KR20200119107A - Electronic device comprising antenna - Google Patents

Abstract

Disclosed is an electronic device to secure radiation performance of an antenna. According to one embodiment of the present invention, the electronic device comprises: a window; a display panel; a support member including a first structure forming at least a part of a side surface of the electronic device and a second structure forming a mounting space of parts, wherein the first structure includes a first metal portion and a protrusion portion protruding from a first position of the first metal portion toward the second structure and the second structure is spaced apart from the first metal portion by a predetermined gap and is arranged along at least a part of the first metal portion; a PCB; at least one wireless communication circuit; a capacitor connected to the protrusion part; a switching circuit electrically connecting a connection point between the first metal portion and the capacitor to the second structure or the ground of the PCB; and a cover. The first metal portion is electrically connected to the second structure or the ground of the PCB at a second point different from the first point. The wireless communication circuit supplies power to the first metal portion through a power supply point connected to the capacitor to be set to transmit and/or receive a first signal of a first frequency range and a second signal of a second first range. Various other embodiments known through the description are possible.

Description

Electronic device comprising an antenna

Embodiments disclosed in this document relate to electronic devices including an antenna.

Electronic devices that support wireless communication are equipped with antennas. A mobile electronic device such as a smart phone or a tablet may transmit and receive signals in a specific frequency range by using a metal material disposed inside the electronic device or forming the appearance of the electronic device as a radiator. In general, a conventional smartphone has a narrow side bezel area, whereas the upper and lower bezel areas have a relatively large area so that a camera, receiver, speaker, microphone, or home button can be disposed. Accordingly, antennas for supporting wireless communication such as cellular networks, Wi-Fi, or Bluetooth in conventional electronic devices such as smart phones have been mainly disposed in upper and lower bezel areas.

Meanwhile, in order to secure the maximum screen size while keeping the device size small, electronic devices such as recent smartphones are designed to have a very narrow area not only on the side surfaces but also on the top and bottom bezel areas.

When most of the front area of an electronic device (eg, a smartphone) is implemented as a display in order to secure the maximum screen size, the electronic device has a very narrow area across the sides and the top and bottom. In this case, electronic components such as a receiver, a microphone, or a camera may be mainly disposed in an upper area to maintain an existing user experience or to efficiently utilize a space. However, if electronic components and antennas are placed together in the narrowed upper bezel area, the design difficulty increases, and the efficiency of the antenna may decrease due to the material of the electronic component (eg, metal) or the frequency of the signal used by the electronic component. have. In addition, space is insufficient even in the lower bezel area, and the lower bezel area is an area frequently gripped by the user, so the efficiency of the antenna may be deteriorated.

Accordingly, in an electronic device having a very narrow bezel region, when antennas are implemented mainly depending on the upper and lower bezel regions as in the past, radiation performance may be degraded or design difficulty may increase.

According to the exemplary embodiment disclosed in this document, the electronic device may secure the radiation performance of the antenna by disposing an insulating portion and an antenna capable of transmitting and/or receiving multiple bands on the side.

An electronic device according to an embodiment disclosed in the present document may include a window forming at least a part of at least a front surface of the electronic device, a display panel disposed under the window, and at least a portion of a side surface of the electronic device A support member comprising a first structure forming a first structure and a second structure forming a mounting space for parts, wherein the first structure comprises a first metal portion and a first point of the first metal portion. And a protrusion protruding toward a second structure, wherein the second structure includes a second metal part disposed along at least a portion of the first metal part while being spaced apart by a gap from the first metal part. A supporting member comprising, a PCB disposed on the second structure, at least one wireless communication circuit, a capacitor connected to the protrusion, and a connection point between the first metal part and the capacitor of the second structure or the PCB. A switching circuit electrically connected to the ground and a cover forming a rear surface of the electronic device, wherein the first metal portion is formed of the second structure or the PCB at a second point different from the first point. Electrically connected to the ground, the wireless communication circuit, through a feeding point connected to the capacitor, by feeding power to the first metal part, the first signal in the first frequency range and the second signal in the second frequency range It is set to transmit and/or receive.

In addition, an electronic device according to an embodiment disclosed in the present document includes a window forming at least a front surface of the electronic device, a display panel disposed under the window, and a first device forming at least a part of a side surface of the electronic device. A support member including a structure and a second structure forming a mounting space for components, wherein the first structure includes a first side surface extending in a first direction, a second direction perpendicular to the first direction, and the first structure A second side shorter than a side, a third side extending parallel to the first side, a fourth side extending parallel to the second side and connecting the first side and the third side, the first side A support member including a first metal part that is a part, a protrusion protruding in the second direction from a first point of the first metal part, and a second metal part that is a part of the third side, disposed on the second structure PCB, a wireless communication circuit disposed on the PCB, a capacitor connected to the protrusion, a switching circuit electrically connecting a connection point between the first metal part and the capacitor to the second structure or the ground of the PCB, and the Includes a cover forming a rear surface of the electronic device, wherein the first metal part is electrically connected to the second structure or the ground of the PCB at a second point different from the first point, and the wireless communication The circuit is configured to transmit and/or receive a first signal in a first frequency range and a second signal in a second frequency range different from the first frequency range by feeding the first metal part through a feed point connected to the capacitor. It is set and may be set to transmit and/or receive a signal in a third frequency range different from the first frequency range and the second frequency range by feeding power to the second metal part.

According to the embodiments disclosed in this document, in a structure where it is difficult to place an antenna in the upper bezel area of the electronic device, by disposing the antenna on the side of the electronic device, it is equal to or superior to the existing antenna radiation performance. Radiation performance can be realized.

In addition to this, various effects that are directly or indirectly identified through this document can be provided.

1 is a block diagram of an electronic device in a network environment 100 according to an embodiment disclosed in this document.
2 is an exploded perspective view illustrating an electronic device according to an embodiment disclosed in the present document.
FIG. 3 is a view of the support member of FIG. 2 viewed in the z direction.
4 is an enlarged view of area k of FIG. 3.
5 is a cross-sectional view taken along line A-A' of FIG. 4.
6 is a cross-sectional view taken along line B-B' of FIG. 4.
7A is an enlarged perspective view of portion j of FIG. 4.
7B is an enlarged perspective view of portion j of FIG. 4.
7C is a circuit diagram corresponding to FIGS. 7A and 7B.
8 is a diagram illustrating a first electrical path and a second electrical path of an electronic device according to an embodiment disclosed in the present document.
9 is a graph for describing signals transmitted and received by a wireless communication circuit using a first metal part, a second metal part, and a protrusion of an electronic device according to an exemplary embodiment disclosed in the present document.
10 is a diagram illustrating that an electronic device includes a slide unit according to an exemplary embodiment disclosed in this document.
11 is a side view illustrating a raising operation of a camera module unit according to an embodiment disclosed in this document.
12 is a side view illustrating a lowering operation of a camera module unit according to an embodiment disclosed in this document.
13A is a diagram illustrating a protrusion of an electronic device according to an embodiment disclosed in this document.
13B is a diagram illustrating a protrusion of an electronic device according to an embodiment disclosed in the present document.
13C is a diagram for explaining effects related to FIGS. 13A and 13B.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to a specific embodiment, it should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present invention.

1 is a block diagram of an electronic device 101 in a network environment 100 according to an embodiment disclosed in this document. Referring to FIG. 1, in a network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (for example, a short-range wireless communication network), or a second network 199 It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) Can be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to implement at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least a part of data processing or operation, the processor 120 stores commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132 The command or data stored in the volatile memory 132 may be processed, and result data may be stored in the nonvolatile memory 134. According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and an auxiliary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or together. , A sensor hub processor, or a communication processor). Additionally or alternatively, the coprocessor 123 may be set to use lower power than the main processor 121 or to be specialized for a designated function. The secondary processor 123 may be implemented separately from the main processor 121 or as a part thereof.

The coprocessor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, an application is executed). ) While in the state, together with the main processor 121, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the functions or states related to. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176). The data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.

The input device 150 may receive a command or data to be used for a component of the electronic device 101 (eg, the processor 120) from an outside (eg, a user) of the electronic device 101. The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output an sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 160 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.

The audio module 170 may convert sound into an electric signal or, conversely, convert an electric signal into sound. According to an embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device directly or wirelessly connected to the electronic device 101 (for example, Sound may be output through the electronic device 102) (for example, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101, or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 176 is, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or motor sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture a still image and a video. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 388 may be implemented as at least a part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, electronic device 102, electronic device 104, or server 108). It is possible to support establishment and communication through the established communication channel. The communication module 190 operates independently of the processor 120 (eg, an application processor), and may include one or more communication processors that support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : A LAN (local area network) communication module, or a power line communication module) may be included. Among these communication modules, a corresponding communication module is a first network 198 (for example, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (for example, a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (for example, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip), or may be implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 in a communication network such as the first network 198 or the second network 199. The electronic device 101 can be checked and authenticated.

The antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside. According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, provided by the communication module 190 from the plurality of antennas. Can be chosen. The signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197.

At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and signals ( E.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the electronic devices 102 and 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service by itself. In addition or in addition, it is possible to request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 101. The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.

2 is an exploded perspective view illustrating an electronic device 101 according to an embodiment disclosed in this document.

In one embodiment, the electronic device 101 includes a window 220, a display panel 230, a conductive sheet 231, a support member 210, a printed circuit board (PCB) 240, and short-range communication. The circuit 260 and/or the cover 270 may be included.

The window 220 may form at least the entire surface of the electronic device 101. The window 220 may be formed by a glass plate or a polymer plate including various coating layers.

The display panel 230 may be disposed under the window 220. At least a portion of the display panel 230 may be exposed through the window 220. In an embodiment, the edge of the display panel 230 may be formed substantially the same as an adjacent outer shape of the window 220. In an embodiment, in order to expand the area to which the display panel 230 is exposed, the distance between the outer periphery of the display panel 230 and the outer periphery of the window 220 may be formed to be substantially the same. The display panel 230 may be connected to the processor of the electronic device 101 (eg, the processor 120 of FIG. 1 ). The display panel 230 may receive image data from the processor and display an image to be displayed by the processor.

The conductive sheet 231 may be disposed on one surface of the display panel 230. The conductive sheet 231 may be a ground layer that serves as a ground of the display panel 230. The conductive sheet 231 may be implemented as a metal plate (for example, a copper (Cu) sheet) or graphite. The conductive sheet 231 may block electromagnetic waves flowing into or out of the display panel 230. The conductive sheet 231 may dissipate heat generated from the display panel 230.

The support member 210 may include a first structure 211 that forms at least a part of a side surface of the electronic device 101 and a second structure 212 that forms a mounting space for components. The first structure 211 may be combined with the window 220 and the cover 270. The first structure 211 may include at least a portion of a metal and/or a polymer. The second structure 212 may be disposed inside the electronic device 101. The second structure 212 may be integrally formed with the first structure 211 or may be formed separately and connected to each other. For example, the second structure 212 may be integrally formed from the side of the first structure 211 toward the inside. At least a portion of the second structure 212 may be formed of a metal material and/or a polymer material. In one embodiment, the display panel 230 may be coupled to the first surface of the second structure 212. The PCB 240 may be coupled to the second surface of the second structure 212. The second structure 212 may be connected to the ground of the PCB 240, for example. Further details of the support member 210 will be described later with reference to FIG. 3.

According to an embodiment, a processor (eg, the processor 120 of FIG. 1) may be disposed on the PCB 240. The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

According to an embodiment, a wireless communication circuit may be disposed on the PCB 240. The wireless communication circuit may, for example, communicate with an external device (eg, the electronic device 104 of FIG. 1 ).

According to an embodiment, the PCB 240 may include a ground. The ground of the PCB 240 may function as a ground of an antenna implemented using a wireless communication circuit.

The short-range communication circuit 260 may perform short-range communication with an external device or wirelessly transmit and receive power required for charging. For example, the short-range communication circuit 260 may be implemented with NFC (near field communication) or MST (magnetic secure transmission).

The cover 270 may form a rear surface of the electronic device 101. The cover 270 may protect the electronic device 101 from external impacts or foreign substances.

3 is a view of the support member 210 of FIG. 2 viewed in the z direction. 4 is an enlarged view of area k of FIG. 3. 5 is a cross-sectional view taken along line A-A' of FIG. 4. 6 is a cross-sectional view taken along line B-B' of FIG. 4.

Referring to FIG. 3, the first structure 211 of the support member 210 includes a first side 211_1, a second side 211_2, a third side 211_3, and a fourth side 211_4. I can.

The first side surface 211_1 may extend in the first direction y. The second side surface 211_2 extends in a second direction x perpendicular to the first direction y, and may be shorter than the first side surface 211_1. The third side surface 211_3 may extend parallel to the first side surface 211_1. The fourth side 211_4 may extend parallel to the second side 211_2 and connect the first side 211_1 and the third side 211_3 to each other.

The first side surface 211_1 may include a first insulating portion 210i_1, a first metal portion 210m_1, a second insulating portion 210i_2, and a third metal portion 210m_3.

The third side surface 211_3 may include a third insulating portion 210i_3 and a fifth metal portion 210m_5.

The second structure 212 may include a second metal part 210m_2, a fourth metal part 210m_4, and a sixth metal part 210m_6.

In one embodiment, the electronic device 101 uses at least a portion of the first structure 211 and at least a portion of the second structure 212 forming at least a part of a side surface of the electronic device 101, and provides wireless communication. It may be implemented to enable the radiation of electromagnetic waves for.

Referring to FIGS. 4 to 6 together with FIG. 3, the first metal part 210m_1 may have a first length L1. The start portion of the first metal portion 210m_1 may be defined by the first insulating portion 210i_1. For example, the first insulating portion 210i_1 may be disposed at one end of the first metal portion 210m_1.

In an embodiment, the protrusion 210p may be a portion protruding from the first metal portion 210m_1 in the second direction x. For example, the protrusion 210p may protrude toward the second structure 212 from the first point p1 of the first metal part 210m_1. The first point p1 of the first metal portion 210m_1 may be, for example, a point between the start portion of the first metal portion 210m_1 and the end 210e of the first metal portion 210m_1.

In an embodiment, the second metal portion 210m_2 may be disposed along at least a portion of the first metal portion 210m_1 while being spaced apart from the first metal portion 210m_1 by a gap. As the first metal portion 210m_1 and the second metal portion 210m_2 are spaced apart, the first slit s1 is formed between the first metal portion 210m_1 and the second metal portion 210m_2, and the protrusion 210p. It may be formed between the second metal portions 210m_2. The first slit s1 may be an air gap, but may be filled with an insulating material.

In an embodiment, the first slit s1 may further include a first auxiliary slit s1_1. The first auxiliary slit s1_1 may be formed in, for example, the second metal part 210m_2 in a recess shape. The first auxiliary slit s1_1 may be, for example, a portion recessed in the second metal portion 210m_2 facing the first metal portion 210m_1. The first auxiliary slit s1_1 may be an air gap, but may be filled with an insulating material. As the first slit s1 additionally includes the first auxiliary slit s1_1, the length of the first electrical path EP1 to be described later may be further increased.

The second metal part 210m_2 may include a recess 212r formed to correspond to the protrusion 210p. At least a portion of the protrusion 210p may extend to an inner region of the recess 212r, but it is also possible that the protrusion 210p does not extend to the inside of the recess 212r.

The end 210e of the first metal part 210m_1 may be connected to the second metal part 210m_2 through the first connection part 210c_1. The end 210e of the first metal part 210m_1 may be referred to as a second point p2. The first metal part 210m_1 may be electrically connected to the ground through the second point p2. The first metal part 210m_1 may be directly connected to the ground of the PCB 240, but may be connected to the ground of the PCB 240 through the metal part of the second structure 212.

Referring back to FIG. 3, the third metal part 210m_3 may be spaced apart from the first metal part 210m_1 in the first direction y. The third metal part 210m_3 may have a second length L2. The start portion of the third metal portion 210m_3 may be defined by the second insulating portion 210i_2. For example, the second insulating portion 210i_2 may be disposed at one end of the third metal portion 210m_3. The second insulating portion 210i_2 may be disposed between the first metal portion 210m_1 and the third metal portion 210m_3.

The fourth metal portion 210m_4 may be disposed along at least a portion of the third metal portion 210m_3 while being spaced apart from the third metal portion 210m_3 by a predetermined interval. As the third metal portion 210m_3 and the fourth metal portion 210m_4 are spaced apart, the second slit s2 may be formed between the third metal portion 210m_3 and the fourth metal portion 210m_4. The second slit s2 may be filled with an insulating material, for example.

An end of the third metal part 210m_3 may be connected to the fourth metal part 210m_4 through the second connection part 210c_2.

The fifth metal part 210m_5 may have a third length L3. The start portion of the fifth metal portion 210m_5 may be defined by the third insulating portion 210i_3. For example, the third insulating portion 210i_3 may be disposed at one end of the fifth metal portion 210m_5.

The sixth metal part 210m_6 may be disposed along at least a part of the fifth metal part 210m_5 while being spaced apart from the fifth metal part 210m_5 by a predetermined distance. As the fifth metal portion 210m_5 and the sixth metal portion 210m_6 are spaced apart, the third slit s3 may be formed between the fifth metal portion 210m_5 and the sixth metal portion 210m_6. The third slit s3 may be filled with an insulating material, for example.

In an embodiment, the third slit s3 may further include a second auxiliary slit s3_1. The second auxiliary slit s3_1 may be formed, for example, in the shape of a recess in the sixth metal part 210m_6. The second auxiliary slit s3_1 may be, for example, a portion recessed in the sixth metal portion 210m_6 facing the fifth metal portion 210m_5. The second auxiliary slit s3_1 may be an air gap, but may be filled with an insulating material. As the third slit s3 additionally includes the second auxiliary slit s3_1, the electrical path of the radiator of the antenna including the fifth metal part 210m_5 and the sixth metal part 210m_6 may be increased.

An end of the fifth metal part 210m_5 may be connected to the sixth metal part 210m_6 through a third connection part 210c_3.

In an embodiment, the fifth metal part 210m_5 may include a protrusion 210p1. The protrusion 210p1 may protrude toward the second structure 212 from the fifth metal portion 210m_5. The sixth metal part 210m_6 may include, for example, a recess formed to correspond to the protrusion 210p1. In one embodiment, the fifth metal part 210m_5, the protrusion 210p1, the sixth metal part 210m_6, and the recess are the first metal part 210m_1, the protrusion 210p1, and the second metal part 210m_2 And the recess 212r, respectively.

The radiator of the first antenna may include at least a first metal portion 210m_1, a protrusion 210p, and a second metal portion 210m_2. The radiator of the second antenna may include at least a third metal portion 210m_3 and a fourth metal portion 210m_4. The radiator of the third antenna may include at least a fifth metal part 210m_5 and a sixth metal part 210m_6.

In an embodiment, the electronic device 101 may further include an antenna disposed on the fourth side.

In an embodiment, the first length L1 of the first metal part 210m_1 may be longer than the third length L3 of the fifth metal part 210m_5. The third length L3 of the fifth metal part 210m_5 may be longer than the second length L2 of the third metal part 210m_3. The frequency ranges of signals transmitted and received by the first metal part 210m_1, the third metal part 210m_3, and the fifth metal part 210m_5 may be different from each other.

7A and 7B are enlarged perspective views of portion j of FIG. 4. 7A and 7B show a first metal part 210m_1 and a second metal part 210m_2 in order for the first metal part 210m_1, the second metal part 210m_2, and the protrusion 210p to operate as a radiator of the antenna. And circuit elements connected to the protrusion 210p. 7C is a circuit diagram corresponding to FIGS. 7A and 7B. FIG. 8 is a diagram illustrating a first electrical path EP1 and a second electrical path EP2 of the electronic device 101 according to an exemplary embodiment disclosed in this document. 9 illustrates a signal transmitted and received by a wireless communication circuit using a first metal part 210m_1, a second metal part 210m_2, and a protrusion 210p of the electronic device 101 according to an embodiment disclosed in this document. It is a graph to do. The x-axis of FIG. 9 may represent frequency (unit: MHz), and the y-axis may represent S ₁₁ (unit: dB).

7A, 7B, and 7C, the first point p1 of the first metal part 210m_1 may be connected to the capacitor 301 and the switching circuit 305, and the first metal part 210m_1 The second point p2 may be connected to the second structure 212 or the ground of the PCB 240. When the second point p2 of the first metal part 210m_1 is connected to the second structure 212, at least a part of the second structure 212 may function as a ground.

The protrusion 210p protruding from the first point p1 of the first metal part 210m_1 may be connected to the capacitor 301 and the switching circuit 305. The capacitor 301 and the switching circuit 305 may be disposed on the PCB 240, for example.

In the embodiment of FIG. 7A, the capacitor 301 may be disposed on the PCB 240. For example, the capacitor 301 is a lump element, and may be implemented in a form of direct power supply.

In the exemplary embodiment of FIG. 7B, the capacitor 301 may be replaced or added by two or more conductive patterns 301_1 and 301_2 provided on two or more layers among a plurality of layers included in the PCB 240. For example, the capacitor 301 may include two or more conductive patterns 301_1 and 301_2 disposed on different layers of the PCB 240, and may be implemented in an indirect power supply type.

One end of the capacitor 301 may be connected to the protrusion 210p through a connection circuit 320, and the other end may be connected to a wireless communication circuit through a feeding point (FP). The connection circuit 320 may provide a connection between one end of the capacitor 301 and the protrusion 210p.

The switching circuit 305 may electrically connect the connection point CP to the second structure 212 or the ground of the PCB 240 through a plurality of elements. The connection point CP may be a point between the capacitor 301 and the first metal part 210m_1. For example, the connection point CP may be a predetermined point of one end of the capacitor 301 connected to the protrusion 210p. The connection circuit 320 may provide a connection between the connection point CP and the switching circuit 305.

In one embodiment, the switching circuit 305, through any one of the four elements 311, 312, 313, 314, the connection point (CP) of the second structure 212 or the PCB 240 Can be connected to the ground. However, the present invention is not limited thereto, and the switching circuit 305 may connect the connection point CP to the second structure 212 or the ground of the PCB 240 through an arbitrary number of devices as necessary.

When the switching circuit 305 connects the connection point CP with the ground of the second structure 212 or the PCB 240 through any one of the four elements, the four elements are, for example, a capacitor and / Or may include an inductor.

The wireless communication circuit may be disposed on the PCB 240. The wireless communication circuit may supply power to the first metal part 210m_1 through the power supply point FP connected to the capacitor 301.

8 and 9, the wireless communication circuit may supply power to the first metal part 210m_1 through the power supply point FP connected to the capacitor 301. Through the electrical paths EP1 and EP2 including at least some of the first metal part 210m_1, the first connection part 210c_1, the protrusion 210p, and the second metal part 210m_2, the first frequency range a A first signal in the first frequency range FB1 and a second signal in the second frequency range FB2 may be transmitted and received.

The first, second, third, and fourth graphs G1, G2, G3, G4 are, when power is supplied to the first metal part 210m_1 by a wireless communication circuit, the first metal part 210m_1, the first Signals that can be transmitted/received through electrical paths EP1 and EP2 including the connection portion 210c_1, the protrusion 210p, and the second metal portion 210m_2 are represented.

The first frequency range FB1 may include first, second, third, and fourth resonance frequencies f1, f2, f3, and f4. The second frequency range FB2 may include fifth, sixth, seventh, and eighth resonance frequencies f5, f6, f7, and f8. The second frequency range FB2 may be higher than the first frequency range FB1.

The first signal group may be signals included in the first frequency range FB1 in the first, second, third, and fourth graphs G1, G2, G3, and G4. The first signal group may include a first signal. The second signal group may be signals included in the second frequency range FB2 in the first, second, third, and fourth graphs G1, G2, G3, and G4. The second signal group may include a second signal.

When the wireless communication circuit supplies power to the first metal part 210m_1 through the feeding point FP connected to the capacitor 301, the first electrical path EP1 for transmitting the first signal in the first frequency range FB1 ) May include a first metal part 210m_1, a first connection part 210c_1, a second metal part 210m_2, and a protrusion 210p. The wireless communication circuit may transmit and receive the first signal in the first frequency range FB1 based on the first electrical path EP1.

When the wireless communication circuit supplies power to the first metal part 210m_1 through the feeding point FP connected to the capacitor 301, the second electrical path EP2 for transmitting a second signal in the second frequency range FB2 ) May include at least a portion of the first metal portion 210m_1 and/or at least a portion of the second metal portion 210m_2. For example, in order to transmit and receive a second signal in the second frequency range FB2, a part of the first metal part 210m_1 between the protrusion 210p and the first insulating part 210i_1, and the protrusion 210p and the first A portion of the second metal portion 210m_2 between the 1 insulating portion 210i_1 may be used as an antenna radiator.

When the wireless communication circuit feeds the first metal part 210m_1 through the feeding point FP connected to the capacitor 301 to transmit and receive the first signal and the second signal, the first frequency range FB1 and the second frequency The resonant frequency in the range FB2 can be adjusted by the switching circuit 305.

For example, the switching circuit 305 connects the connection point CP to the second structure 212 or the ground of the PCB 240 through any one of the first to fourth elements 311, 312, 313, and 314. When electrically connected, the first metal part 210m_1, the first connection part 210c_1, the second metal part 210m_2, and the protrusion 210p have the first to fourth resonant frequencies in the first frequency range FB1 ( f1, f2, f3, f4) can transmit and receive signals, and at least a part of the first metal part 210m_1 or at least part of the second metal part 210m_2 is in the second frequency range FB2. Signals having fifth to eighth resonant frequencies f5, f6, f7, and f8 may be transmitted and received.

For example, when the switching circuit 305 does not electrically connect the connection point CP with the second structure 212 or the ground of the PCB 240 through a plurality of elements, the first antenna radiation element can transmit/receive. The reference resonant frequencies of the possible signal may be between the first and second resonant frequencies f1 and f2 and between the fifth and sixth resonant frequencies f5 and f6. Switching circuit 305 When the connection point CP is electrically connected to the second structure 212 or the ground of the PCB 240 through an element that is a capacitor among the first to fourth elements 311, 312, 313, and 314, the first metal The portion 210m_1, the first connection portion 210c_1, the second metal portion 210m_2, and the protrusion 210p (eg, the first electrical path EP1) have resonance frequencies lower than the reference resonance frequencies (eg, f1). , f5) can transmit and receive signals. The resonance frequency of the signal transmitted and received through the first electrical path EP1 may be lower than the resonance frequency transmitted and received through the electrical path not including the protrusion 210p. When the protrusion 210p is included in the electrical path for transmitting and receiving signals, compared to the case where the protrusion 210p is not included in the electrical path for transmitting and receiving a signal, a slit (for example, the first slit s1 and the first auxiliary This is because the length of the slit s1_1 can be increased.

The resonance frequency of the signal that can be transmitted and received by the first metal part 210m_1, the first connection part 210c_1, the second metal part 210m_2, and the protrusion 210p is the inductance element connected to the switching circuit 305. It can be adjusted according to the value. In this case, the switching circuit 305 may be used as a matching circuit, for example. For example, the switching circuit 305 is an inductor among the first to fourth elements 311, 312, 313, and 314, and the connection point CP is connected to the second structure 212 or the ground of the PCB 240. When electrically connected to, the first metal part 210m_1, the first connection part 210c_1, the second metal part 210m_2, and the protrusion 210p have a resonant frequency higher than the reference resonant frequencies (for example, f2, f3, Signals having f4, f6, f7, and f8) can be transmitted and received. The switching circuit 305 electrically connects the connection point CP to the second structure 212 or the ground of the PCB 240 through an inductor among the first to fourth elements 311, 312, 313, and 314 Thus, a tunable antenna having a broadband characteristic can be implemented. Therefore, compared to the case where the switching circuit 305 is not included, signals in a wide frequency range can be transmitted and received.

As the value of the inductor connected by the switching circuit 305 increases, the resonant frequencies may decrease. For example, the first metal part 210m_1, the first connection part 210c_1, the second metal part 210m_2, and the protrusion 210p transmit and receive signals having second and sixth resonance frequencies f2 and f6. In this case, the inductor value connected by the switching circuit 305 is the first metal part 210m_1, the first connection part 210c_1, the second metal part 210m_2, and the protrusion 210p at the third and seventh resonance. When signals having frequencies f3 and f7 are transmitted/received, it may be greater than an inductor value connected by the switching circuit 305.

The wireless communication circuit may supply power to the third metal part 210m_3 and the fifth metal part 210m_5 described with reference to FIG. 3. When the wireless communication circuit supplies power to the third metal part 210m_3, the third metal part 210m_3 and the fourth metal part 210m_4 are different from the first frequency range FB1 and the second frequency range FB2. It can transmit and receive signals in the 3 frequency range. When the wireless communication circuit supplies power to the fifth metal part 210m_5, the fifth metal part 210m_5 and the sixth metal part 210m_6 are different from the first frequency range FB1 and the second frequency range FB2. Can transmit and receive signals in the 4 frequency range. The fourth frequency range may be, for example, a band supporting WiFi.

When power is supplied by connecting the wireless communication circuit directly to the first metal part 210m_1 and connecting the switching circuit 305 to the wireless communication circuit without feeding power through the protrusion 210p and the capacitor 301, the wireless communication circuit It can transmit and receive signals in one frequency range. The electronic device 101 according to the exemplary embodiment disclosed in this document supplies power to the first metal part 210m_1 disposed on the side of the electronic device 101 through the protrusion 210p and the capacitor 301, The first signal of the first frequency range FB1 and the second signal of the second frequency range FB2 may be simultaneously transmitted and received.

When impedance matching is performed by using an existing impedance matching circuit or when the switching circuit 305 is connected to the feed point (FP) rather than the connection point (CP), adjusting the resonant frequency within the transmit/receive frequency range It can be difficult. In this case, for example, it may be difficult to cause a large change in the resonant frequency, and efficiency can only be improved by tuning the resonant frequency. The electronic device 101 according to the embodiment disclosed in this document implements a frequency swing using the switching circuit 305 when power is supplied to the first metal part 210m_1, so that a resonance frequency within a frequency range that can be transmitted/received. Can be adjusted in various ways.

FIG. 10 is a diagram for explaining that the electronic device 101 includes a slide unit 501 according to an embodiment disclosed in this document. 11 is a side view showing an upward operation of the camera module unit 503 according to an embodiment disclosed in this document. 12 is a side view illustrating a lowering operation of the camera module unit 503 according to an embodiment disclosed in this document.

Referring to FIG. 10, the electronic device 101 may further include a slide unit 501 and a camera module unit 503.

In one embodiment, the slide unit 501 may be disposed on the first structure 211 and the second structure 212. The slide part 501 may be spaced apart by the first metal part 210m_1 and the first insulating part 210i_1, and spaced apart by the fifth metal part 210m_5 and the third insulating part 210i_3. The slide part 501 may slide with respect to the first metal part 210m_1 and the fifth metal part 210m_5. For example, when the slide part 501 slides in the first direction y with respect to the first metal part 210m_1 and the fifth metal part 210m_5, only the slide part 501 is moved and the first metal part (210m_1) and the fifth metal part 210m_5 may not be moved. Accordingly, the first metal part 210m_1 and the fifth metal part 210m_5 of the electronic device 101 according to the exemplary embodiment disclosed in this document are not affected by the sliding operation of the slide part 501 and have a specified frequency range. Can send and receive signals.

In an embodiment, the camera module unit 503 may include at least one camera device, a flash, or a sensor module. The camera module part 503 can rotate with respect to the slide part 501.

Referring to FIG. 11, the camera module unit 503 may perform an ascending operation or a rotation operation based on a user input (eg, a front photographing change input, front photographing basic app execution). As the camera module unit 503 rotates, at least one camera included in the camera module unit 503 may be used as a front camera (eg, a selfie camera).

According to an embodiment, in the 401 state, the camera included in the camera module unit 503 may face the rear side of the electronic device 101. In this case, the camera included in the camera module unit 503 may be used as a rear camera.

According to an embodiment, in the 403 state, the camera module unit 503, the rack gear 521, and the slide unit 501 may perform an upward movement based on a user input (eg, a first stroke). have. The rack gear 521 can move in response to the movement of the slide unit 501. For example, the camera module unit 503, the rack gear 521, and the slide unit 501 may move by the first movement distance H1. As the camera module unit 503, the rack gear 521, and the slide unit 501 are moved upward by the first moving distance H1 by a user input (eg, first stroke), the slide unit 501 and the slide unit 501 are 1 The distance to the metal part 210m_1 may be increased. In the 403 state, the rack gear 521 may be fixed by a cleek.

According to an embodiment, in states 405 to 409, the camera module unit 503 may perform an upward movement and a rotation movement. For example, in states 405 to 409, the rack gear 521 is fixed by the click, and only the camera module unit 503 and the slide unit 501 can move upward. The camera module unit 503 and the slide unit 501 may move upward by a second movement distance H2 by a user input (eg, a second stroke). As the camera module unit 503 and the slide unit 501 are moved upward by the second movement distance H2 by a user input (eg, the second stroke), the camera module unit 503 and the slide unit 501 are moved upward by the first movement distance H1. , The distance between the slide part 501 and the first metal part 210m_1 may be further increased. The pinion gear 511 may rotate and move in engagement with the rack gear 521. Accordingly, the camera module unit 503 can be rotated. In the 409 state, the camera included in the camera module unit 503 may face the front of the electronic device 101. In this case, the camera included in the camera module unit 503 may be used as a front camera.

According to various embodiments, the pinion gear 511 may rotate based on the length (or number of gears) of the rack gear 521. For example, the angle at which the pinion gear 511 rotates may vary depending on the length (or number of gears) of the rack gear 521. Therefore, according to the length (or number of gears) of the rack gear 521, the camera module unit 503 coupled with the pinion gear 511 is at a predetermined angle (eg, 10 degrees to 270 degrees from the rear of the electronic device) You can rotate as many times as you like. For example, the length (or number of gears) of the rack gear 521 may be set so that the pinion gear 511 rotates 180 degrees. In various embodiments, the length (or number of gears) of the rack gear 521 may be set such that the pinion gear 511 rotates by 180 degrees or less. Alternatively, the length (or number of gears) of the rack gear 521 may be set such that the pinion gear 511 rotates by 180 degrees or more (180 to 300 degrees). When the pinion gear 511 is rotated by 180 degrees or more, the camera module unit 503 may rotate at an angle that is more appropriate for taking a selfie.

Referring to FIG. 12, the camera module unit 503 may perform a descending operation or a rotation operation based on a user input (eg, a rear shooting change input, a shooting end input). As the camera module unit 503 rotates, at least one camera included in the camera module unit 503 may be used as a rear camera.

According to an embodiment, in the state 411, the camera included in the camera module unit 503 may face the front of the electronic device 101. For example, the camera included in the camera module unit 503 may face the front of the electronic device 101 according to a previously input user input (eg, a front shot conversion input, a front shot basic app execution). In various embodiments, the camera module unit 503 may be configured at a specific angle (eg, 10 degrees to 270 degrees with respect to the rear surface of the electronic device 101) according to the gear ratio of the pinion gear 511 and the rack gear 521. It may face the front of the electronic device 101.

According to an embodiment, in states 411 to 415, the camera module unit 503 may perform downward movement and rotation movement. For example, in the states 411 to 415, the rack gear 521 is maintained in a fixed state by the click, and only the camera module unit 503 and the slide unit 501 can move downward. The camera module unit 503 and the slide unit 501 may move downward by a second movement distance H2. As the camera module part 503 and the slide part 501 are moved downward by the second moving distance H2, the distance between the slide part 501 and the first metal part 210m_1 may be reduced. The pinion gear 511 may rotate and move in engagement with the rack gear 521. Accordingly, the camera module unit 503 can be rotated.

According to an embodiment, in the state 417, the camera included in the camera module unit 503 may face the rear side of the electronic device 101. For example, in the 417 state, the camera module unit 503, the rack gear 521, and the slide unit 501 may perform downward movement together. At this time, the rack gear 521 may be fixedly released from the click. The camera module unit 503, the rack gear 521, and the slide unit 501 may move by the first movement distance H1. As the camera module unit 503, the rack gear 521, and the slide unit 501 are moved by the first movement distance H1, the slide unit 501 is moved downward by the second movement distance H2. The distance between the and the first metal part 210m_1 may be further reduced. In the 419 state, the camera module unit 503 may return to its original position (eg, the 401 state).

13A and 13B are diagrams for describing a protrusion 210p of the electronic device 101 according to an exemplary embodiment disclosed in this document. 13A and 13B are enlarged perspective views of portion j of FIG. 4. 13C is a diagram for explaining effects related to FIGS. 13A and 13B. In FIG. 13C, the x-axis represents frequency (unit: MHz), and the y-axis represents S ₁₁ (unit: dB).

13A and 13B, in an embodiment, the protrusion 210p may further include a first portion 210pa. The first portion 210pa may increase the thickness of the protrusion 210p. The thickness of the protrusion 210p may be, for example, a value measured in a direction perpendicular to a direction in which the protrusion 210p protrudes from the first metal part 210m_1.

In the drawing, the first portion 210pa is shown to be disposed on the protrusion 210p, but is not limited thereto. For example, the first portion 210pa may be added to the protrusion 210p to increase the thickness of the protrusion 210p.

Referring to FIG. 13C, as the first portion 210pa is added to the protrusion 210p in an embodiment, a resonance frequency in a predetermined frequency range may be adjusted.

The fifth graph G5 shows that when the protrusion 210p includes the first part 210pa, the first metal part 210m_1, the first connection part 210c_1, the protrusion 210p, and the second metal part 210m_2 It represents signals that can be transmitted/received through electrical paths EP1 and EP2 including ). The sixth graph G6 shows that when the protrusion 210p does not include the first part 210pa, the first metal part 210m_1, the first connection part 210c_1, the protrusion 210p, and the second metal part These represent signals that can be transmitted/received through electrical paths EP1 and EP2 including (210m_2).

Referring to the fifth and sixth graphs G5 and G6, it can be seen that the resonant frequency in a specific frequency range can be adjusted by adjusting the thickness of the protrusion 210p. For example, when the protrusion 210p does not include the first portion 210pa, the resonance frequency of the signal that can be transmitted/received through the electrical paths EP1 and EP2 is f9, whereas the protrusion 210p is the first When the portion 210pa is included, a resonance frequency of a signal that can be transmitted/received through the electrical paths EP1 and EP2 may be f10. For example, by adding the first portion 210pa to the protrusion 210p to adjust the thickness of the protrusion 210p, the resonant frequencies (eg, f9 and f10) in some high frequency range may be adjusted. Some high frequency range may be, for example, a second frequency range (eg, FB2 in FIG. 8).

An electronic device according to an embodiment disclosed in the present document may include a window forming at least a part of at least a front surface of the electronic device, a display panel disposed under the window, and at least a part of a side surface of the electronic device. A support member including a first structure to form and a second structure to form a mounting space for parts, wherein the first structure comprises a first metal portion and the first metal portion at a first point of the first metal portion. 2 includes a protrusion protruding toward the structure, and the second structure includes a second metal portion disposed along at least a portion of the first metal portion while being spaced apart from the first metal portion by a gap A supporting member, a PCB disposed on the second structure, at least one wireless communication circuit, a capacitor connected to the protrusion, and a connection point between the first metal part and the capacitor as the second structure or the ground of the PCB. A switching circuit electrically connected to and a cover for forming a rear surface of the electronic device, wherein the first metal part comprises the second structure or the PCB at a second point different from the first point Electrically connected to the ground, the wireless communication circuit transmits a first signal in a first frequency range and a second signal in a second frequency range by feeding power to the first metal part through a feeding point connected to the capacitor And/or is set to receive.

In an embodiment, the second structure may include a recess formed to correspond to the protrusion, and at least a portion of the protrusion may be disposed within the recess.

In one embodiment, one end of the first metal part is connected to the second metal part through a connection part, and a first electrical path for receiving the first signal is the first metal part, the connection part , The second electrical path including the second metal part and the protrusion, and for receiving the second signal, may include at least a part of the first metal part or at least a part of the second metal part.

In one embodiment, the first structure includes a first side extending in a first direction, a second side extending in a second direction perpendicular to the first direction and shorter than the first side, and parallel to the first side. And a third side surface extending in a manner that is parallel to the second side surface, and a fourth side surface connecting the first side surface and the third side surface, and the first metal part is a part of the first side surface. , The first structure is a part of the third side, and includes a third metal part connected to the wireless communication circuit, and the wireless communication circuit is supplied with power to the third metal part, so that the first frequency range And a third signal in a third frequency range different from the second frequency range.

In an embodiment, the third frequency range may be a band supporting WiFi.

In an embodiment, the switching circuit may electrically connect the connection point to the second structure or the ground of the PCB through a plurality of devices including a first device or a second device.

In an embodiment, when the switching circuit electrically connects the connection point to the second structure or the ground of the PCB through the first element, the electronic device adjusts a first resonance frequency in the first frequency range. When receiving a signal having a signal having a second resonant frequency in the second frequency range and a signal having a second resonant frequency, and the switching circuit electrically connects the connection point to the second structure or the ground of the PCB through the second element, The electronic device may receive a signal having a third resonance frequency in the first frequency range and a signal having a fourth resonance frequency in the second frequency range.

In one embodiment, the first structure includes a first side extending in a first direction, a second side extending in a second direction perpendicular to the first direction and shorter than the first side, and parallel to the first side. And a third side surface extending in a manner that is parallel to the second side surface, and a fourth side surface connecting the first side surface and the third side surface, and the first metal part is a part of the first side surface. The first structure includes a third metal part that is a part of the first side, is spaced apart from the first metal part in the first direction, and is connected to the wireless communication circuit, and the wireless communication circuit, By feeding power to the third metal part, it may be set to receive a signal in a frequency range different from the first frequency range and the second frequency range.

In one embodiment, an insulation portion disposed at one end of the first metal portion, and a slide portion spaced apart from the first metal portion by the insulation portion and sliding with respect to the first metal portion may be further included. I can.

In an embodiment, a camera module unit that rotates with respect to the slide unit may further be included.

In one embodiment, the slide portion is positioned to overlap the display panel in a first state, and in a second state, the distance to the first metal part increases by a first stroke, and in a third state, The distance with the first metal part is increased more than the first stroke by the 2 stroke, and the camera module part faces the cover in the first state and the second state, and switches to the third state. It may be set to rotate toward the display panel by the second stroke.

An electronic device according to an embodiment disclosed in this document includes: a window forming at least a front surface of the electronic device, a display panel disposed under the window, a first structure forming at least a part of a side surface of the electronic device, and a component As a support member including a second structure forming a mounting space of the device, the first structure is a first side extending in a first direction, a second direction perpendicular to the first direction, and shorter than the first side A second side, a third side extending parallel to the first side, a fourth side extending parallel to the second side and connecting the first side and the third side, a first side that is a part of the first side A support member including a metal part, a protrusion protruding in the second direction from a first point of the first metal part, and a second metal part that is a part of the third side surface, a PCB disposed on the second structure, the A wireless communication circuit disposed on a PCB, a capacitor connected to the protrusion, a switching circuit electrically connecting a connection point between the first metal part and the capacitor to the second structure or the ground of the PCB, and the electronic device. Including a cover (cover) forming a rear surface, the first metal part is electrically connected to the second structure or the ground of the PCB at a second point different from the first point, and the wireless communication circuit, It is set to transmit and/or receive a first signal in a first frequency range and a second signal in a second frequency range different from the first frequency range by feeding the first metal part through a feeding point connected to the capacitor, It may be set to transmit and/or receive a signal in a third frequency range different from the first frequency range and the second frequency range by feeding power to the second metal part.

In an embodiment, the second structure includes a third metal portion disposed along at least a portion of the first metal portion while being spaced apart from the first metal portion by a gap, and the first metal The end of the portion is connected to the third metal portion through a connection portion, and a first electrical path for receiving the first signal includes the first metal portion, the connection portion, the third metal portion, and the protrusion. And a second electrical path for receiving the second signal may include at least a portion of the first metal portion or at least a portion of the third metal portion.

In an embodiment, the second structure may include a recess formed to correspond to the protrusion, and at least a portion of the protrusion may be disposed within the recess.

In an embodiment, the recess may be recessed in a direction in which the protrusion protrudes.

In an embodiment, the first structure includes a third metal part that is a part of the first side surface, is spaced apart from the first metal part along the first direction, and is connected to the wireless communication circuit, and the The wireless communication circuit may be set to receive a signal in a third frequency range different from the first frequency range and the second frequency range by feeding power to the third metal part.

In an embodiment, the third frequency range may be a band supporting WiFi.

In one embodiment, an insulation portion disposed at one end of the first metal portion, and a slide portion spaced apart from the first metal portion by the insulation portion and sliding with respect to the first metal portion may be further included. I can.

In an embodiment, a camera module unit that is rotated with respect to the slide unit may be further included.

In one embodiment, the slide portion is positioned to overlap the display panel in a first state, and in a second state, the distance to the first metal part increases by a first stroke, and in a third state, The distance between the first metal part and the first metal part is further increased by the 2 stroke, and the camera module part faces the cover in the first state and the second state, and switches to the third state. It may be set to rotate toward the display panel by the second stroke.

Various embodiments of the present document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the corresponding embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or a plurality of the items unless clearly indicated otherwise in a related context. In this document, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A Each of phrases such as "at least one of, B, or C" may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may be used simply to distinguish a corresponding component from other corresponding Order) is not limited. Some (eg, first) component is referred to as “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that any of the above components can be connected to the other components directly (eg by wire), wirelessly, or via a third component.

The term "module" used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits. The module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more commands stored in a storage medium (eg, internal memory 136 or external memory 138) that can be read by a machine (eg, electronic device 101). It may be implemented as software (for example, the program 140) including them. For example, the processor (eg, the processor 120) of the device (eg, the electronic device 101) may call and execute at least one command among one or more commands stored from a storage medium. This makes it possible for the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here,'non-transient' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves). It does not distinguish between temporary storage cases.

According to an embodiment, a method according to various embodiments disclosed in this document may be provided in a computer program product. Computer program products can be traded between sellers and buyers as commodities. Computer program products are distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store ^™ ) or two user devices ( It can be distributed (e.g., downloaded or uploaded) directly between, e.g. smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium that can be read by a device such as a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be sequentially, parallel, repeatedly, or heuristically executed, or one or more of the operations may be executed in a different order or omitted. , Or one or more other actions may be added.

220: Windows
230: display panel
210: support member
240: PCB

Claims (20)

In the electronic device,
A window forming at least a part of at least a front surface of the electronic device;
A display panel disposed under the window;
A support member including a first structure forming at least a part of a side surface of the electronic device and a second structure forming a mounting space for components,
The first structure includes a first metal portion and a protrusion protruding toward the second structure at a first point of the first metal portion, and the second structure includes a predetermined distance from the first metal portion A support member including a second metal portion spaced apart by a gap and disposed along at least a portion of the first metal portion;
A PCB disposed on the second structure;
At least one wireless communication circuit;
A capacitor connected to the protrusion;
A switching circuit electrically connecting a connection point between the first metal part and the capacitor to the second structure or the ground of the PCB; And
Including a cover (cover) forming the rear surface of the electronic device,
The first metal part is electrically connected to the second structure or the ground of the PCB at a second point different from the first point,
The wireless communication circuit is configured to transmit and/or receive a first signal in a first frequency range and a second signal in a second frequency range by feeding the first metal part through a feeding point connected to the capacitor. , Electronic device. The method according to claim 1,
The second structure includes a recess formed to correspond to the protrusion,
At least a portion of the protrusion is disposed within the recess. The method according to claim 1,
One end of the first metal part is connected through the second metal part and a connection part,
A first electrical path for receiving the first signal includes the first metal part, the connection part, the second metal part, and the protrusion,
The electronic device, wherein the second electrical path for receiving the second signal includes at least a portion of the first metal portion or at least a portion of the second metal portion. The method according to claim 1,
The first structure may include a first side extending in a first direction, a second side extending in a second direction perpendicular to the first direction and shorter than the first side, and a third side extending parallel to the first side. A side surface, and a fourth side surface extending parallel to the second side surface and connecting the first side surface and the third side surface,
The first metal part is a part of the first side surface,
The first structure is part of the third side and includes a third metal portion connected to the wireless communication circuit,
The wireless communication circuit is set to receive a third signal in a third frequency range different from the first frequency range and the second frequency range by feeding power to the third metal part. The method of claim 4,
The third frequency range is a band supporting WiFi. The method according to claim 1,
The switching circuit electrically connects the connection point to the second structure or the ground of the PCB through a plurality of elements including a first element or a second element. The method of claim 6,
When the switching circuit electrically connects the connection point to the second structure or the ground of the PCB through the first element, the electronic device comprises a signal having a first resonant frequency in the first frequency range and the first 2 receives a signal having a second resonant frequency in the frequency range,
When the switching circuit electrically connects the connection point to the second structure or the ground of the PCB through the second element, the electronic device may generate a signal having a third resonant frequency in the first frequency range and the second An electronic device for receiving a signal having a fourth resonant frequency among two frequency ranges. The method according to claim 1,
The first structure may include a first side extending in a first direction, a second side extending in a second direction perpendicular to the first direction and shorter than the first side, and a third side extending parallel to the first side. A side surface, and a fourth side surface extending parallel to the second side surface and connecting the first side surface and the third side surface,
The first metal part is a part of the first side surface,
The first structure includes a third metal part that is a part of the first side surface, is spaced apart from the first metal part in the first direction, and is connected to the wireless communication circuit,
The electronic device, wherein the wireless communication circuit is set to receive a signal in a frequency range different from the first frequency range and the second frequency range by feeding power to the third metal part. The method according to claim 1,
An insulation portion disposed at one end of the first metal portion; And
The electronic device further comprises a slide part spaced apart from the first metal part by the insulating part and slid with respect to the first metal part. The method of claim 9,
The electronic device further comprises a camera module unit rotated with respect to the slide unit. The method of claim 10,
The slide part,
In the first state, it is overlapped and positioned on the display panel,
In the second state, the distance to the first metal part increases by the first stroke,
In the third state, the distance with the first metal part is increased more than the first stroke by the second stroke,
The camera module unit,
In the first state and the second state, facing the cover,
The electronic device configured to rotate toward the display panel by the second stroke when switching to the third state. In the electronic device,
A window forming at least a front surface of the electronic device;
A display panel disposed under the window;
A support member comprising a first structure forming at least a part of a side surface of the electronic device and a second structure forming a mounting space for components,
The first structure may include a first side extending in a first direction, a second side extending in a second direction perpendicular to the first direction and shorter than the first side, and a third side extending parallel to the first side , A fourth side extending parallel to the second side and connecting the first side and the third side, a first metal part that is a part of the first side, and the second at a first point of the first metal part A support member including a protrusion protruding in a direction and a second metal portion that is a part of the third side surface;
A PCB disposed on the second structure;
A wireless communication circuit disposed on the PCB;
A capacitor connected to the protrusion;
A switching circuit electrically connecting a connection point between the first metal part and the capacitor to the second structure or the ground of the PCB; And
Including a cover (cover) forming the rear surface of the electronic device,
The first metal part is electrically connected to the second structure or the ground of the PCB at a second point different from the first point,
The wireless communication circuit transmits a first signal in a first frequency range and a second signal in a second frequency range different from the first frequency range by feeding power to the first metal portion through a feeding point connected to the capacitor and/ Or set to receive, and set to transmit and/or receive a signal in a third frequency range different from the first frequency range and the second frequency range by feeding power to the second metal part. The method of claim 12,
The second structure includes a third metal portion disposed along at least a portion of the first metal portion while being spaced apart from the first metal portion by a gap, and an end of the first metal portion, It is connected through the third metal part and the connection part,
The first electrical path for receiving the first signal includes the first metal part, the connection part, the third metal part, and the protrusion,
The electronic device, wherein the second electrical path for receiving the second signal includes at least a portion of the first metal portion or at least a portion of the third metal portion. The method of claim 12,
The second structure includes a recess formed to correspond to the protrusion,
At least a portion of the protrusion is disposed within the recess. The method of claim 14,
The recess is depressed in a direction in which the protrusion protrudes. The method of claim 12,
The first structure includes a third metal part that is a part of the first side surface, is spaced apart from the first metal part along the first direction, and is connected to the wireless communication circuit,
The electronic device, wherein the wireless communication circuit is set to receive a signal in a third frequency range different from the first frequency range and the second frequency range by feeding power to the third metal part. The method of claim 12,
The third frequency range is a band supporting WiFi. The method of claim 12,
An insulation portion disposed at one end of the first metal portion; And
The electronic device further comprises a slide part spaced apart from the first metal part by the insulating part and slid with respect to the first metal part. The method of claim 18,
The electronic device further comprises a camera module unit rotated with respect to the slide unit. The method of claim 19,
The slide part,
In the first state, it is overlapped and positioned on the display panel,
In the second state, the distance to the first metal part increases by the first stroke,
In the third state, the distance to the first metal part is increased more than the first stroke by the second stroke,
The camera module unit,
In the first state and the second state, facing the cover,
The electronic device configured to rotate toward the display panel by the second stroke when switching to the third state.

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