapor discharge lid 10 may have the same shape as the opening of the container 20 . In addition, the steam discharge lead 10 may have a shape in which one side is extended and protruded so that the user can easily hold and open the lid 10 .

The vapor discharge lead 10 is composed of a multilayer film, and includes a first film layer 101 and a second film layer 104 .

The first film layer 101 is a layer attached to the upper side of the container 20 to seal the accommodation space of the container 20 . The first film layer 101 may have a thickness of 30 to 100 μm.

The first film layer 101 is attached along the upper edge of the container 20 in an easy peel form. Here, the easy-peel form refers to a form in which a user can easily separate the film sealing the container 20 from the container 20 . At this time, the first film layer 101 may be attached to the upper side of the container 20 in a thermal bonding method. For example, the first film layer 101 may be attached to the container 20 with an adhesive strength of 1.0 kgf/15 mm to 2.0 kgf/15 mm.

The first film layer 101 may be made of a flexible packaging material that breaks when a force equal to or greater than the elongation is applied. Also, the first film layer 101 may be an easy peel film. For example, the first film layer 101 is formed to include at least one selected from the group consisting of polyethylene (PE), polypropylene (PP), and casting polypropylene (CPP).

The second film layer 104 is laminated on the first film layer 101 , and is a layer located on the uppermost side of the vapor discharge lead 10 . The second film layer 104 may have a thickness of 15 to 25 μm.

The second film layer 104 may constitute the outer surface of the packaging container 1 . The second film layer 104 may be made of a material capable of improving the stability and durability of the packaging container 1 . For example, the second film layer 104 is at least one selected from the group consisting of nylon, polyethylene terephthalate (PET), oriented polypropylene (OPP), polyethylene (PE), polypropylene (PP), and polyolefin (PO). formed including the above.

Meanwhile, information on the contents of the packaging container 1 or the design of a product may be printed on the second film layer 104 . At this time, the information of the contents or the design of the product may be printed by gravure printing, offset printing, UV printing or flexographic printing method.

When information on contents or a product design is printed on the second film layer 104 , the second film layer 104 may be corona-discharged surface-treated to improve adhesion and adhesion density of ink. In addition, the second film layer 104 may be laminate-coated to protect the printed contents and to improve the durability of the packaging container 1 .

In the second film layer 104, when the internal vapor pressure of the container 20 rises, the cutout 11 is formed to discharge the internal vapor to control the vapor pressure. When the cutout 11 is formed, a guide line indicating the location of the cutout 11 may be displayed on the second film layer 104 . The guide line may be printed and displayed in the same way as the information on the contents of the packaging container 1 or the design of the product is printed. In this case, the guide line may have the same length as the cutout 11 or may be displayed longer.

Hereinafter, with reference to FIG. 2 , the cutout 11 formed in the second film layer 104 according to an embodiment will be described in detail. For reference, Figure 2 is a plan view showing the vapor discharge lead 10 according to an embodiment.

Referring to FIG. 2 , the cutout 11 may be formed in the center of the second film layer 104 .

At this time, the cutout 11 may be formed in a straight shape as shown in the drawing. When the cutout 11 is in the form of a straight line, the length of the cutout 11 may be 3 to 10 cm. Also, the width of the cutout 11 may be 190 to 230 μm. Here, the cutout 11 is located in the center of the second film layer 104, and the longer the length, the more advantageous it is to discharge the internal vapor of the container 20. However, this is only an embodiment, and the shape of the cutout 11 is not limited by the drawings.

The cutout 11 may also be formed in a form in which a plurality of lines intersect. For example, the shape of the cutout 11 may be a cross (+), an asterisk (*), or a vertex (^).

In addition, the cutout 11 may be formed in a plurality of locations in the second film layer 104 . When the cutout 11 is a plurality of locations, each location may be intermittently formed to be spaced apart from each other. At this time, each location may be arranged in the longitudinal direction.

The cutout 11 is formed from the upper surface to the lower surface of the second film layer 104 . For this reason, the first film layer 101 may be in contact with the outside air through the cutout 11 . The cutout 11 may be formed by irradiating a laser to the second film layer 104 to penetrate the second film layer 104 .

The first film layer 101 and the second film layer 104 including the cutout 11 are laminated through any one of an extrusion method, a coating method, a spraying method, and a deposition method. The lamination method may be a method such as thermocompression compression, spraying, dry roll forming, or the like. However, the lamination method is not limited to the above-described example, and various methods in which the first film layer 101 and the second film layer 104 can maintain the lamination state may be applied.

On the other hand, the vapor discharge lead 10 composed of a multilayer film may further include other layers in addition to the first film layer 101 and the second film layer 104 .

Referring to FIG. 3 , a vapor exhaust lead 10 according to another embodiment will be described in detail. For reference, Figure 3 is a cross-sectional view of the vapor discharge lead 10 according to another embodiment.

Referring to FIG. 3 , the vapor discharge lead 10 may further include a porous layer 102 or a barrier layer 103 .

The porous layer 102 is formed between the first film layer 101 and the second film layer 104 . The porous layer 102 is a layer capable of tearing in multiple directions for effective opening of the vapor discharge lid 10 as the vapor pressure inside the container 20 rises. The porous layer 102 may be formed of, for example, a porous-treated PET material.

The barrier layer 103 is formed between the first film layer 101 and the second film layer 104 . At this time, as shown in the figure, when the vapor discharge lead 10 also includes the porous layer 102 , the barrier layer 103 may be formed between the porous layer 102 and the second film layer 104 . can In this case, the vapor discharge lead 10 may be formed by sequentially stacking the first film layer 101 , the porous layer 102 , the barrier layer 103 and the second film layer 104 . Here, each layer may be laminated through any one of an extrusion method, a coating method, a spray method, and a deposition method.

The barrier layer 103 is formed of a transparent deposition film or a film coated with at least one of the group consisting of ethylene vinyl alcohol (EVOH), polyvinylidene chloride (PVDC), and polyvinyl acetate (PVA). In this case, the barrier layer 103 may be formed by co-extrusion.

In a state in which the barrier layer 103 and the second film layer 104 are stacked, when the laser is irradiated to the second film layer 104 to form the cutout 11 , the laser is applied to the second film layer 104 . The cutout 11 may be formed by adjusting the output of the laser that determines the irradiation depth of the laser so as to penetrate only from the upper surface to the lower surface of the .

At this time, since the cutout 11 is not formed in the barrier layer 103 , the contents accommodated in the container 20 may be protected from the outside. The barrier layer 103 may prevent the contents of the container 20 from leaking and preserve the freshness of the contents by including a moisture and oxygen barrier. In addition, the barrier layer 103 is formed in a state in which a UV blocking coating agent is applied, sprayed or deposited, or a UV blocking film is further included, thereby blocking sunlight from penetrating into the receiving space and preventing the contents from being altered by sunlight. You may.

Hereinafter, with reference to FIG. 4 , the shape deformation of the packaging container 1 that appears when the internal vapor pressure of the container 20 rises will be described in detail. For reference, FIG. 4 is a cross-sectional view of a packaging container 1 having a vapor discharge lid 10 according to a modified embodiment of FIG. 1 .

Although the vapor discharge lead 10 of FIG. 4 is composed of a first film layer 101 and a second film layer 104 , the multilayer film structure of the vapor discharge lead 10 is not limited by the drawings. For example, the vapor exhaust lead 10 may further include a porous layer 102 and a barrier layer 103, as described above.

When the container 20 contains home-cooked substitute food, the packaging container 1 may be heated in a microwave oven or heated in boiling water. As the packaging container 1 is heated, water vapor is generated in the food in the container 20 , and the internal vapor pressure of the container 20 sealed with the vapor discharge lead 10 may increase.

As the internal vapor pressure of the container 20 rises, the packaging container 1 may inflate as shown in FIG. 4 . When the packaging container 1 is inflated, in order to control the internal vapor pressure, the portion in which the cutout 11 is formed is broken in the first film layer 101 . Here, the portion in which the cutout 11 is formed refers to the position of the cutout 11 formed in the second film layer 104 . In other words, the first film layer 101 is a portion in contact with the outside air. The first film layer 101 may break, for example, when the internal vapor pressure of the container 20 is 140% or more than the external vapor pressure.

The packaging container 1 has such a structure, the internal vapor pressure is adjusted, and the food inside the container 20 can be effectively heated and cooked. First, the food inside the container 20 up to a certain vapor pressure can be sufficiently cooked so as not to be overcooked by using the internal vapor pressure of the container 20 . Thereafter, when the internal vapor pressure of the container 20 increases as the packaging container 1 is heated, the first film layer 101 is broken, and the vapor can be discharged through the broken portion. For this reason, it is possible to prevent the packaging container 1 from bursting, and further heat and cook food.

According to embodiments, the packaging container 1 is configured to include a container 20 and a vapor discharge lead 10 , and the vapor discharge lead 10 is a first film layer sealing the receiving space of the container 20 . 101 and the second film layer 104 laminated on the first film layer, and including the cutout 11 . Since the packaging container 1 is provided with the vapor discharge lead 10 , the vapor pressure inside the packaging container 1 can be adjusted without the user opening a part of the vapor discharge lead 10 in advance. When the internal vapor pressure of the container 20 rises, the steam discharge lead 10 is partially broken and opened, and the vapor inside the container 20 may be discharged. In addition, the packaging container 1 having the vapor discharge lead 10 does not have a risk of bursting when heated, and it is also possible to prevent the contents inside the container 20 from leaking.

As described above, although the embodiments have been described with reference to the limited drawings, various modifications and variations are possible from the above description by those of ordinary skill in the art. For example, the described techniques are performed in an order different from the described method, and/or the described components of structures, devices, etc. are combined or combined in a different form than the described method, or other components or equivalents are used. Appropriate results can be achieved even if substituted or substituted by

Therefore, the spirit of the present invention should not be limited to the described embodiments, and not only the claims described below, but also all of the claims and all equivalents or equivalent modifications will fall within the scope of the spirit of the present invention.

1: Packaging container
10: steam exhaust lead
101: first film layer
102: porous layer
103: barrier layer
104: second film layer
11: incision
20: courage

Claims (25)

a first film layer provided to seal the accommodation space of the container; and
a second film layer laminated on the first film layer and including a cutout;
A vapor exhaust lead comprising a.
According to claim 1,
The cutout is formed from the upper surface to the lower surface of the second film layer,
A vapor discharge lead formed so that the first film layer can be in contact with the outside air through the cutout.
According to claim 1,
a barrier layer formed between the first film layer and the second film layer;
further comprising,
The barrier layer is a vapor discharge lead formed of a transparent deposition film or a film coated with at least one or more from the group consisting of EVOH (ethylene vinyl alcohol), PVDC (polyvinylidene chloride), and PVA (polyvinyl acetate).
4. The method of claim 3,
The laser irradiated to the second film layer,
A vapor discharge lead forming the cutout so as to penetrate only the second film layer.
3. The method of claim 2,
The cutout is a vapor discharge lead formed in the center of the second film layer.
3. The method of claim 2,
The incision is a vapor discharge lead formed in a straight shape.
7. The method of claim 6,
The length of the incision is 3 to 10 cm steam exhaust lead.
7. The method of claim 6,
The width of the incision is 190 to 230 ㎛ vapor discharge lead.
3. The method of claim 2,
The incision portion is a vapor discharge lead formed in a plurality of locations on the second film layer.
3. The method of claim 2,
The cutout leads to a vapor discharge formed in a shape in which a plurality of lines intersect.
According to claim 1,
The thickness of the first film layer is 30 to 100 ㎛ vapor discharge lead.
According to claim 1,
The thickness of the second film layer is 15 to 25 ㎛ vapor discharge lead.
According to claim 1,
The first film layer, along the upper edge of the container, vapor discharge lead attached in the form of an easy peel (Easy Peel).
According to claim 1,
The first film layer is, as the internal vapor pressure of the container rises, a vapor discharge lead in which the cut-out portion is formed of a breakable material.
15. The method of claim 14,
The first film layer,
A vapor discharge lead comprising at least one selected from the group consisting of PE (polyethylene), PP (polypropylene), and CPP (casting polypropylene).
According to claim 1,
The first film layer may include a porous layer capable of tearing in multiple directions on an upper surface;
further comprising,
The porous layer is a vapor discharge lead formed between the first film layer and the second film layer.
17. The method of claim 16,
A barrier layer to prevent deterioration of the contents accommodated in the container is further provided,
The vapor discharge lead in which the first film layer, the porous layer, the barrier layer and the second film layer are sequentially stacked.
According to claim 1,
The second film layer,
A vapor discharge lead comprising at least one selected from the group consisting of nylon, polyethylene terephthalate (PET), oriented polypropylene (OPP), polyethylene (PE), polypropylene (PP), and polyolefin (PO).
According to claim 1,
The second film layer,
A vapor discharge lead including a guide line indicating the position of the cutout.
According to claim 1,
The first film layer and the second film layer is a vapor discharge lead laminated by at least one of an extrusion method, an application method, a spray method, and a deposition method.
a container having a receiving space; and
a vapor exhaust lid sealing the vessel;
including,
The vapor discharge lead,
a first film layer provided to seal the accommodating space of the container in an easy-peel form; and
a second film layer laminated on the first film layer, the second film layer including a cutout formed so that the first film layer can contact the outside air;
A packaging container comprising a.
22. The method of claim 21,
The cutout portion is a packaging container formed in a straight shape in the center of the second film layer.
22. The method of claim 21,
The thickness of the first film layer is 30 to 100 ㎛ packaging container.
22. The method of claim 21,
The thickness of the second film layer is 15 to 25 ㎛ packaging container.
22. The method of claim 21,
The first film layer is a packaging container in which the portion formed with the cutout is formed of a breakable material as the internal vapor pressure of the container rises.

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