KR20200117651A - Apparatus for Micro Electrode Array for Neural Signals Measurement and Optical Stimulus - Google Patents

Abstract

Disclosed are a device for micro electrode array for neural signal measurement and photic simulation. According to an embodiment of the present invention, the device for micro electrode array may comprise: a substrate; a light emitting diode disposed on part of the substrate and emitting light; a first wiring connected to the light emitting diode; a first insulating layer applied on the substrate and applied on the light emitting diode and the first wiring on the substrate; an electrode disposed on part of the first insulating layer to transmit and receive neural signals; a second wiring connected to the electrode; and a second insulating layer applied on the first insulating layer excluding a partial region of the electrode.

Description

[Apparatus for Micro Electrode Array for Neural Signals Measurement and Optical Stimulus}

The present invention relates to an apparatus for arranging microelectrodes for transmitting photostimulation to an object, activating nerves of the object, or acquiring nerve signals from the object.

The content described in this section merely provides background information on the embodiments of the present invention and does not constitute the prior art.

A microelectrode array (MEA) is a device including multiple microelectrodes that obtain or transmit neural signals, and serves as a neural interface device connecting neurons and electronic circuits.

Since the general commercialized microelectrode array device is manufactured on a hard glass or sapphire substrate based on a metal electrode or ITO that is inferior in transparency and flexibility, there are limitations in various flexible applications such as in-vivo experiments.

Until now, in order to conduct an experiment through light, a separate light emitting device from the microelectrode array device had to be provided. This situation has been limited to studies that measure only the signals of neurons, and it has been difficult for research on optogenetics technology to proceed.

Accordingly, in the present invention, by integrating a light emitting diode into a transparent and flexible graphene-based microelectrode array device, it is intended to overcome the problems and mechanical limitations of the existing microelectrode array device.

The present invention integrates micro light-emitting diodes into a transparent and flexible graphene-based microelectrode array device to deliver photostimulation to an object, activate nerves of the object, or acquire nerve signals from the object, The main purpose is to provide an electrode arrangement.

According to an aspect of the present invention, an apparatus for arranging fine electrodes for achieving the above object includes: a substrate; A light emitting diode disposed on a portion of the substrate to emit light; A first wiring connected to the light emitting diode; A first insulating layer applied on the substrate and applied on the light emitting diode and the first wiring on the substrate; An electrode disposed on a portion of the first insulating layer to transmit and receive neural signals; A second wiring connected to the electrode; And a second insulating layer applied on the first insulating layer excluding a partial region of the electrode.

In addition, according to another aspect of the present invention, a fine electrode array device for achieving the above object, a substrate; Ultraviolet Ray (UV) light emitting diodes disposed on a portion of the substrate to emit ultraviolet rays; A first insulating layer applied on the substrate and applied on the ultraviolet light emitting diode on the substrate; A color filter that filters the ultraviolet light to extract at least one color of red, green, and blue, and is disposed on the first insulating layer at regular intervals; An electrode disposed on the color filter to transmit and receive neural signals; A second wiring connected to the electrode; And a second insulating layer applied on the first insulating layer excluding a partial region of the electrode.

As described above, the present invention has the effect of freely irradiating light by integrating the micro LED under the graphene electrode.

In addition, the present invention has an effect that can be integrated on a flexible substrate by applying a graphene electrode and a micro LED.

In addition, according to the present invention, since three LEDs of red, green, and blue can be integrated, light of various wavelengths is irradiated, and the reaction of neurons accordingly can be measured in-situ with a graphene electrode.

1 is a side cross-sectional view of a microelectrode arrangement device according to a first embodiment of the present invention.
2 is a view for explaining a process of manufacturing the microelectrode array device according to the first embodiment of the present invention.
3A and 3B are exemplary views showing a shape of the microelectrode arrangement device according to the first embodiment of the present invention.
4 is a view showing a top view of a fine electrode array device according to a second embodiment of the present invention.
5 is a side cross-sectional view of a microelectrode arrangement device according to a second embodiment of the present invention.
6A and 6B are side cross-sectional views of a microelectrode array device according to a third embodiment of the present invention.
7 is a side cross-sectional view of an apparatus for arranging microelectrodes according to a fourth embodiment of the present invention.
8 is a side cross-sectional view of a microelectrode arrangement device according to a fifth embodiment of the present invention.
9 is a side cross-sectional view of an apparatus for arranging microelectrodes according to a sixth embodiment of the present invention.
10 is a side cross-sectional view of a micro-electrode arrangement device according to a seventh embodiment of the present invention.
11 is a view for explaining a process of manufacturing a light emitting diode bonded to the microelectrode array device according to the second embodiment of the present invention.
12 is a view for explaining a process of manufacturing a light emitting diode bonded to the microelectrode array device according to the third embodiment of the present invention.
13 is an exemplary view showing a shape of implementing the microelectrode arrangement device according to the first embodiment according to the embodiment of the present invention.
14A and 14B are exemplary views showing a light emitting diode and an array bonded to the microelectrode array device according to the second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, when it is determined that a detailed description of a related known configuration or function may obscure the subject matter of the present invention, a detailed description thereof will be omitted. In addition, a preferred embodiment of the present invention will be described below, but the technical idea of the present invention is not limited thereto or is not limited thereto, and may be modified and variously implemented by a person skilled in the art. Hereinafter, with reference to the drawings, a detailed description will be given of the microelectrode arrangement device for measuring neural signals proposed in the present invention.

1 is a side cross-sectional view of a microelectrode arrangement device according to a first embodiment of the present invention.

The microelectrode array device 100 according to the first embodiment of the present invention includes a substrate 110, an electrode 120, a wiring 130, and an insulating layer 140. The microelectrode arrangement apparatus 100 of FIG. 1 is according to an embodiment, and not all blocks shown in FIG. 1 are essential components, and some blocks included in the microelectrode arrangement apparatus 100 are added in other embodiments. , May be changed or deleted.

The microelectrode arrangement device 100 transmits and receives nerve signals by contacting the tissue of the object by only a part of the electrode 120 made of graphene material, and the remaining areas are in the insulating layer 140 made of SU-8 material. Insulated by

The substrate 110 may be basically made of glass or sapphire, but a material such as plastic or rubber is used to fabricate the microelectrode array device 100 having a flexible property. Can be made. That is, it may be implemented with a transparent and flexible material so that it can be attached to an object having a curved surface.

Further, the substrate 110 may be manufactured using a transparent material to transmit light transmitted from a separate light emitting device (not shown).

The electrode 120 is disposed on a part of the substrate 110 and performs an operation of transmitting a neural signal to an object in contact with the microelectrode arrangement device 100 or receiving a neural signal (response signal) from the object.

The electrode 120 is manufactured in a shape having a predetermined width 122 and a thickness 124. For example, the electrode 120 may have a thickness of less than 1.5 nm, and may be implemented in a shape having a width between 60 um and 110 um on the upper surface of the substrate 110. Here, the electrode 120 is preferably formed to be less than the maximum thickness that can transmit and receive nerve signals, the width of the electrode 120 is formed larger than the width of the electrode hole formed on the electrode 120 to transmit and receive nerve signals. It is desirable to be.

The electrode 120 may be made of a flexible, transparent, and conductive material. Here, the electrode 120 is preferably formed of a graphene material, but may be implemented with a variety of flexible, transparent, and conductive materials. Here, the electrode 120 may be formed by stacking a plurality of graphene layers, and may be formed of, for example, a graphene layer stacked in four layers.

The electrode 120 may transmit a nerve signal to the object or obtain a nerve signal generated from the object through an electrode hole formed by the coated insulating layer 140 excluding a partial area of the electrode 120. Here, the width 152 of the electrode hole may be implemented in a size between 50 um and 100 um.

Meanwhile, the electrode 120 transmits light emitted from a separate light emitting device (not shown) to be incident on the object, and measures a response signal of the object to the light.

The wiring 130 is formed to be in contact with a partial region of the electrode 120 and transmits an electrical signal for controlling the operation of the electrode 120. The wiring 130 is preferably made of gold (Au), but is not limited thereto, and may be made of various conductive materials.

The wiring 130 is formed on the substrate 110, and the thickness 132 of the wiring 130 is preferably formed to be thicker than the thickness 124 of the electrode 120. For example, the thickness 132 of the wiring 130 is preferably formed to a thickness between 30 nm and 50 nm.

The insulating layer 140 is formed by coating an insulating material on the substrate 110 except for a partial region of the electrode 120. Specifically, the insulating layer 140 is formed on the substrate 110, the electrode 120 formed on the substrate 110, the wiring 130, etc., excluding a partial region of the electrode 120 to form an electrode hole do.

The thickness 142 of the insulating layer 140 is preferably formed to a thickness between 2 um and 5 um, and the width 152 of the electrode hole formed through the insulating layer 140 is between 50 um and 100 um. Can be formed.

The insulating layer 140 is preferably implemented as an SU-8 coating layer, but is not limited thereto.

2 is a view for explaining a process of manufacturing the microelectrode array device according to the first embodiment of the present invention.

The microelectrode array device 100 according to the first embodiment of the present invention may be manufactured through the following process.

In (a) of FIG. 2, single-layer graphene was deposited on a copper thin film having a thickness of 20 um to 30 um using a chemical vapor deposition (CVD) method.

In (b) of FIG. 2, PMMA is coated on single-layer graphene in the manner of a support layer, and the lower copper thin film is etched by an aqueous ammonium sulfate solution.

Thereafter, in (c) of FIG. 2, the PMMA-coated graphene is transferred onto another graphene on a copper thin film, and this etching and stacking process is repeated until a preset number of graphene layers is formed.

In Fig. 2(d), the gold track material is patterned through a lift-off process. Prior to depositing the gold track material, it is patterned according to the pattern of the gold track to form a negative photoresist. Specifically, the gold track material is deposited on the patterned negative photoresist by a thermal evaporation method, and the photoresist under the gold track material is dissolved by a photoresist solution such as acetone to remove the gold track material.

In (e) of Figure 2, the multilayer graphene film is transferred onto the glass or plastic substrate using a wet transfer method, dried for a certain period of time, and then the transferred multilayer graphene film is patterned using photolithography. , Etched using a reactive ion etching system (RIE).

In (f) of FIG. 2, the transparent SU-8 photoresist is patterned on a micro electrode array (MEA) to insulate the track metal and open only the graphene electrode in contact with the object.

In FIG. 2, it is described that the process (step) of manufacturing the microelectrode array device is sequentially performed, but is not limited thereto. In other words, since it may be applicable by changing and executing the processes (steps) illustrated in FIG. 3 or executing one or more processes (steps) in parallel, FIG. 3 is not limited to a time series order.

3A and 3B are exemplary views showing a shape of the microelectrode arrangement device according to the first embodiment of the present invention.

3A (a) shows the overall structure 10 of the microelectrode array device 100 composed of the graphene electrode 120 and the wiring 130.

3A(b) shows an enlarged structure of the microelectrode array device 100. here,

A distance between one electrode 120 exposed through the electrode hole 150 and an adjacent electrode must maintain a preset minimum space. That is, the electrodes 120 adjacent to each other are arranged in a shape having a predetermined minimum space with each other. Here, the minimum space between the electrodes 120 is preferably formed in a size between 150 um to 250 um.

As shown in (c) of FIG. 3A, one electrode 120 exposed through the electrode hole 150 may be implemented in the form of a circle having a diameter between 60 um and 110 um.

Figure 3b (a) shows the overall structure 10 of the microelectrode arrangement system of the microelectrode arrangement device 100, and Figure 3b (b) shows an electrode 120 made of graphene and a track made of gold It shows an enlarged structure of the microelectrode array device 100 designed with the implemented wiring 130.

4 is a view showing a top view of a fine electrode array device according to a second embodiment of the present invention.

The microelectrode arrangement device 400 according to the second embodiment refers to a device in which the light emitting diode 410 and the electrode 420 are integrated. In other words, the microelectrode array device 400 has a structure in which an electrode 420 made of a graphene material is integrated on a light emitting surface of the light emitting diode 410.

The fine electrode array device 400 may be integrated by aligning the light emitting diode 410 under the electrode 420 exposed by the hole, and according to the embodiment, the light emitting diode 410 is aligned with the hole of the electrode 420 It may be formed in an unstructured arrangement. Hereinafter, the second to seventh embodiments according to the microelectrode array device 400 will be described with reference to FIGS. 5 to 10. Some configurations of the second to seventh embodiments may be redundant, and descriptions of overlapping descriptions may be omitted.

5 is a side cross-sectional view of a microelectrode arrangement device according to a second embodiment of the present invention.

The microelectrode array device 400 according to the second embodiment of the present invention includes a substrate 510, a light emitting diode 520, a first wiring 530, a first insulating layer 540, an electrode 550, and a second A wiring 560 and a second insulating layer 570 are included. The microelectrode arrangement device 400 of FIG. 5 is according to an embodiment, and not all blocks shown in FIG. 5 are essential components, and some blocks included in the microelectrode arrangement device 400 are added in other embodiments. , May be changed or deleted.

The microelectrode array device 400 transmits and receives neural signals by contacting the object by only a partial area of the electrode 550 made of graphene material, and the remaining area is in the second insulating layer 570 made of SU-8 material. Insulated by The microelectrode array device 400 may transmit and receive neural signals generated by using light emitted through the light emitting diode 520.

Since the fine electrode array device 400 has a transparent graphene electrode, the light emitted from the light emitting diode integrated underneath is transmitted, and the light is incident on an object (eg, a cell) located above the fine electrode array device 400 to induce stimulation. can do. In addition, since the microelectrode array device 400 uses a flexible plastic or rubber substrate in addition to glass and sapphire substrates, the microelectrode array device 400 itself can be bent, so that the microelectrode array device 400 can be attached to a curved structure such as a brain to directly control the characteristics of the object. Can be measured.

The substrate 510 may be basically implemented with glass or sapphire, but in order to manufacture the microelectrode array device 400 having a flexible property, a material such as plastic or rubber is used. Can be made. That is, it may be implemented with a transparent and flexible material so that it can be attached to an object having a curved surface.

In addition, the substrate 510 may be manufactured using a transparent material in order to transmit light transmitted from a separate light emitting device (not shown).

The light emitting diode 520 is disposed on a part of the substrate 510 to perform an operation of emitting light. The light emitting diode 520 is preferably an LED (Light Emitting Diode) less than a predetermined size to be disposed on the microelectrode array device 400.

It is preferable that the light emitting diodes 520 according to the second embodiment are disposed on the substrate 510 in the same number as the number of electrodes 550. Also, the light emitting diode 520 may be implemented as a micro light emitting diode (μLED) that outputs a single white color.

The light emitting diodes 520 may be aligned on the same vertical line as the electrode 550. In addition, the electrode hole 580 formed by the second insulating layer 570 applied excluding a partial area of the electrode 550 is located in the center of the light emitting diode 520 when looking at the upper side of the light emitting diode 520. It is desirable to be located.

The first wiring 530 is connected to the light emitting diode 520 and transmits an electric signal for controlling the operation of the light emitting diode 520. Here, the first wiring 530 may have a PN junction structure, but may be implemented in various forms as long as the operation of the light emitting diode 520 can be controlled.

The first insulating layer 540 is formed by coating an insulating material on the substrate 510. Specifically, the first insulating layer 540 is formed on the substrate 510, the light emitting diode 520 provided on the substrate 510, the first wiring 530, and the like.

The thickness 542 of the first insulating layer 540 may be formed to a thickness between 4 um to 6 um, and the first insulating layer 540 is preferably implemented as an SU-8 coating layer, but is limited thereto. no. When the thickness 542 of the first insulating layer 540 exceeds 6 um, it becomes difficult to transmit the light emitted from the light emitting diode 520 to the electrode 550, and the thickness 542 of the first insulating layer 540 When) is less than 4 μm, it is difficult to maintain the stacked structure of the light emitting diode 520 and the first wiring 530.

The electrode 550 is disposed on a part of the substrate 510 and performs an operation of transmitting a neural signal to an object in contact with the microelectrode arrangement device 400 or receiving a neural signal (response signal) from the object.

The electrode 550 is manufactured in a shape having a predetermined width 552 and a thickness 554. For example, the electrode 550 may have a thickness of less than 1.5 nm, and may be implemented in a shape having a width between 60 um and 110 um on the upper side of the electrode 550. Here, the electrode 550 is preferably formed to be less than the maximum thickness capable of transmitting and receiving nerve signals, and the width of the electrode 550 is of the electrode hole 580 formed on the electrode 550 to transmit and receive nerve signals. It is preferable to be formed larger than the width.

The electrode 550 may be made of a flexible, transparent, and conductive material. Here, the electrode 550 is preferably formed of a graphene material, but may be implemented with a variety of flexible, transparent, and conductive materials. The electrode 550 may be formed by stacking a plurality of graphene layers, and may be formed of, for example, a graphene layer stacked in four layers.

The electrode 550 contacts the object through the electrode hole 580 formed by the second insulating layer 570 applied excluding a partial area of the electrode 550, and a nerve signal to the object through the electrode hole 580 May be transmitted or a neural signal generated from an object may be obtained. Here, the width 582 of the electrode hole 580 may be implemented with a size between 50 um and 100 um.

The second wiring 560 is formed to be in contact with a partial region of the electrode 550 and transmits an electric signal for controlling the operation of the electrode 550. The second wiring 560 is preferably made of gold (Au), but is not limited thereto, and may be made of various conductive materials.

The second wiring 560 is formed on the first insulating layer 540, and the thickness 562 of the second wiring 560 is preferably formed to be thicker than the thickness 554 of the electrode 550. For example, the thickness 562 of the second wiring 560 is preferably formed to be between 30 nm and 50 nm.

The second insulating layer 570 is formed by coating an insulating material on the first insulating layer 540 except for a partial area of the electrode 550. Specifically, the second insulating layer 570 is formed on the first insulating layer 540, the electrode 550 formed on the first insulating layer 540, the second wiring 560, and the like, and the electrode 550 The electrode hole 580 is formed by being applied by excluding some areas of.

The thickness 572 of the second insulating layer 570 is preferably formed to be between 2 um and 5 um, and the width 582 of the electrode hole 580 formed through the second insulating layer 570 is 50 It may be formed in a size between um and 100 um. The second insulating layer 570 is preferably implemented as an SU-8 coating layer, but is not limited thereto. Here, when the thickness 542 of the second insulating layer 570 is less than 2 um, it is difficult to serve as an insulating layer.

6A and 6B are side cross-sectional views of a microelectrode array device according to a third embodiment of the present invention.

The microelectrode array device 400 according to the third exemplary embodiment has a structure obtained by modifying the light emitting diode portion of the microelectrode array apparatus 400 according to the second exemplary embodiment. Accordingly, a description of the technical content overlapping with the second embodiment will be omitted.

Referring to FIG. 6A, the light emitting diodes 610, 612, and 614 of the microelectrode array device 400 are disposed on a portion of the substrate 510 to emit light. It is preferable that the light emitting diodes 610, 612, and 614 are LEDs (Light Emitting Diodes) having a size smaller than a preset size to be disposed in the microelectrode array device 400.

It is preferable that the light emitting diodes 610, 612, and 614 according to the third embodiment are disposed on the substrate 510 in the same number as the number of electrodes 550. Further, the light emitting diodes 610, 612, and 614 may be implemented as μLEDs that output one color of red, green, and blue. For example, the first light emitting diode 610 may be implemented as a μLED that outputs red, the second light emitting diode 612 may be implemented as a μLED that outputs green, and the third light emitting diode 614 may be implemented as a μLED that outputs blue. . Here, the μLED can implement three primary colors using a color filter or quantum dot on a blue LED or a white LED.

The light emitting diodes 610, 612, and 614 may be aligned on the same vertical line as each of the plurality of electrodes 550. In addition, each of the electrode holes 580 formed by the second insulating layer 570 applied excluding a partial region of the electrode 550 is a light emitting diode when looking at the upper side of each of the light emitting diodes 610, 612, and 614. (610, 612, 614) is preferably located in the middle of each.

Referring to FIG. 6B, the microelectrode arrangement device 400 may be formed to match the light emitting diodes 610, 612, and 614 with one electrode 550. For example, the microelectrode array device 400 may integrate three color μLEDs aligned with one electrode 550 on the substrate 510. Here, the three-color μLED means a light-emitting diode capable of outputting red, green, and blue.

7 is a side cross-sectional view of an apparatus for arranging microelectrodes according to a fourth embodiment of the present invention.

The microelectrode arrangement device 400 according to the fourth embodiment has a structure in which a diffuser layer 700 is inserted into the microelectrode arrangement apparatus 400 according to the third embodiment. Accordingly, description of the technical content overlapping with the third embodiment will be omitted.

The microelectrode arrangement device 400 according to the fourth exemplary embodiment further includes a diffuser layer 700 formed by coating a diffusion material on the first insulating layer 540. Accordingly, the electrode 550 of the microelectrode arrangement device 400 is disposed on the diffuser layer 700.

The diffuser layer 700 according to the fourth exemplary embodiment diffuses light emitted through the light emitting diodes 610, 612, and 614, and uniformly transmits the diffused light to the object through the electrode 550.

8 is a side cross-sectional view of a microelectrode arrangement device according to a fifth embodiment of the present invention.

The microelectrode arrangement device 400 according to the fifth embodiment has a structure in which a coating material 810 and a film 820 are added to the microelectrode arrangement apparatus 400 of the third embodiment. Accordingly, description of the technical content overlapping with the third embodiment will be omitted.

The microelectrode arrangement device 400 according to the fifth embodiment includes a coating material 810 and a film 820 formed on the second insulating layer 570.

The coating material 810 includes a protein that reacts to light, and is applied to a portion of the second insulating layer 570. The film 820 refers to a film surrounding the coating material 810 in order to maintain the shape of the coating material 810 positioned on the second insulating layer 570. Here, the film 820 is preferably made of a material that is soluble in a liquid (eg, water) so that the coating material 810 is released when contacting the object.

Applying the microelectrode array device 400 according to the fifth embodiment to optogenetics, that is, using Optin or Rhodopsin protein, a type of retinal protein, to make nerve cells react to light. Light-gated proton channel should be formed.

Accordingly, a lentivirus (Lentivirus, 810), including a protein that responds to light, is infected with a target tissue or organism to make it sensitive to light.

The microelectrode arrangement device 400 according to the fifth embodiment has a structure in which the powder of the lentivirus 810 including a protein that reacts to light is covered with a film 820 that is soluble in a liquid (eg, water). As the film 820 melts by the culture medium or biofluids present when culturing cells on the microelectrode array device 400 or conducting an experiment in-vivo It will automatically release the lentivirus 810 (releasing). Here, the protein that responds to light may be implemented as various types of proteins that respond to various wavelengths.

9 is a side cross-sectional view of an apparatus for arranging microelectrodes according to a sixth embodiment of the present invention.

The microelectrode arrangement device 400 according to the sixth embodiment has a structure in which a graphene layer 910 is added to the microelectrode arrangement apparatus 400 according to the third embodiment. Accordingly, description of the technical content overlapping with the third embodiment will be omitted.

The microelectrode arrangement device 400 according to the fifth embodiment includes a graphene layer 910. The graphene layer 910 is disposed on the second insulating layer 570. The graphene layer 910 may be formed to promote cell growth of an object and to enhance a response signal of the object.

The microelectrode arrangement device 400 according to the fifth embodiment allows cell differentiation and cell regeneration to be promoted on the graphene layer 910. The graphene layer 910 can be applied when conducting an in-vitro experiment by culturing cells through a characteristic capable of interfacing with a special tissue.

In the structure of the microelectrode array device 400 according to the fifth embodiment, the graphene electrode 520 is connected by a second wiring 560, that is, an interconnect electrode, and serves to read electrical signals from adjacent cell tissues. And, the graphene layer 910 serves to promote the growth of cultured cells. In vitro experiments using conventional microelectrode array devices should be measured after growing the cells for about a week after culturing them. In addition, it had to be added daily to prevent the medium from drying out.

In the microelectrode arrangement device 400 according to the fifth exemplary embodiment, by using the graphene layer 910 to promote cell growth, it is possible to measure the object faster.

Since the graphene layer 910 is not electrically connected to the graphene electrode 520, it does not directly affect the signal of the cell to be measured. In addition, since an electrophysiologic signal can be enhanced through the graphene layer 910, a high SNR to a nerve signal and a clear response of the object can be observed.

10 is a side cross-sectional view of a micro-electrode arrangement device according to a seventh embodiment of the present invention.

The fine electrode array device 400 according to the seventh exemplary embodiment has a structure in which the light emitting diode is modified in the fine electrode array device 400 according to the third exemplary embodiment. Accordingly, description of the technical content overlapping with the third embodiment will be omitted.

The microelectrode array device 400 according to the seventh embodiment does not use a μLED, but includes an ultraviolet light emitting diode 1010 and color filters 1020, 1022, and 1024.

The ultraviolet light emitting diode 1010 is disposed on a portion of the substrate 510 to emit ultraviolet rays (UV).

The color filters 1020, 1022, and 1024 filter ultraviolet rays emitted from the ultraviolet light emitting diode 1010 to extract at least one color of red, green, and blue, and transmit the wavelength of the extracted color to the electrode 550. . Here, the electrode 550 has a structure disposed on the color filters 1020, 1022, and 1024.

The number of color filters 1020, 1022, and 1024 is greater than the number of ultraviolet light emitting diodes 1010, and is preferably formed equal to the number of electrodes 550.

11 is a view for explaining a process of manufacturing a light emitting diode bonded to the microelectrode array device according to the second embodiment of the present invention.

The light emitting diode bonded to the microelectrode array device 400 according to the second embodiment of the present invention may be manufactured through the following process.

In (a) of FIG. 11, the III-V LED wafer deposited by the MOCVD method was patterned by the photolithography method, and the n-layer was exposed by the ICP-RIE dry etching method.

In (b) of FIG. 11, the p-layer and the n-layer are bonded to the metal through ohmic contacts.

In Fig. 11(c), the SiN passivation layer is deposited through the PECVD method.

In (d) of FIG. 11, each of the III-V LED chips is applied based on the side dimensions defined by ICP-RIE.

In Fig. 11(e), the III-V LEDs in the array layout are emitted from the mother substrate through a laser lift off (LLO) method or a wet etching method.

In (f) of FIG. 11, the emitted LED is transferred and printed on various substrates (eg, glass and PET) using a rubber material such as PDMS.

In (g) of FIG. 11, a transparent epoxy intermediate layer is spin-coated to overcome the LED thickness and deposit a lower interconnect metal.

In Fig. 11(h), a second transparent epoxy insulating layer is coated and an upper interconnect metal is deposited.

In FIG. 11, it is described that the process (step) of manufacturing the microelectrode array device is sequentially performed, but is not limited thereto. In other words, since it may be applicable to changing and executing the processes (steps) illustrated in FIG. 11 or executing one or more processes (steps) in parallel, FIG. 11 is not limited to a time series order.

12 is a view for explaining a process of manufacturing a light emitting diode bonded to the microelectrode array device according to the third embodiment of the present invention.

In Fig. 12A, a blue LED is bonded to a sapphire substrate. Here, the substrate is preferably sapphire, but is not limited thereto, and may be a transparent substrate made of at least one of glass, plastic, and rubber.

In FIG. 12B, a red LED wafer including a sacrificial layer is integrally integrated on a blue LED wafer through an insulating layer adhesive bonding method. Here, the insulating layer may be an SU-8 coating layer.

In (c) of FIG. 12, the base substrate is removed from the red LED wafer by etching the sacrificial layer.

In (d) of FIG. 12, ohmic contacts are formed by depositing a metal pad on the red LED.

In Fig. 12E, a green LED wafer including a sacrificial layer is integrally integrated on a blue LED wafer through an insulating layer adhesive bonding method. Here, the insulating layer may be an SU-8 coating layer. Thereafter, the sacrificial layer is etched to remove the base substrate from the green LED wafer. Then, a metal pad is deposited on the green LED to form ohmic contacts.

In (f) of FIG. 12, a monolithic three-color LED formed through adhesive bonding is shown.

13 is an exemplary view showing a shape of implementing the microelectrode arrangement device according to the first embodiment according to the embodiment of the present invention.

13A and 13B show optical images of the graphene microelectrode array device 400. The graphene microelectrode array device 400 may be a cell culture medium with a cylindrical glass attached to the center.

13(c) shows an enlarged OM image of the graphene microelectrode array device 400. The yellow line is the gold track metal (wiring), and the circular hole represents the graphene electrode with about 60 partial areas exposed.

13D and 13E show OM images of the graphene electrode and the gold wire, the transparent graphene electrode is not visible to the naked eye, and the electrode hole is an opening by the SU-8 pattern.

14A and 14B are exemplary views showing a light emitting diode and an array bonded to the microelectrode array device according to the second embodiment of the present invention.

14a shows images and sizes of μLED and mini LED applied to the microelectrode array device 400 according to the second embodiment.

14b(a) shows the OM image of the μLED array transferred from the Si mother substrate to the ultra-thin PET. 14b(b) shows an optical image of a flexible passive matrix 16 X 16 μLED display fabricated on a 6 μm thick PET. 14b(c) shows an enlarged optical image of a μLED display including 256 μLEDs and Au electrode interconnections. (D) of 14b is an optical image showing a single LED operation when a forward bias voltage is applied. 14b(e) shows an optical image of an interconnected μLED array operated under forward bias. (F) of 14b shows the I-V curve of the μLED transferred to the PET substrate.

The above description is merely illustrative of the technical idea of the embodiments of the present invention, and those of ordinary skill in the technical field to which the embodiments of the present invention belong to, various modifications and modifications without departing from the essential characteristics of the embodiments of the present invention Transformation will be possible. Accordingly, the embodiments of the present invention are not intended to limit the technical idea of the embodiments of the present invention, but to explain, and the scope of the technical idea of the embodiments of the present invention is not limited by these embodiments. The scope of protection of the embodiments of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the rights of the embodiments of the present invention.

100, 400: fine electrode array device
110, 510: substrate 120, 550: electrode
130: wiring 140: insulating layer
520: light emitting diode 530: first wiring
540: first insulating layer 560: second wiring
570: second insulating layer

Claims (14)

Board;
A light emitting diode disposed on a portion of the substrate to emit light;
A first wiring connected to the light emitting diode;
A first insulating layer applied on the substrate and applied on the light emitting diode and the first wiring on the substrate;
An electrode disposed on a portion of the first insulating layer to transmit and receive neural signals;
A second wiring connected to the electrode; And
A second insulating layer applied on the first insulating layer excluding a partial region of the electrode
Micro electrode array device comprising a. The method of claim 1,
The substrate,
It is manufactured using at least one material of plastic and rubber,
The microelectrode arrangement device, characterized in that it is formed to be transparent and flexible so that the light can be transmitted and attached to an object having a curved surface. The method of claim 1,
The light emitting diode,
Micro Light Emitting Diodes (μLEDs) that output a single white color or μLEDs that output one color of red, green, and blue. Electrode arrangement device. The method of claim 3,
Each of the light emitting diodes,
Microelectrode array device, characterized in that implemented as a three-color μLED capable of outputting all of red, green and blue. The method of claim 1,
The light emitting diode and the electrode are aligned on the same vertical line,
The electrode hole formed by the second insulating layer applied excluding a partial region of the electrode is located at the center of the light emitting diode. The method of claim 1,
It further includes a diffuser (Diffuser) layer formed on the first insulating layer,
The electrode is arranged on a portion of the diffuser layer, characterized in that the fine electrode array device. The method of claim 6,
The diffuser layer,
Diffused the light emitted through the light emitting diode, and the diffused light is transmitted to an object through the electrode. The method of claim 1,
The electrode,
A microelectrode array device, characterized in that it is made of less than a predetermined thickness, and is formed of a flexible, transparent and conductive graphene material. The method of claim 8,
The electrode,
Transmitting the neural signal to an object in contact with the second insulating layer through an electrode hole formed by the second insulating layer applied excluding a partial region of the electrode, or obtaining a neural signal generated from the object Micro electrode array device made by. The method of claim 9,
The electrode,
A fine electrode arrangement device, characterized in that for making the light emitted through the light emitting diode incident on the object and measuring a response signal of the object to the light. The method of claim 1,
A coating material that is applied to a portion of the second insulating layer and contains a protein that reacts to light; And
A film that has a property of being soluble in a liquid and surrounds the coating material to maintain the shape of the coating material
Micro electrode array device, characterized in that it further comprises. The method of claim 1,
Further comprising a graphene layer disposed on the second insulating layer,
The graphene layer is formed to promote cell growth of the object and to enhance the response signal of the object. Board;
Ultraviolet Ray (UV) light emitting diodes disposed on a portion of the substrate to emit ultraviolet rays;
A first insulating layer applied on the substrate and applied on the ultraviolet light emitting diode on the substrate;
A color filter that filters the ultraviolet light to extract at least one color of red, green, and blue, and is disposed on the first insulating layer at regular intervals;
An electrode disposed on the color filter to transmit and receive neural signals;
A second wiring connected to the electrode; And
A second insulating layer applied on the first insulating layer excluding a partial region of the electrode
Micro electrode array device comprising a. The method of claim 13,
The color filter,
A fine electrode array device, characterized in that it is formed equal to the number of electrodes and is greater than the number of ultraviolet light emitting diodes, and transmits the extracted color to the electrode.

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