KR20210054260A - Flooring chips and flooring comprising the same and Manufacturing method of the same - Google Patents

Abstract

The present invention relates to a flooring chip, a flooring material comprising the same, and a method for manufacturing the same and, more specifically, to an environmentally-friendly flooring chip that uses a styrene-butadiene copolymer as a non-PVC material which is an environmentally-friendly material and adds a thermal aging inhibitor to increase the thermal decomposition start temperature of the non-PVC material, and have excellent dynamic heat resistance and easy workability, to a flooring material comprising the same and to a method for manufacturing the same.

Description

Flooring chips and flooring comprising the same, and a method for manufacturing the same {Flooring chips and flooring comprising the same and manufacturing method of the same}

The present invention relates to a chip for flooring, a flooring material including the same, and a method of manufacturing the same, and more specifically, a styrene-butadiene copolymer is used as an eco-friendly non-PVC material, and a thermal aging inhibitor is added to the Non-PVC. The present invention relates to an eco-friendly chip for flooring that has an increased thermal decomposition initiation temperature of a material and excellent dynamic heat resistance for easy workability, a flooring material including the same, and a method for manufacturing the same.

In general, flooring is mainly used for finishing indoor floors of residential or commercial buildings. It provides a hygienic space by blocking dust and coldness from the cement floor, and various colors of beautiful patterns are printed to suit customer preference. As a result, it has decorative effects such as changing the indoor atmosphere cozyly.

As an example of the flooring material, a flooring material made of polyvinyl chloride (polyvinyl chloride, hereinafter referred to as'PVC') is used as a residential flooring material, which is relatively inexpensive, easy to install, and has excellent decorative effects. PVC flooring is disclosed in Korean Patent Publication No. 10-0805633 (announcement date: 2008.02.20).

However, the PVC flooring is usually manufactured by mixing PVC with additives such as a phthalate plasticizer and a stabilizer, and since chlorine is present in the PVC, toxic gases such as dioxins can be generated during incineration, and the plasticizer and There is a problem in that the amount of volatile organic compounds (VOC) emitted from additives such as stabilizers is high, and the plasticizer may also be eluted, thereby deteriorating eco-friendliness.

Therefore, there have been many attempts to develop a non-PVC flooring material in order to solve the problems of the PVC flooring material as described above.

As an example of the non-PVC flooring material, Korean Patent Laid-Open Publication No. 10-2006-0055090 (published on May 23, 2006) includes a surface treatment layer, a transparent layer, a printed material layer, a sol-impregnated size reinforcing layer, and a non-foaming layer. , It is disclosed to use a polystyrene-butadiene-based copolymer resin as a non-PVC material for the transparent layer, the printed material layer, and the non-foaming layer.

However, the flooring material of the patent document is heated by thermally decomposing the resin in the non-foaming layer when the transparent layer, the printed layer and the non-foaming layer are thermally laminated through a heating drum due to the low thermal properties of the polystyrene-butadiene-based copolymer resin. There was a problem that it was not separated from the drum.

In addition, Korean Patent Laid-Open Publication No. 10-2019-0075000 (published on June 28, 2019), which relates to a single-layer sheet flooring material manufactured by manufacturing a chip for flooring, provides a sheet containing a styrene-butadiene copolymer. It discloses manufacturing into a single-layer sheet flooring material by manufacturing into chips and rolling.

However, when the lower layer formed of the chip of the patent document is pressed with the upper layer, there is a problem in that the chip is thermally decomposed due to the low thermal characteristics of the chip including the styrene-butadiene copolymer.

Thus, in order to solve the above problems, the inventors of the present invention impart excellent thermal properties to a chip for flooring comprising a styrene-butadiene copolymer, which is a non-PVC material, to include a base layer formed of the chip for flooring. When manufacturing the flooring material, it was confirmed that it was neatly separated from the heating drum without thermal decomposition of the underlayer composition, and the present invention was completed based on this.

KR 10-0805633 B (announcement date: 2008.02.20) KR 10-2006-0055090 A (Published: 2006.05.23) KR 10-2019-0075000 A (Published: 2019.06.28)

The present invention was conceived to solve the above-described problems, using a styrene-butadiene copolymer as an eco-friendly non-PVC material, and adding a thermal aging inhibitor to increase the thermal decomposition initiation temperature of the non-PVC material, and dynamic It is an object of the present invention to provide an eco-friendly chip for flooring with excellent heat resistance and easy workability, a flooring material including the same, and a method for manufacturing the same.

To achieve the above object,

The present invention provides a chip for flooring comprising a styrene-butadiene copolymer (SBC), a styrene-(meth)acrylate copolymer (B) (Styrene methyl methacrylate, SMMA), and a thermal aging inhibitor. to provide.

Specifically, the present invention uses a styrene-butadiene copolymer as a non-PVC material and adds a thermal aging inhibitor to increase the thermal decomposition initiation temperature of the styrene-butadiene copolymer and has excellent dynamic heat resistance for easy workability. It is intended to provide a chip, a flooring material including the same, and a method of manufacturing the same.

The chip for flooring of the present invention, the flooring material including the same, and the method of manufacturing the same include a non-PVC material, so that the amount of total volatile organic compounds (TVOC) is small, so that the environment-friendly effect is excellent.

The flooring chip of the present invention, the flooring material including the same, and the method of manufacturing the same include a thermal aging inhibitor in the flooring chip to provide excellent dynamic heat resistance, and the thermal decomposition initiation temperature is increased to provide a base layer formed of the flooring chip. When the lower layer is passed through a heating drum that is a preheating step in order to thermally laminate the lower layer and the upper layer including the lower layer, the lower layer is neatly separated from the heating drum, thereby facilitating workability.

1 is a side cross-sectional view of a flooring according to an embodiment of the present invention.
2 is a block diagram schematically showing a method of manufacturing a flooring material according to an embodiment of the present invention.

Hereinafter, the configuration and operation of a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Here, in adding reference numerals to elements of each drawing, it should be noted that, even though they are indicated on different drawings, only the same elements are denoted by the same numerals as much as possible.

The terms used in the present invention are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present invention, terms such as "comprise" or "have" are intended to designate the presence of features, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features or steps. It is to be understood that it does not preclude the possibility of addition or presence of, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms, including technical or scientific terms, used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs.

Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should be interpreted as an ideal or excessively formal meaning unless explicitly defined in the present invention. It doesn't work.

The present invention is a styrene-butadiene copolymer (Styrene-butadiene copolymer, SBC), styrene- (meth) acrylate copolymer (B) (Styrene methyl methacrylate, SMMA) and a chip for flooring comprising a thermal aging inhibitor About.

The flooring chip is to form the underlying layer of the flooring material described below, specifically, the flooring material of the present invention including the underlying layer formed of the flooring chip of the present invention is, from the bottom to the top, a nonwoven fabric layer, a base layer It may include an upper layer including a lower layer and a dimensionally stable layer, a white sheet, a printing layer, and a transparent layer including a.

Hereinafter, a chip for flooring will be described in more detail.

The flooring chip is melt-pressed on the top of the nonwoven fabric layer of the flooring material to be described later to further complement the impact resistance, walking feeling, and strength of the flooring material, and may be made of a base layer composition.

Specifically, the chip for flooring is prepared in the form of a chip comprising a styrene-butadiene copolymer (A1, A2), a styrene-(meth)acrylate copolymer (B), a thermal aging inhibitor, a filler, and an oil. It may have been.

The underlayer composition is a styrene-butadiene copolymer (A1) (Styrene-butadiene copolymer, SBC), a styrene-butadiene copolymer (A2), styrene-(meth)acrylate copolymer (B) (Styrene methyl methacrylate, SMMA) With respect to 100 parts by weight of the mixed resin is mixed, it may include 20 to 100 parts by weight of a thermal aging inhibitor, 50 to 200 parts by weight of a filler, and 1 to 20 parts by weight of an oil.

The styrene-butadiene copolymer (A1) may be polymerized using at least a styrene-based monomer and a butadiene-based monomer.

The styrene-based monomer is, for example, styrene, a-methylstyrene, o-ethylstyrene, p-ethylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 4-propylstyrene, 4-cyclohexylstyrene, It may be one or more selected from the group consisting of 4-dodecylstyrene, 2-ethyl-4-benzylstyrene, and 4-(phenylbutyl)styrene, and as a specific example, the styrene-based monomer may be styrene.

The butadiene-based monomer may be, for example, one or more selected from the group consisting of 1,3-butadiene, isoprene, and 2,3-dimethyl-1,3-butadiene, and as a specific example, the butadiene-based monomer is 1,3 -May be butadiene.

In the styrene-butadiene copolymer (A1), the bonding form of the styrene-based monomer and the butadiene-based monomer is not particularly limited, and the bonding form is, for example, 1 selected from the group consisting of linear, branched and radial. It can be more than a species.

In the styrene-butadiene copolymer (A1), the copolymerization form may be one or more selected from the group consisting of alternating, random, and block. It may be a block copolymer having a softening effect. More specifically, the styrene-butadiene copolymer (A1) contains 30-90% by weight of styrene, preferably 50-80% by weight, more preferably 60-80% by weight, and 1,3-butadiene 10 It may be a block copolymer containing -70% by weight, preferably 20-50% by weight, more preferably 20-40% by weight, and when the styrene and 1,3-butadiene are within the above content range, the softening effect is It has an excellent effect.

Optionally, the styrene-butadiene copolymer (A1) may be polymerized using a comonomer other than a styrene-based monomer and a butadiene-based monomer.

The other comonomer may be, for example, one or more selected from the group consisting of ethylene, propylene, vinyl chloride, vinyl fluoride, polyvinyl alcohol, or vinyl acetate.

The styrene-butadiene copolymer (A1) may have a melt volume rate (MVR) of 1-10g/10min (200°C, 5kg), preferably 2-8g/10min (200°C, 5kg), and , While having excellent processability within the above range, there is an effect of excellent compatibility with other components. The melt volume rate can be measured according to ISO 1133.

In addition, the styrene-butadiene copolymer (A1) may have a tensile strength of 1-10Mpa, preferably 3-8Mpa, and has excellent durability of a chip for flooring within the above range. The tensile strength can be measured under 20-25°C, preferably 23°C according to ISO 527.

In addition, the styrene-butadiene copolymer (A1) may have a flexural strength of 1-15Mpa, preferably 2-10Mpa, and has excellent durability of a chip for flooring within the above range. The flexural strength can be measured under 20-25°C, preferably 23°C according to ISO 178.

In addition, the styrene-butadiene copolymer (A1) may have a Shore A hardness of 60-90, preferably 65-85, and there is an effect of excellent pressing property of the flooring material within the above range. The Shore A hardness can be measured using a Shore A hardness tester.

In addition, the styrene-butadiene copolymer (A1) may have a weight average molecular weight of 100,000-300,000 g/mol, preferably 150,000-250,000 g/mol, and has excellent processability and heat resistance within the above range. The weight average molecular weight may be measured by a method known in the art.

The styrene-butadiene copolymer (A2) is to improve adhesion between the nonwoven fabric layer 11 of the flooring material and the underlying layer 13 formed of the flooring chip, which will be described later, and contain at least a styrene-based monomer and a butadiene-based monomer. It may be polymerized by using.

Since the styrene-based monomer and the butadiene-based monomer are the same as described above, duplicate descriptions will be omitted.

In the styrene-butadiene copolymer (A2), the bonding form of the styrene-based monomer and the butadiene-based monomer is not particularly limited, and the bonding form is, for example, 1 selected from the group consisting of linear, branched, and radial. It can be more than a species.

In the styrene-butadiene copolymer (A2), the copolymerization form may be one or more selected from the group consisting of alternating, random, and block. It may be a block copolymer having a softening effect. More specifically, the styrene-butadiene copolymer (A2) contains 40-90% by weight of styrene, preferably 50-85% by weight, more preferably 65-85% by weight, and 1,3-butadiene 10 It may be a block copolymer containing -60% by weight, preferably 15-50% by weight, more preferably 15-35% by weight, and when the styrene and 1,3-butadiene are within the above content range, the styrene- Compared to the butadiene copolymer (A1), the content of styrene, which is a crystalline resin, is somewhat higher, so when the base layer 13 is formed in the future, it is well melted and has the effect of improving the adhesion between the base layer 13 and the nonwoven fabric layer 11 have.

The styrene-butadiene copolymer (A2) may have a melt flow rate (MFR) of 5-20g/10min (200°C, 5kg), preferably 8-15g/10min (200°C, 5kg), and , While having excellent processability within the above range, there is an effect of excellent compatibility with other components. The melt flow rate can be measured according to ASTM D 1238.

In addition, the styrene-butadiene copolymer (A2) may have a weight average molecular weight of 100,000-300,000 g/mol, preferably 150,000-250,000 g/mol, and a styrene-butadiene copolymer ( It has a higher hardness than A1), so it has an excellent effect of durability of the chip for flooring. The weight average molecular weight may be measured by a method known in the art.

In addition, the styrene-butadiene copolymer (A2) may have a Vicat softening point of 40-90°C, preferably 50-80°C, and within the above range, the chip for flooring is well melted, so that the nonwoven fabric layer of the flooring material described later ( There is an effect of improving the adhesion between 11) and the underlying layer 13 formed of the chip for flooring. The Vicat softening point can be measured according to ASTM D 1525 (B/1, 120°C/h, 10N).

In addition, the styrene-butadiene copolymer (A2) may be used in an amount of 150-400 parts by weight, preferably 200-350 parts by weight, based on 100 parts by weight of the styrene-butadiene copolymer (A1). When the layer composition is not melted well, the adhesive strength between the nonwoven fabric layer 11 and the base layer 13 may be lowered when the lower layer 10 of the flooring material to be described later is manufactured, and if it exceeds 400 parts by weight, an excessive amount of the base layer composition It is impregnated into the nonwoven fabric, so that the elongation of the nonwoven fabric layer 11 may be lowered, so that it can be used within the above content range.

Meanwhile, the styrene-butadiene copolymer (A2) has a higher content of styrene than the styrene-butadiene copolymer (A1), and the styrene-butadiene copolymer (A2) has a melt volume compared to the styrene-butadiene copolymer (A1). Since the speed is high and melts better at a high temperature to increase the bonding strength with the nonwoven fabric, the above two types may be used by mixing a styrene-butadiene copolymer.

The styrene-(meth)acrylate copolymer (B) has excellent dynamic heat resistance and activity so that it is advantageous to desorb from the heating drum at 150-170°C, and is polymerized using a styrene-based monomer and a (meth)acrylate compound. It may have been.

Since the styrene-based monomer is the same as described above, duplicate descriptions will be omitted.

The (meth)acrylate compound is methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, 2-methyl-2-nitropropyl (meth) Acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, n-pentyl (meth)acrylate, t-pentyl (Meth)acrylate, 3-pentyl (meth)acrylate, 2,2-dimethylbutyl (meth)acrylate, n-hexyl (meth)acrylate, cetyl (meth)acrylate, n-octyl (meth)acrylic Rate, 2-ethylhexyl (meth) acrylate, 4-methyl-2-propylpentyl (meth) acrylate and n-octadecyl (meth) acrylate may be one or more selected from the group consisting of acrylate, in the present invention In a specific embodiment, it may be methyl (meth) acrylate.

In the styrene-(meth)acrylate copolymer (B), the bonding form of the styrene-based monomer and the (meth)acrylate compound is not particularly limited, and the bonding form is, for example, a linear, branched and It may be one or more selected from the group consisting of radial.

In the styrene-(meth)acrylate copolymer (B), the copolymerization form of the styrene-based monomer and the (meth)acrylate compound is not particularly limited, for example, alternating, random, and block It may be one or more selected from the group consisting of (block), and in the present invention may be a random copolymer as a specific embodiment. More specifically, the styrene-(meth)acrylate copolymer (B) is 60-90% by weight of styrene, preferably 70-85% by weight, and 10-40% by weight of methyl (meth)acrylate, preferably It may be a random copolymer containing 15-30% by weight, and when the styrene and methyl (meth)acrylate are within the above content range, there is an effect of excellent processability.

The styrene-(meth)acrylate copolymer (B) has a melt volume rate (MVR) of 15-40 cm ³ /10 min (220° C., 10 kg), preferably 20-35 cm ³ /10 min (220° C. , 10kg), and while having excellent processability within the above range, there is an effect of excellent compatibility with other components. The melt volume rate can be measured according to ISO 1133.

In addition, the styrene-(meth)acrylate copolymer (B) may have a tensile strength of 45-70Mpa, preferably 50-68Mpa, and has excellent durability of a chip for flooring within the above range. The tensile strength can be measured under 20-25°C, preferably 23°C according to ISO 527.

In addition, the styrene-(meth)acrylate copolymer (B) may have a flexural strength of 85-120Mpa, preferably 90-110Mpa, and has excellent durability of a chip for flooring within the above range. The flexural strength can be measured under 20-25°C, preferably 23°C according to ISO 178.

In addition, the styrene-(meth)acrylate copolymer (B) may have a ball indentation of 150-190Mpa, preferably 155-185Mpa, and there is an effect of excellent restoration of the flooring material within the above range. . The ball indentation hardness can be measured according to ISO 2039-1.

In addition, the styrene-(meth)acrylate copolymer (B) may have a weight average molecular weight of 100,000-250,000 g/mol, preferably 120,000-220,000 g/mol, and has excellent processability and heat resistance within the above range. There is. The weight average molecular weight may be measured by a method known in the art.

The styrene-(meth)acrylate copolymer (B) may be used in an amount of 50-300 parts by weight, preferably 80-250 parts by weight, and less than 50 parts by weight based on 100 parts by weight of the styrene-butadiene copolymer (A1). In this case, the viscosity of the underlayer composition is lowered, making it difficult to processability, and mechanical properties such as dimensional stability and curling property of the flooring material may be deteriorated.If it exceeds 300 parts by weight, it is difficult to secure flexibility and thus processability decreases, and strength As it becomes larger, the cushioning feeling and pressing property of the flooring material may be deteriorated, so that it can be used within the above content range.

The thermal aging inhibitor is for preventing the aging phenomenon of the mixed resin in which the styrene-butadiene copolymer (A1, A2) and the styrene-(methyl)acrylate copolymer (B) are mixed at a high temperature. And an acrylic copolymer, which is a random copolymer of alkyl acrylate. In this case, the dynamic heat resistance and activity are excellent, and the molecular weight is large, so that the heat aging prevention effect is excellent.

The alkyl methacrylate is methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, i-propyl methacrylate, n-butyl methacrylate, t-butyl methacrylate, pentyl methacrylate, hexyl One selected from the group consisting of methacrylate, 2-ethylhexyl methacrylate, heptyl methacrylate, octyl methacrylate, cyclopentyl methacrylate, 3-vinylcyclohexyl methacrylate, and cyclohexyl methacrylate It may be more than one, preferably methyl methacrylate.

In addition, the alkyl acrylate is methyl acrylate, ethyl acrylate, n-propyl acrylate, i-propyl acrylate, n-butyl acrylate, t-butyl acrylate, pentyl acrylate, hexyl acrylate, 2-ethyl It may be one or more selected from the group consisting of hexyl acrylate, heptyl acrylate, octyl acrylate, cyclopentyl acrylate, 3-vinylcyclohexyl acrylate and cyclohexyl acrylate, preferably n-butyl acrylate. I can.

The acrylic copolymer may have a weight average molecular weight of 2,000,000-10,000,000 g/mol, preferably 3,000,000-9,000,000 g/mol, more preferably 5,000,000-8,000,000 g/mol, and a weight average molecular weight of less than 2,000,000 g/mol Thermal aging of the mixed resin cannot be prevented, and if it exceeds 10,000,000 g/mol, the calendering processability may be deteriorated, and thus the mixed resin may have a weight average molecular weight within the above range.

The acrylic copolymer may be used in an amount of 20 to 100 parts by weight, preferably 25 to 50 parts by weight, based on 100 parts by weight of the mixed resin. If the amount is less than 20 parts by weight, when passing the lower layer 10 and the upper layer 20 including the underlying layer 13 formed of a chip for flooring through a heating drum, which is a preheating step during thermal plywood, Since the mixed resin is thermally decomposed and is not separated from the heating drum, productivity may be lowered, and if it exceeds 100 parts by weight, flexibility may be lowered, so that it can be used within the above content range.

The filler may be one or more selected from the group consisting of coal stone, talc, fly ash, and blast furnace slag as an example, and as a specific embodiment, a carbon stone (CaCO ₃ ) that is advantageous in terms of price and versatility and can increase durability. Can be used.

The filler may be used in an amount of 50-200 parts by weight, preferably 80-150 parts by weight, based on 100 parts by weight of the mixed resin, and there is an effect of imparting mechanical properties to the flooring material within the above range.

The oil acts as an emollient or processing oil to facilitate molding and processing by providing more flexibility to the underlayer composition, and one selected from mineral oil or synthetic resin oil may be used.

The mineral oil-based oil is generally a mixture of aromatic hydrocarbons, naphthane hydrocarbons, and paraffinic hydrocarbons, and when the number of carbon atoms of the paraffinic hydrocarbon accounts for 50% or more of the total carbon atoms, the number of carbon atoms of the paraffinic oil and naphthane hydrocarbons When the content is 30-45% or more, it is called a naphthane oil, and when the aromatic hydrocarbon has 35% or more carbon atoms, it is called an aromatic oil.

The synthetic resin oil is an oil made by artificially combining molecules of petroleum or other substances, and examples thereof include polybutene or low molecular weight polybutadiene.

In a specific embodiment of the present invention, the oil contained in the underlayer composition may be a paraffinic oil in consideration of compatibility with the resins and ease of handling.

The weight average molecular weight (Mw) of the oil may be 100-400g/mol, preferably 200-400g/mol. If it is less than 100g/mol, bleeding occurs in which oil leaks out to the surface of the flooring material, and if it exceeds 400g/mol, it is not absorbed into the resin and thus does not impart flexibility, so it can have a weight average molecular weight within the above range. have.

The oil may have a viscosity of 80-400 cps at 25° C., preferably 100-300 cps, and has excellent productivity within the above range.

The oil may be used in an amount of 1-20 parts by weight, preferably 5-10 parts by weight, based on 100 parts by weight of the mixed resin, and has excellent molding and processability by imparting flexibility to the underlayer composition within the above range.

The chip for flooring of the present invention may further include a flame retardant to ensure high flame retardancy. The flame retardant may be a halogen-based flame retardant having excellent flame retardant performance, and an inorganic flame retardant having a large synergy effect therewith.

Specifically, the halogen-based flame retardant is decabromo diphenyl oxide (DBDPO), tetrabromobisphenol-A (Tetrabromobisphenol A, TBBA), decabromo diphenyl ethane (DBDPE), tetrabromobisphenol A Bis (2,3-dibromopropyl ether) (Tetrabromobisphenol A bis (2,3-dibromopropyl ether), BDDP) and brominated polystyrene (BPS) can be at least one brominated flame retardant selected from the group consisting of (BPS) have.

The bromine-based flame retardant is an organic flame retardant and generates a non-combustible gas in a fire, diluting the combustible gas and blocking oxygen, thereby exerting a flame-retardant effect.

In the present invention, decabromediphenylethane may be used as a specific example.

The halogen-based flame retardant may be used in an amount of 1-50 parts by weight, preferably 10-25 parts by weight, based on 100 parts by weight of the mixed resin, and if it is less than 1 part by weight, non-combustible gas is not sufficiently generated in case of fire, resulting in lower flame retardancy, If it exceeds 50 parts by weight, there may be a problem in that the workability is deteriorated, so it can be used within the above content range.

In addition, the inorganic flame retardant generates water during combustion due to a fire and changes to water vapor, suppressing the combustion phenomenon, and at the same time lowering the ambient temperature, thereby exhibiting a flame retardant effect.

The inorganic flame retardant is, for example, antimony trioxide (Sb ₂ O ₃ ), aluminum hydroxide (Al (OH) ₃ ), magnesium hydroxide (Mg (OH) ₂ ), zinc stannate, 1 selected from the group consisting of guanidine-based and zirconium It may be more than a species, and in the present invention, antimony trioxide (Sb ₂ O ₃ ) may be used as a specific example.

The inorganic flame retardant may be 1-30 parts by weight, preferably 5-20 parts by weight, based on 100 parts by weight of the mixed resin, and if it is less than 1 part by weight, the generation of water vapor in the event of a fire is insignificant, resulting in reduced flame retardant performance, and 30 parts by weight. If it exceeds part, there may be a problem in that the workability is deteriorated, so it can be used within the above content range.

In addition to the above-described composition, the underlayer composition may further include one or more additives selected from the group consisting of light stabilizers, heat stabilizers, lubricants, and antioxidants, and the types and contents thereof do not impede the object of the present invention. As long as there is no limit.

The above-described underlayer composition may be formed into a sheet form using, for example, a calender roll or an extruder, and the sheet may be pulverized into various sizes to be manufactured into chips for flooring.

The specific shape of the flooring chip is not limited.

In addition, the size of the chip may be 300-700 μm, or 1,000-2500 μm, for example, but is not limited thereto.

The flooring chip is described below because the thermal decomposition initiation temperature of the mixed resin in which the styrene-butadiene copolymer (A1, A2) and the styrene-(meth)acrylate copolymer (B) are mixed is increased and the dynamic heat resistance is enhanced. When the lower layer 10 and the upper layer 20 of the flooring material are thermally laminated, when the lower layer 10 is passed through the heating drum, which is a preheating step, the lower layer 10 is neatly separated from the heating drum to facilitate workability. It works.

In addition, the flooring chip may be melt-impregnated into the nonwoven fabric layer 11 to achieve excellent peel strength with the nonwoven fabric layer.

The above-described flooring chip can be used to form the underlying layer in the flooring material of the present invention. As a relief chuck, the flooring material of the present invention includes a lower layer 10 including a non-woven fabric layer 11, a base layer 13 formed of the flooring chip, from the bottom to the top; An upper layer 20 including a dimensionally stable layer 21, a white sheet 23, a printing layer 25, and a transparent layer 27; It relates to a flooring (1) comprising a (see Fig. 1).

Hereinafter, each layer of the flooring material will be described in detail.

Lower layer (10)

The lower layer 10 is positioned under the flooring material 1 of the present invention, and may include a nonwoven fabric layer 11 and an underlying layer 13.

Non-woven layer (11)

The non-woven fabric layer 11 is located at the bottom of the floor material 1 to prevent transfer of miscellaneous objects and cracks on the floor surface, prevent crack waves during floor heating, and provide sound insulation and light weight to the floor material 1 can do.

In the present invention, miscellaneous objects refer to foreign substances such as gravel and sand on the floor surface (ie, concrete floor), and crack refers to cracks in the floor surface, and crack wave refers to, It refers to the wave pattern generated on the surface of the floor material due to hot air coming up from the cracks on the floor surface.

The non-woven fabric refers to a fabric shape in which fibers are bonded to each other by chemical action, mechanical action, or heat treatment with appropriate moisture without a woven process such as spinning, weaving, or knitting.

For example, the nonwoven fabric is a blend of two or more fibers having different fineness (denier, denier) of a thermoplastic resin material, and has excellent effects in dimensional stability, recovery rate, and elongation.

The thermoplastic resin is, for example, polyester (PET), polypropylene (PP), polyethylene (PE), polyvinyl alcohol (PVA), polyamide (PA), polyurethane (Polyurethane, PU) and polyvinylidene chloride (PVDC) may be one or more selected from the group consisting of, and in the present invention, as a specific embodiment of the thermoplastic resin, the glass transition temperature is high and the floor is heated when the floor is heated. Polyester (PET) with excellent dimensional stability can be used because it is not affected by changes in the temperature of the cotton.

The fiber may be a fiber chop having a length of about 4-7cm, preferably 5-6cm, that is, a short fiber, and has excellent dimensional stability within the above range.

In one embodiment, the nonwoven fabric is a fiber having a fineness of 4-12 denier (f1) 70-90% by weight, preferably 75-85% by weight, and a fiber having a fineness of 13-20 denier (f2) 10-30% by weight , Preferably, 15-25% by weight may be honseom.

In another embodiment of the nonwoven fabric, a fiber having a fineness of 4-6 denier (f1-1) 35-50% by weight, preferably a 35-40% by weight, a fiber having a fineness of 7-12 denier (f1-2 ) 35-50% by weight, preferably 35-40% by weight and fineness of 13-20 denier fiber (f2) 10-30% by weight, preferably 15-25% by weight may be blended.

If the fineness of the fiber is less than 4 denier, the mechanical properties of the nonwoven fabric may be degraded and spinning may be difficult, and if the fineness exceeds 20 denier, the bonding force between the fibers may decrease and the elongation of the nonwoven fabric may decrease. Fibers having a can be used. If the content of the fibers (f1) (f1-1) (f1-2) having a fineness of 4-12 denier is less than the above range, the dimensions of the nonwoven fabric are severely increased and the dimensional stability and recovery rate of the nonwoven fabric are not reduced. In addition, if it exceeds the above range, the elongation of the nonwoven fabric decreases, so it may be included in the above content range. Specifically, a typical nonwoven fabric has a tensile strength of about 1.0kgf or more when stretching 40-60% in the longitudinal direction at 120-140°C, and as an example, 50% stretching at 130°C. Compared with the tensile strength of (about 0.2-0.4kgf), it is very different, so when including it in the flooring material, when performing the synchronous embossing process in which the embossing pattern on the flooring material matches the printed pattern of the printed layer, the nonwoven fabric layer is wrinkled. There may be a problem with this occurring.

However, the nonwoven fabric of the present invention has a tensile strength of 0.3-0.8kgf, preferably 0.4-0.6kgf, when stretching 40-60% in the longitudinal direction at 120-140°C, and in one embodiment 50% stretching at 130°C. Compared to phosphorus nonwoven fabric, the tensile strength is small, and the difference in tensile strength from the upper layer of SBC material is very small.When performing the tuning embossing process, wrinkles do not occur in the nonwoven fabric layer, so the yield of the flooring material is excellent. have.

In the present invention, the synchronous embossing process means that a printed pattern and an embossed pattern are matched to achieve a good fit and excellent appearance.

The tensile strength of the nonwoven fabric was measured according to KS K 0521. Specifically, the nonwoven fabric specimen was held in a chamber at 130°C for 1 minute, bitten by a clamp of a Universal Testing Machine (UTM, Instron), and then 50% in the longitudinal direction. The tensile strength of the nonwoven fabric was measured during stretching.

In addition, the nonwoven fabric of the present invention has an elongation at break of 80-200% in the longitudinal direction at 20-25°C, preferably 90-180%, which is very high compared to the breaking elongation (15-30%) of a conventional nonwoven fabric. Although excellent, the difference is small compared to the elongation at break (150-250%) of the upper SBC material layer, so when the tuning embossing process is performed, wrinkles do not occur in the nonwoven fabric layer, so the yield of the flooring material is excellent.

The elongation at break of the nonwoven fabric was measured by stretching it until the nonwoven fabric broke under the conditions of 20-25°C using a Universal Testing Machine (UTM, Instron).

In the present invention, the longitudinal direction means a machine direction, that is, Machine Direction (MD).

In addition, the nonwoven fabric may have a basis weight of 180-230 g/m ² , preferably 190-220 g/m ² , and within the above range, it is possible to prevent the transfer of miscellaneous objects and cracks on the floor surface and to provide light weight while preventing crack wave. can do. The basis weight may be measured according to the ERT method (EDANA RECOMMENDED TEST METHODS) 40.3-90.

In addition, the nonwoven fabric may have a thickness of 0.5-1.5mm, preferably 0.6-1.2mm, and within the above range, it prevents the transfer of cracks and miscellaneous matters on the floor surface and prevents crack waves during floor heating. Voice and light weight can be realized.

Underlayer (13)

The base layer 13 is formed of a chip for flooring containing the thermal aging inhibitor described above, and may be produced by scattering the chip for flooring on an upper portion of a nonwoven fabric and then melt pressing.

Specifically, the base layer 13 has a sheet shape in which chips for flooring are completely melted, and has excellent peel strength with the nonwoven fabric layer 11 located below.

The chip for flooring is described above, and overlapping descriptions will be omitted.

The high-temperature peeling strength of the lower layer 10 and the iron plate of the present invention at 150-170° C. may be 0.02-0.10kgf/5cm, preferably 0.02-0.06kgf/5cm. When the high-temperature peeling strength is less than 0.02kgf/5cm, there is a problem of insufficient roll wrapability, and when it exceeds 0.10kgf/5cm, the dynamic heat resistance and thermal stability of the flooring chip are lowered, thereby forming the lower layer 10 and the upper layer 20. In case of passing the lower layer 10 through the heating drum, which is the preheating step when thermal plywood, there is a problem that the lower layer 10 does not remove cleanly from the heating drum and the residue of the underlying layer composition is stained, thereby deteriorating workability. It may have a peel strength within the above range.

The high-temperature peeling strength between the lower layer 10 and the steel plate is determined by cutting the lower layer 10 into a specimen having a size of 50 mm × 100 mm (width × length), and then using a 5 kg weight in a chamber at a high temperature of 150-170° C. for 2 minutes. After pressing and attaching the steel plate and the specimen inside the chamber by heat, the steel plate and the attached specimen are bitten by a clamp of a Universal Testing Machine (UTM, Instron), and then the high temperature peeling strength of the lower layer and the steel plate can be measured.

Upper layer (20)

The upper layer 20 may include a dimensionally stable layer 21, a white sheet 23, a printing layer 25, and a transparent layer 27 from the bottom to the top.

Dimensional stability layer (21)

The dimensional stability layer 21 is a layer for imparting dimensional stability of the flooring material, and a styrene-butydiene copolymer (A1), a halogen-based flame retardant, and an inorganic flame retardant in the white sheet 23 to be described later are partially melted to form a glass fiber ( glass fiber) may be formed by impregnation into the fabric.

The glass fiber fabric may be a glass fiber woven fabric or a non-woven fabric, but is not limited thereto.

Since the styrene-butadiene copolymer (A1), the halogen-based flame retardant and the inorganic flame retardant are the same as described above, duplicate descriptions will be omitted.

The dimensionally stable layer 21, which is a glass fiber fabric impregnated with a styrene-butadiene copolymer (A1), a halogen-based flame retardant and an inorganic flame retardant, has a basis weight of 40-80 g/m ² , preferably 50-70 ^{g/m 2} It may be, and there is an effect capable of imparting excellent dimensional stability to the flooring material within the above range.

In addition, the dimensional stability layer 21 may have a thickness of 0.2-0.8mm, preferably 0.3-0.5mm, and there is an effect of imparting excellent dimensional stability to the flooring material within the above range.

In addition, the dimensional stability layer 21 is impregnated with a non-PVC material, so that dimensional stability and eco-friendliness are excellent.

White Sheet(23)

The white sheet 23 is a resin, and may include a styrene-butadiene copolymer (A1) alone.

Specifically, the white sheet 23 includes 1 to 30 parts by weight of a halogen-based flame retardant, 1 to 20 parts by weight of an inorganic flame retardant, and 1 to 20 parts by weight of a pigment based on 100 parts by weight of the styrene-butadiene copolymer (A1) resin. It can be formed using a white sheet composition.

Since the characteristics of the styrene-butadiene copolymer (A1), the halogen-based flame retardant and the inorganic flame retardant are the same as described above, duplicate descriptions will be omitted.

In the present invention, as a specific embodiment, decabromodiphenyl ethane (DBDPE) may be used as a halogen-based flame retardant in the white sheet composition, and antimony trioxide (Sb ₂ O ₃ ) may be used as an inorganic flame retardant.

The halogen-based flame retardant may be used in an amount of 1 to 30 parts by weight, preferably 10 to 25 parts by weight, based on 100 parts by weight of the styrene-butadiene copolymer (A1), and within the above range, there is an effect of excellent flame retardancy of the flooring material.

In addition, the inorganic flame retardant may be used in an amount of 1-20 parts by weight, preferably 5-15 parts by weight, based on 100 parts by weight of the styrene-butadiene copolymer (A1), and there is an effect of excellent flame retardancy of the flooring material within the above range. .

The pigment may use white titanium dioxide (TiO ₂ ) to make the printed pattern stand out, but is not limited thereto.

The pigment may be 1-20 parts by weight, preferably 5-15 parts by weight, based on 100 parts by weight of the styrene-butadiene copolymer (A1), and there is an effect that the printed pattern can stand out within the above range.

The white sheet composition may further include one or more additives selected from the group consisting of fillers, light stabilizers, heat stabilizers, lubricants and antioxidants in addition to the components described above, and the types and contents thereof hinder the object of the present invention. Do not limit unless you do.

The white sheet may have a thickness of 0.1-0.5mm, preferably 0.15-0.3mm, and when the thickness is less than the above range, when the dimensional stability layer 21 is manufactured, the styrene-butadiene copolymer (A1) is incorporated into the glass fiber fabric. The dimensional stability of the flooring material is not sufficiently impregnated, and the dimensional stability of the flooring material may be lowered, and if the above range is exceeded, heat transfer is difficult because it is too thick. Therefore, it may have a thickness within the above range.

On the other hand, the dimensionally stable layer 21 and the white sheet 23 are made of the same material, and have excellent peel strength.

Specifically, the peeling strength of the dimensionally stable layer 21 and the white sheet 23 may be 7-15kgf/5cm, preferably 8-12kgf/5cm, and within the above range, the dimensionally stable layer 21 and its There is an excellent effect of adhesion to the white sheet 23 located on the top.

The peel strength is determined by cutting the semi-finished product including the dimensionally stable layer 21 and the white sheet 23 into a size of 50 mm×100 mm (width×length), and then bitten by a clamp of a Universal Testing Machine (UTM, Instron). The peel strength of the dimensional stability layer and the white sheet was measured.

In addition, the dimensional stability of the semi-finished product including the dimensional stability layer 21 and the white sheet 23 may be 0.1-0.6%, preferably 0.2-0.4%, and provides excellent dimensional stability to the flooring material within the above range. There is an effect that can be done.

For the dimensional stability of the semi-finished product, after cutting the semi-finished product into a size of 250 mm × 250 mm (width × length), measuring the initial dimension in the longitudinal direction of the semi-finished product at room temperature of about 25°C, and then 80 (±2) the semi-finished product. 6 hours at ℃ After standing, the dimension in the longitudinal direction is measured, and the dimensional change rate (%) can be calculated by the following <Equation 1>.

<Equation 1>

Dimensional change rate (%) = (late dimension-initial dimension) / initial dimension × 100

In addition, the tensile strength of the semi-finished product including the dimensionally stable layer 21 and the white sheet 23 may be 40-80kgf/cm ² , preferably 42-60kgf/cm ² , and workability within the above range It has an excellent effect.

The tensile strength of the semi-finished product is determined by cutting the semi-finished product into a size of 2.5 mm × 7 mm (width × length), biting it into a clamp of a Universal Testing Machine (UTM, Instron), and then stretching it to the yield point in the longitudinal direction. I can.

In addition, the total volatile organic compounds (TVOC) generation amount of the semi-finished product including the dimensionally stable layer 21 and the white sheet 23 may be 0.01-0.05 μg/g, preferably 0.02-0.04 μg/g, and the There is an effect that can impart excellent eco-friendliness to the flooring material within the range. The total volatile organic compounds (TVOC) generation amount of the semi-finished product is determined by cutting the semi-finished product into a size of 16.5 mm × 16.5 mm (width × length), and then TVOC generation amount by the Small Chamber method using a TVOC (total volatile organic compounds) measuring instrument. Can be measured.

Print layer(25)

The printing layer 25 may be formed on the surface of the white sheet 23 through transfer printing, gravure printing, or screen printing to impart aesthetics to the flooring material.

The thickness of the printing layer 25 may be 10-50 μm, preferably 15-25 μm, and within the above range, the aesthetics of the flooring material is excellent.

Transparent layer (27)

The transparent layer 27 serves to protect the printed layer 25 located below, and is a mixed resin in which a styrene-butadiene copolymer (A1) and a styrene-(meth)acrylate copolymer (B) are mixed, and transparency. It may be formed using a transparent layer composition containing a flame retardant.

Specifically, the transparent layer 27 may include 5-40 parts by weight of a transparent flame retardant based on 100 parts by weight of a mixed resin in which a styrene-butadiene copolymer (A1) and a styrene-(meth)acrylate copolymer (B) are mixed. have.

Since the properties of the styrene-butadiene copolymer (A1) are the same as described above, duplicate descriptions will be omitted.

The styrene-(meth)acrylate copolymer (B) provides transparency to the transparent layer and improves surface properties such as scratch resistance, abrasion resistance, dynamic heat resistance and thermal stability of the flooring material. It may be polymerized using a monomer and a (meth) acrylate compound, and a detailed description thereof is the same as described above, so a duplicate description will be omitted.

The weight ratio of the styrene-butadiene copolymer (A1) and the styrene-(meth)acrylate-based copolymer (B) in the mixed resin may be 40-80:20-60, preferably 50-70:30-50, and , When the content of the styrene-butadiene copolymer (A1) is less than the above range, the strength becomes very high, so that the flexibility, cushioning and pressing properties of the flooring material may be lowered, and when the content of the styrene-butadiene copolymer (A1) is less than the above range, relatively styrene-(meth)acrylic Since the content of the rate-based copolymer (B) is reduced, transparency cannot be imparted to the transparent layer, and the viscosity of the transparent layer composition is lowered, thereby reducing processability, and thus can be used within the above content range.

The transparent flame retardant is intended to impart flame retardancy without impairing the transparency of the transparent layer, and more specifically, there is a disadvantage of lowering transparency when an existing halogen-based flame retardant is added to the transparent layer, and the transparent flame retardant of the present invention is an epoxy resin. A mixed halogen-based flame retardant can be used.

The halogen-based flame retardant may be a bromine-based flame retardant, and tetrabrombisphenol-A may be used as a specific embodiment, but is not limited thereto. Since the characteristics of the halogen-based flame retardant are the same as described above, duplicate descriptions will be omitted.

The epoxy resin may be at least one selected from the group consisting of bisphenol-based, naphthalene-based, phenollobolac-based, cycloaliphatic-based, and amine-based polyfunctional epoxy resins.

The halogen-based flame retardant may be used in an amount of 1-30 parts by weight, preferably 5-25 parts by weight of a halogen-based flame retardant based on 100 parts by weight of the epoxy resin, and if it is less than 1 part by weight, the flame-retardant performance of the flooring material 1 may be deteriorated. In addition, when it exceeds 30 parts by weight, transparency of the transparent layer 27 may be impaired, and thus may be used within the above content range.

In addition, the transparent flame retardant may be used in an amount of 5-40 parts by weight, preferably 10-20 parts by weight, based on 100 parts by weight of the mixed resin, and if it is less than 5 parts by weight, the flame-retardant performance of the flooring material 1 may be lowered, and 40 If it exceeds parts by weight, processability may be deteriorated, and thus can be used within the above content range.

In addition to the above-described composition, the transparent layer composition may further include one or more additives selected from the group consisting of oil, light stabilizer, heat stabilizer, lubricant, and antioxidant, and the type and content thereof do not impede the object of the present invention. Do not limit unless.

The transparent layer 27 may have a thickness of 0.1-0.6mm, preferably 0.2-0.5mm, and can protect the printing layer 25 located below within the above range, and the abrasion resistance and resistance of the flooring material 1 There is an effect excellent in surface properties such as scratch properties.

The flooring material 1 of the present invention may optionally further include an embossed pattern (not shown) on the transparent layer 27, and the embossed pattern is a synchronized embossing pattern that matches the printing pattern of the lower printing layer 25. Can be In the case of including the tuning emboss, a feeling of depth and realism of printing can be felt, so that the appearance of the flooring material 1 has a more luxurious effect.

In addition, the flooring material 1 is optionally laminated on the transparent layer 27 on which the tuning emboss is formed to improve scratch resistance and abrasion resistance of the surface of the flooring material 1, and a surface treatment layer that prevents contaminants from adhering. It may further include (not shown).

The surface treatment layer may be formed by applying a conventional UV curable paint and then UV curing, and the thickness thereof may be 0.001-0.05mm or 0.01-0.03mm.

The thickness of the flooring material of the present invention may be 2-5mm, preferably 2-4.5mm, and there is an excellent effect of durability and light weight of the flooring material within the above range.

Total volatile organic compounds (TVOC) generation amount of the flooring material of the present invention may be 0.01-0.09 μg/g, preferably 0.03-0.08 μg/g, and the effect of imparting excellent eco-friendliness to the flooring material within the above range is have.

The total volatile organic compounds (TVOC) generation amount of the flooring material is determined by cutting the flooring material into a size of 165 mm × 165 mm (width × length), and then measuring the TVOC generation amount by a small chamber method using a TVOC (total volatile organic compounds) measuring device. I can.

In addition, the tensile strength of the flooring material of the present invention may be 40-100kgf/cm ² , preferably 50-80kgf/cm ² , and there is an effect of excellent mechanical properties of the flooring material within the above range.

The tensile strength of the flooring material can be measured when the flooring material is cut into a size of 25 mm × 70 mm (width × length), bitten by a clamp of a Universal Testing Machine (UTM, Instron), and stretched to the yield point in the longitudinal direction. have.

In addition, the dimensional stability of the flooring material of the present invention may be 0.1-0.6%, preferably 0.2-0.4%, and there is an effect of imparting excellent dimensional stability to the flooring material within the above range.

For the dimensional stability, after cutting the flooring material to a size of 250 mm×250 mm (width×length), the initial dimensions in the longitudinal direction of the flooring material were measured at room temperature of about 25°C, and then the flooring material was placed at 80 (±2)° C. 6 hours After standing, the dimension in the longitudinal direction is measured, and the dimensional change rate (%) can be calculated by the following <Equation 1>.

<Equation 1>

Dimensional change rate (%) = (late dimension-initial dimension) / initial dimension × 100

In addition, the peeling strength of the dimensionally stable layer and the underlying layer in the flooring of the present invention may be 7-15kgf/5cm, preferably 8-12kgf/5cm, and within the above range, the dimensionally stable layer and the underlying layer located under it There is an excellent effect of adhesion of.

The peeling strength was measured by cutting the floor material into a size of 50mm×100mm (width×length), biting it by a clamp of a Universal Testing Machine (UTM, Instron), and then measuring the peeling strength of the dimensionally stable layer and the underlying layer.

Flooring according to the present invention is digested during the critical yeolryuryang (Critical Flux at Extinguishment, CFE) is 0.45W / cm ² or more, preferably 0.50 W / cm ² or higher number, and the upper limit thereof is not limited, but one example, 0.80 W / cm ² It may be below, and there is an effect of excellent flame propagation within the above range.

The critical heat flow during extinguishing refers to the heat energy received per unit area per hour at the extinguishing point at which the propagation of the flame ends, and after cutting the floor material into a size of 230 mm × 1050 mm (width × length), measured in accordance with ASTM E 648. can do.

In addition, the flooring material of the present invention may have a maximum smoke density (Dm) of less than 500, preferably less than 480, and the lower limit thereof is not limited, but may be, for example, 10 or more, and has excellent flame retardancy within the above range.

The maximum smoke density may be measured as the maximum smoke density generated during combustion for 20 minutes according to ASTM E 648 after cutting the floor material to a size of 75 mm×75 mm (width×length).

The flooring material of the present invention satisfies ASTM E 648 standard Class 1 grade as the critical heat flow and maximum smoke density during the fire extinguishing are within the above condition range, and thus has excellent flame propagation properties and flame retardancy.

In addition, in the flooring material of the present invention, the amount of toxic gas (CO) generated may be 1460 ppm or less, preferably 1400 ppm or less, and the lower limit thereof is not limited, but may be 100 ppm or more, for example, and has excellent flame retardancy within the above range.

The amount of toxic gas generated may be determined by cutting the floor material into a size of 75 mm × 75 mm (width × length), and then measuring the amount of toxic gas generated 20 minutes after flame generation according to ASTM E 648.

In addition, the present invention provides an underlayer composition comprising a styrene-butadiene copolymer (SBC), a styrene-(meth)acrylate copolymer (B) (Styrene methyl methacrylate, SMMA), and a thermal aging inhibitor. Flooring chip manufacturing step (S1') of manufacturing a chip for flooring by using;

A scattering step (S3') of scattering the flooring chips on the top of the nonwoven fabric;

An oven input step (S5') of melting the flooring chips by putting the nonwoven fabric scattered on the flooring chips into an oven;

A lower layer manufacturing step (S7') of manufacturing a lower layer in which the base layer and the nonwoven fabric layer are bonded from the top to the bottom by pressing the nonwoven fabric in which the flooring chips are melted;

White sheet manufacturing step (S1) of manufacturing a white sheet;

A glass fiber fabric laminating step (S3) of laminating a glass fiber fabric on the white sheet;

Injecting the white sheet on which the glass fiber fabric is laminated into an oven to partially melt the white sheet (S5);

A dimensionally stable layer forming step (S7) of forming a dimensionally stable layer by pressing the white sheet on which the glass fiber fabric is laminated through the step (S5);

A printing layer forming step (S9) of forming a printing layer on the white sheet;

A transparent layer manufacturing step (S10) of manufacturing a transparent layer;

The dimensionally stable layer; White sheet; Printing layer; And a transparent layer; By heat plywood, the upper layer manufacturing step of manufacturing the upper layer (S11); And

It relates to a method of manufacturing a flooring material including a thermal plywood step (S13) of thermally plying the lower layer and the upper layer (see FIG. 2).

Hereinafter, each step will be described in detail.

Flooring chip manufacturing step (S1');

The chip manufacturing step (S1') for flooring may be a step of preparing an underlying layer composition into chips. Specifically, the inventors of the present invention prepared the base layer composition in a sheet form by calendering or extrusion method to form the base layer on the top of the nonwoven fabric, and then placed it on the top of the nonwoven fabric and performed thermal plywood. There was a problem that the bonding strength of the underlying layer was lowered.

Therefore, the base layer composition was prepared as chips and scattered on the top of the nonwoven fabric, and then put into an oven and melt-pressed to form a sheet-shaped base layer to increase the bonding strength between the nonwoven fabric and the base layer.

However, when passing the lower layer through a heating drum at 150-170° C., which is a preheating step in order to thermally ply the lower layer including the non-woven fabric and the under layer, the resin in the under-layer composition is thermally decomposed from the heating drum. There was a phenomenon in which no detachment occurred.

Accordingly, the inventors of the present invention have attempted to increase the bonding strength between the nonwoven fabric and the underlying layer while preventing thermal aging of the resin by preparing an underlying layer composition having a specific composition.

Specifically, the flooring chip manufacturing step (S1') includes 100 weight of a mixed resin in which a styrene-butadiene copolymer (A1), a styrene-butadiene copolymer (A2), and a styrene-(meth)acrylate copolymer (B) are mixed. The base layer composition containing 20-100 parts by weight of a thermal aging inhibitor, 50-200 parts by weight of a filler, and 1-20 parts by weight of an oil is calendered or extruded to form a sheet, and then pulverized to produce chips. It can be a step.

At this time, the mixed resin is 150-400 parts by weight of styrene-butadiene copolymer (A2) and 50-300 parts by weight of styrene-(meth)acrylate copolymer (B) based on 100 parts by weight of styrene-butadiene copolymer (A1). It may be to include.

In addition, the underlayer composition may further include a halogen-based flame retardant and an inorganic flame retardant to have excellent flame retardancy.

As a rescue chuck, a halogen-based flame retardant 1-50 per 100 parts by weight of a mixed resin in which styrene-butadiene copolymer (A1), styrene-butadiene copolymer (A2), and styrene-(meth)acrylate copolymer (B) are mixed. It may further include parts by weight and 1 to 30 parts by weight of an inorganic flame retardant.

Since the specific characteristics of each component in the underlayer composition are the same as described above, duplicate descriptions will be omitted.

The base layer composition is, for example, kneaded in a Banbari mixer at a temperature of 150-170°C, preferably 160-165°C, and then passed through a calender roll of 150-170°C, preferably 160-165°C to form a sheet Can be molded into

Alternatively, the underlayer composition may be formed into a sheet form by passing through an extruder at 200-250°C, for example.

Subsequently, the sheet may be pulverized into various sizes to be manufactured into chips (ie, chips for flooring).

Scattering step (S3');

The scattering step (S3') may be a step of scattering the flooring chip on the top of the nonwoven fabric.

Since the nonwoven fabric is the same as described above, duplicate descriptions will be omitted.

The nonwoven fabric may be manufactured by the following method. First, it goes through a blending process of mixing and mixing the fibers described above at a certain ratio in a hopper. Thereafter, after performing a carding process of forming a flat sheet-like web of a certain weight and width by combing the raw cotton supplied in the mixed-noodle process through a padding machine and a carding machine and mixing evenly so as not to have directionality, the carded web is applied in an appropriate layer. It goes through a cross lapper process that folds it into.

Then, a plurality of the webs are bonded using at least one bonding process selected from a chemical bonding method, a thermal bonding method, or a mechanical bonding method. In the present invention, a mechanical bonding method may be used, and more specifically, a needle punching bonding method may be used in order for the nonwoven fabric to have a specific elongation at break and tensile strength.

Subsequently, the bonded web may be pressed once again through a thermal calender having a heating temperature of 520-600°C or 540-560°C to manufacture the nonwoven fabric of the present invention.

Oven input step (S5')

The oven input step (S5') is a step of melting the flooring chips by inserting the nonwoven fabric scattered with the flooring chips into an oven, and specifically, in an oven at 200-250°C, preferably 210-240°C. It may be a step of melting the mixed resin in the chip for flooring by adding for 1-10 minutes, preferably 2-8 minutes.

If the temperature and/or the time range is less than the above range, the adhesion between the base layer and the nonwoven fabric may be reduced because the chip for flooring is not sufficiently melted, and if the temperature and/or the time range is exceeded, the elongation of the nonwoven fabric is reduced and the tuning embossing process When performing, since wrinkles may occur in the nonwoven fabric layer, it may be performed within the above range.

Lower layer manufacturing step (S7')

The lower layer manufacturing step (S7') may be a step of manufacturing a lower layer in which the base layer and the nonwoven fabric layer are bonded from the top to the bottom by pressing the nonwoven fabric in which the flooring chips are melted using a pressure roll.

The pressure is the adhesion of 30-250kgf / cm ^2, preferably within the resin for the flooring chip can not not sufficiently be impregnated into the nonwoven fabric layer and the nonwoven fabric is less than the pressure range, can be carried out by 40-200kgf / cm ² It may be lowered, and when the pressure range is exceeded, the elongation of the nonwoven fabric is lowered, and when the tuning embossing process is performed, wrinkles may occur in the nonwoven fabric layer, and thus can be performed within the above range.

The pressing may use a pressing roll as an example, but is not limited thereto.

The base layer in the lower layer prepared as above may have a thickness of 0.5-2.0mm, preferably 0.7-1.5mm, and the durability of the flooring material is excellent within the above range.

White sheet manufacturing step (S1)

The white sheet manufacturing step (S1) is a step of preparing a white sheet including a styrene-butadiene copolymer (A1) alone as a resin, specifically, for 100 parts by weight of a styrene-butadiene copolymer (A1), halogen A white sheet composition comprising 1 to 30 parts by weight of a flame retardant, 1 to 20 parts by weight of an inorganic flame retardant, and 1 to 20 parts by weight of a pigment may be prepared by calendering.

Since the characteristics of each component in the white sheet composition are the same as described above, duplicate descriptions will be omitted.

The white sheet composition is, for example, kneaded in a Banbari mixer at a temperature of 150-170° C., preferably 160-165° C., and then passed through a calender roll of 150-170° C., preferably 160-165° C., It can be ring molded.

Glass fiber fabric lamination step (S3)

The glass fiber fabric laminating step (S3) is a step of laminating a glass fiber fabric on the white sheet, and the glass fiber fabric may be a glass fiber woven fabric or a non-woven fabric.

Oven input step (S5)

The oven input step (S5) is a step of putting the white sheet on which the above glass fiber fabric is laminated into an oven, specifically, in an oven at 200-250°C, preferably 210-240°C for 1-10 minutes, preferably It may be a step of injecting for 2-8 minutes to partially melt the white sheet.

If the temperature and/or time range is less than the above range, the styrene-butadiene copolymer (A1) in the white sheet is not sufficiently impregnated into the glass fiber fabric in the dimensional stability layer forming step (S7) to be described later because the white sheet is not sufficiently melted. In addition to the reduction in dimensional stability, dynamic heat resistance may be reduced, and if the temperature and/or time range is exceeded, the styrene-butadiene copolymer (A1) is excessively impregnated, thereby reducing the flexibility of the flooring material. Can be done in

Dimensional stability layer manufacturing step (S7)

In the manufacturing step (S7) of the dimensionally stable layer, the styrene-butadiene copolymer (A1), the halogen-based flame retardant, and the inorganic flame retardant are incorporated into the glass fiber fabric by pressing the white sheet on which the glass fiber fabric is laminated through the step (S5). By impregnation, it may be a step of forming a dimensionally stable layer, which is a glass fiber fabric impregnated with a styrene-butadiene copolymer (A1), a halogen-based flame retardant and an inorganic flame retardant.

The pressure is the pressure roll can be used, and can be performed in 30-250kgf / cm ^2, preferably 40-200kgf / cm ^2, and, if the pressure is less than the range of the styrene-butadiene copolymer (A1) is a glass fiber The dimensional stability of the flooring material may be deteriorated due to insufficient impregnation into the fabric.If the pressure range is exceeded, the styrene-butadiene copolymer (A1) is excessively impregnated and the flexibility of the flooring material decreases. I can.

Printing layer forming step (S9)

The printing layer forming step (S9) is a step of forming a printing layer on the white sheet, and in a specific embodiment, a printing pattern may be transferred and printed on the white sheet to form a printing layer.

Transparent layer manufacturing step (S10)

The transparent layer manufacturing step (S10) is a transparent flame retardant for 100 parts by weight of a mixed resin in which the mixing weight ratio of the styrene-butadiene copolymer (A1): styrene-(meth)acrylate copolymer (B) is 40-80:20-60. It may be a step of preparing a transparent layer by calendering a transparent layer composition containing 5-40 parts by weight.

Since the transparent layer composition is the same as described above, overlapping descriptions will be omitted.

The transparent layer composition is, for example, kneaded in a Banbari mixer at a temperature of 150-170° C., preferably 160-165° C., and then passed through a calender roll of 150-170° C., preferably 160-165° C., calendering Can be molded.

The transparent layer manufacturing step (S10) may be performed independently from the printing layer forming step (S9) above, and thus the transparent layer manufacturing step (S10) may be performed first and then the printed layer forming step (S9) may be performed.

Upper layer manufacturing step (S11)

The upper layer manufacturing step (S11) includes: a dimensionally stable layer from bottom to top; White sheet; Printing layer; And a transparent layer; Position and heat plywood to prepare an upper layer of the flooring material, the heat plywood may be carried out at 160-180 °C, preferably 165-175 °C.

Thermal plywood step (S13)

The thermal plywood step (S13) is a step of thermally plying the upper layer and the lower layer prepared above. After preheating the lower layer through a heating drum at 150-170° C., a dimensionally stable layer of the upper layer is formed on the lower layer of the lower layer. After positioning so as to be in contact, it may be plywood using a pressure roll.

Alternatively, a tuning embossing process may be performed on the transparent layer of the upper layer selectively at the same time as the thermal plywood.

The temperature of the lower layer passing through the heating drum may be 110-150°C, preferably 120-140°C.

The plywood may be performed under a pressure of 1-10kgf/cm ² , preferably 3-8kgf/cm ^2.

On the other hand, if using a conventional non-woven fabric, the non-woven fabric layer from the bottom to the top; A base layer (lower layer) and a dimensionally stable layer; White sheet; Printing layer; And when performing the co-embossing process on the floor material on which the transparent layer (upper layer) is laminated, the tensile strength when the nonwoven fabric is stretched at a high temperature is very high compared to the tensile strength of the upper SBC layer, causing wrinkles in the nonwoven fabric layer. The yield of may be lowered.

Accordingly, after performing the tuning embossing process on the transparent layer of the upper layer in advance, there is no choice but to use a method of manufacturing a flooring material by thermally plying the upper layer on which the tuning emboss is formed with the lower layer. There may be a problem in that the embossing retention rate is low due to the collapse of the embossing, and the yield of the flooring material is lowered because the process of the flooring material is too long as the process of synchronizing embossing and the plywood process are divided.

However, in the present invention, by using a nonwoven fabric having a specific range of tensile strength when stretching at a high temperature, a floor material can be manufactured in a one-pass process capable of performing a synchronized embossing process simultaneously with the tertiary thermal plywood of the lower layer and the upper layer. There are no wrinkles on the surface and the emboss retention rate is high, but the process is shortened and the yield of the flooring material is excellent.

In addition, optionally, the method of manufacturing a flooring material of the present invention may further include forming a surface treatment layer by applying a UV-curable paint to the top of the flooring material on which the tuning emboss is formed, followed by UV curing.

Hereinafter, preferred embodiments are presented to aid in the understanding of the present invention, but the following examples are only illustrative of the present invention, and it is obvious to those skilled in the art that various changes and modifications are possible within the scope and spirit of the present invention. , It is natural that such changes and modifications fall within the scope of the appended claims.

Each component used in Examples and Comparative Examples described below is shown in Table 1 below.

Kinds ingredient SBC(A1) Styrene-butadiene block copolymer having a melt volume rate (MVR) of 6g/10min (200°C, 5kg) and a styrene content of 70% by weight SBC(A2) Styrene-butadiene block copolymer having a melt flow rate (MFR) of 10g/10min (200°C, 5kg) and a styrene content of 80% by weight SMMA(B) Styrene-(meth)acrylate random copolymer having a melt volume rate (MVR) of 30cm ³ /10min (220°C, 10kg), a styrene content of 70% by weight, and a methyl methacrylate content of 30% by weight Thermal anti-aging agent A random copolymer of n-butyl acrylate and methyl methacrylate with a weight average molecular weight of 8,000,000 g/mol Filler Calcium carbonate oil Paraffinic oil Flame retardant ¹ Halogen-based (brominated) flame retardant, decabromediphenylethane (DBDPE) Flame retardant ² Antimony trioxide (Sb ₂ O ₃ ) Flame retardant ³ Epoxy resin mixed tetrabrombisphenol-A (TBBA)

1. Flooring manufacturing

<Example 1>

(Non-woven)

40% by weight of polyester (PET) fiber with a length of 5 cm and a fineness of 6 denier, 40% by weight of a polyester (PET) fiber with a length of 5 cm and a fineness of 7 denier, and a polyester with a length of 6 cm and a fineness of 16 denier ( PET) After going through a blending process of blending 20% by weight of fibers, a web is formed through a carding process.

Then, fold the carded web into an appropriate layer through a cross wrapper process, and after performing a needle punching process, pass it through a thermal calendar at 540-560°C, so that ^{a non-woven fabric with a basis weight of 200 g/m 2} and a thickness of 0.8 mm (HS Co., Ltd. Glotech, 0820) was prepared.

(Lower floor)

SBC(A1), SBC(A2) And SMMA (B) with respect to 100 parts by weight of the mixed resin having a weight ratio of 1:2.5:1, 30 parts by weight of thermal aging inhibitor, 100 parts by weight of filler, 8 parts by weight of oil, 15 parts by weight of ^{flame retardant 1} , 10 parts by weight of ^{flame retardant 2} , After kneading a base layer composition comprising 3 parts by weight of an antioxidant and 3 parts by weight of a lubricant at 160° C. with a Banbari mixer, the kneaded base layer composition was passed through a calender roll at 160° C. to form a sheet.

Subsequently, the sheet was pulverized into various sizes to prepare a chip for flooring.

After scattering the chip for flooring on the top of the nonwoven fabric prepared above, it is put in an oven at 230° C. for 3 minutes to melt the mixed resin in the chip for flooring. Subsequently, by pressing with a pressure of 50 kgf/cm ² using a pressure roll, a lower layer of flooring was prepared in which a 0.7 mm thick base layer and a 0.8 mm thick nonwoven fabric layer were bonded from the top to the bottom.

(White sheet)

SBC(A1) With respect to 100 parts by weight, a white sheet composition comprising 6 parts by weight _{of titanium dioxide (TiO 2} ) as a pigment, 15 parts by weight of a ^{flame retardant 1 , 10 parts by weight of a flame retardant 2} and 3 parts by weight of a heat stabilizer was kneaded at 160°C with a Banbari mixer. Thereafter, the kneaded white sheet composition was passed through a calender roll at 160° C. to prepare a white sheet having a thickness of 0.2 mm.

(Dimension Stability Layer)

A glass fiber nonwoven fabric (HS Glotech, 0820C) was placed on the top of the white sheet and put in an oven at 220° C. for 5 minutes to melt the SBC (A1) in the white sheet. ^{Subsequently, a dimensional stability layer having a basis weight of 60 g/m 2} and a thickness of 0.4 mm was prepared in which SBC (A1) and a flame retardant were impregnated into the glass fiber nonwoven fabric by pressing at 50 kgf/cm ^{2 using a pressure roll.}

(Printed layer)

A print layer was formed by direct transfer printing on the white sheet.

(Transparent layer)

^{After kneading a transparent layer composition containing 15 parts by weight of a flame retardant 3 and} 3 parts by weight of a heat stabilizer at 160°C with a Banbari mixer with respect to 100 parts by weight of the mixed resin having a weight ratio of SBC (A1) and SMMA (B) of 6:4 , The kneaded transparent layer composition was passed through a calender roll at 160° C. to prepare a transparent layer having a thickness of 0.3 mm.

Dimensional stability layer from bottom to top; White sheet; And a printing layer; On the laminated preliminary upper layer, the transparent layer prepared above was placed in contact with the printed layer and then thermally laminated at 170° C. to prepare an upper layer of the flooring material.

(Sync embossing)

After placing the dimensional stability layer of the upper layer on the upper layer of the lower layer of about 130°C passed through the heating drum of 150°C, the thermal plywood and the transparent layer are simultaneously embossed with the thermal plywood under a pressure of ^{5kgf/cm 2 with a copper embossing roll.} A process was performed to form a tuned emboss consistent with the print pattern of the printed layer formed under the transparent layer.

(Surface treatment layer)

After applying a surface treatment agent containing a UV-curable resin on the transparent layer on which the tuning emboss was formed, UV irradiation was applied to form a surface treatment layer having a thickness of 0.02 mm to prepare the flooring material of Example 1 having a thickness of about 2.2 mm.

<Example 2>

A flooring material of Example 2 was prepared in the same manner as in Example 1, except that 50 parts by weight of a thermal aging inhibitor was added to the base layer.

<Comparative Example 1>

(Lower floor)

For 100 parts by weight of a polyvinyl chloride resin (LG Chemical, LS100) with a degree of polymerization of 1000, 5 parts by weight of acrylonitrile-butadiene rubber, 60 parts by weight of a filler, and 40 parts by weight of a plasticizer (LG Chemical, dioctyl terephthalate) And 3 parts by weight of a heat stabilizer were kneaded at 160° C. with a Banbari mixer, and then passed through a calender roll at 160° C. to prepare a base layer having a thickness of 1.5 mm.

(Dimension Stability Layer)

Polyvinyl chloride resin (LG Chemical, PB1202) 100 parts by weight of a nonwoven glass fiber paste, 80 parts by weight of a plasticizer (LG Chemical, dioctyl terephthalate), 60 parts by weight of a filler, and 2 parts by weight of a heat stabilizer. After impregnation in vinyl chloride sol and gelling at 150°C ^{, a dimensional stability layer having a basis weight of 60 g/m 2} and a thickness of 0.2 mm was prepared.

(White sheet)

For 100 parts by weight of polyvinyl chloride resin (LG Chemicals, LS100), 25 parts by weight of plasticizer (LG Chemicals, dioctyl terephthalate), 8 parts by weight of filler, 20 parts by weight of _{titanium dioxide (TiO 2) and 3 thermal stabilizers} After the white sheet composition including parts by weight was kneaded at 160° C. with a Banbari mixer, the kneaded white sheet composition was calendered at a temperature of 160° C. to prepare a white sheet having a thickness of 0.2 mm.

(Printed layer)

A print layer was formed by directly transferring and printing a print pattern on the white sheet.

(Transparent layer)

After kneading a transparent layer composition containing 100 parts by weight of a polyvinyl chloride resin (LG Chemical, LS100), 28 parts by weight of a plasticizer (LG Chemical, dioctyl terephthalate) and 3 parts by weight of a heat stabilizer at 160°C with a Banbari mixer , The kneaded transparent layer composition was passed through a calender roll of 160° C. to prepare a transparent layer having a thickness of 0.3 mm.

Dimensional stability layer from bottom to top; White sheet; Printing layer; And the transparent layer was laminated and thermally laminated at 170° C. to prepare an upper layer of the flooring material.

Subsequently, after the dimensional stability layer of the upper layer was placed on the upper part of the base layer to abut, the thermal plywood was performed under ^{a temperature of 170° C. and a pressure of 50 kgf/cm 2.}

(Surface treatment layer)

After applying a surface treatment agent containing a UV curable resin on the transparent layer, UV irradiation was applied to form a surface treatment layer having a thickness of 0.02 mm to prepare a flooring material of Comparative Example 1 having a thickness of about 2.2 mm.

<Comparative Example 2>

The flooring material of Comparative Example 2 was manufactured in the same manner as in Example 1, except that the underlayer did not contain a thermal aging inhibitor.

2. Measurement of physical properties

In the flooring materials of Examples 1 and 2 and Comparative Examples 1 and 2 prepared above, the high-temperature peeling strength between the lower layer and the steel plate was measured to determine the thermal aging prevention properties of the semi-finished product (lower layer) including the nonwoven fabric layer and the underlying layer. , Total volatile organic compound generation amount (TVOC) and tensile strength of the finished flooring material were measured, and the results are shown in Table 2 below.

(1) High-temperature peeling strength of the lower layer and the steel plate: The high-temperature peeling strength of the lower layer and the steel plate is cut into a size of 50 mm × 100 mm (width × length), and then press the specimen with a weight of 5 kg for 2 minutes in a high temperature chamber at 150°C. After attaching the steel plate and the specimen inside the chamber by heat, the steel plate and the attached specimen are bitten by a clamp of a Universal Testing Machine (UTM, Instron), and then the high-temperature peeling strength of the lower layer and the steel plate can be measured.

The higher the high temperature peeling strength is and the more peeled without residue, the higher the thermal decomposition initiation temperature and excellent dynamic heat resistance.

(2) Total Volatile Compound Generation (TVOC): After cutting the floor material into a size of 165mm×165mm (width×length), TVOC generation was measured by the Small Chamber method using a TVOC (total volatile organic compounds) measuring device.

The smaller the amount of TVOC generated, the better the eco-friendliness.

Example 1 Example 2 Comparative Example 1 Comparative Example 2 Lower layer Non-woven layer ○ ○ - ○ Underlayer With/without chips for flooring U U radish U Suzy SBC+SMMA SBC+SMMA PVC SBC+SMMA Thermal aging inhibitor (parts by weight) 30 50 - - Dimensional stability layer SBC+SMMA SBC+SMMA PVC SBC+SMMA Transparent layer SBC+SMMA SBC+SMMA PVC SBC+SMMA Properties High temperature peeling strength between the lower layer and the steel plate (kgf/5cm) 0.04 0.03 0.03 0.17 Total Volatile Compound Generation (㎍/g) 0.05 0.07 0.1 0.06

As confirmed in Table 2, the lower layers of Examples 1 and 2 including the underlying layer formed of the chip for flooring containing the thermal aging inhibitor of the present invention and the iron plate have excellent high-temperature peel strength, and the upper layer and lower layer thermal plywood In the case of passing the lower layer through the heating drum, which is the preheating step, it was confirmed that the residuals of the composition of the underlying layer were not stained, so that the thermal decomposition initiation temperature of the SBC and SMMA mixed resin was increased and the dynamic heat resistance was excellent, and the non-PVC material It was confirmed that the bar includes an excellent eco-friendly property.

On the other hand, Comparative Example 1, which is a flooring material made of a PVC resin, has excellent high-temperature peeling strength between the lower layer and the steel plate, but it was confirmed that the eco-friendliness was very deteriorated because the non-PVC resin was not included.

In addition, Comparative Example 3, in which the underlying layer was formed with a chip for flooring that did not contain a thermal aging inhibitor, was excellent in eco-friendliness by using a non-PVC resin as in the present invention, but the high temperature peeling strength between the lower layer and the steel plate was not excellent. , When passing the lower layer through the heating drum which is the preheating step in the case of thermal plywood of the upper layer and the lower layer, it was confirmed that the underlayer composition was not removed cleanly from the heating drum, and the underlayer composition was thermally aged.

1: flooring 10: lower layer
11: Non-woven fabric layer 13: Underlying layer
20: upper layer 21: dimensionally stable layer
23: white sheet 25: printed layer
27: transparent layer

Claims (14)

A chip for flooring comprising a styrene-butadiene copolymer (SBC), a styrene-(meth)acrylate copolymer (B) (Styrene methyl methacrylate, SMMA), and a thermal aging inhibitor. The method of claim 1,
The thermal aging inhibitor is an acrylic random copolymer having a molecular weight of 2,000,000 to 10,000,000 flooring chips. The method of claim 1,
The styrene-butadiene copolymer (Styrene-butadiene copolymer, SBC),
Styrene-butadiene copolymer (A1) in which 30-90% by weight of styrene and 10-70% by weight of 1,3-butadiene are mixed, and
40-90% by weight of styrene and 10-60% by weight of 1,3-butadiene are mixed (A2),
A chip for flooring that 150-400 parts by weight of a styrene-butadiene copolymer (A2) is mixed with respect to 100 parts by weight of the styrene-butadiene copolymer (A1). The method of claim 1,
The melt volume rate of the styrene-butadiene copolymer (A1) is (Melt Volume Rate, MVR) 1-10g/10min (200°C, 5kg),
The styrene-butadiene copolymer (A2) has a melt flow rate of 5-20g/10min (200°C, 5kg). The styrene-(meth)acrylate copolymer (B) is 50-300 parts by weight based on 100 parts by weight of the styrene-butadiene copolymer (A1). Flooring chips. The method of claim 1,
The chip for flooring is a styrene-butadiene copolymer and a styrene-(meth)acrylate copolymer (B) containing 20-100 parts by weight of a thermal aging inhibitor based on 100 parts by weight of the mixed resin. The method of claim 1,
The flooring chip further comprises a halogen-based flame retardant, an inorganic flame retardant, a filler, and an oil. The method of claim 1,
The chip for flooring is melted and used as an underlying layer. From the bottom to the top, a non-woven fabric layer (11), a lower layer (10) comprising a base layer (13) formed of a chip for flooring according to any one of claims 1 to 8; An upper layer 20 including a dimensionally stable layer 21, a white sheet 23, a printing layer 25, and a transparent layer 27; Flooring comprising a. The method of claim 9,
The transparent layer 27 is a flooring comprising a styrene-butadiene copolymer (Styrene-butadiene copolymer, SBC) and styrene-(meth)acrylate (Styrene methyl methacrylate, SMMA). The method of claim 9,
The lower layer 10 is a flooring material having a high-temperature peeling strength of 0.02-0.10kgf/mm ^{2 with a steel plate.} The method of claim 9,
The lower layer 10 is a flooring material having a high-temperature peeling strength of 0.02-0.06kgf/mm ^{2 with a steel plate.} The method of claim 9,
The flooring material is a flooring material in which the generation amount of total volatile organic compounds is 0.01-0.09 μg/g. Chips for flooring were prepared by using an underlayer composition containing a styrene-butadiene copolymer (SBC), a styrene-(meth)acrylate copolymer (B) (Styrene methyl methacrylate, SMMA), and a thermal aging inhibitor. Chip manufacturing step for manufacturing flooring (S1');
A scattering step (S3') of scattering the flooring chips on the top of the nonwoven fabric;
An oven input step (S5') of melting the flooring chips by putting the nonwoven fabric scattered on the flooring chips into an oven;
A lower layer manufacturing step (S7') of manufacturing a lower layer in which the base layer and the nonwoven fabric layer are bonded from the top to the bottom by pressing the nonwoven fabric in which the flooring chips are melted;
White sheet manufacturing step of manufacturing a white sheet (S1);
A glass fiber fabric lamination step (S3) of laminating a glass fiber fabric on the white sheet;
Injecting the white sheet on which the glass fiber fabric is laminated into an oven to partially melt the white sheet (S5);
Step (S7) of forming a dimensional stability layer by pressing the white sheet on which the glass fiber fabric is laminated through the step (S5);
A printing layer forming step (S9) of forming a printing layer on the white sheet;
A transparent layer manufacturing step (S10) of manufacturing a transparent layer;
The dimensionally stable layer; White sheet; Printing layer; And a transparent layer; By heat plywood, the upper layer manufacturing step of manufacturing the upper layer (S11); And
A method of manufacturing a flooring material comprising a thermal plywood step (S13) of thermally plying the lower layer and the upper layer.

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