KR20210001813A - Printed circuit board and electronic device comprising the same - Google Patents

Abstract

The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes: a first substrate having a through portion; a second substrate which is disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate; and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates. The present invention provides the printed circuit board capable of sufficiently securing a component mounting space through efficient space utilization.

Description

Printed circuit board and electronic devices including the same {PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING THE SAME}

The present disclosure relates to a printed circuit board and an electronic device including the same.

In electronic devices such as smartphones, as the importance of camera performance continues to increase, the number of camera pixels or cameras is increasing. In addition, in order to improve the utilization of multimedia, the speaker of the upper receiver is also larger than a certain size. For this reason, the space for arranging the camera module and/or the speaker is also continuously increasing. Therefore, in recent years, securing a space for mounting parts of the main board is emerging as an important technology.

One of the various objects of the present disclosure is to provide a printed circuit board capable of sufficiently securing a component mounting space through efficient space utilization and an electronic device including the same. In addition, another of the various objects of the present disclosure is to provide a printed circuit board and an electronic device including the same, which can have a multi-layered structure through a relatively simple process and can reduce costs.

One of the various solutions proposed through the present disclosure is that the first and second substrates are connected by a flexible substrate, and at this time, the second substrate and the flexible substrate are in the through portion formed in the first substrate before the flexible substrate is bent. It is to provide a printed circuit board on which the substrate is disposed. In addition, the other one of the various solutions proposed through the present disclosure is that in the above-described printed circuit board, the flexible substrate is bent to implement a multilayer structure by the first and second substrates, and at this time, the first and second substrates Each electronic component can be mounted and an electronic device can be further arranged separately in the through part.

For example, a printed circuit board according to an example proposed in the present disclosure includes a first substrate having a through portion, a second substrate disposed within the through portion of the first substrate and at least a part of a side surface surrounded by the first substrate, And a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.

For example, the electronic device according to an example proposed in the present disclosure includes a first substrate having a through portion, a flexible substrate connected to the first substrate in the through portion, and connected to the flexible substrate, and at least part of the first A second substrate disposed on the first substrate so as to overlap the substrate, a first electronic component disposed on at least one surface of the first substrate, and a second electronic component disposed on at least one surface of the second substrate It may include a printed circuit board.

As one of the various effects of the present disclosure, a printed circuit board capable of sufficiently securing a component mounting space through efficient space utilization and an electronic device including the same may be provided. In addition, as another effect of the various effects of the present disclosure, it is possible to provide a printed circuit board and an electronic device including the same, which can have a multilayer structure through a relatively simple process and can reduce costs.

1 is a block diagram schematically showing an example of an electronic device system.
2 is a perspective view schematically showing an example of an electronic device.
3 is a perspective view schematically showing an example of a printed circuit board.
FIG. 4 is a schematic perspective view of the printed circuit board of FIG. 3 after the flexible board is bent.
5A and 5B are cross-sectional views schematically illustrating that first and second connectors are applied between the first and second substrates after the flexible substrate of the printed circuit board of FIG. 3 is bent.
6A and 6B are plan views schematically showing first and second surfaces of the first substrate of the printed circuit board of FIG. 3, respectively.
7A and 7B are plan views schematically showing the third and fourth surfaces of the second substrate of the printed circuit board of FIG. 3, respectively.
8 is a perspective view schematically showing another example of a printed circuit board.
9 is a schematic perspective view of the printed circuit board of FIG. 8 after the flexible board is bent.
10 is a perspective view schematically showing another example of a printed circuit board.
FIG. 11 is a schematic perspective view of the printed circuit board of FIG. 10 after the flexible board is bent.

Hereinafter, the present disclosure will be described with reference to the accompanying drawings. In the drawings, the shapes and sizes of elements may be exaggerated or reduced for clearer explanation.

Electronics

1 is a block diagram schematically showing an example of an electronic device system.

Referring to the drawings, the electronic device 1000 accommodates a main board 1010. A chip-related component 1020, a network-related component 1030, and other components 1040 are physically and/or electrically connected to the main board 1010. These are also combined with other electronic components to be described later to form various signal lines 1090.

The chip-related parts 1020 include memory chips such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory; Application processor chips such as a central processor (eg, a CPU), a graphics processor (eg, a GPU), a digital signal processor, an encryption processor, a microprocessor, and a microcontroller; Logic chips such as analog-to-digital converters and application-specific ICs (ASICs) are included, but are not limited thereto, and other types of chip-related electronic components may be included. In addition, of course, these electronic components 1020 may be combined with each other. The chip-related component 1020 may be in the form of a package including the above-described chip or electronic component.

As the network-related parts 1030, Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated as such and beyond, including, but not limited to, many other wireless or Any of the wired standards or protocols may be included. In addition, it goes without saying that the network-related component 1030 may be combined with the chip-related electronic component 1020 with each other.

The other parts 1040 include high frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (Electro Magnetic Interference) filters, MLCC (Multi-Layer Ceramic Condenser), etc. do. However, the present invention is not limited thereto, and a passive device in the form of a chip component used for various other uses may be included. In addition, it goes without saying that the other component 1040 may be combined with the chip-related electronic component 1020 and/or the network-related electronic component 1030 with each other.

Depending on the type of the electronic device 1000, the electronic device 1000 may include other electronic components that may or may not be physically and/or electrically connected to the main board 1010. Examples of other electronic components include a camera module 1050, an antenna module 1060, a display 1070, and a battery 1080. However, the present invention is not limited thereto, and includes audio codec, video codec, power amplifier, compass, accelerometer, gyroscope, speaker, mass storage device (eg, hard disk drive), compact disk (CD), digital versatile disk (DVD), etc. May be. In addition, it goes without saying that other electronic components used for various purposes may be included according to the type of the electronic device 1000.

The electronic device 1000 includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer. (computer), monitor (monitor), tablet (tablet), laptop (laptop), netbook (netbook), television (television), video game (video game), smart watch (smart watch), automotive (Automotive), etc. . However, the present invention is not limited thereto, and, of course, it may be any other electronic device that processes data in addition to these.

2 is a perspective view schematically showing an example of an electronic device.

Referring to the drawings, the electronic device may be, for example, a smartphone 1100. A printed circuit board 1110 used as a main board is accommodated in the smartphone 1100, and various electronic components 1120 are physically and/or electrically connected to the printed circuit board 1110. In addition, other electronic components that may or may not be physically and/or electrically connected to the printed circuit board 1110, such as the camera module 1130 and/or the speaker 1140, are accommodated therein. Some of the electronic components 1120 may be the above-described chip-related parts, for example, the semiconductor package 1121, but the present invention is not limited thereto. On the other hand, the electronic device is not necessarily limited to the smart phone 1100, and may be other electronic devices as described above, of course.

Printed circuit board

3 is a perspective view schematically showing an example of the printed circuit board, and FIG. 4 is a perspective view schematically showing an example of the printed circuit board of FIG. 3 after the flexible board is bent.

5A and 5B are cross-sectional views schematically illustrating that first and second connectors are applied between the first and second substrates after the flexible substrate of the printed circuit board of FIG. 3 is bent.

6A and 6B are plan views schematically showing the first and second surfaces of the first substrate of the printed circuit board of FIG. 3, respectively, and FIGS. 7A and 7B are, respectively, of the second substrate of the printed circuit board of FIG. It is a plan view schematically showing the third and fourth surfaces.

Referring to the drawings, a printed circuit board 100A according to an example has a first surface 110a and a second surface 110b opposite to the first surface 110a, and the first and second surfaces 110a, 110b) A first substrate 110A having a through portion 110HA penetrating therebetween, a flexible substrate 120A connected to the first substrate 110A within the through portion 110HA, and the flexible substrate 120A And a second substrate 130A connected to and having a third surface 130a and a fourth surface 130b opposite to the third surface 130a. At this time, as shown in FIG. 3, before the connection substrate 120A is bent, the second substrate 130A may be disposed in the through portion 110HA, and at least a portion of the side surface thereof is the first substrate 110A. ) Can be surrounded by. Meanwhile, in an example, the through part 110HA has an exposed area. Before the flexible substrate 120A is bent, the second substrate 130A is disposed in the through part 110HA, and if necessary, a part of the through part 110HA is provided. The through part 110HA may be escaped through the exposed area. In other words, being disposed within does not necessarily mean that the entire configuration is disposed. The flexible substrate 120A may connect the first and second substrates 110A and 130A within the through portion 110HA of the first substrate 110A. For example, one side of the flexible substrate 120A may be connected to a wall surface of the through portion 110H of the first substrate 110A, and the other side may be connected to a side surface of the second substrate 130A. In addition, as shown in FIG. 4, after the connection substrate 120A is bent, the second substrate 130A may be disposed on the first substrate 110A, and the first substrate 110A on a plane And at least a portion of each of the second substrates 130A may overlap each other.

Meanwhile, as described above, in an electronic device such as a smartphone, as the importance of camera performance continues to increase, the number of pixels or cameras of a camera is increasing. In addition, in order to improve the utilization of multimedia, the speaker of the upper receiver is also larger than a certain size. For this reason, the space for arranging the camera module and/or speaker on the main board is continuously increasing. Therefore, in recent years, securing a space for mounting parts of the main board is emerging as an important technology. For example, it may be considered to apply a multilayered printed circuit board as a main board of a smartphone. To this end, it may be considered to prepare a main printed circuit board and a sub printed circuit board, and connect the main printed circuit board and the sub printed circuit board up and down using an interposer board. However, as for such a multilayered printed circuit board, at least three separately manufactured substrates are used, and in addition to the process of mounting components on these substrates, a separate assembly process is required to stack and connect these substrates up and down. The process is lengthened, and the cost may increase due to defects in the manufacturing process.

On the other hand, in the printed circuit board 100A according to an example, the first board 110A has a through part 110HA, and before the flexible board 120A is bent, the through part 110HA is provided with the flexible board 120A. ) And the second substrate 130A may be disposed. In other words, it basically has efficient space utilization even before it is applied to electronic devices. Further, after the flexible substrate 120A is bent, the second substrate 130A may be disposed on the first substrate 110A due to the bending of the flexible substrate 120A. For example, it may have a multilayer structure without having a separate interposer substrate or sub-substrate. In addition, since a separate assembly process is unnecessary, the manufacturing process is relatively simple, and cost reduction is also possible.

On the other hand, the printed circuit board 100A according to an example includes first and second connectors 180a between the first and second substrates 110A and 130A in a state of a multilayer structure after the flexible substrate 120A is bent. 180b) can be placed. For example, as shown in FIGS. 5A and 5B, the first connector 180a may be disposed on the first surface 110a of the first substrate 110A facing the second substrate 130A. In addition, a second connector 180b may be disposed on a third surface 130a of the second substrate 130A facing the first substrate 110A. The first and second connectors 180a and 180b may be connected to each other. In this case, the first and second substrates 110A and 130A may be electrically connected through a path through the first and second connectors 180a and 180b in addition to a path through the flexible substrate 120A. For example, signals having paths through wiring layers of the first and second substrates 110A and 130A may be electrically connected to each other through the first and second connectors 180a and 180b. Meanwhile, in the first and second connectors 180a and 180b, as shown in FIG. 5A, the first connector 180a has a convex portion P, and the second connector 180b has a concave portion R. Can have. Alternatively, in the first and second connectors 180a and 180b, as shown in FIG. 5B, the first connector 180a has a concave portion R, and the second connector 180b has a convex portion P. You can have it. The first and second connectors 180a and 180b may be connected by combining the concave portion R and the convex portion P.

Meanwhile, if necessary, one or more spacers may be further disposed between the first and second substrates 110A and 130A in a state of a multilayer structure after the flexible substrate 120A is bent. For example, one or more spacers may be disposed between the first surface 110a of the first substrate 110A and the third surface 130a of the second substrate 130A. Through this, in the state of the multilayer structure after the flexible substrate 120A is bent, the second substrate 130A may be stably disposed on the first substrate 110A. The spacers may physically contact the first surface 110a of the first substrate 110A and the third surface 130a of the second substrate 130A, respectively. The spacer may be thicker than each of the first and third electronic components 140a and 150a to be described later. The spacer may be made of various materials, and the shape and the like are not particularly limited. For example, the spacer may be an insulating film, an insulating substrate, a metal lump, a dummy part, or the like, and an adhesive film may be further attached thereto.

On the other hand, in the printed circuit board 100A according to an example, in the state of the multilayer structure after the flexible board 120A is bent, the through part 110HA is an empty space from the viewpoint of the printed circuit board 100A. Separate electronic components such as the camera module 200 and/or the speaker 300 may be disposed in the. For example, when the printed circuit board 100A according to an example is used as a main board of an electronic device such as a smartphone, as shown in FIGS. 6A and 6B, the first and/or The first and/or second electronic components 140a and 140b may be disposed on the second surfaces 110a and 110b, and as in FIGS. 7A and 7B, the third and/or fourth surfaces of the second substrate The third and/or fourth electronic components 150a and 150b may be disposed in the 130a and 130b. In addition, as shown in FIGS. 6A and 6B, the printed circuit board 100A is bent and empty from the perspective of the printed circuit board 100A. Separate fifth electronic components 200 and 300 that are not directly mounted on the printed circuit board 100A, such as the camera module 200 and/or the speaker 300, are disposed in the through part 110HA remaining as a space Can be. Meanwhile, the fifth electronic component 200 and 300 may be physically and/or electrically connected to the printed circuit board 100A through a connector or a separate board. For example, it may be electrically connected to at least one wiring layer among the first and second substrates 110A and 130A. It may not be connected if necessary. The fifth electronic components 200 and 300 may be other types of modules or chip packages, and are not particularly limited. In this way, since it can have a multi-layered structure with excellent space utilization, it can be usefully used as a main board in electronic devices such as smart phones.

Hereinafter, components of the printed circuit board 100A according to an example will be described in more detail with reference to the drawings.

The printed circuit board 100A includes the first board 110A, the flexible board 120A, and the second board 130A. In this case, each of the first and second substrates 110A and 130A may have higher rigidity than that of the flexible substrate 120A. Excellent rigidity means that it has relatively less bending properties under the same conditions. For example, the printed circuit board 100A according to an example may be a Rigid-Flexible Printed Circuit Board (RFPCB) having a rigid-flexible-rigid form. The cross-sectional structure of the RFPCB that can be applied to the printed circuit board 100A according to an example is not particularly limited, and may be a known cored type RFPCB having a relatively thick core layer therein, or formed through a coreless process. It may be a known coreless type RFPCB in which the core layer is omitted inside the bar.

Each of the first substrate 110A and the second substrate 130A may include an insulating layer, a wiring layer, and a via layer. The wiring layer may be disposed on or in the insulating layer. The via layer may pass through the insulating layer and electrically connect the wiring layers disposed on different layers. The number of layers of the insulating layer, the wiring layer, and the via layer is not particularly limited, and may be multiple layers or single layers, respectively, depending on the design.

An insulating material may be used as the material of the insulating layer, and in this case, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a glass fiber together with them (Glass Fiber, Glass Cloth, Glass Fabric) And/or a material including a reinforcing material such as an inorganic filler, for example, a prepreg, Ajinomoto Build-up Film (ABF), Photo Image-able Dielectric (PID), or the like may be used. However, the present invention is not limited thereto, and a glass plate or a ceramic plate may be used as a material for a specific insulating layer. If necessary, LCP (Liquid Crystal Polymer) having a low dielectric loss may be used. When a plurality of insulating layers are used, the material of each insulating layer may be the same or different.

A metal material may be used as the material of the wiring layer, and the metal material is copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and lead. (Pb), titanium (Ti), or an alloy thereof may be used. The wiring layer may perform various functions according to the design of the corresponding layer. For example, it may include a ground (GrouND: GND) pattern, a power (PoWeR: PWR) pattern, a signal (S) pattern, and the like. Here, the signal S pattern includes various signals, for example, data signals, excluding the ground (GND) pattern, the power (PWR) pattern, and the like. If necessary, the ground (GND) pattern and the power (PWR) pattern may be the same pattern. Each of these patterns may include a line pattern, a plane pattern, and/or a pad pattern.

A metal material may be used as the material of the via layer. In this case, the metal material is copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and lead. (Pb), titanium (Ti), or an alloy thereof may be used. Each of the connection vias of the via layer may be completely filled with a metal material, or may be formed along a wall surface of the via hole. In addition, all known shapes, such as a tapered shape, an hourglass shape, and a cylindrical shape, can be applied. The via layer may also perform various functions according to the design design of the corresponding layer. For example, it may include a connection via for signal connection, a connection via for ground connection, and a connection via for power connection. The connection via for ground connection and the connection via for power connection may be the same connection via.

The flexible substrate 120A may basically include an insulating layer, and may include a wiring layer and/or a via layer as necessary. In this case, a material having sufficient flexibility may be used as the material of the insulating layer. For example, polyimide, polyetherene terephthalate, polyethylene naphthalate. An adhesive including an amorphous polyimide, a liquid crystal polymer, or an epoxy resin formulated to lower the modulus of elasticity as a main material may be used, but is not limited thereto. For example, in addition to this, other known materials having low elasticity and low rigidity may be used. Since the wiring layer and/or the via layer are substantially the same as described above, detailed descriptions will be omitted.

The through part 110HA penetrates between the first and second surfaces 110a and 110b of the first substrate 110A. As in one example, on a plane, the through portion 110HA is surrounded by the first substrate 110A, but may be exposed from the first substrate 110A in a partial area. However, even in this case, most of the area may be surrounded by the first substrate 110A. For example, in a plan view, a length of a side portion of the through portion 110HA surrounded by the first substrate 110A may be longer than a length of a side portion exposed from the first substrate 110H. Having such a through portion 110HA may be more preferable from the viewpoint of utilization of the public pipe. Meanwhile, the through part 110HA referred to in the present disclosure basically means a space in which at least a part of the flexible substrate 120A and the second substrate 130A can be accommodated before the flexible substrate 120A is bent. do. In this respect, before the flexible substrate 120A is bent, a part of the side surface of the second substrate 130A is exposed from the first substrate 110A, but the first The area of the side surface surrounded by the substrate 110A is larger than the area of the side surface exposed from the first substrate 110A of the second substrate 130A.

On the other hand, as shown in FIGS. 6A and 6B, on a plane, a first direction is referred to as a direction substantially perpendicular to an arbitrary substantially flat side surface of the first substrate 110A, and a second direction is referred to as a first direction. And a direction substantially parallel to but substantially opposite to the first direction, the third direction is referred to as another direction substantially perpendicular to the first direction, and the fourth direction is substantially parallel to the third direction, but the third direction When the direction is substantially opposite to, the through part 110HA may be blocked by the first substrate 110A in at least three of the first to fourth directions. For example, in one example, the through part 110HA is completely surrounded by the first substrate 110A in the first direction, the second direction, and the fourth direction, and in the third direction, the first substrate ( 110A). Having such a through portion 110HA may be more preferable from the viewpoint of utilization of the public pipe.

In addition, as in FIGS. 6A and 6B, on a plane, the through portion 110HA may not deviate from the outline OL of the first substrate 110A. Here, the outline OL means a line surrounding the outer side of an arbitrary exterior assuming that the through part 110HA is not formed in the first substrate 110A. For example, as in one example, when there is a region recessed toward the inside by the formation of the through portion 110HA in the first substrate 110A on the plane, the recessed region is An outline OL is defined by connecting the two edges E1 and E2 of the first substrate 110A with a virtual line. Meanwhile, in an example, when there are a plurality of recessed regions, at least a portion of the flexible substrate 120A and the second substrate 130A may be accommodated before the flexible substrate 120A is bent as described above. The recessed area is defined as the through part 110HA, and the outline OL is defined by connecting the two corners E1 and E2 in the recessed area with a virtual line.

Meanwhile, the through part 110HA may have a shape substantially corresponding to the shape of the second substrate 130A. For example, as shown in FIG. 3, before the flexible substrate 120A is bent, it may have a shape substantially corresponding to the third surface 130a of the second substrate 130A on a plane. In addition, as shown in FIG. 4, after the flexible substrate 120A is bent, a shape substantially corresponding to the symmetric shape of the shape of the fourth surface 130b of the second substrate 130A is formed on a plane. Can have. Here, having a substantially corresponding shape is a concept including not only having a completely the same shape, but also that an outline on a plane corresponds roughly. For example, in one example, the second substrate 130A has an approximately T-shape when viewed by rotating it to a specific position, and similarly, the through part 110HA also has an approximately T-shaped when viewed by rotating to a specific position. .

Meanwhile, an area of the through part 110HA on a plane may be larger than an area of each of the third and fourth surfaces 130a and 130b of the second substrate 130A. In this case, before bending, the second substrate 130A may be more effectively disposed in the through portion 110A together with the flexible substrate 120A. Therefore, it is possible to use the through portion more effectively.

The printed circuit board 100A may have a structure in a state before being bent, as shown in FIG. 3, or may have a structure in a state after being bent, as in FIG. 4. In addition, the printed circuit board 100A may have a structure in which the electronic component is not mounted, but may have a structure in the state in which the electronic component is mounted, if necessary. For example, as described above, the first electronic component 130a and/or the second electronic component 130b are provided on the first surface 110a and/or the second surface 110b of the first substrate 110A. ) Can be placed. In addition, as described above, the third electronic component 140a and/or the fourth electronic component 140b are disposed on the third surface 130a and/or the fourth surface 130b of the second substrate 130A. Can be placed. Each of the first to fourth electronic components 130a, 130b, 140a, and 140b may independently be a chip-related component, a network-related component, and other components. These components are each surface mounted on the printed circuit board 100A, and may be electrically connected to each other through internal wiring or the like of the printed circuit board 100A. These parts may be introduced into the structure of the printed circuit board 100A before bending. Alternatively, it may be introduced into the structure of the printed circuit board 100A after bending.

The chip-related components include, as described above, memory chips such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory; Application processor chips such as a central processor (eg, a CPU), a graphics processor (eg, a GPU), a digital signal processor, an encryption processor, a microprocessor, and a microcontroller; Logic chips such as analog-to-digital converters and ASICs are included, but are not limited thereto. It goes without saying that other types of electronic components related to chips may be included. In addition, of course, these electronic components can be combined with each other. The chip-related component may be in the form of a package including the above-described chip or electronic component.

As the network-related parts 1030, as described above, Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE, Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated as such and beyond, including, but not limited to, many other wireless or Any of the wired standards or protocols may be included. In addition, it goes without saying that the network-related components may be combined with the chip-related electronic components.

The other components include high frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC, EMI filters, MLCCs, and the like, as described above. However, the present invention is not limited thereto, and a passive device in the form of a chip component used for various other uses may be included. It goes without saying that the other components may be combined with the chip-related electronic components and/or the network-related electronic components.

FIG. 8 is a perspective view schematically showing another example of the printed circuit board, and FIG. 9 is a perspective view schematically showing the flexible board of the printed circuit board of FIG. 8 after being bent.

Referring to the drawings, a printed circuit board 100B according to another example also has a first surface 110a and a second surface 110b, as in the printed circuit board 100A according to the example, and the first and second surfaces A first substrate 110B having a through portion 110HB passing through (110a, 110b), a flexible substrate 120B connected to the first substrate 110B in the through portion 110HB, and the flexible substrate It includes a second substrate (130B) connected to (120B) and having a third surface (130a) and a fourth surface (140b). In this case, as shown in FIG. 8, before the flexible substrate 120B is bent, the second substrate 130B may be disposed in the through portion 110HB, and at least a portion of the side surface thereof is the first substrate 110B. It is surrounded by, but a portion of the side surface may be exposed from the first substrate 110B. In addition, the flexible substrate 120B may be disposed between the first and second substrates 110B and 130B in the through portion 110HB to connect the first and second substrates 110B and 130B. In addition, as shown in FIG. 9, after the flexible substrate 120B is bent, the second substrate 130B may be disposed on the first substrate 110B, and the first substrate 110B on a plane At least a portion of each of the first surface 110a of and the third surface 130a of the second substrate 130B may overlap each other. However, compared to the printed circuit board 100A according to the example above, the through part 110HB may have a larger area on a plane, and correspondingly, the second substrate 130B may also have the third surface 130a and The fourth surface 130b may have a larger area. For example, when the size of the camera module or the like disposed in the through portion 110HB increases, the areas of the through portion 110HB and the second substrate 130B may be further increased accordingly.

Other descriptions, such as a non-contradictory detailed description of the first and second substrates 110B and 130B, the flexible substrate 120B, and the through portion 110HB, or the mounting or arrangement of the electronic component The description, and a description of a case applied to an electronic device such as a smartphone, etc., are substantially the same as those described above with reference to FIGS. 1 to 7, and a detailed description will be omitted herein.

FIG. 10 is a perspective view schematically illustrating another example of the printed circuit board, and FIG. 11 is a perspective view schematically illustrating a flexible substrate of the printed circuit board of FIG. 10 after being bent.

Referring to the drawings, a printed circuit board 100C according to another example also has a first surface 110a and a second surface 110b, as in the printed circuit board 100A according to the example, and the first and second surfaces A first substrate 110C having a through portion 110HC penetrating between (110a, 110b), a flexible substrate 120C connected to the first substrate 110C within the through portion 110HC, and the flexible substrate It includes a second substrate (130C) connected to (120C) and having a third surface (130a) and a fourth surface (140b). In this case, as shown in FIG. 10, before the flexible substrate 120C is bent, the second substrate 130C may be disposed in the through portion 110HC, and the flexible substrate in the through portion 110HC. 120C may be disposed between the first and second substrates 110C and 130C to connect the first and second substrates 110C and 130C. In addition, as shown in FIG. 11, after the flexible substrate 120C is bent, the second substrate 130C may be disposed on the first substrate 110C, and the first substrate 110C on a plane. At least a portion of each of the first surface 110a of and the third surface 130a of the second substrate 130C may overlap each other. However, unlike in the printed circuit board 100A according to the above example, on a plane, the through part 110HC is completely surrounded by the first board 110C. For example, it is blocked by the first substrate 110C in all of the above-described first to fourth directions. For example, the through part 110HC may have a through hole shape. The first substrate 110C may have an inner side and an outer side separated from each other by the through portion 110HC. The second substrate 130C may be disposed in the through portion 110HC before the flexible substrate 120C is bent, so that all sides of the second substrate 130C may be surrounded by the first substrate 110C.

Other descriptions, such as non-contradictory detailed descriptions of the first and second substrates 110C and 130C, the flexible substrate 120C, and the through portion 110HC, or the mounting or arrangement of the electronic component The description, and a description of a case applied to an electronic device such as a smartphone, etc., are substantially the same as those described above with reference to FIGS. 1 to 7, and a detailed description will be omitted herein.

In the present disclosure, the lower side, the lower side, the lower side, etc. are used to mean the downward direction based on the cross section of the drawing for convenience, and the upper side, the upper side, the upper surface, etc. are used to mean the opposite direction. However, this has defined the direction for convenience of explanation, and the scope of the claims is not particularly limited by the description of this direction, and the upper/lower concept may be changed at any time.

In the present disclosure, the meaning of connection is a concept including not only direct connection but also indirect connection through an adhesive layer or the like. In addition, the meaning of being electrically connected is a concept that includes both physically connected and unconnected cases. In addition, expressions such as first and second are used to distinguish one component from another, and do not limit the order and/or importance of the corresponding components. In some cases, without departing from the scope of the rights, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

The expression example used in the present disclosure does not mean the same embodiment as each other, and is provided to emphasize and describe different unique features. However, the examples presented above are not excluded from being implemented in combination with other example features. For example, even if a matter described in a specific example is not described in another example, it may be understood as a description related to another example unless there is a description contradicting or contradicting the matter in another example.

The terms used in the present disclosure are used only to describe an example, and are not intended to limit the present disclosure. In this case, the singular expression includes a plural expression unless it clearly means differently in the context.

Claims (17)

A first substrate having a through portion;
A second substrate disposed within the penetrating portion of the first substrate and having at least a portion of a side surface surrounded by the first substrate; And
A flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates; Containing,
Printed circuit board.
The method of claim 1,
One side of the flexible substrate is connected to a wall surface of the penetrating portion of the first substrate, and the other side is connected to a side surface of the second substrate,
Printed circuit board.
The method of claim 1,
Part of the side surface of the second substrate is exposed from the first substrate,
Printed circuit board.
The method of claim 3,
An area of a side surface of the second substrate surrounded by the first substrate is larger than an area of a side surface of the second substrate exposed from the first substrate,
Printed circuit board.
The method of claim 1,
All sides of the second substrate are surrounded by the first substrate,
Printed circuit board.
The method of claim 1,
On a plane, the through portion of the first substrate has a shape substantially corresponding to the shape of the second substrate,
Printed circuit board.
The method of claim 1,
In a plane, the through portions are perpendicular to each other or parallel to each other, but are blocked with the first substrate in at least three directions of first to fourth directions facing different directions,
Printed circuit board.
The method of claim 7,
The through part is exposed from the first substrate in any one of the first to fourth directions,
Printed circuit board.
The method of claim 7,
The through part is blocked with the first substrate in all of the first to fourth directions,
Printed circuit board.
A first substrate having a penetration portion, a flexible substrate connected to the first substrate within the penetration portion, a second substrate connected to the flexible substrate and disposed on the first substrate so that at least a portion thereof overlaps the first substrate on a plane A printed circuit board including a first electronic component disposed on at least one surface of the first substrate, and a second electronic component disposed on at least one surface of the second substrate; Containing,
Electronics.
The method of claim 10,
The first and second electronic components are disposed on both surfaces of the first and second substrates, respectively,
Electronics.
The method of claim 10,
Each of the first and second electronic components includes at least one of a semiconductor chip, a passive device, and a chip package including the same,
Electronics.
The method of claim 10,
A third electronic component disposed in the through part; It further includes,
The third electronic component is electrically connected to at least one wiring layer of the first and second substrates,
Electronics.
The method of claim 13,
The third electronic component includes at least one of a camera module and a speaker,
Electronics.
The method of claim 10,
The printed circuit board further includes a first connector disposed on a surface of the first substrate facing the second substrate, and a second connector disposed on a surface of the second substrate facing the first substrate And
The first and second connectors are connected to each other,
The wiring layers of the first and second substrates are electrically connected to each other through the first and second connectors,
Electronics.
The method of claim 15,
One of the first and second connectors has a concave portion, and the other of the first and second connectors has a convex portion,
The first and second connectors are connected by combining the concave portion and the convex portion,
Electronics.
The method of claim 10,
The electronic device is a smartphone,
The printed circuit board is the main board of the smartphone,
Electronics.

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