KR20210048015A - A sensor structure and a smart insole comprising the same - Google Patents

Abstract

An aspect of the present invention relates to a sensor structure in which a substrate, an electrode and a conductive cover are sequentially stacked. The present invention provides the sensor structure in which the conductive cover is made of a fabric woven by twisted yarn of conductive fiber yarn and non-conductive fiber yarn, and smart insoles including the same. An objective of the present invention is to provide the sensor structure in which mechanical strength and electrical characteristics are implemented in a balanced manner, and the smart insoles including the same.

Description

Sensor structure and smart insole including it {A SENSOR STRUCTURE AND A SMART INSOLE COMPRISING THE SAME}

The present invention relates to a sensor structure and a smart insole including the same.

When an excessive load is applied to the foot, a reaction of the human body to the load occurs, and if the load is repeatedly and continuously applied, the likelihood of injury increases. To prevent this, it is necessary to incorporate sensors to measure and evaluate the load in the shoe. In addition, a battery for operating this sensor and a communication module for transmitting a signal from the sensor to an external device are required.

Korean Patent Laid-Open Publication No. 10-2014-0062541 is a floor layer in contact with the floor inside the shoe and on which a circuit unit for controlling the operation of the smart insole is installed, is formed in a shape corresponding to the floor layer, and is combined on the floor layer. , Disclosed is a smart insole comprising a sensing layer made of a smart fiber whose capacitance changes according to changes in temperature, humidity, or pressure, and a cover layer covering the sensing layer.

Conventionally, as such smart fibers, high-strength conductive yarns, fiber-based sensor yarns, optical fibers (POF), ceramic yarns, carbon yarns, metal yarns, etc. are known, but general carbon yarns, metal yarns, etc. have excellent conductivity but frequent bending and impact. There is a fragile problem on the back.

Therefore, in order to apply the smart fiber to a sub-structure such as a shoe insole, specifically, a sensor structure included in the smart insole, it is necessary to implement the mechanical strength and electrical properties of the fiber in a balanced manner. have.

The present invention is to solve the problems of the prior art, and an object of the present invention is to provide a sensor structure in which mechanical strength and electrical characteristics are implemented in a balanced manner, and a smart insole including the same.

One aspect of the present invention provides a sensor structure in which an electrode and a conductive cover are sequentially stacked, wherein the conductive cover is made of a fabric in which a conductive fiber yarn and a twisted yarn of a non-conductive fiber yarn are woven.

In one embodiment, the electrode may be a comb-shaped electrode in which a plurality of comb-shaped fingers are arranged to be spaced apart from each other.

In one embodiment, the conductive fiber yarn may include a first region including a carbon-based material.

In one embodiment, the carbon-based material may be one selected from the group consisting of carbon nanotubes, fullerenes, graphene, graphite, carbon fiber, carbon black, and combinations of two or more of them.

In one embodiment, the conductive fiber yarn may further include a second region including a thermoplastic resin.

In one embodiment, a ratio of the cross-sectional area of the second area to the cross-sectional area of the conductive fiber yarn may be 0.01 to 0.9.

Another aspect of the present invention, the sensor structure; Electronic module; And a substrate including a wire connecting the sensor structure and the electronic module.

In an embodiment, the sensor structure may be located in a toe area, a cheek area, and a heel area of the substrate.

In one embodiment, the wiring is primarily extended in a radial direction from the sensor structure toward the outside of the insole, and is secondarily extended in a circumferential direction along the circumference of the insole to form a port and an interface in the inner arch area of the substrate. May be connected to the electronic module.

In one embodiment, the electronic module includes a communication module and a battery, the communication module communicates with an external sensor attached to the wearer's body, and the external sensor is a joint portion of the wearer, a plurality of connected to the joint portion. It may be attached to a bone site, or a combination thereof.

The sensor structure according to an aspect of the present invention includes a conductive cover made of a fabric in which a twisted yarn of a conductive fiber yarn and a non-conductive fiber yarn is woven, thereby balancing the mechanical strength and electrical properties of the sensor structure and the smart insole including the same. It can be implemented as an alternative.

The effects of the present invention are not limited to the above effects, and should be understood to include all effects that can be deduced from the configuration of the invention described in the detailed description or claims of the present invention.

1 is a cross-sectional view of a sensor structure according to an embodiment of the present invention;
2 is a plan view of a conductive cover according to an embodiment of the present invention;
3 is a schematic diagram of a continuous project according to an embodiment of the present invention;
4 and 5 are cross-sectional views of a conductive fiber yarn according to an embodiment of the present invention;
6 is a schematic diagram of a sensor structure and a driving principle of an external sensor according to an embodiment of the present invention;
7 is an image measuring the average foot pressure of the foot;
8 is a plan view of a smart insole according to an embodiment of the present invention.

Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be implemented in various different forms, and therefore is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and similar reference numerals are attached to similar parts throughout the specification.

Throughout the specification, when a part is said to be "connected" with another part, this includes not only "directly connected" but also "indirectly connected" with another member interposed therebetween. . In addition, when a part "includes" a certain component, it means that other components may be further provided, rather than excluding other components unless specifically stated to the contrary.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Sensor structure

1 is a cross-sectional view of a sensor structure according to an embodiment of the present invention. Referring to Figure 1, the sensor structure according to an aspect of the present invention, in the sensor structure in which the electrode 100 and the conductive cover 200 are sequentially stacked, the conductive cover 200 is a conductive fiber yarn and a vision The twisted yarn of the conductive fiber yarn may be made of a woven fabric.

The electrode 100 may be a comb-shaped electrode (not shown) in which a plurality of comb-shaped fingers are spaced apart from each other, but the structure and shape are not limited thereto.

2 is a plan view of a conductive cover according to an embodiment of the present invention. The conductive cover 220 is a fabric in which a fiber yarn having a required level of conductivity is woven, and the electrical properties such as electric capacity and resistance change according to external conditions such as pressure, temperature, and humidity. It is used as a component, and is also called “fiber sensor”.

2 shows a plan view of a conductive cover in which a twisted yarn of a conductive fiber yarn and a non-conductive fiber yarn is plain weave with warp 210 and weft 220, but the weaving method of the twisted yarn is not limited to plain weave, twill weave, weft weave Or, it may be a combination of two or more of these.

As used herein, the term "plain weave" refers to a fabric made by alternating warp and weft yarns one by one, and “twill” refers to a warp yarn or weft yarn that is made by alternating one, two, or more yarns. It means a fabric made so that a line that crosses and connects the tissue points (the part where the inclination is protruding) appears in a diagonal direction, and "Suzy Weave" means that the tissue points of the warp and weft are as small as possible, and they are separated from the surface of the fabric without attaching them. Or it means a fabric made so that only the weft is visible.

3 is a schematic diagram of a continuous project according to an embodiment of the present invention. Referring to FIG. 3, the conductive cover 200 may be made of a fabric in which a twisted yarn of a conductive fiber yarn 221 and a non-conductive fiber yarn 222 is woven.

As used herein, the term "twisted yarn" means a yarn twisted by combining two or more yarns. That is, the twisted yarn means a braided yarn by combining one strand of the conductive fiber yarn 221 and one strand of the non-conductive fiber yarn 222, and the conductive cover 200 may be such a twisted yarn woven. have.

Conventionally, as conductive fiber yarns, high-strength conductive yarns, fiber-based sensor yarns, optical fibers (POF), ceramic yarns, carbon yarns, metal yarns, etc. are known, but inorganic fibers such as general carbon yarns and metal yarns have excellent conductivity but frequent bending. , Impact, etc. There was a weak problem, and there was a limitation in applying this to the sub-structure such as the sensor structure included in the shoe insole, specifically, the sensor structure included in the smart insole, which is the shoe insole that has the most load among shoes and clothing.

In contrast, the non-conductive fiber yarn 222 complements and improves mechanical properties such as tensile strength, tensile elongation, and tear strength of the conductive fiber yarn 221 so that the conductive cover can be applied to the insole of the shoe. In this case, the deterioration of electrical properties due to the coupling of the non-conductive fiber yarn 222 may be compensated by increasing the conductivity of the conductive fiber yarn 221.

The conductivity of the conductive fiber yarn 221 may be adjusted according to the type and content of the conductive material included therein, and the conductive fiber yarn 221 also has a certain amount of It may be made of a material in which organic and inorganic materials are combined with each other.

The conductive fiber yarn 221 may include a first region 2211 including a thermoplastic resin and a carbon-based material. The carbon-based material has a required level of electrical conductivity, and may be, for example, one selected from the group consisting of carbon nanotubes, fullerenes, graphene, graphite, carbon fibers, carbon black, and combinations of two or more of them, Preferably, it may be a carbon nanotube, but is not limited thereto.

Depending on the number of walls, the carbon nanotubes are single-walled carbon nanotubes, double-walled carbon nanotubes, multi-walled carbon nanotubes, and truncated conical graphenes. It may be one selected from the group consisting of cup-stacked carbon nanofibers in the form of a hollow tube in which a plurality of truncated graphenes are stacked and a combination of two or more of them, and preferably, it is excellent in ease of manufacture and economy. It may be a multi-walled carbon nanotube, but is not limited thereto.

In the Raman spectrum of the carbon nanotubes, ^{a peak present in the wavenumber 1580±50cm -1} region is referred to as a G band, which indicates a sp2 bond of the carbon nanotubes, indicating a carbon crystal without structural defects. In addition, the peak present in the wavenumber 1360±50cm ^-1 region is referred to as the D band, which represents the sp3 bond of the carbon nanotubes and represents the carbon having structural defects.

Furthermore, the peak values of the G band and the D band are _{referred to as I G} and I _D , respectively, and the crystallinity of the carbon nanotubes can be quantified and measured through the Raman spectral intensity ratio (I _G / I _{D ), which is a ratio between the two.} have. That is, the higher the Raman spectral intensity ratio is, the less structural defects of the carbon nanotubes are. Therefore, when a carbon nanotube having a high Raman spectral intensity ratio is used, more excellent conductivity can be realized.

Specifically, the Raman spectral intensity ratio (I _G /I _D ) of the carbon nanotubes may be 1.0 or more. _{If the I G} / I _D value of the carbon nanotube is less than 1.0, a large amount of amorphous carbon is contained, resulting in poor crystallinity of the carbon nanotube. Accordingly, the effect of improving conductivity may be weak when kneaded with a thermoplastic resin.

In addition, since carbon nanotubes have fewer impurities such as catalysts, the higher the carbon content, so that the carbon nanotubes have a carbon purity of 95% or more, preferably 95 to 98%, more preferably, It can be 96.5~97.5%.

If the carbon purity of the carbon nanotubes is less than 95%, structural defects of the carbon nanotubes may be caused, thereby reducing crystallinity, and the carbon nanotubes may be easily cut and destroyed by external stimulation.

In addition, the multi-walled carbon nanotubes may be aggregated with each other to exist in the form of a bundle. The average bundle diameter of these bundle-type carbon nanotubes may be 1 to 10 μm, preferably 3 to 5 μm, more preferably 3.5 to 4.5 μm, and the average bundle length is 10 to 100 μm, preferably , 30 ~ 60㎛, more preferably, it may be 45 ~ 55㎛.

The bundle-type carbon nanotubes may be dispersed in a thermoplastic resin to form a three-dimensional network structure, and the stronger the network structure is, the better the conductivity may be. In particular, the network structure can be firmly formed by adjusting the average bundle diameter and the average bundle length of the bundle-type carbon nanotube in a predetermined range.

If the average bundle diameter of the bundle-type carbon nanotubes is less than 1 μm or the average bundle length exceeds 100 μm, dispersibility may be lowered, resulting in non-uniform conductivity for each portion of the first region of the conductive fiber yarn, and the average bundle diameter If this value exceeds 10 μm or the average bundle length is less than 10 μm, the network structure becomes unstable and the conductivity may decrease.

The content of the carbon nanotubes may be 0.1 to 50% by weight, preferably 0.1 to 30% by weight, based on the total weight of the first region. If the content of the carbon nanotubes is less than 0.1% by weight, sufficient conductivity cannot be imparted to the conductive fiber yarn, and if it exceeds 50% by weight, the moldability, workability, and stretchability of the conductive fiber yarn may be deteriorated.

The conductive fiber yarn 221 may further include a second region 2212 containing a thermoplastic resin, preferably substantially made of a thermoplastic resin. The second region 2212 may support the first region 2211 that imparts conductivity to the conductive fiber yarn 221 to improve mechanical properties of the conductive fiber yarn 221.

The ratio of the cross-sectional area of the second region 2212 to the cross-sectional area of the conductive fiber yarn 221 may be 0.01 to 0.9, preferably 0.1 to 0.8, more preferably 0.4 to 0.7. If the ratio of the second region 2212 is less than 0.01, the first region 2211 cannot be sufficiently supported, so the mechanical properties of the conductive fiber yarn may be deteriorated. Since the ratio of the one region 2211 is reduced, the conductivity of the conductive fiber yarn may be lowered.

4 and 5 are cross-sectional views of conductive fiber yarns according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of a conductive fiber yarn in which the first and second regions are a skin and a core material, that is, in an inner-outer position, and FIG. 5 is a cross-sectional view of the first and second regions, respectively. It is a cross-sectional view of a conductive fiber yarn in position.

Referring to FIG. 4, the first and second regions may be an outer skin and a core material, respectively.

The thermoplastic resin included in the first and second regions 2211 and 2212 is, for example, polyamide, polyimide, polyethylene, polypropylene, polyethylene copolymer, polyester, polyacrylonitrile, polystyrene, poly Carbonate, aramid, polyethylene terephthalate, polyurethane, styrene-ethylene copolymer, styrene-ethylene-butadiene-styrene copolymer, styrene-ethylene-propylene-styrene copolymer, styrene-butadiene-styrene copolymer, styrene-isoprene-styrene Copolymer, ethylene-propylene-diene copolymer (EPDM), ethylene-vinyl acetate copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, maleic anhydride graft Polypropylene, maleic anhydride grafted linear low density polyethylene, maleic anhydride grafted low density polyethylene, maleic anhydride grafted styrene-ethylene-butylene-styrene copolymer and maleic anhydride grafted styrene-ethylene- It may include one or more components selected from the group consisting of butadiene-styrene copolymer.

As a thermoplastic resin mixed with the carbon-based material in the first region 2211, a polyurethane, preferably, a thermoplastic polyurethane, may be exemplified, but is not limited thereto. Thermoplastic polyurethane (TPU) can improve the stretchability and impact strength of the conductive fiber yarn 221. In addition, since the thermoplastic polyurethane improves the stretchability of the conductive fiber yarn 221 and does not inhibit the dispersion of carbon nanotubes, it is possible to minimize the conductivity deviation of the conductive fiber yarn 221 by region.

The thermoplastic resin constituting the second region 2222 may include polyamide, but is not limited thereto. The polyamide may improve the mechanical properties of the conductive fiber yarn 221 by supplementing the problem of the polyurethane having low tensile strength.

Smart insole

8 is a plan view of a smart insole according to an embodiment of the present invention. Referring to Figure 8, the smart insole according to another aspect of the present invention, the sensor structure 10; Electronic module 20; And a substrate 30 including a wire connecting the sensor structure and the electronic module.

The substrate 30 is a thin flexible synthetic resin plate, and may be made of a material that does not affect the cushion of the wearer's foot at all. The sensor structure 10 is, for example, one selected from the group consisting of a pressure sensor, a temperature sensor, a humidity sensor, a three-axis acceleration sensor, a three-axis gyro sensor, a three-axis geomagnetic sensor, a GPS sensor, and a combination of two or more of them. May be, preferably, a pressure sensor, but is not limited thereto.

By measuring the pressure distribution by the pressure sensor, it is possible to accurately measure, analyze, and evaluate the load or impact transmitted to each part of the human body during the wearer's activities, as well as prevent, treat, and diagnose the wearer's injuries.

In addition, in order to measure the condition of the wearer's foot and the surrounding environment, any portion of the substrate may further include a temperature sensor and a humidity sensor. The temperature sensor may prevent the wearer from being exposed to dangers due to temperature in extreme conditions, such as cryogenic and extremely high temperature regions. For example, if a temperature sensor detects that the temperature in the area is above 30°C, the wearer can move to a safe place.

In addition, as an additional sensor, at least one of a 3-axis acceleration sensor, a 3-axis gyro sensor, a 3-axis geomagnetic sensor, and a GPS sensor may be installed on the substrate. The 3-axis acceleration sensor may measure inclination, acceleration, vibration, and shock when the wearer stops. The 3-axis gyro sensor may measure the amount of change when the change position of the wearer changes. In addition, the 3-axis geomagnetic sensor can determine the exact orientation of the wearer through the magnetic field. Through the GPS sensor, the walking distance of the wearer can be calculated and the location of the wearer can be quickly determined.

The substrate 30 may be embedded in a midsole or an insole of a shoe, or may be attached or bonded to a surface thereof. For example, by making the midsole and the insole into one member, the substrate 30, the battery, and the communication module may be embedded therein.

The substrate 30 may have a shape according to the wearer's foot shape (foot shape), and the sensor structures 10 may be mounted according to the wearer's foot shape. The substrate 30 may be positioned on an upper portion close to the wearer's foot to ensure smooth operation of the sensor structure 10.

The electronic module 20 including the battery and the communication module may be located at the inner arch portion of the smart insole in order to less affect the cushion of the wearer's foot.

The battery supplies power to the sensor structure 10 of the substrate 30 through wiring, and the communication module receives signals and data from the sensor structures 10 of the substrate 30 through wiring. So it can be transmitted to an external device.

The external device may be a wearer mobile phone terminal, an administrator mobile phone terminal, a company management server, a hospital server, or the like. The communication method between the communication module and the external device may be Bluetooth, Wi-Fi, wireless communication (radio), or Internet, but is not limited thereto.

The sensor structure, the communication module, and the control and communication method of the external device may be applied with reference to those described in Korean Patent Application No. 10-2013-7024781 and Korean Patent Application No. 10-2012-0126930.

In addition to the sensor structure 10 located on the substrate 30, the communication module may wirelessly transmit and receive data with an external sensor (not shown) attached to the wearer's body for the purpose of additionally examining the state of the wearer. For example, the external sensor may be attached to a joint portion of the wearer, a plurality of bone portions connected to the joint portion, or a combination thereof. As used herein, the terms "joint part" and "bone part" may refer to the wearer's epidermis or the periphery of the wearer's joints or bones, and "attachment" refers only to attachment by adhesives, adhesives, etc. It can be understood as a concept including physical and mechanical coupling using a band or the like.

6 is a schematic diagram of a sensor structure and a driving principle of an external sensor according to an embodiment of the present invention. Referring to FIG. 6, when an external sensor is mounted on a joint portion of a wearer, for example, a knee joint, a hip joint, a spine joint, a cervical spine joint, the communication module includes data and a joint portion through the sensor structure 10. All of the data through the external sensor of can be transmitted to the external device. In this case, it can be used to prevent the risk of injury to the wearer by analyzing data of the wearer's joint momentum and foot load.

In addition, the external sensor may be attached to a plurality of bone regions connected to the joint region. For example, the external sensor may be attached to the tibia (tibia) and femur (femur) regions connected to the knee joint, that is, the calf and the thigh, respectively. External sensors respectively attached to the tibialis and femurs may track, invert, and transmit a load applied to the joint by the wearer's activity to the external device.

7 is an image obtained by measuring the average foot pressure of the foot, and FIG. 8 is a plan view of a substrate according to an exemplary embodiment of the present invention.

Referring to FIG. 7, the foot pressure, that is, the load applied to the shoe between the wearer's activities is mainly concentrated in the toe area, the cheek area, and the heel area, whereas the arch area, preferably, the inner arch area, is almost applied with a load. It doesn't work.

According to this average foot pressure distribution, as in the prior art, for example, as in Korean Patent No. 10-1780654, a plurality of wires extending from the sensor and an electronic module located in the arch area are connected between the ball area and the arch area of the foot. When an interface is formed, since the interface is located in a region where a load is large due to deformation of the working shoe, if a wire break occurs due to load accumulation, an error or malfunction of the sensor and the electronic module may be caused.

On the other hand, referring to FIG. 8, the electronic module 20 is located in the arch area of the substrate 30, and the wiring is on the substrate 30 from the sensor structure 10 toward the outside of the insole in a radial direction. It may be extended first and secondly extended in a circumferential direction along the circumference of the insole to form a port and an interface 40 in an inner arch region of the substrate to be connected to the electronic module 20. Such a structure of the wiring may fundamentally prevent disconnection of the wiring due to the accumulation of loads, and errors or malfunctions of the sensor structure 10 and the electronic module 20 accordingly.

The above description of the present invention is for illustrative purposes only, and those of ordinary skill in the art to which the present invention pertains will be able to understand that other specific forms can be easily modified without changing the technical spirit or essential features of the present invention will be. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as being distributed may also be implemented in a combined form.

The scope of the present invention is indicated by the claims to be described later, and all changes or modified forms derived from the meaning and scope of the claims and the concept of equivalents thereof should be construed as being included in the scope of the present invention.

100: electrode
200: conductive cover
210: slope
220: weft
221: conductive fiber yarn
222: non-conductive fiber yarn
2211: first area
2212: second area
10: sensor structure
20: electronic module
30: substrate
40: interface

Claims (10)

In the sensor structure in which an electrode and a conductive cover are sequentially stacked,
The conductive cover is made of a fabric in which a twisted yarn of a conductive fiber yarn and a non-conductive fiber yarn is woven, the sensor structure. The method of claim 1,
The electrode is a comb-shaped electrode in which a plurality of comb-shaped fingers are arranged to be spaced apart from each other, the sensor structure. The method of claim 1,
The conductive fiber yarn includes a first region containing a carbon-based material, the sensor structure. The method of claim 3,
The carbon-based material is one selected from the group consisting of carbon nanotubes, fullerenes, graphene, graphite, carbon fibers, carbon black, and combinations of two or more of them, a sensor structure. The method of claim 3,
The conductive fiber yarn further comprises a second region comprising a thermoplastic resin, the sensor structure. The method of claim 5,
The ratio of the cross-sectional area of the second region to the cross-sectional area of the conductive fiber yarn is 0.01 to 0.9. The sensor structure according to any one of claims 1 to 6;
Electronic module; And
Containing, a smart insole; a substrate including a wire connecting the sensor structure and the electronic module. The method of claim 7,
The sensor structure is located in the toe area, the ball area and the heel area of the substrate, smart insole. The method of claim 7,
The wiring is,
It first extends in a radial direction toward the outside of the insole from the sensor structure,
The smart insole is connected to the electronic module by extending a second circumferential direction along the circumference of the insole to form a port and an interface in an inner arch region of the substrate. The method of claim 7,
The electronic module includes a communication module and a battery,
The communication module communicates with an external sensor attached to the wearer's body,
The external sensor is attached to a joint portion of the wearer, a plurality of bone portions connected to the joint portion, or a combination thereof, a smart insole.

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