KR20210055823A - Etching apparatus and method of manufacturing display device - Google Patents

Abstract

An etching apparatus is provided. The etching device includes a vacuum chamber in which an etching process for a target substrate is performed, and including a light-transmitting window on the upper surface; a substrate transfer unit disposed inside the vacuum chamber and seating the target substrate on the lower part; and at least one laser module disposed outside the vacuum chamber and including a laser irradiation unit for performing the etching process by emitting a laser beam into the vacuum chamber through the light-transmitting window. It is possible to increase the efficiency of the etching process.

Description

Manufacturing method of an etching apparatus and a display apparatus TECHNICAL FIELD

The present invention relates to an etching device and a method of manufacturing a display device.

With the rapid development of information and communication technology and the expansion of the market, flat panel displays are in the spotlight as display devices.

Such flat panel displays include a liquid crystal display, a plasma display panel, and an organic light emitting diode display. Among them, the OLED display has a fast response speed, lower power consumption than a conventional liquid crystal display (LCD), light weight, and the point that it can be made ultra-thin because it does not require a separate back light device. It has very good advantages such as high luminance, so it is receiving attention as a next-generation display device.

These OLED displays are made into products through a pattern formation process, an organic thin film deposition process, an etching process, an encapsulation process, and a bonding process in which the substrate on which the organic thin film is deposited and the substrate that has undergone the sealing process are attached. Can be produced. On the other hand, among various processes, the etching process is a process of obtaining a desired shape by etching unnecessary portions on the surface of the substrate.

By placing the laser irradiation unit above the vacuum chamber, there is provided an etching apparatus in which the efficiency of the etching process is increased because it is not affected by particles separated from the target substrate and falling below the vacuum chamber.

The present invention provides a method of manufacturing a display device using an etching apparatus in which the efficiency of an etching process is increased because the laser irradiation unit is positioned above the vacuum chamber and is not affected by particles separated from the target substrate and falling below the vacuum chamber.

The problems of the present invention are not limited to the problems mentioned above, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

An etching apparatus according to an embodiment for solving the above problem is a vacuum chamber in which an etching process is performed on a target substrate, a vacuum chamber including a transparent window on an upper surface, and disposed inside the vacuum chamber, and A substrate transfer unit on which the target substrate is mounted, and a laser irradiation unit disposed outside the vacuum chamber and performing the etching process by irradiating a laser beam into the vacuum chamber through the transparent window And at least one laser module.

The laser module further includes a first optical system, a second optical system, and a scanner, and the first optical system and the second optical system change the path of the laser beam emitted from the laser irradiation unit, and transmit the laser beam to the scanner. And, the scanner may emit the laser beam toward the target substrate.

The first optical system may include a first mirror unit that reflects the laser beam, and the second optical system may include a second mirror unit that reflects the laser beam.

The substrate transfer unit includes a stage unit and a chucking unit, and the target substrate may be mounted on a lower surface of the chucking unit.

The chucking unit may include at least one beam transmitting hole penetrating the chucking unit.

The stage unit may include a stage upper plate and a stage lower plate, and the stage upper plate may include a frame-shaped upper plate rim and an upper plate window surrounded by the upper plate rim and transmitting the laser beam.

The stage lower plate includes a lower plate rim disposed on both sides in a first direction, a lower plate stepped part disposed on both sides in a second direction crossing the first direction, and a lower plate connecting part connecting the lower plate rim and the lower plate stepped part, There may be a step difference between the lower plate rim portion and the lower plate step portion.

The lower plate stepped portion may be located above the lower plate rim portion.

It is disposed outside the vacuum chamber and may further include an optical system platen surrounding the vacuum chamber.

The optical system platen may include a lower support disposed below the vacuum chamber, an upper bridge disposed above the vacuum chamber, and a platen connecting portion connecting the lower supporter and the upper bridge.

The laser module may be disposed on the upper bridge.

It is disposed inside the vacuum chamber, and may further include an inspection optical unit for inspecting the target substrate.

The inspection optical unit may be located under the target substrate.

A method of manufacturing a display device according to an exemplary embodiment for solving the above problem includes the steps of introducing a target substrate including a plurality of pixels and a light emitting device disposed for each pixel into a vacuum chamber including a light-transmitting window on an upper surface thereof, Transferring the target substrate to the lower portion of the substrate transfer unit and irradiating a laser beam emitted from a laser irradiation unit disposed outside the substrate transfer unit to the target substrate through the light transmitting window. And performing an etching process on the target substrate.

The substrate transfer unit includes a stage unit and a chucking unit, and the chucking unit includes at least one beam transmission hole penetrating through the chucking unit, and the target substrate may be mounted on a lower surface of the chucking unit.

The stage unit may include a stage upper plate and a stage lower plate, and the stage upper plate may include a frame-shaped upper plate rim and an upper plate window that is surrounded by the upper plate rim and transmits a laser beam.

The stage lower plate includes a lower plate rim disposed on both sides in a first direction, a lower plate stepped part disposed on both sides in a second direction crossing the first direction, and a lower plate connecting part connecting the lower plate rim and the lower plate stepped part, There may be a step difference between the lower plate rim portion and the lower plate step portion.

The lower plate stepped portion may be located above the lower plate rim portion.

After the step of etching the target substrate, the step of inspecting the target substrate may be further included, wherein the inspection optical unit for inspecting the target substrate may pass between the lower edge portions while passing a lower portion of the lower plate stepped portion.

Etching the target substrate may include forming a hole penetrating a portion of the target substrate.

Details of other embodiments are included in the detailed description and drawings.

By placing the laser irradiation unit in the upper part of the vacuum chamber, it is possible to provide an etching apparatus with increased efficiency of the etching process since it is not affected by particles separated from the target substrate and falling below the vacuum chamber.

By placing the laser irradiation unit above the vacuum chamber, it is possible to provide a method of manufacturing a display device using an etching apparatus in which the efficiency of the etching process is increased because it is not affected by particles separated from the target substrate and falling below the vacuum chamber.

Effects according to the embodiments are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a perspective view of an etching apparatus according to an embodiment.
FIG. 2 is a cross-sectional view taken along line II-II' of FIG. 1.
3 is a perspective view of an optical system base according to an embodiment.
4 is an enlarged view showing an enlarged area A of FIG. 2.
5 is an enlarged view showing an enlarged area B of FIG. 2.
6 is an enlarged view of an enlarged area C of FIG. 5.
7 is a perspective view of a combined substrate moving unit, a target substrate, and an optical unit for inspection according to an exemplary embodiment.
8 is a side view of FIG. 7.
9 is an exploded perspective view illustrating a coupling relationship between a stage unit, a chucking unit, and a target substrate according to an exemplary embodiment.
10 is a perspective view of a chucking unit according to an embodiment.
11 is a plan view as viewed from above of an etching apparatus according to an exemplary embodiment.
12 is a cross-sectional view taken along line XII-XII' of FIG. 11.
13 is a flowchart illustrating a method of manufacturing a display device using an etching device according to an exemplary embodiment.
14 to 16 are cross-sectional views illustrating a method of manufacturing a display device using an etching device according to an exemplary embodiment.
17 is a perspective view of a display device manufactured using an etching apparatus according to an exemplary embodiment.
FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII' of FIG. 17.
19 is a perspective view of an etching apparatus according to another embodiment.
FIG. 20 is a cross-sectional view taken along line XX-XX' in FIG. 19;
21 is a cross-sectional view of an etching apparatus according to another embodiment.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms different from each other, and only these embodiments make the disclosure of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to the possessor, and the invention is only defined by the scope of the claims.

When elements or layers are referred to as “on” of another element or layer includes all cases of interposing another layer or another element directly on or in the middle of another element. The same reference numerals refer to the same elements throughout the specification.

Although the first, second, and the like are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are only used to distinguish one component from another component. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical idea of the present invention.

Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

1 is a perspective view of an etching apparatus according to an embodiment. FIG. 2 is a cross-sectional view taken along line II-II' of FIG. 1.

1 and 2, the etching apparatus 10 according to an embodiment is disposed outside the vacuum chamber 100 and the vacuum chamber 100 in which an etching process for a target substrate is performed therein, and the vacuum chamber ( Including a laser optical system 200 that performs an etching process by irradiating a laser beam (L) to a target substrate within 100), and an optical system base 300 on which the laser optical system 200 is disposed. can do.

A stage unit 120, a chucking unit 130, a particle collecting unit 140, and an inspection optical unit 150 may be disposed inside the vacuum chamber 100. Although not shown, the target substrate 20 may be transferred into the vacuum chamber 100 from the outside of the vacuum chamber 100 by a robot arm or the like. The target substrate 20 transferred into the vacuum chamber 100 may be attached to the chucking unit 130 and the stage unit 120.

The chucking unit 130 is disposed on the target substrate 20, and the stage unit 120 is disposed on the chucking unit 130. That is, the chucking unit 130 may be positioned between the target substrate 20 and the stage unit 120.

In the drawing, the first direction DR1 indicates the direction in which the side surface of the vacuum chamber 100 in which the platen connection part 330 of the optical system platen 300 covers a part is extended, and the second direction DR2 is the optical system platen 300 ) Indicates the direction in which the side surface of the vacuum chamber 100 that is not covered by the platen connection part 330 is extended. In addition, the third direction DR3 represents the thickness direction of the vacuum chamber 100. The first direction DR1 and the second direction DR2 cross each other perpendicularly, and the third direction DR3 is a direction crossing a plane on which the first and second directions DR1 and DR2 are placed. Both the first direction DR1 and the second direction DR2 intersect perpendicularly.

Unless otherwise defined, "upper", "upper surface", and "upper side" expressed with respect to the third direction DR3 in this specification mean the chucking unit 130 side with respect to the target substrate 20, “Lower”, “lower”, and “lower” refer to the opposite side of the chucking unit 130 with respect to the target substrate 20.

As shown in FIGS. 1 and 2, the vacuum chamber 100 is a box-type structure, and an etching process for the target substrate 20 may be performed therein. That is, the vacuum chamber 100 may provide a space in which an etching process for the target substrate 20 is performed. A gate valve 110 through which a substrate enters and exits may be disposed on one wall of the vacuum chamber 100.

A first chamber window 101a and a second chamber window 101b are provided on the upper surface of the vacuum chamber 100. The first chamber window 101a and the second chamber window 101b are transparent windows through which a laser beam L of a specific wavelength can pass, and from the laser irradiation unit 190 disposed outside the vacuum chamber 100. The laser beam L of may be incident into the vacuum chamber 100 through the first chamber window 101a and the second chamber window 101b of the vacuum chamber 100.

In this embodiment, a plurality of chamber windows may be provided on the upper surface of the vacuum chamber 100. In addition, a chamber window protection unit (not shown) having a protection window (not shown) shielding the first chamber window 101a and the second chamber window 101b may be further disposed on the upper surface of the vacuum chamber 100. have.

In addition, although not shown, an inspection chamber window (not shown) may be further disposed on the bottom surface of the vacuum chamber 100. The inspection chamber window (not shown), like the first chamber window 101a and the second chamber window 101b, is a window through which a laser beam L of a specific wavelength can pass, and the inside of the vacuum chamber 100 is The passed laser beam L may be transmitted to a laser output measuring unit (not shown) disposed outside the vacuum chamber 100 through an inspection chamber window (not shown).

A substrate transfer unit (STU) may be disposed inside the vacuum chamber 100. The substrate transfer unit STU transfers a substrate in the vacuum chamber 100. The substrate transfer unit (STU) 120 is a chucking unit 130 for attaching a target substrate 20 loaded into the vacuum chamber 100, and a stage unit disposed on the upper surface of the chucking unit 130 120 and a stage moving unit (not shown).

The stage unit 120 moves or rotates while the chucking unit 130 and the target substrate 20 are combined under the stage unit 120 to adjust the position and direction of the target substrate 20 on which the etching process is to be performed. I can. Accordingly, the laser beam L emitted from the laser irradiation unit may reach a desired area of the target substrate 20.

A chucking unit 130 on which a substrate loaded into the vacuum chamber 100 is mounted may be disposed on a lower surface of the stage unit 120. The chucking unit 130 may be disposed under the stage unit 120 to contact the upper surface of the target substrate 20 and may couple the target substrate 20 to the stage unit 120. In the present embodiment, an electrostatic chuck (ESC) may be used for the chucking unit 130, but is not limited thereto, and various chucking devices capable of attaching a substrate may be used as the chucking unit 130.

A detailed description of the stage unit 120 and the chucking unit 130 will be described later.

In addition, although not shown, a stage moving unit (not shown) connected to the stage unit 120 and supporting the stage unit 120 may be further disposed inside the vacuum chamber 100. The stage moving unit (not shown) includes a guide rail for a stage (not shown) connected to the stage unit 120 and guiding the movement of the stage unit 120, and a driving unit for moving the stage unit 120 by electromagnetic force ( (Not shown) may be included. The driving unit (not shown) interacts with the first magnetic body (not shown) for the stage provided in the stage unit 120 to generate a propulsion force by the electromagnetic force to the stage unit 120. It includes a second magnetic material (not shown) for the stage disposed along the longitudinal direction. The first magnetic body for the stage is provided as a permanent magnet, and the second magnetic body for the stage is provided as an electromagnet.

A particle collecting unit 140 may be disposed under the target substrate 20. The particle collecting unit 140 may collect particles P separated from the target substrate 20 during an etching process by the laser irradiation unit. That is, by collecting the particles P separated from the target substrate 20, the particles P are prevented from accumulating in the chamber, and the vacuum chamber 100 so that the etching process proceeds smoothly inside the vacuum chamber 100. ) To maintain its internal state.

An inspection optical unit 150 may be disposed inside the vacuum chamber 100. The inspection optical unit 150 is disposed under the vacuum chamber 100 to inspect the substrate.

An optical system platen 300 may be disposed outside the vacuum chamber 100. 3 is further referred to in order to describe the optical system base 300 in detail.

3 is a perspective view of an optical system base according to an embodiment. In FIG. 3, the optical system platen 300 of the etching apparatus 10 is shown.

The optical system platen 300 is located under the vacuum chamber 100 and is a lower support 310 supporting the vacuum chamber 100, an upper bridge 320 located above the vacuum chamber 100 and on which a laser module is disposed, and a vacuum It is located on the side of the chamber 100 and may include a platen connecting portion 330 connecting the lower support 310 and the upper bridge 320. That is, the lower support 310, the upper bridge 320, and the base connection part 330 of the optical system base 300 may surround the vacuum chamber 100. In addition, the lower support 310, the upper bridge 320, and the platen connection part 330 may be separately formed and combined, but are not limited thereto and may be integrally formed. The optical system platen 300 may be made of granite, but is not limited thereto.

The lower support 310 of the optical system base 300 is positioned under the vacuum chamber 100 and serves to support the vacuum chamber 100, and includes a separate configuration such as a laser output inspection unit (not shown). can do. The planar shape of the lower support 310 may be substantially similar to the planar shape of the vacuum chamber 100, but is not limited thereto.

The base connection part 330 of the optical system base 300 may protrude from the lower support 310 and extend upward. The platen connection part 330 extending upward may cover a side surface of the vacuum chamber 100. The lower side of the platen connection part 330 is coupled with some of the side surfaces of the lower supporter 310, and the width of the first direction DR1 of the platen connection part 330 is the second of the lower supporter 310 connected to the platen connection 330. Both side surfaces of the direction DR2 may be smaller than the length extending in the first direction DR1. In addition, the lower portion of the platen connection portion 330 may be coupled to the central portions of both sides, but is not limited thereto. The upper side of the platen connection part 330 may be coupled to the lower surface of the upper bridge 320 of the optical system platen 300, and the platen connection part 330 may serve to support the upper bridge 320.

The upper bridge 320 of the optical system platen 300 is connected to the upper side of the platen connection part 330 and may be disposed on the upper side of the vacuum chamber 100. The upper bridge 320 may be disposed to be spaced apart from the vacuum chamber 100 by a predetermined distance, but is not limited thereto. The upper bridge 320 may cover a part of the upper side of the vacuum chamber 100, and the width of the upper bridge 320 extending in the first direction DR1 is the upper surface of the vacuum chamber 100 in the first direction DR1 May be smaller than the extended width. The upper bridge 320 may be located near the center of the upper surface of the vacuum chamber 100, but is not limited thereto.

A plurality of grooves formed in a predetermined pattern may be included on a lower surface of the lower support 310 of the optical system platen 300 and outside the second direction DR2 of the platen connection part 330. Although not limited thereto, for example, a plurality of triangular first groove patterns HP1 may be included on a lower surface of the lower support 310, and a triangular shape and a square shape may be formed on the outer surface of the base connection part 330. It may include a second groove pattern HP2 made of.

By including the first groove pattern HP1 and the second groove pattern HP2 in the lower support 310 and the platen connection part 330, the overall weight of the optical system platen 300 is reduced, thereby moving the etching apparatus 10 and Assembly may be facilitated, and material cost may be reduced by reducing materials required for formation of the optical system platen 300. In addition, even if the lower support 310 and the base connection part 330 include the first groove pattern HP1 and the second groove pattern HP2, a portion maintaining a certain thickness between each of the plurality of grooves remains, so that the optical system It is possible to maintain the rigidity of the surface plate 300 against vibration. Accordingly, the laser module disposed on the upper bridge 320 of the optical system base 300 does not shake even when vibration is transmitted from the outside, and can transmit the laser beam L to a desired region of the target substrate 20.

The laser optical system 200 may be disposed on the upper bridge 320 of the optical system base 300. 4 and 5 are referred to in order to describe the paths of the laser optical system 200 and the laser beam L in detail.

4 is an enlarged view showing an enlarged area A of FIG. 2. 5 is an enlarged view showing an enlarged area B of FIG. 2.

1 to 5, the laser optical system 200 may include a first laser module 200a and a second laser module 200b. The laser optical system 200 is located above the vacuum chamber 100 and may be spaced apart from the vacuum chamber 100 by a predetermined distance. In addition, the laser optical system 200 is located above the target substrate 20, the chucking unit 130 and the stage unit 120 located in the vacuum chamber 100, and the laser optical system 200 and the target substrate 20 Between the stage unit 120 and the chucking unit 130 may be positioned.

The first laser module 200a is disposed on one side of the first direction DR1 of the upper bridge 320, and the second laser module 200b is disposed on the other side of the first direction DR1 of the upper bridge 320. I can. Each of the first laser module 200a and the second laser module 200b may be a plurality of two or more. The plurality of first laser modules 200a may each maintain a predetermined distance and may be spaced apart in the second direction DR2, and the plurality of second laser modules 200b each maintain a predetermined distance, and the second direction DR2 ) Can be spaced apart. In the etching apparatus 10 according to an embodiment, four first and second laser modules 200a and 200b are disposed on one side and the other side of the first direction DR1 of the upper bridge 320, respectively. Although shown, it is not limited thereto.

The first laser module 200a includes a first laser irradiation unit 210a that emits a laser beam L, a first optical system 220a and a second optical system 230a that change the path of the emitted laser beam L. , It may include a first scanner (240a) for transmitting the laser beam (L) received from the laser irradiation unit to a desired position of the target substrate 20. The second laser module 200b includes a second laser irradiation unit 210b that emits a laser beam L, a third optical system 220b and a fourth optical system 230b that change the path of the laser beam L, and a laser. It may include a second scanner (240b) for transmitting the laser beam (L) received from the irradiation unit to a desired position on the target substrate 20.

As the etching apparatus 10 includes a first laser module 200a and a second laser module 200b capable of emitting a laser beam L, the laser beam L is applied to a larger area of the target substrate 20. ) Can be etched or lifted off. In addition, even if some of the first laser module 200a and the second laser module 200b do not operate normally, if the rest of the first laser module 200a and the second laser module 200b operate normally, as the target substrate 20 moves, a desired portion of the target substrate 20 The laser beam L can be irradiated. That is, it may be less affected by the failure of the first laser module 200a or the second laser module 200b. As a result, as each of the first laser module 200a and the second laser module 200b is provided on one side and the other side of the upper bridge 320 of the optical system base 300 in the first direction DR1, the efficiency of the process is increased. can do.

As described above, the first laser module 200a and the second laser module 200b have substantially the same configuration, and the configurations may perform substantially the same role. That is, hereinafter, the description will be made on the basis of the first laser module 200a without a separate reference, but the description may be applied to the second laser module 200b as well.

The first laser irradiation unit 210a may emit a laser beam L capable of etching the target substrate 20. The first laser irradiation unit 210a emits the laser beam L toward the first optical system 220a. The first laser irradiation unit 210a may be disposed on the upper surface of the upper bridge 320.

The first optical system 220a may change the path of the laser beam L emitted from the first laser irradiation unit 210a to face the second optical system 230a. That is, the first optical system 220a may change the path of the laser beam L traveling in the first direction DR1 and guide the laser beam L to face downward in the third direction DR3. The first optical system 220a may be disposed to be spaced a predetermined distance from the first laser irradiation unit 210a in the first direction DR1.

The second optical system 230a may change the path of the laser beam L transmitted from the first optical system 220a to face the first scanner 240a. That is, the second optical system 230a may change the path of the laser beam L traveling downward in the third direction DR3 and guide the laser beam L toward the other side in the first direction DR1. . The second optical system 230a is disposed under the first optical system 220a and may be spaced apart by a predetermined distance.

In order to change the path of the laser beam L as described above, a first mirror unit (not shown) reflecting the laser beam L may be provided in the first optical system 220a, and the second optical system 230a Also, a second mirror unit (not shown) that reflects the laser beam L may be provided. In this embodiment, the first mirror unit (not shown) and the second mirror unit (not shown) may include one or a plurality of reflective mirrors for lasers.

At least one of the first optical system 220a and the second optical system 230a according to the present embodiment is an angle adjusting unit that adjusts the arrangement angle of the first mirror unit (not shown) or the second mirror unit (not shown) (Not shown) may be included. The angle adjustment unit (not shown) is rotatably provided inside the first optical system 220a and/or the second optical system 230a, and the first mirror unit (not shown) and/or the second mirror unit (not shown) And a rotation shaft (not shown) to which the is coupled, and an operation unit (not shown) connected to the rotation shaft (not shown) and rotating the rotation shaft (not shown). The user may adjust the arrangement angle of the first mirror unit and/or the second mirror unit (not shown) by rotating the rotation shaft (not shown) through the operation unit (not shown).

The angle adjustment unit (not shown) adjusts the angle of arrangement of the second mirror unit (not shown) to adjust the reflection angle of the laser beam L reflected by the first scanner 240a. As described above, the first optical system 220a and/or the second optical system 230a according to the present embodiment can be controlled by adjusting the arrangement angle of the first mirror unit (not shown) and/or the second mirror unit (not shown). By providing an angle adjusting unit (not shown) that can be used, even if the emission angle of the laser beam L emitted from the first laser irradiation unit 210a is changed, the first optical system 220a and/or the second optical system 230a It is possible to easily transmit the laser beam L to the first scanner 240a by adjusting the reflection angle of the laser beam L reflected from.

The first scanner 240a may receive the laser beam L emitted from the first laser irradiation unit 210a through the first optical system 220a and the second optical system 230a, and the received laser beam L ), you can change the path. The first scanner emits the received laser beam L toward the bottom, and the laser beam L enters the vacuum chamber 100 through the first chamber window 101a of the vacuum chamber 100. . Subsequently, the laser beam L incident into the vacuum chamber 100 may pass through the stage unit 120 and the chucking unit 130 to reach the target substrate 20. That is, the first scanner 240a serves to adjust the laser beam L to reach a desired position of the target substrate 20.

The first scanner 240a may be spaced apart from the second optical system 230a by a predetermined distance, and may be located on the other side of the second optical system 230a in the first direction DR1. In addition, the first scanner 240a may be disposed under the upper bridge 320 of the optical system base 300. That is, the first scanner 240a may be disposed between the upper bridge 320 of the optical system base 300 and the vacuum chamber 100. The first scanner 240a may overlap the first chamber window 101a of the vacuum chamber 100 in a third direction DR3.

The laser beam L reaching the target substrate 20 may etch the target substrate 20. As the target substrate 20 is etched, the particles P may be separated from the target substrate 20, and the particles P may fall toward the lower portion of the vacuum chamber 100 by gravity.

In the following, reference is made to FIG. 6 to describe the target substrate 20 in detail.

6 is an enlarged view of an enlarged area C of FIG. 5. 6 shows a stacked structure of the target substrate 20.

Referring to FIG. 6, the target substrate 20 may include a lower member 21, a display panel 22, a touch member 23, a polarizing member 24, and a cover window 25, and the lower member ( 21), the display panel 22, the touch member 23, the polarizing member 24, and the cover window 25 may be sequentially stacked. At least one bonding member such as an adhesive layer or an adhesive layer is disposed between each of the stacking members to couple adjacent stacking members. However, the present invention is not limited thereto, and other layers may be further disposed between each layer, and some of the stacking members may be omitted.

The display panel 22 is a panel that displays a screen or an image, and examples thereof include an organic light-emitting display panel (OLED), an inorganic light-emitting display panel (inorganic EL), a quantum dot light-emitting display panel (QED), and a micro LED display panel (micro -LED), nano-LED display panel (nano-LED), plasma display panel (PDP), field emission display panel (FED), cathode ray display panel (CRT), as well as self-luminous display panels, as well as liquid crystal display panels (LCD) And a light-receiving display panel such as an electrophoretic display panel (EPD). Hereinafter, an organic light emitting display panel will be described as an example of the display panel, and the organic light emitting display panel applied to the embodiment will be simply referred to as the display panel 22 unless special classification is required. However, the embodiment is not limited to the organic light emitting display panel, and other display panels listed above or known in the art may be applied within a range that shares the technical idea.

The display panel 22 includes a substrate SUB1, a buffer layer SUB2, a semiconductor layer ACT, a first insulating layer 221, a first gate conductive layer 230, a second insulating layer 222, and a second gate. A bank layer including an opening exposing the conductive layer 230, the third insulating layer 223, the data conductive layer 250, the fourth insulating layer 224, the anode electrode 260, and the anode electrode 260 ( 226), the light emitting layer 270 disposed in the opening of the bank layer 226, the cathode electrode 280 disposed on the light emitting layer 270 and the bank layer 226, a thin film encapsulation disposed on the cathode electrode 280 A layer 290 may be included. Each of the above-described layers may be formed of a single layer, but may be formed of a laminated layer including a plurality of layers. Another layer may be further disposed between each layer.

The substrate SUB1 may support respective layers disposed thereon. The substrate SUB1 may be made of an insulating material such as a polymer resin or an inorganic material such as glass or quartz.

A buffer layer SUB2 is disposed on the substrate SUB1. The buffer layer SUB2 may include silicon nitride, silicon oxide, or silicon oxynitride.

The semiconductor layer ACT is disposed on the buffer layer SUB2. The semiconductor layer ACT forms a channel of a thin film transistor of a pixel.

A first insulating layer 221 is disposed on the semiconductor layer ACT. The first insulating layer 221 may be a first gate insulating layer having a gate insulating function.

A first gate conductive layer 230 is disposed on the first insulating layer 221. The first gate conductive layer 230 may include a gate electrode GAT of the thin film transistor of the pixel PX, a scan line connected thereto, and a storage capacitor first electrode CE1.

A second insulating layer 222 may be disposed on the first gate conductive layer 230. The second insulating layer 222 may be an interlayer insulating layer or a second gate insulating layer.

A second gate conductive layer 240 is disposed on the second insulating layer 222. The second gate conductive layer 240 may include a storage capacitor second electrode CE2.

A third insulating layer 223 is disposed on the second gate conductive layer 240. The third insulating layer 223 may be an interlayer insulating layer.

A data conductive layer 250 is disposed on the third insulating layer 223. The data conductive layer 250 may include a first electrode SD1 and a second electrode SD2 of the thin film transistor of the pixel PX. The first electrode SD1 and the second electrode SD2 of the thin film transistor are a first contact hole CNT1 penetrating the third insulating layer 223, the second insulating layer 222, and the first insulating layer 221. Through this, the source region and the drain region of the semiconductor layer 210 may be electrically connected.

A fourth insulating layer 224 is disposed on the data conductive layer 250. The fourth insulating layer 224 covers the data conductive layer 250. The fourth insulating layer 224 may be a via layer.

An anode electrode 260 is disposed on the fourth insulating layer 224. The anode electrode 260 may be a pixel electrode provided for each pixel PX. The anode electrode 260 may be connected to the second electrode SD2 of the thin film transistor through the second contact hole CNT2 penetrating the fourth insulating layer 224.

The anode electrode 260 is not limited thereto, but indium-tin-oxide (ITO), indium-zinc-oxide (IZO), zinc oxide (ZnO), Material layer with high work function of indium oxide (In2O3) and silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pd), gold (Au), nickel (Ni) , Neodium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or a mixture thereof may have a laminated layer structure. A layer having a high work function may be disposed above the reflective material layer and may be disposed closer to the light emitting layer 270. The anode electrode 260 may have a multilayer structure of ITO/Mg, ITO/MgF, ITO/Ag, and ITO/Ag/ITO, but is not limited thereto.

A bank layer 226 may be disposed on the anode electrode 260. The bank layer 226 is disposed on the anode electrode 270 and may include an opening exposing the anode electrode 270. The emission area EMA and the non-emission area NEM may be divided by the bank layer 226 and the opening thereof.

A spacer 227 may be disposed on the bank layer 226. The spacer 227 may serve to maintain a gap with a structure disposed thereon.

The emission layer 270 is disposed on the anode electrode 270 exposed by the bank layer 226. The emission layer 270 may include an organic material layer. The organic material layer of the emission layer includes an organic emission layer, and may further include a hole injection/transport layer and/or an electron injection/transport layer.

A cathode electrode 280 may be disposed on the emission layer 270. The cathode electrode 280 may be a common electrode that is entirely disposed without distinction of the pixels PX. The anode electrode 270, the emission layer 270, and the cathode electrode 280 may each constitute an organic light emitting device.

The cathode electrode 280 is Li, Ca, LiF/Ca, LiF/Al, Al, Mg, Ag, Pt, Pd, Ni, Au Nd, Ir, Cr, BaF, Ba, or a compound or mixture thereof (for example, , A mixture of Ag and Mg, etc.). The cathode electrode 280 may further include a transparent metal oxide layer disposed on the material layer having a small work function.

A thin film encapsulation layer 290 including a first inorganic layer 291, a first organic layer 292 and a second inorganic layer 293 is disposed on the cathode electrode 280. At the end of the thin film encapsulation layer 290, the first inorganic layer 291 and the second inorganic layer 293 may contact each other. The first organic layer 292 may be sealed by the first inorganic layer 291 and the second inorganic layer 293.

The first inorganic layer 291 and the second inorganic layer 293 may each include silicon nitride, silicon oxide, or silicon oxynitride. The first organic layer 292 may include an organic insulating material.

The touch member 23 may be disposed on the display panel 22. The touch member 23 may sense a touch input. The touch member 23 may be provided as a panel or film separate from the display panel 22 and attached to the display panel 22 as shown, but may be provided in the form of a touch layer inside the display panel 22. May be.

A polarizing member 24 may be disposed on the touch member 23. The polarizing member 24 polarizes the passing light. The polarizing member 24 may serve to reduce reflection of external light.

A cover window 25 may be disposed on the touch member 23. The cover window 25 covers and protects the display panel 22. The cover window 25 may be made of a transparent material. The cover window 25 may be made of, for example, glass or plastic.

The lower member 21 may be disposed under the display panel 22. The lower member 21 may perform a light blocking role. That is, the lower member 21 may block light from entering the display panel 22 from the outside. In addition, the lower member 21 may perform a shock absorbing function other than a light blocking function.

Although not limited thereto, the display panel 22 may emit light toward the top. That is, in the path of light emitted from the display panel 22, the chucking unit 130, the stage unit 120, and the laser optical system 200 that emits a laser may be positioned.

The laser beam L for etching the target substrate 20 proceeds toward the target substrate 20 from the top of the target substrate 20, and at least some of the stacked members of the target substrate 20 are etched or lifted off. (Lift-off) can be made. In this process, particles P (Particles) may be peeled off from the laminated member that has been etched or lifted off. Particles P peeled off and separated from the target substrate 20 fall toward the bottom of the target substrate 20. That is, by arranging the first laser module 200a that emits the laser beam L above the target substrate 20, particles P separated from the target substrate 20 on the path where the laser beam L travels. ) May not be stacked. Accordingly, even if the etching process is continuously performed, the laser beam L for etching the target substrate 20 may not be affected by the particles P separated from the target substrate 20. In other words, it is possible to prevent the refraction of the laser beam L caused by the particles P, change over time, and change in energy density, thereby preventing deterioration of the processing quality of the actual processed area, and the efficiency of the etching process. It can be prevented from being deteriorated.

As described above, the laser beam L may penetrate the stage unit 120 and the chucking unit 130 to reach the target substrate 20. In addition, an inspection optical unit 150 may be disposed to determine whether an etching process has been performed at a desired position on the target substrate 20. Hereinafter, FIGS. 7 to 9 are referred to to describe the relationship between the stage unit 120, the chucking unit 130, and the inspection optical unit 150.

7 is a perspective view of a combined substrate moving unit, a target substrate, and an inspection optical unit according to an exemplary embodiment. 8 is a side view of FIG. 7. 9 is an exploded perspective view illustrating a coupling relationship between a stage unit, a chucking unit, and a target substrate according to an exemplary embodiment.

7 to 9, the target substrate 20, the chucking unit 130, and the stage unit 120 may be sequentially disposed, and an inspection optical unit 150 is provided under the target substrate 20. Can be placed.

The stage top plate 121 of the stage unit 120 may be formed in a rectangular shape in plan view, and may include a top plate rim portion 121a and a top plate window 121b surrounded by the top plate rim portion 121a. The upper plate rim portion 121a may be formed in a frame shape with an open center, and the upper plate window 121b may be positioned near the open center. The upper window 121b may correspond to the shape of the stage upper plate 121, but is not limited thereto.

The laser beam L transmitted from the upper portion of the target substrate 20 may pass through the upper window 121b of the stage upper plate 121 and proceed to the lower portion of the stage upper plate 121.

The lower stage plate 122 may be disposed under the upper stage plate 121 of the stage unit 120. The stage lower plate 122 may include a lower plate rim, a lower plate stepped portion 122b, and a lower plate connecting portion 122c. The lower stage of the stage 122 may have a rectangular frame shape with an open center in a plan view. In addition, the stage lower plate 122 may have a step difference between the lower plate edge portion 122a and the lower plate step portion 122b. That is, the lower plate rim and the lower plate stepped portion 122b have different heights, and the lower plate rim and the lower plate stepped portion 122b may be connected by the lower plate connecting portion 122c.

In detail, the lower plate rim portion 122a is positioned on both sides of the stage lower plate 122 in the second direction DR2 and extends in the first direction DR1, and may have a constant width in the second direction DR2. The lower plate rim portion 122a may be spaced apart from the upper plate rim portion 121a at a predetermined interval under the upper plate rim portion 121a. The width of the lower edge portion 122a in the second direction DR2 may be greater than the width of the upper edge portion 121a in the second direction DR2, but is not limited thereto.

The lower stepped portions 122b are located on both sides of the first direction DR1 of the stage lower plate 122, extend in the second direction DR2, and may have a constant width in the first direction DR1. The lower plate stepped portion 122b and the lower plate rim portion 122a may have different heights, and the lower plate stepped portion 122b may be positioned above the lower plate rim portion 122a. The stepped portion 122b of the lower plate may be located outside both sides of the first direction DR1 of the upper stage plate 121 and may have the same height as the upper stage plate 121, but is not limited thereto.

The lower plate connecting part 122c may connect the lower plate rim part 122a and the lower plate stepped part 122b between the lower plate rim part 122a and the lower plate stepped part 122b. The lower plate connection part 122c may protrude from one end of the lower plate rim part 122a in the first direction DR1 and the other end toward the upper part of the lower plate rim part 122a. The lower plate connection part 122c may have a certain width in the first direction DR1, and the width of the lower plate connection part 122c in the first direction DR1 is the same as the width in the first direction DR1 of the lower plate rim part 122a. can do.

As described above, the lower plate stepped portion 122b and the lower plate edge portion 122a may have a height difference equal to the thickness of the lower plate edge portion 122a and the lower plate connecting portion 122c in the third direction DR3. The inspection optical unit 150 may pass between the lower plate connection portion 122c and the lower plate edge portion 122a on both sides of the second direction DR2 while passing the lower portion of the lower plate step portion 122b. Accordingly, the distance between the inspection optical unit 150 and the target substrate 20 may be reduced. As the distance between the inspection optical unit 150 and the target substrate 20 decreases, the target substrate 20 can be inspected using a high-resolution lens having a small working distance, and the target substrate 20 The inspection precision of can be improved.

In detail, a space formed by the difference in height between the lower plate stepped portion 122b and the lower plate rim portion 122a, that is, a space below the lower plate stepped portion 122b and between the two lower plate connecting portions 122c. 150 can pass. At this time, since the inspection optical unit 150 can cross between the two lower plate rims 122a of the stage lower plate 122, the target substrate located on the lower surface of the stage upper plate 121 and the chucking unit 130 It is possible to reduce the distance between the 20 and the optical unit for inspection 150. That is, the inspection optical unit 150 using a high-resolution lens is a space formed by the difference in height between the lower plate step part 122b and the lower plate rim part 122a, even though the working distance is small. Since the optical unit 150 can pass, it is possible to obtain a working distance required for a high-resolution lens. Accordingly, the optical unit 150 for inspection using a high-resolution lens can be used, and the target substrate 20 can be inspected more precisely.

The chucking unit 130 may be disposed on the lower surface of the stage unit 120, and the target substrate 20 may be attached to the lower surface of the chucking unit 130. To describe the chucking unit 130 in detail, FIGS. 10 to 12 are referred.

10 is a perspective view of a chucking unit according to an embodiment. 11 is a plan view as viewed from above of an etching apparatus according to an exemplary embodiment, and FIG. 12 is a cross-sectional view taken along line XII-XII' of FIG. 11. 11 and 12, for convenience of description, the chucking unit 130, the upper bridge 320 of the optical system base 300, the first scanner 240a and the second laser module 200b of the first laser module 200a. ) Of the second scanner 240b.

7 to 12, the chucking unit 130 may be disposed on the lower surface of the stage upper plate 121 of the stage unit 120, and between both lower plate rims 122a of the stage lower plate 122 and It may be disposed between the stepped portions 122b of both lower plates.

The chucking unit 130 may include a plurality of beam transmission holes BHL. The beam transmission hole BHL is surrounded by the chucking unit 130 and may pass through the chucking unit 130 in the thickness direction. In one embodiment, 8 beam-transmitting holes BHL are arranged to be spaced apart from each other in the first direction DR1, and four are arranged to be spaced apart from each other in the second direction DR2, so a total of 32 beam-transmitting holes. Although (BHL) is shown to be disposed in the chucking unit 130, it is not limited thereto, and the number and position of the beam transmission holes BHL may vary. However, the number of beam transmission holes BHL arranged in the second direction DR2 may be the same as the number of the first laser modules 200a and/or the second laser modules 200b arranged in the second direction DR2. I can.

During the etching process, the chucking unit 130 may move in the first direction DR1, and as the chucking unit 130 moves, the beam transmission hole BHL of the chucking unit 130 and the first The scanner 240a and the second scanner 240b may overlap in the third direction DR3, and the positions of the first scanner 240a and the second scanner 240b are holes for beam transmission of the chucking unit 130 It may correspond to the location of (BHL).

In addition, all of the beam transmission holes BHL disposed in the chucking unit 130 may overlap the upper window 121b of the stage upper plate 121 disposed on the upper surface of the chucking unit 130. Accordingly, the laser beam L transmitted through the upper window 121b of the stage upper plate 121 passes through the beam transmission hole BHL of the chucking unit 130 and is disposed on the lower surface of the chucking unit 130. The target substrate 20 can be reached.

Accordingly, the target substrate 20 is seated under the stage unit 120 and the chucking unit 130, and the laser beam L is applied to the stage unit 120, the chucking unit 130, and the target substrate 20. Despite being transmitted from the top, the laser beam L transmitted from the top of the stage unit 120 and the chucking unit 130 penetrates the stage unit 120 and the chucking unit 130 to reach the target substrate 20 can do.

Hereinafter, a method of manufacturing a display device using the etching device 10 will be described with reference to FIGS. 13 to 15.

13 is a flowchart illustrating a method of manufacturing a display device using an etching device according to an exemplary embodiment. 14 to 16 are cross-sectional views illustrating a method of manufacturing a display device using an etching device according to an exemplary embodiment.

13 to 16, first, a target substrate 20 to be etched is prepared (S01), and the target substrate 20 is inserted into the vacuum chamber 100 (S02).

When transferring the target substrate 20 from the outside of the vacuum chamber 100 to the inside of the vacuum chamber 100, a robot arm may be used, but is not limited thereto.

Subsequently, the target substrate 20 inserted into the vacuum chamber 100 is transferred to the lower portion of the substrate transfer unit (STU) including the stage unit 120 and the chucking unit 130, and the lower surface of the chucking unit 130 It is settled in (S03).

In the vacuum chamber 100, the target substrate 20 is mounted on the lower surface of the chucking unit 130 of the substrate transfer unit STU and transferred to the lower portion of the laser optical system 200. The target substrate and the substrate transfer unit (STU) transferred to the lower portion of the laser optical system 200 are rotated through the stage unit 120, so that the first scanner 240a and the second scanner 240b of the laser optical system 200 Aligned so that the laser beam (L) is irradiated to a desired portion of the target substrate (20).

Subsequently, the laser beam L is irradiated to the target substrate 20 aligned with the first scanner 240a and the second scanner 240b, so that the target substrate 20 is etched or lifted off (S04).

The laser beam L may be emitted from the laser irradiation unit disposed on the optical system base 300, and the path of the laser beam L is changed by the first optical system 220a and the second optical system 230a. 1 can be directed to the scanner 240a. The path of the laser beam L directed to the first scanner 240a may be changed again within the first scanner 240a and the traveling direction may be changed to face the target substrate 20, that is, to face the lower direction.

The target substrate 20 may move in the first direction DR1, and accordingly, even if the laser optical system 200 is fixed, the target substrate 20 moves and the laser beam L is applied to a desired area of the target substrate 20. ) Can be reached.

The laser beam L directed to the target substrate 20 may pass through the stage unit 120 and the chucking unit 130 to reach the target substrate 20. The laser beam L may be adjusted to have a specific wavelength, and the laminated member etched on the target substrate 20 may vary according to the corresponding wavelength. At least some of the stacked members of the target substrate 20 may be etched or lifted off by a specific wavelength. Only one of the stacked members may be lifted off by the etching process, and is not limited thereto, and not only some of the stacking members lifted off by a specific wavelength among the stacking members of the target substrate 20, but also the lower portion of the stacked members. Other stacked members placed may also be etched together.

Subsequently, the target substrate 20 etched or lifted off by the laser beam L may move back to one side of the first direction DR1. As the target substrate 20 moves, it may pass through the upper portion of the inspection optical unit 150 disposed on the bottom surface of the vacuum chamber 100. When the target substrate 20 passes the upper portion of the inspection optical unit 150, the inspection optical unit 150 may inspect a region etched or lifted off on the target substrate 20 (S05).

Hereinafter, a display device that can be manufactured using the etching apparatus 10 according to an exemplary embodiment will be described with reference to FIGS. 17 and 18.

17 is a perspective view of a display device manufactured using an etching apparatus according to an exemplary embodiment. FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII' of FIG. 17.

17 and 18, the display device 30 displays a screen or an image through the active area AAR, and various devices including the active area AAR may be included therein. Examples of the display device 30 are, but are not limited to, a smartphone, a mobile phone, a tablet PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a television, a game machine, a wrist watch type electronic device, and a head mount. Various home appliances including active area (AAR) such as displays, personal computer monitors, notebook computers, car navigation, car dashboards, digital cameras, camcorders, external billboards, billboards, various medical devices, various inspection devices, refrigerators, washing machines, etc. , Internet of Things devices, and the like.

It includes an active area AAR and an inactive area NAR. The active area AAR of the display device 30 may include a display area. In addition, when the display device 30 has a touch function, a touch area, which is an area in which a touch input is sensed, may also be included in the active area AAR.

The non-active area NAR may surround the active area AAR. The inactive area NAR may include a non-display area in which no display is made. The non-active area NAR may surround all sides of the active area AAR, but is not limited thereto, and the non-active area NAR may not be disposed near at least some of the four sides of the active area AAR. . The bezel area of the display device 30 may be configured as an inactive area NAR.

The display device 30 may include at least one hole HLE. The hole HLE is disposed to overlap the optical element and the display device 30 in the thickness direction, and serves to transmit light to the light receiving portion of the optical element. The hole HLE may be disposed inside the active area AAR, but is not limited thereto.

The hole HLE may be a physically penetrated through hole. The hole HLE may physically penetrate the lower member 21, the display panel 22, the touch member 23, and the polarization member 24. As the hole HLE physically penetrates the stacked members, the members are removed from the region where the hole HLE is formed, and light transmittance may be improved in the region.

The display device 30 may further include an optical element OPS including a light receiving unit. Examples of the optical element OPS including the light receiving unit include a camera, a lens (such as a condensing lens or a light path guide lens), an infrared sensor, an iris recognition sensor, and an optical sensor such as an illuminance sensor. Part or all of the light receiving part of the optical element OPS may be located in the hole HLE. Light outside the display device 30 may pass through the cover window 25 and enter the light receiving unit through a hole HLE under the cover window 25. When the cover window 25 exhibits a high transmittance, external light may reach the light receiving unit of the optical element OPS through the above-described optical path without significant loss.

Hereinafter, other embodiments of the etching apparatus 10 will be described. In the following embodiments, descriptions of the same configurations as those of the previously described embodiments will be omitted or simplified, and differences will be mainly described.

19 is a perspective view of an etching apparatus according to another embodiment. FIG. 20 is a cross-sectional view taken along line XX-XX' of FIG. 19;

19 and 20, the etching apparatus 10_1 according to the present embodiment includes not only the first laser module 200a and the second laser module 200b, but also the third laser module 200c and the fourth laser module ( It is different from the embodiment of FIG. 1 in that it further includes 200d).

Specifically, the laser optical system 200 according to the present embodiment may include first to fourth laser modules 200a, 200b, 200c, and 200d. In addition, the optical system surface plate 300 may include a first upper bridge 320 and a second upper bridge 320, and the first upper bridge 320 and the second upper bridge 320 are connected to the surface plate 330. It is supported by and is physically connected to the lower support 310 by the platen connection part 330.

The first laser module 200a and the second laser module 200b are disposed on the first upper bridge 320, and the third laser module 200c and the fourth laser module 200d are the second upper bridge 320 Can be placed on The first laser module 200a is disposed on one side of the first upper bridge 320 in the first direction DR1, and the second laser module 200b is the other side in the first direction DR1 of the first upper bridge 320 Can be placed on The third laser module 200c is disposed on one side of the second upper bridge 320 in the first direction DR1, and the fourth laser module 200d is the other side in the first direction DR1 of the second upper bridge 320 Can be placed on

Each of the first to fourth laser modules 200a, 200b, 200c, and 200d may be a plurality of two or more, and may be disposed to be spaced apart from each other in the second direction DR2.

Even in this case, the first to fourth laser modules 200a, 200b, 200c, and 200d emitting a laser beam L capable of etching or lifting-off the target substrate 20 are placed on the target substrate 20. The laser beam L is disposed and emitted from the first to fourth laser modules 200a, 200b, 200c, and 200d is emitted toward the top of the target substrate 20. Therefore, since the particles P peeled off from the target substrate 20 fall toward the bottom of the target substrate 20, the laser beam L is not affected by the particles P, and the efficiency of the etching process is reduced. Can be prevented. In addition, as the third laser module 200c and the fourth laser module are additionally disposed, more areas of the target substrate 20 can be simultaneously etched or lifted off, thereby increasing the efficiency of the etching process.

21 is a cross-sectional view of an etching apparatus according to another embodiment.

Referring to FIG. 21, the etching apparatus 10_2 according to the present embodiment includes not only the first laser module 200a and the second laser module 200b disposed on the target substrate 20, but also the target substrate 20. It is different from the embodiment of FIG. 2 in that it may further include a lower laser module 250 disposed below.

Specifically, the etching apparatus 10 according to the present exemplary embodiment may further include a lower laser module 250 disposed outside the vacuum chamber 100 while being disposed under the target substrate 20. The lower laser module 250 may be disposed on the lower support 310 of the optical system base 300. In addition, the vacuum chamber 100 of the etching apparatus 10 may further include a lower chamber window 101c on the bottom surface of the vacuum chamber 100. The lower chamber window 101c is positioned above the lower laser module 250 to allow the laser beam L emitted from the lower laser module 250 to enter the inside of the vacuum chamber 100. That is, the laser beam L emitted from the lower laser module 250 may enter the inside of the vacuum chamber 100 through the lower chamber window 101c.

The lower laser module 250 disposed under the target substrate 20 is disposed in the first laser module 200a and the second laser module 200b disposed on the target substrate 20 and in a third direction DR3. May not overlap. Accordingly, it is possible to prevent the lower laser module 250, the first laser module 200a, and the second laser module 200b from interfering with each other.

Even in this case, the first and second laser modules 200a and 200b emitting a laser beam L capable of etching or lift-off the target substrate 20 are disposed on the target substrate 20 and the first The laser beam L emitted from the first and second laser modules 200a and 200b is emitted toward the top of the target substrate 20. Therefore, since the particles P peeled off from the target substrate 20 fall toward the bottom of the target substrate 20, the laser beam L is not affected by the particles P, and the efficiency of the etching process is reduced. Can be prevented. In addition, since the lower laser module 250 is disposed under the target substrate 20, the lower side of the target substrate 20 can be etched or lifted off more precisely, so that the reliability of the etching process can be improved.

Although embodiments of the present invention have been described with reference to the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. You will be able to understand. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects.

10: etching device
20: target substrate
30: display device
100: vacuum chamber
200: laser optical system
300: optical system platen

Claims (20)

A vacuum chamber in which an etching process is performed on a target substrate, the vacuum chamber including a light-transmitting window on an upper surface thereof;
A substrate transfer unit disposed inside the vacuum chamber and on which the target substrate is seated under the vacuum chamber; And
An etching apparatus including at least one laser module disposed outside the vacuum chamber and including a laser irradiation unit for performing the etching process by irradiating a laser beam into the vacuum chamber through the transparent window . The method of claim 1,
The laser module,
A first optical system;
A second optical system; And
Further includes a scanner,
The first optical system and the second optical system change the path of the laser beam emitted from the laser irradiation unit, and transmit the laser beam to the scanner,
The scanner emits the laser beam toward the target substrate. The method of claim 2,
The first optical system includes a first mirror unit that reflects the laser beam, and the second optical system includes a second mirror unit that reflects the laser beam. The method of claim 1,
The substrate transfer unit includes a stage unit and a chucking unit, and the target substrate is mounted on a lower surface of the chucking unit. The method of claim 4,
The chucking unit includes at least one beam transmission hole passing through the chucking unit. The method of claim 4,
The stage unit includes a stage upper plate and a stage lower plate,
The stage upper plate has a frame-shaped upper plate rim and
An etching apparatus including an upper plate window surrounded by the upper plate rim and transmitting the laser beam. The method of claim 6,
The lower plate of the stage,
Lower plate rims disposed on both sides in the first direction;
Lower plate steps disposed on both sides of the second direction crossing the first direction; And
And a lower plate connecting portion connecting the lower plate rim portion and the lower plate stepped portion,
An etching apparatus having a step difference between the lower plate edge portion and the lower plate step portion. The method of claim 7,
The lower plate stepped portion is an etching apparatus located above the lower plate rim portion. The method of claim 1,
An etching apparatus disposed outside the vacuum chamber and further comprising an optical system platen surrounding the vacuum chamber. The method of claim 9,
The optical system platen is a lower support disposed under the vacuum chamber,
An upper bridge disposed above the vacuum chamber, and
Etching apparatus comprising a plate connecting portion connecting the lower support and the upper bridge. The method of claim 10,
The laser module is an etching apparatus disposed on the upper bridge. The method of claim 1,
An etching apparatus further comprising an inspection optical unit disposed inside the vacuum chamber and inspecting the target substrate. The method of claim 12,
The inspection optical unit is an etching apparatus located under the target substrate. Introducing a target substrate including a plurality of pixels and a light emitting device disposed for each pixel into a vacuum chamber including a light-transmitting window on an upper surface;
Transferring the target substrate and seating it under the substrate transfer unit; And
A display device comprising the step of performing an etching process on the target substrate by irradiating a laser beam emitted from a laser irradiation unit disposed outside the substrate transfer unit to the target substrate through the transparent window. Manufacturing method. The method of claim 14,
The substrate transfer unit includes a stage unit and a chucking unit, the chucking unit includes at least one beam transmission hole penetrating through the chucking unit, and the target substrate is mounted on a lower surface of the chucking unit. Manufacturing method. The method of claim 15,
The stage unit includes a stage upper plate and a stage lower plate,
The stage upper plate is a method of manufacturing a display device including a frame-shaped upper plate edge portion and an upper plate window surrounded by the upper plate edge portion and transmitting a laser beam. The method of claim 16,
The lower plate of the stage,
Lower plate rims disposed on both sides in the first direction;
Lower plate steps disposed on both sides of the second direction crossing the first direction; And
And a lower plate connecting portion connecting the lower plate rim portion and the lower plate stepped portion,
A method of manufacturing a display device having a step difference between the lower plate edge portion and the lower plate step portion. The method of claim 17,
A method of manufacturing a display device in which the stepped portion of the lower plate is positioned above an edge portion of the lower plate. The method of claim 18,
Further comprising the step of inspecting the target substrate after the step of etching the target substrate,
A method of manufacturing a display device, wherein an inspection optical unit for inspecting a target substrate passes between the lower edge portions while passing a lower portion of the lower plate stepped portion. The method of claim 14,
The etching of the target substrate includes forming a hole penetrating a portion of the target substrate.

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