KR20200124346A - Method of manufacturing for the display device - Google Patents

Abstract

Provided is a manufacturing method of a display device. According to one embodiment, the manufacturing method of the display device includes the steps of: arranging lead wires of a printed circuit film on signal wires provided on one side of a target panel; applying vibration to the printed circuit film to attach the signal wires of the target panel and lead wires of the printed circuit film; and measuring the vibration displacement of the printed circuit film using a sensor pattern disposed around the lead wires of the printed circuit film. The present invention can easily measure the vibration displacement of the printed circuit film.

Description

TECHNICAL FIELD OF THE DISPLAY DEVICE {METHOD OF MANUFACTURING FOR THE DISPLAY DEVICE}

The present invention relates to a method of manufacturing a display device.

The display device is a device that visually displays data. Such a display device includes a substrate partitioned into a display area and a non-display area. A plurality of pixels are disposed on the substrate in the display area, and a plurality of wirings PADs are disposed on the substrate in the non-display area. A flexible film (COF film) on which a driving circuit or the like is mounted is coupled to the plurality of pads to transmit a driving signal to the pixel.

The flexible film may include a plurality of leads coupled to the plurality of pads, and each lead may be bonded to a pad separated from each other. The bonding may be performed through an ultrasonic bonding process.

The ultrasonic bonding process may be performed through an ultrasonic device that applies a predetermined vibration to the flexible film and the pad. On the other hand, when vibration is applied to the flexible film, the flexible film vibrates with a predetermined vibration displacement and the leads and pads of the flexible film are ultrasonically bonded. By measuring the vibration displacement of the flexible film, the completion of ultrasonic bonding is determined. I can confirm.

An object of the present invention is to provide a method of manufacturing a display device capable of easily measuring the vibration displacement of a printed circuit film.

The problems of the present invention are not limited to the technical problems mentioned above, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

A method of manufacturing a display device according to an exemplary embodiment of the present disclosure includes disposing lead wires of a printed circuit film on signal wires provided on one side of a target panel; Applying vibration to the printed circuit film to attach signal wires of the target panel and lead wires of the printed circuit film; And measuring the vibration displacement of the printed circuit film by using a sensor pattern disposed around the lead wires of the printed circuit film.

Measuring the vibration displacement of the printed circuit film using a sensor pattern disposed around the lead wires of the printed circuit film, the vibration displacement of the sensor pattern disposed around the lead wires of the printed circuit film I can.

Measuring the vibration displacement of the sensor pattern disposed around the lead wires of the printed circuit film may include measuring the vibration displacement of the sensor pattern using a gap sensor above the printed circuit film. .

Measuring the vibration displacement of the sensor pattern using a gap sensor above the printed circuit film may include measuring the vibration displacement of the sensor pattern while the gap sensor is fixed.

The gap sensor may include a capacitance type sensor.

In the step of measuring the vibration displacement of the sensor pattern while the gap sensor is fixed, the gap sensor may derive different capacitances according to an overlapping area of the gap sensor in the thickness direction with the sensor pattern below.

The step of deriving different capacitances according to the overlapping area of the gap sensor and the sensor pattern in the thickness direction underneath the gap sensor, the greater the overlapping area of the gap sensor and the sensor pattern in the thickness direction, the greater the capacitance. I can.

The gap sensor may include a laser type sensor.

The sensor pattern may include a sensor substrate, a sensor bonding layer disposed on a lower surface of the sensor substrate, and a reflective pattern disposed on an upper surface of the sensor substrate.

Applying vibration to the printed circuit film to attach the signal wires of the target panel and the lead wires of the printed circuit film, and the printed circuit film using a sensor pattern disposed around the lead wires of the printed circuit film. The steps of measuring the vibration displacement can be performed simultaneously.

The step of applying vibration to the printed circuit film may be performed using an ultrasonic bonding device.

Attaching the signal wires of the target panel and the lead wires of the printed circuit film may include directly connecting the signal wires and the lead wires.

Directly connecting the signal wires and the lead wires may include ultrasonic bonding the signal wires and the lead wires.

The sensor pattern may include a sensor conductive layer, and the sensor conductive layer may include a metal.

The sensor pattern further includes a sensor substrate disposed between the sensor conductive layer and the printed circuit film, and a sensor bonding layer disposed between the sensor substrate and the sensor conductive layer, wherein the sensor bonding layer is the sensor conductive layer And the sensor substrate may be combined.

According to another exemplary embodiment of the present disclosure, a method of manufacturing a display device may include disposing lead wires of a printed circuit film on signal wires provided on one side of a target panel; Applying vibration to the printed circuit film to attach signal wires of the target panel and lead wires of the printed circuit film; And measuring a vibration displacement of the printed circuit film using a sensor pattern disposed inside the printed circuit film.

The sensor pattern may include a sensor conductive layer, and the sensor conductive layer may include a metal.

The sensor conductive layer may include a driving integrated circuit.

Measuring the vibration displacement of the printed circuit film using a sensor pattern disposed around the lead wires of the printed circuit film, measuring vibration displacement of the sensor pattern disposed around the lead wires of the printed circuit film Including the step, and measuring the vibration displacement of the sensor pattern disposed around the lead wires of the printed circuit film, measuring the vibration displacement of the sensor pattern using a gap sensor on the upper portion of the printed circuit film It may include.

Measuring the vibration displacement of the sensor pattern using a gap sensor on the upper portion of the printed circuit film includes measuring the vibration displacement of the sensor pattern while the gap sensor is fixed, and the gap sensor It may include a capacitance type sensor.

Details of other embodiments are included in the detailed description and drawings.

According to embodiments of the present invention, a method of manufacturing a display device capable of easily measuring vibration displacement of a printed circuit film may be provided by disposing a sensor pattern on a printed circuit film.

The effect according to the present invention is not limited by the contents illustrated above, and more various effects are included in the present specification.

1 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment.
2 is a perspective view illustrating one process step in a method of manufacturing a display device according to an exemplary embodiment.
3 is a perspective view of an ultrasonic bonding device.
4 is a block diagram showing an operation of components of an ultrasonic bonding device.
5 is a cross-sectional view taken along line V-V' of FIG. 2.
6 is a cross-sectional view illustrating another process step of a method of manufacturing a display device according to an exemplary embodiment.
7 to 11 are cross-sectional views illustrating still other process steps in a method of manufacturing a display device according to an exemplary embodiment.
12 is a graph measuring the amount of capacitance over time.
13 is a flowchart of a method of manufacturing a display device according to another exemplary embodiment.
14 is a cross-sectional view illustrating one process step of a method of manufacturing a display device according to another exemplary embodiment.
15 is a cross-sectional view illustrating one process step of a method of manufacturing a display device according to another exemplary embodiment.
16 is a cross-sectional view illustrating one process step in a method of manufacturing a display device according to another exemplary embodiment.
17 is a cross-sectional view illustrating one process step in a method of manufacturing a display device according to another exemplary embodiment.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in other forms. That is, the present invention is only defined by the scope of the claims.

When an element or layer is referred to as “on” or “on” of another element or layer, it is possible to interpose another layer or other element in the middle as well as directly above the other element or layer. All inclusive. On the other hand, when a device is referred to as "directly on" or "directly on", it indicates that no other device or layer is interposed therebetween.

The same reference numerals are used for the same or similar parts throughout the specification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment, FIG. 2 is a perspective view illustrating a step in a method of manufacturing a display device according to an exemplary embodiment, and FIG. 3 is a perspective view of an ultrasonic bonding device, and FIG. 4 is a block diagram showing the operation of components of the ultrasonic bonding device, FIG. 5 is a cross-sectional view taken along line V-V' of FIG. It is a sectional view shown.

1 to 6, a method of manufacturing a display device according to an exemplary embodiment may be a manufacturing method for manufacturing a display device to be described later. A display device is a device that displays moving pictures or still images, and includes mobile phones, smart phones, tablet PCs (Personal Computers), and smart watches, watch phones, mobile communication terminals, electronic notebooks, e-books, Portable Multimedia PCAyers (PMPs), It can be used not only as a display screen for portable electronic devices such as navigation and UMPC (Ultra Mobile PC), but also for various products such as televisions, notebook computers, monitors, billboards, and Internet of Things.

The display device is, for example, a liquid crystal display (LCD) device, a quantum dot organic light emitting display (QD-OLED) device, a quantum dot liquid crystal display (QD-LCD) device, a quantum nano light emitting display (Nano LED) device, a micro LED ( At least one of Micro LED) devices can be applied.

Referring to FIGS. 1 and 2, in a method 1 of manufacturing a display device according to an exemplary embodiment, first, a printed circuit film 300 is formed on signal wires PADs provided at one side of the target panel 100. The lead wiring LE of is placed (S10).

Specifically, the target panel 100 may include a display area DA for displaying an image and a non-display area NA located around the display area DA. The planar shape of the display area DA may have a rectangular shape or a rectangular shape with rounded corners. However, the present invention is not limited thereto, and the display area DA may have various shapes such as a square or other polygonal shape, or a circle or an ellipse.

The display area DA includes a plurality of pixels. Each pixel may include an emission layer and a circuit layer disposed on the emission layer and controlling the amount of light emitted by the emission layer. The circuit layer may include a display wiring, a display electrode, and at least one transistor. The emission layer may include an organic emission material. The light-emitting layer may be sealed by an encapsulation film. The encapsulation layer may seal the light emitting layer to prevent moisture or the like from entering from the outside. The encapsulation film may be formed of a single or multi-layered inorganic film, or a laminated film in which an inorganic film and an organic film are alternately stacked.

The non-display area NA is disposed around, for example, one side of the display area DA. The non-display area NA may be a non-display part that does not display a screen. Unlike the display area DA, the non-display area NA may not include pixels. When the display area DA has a rectangular shape with rounded corners, the non-display area NA is disposed adjacent to at least one side of the rectangular shape of the display area DA. In the drawing, a case in which the non-display area NA is disposed adjacent to one short side and both long sides of the display area DA is illustrated.

The non-display area NA may include a plurality of signal wires PAD connected to the display wires of the pixel. A plurality of signal wires PAD arranged in the non-display area NA may be electrically connected to the at least one transistor through the display wires, respectively. A printed circuit film 300 may be attached on the plurality of signal wirings PAD as described later.

The target panel 100 may include the target substrate 101. The target substrate 101 may be a rigid substrate. The rigid substrate may include glass or quartz. In some embodiments, the target substrate 101 may be a flexible substrate. The flexible substrate may include a flexible material such as polyimide (PI). When the target substrate 101 includes a flexible substrate, the non-display area NA located on the short side of the target panel 100 may be bent in a direction opposite to the display surface to overlap the display area DA in the thickness direction. . Hereinafter, a description will be made focusing on the application of a rigid substrate as the target substrate 101 of the target panel 100.

The emission layer, the circuit layer, and the signal wires PADs of the target panel 100 may be disposed on the target substrate 101.

The printed circuit film 300 is disposed on the non-display area NA of the target panel 100. The printed circuit film 300 may include an attachment area CA attached to the non-display area NA of the target panel 100, and a sensor area SA positioned around the attachment area CA.

The attachment area CA of the printed circuit film 300 is located on one side of the printed circuit film 300 as shown in FIG. 2, and the sensor area SA of the printed circuit film 300 is the printed circuit film 300. It may be located in a peripheral area located farther from the target panel 100 than the attachment area CA of.

The printed circuit film 300 may include a base film 301, a plurality of conductive wires disposed on the base film 301, and a driving integrated circuit.

The base film 301 may serve to support a plurality of conductive wires, a driving integrated circuit, and a sensor pattern 500 of the printed circuit film 300. The base film 301 may include a flexible material. Examples of the flexible material may include polyimide (PI), but are not limited thereto. The base film 301 may include a lower surface on which the plurality of conductive wires and a driving integrated circuit are disposed, and an upper surface opposite to the lower surface. A sensor pattern 500 may be disposed on the upper surface of the base film 301.

The plurality of conductive wires of the printed circuit film 300 may include a plurality of lead wires LE. The plurality of lead wires LE may be electrically connected to the driving integrated circuit, and may be connected to the plurality of signal wires PAD in the attachment area CA of the target panel 100.

The plurality of lead wires LE may include a metallic material. The plurality of lead wires (LE) are molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium ( Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), may include at least one metal selected from copper (Cu).

The driving integrated circuit may be, for example, a data driving integrated circuit that applies a data signal. The driving integrated circuit may use a chip on film (COF) method implemented as a driving chip.

The sensor pattern 500 is disposed on the sensor area SA of the base film 301. The sensor pattern 500 may be disposed on the upper surface of the base film 301. The sensor pattern 500 may be used to measure the vibration displacement of the printed circuit film 300 during the attachment process of the printed circuit film 300 and the target panel 100. The sensor pattern 500 includes a sensor bonding layer disposed on the upper surface of the base film 310 (see “510” in FIG. 5), a sensor base layer disposed on the sensor bonding layer (see “530” in FIG. 5), And a sensor conductive layer (refer to '550' in FIG. 5) disposed on the sensor substrate layer. This will be described later.

A stage 700 supporting the target panel 100 and the printed circuit film 300 may be further disposed under the target panel 100 and the printed circuit film 300.

The stage 700 may include a first support part supporting the target panel 100 and a second support part connected to the first support part and mainly supporting the printed circuit film 300. The surface height of the first support may be lower than the surface height of the second support. This is because the attachment area CA of the printed circuit film 300 is attached to the upper surface of the non-display area NA of the target panel 100, so that the peripheral area including the sensor area SA of the printed circuit film 300 Silver may have a step according to the thickness of the target panel 100. However, since the second support portion of the stage 700 has a height higher than the surface of the first support portion, the target panel 100 is located in the peripheral area including the sensor area SA of the printed circuit film 300. It is possible to support the printed circuit film 300 and compensate for the step difference due to the thickness of.

1, 3, and 5, the signal lines PADs of the target panel 100 and the lead wires LE of the printed circuit film 300 are then subjected to vibration by applying vibration to the printed circuit film 300. Attach (S20).

More specifically, the step of applying vibration to the printed circuit film 300 may be performed using the bonding device 10. The bonding device 10 may serve to bond a plurality of signal wires PADs of the target panel 100 and a plurality of lead wires LE of the printed circuit film 300. The step (S20) of attaching the signal wires PADs of the target panel 100 and the lead wires LE of the printed circuit film 300 by applying vibration to the printed circuit film 300 (S20) It may include disposing the bonding device 10 on the attachment area CA.

More specifically, the bonding device 10 may be, for example, an ultrasonic bonding device, and may be designed to match the applied ultrasonic frequency and the resonance frequency of the bonding device 10. The bonding apparatus 10 may directly bond a plurality of signal wires PADs of the target panel 100 and a plurality of lead wires LE of the printed circuit film 300. That is, each signal wire PAD and a lead wire LE corresponding thereto may be directly bonded and ultrasonically bonded.

As shown in FIG. 3, the bonding apparatus 10 according to an embodiment includes a body portion 20 and a horn portion 30 connected to the body portion 20. The horn portion 30 includes a horn coupling portion 31 physically connected to the body portion 20, a horn body portion 33 connected to the horn coupling portion 31, and a horn tip portion 35 connected to the horn body portion 33. ).

The body part 20 serves to transmit a vibration signal to the connected horn part 30. The vibration signal may be vibration energy. The horn coupling portion 31 of the horn portion 30 may be physically fastened to the body portion 20 through the coupling region CP of the body portion 20. The horn body portion 33 of the horn portion 30 may serve to transmit the vibration signal applied from the body portion 20 to the horn tip portion 35 of the horn portion 30. The horn tip portion 35 of the horn portion 30 may bond the object to be bonded through the vibration signal applied from the horn body portion 33. That is, the horn tip portion 35 may directly bond the signal wiring and the lead wiring by directly applying the vibration signal to the flexible printed circuit film of the bonding portion of the display device.

Referring to FIG. 4, the body part 20 of the bonding device 10 includes a power supply unit 21 for generating an electric signal, and a signal conversion unit for converting the electric signal applied from the power supply unit 21 into a vibration signal. (23), and a vibration amplifying unit 25 for amplifying the vibration amplitude of the vibration signal.

The power supply unit 21 receives power through an external power source. The power supply unit 21 may convert the power applied from the external power source into an electric signal. The electric signal converted by the power supply unit 21 may be transmitted to the signal conversion unit 23. The electrical signal may have a higher frequency than the power source. For example, the frequency of the power source is typically about 60 Hz, and the frequency of the electrical signal may be about 20 kHz, 35 kHz, and 40 kHz, but is not limited thereto.

The signal conversion unit 23 converts the electric signal applied from the power supply unit 21 into a vibration signal and transmits the vibration signal to the vibration amplification unit 25.

The vibration amplifying unit 25 amplifies the amplitude of the vibration signal applied from the signal conversion unit 23 and transmits the amplified vibration signal to the horn unit 30.

The horn body portion 33 of the horn portion 30 may serve to transmit the amplified vibration signal applied from the vibration amplifying portion 25 to the horn tip portion 35 of the horn portion 30. The horn body 33 may transmit a vibration signal having the same amplitude as the amplified vibration signal applied from the vibration amplifying unit 25 to the horn tip 35, but is not limited thereto, and the vibration amplifying unit 25 By amplifying the amplified vibration signal applied from ), a vibration signal having a greater amplitude intensity than this may be transmitted to the horn tip part 35.

The horn tip portion 35 of the horn portion 30 may bond the printed circuit film 300 and the target panel 100 to each other through the vibration signal applied from the horn body portion 33.

1 and 6, the step of attaching the signal wires PADs of the target panel 100 and the lead wires LE of the printed circuit film 300 by applying vibration to the printed circuit film 300 ( S20) may include a step of directly connecting the signal wiring PAD and the lead wiring LE. Directly connecting the signal wiring PAD and the lead wiring LE may include ultrasonic bonding the signal wiring PAD and the lead wiring LE. The vibration applied to the printed circuit film 300 may be in the extension direction of the signal line PAD and the lead line LE, for example, in the second direction DR2.

More specifically, when the lead wire LE is ultrasonically vibrated on one surface of the signal wire PAD using the bonding device 10 described above, the base film of the printed circuit film 300 in contact with the bonding device 10 ( 301 and the lead wire LE may vibrate together in the ultrasonic vibration direction according to the vibration of the bonding device 10 along the ultrasonic vibration direction, for example, the second direction DR2. Due to the pressure in the direction perpendicular to the vibration and the vibration in the horizontal direction, a predetermined frictional force is generated at the interface between one surface of the signal wiring PAD and the one surface of the lead wiring LE, and frictional heat may be generated due to the frictional force. If the frictional heat is sufficient to melt the material forming the signal wiring PAD and the lead wiring LE, the pad melting region PADb adjacent to the lead wiring LE of the signal wiring PAD and the signal of the lead wiring LE The lead melting regions LEb adjacent to the wiring PAD may be melted, respectively. That is, the signal wiring PAD may include the pad non-melting area PADa and the pad melting area PADb. In addition, the lead wiring LE may include a lead non-melting region LEa and a lead melting region LEb.

The pad non-melting area PADa may be an area including only a material included in the signal line PAD. The lead non-melting region LEa may be a region including only a material included in the lead wiring LE.

The pad melting area PADb is a region in which the material included in the lead wiring LE is diffused and the material of the signal wiring PAD and the material of the lead wiring LE are mixed, and the lead melting area LEb is a signal wiring ( The material included in the PAD) may be diffused to be a region in which the material of the lead wire LE and the material of the signal wire PAD are mixed.

In the pad melting region PADb and the lead melting region LEb, the signal wiring PAD and the lead wiring LE may be combined while solidifying. The interface between the signal line PAD and the lead line LE, that is, the interface between the pad melting area PADb and the lead melting area LEb, may have a non-flat shape.

Referring to FIGS. 1 and 6, the vibration displacement of the printed circuit film 300 is then measured using the sensor pattern 500 disposed around the lead wires LE of the printed circuit film 300 (S30). ).

The vibration displacement of the printed circuit film 300 may be a displacement in the vibration direction of the bonding device 10 and the printed circuit film 300 described above, for example, in the second direction DR2. In the initial state of the ultrasonic bonding process, the frictional force between the contact surface of the horn part 30 of the bonding device 10 and the contact surface of the printed circuit film 300 is determined by the lead wire LE of the printed circuit film 300 and the target panel 100. It may be greater than the frictional force between the signal lines PAD of. Therefore, in the initial state of the ultrasonic bonding process, the contact surface of the horn part 30 of the bonding device 10 and the contact surface of the printed circuit film 300 behave together according to the ultrasonic vibration of the bonding device 10, so that the relative position change There may be few. On the other hand, the lead wiring LE of the printed circuit film 300 and the signal wiring PAD of the target panel 100 are at the mutual interface, and the lead wiring LE of the printed circuit film 300 is an ultrasonic wave of the bonding device 10. It behaves according to the vibration, and since the signal line PAD of the target panel 100 hardly moves, a relative position change may occur.

However, as described above, mutual melting occurs at the interface between the lead wiring LE of the printed circuit film 300 and the signal wiring PAD of the target panel 100, and solidification proceeds, while the lead wiring LE and the signal wiring ( When the frictional force between PAD) increases and the frictional force between them is greater than the frictional force between the contact surface of the horn portion 30 of the bonding device 10 and the contact surface of the printed circuit film 300, the horn portion 30 of the bonding device 10 A relative positional change may occur between the contact surface and the contact surface of the printed circuit film 300. Due to this, even though sufficient ultrasonic bonding between the signal wiring PAD and the lead wiring LE is performed, a relative vibrational motion between the contact surface of the horn portion 30 of the bonding device 10 and the contact surface of the printed circuit film 300 occurs. Thus, the surface of the printed circuit film 300 may be physically damaged by the horn part 30.

Measuring the vibration displacement of the printed circuit film 300 using the sensor pattern 500 disposed around the lead wires LE of the printed circuit film 300 (S30) is a lead of the printed circuit film 300 And measuring the vibration displacement of the sensor pattern 500 disposed around the wires LE. Measuring the vibration displacement of the sensor pattern 500 disposed around the lead wires LE of the printed circuit film 300 may be performed using the gap sensor 900 on the printed circuit film 300. 500) may include measuring the vibration displacement.

The gap sensor 900 may be a capacitance type sensor. That is, the gap sensor 900 measures the capacitance between the gap sensor 900 and the sensor pattern 500 disposed below and/or the printed circuit film 300 to measure the vibration displacement of the sensor pattern 500. I can.

As described above, the sensor pattern 500 includes a sensor bonding layer 510 disposed on the upper surface of the base film 301, a sensor base layer 530 disposed on the sensor bonding layer 510, and a sensor base layer 530. ) May include a sensor conductive layer 550 disposed on it.

The sensor bonding layer 510 may serve to attach the sensor pattern 500 to the base film 301. The sensor bonding layer 510 may include at least one of an adhesive layer, an adhesive layer, or a resin layer. For example, the sensor bonding layer 510 is a silicone-based, urethane-based, silicone-urethane hybrid SU polymer, acrylic-based, isocyanate-based, polyvinyl alcohol-based, gelatin-based, vinyl-based, latex-based, polyester-based, water-based polyester. It may contain a polymer material classified as a system or the like.

The sensor base layer 530 may serve to maintain the gap between the sensor patterns 500. The sensor substrate layer 530 includes polyethylene terephthalate (PET), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), and polymethyl methacrylate (PMMA). ), triacetyl cellulose (TAC), cycloolefin polymer (COP), and the like.

The sensor conductive layer 550 may serve to measure the capacitance by inducing free electrons to the surface by the gap sensor 900. The sensor conductive layer 550 may include a metal.

The capacitance between the gap sensor 900 and the sensor conductive layer 550 is the size of the surface area facing the gap sensor 900 and the sensor conductive layer 550, the uniformity of the electric field generated by the gap sensor 900, It may depend on the distance between the gap sensor 900 and the sensor conductive layer 550, the amount of free electrons induced from the sensor conductive layer 550 to the surface by the electric field generated by the gap sensor 900.

In some embodiments, attaching the signal wires PADs of the target panel 100 and the lead wires LE of the printed circuit film 300 by applying vibration to the printed circuit film 300 and the printed circuit film 300 Measuring the vibration displacement of the printed circuit film 300 using the sensor pattern 500 disposed around the lead wires LE of may be performed simultaneously.

7 to 11 are cross-sectional views illustrating other process steps in a method of manufacturing a display device according to an exemplary embodiment, and FIG. 12 is a graph measuring an amount of capacitance over time. 7 to 12, positions 2 and 4 have different relative positions between the gap sensor 900 and the sensor pattern 500, respectively, but the overlapping area between the gap sensor 900 and the sensor pattern 500 is the same. It is assumed to have the same capacitance for convenience. In addition, positions 1 and 5 also have different relative positions between the gap sensor 900 and the sensor pattern 500, respectively, but since there is no overlapping area between the gap sensor 900 and the sensor pattern 500, for convenience of description. It is assumed to have the same electrostatic capacity.

1 and 7 to 12, the step of measuring the vibration displacement of the sensor pattern 500 using the gap sensor 900 on the printed circuit film 300 is fixed by the gap sensor 900 In this state, measuring the vibration displacement of the sensor pattern 500 may be included. In the step of measuring the vibration displacement of the sensor pattern 500 while the gap sensor 900 is fixed, the gap sensor 900 measures different capacitances at the bottom according to the overlap area in the thickness direction with the sensor pattern 500. It may include the step of deriving.

In FIG. 12, the horizontal axis represents the ultrasonic bonding process time, and the vertical axis represents the capacitance measured by the gap sensor 900.

As shown in FIG. 7, when the printed circuit film 300 and the sensor pattern 500 move to position 1 while the gap sensor 900 and the target panel 100 are fixed, the first capacitance CAP1 Can be measured. The gap sensor 900 may be disposed to overlap the printed circuit film 300 in the thickness direction and may be disposed non-overlapping with the sensor pattern 500. The gap sensor 900 and the printed circuit film 300 are spaced apart at a first distance d1.

As shown in FIG. 8, when the gap sensor 900 and the target panel 100 are fixed and the printed circuit film 300 and the sensor pattern 500 move to position 2, the second capacitance CAP2 Can be measured. The second capacitance CAP2 may be greater than the first capacitance CAP1. In position 2, unlike position 1, the gap sensor 900 may partially overlap the sensor pattern 500 in the thickness direction. The gap sensor 900 and the sensor pattern 500 are spaced apart at a second distance d2. The second distance d2 may be smaller than the first distance d1.

The sensor pattern 500 includes the sensor conductive layer 550 facing the gap sensor 900, so that the amount of free electrons induced by the gap sensor 900 is greater than that of the position 1, and the gap sensor 900 and the Since the second distance d2 between the sensor patterns 500 is smaller than the first distance d1 between the gap sensor 900 and the printed circuit film 300, the second capacitance measured by the gap sensor 900 ( CAP2) may be larger than the first capacitance CAP1.

8 and 12 show only the capacitances at positions 1 and 2, the capacitances measured by the gap sensor 900 at positions between positions 1 and 2 may be measured together. For this reason, the behavior of the printed circuit film 300 from position 1 to position 2 can be measured in real time.

As shown in FIG. 9, when the gap sensor 900 and the target panel 100 are fixed and the printed circuit film 300 and the sensor pattern 500 move to position 3, the third capacitance CAP3 Can be measured. The third capacitance CAP3 may be greater than the first capacitance CAP1 and the second capacitance CAP2. In the position 3, unlike the position 2, the gap sensor 900 may completely overlap the sensor pattern 500 in the thickness direction.

Since the sensor pattern 500 at position 3 has a larger effective area than the gap sensor 900 compared to the position 2, the third capacitance CAP3 measured by the gap sensor 900 is the second capacitance CAP2. Can be greater than ).

9 and 12 show only the capacitances at positions 2 and 3, the capacitances measured by the gap sensor 900 at positions between the positions 2 and 3 may be measured together. For this reason, the behavior of the printed circuit film 300 from position 2 to position 3 can be measured in real time.

As shown in FIG. 10, when the gap sensor 900 and the target panel 100 are fixed and the printed circuit film 300 and the sensor pattern 500 move to position 4, the second capacitance CAP2 Can be measured. As described above, in position 4, the overlapping area between the gap sensor 900 and the sensor pattern 500 in the position 2 is substantially the same, so that the same capacitance may be measured.

As shown in FIG. 11, when the gap sensor 900 and the target panel 100 are fixed and the printed circuit film 300 and the sensor pattern 500 move to position 5, the fifth capacitance CAP1 Can be measured. As described above, since there is no overlapping area between the gap sensor 900 and the sensor pattern 500 as in the position 1, it may be substantially the same as the capacitance measured at the position 1.

As described above, in the manufacturing method 1 of the display device according to the exemplary embodiment, the printed circuit film 300

In the manufacturing method 1 of the display device according to an exemplary embodiment, the sensor pattern 500 disposed on the printed circuit film 300 using the gap sensor 900 disposed on the printed circuit film 300 during an ultrasonic bonding process. ) And the gap sensor 900 by measuring the capacitance between the sensor pattern 500 and the vibration displacement of the sensor pattern 500 through the measurement, it is possible to more accurately measure the vibration displacement of the printed circuit film 300 (to check the bonding behavior). Due to this, even though sufficient ultrasonic bonding between the signal wiring PAD and the lead wiring LE is performed, a relative vibrational motion between the contact surface of the horn portion 30 of the bonding device 10 and the contact surface of the printed circuit film 300 occurs. Thus, it is possible to prevent physical damage to the surface of the printed circuit film 300 by the horn part 30 in advance.

Hereinafter, a method 2 of manufacturing a display device according to another exemplary embodiment will be described. In the following embodiments, the same components as those of the previously described embodiments are referred to by the same reference numerals, and descriptions thereof will be omitted or simplified.

13 is a flowchart illustrating a method of manufacturing a display device according to another exemplary embodiment, and FIG. 14 is a cross-sectional view illustrating one process step of a method of manufacturing a display device according to another exemplary embodiment.

13 and 14, the manufacturing method 2 of the display device according to the present exemplary embodiment uses a sensor pattern 500_1 disposed inside the printed circuit film 300 to determine the printed circuit film 300. It is different from the method 1 of manufacturing a display device according to an exemplary embodiment in that vibration displacement is measured.

More specifically, as shown in FIG. 14, a sensor pattern 500_1 is disposed on the lower surface of the base film 301 of the printed circuit film 300, and the sensor pattern 500_1 is Can be placed inside.

In some embodiments, the sensor pattern 500_1 may be the driving integrated circuit described above in one embodiment. The sensor pattern 500_1 may be, for example, a data driving integrated circuit that applies a data signal. The sensor pattern 500_1 may be electrically connected to the lead wires LE disposed on the base film 301.

The sensor pattern 500_1 may include a conductive material on its surface, similar to the sensor pattern 500 described above in an exemplary embodiment.

The capacitance between the gap sensor 900 and the sensor pattern 500_1 is the size of the surface area facing the gap sensor 900 and the sensor pattern 500_1, the strength of the electric field generated by the gap sensor 900, and the gap sensor 900 The distance between the sensor pattern 500_1 and the gap sensor 900 may depend on the amount of free electrons induced on the surface of the sensor pattern 500_1 by an electric field generated by the gap sensor 900.

As described above, melting occurs at the interface between the lead wiring LE of the printed circuit film 300 and the signal wiring PAD of the target panel 100, and solidification proceeds, and the lead wiring LE and the signal wiring PAD When the frictional force between them increases and the frictional force between them is greater than the frictional force between the contact surface of the horn part 30 of the bonding device 10 and the contact surface of the printed circuit film 300, the contact surface of the horn part 30 of the bonding device 10 A relative positional change may occur on the contact surface of the printed circuit film 300. Due to this, even though sufficient ultrasonic bonding between the signal wiring PAD and the lead wiring LE is performed, a relative vibrational motion between the contact surface of the horn portion 30 of the bonding device 10 and the contact surface of the printed circuit film 300 occurs. Thus, the surface of the printed circuit film 300 may be physically damaged by the horn part 30.

Measuring the vibration displacement of the printed circuit film 300 using the sensor pattern 500_1 disposed inside the printed circuit film 300 (S31) includes a sensor pattern disposed inside the printed circuit film 300 ( 500_1) and measuring the vibration displacement. The step of measuring the vibration displacement of the sensor pattern 500_1 disposed inside the printed circuit film 300 is to measure the vibration displacement of the sensor pattern 500_1 using the gap sensor 900 above the printed circuit film 300. It may include the step of measuring.

In the manufacturing method 2 of the display device according to the present exemplary embodiment, the sensor pattern 500_1 disposed on the printed circuit film 300 using the gap sensor 900 disposed on the printed circuit film 300 during the ultrasonic bonding process. ) And the gap sensor 900 by measuring the capacitance between the sensor pattern 500_1 and the vibration displacement of the sensor pattern 500_1 can be more accurately measured the vibration displacement of the printed circuit film 300. Due to this, even though sufficient ultrasonic bonding between the signal wiring PAD and the lead wiring LE is performed, a relative vibrational motion between the contact surface of the horn portion 30 of the bonding device 10 and the contact surface of the printed circuit film 300 occurs. Thus, it is possible to prevent physical damage to the surface of the printed circuit film 300 by the horn part 30 in advance.

15 is a cross-sectional view illustrating one process step of a method of manufacturing a display device according to another exemplary embodiment.

Referring to FIG. 15, in the method of manufacturing the display device according to the present exemplary embodiment, a sensor pattern 500_2 different from the sensor pattern 500_1 according to the exemplary embodiment of FIG. 14 is disposed inside the printed circuit film 300_1. It is different from the embodiment of FIG. 14.

In more detail, the sensor pattern 500_2 according to the present exemplary embodiment may be physically separated from and electrically insulated from the plurality of lead wires LE of the printed circuit film 300_1.

Like the sensor pattern 500_1 according to the embodiment of FIG. 14, the sensor pattern 500_2 may include a conductive material.

As described above, melting occurs at the interface between the lead wiring LE of the printed circuit film 300_1 and the signal wiring PAD of the target panel 100, and solidification proceeds, and the lead wiring LE and the signal wiring PAD When the frictional force between them increases and the frictional force between them is greater than the frictional force between the contact surface of the horn part 30 of the bonding device 10 and the contact surface of the printed circuit film 300_1, the contact surface of the horn part 30 of the bonding device 10 A relative position change may occur on the contact surface of the printed circuit film 300_1. Due to this, relatively vibrational motion between the contact surface of the horn part 30 of the bonding device 10 and the contact surface of the printed circuit film 300_1 occurs even though sufficient ultrasonic bonding between the signal wire PAD and the lead wire LE is performed. Thus, physical damage may occur on the surface of the printed circuit film 300_1 by the horn part 30.

Measuring the vibration displacement of the printed circuit film 300_1 using the sensor pattern 500_2 disposed inside the printed circuit film 300_1 includes the sensor pattern 500_2 disposed inside the printed circuit film 300_1. And measuring the vibration displacement. Measuring the vibration displacement of the sensor pattern 500_2 disposed inside the printed circuit film 300_1 is to measure the vibration displacement of the sensor pattern 500_2 using the gap sensor 900 above the printed circuit film 300_1. It may include the step of measuring.

In the method of manufacturing the display device according to the present exemplary embodiment, the sensor pattern 500_2 disposed on the printed circuit film 300_1 and the gap using the gap sensor 900 disposed on the printed circuit film 300_1 during the ultrasonic bonding process. By measuring the capacitance between the sensors 900 and measuring the vibration displacement of the sensor pattern 500_2 through this, the vibration displacement of the printed circuit film 300_1 may be more accurately measured. Due to this, relatively vibrational motion between the contact surface of the horn part 30 of the bonding device 10 and the contact surface of the printed circuit film 300_1 occurs even though sufficient ultrasonic bonding between the signal wire PAD and the lead wire LE is performed. Thus, it is possible to prevent physical damage to the surface of the printed circuit film 300_1 by the horn part 30 in advance.

16 is a cross-sectional view illustrating one process step in a method of manufacturing a display device according to another exemplary embodiment.

Referring to FIG. 16, the method of manufacturing the display device according to the present exemplary embodiment is different from the manufacturing method of the display device according to the exemplary embodiment in that the gap sensor 900_1 is a laser type sensor. That is, the gap sensor 900_1 can measure the vibration displacement of the sensor pattern 500 by measuring the distance between the gap sensor 900 and the sensor pattern 500 and/or the printed circuit film 300 disposed below. have.

The sensor pattern 500 is substantially the same as described above in an exemplary embodiment, and thus a duplicate description will be omitted.

The gap sensor 900_1 may measure the behavior of the printed circuit film 300 while measuring a gap between the gap sensor 900_1 and the sensor pattern 500 and/or the base film 301 below. That is, while the gap sensor 900_1 is fixed, when the printed circuit film 300 and the sensor pattern 500 disposed on the printed circuit film 300 move, the gap sensor 900_1 moves the sensor pattern 500 in the thickness direction. ) And the second measurement distance when the gap sensor 900_1 overlaps with the sensor pattern 500 in the thickness direction. For example, when the sensor pattern 500 moves to the left in the first direction DR1, the second measurement distance is derived, and when the sensor pattern 500 moves to the right in the first direction DR1, the first measurement When the distance is derived and the sensor pattern 500 moves to the left in the first direction DR1 again, the second measurement distance may be derived. The first measurement distance and the second measurement distance derived over time may appear repeatedly.

When ultrasonic bonding is completed, the number of repetitions of the first measurement distance and the second measurement distance decreases over time, and through this, it is possible to know whether the ultrasonic bonding is completed.

As described above, melting occurs at the interface between the lead wiring LE of the printed circuit film 300 and the signal wiring PAD of the target panel 100, and solidification proceeds, and the lead wiring LE and the signal wiring PAD When the frictional force between them increases and the frictional force between them is greater than the frictional force between the contact surface of the horn part 30 of the bonding device 10 and the contact surface of the printed circuit film 300, the contact surface of the horn part 30 of the bonding device 10 A relative positional change may occur on the contact surface of the printed circuit film 300. Due to this, even though sufficient ultrasonic bonding between the signal wiring PAD and the lead wiring LE is performed, a relative vibrational motion between the contact surface of the horn portion 30 of the bonding device 10 and the contact surface of the printed circuit film 300 occurs. Thus, the surface of the printed circuit film 300 may be physically damaged by the horn part 30.

Measuring the vibration displacement of the printed circuit film 300 using the sensor pattern 500 disposed on the printed circuit film 300 is the vibration of the sensor pattern 500 disposed inside the printed circuit film 300. Measuring the displacement. The step of measuring the vibration displacement of the sensor pattern 500 disposed inside the printed circuit film 300 includes the sensor pattern 500_2 using a laser-type gap sensor 900_1 above the printed circuit film 300. It may include measuring the vibration displacement.

In the method of manufacturing the display device according to the present exemplary embodiment, the sensor pattern 500 and the gap disposed on the printed circuit film 300 using the gap sensor 900_1 disposed on the printed circuit film 300 during the ultrasonic bonding process. By measuring the distance between the sensors 900_1 and measuring the vibration displacement of the sensor pattern 500 through this, the vibration displacement of the printed circuit film 300 can be more accurately measured. Due to this, even though sufficient ultrasonic bonding between the signal wiring PAD and the lead wiring LE is performed, a relative vibrational motion between the contact surface of the horn portion 30 of the bonding device 10 and the contact surface of the printed circuit film 300 occurs. Thus, it is possible to prevent physical damage to the surface of the printed circuit film 300 by the horn part 30 in advance.

17 is a cross-sectional view illustrating one process step in a method of manufacturing a display device according to another exemplary embodiment.

Referring to FIG. 17, in the method of manufacturing the display device according to the present exemplary embodiment, the sensor pattern 500_3 does not include the sensor conductive layer 550 and includes a sensor reflective layer 570 disposed on the sensor base layer 530. It is different from the embodiment according to FIG. 16 in that it further includes.

More specifically, the method of manufacturing the display device according to the present exemplary embodiment may further include a sensor reflective layer 570 in which the sensor pattern 500_3 is disposed on the sensor base layer 530. The sensor reflective layer 570 may serve to better reflect incident light of the laser-type gap sensor 900_1 from the surface of the sensor pattern 500_3. That is, the gap sensor 900_1 measures the behavior of the printed circuit film 300 while measuring the gap between the gap sensor 900_1 and the lower sensor pattern 500 and/or the base film 301 as described above, Since the sensor pattern 500_3 further includes a sensor reflective layer 570 at the top, the first measurement distance and the gap sensor 900_1 in the thickness direction when the gap sensor 900_1 overlaps the sensor pattern 500 in the thickness direction. Data accuracy between the second measurement distance when the sensor pattern 500 is non-overlapping may be further improved.

The embodiments of the present invention have been described above, but these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention pertains should not depart from the essential characteristics of the embodiments of the present invention. It will be appreciated that various modifications and applications not illustrated above are possible. For example, each component specifically shown in the embodiments of the present invention can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

1: Method of manufacturing a display device
10: display device manufacturing device
20: body part
30: horn part
100: target panel
300: printed circuit film
500: sensor pattern
700: stage
900: gap sensor

Claims (20)

Disposing lead wires of a printed circuit film on signal wires provided on one side of the target panel;
Applying vibration to the printed circuit film to attach signal wires of the target panel and lead wires of the printed circuit film; And
And measuring a vibration displacement of the printed circuit film using sensor patterns disposed around the lead wires of the printed circuit film. The method of claim 1,
Measuring the vibration displacement of the printed circuit film using a sensor pattern disposed around the lead wires of the printed circuit film,
A method of manufacturing a display device for measuring vibration displacement of a sensor pattern disposed around lead wires of the printed circuit film. The method of claim 2,
Measuring the vibration displacement of the sensor pattern disposed around the lead wires of the printed circuit film,
And measuring the vibration displacement of the sensor pattern using a gap sensor on the printed circuit film. The method of claim 3,
Measuring the vibration displacement of the sensor pattern using a gap sensor on the upper portion of the printed circuit film,
And measuring a vibration displacement of the sensor pattern while the gap sensor is fixed. The method of claim 4,
The gap sensor is a method of manufacturing a display device including a capacitance type sensor. The method of claim 5,
Measuring the vibration displacement of the sensor pattern while the gap sensor is fixed,
A method of manufacturing a display device in which the gap sensor derives different capacitances under an overlapping area with the sensor pattern in a thickness direction. The method of claim 6,
The step of deriving different capacitances according to the overlapping area of the gap sensor in the thickness direction with the sensor pattern underneath,
A method of manufacturing a display device in which a larger capacitance is derived as an overlapping area between the gap sensor and the sensor pattern in a thickness direction increases. The method of claim 4,
The gap sensor is a method of manufacturing a display device including a laser type sensor. The method of claim 8,
The sensor pattern includes a sensor substrate, a sensor bonding layer disposed on a lower surface of the sensor substrate, and a reflective pattern disposed on an upper surface of the sensor substrate. The method of claim 1,
Applying vibration to the printed circuit film to attach the signal wires of the target panel and the lead wires of the printed circuit film, and the printed circuit film using a sensor pattern disposed around the lead wires of the printed circuit film. The measuring of the vibration displacement is performed simultaneously. The method of claim 1,
The applying of vibration to the printed circuit film is performed by using an ultrasonic bonding device. The method of claim 11,
Attaching the signal wires of the target panel and the lead wires of the printed circuit film includes directly connecting the signal wires and the lead wires. The method of claim 12,
Directly connecting the signal wires and the lead wires includes ultrasonic bonding the signal wires and the lead wires. The method of claim 1,
The sensor pattern includes a sensor conductive layer, and the sensor conductive layer includes a metal. The method of claim 14,
The sensor pattern further includes a sensor substrate disposed between the sensor conductive layer and the printed circuit film, and a sensor bonding layer disposed between the sensor substrate and the sensor conductive layer, wherein the sensor bonding layer is the sensor conductive layer And a method of manufacturing a display device combining the sensor substrate. Disposing lead wires of a printed circuit film on signal wires provided on one side of the target panel;
Applying vibration to the printed circuit film to attach signal wires of the target panel and lead wires of the printed circuit film; And
And measuring a vibration displacement of the printed circuit film by using a sensor pattern disposed inside the printed circuit film. The method of claim 16,
The sensor pattern includes a sensor conductive layer, and the sensor conductive layer includes a metal. The method of claim 17,
The sensor conductive layer is a method of manufacturing a display device including a driving integrated circuit. The method of claim 16,
Measuring the vibration displacement of the printed circuit film using a sensor pattern disposed around the lead wires of the printed circuit film,
Including the step of measuring the vibration displacement of the sensor pattern disposed around the lead wires of the printed circuit film,
Measuring the vibration displacement of the sensor pattern disposed around the lead wires of the printed circuit film,
And measuring the vibration displacement of the sensor pattern using a gap sensor on the printed circuit film. The method of claim 19,
Measuring the vibration displacement of the sensor pattern using a gap sensor on the upper portion of the printed circuit film,
Including the step of measuring the vibration displacement of the sensor pattern while the gap sensor is fixed,
The gap sensor is a method of manufacturing a display device including a capacitance type sensor.

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