KR20210012821A - Electronic device including flexible printed circuit board - Google Patents

Abstract

According to various embodiments, an electronic device comprises: a housing structure; a first printed circuit board disposed in an inner space of the housing structure; a second printed circuit board disposed so as to be spaced apart from the first printed circuit board; and a flexible printed circuit board including a connection part for electrically connecting the first printed circuit board and the second printed circuit board, and connected to the second printed circuit board, and a coupling part extending from the connection part and including a bent part capable of being at least partially bent. The flexible printed circuit board includes: a dielectric substrate; a first conductive layer disposed on a first surface of the dielectric substrate; a first cover layer disposed on the first conductive layer; a second conductive layer disposed on a second surface opposite to the first surface of the dielectric substrate; a second cover layer disposed on the second conductive layer; a plurality of first conductive terminals exposed through the first cover layer and electrically connected to the first conductive layer, in the connection part; and a plurality of second conductive terminals exposed through the first cover layer, electrically connected to the first conductive layer, and disposed at a greater distance from the bent part than the plurality of first conductive terminals, in the connection part. In the bent part, the first conductive layer can include a disconnected portion electrically disconnected. The plurality of second conductive terminals can include, in the connection part, the flexible circuit board electrically connected to the second conductive layer through at least one conductive via formed through the dielectric substrate. Other various embodiments can be possible.

Description

Electronic device including a flexible circuit board TECHNICAL FIELD

Various embodiments of the present invention relate to electronic devices including flexible circuit boards.

The electronic device may include at least one electronic component disposed in the internal space. The at least one electronic component may be disposed to perform a corresponding function at a corresponding position in an internal space of the electronic device, and may be generally electrically connected to a first printed circuit board (eg, a main board). The plurality of electronic components may also be mounted on a second printed circuit board (sub board or flexible board) and may be spaced apart from the first printed circuit board. In this case, the first printed circuit board and the second printed circuit board may be electrically connected through a flexible printed circuit board (FPCB) having a predetermined length.

The first printed circuit board and the second printed circuit board may have different arrangement conditions for each other. For example, when the first printed circuit board and the second printed circuit board are spaced apart from each other, but the spaced apart is considerably narrow or the surrounding electronic components or housings are disposed nearby, the flexible circuit board may at least partially cause excessive bends. In addition, such excessive bent portions may cause a problem in that the internal wiring structure of the flexible circuit board is disconnected. Moreover, when the spacing between printed circuit boards is widened to prevent disconnection, a problem may occur that counteracts the slimming of the electronic device. In addition, in order to be connected with the conductive terminals of the first printed circuit board and/or the second printed circuit board, when bending around the conductive terminals of the flexible circuit board exposed to the outside is required, the possibility of disconnection of the electrical wiring is more It can grow.

Various embodiments of the present disclosure may provide an electronic device including a flexible circuit board.

Various embodiments of the present disclosure may provide an electronic device including a flexible circuit board that can help to secure an efficient mounting space of an electronic component by having a flexible structure corresponding to a curved area.

Various embodiments of the present disclosure may provide an electronic device including a flexible circuit board configured to prevent a disconnection problem that may occur during a connection process to a printed circuit board.

According to various embodiments, an electronic device includes a housing structure, a first printed circuit board disposed in an inner space of the housing structure, a second printed circuit board spaced apart from the first printed circuit board, and the first printed circuit board. A flexible circuit board comprising a connection part electrically connecting a circuit board and the second printed circuit board and connected to the second printed circuit board, and a connection part extending from the connection part and including a bent part at least partially bent. , A dielectric substrate, a first conductive layer disposed on a first surface of the dielectric substrate, a first coverlay disposed on the first conductive layer, and a second surface opposite to the first surface of the dielectric substrate A second conductive layer disposed, a second coverlay disposed on the second conductive layer, and a first plurality of first plurality of layers exposed through the first coverlay at the connection portion and electrically connected to the first conductive layer At the conductive terminals and the connection part, a second plurality of electrodes exposed through the first cover layer, electrically connected to the first conductive layer, and disposed at a distance from the bent part farther from the first plurality of conductive terminals. Conductive terminals include, in the bent portion, a disconnection portion in which the first conductive layer is electrically disconnected, and the second plurality of conductive terminals include at least one conductive via formed at the connection portion through the dielectric substrate. It may include a flexible circuit board electrically connected to the second conductive layer through.

According to various embodiments, a flexible circuit board including a connection portion connected to a printed circuit board, and a connection portion extending from the connection portion and including a bent portion at least partially bendable, comprises: a dielectric substrate; and a first surface of the dielectric substrate A first conductive layer disposed on the first conductive layer, a first cover layer disposed on the first conductive layer, a second conductive layer disposed on a second surface opposite to the first surface of the dielectric substrate, and the second conductive layer A second cover layer disposed on a layer; at the connection portion, a first plurality of conductive terminals exposed through the first cover layer and electrically connected to the first conductive layer, and at the connection portion, the first cover A second plurality of conductive terminals exposed through a ray, electrically connected to the first conductive layer, and disposed at a distance from the bent portion farther than the first plurality of conductive terminals, and in the bent portion, the second plurality of conductive terminals One conductive layer includes a disconnection portion electrically disconnected, and the second plurality of conductive terminals may be electrically connected to the second conductive layer through at least one conductive via formed through the dielectric substrate at the connection portion. .

The flexible circuit board according to various embodiments of the present invention has a flexible structure applied to correspond to a region where bending is required, so that disconnection of electrical wiring that may occur when the flexible circuit board is installed can be prevented, and the structure of the flexible circuit board Through the change, it is possible to induce efficient mounting of electronic components in the internal space of the electronic device.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.
1 is a perspective view illustrating a front surface of an electronic device according to various embodiments of the present disclosure.
FIG. 2 is a perspective view illustrating a rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure.
3 is a diagram schematically illustrating an arrangement configuration of a flexible circuit board in an internal space of an electronic device according to various embodiments of the present disclosure.
4 is a partial cross-sectional view of an electronic device as viewed from line A-A' of FIG. 3 according to various embodiments of the present disclosure.
5 is a plan view illustrating a state in which a flexible circuit board according to various embodiments of the present disclosure is electrically connected to a second printed circuit board.
6A is a partial cross-sectional view of a flexible circuit board viewed from line B-B' of FIG. 5 according to various embodiments of the present disclosure.
6B is a view viewed from above of a first connection part and a connection part of a flexible circuit board according to various embodiments of the present disclosure.
7 is a partial cross-sectional view of a flexible circuit board according to various embodiments of the present disclosure.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable antenna module (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiment of the present document is not limited to devices to be described later.

Various embodiments of the present document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the corresponding embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or a plurality of the items unless clearly indicated otherwise in a related context. In this document, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A, Each of the phrases such as "B, or at least one of C" may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. "First", "Second" , Or terms such as "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and the corresponding components are not limited in other aspects (eg, importance or order).

1 is a perspective view illustrating a front surface of an electronic device 100 according to various embodiments of the present disclosure. FIG. 2 is a perspective view illustrating a rear surface of the electronic device 100 of FIG. 1 according to various embodiments of the present disclosure.

Referring to FIGS. 1 and 2, the electronic device 100 includes a front cover 111, a rear cover 112 facing in a direction opposite to the front cover 111, and between the front cover 111 and the rear cover 112. It may include a housing structure 110 including a side member 113 surrounding the inner space (eg, the inner space 1001 of FIG. 3 ). According to an embodiment, the front cover 111 may be formed by a glass plate including various coating layers or a polymer plate. According to one embodiment, the back cover 112 is, for example, coated or colored glass, ceramic, polymer, metal (for example, aluminum, stainless steel (STS), or magnesium), or at least two of the above materials. It can be formed by a combination of. According to an embodiment, the side member 113 is coupled to the front cover 111 and the rear cover 112 and may be formed in a side bezel structure including a metal and/or a polymer. In another embodiment, the rear cover 112 and the side member 113 may be integrally formed and include the same material (eg, a metal material such as aluminum or magnesium).

According to various embodiments, the electronic device 100 is disposed to be visible from the outside through at least a part of the front cover 111 in an inner space of the electronic device 100 (eg, the inner space 1001 of FIG. 3 ). The display 101 may be included. According to an embodiment, the display 101 may be exposed through, for example, a substantial portion of the front cover 111. In another embodiment, the display 101 may be exposed through substantially the entire area of the front cover 111. In another embodiment, the edge of the display 101 may be formed to have substantially the same shape as an adjacent outer shape of the front cover 111. In another embodiment, in order to expand the area to which the display 101 is exposed, the distance between the outer periphery of the display 101 and the outer periphery of the front cover 111 may be formed substantially the same. In another embodiment, in the display 101, a recess or opening is formed in a part of the screen display area, and in the inner space of the electronic device 100, the above-described recess or opening is aligned. At least one of the components may be disposed. In another embodiment, the electronic device 100 includes at least one electronic device disposed on a rear surface of a screen display area (eg, active area) of the display 101 in an internal space (eg, the interior space 1001 of FIG. 3 ). It can also contain parts. According to an embodiment, the at least one electronic component may include at least one of at least one sensor module, at least one camera module, an audio module, a fingerprint sensor, and a light emitting device. In another embodiment, the display 101 includes a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or an electromagnetic induction panel detecting a magnetic field type electronic pen (eg, a stylus pen). E.g. digitizer) and may be combined or placed adjacent to each other. According to an embodiment, the electronic device 100 may include at least one audio module 1131 (eg, a speaker device) disposed to be exposed to the outside through at least a portion of the side member 113.

According to various embodiments, the electronic device 100 may include at least one sensor module 103 disposed through at least a portion of the front cover 111 in an inner space (eg, the inner space 1001 of FIG. 3 ). I can. According to an embodiment, the at least one sensor module 103 is a proximity sensor module, a fingerprint sensor module, a gesture sensor module, a gyro sensor module, an atmospheric pressure sensor module, a temperature sensor module, a humidity sensor module, a magnetic sensor module, an acceleration sensor module. , A grip sensor module, an illuminance sensor module, an infrared sensor module, a color sensor module, an ultrasonic sensor module, an iris sensor module, a biometric sensor module, or a time of flight (TOF) sensor module.

3 is a diagram schematically illustrating an arrangement configuration of a flexible circuit board 300 in an internal space 1001 of an electronic device 100 according to various embodiments of the present disclosure. 4 is a partial cross-sectional view of the electronic device 100 viewed from line A-A' of FIG. 3 according to various embodiments of the present disclosure.

3 and 4, the electronic device 100 may include a first printed circuit board 130 disposed in the inner space 1001. According to an embodiment, the first printed circuit board 130 may include the main printed circuit board of the electronic device 100. According to an embodiment, the electronic device 100 may include at least one camera module 102 for detecting an external environment through the front cover 111. According to an embodiment, at least one camera module 102 may be disposed in the internal space 1001 of the electronic device 100 through the second printed circuit board 120. According to an embodiment, the electronic device 100 is a flexible printed circuit board 300 (FPCB) disposed to electrically connect the second printed circuit board 120 to the first printed circuit board 130. ) (For example, a flexible printed circuit board).

According to various embodiments, the flexible circuit board 300 is disposed at one end based on the connection part C2 of a predetermined length, and is connected to the first connection part C1 and the other end electrically connected to the second printed circuit board 120. It may include a second connection portion (C3) disposed and electrically connected to the first printed circuit board (130). According to an embodiment, the flexible circuit board 300 may include electrical wiring through conductive layers (eg, copper foil layers) disposed through a plurality of insulating layers.

According to various embodiments, the electronic device 100 may include a support member 114 disposed in the inner space 1001. According to an embodiment, the support member 114 may extend from the housing structure 110 or may be structurally coupled to the housing structure 110. According to an embodiment, the second printed circuit board 120 may be disposed to be supported at least partially through the support member 114 in the inner space 1001 of the electronic device 100. For example, the second printed circuit board 120 may be disposed at a position at least partially overlapping with the front cover 111 when viewing the display 101 from above through the support member 114. According to an embodiment, the flexible circuit board 300 may be electrically connected to the second printed circuit board 120 through the electrical connector 370 disposed on the first connection part C1. In this case, the flexible circuit board 300 may be provided with a supporting force through a rigid reinforcing layer 342 (for example, a stiffner) disposed at a position corresponding to the electrical connector 370 at the first connection part C1. have.

According to various embodiments, the flexible circuit board 300 is a first printed circuit board through a connection part C2 of a predetermined length extending from the first connection part C1 and through a second connection part C3 disposed at the other end. By being connected to 130, it can be electrically connected. According to an embodiment, the connection part C2 is a mounting of peripheral electronic components such as the display 101 disposed in the path from the internal space 1001 of the electronic device 100 to the first printed circuit board 130 It may include at least one bent portion (F1, F2) that is deformed (bent) in consideration of space. According to an embodiment, the degree of curvature of at least one of the bent portions F1 and F2 may be determined by a separation distance between the second printed circuit board 120 and the display 101. For example, as the separation distance between the second printed circuit board 120 and the display 101 decreases, the connection portion C2 may be deformed into an excessively curved state, which may lead to disconnection of electrical wiring.

In order to prevent disconnection of electrical wiring due to bending of at least one bent portion F1, F2 of the connection portion C2, which is excessively bent, the flexible circuit board 300 according to the exemplary embodiment of the present invention It may include a flexible structure arranged in (F1, F2).

Hereinafter, the structure of the flexible circuit board 300 will be described in detail.

5 is a plan view illustrating a state in which the flexible circuit board 300 is electrically connected to the second printed circuit board 120 according to various embodiments of the present disclosure. 6A is a partial cross-sectional view of a flexible circuit board 300 viewed from line B-B' of FIG. 5 according to various embodiments of the present disclosure. 6B is a view viewed from above of the first connection part C1 and the connection part C2 of the flexible circuit board 300 according to various embodiments of the present disclosure.

5 to 6B, the flexible circuit board 300 includes a first connection part C1 and a first connection part C1 electrically connected to the second printed circuit board 120 on which the camera module 102 is mounted. ) And a second connection part C3 which is disposed at an end of the connection part C2 and is electrically connected to the first printed circuit board 120. According to an embodiment, the flexible circuit board 300 may include at least one bent portion F1 and F2 that is at least partially disposed on the connection portion C2.

According to various embodiments, the flexible circuit board 300 may have a multilayer structure stacked through at least one insulating layer. According to an embodiment, the flexible circuit board 300 may be formed in a multilayer structure of two layers, three layers, or three or more layers. According to an embodiment, the flexible circuit board 300 may include a dielectric substrate 310 (eg, a polypropylene glycol (PPG) substrate or a polyimide substrate). According to an embodiment, the dielectric substrate 310 includes a first conductive layer 320 disposed on the first surface 3101 and a second conductive layer 330 disposed on a second surface facing in a direction opposite to the first surface. It may include. According to an embodiment, the flexible circuit board 300 includes a first cover layer 3201 stacked on the first conductive layer 320 and a second cover layer stacked on the second conductive layer 330 ( 3301) may be included.

According to various embodiments, the flexible circuit board 300 may include a first plurality of conductive terminals 350 exposed through the first coverlay 3201 at the first connection part C1. According to an embodiment, the flexible circuit board 300 is exposed through the first coverlay 3201 at the first connection part C1, is electrically connected to the first conductive layer 320, and is It may include a second plurality of conductive terminals 360 disposed at a greater distance from the first bent portion F1 than the conductive terminals 350 of FIG. Each of the plurality of conductive terminals 350 and 360 may be exposed to the outside through a separate conductive pad. According to one embodiment, the flexible circuit board 300 includes a first conductive layer in the first bent portion F1. The 320 may include a first disconnection portion 321 that is electrically disconnected. According to an embodiment, the first cutting portion 321 may include a conductive layer removal region from which the first conductive layer 320 is omitted. According to an embodiment, the first disconnection portion 321 may at least partially overlap the first connection portion C1 when viewing the flexible circuit board 300 from above. According to an embodiment, the cut length d of the first cut portion 321 formed in the direction from the first connection part C1 to the connection part C2 may be determined by the degree of curvature of the first bent part F1. have. For example, the cut length d of the first cut-out part 321 may increase as the degree of curvature (eg, a bend angle) of the first bent part F1 increases. According to an embodiment, the second plurality of conductive terminals 360 may be configured as a second conductive layer through at least one first conductive via 311 disposed on the dielectric substrate 310 in the first connection part C1. It may be electrically connected to 330.

According to various embodiments, the flexible circuit board 300 is disposed on the first coverlay 3201 at the first connection part C1, the first plurality of conductive terminals 350 and/or the second plurality of conductivity An electrical connector 370 electrically connected to the terminals 360 may be included. According to an embodiment, when the electrical connector 370 is connected to the second printed circuit board 120, the second plurality of conductive terminals 360 pass through at least one first conductive via 311, 1 It can be electrically connected to the first printed circuit board (for example, the first printed circuit board 130 in FIG. 3) using the second conductive layer 330 that extends seamlessly from the connection part C1 to the connection part C2. have.

According to various embodiments, the flexible circuit board 300 includes a photoresist layer 341 (eg, a photo solder resist (PSR) layer) disposed on the second coverlay 3301 in the first connection part C1 can do. According to one embodiment, the photoresist layer 341 may be used as a rigid reinforcing member for rigidly stiffening the corresponding region of the flexible circuit board 300 (eg, the first connection portion C1). According to one embodiment, the ductile The circuit board 300 may include a stiffner 342 that is stacked on the photoresist layer 341. According to an embodiment, the stiffness reinforcing layer 342 is formed of the flexible circuit board 300. 1 It may include an epoxy made of a non-conductive material that is formed to have rigidity when it is applied to the connection part C1 and then cured or solidified In another embodiment, the rigid reinforcing layer 342 is a flexible circuit board 300 ) May include a pre-cured epoxy bonded to the first connection portion C1 of the). According to one embodiment, the rigid reinforcing layer 342 is a dielectric material attached to the first connection portion C1 of the flexible circuit board 300 It may also include a tape member having the rigidity of the material.

According to an exemplary embodiment of the present invention, in the flexible circuit board 300, the first conductive layer 320 in which the most stress is concentrated, which is close to the bending direction (direction ①), is omitted in the first bent portion F1. The first conductive layer 320 can be prevented from being disconnected due to the bend of the bent part F1 by being formed as the cut-off part 321, and in the first bent part F1, the improved bending property of the connection part C2 is Can be provided. According to various embodiments, the first plurality of conductive terminals 350 may be electrically disconnected from the first conductive layer 320, and the second plurality of conductive terminals 360 may be provided with at least one first conductive via. Electrical connection may be replaced by being connected to the second conductive layer 330 through 311.

According to various embodiments, at least one conductive terminal among the first plurality of conductive terminals 350 electrically disconnected through the first disconnection portion 321 is at the first connection portion C1 and the first conductive layer 320 It may be electrically connected to at least one conductive terminal of the second plurality of conductive terminals 360 through the terminal. In this case, at least one of the first plurality of conductive terminals 350, which is electrically connected to at least one of the second plurality of conductive terminals 360 through the first conductive layer 320, is It may include a ground terminal and/or a signal transmission terminal.

According to various embodiments, the first plurality of conductive terminals 350 or the second plurality of conductive terminals 360 are formed from the first plurality of conductive terminals 350 by the first cutting portion 321. At least one conductive via 311 formed in a direction away from the bent part F1 (for example, between the first plurality of conductive terminals 350 and the second plurality of conductive terminals 360 in the first connection part C1) ) May be electrically connected to the second conductive layer 330. The first connection part C1 and the second connection part (for example, the second connection part C3 of FIG. 5) may be electrically connected using the second conductive layer 330 of the first bent part F1.

According to various embodiments, as shown in FIG. 6B, the flexible circuit board 300 may further include at least one grounding terminal disposed to the left and right of the first plurality of conductive terminals 350. According to an embodiment, such at least one grounding terminal may also be disposed to include the disconnection portion 321.

7 is a partial cross-sectional view of a flexible circuit board 300 according to various embodiments of the present disclosure.

In describing the flexible circuit board 300 of FIG. 7, the same reference numerals are assigned to components that are substantially the same as those of the flexible circuit board 300 of FIG. 6A, and detailed descriptions thereof may be omitted. .

Referring to FIG. 7, the flexible circuit board 300 may include a pair of bent portions F1 and F2 spaced apart from each other in the connection portion C2. According to an embodiment, the flexible circuit board 300 may include a first disconnection portion 321 in which at least a part of the first conductive layer 320 is omitted from the first bent portion F1. According to an embodiment, the flexible circuit board 300 may include a second cutting portion 331 in which at least a portion of the second conductive layer 330 is omitted from the second bent portion F2. According to an embodiment, the first cutting portion 321 is a first conductive layer in which stress is most concentrated according to the deformation in which the connection portion C2 is bent in the downward direction (the direction ①) in the first bent portion F1 ( 320) may be omitted. In the second cut-off part 331, in the second bent part F2, the second conductive layer 330 in which the stress is most concentrated according to the deformation in which the connection part C2 is bent in the upward direction (the direction ②) is omitted. Can be formed. According to an embodiment, the flexible circuit board 300 is formed on the dielectric substrate 310 between the first bent portion F1 and the second bent portion F2 of the connection portion C2, and the first conductive layer 320 ) And at least one second conductive via 312 for electrically connecting the second conductive layer 330 to each other. Accordingly, the electrical signal from the first electrical connector 370 is the second plurality of conductive terminals 360, at least one first conductive via 311, the second conductive layer 330, and at least one second It may be transferred to the first printed circuit board (eg, the first printed circuit board 130 of FIG. 3) through the conductive via 312 and again using the first conductive layer 320.

Although not shown, the flexible circuit board 300 helps to improve the bendability through the configuration of the cutout portions in which a part of the conductive layer is removed, as described above, even if a bent portion that is bent two or more times in the connection portion C2 is formed. I can receive it.

According to various embodiments, an electronic device (eg, the electronic device 100 of FIG. 3) includes a housing structure (eg, the housing structure 110 of FIG. 3 ), and an inner space of the housing structure (eg, the electronic device 100 of FIG. 3 ). A first printed circuit board (eg, the first printed circuit board 130 in FIG. 3) disposed in the inner space 1001 and a second printed circuit board disposed spaced apart from the first printed circuit board (eg, FIG. The second printed circuit board 120 of 3 and a connection part electrically connecting the first printed circuit board and the second printed circuit board, and connected to the second printed circuit board (e.g., the first connection part in FIG. 6A) (C1)), and a connection portion (e.g., a connection portion (C2) of FIG. 6A) including a bent portion (e.g., the first bent portion F1 of FIG. 6A) extending from the connection portion and capable of being at least partially bent As a circuit board (for example, the flexible circuit board 300 in FIG. 6A), a dielectric substrate (for example, the dielectric substrate 310 in FIG. 6A) and a first surface of the dielectric substrate (for example, the first surface in FIG. 6A) 3101)), a first conductive layer (for example, the first conductive layer 320 of FIG. 6A), and a first coverlay disposed on the first conductive layer (for example, the first coverlay 3201 of FIG. 6A). ), and a second conductive layer (eg, the second conductive layer 330 of FIG. 6A) disposed on a second surface of the dielectric substrate opposite to the first surface (eg, 3102 of FIG. 6A), A second cover layer disposed on the second conductive layer (for example, the second cover layer 3301 in FIG. 6A), and at the connection portion, exposed through the first cover layer, and electrically connected to the first conductive layer. The first plurality of conductive terminals to be connected (for example, the first plurality of conductive terminals 350 in FIG. 6A) and the connection part are exposed through the first coverlay, and are electrically connected to the first conductive layer. And a second plurality of conductive terminals (eg, a second plurality of conductive terminals 360 of FIG. 6A) disposed at a distance from the bent portion more than the first plurality of conductive terminals, and at the bent portion , The first conductive layer is electrically disconnected from the disconnection portion (eg, the first disconnection portion 321 of FIG. 6A) And the second plurality of conductive terminals may include a flexible circuit board electrically connected to the second conductive layer through at least one conductive via formed through the dielectric substrate at the connection portion.

According to various embodiments, in the connection part, an electrical connector disposed on the first coverlay and electrically connected to the first plurality of conductive terminals and/or the second plurality of conductive terminals (for example, FIG. 6A It may include an electrical connector 370 of.

According to various embodiments, the connection part may include a photoresist layer (PSR layer) (eg, photoresist layer 341 of FIG. 6A) disposed on the second cover ray.

According to various embodiments, the connection portion may further include a stiffner (eg, a stiffness reinforcing layer 342 of FIG. 6A) disposed on the second coverlay.

According to various embodiments, the rigid reinforcing layer may include an epoxy or tape member that is cured after being applied to the second cover layer, or disposed in a cured state on the second cover layer.

According to various embodiments, the disconnection portion may at least partially overlap the connection portion when the flexible circuit board is viewed from above.

According to various embodiments, the cut-off portion may include a region in which the first conductive layer is omitted.

According to various embodiments of the present disclosure, the length of the cutoff portion formed from the connection portion toward the connection portion may be determined by a degree of curvature of the bent portion.

According to various embodiments, at least one conductive terminal among the first plurality of conductive terminals is electrically connected to at least one conductive terminal of the second plurality of conductive terminals through the first conductive layer at the connection part. Can be connected.

According to various embodiments, at least one conductive terminal of the second plurality of conductive terminals electrically connected to at least one conductive terminal of the first plurality of conductive terminals may include a grounding terminal.

According to various embodiments, at least one sensor module (eg, the camera module 102 of FIG. 3) disposed on the second printed circuit board may be further included.

According to various embodiments, the at least one sensor module may include a proximity sensor module, a fingerprint sensor module, a gesture sensor module, a gyro sensor module, an atmospheric pressure sensor module, a temperature sensor module, a humidity sensor module, a magnetic sensor module, an acceleration sensor module, It may include at least one of a grip sensor module, an illuminance sensor module, an infrared sensor module, a color sensor module, an ultrasonic sensor module, an iris sensor module, a biometric sensor module, a camera module, or a time of flight (TOF) sensor module.

According to various embodiments, the first printed circuit board may include the main board of the electronic device.

According to various embodiments, the connecting portion may be bent in a direction having an inner radius of curvature of the cut-off portion in the bent portion.

According to various embodiments, the internal space may include a display (eg, the display 101 of FIG. 3) disposed to be visible from the outside through at least a part of the housing structure.

According to various embodiments, a connection part (for example, a first connection part C1 in FIG. 6A) connected to a printed circuit board (for example, the second printed circuit board 120 in FIG. 6A), and extending from the connection part, at least A flexible circuit board (e.g., a flexible circuit board 300 of FIG. 6A) including a connection portion (e.g., a connection portion C2 of FIG. 6A) including a partially bendable bend (e.g., the first bent portion F1 in FIG. 6A) )) is a dielectric substrate (e.g., the dielectric substrate 310 of FIG. 6A), and a first conductive layer (e.g., a first conductive layer disposed on the first surface of the dielectric substrate (eg, the first surface 3101 of FIG. The first conductive layer 320 of FIG. 6A and a first coverlay disposed on the first conductive layer (for example, the first coverlay 3201 of FIG. 6A, and the first surface of the dielectric substrate are opposite to each other. A second conductive layer (for example, the second conductive layer 330 in FIG. 6A) disposed on the second surface (eg, (3102) in FIG. 6A) and a second coverlay disposed on the second conductive layer ( Example: The second coverlay 3301 of FIG. 6A), and at the connection part, a first plurality of conductive terminals exposed through the first coverlay and electrically connected to the first conductive layer (eg, FIG. The first plurality of conductive terminals 350 of 6a and the connection part are exposed through the first cover layer and are electrically connected to the first conductive layer, and the bent part is more than that of the first plurality of conductive terminals. And a second plurality of conductive terminals (for example, the second plurality of conductive terminals 360 of FIG. 6A) disposed at a distance from the bent portion, and in the bent portion, a disconnection portion in which the first conductive layer is electrically disconnected ( Example: Including the first disconnection portion 321 of FIG. 6A, and the second plurality of conductive terminals are connected to the second conductive layer through at least one conductive via formed through the dielectric substrate at the connection portion. Can be electrically connected.

According to various embodiments, the disconnection portion may at least partially overlap the connection portion when the flexible circuit board is viewed from above.

According to various embodiments, the cut-off portion may include a region in which the first conductive layer is omitted.

According to various embodiments of the present disclosure, the length of the cutoff portion formed from the connection portion toward the connection portion may be determined by a degree of curvature of the bent portion.

According to various embodiments, the connecting portion may be bent in a direction having an inner radius of curvature of the cut-off portion in the bent portion.

In addition, the embodiments of the present invention disclosed in the present specification and drawings are only intended to provide specific examples in order to easily explain the technical content according to the embodiments of the present invention and to aid understanding of the embodiments of the present invention, and the scope of the embodiments of the present invention It is not intended to be limited. Therefore, the scope of various embodiments of the present invention should be interpreted as being included in the scope of various embodiments of the present invention in addition to the embodiments disclosed herein, all changes or modified forms derived based on the technical idea of various embodiments of the present invention. .

100: electronic device 101: display
102: camera module 120: second printed circuit board
130: first printed circuit board 300: flexible circuit board
310: dielectric substrate 311, 312: conductive blank
320: first conductive layer 321: disconnection
330: second conductive layer 350: first plurality of conductive terminals
360: second plurality of conductive terminals

Claims (20)

In the electronic device,
Housing structure;
A first printed circuit board disposed in the inner space of the housing structure;
A second printed circuit board spaced apart from the first printed circuit board; And
And a connection part electrically connecting the first printed circuit board and the second printed circuit board and connected to the second printed circuit board, and a connection part extending from the connection part and including a bent part at least partially bent. As a flexible circuit board,
A dielectric substrate;
A first conductive layer disposed on the first surface of the dielectric substrate;
A first coverlay disposed on the first conductive layer;
A second conductive layer disposed on a second surface of the dielectric substrate opposite to the first surface;
A second coverlay disposed on the second conductive layer;
A first plurality of conductive terminals exposed through the first cover layer at the connection part and electrically connected to the first conductive layer; And
In the connection part, a second plurality of conductive terminals exposed through the first coverlay, electrically connected to the first conductive layer, and disposed at a distance from the bent part more than the first plurality of conductive terminals and,
In the bent portion, the first conductive layer includes a disconnection portion electrically disconnected,
The second plurality of conductive terminals includes a flexible circuit board electrically connected to the second conductive layer through at least one conductive via formed through the dielectric substrate at the connection portion.
The method of claim 1,
And an electrical connector disposed on the first coverlay at the connection portion and electrically connected to the first plurality of conductive terminals and/or the second plurality of conductive terminals.
The method of claim 1,
In the connection part, an electronic device including a photoresist layer (PSR layer) disposed on the second cover ray.
The method of claim 1,
The electronic device further comprises a stiffner disposed on the second coverlay at the connection part.
The method of claim 4,
The stiffness reinforcing layer is applied to the second cover layer and then cured, or the electronic device including an epoxy or tape member disposed on the second cover layer in a cured state.
The method of claim 1,
The disconnection portion is at least partially overlapped with the connection portion when the flexible circuit board is viewed from above.
The method of claim 1,
The electronic device includes a region in which the first conductive layer is omitted.
The method of claim 1,
The length of the cutoff portion formed from the connection portion toward the connection portion is determined by a degree of curvature of the bent portion.
The method of claim 1,
At least one conductive terminal of the first plurality of conductive terminals is electrically connected to at least one conductive terminal of the second plurality of conductive terminals through the first conductive layer at the connection part.
The method of claim 9,
At least one conductive terminal of the second plurality of conductive terminals electrically connected to at least one conductive terminal of the first plurality of conductive terminals includes a grounding terminal.
The method of claim 1,
The electronic device further comprises at least one sensor module disposed on the second printed circuit board.
The method of claim 11,
The at least one sensor module may include a proximity sensor module, a fingerprint sensor module, a gesture sensor module, a gyro sensor module, an atmospheric pressure sensor module, a temperature sensor module, a humidity sensor module, a magnetic sensor module, an acceleration sensor module, a grip sensor module, an illuminance sensor. An electronic device comprising at least one of a module, an infrared sensor module, a color sensor module, an ultrasonic sensor module, an iris sensor module, a biometric sensor module, a camera module, or a time of flight (TOF) sensor module.
The method of claim 1,
The first printed circuit board is an electronic device including a main board of the electronic device.
The method of claim 1,
The connecting portion is an electronic device in which the disconnection portion is bent in a direction having an inner radius of curvature in the bent portion.
The method of claim 1,
An electronic device including a display disposed to be visible from the outside through at least a portion of the housing structure in the inner space.
In the flexible circuit board,
A flexible circuit board comprising a connection portion connected to a printed circuit board, and a connection portion extending from the connection portion and including a bent portion at least partially bent,
A dielectric substrate;
A first conductive layer disposed on the first surface of the dielectric substrate;
A first coverlay disposed on the first conductive layer;
A second conductive layer disposed on a second surface of the dielectric substrate opposite to the first surface;
A second coverlay disposed on the second conductive layer;
A first plurality of conductive terminals exposed through the first cover layer at the connection part and electrically connected to the first conductive layer; And
In the connection part, a second plurality of conductive terminals exposed through the first coverlay, electrically connected to the first conductive layer, and disposed at a distance from the bent part more than the first plurality of conductive terminals and,
In the bent portion, the first conductive layer includes a disconnection portion electrically disconnected,
The second plurality of conductive terminals are electrically connected to the second conductive layer through at least one conductive via formed through the dielectric substrate at the connection portion.
The method of claim 16,
The disconnection portion is a flexible circuit board that at least partially overlaps with the connection portion when the flexible circuit board is viewed from above.
The method of claim 16,
The cut-off portion is a flexible circuit board including a region in which the first conductive layer is omitted.
The method of claim 16,
The length of the cut portion formed from the connection portion toward the connection portion is determined by a degree of curvature of the bent portion.
The method of claim 1,
The connection part is a flexible circuit board in which the disconnection part is bent in a direction having an inner radius of curvature in the bent part.

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