KR20200126857A - transparent electrode with low resistance and method of manufacturing the same - Google Patents

Abstract

Disclosed is a transparent electrode with low resistance. The transparent electrode with low resistance of the present invention comprises: a substrate; a first copper oxide layer (CuOx layer) disposed on an undercoating layer; a metal layer disposed on the first CuOx layer; and a second CuOx layer disposed on the metal layer.

Description

Transparent electrode with low resistance and method of manufacturing the same}

The present invention relates to a low resistance transparent electrode and a method of manufacturing the same.

The transparent electrode is an electrode having electric conductivity and light transmission at the same time. These transparent electrodes are required to have high transmittance and low sheet resistance.

Metals with sufficient thickness do not transmit visible light, but with the development of thin film technology, electrodes can also take on a transparent shape. In order to achieve high transmittance, the thickness of the electrode should be generally thin, and the electrode should not be easily oxidized.

The currently commonly used transparent electrode is an indium tin oxide (ITO) thin film doped with tin oxide in indium oxide.

However, ITO is 1) difficult to obtain low sheet resistance when formed on an organic substrate, 2) easy to form cracks due to bending of the substrate, 3) limited reserves, 4) high temperature, high vacuum process environment conditions. Since it also possesses disadvantages such as cost competitiveness, transparent electrodes that can replace them are being developed.

The technical problem to be solved by the present invention is to provide a low-resistance transparent electrode capable of effectively preventing corrosion of metal forming an electrode while securing high transmittance and low sheet resistance characteristics.

In order to solve the above technical problem, a low resistance transparent electrode according to an embodiment of the present invention includes a substrate; A first copper oxide layer (CuOx layer) disposed on the undercoat layer; A metal layer disposed on the first copper oxide layer; And a second copper oxide layer (CuOx layer) disposed on the metal layer.

In an embodiment of the present invention, an under coating layer disposed on the substrate to increase adhesion between the substrate and the metal layer may be further included.

In an embodiment of the present invention, a refractive index matching layer disposed on the second copper oxide layer and having a refractive index of a medium selected to increase transmittance may further be included.

In one embodiment of the present invention, the metal of the metal layer may be Ag, Pt, Au, and combinations thereof.

In one embodiment of the present invention, the first copper oxide layer and the second copper oxide layer may each have a thickness in the range of 2 to 5 nm.

In order to solve the above technical problem, a method of manufacturing a low-resistance transparent electrode according to an embodiment of the present invention includes preparing a substrate; Forming a first copper oxide layer (CuOx layer) on the substrate; Forming a metal layer on the first copper oxide layer; And forming a second copper oxide layer on the metal layer.

In one embodiment of the present invention, before forming the first copper oxide layer, forming an under coating layer on the substrate to increase adhesion between the substrate and the metal layer; may include.

In one embodiment of the present invention, forming an index matching layer having a selected refractive index of a medium to increase transmittance on the second copper oxide layer may further include.

In an embodiment of the present invention, the metal of the metal layer is Ag, the first copper oxide layer and the second copper oxide layer are each formed to a thickness in the range of 2 to 5 nm, and the metal layer is formed to a thickness of 10 nm or less. Can be.

The present invention has the effect of effectively preventing corrosion of metal forming an electrode while securing high transmittance and low sheet resistance characteristics.

1 shows a low resistance transparent electrode according to an embodiment of the present invention.
2 is a flow chart showing a method of manufacturing a low-resistance transparent electrode according to an embodiment of the present invention.
3 is an image for comparing a low-resistance transparent electrode according to an embodiment of the present invention and a transparent electrode according to a comparative example.

Since the present invention can apply various transformations and have various embodiments, specific embodiments are illustrated in the drawings and will be described in detail in the detailed description. However, this is not intended to limit the present invention to a specific embodiment, it is to be understood to include all conversions, equivalents, and substitutes included in the spirit and scope of the present invention.

In describing the present invention, when it is determined that a detailed description of a related known technology may obscure the subject matter of the present invention, a detailed description thereof will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 shows a low resistance transparent electrode 100 according to an embodiment of the present invention.

Referring to FIG. 1, a low-resistance transparent electrode 100 according to an embodiment of the present invention includes a substrate 110, an undercoat layer 120, a first copper oxide layer 130, a metal layer 140, and a second copper. An oxide layer 150, a refractive index matching layer 160, and a functional layer 170 are included.

The substrate 110 may be disposed at the bottom of the low-resistance transparent electrode 100.

The substrate 110 is used to stack the undercoat layer 120, the first copper oxide layer 130, the metal layer 140, the second copper oxide layer 150, the refractive index matching layer 160, and the functional layer 170. Since it is necessary for, any material capable of laminating the above materials can be used without limitation.

The substrate 110 may include an inorganic material or an organic material.

The inorganic material may be any one of glass, quartz, Al2O3, SiC, Si, GaAs, and InP, or a combination thereof, but is not limited thereto.

Organic materials are Kepton foil, polyimide (PI), polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN) , Polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polycarbonate (PC), cellulose triacetate (CTA), cellulose acetate propio It may be selected from cellulose acetate propionate (CAP), but is not limited thereto.

However, since the present invention is intended to achieve low resistance and high light transmittance, it is preferable that the substrate 110 is selected with a thickness, index, or the like suitable thereto.

In one embodiment of the present invention, the substrate 110 includes polyethylene terephthalate (PET).

The undercoat layer 120 may be disposed on the substrate 110 to increase adhesion between the substrate 110 and the metal layer 140 to be stacked.

The undercoat layer 120 may be deposited to a thickness of 10 nm. However, the thickness is not limited thereto.

In the present invention, the undercoat layer 120 may be used by selecting an appropriate refractive index in consideration of the fact that the material of the metal layer 140 has a small refractive index rather than being formed of two or more layers having different refractive indices. Specifically, the undercoat layer 120 may be formed as a low refractive layer formed of a material having a refractive index of 1.4 to 1.6 or a high refractive layer having a refractive index of 2.0 or more.

The undercoating layer 120 is preferably formed to a thickness of 10 nm to 1.5 μm. When the thickness of the undercoat layer exceeds 1.5 μm, film stress may be severe, resulting in cracks, and total light transmittance may be reduced. Conversely, when the thickness of the undercoat layer 120 is less than 10 nm, there is a problem in that the effect of improving transmittance and visibility is insufficient.

The material forming the undercoat layer 120 can be a high refractive index material such as TiO ₂ , and a solution in which HMDS (1,1,1,3,3,3-Hexamethyldisilazane) is mixed with PMMA, an acrylic compound, can be used. May be.

The undercoat layer 120 may be formed by a sputtering process or a process such as a slot die.

The first copper oxide layer 130 is disposed on the undercoat layer 120.

The first copper oxide layer 130 includes copper oxide (CuOx). Here, x is used to mean that there is no fixed or known amount of oxygen. This is because even if oxygen is supplied to the metal when producing a metal oxide, the exact binding ratio cannot be known.

The first copper oxide layer 130 may block air and moisture by forming a film on one side of the metal layer 140 to be stacked thereon.

The first copper oxide layer 130 may protect the cathode of the metal layer 140 to be stacked thereon. Cathodeization of the metal layer 140 can be protected because the reactivity of the metal included in the first copper oxide layer 130 is selected to be greater than that of the metal included in the metal layer 140.

The first copper oxide layer 130 may have a thickness of 2 to 5 nm. When the first copper oxide layer 130 is less than 2 nm, a sufficient film cannot be formed, and air and moisture cannot be effectively blocked. When the first copper oxide layer 130 exceeds 5 nm, the thickness of the layer including the metal oxide itself increases, resulting in a decrease in the overall transmittance of the low-resistance transparent electrode 100 and a decrease in sheet resistance.

The metal layer 140 is disposed on the first copper oxide layer 130.

The metal of the metal layer 140 is Ag, Cu, Au, Al, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, Ti, V, Cr , Mn, Fe, Co, Ni, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Cd, In, Sn, Hf, Ta, W, Re, Os, Ir, Pt, Tl, Pb , Bi, Ga, Ge, Sb, Ac, Th, and may include any one of a mixture thereof.

Preferably, the metal of the metal layer 140 may include any one of Ag, Pt, Au, and mixtures thereof. This is because Cu is more reactive than Ag, Pt, and Au and can effectively protect them.

In one embodiment of the present invention, the metal of the metal layer 140 includes silver (Ag). Silver can be easily oxidized by oxygen in the air and is vulnerable to moisture. However, since copper (Cu) is oxidized at a faster rate than silver, when it is formed thinly, an oxide film is formed. CuOx thus formed effectively prevents silver from contacting oxygen or moisture.

The metal layer 140 may be formed in a range of 7 nm to 10 nm, but is not limited thereto. However, when the metal layer 140 is less than 7 nm, it is difficult to function as the low-resistance transparent electrode 100, and when it exceeds 10 nm, the sheet resistance increases and the transmittance decreases, so that the properties required as the transparent low-resistance transparent electrode 100 may be degraded. .

The second copper oxide layer 150 is disposed on the metal layer 140. That is, the first copper oxide layer 130 and the second copper oxide layer 150 are disposed above and below the metal layer 140 with the metal layer 140 in the center to protect the metal layer 140.

The second copper oxide layer 150 includes copper oxide (CuOx).

The second copper oxide layer 150 may block air and moisture by forming a film on the other side of the metal layer 140 disposed below.

The second copper oxide layer 150 may protect the lower metal layer 140 from being cathodicated. Cathodeization of the metal layer 140 can be protected because the reactivity of the metal included in the second copper oxide layer 150 is greater than that of the metal included in the metal layer 140.

The second copper oxide layer 150 may have a thickness of 2 to 5 nm. When the second copper oxide layer 150 is less than 2 nm, a sufficient film cannot be formed, and air and moisture cannot be effectively blocked. When the second copper oxide layer 150 exceeds 5 nm, the thickness of the layer including the metal oxide itself increases, resulting in a lower overall transmittance of the low resistance transparent electrode 100 and a decrease in sheet resistance.

The refractive index matching layer 160 is disposed on the second copper oxide layer 150.

The refractive index of the refractive index matching layer 160 may be selected to increase the transmittance of the low-resistance transparent electrode 100. For example, if the refractive index of the medium forming each layer is high, the refractive index of the refractive index matching layer 160 may be selected to be low. If the refractive index of the medium constituting each layer is selected as those having a relatively high refractive index, the amount of reflection increases, and the transmittance may decrease as a result. Therefore, the refractive index of the refractive index matching layer 160 may be selected to reduce the overall transmittance of the low resistance transparent electrode 100 as low as possible.

It is preferable that the refractive index matching layer 160 has a thickness of 30 to 40 nm. When the thickness of the refractive index matching layer 160 is less than 30 nm, there is a problem in that the specific resistance value is increased, thereby increasing the sheet resistance, and when it exceeds 40 nm, the specific resistance value decreases while the transmittance decreases.

The refractive index matching layer 160 may include a metal oxide, and the metal oxide may include all types of metal oxides having amphiphilicity. For example, titanium oxide (Titanium sub-oxide, TiOX and Titanium oxide, TiO2), zinc oxide (ZnO), tungsten oxide (W2O3, WO2, WO3), molybdenum oxide (Molybdenum oxide, MoO2, MoO3 and Molybdenum sub-oxide, MoOX) and at least one selected from combinations thereof. Preferably, the refractive index matching layer 160 is zinc oxide (ZnO) in that it has excellent transmittance, electrical conductivity, and durability against plasma in the infrared and visible regions, can be processed at low temperatures, and the raw material price is low. It may include.

The functional layer 170 is disposed on the refractive index matching layer 160.

The functional layer 170 may serve as a film preventing the inflow of oxygen and moisture, and may serve as a secondary (or final) refractive index matching function to increase the overall transmittance of the low resistance transparent electrode 100. The functional layer 170 may include an anti-reflection layer, and may include at least one or more layers of auxiliary functions described above.

For example, the functional layer 170 may be an antireflection layer.

Since the antireflection layer has an antireflection effect due to a refractive index, the transparency of the low-resistance transparent electrode 100 can be further increased by enhancing optical properties using this.

A conductive polymer may be used for the antireflection layer, but the present invention is not limited thereto, and a metal oxide, an electrolyte, or other organic materials may be used.

The conductive polymer used as the anti-reflection layer may include a conductive polymer that may contain a hetero element selected from the group consisting of nitrogen, oxygen, sulfur, carbon, and combinations thereof, but is not limited thereto.

For example, the conductive polymer is polyaniline, polythiophene, polyethylenedioxythiophene (PEDOT), polyimide, polystyrene sulfonate (PSS), and polypyrrole. , Polyacetylene, poly(p-phenylene)[Poly(pphenylene)], poly(p-phenylene sulfide)[Poly(p-phenylene sulfide)], poly(p-phenylene vinylene)[Poly (p-phenylenevinylene)], polythiophene poly(thienylene vinylene)[(Polythiophene Poly(thienylene vinylene))), poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) [Poly(3, 4-ethylenedioxythiophene) poly(styrenesulfonate), (PEDOT:PSS)], and combinations thereof, but are not limited thereto.

Among the electrolytes used as the antireflection layer, the polymer electrolyte is, for example, poly[9,9-bis(3'-(N,N-dimethylamino)propyl)-2,7-fluorene)-alt-2,7 -(9,9-dioctylfluorene)](poly [(9,9-bis(3'-(N,N-dimethylamino)propyl)-2,7-fluorene)-alt-2,7-(9 ,9-dioctylfluorene)], PFN), poly(9,9-bis(4'-sulfonatobutyl)fluorene-alt-co-1,4-phenylene (poly(9,9-bis(4'- sulfonatobutyl)(fluorine-alt-co-1,4-phenylene, PFP), poly(styrenesulfonic acid, PSS), poly(p-quaterphenylene-2,2'-dicarboxylic acid) (poly(p-quaterphenylene-2,2'-dicarboxylic acid)), and the like, and the monomolecular electrolyte is, for example, diphenyl fluorene derivative (DPF), tetrakis (1-imidazoryl) Borate (Tetrakis(1-imidazolyl)borate, Bim4-), and the like.

The antireflection layer may be preferably PEDOT:PSS ([Poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate)]) in terms of high electrical conductivity, excellent stability, and excellent fairness.

2 is a flow chart showing a method of manufacturing a low-resistance transparent electrode 100 according to an embodiment of the present invention.

Referring to FIG. 2, in step S210, a substrate 110 is prepared.

As for the substrate 110, the substrate 110 may include an inorganic material or an organic material, and any one of the above-described exemplary substrates 110 may be selected. In one embodiment of the present invention, the substrate 110 includes polyethylene terephthalate (PET).

The substrate 110 may be prepared independently, but may be prepared by disposing a layer of a material corresponding to the substrate 110 on a device on which the low resistance transparent electrode 100 is stacked. For example, when the top of the emission layer is made of a PET layer, the top layer of the emission layer may be the substrate 110.

In step S220, an undercoat layer 120 is formed on the substrate 110.

The undercoat layer 120 may be deposited on the substrate 110 to increase adhesion between the substrate 110 and the metal layer 140 to be stacked.

In step S230, the first copper oxide layer 130 is formed on the undercoat layer 120.

The first copper oxide layer 130 may be formed by a dry deposition process, and oxygen is introduced during the deposition process to form a CuOx layer.

The first copper oxide layer 130 may have a thickness of 2 to 5 nm. When the first copper oxide layer 130 is less than 2 nm, a sufficient film cannot be formed, and air and moisture cannot be effectively blocked. When the first copper oxide layer 130 exceeds 5 nm, the thickness of the layer including the metal oxide itself increases, resulting in a decrease in the overall transmittance of the low-resistance transparent electrode 100 and a decrease in sheet resistance.

In step S240, a metal layer 140 is formed on the first copper oxide layer 130.

The metal of the metal layer 140 is Ag, Cu, Au, Al, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, Ti, V, Cr , Mn, Fe, Co, Ni, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Cd, In, Sn, Hf, Ta, W, Re, Os, Ir, Pt, Tl, Pb , Bi, Ga, Ge, Sb, Ac, Th, and may include any one of a mixture thereof.

Preferably, the metal of the metal layer 140 may include any one of Ag, Pt, Au, and mixtures thereof. This is because Cu is more reactive than Ag, Pt, and Au and can effectively protect them.

The metal layer 140 may be formed by a sputter deposition method, an electron beam deposition method, a thermal vapor deposition method, a chemical vapor deposition method, or a coating method using a solution process.

The metal layer 140 may be formed in a range of 7 nm to 10 nm, but is not limited thereto. However, when the metal layer 140 is less than 7 nm, it is difficult to function as the low-resistance transparent electrode 100, and when it exceeds 10 nm, the sheet resistance increases, and the transmittance decreases, resulting in a decrease in characteristics required as the transparent low-resistance transparent electrode 100. have.

In one embodiment of the present invention, the metal layer 140 is formed to 10 nm by sputtering deposition using Ag.

In step S250, a second copper oxide layer 150 is formed on the metal layer 140.

The second copper oxide layer 150 may be formed by a dry deposition process, and oxygen is introduced during the deposition process to form a CuOx layer.

The second copper oxide layer 150 is formed to have a thickness of 2 to 5 nm. When the second copper oxide layer 150 is less than 2 nm, a sufficient film cannot be formed, and air and moisture cannot be effectively blocked. When the second copper oxide layer 150 exceeds 5 nm, the thickness of the layer including the metal oxide itself increases, resulting in a decrease in the overall transmittance of the low-resistance transparent electrode 100 and a decrease in sheet resistance.

Thus, the first copper oxide layer 130 and the second copper oxide layer 150 formed on both sides of the metal layer 140 can effectively protect the metal from corrosion. In addition, since the first copper oxide layer 130 and the second copper oxide layer 150 are formed to a degree to minimize the influence on the resistance and transmittance of the low resistance transparent electrode 100, the low resistance high transmittance transparent low resistance transparent It is possible to maintain the characteristics of the electrode 100.

In step S260, a refractive index matching layer 160 is formed on the second copper oxide layer 150.

The refractive index matching layer 160 is a spin coating method, a roll coating method, a spray coating method, a flow coating method, an inkjet printing method, a nozzle printing method, and a solution related to a material capable of achieving a desired refractive index. Dip coating method, electrophoretic deposition method, tape casting method, screen printing method, pad printing method, doctor blade coating method, gravure printing method, gravure offset printing method, or Langmuir-Blogett It may be formed by coating on the second copper oxide layer 150 by a method.

The refractive index matching layer 160 may form an amine group-containing compound layer using a sputter deposition method, an electron beam deposition method, a thermal deposition method, or a chemical vapor deposition method, and is not limited to the above-described formation method.

In step S270, the functional layer 170 is formed on the refractive index matching layer 160.

The functional layer 170 is a spin coating method, a roll coating method, a spray coating method, a flow coating method, an inkjet printing method, and a nozzle using a solution related to a medium that can serve as the functional layer 170. Printing method, dip coating method, electrophoretic deposition method, tape casting method, screen printing method, pad printing method, doctor blade coating method, gravure printing method, gravure offset printing method, or Langmuir-Blojet -Blogett) may be formed by coating on the second copper oxide layer 150.

The functional layer 170 may form an amine group-containing compound layer using a sputter deposition method, an electron beam deposition method, a thermal vapor deposition method, or a chemical vapor deposition method, and is not limited to the above-described formation method.

Hereinafter, the results of measuring optical and electrical properties in Examples 1 and 2 of the present invention and comparing them with Comparative Examples 1 and 2 will be described.

The conditions of Example 1 and Comparative Example 1 of the present invention are as follows.

[Comparative Example 1]

Substrate 110: PET, 125nm

Metal layer 140: Ag, 7 nm

[Example 1]

Substrate 110: PET, 125nm

First copper oxide layer 130: CuOx, 2 nm

Metal layer 140: Ag, 7 nm

Second copper oxide layer 150, CuOx, 2nm

[Table 1] is a reliability test using the electrodes of Comparative Example 1 and Example 1, and the test conditions are 85°C and 85% humidity. The comparative example was tested four times, and the example was tested twice. The transmittance was measured at 550 nm.

Electrodes/trial Comparative example Example One 2 3 4 One 2 Transmittance Before test 67 67 67 66 68 68 10 minutes elapsed 56 56 56 56 70 70 20 minutes elapsed 53 53 53 53 70 70 30 minutes elapsed 50 49 50 48 70 70 1 hour elapsed 45 44 45 43 70 70

Referring to [Table 1], in Comparative Example 1, it was found that the transmittance was significantly lowered over time after the test. It is believed that this is due to the fact that the metal layer 140 is oxidized in contact with moisture and oxygen under severe conditions of high temperature and humidity, thereby affecting the transmittance characteristics.

In contrast, in Example 1 of the present invention, a difference in transmittance was hardly seen before and after the test, so that the copper oxide layer effectively protects the metal layer 140 formed of Ag.

The conditions of Example 2 and Comparative Example 2 of the present invention are as follows.

[Comparative Example 2]

Substrate 110: PET, 125nm

Metal layer 140: Ag, 7 nm

Refractive index matching layer 160, Nb2O5, 15 nm

[Example 2]

Substrate 110: PET, 125nm

First copper oxide layer 130: CuOx, 2 nm

Metal layer 140: Ag, 7 nm

Second copper oxide layer 150, CuOx, 2nm

Refractive index matching layer 160, Nb2O5, 15 nm

The difference between Comparative Examples 2 and 2 from Comparative Examples 1 and 1 is that they further include a refractive index matching layer 160.

[Table 2] is a reliability test using the low-resistance transparent electrode 100 of Comparative Example 2 and Example 2, and the test conditions are 85°C and 85% humidity. The optical properties of each sample were measured before and 7 days after the test. The results are as follows.

electrode When to test a* b* Y Transmittance
(550nm) Haze
(HAZE) Sheet resistance
(/□) Comparative Example 2 Before test -2.64 1.25 86.83 87.86 1.11 9.78 Day 7 -2.03 -0.29 80.5 81.17 10.67 19.61 Difference (Δ) 0.61 -1.54 -6.33 -6.69 9.56 9.83 Example 2 Before test -2.24 0.27 85.01 85.54 0.9 12 Day 7 -2.28 0.49 86.28 87.04 6.84 13 Difference (Δ) -0.04 0.22 1.27 1.5 5.94 One

In Table 2, a* and b* are coordinates defined in the CIE (International Lighting Commission) LAB color space, where a* is the degree of red and green, and b* is the yellow and blue ( Blue). Y represents luminance, and transmittance was measured at 550 nm.

Test Results In Comparative Example 2, before and after the test (after 7 days), the difference between a* was 0.61, the difference between b* was -1.54, and the difference between Y was -6.33, indicating a relatively large value, and the transmittance was decreased by 6.69%, and haze. Was increased by 9.56 and sheet resistance increased by 9.83, indicating that the optical and electrical properties of the low-resistance transparent electrode 100 were deteriorated.

Y is the luminance, but assuming that there is no significant difference from the brightness, assuming Y=L, the color difference (ΔE), which is the geometric distance in the above color space, can be calculated.

The color difference in Comparative Example 2 is at the level of 6.54, which is a large difference that can be clearly seen with the naked eye.

In contrast, in Example 2 before and after the test (after 7 days), the difference between a* was -0.04, the difference between b* was 0.22, and the difference between Y was 1.27, indicating a relatively large value, and the transmittance was rather increased by 1.5%, The haze increased by 5.94 and the sheet resistance increased by only 1, indicating that the electrical and optical properties were not significantly affected before and after the test.

When the color difference (ΔE) was calculated in the same manner as in Comparative Example 2 in Example 2, the color difference in Example 2 was 1.29, and the color difference was felt, but it was found that the color difference was generally used.

3 is an image for comparing the low-resistance transparent electrode 100 according to an embodiment of the present invention and an electrode according to a comparative example.

3A shows images of Comparative Example 2 and FIG. 3B, respectively. The upper part of FIG. 3 is an image before the reliability test, and the lower part is an image after each reliability test.

From the images at the top and bottom of FIG. 3A, which are the results before and after the test of Comparative Example 2, it was found that many defects occurred on the surface of the sample after the test compared to the sample before the test.

From the images at the top and bottom of FIG. 3B, which is the result of before and after the test of Example 2, it was difficult to find that the defect occurred on the surface of the sample after the test compared to the sample before the test.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

100: low resistance transparent electrode
110: substrate
120: undercoat layer
130: first copper oxide layer
140: metal layer
150: second copper oxide layer
160: refractive index matching layer
170: functional layer

Claims (9)

Board;
A first copper oxide layer (CuOx layer) disposed on the undercoat layer;
A metal layer disposed on the first copper oxide layer; And
Including; a second copper oxide layer (CuOx layer) disposed on the metal layer
Low resistance transparent electrode, characterized in that.
The method of claim 1,
Further comprising an under coating layer disposed on the substrate to increase adhesion between the substrate and the metal layer
Low resistance transparent electrode, characterized in that.
The method of claim 1,
A refractive index matching layer disposed on the second copper oxide layer and having a refractive index of a medium selected to increase transmittance;
Low resistance transparent electrode, characterized in that.
The method of claim 1,
The metal of the metal layer is Ag, Pt, Au, and combinations thereof
Low resistance transparent electrode, characterized in that.
The method of claim 1,
The first copper oxide layer and the second copper oxide layer are each formed with a thickness in the range of 2 to 5 nm
Low resistance transparent electrode, characterized in that.
Preparing a substrate;
Forming a first copper oxide layer (CuOx layer) on the substrate;
Forming a metal layer on the first copper oxide layer; And
Including; forming a second copper oxide layer on the metal layer
A method of manufacturing a low resistance transparent electrode, characterized in that.
The method of claim 6,
Including; before forming the first copper oxide layer, forming an under coating layer on the substrate for increasing adhesion between the substrate and the metal layer;
A method of manufacturing a low resistance transparent electrode, characterized in that.
The method of claim 6,
Forming a refractive index matching layer on the second copper oxide layer in which the refractive index of the medium is selected to increase transmittance; further comprising
A method of manufacturing a low resistance transparent electrode, characterized in that.
The method of claim 6,
The metal of the metal layer is Ag,
The first copper oxide layer and the second copper oxide layer are each formed to a thickness in the range of 2 to 5 nm,
The metal layer is formed to a thickness of 10 nm or less
A method of manufacturing a low resistance transparent electrode, characterized in that.

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