KR20210006835A - Electronic device including antenna module - Google Patents

Abstract

According to various embodiments of the present disclosure, provided is a portable communication device, which comprises: a display forming a front surface of a portable communication device; a plate forming a rear surface of the portable communication device and including a non-conductive material, wherein the plate includes a first surface toward outside the portable communication device and a second surface toward inside the portable communication device; a first antenna module attached to or positioned adjacent to a first area of the second surface; a second antenna module attached to or positioned adjacent to a second area of the second surface; and a conductive member formed or attached to a third area between the first area and the second area of the second surface. Among radio waves radiated from the first antenna module, some radio waves directed to the second antenna module through the plate may be at least partially blocked by the conductive member.

Description

Electronic device including an antenna module {ELECTRONIC DEVICE INCLUDING ANTENNA MODULE}

Various embodiments of the present disclosure relate to an electronic device including an antenna module.

With the development of digital technology, electronic devices are being provided in various forms such as a smart phone, a tablet personal computer (PC), or a personal digital assistant (PDA). Electronic devices are also being developed in a form that can be worn by a user to improve portability and accessibility of the user. With the development of wireless communication technology, electronic devices (eg, electronic devices for communication) are commonly used in daily life, and the use of contents is increasing exponentially.

High-frequency wireless communication technology is being developed, and in order to properly operate in a mobile environment, which is a wireless communication system such as satellite communication, broadcasting, mobile communication, or terrestrial communication, a phased array antenna of high directivity (e.g., antenna array )) can be used. The electronic device may utilize a beam forming system that processes a transmission or reception signal so that energy radiated from a phased array antenna is concentrated in a specific direction in space.

The electronic device may include a housing that forms an exterior, and at least a portion of the housing may be formed of, for example, an insulator or dielectric such as glass or polymer. At least a portion of the housing is a waveguide through which electromagnetic waves formed by the phased array antenna flow, and may operate as a path of a medium through which electromagnetic waves flow using, for example, total reflection properties. Antenna radiation characteristics include, for example, an antenna radiation pattern or a beam pattern, which is a directional function representing the relative distribution of power radiated from an antenna element, and a polarization state of electromagnetic waves radiated from the antenna element ( Or antenna polarization). When at least a part of the housing operates as a waveguide, the antenna radiation characteristic of the phased array antenna may be different from the antenna radiation characteristic corresponding to the selected or specified frequency (e.g., distortion), resulting in a decrease in antenna performance. . When the electromagnetic wave formed by the phased array antenna flows through at least a portion of the housing, this may have an electrical effect that deteriorates its performance on other electrical elements (eg, at least one antenna provided separately from the phased array antenna). .

Various embodiments of the present invention include an electrical effect that a structure such as a housing has on the antenna radiation characteristics (eg, a beam pattern or a polarization state of an electromagnetic wave) of a phased array antenna, or an electromagnetic wave of a phased array antenna through the structure. An electronic device including an antenna module may be provided to reduce an electrical effect on the device.

A portable communication device according to various embodiments of the present disclosure includes a display forming a front surface of the portable communication device, a plate forming a rear surface of the portable communication device and including a non-conductive material, wherein the plate is external to the portable communication device. Including a first side facing toward and a second side facing toward the inside, a first antenna module attached to a first area of the second side or positioned adjacent to the first area, and a second area of the second side A second antenna module attached or positioned adjacent to the second region, and a conductive member formed or attached to a third region between the first region and the second region of the second surface, and the first Some of the radio waves radiated from the antenna module toward the second antenna module through the plate may be at least partially blocked by the conductive member.

A portable communication device according to various embodiments of the present disclosure includes a display forming a front surface of the portable communication device, a plate forming a rear surface of the portable communication device and including a non-conductive material, wherein the plate is external to the portable communication device. Including a first side facing toward and a second side facing toward the inside, an antenna formed or attached to the first area of the second side, or located adjacent to the first area, and formed on the second area of the second side Or an attached component, and a conductive member formed or attached to a third region between the first region and the second region of the second side, and to the component through the plate during radio waves radiated from the antenna. Some propagation directed toward may be at least partially blocked by the conductive member.

According to various embodiments of the present disclosure, an electric effect of a structure such as a housing on an antenna radiation characteristic (eg, a beam pattern or a polarization state of an electromagnetic wave) of an antenna module may be reduced, thereby securing antenna performance for an antenna module. According to various embodiments of the present disclosure, an electromagnetic wave formed in an antenna module may reduce an electrical influence on other electrical elements through the structure, thereby securing the performance of the other electrical elements.

In addition, effects that can be obtained or predicted by various embodiments of the present invention will be disclosed directly or implicitly in the detailed description of the embodiments of the present invention. For example, various effects predicted according to various embodiments of the present invention will be disclosed within the detailed description to be described later.

1 is a block diagram of an electronic device in a network environment according to example embodiments.
2 is a block diagram of an electronic device in a network environment including a plurality of cellular networks, according to various embodiments.
3A is a front perspective view of a mobile electronic device according to an exemplary embodiment.
3B is a perspective view of a rear surface of the electronic device of FIG. 3A according to an exemplary embodiment.
4 is an exploded perspective view of an apparatus according to an exemplary embodiment.
5A and 5B are diagrams illustrating an electronic device including an antenna module according to an exemplary embodiment.
6 is a view of the electronic device of FIG. 5A as viewed from above a rear plate according to an exemplary embodiment.
7A and 7B are perspective views of an antenna module according to an exemplary embodiment.
8 is a perspective view of the electronic device of FIG. 5A according to an exemplary embodiment.
9 is a cross-sectional view of the electronic device of FIG. 8 according to an embodiment.
10 is a perspective view of the electronic device of FIG. 5A according to various embodiments.
11 and 12 illustrate radiation patterns of horizontal polarization radiated from an antenna module in the electronic device of FIG. 9 according to an exemplary embodiment.
13 and 14 illustrate radiation patterns of vertical polarization radiated from an antenna module when a conductive layer is omitted in the electronic device of FIG. 9, for example.
15 and 16 illustrate beam patterns of horizontal polarization radiated from an antenna module in the electronic device of FIG. 9 according to an exemplary embodiment.
17 and 18 illustrate beam patterns regarding vertical polarization radiated from an antenna module in the example in which the conductive layer is omitted in the electronic device of FIG. 9.
19 is a cross-sectional view of an electronic device including an antenna module according to various embodiments of the present disclosure.
20 is a perspective view of the electronic device of FIG. 19, for example.
21 illustrates a beam pattern of an electromagnetic wave radiated from an antenna module in the electronic device of FIG. 19 or 20 according to an exemplary embodiment.
FIG. 22 shows a beam pattern of an electromagnetic wave radiated from an antenna module in an example in which a conductive layer is omitted in the electronic device of FIG. 19 or 20, for example.
FIG. 23 is a graph showing antenna gains on a frequency distribution of the electronic device of FIG. 19 or 20 and the embodiment of FIG. 22 according to an embodiment.
24 to 26 are cross-sectional views taken along the line II of FIG. 6.
27 illustrates an electronic device including an antenna module mounted on a mid frame according to an embodiment.
28 is a cross-sectional view of the electronic device cut along the line II-II in FIG. 27.
FIG. 29 illustrates an electronic device including a conductive member of a mid frame and a conductive layer attached to a rear frame according to an embodiment.
30 is a cross-sectional view of the electronic device cut along the line III-III in FIG. 29.

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings.

1 is a block diagram of an electronic device 101 in a network environment, according to example embodiments.

Referring to FIG. 1, in a network environment 199, the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network), or a second network 199 It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) Can be included. In some embodiments, at least one of these components (for example, the display device 160 or the camera module 180) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to implement at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 may transfer commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132 The command or data stored in the volatile memory 132 may be processed, and result data may be stored in the nonvolatile memory 134. According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and an auxiliary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or together. , A sensor hub processor, or a communication processor). Additionally or alternatively, the coprocessor 123 may be set to use less power than the main processor 121 or to be specialized for a designated function. The secondary processor 123 may be implemented separately from the main processor 121 or as a part thereof.

The coprocessor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, an application is executed). ) While in the state, together with the main processor 121, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the functions or states related to. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component of the electronic device 101 (for example, the processor 120 or the sensor module 176 ). The data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.

The input device 150 may receive commands or data to be used for components of the electronic device 101 (eg, the processor 120) from outside the electronic device 101 (eg, a user). The input device 150 may include, for example, a microphone, a mouse, or a keyboard.

The sound output device 155 may output an sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 160 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.

The audio module 170 may convert sound into an electric signal or, conversely, convert an electric signal into sound. According to an embodiment, the audio module 170 obtains sound through the input device 150, the sound output device 155, or an external electronic device (for example, an external electronic device directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102) (for example, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101, or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 176 is, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used to connect the electronic device 101 directly or wirelessly to an external electronic device (eg, the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert, for example, an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or motor sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture a still image and a video. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, electronic device 102, electronic device 104, or server 108). It is possible to support establishment and communication through the established communication channel. The communication module 190 operates independently of the processor 120 (eg, an application processor), and may include one or more communication processors that support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : A LAN (local area network) communication module, or a power line communication module) may be included. Among these communication modules, a corresponding communication module is a first network 198 (for example, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (for example, a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (for example, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into a single component (eg, a single chip), or may be implemented as a plurality of separate components (eg, a plurality). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 in a communication network such as the first network 198 or the second network 199. The electronic device 101 can be checked and authenticated.

The antenna module 197 may transmit, for example, a signal or power to the outside (eg, an external electronic device) or receive from the outside. According to an embodiment, the antenna module 197 may include one or more antennas, from which at least one suitable for a communication method used in a communication network such as the first network 198 or the second network 199 An antenna of, for example, may be selected by the communication module 190. The signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.

At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and signals ( E.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the electronic devices 102 and 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service by itself. In addition or in addition, it is possible to request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 101. The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable antenna module (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the exemplary embodiment of the present document is not limited to the above-described devices.

Various embodiments of the present document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the corresponding embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or a plurality of the items unless clearly indicated otherwise in a related context. In this document, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A Each of the phrases such as "at least one of B, or C" may include all possible combinations of items listed together in the corresponding phrase among the phrases. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the component from other corresponding components, and the components may be separated from other aspects (eg, importance or Order) is not limited. Some (eg, a first) component is referred to as “coupled” or “connected” to another (eg, a second) component, with or without the terms "functionally" or "communicatively". When mentioned, it means that any of the above components may be connected to the other components directly (eg by wire), wirelessly, or via a third component.

The term "module" used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits. The module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, program 140) including instructions. For example, the processor (eg, the processor 120) of the device (eg, the electronic device 101) may call and execute at least one command among one or more commands stored from a storage medium. This makes it possible for the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here,'non-transient' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term refers to the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.

According to an embodiment, a method according to various embodiments disclosed in this document may be provided in a computer program product. Computer program products can be traded between sellers and buyers as commodities. Computer program products are distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play StoreTM) or two user devices ( It can be distributed (e.g., downloaded or uploaded) directly between, e.g. smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium that can be read by a device such as a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, a module or program) of the above-described components may include a singular number or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be sequentially, parallel, repeatedly, or heuristically executed, or one or more of the operations may be executed in a different order or omitted. , Or one or more other actions may be added.

2 is a block diagram 200 of an electronic device 101 in a network environment including a plurality of cellular networks, according to various embodiments.

Referring to FIG. 2, the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit 222, a second RFIC 224, and a third RFIC. 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna ( 248. The electronic device 101 may further include a processor 120 and a memory 130. The second network 199 includes a first cellular network 292 and a second cellular network. 294). According to another embodiment, the electronic device 101 may further include at least one of the components shown in FIG. 1, and the second network 199 may include at least one other network. According to an embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, The first RFFE 232 and the second RFFE 234 may form at least a part of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 is omitted or the third RFIC ( 226).

The first communication processor 212 may support establishment of a communication channel of a band to be used for wireless communication with the first cellular network 292 and communication of a legacy network through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second cellular network 294, and a 5G network through the established communication channel. Can support communication. According to various embodiments, the second cellular network 294 may be a 5G network defined by 3GPP. Additionally, according to an embodiment, the first communication processor 212 or the second communication processor 214 corresponds to another designated band (eg, about 6 GHz or less) among the bands to be used for wireless communication with the second cellular network 294. It is possible to establish a communication channel to communicate with, and support 5G network communication through the established communication channel. According to an embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 is a processor 120, a coprocessor (eg, the coprocessor 123 in FIG. 1), or a communication module (eg, FIG. 1 ). It may be formed in a single chip or a single package with the communication module 190). According to an embodiment, the first communication processor 212 and the second communication processor 214 are directly or indirectly connected to each other by an interface (not shown), and data or control signals in either or both directions Can offer or receive.

The first RFIC 222, when transmitting, transmits a baseband signal generated by the first communication processor 212 to about 700 MHz used for the first cellular network 292 (eg, a legacy network). It can be converted into a 3GHz radio frequency (RF) signal. Upon reception, an RF signal is obtained from the first cellular network 292 (eg, a legacy network) through an antenna (eg, the first antenna module 242), and an RFFE (eg, the first RFFE 232) is It can be preprocessed through. The first RFIC 222 may convert the preprocessed RF signal into a baseband signal so that it can be processed by the first communication processor 212.

The second RFIC 224, when transmitting, uses the baseband signal generated by the first communication processor 212 or the second communication processor 214 to the second cellular network 294 (for example, a 5G network). It can be converted into an RF signal (hereinafter, referred to as 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less). Upon reception, a 5G Sub6 RF signal is obtained from the second cellular network 294 (eg, 5G network) through an antenna (eg, the second antenna module 244), and RFFE (eg, the second RFFE 234). ) Can be pretreated. The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by a corresponding one of the first communication processor 212 or the second communication processor 214.

The third RFIC 226 transmits the baseband signal generated by the second communication processor 214 to the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (eg, 5G network). It can be converted into an RF signal (hereinafter, 5G Above6 RF signal). Upon reception, a 5G Above6 RF signal may be obtained from the second cellular network 294 (eg, 5G network) through an antenna (eg, antenna 248) and preprocessed through the third RFFE 236. The third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214. According to an embodiment, the third RFFE 236 may be formed as a part of the third RFIC 226.

According to an embodiment, the electronic device 101 may include the fourth RFIC 228 separately or at least as a part of the third RFIC 226. In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal of an intermediate frequency band (eg, about 9 GHz to about 11 GHz) (hereinafter, IF (intermediate frequency) ) Signal), the IF signal may be transferred to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second cellular network 294 (eg, 5G network) through an antenna (eg, antenna 248) and converted into an IF signal by the third RFIC 226. have. The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.

According to an embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package. According to an embodiment, at least one of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to an embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be disposed on a first substrate (eg, a main PCB). In this case, the third RFIC 226 is located in a partial area (eg, lower surface) of the second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is disposed in another area (eg, upper surface). Is disposed, a third antenna module 246 may be formed. By arranging the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This can reduce loss (eg, attenuation) of a signal in a high-frequency band (eg, about 6 GHz to about 60 GHz) used for communication in a 5G network, for example. Accordingly, the electronic device 101 may improve the quality or speed of communication with the second cellular network 294 (eg, a 5G network).

According to an embodiment, the antenna 248 may be formed as an antenna array including a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC 226 may include, for example, a plurality of phase shifters 238 corresponding to a plurality of antenna elements as part of the third RFFE 236. During transmission, each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. . Upon reception, each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal received from the outside through a corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second cellular network 294 (e.g., a 5G network) can be operated independently from the first cellular network 292 (e.g., a legacy network) (e.g., Stand-Alone (SA)) or connected and operated ( Example: Non-Stand Alone (NSA)). For example, a 5G network may have only an access network (eg, 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (eg, next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (eg, the Internet) under the control of the core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information (eg, LTE protocol information) for communication with a legacy network or protocol information (eg, New Radio (NR) protocol information) for communication with a 5G network is stored in the memory 130, and other components (eg, processor information) 120, the first communication processor 212, or the second communication processor 214.

3A is a perspective view illustrating an electronic device 300 according to one of various embodiments disclosed in this document. FIG. 3B is a perspective view illustrating the electronic device 300 of FIG. 3A viewed from the rear side.

3A and 3B, the electronic device 300 according to various embodiments includes a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and a first surface 310A. A housing 310 including a side surface (or sidewall) 310C surrounding the space between the second surfaces 310B may be included. In another embodiment (not shown), the housing may refer to a structure forming some of the first surface 310A, the second surface 310B, and the side surfaces 310C of FIGS. 3A and 3B.

According to various embodiments, at least a portion of the first surface 310A may be formed by a substantially transparent front plate 302 (eg, a glass plate including various coating layers, or a polymer plate). According to an embodiment, the front plate 302 may include a curved portion that is bent toward the rear plate 311 from the first surface 310A at at least one side edge portion and extends seamlessly.

According to various embodiments, the second surface 310B may be formed by a substantially opaque rear plate 311. The back plate 311 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be. According to an embodiment, the rear plate 311 may include a curved portion seamlessly extending from the second surface 310B toward the front plate 302 at at least one end thereof.

According to various embodiments, the side surface 310C is coupled to the front plate 302 and the rear plate 311 and includes a metal and/or polymer side bezel structure (or “side member or side wall”) 318 ) Can be formed by. In some embodiments, the back plate 311 and the side bezel structure 318 are formed integrally and may include the same material (eg, a metallic material such as aluminum).

According to various embodiments, the electronic device 300 includes at least one of a display 301, an audio module 303, 314, a sensor module, a camera module 305, a key input device 317, and a connector hole 308. It may include more than one. In some embodiments, the electronic device 300 may omit at least one of the components (for example, the key input device 317) or additionally include other components. For example, the electronic device 300 may include a sensor module (not shown). For example, in the area provided by the front plate 302, a sensor such as a proximity sensor or an illuminance sensor may be integrated into the display 301 or disposed in a position adjacent to the display 301. In some embodiments, the electronic device 300 may further include a light-emitting element, and the light-emitting element may be disposed in a position adjacent to the display 301 within an area provided by the front plate 302. The light emitting device may provide state information of the electronic device 300 in the form of light, for example. In another embodiment, the light emitting device may provide a light source that is interlocked with the operation of the camera module 305, for example. The light-emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

Display 301 may be exposed through a significant portion of front plate 302, for example. In some embodiments, the edge of the display 301 may be formed substantially the same as the adjacent outer shape (eg, curved surface) of the front plate 302. In another embodiment (not shown), in order to expand the area to which the display 301 is exposed, the distance between the outer periphery of the display 301 and the outer periphery of the front plate 302 may be formed substantially the same. In another embodiment (not shown), a recess or opening is formed in a part of the screen display area of the display 301, and another electronic component aligned with the recess or the opening, for example, , A camera module 305, a proximity sensor, or an illuminance sensor, not shown.

In another embodiment (not shown), at least one of the camera modules 312 and 313, the fingerprint sensor 316, and the flash 306 may be included on the rear surface of the screen display area of the display 301. In another embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. Can be placed.

The audio modules 303 and 314 may include a microphone hall and a speaker hole. In the microphone hall, a microphone for acquiring external sound may be disposed inside, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. In some embodiments, the speaker hole and the microphone hole may be implemented as one hole 303, or a speaker may be included without a speaker hole (eg, piezo speaker). The speaker hole may include an external speaker hole and a call receiver hole 314.

The electronic device 300 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state by including a sensor module (not shown). The sensor module may include, for example, a proximity sensor disposed on the first side 310A of the housing 310, a fingerprint sensor integrated in or disposed adjacent to the display 301, and/or the manufacturing of the housing 310. A biometric sensor (eg, HRM sensor) disposed on the second side 310B may be further included. The electronic device 300 is a sensor module not shown, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor or an illuminance sensor may be further included.

The camera modules 305, 312, 313, and 306 include a first camera device 305 disposed on the first surface 310A of the electronic device 300, and a second camera device disposed on the second surface 310B. (312, 313), and/or flash 306. The camera devices 305, 312, 313 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 306 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300.

The key input device 317 may be disposed on the side surface 310C of the housing 310. In another embodiment, the electronic device 300 may not include some or all of the above-mentioned key input devices 317, and the key input device 317 that is not included is a soft key or the like on the display 301. It can be implemented in a form. In some embodiments, the key input device may include at least a portion of the fingerprint sensor 316 disposed on the second side 310B of the housing 310.

The connector hole 308 may accommodate a connector for transmitting and receiving power and/or data with an external electronic device, and/or a connector for transmitting and receiving an audio signal with an external electronic device. For example, the connector hole 308 may include a USB connector or an earphone jack.

Referring to FIG. 4, an electronic device 400 (eg, the electronic device 300 of FIG. 3A or 3B) according to an embodiment includes a side bezel structure 410 (eg, a side bezel structure 318 of FIG. 3A ). ), a first support member 411 (e.g., a bracket), a front plate 420 (e.g., the front plate 302 of Fig. 3A), a display 430 (e.g., the display 301 of Fig. 3A) ), a printed circuit board 440, a battery 450, a second support member 460 (eg, a rear case), an antenna 470, or a rear plate 480 (eg, a rear plate 311 in FIG. 3B) ) Can be included. In some embodiments, the electronic device 400 may omit at least one of the constituent elements (eg, the first support member 411 or the second support member 460) or may additionally include other constituent elements. . At least one of the constituent elements of the electronic device 400 may be the same as or similar to at least one of the constituent elements of the electronic device 300 of FIG. 3A or 3B, and redundant descriptions will be omitted below.

The first support member 411 may be disposed inside the electronic device 400 to be connected to the side bezel structure 410 or may be integrally formed with the side bezel structure 410. The first support member 411 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. In the first support member 411, the display 430 may be coupled to one surface and the printed circuit board 440 may be coupled to the other surface. A processor, a memory, and/or an interface may be mounted on the printed circuit board 440. The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 400 to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 450 is a device for supplying power to at least one component of the electronic device 400, for example, a non-rechargeable primary cell, or a rechargeable secondary cell, or a fuel cell It may include. At least a portion of the battery 450 may be disposed substantially on the same plane as the printed circuit board 440, for example. The battery 450 may be integrally disposed within the electronic device 400 or may be disposed detachably from the electronic device 400.

The antenna 470 may be disposed between the rear plate 480 and the battery 450 in one embodiment. The antenna 470 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 470 may perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a side bezel structure 410 and/or a part of the first support member 411 or a combination thereof.

5A and 5B are diagrams illustrating an electronic device including an antenna module according to an exemplary embodiment. 6 is a view of the electronic device of FIG. 5A viewed from above a rear plate according to an exemplary embodiment. 7A and 7B are perspective views of an antenna module according to an exemplary embodiment.

Referring to FIG. 5A, the electronic device 500 (eg, the electronic device 101 of FIG. 1 or 2, the electronic device 300 of FIG. 3A, or the electronic device 400 of FIG. 4) has a side bezel structure 510 ), a rear plate 580, an antenna module (or antenna structure) 610, a second printed circuit board 540, or a conductive layer (or a conductive film) 620a. can do.

At least one of the components of the electronic device 500 may be the same as or similar to at least one of the components of the electronic device 300 of FIG. 3A or 3B or the electronic device 400 of FIG. 4, and overlap Description will be omitted below.

5A, 5B and 6, in one embodiment, a side bezel structure 510 (eg, a side bezel structure 318 of FIG. 3A or a side bezel structure 410 of FIG. 4) is a first side portion 511 ), a second side portion 512, a third side portion 513, and a fourth side portion 514. The first side portion 511 and the second side portion 512 may be disposed opposite and parallel to each other. The third side portion 513 and the fourth side portion 514 may be disposed opposite and parallel to each other. The third side portion 513 is perpendicular to the first side portion 511 (or the second side portion 512), and one end (not shown) of the first side portion 511 and one end portion of the second side portion 512 ( Not shown) can be connected. The fourth side portion 514 is perpendicular to the first side portion 511 (or the second side portion 512), and the other end (not shown) of the first side portion 511 and the other end of the second side portion 512 ( Not shown) can be connected.

The first side portion 511 may form a first side (not shown) of the electronic device 500, and the second side portion 512 is a first side of the electronic device 500 disposed on the opposite side of the first side. 2 side (not shown) can be formed. The third side portion 513 may form a third side (not shown) of the electronic device 500, and the fourth side portion 514 is a third side of the electronic device 500 disposed on the opposite side of the third side. 4 side (not shown) can be formed.

For example, when viewed from the top of the rear plate 580, the first side and the second side have a first length extending in the y-axis direction, and the third side and the fourth side have the second side extending in the x-axis direction. It may have a second length shorter than one length. A connection portion (not shown) between the first side portion 511 and the third side portion 513, a connection portion (not shown) between the first side portion 511 and the fourth side portion 514, the second side portion 512 and the second 3 A connection portion (not shown) between the side portions 513, and/or a connection portion (not shown) between the second side portion 512 and the fourth side portion 514 is formed as a corner in a curved shape. I can.

5A, 5B, 7A and 7B, in one embodiment, the antenna module 610 (for example, the second antenna module 244 or the third antenna module 246 of FIG. 2) is a first printed circuit board 611, a first wireless communication circuit 730, a power management circuit 740, or a first connector 750.

The first printed circuit board 611 may include, for example, a first surface 611a and a second surface 611b disposed opposite to the first surface 611a. According to an embodiment, the first side 611a faces the rear plate 580, the second side 611b faces the second printed circuit board 540, and the first printed circuit board 611 faces the rear surface. It may be disposed between the plate 580 and the second printed circuit board 540. The first printed circuit board 611 may be disposed parallel to the second printed circuit board 540. For example, the first printed circuit board 611 may be directly soldered to the second printed circuit board 612. As another example, the first printed circuit board 611 and the second printed circuit board 612 are interposers (not shown) disposed between the first printed circuit board 611 and the second printed circuit board 612 Can be bound to each other by For another example, the first printed circuit board 611 is disposed on one surface of the second printed circuit board 612 and may be connected by a separate cable.

Referring to FIG. 6, in an embodiment, the antenna module 610 may be disposed closer to the third side portion 513 than the fourth side portion 514. According to an embodiment, the antenna module 610 may be disposed closer to the second side portion 512 than to the first side portion 511. For example, the antenna module 610 may be disposed near a corner between the second side portion 512 and the third side portion 513. Referring to FIG. 5, in one embodiment, the antenna module 610 is located near the opening 513a formed in the third side portion 513 (eg, near the memory card connector (eg, SIM card connector) 595 of FIG. 9 ). Can be placed.

According to various embodiments (not shown), the antenna module 610 may be disposed in various other locations. For example, the antenna module 610 may be disposed closer to the fourth side portion 514 than the third side portion 513. For example, the antenna module 610 may be disposed closer to the first side portion 511 than the second side portion 512. According to various embodiments (not shown), the antenna module 610 is located near the corner between the first side portion 511 and the third side portion 513, and the corner between the first side portion 511 and the fourth side portion 514 It may be disposed near or near a corner between the second side portion 512 and the fourth side portion 514.

According to an embodiment, the first printed circuit board 611 may include one or more antennas. For example, one or more antennas may be implemented as at least some of a plurality of conductive layers (eg, a plurality of conductive pattern layers or a plurality of circuit layers) included in the first printed circuit board 611. According to an embodiment, the one or more antennas may include at least one of the first antenna array 710 and the second antenna array 720. The first antenna array 710 or the second antenna array 720 may include a structure in which a plurality of antenna elements of substantially the same shape are arranged or a structure in which a plurality of antenna elements are arranged at regular intervals. According to various embodiments, the location or number of antenna arrays is not limited to the example illustrated in FIGS. 5A, 5B, or 7A, but may be various. According to various embodiments, the positions or number of antenna elements included in the first antenna array 710 or the second antenna array 720 are not limited to the examples shown in FIGS. 5A, 5B, or 7A, but may be various. According to other embodiments, the second antenna array 720 (eg, a dipole antenna) may be omitted from the antenna module 610. For example, the antenna module 610 may include only the first antenna array 710.

The plurality of antenna elements included in the first antenna array 710 or the second antenna array 720 are, for example, patch antennas, loop antennas, or dipole antennas. ) Can be included. According to an embodiment, a plurality of antenna elements 711, 712, 713, and 714 included in the first antenna array 710 may be patch antennas, and a plurality of antennas included in the second antenna array 720 The elements 721, 722, 723, and 724 may be dipole antennas. According to an embodiment, a plurality of antenna elements included in the first antenna array 710 and/or the second antenna array 720 may be electrically connected to the first wireless communication circuit 730.

According to an embodiment, the first antenna array 710 and/or the second antenna array 720 is disposed closer to the first surface 611a than the second surface 611b, or on the first surface 611a. Can be placed. 5A, 5B, 6, and 7A, in one embodiment, when viewed from above of the back plate 580 (e.g., the back plate 311 in FIG. 3B, or the back plate 480 in FIG. 4), A plurality of antenna elements 711, 712, 713, 714 of the first antenna array 710, or a plurality of antenna elements 721, 722, 723, 724 of the first antenna array 720 are a first side portion It may be arranged in a direction from 511 to the second side portion 512 (eg, an x-axis direction). According to an embodiment, when viewed from the top of the rear plate 520, the second antenna array 720 may be disposed closer to the third side portion 513 than the first antenna array 710.

7A and 7B, in an embodiment, the first wireless communication circuit 730 may be disposed on the second surface 611b of the first printed circuit board 611 through a conductive bonding member such as solder, , It may be electrically connected to the first printed circuit board 611. The first wireless communication circuit 730 may be electrically connected to the first antenna array 710 and the second antenna array 720 through wires included in the first printed circuit board 611. For example, the first wireless communication circuit 730 may include a circuit element (eg, RFIC) mounted on the first printed circuit board 611.

According to an embodiment, the first wireless communication circuit 730 is at least some of the frequency bands (about: about 100 GHz) from about 6 GHz to about 100 GHz through the first antenna array 710 and/or the second antenna array 720. The first signal may be transmitted and/or received in a frequency band between 24 GHz and about 100 GHz, a frequency band between about 24 GHz and about 30 GHz, or a frequency band between about 37 GHz and about 40 GHz. According to an embodiment, the first wireless communication circuit 730 may up-convert or down-convert a frequency of a signal transmitted or received in wireless communication. 5A, 5B, and 7B, for example, the first wireless communication circuit 730 is the second wireless communication circuit 5022 of the second wireless communication module 502 disposed on the second printed circuit board 540. ), and up-converting the received IF signal to a radio frequency (RF) signal. For example, the first wireless communication circuit 730 down-converts the RF signal (eg, millimeter wave) received through the first antenna array 710 or the second antenna array 720 into an IF signal. And, the IF signal may be provided to the second wireless communication circuit 5022 disposed on the second printed circuit board 540.

According to an embodiment, at least some of the plurality of conductive layers included in the first printed circuit board 611 is a transmission line between the one or more antennas 710 and 720 and the first wireless communication circuit 730 (e.g. : RF line) can be included. A transmission line is a structure for transmitting frequency signals (e.g., voltage, current), and can be referred to as a conductor system that uses the transmission of waves by electrical parameters (e.g., resistance per unit length, inductance, conductance, or capacitance). . For example, at least some of the plurality of conductive layers included in the first printed circuit board 611 may include one or more antennas 710 between the one or more antennas 710 and 720 and the first wireless communication circuit 730. 720) may include an electrical path (or wiring) for supplying power.

According to an embodiment, the first connector 750 may be disposed or coupled to the second surface 611b of the first printed circuit board 611 through a conductive bonding member such as solder, and the first printed circuit board ( 611) can be electrically connected. The first connector 750 is disposed on the first wireless communication circuit 730, the power management circuit 740, or the first printed circuit board 611 through at least one wire included in the first printed circuit board 611 It can be electrically connected to a variety of other elements. The electronic device 500 may include, for example, a second connector (not shown) mounted on the second printed circuit board 540. According to an embodiment, the electronic device 500 is electrically connected to a flexible printed circuit board (FPCB) or a coaxial cable that electrically connects the first connector 750 and the second connector. It may include a path (not shown).

Referring to FIG. 5A, in an embodiment, the electronic device 500 is a second wireless communication module 502 electrically connected to the second printed circuit board 540 (eg, the wireless communication module 192 of FIG. 1 ). , A processor 504 (eg, the processor 120 of FIG. 1), a memory 505 (eg, the memory 130 of FIG. 1), a power management module 506 (eg, the power management module 188 of FIG. 1 ). )) or at least one antenna 507 may be included.

The second printed circuit board 540 may include, for example, a third surface 540a and a fourth surface (not shown) facing in opposite directions to each other. In one embodiment, referring to FIGS. 5A, 5B, 7A, and 7B, the second side 611b of the first printed circuit board 611 is formed with the third side 540a of the second printed circuit board 540. You can face it. The first wireless communication module 501, the second wireless communication module 502, the processor 504, the power management module 506, or the memory 505 is printed through a conductive bonding member (not shown) such as solder. It may be disposed or coupled to the circuit board 540.

According to an embodiment, at least one antenna 507 (for example, the first antenna module 242 or the second antenna module 244 of FIG. 2) is connected to the second printed circuit board 540 through various electrical paths. Can be electrically connected. According to some embodiments, at least one antenna 507 is disposed on the second printed circuit board 540 or implemented as a conductive pattern (eg, microstrip) included in the second printed circuit board 540 It could be. According to various embodiments, the at least one antenna 507 is disposed in a housing (not shown) forming the exterior of the electronic device 500, or at least a portion of the housing (eg, at least a portion of the side bezel structure 510) Can be implemented as

According to an embodiment, the processor 504 may execute software to control at least one component (eg, hardware or software component) of the electronic device 500 electrically connected to the processor 504, Various data processing or operations can be performed. According to an embodiment, the processor 504 may process commands or data stored in the memory 505. For example, the processor 504 may transmit and/or receive a signal through the first wireless communication module 501 or the second wireless communication module 502. The processor 504 may write and read data in the memory 505. The processor 504 may perform functions of a protocol stack required by a communication standard. A part of the second wireless communication module 502 and/or the processor 504 may be referred to as a communication processor (CP).

According to an embodiment, the second wireless communication module 502 may perform functions for transmitting or receiving a signal through a wireless channel. For example, the second wireless communication module 502 may perform a conversion function between a baseband signal and/or a bit string according to a physical layer standard of the system. For example, when transmitting data, the second wireless communication module 502 may generate complex symbols by encoding and modulating a transmission bit stream. When receiving data, the second wireless communication module 502 may demodulate and decode the baseband signal to restore the received bit stream. The second wireless communication module 502 may up-convert the RF signal, transmit through at least one antenna, and down-convert the RF signal received through the at least one antenna into a baseband signal. For example, the second wireless communication module 502 may include elements such as a transmission filter, a reception filter, an amplifier, a mixer, an oscillator, a digital to analog converter (DAC), and an analog to digital converter (ADC).

According to an embodiment, the second wireless communication module 502 may include a plurality of wireless communication circuits to process signals of different frequency bands. For example, the second wireless communication module 502 may include a plurality of wireless communication circuits to support a plurality of different wireless access technologies. For example, different wireless access technologies may include Bluetooth low energy (BLE), wireless fidelity (WiFi), WiFi Gigabyte (WiGig), or a cellular network (eg, long term evolution (LET)). In addition, different frequency bands may include a super high frequency (SHF) (eg, about 2.5 GHz or about 5 GHz) band, and a millimeter wave (eg, about 60 GHz) band.

According to an embodiment, the second wireless communication module 502 includes a baseband processor, or at least one communication circuit (eg, an intermediate frequency integrated circuit (IFIC) or a radio frequency integrated circuit (RFIC)). Can include. The second wireless communication module 502 may include, for example, a baseband processor separate from the processor 504 (eg, an application processor (AP)).

According to an embodiment, the first wireless communication module 501 may include a first wireless communication circuit 730. The second wireless communication module 502 may include at least one of the second wireless communication circuit 5022 and the third wireless communication circuit 5032. The electronic device 500 may further include one or more interfaces for supporting inter-chip communication between the second wireless communication module 502 and the processor 504. The processor 504 and the first wireless communication circuit 730, the second wireless communication circuit 5022, or the third wireless communication circuit 5023 uses the inter-chip interface (for example, an inter processor communication channel) to provide data (or Signal) can be transmitted or received.

According to an embodiment, the second wireless communication circuit 5022 or the third wireless communication circuit 5023 may provide an interface for performing communication with other entities. . The second wireless communication circuit 5022 may support wireless communication regarding, for example, a second network (eg, the second cellular network 294 of FIG. 2) utilizing the antenna module 610. The third wireless communication circuit 5023 may support wireless communication regarding a first network (eg, the first cellular network 292 of FIG. 2) using, for example, at least one antenna 507. According to an embodiment, the first network may include a 4th generation (4G) network, and the second network may include a 5th generation (5G) network. The 4G network may support, for example, a long term evolution (LTE) protocol specified in 3GPP. The 5G network may support, for example, a new radio (NR) protocol specified in 3GPP. According to various embodiments, the first network may be related to wireless fidelity (WiFi) or global positioning system (GPS).

According to an embodiment, the third wireless communication circuit 5023 receives a high-frequency signal (hereinafter, referred to as a radio frequency (RF) signal) for a first network (eg, 4G network) through at least one antenna 507 Then, the received RF signal may be modulated (eg, down-converted) into a low-frequency signal (hereinafter, referred to as a baseband signal) and transmitted to the processor 504. The third wireless communication circuit 5023 receives a baseband signal related to the first network from the processor 504, modulates the received baseband signal into an RF signal (eg, up-converts) at least one antenna 507. It can be transmitted externally through According to an embodiment, the first wireless communication circuit 730 of the first wireless communication module 501 may include an RFIC 720. According to various embodiments, when modulating an RF signal into a baseband signal or modulating a baseband signal into an RF signal, an input of a local oscillator (LO) may be utilized.

According to an embodiment, the second wireless communication circuit 5022 may receive a baseband signal related to the second network from the processor 504. The second wireless communication circuit 5022 up-converts the baseband signal to an IF signal using an input (hereinafter, LO signal) of a local oscillator (LO), and transmits the IF signal to the antenna module 610. I can. The antenna module 610 may receive an IF signal from the second wireless communication circuit 5022. The antenna module 610 up-converts the IF signal to an RF signal using the LO signal, and transmits the RF signal to the outside through one or more antennas 710 and 720 included in the antenna module 610.

According to an embodiment, the antenna module 610 may receive an RF signal through one or more antennas 710 and 720. The antenna module 610 may down-convert the RF signal to an IF signal by using the LO signal and transmit the IF signal to the second wireless communication circuit 5022. The second wireless communication circuit 5022 may receive an IF signal from the antenna module 610. The second wireless communication circuit 5022 may down-convert the IF signal to a baseband signal using the LO signal and transmit the baseband signal to the processor 504. According to an embodiment, the second wireless communication circuit 55022 may include an IFIC. The second wireless communication circuit 5022 may transmit and/or receive a second signal in a frequency band between about 5 GHz and about 15 GHz.

According to an embodiment, the second wireless communication circuit 5022 or the first wireless communication circuit 730 may include a plurality of transmission/reception paths. For example, in the second wireless communication circuit 5022 or the first wireless communication circuit 730, energy radiated from a plurality of antenna elements of the first antenna array 710 or the second antenna array 720 is transmitted in space. It may include a beam forming system that processes a transmission or reception signal to be focused in a specific direction. The beamforming system may receive a signal with a stronger intensity in a desired direction, transmit a signal in a desired direction, or prevent a signal from an unwanted direction. The beamforming system may adjust the shape and direction of a beam using a difference in amplitude or phase of a carrier signal in an RF band. According to an embodiment, the second wireless communication circuit 5022 or the first wireless communication circuit 730 may control each antenna element to have a phase difference. For example, the second wireless communication circuit 5022 or the first wireless communication circuit 730 may include a first electrical path electrically connected to a first point on a first antenna element, and a second point on a second antenna element. It may include a second electrical path that is electrically connected. The processor 504, the second wireless communication circuit 5022, or the first wireless communication circuit 730 calculates a phase difference between the first signal at the first point and the second signal at the second point. Can provide. According to various embodiments (not shown), the electronic device 500 includes one or more phase converters disposed on the antenna module 610 (or the first wireless communication circuit 730) or the first printed circuit board 540 (phase shifters) may be included. One or more phase converters may adjust the phase of the plurality of antenna elements of the first antenna array 710 or the second antenna array 720.

For example, the beamforming system includes a plurality of antenna elements 711, 712, 713, 714 of the first antenna array 710 or a plurality of antenna elements 721, 722 of the second antenna array 720, A beam pattern (eg, beam width, beam direction) may be formed by adjusting the phase of the current supplied to the 723 and 724. According to an embodiment, by the beamforming system, the plurality of antenna elements 711, 712, 713, and 714 of the first antenna array 710 are formed on the first surface of the first printed circuit board 611 ( A beam that radiates relatively high energy in a first direction (eg, +z axis direction) toward 611a) may be formed. According to an embodiment, by the beamforming system, the plurality of antenna elements 721, 722, 723, and 724 of the second antenna array 720 are orthogonal to the first direction, toward the third side portion 513. It is possible to form a beam in which relatively large amount of energy is radiated in the second direction (eg, +y axis direction) toward.

According to an embodiment, the memory 505 may store codebook information related to beamforming. The processor 504, the first wireless communication circuit 730, or the second wireless communication circuit 5022 is based on the codebook information through a plurality of antenna elements of the first antenna array 710 or the second antenna array 720. Multiple beams can be efficiently controlled (eg, allocated or arranged).

According to various embodiments, the second wireless communication module 502 including the second wireless communication circuit 5022 and/or the third wireless communication circuit 5023 may form one module with the processor 504. . For example, the second wireless communication module 502 may be integrally formed with the processor 504. According to some embodiments, the second wireless communication circuit 5022 and/or the third wireless communication circuit 5023 may be disposed in one chip or may be formed in the form of an independent chip.

According to an embodiment, the processor 504 and one wireless communication circuit (for example, the second wireless communication circuit 5022) may be integrally formed in one chip (SoC chip), and the other wireless communication circuit (Example: the third wireless communication module 5023) may be formed in the form of an independent chip.

According to an embodiment, the power management module 506 is supplied to the electronic device 500 by using power from a battery electrically connected to the second printed circuit board 540 (eg, the battery 189 in FIG. 1 ). You can manage the power that is being used.

Referring to FIG. 7B, in an embodiment, the power management circuit 740 may be disposed or coupled to the second surface 611b of the first printed circuit board 611 through a conductive bonding member such as solder. 1 It may be electrically connected to the printed circuit board 611. The power management circuit 740 is a first wireless communication circuit 730 through at least one wire included in the first printed circuit board 611, the connector 750, or a variety of devices disposed on the first printed circuit board 611 It can be electrically connected to other elements (eg, passive elements) (not shown). The power management circuit 740 receives power from the power management module 506 of FIG. 5A through an electrical path such as an FPCB or a coaxial cable, and manages the power supplied to the antenna module 610 using the received power. I can. According to an embodiment, the power management circuit 740 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

According to some embodiments, the power management circuit 740 may be omitted from the antenna module 610. For example, the power management module 506 may manage power supplied to the antenna module 610.

According to an embodiment, the back plate 580 may be formed of an insulator or dielectric material such as glass or polymer. According to an embodiment, the conductive layer 620a may be disposed between the rear plate 580 and the second printed circuit board 540. According to an embodiment, the conductive layer 620a may be disposed or coupled to the rear plate 580. For example, the conductive layer 620a may be formed by applying a conductive material to the rear plate 580 or attaching a conductive film (eg, a copper film) or a conductive plate (eg, a copper plate).

According to an embodiment, when viewed from the top of the rear plate 580, the conductive layer 620a may not overlap with the antenna module 610. According to various embodiments, the rear plate 580 may not overlap one or more antennas 710 and 720.

Referring to FIG. 5B, the film 620b may be disposed between the rear plate 580 and the second printed circuit board 540a. The film 620b may include a specific pattern or color, and may be visually recognized from the outside through the rear plate 580. The film 620b may include a first region 621 formed of a non-conductive material and a second region 622 processed to have conductive properties in a region not overlapping with the antenna module 610. The film 620b may be formed to include a conductive material by applying a conductive material or depositing a conductive material in the second region 622.

6, in one embodiment, when viewed from the top of the rear plate 580, the antenna module 610 is at least partially disposed between the third side portion 513 and the conductive layer 620 (or conductive region). I can.

Unless otherwise described below, the conductive layer 620 is a concept including a region including a conductive material among the conductive layers 620a and 620b of FIG. 5B (for example, the second region 622 of FIG. 5B). Can be understood as

Referring to FIG. 6, in an embodiment, the electronic device 500 includes an antenna 570 (eg, at least one antenna) disposed between a rear plate 580 and a battery (eg, battery 450 of FIG. 4 ). (507)). According to an embodiment, the antenna 570 may be disposed on the rear plate 580. The antenna 570 (for example, the antenna 470 of FIG. 4) may include, for example, an NFC antenna, a wireless charging antenna, and/or an MST antenna. The antenna 570 may perform short-range communication with an external device or wirelessly transmit/receive power required for charging. According to an embodiment, when viewed from the top of the rear plate 580, the conductive layer 620 may be disposed between the antenna module 610 and the antenna 570.

In an embodiment, the antenna 570 may include a coil as an antenna radiator. In an embodiment, the antenna 570 may include a plurality of coils. For example, each of the coils may be configured to support one of NFC, wireless charging, or MST. In an embodiment, the antenna 570 may include a printed circuit board on which coils are disposed.

In the present disclosure, the antenna 570 may be understood as a concept including an antenna radiator, a communication circuit for feeding power to the antenna radiator, and/or a ground connected to the antenna radiator unless otherwise described. For example, the antenna 570 may include a printed circuit board including a communication circuit, and an antenna radiator (eg, a conductive pattern, a conductive patch) integrally formed with the printed circuit board.

In an embodiment, the antenna 570 may include a non-conductive member disposed at a position adjacent to the rear plate. For example, the antenna 570 may include a conductive protective film laminated on the antenna radiator, and a conductive protective film may be attached to the rear plate. In an embodiment, when the antenna 570 includes a printed circuit board, the antenna may include a non-conductive member disposed between the printed circuit board and the rear plate. In an embodiment, the non-conductive member may include a dielectric material such as polyimide or plastic.

In an embodiment, an electronic component related to an antenna operation of the antenna 570 and a printed circuit board including a conductive pattern may be included. The printed circuit board of the antenna 570 may include a material having a dielectric constant different from that of the rear plate 580. For example, when the rear plate 580 includes a material having a first permittivity, the printed circuit board of the antenna 570 may include a material having a second permittivity greater than the first permittivity.

Although not shown, the antenna 570 disposed under the rear plate 580 in an embodiment of the present disclosure may be replaced with another component. For example, the antenna 570 may be replaced with an electronic component disposed inside an electronic device such as a camera module or a speaker module. For another example, the antenna 570 may be replaced with an antenna module supporting mmWave different from the antenna module 610. For another example, the antenna 570 may be replaced with an antenna radiator integrally formed with the rear plate 580. In embodiments to be described later, the antenna 570 may be understood as a concept including the components. For example, in FIGS. 5A to 30, the antenna 570 may be replaced with a speaker module.

In an embodiment, the antenna 570 (or a component that replaces the antenna 570, hereinafter the same) may include a dielectric member. The dielectric member may include a dielectric material having a different dielectric constant than the back plate. For example, the rear plate 580 may include a dielectric material having a first permittivity, and the dielectric member may include a dielectric material having a second permittivity. Since the antenna 570 includes a dielectric member, the antenna may have a different dielectric constant than the rear plate 580.

Referring to FIG. 5A, according to an embodiment, the conductive layer 620a has an electrical effect that the rear plate 580 has on the antenna radiation characteristic of the antenna module 610 (eg, a beam pattern or a polarization state of an electromagnetic wave). Can be reduced. This is because the conductive layer 620 can shield electromagnetic waves (or electromagnetic fields). In one embodiment, the conductive layer 620a is a material capable of shielding electromagnetic waves such as aluminum (Al), copper (Cu), silver (Ag), etc. (material) may be included.

According to an embodiment, in the conductive layer 620a, electromagnetic waves radiated from the first antenna array 710 and/or the second antenna array 720 of the antenna module 610 are guided through the rear plate 580 By not being transmitted to an electrical element such as the antenna 570, an electrical influence of the electromagnetic wave on an electrical element such as the antenna 570 may be reduced.

For example, when the conductive layer 620a is omitted, the rear plate 580 is, the electromagnetic wave radiated from the first antenna array 710 and/or the second antenna array 720 of the antenna module 610 flows. As a waveguide, it can operate as a path of a medium through which electromagnetic waves flow using, for example, total reflection properties. The antenna radiation characteristic of the antenna module 610 is, for example, an antenna radiation pattern, which is a directional function representing the relative distribution of power radiated from the antenna element 711, 712, 713, 714, 721, 722, 723, or 724 ( antenna radiation pattern) or a beam pattern, and a polarization state (or antenna polarization) of electromagnetic waves radiated from the antenna elements 711, 712, 713, 714, 721, 722, 723 or 724. When the rear plate 580 operates as a waveguide, it may be difficult for the antenna module 610 to have an antenna radiation characteristic corresponding to a selected or designated frequency, and thus antenna performance may be degraded. When electromagnetic waves radiated from the antenna module 610 are guided through the rear plate 580 and transmitted to the antenna 570, the antenna performance of the antenna 570 may be deteriorated.

According to an embodiment, the antenna module 610 may form a first beam pattern in which beam patterns formed from a plurality of antenna elements 711, 712, 713, and 714 of the first antenna array 710 are combined. . The first beam pattern is an effective area in which the first antenna array 710 can radiate or detect an electromagnetic wave, and the plurality of antenna elements 711, 712, 713, 714 of the first antenna array 710 Radiated powers can be combined to form. According to an embodiment, the antenna module 610 may have directivity capable of concentrating electromagnetic wave energy in a specific direction or transmitting and receiving waves. For example, by the beamforming system, the first antenna array 710 has energy in a first direction (eg, a +z axis direction) toward the first surface 611a of the first printed circuit board 611. It is possible to form a relatively large radiation beam. For example, the first beam pattern may have a broadside shape. The broadside type of the first beam pattern may include a main lobe in a direction in which radiant energy is maximized substantially without side lobes. According to an embodiment, the first beam pattern is a main lobe substantially formed in a first direction (eg, +z axis direction) toward which the first surface 611a of the first printed circuit board 611 faces. It may include. When the conductive layer 620 is omitted, at least a part of the electromagnetic field formed from the first antenna array 710 may be reflected from the rear plate 580, and the reflected component is the maximum boresight (e.g., main Compensation and/or interference may occur in the direction of the main lobe, thereby causing deformation (or distortion) of the first beam pattern. The deformation (or distortion) of the first beam pattern is, for example, a null formed between the lobes of the first beam pattern (for example, a radiation group in which the energy distribution of an electromagnetic wave is divided in several directions) ( null). The null may indicate, for example, an ineffective region in which the first antenna array 710 cannot radiate or detect electromagnetic waves. The null may, for example, point in a direction in which the radiation intensity is substantially zero. According to an embodiment, the conductive layer 620 reduces the electromagnetic wave (or wave) emitted from the first antenna array 710 is guided through the rear plate 580 due to total reflection, thereby deforming the first beam pattern. (E.g. distortion) can be prevented.

In the absence of the conductive layer 620, electromagnetic waves generated by the antenna module 610 and guided through the rear plate 580 may be totally reflected inside the rear plate 580. As some of the electromagnetic waves totally reflected inside the rear plate 580, the electromagnetic waves radiated back to the outside of the electronic device may degrade the performance of the main beam (ie, the first beam) of the antenna module 610.

According to an embodiment, the conductive layer 620 prevents electromagnetic waves (or waves) radiated from the first antenna array 710 from being guided through the rear plate 580 and transmitted to an electrical element such as the antenna 570. Thus, it is possible to reduce the electrical influence of the electromagnetic wave on an electrical element such as the antenna 570. For example, the conductive layer 620 may shield or attenuate an electromagnetic field (or wave) radiated from the first antenna array 710 between the antenna module 610 and the antenna 570. According to an exemplary embodiment, the conductive layer 620 may reduce an electrical influence of an electromagnetic wave (or wave) radiated from the first antenna array 710 on a frequency band of the antenna 570.

According to an embodiment, the electromagnetic wave radiated from the first antenna array 710 may include a polarized wave. For example, the antenna module 610 may radiate horizontal polarization (H-pol) and vertical polarization (V-pol) through the first antenna array 710. The polarization may be the direction of the electric field (or electric field) of the antenna. According to an embodiment, the horizontal polarization is a linear polarization in which the vector direction of the electric field is horizontal, and the electric field vector of the horizontal polarization is a ground plane included in the first printed circuit board 611 (e.g., xy plane and It can be parallel to a parallel ground plane). According to an embodiment, the vertical polarization is a linear polarization in which the vector direction of the electric field is vertical, and the electric field vector of the vertical polarization may be perpendicular to the ground plane included in the first printed circuit board 611. The ground plane may be related to the radiation characteristics of the antenna module 610. For example, the radiation characteristic of the antenna module 610 may be determined based on a distance between a plurality of antenna elements included in the first antenna array 710 or the second antenna array 720 separated from the ground plane. . For example, the radiation characteristic of the antenna module 610 may be determined based on the shape of the ground plane (eg, width, length, thickness). For example, the radiation characteristic of the antenna module 610 is an insulating material (eg, dielectric constant) between a plurality of antenna elements included in the first antenna array 710 or the second antenna array 720 and the ground plane. Can be determined on a basis.

According to an embodiment, the plurality of antenna elements 711, 712, 713, and 714 of the first antenna array 710 may form horizontal polarization and vertical polarization through single feed or multiple feed. According to an embodiment, the positions or number of feed units for the plurality of antenna elements 711, 712, 713, and 714 of the first antenna array 710 may be variously formed in consideration of impedance matching.

According to an embodiment, the conductive layer 620a or the film 620b including the conductive material is not limited to the shape shown in FIG. 5A or 5B, and the horizontal polarization radiated from the first antenna array 710 In order to reduce the effect of deformation (or distortion) and the horizontal polarization on electrical elements such as the antenna 570, it may be variously formed according to the boundary condition of the horizontal polarization with respect to the rear plate 580. have.

According to an embodiment, the shape of the conductive layer 620 may shield noise (eg, at least a portion of the electromagnetic wave radiated from the antenna module 610) related to a frequency selected or specified by the antenna system using the antenna 570. It can be related to the possible wavelength length. For example, when the selected or designated frequency is 2.4 GHz, the length of the conductive layer 620 in the y-axis direction may be implemented as a wavelength length value of 2.4 GHz (about 30 mm), or a threshold range thereof. According to various embodiments, the antenna system may transmit or receive frequency signals for WiFi, 2G, 3G, LTE, 5G, or other various networks, and the conductive layer 620 may have a wavelength length for the corresponding frequency. Can be formed.

In an embodiment, the conductive layer 620 may be positioned on a waveguide path p of electromagnetic waves directed in the y-axis direction among electromagnetic waves radiated from the antenna module 610. In an embodiment, the conductive layer 620 may be configured to shield an electromagnetic field from the antenna module 610 in the y-axis direction or substantially in the y-axis direction. Accordingly, in an embodiment, the conductive layer 620 may have a larger width than the antenna module 610. 6A, the antenna module 610 is in a second direction substantially perpendicular to the first direction (ie, y-axis direction) from the antenna module 610 toward the antenna 570 (ie, the x-axis direction). It may have a first width w1. The second width w2 of the conductive layer 620 may be larger than the first width w1 of the antenna module 610. Since the conductive layer 620 is configured to have a width greater than that of the antenna module 610, an electromagnetic field waved in the first direction from the antenna module 610 through the rear plate 580 may be shielded.

In an embodiment, the first distance d1 between the conductive layer 620 and the antenna module 610 may be shorter than the second distance d2 between the conductive layer 620 and the antenna 570.

According to an embodiment, although not illustrated, the electronic device 500 may include an additional conductive layer between the antenna module 610 and the first side portion 511. For example, the conductive layer 620 may extend between the antenna module 610 and the first side portion 511. The conductive layer disposed between the antenna module 610 and the first side portion 511 prevents deformation (or distortion) of the vertical polarization, or the horizontal polarization is at least between the first side portion 511 and the antenna module 610. It is possible to reduce the electrical influence on one electrical element.

According to an embodiment, the antenna module 610 may form a second beam pattern in which beam patterns formed from a plurality of antenna elements 721, 722, 723, and 724 of the second antenna array 720 are combined. . The second beam pattern is an effective area in which the second antenna array 720 can radiate or detect electromagnetic waves, and the plurality of antenna elements 721, 722, 723, 724 of the second antenna array 720 Radiated powers can be combined to form. For example, the second beam pattern may have an end-fire type. The energy distribution of the electromagnetic wave radiated from the second antenna array 720 may include a main lobe and a side lobe, which are radiation groups divided in various directions. For example, the main lobe of the second beam pattern may be substantially formed in a second direction (eg, a +y axis direction) in which radiant energy is directed toward the third side portion 513.

8 is a perspective view of the electronic device of FIG. 5A according to an exemplary embodiment. 9 is a cross-sectional view of the electronic device of FIG. 8 according to an embodiment.

8 and 9, in an embodiment, the electronic device 500 includes a front plate 520, a side bezel structure 510, a support member 515, a display 530, and a second printed circuit board 540. ), a battery 550, an antenna 570, a rear plate 580, an antenna module 610, or a conductive layer 620. At least one of the constituent elements of the electronic device 500 may be the same as or similar to at least one of the constituent elements illustrated in FIG. 5A, and redundant descriptions will be omitted below.

The front plate 520 may be, for example, the front plate 302 of FIG. 3A or the front plate 420 of FIG. 4. The support member 515 may be, for example, the first support member 411 of FIG. 4. The support member 515 may be connected to the side bezel structure 510 or may be integrally formed with the side bezel structure 510.

According to an embodiment, the support member 515 includes one surface 515a on which the second printed circuit board 540 is disposed, and the other surface 515b on which the display 530 (eg, the display 430 of FIG. 4) is disposed. ) Can be included. The battery 550 may be electrically connected to the second printed circuit board 540 through an electrical path 594 such as an FPCB.

The electronic device 500 may include various electrical elements 591, 592, 593, and 595 disposed on the second printed circuit board 540. For example, the electrical elements 591, 592, 593 are an audio receiver 591, a camera 592 (e.g., the second camera device 312 in Fig. 3B), a communication circuit (e.g., WiFi An integrated circuit (IC) (IC) 593, or a memory card connector (eg, a SIM card connector) 595 may be included. The second printed circuit board 540 may include a third surface 540a facing the rear plate 580 and a fourth surface 540b facing the front plate 520. Various electrical elements, such as audio receiver 591, camera 592, or communication circuit 593, may be disposed on the third side 540a. Various elements such as memory card connector 595 or IC 596 may be disposed on the fourth side 540b. Other various electrical elements (eg, components included in the electronic device 101 of FIG. 1) are to be disposed on the third side 540a or the fourth side 540b of the first printed circuit board 540. I can.

According to an embodiment, the antenna module 610 may be disposed between the rear plate 580 and the second printed circuit board 540. Although not shown, the antenna module 610 may be connected to the support member 515 or may be disposed (or coupled) to a portion extending from the support member 515. The antenna module 610 may include a second printed circuit board 611 including a first antenna array 710 and/or a second antenna array 720. The first printed circuit board 611 may include a first surface 611a facing the rear plate 580 and a second surface 611b facing the second printed circuit board 540. According to an embodiment, the first side 611a (or the second side 611(b)) of the first printed circuit board 611 is the third side 540a or the third side of the second printed circuit board 540. It may be substantially parallel to the four sides 540b.

In the illustrated embodiment, the antenna module 610 may be spaced apart from the rear plate 580 by a predetermined distance. For example, an air gap may exist between the antenna module 610 and the rear plate 580. In another embodiment, the antenna module 610 may be adjacent to the rear plate 580. For example, the antenna module 610 may be attached to the rear plate 580.

The conductive layer 620 may be attached to the rear plate 580, for example. According to an embodiment, when viewed from the top of the rear plate 580, the conductive layer 620 may be disposed on the rear plate 580 so as not to overlap with the antenna module 610. According to an embodiment, when viewed from the top of the rear plate 580, the antenna module 610 may be disposed between the third side portion 513 and the conductive layer 620.

The antenna 570 may be attached to the rear plate 580, for example. According to another embodiment, the antenna 570 may be attached to the battery 550. According to an embodiment, when viewed from the top of the rear plate 580, the conductive layer 620 may be disposed between the antenna module 610 and the antenna 570.

According to an embodiment, in the conductive layer 620, electromagnetic waves (eg, horizontal polarization or vertical polarization) radiated from the first antenna array 710 or the second antenna array 720 may be applied to the rear plate 580 by total reflection. It is possible to prevent deformation (eg, distortion) of the electromagnetic wave by reducing the waveguide. For example, when the conductive layer 620 is omitted, the electromagnetic wave may be reflected from the rear plate 580, and the reflected component may cause compensation and/or interference to cause deformation (or distortion) of the electromagnetic wave. I can.

According to an embodiment, the conductive layer 620 is a first antenna array 710 or a second antenna array 720, electromagnetic waves (eg, horizontal polarization or vertical polarization) radiated through the rear plate 580 As a result, the electromagnetic wave may not be transmitted to an electrical element such as the antenna 570, thereby reducing an electrical influence of the electromagnetic wave on an electrical element such as the antenna 570. For example, the conductive layer 620 may shield or attenuate the electromagnetic wave between the antenna module 610 and the antenna 570. According to an embodiment, the conductive layer 620 may reduce an electrical influence of the electromagnetic wave on a frequency band of the antenna 570.

According to an embodiment, when viewed from the top of the rear plate 580, the conductive layer 620 may be disposed to overlap at least with the communication circuit (eg, WiFi IC) 593. The conductive layer 620 can reduce the electrical influence of the electromagnetic wave radiated from the first antenna array 710 or the second antenna array 720 on the communication circuit 593, thereby reducing the performance of the communication circuit 593 Can be secured.

10 is a perspective view of the electronic device of FIG. 5A according to an embodiment.

Referring to FIG. 10, in an embodiment, the electronic device 1000 includes a front plate 520, a side bezel structure 510, a support member 515, a display 530, a second printed circuit board 540, and Electrical elements 591, 592, 593, 595, battery 550, antenna 570, back plate 580, antenna module 610, or conductive layer 1020 may be included. At least one of the constituent elements of the electronic device 1000 may be the same as or similar to at least one of the constituent elements illustrated in FIG. 9, and redundant descriptions will be omitted below.

According to an embodiment, the conductive layer 1020 may replace the conductive layer 620 of FIG. 9. In an embodiment, the conductive layer 1020 may include a plurality of physically separated conductive patterns. According to another embodiment (not shown), the conductive layer 1020 may have a shape including a plurality of openings. According to an embodiment, the conductive layer 1020 may have an electromagnetic band gap structure (EBG) for preventing an electromagnetic band gap (EBG) phenomenon. The EBG structure may be, for example, a structure such that at least a part of the electromagnetic wave radiated from the antenna module 610 is not transmitted to the antenna 570 as noise.

According to an embodiment, a plurality of conductive patterns included in the conductive layer 1020 may be arranged at predetermined intervals from each other in the y-axis direction. In one embodiment, the spacing between the plurality of patterns or the width of the conductive pattern is determined by the noise (eg, the electromagnetic wave radiated from the antenna module 610) about a selected or specified frequency in the antenna system using the antenna 570. At least some) can be related to the length of the wavelength that can be shielded.

11 and 12 illustrate radiation patterns of horizontal polarization radiated from an antenna module in the electronic device of FIG. 9 according to an exemplary embodiment. 13 and 14 illustrate radiation patterns of vertical polarization radiated from an antenna module when a conductive layer is omitted in the electronic device of FIG. 9, for example.

Referring to FIG. 11, in an embodiment, the electronic device 500 includes a front plate 520, a side bezel structure 510, a support member 515, a display 530, a second printed circuit board 540, Electrical elements 591, 592, 593, 595, 596, battery 550, antenna 570, back plate 580, antenna module 610, or conductive layer 620 may be included.

13 and 14, when the conductive layer 620 is omitted, at least a part of the electromagnetic wave (eg, horizontal polarization or vertical polarization) radiated from the antenna module 610 may be reflected from the rear plate 580 , The reflected component may cause compensation and/or interference to cause deformation (or distortion) of the electromagnetic wave.

When the conductive layer 620 is omitted, at least a part of the horizontal polarization radiated from the antenna module 610 may be guided in the -y axis direction 1201 through the rear plate 580 operating as a waveguide. The deformation (or distortion) of the horizontal polarization may include, for example, a null formed between lobes of the horizontal polarization.

In the absence of the conductive layer 620, electromagnetic waves generated by the antenna module 610 and guided through the rear plate 580 may be totally reflected inside the rear plate 580. As some of the electromagnetic waves totally reflected inside the rear plate 580, the electromagnetic waves radiated back to the outside of the electronic device may degrade the performance of the main beam of the antenna module 610. Referring to FIG. 13, a plurality of circular radio waves may be formed along the rear plate 580 by electromagnetic waves that are reradiated to the outside of the electronic device.

Referring to FIGS. 11 and 12, according to an embodiment, the conductive layer 620 reduces the electromagnetic wave radiated from the antenna module 610 waved through the rear plate 580 due to total reflection, thereby reducing the deformation of the electromagnetic wave ( E.g. distortion) can be prevented. For example, the conductive layer 620 may reduce horizontal polarization radiated from the antenna module 610 from being guided in the -y axis direction 1201 through the rear plate 580. According to an embodiment, the conductive layer 620 prevents electromagnetic waves radiated from the antenna module 610 from being guided through the rear plate 580 and transmitted to electrical elements such as the antenna 570, so that the electromagnetic waves are transmitted to the antenna. It is possible to reduce the electrical influence on the electrical elements such as (570).

15 and 16 illustrate beam patterns of horizontal polarization radiated from an antenna module in the electronic device of FIG. 9 according to an exemplary embodiment. 17 and 18 illustrate beam patterns of horizontal polarization radiated from an antenna module in an example 1700 in which the conductive layer 620 is omitted in the electronic device of FIG. 9.

15 and 16, the antenna module 610 may form a horizontally polarized beam pattern 1501 in which beam patterns formed from a plurality of antenna elements of the first antenna array 710 of FIG. 5A are combined. The horizontally polarized beam pattern 1501 is an effective area in which the first antenna array 710 can radiate or detect an electromagnetic wave, and is formed by combining radiated powers of a plurality of antenna elements of the first antenna array 710. I can. According to an embodiment, by the beamforming system, the antenna module 610 is a horizontally polarized beam pattern 1501 in which energy is relatively largely radiated in a direction toward the rear plate 580 (eg, in the +z axis direction). ) Can be formed. For example, the horizontally polarized beam pattern 1501 may have a broadside shape. The broadside-type horizontally polarized beam pattern 1501 may include a main lobe in a direction in which radiant energy is maximized substantially without side lobes. According to an embodiment, the conductive layer 620 prevents deformation (eg, distortion) of the horizontal polarization by reducing the horizontal polarization radiated from the antenna module 610 to be waved through the rear plate 580 due to total reflection. can do.

17 and 18, when the conductive layer 620 is omitted, at least a part of the horizontal polarization radiated from the antenna module 610 may be reflected from the rear plate 580, and the reflected component is compensated and /Or interference may be caused to cause deformation (or distortion) of the beam pattern of the horizontal polarization. The deformation (or distortion) of the beam pattern of the horizontal polarization is, for example, nulls indicating an ineffective region in which the antenna module 610 cannot radiate or detect an electromagnetic wave, or a direction in which the radiation intensity is substantially zero. ) (1701, 1702, 1703, 1704) can be formed.

19 is a cross-sectional view of an electronic device including an antenna module according to an exemplary embodiment. 20 is a perspective view of the electronic device of FIG. 19, for example.

19 and 20, in an embodiment, an electronic device 1900 (eg, the electronic device 101 of FIG. 1, the electronic device 300 of FIG. 3A or 3B, or the electronic device 400 of FIG. 4) ) Is a front plate 1910 (e.g., the front plate 420 of FIG. 4), a rear plate 1920 (e.g., the rear plate 480 of FIG. 4), and a side bezel structure 1930 (e.g., The side bezel structure 410), the support member 1940 (for example, the support member 411 in FIG. 4), the antenna module 1950 (for example, the antenna module 610 in FIG. 7A or 7B), and the conductive layer 1980 ) (Eg, the conductive layer 620 of FIG. 9), the second printed circuit board 1960 (eg, the printed circuit board 440 of FIG. 4), or at least one of the flexible printed circuit board 1970 I can. At least one of the constituent elements of the electronic device 1900 may be the same as or similar to at least one of the constituent elements illustrated in FIG. 4, and redundant descriptions will be omitted below.

For example, the front plate (or window) 1910 may form the front surface of the electronic device 1900, and the rear plate (or rear cover) 1920 may form the rear surface of the electronic device 1900. I can. The side bezel structure 1930 may surround at least a portion of the space between the front plate 1910 and the rear plate 1920, and may form a side surface 1930a of the electronic device 1900.

According to an embodiment, the front plate 1910 may include a first planar portion 1911 and a first curved portion 1912. The first curved portion 1912 may extend from the first flat portion 1911 and may be curved toward the rear plate 1920. The front surface of the electronic device 1900 is formed by a first plane 1910a formed by a first flat part 1911 and a first curved part 1912 and from an edge (not shown) of the first plane 1910a. It may include an extended first curved surface 1910b. According to various embodiments, the first plane 1910a may be the front surface 310A of FIG. 3A, and the first curved surface 1910b may be one of the two first regions 310D of FIG. 3A.

According to an embodiment, the rear plate 1920 may include a second flat portion 1921 and a second curved portion 1922. The second curved portion 1922 may extend from the second flat portion 1921 and may be curved toward the front plate 1910. The rear surface of the electronic device 1900 is formed by a second plane 1920a formed by a second flat part 1921 and a second curved part 1922 from an edge (not shown) of the second plane 1920a. It may include an extended second curved surface 1920b. According to various embodiments, the second plane 1920a may be the rear surface 310B of FIG. 3A, and the second curved surface 1920b may be one of the two second regions 310E of FIG. 3B.

The side surface 1930a of the electronic device 1900 (for example, the side surface 310C of FIG. 3A) interconnects the first curved surface 1910b of the front plate 1910 and the second curved surface 1920b of the rear plate 1920. I can. According to some embodiments (not shown), the first curved portion 1912 of the front plate 1910 and/or the second curved portion 1922 of the rear plate 1920 may be formed to be flat.

According to an embodiment, the support member 1940 (for example, a bracket) may be disposed inside the electronic device 1900 to be connected to the side bezel structure 1930 or integrally with the side bezel structure 1930. Can be formed. The support member 1940 may be formed of, for example, a metal material and/or a non-metal material (eg, a polymer). The support member 1940 includes one side 1940a on which a display (not shown) (for example, the display 430 of FIG. 4) is disposed, and the other side 1940b on which the first printed circuit board 1960 is disposed. I can. The display may be at least partially disposed along the front plate 1911. For example, the display, as a flexible display, may include a flat area disposed along the first flat portion 1911 and a curved area disposed along the first curved portion 1912.

According to an embodiment, the second printed circuit board 1960 may include a fourth surface 1960b facing the support member 1940 and a third surface 1960a facing opposite to the fourth surface 1960b. I can. According to an embodiment, the antenna module 1950 (eg, the antenna module 246 of FIG. 3 or the antenna module 610 of FIG. 7A) is a first printed circuit board 1951 (eg, the first printed circuit of FIG. 7A ). It may include a substrate 611). The first printed circuit board 1951 may include a first surface 1951a and a second surface 1951b facing opposite to the first surface 1951a. According to an embodiment, the second printed circuit board 1960 may be disposed substantially perpendicular to the first printed circuit board 1951. For example, the third side 1960a (or the fourth side 1960b) of the second printed circuit board 1960 may be the first side 1951a or the second side of the first printed circuit board 1951 ( 1951b) can be substantially at an angle of 90 degrees. According to an embodiment, the support member 1940 may include a portion 1941 extending between the second printed circuit board 1960 and the first printed circuit board 1951, and the first printed circuit board 1951 May be disposed on the portion 1941.

According to an embodiment, the first printed circuit board 1951 may be perpendicular to the first flat portion 1911 of the front plate 1910 and/or the second flat portion 1921 of the rear plate 1920. According to an embodiment, the second curved portion 1922 of the rear plate 1920 may be curved and extended in front of the first surface 1951a of the first printed circuit board 1951 from the second flat portion 1921. .

According to an embodiment, the first printed circuit board 1951 may be disposed to form an acute angle or an obtuse angle with the second printed circuit board 1960. For example, the third side 1960a (or the fourth side 1960b) of the second printed circuit board 1960 may be the first side 1951a or the second side of the first printed circuit board 1951 ( 1951b) can be at an acute or obtuse angle.

Referring to FIGS. 19 and 20, in one embodiment, the electronic device 1900 includes a third connector 2091 disposed at one end of the flexible printed circuit board 1970 and the other end of the flexible printed circuit board 1970. It may include a fourth connector 2092 disposed on. The third connector 2091 is electrically connected to a first connector (eg, the second connector 750 in FIG. 7B) disposed on the first printed circuit board 1951, and the fourth connector 2092 is a second printed circuit board. It may be electrically connected to a second connector (not shown) disposed on the circuit board 1960.

The antenna module 1950 may include, for example, at least a part of the antenna module 610 shown in FIG. 7A or 7B. According to an embodiment, the antenna module 1950 includes the first antenna array 1952 (for example, the first antenna array 710 in FIG. 7A) and/or the second antenna array 1953 (for example, the first antenna array 1953 in FIG. 7A). It may include 2 antenna array 720). According to an embodiment, the antenna module 1950 may include a first wireless communication circuit (eg, the first wireless communication circuit 730 of FIG. 7B) mounted on the second surface 1951b.

According to an embodiment, the first antenna array 1952 and/or the second antenna array 1953 are disposed closer to the first surface 1951a than the second surface 1951b, or on the first surface 1951a. Can be placed. According to an embodiment, a plurality of antenna elements included in the first antenna array 1952 may include a patch antenna, and the plurality of antenna elements included in the second antenna array 1953 may include a dipole antenna. have. According to an embodiment, the antenna array, or the location or number of antenna elements included in the antenna array is not limited to the example shown in FIG. 20 and may be various.

According to an embodiment, the first antenna array 1952 may be disposed closer to the rear plate 1920 than the second antenna array 1953. The second antenna array 1953 may be disposed closer to the front plate 1910 than the first antenna array 1952.

According to an embodiment, the beamforming system adjusts the phase of the current supplied to the plurality of antenna elements of the first antenna array 1952 or the plurality of antenna elements of the second antenna array 1953 to adjust the direction of the beam. Can be formed. For example, referring to FIG. 19, by the beamforming system, the antenna module 1950 is a first direction 1901 facing the first surface 1951a of the first printed circuit board 1951 (eg: +z axis direction) and/or the second direction 1902 (e.g., -x axis direction) orthogonal to the first direction 1901 toward the rear plate 1920 to form a beam in which a relatively large amount of energy is radiated. I can. As another example, by the beamforming system, the antenna module 1950 transmits a beam in which relatively large amount of energy is radiated in a third direction 1902 between the first direction 1901 and the second direction 1902. It can also be formed. For example, the third direction 1902 may form an angle of about 45° with the first direction 1901 or the second direction 1902. According to an embodiment, by the beamforming system, the antenna module 1950 may form a beam in which relatively large amounts of energy are radiated in various directions.

According to an embodiment, the back plate 1920 may be formed of an insulator or dielectric material such as glass or polymer. According to an embodiment, the conductive layer 1980 may be disposed between the rear plate 1920 and the second printed circuit board 1960. According to an embodiment, the conductive layer 1980 may be disposed or coupled to the rear plate 1920. For example, the conductive layer 1980 may be formed by applying a conductive material to the rear plate 1920 or attaching a conductive film or a conductive plate.

According to an embodiment, when viewed from the top of the rear plate 1920, the conductive layer 1980 may at least partially overlap the second printed circuit board 1960. According to an embodiment, when viewed from the rear plate 1920, the conductive layer 1980 may be disposed not to overlap with the first printed circuit board 1951.

According to an embodiment, the conductive layer 1980 may be disposed on the second flat portion 1921 of the rear plate 1920. According to an embodiment (not shown), the conductive layer 1980 may be extended to the second curved portion 1922 of the rear plate 1920 in a range that does not cover the first surface 1951a of the antenna module 1950. May be.

According to an embodiment, the antenna module 1950 may have directivity capable of concentrating electromagnetic wave energy in a specific direction or transmitting and receiving waves. According to an embodiment, the antenna module 1950 may form a beam pattern in which beam patterns formed from a plurality of antenna elements of the first antenna array 1952 or the second antenna array 1953 are combined. The beam pattern is an effective region in which the first antenna array 1952 or the second antenna array 1953 can radiate or detect electromagnetic waves, and a plurality of the first antenna array 1952 or the second antenna array 1953 Radiated powers of the antenna elements of may be combined to form. According to an embodiment, the antenna module 1950 includes a first direction 1901 (eg, +z axis direction) and a second direction 1902 through the first antenna array 1952 or the second antenna array 1953. It is possible to form a beam in which relatively large amounts of energy are radiated in at least one of (eg, -x axis direction). According to an embodiment, the antenna module 1950 transmits energy in at least one of the first direction 1901 and the third direction 1902 through the first antenna array 1952 or the second antenna array 1953. It is possible to form a relatively large radiation beam. According to an embodiment, the antenna module 1950 transmits energy in at least one of the second direction 1902 and the third direction 1902 through the first antenna array 1952 or the second antenna array 1953. It is possible to form a relatively large radiation beam. According to an embodiment, electromagnetic waves radiated from the first antenna array 1952 or the second antenna array 1953 may include horizontal polarization and vertical polarization. According to an embodiment, the horizontal polarization is a linear polarization in which the vector direction of the electric field is horizontal, and the electric field vector of the horizontal polarization is a ground plane included in the first printed circuit board 1951 (eg, a ground plane parallel to the xy plane). Can be parallel to According to an embodiment, the vertical polarization is a linear polarization in which the vector direction of the electric field is vertical, and the electric field vector of the vertical polarization may be perpendicular to the ground plane included in the first printed circuit board 1951. For example, electromagnetic waves (eg, horizontal polarization or vertical polarization) radiated from the first antenna array 1952 or the second antenna array 1953 may be directed toward the rear plate 1920 by directivity, and the electromagnetic wave is The reflected component reflected from the plate 1920 may compensate and/or interfere with the maximum boresight, resulting in deformation (or distortion) of the electromagnetic wave. According to an embodiment, the conductive layer 1980 may reduce deformation (or distortion) of the electromagnetic wave by changing a boundary condition of the electromagnetic wave with respect to the rear plate 1920.

For example, when the conductive layer 1980 is omitted, the rear plate 1920 is, the electromagnetic wave radiated from the first antenna array 1952 and/or the second antenna array 1953 of the antenna module 1950 flows. As a waveguide, for example, it can operate as a path of a medium through which electromagnetic waves flow using a property of total reflection. When the rear plate 1920 operates as a waveguide, it may be difficult for the antenna module 1950 to secure an antenna radiation characteristic corresponding to a selected or specified frequency, and thus, the antenna performance of the antenna module 1950 may be degraded. have. When the electromagnetic wave radiated from the antenna module 1950 is guided through the rear plate 1920, the performance of an electrical element such as the antenna 570 of FIG. 8 or 9 may be degraded.

According to an embodiment, the conductive layer 1980 reduces the electromagnetic wave (or wave) radiated from the antenna module 1950 being guided through the rear plate 1920 to reduce the deformation of antenna radiation characteristics (e.g., distortion). ) Can be prevented.

According to an embodiment, the conductive layer 1980 reduces the electromagnetic wave radiated from the antenna module 1950 being guided through the rear plate 1920, thereby reducing the performance of electrical elements such as the antenna 570 of FIG. 8 or 9. Can be secured. For example, the conductive layer 1980 prevents an electromagnetic field (or wave) formed in the first antenna array 1952 or the second antenna array 1953 between electrical elements such as the antenna module 1950 and the antenna 570. Can be shielded or attenuated.

According to an embodiment, the conductive layer 1980 is not limited to the shape shown in FIG. 19, and the deformation (or distortion) of the electromagnetic wave (eg, horizontal polarization or vertical polarization) radiated from the antenna module 1950 and the In order to reduce the influence of the electromagnetic wave on other electrical elements (eg, the antenna 570 of FIG. 8 or 9), it may be variously formed according to the boundary condition of the electromagnetic wave with respect to the rear plate 1920. According to an embodiment (not shown), the conductive layer 1980 may be implemented as a plurality of physically separated conductive patterns like the conductive layer 1020 of FIG. 10. According to an embodiment (not shown), the conductive layer 1980 may be implemented in a form including a plurality of openings. For example, the conductive layer 1980 may be formed in an EBG structure.

21 illustrates a beam pattern of an electromagnetic wave radiated from an antenna module in the electronic device of FIG. 19 or 20 according to an exemplary embodiment. 22 illustrates a beam pattern of an electromagnetic wave radiated from an antenna module in an example 2200 in which the conductive layer 1980 is omitted in the electronic device of FIG. 19 or 20, for example. 23 is a graph showing antenna gains on a frequency distribution of the electronic device of FIG. 19 or 20 and the embodiment of FIG. 22 according to an embodiment.

Referring to FIG. 22, electromagnetic waves (eg, vertical polarization) radiated from the antenna module 1950 may have a beam directed to the rear plate 1920 by directivity. The beam is reflected from the rear plate 1920 so that the reflected component compensates and/or interferes with the maximum boresight, resulting in deformation (or distortion) of the beam pattern as shown in FIG. 22. Referring to FIG. 21, in an embodiment, the conductive layer 1980 may reduce deformation of the electromagnetic wave by changing a boundary condition of the electromagnetic wave with respect to the rear plate 1920. Referring to FIG. 21, in an embodiment, the conductive layer 1980 shields or attenuates at least part of the electromagnetic wave induced by the rear plate 192, thereby reducing deformation of the beam pattern and securing antenna gain. .

Referring to FIG. 23, reference numeral 2301 denotes an antenna gain on a frequency distribution of the electronic device of FIG. 19 or 20, and reference numeral 2303 denotes an antenna gain on a frequency distribution of the embodiment of FIG. 22. Comparing 2301 and 2303, the conductive layer 1980 of FIG. 19 according to an exemplary embodiment may increase a peak gain.

24 to 26 are cross-sectional views taken along the line I-I of FIG. 6.

24 to 26, in an embodiment, the antenna module 610 may be disposed at a position corresponding to the first portion 581 of the rear plate 580. The electromagnetic wave of the antenna module 610 may pass through the first portion 581 of the rear plate 580 and radiate outside the electronic device. Therefore, a member (eg, a conductive member, a ferrite film) may not be disposed between the first portion 581 of the rear plate 580 and the antenna module 610 to shield electromagnetic waves.

Referring to FIGS. 24 and 25, an antenna 570 (or a component that replaces the antenna 570, see the description of FIG. 6) may be disposed under the rear plate 580. The antenna 570 may be spaced apart from the antenna module 610 in a direction parallel to the rear plate 580 (eg, in the -y axis direction). For example, the antenna 570 may be disposed under the third portion 583 of the rear plate 580.

24 and 25, the conductive layer 620a may not overlap the antenna module 610 when looking at the x-y plane in an embodiment. For example, the conductive layer 620a may be disposed under the second portion 582 of the rear plate 580 adjacent to the first portion 581 of the rear plate 580. The conductive layer 620a may be generated in the antenna module 610 to shield an electromagnetic field that is guided along the rear plate 580 to the second portion 582 of the rear plate 580.

Referring to FIGS. 24 and 25, in an embodiment, a conductive layer 620a may be disposed between the antenna module 610 and the antenna 570. In an embodiment, the conductive layer 620a may extend toward the antenna 570 at a portion adjacent to the antenna module 610. For example, the antenna 570 may be disposed under the third portion 583 adjacent to the second portion 582 of the rear plate 580. In an embodiment, the conductive layer 620a may be disposed closer to the antenna module 610 than the antenna 570. For example, the distance d1 between the conductive layer 620a and the antenna module 610 may be smaller than the distance d2 between the conductive layer 620a and the antenna 570.

In an embodiment, the rear plate 580 may include a first surface facing the outside of the electronic device and a second surface facing the inside of the electronic device. In one embodiment, the antenna module 610 is disposed at a position adjacent to the first region corresponding to the first portion 581 of the second surface of the rear plate 580, and is a second surface of the second surface of the rear plate 580. The conductive member may be disposed at a position adjacent to the second region corresponding to the second portion 582. For example, the antenna module 610 and the conductive layer 620a may be attached on the first region and the second region, respectively. The conductive layer 620a may be generated in the antenna module 610 to shield an electromagnetic field that is guided along the rear plate 580 to the second portion 582 of the rear plate 580.

In an embodiment, a component including a dielectric material may be disposed at a position adjacent to the third region corresponding to the third portion 583 of the second surface. For example, the antenna 570 may be attached on the third area of the rear plate 580.

Referring to FIGS. 24 and 25, in an embodiment, the electronic device may include a film 620b disposed between the conductive layer 620a and the rear plate 580. The film 620b is a layer deposited or applied under the rear plate 580 and may be visually recognized from outside the electronic device through the rear plate 580. In an embodiment, the conductive layer 620a may be implemented by directly depositing (or applying) a conductive material to one surface of the film 620b or attaching a conductive member to the film 620b. In the embodiment illustrated in FIG. 25, the conductive layer 620a may be attached under the film 620b through the adhesive member 630.

Although not shown, in an embodiment, the conductive layer 620a may be disposed directly under the rear plate 580. For example, the conductive layer 620a may be implemented by attaching a film including a conductive material to one surface of the rear plate 580. An adhesive member may be attached between the conductive layer 620a and the rear plate 580. For another example, the conductive layer 620a may be implemented by depositing (or applying) a conductive material on the rear plate 580.

Although not shown, in an embodiment, the conductive layer 620a may be electrically connected to the ground inside the electronic device. In an embodiment, the conductive layer 620a may be grounded to a component including a ground in the electronic device. For example, the electronic device may include a bracket including a conductive material and configured to support the display therein, and the conductive layer 620a may be electrically connected to the bracket. For another example, the electronic device includes a printed circuit board (for example, the second printed circuit board 540 of FIG. 5A) including a ground therein, and the conductive layer 620a is electrically connected to the ground of the printed circuit board. Can be connected.

Referring to FIG. 26, the film 620b includes a first region 621 formed of a non-conductive material and a second region 622 processed to have a conductive property in a region not overlapping with the antenna module 610. can do. The second region 622 may be located under the second portion 582 of the rear plate 580. In this case, the second region 622 of the film 620b may replace the conductive layer 620a of FIGS. 24 and 25. This is because when the film 620b includes a conductive material, the film 620b can shield the electromagnetic field waved from the antenna module 610 in the -y direction.

27 illustrates an electronic device including an antenna module mounted on a mid frame according to an embodiment. 28 is a cross-sectional view of the electronic device cut along the line II-II in FIG. 27.

In an embodiment, the antenna module 610 may be disposed on the mid frame 640 disposed between the second printed circuit board 540 and the rear plate 580. In an embodiment, the antenna module 610 may be electrically connected to the second printed circuit board 540 through a conductive path passing through or bypassing the mid frame 640.

In an embodiment, the antenna module 610 may be seated in a depression (or recess) 641 formed in the mid frame 640. In an embodiment, the depression 641 may be formed such that an air gap 642 exists between the antenna module 610 and the rear plate 580 when the antenna module 610 is seated on the depression 641. .

In an embodiment, the mid frame 640 may include a non-conductive member 643 and a conductive member (or conductive pattern, shield member) 644. In an embodiment, the conductive member 644 may include a radiator of an antenna different from the antenna module 610. For example, a radiator of a WiFi antenna and/or a GPS antenna may be disposed on the mid frame 640. In an embodiment, the non-conductive member 643 and the conductive member 644 may be integrally formed by double injection or insert molding.

In an embodiment, the conductive member 644 of the mid frame 640 may be disposed around the depression 641. For example, the conductive member 644 may be disposed at a position adjacent to the depression 641. In an embodiment, the conductive member 644 may surround at least a portion of the boundary of the depression 641. In an embodiment, two or more conductive members separated from each other may partially surround the boundary of the depression 641.

In an embodiment, when the antenna module 610 is seated in the depression 641, the conductive member 644 may be adjacent to the boundary of the antenna module 610. The conductive member 644 may be disposed along at least a portion of the boundary of the antenna module 610. Accordingly, at least a portion of the antenna module 610 may be surrounded by the conductive member 644. In an embodiment, the conductive member 644 may be disposed to surround the -y-direction boundary 631 of the antenna module 610. In this case, the electromagnetic field induced in the -y direction in the antenna module 610 may be shielded by the conductive member 644.

According to an embodiment, the conductive member 644 of the mid frame 640 has an electrical effect that the rear plate 580 has on the antenna radiation characteristic of the antenna module 610 (eg, a beam pattern or a polarization state of an electromagnetic wave). Can be reduced. This is because the conductive member 644 prevents the electromagnetic field radiated from the antenna module 610 from being waved through the rear plate 580.

FIG. 29 illustrates an electronic device including a conductive member of a mid frame and a conductive layer attached to a rear frame in an embodiment. 30 is a cross-sectional view of the electronic device taken along line III-III in FIG. 29.

Referring to FIG. 30, the antenna module 610 is disposed in the depression 841 of the mid frame 840 in the same manner as in the embodiment illustrated in FIG. 27. However, referring to FIG. 29, unlike the embodiment of FIG. 27, in an embodiment, the conductive member 844 may be opened in the -y axis direction. For example, the conductive member 844 of the mid frame 840 may surround only a part of the -y direction boundary 631 of the antenna module 610. The shape and position of the conductive member 844 shown in FIG. 29 are only examples. For example, the length of the conductive member 844 extending along the boundary of the antenna module 610 may be different from that illustrated in FIG. 29.

A part of the electromagnetic field generated by the antenna module 610 may pass through the portion 845 not surrounded by the conductive member 844 and may be induced in the -y direction. The electromagnetic field induced in the -y direction is guided through the rear plate 580, which may cause performance degradation of the antenna module 610. In an embodiment, the electromagnetic field induced in the -y direction by the antenna module 610 may be shielded by a conductive layer 620a, which will be described later.

In an embodiment, the electronic device may include a conductive layer 620a disposed under the rear plate 580. The conductive layer 620a of FIG. 29 is substantially the same as the conductive layer 620a of FIGS. 6 to 11, and redundant descriptions are omitted. For example, the conductive layer 620a is a second portion of the rear plate 580 so as not to overlap with the antenna module 610 disposed under the first portion 581 of the rear plate 580 when looking at the xy plane. 582 can be attached below.

In an embodiment, the conductive layer 620a may be positioned in a region corresponding to a portion 845 of the boundary of the antenna module 610 that is not surrounded by the conductive member 844. For example, the conductive layer 620a may be disposed along a path in which a portion of the electromagnetic field generated from the antenna module 610 passing through the portion 845 not surrounded by the conductive member 844 is induced (or waveguided). I can. In an embodiment, the width of the conductive layer 620a may correspond to the length of the portion 845 of the -y-axis boundary 631 of the antenna module 610 that is not wrapped by the conductive member 844. Accordingly, the electromagnetic field induced in the -y direction by the antenna module 610 may be shielded by the conductive layer 620a.

In an embodiment, the portable communication device (eg, the electronic device 500 of FIG. 5A) includes a display (eg, the display 530 of FIG. 8) forming a front surface of the portable communication device, and a rear surface of the portable communication device. A plate formed and comprising a non-conductive material (e.g., the rear plate 580 of FIG. 6), the plate comprising a first side facing outward and a second side facing inward of the portable communication device, the second A first antenna module (eg, the antenna module 610 of FIG. 24) attached to the first area of the surface (eg, the first portion 581 of FIG. 24) or positioned adjacent to the first area, and the second A second antenna module (eg, the antenna 570 of FIG. 24) attached to a second area of the surface (eg, the third portion 583 of FIG. 24) or positioned adjacent to the second area, and the second Includes a conductive member (eg, conductive layer 620a in FIG. 24) formed or attached to a third area (eg, the second portion 582 in FIG. 24) between the first area and the second area of the surface In addition, some of the radio waves radiated from the first antenna module toward the second antenna module through the plate may be at least partially blocked by the conductive member.

In an embodiment, the first antenna module is substantially perpendicular to a first direction from the first antenna module toward the second antenna module (eg, the y-axis direction in FIG. 6), and is substantially parallel to the rear surface. In two directions (eg, in the x-axis direction in FIG. 6 ), the conductive member has a first width (eg, in the first width w1 in FIG. 6 ), and the conductive member is in the second direction, and the first It may have a second width larger than the width (eg, the second width w2 in FIG. 6 ).

In an embodiment, the conductive member may be grounded through another component in the portable communication device except for the first antenna module and the second antenna module.

In one embodiment, the other component may include a bracket that at least partially supports the plate or the display, and the conductive member may be electrically connected to the ground of the bracket.

In an embodiment, the conductive member is spaced apart from the first antenna module by a first distance (eg, the first distance d1 in FIG. 6), and a second distance greater than the first distance from the second antenna module ( Example: It can be separated by the second distance d2 of FIG. 6.

In an embodiment, the conductive member may be deposited on the third area.

In an embodiment, a film positioned between the third region and the conductive member (eg, the film 620b of FIG. 25 ), and an adhesive layer positioned between the third region and the film may be included.

In one embodiment, the plate may be formed of glass.

In one embodiment, the first antenna module includes a first printed circuit board (eg, the first printed circuit board 611 of FIG. 7A) and a first antenna (eg, the first printed circuit board 611 of FIG. 7A). 1 array 710), and the second antenna module may include a second printed circuit board and a second antenna positioned on the second printed circuit board.

In an embodiment, the second antenna may include a coil configured to support near field communication.

In an embodiment, the second antenna module may include a non-conductive member positioned between the plate and the second printed circuit board.

In an embodiment, the portable communication device includes a display forming a front surface of the portable communication device, a plate forming a rear surface of the portable communication device and including a non-conductive material, the plate being a first surface facing the outside of the portable communication device And an inwardly facing second side, an antenna formed or attached to or positioned adjacent to the first area of the second side, a component formed or attached to the second area of the second side, And a conductive member formed or attached to a third area between the first area and the second area of the second surface, and some of the radio waves radiated from the antenna toward the component through the plate It can be at least partially blocked by the conductive member.

In an embodiment, the antenna is substantially perpendicular to a first direction from the antenna to the component, and in a second direction substantially parallel to the rear surface, has a first width, and the conductive member is In the second direction, it may have a second width greater than the first width.

In an embodiment, the conductive member may be spaced apart from the antenna by a first distance, and may be spaced apart from the component by a second distance greater than the first distance.

In one embodiment, a film positioned between the third region and the conductive member, and an adhesive layer positioned between the third region and the film may be included.

In an embodiment, the antenna may include a first printed circuit board on which the antenna is positioned, and the component may include a second printed circuit board and a second antenna on the second printed circuit board.

In one embodiment, a shielding member positioned adjacent to the antenna is included, and the shielding member is opened in a first direction from the antenna toward the second antenna, and at least a portion is disposed in a second direction different from the first direction. It may include a conductive pattern.

In one embodiment, the portable communication device includes a display forming a front surface of the portable communication device, a plate forming a rear surface of the portable communication device and including a dielectric material, and positioned below and spaced apart from the plate. Positioned antenna module, the radio wave generated from the antenna module may pass through the plate and be radiated to the outside of the portable communication device, located under the plate, and having a different dielectric constant than the plate A dielectric member, the dielectric member being positioned away from the antenna module in a direction parallel to the plate, positioned under the plate and extending toward the dielectric member at a portion adjacent to the antenna module It may include a conductive member.

In an embodiment, the antenna module is substantially perpendicular to a first direction from the antenna module to the dielectric member, in a second direction substantially parallel to the plate, has a first width, and The member may have a second width greater than the first width in the second direction.

In an embodiment, the conductive member may be grounded through another component in the portable communication device other than the antenna module.

The embodiments of the present invention disclosed in the present specification and drawings are only provided with specific examples to easily explain the technical content according to the embodiments of the present invention and to aid understanding of the embodiments of the present invention, and limit the scope of the embodiments of the present invention. I don't want to. Therefore, the scope of the various embodiments of the present invention should be interpreted as being included in the scope of the various embodiments of the present invention in addition to the embodiments disclosed herein, all changes or modifications derived based on the technical idea of the various embodiments of the present invention.

500: electronic device 520: front plate
530: display 580: back plate
510: side bezel structure 540: second printed circuit board
610: antenna module 620: conductive layer
550: battery

Claims (20)

In the portable communication device,
A display forming a front surface of the portable communication device;
A plate forming a rear surface of the portable communication device and comprising a non-conductive material, the plate including a first surface facing outward and a second surface facing inward of the portable communication device;
A first antenna module attached to a first area of the second surface or positioned adjacent to the first area;
A second antenna module attached to a second area of the second surface or positioned adjacent to the second area; And
And a conductive member formed or attached to a third region between the first region and the second region of the second surface,
Some of the radio waves radiated from the first antenna module that are directed to the second antenna module through the plate are at least partially blocked by the conductive member. The method of claim 1,
The first antenna module has a first width in a second direction substantially perpendicular to a first direction from the first antenna module toward the second antenna module and substantially parallel to the rear surface, and
The conductive member has a second width greater than the first width in the second direction. The method of claim 1,
The conductive member is grounded through another component in the portable communication device, except for the first antenna module and the second antenna module. The method of claim 3,
The other component includes a bracket that at least partially supports the plate or the display, and the conductive member is electrically connected to the ground of the bracket. The method of claim 1,
The conductive member is spaced apart from the first antenna module by a first distance and spaced apart from the second antenna module by a second distance greater than the first distance. The method of claim 1,
The conductive member is deposited on the third area. The method of claim 1,
A film positioned between the third region and the conductive member; And
And an adhesive layer positioned between the third region and the film. The method of claim 1,
The plate is formed of glass, portable communication device. The method of claim 1,
The first antenna module includes a first printed circuit board and a first antenna located on the first printed circuit board, and
The second antenna module includes a second printed circuit board and a second antenna located on the second printed circuit board. The method of claim 9,
The second antenna comprises a coil configured to support near field communication. The method of claim 9,
The second antenna module includes a non-conductive member positioned between the plate and the second printed circuit board. In the portable communication device,
A display forming a front surface of the portable communication device;
A plate forming a rear surface of the portable communication device and comprising a non-conductive material, the plate including a first surface facing outward and a second surface facing inward of the portable communication device;
An antenna formed or attached to a first region of the second surface or positioned adjacent to the first region;
A component formed or attached to a second region of the second side; And
And a conductive member formed or attached to a third region between the first region and the second region of the second surface,
A portable communication device, wherein some of the radio waves radiated from the antenna directed to the component through the plate are at least partially blocked by the conductive member. The method of claim 12,
The antenna has a first width, in a second direction substantially perpendicular to a first direction from the antenna to the component and substantially parallel to the rear surface,
The conductive member has a second width greater than the first width in the second direction. The method of claim 12,
The conductive member is spaced apart from the antenna by a first distance and spaced apart from the component by a second distance greater than the first distance. The method of claim 12,
A film positioned between the third region and the conductive member; And
And an adhesive layer positioned between the third region and the film. The method of claim 12,
And a first printed circuit board on which the antenna is located,
Wherein the component includes a second printed circuit board and a second antenna located on the second printed circuit board. The method of claim 16,
And a shielding member positioned adjacent to the antenna, the shielding member opening in a first direction from the antenna toward the second antenna, and at least partially disposed in a second direction different from the first direction. Containing, portable communication device. In the portable communication device,
A display forming a front surface of the portable communication device;
A plate forming a rear surface of the portable communication device and comprising a dielectric material;
An antenna module positioned below the plate, and radio waves generated from the antenna module may pass through the plate and be radiated to the outside of the portable communication device;
A dielectric member positioned under the plate and having a dielectric constant different from that of the plate, the dielectric member being positioned away from the antenna module in a direction parallel to the plate,
An electronic device comprising a conductive member positioned under the plate and extending toward the dielectric member at a portion adjacent the antenna module. The method of claim 18,
The antenna module has a first width, in a second direction substantially perpendicular to a first direction from the antenna module toward the dielectric member, and substantially parallel to the plate, and
The conductive member has a second width greater than the first width in the second direction. The method of claim 19,
The conductive member is grounded through another component in the portable communication device, except for the antenna module.

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