KR20200109102A - Curable resin composition, scattering layer and image display device using the same - Google Patents
Curable resin composition, scattering layer and image display device using the same Download PDFInfo
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- KR20200109102A KR20200109102A KR1020190028172A KR20190028172A KR20200109102A KR 20200109102 A KR20200109102 A KR 20200109102A KR 1020190028172 A KR1020190028172 A KR 1020190028172A KR 20190028172 A KR20190028172 A KR 20190028172A KR 20200109102 A KR20200109102 A KR 20200109102A
- Authority
- KR
- South Korea
- Prior art keywords
- acrylate
- curable resin
- meth
- resin composition
- weight
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 52
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 49
- 239000011230 binding agent Substances 0.000 claims abstract description 41
- 239000002245 particle Substances 0.000 claims abstract description 39
- 150000001875 compounds Chemical class 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims description 57
- 229920000647 polyepoxide Polymers 0.000 claims description 57
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 38
- -1 acryloyloxy Chemical group 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 15
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- 239000003963 antioxidant agent Substances 0.000 claims description 14
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 12
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 10
- 239000002096 quantum dot Substances 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 9
- 230000003078 antioxidant effect Effects 0.000 claims description 9
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 7
- 229920003986 novolac Polymers 0.000 claims description 7
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 6
- 150000008064 anhydrides Chemical class 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000002723 alicyclic group Chemical group 0.000 claims description 5
- 239000002270 dispersing agent Substances 0.000 claims description 5
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 claims description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002318 adhesion promoter Substances 0.000 claims description 3
- 230000002744 anti-aggregatory effect Effects 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- YHFGMFYKZBWPRW-UHFFFAOYSA-N 3-methylpentane-1,1-diol Chemical compound CCC(C)CC(O)O YHFGMFYKZBWPRW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 17
- 238000002834 transmittance Methods 0.000 abstract description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 23
- 239000000047 product Substances 0.000 description 19
- 239000000178 monomer Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 15
- 239000004973 liquid crystal related substance Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- 229930185605 Bisphenol Natural products 0.000 description 9
- 230000008901 benefit Effects 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 239000007859 condensation product Substances 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 3
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 3
- MSXXDBCLAKQJQT-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCCOP2OC3=C(C=C(C=C3C=3C=C(C=C(C=3O2)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)=C1 MSXXDBCLAKQJQT-UHFFFAOYSA-N 0.000 description 3
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 238000004649 discoloration prevention Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 239000002530 phenolic antioxidant Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- FBOUIAKEJMZPQG-AWNIVKPZSA-N (1E)-1-(2,4-dichlorophenyl)-4,4-dimethyl-2-(1,2,4-triazol-1-yl)pent-1-en-3-ol Chemical compound C1=NC=NN1/C(C(O)C(C)(C)C)=C/C1=CC=C(Cl)C=C1Cl FBOUIAKEJMZPQG-AWNIVKPZSA-N 0.000 description 2
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- SFIRFYRWCFNIAJ-UHFFFAOYSA-N 2,6-bis(dodecylsulfanylmethyl)-4,4-bis(3-dodecylsulfanylpropanoyloxymethyl)heptanedioic acid Chemical group CCCCCCCCCCCCSCCC(=O)OCC(CC(CSCCCCCCCCCCCC)C(O)=O)(CC(CSCCCCCCCCCCCC)C(O)=O)COC(=O)CCSCCCCCCCCCCCC SFIRFYRWCFNIAJ-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 2
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 2
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical group CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 2
- OTKLRHWBZHQJOP-UHFFFAOYSA-N 3-aminopropyl prop-2-enoate Chemical compound NCCCOC(=O)C=C OTKLRHWBZHQJOP-UHFFFAOYSA-N 0.000 description 2
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
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- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 2
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 229920005822 acrylic binder Polymers 0.000 description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/015—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/015—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction
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Abstract
Description
본 발명은 경화성 수지 조성물, 이를 이용하여 제조된 산란층 및 상기 산란층을 포함하는 화상표시장치에 관한 것이다.The present invention relates to a curable resin composition, a scattering layer prepared using the same, and an image display device including the scattering layer.
화상표시장치는 일반적으로 텔레비전, 모니터, 노트북 컴퓨터, 스마트폰, 테블릿 컴퓨터, 전자 패드, 웨어러블 기기, 워치 폰, 휴대용 정보 기기, 네비게이션 또는 차량 제어 디스플레이 기기 등의 전자 제품에 탑재되어 영상을 표시하는 화면으로 사용되고 있다.Image display devices are generally mounted on electronic products such as televisions, monitors, notebook computers, smartphones, tablet computers, electronic pads, wearable devices, watch phones, portable information devices, and navigation or vehicle control display devices to display images. It is being used as a screen.
이러한 화상표시장치는 구체적으로 액정표시장치(LCD), PDP(Plasma display panel), OLED(Organic light emitting diode)등을 들 수 있는데, 이 중 액정표시장치는 박막트랜지스터 기판, 컬러필터 기판 그리고 양 기판 사이에 액정이 주입되어 있는 액정표시패널을 포함한다. 이 때, 액정표시패널은 비발광소자이기때문에 박막트랜지스터 기판의 하면에는 빛을 공급하기 위한 백라이트 유닛이 위치하게 되고, 백라이트 유닛에서 조사된 빛은 액정의 배열상태에 따라 투과량이 조정된다. Specifically, such an image display device may include a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting diode (OLED), and among them, the liquid crystal display device is a thin film transistor substrate, a color filter substrate, and both substrates. It includes a liquid crystal display panel in which liquid crystal is injected. At this time, since the liquid crystal display panel is a non-light emitting device, a backlight unit for supplying light is positioned on the lower surface of the thin film transistor substrate, and the amount of light emitted from the backlight unit is adjusted according to the arrangement of the liquid crystals.
백라이트 유닛은 광원의 위치에 따라 에지형과 직하형으로 구분된다. 에지형은 도광판의 측면에 광원이 설치되는 구조이다. 이에 비해, 직하형은 액정표시장치의 크기가 대형화되면서 중점적으로 개발되기 시작한 구조로서, 액정표시패널의 하부면에 하나 이상의 광원을 배치시켜 액정표시패널에 전면적으로 빛을 공급하는 구조를 갖는다. 이러한 직하형 백라이트 유닛은 에지형 백라이트 유닛에 비해 많은 수의 광원을 이용할 수 있어 높은 휘도를 확보할 수 있는 장점이 있다.The backlight unit is divided into an edge type and a direct type according to the position of the light source. The edge type is a structure in which a light source is installed on the side of the light guide plate. In contrast, the direct type has a structure that has begun to be developed intensively as the size of the liquid crystal display device increases, and has a structure in which at least one light source is disposed on the lower surface of the liquid crystal display panel to supply light to the liquid crystal display panel entirely. Such a direct type backlight unit has an advantage of securing high luminance since a large number of light sources can be used compared to the edge type backlight unit.
최근에는 백라이트 유닛을 구성하는 청색 광을 발진하는 블루 LED의 전방에 청색 광을 받으면 적색 파장 또는 녹색 파장으로 변환되는 다수의 양자점이 분산된 양자점바를 구비시켜 상기 양자점바에 청색광을 조사함으로써, 양자점바에 분산된 다수의 양자점들에 의해 청색광, 적색광 및 녹색광이 혼합된 백색광을 제공함으로써, 고색재현을 구현하기 위한 기술이 개발되고 있다. Recently, a quantum dot bar in which a plurality of quantum dots that are converted into a red wavelength or a green wavelength is converted into a red wavelength or a green wavelength when receiving blue light is provided in front of a blue LED that emits blue light constituting a backlight unit, and is distributed to the quantum dot bar by irradiating blue light to the quantum dot bar. A technology for realizing high color reproduction is being developed by providing white light in which blue light, red light, and green light are mixed by a plurality of quantum dots.
하지만, 이러한 양자점을 도입한다고 하더라도, 광원이 위치한 곳과 위치하지 않은 곳 간의 투과율의 차이로 인해 발생하는 색재현율의 차이를 극복하기 어려운 실정이다. 이러한 문제를 해결하기 위해 최근에는 상기 광원으로부터 방출되는 광을 양자점층 전체에 균일하게 투과시키기 위한 하나의 방법으로 산란층을 도입하는 기술이 개발되고 있다.However, even with the introduction of such quantum dots, it is difficult to overcome the difference in color reproducibility caused by the difference in transmittance between the place where the light source is located and the place where the light source is not located. In order to solve this problem, a technique of introducing a scattering layer has recently been developed as a method for uniformly transmitting light emitted from the light source to the entire quantum dot layer.
이와 관련하여, 대한민국 공개특허 제10-2009-0102694호에는 분자 중에 1급 아미노기를 함유하는 우레탄 올리고머와 열경화성 화합물을 함유함으로써, 기재와의 밀착성, 내절성, 저휘어짐성 등을 개선한 열경화성 수지 조성물을 개시하고 있다. 또한, 대한민국 공개특허 제10-2012-0030050호에는 특정 폴리올 성분과 폴리이소시아네이트, 특정 불포화 하이드록시화합물의 반응 생성물로서 경화성 관능기를 갖음으로써 투명성이 양호하고, 투명 기판과의 밀착성 및 내인열성을 향상시킨 경화성 수지 조성물에 대하여 개시하고 있다.In this regard, Korean Laid-Open Patent Publication No. 10-2009-0102694 contains a urethane oligomer containing a primary amino group in a molecule and a thermosetting compound, thereby improving adhesion to the substrate, cutting resistance, low warpage, etc. Is being disclosed. In addition, Korean Patent Laid-Open No. 10-2012-0030050 discloses that a specific polyol component, a polyisocyanate, and a specific unsaturated hydroxy compound have a curable functional group as a reaction product, so that transparency is good, and adhesion and tear resistance to a transparent substrate are improved. Disclosed is a curable resin composition.
그러나, 전술한 공개특허들은 별도의 산란입자를 포함하고 있지 않아 산란층으로서 사용되기 적절하지 못한 것으로 보인다. 따라서, 산란입자를 포함하여 우수한 산란효과를 가지면서도 투과율 역시 우수한 산란층을 제조하기 위한 수지 조성물의 개발이 요구되는 실정이다.However, the above-described patents do not contain separate scattering particles, so it seems that they are not suitable for use as a scattering layer. Therefore, there is a need to develop a resin composition for manufacturing a scattering layer having excellent scattering effect, including scattering particles, and having excellent transmittance.
본 발명은 산란입자를 포함함으로써 산란효과가 우수하고, 이와 동시에 투과율이 우수하여 산란층 제조에 적합한 경화성 수지 조성물을 제공하는 것을 목적으로 한다. It is an object of the present invention to provide a curable resin composition suitable for producing a scattering layer by including scattering particles, which has excellent scattering effect and excellent transmittance.
또한, 본 발명은 상기 경화성 수지 조성물을 이용하여 제조된 산란층을 제공하는 것을 목적으로 한다.In addition, it is an object of the present invention to provide a scattering layer prepared by using the curable resin composition.
또한, 본 발명은 상기 산란층을 포함하는 화상표시장치를 제공하는 것을 목적으로 한다.It is another object of the present invention to provide an image display device including the scattering layer.
본 발명은 산란입자, 결합제 수지, 중합성 화합물, 열경화제 및 용제를 포함하는 경화성 수지 조성물로서, 상기 산란입자는 TiO2 및 SiO2를 포함하는 것인 경화성 수지 조성물을 제공한다.The present invention provides a curable resin composition comprising a scattering particle, a binder resin, a polymerizable compound, a thermosetting agent and a solvent, wherein the scattering particles include TiO 2 and SiO 2 .
또한, 본 발명은 상기 경화성 수지 조성물의 경화물을 포함하는 산란층을 제공한다.In addition, the present invention provides a scattering layer comprising a cured product of the curable resin composition.
또한, 본 발명은 상기 산란층을 포함하는 화상표시장치를 제공한다.Further, the present invention provides an image display device including the scattering layer.
본 발명에 따른 경화성 수지 조성물은 산란입자로서 TiO2 및 SiO2를 함께 포함함으로써, 광원으로부터 방출되는 광의 산란효과 및 투과율이 우수한 효과를 제공한다.The curable resin composition according to the present invention includes TiO 2 and SiO 2 as scattering particles together, thereby providing an effect of having excellent scattering effect and transmittance of light emitted from a light source.
따라서, 상기 경화성 수지 조성물의 경화물을 포함하는 산란층 및 상기 산란층을 포함하는 화상표시장치는 광원으로부터 방출되는 광을 균일하게 투과시킴으로써 광원이 위치한 곳과 위치하지 않은 곳 간의 색재현율 차이를 줄일 수 있는 효과를 제공한다.Therefore, the scattering layer including the cured product of the curable resin composition and the image display device including the scattering layer uniformly transmit light emitted from the light source to reduce the difference in color gamut between the light source and the non-located light source. Provides a possible effect.
도 1은 본 발명에서 산란층의 표면 상태를 평가하는 기준을 나타낸 도이다.1 is a diagram showing a criterion for evaluating the surface condition of a scattering layer in the present invention.
본 발명은, 산란입자, 결합제 수지, 중합성 화합물, 열경화제 및 용제를 포함하는 경화성 수지 조성물로서, 상기 산란입자는 TiO2 및 SiO2를 포함하는 것인 경화성 수지 조성물, 이의 경화물을 포함하는 산란층 및 상기 산란층을 포함하는 화상표시장치에 관한 것으로, 본 발명에 따른 경화성 수지 조성물은 광원으로부터 방출되는 광의 산란효과 및 투과율이 우수한 효과를 제공하며, 상기 경화성 수지 조성물의 경화물을 포함하는 산란층 및 상기 산란층을 포함하는 화상표시장치는 광원으로부터 방출되는 광을 균일하게 투과시킴으로써 광원이 위치한 곳과 위치하지 않은 곳 간의 색재현율 차이를 줄일 수 있는 효과를 제공한다.The present invention is a curable resin composition comprising a scattering particle, a binder resin, a polymerizable compound, a thermosetting agent, and a solvent, wherein the scattering particles include TiO 2 and SiO 2 A curable resin composition comprising a cured product thereof, It relates to an image display device comprising a scattering layer and the scattering layer, wherein the curable resin composition according to the present invention provides excellent scattering effect and transmittance of light emitted from a light source, and includes a cured product of the curable resin composition. An image display device including a scattering layer and the scattering layer uniformly transmits light emitted from a light source, thereby providing an effect of reducing a difference in color gamut between a location where a light source is located and a location where the light source is not located.
이하, 본 발명의 구성을 상세히 설명한다. Hereinafter, the configuration of the present invention will be described in detail.
<경화성 수지 조성물><curable resin composition>
산란입자Scattering particles
본 발명의 경화성 수지 조성물은 산란입자로서 TiO2 및 SiO2를 함께 포함함으로써 광 산란효과가 보다 향상될 수 있는 이점이 있다.The curable resin composition of the present invention has the advantage that the light scattering effect can be further improved by including TiO 2 and SiO 2 together as scattering particles.
상기 TiO2 및 SiO2는 0.1 내지 50 : 1 의 중량비로 포함될 수 있으며, 바람직하게는 1 내지 30 : 1 의 중량비로 포함될 수 있다. 산란입자가 상기 TiO2 및 SiO2의 중량비 범위를 만족하는 경우, 우수한 광산란 효과와 투과율을 확보할 수 있으므로 바람직하다. The TiO 2 and SiO 2 may be included in a weight ratio of 0.1 to 50: 1, preferably in a weight ratio of 1 to 30: 1. When the scattering particles satisfy the weight ratio range of TiO 2 and SiO 2 , it is preferable because excellent light scattering effect and transmittance can be secured.
상기 산란입자는 평균입경이 10 내지 1000nm 일 수 있고, 바람직하게는 10 내지 800nm 일 수 있으며, 보다 바람직하게는 100 내지 500nm 일 수 있다. 산란입자의 평균입경이 상기 범위를 만족하는 경우, 광원으로부터 방출된 빛의 충분한 산란 효과를 기대할 수 있으며, 조성물 내에 산란입자가 가라 앉는 것을 방지하고, 균일한 품질의 산란층 표면을 얻을 수 있으므로 바람직하다. The scattering particles may have an average particle diameter of 10 to 1000 nm, preferably 10 to 800 nm, and more preferably 100 to 500 nm. When the average particle diameter of the scattering particles satisfies the above range, a sufficient scattering effect of the light emitted from the light source can be expected, preventing the scattering particles from sinking in the composition, and obtaining a scattering layer surface of uniform quality. Do.
본 발명에서 "평균입경"이란, 수평균 입경일 수 있으며, 예컨대 전계방출 주자전자현미경(FE-SEM) 또는 투과 전자 현미경(TEM)에 의해 관찰한 상으로부터 구할 수 있다. 구체적으로, FE-SEM 또는 TEM의 관찰 화상으로부터 몇 개의 샘플을 추출하고 이들 샘플의 직경을 측정하여 산술 평균한 값으로 얻을 수 있다.In the present invention, the term "average particle diameter" may be a number average particle diameter, and may be obtained from an image observed by, for example, a field emission column electron microscope (FE-SEM) or a transmission electron microscope (TEM). Specifically, several samples are extracted from the observation image of FE-SEM or TEM, and the diameters of these samples are measured to obtain an arithmetic average.
상기 산란입자는 상기 TiO2 및 SiO2 외에 당 업계에서 일반적으로 사용되는 산란입자를 더 포함할 수 있다. 상기 일반적으로 사용되는 산란입자는 특별한 제한 없이 사용할 수 있으나, 일 예로 금속산화물을 사용할 수 있고, 상기 금속산화물은 예를 들면 Li, Be, B, Na, Mg, Al, K, Ca, Sc, V, Cr, Mn, Fe, Ni, Cu, Zn, Ga, Ge, Rb, Sr, Y, Mo, Cs, Ba, La, Hf, W, Tl, Pb, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Sb, Sn, Zr, Nb, Ce, Ta, In 및 이들의 조합으로 이루어진 군으로부터 선택되는 하나 이상의 산화물일 수 있다. 보다 구체적으로는, Al2O3, ZnO, ZrO2, BaTiO3, Ta2O5, Ti3O5, ITO, IZO, ATO, ZnO-Al, Nb2O3, SnO, MgO 및 이들의 조합으로 이루어진 군으로부터 선택되는 하나 이상을 포함할 수 있으며, 필요에 따라 아크릴레이트와 같은 불포화 결합을 갖는 화합물로 표면처리된 것들도 사용될 수 있으나, 이에 한정되는 것은 아니다.The scattering particles may further include scattering particles generally used in the art in addition to the TiO 2 and SiO 2 . The generally used scattering particles may be used without particular limitation, but as an example, a metal oxide may be used, and the metal oxide is, for example, Li, Be, B, Na, Mg, Al, K, Ca, Sc, V , Cr, Mn, Fe, Ni, Cu, Zn, Ga, Ge, Rb, Sr, Y, Mo, Cs, Ba, La, Hf, W, Tl, Pb, Ce, Pr, Nd, Pm, Sm, Eu , Gd, Tb, Dy, Ho, Er, Tm, Yb, Sb, Sn, Zr, Nb, Ce, Ta, In, and may be one or more oxides selected from the group consisting of a combination thereof. More specifically, Al 2 O 3 , ZnO, ZrO 2 , BaTiO 3 , Ta 2 O 5 , Ti 3 O 5 , ITO, IZO, ATO, ZnO-Al, Nb 2 O 3 , SnO, MgO, and combinations thereof One or more selected from the group consisting of may be included, and if necessary, those surface-treated with a compound having an unsaturated bond such as acrylate may be used, but the present invention is not limited thereto.
상기 산란입자는 상기 경화성 수지 조성물 전체 100 중량부에 대하여, 0.1 내지 30 중량부로 포함될 수 있으며, 바람직하게는 1 내지 20 중량부로 포함될 수 있다. 상기 산란입자의 함량이 상기 범위를 만족하는 경우, 정면 시야각 0°를 기준으로, 시야각이 -60° 내지 +60°범위 내에서 우수한 발광세기를 갖는 화상표시장치를 제조할 수 있어, 정면 시야각은 물론 좌우측면에서도 목적하는 발광 세기를 얻을 수 있는 이점이 있으며, 과도한 산란입자에 의한 차광영향을 최소화하고, 조성물의 안정성을 향상시킬 수 있으므로 바람직하다. The scattering particles may be included in an amount of 0.1 to 30 parts by weight, and preferably 1 to 20 parts by weight, based on 100 parts by weight of the curable resin composition. When the content of the scattering particles satisfies the above range, an image display device having excellent light emission intensity within a range of -60° to +60° can be manufactured based on a front viewing angle of 0°, and the front viewing angle is Of course, there is an advantage of obtaining the desired luminous intensity from the left and right sides, and it is preferable because it can minimize the effect of blocking light by excessive scattering particles and improve the stability of the composition.
결합제 수지Binder resin
상기 결합제 수지는 열 또는 광의 작용에 의한 반응성을 가지며, 고형분의 분산매로서도 작용할 수 있고, 결착 수지의 기능을 수행할 수 있는 것이라면, 당 업계에서 통상적으로 사용되는 수지를 특별한 제한 없이 사용할 수 있다.The binder resin has reactivity due to the action of heat or light, can act as a dispersion medium of solid content, and can perform the function of a binder resin, a resin commonly used in the art may be used without particular limitation.
보다 구체적으로, 상기 결합제 수지는 아크릴계 바인더 수지, 카도계 바인더 수지 또는 이들의 혼합물을 포함할 수 있다. More specifically, the binder resin may include an acrylic binder resin, a cardo binder resin, or a mixture thereof.
상기 아크릴계 바인더 수지는 구체적으로 불포화 카르복실기 함유 단량체 및 이와 공중합 가능한 다른 단량체의 공중합체일 수 있다. The acrylic binder resin may specifically be a copolymer of an unsaturated carboxyl group-containing monomer and another monomer copolymerizable therewith.
상기 불포화 카르복실기 함유 단량체는 예를 들면, 불포화 모노카르복실산이나, 불포화 디카르복실산, 불포화 트리카르복실산 등의 분자 중에 1개 이상의 카르복실기를 갖는 불포화 다가 카르복실산 등을 들 수 있다. 상기 불포화 모노카르복실산은 예를 들면, 아크릴산, 메타크릴산, 크로톤산, α-클로로아크릴산, 신남산 등을 들 수 있다. 상기 불포화 디카르복실산은 예를 들면, 말레산, 푸마르산, 이타콘산, 시트라콘산, 메사콘산 등을 들 수 있다. 상기 불포화 다가 카르복실산은 산무수물일 수도 있으며, 예를 들면, 말레산 무수물, 이타콘산 무수물, 시트라콘산 무수물 등을 들 수 있고, 상기 다가 카르복실산은 그의 모노(2-메타크릴로일옥시알킬)에스테르일 수도 있으며, 예컨대, 숙신산모노(2-아크릴로일옥시에틸), 숙신산모노(2-메타크릴로일옥시에틸), 프탈산모노(2-아크릴로일옥시에틸), 프탈산모노(2-메타크릴로일옥시에틸) 등을 들 수 있다. 상기 불포화 다가 카르복실산은 그 양말단에 디카르복시중합체의 모노(메타)아크릴레이트를 포함할 수도 있으며, 예를 들면, ω-카르복시폴리카프로락톤모노아크릴레이트, ω-카르복시폴리카프로락톤모노메타크릴레이트 등을 들 수 있다. The unsaturated carboxyl group-containing monomer includes, for example, an unsaturated monocarboxylic acid, an unsaturated dicarboxylic acid, or an unsaturated polycarboxylic acid having one or more carboxyl groups in the molecule thereof. Examples of the unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, crotonic acid, α-chloroacrylic acid, and cinnamic acid. Examples of the unsaturated dicarboxylic acid include maleic acid, fumaric acid, itaconic acid, citraconic acid, and mesaconic acid. The unsaturated polyhydric carboxylic acid may be an acid anhydride, for example, maleic anhydride, itaconic anhydride, citraconic anhydride, etc., and the polyhydric carboxylic acid is its mono(2-methacryloyloxyalkyl ) It may be an ester, for example, succinate mono (2-acryloyloxyethyl), succinate mono (2-methacryloyloxyethyl), phthalate mono (2-acryloyloxyethyl), phthalate mono (2- Methacryloyloxyethyl) and the like. The unsaturated polyhydric carboxylic acid may include mono(meth)acrylate of a dicarboxylic polymer at both ends, for example, ω-carboxypolycaprolactone monoacrylate, ω-carboxypolycaprolactone monomethacrylate And the like.
전술한 카르복실기 함유 단량체는 이에 한정되는 것은 아니며, 이들은 각각 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다. The above-described carboxyl group-containing monomers are not limited thereto, and these may be used alone or in combination of two or more.
상기 카르복실기 함유 단량체와 공중합 가능한 다른 단량체는 예를 들면, 스티렌, α-메틸스티렌, o-비닐톨루엔, m-비닐톨루엔, p-비닐톨루엔, p-클로로스티렌, o-메톡시스티렌, m-메톡시스티렌, p-메톡시스티렌, o-비닐벤질메틸에테르, m-비닐벤질메틸에테르, p-비닐벤질메틸에테르, o-비닐벤질글리시딜에테르, m-비닐벤질글리시딜에테르, p-비닐벤질글리시딜에테르, 인덴 등의 방향족 비닐 화합물; 메틸아크릴레이트, 메틸메타크릴레이트, 에틸아크릴레이트, 에틸메타크릴레이트, n-프로필아크릴레이트, n-프로필메타크릴레이트, i-프로필아크릴레이트, i-프로필메타크릴레이트, n-부틸아크릴레이트, n-부틸메타크릴레이트, i-부틸아크릴레이트, i-부틸메타크릴레이트, sec-부틸아크릴레이트, sec-부틸메타크릴레이트, t-부틸아크릴레이트, t-부틸메타크릴레이트, 2-히드록시에틸아크릴레이트, 2-히드록시에틸메타크릴레이트, 2-히드록시프로필아크릴레이트, 2-히드록시프로필메타크릴레이트, 3-히드록시프로필아크릴레이트, 3-히드록시프로필메타크릴레이트, 2-히드록시부틸아크릴레이트, 2-히드록시부틸메타크릴레이트, 3-히드록시부틸아크릴레이트, 3-히드록시부틸메타크릴레이트, 4-히드록시부틸아크릴레이트, 4-히드록시부틸메타크릴레이트, 알릴아크릴레이트, 알릴메타크릴레이트, 벤질아크릴레이트, 벤질메타크릴레이트, 시클로헥실아크릴레이트, 시클로헥실메타크릴레이트, 페닐아크릴레이트, 페닐메타크릴레이트, 2-메톡시에틸아크릴레이트, 2-메톡시에틸메타크릴레이트, 2-페녹시에틸아크릴레이트, 2-페녹시에틸메타크릴레이트,메톡시디에틸렌글리콜아크릴레이트, 메톡시디에틸렌글리콜메타크릴레이트, 메톡시트리에틸렌글리콜아크릴레이트, 메톡시트리에틸렌글리콜메타크릴레이트, 메톡시프로필렌글리콜아크릴레이트, 메톡시프로필 렌글리콜메타크릴레이트, 메톡시디프로필렌글리콜아크릴레이트, 메톡시디프로필렌글리콜메타크릴레이트, 이소보르닐아크릴레이트, 이소보르닐메타크릴레이트, 디시클로펜타디에닐아크릴레이트, 디시클로펜타디에틸메타크릴레이트, 2-히드록시-3-페녹시프로필아크릴레이트, 2-히드록시-3-페녹시프로필메타크릴레이트, 글리세롤모노아크릴레이트, 글리세롤모노메타크릴레이트 등의 불포화 카르복실산 에스테르류; 2-아미노에틸아크릴레이트, 2-아미노에틸메타크릴레이트, 2-디메틸아미노에틸아크릴레이트, 2-디메틸아미노에틸메타크릴레이트, 2-아미노프로필아크릴레이트, 2-아미노프로필메타크릴레이트, 2-디메틸아미노프로필아크릴레이트, 2-디메틸아미노프로필메타크릴레이트, 3-아미노프로필아크릴레이트,3-아미노프로필메타크릴레이트, 3-디메틸아미노프로필아크릴레이트, 3-디메틸아미노프로필메타크릴레이트 등의 불포화 카르복실산 아미노알킬에스테르류; 글리시딜아크릴레이트, 글리시딜메타크릴레이트 등의 불포화 카르복실산 글리시딜에스테르류; 아세트산비닐, 프로피온산비닐, 부티르산비닐, 벤조산비닐 등의 카르복실산 비닐에스테르류; 비닐메틸에테르, 비닐에틸에테르, 알릴글리시딜에테르 등의 불포화에테르류; 아크릴로니트릴, 메타크릴로니트릴, α-클로로아크릴로니트릴, 시안화비닐리덴 등의 시안화 비닐 화합물; 아크릴아미드, 메타크릴아미드, α-클로로아크릴아미드, N-2-히드록시에틸아크릴아미드, N-2-히드록시에틸메타크릴아미드 등의 불포화 아미드류; 말레이미드, N-페닐말레이미드. N-시클로헥실말레이미드 등의 불포화 이미드류; 1,3-부타디엔, 이소프렌, 클로로프렌 등의 지방족 공액 디엔류; 및 폴리스티렌, 폴리메틸아크릴레이트, 폴리메틸메타크릴레이트, 폴리-n-부틸아크릴레이트, 폴리-n-부틸메타크릴레이트, 폴리실록산의 중합체 분자쇄의 말단에 모노아크릴로일기 또는 모노메타크릴로일기를 갖는 거대 단량체류 등을 들 수 있으나, 이에 한정되는 것은 아니며, 이들은 각각 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다.Other monomers copolymerizable with the carboxyl group-containing monomer include, for example, styrene, α-methylstyrene, o-vinyltoluene, m-vinyltoluene, p-vinyltoluene, p-chlorostyrene, o-methoxystyrene, m-methoxy. Toxoxystyrene, p-methoxystyrene, o-vinylbenzylmethylether, m-vinylbenzylmethylether, p-vinylbenzylmethylether, o-vinylbenzyl glycidyl ether, m-vinylbenzylglycidyl ether, p- Aromatic vinyl compounds such as vinyl benzyl glycidyl ether and indene; Methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, i-propyl acrylate, i-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, i-butyl acrylate, i-butyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, t-butyl acrylate, t-butyl methacrylate, 2-hydroxy Ethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl acrylate, 3-hydroxypropyl methacrylate, 2-hydroxy Roxybutyl acrylate, 2-hydroxybutyl methacrylate, 3-hydroxybutyl acrylate, 3-hydroxybutyl methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, allylacrylic Rate, allyl methacrylate, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, phenyl acrylate, phenyl methacrylate, 2-methoxyethyl acrylate, 2-methoxyethyl meth Crylate, 2-phenoxyethyl acrylate, 2-phenoxyethyl methacrylate, methoxydiethylene glycol acrylate, methoxydiethylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate Rate, methoxypropylene glycol acrylate, methoxypropylene glycol methacrylate, methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, isobornyl acrylate, isobornyl methacrylate, dicyclopentadie Nyl acrylate, dicyclopentadiethyl methacrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-phenoxypropyl methacrylate, glycerol monoacrylate, glycerol monomethacrylate Unsaturated carboxylic acid esters such as; 2-Aminoethyl acrylate, 2-aminoethyl methacrylate, 2-dimethylaminoethyl acrylate, 2-dimethylaminoethyl methacrylate, 2-aminopropyl acrylate, 2-aminopropyl methacrylate, 2-dimethyl Unsaturated carboxyl, such as aminopropyl acrylate, 2-dimethylaminopropyl methacrylate, 3-aminopropyl acrylate, 3-aminopropyl methacrylate, 3-dimethylaminopropyl acrylate, and 3-dimethylaminopropyl methacrylate Acid aminoalkyl esters; Unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate and glycidyl methacrylate; Carboxylic acid vinyl esters such as vinyl acetate, vinyl propionate, vinyl butyrate, and vinyl benzoate; Unsaturated ethers such as vinyl methyl ether, vinyl ethyl ether, and allyl glycidyl ether; Vinyl cyanide compounds such as acrylonitrile, methacrylonitrile, α-chloroacrylonitrile, and vinylidene cyanide; Unsaturated amides such as acrylamide, methacrylamide, α-chloroacrylamide, N-2-hydroxyethylacrylamide, and N-2-hydroxyethyl methacrylamide; Maleimide, N-phenylmaleimide. Unsaturated imides such as N-cyclohexylmaleimide; Aliphatic conjugated dienes such as 1,3-butadiene, isoprene, and chloroprene; And a monoacryloyl group or a monomethacryloyl group at the end of the polymer molecular chain of polystyrene, polymethyl acrylate, polymethyl methacrylate, poly-n-butyl acrylate, poly-n-butyl methacrylate, and polysiloxane. And macromonomers, but are not limited thereto, and these may be used alone or in combination of two or more.
본 발명의 일 실시형태에 따르면, 상기 결합제 수지는 카도계 바인더 수지를 포함할 수 있으며, 상기 카도계 바인더 수지는 하기 화학식 1로 표시되는 화합물을 포함하는 것일 수 있다. 이와 같이 결합제 수지가 카도계 바인더 수지를 포함하는 경우 결합제 수지 자체에서 발생하는 아웃가스를 억제할 수 있는 이점이 있으며, 상기 카도계 바인더 수지가 하기 화학식 1로 표시되는 바인더 수지를 포함하는 경우 이를 포함하는 조성물로부터 형성된 경화물(도막)을 균일하게 하고, 현상성이 양호해 질 수 있다.According to an embodiment of the present invention, the binder resin may include a cardo-based binder resin, and the cardo-based binder resin may include a compound represented by Formula 1 below. In this way, when the binder resin contains the cardo-based binder resin, there is an advantage of suppressing outgassing from the binder resin itself, and the cardo-based binder resin includes a binder resin represented by the following formula (1). The cured product (coating film) formed from the composition can be made uniform, and developability can be improved.
[화학식 1][Formula 1]
(상기 화학식 1에서, X는 하기 화학식 2로 표시되는 기이고, Y는 각각 독립적으로 디카르복실산 무수물의 잔기이며, Z는 각각 독립적으로 테트라카르복실산 2무수물의 잔기이고, l은 4 내지 20의 정수이다.)(In Formula 1, X is a group represented by the following Formula 2, Y is each independently a residue of a dicarboxylic anhydride, Z is each independently a residue of a tetracarboxylic dianhydride, and l is 4 to It is an integer of 20.)
[화학식 2][Formula 2]
(상기 화학식 2에서, *은 탄소 원자 또는 산소 원자와의 결합손을 의미한다.)(In Chemical Formula 2, * means a hand bonded to a carbon atom or an oxygen atom.)
상기 디카르복실산 무수물은 예를 들면, 무수 말레산, 무수 호막산, 무수 이타콘산, 무수 프탈산, 무수 테트라하이드로프탈산, 무수 헥사하이드로프탈산, 무수 메틸 엔드 메틸렌테트라하이드로프탈산, 무수 클로렌드산, 메틸테트라하이드로 무수 프탈산, 무수 글루타르산 등을 들 수 있고, 상기 디카르복실산 무수물의 잔기라 함은 전술한 디카르복실산 무수물로부터 카르복실산 무수물기(-CO-O-CO-)를 제외한 잔기를 의미한다.The dicarboxylic anhydride is, for example, maleic anhydride, homak anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl end methylenetetrahydrophthalic anhydride, chlorendic anhydride, methyl Tetrahydro phthalic anhydride, glutaric anhydride, and the like, and the residue of the dicarboxylic anhydride refers to excluding the carboxylic anhydride group (-CO-O-CO-) from the aforementioned dicarboxylic anhydride. Means a residue.
상기 테트라카르복실산 2무수물은 예를 들면, 피로멜리트산, 벤조페논테트라카복시산 2무수물, 비페닐테트라카복시산 2무수물, 비페닐에테르테트라카복시산 2무수물 등을 들 수 있으며, 상기 테트라카르복실산 2무수물의 잔기라 함은 전술한 테트라카르복실산 2무수물로부터 2개의 카르복실산 무수물기를 제외한 잔기를 의미한다.The tetracarboxylic dianhydride may include, for example, pyromellitic acid, benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, biphenyl ether tetracarboxylic dianhydride, and the like, and the tetracarboxylic acid dianhydride. The residue of the acid dianhydride refers to a residue excluding two carboxylic anhydride groups from the tetracarboxylic dianhydride described above.
본 발명의 경화성 수지 조성물이 상기 카도계 바인더 수지를 더 포함하는 경우, 카도계 바인더 수지의 함량은 결합제 수지 고형분 전체 100 중량%에 대하여 30 내지 100 중량% 이하일 수 있으며, 바람직하게는 30 내지 90 중량% 일 수 있고, 보다 바람직하게는 40 내지 80 중량% 일 수 있다. 이와 같이 카도계 바인더 수지의 함량이 상기 범위를 만족하는 경우, 경화 후 제작된 산란층의 연필경도가 보다 향상될 수 있으므로 바람직하다.When the curable resin composition of the present invention further includes the cardo-based binder resin, the content of the cardo-based binder resin may be 30 to 100% by weight or less, preferably 30 to 90% by weight based on 100% by weight of the total solid content of the binder resin. %, more preferably 40 to 80% by weight. As described above, when the content of the cardo-based binder resin satisfies the above range, the pencil hardness of the scattering layer produced after curing may be further improved, so it is preferable.
상기 결합제 수지의 중량평균분자량(Mw)은 3,000 내지 40,000 일 수 있고, 바람직하게는 5,000 내지 20,000 일 수 있으며, 분자량 분포(Mw/Mn)는 1.5 내지 6.0 일 수 있고, 바람직하게는 1.8 내지 4.0 일 수 있다. 결합제 수지의 중량평균분자량 또는 분자량 분포가 상기 범위 내로 포함되는 경우, 경도 및 잔막율이 향상될 수 있으므로 바람직하다. The weight average molecular weight (Mw) of the binder resin may be 3,000 to 40,000, preferably 5,000 to 20,000, and the molecular weight distribution (Mw/Mn) may be 1.5 to 6.0, and preferably 1.8 to 4.0 days. I can. When the weight average molecular weight or molecular weight distribution of the binder resin is included within the above range, it is preferable because the hardness and the residual film rate can be improved.
본 발명에서 "분자량 분포"란, GPC(Gel Permeation Chromatogrphy)로 측정한 중량평균분자량(Mw)을 수평균분자량(Mn)으로 나눈 값을 의미한다.In the present invention, "molecular weight distribution" means a value obtained by dividing the weight average molecular weight (Mw) measured by GPC (Gel Permeation Chromatogrphy) by the number average molecular weight (Mn).
상기 결합제 수지의 산가는 30 내지 200 mgKOH/g 일 수 있고, 바람직하게는 20 내지 200 mgKOH/g 일 수 있다. 결합제 수지의 산가가 상기 범위를 만족하는 경우, 충분한 현상속도를 확보할 수 있고, 기판과의 밀착성 감소, 전체 조성물의 저장 안정성 저하 및 점도 상승을 방지할 수 있으므로 바람직하다.The acid value of the binder resin may be 30 to 200 mgKOH/g, and preferably 20 to 200 mgKOH/g. When the acid value of the binder resin satisfies the above range, a sufficient development speed can be secured, adhesion to the substrate can be reduced, storage stability of the entire composition, and viscosity increase can be prevented.
본 발명에서 "산가"란 아크릴계 중합체 1g을 중화하는 데 필요한 수산화칼륨의 양(mg)으로서 측정되는 값으로 용해성에 관여하는 값을 의미한다.In the present invention, "acid value" refers to a value related to solubility as a value measured as the amount (mg) of potassium hydroxide required to neutralize 1 g of an acrylic polymer.
상기 결합제 수지는 경화성 수지 조성물 전체 100 중량부에 대하여 2 내지 20 중량부, 바람직하게는 5 내지 10 중량부로 포함될 수 있다. 이와 같은 결합제 수지의 함량 범위는 현상액에 대한 용해도와 패턴 형성 등을 다각적으로 고려하여 선정한 범위로서, 결합제 수지가 상기 함량범위를 만족하는 경우 산란층의 표면이 균일하여 광원을 보다 효과적으로 산란시킬 수 있으므로 바람직하다.The binder resin may be included in an amount of 2 to 20 parts by weight, preferably 5 to 10 parts by weight, based on 100 parts by weight of the total curable resin composition. The content range of the binder resin is a range selected in consideration of the solubility of the developer and pattern formation, etc., and when the binder resin satisfies the above content range, the surface of the scattering layer is uniform and the light source can be more effectively scattered. desirable.
중합성 화합물Polymerizable compound
상기 중합성 화합물은 광 또는 열에 의해 중합될 수 있는 화합물을 의미하며, 보다 구체적으로 단관능 단량체, 2관능 단량체 또는 그 밖의 다관능 단량체 등을 들 수 있다.The polymerizable compound refers to a compound that can be polymerized by light or heat, and more specifically, a monofunctional monomer, a bifunctional monomer, or other polyfunctional monomer may be mentioned.
상기 단관능 단량체는 예를 들면, 노닐페닐카르비톨아크릴레이트, 2-히드록시-3-페녹시프로필아크릴레이트, 2-에틸헥실카르비톨아크릴레이트, 2-히드록시에틸아크릴레이트, N-비닐피롤리돈 등을 들 수 있으나, 이에 한정되는 것은 아니다.The monofunctional monomer is, for example, nonylphenylcarbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexylcarbitol acrylate, 2-hydroxyethyl acrylate, N-vinylpi Rolidone, and the like, but are not limited thereto.
상기 2관능 단량체는 예를 들면, 1,6-헥산디올디(메타)아크릴레이트, 에틸렌글리콜디(메타)아크릴레이트, 네오펜틸글리콜디(메타)아크릴레이트, 트리에틸렌글리콜디(메타)아크릴레이트, 비스페놀 A의 비스(아크릴로일옥시에틸)에테르, 3-메틸펜탄디올디(메타)아크릴레이트 등을 들 수 있으나, 이에 한정되는 것은 아니다.The bifunctional monomer is, for example, 1,6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate , Bis(acryloyloxyethyl) ether of bisphenol A, 3-methylpentanediol di(meth)acrylate, and the like, but are not limited thereto.
상기 다관능 단량체는 예를 들면, 트리메틸올프로판트리(메타)아크릴레이트, 에톡실레이티드트리메틸올프로판트리(메타)아크릴레이트, 프로폭실레이티드트리메틸올프로판트리(메타)아크릴레이트, 펜타에리스리톨트리(메타)아크릴레이트, 펜타에리스리톨테트라(메타)아크릴레이트, 디펜타에리스리톨트리(메타)아크릴레이트, 디펜타에리스리톨펜타(메타)아크릴레이트, 에톡실레이티드디펜타에리스리톨헥사(메타)아크릴레이트, 프로폭실레이티드디펜타에리스리톨헥사(메타)아크릴레이트, 디펜타에리스리톨헥사(메타)아크릴레이트 등을 들 수 있으나, 이에 한정되는 것은 아니다.The polyfunctional monomers are, for example, trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri (Meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, pro Foxylated dipentaerythritol hexa (meth) acrylate, dipenta erythritol hexa (meth) acrylate, and the like, but are not limited thereto.
상기 예시된 단량체들은 각각 단독으로 혹은 2종 이상을 혼합하여 사용할 수 있다. 또한, 상기 단량체로서 시판되는 것을 구입하여 사용할 수도 있는데, 시판품은 예를 들면 미원상사의 Miramer M600 등을 들 수 있다.Each of the exemplified monomers may be used alone or in combination of two or more. In addition, commercially available monomers may be purchased and used. Examples of commercially available products include Miramer M600 manufactured by Miwon Corporation.
상기 중합성 화합물은 경화성 수지 조성물 전체 100 중량부에 대하여, 1 내지 15 중량부, 바람직하게는 2 내지 15 중량부, 보다 바람직하게는 2 내지 10 중량부로 포함될 수 있다. 중합성 화합물이 상기 함량범위를 만족하는 경우, 이를 포함하는 조성물의 경화물 형성 시 이의 강도나 평활성이 향상될 수 있으므로 바람직하다.The polymerizable compound may be included in an amount of 1 to 15 parts by weight, preferably 2 to 15 parts by weight, more preferably 2 to 10 parts by weight, based on 100 parts by weight of the total curable resin composition. When the polymerizable compound satisfies the above content range, it is preferable because the strength or smoothness thereof may be improved when the cured product of the composition containing the same is formed.
열경화제Heat curing agent
상기 열경화제는 이를 포함하는 경화성 수지 조성물을 이용하여 경화물을 형성할 때, 경화물의 심부 경화 또는 경화물의 기계적 강도를 향상시킬 수 있다.When forming a cured product using the curable resin composition including the thermosetting agent, the cured product may be deeply cured or the mechanical strength of the cured product may be improved.
상기 열경화제는 예를 들면, 단관능 지환족 에폭시 수지, 노볼락형 에폭시 수지 및 실란 변성 에폭시 수지로 이루어진 군으로부터 선택되는 하나 이상일 수 있다. The thermosetting agent may be, for example, one or more selected from the group consisting of a monofunctional alicyclic epoxy resin, a novolak type epoxy resin, and a silane-modified epoxy resin.
상기 단관능 지환족 에폭시 수지는 디엔 화합물을 중합반응시켜 만들어질 수 있으며, 바람직하게는 하기 화학식 3 또는 화학식 4로 표시되는 화합물을 포함할 수 있다.The monofunctional alicyclic epoxy resin may be prepared by polymerizing a diene compound, and preferably may include a compound represented by the following Formula 3 or Formula 4.
[화학식 3][Formula 3]
(상기 화학식 3에서, m, n 및 o는 각각 독립적으로 1 내지 20의 정수이다.)(In Formula 3, m, n, and o are each independently an integer of 1 to 20.)
[화학식 4][Formula 4]
상기 노볼락형 에폭시 수지는 크레졸 노볼락 또는 하기 화학식 5로 표시되는 화합물을 포함할 수 있다.The novolak-type epoxy resin may include cresol novolac or a compound represented by the following Formula 5.
[화학식 5][Formula 5]
(상기 화학식 5에서, p는 1 내지 20의 정수이다.)(In Formula 5, p is an integer of 1 to 20.)
상기 실란 변성 에폭시 수지는 수산기 함유 에폭시 수지와 알콕시실란의 반응물일 수 있다. The silane-modified epoxy resin may be a reaction product of a hydroxyl group-containing epoxy resin and an alkoxysilane.
상기 수산기 함유 에폭시 수지는 예를 들면, 비스페놀형 에폭시 수지, 노볼락형 에폭시 수지, 글리시딜 에스테르형 에폭시 수지, 글리시딜 아민형 에폭시 수지, 선형 지방족 에폭시 수지 및 지환식 에폭시 수지, 및 비페닐형 에폭시 수지 등을 들 수 있고, 이 중에서도, 비스페놀형 에폭시 수지 및 노볼락형 에폭시 수지가 바람직하게 사용될 수 있다.The hydroxyl group-containing epoxy resin is, for example, a bisphenol type epoxy resin, a novolak type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, a linear aliphatic epoxy resin and an alicyclic epoxy resin, and biphenyl. Type epoxy resins and the like, and among them, bisphenol type epoxy resins and novolak type epoxy resins can be preferably used.
상기 비스페놀형 에폭시 수지는 비스페놀류와 에피크롤히드린 또는 α-메틸에피크롤히드린 등의 할로에폭시드와의 반응에 의해 얻어질 수 있으며, 상기 비스페놀류는 예를 들면, 페놀 또는 2,6-디할로페놀과 포름알데히드, 아세트알데히드, 아세톤, 아세토페논, 시클로헥사논, 벤조페논 등의 알데히드류 또는 케톤류와의 반응 생성물 및 디히드록시페닐술피드의 과산에 의한 산화 생성물, 히드로퀴논끼리의 에테르화 반응 생성물 등을 들 수 있다. 상기 비스페놀형 에폭시 수지로는 바람직하게 비스페놀류로서 비스페놀 A, 비스페놀 S, 비스페놀 F, 또는 이들 수소 첨가물을 사용하여 얻어진 비스페놀형 에폭시 수지가 사용될 수 있다.The bisphenol-type epoxy resin can be obtained by reaction of bisphenols with haloepoxides such as epichlorohydrin or α-methylepicorolhydrin, and the bisphenols are, for example, phenol or 2,6- Reaction products of dihalophenol with formaldehyde, acetaldehyde, acetone, acetophenone, cyclohexanone, benzophenone, and other aldehydes or ketones, and oxidation products of dihydroxyphenylsulfide by peracid, etherification of hydroquinones Reaction products, etc. are mentioned. As the bisphenol-type epoxy resin, bisphenol A, bisphenol S, bisphenol F, or bisphenol-type epoxy resin obtained by using these hydrogenated substances may be preferably used as bisphenols.
상기 비스페놀형 에폭시 수지는 후술하는 알콕시실란과 반응할 수 있는 수산기를 포함할 수 있다. 상기 수산기는 비스페놀형 에폭시 수지를 구성하는 모든 분자에 포함되는 것은 아니고, 비스페놀형 에폭시 수지 전체로서 수산기를 포함하는 것일 수 있다. 예를 들면, 비스페놀 A형 에폭시 수지는 하기 화학식 6으로 표시될 수 있지만, q가 1 이상인 것을 포함할 수도 있고, q가 0인 것을 포함할 수도 있다.The bisphenol-type epoxy resin may include a hydroxyl group capable of reacting with an alkoxysilane described later. The hydroxyl group is not included in all molecules constituting the bisphenol-type epoxy resin, and may include a hydroxyl group as the whole bisphenol-type epoxy resin. For example, the bisphenol A type epoxy resin may be represented by the following formula (6), but may include those in which q is 1 or more, or those in which q is 0.
[화학식 6][Formula 6]
(상기 화학식 6에서, q는 1 내지 34의 정수이다.)(In Formula 6, q is an integer of 1 to 34.)
상기 비스페놀형 에폭시 수지는 예를 들면, 인 화합물을 반응시켜, 인 변성 비스페놀형 에폭시 수지를 사용할 수도 있다. 상기 노볼락형 에폭시 수지는 예를 들면, 페놀노볼락 수지, 크레졸노볼락 수지에 할로에폭시드를 반응시켜 얻을 수 있다. 상기 글리시딜 에스테르형 에폭시 수지는, 예를 들면 프탈 등의 다른 염기산류와 에피클로로히드린을 반응시킴으로써 얻을 수 있다. 상기 글리시딜 아민형 에폭시 수지는 예를 들면, 디아미노디페닐메탄, 이소시아누르산 등의 폴리아민류와 에피클로로히드린을 반응시켜 얻을 수 있다. 상기 선형 지방족 에폭시 수지 및 지환식 에폭시 수지는 예를 들면 올레핀류를 과아세트산 등의 과산으로 처리하여 얻을 수 있다. 상기 비페닐형 에폭시 수지는 예를 들면 비페놀류와 에피클로로히드린을 반응시켜 얻을 수 있다.As the bisphenol type epoxy resin, for example, a phosphorus-modified bisphenol type epoxy resin may be used by reacting a phosphorus compound. The novolac-type epoxy resin can be obtained, for example, by reacting a haloepoxide with a phenol novolak resin or a cresol novolac resin. The glycidyl ester type epoxy resin can be obtained by, for example, reacting epichlorohydrin with other basic acids such as phthal. The glycidyl amine type epoxy resin can be obtained by, for example, reacting polyamines such as diaminodiphenylmethane and isocyanuric acid with epichlorohydrin. The linear aliphatic epoxy resin and alicyclic epoxy resin can be obtained, for example, by treating olefins with peracids such as peracetic acid. The biphenyl-type epoxy resin can be obtained, for example, by reacting biphenols with epichlorohydrin.
상기 수산기 함유 에폭시 수지의 바람직한 에폭시 당량의 범위는 수산기 함유 에폭시 수지의 구조에 따라서 상이할 수 있으며, 용도에 따라서 적절하게 선택하여 사용할 수 있다. 통상적으로, 에폭시 당량이 과도하게 적은 수산기 함유 에폭시 수지 성분을 사용하면 보호막으로 했을 때에 기판과의 밀착성이 저하되는 경우가 있기 때문에, 수산기 함유 에폭시 수지의 에폭시 당량은 180 이상으로 하는 것이 바람직하다.The range of the preferred epoxy equivalent of the hydroxyl group-containing epoxy resin may vary depending on the structure of the hydroxyl group-containing epoxy resin, and may be appropriately selected and used according to the application. Usually, when a hydroxyl-containing epoxy resin component having an excessively small amount of epoxy equivalent is used, the adhesion to the substrate may be lowered when used as a protective film, so the epoxy equivalent of the hydroxyl-containing epoxy resin is preferably 180 or more.
한편, 에폭시 당량이 과도하게 큰 수산기 함유 에폭시 수지 성분을 사용하면 후술하는 알콕시실란과의 반응시에 겔화되는 경우가 있기 때문에, 수산기 함유 에폭시 수지 성분의 에폭시 당량은 5,000 이하로 하는 것이 바람직하고, 200 내지 400 인 것이 보다 바람직하다.On the other hand, if an epoxy resin component containing an excessively large epoxy equivalent is used, gelation may occur during reaction with an alkoxysilane described later, so the epoxy equivalent of the epoxy resin component containing a hydroxyl group is preferably 5,000 or less, and 200 It is more preferable that it is 400.
상기 알콕시실란으로는 일반적으로 졸-겔법에 이용되는 것을 사용할 수 있으며, 예를 들면, 하기 화학식 7로 표시되는 화합물, 또는 이들의 부분 축합물 등을 들 수 있다.As the alkoxysilane, those generally used in the sol-gel method may be used, and examples thereof include a compound represented by the following formula (7), or a partial condensation product thereof.
[화학식 7][Formula 7]
(R4)rSi(OR5)4-r (R 4 ) r Si(OR 5 ) 4-r
(상기 화학식 7에서, r은 0 또는 1의 정수이고, R4는 탄소수 1 내지 6의 알킬기, 탄소수 6 내지 20의 아릴기 또는 탄소수 2 내지 6의 불포화 지방족 탄화수소기이며, R5는 각각 독립적으로 수소 원자 또는 탄소수 1 내지 6의 알킬기이다.)(In Formula 7, r is an integer of 0 or 1, R 4 is an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an unsaturated aliphatic hydrocarbon group having 2 to 6 carbon atoms, and R 5 is each independently It is a hydrogen atom or a C1-C6 alkyl group.)
상기 화학식 7에서, R4는 보다 구체적으로, 비닐기, 머캅토기, 에폭시기, 글리시독시기 등일 수 있다. In Chemical Formula 7, R 4 may be more specifically, a vinyl group, a mercapto group, an epoxy group, a glycidoxy group, and the like.
본 발명에서 "부분 축합물"이란, 상기 화학식 7로 표시되는 알콕시실란 화합물 중 알콕시기의 일부를 축합하여 얻어지는 것을 의미한다. 이러한 부분 축합물은 상기 알콕시실란을 산 또는 알칼리 및 물의 존재하에 가수분해함으로써 얻을 수 있다.In the present invention, the term "partial condensation product" means obtained by condensing a part of an alkoxy group in the alkoxysilane compound represented by Formula 7. Such partial condensates can be obtained by hydrolyzing the alkoxysilane in the presence of an acid or alkali and water.
상기 알콕시 실란은 에를 들면, 테트라메톡시실란, 테트라에톡시실란, 테트라프로폭시실란, 테트라이소프로폭시실란, 테트라부톡시실란과 같은 테트라알콕시실란류; 메틸트리메톡시실란, 메틸트리에톡시실란, 메틸트리프로폭시실란, 메틸트리부톡시실란, 에틸트리메톡시실란, 에틸트리에톡시실란, n-프로필트리메톡시실란, n-프로필트리에톡시실란, 이소프로필트리메톡시실란, 이소프로필트리에톡시실란, 비닐트리메톡시실란, 비닐트리에톡시실란, 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필트리에톡시실란, 3-머캅토프로필트리메톡시실란, 3-머캅토프로필트리에톡시실란, 페닐트리메톡시실란, 페닐트리에톡시실란, 3,4-에폭시시클로헥실에틸트리메톡시실란, 3,4-에폭시시클로헥실에틸트리에톡시실란과 같은 트리알콕시실란류; 또는 이들의 부분 축합물 등을 들 수 있으며, 이들 중에서도, 하기 화학식 8로 표시되는 테트라메톡시실란 또는 알킬트리메톡시실란의 부분 축합물이 바람직할 수 있다.The alkoxy silane may include, for example, tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetraisopropoxysilane, and tetrabutoxysilane; Methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, methyltributoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxy Silane, isopropyltrimethoxysilane, isopropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, 3,4-epoxycyclohexylethyltrimethoxysilane, 3,4-epoxy Trialkoxysilanes such as cyclohexylethyltriethoxysilane; Or a partial condensation product of these may be mentioned. Among these, a partial condensation product of tetramethoxysilane or alkyltrimethoxysilane represented by the following general formula (8) may be preferable.
[화학식 8][Formula 8]
(상기 화학식 8에서, R6은 각각 독립적으로 메톡시기 또는 탄소수 1 내지 6의 알킬기이고, b는 1 내지 7의 정수이다.)(In Formula 8, R 6 is each independently a methoxy group or an alkyl group having 1 to 6 carbon atoms, and b is an integer of 1 to 7.)
상기 화학식 8로 표시되는 테트라메톡시실란 또는 알킬트리메톡시실란의 부분 축합물의 중량평균분자량(Mw)은 260 내지 2,000 정도인 것이 바람직하고, 260 내지 890 정도인 것이 더욱 바람직할 수 있다. 해당 테트라메톡시실란 또는 알킬트리메톡시실란의 부분 축합물은 수산기 함유 에폭시 수지 성분과의 반응에 있어서, 메탄올과 함께 미반응의 알콕시실란 성분이 증발되어 계 외부에 유출되지 않기 때문에, 반응 조작상으로도 바람직하다. 또한, 이러한 부분 축합물에는 대응하는 단량체에서 발견되는 것과 같은 독성이 없다는 점에 있어서도 바람직할 수 있다.The weight average molecular weight (Mw) of the partial condensation of tetramethoxysilane or alkyltrimethoxysilane represented by Formula 8 is preferably about 260 to 2,000, and more preferably about 260 to 890. In the reaction of the tetramethoxysilane or the partial condensation of alkyltrimethoxysilane with the hydroxyl group-containing epoxy resin component, the unreacted alkoxysilane component is evaporated together with methanol and does not flow out of the system. It is also preferable. It may also be desirable in that such partial condensates are not toxic as found in the corresponding monomers.
상기 화학식 8에 있어서, 평균 반복 단위수의 값(b)은 7 이하가 바람직할 수 있다. 이 값이 7을 초과하는 경우 용해성이 악화되고, 수산기 함유 에폭시 수지 또는 유기용제에 불용화되기 쉽기 때문에, 수산기 함유 에폭시 수지와의 반응성이 저하될 수 있다. In Formula 8, the average number of repeating units (b) may be 7 or less. When this value exceeds 7, solubility deteriorates, and since it is liable to be insoluble in a hydroxyl group-containing epoxy resin or an organic solvent, reactivity with a hydroxyl group-containing epoxy resin may decrease.
상기 실란 변성 에폭시 수지는 상기 수산기 함유 에폭시 수지와 알콕시실란과의 탈알코올 축합 반응에 의해 얻어질 수 있다. 수산기 함유 에폭시 수지와 알콕시실란의 사용 비율은 얻어지는 실란 변성 에폭시 수지 중에 알콕실기가 실질적으로 잔존하는 것과 같은 비율이면 특별히 제한되지 않지만, 알콕시실란의 실리카 환산 질량/수산기함유 에폭시 수지의 질량(질량비)를 0.01 내지 3의 범위로 하는 것이 바람직할 수 있다.The silane-modified epoxy resin may be obtained by a dealcohol condensation reaction between the hydroxyl group-containing epoxy resin and an alkoxysilane. The ratio of the hydroxyl group-containing epoxy resin and the alkoxysilane to be used is not particularly limited as long as it is the same ratio as that the alkoxyl group substantially remains in the resulting silane-modified epoxy resin, but the mass (mass ratio) of the alkoxysilane in terms of silica / the hydroxyl group-containing epoxy resin It may be desirable to range from 0.01 to 3.
단, 수산기 함유 에폭시 수지가 에폭시당량 400 정도 이상의 고분자량 수지인 경우에는 탈알코올 반응의 진행에 의해서 용액의 고점도화나 겔화를 초래하는 경우가 있다. 따라서, 수산기 함유 에폭시 수지의 수산기 당량 또는 알콕시실란의 알콕시기 당량 중 어느 한쪽이 많아지도록, 수산기 함유 에폭시 수지의 수산기 당량과 알콕시실란의 알콕시기 당량의 당량비를 1 미만 또는 1을 초과하도록 조정하는 것이 바람직하다. 특히, 상기 당량비는 0.8 미만 또는 1.2 이상으로 조정하는 것이 더욱 바람직하며, 1.2 이상으로 제조하는 것이 가장 바람직하다.However, in the case where the hydroxyl group-containing epoxy resin is a high molecular weight resin having an epoxy equivalent of about 400 or more, the solution may become highly viscous or gelled by the progress of the dealcoholization reaction. Therefore, adjusting the equivalent ratio of the equivalent of the hydroxyl group of the epoxy resin containing the hydroxyl group and the equivalent of the alkoxy group of the alkoxysilane to be less than 1 or more than 1 so that either the equivalent of the hydroxyl group of the epoxy resin containing the hydroxyl group or the equivalent of the alkoxy group of the alkoxysilane increases. desirable. In particular, the equivalent ratio is more preferably adjusted to less than 0.8 or more than 1.2, and most preferably more than 1.2.
또한, 탈알코올 반응을 반응 도중에 정지시키는 등의 방법에 의해 고점도화 또는 겔화를 방지할 수 있다. 예를 들면, 고점도화 된 시점에서 반응계를 환류계로 하여, 반응계에서 메탄올의 증류 제거량을 조정하거나, 반응계를 냉각하여 반응을 종료시키는 방법 등을 채용할 수 있다.Further, high viscosity or gelation can be prevented by a method such as stopping the dealcoholization reaction during the reaction. For example, a method of adjusting the amount of methanol distilled off in the reaction system by using the reaction system as a reflux system at the point when the viscosity becomes high, or cooling the reaction system to terminate the reaction may be employed.
상기 실란 변성 에폭시 수지의 제조는 예를 들면, 상기 각 성분을 넣고, 가열하여 생성되는 알코올을 증류 제거하면서 탈알코올 축합 반응함으로써 행해진다. 반응 온도는, 바람직하게는 50 내지 130℃, 보다 바람직하게는 70 내지 110℃이고, 전체 반응 시간은 바람직하게는 1 내지 15시간이다. 이 반응은 알콕시실란 자체의 중축합반응을 방지하기 위해 실질적으로 무수 조건하에서 행하는 것이 바람직하다. 또한, 이 반응은 반응 시간의 단축을 위해 수산기 함유 에폭시 수지가 증발되지 않는 범위에서, 감압하에 행하는 것도 가능하다.The production of the silane-modified epoxy resin is carried out, for example, by adding each component and performing a dealcohol condensation reaction while distilling off the alcohol generated by heating. The reaction temperature is preferably 50 to 130°C, more preferably 70 to 110°C, and the total reaction time is preferably 1 to 15 hours. This reaction is preferably carried out under substantially anhydrous conditions in order to prevent the polycondensation reaction of the alkoxysilane itself. In addition, this reaction can also be carried out under reduced pressure within a range in which the hydroxyl group-containing epoxy resin is not evaporated in order to shorten the reaction time.
또한, 상기 탈알코올 축합 반응에 있어서는, 반응 촉진을 위해 종래 공지된 촉매 중, 옥실란환을 개환하지 않는 것을 사용할 수 있다. 상기 촉매로는 예를 들면, 리튬, 나트륨, 칼륨, 루비듐, 세슘, 마그네슘, 칼슘, 바륨, 스트론튬, 아연, 알루미늄, 티탄, 코발트, 게르마늄, 주석, 납, 안티몬, 비소, 세륨, 카드뮴, 망간과 같은 금속; 이들 금속의 산화물, 유기산염, 할로겐화물, 알콕시드 등을 들 수 있다. 이들 중에서도, 특히, 유기주석, 유기산 주석이 바람직하고, 구체적으로는 디부틸주석디라우레이트, 옥틸산주석 등이 유효하다.Further, in the dealcohol condensation reaction, among conventionally known catalysts for accelerating the reaction, those that do not open the oxysilane ring may be used. As the catalyst, for example, lithium, sodium, potassium, rubidium, cesium, magnesium, calcium, barium, strontium, zinc, aluminum, titanium, cobalt, germanium, tin, lead, antimony, arsenic, cerium, cadmium, manganese and The same metal; Oxides, organic acid salts, halides and alkoxides of these metals may be mentioned. Among these, in particular, organotin and tin organic acid are preferred, and specifically, dibutyltin dilaurate, tin octylate, and the like are effective.
또한, 상기 반응은 용제 중에서 행할 수도 있다. 용제로는 수산기 함유 에폭시 수지 및 알콕시실란을 용해하고, 또한 이들과 반응하지 않는 유기 용제이면 특별히 제한은 없다. 이러한 유기 용제로는 예를 들면, 디메틸포름아미드, 디메틸아세트아미드, 테트라히드로퓨란, 메틸에틸케톤 등의 비프로톤성 극성 용매를 들 수 있다.In addition, the reaction can also be carried out in a solvent. The solvent is not particularly limited as long as it is an organic solvent that dissolves a hydroxyl group-containing epoxy resin and an alkoxysilane and does not react with them. Examples of such organic solvents include aprotic polar solvents such as dimethylformamide, dimethylacetamide, tetrahydrofuran, and methylethylketone.
실란 변성 에폭시 수지로서 바람직하게 사용되는 시판품으로는 아라카와 화학 공업(주) 제조 상품명: 컴포세란 E-101, E-102, E-201, E-202, E-211, E-212 등을 들 수 있다.Commercial products preferably used as silane-modified epoxy resins include Arakawa Chemical Industries Co., Ltd. product names: Composeran E-101, E-102, E-201, E-202, E-211, E-212, etc. have.
상기 열경화제가 실란 변성 에폭시 수지를 포함하는 경우, 실란 변성 에폭시 수지는 경화성 수지 조성물 고형분 전체 100 중량부에 대해서 0.1 내지 30 중량부로 포함될 수 있다. 상기 범위를 만족하는 경우, 양호한 내약품성, 내열성 및 현상속도를 나타낼 수 있으므로 바람직하다.When the thermosetting agent includes a silane-modified epoxy resin, the silane-modified epoxy resin may be included in an amount of 0.1 to 30 parts by weight based on 100 parts by weight of the total solid content of the curable resin composition. If the above range is satisfied, it is preferable because it can exhibit good chemical resistance, heat resistance, and development speed.
상기 열경화제는 산란층 제조공정 중 현상 후의 화소 도막의 가열처리시(통상 180~250℃ 이하, 바람직한 것은 200~230℃에서 5~40분, 바람직하게는 10~35분), 결합제 수지 중의 카르복실기와 반응하여 결합제 수지의 가교를 증진시켜, 도막의 경도를 향상시킴으로써 산란층의 성능을 더욱 개선한다.The heat curing agent is used for heat treatment of the pixel coating film after development during the scattering layer manufacturing process (usually 180 to 250°C or less, preferably at 200 to 230°C for 5 to 40 minutes, preferably 10 to 35 minutes), and the carboxyl group in the binder resin By reacting with and promoting crosslinking of the binder resin, the hardness of the coating film is improved, thereby further improving the performance of the scattering layer.
상기 열경화제는 경화성 수지 조성물 전체 100 중량부에 대하여, 0.1 내지 20 중량부, 바람직하게는 0.1 내지 10 중량부로 포함될 수 있다. 상기 열경화제가 상기 범위 내로 포함될 경우, 내약품성이 양호해 지고, 내열성 및 현상속도가 양호할 수 있는 이점이 있다.The thermosetting agent may be included in an amount of 0.1 to 20 parts by weight, preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the total curable resin composition. When the thermosetting agent is included within the above range, there is an advantage in that the chemical resistance is good, and the heat resistance and development speed can be good.
용제solvent
상기 용제는 당 업계에서 사용되는 유기용제를 특별한 제한 없이 사용할 수 있다.The solvent may be an organic solvent used in the art without particular limitation.
예를 들면, 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노에틸에테르, 에틸렌글리콜모노프로필에테르,에틸렌글리콜모노부틸에테르 등의 에틸렌글리콜모노알킬에테르류; 디에틸렌글리콜디메틸에테르, 디에틸렌글리콜디에틸에테르, 디에틸렌글리콜디프로필에테르, 디에틸렌글리콜디부틸에테르 등의 디에틸렌글리콜디알킬에테르류; 메틸셀로솔브아세테이트, 에틸셀로솔브아세테이트 등의 에틸렌글리콜알킬에테르아세테이트류; 프로필렌글리콜모노메틸에테르아세테이트, 프로필렌글리콜모노에틸에테르아세테이트, 프로필렌글리콜모노프로필에테르아세테이트, 메톡시부틸아세테이트 및 메톡시펜틸아세테이트 등의 알킬렌글리콜알킬에테르아세테이트류; 벤젠, 톨루엔, 크실렌, 메시틸렌 등의 방향족 탄화수소류; 메틸에틸케톤, 아세톤, 메틸아밀케톤, 메틸이소부틸케톤, 시클로헥사논 등의 케톤류; 에탄올, 프로판올, 부탄올, 헥사놀, 시클로헥산올, 에틸렌글리콜, 글리세린 등의 알코올류; 3-에톡시프로피온산 에틸, 3-메톡시프로피온산 메틸 등의 에스테르류; γ-부티롤락톤 등의 환상 에스테르류 등을 들 수 있으나, 이에 한정되는 것은 아니며, 이들을 각각 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다.For example, ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, and diethylene glycol dibutyl ether; Ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate; Alkylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate and methoxypentyl acetate; Aromatic hydrocarbons such as benzene, toluene, xylene, and mesitylene; Ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; Alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, and glycerin; Esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate; cyclic esters such as γ-butyrolactone may be mentioned, but are not limited thereto, and these may be used alone or in combination of two or more.
상기 예시된 용제들 중 도포성, 건조성 면에서 바람직하게는 비점이 100℃ 내지 200℃인 유기용제를 사용할 수 있다. 예를 들면, 알킬렌글리콜알킬에테르아세테이트류, 케톤류, 3-에톡시프로피온산 에틸이나, 3-메톡시프로피온산 메틸 등의 에스테르류 등을 들 수 있고, 보다 바람직하게는 프로필렌글리콜모노메틸에테르아세테이트, 프로필렌글리콜모노에틸에테르아세테이트, 시클로헥사논, 3-에톡시프로피온산 에틸, 3-메톡시프로피온산 메틸 등을 들 수 있다.Among the exemplified solvents, an organic solvent having a boiling point of 100° C. to 200° C. may be preferably used in terms of coating properties and drying properties. For example, alkylene glycol alkyl ether acetates, ketones, esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate, and the like, more preferably propylene glycol monomethyl ether acetate, propylene Glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, and the like.
상기 용제는 경화성 수지 조성물 전체 100 중량부에 대하여, 60 내지 90 중량부, 바람직하게는 70 내지 85 중량부로 포함될 수 있다. 상기 용제의 함량이 전술한 범위 내로 포함되는 경우, 롤 코터, 스핀 코터, 슬릿 앤드 스핀 코터, 슬릿 코터(다이코터라고도 하는 경우가 있음), 잉크젯 등의 도포 장치로 도포했을 때 도포성이 양호해질 수 있다.The solvent may be included in an amount of 60 to 90 parts by weight, preferably 70 to 85 parts by weight, based on 100 parts by weight of the total curable resin composition. When the content of the solvent is within the above-described range, the coating property will be good when applied with a coating device such as a roll coater, a spin coater, a slit and spin coater, a slit coater (sometimes referred to as a die coater), or inkjet. I can.
첨가제additive
본 발명의 경화성 수지 조성물은 첨가제를 더 포함할 수 있다. The curable resin composition of the present invention may further include an additive.
상기 첨가제의 종류는 사용자의 필요에 따라 정해질 수 있는 것으로 본 발명에서 특별히 한정하는 것은 아니나, 예를 들면, 충진제, 다른 고분자 화합물, 분산제, 밀착 촉진제, 산화 방지제 및 응집 방지제 등을 들 수 있다. The type of the additive may be determined according to the needs of the user and is not particularly limited in the present invention, but examples thereof include fillers, other polymer compounds, dispersants, adhesion promoters, antioxidants and anti-aggregation agents.
상기 충진제는 예를 들면, 유리, 실리카, 알루미나 등을 들 수 있다.The filler may be, for example, glass, silica, or alumina.
상기 다른 고분자 화합물로서는 구체적으로 에폭시 수지, 말레이미드 수지 등의 경화성 수지, 폴리비닐알코올, 폴리아크릴산, 폴리에틸렌글리콜모노알킬에테르, 폴리플루오로알킬아크릴레이트, 폴리에스테르, 폴리우레탄 등의 열가소성 수지 등을 들 수 있다.Specific examples of the other high molecular compound include curable resins such as epoxy resins and maleimide resins, thermoplastic resins such as polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, and polyurethane. I can.
상기 분산제는 함께 포함되는 산란입자를 보다 효과적으로 분산시키기 위해 더 포함될 수 있으며, 예를 들면, 시판되는 계면 활성제를 이용할 수 있다. 구체적으로 실리콘계, 불소계, 에스테르계, 양이온계, 음이온계, 비이온계, 양성 등의 계면 활성제 등을 들 수 있다. 이들은 각각 단독으로 또는 2종 이상을 조합하여 사용될 수 있다. 상기의 계면 활성제로서, 예를 들면 폴리옥시에틸렌알킬에테르류, 폴리옥시에틸렌알킬페에테르류, 폴리에틸렌글리콜 디에스테르류, 소르비탄 지방상 에스테르류, 지방산 변성 폴리에스테르류, 3급아민 변성 폴리우레탄류, 폴리에틸렌이민류 등이 있으며 이외에, 상품명으로 KP(신에쯔 가가꾸 고교㈜ 제조), 폴리플로우(POLYFLOW)(교에이샤 가가꾸㈜ 제조), 에프톱(EFTOP)(토켐 프로덕츠사 제조), 메가팩(MEGAFAC)(다이닛본 잉크 가가꾸 고교㈜ 제조), 플로라드(Flourad)(스미또모 쓰리엠㈜ 제조), 아사히가드(Asahi guard), 서플(Surflon)(이상, 아사히글라스㈜ 제조), 솔스퍼스(SOLSPERSE)(제네까㈜ 제조), EFKA(EFKA 케미칼스사 제조), PB 821(아지노모또㈜ 제조) 등을 들 수 있다.The dispersant may be further included in order to more effectively disperse the scattering particles included together, and for example, a commercially available surfactant may be used. Specifically, surfactants such as silicone-based, fluorine-based, ester-based, cationic, anionic, nonionic and amphoteric are mentioned. Each of these may be used alone or in combination of two or more. As the above surfactant, for example, polyoxyethylene alkyl ethers, polyoxyethylene alkyl peethers, polyethylene glycol diesters, sorbitan fatty esters, fatty acid modified polyesters, tertiary amine-modified polyurethanes , Polyethyleneimines, etc. In addition, KP (manufactured by Shin-Etsu Chemical Co., Ltd.), POLYFLOW (manufactured by Kyoeisha Chemical Co., Ltd.), EFTOP (manufactured by Tochem Products), Megafac (manufactured by Dai Nippon Ink Kagaku Kogyo Co., Ltd.), Flourad (manufactured by Sumitomo 3M), Asahi guard, Surflon (manufactured by Asahi Glass), Sol SOLSPERSE (manufactured by Geneva Corporation), EFKA (manufactured by EFKA Chemicals Corporation), PB 821 (manufactured by Ajinomoto Corporation), and the like.
상기 밀착 촉진제로서, 예를 들면 비닐트리메톡시실란, 비닐트리에톡시실란, 비닐트리스(2-메톡시에톡시)실란, N-(2-아미노에틸)-3-아미노프로필메틸디메톡시실란, N-(2-아미노에틸)-3-아미노프로필트리메톡시실란, 3-아미노프로트리에톡시실란, 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필메틸디메톡시실란, 2-(3,4-에폭시시클로헥실)에틸트리메톡시실란, 3-클로로프로필메틸디메톡시실란, 3-클로로프로필트리메톡시실란, 3-메타크릴옥시프로필트리메톡시실란, 3-머캅토프로필트리메톡시실란 등을 들 수 있다. As the adhesion promoter, for example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminoprotriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2 -(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyl Trimethoxysilane, etc. are mentioned.
상기 응집 방지제로서는 구체적으로 폴리아크릴산 나트륨 등을 들 수 있다.Specific examples of the anti-aggregation agent include sodium polyacrylate.
상기 첨가제 중에서 함량이 예시되지 않은 첨가제들의 경우 본 발명의 효과를 저해하지 않는 범위에서 당업자가 적절히 추가하여 사용이 가능하다. 예컨대 상기 첨가제는 상기 경화성 수지 조성물 전체 100 중량부에 대하여 0.05 내지 10 중량부, 바람직하게는 0.1 내지 10 중량부, 더욱 바람직하게는 0.1 내지 5 중량부로 사용할 수 있으나, 이에 한정되는 것은 아니다.In the case of additives whose content is not exemplified among the additives, those skilled in the art may appropriately add and use them within a range that does not impair the effect of the present invention. For example, the additive may be used in an amount of 0.05 to 10 parts by weight, preferably 0.1 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the curable resin composition, but is not limited thereto.
본 발명의 경화성 수지 조성물은 첨가제로서 산화 방지제를 포함할 수 있다. 상기 산화 방지제를 더 포함하는 경우, 경화물을 형성하기 위한 공정 중 포스트 베이크 시 열로 인한 노화를 방지하고 색상을 보존하는 효과를 기대할 수 있는 이점이 있다. The curable resin composition of the present invention may contain an antioxidant as an additive. When the antioxidant is further included, there is an advantage of preventing aging due to heat during post-baking during a process for forming a cured product and preserving color.
상기 산화 방지제는 예를 들면, 페놀계 산화방지제, 인계 산화방지제 및 황계 산화방지제로 이루어진 군으로부터 선택되는 하나 이상을 포함할 수 있으며, 이 경우 공정 중 고온에서 발생할 수 있는 색변 현상 또는 디스플레이 제작 후 광원에 의해 야기될 수 있는 황변 발생을 억제시킬 수 있다.The antioxidant may include, for example, one or more selected from the group consisting of phenolic antioxidants, phosphorus antioxidants, and sulfur antioxidants, and in this case, a color change phenomenon that may occur at high temperatures during the process or a light source after display production It can suppress the occurrence of yellowing that can be caused by.
상기 페놀계 산화방지제의 종류는 특별히 제한되지는 않지만, 구체적인 예로는, 3,9-비스[2-〔3-(3-t-부틸-4-히드록시-5-메틸페닐)프로피오닐옥시〕-1,1-디메틸에톡시]-2,4,8,10-테트라옥사스피로[5.5]운데칸, 펜타에리트리틸·테트라키스[3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트], 1,3,5,-트리메틸-2,4,6,-트리스(3'5'-디-t-부틸-4-히드록시벤질)벤젠, 트리에틸렌글리콜-비스[3-(3-t-부틸-5-메틸-4-히드록시페닐)프로피오네이트], 4,4'-티오비스(6-t-부틸-3-메틸페놀), 트리스-(3,5-디-t-부틸-4-히드록시벤질)-이소시아누레이트, 1,3,5-트리스(4-t-부틸-3-히드록시-2,6-디메틸벤질)-이소시아누레이트, 1,6-헥산디올-비스[3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트], 2,2-티오-디에틸렌비스[3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트], N,N'-헥사메틸렌비스(3,5-디-t-부틸-4-히드록시-히드로신남아미드), 1,3,5-트리메틸-2,4,6-트리스(3,5-디-t-부틸-4-히드록시벤질)벤젠, 2,4-비스[(옥틸티오)메틸]-O-크레졸,1,6-헥산디올-비스-[3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트], 옥타데실 3-(3,5-디-tert-부틸-4-히드록시페놀)프로피오네이트, 2,2'-메틸렌비스(4-메틸-6-t-부틸페놀), 4,4'-부틸리덴-비스(3-메틸-6-t-부틸페놀), 1,1,3-트리스(2-메틸-4-히드록시-5-t-부틸페닐)부탄, 1,3,5-트리스(4-히드록시벤질)벤젠및테트라키스[메틸렌-3-(3,5'-디-t-부틸-4'-히드록시페닐프로피오네이트)]메탄 등을 들 수 있다.The kind of the phenolic antioxidant is not particularly limited, but a specific example is 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]- 1,1-dimethylethoxy]-2,4,8,10-tetraoxaspiro[5.5]undecane, pentaerythrityl tetrakis[3-(3,5-di-t-butyl-4-hyd) Oxyphenyl)propionate], 1,3,5,-trimethyl-2,4,6,-tris(3'5'-di-t-butyl-4-hydroxybenzyl)benzene, triethylene glycol-bis [3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 4,4'-thiobis(6-t-butyl-3-methylphenol), tris-(3, 5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl)-isocyanu Rate, 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,2-thio-diethylenebis[3-(3, 5-di-t-butyl-4-hydroxyphenyl)propionate], N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), 1, 3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, 2,4-bis[(octylthio)methyl]-O-cresol,1 ,6-hexanediol-bis-[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], octadecyl 3-(3,5-di-tert-butyl-4- Hydroxyphenol) propionate, 2,2'-methylenebis(4-methyl-6-t-butylphenol), 4,4'-butylidene-bis(3-methyl-6-t-butylphenol) , 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 1,3,5-tris(4-hydroxybenzyl)benzene and tetrakis[methylene-3- (3,5'-di-t-butyl-4'-hydroxyphenylpropionate)]methane, etc. are mentioned.
상기 페놀계 산화방지제 중, 내열성 및 내열 변색 방지 측면에서 3,9-비스[2-〔3-(3-t-부틸-4-히드록시-5-메틸페닐)프로피오닐옥시〕-1,1-디메틸에톡시]-2,4,8,10-테트라옥사사스피로[5.5]운데칸, 1,3,5,-트리메틸-2,4,6,-트리스(3'5'-디-t-부틸-4-히드록시벤질)벤젠, 펜타에리트리틸·테트라키스[3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트], 트리에틸렌글리콜-비스[3-(3-t-부틸-5-메틸-4-히드록시페닐)프로피오네이트], 4,4'-티오비스(6-t-부틸-3-메틸페놀), 트리스-(3,5-디-t-부틸-4-히드록시벤질)-이소시아누레이트, 1,3,5-트리스(4-t-부틸-3-히드록시-2,6-디메틸벤질)-이소시아누레이트, 1,6-헥산디올-비스[3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트], 2,2-티오-디에틸렌비스[3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트], N,N'-헥사메틸렌비스(3,5-디-t-부틸-4-히드록시-히드로신남아미드), 1,3,5-트리메틸-2,4,6-트리스(3,5-디-t-부틸-4-히드록시벤질)벤젠 및 2,4-비스[(옥틸티오)메틸]-O-크레졸이 바람직하다.Among the above phenolic antioxidants, 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1- in terms of heat resistance and heat discoloration prevention Dimethylethoxy]-2,4,8,10-tetraoxaspiro[5.5]undecane, 1,3,5,-trimethyl-2,4,6,-tris(3'5'-di-t- Butyl-4-hydroxybenzyl)benzene, pentaerythrityl tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], triethylene glycol-bis[3- (3-t-butyl-5-methyl-4-hydroxyphenyl) propionate], 4,4'-thiobis(6-t-butyl-3-methylphenol), tris-(3,5-di -t-butyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl)-isocyanurate, 1 ,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,2-thio-diethylenebis[3-(3,5-di -t-butyl-4-hydroxyphenyl)propionate], N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), 1,3,5 -Trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene and 2,4-bis[(octylthio)methyl]-O-cresol are preferred.
시판품으로는 Irganox 1010 (BASF 제조), Sumilizer BBM-S (스미토모 화학 제조), ADK STAB AO-80 (ADEKA 제조), Sumilizer GP (스미토모 화학 제조), Irganox 1035 (BASF 제조) 등을 들 수 있다.Commercially available products include Irganox 1010 (manufactured by BASF), Sumilizer BBM-S (manufactured by Sumitomo Chemical), ADK STAB AO-80 (manufactured by ADEKA), Sumilizer GP (manufactured by Sumitomo Chemical), Irganox 1035 (manufactured by BASF), and the like.
상기 인계 산화방지제의 종류는 특별히 제한되지는 않지만, 구체적인 예로는, 3,9-비스(2,6-디-tert-부틸-4-메틸페녹시)-2,4,8,10-테트라옥사-3,9-디포스파스피로[5.5]운데칸, 디이소데실펜타에리트리톨디포스파이트, 비스(2,4-디-t-부틸페닐)펜타에리트리톨디포스파이트, 2,2'-메틸렌비스(4,6-디-t-부틸-1-페닐옥시)(2-에틸헥실옥시)포스포러스, 6-[3-(3-t-부틸-4-히드록시-5-메틸페닐)프로폭시]-2,4,8,10-테트라-t-부틸디벤즈[d,f][1,3,2]디옥사포스페핀, 트리페닐포스파이트, 디페닐이소데실포스파이트, 페닐디이소데실포스파이트, 4,4'-부틸리덴-비스(3-메틸-6-t-부틸페닐디트리데실)포스파이트, 옥타데실포스파이트, 트리스(노닐페닐)포스파이트, 9,10-디히드로-9-옥사-10-포스파페난트렌-10-옥사이드, 10-(3,5-디-t-부틸-4-히드록시벤질)-9,10-디히드로-9-옥사-10-포스파페난트렌-10-옥사이드, 10-데실옥시-9,10-디히드로-9-옥사-10-포스파페난트렌-10-옥사이드, 트리스(2,4-디-t-부틸페닐)포스파이트, 시클릭네오펜탄테트라일비스(2,4-디-t-부틸페닐)포스파이트, 시클릭네오펜탄테트라일비스(2,6-디-t-부틸페닐)포스파이트, 2,2-메틸렌비스(4,6-디-t-부틸페닐)옥틸포스파이트,트리스(2,4-디-t-부틸페닐)포스파이트, 테트라키스(2,4-디-t-부틸페닐)[1,1-비페닐]-4,4'디일비스포스포나이트, 비스[2,4-비스(1,1-디메틸에틸)-6-메틸페닐]에틸에스테르, 포스폰산 등을 들 수 있다.The kind of the phosphorus antioxidant is not particularly limited, but a specific example is 3,9-bis(2,6-di-tert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa -3,9-diphosphaspiro[5.5]undecane, diisodecylpentaerythritol diphosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, 2,2'-methylenebis( 4,6-di-t-butyl-1-phenyloxy)(2-ethylhexyloxy)phosphorus, 6-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propoxy] -2,4,8,10-tetra-t-butyldibenz[d,f][1,3,2]dioxaphosphine, triphenylphosphite, diphenylisodecylphosphite, phenyldiisodecylphosphite Pite, 4,4′-butylidene-bis(3-methyl-6-t-butylphenylditridecyl)phosphite, octadecylphosphite, tris(nonylphenyl)phosphite, 9,10-dihydro- 9-oxa-10-phosphaphenanthrene-10-oxide, 10-(3,5-di-t-butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphafe Nanthrene-10-oxide, 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, tris(2,4-di-t-butylphenyl)phosphite , Cyclic neopentanetetraylbis(2,4-di-t-butylphenyl)phosphite, Cyclic neopentanetetraylbis(2,6-di-t-butylphenyl)phosphite, 2,2-methylene Bis(4,6-di-t-butylphenyl)octylphosphite, tris(2,4-di-t-butylphenyl)phosphite, tetrakis(2,4-di-t-butylphenyl)[1, 1-biphenyl]-4,4'diylbisphosphonate, bis[2,4-bis(1,1-dimethylethyl)-6-methylphenyl]ethyl ester, phosphonic acid, and the like.
상기 인계 산화방지제 중 내열성 및 내열 변색 방지 측면에서, 2,2'-메틸렌비스(4,6-디-t-부틸-1-페닐옥시)(2-에틸헥실옥시)포스포러스, 3,9-비스(2,6-디-tert-부틸-4-메틸페녹시)-2,4,8,10-테트라옥사-3,9-디포스파스피로[5.5]운데칸 및 6-[3-(3-t-부틸-4-히드록시-5-메틸페닐)프로폭시]-2,4,8,10-테트라-t-부틸디벤즈[d,f][1,3,2]디옥사포스페핀 등이 바람직하다.In terms of heat resistance and heat discoloration prevention among the phosphorus antioxidants, 2,2'-methylenebis(4,6-di-t-butyl-1-phenyloxy)(2-ethylhexyloxy)phosphorus, 3,9 -Bis(2,6-di-tert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane and 6-[3-( 3-t-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-t-butyldibenz[d,f][1,3,2]dioxaphosphepine And the like are preferred.
상기 황계 산화방지제의 종류는 특별히 제한되지는 않지만, 구체적인 예로는, 2,2-비스({[3-(도데실티오)프로피오닐]옥시}메틸)-1,3-프로판디일-비스[3-(도데실티오)프로피오네이트], 2-메르캅토벤즈이미다졸, 디라우릴-3,3'-티오디프로피오네이트, 디미리스틸-3,3'-티오디프로피오네이트, 디스테아릴-3,3'-티오디프로피오네이트, 펜타에리트리틸-테트라키스(3-라우릴티오프로피오네이트), 2-메르캅토벤즈이미다졸 등을 들 수 있다.The kind of the sulfur-based antioxidant is not particularly limited, but a specific example is 2,2-bis({[3-(dodecylthio)propionyl]oxy}methyl)-1,3-propanediyl-bis[3 -(Dodecylthio)propionate], 2-mercaptobenzimidazole, dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, distea Reel-3,3'-thiodipropionate, pentaerythrityl-tetrakis (3-laurylthiopropionate), 2-mercaptobenzimidazole, etc. are mentioned.
상기 황계 산화 방지제 중 내열성 및 내열 변색 방지 측면에서, 2,2-비스({[3(도데실티오)프로피오닐]옥시}메틸)-1,3-프로판디일-비스[3-(도데실티오)프로피오네이트], 2-메르캅토벤즈이미다졸 등이 바람직하다.In terms of heat resistance and heat discoloration prevention among the sulfur-based antioxidants, 2,2-bis({[3(dodecylthio)propionyl]oxy}methyl)-1,3-propanediyl-bis[3-(dodecylthio ) Propionate], 2-mercaptobenzimidazole, and the like are preferable.
상기 산화 방지제는 경화성 수지 조성물의 전체 고형분 총 100 중량부를 기준으로 0.1 내지 30 중량부, 바람직하게는 0.5 내지 20 중량부로 포함될 수 있다. 상기 산화방지제의 함량이 상기 범위를 만족하는 경우 발광 강도 저하 문제 해결 측면에서 유리하다.The antioxidant may be included in an amount of 0.1 to 30 parts by weight, preferably 0.5 to 20 parts by weight, based on 100 parts by weight of the total solid content of the curable resin composition. When the content of the antioxidant satisfies the above range, it is advantageous in terms of solving the problem of lowering the emission intensity.
본 발명의 경화성 수지 조성물의 제조 방법은 당 업계에 알려진 통상적인 방법으로 제조될 수 있는 것으로, 본 발명에서 특별히 한정하는 것은 아니나, 일 예를 들면, 하기와 같은 방법으로 제조될 수 있다.The method for preparing the curable resin composition of the present invention may be prepared by a conventional method known in the art, and is not particularly limited in the present invention, but may be prepared by, for example, the following method.
산란입자를 미리 용제와 혼합하여 평균입경이 30 내지 300nm가 될 때까지 비드 밀 등을 이용하여 분산시킨다. 이때, 필요에 따라 분산제를 추가로 사용할 수 있고, 결합제 수지의 일부 또는 전부가 배합될 수도 있다. 얻어진 분산액(이하, 밀 베이스라고 하는 경우도 있음)에 결합제 수지의 나머지, 열경화제, 중합성 화합물, 필요에 따라 사용되는 그밖의 성분과 필요에 따라 추가의 용제를 소정의 농도가 되도록 더 첨가하여 목적하는 경화성 수지 조성물을 얻을 수 있다.The scattering particles are mixed with a solvent in advance and dispersed using a bead mill or the like until the average particle diameter is 30 to 300 nm. At this time, if necessary, a dispersant may be additionally used, and some or all of the binder resin may be blended. To the obtained dispersion (hereinafter, sometimes referred to as mill base), the remainder of the binder resin, a thermosetting agent, a polymerizable compound, other components used as necessary, and additional solvents as necessary are further added to a predetermined concentration. A desired curable resin composition can be obtained.
<산란층><scattering layer>
또한, 본 발명은 본 발명에 따른 경화성 수지 조성물의 경화물을 포함하는 산란층을 제공한다. In addition, the present invention provides a scattering layer comprising a cured product of the curable resin composition according to the present invention.
본 발명에 따른 산란층은 광원으로부터 방출되는 광을 균일하게 투과시킴으로써 광원이 위치한 곳과 위치하지 않은 곳 간의 색재현율 차이를 줄일 수 있는 효과를 제공한다.The scattering layer according to the present invention uniformly transmits light emitted from a light source, thereby providing an effect of reducing a difference in color reproducibility between a location where a light source is located and a location where the light source is not located.
구체적으로, 고색재현과 대형화를 위해 액정표시장치 패널의 하부면에 하나 이상의 광원을 배치시켜 화상표시장치 내 패널에 전면적으로 빛을 공급하 는 직하형 구조가 사용되고 있는데, 이 경우 광원이 표시패널 하부에 전면적으로 배치되어 있는 구조가 아니라, 1개 이상의 광원이 특정 간격을 두고 배치되어 있는 구조로서, 광원이 위치한 곳과 위치하지 않은 곳 간의 투과율 차이가 발생하게 된다. 따라서, 본 발명은 상기 화상표시장치 내 패널과 광원의 사이에 본 발명에서 제시하는 산란층을 포함시킴으로써 광원으로부터 방출되는 광을 산란시켜 패널 전체의 투과율을 일정수준으로 균일하게 조절할 수 있는 이점이 있다. 특히, 본 발명의 경화성 수지 조성물의 경화물을 포함하는 산란층의 경우 산란효과가 우수하여 투과율 조절에 보다 용이한 이점이 있다.Specifically, in order to reproduce high color and increase the size, a direct type structure is used in which one or more light sources are placed on the lower surface of the LCD panel to supply light to the entire panel inside the image display device. In this case, the light source is used under the display panel. In a structure in which one or more light sources are disposed at specific intervals, not a structure that is entirely disposed in the light source, a difference in transmittance occurs between the place where the light source is located and the place where the light source is not located. Therefore, the present invention has the advantage of uniformly adjusting the transmittance of the entire panel to a certain level by scattering the light emitted from the light source by including the scattering layer proposed in the present invention between the panel in the image display device and the light source. . In particular, in the case of a scattering layer including a cured product of the curable resin composition of the present invention, the scattering effect is excellent, and thus there is an advantage in that it is easier to control transmittance.
본 발명의 산란층 형성 방법은 당 업계에 알려진 통상의 방법을 적용할 수 있는 것으로 그 방법을 특별히 한정하지는 않으며, 일반적으로 열경화를 통한 도막의 형성방법을 통해 제조될 수 있지만, 필요에 따라 광경화 과정이 추가로 도입될 수도 있다.The method of forming the scattering layer of the present invention is not specifically limited to a method known in the art, and may be generally manufactured through a method of forming a coating film through thermal curing. Additional processes may be introduced.
<화상표시장치><Image display device>
또한, 본 발명은 본 발명에 따른 산란층을 포함하는 화상표시장치를 제공한다. Further, the present invention provides an image display device including the scattering layer according to the present invention.
상기 화상표시장치는 예를 들면, 상기 화상 표시 장치는 구체적으로, 액정 디스플레이(액정표시장치; LCD), 유기 EL 디스플레이(유기 EL 표시장치), 퀀텀닷 디스플레이, 액정 프로젝터, 게임기용 표시장치, 휴대전화 등의 휴대단말용 표시장치, 디지털 카메라용 표시장치, 카 네비게이션용 표시장치 등의 표시장치 등을 들 수 있으며, 본 발명의 일 실시형태에 따른 화상표시장치는 퀀텀닷 디스플레이일 수 있다.The image display device is, for example, the image display device is specifically, a liquid crystal display (liquid crystal display; LCD), an organic EL display (organic EL display), a quantum dot display, a liquid crystal projector, a display device for a game machine, a portable A display device such as a display device for a portable terminal such as a telephone, a display device for a digital camera, a display device for car navigation, etc. may be exemplified, and the image display device according to an embodiment of the present invention may be a quantum dot display.
상기 화상표시장치는 광원 등과 같은 발광 장치, 도광판, 컬러필터를 포함하는 액정표시부 등과 같이 통상적으로 화상표시장치에 포함될 수 있는 그 밖의 구성들을 포함할 수 있으며, 본 발명에서 이를 한정하지는 않는다.The image display device may include a light-emitting device such as a light source, a light guide plate, a liquid crystal display including a color filter, and the like, and other components that can be included in the image display device, and the present invention is not limited thereto.
본 발명에 따른 화상표시장치는 본 발명에 따른 산란층을 포함함으로써 광원으로부터 방출되는 광을 균일하게 투과시킴으로써 광원이 위치한 곳과 위치하지 않은 곳 간의 색재현율 차이를 줄일 수 있으며, 이를 통해 화상표시장치 전반적으로 고색재현이 가능한 이점이 있다.The image display device according to the present invention can reduce the difference in color reproducibility between the place where the light source is located and the place where the light source is not located by uniformly transmitting light emitted from the light source by including the scattering layer according to the present invention. Overall, there is an advantage that high color reproduction is possible.
이하, 실시예를 통하여 본 발명을 보다 상세히 설명한다. 그러나 하기의 실시예는 본 발명을 더욱 구체적으로 설명하기 위한 것으로서, 본 발명의 범위가 하기의 실시예에 의하여 한정되는 것은 아니다. 이하의 실시예 및 비교예에서 함량을 나타내는 "%" 및 "부"는 특별히 언급하지 않는 한 중량 기준이다.Hereinafter, the present invention will be described in more detail through examples. However, the following examples are for explaining the present invention in more detail, and the scope of the present invention is not limited by the following examples. In the following Examples and Comparative Examples, "%" and "parts" indicating the content are based on weight unless otherwise specified.
<실시예><Example>
합성예 1: 결합제 수지의 합성Synthesis Example 1: Synthesis of binder resin
4구 플라스크 중에, 하기 화학식 9로 표시되는 비스페놀플루오렌형 에폭시 모노머 235g(에폭시 당량 235)과 테트라메틸암모늄클로라이드 110㎎, 2,6-디-tert부틸-4-메틸페놀 100㎎ 및 아크릴산 72.0g를, 25㎖/분의 속도로 공기를 송풍하면서 90℃부터 100℃로 가열하여 용해시켰다.In a 4-neck flask, 235 g of bisphenol fluorene-type epoxy monomer represented by the following formula (9) (epoxy equivalent 235), 110 mg of tetramethylammonium chloride, 100 mg of 2,6-di-tertbutyl-4-methylphenol, and 72.0 g of acrylic acid Was dissolved by heating from 90° C. to 100° C. while blowing air at a rate of 25 ml/min.
[화학식 9][Formula 9]
다음에, 이 용액을 백탁한 상태인채로, 120℃까지 천천히 승온시켜서 완전히 용해시켰다. 이때 용액이 점차 투명하게 되어 가는 것을 확인하며 교반을 계속하였다. 산가가 1.0 ㎎K0H/g 미만이 될 때까지 약 12시간 가열 교반을 계속하였다. 그 후, 실온까지 냉각하여, 무색 투명하고 고체상의 하기 화학식 10으로 표시되는 비스페놀플루오렌형 에폭시아크릴레이트가 얻어졌다.Next, the solution was slowly heated up to 120° C. in a cloudy state to completely dissolve. At this time, stirring was continued while confirming that the solution gradually became transparent. Heating and stirring was continued for about 12 hours until the acid value became less than 1.0 mgK0H/g. Then, it cooled to room temperature, and the colorless, transparent and solid bisphenol fluorene type epoxy acrylate represented by the following formula (10) was obtained.
[화학식 10][Formula 10]
그 후, 이와 같이 얻어진 비스페놀플루오렌형 에폭시아크릴레이트 307.0g에, 프로필렌글리콜모노에틸에테르아세테이트(PGMEA) 600g를 가하여 용해시킨 후, 벤조페논테트라카복시산 2무수물 80.5g, 및 브롬화테트라에틸암모늄 1g을 혼합하고, 110℃부터 115℃로 6시간 반응시켰다. 산무수물기의 소실을 확인 한 후, 1,2,3,6-테트라하이드로무수프탈산 38.0g를 혼합하고, 90℃로 6시간 반응시켜서 카도계 결합제 수지를 얻었다. 이때, 산무수물기의 소실은 IR 스펙트럼에 의해 확인하였고 제조된 카도계 결합제 수지는 5,300g/mol의 중량평균분자량과, 123 mgKOH/g의 산가를 가지는 것을 확인하였다.Thereafter, to 307.0 g of the bisphenol fluorene-type epoxy acrylate thus obtained, 600 g of propylene glycol monoethyl ether acetate (PGMEA) was added and dissolved, and then 80.5 g of benzophenone tetracarboxylic dianhydride and 1 g of tetraethyl ammonium bromide were added. It mixed and reacted at 110 degreeC to 115 degreeC for 6 hours. After confirming the disappearance of the acid anhydride group, 38.0 g of 1,2,3,6-tetrahydrophthalic anhydride was mixed, and reacted at 90° C. for 6 hours to obtain a cardo-based binder resin. At this time, the disappearance of the acid anhydride group was confirmed by the IR spectrum, and it was confirmed that the prepared Cardo-based binder resin had a weight average molecular weight of 5,300 g/mol and an acid value of 123 mgKOH/g.
실시예 1~7 및 비교예 1~3: 경화성 수지 조성물의 제조Examples 1 to 7 and Comparative Examples 1 to 3: Preparation of curable resin composition
하기 표 1에 기재된 각 구성 및 함량으로 경화성 수지 조성물을 제조하였다.A curable resin composition was prepared with each composition and content shown in Table 1 below.
A1: TiO2(TR-88, 훈츠만사 제조)A1: TiO 2 (TR-88, manufactured by Huntsman)
A2: SiO2(E+ 508, 에이비씨 나노테크사 제조)A2: SiO 2 (E+ 508, manufactured by ABC Nanotech)
A3: ZnO(SG-ZNO30, 석경에이티사 제조)A3: ZnO (SG-ZNO30, manufactured by Seokkyung AT)
A4: ZrO2(SG-ZRO30SPM, 석경에이티사 제조)A4: ZrO 2 (SG-ZRO30SPM, manufactured by Seokkyung AT)
B: 합성예 1의 결합제 수지B: Binder resin of Synthesis Example 1
C: 디펜타에리트리톨헥사아크릴레이트(DPHA, Kayarad DPHA, 닛본 카야꾸㈜ 제조)C: Dipentaerythritol hexaacrylate (DPHA, Kayarad DPHA, manufactured by Nippon Kayaku Co., Ltd.)
D: 에폭시 수지(스미 에폭시 ESCN 195XL, 스미토모 카가쿠 고교(주) 제조)D: Epoxy resin (Sumi Epoxy ESCN 195XL, manufactured by Sumitomo Chemical Industry Co., Ltd.)
E1: 분산제 (DISPERBYK-110, BYK사 제조)E1: Dispersant (DISPERBYK-110, manufactured by BYK)
E2: 산화방지제 (Sumilizer GP, 스미토모 화학 제조)E2: Antioxidant (Sumilizer GP, manufactured by Sumitomo Chemical)
F: 프로필렌글리콜모노메틸에테르아세테이트(PGMEA)F: Propylene glycol monomethyl ether acetate (PGMEA)
제조예: 산란층의 제조Preparation Example: Preparation of scattering layer
5cmX5cm의 유리기판(코닝社)을 중성세제 및 물로 세정 후 건조하였다. 상기 유리기판 상에 상기 실시예 및 비교예에서 제조된 경화성 수지 조성물 각각을 최종 막 두께가 2.0㎛가 되도록 스핀 코팅을 하고, 80 내지 120℃에서 1 내지 2분간 선 소성 및 건조하여 용제를 제거하였다. 그런 다음, 150 내지 250℃에서 10 내지 30분간 후 소성하여 산란층을 제조하였다.A 5cmX5cm glass substrate (Corning) was washed with neutral detergent and water, and then dried. Each of the curable resin compositions prepared in Examples and Comparative Examples was spin-coated on the glass substrate so that the final film thickness became 2.0 μm, and the solvent was removed by pre-baking and drying at 80 to 120° C. for 1 to 2 minutes. . Then, after 10 to 30 minutes at 150 to 250 ℃ firing to prepare a scattering layer.
<실험예><Experimental Example>
실험예 1: 휘도 평가Experimental Example 1: Evaluation of luminance
상기에서 제조된 산란층을 Blue 광원(XLamp XR-E LED, Royal blue 450, Cree 社)상부에 위치 시킨 후 휘도 측정기(CAS140CT Spectrometer, Instrument systems 社)를 이용하여, 시야각 0° 및 60°에서의 휘도를 측정하였다. 실시예 1의 경화성 수지 조성물을 이용하여 제조된 산란층의 휘도를 기준(100%)으로, 나머지 실시예 및 비교예의 경화성 수지 조성물을 이용하여 제조된 각 산란층의 휘도를 비교하였으며, 그 결과를 하기 표 2에 기재하였다.After placing the scattering layer prepared above on a blue light source (XLamp XR-E LED, Royal blue 450, Cree Company), using a luminance meter (CAS140CT Spectrometer, Instrument Systems Company), at
실험예 2: 표면 상태 평가Experimental Example 2: Surface condition evaluation
상기에서 제조된 산란층의 표면 상태를 OM장비(ECLIPSE LV100POL 니콘사)를 통해 관찰하였다. 도 1은 산란층의 표면 상태를 평가하는 기준을 나타낸 도이다. 상기 도 1을 기준으로 각 산란층의 표면상태를 O 및 X로 판단하고, 그 결과를 하기 표 2에 기재하였다.The surface condition of the scattering layer prepared above was observed through an OM equipment (ECLIPSE LV100POL Nikon). 1 is a diagram showing a criterion for evaluating a surface condition of a scattering layer. Based on FIG. 1, the surface conditions of each scattering layer were determined as O and X, and the results are shown in Table 2 below.
(%)0° luminance
(%)
휘도(%)60°
Luminance (%)
상기 표 2를 참조하면, 산란입자로 TiO2 및 SiO2를 포함하는 본원 실시예 1 내지 7의 경우, 휘도 및 표면상태 평가에서 모두 우수한 효과를 나타내는 것을 확인할 수 있다.Referring to Table 2, in the case of Examples 1 to 7 of the present application including TiO 2 and SiO 2 as scattering particles, it can be seen that excellent effects are exhibited in both luminance and surface condition evaluation.
반면, 산란입자로 TiO2 만을 포함하는 비교예 1의 경우, 시야각 0° 에서의 휘도가 실시예 1 대비 84.8%로 현저히 저하된 것을 확인할 수 있고, 산란입자로 TiO2 및 SiO2 조합이 아닌 TiO2 및 ZnO 조합 또는 TiO2 및 ZrO2 조합을 각각 사용하는 비교예 2 및 3의 경우, 산란층의 표면상태가 불량한 것을 확인할 수 있다. On the other hand, in the case of Comparative Example 1 containing only TiO 2 as scattering particles, it can be seen that the luminance at a viewing angle of 0° was significantly reduced to 84.8% compared to Example 1, and TiO 2 and SiO 2 as the scattering particles were not combined. In the case of Comparative Examples 2 and 3 using 2 and ZnO combinations or TiO 2 and ZrO 2 combinations, respectively, it can be seen that the surface condition of the scattering layer is poor.
이와 같이, 산란입자로서 TiO2 및 SiO2를 포함하는 경화성 수지 조성물을 사용하여 제조된 산란층은 광원으로부터 방출되는 광의 산란효과 및 투과율이 향상되고, 이에 따라 우수한 휘도를 나타낼 수 있음을 확인할 수 있다.As such, it can be seen that the scattering layer prepared using a curable resin composition containing TiO 2 and SiO 2 as scattering particles improves the scattering effect and transmittance of light emitted from the light source, and thus exhibits excellent luminance. .
Claims (13)
상기 산란입자는 TiO2 및 SiO2를 포함하는 것인 경화성 수지 조성물.As a curable resin composition containing scattering particles, a binder resin, a polymerizable compound, a thermosetting agent and a solvent,
The scattering particles are the curable resin composition containing TiO 2 and SiO 2 .
상기 TiO2 및 SiO2는 0.1 내지 50 : 1 의 중량비로 포함되는 것을 특징으로 하는 경화성 수지 조성물.The method according to claim 1,
The TiO 2 and SiO 2 Curable resin composition, characterized in that contained in a weight ratio of 0.1 to 50: 1.
상기 산란입자는 평균 입경이 10 내지 1000nm 인 금속 산화물을 포함하는 것을 특징으로 하는 경화성 수지 조성물.The method according to claim 1,
The scattering particles are curable resin composition comprising a metal oxide having an average particle diameter of 10 to 1000nm.
상기 결합제 수지는 카도계 바인더 수지를 포함하는 것을 특징으로 하는 경화성 수지 조성물.The method according to claim 1,
The binder resin is a curable resin composition comprising a cardo-based binder resin.
상기 카도계 바인더 수지는 하기 화학식 1로 표시되는 화합물을 포함하는 것을 특징으로 하는 경화성 수지 조성물.
[화학식 1]
(상기 화학식 1에서,
X는 하기 화학식 2로 표시되는 기이고,
Y는 각각 독립적으로 디카르복실산 무수물의 잔기이며,
Z는 각각 독립적으로 테트라카르복실산 2무수물의 잔기이고,
l은 4 내지 20의 정수이다.)
[화학식 2]
(상기 화학식 2에서, *은 탄소 원자 또는 산소 원자와의 결합손을 의미한다.)The method of claim 4,
The cardo-based binder resin is a curable resin composition, characterized in that it comprises a compound represented by the following formula (1).
[Formula 1]
(In Formula 1,
X is a group represented by the following formula (2),
Each Y is independently a residue of a dicarboxylic anhydride,
Z is each independently a residue of tetracarboxylic dianhydride,
l is an integer of 4 to 20.)
[Formula 2]
(In Chemical Formula 2, * means a hand bonded to a carbon atom or an oxygen atom.)
상기 광중합성 화합물은 노닐페닐카르비톨아크릴레이트, 2-히드록시-3-페녹시프로필아크릴레이트, 2-에틸헥실카르비톨아크릴레이트, 2-히드록시에틸아크릴레이트, N-비닐피롤리돈, 1,6-헥산디올디(메타)아크릴레이트, 에틸렌글리콜디(메타)아크릴레이트, 네오펜틸글리콜디(메타)아크릴레이트, 트리에틸렌글리콜디(메타)아크릴레이트, 비스페놀 A의 비스(아크릴로일 옥시에틸)에테르, 3-메틸펜탄디올디(메타)아크릴레이트, 트리메틸올프로판트리(메타)아크릴레이트, 에톡실레이티드트리메틸올프로판트리(메타)아크릴레이트, 프로폭실레이티드트리메틸올프로판트리(메타)아크릴레이트, 펜타에리트리톨트리(메타)아크릴레이트, 펜타에리트리톨테트라(메타)아크릴레이트, 디펜타에리트리톨트리(메타)아크릴레이트, 디펜타에리트리톨펜타(메타)아크릴레이트, 에톡실레이티드디펜타에리트리톨헥사(메타)아크릴레이트, 프로폭실레이티드디펜타에리트리톨헥사(메타)아크릴레이트 및 디펜타에리트리톨헥사(메타)아크릴레이트로 이루어진 군으로부터 선택되는 하나 이상인 것을 특징으로 하는 경화성 수지 조성물.The method according to claim 1,
The photopolymerizable compound is nonylphenylcarbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexylcarbitol acrylate, 2-hydroxyethyl acrylate, N-vinylpyrrolidone, 1 ,6-hexanedioldi(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxy) of bisphenol A Ethyl) ether, 3-methylpentanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth) )Acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated A curable resin, characterized in that it is at least one selected from the group consisting of dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol hexa (meth) acrylate and dipentaerythritol hexa (meth) acrylate Composition.
상기 열경화제는 단관능 지환족 에폭시 수지, 노볼락형 에폭시 수지 및 실란 변성 에폭시 수지로 이루어진 군으로부터 선택되는 하나 이상인 것을 특징으로 하는 경화성 수지 조성물.The method according to claim 1,
The thermosetting agent is a curable resin composition, characterized in that at least one selected from the group consisting of a monofunctional alicyclic epoxy resin, a novolak type epoxy resin, and a silane-modified epoxy resin.
상기 경화성 수지 조성물은 충진제, 다른 고분자 화합물, 분산제, 밀착 촉진제, 산화 방지제 및 응집 방지제로 이루어진 군으로부터 선택되는 하나 이상의 첨가제를 더 포함하는 것을 특징으로 하는 경화성 수지 조성물.The method according to claim 1,
The curable resin composition further comprises one or more additives selected from the group consisting of a filler, another polymer compound, a dispersant, an adhesion promoter, an antioxidant and an anti-aggregation agent.
상기 경화성 수지 조성물 전체 100중량부에 대하여,
산란입자 0.1 내지 30 중량부;
결합제 수지 2 내지 20 중량부;
중합성 화합물 1 내지 15 중량부;
열경화제 0.1 내지 20 중량부; 및
용제 60 내지 90 중량부를 포함하는 것을 특징으로 하는 경화성 수지 조성물.The method according to claim 1,
Based on the total 100 parts by weight of the curable resin composition,
0.1 to 30 parts by weight of scattering particles;
2 to 20 parts by weight of a binder resin;
1 to 15 parts by weight of a polymerizable compound;
0.1 to 20 parts by weight of a thermosetting agent; And
Curable resin composition comprising 60 to 90 parts by weight of a solvent.
상기 경화성 수지 조성물은 산란층 형성용인 것을 특징으로 하는 경화성 수지 조성물.The method according to claim 1,
The curable resin composition, characterized in that for forming a scattering layer.
상기 화상표시장치는 퀀텀닷 디스플레이인 것을 특징으로 하는 화상표시장치. The method of claim 12,
The image display device, wherein the image display device is a quantum dot display.
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