KR20210059354A - Black photosensitive composition for low temperature curing, black light shielding film and display device - Google Patents

Abstract

The present specification relates to a low-temperature curing black photosensitive composition including: a binder resin; a polyfunctional monomer; a coloring agent; a photoinitiator; and a solvent. Provided are a low-temperature curing black photosensitive composition, a black light-shielding film formed using the same, and a display device including the black light-shielding film, wherein the binder resin includes an alkali-soluble resin and an epoxy resin, the polyfunctional monomer has a molecular weight of 250 to 500 g/mol, and an acrylate monomer having an acryloyl group equivalent of 80 to 110 g/eq is included.

Description

Black photosensitive composition for low temperature curing, black light shielding film, and display device TECHNICAL FIELD [BLACK PHOTOSENSITIVE COMPOSITION FOR LOW TEMPERATURE CURING, BLACK LIGHT SHIELDING FILM AND DISPLAY DEVICE}

The present application relates to a low-temperature curing black photosensitive composition, a black light shielding film formed using the same, and a display device including the same.

In the configuration of an OLED device, in order to improve light leakage and contrast, it has been a conventional technique to secure the image quality by using a circular polarizing plate on the device. However, the use of such a circularly polarizing plate can improve the contrast and reflection visibility, but decrease the transmittance, thereby reducing the luminance and limiting the flexibility, which is an advantage of the OLED device, making it difficult to apply to foldable OLEDs.

Therefore, instead of using a polarizing plate, the function of the existing polarizing plate can be secured by manufacturing a black shading pattern on top of the OLED element and performing a color filter process, and the range of application is not limited by flexibility by directly coating and manufacturing the OLED element. I came to be able to take it more widely,

However, since the previously developed photosensitive resin composition for black and color filters has secured its pattern characteristics through high temperature curing at 230°C after exposure and development, it cannot be applied to OLED devices in which organic materials for light emission that are vulnerable to temperature are adopted. Accordingly, there is a need to develop a composition capable of patterning and curing at less than 100° C. in which pattern characteristics and organic materials are stable. With a composition with certain characteristics, the formation of a black light-shielding film and fine pattern characteristics could be secured. However, curing at a low temperature of 100°C or lower results in lower crosslinking than before, and this characteristic causes chemical resistance issues such as damage to the surface of the black film and chipping after the black light-shielding film process and the subsequent color filter or planarization process. Was done. Therefore, there is a need to improve chemical resistance by slightly increasing the degree of crosslinking in forming a black light-shielding film.

Korean Patent Application Publication No. 2011-0071965

The present application is to provide a low-temperature curing black photosensitive composition, a black light shielding film, and a display device including the same.

An exemplary embodiment of the present application is a binder resin; Polyfunctional monomers; coloring agent; As a low-temperature curing black photosensitive composition containing a photoinitiator and a solvent, the binder resin includes an alkali-soluble resin and an epoxy resin, and the multifunctional monomer has a molecular weight of 250 g/mol to 500 g/mol, and an acryloyl group equivalent It provides a low-temperature curing black photosensitive composition comprising an acrylate monomer of 80 g / eq to 110 g / eq.

Another exemplary embodiment of the present application provides a black light-shielding film formed at a curing temperature of 80°C to 100°C using the low-temperature curing black photosensitive composition.

Another exemplary embodiment of the present application provides a display device including the above-described black light shielding film.

When a black light-shielding film is formed and applied using the low-temperature curing black photosensitive composition according to the exemplary embodiments described in the present specification, ultraviolet (UV) curing and crosslinking degree at a low temperature of 100° C. or less can be maximized to enhance thermosetting properties. And, accordingly, chemical resistance can be improved.

1 to 3 are views showing evaluation results of a low-temperature curing black photosensitive composition according to exemplary embodiments of the present application.
4 is a simplified diagram of a display device to which a low-temperature curing black photosensitive composition according to an exemplary embodiment of the present application is applied.

An exemplary embodiment of the present application is a binder resin; Polyfunctional monomers; coloring agent; As a low-temperature curing black photosensitive composition containing a photoinitiator and a solvent, the binder resin includes an alkali-soluble resin and an epoxy resin, and the multifunctional monomer has a molecular weight of 250 g/mol to 500 g/mol, and an acryloyl group equivalent It provides a low-temperature curing black photosensitive composition comprising an acrylate monomer of 80 g / eq to 110 g / eq.

The present applicant intends to provide a black photosensitive composition that can be cured at a low temperature of 100° C. or lower for application to an OLED device on which an organic material is already deposited.

The black photosensitive composition for low temperature curing according to an exemplary embodiment of the present application may be patterned and cured at 100° C. or lower in which pattern characteristics and organic materials are stable. Specifically, the binder resin included in the low-temperature curing black photosensitive composition according to an exemplary embodiment of the present application includes an epoxy resin to enable low-temperature curing in addition to a binder resin capable of developing in an alkali developer, and ultraviolet (UV) curing The degree of crosslinking of the black photosensitive composition by ultraviolet curing by including an acrylate monomer having a molecular weight of 250 g/mol to 500 g/mol and an acryloyl group equivalent of 80 g/eq to 110 g/eq. Can be maximized, and the thermosetting properties can be enhanced to improve chemical resistance.

The epoxy resin contained in the binder resin refers to a resin capable of thermosetting by having an epoxy group. Specifically, the epoxy resin is a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a novolak type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac epoxy resin, a DCPD (Dicyclopentadiene) novolac epoxy resin, etc. However, it is not limited thereto.

In the exemplary embodiment of the present application, the epoxy resin may be a bisphenol A-type novolac epoxy resin.

In the exemplary embodiment of the present application, the epoxy group equivalent of the epoxy resin may be 150g/eq to 250g/eq.

The epoxy group equivalent can be calculated by dividing the average branching amount of the repeating unit by the number of epoxy groups in the repeating unit.

The epoxy group equivalent of the bisphenol A novolac epoxy resin may be 200 g/eq.

The alkali-soluble resin has an acid value of 30 KOH mg/g to 300 KOH mg/g, preferably 50 KOH mg/g to 150 KOH mg/g. The weight average molecular weight of the alkali-soluble resin is preferably in the range of 2,000 g/mol to 200,000 g/mol, and more preferably, the weight average molecular weight is in the range of about 2,000 g/mol to 20,000 g/mol.

When the acid value and the weight average molecular weight of the alkali-soluble resin satisfy the above range, it may have a wide development process margin without loss of residue or pattern.

The alkali-soluble resin may be used alone or in combination of two or more, and may be used by mixing a cardo-based binder, an acrylate or methacrylate-based copolymer, and the like.

For example, the alkali-soluble resin is a copolymer of a monomer containing an acid functional group and a monomer copolymerizable with the monomer, and a non-limiting example of the monomer containing the acid group is (meth)acrylic Acid, crotonic acid, itaconic acid, maleic acid, fumarin acid, monomethyl maleic acid, isoprene sulfonic acid, styrene sulfonic acid, 5-norbornene-2-camoxylic acid, and the like. These may be used alone or in combination of two or more.

Non-limiting examples of monomers that can be copolymerized with the monomer containing the acid group include styrene, chloro styrene, α-methyl styrene, vinyltoluene, 2-ethylhexyl (meth)acrylate, methyl (meth)acrylate, ethyl ( Meth)acrylate, butyl (meth)acrylate, benzyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, cyclohexyl (meth) Acrylate, dicyclopentanyl (meth)acrylate, isobornyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, tetrahydrofurpril (meth)acrylate, hydroxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxy-3-chloropropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4- Hydroxybutyl (meth)acrylate, dimethylaminomethyl (meth)acrylate, diethylamino (meth)acrylate, acyloctyloxy-2-hydroxypropyl (meth)acrylate, ethylhexyl acrylate, 2-meth Toxoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, butoxyethyl (meth)acrylate, ethoxydiethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, meth Toxoxytripropylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, p-nonylphenoxypolyethylene glycol (meth)acrylate, p-nonylphenoxypolypropylene Glycol (meth)acrylate, tetrafluoropropyl (meth)acrylate, 1,1,1,3,3,3-hexafluoroisopropyl (meth)acrylate, octafluoropentyl (meth)acrylate, Heptadecafluorodecyl (meth)acrylate, tribromophenyl (meth)acrylate, β-(meth)acyloloxyethylhydrogen sucinate, methyl α-hydroxymethyl acrylate, ethyl α-hydroxymethyl Acrylate, propyl α-hydroxymethyl acrylate, butyl α-hydroxymethyl acrylate, N-phenylmaleimide, N-(4-chlorophenyl)maley Meade, etc. These may be used alone or in combination of two or more.

In addition, a non-limiting example of an ethylenically unsaturated compound containing an epoxy group capable of polymerizing and reacting with a copolymer of a monomer containing an acid functional group and a monomer capable of copolymerizing with the monomer is glycidyl (Meth)acrylate, vinyl benzyl glycidyl ether, vinyl glycidyl ether, allyl glycidyl ether, 4-methyl-4,5-epoxypentene, γ-glycidoxy propyl trimethoxysilane, γ-gly Sydoxy propyl methyldiethoxysilane, γ-glycidoxy propyl triethoxy silane, norbornyl derivatives. These may be used alone or in combination of two or more.

In addition, in addition to the monomers, a binder resin represented by the following Chemical Formula 1 may be used.

[Formula 1]

In the above formula, Rx is a structure in which a 5-membered carboxylic anhydride or diisocyanate is added to form an ester bond, and Ry is selected from hydrogen, acryloyl, and methacryloyl, and n is 3 to 8 to be.

Examples of specific compounds of the carboxylic anhydride constituting Rx include succinic anhydride, methylsuccinic anhydride, 2,2-dimethylsuccinic anhydride, isobutenylsuccinic anhydride, 1,2-cyclohexanedicarboxylic anhydride, hexahydro- 4-methylphthalic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, methyl-5-norbornene-2,3-dicarboxylic anhydride, 1,2,3 ,4-cyclobutanetetracarboxylic dianhydride, maleic anhydride, citraconic anhydride, 2,3,-dimethylmaleic anhydride, 1-cyclopentene-1,2-dicarboxylic dianhydride, 3,4,5,6 -Tetrahydrophthalic anhydride, phthalic anhydride, bisphthalic anhydride, 4-methylphthalic anhydride, 3,6-dichlorophthalic anhydride, 3-hydrophthalic anhydride, 1,2,4-benzenetricarboxylic anhydride, 4-nitrophthalic anhydride , And one or more selected from the group consisting of diethylene glycol-1,2-bistrimellic anhydride, but is not limited thereto.

Specific examples of the diisocyanate constituting Rx include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1 ,3-butylene diisocyanate, dodecamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, ω,ω'-diisocyanate-1,3-dimethylbenzene, ω,ω'-diisocyanate-1, 4-dimethylbenzene, ω,ω'-diisocyanate-1,3-diethylbenzene, 1,4-tetramethyl xylene diisocyanate, 1,3-tetramethyl xylene diisocyanate, isophorone diisocyanate, 1,3- Cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'- At least one selected from the group consisting of methylenebisisocyanate methylcyclohexane, 2,5-isocyanatemethyl bicyclo[2,2,2]heptane, and 2,6-isocyanatemethyl bicyclo[2,2,1]heptane; , Is not limited thereto.

Specifically, the alkali-soluble resin is 9,9-bisglycidyloxyphenyl fluorene (9,9-[Bis(glycidyloxy)phenyl]fluorene), 4-cyclohexene-1,2-dicarboxylic acid (4- cyclohexen-1,2-dicarboxylic acid), bisphenol fluorene epoxy acrylate to which acrylic acid is added, and biphenyl-tetracarboxylic acid dianhydride may be mixed.

The mixing may be performed in propylene glycol monomethyl ether acetate (PGMEA) as a solvent, but the type of the solvent is not particularly limited.

In one example, the alkali-soluble resin is 9,9-bisglycidyloxyphenyl fluorene (9,9-[Bis(glycidyloxy)phenyl]fluorene)/4-cyclohexene-1,2-dicarboxylic acid (4-cyclohexen-1,2-dicarboxylic acid) may be an alkali-soluble resin having a molar ratio of 40/60, and also biphenyl-tetracarboxylic acid dianhydride to which acrylic acid is added. ) May be an alkali-soluble resin consisting of a molar ratio of 70/30.

In the exemplary embodiment of the present application, the multifunctional monomer has a molecular weight of 250 g/mol to 500 g/mol. Preferably the molecular weight is 300 g/mol to 400 g/mol, more preferably the molecular weight is 300 g/mol to 360 g/mol.

When the multifunctional monomer satisfies the above molecular weight range, the mobility of radicals generated during UV curing and thermal curing is improved, thereby maximizing the degree of crosslinking of the black photosensitive composition, thereby improving chemical resistance. When the molecular weight of the polyfunctional monomer is less than 250 g/mol, the mobility of the generated radicals may be improved, but the surface film quality is not good, so it is difficult to obtain defect-free surface characteristics due to poor surface film quality. do. When the molecular weight of the polyfunctional monomer exceeds 500 g/mol, the film quality is firmly obtained, but the mobility of radicals generated during ultraviolet (UV) irradiation and thermal curing is limited, and thus it is difficult to improve the degree of crosslinking.

The molecular weight of the polyfunctional monomer can be calculated from the chemical structural formula.

In the exemplary embodiment of the present application, the polyfunctional monomer includes an acrylate monomer having an acryloyl group equivalent of 80 g/eq to 110 g/eq. Preferably, the acryloyl group equivalent is 85 g/eq to 95 g/eq.

When the polyfunctional monomer satisfies the acryloyl group equivalent range, the mobility of radicals generated during UV curing and thermal curing is improved, thereby maximizing the degree of crosslinking of the black photosensitive composition, thereby improving chemical resistance.

The acryloyl group is an acyl group derived from acrylic acid _{and refers to the form of an enone having H 2} C=CH-C(=O)-.

In the exemplary embodiment of the present application, as the multifunctional monomer, a multi-acrylate series having three or more bondable double bonds may be mainly applied. Specifically, the multi-acrylate-based polyfunctional monomers include glycerin triacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetra It may be an acrylate (pentaerythritol tetraacylate) or 2-propoxy glycerol triacrylate, but is not limited thereto.

The polyfunctional monomer may preferably be pentaerythritol triacrylate or pentaerythritol tetraacylate.

In the exemplary embodiment of the present application, the polyfunctional monomer is an acrylate monomer having a molecular weight of 250 g/mol to 500 g/mol and an acryloyl group equivalent of 80 g/eq to 110 g/eq as an acrylate monomer. It contains more than 70% by weight and 100% by weight or less based on the total polyfunctional monomers used in the low-temperature curing black photosensitive composition. Specifically, it is included in an amount of 71% by weight or more and 100% by weight or less.

The polyfunctional monomer includes an acrylate monomer having a molecular weight of 250 g/mol to 500 g/mol and an acryloyl group equivalent of 80 g/eq to 110 g/eq in the above-described weight range, thereby curing ultraviolet rays and heat. Mobility of radicals generated during curing is improved, so that the degree of crosslinking of the black photosensitive composition for low temperature curing is maximized, thereby improving chemical resistance.

In the exemplary embodiment of the present application, the colorant includes at least one selected from carbon black, an organic black pigment, a mixture of color organic pigments, a metal oxide inorganic pigment, and a metal nitride inorganic pigment.

In the exemplary embodiment of the present application, the colorant may be included in the black photosensitive composition as a pigment dispersion.

The pigment dispersion may contain 10% to 30% by weight of a colorant in a solvent propylene glycol monomethyl ether acetate (PGMEA) based on the total weight of the pigment dispersion.

In the present specification, the organic black pigment refers to a pigment made of an organic material and absorbs light in a visible wavelength range as a single species to exhibit a black color. In the case of the organic black pigment, since higher optical density, that is, OD (light-shielding property) per the same amount of use can be obtained than when a color organic pigment is mixed and used, it is advantageous to form a coating film and to secure a process margin. According to an exemplary embodiment, a lactam-based pigment or a perylene-based pigment may be used as the organic black pigment.

In the present specification, the carbon black may be a high-resistance carbon black having a ^{surface resistance of 10 11} ohm/cm 2 or more based on the use of 40% by weight of the content in the coating film. The organic black pigment and the carbon black may be used alone, or may be used by mixing the carbon black and the organic black pigment in a weight ratio of carbon black: organic black = 99:1 to 10:90.

For example, available carbon blacks include Donghae Carbon Co., Ltd.'s Cysto 5HIISAF-HS, Cysto KH, Cysto 3HHAF-HS, Cysto NH, Cysto 3M, Cysto 300HAF-LS, Cysto 116HMMAF-HS, Cysto 116MAF, cysto FMFEF-HS, cysto SOFEF, cysto VGPF, cysto SVHSRF-HS, and cysto SSRF; Mitsubishi Chemical Corporation's Diagram Black II, Diagram Black N339, Diagram Black SH, Diagram Black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E, Diagram G, Diagram R, Diagram N760M, Diagram LR, #2700, #2600, #2400, #2350, #2300, #2200, #1000, #980, #900, MCF88, #52, #50, #47, #45, #45L, #25, # CF9, #95, #3030, #3050, MA7, MA77, MA8, MA11, OIL7B, OIL9B, OIL11B, OIL30B, and OIL31B; Daegu Corporation's PRINTEX-U, PRINTEX-V, PRINTEX-140U, PRINTEX-140V, PRINTEX-95, PRINTEX-85, PRINTEX-75, PRINTEX-55, PRINTEX-45, PRINTEX-300, PRINTEX-35, PRINTEX-25, PRINTEX-200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK-550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100, and LAMP BLACK-101; Columbia Carbon Co., Ltd.'s RAVEN-1100ULTRA, RAVEN-1080ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000, RAVEN-890H, RAVEN-890, RAVEN-880ULTRA, RAVEN-860ULTRA, RAVEN-850, RAVEN-820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN-420, RAVEN-410, RAVEN- 2500ULTRA, RAVEN-2000, RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, and RAVEN-1170, Daido's #9931, #9941, OC's EG410, EG550, EG450, EG880, EG2500G And Cabot's TPK 1099R, TPK1437R, TPK1470R, TPK1104R, TPK1227R, TPX 997, TPX 998, TPK 1104, TPX1168, TPX 1409, TPX 1410, etc., but are not limited thereto.

Color organic pigments that can be mixed with the carbon black include carmine 6B (C.I.12490), phthalocyanine green (C.I. 74260), phthalocyanine blue (C.I. 74160), Mitsubishi carbon black MA100, Black 582 (basf), C.I. PIGMENT BALCK 12, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, perylene black (BASF K0084.K0086), cyanine black, linole yellow (CI21090), linol yellow GRO (CI 21090) ), Benzidine Yellow 4T-564D, Mitsubishi Carbon Black MA-40, Victoria Pure Blue (CI42595), CI PIGMENT RED97, 122, 149, 168, 177, 180, 192, 215, C.I. PIGMENT GREEN 7, 36, C.I. PIGMENT Blue 15:1, 15:4, 15:6, 22, 60, 64, C.I. PIGMENT yellow 83, 139 C.I. There are PIGMENT VIOLET 23 and 29, and other white pigments, fluorescent pigments, etc. may be used, but are not limited thereto.

In the exemplary embodiment of the present application, the metal oxide inorganic pigment and the metal nitride inorganic pigment are not limited, and those used in the art may be appropriately used.

In the exemplary embodiment of the present application, it further includes at least one selected from the group consisting of the surfactant and the silane coupling agent.

In the exemplary embodiment of the present application, the surfactant is a fluorine-based surfactant.

As a fluorine-based surfactant, DIC (DaiNippon Ink & Chemicals)'s F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F -445, F-446, F-470, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483 , F-484, F-486, F-487, F-554, F-570, F-172D, MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF -1129, TF-1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441, TF-1442, etc. may be used, but are not limited thereto. Specifically, it may be F-570.

In the exemplary embodiment of the present application, the silane coupling agent is methacryloyloxy propyltrimethoxy silane, methacryloyloxy propyldimethoxy silane, methacryloyloxy propyltriethoxy silane, methacryloyl oxide. One or more types of meta-acryloyl silane coupling agents such as propyl dimethoxysilane can be selected and used, and as alkyl trimethoxy silanes, octyltrimethoxy silane, dodecyltrimethoxy silane, and octadecyltrimethoxy silane You can select and use more than one type from, etc.

As a non-limiting example of the silane coupling agent, Shin-Etsu's KBM or KBE series may be applied, but is not limited thereto. For example, KBM 1003, KBE1003 as vinyl type, KBM303, KBM403, KBE402, KBE403 as styryl type, KBM1403 as styryl type, KBM502, KBM503, KBE502, KBE503 as methacrylic oxy type, KBM5103 as acrylicoxy type, KBM602 as amino type, KBM603 , KBM903, KBM573, KBM575, KBM974, KBE903, KBE9103, Mercapto system KBM 802, KBM803, other KBM 585, KBE846, KBE9007, etc.

Specifically, the silane coupling agent may be KBM-503 (Shin-Etsu Corporation), but is not limited thereto.

In another exemplary embodiment of the present application, the photoinitiator is a material that generates radicals by light, and is selected from the group consisting of acetophenone-based compounds, biimidazole-based compounds, triazine-based compounds, and oxime-based compounds. It is preferable to use one type or a mixture of two or more compounds.

Examples of acetophenone-based compounds usable as the photoinitiator include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1 -One, 4-(2-hydroxyethoxy)-phenyl-(2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenyl ketone, benzoin methyl ether, benzoin ethyl ether, benzoin iso Butyl ether, benzoinbutyl ether, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl-(4-methylthio)phenyl-2-morpholino-1-propan-1-one, 2-benzyl -2-Dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-(4-bromo-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butane Those selected from the group consisting of -1-one and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one may be used.

Biimidazole-based compounds include 2,2-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl biimidazole, 2,2'-bis(o-chlorophenyl)-4, 4',5,5'-tetrakis(3,4,5-trimethoxyphenyl)-1,2'-biimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4 ',5,5'-tetraphenyl biimidazole, and 2,2'-bis(o-chlorophenyl)-4,4,5,5'-tetraphenyl-1,2'-biimidazole, HABI 101 Those selected from the group consisting of (Tronni Corporation) may be used.

As a triazine compound, 3-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}propionic acid, 1,1,1,3,3,3- Hexafluoroisopropyl-3-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}propionate, ethyl-2-{4-[2,4 -Bis(trichloromethyl)-s-triazine-6-yl]phenylthio}acetate, 2-epoxyethyl-2-{4-[2,4-bis(trichloromethyl)-s-triazine-6 -Yl]phenylthio}acetate, cyclohexyl-2-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}acetate, benzyl-2-{4-[ 2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}acetate, 3-{chloro-4-[2,4-bis(trichloromethyl)-s-triazine-6 -Yl]phenylthio}propionic acid, 3-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}propionamide, 2,4-bis(trichloro Methyl)-6-p-methoxystyryl-s-triazine, 2,4-bis(trichloromethyl)-6-(1-p-dimethylaminophenyl)-1,3,-butadienyl-s -Triazine, and those selected from the group consisting of 2-trichloromethyl-4-amino-6-p-methoxystyryl-s-triazine can be used.

As oxime compounds, OXE-01, OXE-02, OXE-03, OXE-04 (BASF), NCI-831, N-1919, NCI-930 (Adeka), SPI-02, SPI-03 (Samyang) , PI-102, PI-103 (LG Chemical), PBG 304, PBG 305, PBG 3053, PBG3056, PBG3057, PBG 3059, PBG3142 (Tronni).

The photoinitiator is preferably contained in an amount of 0.5 to 10% by weight based on the total solid content of the low-temperature curing black photosensitive composition.

The photoinitiator further includes 0.01 to 5% by weight of a photo-crosslinking sensitizer that promotes the generation of radicals as an auxiliary component based on the total weight of the low-temperature curing black photosensitive composition, or 0.01 to 5% by weight of a curing accelerator that accelerates curing. I can.

As the photocrosslinking sensitizer, benzophenone, 4,4-bis(dimethylamino)benzophenone, 4,4-bis(diethylamino)benzophenone, 2,4,6-trimethylaminobenzophenone, methyl-o-benzoyl Benzophenone compounds such as benzoate, 3,3-dimethyl-4-methoxybenzophenone, and 3,3,4,4-tetra(t-butylperoxycarbonyl)benzophenone; Fluorenone compounds, such as 9-fluorenone, 2-chloro-9-prorenone, and 2-methyl-9-fluorenone; Thioxanthone type such as thioxanthone, 2,4-diethyl thioxanthone, 2-chloro thioxanthone, 1-chloro-4-propyloxy thioxanthone, isopropyl thioxanthone, and diisopropyl thioxanthone compound; Xanthone compounds such as xanthone and 2-methylxanthone; Anthraquinone compounds such as anthraquinone, 2-methyl anthraquinone, 2-ethyl anthraquinone, t-butyl anthraquinone, and 2,6-dichloro-9,10-anthraquinone; 9-phenylacridine, 1,7-bis(9-acridinyl)heptane, 1,5-bis(9-acridinylpentane), 1,3-bis(9-acridinyl)propane, etc. Acridine-based compounds; Dicarbonyl compounds such as benzyl, 1,7,7-trimethyl-bicyclo[2,2,1]heptane-2,3-dione, and 9,10-phenanthrenequinone; Phosphine oxide compounds such as 2,4,6-trimethylbenzoyl diphenylphosphine oxide and bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentyl phosphine oxide; Benzophenone compounds such as methyl-4-(dimethylamino)benzoate, ethyl-4-(dimethylamino)benzoate, and 2-n-butoxyethyl-4-(dimethylamino)benzoate; 2,5-bis(4-diethylaminobenzal)cyclopentanone, 2,6-bis(4-diethylaminobenzal)cyclohexanone, 2,6-bis(4-diethylaminobenzal)-4- Amino synergists such as methyl-cyclopentanone; 3,3-carbonylvinyl-7-(diethylamino)coumarin, 3-(2-benzothiazolyl)-7-(diethylamino)coumarin, 3-benzoyl-7-(diethylamino)coumarin, 3 -Benzoyl-7-methoxy-coumarin, 10,10-carbonylbis[1,1,7,7-tetramethyl-2,3,6,7-tetrahydro-1H,5H,11H-C1]-benzo Coumarin compounds such as pyrano[6,7,8-ij]-quinolizin-11-one; Chalcone compounds such as 4-diethylamino chalcone and 4-azidebenzalacetophenone; 2-benzoylmethylene, 3-methyl-b-naphthothiazoline, or the like can be used.

In addition, as the curing accelerator, 2-mercaptobenzoimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzooxazole, 2,5-dimercapto-1,3,4-thiadiazole, 2- Mercapto-4,6-dimethylaminopyridine, pentaerythritol-tetrakis (3-mercaptopropionate), pentaerythritol-tris (3-mercaptopropionate), pentaerythritol-tetrakis (2-mercapto) Acetate), pentaerythritol-tris (2-mercaptoacetate), trimethylolpropane-tris (2-mercaptoacetate), or trimethylolpropane-tris (3-mercaptopropionate).

In another exemplary embodiment of the present application, the solvent is propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol mono Ethyl ether acetate, diethylene glycol dimethyl ether, cyclohexanone, 2-heptanone, 3-heptanone, 2-hydroxyethylpropionate, 3-methyl-3-methoxybutylpropionate, ethyl-3- Methoxy propionate, methyl-3-ethoxy propionate, ethyl-3-ethoxy propionate, butyl acetate, amyl permate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, Ethyl butyrate, butyl butyrate, ethyl pyruvate, or γ-butyrol acetate may be used. These solvents may be used alone or in combination of two or more.

The low-temperature curable black photosensitive composition according to the above-described exemplary embodiment may further contain an additive as long as it does not adversely affect the object of the present invention. For example, at least one additive selected from the group consisting of a dispersant, an adhesion promoter, an antioxidant, an ultraviolet absorber, an anti-thermal polymerization agent, and a leveling agent may be additionally used.

The dispersant may be used as a method of adding the pigment inside to the pigment in the form of surface treatment in advance, or adding it to the pigment outside. As the dispersant, a polymeric, nonionic, anionic, or cationic dispersant may be used. Non-limiting examples of such dispersants include polyalkylene glycol and esters thereof, polyoxyalkylene polyhydric alcohol, ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonate, carboxylic acid ester, carboxylate. Acid salts, alkylamide alkylene oxide adducts, or alkylamines.

Non-limiting examples of the antioxidant include 2,2-thiobis(4-methyl-6-t-butylphenol), or 2,6-g,t-butylphenol, and the like, and non-limiting examples of the ultraviolet absorber Examples include 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chloro-benzotriazole, or alkoxy benzophenone. In addition, non-limiting examples of the thermal polymerization inhibitor include hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogarol, t-butylcatechol, benzoquinone, 4,4-thiobis (3 -Methyl-6-t-butylphenol), 2,2-methylenebis(4-methyl-6-t-butylphenol), or 2-mercaptoimidazole.

The ultraviolet absorber, the thermal polymerization inhibitor, and the leveling agent may be appropriately employed, and are not particularly limited.

In addition, the low-temperature curing black photosensitive composition may further include one or more additives selected from the group consisting of the pigment mixture dispersion, a functional resin binder, a monomer, a radiation-sensitive compound, and other additives .

In an exemplary embodiment of the present application, based on the total weight of the solid content of the low-temperature curing black photosensitive composition, the alkali-soluble resin is 10 to 40% by weight, the epoxy resin is 5 to 20% by weight, the polyfunctional monomer is 10 To 30% by weight, the colorant includes 10 to 50% by weight, and the photoinitiator contains 0.5 to 10% by weight.

In the exemplary embodiment of the present application, the solvent may be included in an amount of 75 to 90% by weight based on the total weight of the low-temperature curing black photosensitive composition.

When the alkali-soluble resin included in the low-temperature curing black photosensitive composition is less than the above-described weight range, undeveloped residue may be generated due to insufficient developability, and when it exceeds the above-described weight range, the polymer film matrix is solid and mobility is reduced. , There is a possibility of lowering the sensitivity.

If the epoxy resin included in the low-temperature curing black photosensitive composition is less than the above-described range, the degree of crosslinking due to thermal curing may decrease, resulting in a chemical resistance problem, and if it exceeds the above-described range, the aging stability of the composition may be deteriorated. have.

When the content of the multi-inertial monomer included in the low-temperature curing black photosensitive composition is less than the above-described range, the degree of crosslinking may decrease, resulting in film shearing, and if it exceeds the above-described range, the degree of crosslinking may increase, but the surface stickiness of the film. ) Increases, which easily causes surface contamination and causes residue.

If the colorant included in the low-temperature curing black photosensitive composition is less than the above-described weight range, a problem of lowering the light-shielding power occurs, and if it exceeds the above-described weight range, the light-shielding power increases, but the process margin is significantly deteriorated, resulting in the removal of residues and patterns. It can be triggered.

In the case of the photoinitiator included in the low-temperature curing black photosensitive composition, if it is less than the above-described weight range, the sensitivity may decrease and pattern dropout may occur, and if it exceeds the above-described weight range, the mask fidelity of the pattern deteriorates and a fine pattern is obtained. Can be tough.

The low-temperature curing black photosensitive composition according to the above-described embodiments may be prepared by mixing the above-described components. According to an example, first, a pigment dispersion is prepared. By using a commercially available pigment in the form of a dispersion, it is possible to replace the production of a pigment dispersion. The binder resin may be mixed with the pigment dispersion, a polyfunctional monomer, a photoinitiator, and a solvent may be added and stirred to prepare the low-temperature curing black photosensitive composition.

In the exemplary embodiment of the present application, the low-temperature curing black photosensitive composition has a thickness retention rate of 85% or more for evaluation of chemical resistance when a coating film having a thickness of 0.5 µm to 2 µm is formed.

Specifically, the thickness of the coating layer may be 0.7 μm to 1.3 μm.

The thickness retention rate may be 85% or more and 100% or less.

The thickness retention may be measured by conducting chemical resistance evaluation on the cured coating film of the low-temperature curing black photosensitive composition. The chemical resistance evaluation may be a solvent resistance evaluation. A coating-decompression drying-prebake-development-post-baking process is performed on the black light-shielding film pattern substrate using a low-temperature curing red photosensitive resin composition that is performed as a subsequent process. This process is called the red process. This is an experiment to check the chemical resistance of the black light-shielding film used as a substrate. The pattern process through UV curing is not performed, but development is performed with an alkali developer and the coated red film is developed and post-baked at 100°C at 30°C. After passing through the minute process, check the characteristics of the surface of the black light-shielding film. In this way, after measuring the thickness before and after the red process, the thickness retention rate can be measured using the following calculation formula.

[formula]

That the low-temperature curable black photosensitive composition satisfies the thickness retention range indicates excellent chemical resistance.

The thickness of the black light-shielding film can be measured using an optical microscope.

In the present specification, the black light-shielding layer may mean a coating layer in the present specification.

In the exemplary embodiment of the present application, the low-temperature curing black photosensitive composition has an optical density (OD) of 0.5/µm to 4/µm when a coating film having a thickness of 0.5 µm to 2 µm is formed. Specifically, the thickness of the coating layer may be 0.7 μm to 1.3 μm. More specifically, the thickness of the coating film may be 1.2 µm to 1.3 µm.

In the exemplary embodiment of the present application, the low-temperature curing black photosensitive composition may preferably have an optical density (OD) of 2/µm to 3/µm when a coating film having a thickness of 0.5 µm to 2 µm is formed.

The optical density (OD) is a method of measuring the manufactured black light-shielding substrate, and can be measured using a Densitometer 3411C device of X-rite. The measurement wavelength of the optical density may use white light of 380 nm to 780 nm.

When forming the coating film of the low-temperature curing black photosensitive composition, if the optical density (OD) of the above range is satisfied, it may exhibit excellent effects on blocking light leakage and external light reflection, but the effective value may vary depending on the lamination structure and design of the device. have

An exemplary embodiment of the present application provides a black light-shielding film formed under conditions of a curing temperature of 80°C to 100°C using the above-described black photosensitive composition for low-temperature curing.

An exemplary embodiment of the present application provides a display device including the aforementioned black light blocking film.

An example of a method of forming the black light-shielding film is as follows.

Specifically, a) applying the low-temperature curing black photosensitive composition on a substrate, and b) drying and prebaking the applied black photosensitive composition under reduced pressure, c) exposing the applied black photosensitive composition and Developing, d) post-baking the applied black photosensitive composition.

In the method of manufacturing a black light-shielding film according to an exemplary embodiment of the present invention, step a) is a step of applying a low-temperature curing black photosensitive composition, and may be applied on a substrate using a method known in the art. . More specifically, the method of applying the composition may use a spray method, a roll coating method, a spin coating method, a bar coating method, a slit coating method, etc., It is not limited to this.

At this time, the substrate may be made of metal, glass, plastic, silicone, polycarbonate, polyester, aromatic polyamide, polyamideimide, polyimide, etc., and these substrates may be treated with chemicals with a silane coupling agent according to the purpose, Appropriate pretreatment, such as plasma treatment, ion plating, sputtering, vapor phase reaction method, and vacuum deposition, can be performed. In addition, the substrate may optionally have a driving thin film transistor mounted thereon, a nitrided silicon film may be sputtered, and an organic film such as a planarization film may be coated.

In the method of manufacturing a black light-shielding film according to an exemplary embodiment of the present application, step b) is a step of drying and prebaking the applied black photosensitive composition under reduced pressure. Vacuum drying is performed under reduced pressure conditions to 30 Pa to 150 Pa by vacuum, preferably until 65 Pa is reached. Thereafter, as a pre-baking step, pre-baking is performed using a contact hot plate or an oven, and the temperature applied at this time is 80° C. to 100° C., and preferably, a temperature applied during post-baking is selected. The prebaking time may be performed in 60 seconds to 5 minutes.

Step c) is a step of exposing and developing the applied composition. Exposure is performed using a UV light source, and if the mask dimension fidelity is considered as an exposure equipment, it is recommended to use a projection type, but is not limited thereto. As a developing method, a dipping method, a puddle method, a shower method, etc. can be applied without limitation. The development time can be easily determined by a person skilled in the art, and is usually about 30 seconds to 180 seconds, for example.

Examples of the developer include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium silicate, sodium metsilicate, and ammonia as an aqueous alkali solution; Primary amines such as ethylamine and N-propylamine; Secondary amines such as diethylamine and di-n-propylamine; Tertiary amines such as trimenylamine, methyldiethylamine, and dimethylethylamine; Tertiary alcohol amines such as dimethyl ethanolamine, methyl diethanolamine, and triethanolamine; Pyrrol, piperidine, n-methylpiperidine, n-methylpyrrolidine, 1,8-diazabicyclo[5.4.0]-7-undecene, 1,5-diazabicyclo[4.3.0] Cyclic tertiary amines such as -5-nonene; Aromatic tertiary amines such as pyridine, corizine, lutidine, and quiroline; An aqueous solution of a quaternary ammonium salt such as tetramethylammonium hydroxide and tetraethylammonium hydroxide can be used.

After development, the pattern can be formed by performing rinsing using DI water and then drying it with air (with air or nitrogen). A completed pattern can be obtained through post-bake using a heating device such as a hot plate or an oven. At this time, it is preferable to heat the post bake at 80° C. to 100° C. for 3 minutes to 120 minutes.

In the present specification, the completed black light shielding film may be formed as a coating film having a thickness of 0.7 µm to 1.3 µm, a thickness retention rate for chemical resistance evaluation of 85% or more, and an optical density (OD) of 2.4/µm to 4.3/µm Can be

The method of manufacturing the display device including the organic light emitting device according to the exemplary embodiment is not particularly limited, but may be manufactured as follows, for example.

After fabricating a TFT film through a TFT process, an anode is patterned thereon, aligned thereon, and an insulating film (pixel refine layer) is patterned, and an organic material is deposited and stacked thereon. The organic material includes a light-emitting layer, and if necessary, may further include other layers for charge transport or charge blocking, such as an electron injection layer, an electron transport layer, a hole blocking layer, a hole transport layer, a hole injection layer, and/or an electron blocking layer. have.

Then, after the metal electrode layer is formed, it is encapsulated (encapsulated) with an encapsulant (sealing agent) to prepare a sealed encap layer. If necessary, silicon nitride may be deposited on the sealed encap layer or a touch center layer may be laminated. The black light-shielding layer may be patterned on the encap layer by using the low-temperature curing black photosensitive composition and, if necessary, a low-temperature color filter layer may be manufactured thereon, and the subsequent process is a manufacturing process including a conventional organic light-emitting device. According to the manufacturing method, a display device including an organic light-emitting device can be manufactured.

1 and 2 are measured using an optical microscope capable of evaluating the surface characteristics after completion of the process according to the manufacturing of the black light-shielding film of Examples and Comparative Examples and after evaluating the surface characteristics and chemical resistance. The pattern adhesion force of FIGS. 1 and 2 refers to a substrate adhesion force, and when a pattern having a fine line width of 5 μm or less is maintained, a good pattern adhesion force or a substrate adhesion force is indicated. The fine line width refers to the line width of the pattern in which the number of masks made of the mask pattern is. Referring to FIGS. 1 and 2, it can be seen that in the case of the other experiments except for Comparative Example 2, all fine pattern characteristics are excellent.

3 is a photograph showing that good characteristics were obtained as a result of performing fairness evaluation according to development time of Example 1. FIG.

4 is a simplified diagram omitting detailed electrode layers or protective layers required for driving the display device. When a polarizing plate is not applied, the black photosensitive composition for low-temperature curing according to the present specification can be patterned and cured at 100° C. or lower where an organic material is stable, and thus a black light-shielding film can be manufactured.

Hereinafter, a preferred embodiment is presented to aid the understanding of the present invention. However, the following examples are only illustrative of the present invention, and the scope of the present invention is not limited to the following examples.

Manufacturing example

The black photosensitive compositions of Examples and Comparative Examples were prepared by mixing in the mass (g) of Table 1 below.

If the contents of Table 1 are described in detail, they will be described later.

Pigment dispersion: 25% by weight of carbon black (based on the total weight of the pigment dispersion), dispersion solvent PGMEA

Alkali-soluble resin 1: 9,9-bisglycidyloxyphenyl fluorene (9,9-[Bis(glycidyloxy)phenyl]fluorene)/4-cyclohexene-1,2-dicarboxylic acid (4-cyclohexen- 1,2-dicarboxylic acid) is an alkali-soluble binder resin having a weight average molecular weight of 2,300 g/mol and an acid value of 86 KOH mg/g consisting of 40/60 molar ratio

Alkali-soluble resin 2: A weight average molecular weight of 3,500 g/mol, an acid value of 100 KOH mg/g consisting of biphenyl-tetracarboxylic acid dianhydride added with acrylic acid in a molar ratio of 70/30 Phosphorus Alkali Soluble Binder Resin

Epoxy resin: Bisphenol A type novolac epoxy resin (epoxy equivalent 200g/eq)

Polyfunctional monomers: Among M1 to M9, those described in Table 1 were applied, M1 to M6 are listed in the order of substance name, molecular weight, and acryloyl group equivalent, and M7 to M9 are multifunctional monomers of M1 and M3 in Table 1 above. It is meant to be included in the proportions described.

Photoinitiator: PI 102 (LGC)

Photoinitiator: OXE-03 (BASF)

Photoinitiator: HABI 101 (Tronly)

Silane coupling agent: KBM 503 (Shin-Etsu Corporation)

Surfactant: F 570 (DIC)

Solvent: propylene glycol monomethyl ether acetate (PGMEA), methyl-3-methoxy propionate (MMP)

After coating the black photosensitive composition for low temperature curing prepared above on a silicon nitride (SiNx) substrate (370 mm X 470 cm), a vacuum dry process was performed until reaching 65 Pa. Subsequently, prebake was performed at 85° C. for 2 minutes on a digital hot plate. After cooling the coated substrate subjected to prebake to room temperature, a crosslinking reaction was carried out through ultraviolet (UV) irradiation. At this time, the exposure machine used was a projection type (Ushio Corporation) with good mask fidelity, and the irradiated exposure amount was used in the range of 80mJ/cm2 to 140mJ/cm2, and the reference exposure amount was 100mJ/cm2.

After exposure, development was performed with 0.043% (aq) KOH developer for 60 to 80 seconds to obtain a pattern. Thereafter, post-baking was performed at 85° C. for 60 minutes to prepare a black light-shielding film.

During the coating, a spin coater was used, and the coating conditions were as follows.

Coating RPM: 430 rpm, coating time 9sec (ramping 2sec)

Target thickness: 1.3㎛

The prepared black light-shielding film was evaluated under the following conditions, and is shown in Table 2 below.

Chemical resistance (solvent resistance evaluation) was performed on the cured coating film on which all the processes were performed. A coating-decompression drying-prebake-development-post-make process was performed using a low-temperature curing red photosensitive resin composition on the black light-shielding film pattern substrate.

As an experiment to check the chemical resistance of the black light-shielding film used as a substrate, the pattern process through uv curing is not performed, but development is carried out with an alkali developer to peel off the coated red film, and then the characteristics of the surface of the black light-shielding film through post make. Was confirmed.

Chemical resistance evaluation result: The image of the black shading film subjected to the red process was confirmed through an optical microscope.

[Evaluation standard]

If the following conditions are satisfied, the decision is ok (◎) Insufficient (▲), No evaluation (*)

Specifically, no evaluation refers to a case in which accurate thickness measurement is impossible due to severe surface sharpening and defects when observed with an optical image.

1. Substrate Adhesion: Maintaining a pattern with a fine line width (based on the mask line width) of 5 µm or less

2. Surface characteristics after process: No surface defects when observing the coated film after firing with the naked eye or an optical microscope

3. Surface characteristics after evaluation of chemical resistance: No surface defects when the coated film is observed with the naked eye or an optical microscope

4. Remaining film rate: After the chemical resistance evaluation, the thickness retention rate before and after the evaluation is 85% or more

5. Developability: The appropriate development time has a value between 50 seconds and 90 seconds.

Substrate adhesion Surface properties after processing Surface properties after chemical resistance evaluation Film remaining rate Developability Example 1 ◎ ◎ ◎ ◎ ◎ Example 2 ◎ ◎ ◎ ◎ ◎ Comparative Example 1 ◎ ◎ ▲ ◎ ◎ Comparative Example 2 ▲ ◎ ▲ ＊ ▲ Comparative Example 3 ◎ ◎ ▲ ＊ ▲ Comparative Example 4 ◎ ◎ ▲ ＊ ◎ Comparative Example 5 ◎ ◎ ▲ ▲ ◎ Comparative Example 6 ◎ ◎ ▲ ▲ ◎ Comparative Example 7 ◎ ◎ ◎ ▲ ◎

According to Table 2, it was confirmed that all of the substrate adhesion of Examples 1 and 2, the surface properties after the process, the surface properties after the chemical resistance evaluation, the residual film rate, and the developability were excellently obtained. In the case of Comparative Examples 1 to 6, the surface characteristics after the above process were good, but as a result of checking the surface characteristics after the chemical resistance evaluation, a surface defect occurred, and Comparative Example 7 also had good chemical resistance characteristics, but the residual film rate characteristics need to be improved to 80% or less I did.

Claims (10)

Binder resin; Polyfunctional monomers; coloring agent; As a low-temperature curing black photosensitive composition comprising a photoinitiator and a solvent,
The binder resin includes an alkali-soluble resin and an epoxy resin,
The polyfunctional monomer has a molecular weight of 250 g/mol to 500 g/mol, and an acryloyl group equivalent of 80 g/eq to 110 g/eq of an acrylate monomer comprising an acrylate monomer for low temperature curing. The low-temperature curing black photosensitive composition of claim 1, wherein the colorant comprises at least one selected from carbon black, an organic black pigment, a mixture of color organic pigments, a metal oxide inorganic pigment, and a metal nitride inorganic pigment. The low-temperature curing black photosensitive composition according to claim 1, further comprising at least one selected from the group consisting of a surfactant and a silane coupling agent. The method of claim 1, wherein the polyfunctional monomer is an acrylate monomer having a molecular weight of 250 g/mol to 500 g/mol and an acryloyl group equivalent of 80 g/eq to 110 g/eq, and used in a low-temperature curing black photosensitive composition. The low-temperature curing black photosensitive composition comprising more than 70% by weight and 100% by weight or less based on the total polyfunctional monomer. The black photosensitive composition for low temperature curing according to claim 3, wherein the surfactant is a fluorine-based surfactant. The method according to claim 1, wherein the low-temperature curing black photosensitive composition is a low-temperature curing black photosensitive composition having a thickness retention rate of 85% or more for evaluation of chemical resistance when a coating film having a thickness of 0.5 µm to 2 µm is formed. The low-temperature curing black photosensitive composition according to claim 1, wherein the low-temperature curing black photosensitive composition has an optical density (OD) of 0.5/µm to 4/µm when forming a coating film having a thickness of 0.5 µm to 2 µm. The method according to claim 1, based on the total weight of the solid content of the low-temperature curing black photosensitive composition,
The alkali-soluble resin is 10 to 40% by weight,
The epoxy resin is 5 to 20% by weight,
The polyfunctional monomer is 10 to 30% by weight,
10 to 50% by weight of the colorant,
The photoinitiator is a low-temperature curing black photosensitive composition containing 0.5 to 10% by weight. A black light-shielding film formed at a curing temperature of 80°C to 100°C using the low-temperature curing black photosensitive composition according to any one of claims 1 to 8. A display device comprising the black light shielding film according to claim 9.

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