KR20200130645A - Display apparatus and method for manufacturing the same - Google Patents

Abstract

According to embodiments of the present invention, disclosed are a display device and a method of manufacturing a display device that manufactures the display device. According to the present invention, the display device comprises: a substrate having a display area, an opening area disposed inside the display area, and a non-display area disposed to surround at least a portion of the opening area; a pixel defining layer disposed on the substrate and having at least one opening portion; an intermediate layer disposed on the opening portion; a counter electrode disposed to cover the intermediate layer and the pixel defining layer; and a capping layer disposed to cover the counter electrode. At least one end of the intermediate layer, the counter electrode, and the capping layer is disposed on the pixel defining layer, and the thickness thereof decreases as the distance from the opening portion increases.

Description

Display apparatus and method for manufacturing the display apparatus TECHNICAL FIELD

Embodiments of the present invention relate to an apparatus and a method, and more particularly, to a display device and a method of manufacturing the display device.

BACKGROUND OF THE INVENTION In recent years, display devices have diversified their uses. In addition, since the thickness of the display device is thinner and the weight is light, the range of use thereof is becoming wider.

As the area occupied by the display area among display devices is expanded, various functions grafting or linking to the display device are being added. As a way to add various functions while expanding the area, research on a display field that can arrange various components in the display area is being conducted.

The present invention provides a display device including a display panel having an area in which various types of components can be arranged in a display area, and a method of manufacturing a display device manufacturing the same. However, these problems are exemplary, and the scope of the present invention is not limited thereby.

According to an exemplary embodiment of the present invention, a substrate having a display area, an opening area disposed inside the display area, and a non-display area disposed to surround at least a portion of the opening area, and at least one or more A pixel definition layer having an opening, an intermediate layer disposed on the opening, a counter electrode disposed to cover the intermediate layer and the pixel definition layer, and a capping layer disposed to cover the counter electrode, the intermediate layer, the Disclosed is a display device in which at least one end of the counter electrode and the capping layer is disposed on the pixel definition layer, and the thickness becomes smaller as the distance increases from the opening.

In this embodiment, the intermediate layer may include at least one of a first functional layer and a second functional layer.

In the present embodiment, the intermediate layer, the counter electrode, and the capping layer may be sequentially stacked on the pixel definition layer.

In this embodiment, it may further include an encapsulation substrate disposed to be spaced apart from the substrate.

In this embodiment, it may further include a thin film encapsulation layer disposed on the capping layer.

In this embodiment, a through hole may be disposed in the opening area.

In another embodiment of the present invention, a step of forming a pixel definition layer on a substrate, and shielding to shield a portion of the pixel definition layer, an opening area of the substrate, and a non-display area disposed to surround at least a portion of the opening area. Disclosed is a method of manufacturing a display device including arranging a portion and forming an intermediate layer, a counter electrode, and a capping layer on the pixel defining layer and the shielding portion.

In this embodiment, the shielding part may include a first shielding part shielding the opening area, and a second shielding part connected to the first shielding part and disposed to be spaced apart from the upper surface of the pixel defining layer.

In this embodiment, the first shielding portion and the second shielding portion may be disposed at different heights.

In this embodiment, the shielding portion may further include an adhesive portion disposed on the first shielding portion.

In this embodiment, at least some of the adhesive portions may be disposed in the non-display area.

In this embodiment, the step of removing the shielding portion from the substrate may be further included.

In this embodiment, the step of attaching the encapsulation substrate and the substrate by disposing an encapsulation substrate on the substrate so as to be spaced apart from the substrate may be further included.

In this embodiment, the step of forming a thin film encapsulation layer on the pixel defining layer may be further included.

In this embodiment, it may further include forming a through hole in the substrate.

In another embodiment of the present invention, forming a pixel definition layer on a substrate, and shielding a portion of the pixel definition layer, an opening area of the substrate, and a non-display area disposed to surround at least a portion of the opening area. Attaching a shielding part to the open area and/or the non-display area, and forming an intermediate layer, a counter electrode, and a capping layer on the pixel defining layer and the shielding part, and a part of the shielding part is the pixel A method of manufacturing a display device disposed to be spaced apart from a defined layer is disclosed.

In this embodiment, a part of the shielding part may be disposed at a different height from the other part of the shielding part.

In this embodiment, the shielding part may be attached to the display area and/or the non-display area.

In this embodiment, the shielding part may be attached to the display area and/or the non-display area at a plurality of positions of the display area and/or the non-display area spaced apart from each other.

In this embodiment, the shielding part may be attached to the non-display area to surround the opening area.

In this embodiment, the step of removing the shielding portion from the substrate may be further included.

In this embodiment, the step of disposing the encapsulation substrate to be spaced apart on the substrate, and coupling the substrate to the encapsulation substrate may be further included.

In this embodiment, the step of forming a thin film encapsulation layer on the pixel defining layer may be further included.

In this embodiment, it may further include forming a through hole in the substrate.

Other aspects, features, and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

These general and specific aspects may be practiced using a system, method, computer program, or any combination of systems, methods, and computer programs.

The display device according to the exemplary embodiments may have a uniform surface, and a lifespan may be increased by preventing penetration of oxygen and moisture.

The method of manufacturing a display device according to the exemplary embodiments of the present invention can minimize defects in the display device when the display device is manufactured. In addition, in the method of manufacturing a display device according to the exemplary embodiments, it is possible to manufacture a display device having an increased lifespan.

1 is a perspective view illustrating a display device according to an exemplary embodiment of the present invention.
2 is a schematic cross-sectional view of a display device according to an exemplary embodiment of the present invention.
3 is a schematic cross-sectional view of a display device according to another exemplary embodiment of the present invention.
4 is a plan view of a display panel according to example embodiments.
5 is an equivalent circuit diagram illustrating one pixel of a display panel according to example embodiments.
6 is a cross-sectional view illustrating a display panel according to an exemplary embodiment of the present invention.
7 is a cross-sectional view illustrating the display panel illustrated in FIG. 6.
8 to 10 are cross-sectional views illustrating a method of manufacturing the display panel illustrated in FIG. 6.
11 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.
12 is a cross-sectional view illustrating a part of a method of manufacturing the display panel illustrated in FIG. 11.
13 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.
14 is a cross-sectional view illustrating a part of a method of manufacturing the display panel illustrated in FIG. 13.
15 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.
16 to 22 are cross-sectional views illustrating a method of manufacturing the display panel illustrated in FIG. 15.
23 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.
24 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.
25 is a perspective view illustrating an exemplary embodiment of a shielding part used when manufacturing a display panel according to example embodiments.
26 is a perspective view illustrating another embodiment of a shielding part used when manufacturing a display panel according to example embodiments.
27 is a perspective view illustrating still another embodiment of a shielding part used when manufacturing a display panel according to example embodiments.

Since the present invention can apply various transformations and have various embodiments, specific embodiments are illustrated in the drawings and will be described in detail in the detailed description. Effects and features of the present invention, and a method of achieving them will be apparent with reference to the embodiments described later in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding constituent elements are assigned the same reference numerals, and redundant descriptions thereof will be omitted. .

In the following embodiments, terms such as first and second are not used in a limiting meaning, but are used for the purpose of distinguishing one component from another component.

In the following examples, the meaning of “at least one of A and B” or “A and/or B” means A and B, A or B.

In the following examples, the singular expression includes the plural expression unless the context clearly indicates otherwise.

In the following embodiments, terms such as include or have means that the features or elements described in the specification are present, and do not preclude the possibility of adding one or more other features or elements in advance.

In the following embodiments, when a part such as a film, a region, or a component is on or on another part, not only the case directly above the other part, but also another film, region, component, etc. are interposed therebetween. This includes cases where there is.

In the drawings, components may be exaggerated or reduced in size for convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and the present invention is not necessarily limited to what is shown.

In the following embodiments, the x-axis, y-axis, and z-axis are not limited to three axes on a Cartesian coordinate system, and may be interpreted in a broad sense including them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

When a certain embodiment can be implemented differently, a specific process order may be performed differently from the described order. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the described order.

1 is a perspective view illustrating a display device according to an exemplary embodiment of the present invention.

Referring to FIG. 1, the display device 1 includes an opening area OP and a display area DA that is a second area at least partially surrounding the opening area OP. The display device 1 may provide a predetermined image by using light emitted from a plurality of pixels disposed in the display area DA. 1 shows that one opening area OP is disposed inside the display area DA, and the opening area OP may be entirely surrounded by the display area DA. The opening area OP may be an area in which a component to be described later with reference to FIG. 2 is disposed.

A second non-display area NDA2 is disposed as a third area between the opening area OP and the display area DA, which is a second area, and the display area DA is a first non-display area NDA1, which is a fourth area. ) Can be surrounded by. The second non-display area NDA2 and the first non-display area NDA1 may be a type of non-display area in which pixels are not disposed. The second non-display area NDA2 may be entirely surrounded by the display area DA, and the display area DA may be entirely surrounded by the first non-display area NDA1.

Hereinafter, as the display device 1 according to an exemplary embodiment of the present invention, an organic light emitting display device will be described as an example, but the display device of the present invention is not limited thereto. As another embodiment, another type of display device such as a quantum dot light emitting display may be used.

1 illustrates that one opening area OP is provided and is substantially circular, but the present invention is not limited thereto. It goes without saying that the number of the opening areas OP may be two or more, and each shape may be variously changed, such as a circle, an ellipse, a polygon, a star shape, and a diamond shape.

2 is a schematic cross-sectional view of a display device according to an exemplary embodiment of the present invention. 3 is a schematic cross-sectional view of a display device according to another exemplary embodiment of the present invention.

Referring to FIGS. 2 and 3, the display device 1 may include a display panel 10, an input sensing layer 40 disposed on the display panel 10, and an optical functional layer 50, These can be covered with windows 60. The display device 1 may be various types of electronic devices such as a mobile phone, a notebook, and a smart watch.

The display panel 10 may display an image. The display panel 10 includes pixels disposed in the display area DA. The pixels may include a display element and a pixel circuit connected thereto. The display element may include an organic light emitting diode or a quantum dot organic light emitting diode.

The input sensing layer 40 acquires coordinate information according to an external input, for example, a touch event. The input sensing layer 40 may include a sensing electrode or a touch electrode and trace lines connected to the sensing electrode. The input sensing layer 40 may be disposed on the display panel 10. The input sensing layer 40 may detect an external input using a mutual cap method or/and a self cap method.

The input sensing layer 40 may be formed directly on the display panel 10 or may be separately formed and then bonded through an adhesive layer such as an optical clear adhesive. For example, the input sensing layer 40 may be continuously formed after the process of forming the display panel 10, and in this case, the input sensing layer 40 may be understood as a part of the display panel 10, and input sensing An adhesive layer may not be interposed between the layer 40 and the display panel 10. 2 shows that the input sensing layer 40 is interposed between the display panel 10 and the optical functional layer 50, but as another embodiment, the input sensing layer 40 is disposed on the optical functional layer 50 Can be.

/2 위상지연자 및/또는

/4 위상지연자를 포함할 수 있다. 편광자 역시 필름타입 또는 액정 코팅타입일 수 있다. 필름타입은 연신형 합성수지 필름을 포함하고, 액정 코팅타입은 소정의 배열로 배열된 액정들을 포함할 수 있다. 위상지연자 및 편광자는 보호필름을 더 포함할 수 있다. 위상지연자 및 편광자 자체 또는 보호필름이 반사방지 층의 베이스층으로 정의될 수 있다.The optical functional layer 50 may include an antireflection layer. The antireflection layer may reduce reflectance of light (external light) incident from the outside toward the display panel 10 through the window 60. The anti-reflection layer may include a retarder and a polarizer. The phase retarder may be a film type or a liquid crystal coating type,

/2 phase delay and/or

May include /4 phase delay. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretchable synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase delayer and the polarizer may further include a protective film. The phase retarder and the polarizer itself or a protective film may be defined as the base layer of the antireflection layer.

In another embodiment, the antireflection layer may include a black matrix and color filters. The color filters may be arranged in consideration of the color of light emitted from each of the pixels of the display panel 10. In another embodiment, the antireflection layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, may be destructively interfered, and thus reflectance of external light may be reduced.

The optical functional layer 50 may include a lens layer. The lens layer may improve light emission efficiency of light emitted from the display panel 10 or reduce color deviation. The lens layer may include a layer having a concave or convex lens shape, or/and a plurality of layers having different refractive indices. The optical functional layer 50 may include all of the antireflection layer and the lens layer described above, or may include any one of them.

In an embodiment, the optical functional layer 50 may be continuously formed after the process of forming the display panel 10 and/or the input sensing layer 40. In this case, an adhesive layer may not be interposed between the optical functional layer 50, the display panel 10 and/or the input sensing layer 40.

The display panel 10, the input sensing layer 40, and/or the optical functional layer 50 may include an opening. In this regard, in FIG. 2, the display panel 10, the input sensing layer 40, and the optical function layer 50 each include first to third openings 10H, 40H, and 50H, respectively. It shows that the three openings 10H, 40H, 50H overlap each other. The first to third openings 10H, 40H, and 50H are positioned to correspond to the opening area OP. In another embodiment, one or more of the display panel 10, the input sensing layer 40, and the optical functional layer 50 may not include an opening. For example, any one or two components selected from the display panel 10, the input sensing layer 40, and the optical function layer 50 may not include an opening. Alternatively, the display panel 10, the input sensing layer 40, and the optical functional layer 50 may not include an opening as illustrated in FIG. 3.

As described above, the opening area OP may be a kind of component area (eg, a sensor area, a camera area, a speaker area, etc.) in which the component 30 for adding various functions to the display device 1 is located. The component 30 may be located within the first to third openings 10H, 40H and 50H as shown in FIG. 2. Alternatively, the component 30 may be disposed under the display panel 10 as shown in FIG. 3.

The component 30 may include an electronic component. For example, the component 30 may be an electronic element using light or sound. For example, an electronic element is a sensor that outputs or receives light, such as an infrared sensor, a camera that captures an image by receiving light, a sensor that measures a distance or recognizes a fingerprint by outputting and sensing light or sound, and a light. It may be a small lamp that outputs or may include a speaker that outputs sound. In the case of an electronic element using light, light of various wavelength bands such as visible light, infrared light, ultraviolet light, etc. may be used. In some embodiments, the opening area OP may be understood as a transmission area through which light or/and sound that is output from the component 30 or traveling toward the electronic element from the outside may be transmitted.

In another embodiment, when the display device 1 is used as a smart watch or an instrument panel for a vehicle, the component 30 may be a member such as a clock hand or a needle indicating predetermined information (eg, vehicle speed, etc.). When the display device 1 includes a clock hand or an instrument panel for a vehicle, the component 30 may pass through the window 60 and be exposed to the outside, and the window 60 has an opening corresponding to the opening area OP. Can include.

The component 30 may include component(s) related to the function of the display panel 10 as described above, or may include a component such as an accessory that increases the aesthetics of the display panel 10. Although not shown in FIGS. 2 and 3, a layer including an optically transparent adhesive or the like may be positioned between the window 60 and the optical functional layer 50.

4 is a plan view of a display panel according to example embodiments. 5 is an equivalent circuit diagram illustrating one pixel of a display panel according to example embodiments.

4 and 5, the display panel 10 includes an opening area OP as a first area, a display area DA as a second area, a second non-display area NDA2 and a fourth area as a third area. It may include a first non-display area NDA1 which is an area.

The display panel 10 includes a plurality of pixels P disposed in the display area DA. Each pixel P is a pixel circuit PC and a display element connected to the pixel circuit PC, as shown in FIG. 5, and may include an organic light emitting diode OLED. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel P may emit red, green, or blue light, or may emit red, green, blue, or white light through the organic light emitting diode OLED.

The second thin film transistor T2 is a switching thin film transistor, connected to the scan line SL and the data line DL, and data input from the data line DL based on the switching voltage input from the scan line SL. The voltage may be transmitted to the first thin film transistor T1. The storage capacitor Cst is connected to the second thin film transistor T2 and the driving voltage line PL, the voltage received from the second thin film transistor T2 and the first power supply voltage ELVDD supplied to the driving voltage line PL. The voltage corresponding to the difference of can be stored.

The first thin film transistor T1 is a driving thin film transistor, which is connected to the driving voltage line PL and the storage capacitor Cst, and corresponds to the voltage value stored in the storage capacitor Cst. OLED) can be controlled. The organic light emitting diode (OLED) may emit light having a predetermined luminance by a driving current. The counter electrode (eg, the cathode) of the organic light emitting diode OLED may receive the second power voltage ELVSS.

5 illustrates that the pixel circuit PC includes two thin film transistors and one storage capacitor, but the present invention is not limited thereto. The number of thin film transistors and the number of storage capacitors may be variously changed according to the design of the pixel circuit PC. For example, the pixel circuit PC may further include four or five or more thin film transistors in addition to the two thin film transistors described above.

In the first non-display area NDA1, a scan driver 1100 providing a scan signal to each pixel P, a data driver 1200 providing a data signal to each pixel P, and a first power supply voltage ELVDD ) And main power wirings (not shown) for providing the second power voltage ELVSS. 5 shows that the data driver 1200 is disposed adjacent to one side of the substrate 100, but according to another embodiment, the data driver 1200 includes a pad disposed on one side of the display panel 10 and It may be placed on an electrically connected flexible printed circuit board (FPCB).

For example, a wiring unit for supplying various signals and/or power applied to the display area DA may be disposed in the first non-display area NDA1. In this case, the wiring part may include a drive circuit. For example, the driving circuit may include at least one of a scan driving circuit (not shown), a terminal unit (not shown), a driving power supply wiring (not shown), and a second wiring, and controls an electrical signal applied to the display area DA. It may further include a thin film transistor for. Further, a partition wall or a trench may be disposed in the first non-display area NDA1 to block the flow of an organic layer used when manufacturing a display device.

Referring back to FIG. 4, the second non-display area NDA2 may surround the opening area OP on a plane. The second non-display area NDA2 and the open area OP are areas in which no display elements such as an organic light emitting diode emitting light are disposed, and are disposed around the open area OP in the second non-display area NDA2. Signal lines providing signals to the pixels P may pass.

In addition to the signal lines, a separate groove may be disposed in the second non-display area NDA2 as described above, although not shown in the drawing. In this case, a plurality of grooves may be provided, and the plurality of grooves may be disposed to be spaced apart from each other in the second non-display area NDA2.

6 is a cross-sectional view illustrating a display panel according to an exemplary embodiment of the present invention. 7 is a cross-sectional view illustrating the display panel illustrated in FIG. 6. In FIGS. 6 and 7, reference numeral C denotes an arbitrary straight line passing through the center of the opening area.

6 and 7, the display panel 10 includes a display layer 200 disposed on the substrate 100. The substrate 100 may include a glass material or a polymer resin. The substrate 100 may be formed in multiple layers. For example, the substrate 100 may include a first base layer 100-1, a first barrier layer 100-2, a second base layer 100-3, and a second base layer 100-1, as shown in the enlarged view of FIG. It may include two barrier layers 100-4.

Each of the first base layer 100-1 and the second base layer 100-3 may include a polymer resin. For example, the first base layer 100-1 and the second base layer 100-3 are polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), Polyethylene naphthalate (PEN, polyethyelenene napthalate), polyethylene terephthalide (PET, polyethyeleneterepthalate), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), cellulose triacetate (TAC) , Cellulose acetate propionate (CAP), and the like. The polymer resin described above may be transparent.

The first barrier layer 100-2 and the second barrier layer 100-4 are barrier layers that prevent the penetration of foreign substances, and contain a single layer containing inorganic materials such as silicon nitride (SiNx) and silicon oxide (SiOx). It can be layered or multilayered.

The display layer 200 includes a plurality of pixels. The display layer 200 may include a display element layer 200A including display elements disposed for each pixel, and a pixel circuit layer 200B including a pixel circuit and insulating layers disposed for each pixel. In this case, the insulating layer of the pixel circuit layer 200B is among the buffer layer 101, the first gate insulating layer 103, the second gate insulating layer 105, the interlayer insulating layer 107, and the planarization layer 109 to be described later. It may include at least one. Each pixel circuit may include a thin film transistor and a storage capacitor, and each display element may include an organic light-emitting diode (OLED).

Display elements of the display layer 200 may be covered with an encapsulation member such as the thin film encapsulation layer 500, and the thin film encapsulation layer 500 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. . When the display panel 10 includes a substrate 100 including a polymer resin and a thin film encapsulation layer 500 including an inorganic and organic encapsulation layer, the flexibility of the display panel 10 is improved. I can make it.

The display panel 10 may include a first opening 10H penetrating the display panel 10. The first opening 10H may be located in the opening area OP, and in this case, the opening area OP may be a kind of opening area. 6 illustrates that the substrate 100 and the thin film encapsulation layer 500 each include through holes 100H and 500H corresponding to the first opening 10H of the display panel 10. The display layer 200 may also include a through hole 200H corresponding to the opening area OP.

The display panel 10 includes a substrate 100 including a display area DA and a non-display area, and a thin film encapsulation layer 500 sealing the display area DA and the non-display area. In this case, the display panel 10 may include the display layer 200 and the thin film encapsulation layer 500 as described above.

The buffer layer 101 is positioned on the substrate 100 to reduce or block the penetration of foreign matter, moisture, or outside air from the lower portion of the substrate 100 and provide a flat surface on the substrate 100. The buffer layer 101 may include an inorganic material such as an oxide or nitride, an organic material, or an organic-inorganic composite, and may be formed of a single layer or a multilayer structure of an inorganic material and an organic material.

The first thin film transistor T1 includes a semiconductor layer A1, a first gate electrode G1, a source electrode S1, and a drain electrode D1, and a second thin film transistor T2, a semiconductor layer A2, And a second gate electrode G2, a source electrode S2, and a drain electrode D2.

Hereinafter, a case in which the thin film transistors T1 and T2 are of the top gate type is illustrated. However, the present embodiment is not limited thereto, and various types of thin film transistors such as a bottom gate type may be employed.

In addition, hereinafter, a case in which there are two thin film transistors T1 and T2 is illustrated, but is not limited thereto. In embodiments of the present invention, the display device may employ two or more thin film transistors T1 and T2 for one pixel. In some embodiments, various modifications are possible, such as six to seven thin film transistors (T1, T2) may be employed for one pixel.

The semiconductor layers A1 and A2 may include amorphous silicon or polycrystalline silicon. In another embodiment, the semiconductor layers A1 and A2 are indium (In), gallium (Ga), stainless (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium It may include an oxide of at least one material selected from the group including (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The semiconductor layers A1 and A2 may include a channel region and a source region and a drain region having a higher carrier concentration than the channel region.

A first gate electrode G1 is disposed on the semiconductor layer A1 with the first gate insulating layer 103 therebetween. The first gate electrode G1 includes molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like, and may be formed of a single layer or multiple layers. For example, the first gate electrode G1 may be a single layer of Mo.

The first gate insulating layer 103 is for insulating the semiconductor layer A1 and the first gate electrode G1, and is composed of silicon oxide (SiO ₂ ), silicon nitride (SiN _x ), silicon oxynitride (SiON), and aluminum. Oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ).

A second gate electrode G2 is disposed on the semiconductor layer A2 with the first gate insulating layer 103 and the second gate insulating layer 105 therebetween. The second gate electrode G2 may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and is formed as a multilayer or single layer including the above material. Can be. For example, the second gate electrode G2 may be a single layer of Mo or a multilayer of Mo/Al/Mo structure.

The second gate insulating layer 105 may include an inorganic material including oxide or nitride. For example, the second gate insulating layer 105 is silicon oxide (SiO ₂ ), silicon nitride (SiN _x ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), It may include tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO2).

The source electrodes S1 and S2 and the drain electrodes D1 and D2 are disposed on the interlayer insulating layer 107. The source electrodes S1 and S2 and the drain electrodes D1 and D2 may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like. It may be formed as a multi-layer or a single layer including. For example, the source electrodes S1 and S2 and the drain electrodes D1 and D2 may have a Ti/Al/Ti multilayer structure.

The interlayer insulating layer 107 is a silicon oxide (SiO _x ), silicon nitride (SiN _x ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O). ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ).

As described above, the first gate electrode G1 of the first thin film transistor T1 and the second gate electrode G2 of the second thin film transistor T2 may be disposed on different layers. Accordingly, the driving ranges of the first thin film transistor T1 and the second thin film transistor T2 can be differently adjusted.

The first electrode CE1 of the storage capacitor Cst may be formed of the same material on the same layer as the first gate electrode G1. The second electrode CE2 of the storage capacitor Cst overlaps the first electrode CE1 with the second gate insulating layer 105 therebetween. The second electrode CE2 may be formed of the same material on the same layer as the second gate electrode G2.

In FIG. 7, the storage capacitor Cst is shown not to overlap with the first thin film transistor T1 and the second thin film transistor T2. However, it is not limited thereto. For example, the storage capacitor Cst may be disposed to overlap the first thin film transistor T1. In some embodiments, the first electrode CE1 of the storage capacitor Cst may be integrally formed with the first gate electrode G1. That is, the first gate electrode G1 of the first thin film transistor T1 may function as the first electrode CE1 of the storage capacitor Cst.

A planarization layer 109 may be disposed on the source electrodes S1 and S2 and the drain electrodes D1 and D2, and the organic light emitting device 300 (OLED) may be disposed on the planarization layer 109. The planarization layer 109 may be formed of a single layer or multiple layers of an organic material. Organic substances are general-purpose polymers such as polymethylmethacrylate (PMMA) or polystylene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, arylether polymers, amide polymers, fluorine polymers, p-xylene polymers It may include polymers, vinyl alcohol-based polymers, and blends thereof. Further, the planarization layer 109 may be formed of a composite laminate of an inorganic insulating film and an organic insulating film.

The organic light emitting device 300 may be disposed on the planarization layer 109 in the display area DA of the substrate 100. The organic light emitting device 300 may include a pixel electrode 310, a counter electrode 330, and an intermediate layer 320 interposed therebetween.

The pixel electrode 310 makes electrical contact with one of the source electrode S1 and the drain electrode D1 of the first thin film transistor T1 through an opening formed in the planarization layer 109 and the like to be electrically connected to the first thin film transistor T1. It is connected by The pixel electrode 310 may be a reflective electrode. For example, the pixel electrode 310 may include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and compounds thereof, and a transparent or semitransparent electrode layer formed on the reflective film. I can. Transparent or translucent electrode layers include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3; indium oxide), and indium gallium oxide (IGO). ; Indium gallium oxide) and aluminum zinc oxide (AZO; aluminum zinc oxide) may be provided with at least one selected from the group.

A pixel defining layer 112 may be disposed on the planarization layer 109. The pixel defining layer 112 serves to define a pixel by having an opening corresponding to each subpixel, that is, an opening through which at least a central portion of the pixel electrode 310 is exposed. In addition, the pixel defining layer 112 increases the distance between the edge of the pixel electrode 310 and the counter electrode 330 above the pixel electrode 310, thereby generating an arc at the edge of the pixel electrode 310. Can play a role in preventing it. The pixel defining layer 112 may be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

The intermediate layer 320 includes a light emitting layer 322. The emission layer 322 may be formed of an organic material including a fluorescent or phosphorescent material emitting red, green, and blue light, and may be patterned to correspond to the pixel P in the display area DA. The intermediate layer 320 is at least one of a first functional layer 321 interposed between the emission layer 322 and the pixel electrode 310 and a second functional layer 323 interposed between the emission layer 322 and the counter electrode 330. It may include any one functional layer.

The first functional layer 321 may include at least one of a hole injection layer (HIL) and a hole transport layer (HTL).

The hole injection layer allows holes to be easily discharged from the anode, and the hole transport layer allows holes of the hole injection layer to be transferred to the light emitting layer.

The hole injection layer is a phthalocyanine compound such as copper phthalocyanine, DNTPD (N,N'-diphenyl-N,N'-bis-[4-(phenyl-m-tolyl-amino)-phenyl]-biphenyl-4,4'- diamine, N,N'-diphenyl-N,N'-bis-[4-(phenyl-m-tolyl-amino)-phenyl]-biphenyl-4,4'-diamine), m-MTDATA(4, 4',4"-tris(3-methylphenylphenylamino) triphenylamine, 4,4',4"-tris(3-methylphenylphenylamino)triphenylamine), TDATA(4,4'4"-Tris(N,N- diphenylamino)triphenylamine, 4,4',4"-tris(N,N'-diphenylamino)triphenylamine), 2T-NATA(4,4',4"-tris(N,-(2-naphthyl) -N-phenylamino}-triphenylamine, 4,4',4"-tris{N,-(2-naphthyl)-N-phenylamino}-triphenylamine), PEDOT/PSS (Poly(3,4-ethylenedioxythiophene) )/Poly(4-styrenesulfonate), poly(3,4-ethylenedioxythiophene)/poly(4-styrenesulfonate)), Pani/DBSA(Polyaniline/Dodecylbenzenesulfonic acid, polyaniline/dodecylbenzenesulfonic acid), Pani/ CSA (Polyaniline/Camphor sulfonic acid, polyaniline/camphor sulfonic acid) or PANI/PSS (Polyaniline)/Poly(4-styrenesulfonate) or polyaniline/poly(4-styrenesulfonate)), etc.

The hole transport layer includes carbazole derivatives such as N-phenylcarbazole and polyvinylcarbazole, TPD(N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1,1-biphenyl]-4, 4'-diamine, N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1,1-biphenyl]-4,4'-diamine), NPB(N,N'-di (1-naphthyl)-N,N'-diphenylbenzidine, N,N'-di(1-naphthyl)-N,N'-diphenylbenzidine), TCTA(4,4',4"-tris(N- Triphenylamine-based materials such as carbazolyl)triphenylamine, 4,4',4"-tris(N-carbazolyl)triphenylamine) may be included, but are not limited thereto.

The second functional layer 323 may include at least one of an electron transport layer (ETL) and an electron injection layer (EIL).

The electron injection layer allows electrons to be easily emitted from the cathode, and the electron transport layer allows electrons from the electron injection layer to be transferred to the light emitting layer.

The electron transport layer is Alq3, BCP (2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), Bphen (4 ,7-Diphenyl-1,10-phenanthroline, 4,7-diphenyl-1,10-phenanthroline), TAZ(3-(4-Biphenylyl)-4-phenyl-5-tert-butylphenyl-1,2 ,4-triazole, 3-(4-biphenylyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole), NTAZ(4-(Naphthalen-1-yl)-3, 5-diphenyl-4H-1,2,4-triazole, 4-(naphthalen-1-yl)-3,5-diphenyl-4H-1,2,4-triazole), tBu-PBD(2-( 4-Biphenylyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole, 2-(4-biphenylyl)-5-(4-tert-butylphenyl)-1,3,4- Oxadiazole), BAlq(Bis(2-methyl-8-quinolinolato-N1,O8)-(1,1'-Biphenyl-4-olato)aluminum, bis(2-methyl-8-quinolinolato-N1 ,O8)-(1,1'-biphenyl-4-orato)aluminum), Bebq2 (beryllium bis(benzoquinolin-10-olate, beryllium bis(benzoquinolin-10-noate)), ADN(9, 10-di(naphthalene-2-yl)anthrascene, 9,10-di(naphthalen-2-yl)anthrascene), and the like, but are not limited thereto.

The electron injection layer may include a material such as LiF, NaCl, CsF, Li2O, BaO, or Liq, but is not limited thereto.

Of course, the intermediate layer 320 is not necessarily limited thereto, and may have various structures. In addition, the intermediate layer 320 may include an integral layer over the plurality of pixel electrodes 310, or may include a layer patterned to correspond to each of the plurality of pixel electrodes 310. Hereinafter, for convenience of description, the light emitting layer 322 is patterned to correspond to each of the plurality of pixel electrodes 310, and the first functional layer 321 and the second functional layer 323 are a plurality of pixel electrodes 310. It will be described in detail focusing on the case of being integrally disposed on the substrate 100 over the fields.

The counter electrode 330 is disposed above the display area DA, and may be disposed to cover the display area DA as illustrated in FIG. 7. That is, the counter electrode 330 may be formed integrally with the plurality of organic light emitting devices and may correspond to the plurality of pixel electrodes 310. In another embodiment, the counter electrode 330 may be disposed to cover the upper portion of the display area DA and a portion of the non-display area. Hereinafter, for convenience of explanation, the counter electrode 330 will be described in detail focusing on a case where the counter electrode 330 is disposed to cover the upper portion of the display area DA and a portion of the non-display area.

The counter electrode 330 may be a translucent electrode. For example, the counter electrode 330 may be a transparent or translucent electrode, and may be formed of a metal thin film having a small work function including Li, Ca, LiF/Ca, LiF/Al, Al, Ag, Mg, and compounds thereof. have. In addition, a transparent conductive oxide (TCO) film such as ITO, IZO, ZnO, or In ₂ O ₃ may be further disposed on the metal thin film.

As the pixel electrode 310 is provided as a reflective electrode and the counter electrode 330 is a light-transmitting electrode, light emitted from the intermediate layer 320 may be of a front emission type emitted toward the counter electrode 330. However, the present exemplary embodiment is not limited thereto, and may be a bottom emission type in which light emitted from the intermediate layer 320 is emitted toward the substrate 100. In this case, the pixel electrode 310 may be configured as a transparent or translucent electrode, and the counter electrode 330 may be configured as a reflective electrode. In addition, the display device of this embodiment may be a two-sided light emitting type that emits light in both the front and rear directions.

A capping layer 400 may be disposed on the counter electrode 330. In this case, the capping layer 400 may directly contact the counter electrode 330. The capping layer 400 may have a lower refractive index than the counter electrode 330 and a higher refractive index than the first inorganic encapsulation layer 510. The capping layer 400 may serve to improve light efficiency by reducing a rate at which light generated from the intermediate layer 320 including the light emitting layer 322 is totally reflected and is not emitted to the outside.

The thickness of at least one end of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 as described above is as disclosed in FIG. It may gradually decrease as it goes toward the opening area OP. A region in which the thickness of at least one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 is variable is the pixel definition layer 112 It can be placed on a flat top surface. In particular, a region in which the thickness of the ends of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 is variable is on the upper surface of the pixel defining layer 112. It can be placed on a flat part.

The thin film encapsulation layer 500 may cover the display area DA and the non-display area to prevent penetration of external moisture and oxygen. The thin film encapsulation layer 500 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. In FIG. 7, an example in which the thin film encapsulation layer 500 includes two inorganic encapsulation layers 510 and 530 and one organic encapsulation layer 520 is shown, but the stacking order and the number of stacking are shown in FIG. 7. Is not limited to.

The first inorganic encapsulation layer 510 covers the counter electrode 330 and may include silicon oxide, silicon nitride, and/or silicon oxynitride. Of course, other layers such as the capping layer 400 may be interposed between the first inorganic encapsulation layer 510 and the counter electrode 330 as needed. Since the first inorganic encapsulation layer 510 is formed along the lower structure, the top surface thereof is not flat as shown in FIG. 7.

The organic encapsulation layer 520 covers the first inorganic encapsulation layer 510, and unlike the first inorganic encapsulation layer 510, the top surface may be substantially flat. Specifically, the upper surface of the organic encapsulation layer 520 may be substantially flat in a portion corresponding to the display area DA. The organic encapsulation layer 520 may include one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. have. The second inorganic encapsulation layer 530 covers the organic encapsulation layer 520 and may include silicon oxide, silicon nitride, and/or silicon oxynitride.

As such, the thin film encapsulation layer 500 includes the first inorganic encapsulation layer 510, the organic encapsulation layer 520 and the second inorganic encapsulation layer 530, and the thin film encapsulation layer 500 is formed through such a multilayer structure. Even if a crack occurs within, it is possible to prevent such cracks from being connected between the first inorganic encapsulation layer 510 and the organic encapsulation layer 520 or between the organic encapsulation layer 520 and the second inorganic encapsulation layer 530. have. Through this, it is possible to prevent or minimize the formation of a path through which moisture or oxygen from the outside penetrates into the display area DA and the non-display area. The second inorganic encapsulation layer 530 makes contact with the first inorganic encapsulation layer 510 at its edge located outside the display area DA, so that the organic encapsulation layer 520 is not exposed to the outside.

A partition wall 120 is disposed in the non-display area of the substrate 100.

When forming the organic encapsulation layer 520 of the thin film encapsulation layer 500 for sealing the display area DA and the non-display area, the partition wall 120 blocks the organic material from flowing in the edge direction of the substrate 100. It is possible to prevent the formation of the edge tail of the organic encapsulation layer 520.

At least one partition wall 120 as described above may be provided. In this case, when a plurality of partition walls 120 are provided, the plurality of partition walls 120 include a first partition wall 120A and a second partition wall 120B spaced apart from each other.

At least one of the first partition wall 120A and the second partition wall 120B may be formed of a plurality of layers. In FIG. 7, the first partition wall 120A has a structure in which a first layer 121A formed of the same material as the planarization layer 109 and a second layer 123A formed of the same material as the pixel definition layer 112 are stacked. The second partition wall 120B is a structure in which a first layer 121B formed of the same material as the planarization layer 109 and a second layer 123B formed of the same material as the pixel definition layer 112 are stacked. Is shown. However, it is not limited thereto. One of the first partition wall 120A and the second partition wall 120B may be formed as a single layer, both have a two-layer structure, or both have a three-layer structure. In addition, an additional partition wall disposed to be spaced apart from the first partition wall 120A and the second partition wall 120B may be further included.

Although not shown in FIG. 7, the spacer is disposed on a flat portion of the pixel definition layer 112 and may protrude from the flat surface of the pixel definition layer 112 to the thin film encapsulation layer 500. The spacer may be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

As the partition wall 120 includes a plurality of partition walls, it is possible to more effectively prevent an overflow phenomenon of organic matter when the organic encapsulation layer 520 is formed.

8 to 10 are cross-sectional views illustrating a method of manufacturing the display panel illustrated in FIG. 6. In FIGS. 8 to 10, reference numeral C denotes an arbitrary straight line passing through the center of the opening area, and the same reference numerals as in FIGS. 6 and 7 in the reference numerals shown in FIGS. 8 to 10 denote the same member.

Referring to FIGS. 8 to 10, when manufacturing the display panel 10, the organic light emitting device 300 may be formed after forming an insulating layer and a pixel circuit on the substrate 100.

Specifically, after forming the pixel electrode 310 or before forming the pixel electrode 310, the shielding part 20 is partially opened or the second non-display area NDA2 or the open area OP and the second 2 It may be disposed on the substrate 100 to shield the entire non-display area NDA2. Hereinafter, for convenience of description, it is assumed that the shielding part 20 is disposed on the substrate 100 to shield the entire opening area OP and the second non-display area NDA2 after forming the pixel electrode 310. It will be described in detail mainly.

The shielding part 20 as described above may include a first shielding part 21, a second shielding part 22, and an adhesive part 23. The first shielding part 21 and the second shielding part 22 may be integrally formed with each other or may be formed separately. For example, the first shielding portion 21 and the second shielding portion 22 may include a heat-resistant material having a melting point of 350 degrees Celsius or more and a range of 450 degrees or less. In particular, the first shielding part 21 and the second shielding part 22 are made of polyimide resin through injection, or the first shielding part 21 and the second shielding part 22 are formed in a film form. It is also possible to attach or combine with each other. In another embodiment, the first shielding portion 21 and the second shielding portion 22 may be integrally formed through a process such as extrusion or compression of plastic or metal including a thermosetting material. As another embodiment, the first shielding portion 21 and the second shielding portion 22 may be formed of a synthetic resin and/or metal, using a mold.

The first shielding part 21 and the second shielding part 22 as described above may be disposed at different heights. In this case, a part of the first shielding part 21 may be formed to be bent to be connected to the second shielding part 22. In particular, in this case, the bottom surface of the first shielding portion 21 and the bottom surface of the second shielding portion 22 may shield different portions from each other. For example, the bottom surface of the first shielding part 21 may shield part of the opening area OP and the second non-display area NDA2. The bottom surface of the second shielding part 22 may shield a part of the second non-display area NDA2 or the entire second non-display area NDA2. In addition, the second shielding portion 22 may not contact the uppermost layer of the layers stacked on the portion of the substrate 100 that the second shielding portion 22 shields. That is, the bottom surface of the second shielding portion 22 does not contact the uppermost side (or uppermost surface) of the pixel defining layer 119 disposed in the second non-display area NDA2, and is from the uppermost side of the pixel defining layer 119. Can be separated. In this case, when a separate spacer is disposed on the pixel definition layer 119, the bottom surface of the second shielding portion 22 may or may not contact the uppermost side (or uppermost surface) of the spacer.

The adhesive part 23 may include an adhesive member. For example, the adhesive part 23 may include micro-sized vacuum grease. As another embodiment, the adhesive part 23 may include a silicone-based adhesive having heat resistance so as not to be denatured at high temperatures.

The adhesive part 23 as described above may be disposed on the bottom surface of the first shielding part 21 in various forms. For example, the adhesive part 23 may be arranged in a ring shape on the bottom surface of the first shielding part 21. In this case, the opening area OP may be disposed inside the annular adhesive part 23. In another embodiment, a plurality of adhesive portions 23 may be provided on the bottom surface of the first shielding portion 21 to be separated from each other. As another embodiment, the adhesive part 23 may be arranged in a plate shape to completely shield the opening area OP. Hereinafter, for convenience of description, a detailed description will be given focusing on the case where the adhesive part 23 is formed in a ring shape.

The adhesive part 23 may be disposed in various positions. The adhesive part 23 may be disposed outside the edge of the opening area OP or may be disposed to completely shield the opening area OP. In this case, the adhesive part 23 may be disposed in various positions of the second non-display area NDA2 in various shapes.

In the shielding part 20 as described above, after the pixel electrode 310 is formed, the substrate 100 and the shielding part 20 are aligned, and the shielding part 20 is placed on the substrate 100 through a separate robot arm. Can be placed. In this case, although not shown in FIG. 8, a separate alignment mark may be disposed on the substrate 100 in order to place the shielding part 20 at an accurate position. In this case, it is possible to include an alignment mark corresponding to the alignment mark of the substrate 100 in the shielding part 20.

The shielding part 20 may be disposed on the substrate 100 and then fixed through the adhesive part 23. In this case, the adhesive part 23 may be fixed by adhering to the substrate 100 and/or an insulating layer.

After fixing the shielding part 20 shown in FIG. 9, the first functional layer 321, the light emitting layer 322, the second functional layer 323, and the counter electrode are on the substrate 100 and the shielding part 20. 330 and the capping layer 400 may be sequentially formed. At this time, the first functional layer 321, the second functional layer 323, the counter electrode 330, and the capping layer 400 are on the front surface of the substrate 100 or on at least a portion of the display area DA and the non-display area. Can be formed in A plurality of emission layers 322 may be patterned on the substrate 100 and the capping layer 400 so as to be spaced apart from each other.

In such a case, a separate first functional layer 321A, a light emitting layer 322A, a second functional layer 323A, a counter electrode 330A, and a capping layer 400A may be formed on the shielding part 20. In this case, the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the cap are formed on a part of the open area OP and the non-display area DA of the substrate 100. The ping layer 400 may not be stacked.

At this time, at least one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 is a vaporized or sublimated deposition material. It may be supplied in a direction and deposited on the substrate 100. In this case, the deposition source supplying the deposition material is generally disposed in the display area DA, and the deposition material sprayed from the deposition source is applied to the pixel defining layer due to the end 22-1 of the second shielding part 22. A portion having at least one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 may be formed on 112. In this case, the thickness of at least one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 is from the end of the second shielding portion 22. The further away it can be smaller.

When the above process is completed, the shielding part 20 may be removed from the substrate 100. At this time, the separate first functional layer 321A, the light emitting layer 322A, the second functional layer 323A, the counter electrode 330A, and the capping layer 400A on the shielding part 20 are together with the shielding part 20. Can be removed. In addition, the adhesive portion 23 can be easily removed from the insulating layer. In this case, when the adhesive portion 23 is removed, the insulating layer may not be damaged.

After the shielding part 20 is removed as described above, the thin film encapsulation layer 500 may be formed. At this time, the thin film encapsulation layer 500 is formed after removing the shielding part 20 and before removing the substrate 100 and the buffer layer 101 in the opening area OP, or before removing the substrate 100 and the buffer layer in the opening area OP. It is also possible to form after removing 101). Hereinafter, for convenience of explanation, a case where the thin film encapsulation layer 500 is formed before removing the shielding part 20 and removing the substrate 100 and the buffer layer 101 of the opening area OP will be described in detail. To

Thereafter, the substrate 100 and the buffer layer 101 in the opening area OP may be removed by the removal unit L. At this time, the removal unit L may remove the substrate 100 and the buffer layer 101 of the opening area OP by applying thermal energy or light energy such as a laser. In another embodiment, the removal unit L may remove the substrate 100 and the buffer layer 101 of the opening area OP by applying mechanical energy such as a drill.

In this case, since the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 do not exist in the opening area OP, the opening area ( OP) can prevent the layers from being separated from each other.

Specifically, in the conventional case, when the laser is irradiated to penetrate the opening area OP, the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer are There may be a problem that the gap between each layer of (400) occurs. In addition, after attaching a separate film on the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400, the opening area ( When some layers of OP) are removed or holes are formed, some of the adhesive members of the film remain on the top layer due to film attachment, or some of the top layers are removed with the film, or layers placed under the top and top layers There may be a problem that peeling occurs between them. In addition, in the above case, burs of the counter electrode 330 may be generated due to the laser, contaminating the surroundings or impairing the flatness of the uppermost layer. In this case, since the thin film encapsulation layer 500 is not firmly bonded to the uppermost layer, oxygen and/or moisture cannot be blocked, so that the life of the organic light emitting device 300 may be shortened.

However, as described above, the display panel 10 includes the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 in the opening area OP. Since this is not arranged, the above-described problem may not occur around the opening area OP.

In addition, by manufacturing the display panel 10 as described above, the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 in the opening area OP. By not having to remove) separately, manufacturing time can be shortened and the defect rate of the display panel 10 after manufacturing can be reduced.

11 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention. 12 is a cross-sectional view illustrating a part of a method of manufacturing the display panel illustrated in FIG. 11. In FIGS. 11 and 12, reference numeral C denotes an arbitrary straight line passing through the center of the open area, and the same reference numerals as those of FIGS. 6 and 7 in FIGS. 11 and 12 denote the same member.

11 and 12, the substrate 100 may not include a through hole corresponding to the opening area OP. The display layer 200 may include a through hole 200H corresponding to the opening area OP. The thin film encapsulation layer 500 may not include a through hole corresponding to the opening area OP. In this case, at least one of the insulating layers of the pixel circuit layer 200B described above may not be disposed in the opening area OP. In this case, the insulating layer of the pixel circuit layer 200B is not formed in the opening area OP when each insulating layer is formed, or the pixel circuit on the opening area OP after performing the following operations by disposing the shielding part 20 It is also possible to remove the insulating layer of the layer 200B. Hereinafter, for convenience of explanation, the case where the insulating layer of the pixel circuit layer 200B is not formed in the opening area OP when each insulating layer is formed will be described in detail.

In this case, the shielding part 20 may be fixed by disposing the adhesive part 23 on the insulating layer of the second non-display area NDA2. At this time, since the shielding part 20 is the same as or similar to those described in FIGS. 8 to 10, detailed descriptions will be omitted.

Meanwhile, the display panel 10 may be manufactured in the same or similar to that described in FIGS. 8 to 10.

After the pixel electrode 310 is formed, the shielding part 20 is arranged to correspond to the opening area OP and the second non-display area NDA2, and then the first functional layer 321, the light emitting layer 322, and the second The functional layer 323, the counter electrode 330, and the capping layer 400 may be sequentially formed. At this time, the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 may be sequentially stacked on the shielding part 20. Also, in this case, the second shielding portion 22 does not contact each layer of the display panel 10, so that each layer of the display panel 10 may not be damaged when the display panel 10 is manufactured. Thereafter, the shielding part 20 may be removed.

After removing the shielding part 20, the thin film encapsulation layer 500 may be formed on the substrate 100 to manufacture the display panel 10.

Accordingly, since the display panel 10 does not separately form a hole in the opening area OP, peeling of each layer occurring when the hole is formed can be minimized. In addition, in the display panel 10, at least one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 is formed in the opening area OP. By not being disposed, the light transmittance of the opening area OP can be increased.

The display panel 10 can be quickly manufactured through the above method, and the display panel 10 having a high light transmittance of the opening area OP can be manufactured.

13 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention. 14 is a cross-sectional view illustrating a part of a method of manufacturing the display panel illustrated in FIG. 13. In FIGS. 13 and 14, reference numeral C denotes an arbitrary straight line passing through the center of the opening area, and the same reference numerals as those in FIGS. 6 and 7 of FIGS. 13 to 14 denote the same member.

13 and 14, the display layer 200 may not include a through hole 200H corresponding to the opening area OP, and the display element layer 200A is not located in the opening area OP. Does not. In this case, the pixel circuit layer 200B of the display layer 200 or an insulating layer of the pixel circuit layer 200B may be disposed in the opening area OP.

A method of manufacturing the display panel 10 as described above is similar to that described with reference to FIGS. 11 and 12. Specifically, after forming the pixel electrode 310, the shielding portion 20 is disposed, and the first functional layer 321, the light emitting layer 322, and the second functional layer are formed on the substrate 100 and the shielding portion 20. 323, the counter electrode 330, and the capping layer 400 may be sequentially stacked. At this time, the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 are formed in the display area DA and the opening area OP. It is not and may be formed on the shield 20. In addition, the adhesive portion 23 is disposed so as to completely shield the opening area OP, and attaches the first shielding portion 21 to the insulating layer to prevent the shielding portion 20 from moving. Thereafter, the shielding part 20 may be removed and the thin film encapsulation layer 500 may be formed.

Accordingly, since the display panel 10 does not separately form a hole in the opening area OP, peeling of each layer occurring when the hole is formed can be minimized. In addition, in the display panel 10, at least one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 is formed in the opening area OP. By not being disposed, the light transmittance of the opening area OP can be increased.

The display panel 10 can be quickly manufactured through the above method, and the display panel 10 having a high light transmittance of the opening area OP can be manufactured.

15 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention. In FIG. 15, reference numeral C denotes an arbitrary straight line passing through the center of the opening area, and the same reference numerals as those of FIGS. 6 and 7 in FIG. 15 denote the same member.

Referring to FIG. 15, unlike the display panel 10 described above having the thin film encapsulation layer 500, the display panel 10 ′ to be described later may include an encapsulation substrate 500A and a sealing part 700. have.

One or more of the substrate 100, the display layer 200, and the encapsulation substrate 500A may have through holes 100H, 200H, and 500AH corresponding to the opening area OP. The display layer 200 may not be disposed in the opening area OP.

The substrate 100 may include glass or a polymer resin. Polymer resins are polyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalide (polyethyeleneterepthalate, PET). , Polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC) or cellulose acetate propionate (CAP), etc. can do. The substrate 100 may have a multilayer structure including an inorganic layer (not shown) and a layer including the aforementioned polymer resin. Hereinafter, for convenience of description, the case where the substrate 100 is formed of glass will be described in detail.

The sealing part 700 may be disposed between the substrate 100 and the encapsulation substrate 500A. The sealing part 700 may be disposed in the opening area OP and the second non-display area NDA2. In this case, the sealing part 700 may be disposed in the second non-display area NDA2, and the sealing part 700 disposed in the second non-display area NDA2 is It can be arranged to completely surround the border (see SAR area in FIG. 4).

The encapsulation substrate 500A may be disposed to face the substrate 100. In this case, the encapsulation substrate 500A may be formed of the same or similar material as the substrate 100. In particular, the encapsulation substrate 500A may be formed of glass. In another embodiment, the encapsulation substrate 500A may include plastic. In this case, the encapsulation substrate 500A may include at least one or more layers including at least one or more resins.

The dummy wiring (not shown) may be disposed in the first non-display area NDA1 and the second non-display area NDA2 when the source electrode and/or drain electrode of the semiconductor layer is manufactured. In particular, the dummy wiring may be disposed on a portion of the substrate 100 on which the sealing part 700 is to be disposed.

In the above case, the sealing part 700 may firmly couple the substrate 100 and the encapsulation substrate 500A.

16 to 22 are cross-sectional views illustrating a method of manufacturing the display panel illustrated in FIG. 15. In FIGS. 16 to 22, reference numeral C denotes an arbitrary straight line passing through the center of the opening area, and the same reference numerals as those in FIGS. 6 and 7 of FIGS. 16 to 22 denote the same member.

16 to 22, after forming the pixel electrode 310 on the substrate 100, the shielding part 20 may be disposed to correspond to the opening area OP and the second non-display area NDA2. have. In this case, the insulating layer described above may or may not be disposed in the opening area OP. Hereinafter, for convenience of description, a detailed description will be given focusing on the case where the insulating layer is not disposed in the opening area OP.

The adhesive part 23 may be disposed outside the dummy wiring 220. For example, the adhesive part 23 may be disposed farther than the dummy wiring 220 in the X-axis direction of FIG. 16 to shield the opening area OP. In this case, the adhesive part 23 may have a plate (or flat film) shape, a ring shape, or a plurality of protrusions disposed to be spaced apart from each other. As another embodiment, the adhesive part 23 is not shown in the drawing, but may be disposed between the dummy wiring 220 and the organic light emitting device 300. In this case, the adhesive part 23 may have a ring shape or a plurality of protrusions disposed to be spaced apart from each other as described above. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where the adhesive part 23 is disposed outside the dummy wiring 220.

When the shielding part 20 is disposed, the first functional layer 321 may be formed on the substrate 100 and the shielding part 20. In this case, the thickness of the end portion 321-1 of the first functional layer 321 may decrease as the dummy wiring 220 approaches.

A plurality of light emitting layers 322 may be patterned on the first functional layer 321 to be spaced apart from each other. In this case, a part of the emission layer 322 may be disposed in the display area DA, and another part of the emission layer 322 may be disposed in the shielding part 20.

The second functional layer 323 may be disposed on the entire opening area OP and the display area DA in the same manner as the first functional layer 321. In this case, the second functional layer 323 may shield the light emitting layer 322. In this case, the second functional layer 323 may not be disposed in at least a portion of the second non-display area NDA2 and the opening area OP of the substrate 100 due to the shielding part 20.

After the second functional layer 323 is formed, the counter electrode 330 and the capping layer 400 may be sequentially formed on the second functional layer 323.

In the above case, the thickness of each end of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 becomes closer to the dummy wiring 220. As the first functional layer 321 becomes smaller, similarly to the end 221-1 of the first functional layer 321, it may be smaller.

After forming the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 as described above, the shielding part 20 may be removed. In this case, a part of the bonding part 23 may remain in the opening area OP.

After removing the shielding part 20, the sealing part 700 may be disposed on the dummy wiring 220. Thereafter, the encapsulation substrate 500A is disposed to face the substrate 100 and a voltage is applied to the dummy wiring 220 to couple the encapsulation substrate 500A and the substrate 100 to each other by the sealing unit 700. The sealing part 700 is not limited to the above, and when the dummy wiring 220 does not exist, it may be cured after receiving energy such as laser or light from the outside. Thereafter, the encapsulation substrate 500A and the substrate 100 corresponding to the opening area OP may be removed by the removal unit L.

23 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention. In FIG. 23, reference numeral C denotes an arbitrary straight line passing through the center of the opening area, and the same reference numerals as those of FIGS. 6 and 7 in FIG. 23 denote the same member.

Referring to FIG. 23, in the display panel 10 ′, it is also possible to form a through hole 500AH only in the encapsulation substrate 500A. In this case, a separate display element layer 200A may not be disposed in the opening area OP. Also, the pixel circuit layer 200B may not be formed in the opening area OP.

Meanwhile, the display panel 10 ′ as described above may be manufactured similarly to those illustrated in FIGS. 16 to 21. In this case, the through hole 500AH of the encapsulation substrate 500A may be formed through a removal unit (not shown) including a drill or the like.

24 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention. In FIG. 24, reference numeral C denotes an arbitrary straight line passing through the center of the opening area, and the same reference numerals as in FIGS. 6 and 7 in the reference numerals shown in FIG. 24 denote the same member.

Referring to FIG. 24, the display panel 10 ′ may not form a separate through hole in the opening area OP. In this case, the pixel circuit layer 200B is disposed in the opening area OP, and the display element layer 200A may not exist. Also, the sealing part 700 may be disposed only in the first non-display area NDA1.

In this case, the display panel 10 ′ may be manufactured similarly to that described with reference to FIGS. 16 to 22.

25 is a perspective view illustrating an exemplary embodiment of a shielding part used when manufacturing a display panel according to example embodiments.

Referring to FIG. 25, the shielding part 20 may include a first shielding part 21, a second shielding part 22, and an adhesive part 23. In this case, the first shielding portion 21 and the second shielding portion 22 may have a three-dimensional shape. For example, the first shielding portion 21 may be formed to protrude from the second shielding portion 22. In this case, a space may be formed inside the first shielding part 21. In particular, the cross-section of the shielding portion 20 in the height direction of the shielding portion 20 (for example, in the Z direction in FIG. 25) (for example, a cross-section disposed on the YZ plane or the XZ plane in FIG. 25) has an uneven shape. I can.

The shape of the first shielding part 21 as described above may have various shapes. For example, a cross-section of the first shielding portion 21 perpendicular to the height direction of the first shielding portion 21 (for example, a cross-section arranged on the XY plane of FIG. 25) is a semicircle, circle, ellipse, polygon, It can be as diverse as a crescent moon. In this case, a cross section of the first shielding part 21 perpendicular to the height direction of the first shielding part 21 may correspond to the shape of the opening area OP.

The edge of the second shielding portion 22 may be larger than the edge of the lower surface of the first shielding portion 21. In this case, the second shielding portion 22 may protrude from the first shielding portion 21.

The adhesive part 23 may be disposed on the first shielding part 21. In this case, the adhesive portion 23 is formed in a ring shape, and the inner space of the first shielding portion 21 may be disposed inside the adhesive portion 23.

As an exemplary embodiment, in this case, the above-described opening area OP may be disposed in the inner space formed by the adhesive part 23. In this case, the adhesive part 23 may be disposed in the second non-display area NDA2 described above.

In another embodiment, the adhesive part 23 may be disposed inside the opening area OP. In this case, when a hole is formed in the opening area OP, the adhesive portion 23 remaining in the opening area OP when the hole is formed in the opening area OP may also be removed.

In another embodiment, the bonding part 23 may be disposed in the opening area OP and the second non-display area NDA2 at the same time. In this case, a part of the opening area OP may be disposed in the inner space of the adhesive part 23.

26 is a perspective view illustrating another embodiment of a shielding part used when manufacturing a display panel according to example embodiments.

Referring to FIG. 26, the shielding portion 20 ′ may include a first shielding portion 21, a second shielding portion 22, and an adhesive portion 23.

The first shielding part 21 may not have a space formed therein. In this case, the first shielding part 21 may be formed in a column shape, and the second shielding part 22 may be formed flat.

A plurality of adhesive portions 23 may be provided on the first shielding portion 21 so as to be spaced apart from each other. In this case, the plurality of adhesive portions 23 may be disposed on the same circumference. In another embodiment, a plurality of adhesive portions 23 may be provided in a row from the center of the first shielding portion 21 to the outer surface of the first shielding portion 21. In this case, the plurality of adhesive portions 23 are not limited to the above, and may be arranged to form a pattern with each other or may be randomly disposed on the first shielding portion 21.

The plurality of adhesive portions 23 may be disposed at various positions.

As an embodiment, in this case, when the plurality of adhesive portions 23 are arranged to form a space therein, the above-described opening area OP may be disposed in an inner space formed by the plurality of adhesive portions 23. In addition, the adhesive part 23 may be disposed in the second non-display area NDA2 described above.

In another embodiment, the plurality of bonding portions 23 may be disposed inside the opening area OP so as to be spaced apart from each other. In this case, when a hole is formed in the opening area OP, the adhesive portion 23 remaining in the opening area OP when the hole is formed in the opening area OP may also be removed.

In another embodiment, the plurality of bonding portions 23 may be disposed to be spaced apart from each other in the opening area OP and the second non-display area NDA2.

27 is a perspective view illustrating still another embodiment of a shielding part used when manufacturing a display panel according to example embodiments.

Referring to FIG. 27, the shielding part 20″ may include a first shielding part 21, a second shielding part 22, and an adhesive part 23.

The adhesive part 23 may be disposed on one surface of the first shielding part 21. At this time, the adhesive part 23 may be formed as one.

The adhesive part 23 may be disposed in various positions.

As an embodiment, the adhesive part 23 may be disposed only in the opening area OP so as to completely shield the opening area OP. In this case, the adhesive portion 23 disposed in the opening area OP and remaining in the opening area OP when the shielding part 20 is removed is removed when a through hole is formed in the opening area OP. ) May not exist.

In another embodiment, the adhesive part 23 may be disposed inside the opening area OP. In this case, when a hole is formed in the opening area OP, the adhesive portion 23 remaining in the opening area OP when the hole is formed in the opening area OP may also be removed.

In another embodiment, the bonding portion 23 may be disposed in the opening area OP and the second non-display area NDA2 at the same time. In this case, the adhesive part 23 may completely shield the opening area OP.

As described above, the present invention has been described with reference to an embodiment shown in the drawings, but this is only exemplary, and those of ordinary skill in the art will understand that various modifications and variations of the embodiment are possible therefrom. Therefore, the true technical scope of the present invention should be determined by the technical spirit of the appended claims.

1: display device 300: organic light emitting device
10,10': display panel 310: pixel electrode
20,20′,20″: shield 320: intermediate layer
21: first shield 321,321A: first functional layer
22: second shielding portion 322,322A: light emitting layer
23: adhesive portion 323,323A: second functional layer
30: component 330,330A: counter electrode
40: input sensing layer 400,400A: capping layer
50: optical functional layer 500: thin film encapsulation layer
60: window 500A: encapsulation board
100: substrate 510: first inorganic encapsulation layer
200: display layer 520: organic encapsulation layer
200A: display element layer 530: second inorganic encapsulation layer
200B: pixel circuit layer 700: sealing portion
220: dummy wiring

Claims (24)

A substrate having a display area, an opening area disposed inside the display area, and a non-display area disposed to surround at least a portion of the opening area;
A pixel defining layer disposed on the substrate and having at least one opening;
An intermediate layer disposed on the opening;
A counter electrode disposed to cover the intermediate layer and the pixel defining layer; And
Includes; a capping layer disposed to cover the counter electrode,
At least one end of the intermediate layer, the counter electrode, and the capping layer is disposed on the pixel definition layer, and the thickness decreases as the distance increases from the opening. The method of claim 1,
The intermediate layer includes at least one of a first functional layer and a second functional layer. The method of claim 1,
The intermediate layer, the counter electrode, and the capping layer are sequentially stacked on the pixel definition layer. The method of claim 1,
The display device further comprises an encapsulation substrate disposed to be spaced apart from the substrate. The method of claim 1,
The display device further comprising a thin film encapsulation layer disposed on the capping layer. The method of claim 1,
A display device in which a through hole is disposed in the opening area. Forming a pixel defining layer on the substrate;
Arranging a shielding portion to shield a portion of the pixel definition layer, an opening area of the substrate, and a non-display area disposed to surround at least a portion of the opening area; And
Forming an intermediate layer, a counter electrode, and a capping layer on the pixel definition layer and the shielding portion. The method of claim 7,
The shielding part,
A first shielding part shielding the opening area; And
And a second shielding part connected to the first shielding part and disposed to be spaced apart from an upper surface of the pixel definition layer. The method of claim 8,
A method of manufacturing a display device in which the first shielding part and the second shielding part are disposed at different heights. The method of claim 8,
The shielding part,
The method of manufacturing a display device further comprising an adhesive portion disposed on the first shielding portion. The method of claim 10,
A method of manufacturing a display device in which at least some of the adhesive portions are disposed in the non-display area. The method of claim 7,
Removing the shielding portion from the substrate. The method of claim 7,
And attaching the encapsulation substrate and the substrate by disposing an encapsulation substrate on the substrate so as to be spaced apart from the substrate. The method of claim 7,
The method of manufacturing a display device further comprising: forming a thin film encapsulation layer on the pixel definition layer. The method of claim 7,
The method of manufacturing a display device further comprising: forming a through hole in the substrate. Forming a pixel defining layer on the substrate;
Attaching a shielding part to the open area and/or the non-display area to shield a part of the pixel definition layer and a non-display area disposed to surround at least a part of the open area and the open area of the substrate; And
Forming an intermediate layer, an opposite electrode, and a capping layer on the pixel definition layer and the shielding portion; including,
A method of manufacturing a display device in which a part of the shielding part is disposed to be spaced apart from the pixel defining layer. The method of claim 16,
A method of manufacturing a display device in which a part of the shielding part is disposed at a different height from the other part of the shielding part. The method of claim 16,
The method of manufacturing a display device wherein the shielding portion is attached to the display area and/or the non-display area. The method of claim 16,
The shielding portion is attached to the display area and/or the non-display area at a plurality of positions of the display area and/or the non-display area spaced apart from each other. The method of claim 16,
A method of manufacturing a display device in which the shielding part is attached to the non-display area to surround the open area. The method of claim 16,
Removing the shielding portion from the substrate. The method of claim 16,
The method of manufacturing a display device further comprising: disposing an encapsulation substrate on the substrate to be spaced apart from each other, and coupling the substrate and the encapsulation substrate. The method of claim 16,
The method of manufacturing a display device further comprising: forming a thin film encapsulation layer on the pixel definition layer. The method of claim 16,
The method of manufacturing a display device further comprising: forming a through hole in the substrate.

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