KR20200105612A - 3 Layer reflecting back cover and manufacturing method for LED ligntings - Google Patents
3 Layer reflecting back cover and manufacturing method for LED ligntings Download PDFInfo
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- KR20200105612A KR20200105612A KR1020190024403A KR20190024403A KR20200105612A KR 20200105612 A KR20200105612 A KR 20200105612A KR 1020190024403 A KR1020190024403 A KR 1020190024403A KR 20190024403 A KR20190024403 A KR 20190024403A KR 20200105612 A KR20200105612 A KR 20200105612A
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
- B32B2264/0214—Particles made of materials belonging to B32B27/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract
Description
본 발명은 반사기능이 포함된 3중 구조의 엘이디(LED) 조명용 백 커버(Back Cover)와 그 제조방법에 관한 것으로, 보다 상세하게는 폴리프로필렌(polypropylene)이나 폴리에틸렌테레프탈레이트(polyethylenetetephtalate) 또는 폴리카보네이트(polycarbonate)를 주재료로 하는 반사필름에 합금 또는 금속물로된 피착제를 부착시켜 합금 또는 금속물로 된 피착제를 원하는 형상으로 변형한 형상에 따라서 상기 반사필름의 형상을 형성함으로써 최근에 개발되어 사용되는 조명분야에 사용되는 반사필름의 반사효과를 향상시키도록 함과 동시에, 보다 경량화하고 형상유지력 또한 향상시켜 사용용도가 다양한 조명용 백 커버(Back cover)에 적용이 편리하도록 한 반사기능이 포함된 3중 구조의 엘이디(LED) 조명용 백 커버(Back Cover)와 그 제조방법에 관한 것이다.The present invention relates to a three-layered LED lighting back cover including a reflective function and a manufacturing method thereof, and more particularly, to polypropylene or polyethylene terephthalate or polycarbonate It has been recently developed by attaching an adhesive made of an alloy or metal to a reflective film containing (polycarbonate) as the main material and forming the shape of the reflective film according to the shape of the desired shape of the adhesive made of an alloy or metal. It includes a reflective function that improves the reflective effect of the reflective film used in the lighting field used, and at the same time makes it lighter and improves shape retention, making it convenient to apply to the back cover for lighting with various uses. It relates to a three-layered LED lighting back cover and a manufacturing method thereof.
산업이 발전함에 따라 TV와 컴퓨터, 조명과 같은 전기전자제품이 발명되어 보급되었으며, 이와 같은 전기전자제품들은 빛을 활용하는 기술이 발전되어 오고 있으며, 빛이 활용되는 기술 중에 반사 필름에 대한 활용범위도 확대되어 이제는 보다 경량화, 고효율의 반사필름을 개발하기 위한 연구가 이루어지고 있는 실정으로 지금까지 개발된 선행기술의 특허문헌을 살펴보면 다음과 같다.With the development of the industry, electric and electronic products such as TVs, computers, and lighting have been invented and distributed, and technologies that use light have been developed for such electric and electronic products, and the scope of use of reflective films among the technologies that use light Also, the research is being conducted to develop a more lightweight and highly efficient reflective film, and the patent documents of the prior art developed so far are as follows.
그러나 지금까지의 조명 및 디스플레이 분야에 사용되는 반사필름이나 백커버(Back cover)는 경량화, 슬림화가 되면서 형상유지력과 성형성, 열안정성, 치수안정성, 절단 가공성과 같은 문제가 발생하였으나, 본 발명은 상기와 같은 문제를 해결하기 위해 반사기능이 포함된 3중 구조의 LED 조명용 백 커버(Back Cover)와 그 제조방법으로 LED 조명용이나 LED TV나 모니터등과 같은 디스플레이 분야에 적용이 편리하도록 함에 그 목적을 둔 것이다.However, as the reflective film or back cover used in the field of lighting and display so far has become lighter and slimmer, problems such as shape retention, formability, thermal stability, dimensional stability, and cutting processability have occurred. In order to solve the above problems, the purpose of this is to make it convenient to apply to LED lighting or to display fields such as LED TVs or monitors by using a three-layered back cover for LED lighting with a reflective function and its manufacturing method. I put it.
본 발명은 상기한 목적을 달성하기 위하여, 직경 5~100㎛인 폴리머비드(polymerbead)200g에 에폭시 수지(Epoxy resin)3,000g에 우레탄수지(Urethaneresin)1,000g,을 혼합하여 조성한 바인드수지3,000g~4,000g, 경화제300g, 촉매100g을 혼합하여 20분간 교반하여서 코팅용 폴리머비드를 얻는 코팅용 폴리머비드 조성공정과; 두께가 80~500㎛인 폴리프로필렌(polypropylene), 폴리에텔렌테레프탈레이트(polyethylene terephthalate), 폴리카보네이트(polycarbonate) 중 어느 하의 반사필름을 코팅기에 투입하여, 폴리머비드를 5~120㎛로 코팅하고 180℃의 온도로 3분간 가열하는 폴리머비드 코팅공정과; 에폭시수지(Epoxyresin)5,000g에 경화제500g, 촉매100g를 첨가하여 15분간 교반하여 접착제를 얻는 접착제 조성공정과; 30~300㎛ 두께의 폴리에틸렌(polyethylene)필름을 코팅기에 투입하여, 상기 접착제 조성공정에서 조성한 접착제를 폴리에틸렌(polyethylene)필름의 일면에 0.5~10㎛두께로 도포하는 폴리에틸렌(polyethylene)필름 접착제 도포공정과; 상기 폴리에틸렌(polyethylene)필름 접착제 도포공정에서 접착제가 도포된 폴리에틸렌(polyethylene)필름을 상기 폴리머비드 코팅제 코팅공정에서 표면에 폴리머비드가 코팅된 반사필름에 일체로 접합하는 폴리에틸렌(polyethylene)필름 합지공정과; 상기 합지공정에서 폴리에틸렌(polyethylene)필름을 일체로 접합한 2중구조의 반사필름을 45℃의 온도에서 6시간 동안 숙성(Aging)하는 1차 숙성공정과; 50~500㎛ 두께의 알루미늄(aluminium)시트를 코팅 접착기에 투입하여, 상기 접착제 조성공정에서 얻어진 접착제를 0.5~10㎛로 도포하는 알루미늄(aluminium)시트 접착제 도포공정과; 상기 알루미늄(aluminium)시트 접착제 도포공정에서 접착제가 도포된 알루미늄(aluminium)시트를 상기 폴리에틸렌(polyethylene)필름 합지공정에서 반사필름과 일체로 접합된 폴리에틸렌(polyethylene)필름에 일체로 접합하여 3중구조로 구성하고 160℃의 온도로 5분간 가열하는 알루미늄(aluminium)시트 합지공정과; 상기 알루미늄(aluminium)시트 합지공정에서 반사필름과 일체로 접합된 폴리에틸렌(polyethylene)필름에 알루미늄(aluminium)시트를 일체로 접합한 상태에서 50℃의 온도에서 36시간 동안 숙성(Aging)하는 2차 숙성공정과; 상기한 공정으로 완성된 3중구조의 반사필름을 사용용도에 따라 재단하거나 성형기에서 성형하여 조명용 백 커버를 완성하는 조명용 백 커버완성공정으로, 표면에 폴리머 비드(polymer bead) 코팅층을 형성한 반사기능이 내포된 필름과 폴리에틸렌(polyethylene)필름과 알루미늄(aluminium)호일이 일체로 된 3중구조의 LED 조명용 백 커버를 얻는다.In order to achieve the above object, the present invention is a bind resin formed by mixing 200 g of polymer beads having a diameter of 5 to 100 μm, 3,000 g of epoxy resin and 1,000 g of urethane resin, and 3,000 g to A coating polymer bead composition step of mixing 4,000 g, 300 g of a curing agent and 100 g of a catalyst and stirring for 20 minutes to obtain a coating polymer bead; Put a reflective film under any of polypropylene, polyethylene terephthalate, and polycarbonate with a thickness of 80 to 500 µm into a coating machine, coat polymer beads with 5 to 120 µm, A polymer bead coating step of heating at a temperature of °C for 3 minutes; An adhesive composition step of adding 500 g of a curing agent and 100 g of a catalyst to 5,000 g of epoxy resin and stirring for 15 minutes to obtain an adhesive; A polyethylene film adhesive application process in which a polyethylene film having a thickness of 30 to 300 μm is put into a coating machine, and the adhesive formed in the adhesive composition process is applied to one side of the polyethylene film in a thickness of 0.5 to 10 μm. ; A polyethylene film laminating process of integrally bonding a polyethylene film to which an adhesive is applied in the polyethylene film adhesive application process to a reflective film coated with a polymer bead on the surface in the polymer bead coating agent coating process; A first aging step of aging a double-structured reflective film in which a polyethylene film is integrally bonded in the laminating step for 6 hours at a temperature of 45°C; An aluminum sheet adhesive coating step in which an aluminum sheet having a thickness of 50 to 500 μm is put into a coating adhesive machine, and the adhesive obtained in the adhesive composition step is applied at 0.5 to 10 μm; In the aluminum sheet adhesive application process, the aluminum sheet to which the adhesive is applied is integrally bonded to the polyethylene film integrally bonded with the reflective film in the polyethylene film laminating process to form a triple structure. And an aluminum sheet laminating process for heating at a temperature of 160° C. for 5 minutes; Secondary aging by aging for 36 hours at a temperature of 50°C in a state where an aluminum sheet is integrally bonded to a polyethylene film integrally bonded with a reflective film in the aluminum sheet lamination process Process; This is a lighting back cover completion process that completes the lighting back cover by cutting the triple-structured reflective film completed by the above process according to the purpose of use or molding it on a molding machine.It has a reflective function by forming a polymer bead coating layer on the surface. To obtain a back cover for LED lighting with a triple structure in which the enclosed film, polyethylene film and aluminum foil are integrated.
상기한 본 발명인 3중 구조의 LED 조명용 백 커버(Back Cover)는, 조명 및 디스플레이 분야에 사용되는 반사필름이나 백커버(Back cover)를 경량화, 슬림화가 하면서 형상유지력과 성형성, 열안정성, 치수안정성, 절단 가공성이 향상되어 LED 조명용이나 LED TV나 모니터등과 같은 디스플레이 분야에 적용이 편리한 신규한 효과를 창출한다. The above-described inventor's triple structure LED back cover (Back Cover) for light and slim reflective film or back cover used in the field of lighting and display, while reducing shape retention, formability, thermal stability, dimensions Stability and cutting processability are improved, creating a new effect that is convenient to apply to LED lighting or display fields such as LED TVs and monitors.
도 1은 본 발명을 실시 하는데 따른 공정도.
도 2는 본 발명으로 제조된 필름의 구조를 나타낸 단면도.1 is a process diagram according to the practice of the present invention.
Figure 2 is a cross-sectional view showing the structure of the film manufactured by the present invention.
본 발명을 실시하기 위한 구체적인 내용을 설명하면 다음과 같다.Detailed contents for carrying out the present invention will be described as follows.
<실시예 1><Example 1>
코팅용 폴리머비드 조성공정;Coating polymer beads composition process;
폴리메틸메타크릴레이트(polymethyl methacrylate) 또는 폴리뷰틸메타크릴레이트(polybutyl methacrylate) 중 어느 하나로 된 직경 5~100㎛인 폴리머비드(polymerbead)200g에 비스페놀A 다이글리시딜 에테르(DGEA:Diglycidyl ether of bisphenol A) 또는 비스페놀F 다이글리시딜 에테르(DGEF:Diglycidyl ether of bisphenol F) 중 하나 또는 이들 둘을 비스페놀A 다이글리시딜 에테르(DGEA:Diglycidyl ether of bisphenol A) 0 내지 1중량부에 비스페놀F 다이글리시딜 에테르(DGEF:Diglycidyl ether of bisphenol F) 0 내지 0.5중량부를 혼합한 것으로 된 에폭시 수지(Epoxy resin)3,000g에 우레탄수지(Urethaneresin)1,000g,을 혼합하여 조성한 바인드수지3,000g~4,000g, 아디픽 다이하이드라자이드(ADH:Adipic dihydrazide), 헥사하이드로-4-메틸프탈릭 무수물(MHHPA:Hexahydro-4-methylphthalic anhydride), 다이시안디아마이드(DICY:Dicyandiamide) 중 어느 하나로 된 경화제300g, 이미다졸(2MZ-A:2,4-diamino-6[2'methylimidazolyl-(1')]-ethyl-s-triazine), 트리페닐 포스핀(TPP:Triphenylphosphine), 헥사플루오로안티모네이트(BPH:hexafluoroantimonate) 중 어느 하나로 된 촉매100g을 혼합하여 20분간 교반하여서 코팅용 폴리머비드를 얻는다.Bisphenol A diglycidyl ether (DGEA: Diglycidyl ether of polymethyl methacrylate) or polybutyl methacrylate (polybutyl methacrylate) in 200 g of polymer beads with a diameter of 5 to 100㎛ bisphenol A) or bisphenol F diglycidyl ether (DGEF: Diglycidyl ether of bisphenol F), bisphenol A diglycidyl ether (DGEA: Diglycidyl ether of bisphenol A) 0 to 1 part by weight of bisphenol F 3,000 g to 4,000 of a bind resin made by mixing 3,000 g of epoxy resin and 1,000 g of urethaneresin, which is a mixture of 0 to 0.5 parts by weight of diglycidyl ether of bisphenol F (DGEF). g, Adipic dihydrazide (ADH), hexahydro-4-methylphthalic anhydride (MHHPA: Hexahydro-4-methylphthalic anhydride), dicyandiamide (DICY: Dicyandiamide) in any one of the curing agent 300 g , Imidazole (2MZ-A:2,4-diamino-6[2'methylimidazolyl-(1')]-ethyl-s-triazine), triphenylphosphine (TPP:Triphenylphosphine), hexafluoroantimonate ( BPH: hexafluoroantimonate) is mixed with 100 g of a catalyst and stirred for 20 minutes to obtain polymer beads for coating.
여기서 포리머비드는 직경 35㎛인 것이 가장 이상 적이다. Here, the ideal is that the polymer beads have a diameter of 35 μm.
이때 코팅용 폴리머비드의 고형분 무게 구성 중량비는 바인더 수지 1중량부에 경화제 0.1중량부 내지 0.9중량부, 촉매 0.01중량부 내지 0.1중량부, 폴리머비드0.01중량부 내지 0.1중량부의 구성비로 조성면 크게 문제가 없다 할 것이다.At this time, the composition weight ratio of the solid content of the coating polymer beads is 0.1 parts by weight to 0.9 parts by weight of the curing agent, 0.01 parts by weight to 0.1 parts by weight of the catalyst, and 0.01 parts by weight to 0.1 parts by weight of the polymer beads. Will not do.
폴리머비드 코팅공정;Polymer bead coating process;
두께가 80~500㎛ 인 폴리프로필렌(polypropylene), 폴리에텔렌테레프탈레이트(polyethylene terephthalate), 폴리카보네이트(polycarbonate) 중 어느 하의 반사필름을 코팅기에 투입하여 권취 속도 5M/sec 하에서 폴리머비드 코팅층을 5~120㎛로 코팅하고 180℃의 온도로 3분간 가열한다.Put a reflective film under any of polypropylene, polyethylene terephthalate, and polycarbonate with a thickness of 80~500㎛ into the coating machine and apply the polymer bead coating layer to 5~ under a winding speed of 5M/sec. It is coated with 120 μm and heated at 180° C. for 3 minutes.
여기서 폴리머비드 코팅층을 40㎛로 하는 것이 가장 적합하다.Here, it is most suitable to use a polymer bead coating layer of 40 μm.
이때 사용하는 반사필름은 300㎛ 두께의 폴리에텔렌테레프탈레이트(polyethylene terephthalate) 반사필름이 가장 적합하다. The reflective film used at this time is the most suitable reflective film of 300 μm thick polyethylene terephthalate.
접착제 조성공정;Adhesive composition process;
비스페놀A 다이글리시딜 에테르(DGEA:Diglycidyl ether of bisphenol A) 또는 비스페놀F 다이글리시딜 에테르(DGEF:Diglycidyl ether of bisphenol F) 중 하나 또는 이들 둘을 비스페놀A 다이글리시딜 에테르(DGEA:Diglycidyl ether of bisphenol A) 0 내지 1중량부에 비스페놀F 다이글리시딜 에테르(DGEF:Diglycidyl ether of bisphenol F) 0 내지 0.5중량부를 혼합한 것으로 된 에폭시수지(Epoxyresin)5,000g에 아디픽 다이하이드라자이드(ADH:Adipic dihydrazide), MHHPA(Hexahydro-4-methylphthalic anhydride), 다이시안디아마이드(DICY:Dicyandiamine) 중 어느 하나인 경화제500g, 이미다졸(2MZ-A:2,4-diamino-6[2'methylimidazolyl-(1')]-ethyl-s-triazine), 트리페닐포스핀(TPP:Triphenylphosphine), 헥사플루오로안티모네이트(BPH:hexafluoroantimonate) 중 어느 하나로 된 촉매100g를 첨가하여 15분간 교반하여 접착제를 얻는다.One or both of bisphenol A diglycidyl ether (DGEA: Diglycidyl ether of bisphenol A) or bisphenol F diglycidyl ether (DGEF: Diglycidyl ether of bisphenol F) ether of bisphenol A) 0 to 1 part by weight of bisphenol F diglycidyl ether (DGEF: Diglycidyl ether of bisphenol F) 0 to 0.5 parts by weight of a mixture of epoxy resin (Epoxyresin) 5,000 g of adipic dihydrazide (ADH:Adipic dihydrazide), MHHPA (Hexahydro-4-methylphthalic anhydride), dicyandiamine (DICY: Dicyandiamine) any one of 500g, imidazole (2MZ-A:2,4-diamino-6[2') Add 100 g of a catalyst made of any one of methylimidazolyl-(1')]-ethyl-s-triazine), triphenylphosphine (TPP), or hexafluoroantimonate (BPH), and stir for 15 minutes. Get
폴리에틸렌(polyethylene)필름 접착제 도포공정;Polyethylene film adhesive application process;
30~300㎛ 두께의 폴리에틸렌(polyethylene)필름을 코팅기에 투입하여 권취 속도 5M/sec 하에서 폴리에틸렌(polyethylene)필름의 일면에 상기 접착제 조성공정에서 조성한 접착제를 0.5~10㎛두께로 도포한다.A polyethylene film having a thickness of 30 to 300 μm is put into a coating machine, and the adhesive prepared in the adhesive composition process is applied to a thickness of 0.5 to 10 μm on one side of the polyethylene film at a winding speed of 5 M/sec.
여기서 사용하는 폴리에틸렌(polyethylene)필름의 두께는 150㎛가 가장 적합하며, 이때도포하는 접착제의 두께는 3㎛가 가장 좋다.The thickness of the polyethylene film used here is the most suitable 150㎛, and the thickness of the adhesive applied at this time is the best 3㎛.
폴리에틸렌(polyethylene)필름 합지공정;Polyethylene film lamination process;
상기 폴리에틸렌(polyethylene)필름 접착제 도포공정에서 접착제가 도포된 폴리에틸렌(polyethylene)필름을 상기 폴리머비드 코팅제 코팅공정에서 표면에 폴리머비드가 코팅된 반사필름에 일체로 접합한다.In the polyethylene film adhesive application process, the polyethylene film to which the adhesive is applied is integrally bonded to the reflective film coated with polymer beads on the surface in the polymer bead coating agent coating process.
1차 숙성공정;1st aging process;
상기 합지공정에서 폴리에틸렌(polyethylene)필름을 일체로 접합한 2중구조의 반사필름을 45℃의 온도에서 6시간 동안 숙성(Aging)한다.In the laminating process, a double-structure reflective film in which a polyethylene film is integrally bonded is aged for 6 hours at a temperature of 45°C.
알루미늄(aluminium)시트 접착제 도포공정;Aluminum sheet adhesive application process;
50~1000㎛ 두께의 알루미늄(aluminium)시트를 코팅 접착기에 투입하여 권취 속도 5M/sec 하에서 상기 접착제 조성공정에서 얻어진 접착제를 0.5~10㎛로 도포한다.An aluminum sheet having a thickness of 50 to 1000 μm is put into a coating adhesive machine, and the adhesive obtained in the adhesive composition process is applied at 0.5 to 10 μm under a winding speed of 5 M/sec.
여기서 알루미늄(aluminium)시트의 두께는 100㎛인 것이 가장 적합하며, 도포하는 접착제의 두께는 5㎛로 도포 하는 것이 적합하다.Here, it is most suitable that the thickness of the aluminum sheet is 100 μm, and the thickness of the adhesive to be applied is preferably 5 μm.
알루미늄(aluminium)시트 합지공정;Aluminum sheet lamination process;
상기 알루미늄(aluminium)시트 접착제 도포공정에서 접착제가 도포된 알루미늄(aluminium)시트를 상기 폴리에틸렌(polyethylene)필름 합지공정에서 반사필름과 일체로 접합된 폴리에틸렌(polyethylene)필름에 일체로 접합하여 3중구조로 구성하고 160℃의 온도로 5분간 가열한다.In the aluminum sheet adhesive application process, the aluminum sheet to which the adhesive is applied is integrally bonded to the polyethylene film integrally bonded with the reflective film in the polyethylene film laminating process to form a triple structure. And heated for 5 minutes at a temperature of 160°C.
2차 숙성공정; Secondary aging process;
상기 알루미늄(aluminium)시트 합지공정에서 반사필름과 일체로 접합된 폴리에틸렌(polyethylene)필름에 알루미늄(aluminium)시트를 일체로 접합한 상태에서 50℃의 온도에서 36시간 동안 숙성(Aging)한다.In the aluminum sheet laminating process, an aluminum sheet is integrally bonded to a polyethylene film integrally bonded with a reflective film and aged for 36 hours at a temperature of 50°C.
조명용 백 커버완성공정;Lighting back cover completion process;
상기한 공정으로 완성된 3중구조의 반사필름을 사용용도에 따라 재단하거나 성형기에서 성형하여 조명용 백 커버를 완성한다.The reflective film of the triple structure completed by the above process is cut according to the purpose of use or formed in a molding machine to complete a back cover for lighting.
상기한 공정을 실시하여 표면에 폴리머 비드(polymer bead) 코팅층(10)을 형성한 반사기능이 내포된 필름(20)의 이면에 접착층(30)을 형성하여 폴리에틸렌(polyethylene)필름(40)을 일체로 접착하고 상기 폴리에틸렌필름(40)의 표면에 접착층을 형성하여 알루미늄(aluminium)호일(50)을 일체로 접착하여, 표면에 폴리머 비드(polymer bead) 코팅층(10)을 형성한 반사기능이 내포된 필름(20)과 폴리에틸렌(polyethylene)필름(40)과 알루미늄(aluminium)호일(50)이 일체로 된 3중구조의 LED 조명용 백 커버를 완성한다. By performing the above-described process, a polymer
본 발명의 실시예는 당 업계에서 평균적인 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위한 목적으로써 제공되어지는 것에 불과하므로, 본 발명의 범위가 서술된 실시예에 한정되는 것으로 해석되어져서는 아니 됨은 자명하다 할 것이다.Since the embodiments of the present invention are provided only for the purpose of more completely describing the present invention to those with average knowledge in the art, it is construed that the scope of the present invention is limited to the described embodiments. No, it will be self-evident.
상기한 본 발명은 LED TV나 컴퓨터 모니터, LED 조명기구의 백커버(Back cover)로 제작함에 있어서 적용이 가능한 등 산업상 이용가치가 대단하다 할 것이다.The present invention described above can be applied in manufacturing as a back cover of an LED TV, a computer monitor, and an LED lighting fixture, etc. It will be said that the industrial use value is great.
10 : 폴리머 비드(polymer bead) 코팅층
20 : 반사기능이 내포된 필름
30 : 접착층
40 : 폴리에틸렌(polyethylene) 필름
50 : 알루미늄(aluminium) 시트10: polymer bead coating layer
20: film with reflective function
30: adhesive layer
40: polyethylene film
50: aluminum sheet
Claims (7)
두께가 80~500㎛인 폴리프로필렌(polypropylene), 폴리에텔렌테레프탈레이트(polyethylene terephthalate), 폴리카보네이트(polycarbonate) 중 어느 하의 반사필름을 코팅기에 투입하여, 폴리머비드를 5~120㎛로 코팅하고 180℃의 온도로 3분간 가열하는 폴리머비드 코팅공정과;
에폭시수지(Epoxyresin)5,000g에 경화제500g, 촉매100g를 첨가하여 15분간 교반하여 접착제를 얻는 접착제 조성공정과;
30~300㎛ 두께의 폴리에틸렌(polyethylene)필름을 코팅기에 투입하여, 상기 접착제 조성공정에서 조성한 접착제를 폴리에틸렌(polyethylene)필름의 일면에 0.5~10㎛두께로 도포하는 폴리에틸렌(polyethylene)필름 접착제 도포공정과;
상기 폴리에틸렌(polyethylene)필름 접착제 도포공정에서 접착제가 도포된 폴리에틸렌(polyethylene)필름을 상기 폴리머비드 코팅제 코팅공정에서 표면에 폴리머비드가 코팅된 반사필름에 일체로 접합하는 폴리에틸렌(polyethylene)필름 합지공정과;
상기 합지공정에서 폴리에틸렌(polyethylene)필름을 일체로 접합한 2중구조의 반사필름을 45℃의 온도에서 6시간 동안 숙성(Aging)하는 1차 숙성공정과;
50~500㎛ 두께의 알루미늄(aluminium)시트를 코팅 접착기에 투입하여, 상기 접착제 조성공정에서 얻어진 접착제를 0.5~10㎛로 도포하는 알루미늄(aluminium)시트 접착제 도포공정과;
상기 알루미늄(aluminium)시트 접착제 도포공정에서 접착제가 도포된 알루미늄(aluminium)시트를 상기 폴리에틸렌(polyethylene)필름 합지공정에서 반사필름과 일체로 접합된 폴리에틸렌(polyethylene)필름에 일체로 접합하여 3중구조로 구성하고 160℃의 온도로 5분간 가열하는 알루미늄(aluminium)시트 합지공정과;
상기 알루미늄(aluminium)시트 합지공정에서 반사필름과 일체로 접합된 폴리에틸렌(polyethylene)필름에 알루미늄(aluminium)시트를 일체로 접합한 상태에서 50℃의 온도에서 36시간 동안 숙성(Aging)하는 2차 숙성공정과;
상기한 공정으로 완성된 3중구조의 반사필름을 사용용도에 따라 재단하거나 성형기에서 성형하여 조명용 백 커버를 완성하는 조명용 백 커버완성공정으로 이루어짐을 특징으로 하는 3중구조의 LED 조명용 백 커버 제조방법.By mixing 200 g of polymer beads with a diameter of 5 to 100 μm, 3,000 g of epoxy resin and 1,000 g of urethane resin, 3,000 g to 4,000 g of bind resin, 300 g of curing agent, and 100 g of catalyst are mixed. A coating polymer bead composition step of stirring for 20 minutes to obtain a coating polymer bead;
Put a reflective film under any of polypropylene, polyethylene terephthalate, and polycarbonate with a thickness of 80 to 500 µm into a coating machine, coat polymer beads with 5 to 120 µm, A polymer bead coating step of heating at a temperature of °C for 3 minutes;
An adhesive composition step of adding 500 g of a curing agent and 100 g of a catalyst to 5,000 g of epoxy resin and stirring for 15 minutes to obtain an adhesive;
A polyethylene film adhesive application process in which a polyethylene film having a thickness of 30 to 300 μm is put into a coating machine, and the adhesive formed in the adhesive composition process is applied to one side of the polyethylene film in a thickness of 0.5 to 10 μm. ;
A polyethylene film laminating process of integrally bonding a polyethylene film to which an adhesive is applied in the polyethylene film adhesive application process to a reflective film coated with a polymer bead on the surface in the polymer bead coating agent coating process;
A first aging step of aging a double-structured reflective film in which a polyethylene film is integrally bonded in the laminating step for 6 hours at a temperature of 45°C;
An aluminum sheet adhesive application step of applying an aluminum sheet having a thickness of 50 to 500 μm to a coating adhesive machine and applying the adhesive obtained in the adhesive composition step to 0.5 to 10 μm;
In the aluminum sheet adhesive application process, the aluminum sheet to which the adhesive is applied is integrally bonded to the polyethylene film integrally bonded with the reflective film in the polyethylene film laminating process to form a triple structure. And an aluminum sheet laminating process for heating at a temperature of 160° C. for 5 minutes;
Secondary aging by aging for 36 hours at a temperature of 50°C in a state where an aluminum sheet is integrally bonded to a polyethylene film integrally bonded with a reflective film in the aluminum sheet lamination process Process;
A method for manufacturing a back cover for LED lighting of a triple structure, characterized in that it consists of a back cover completion process for lighting that completes the back cover for lighting by cutting the reflective film of the triple structure completed by the above process according to the purpose of use or molding in a molding machine.
상기 폴리머비드(polymerbead)는, 폴리메틸메타크릴레이트(polymethyl methacrylate) 또는 폴리뷰틸메타크릴레이트(polybutyl methacrylate) 중 어느 하나로 한 것을 특징으로하는 3중구조의 LED 조명용 백 커버 제조방법.The method of claim 1,
The polymer bead is a method for manufacturing a back cover for LED lighting of a triple structure, characterized in that one of polymethyl methacrylate or polybutyl methacrylate.
상기 에폭시 수지(Epoxy resin)는, 비스페놀A 다이글리시딜 에테르DpGEA:Diglycidyl ether of bisphenol A) 또는 비스페놀F 다이글리시딜 에테르DpGEF:Diglycidyl ether of bisphenol F) 중 하나 또는 이들 둘을 비스페놀A 다이글리시딜 에테르(DGEA:Diglycidyl ether of bisphenol A) 0 내지 1중량부에 비스페놀F 다이글리시딜 에테르(DrGEF:Diglycidyl ether of bisphenol F) 0 내지 0.5중량부를 혼합한 것으로 된 것을 특징으로 하는 3중구조의 LED 조명용 백 커버 제조방법.The method of claim 1,
The epoxy resin is one or both of bisphenol A diglycidyl ether DpGEA: Diglycidyl ether of bisphenol A) or bisphenol F diglycidyl ether DpGEF: Diglycidyl ether of bisphenol F). Diglycidyl ether of bisphenol A (DGEA) 0 to 1 parts by weight of bisphenol F diglycidyl ether (DrGEF: Diglycidyl ether of bisphenol F) 0 to 0.5 parts by weight of a triple structure characterized in that the mixture Manufacturing method of back cover for LED lighting.
상기 경화제는 3,000g에 우레탄수지(Urethaneresin)1,000g,을 혼합하여 조성한 바인드수지3,000g~4,000g, 아디픽 다이하이드라자이드(ADH:Adipic dihydrazide), 헥사플루오로안티모네이트(MHHPA:Hexahydro-4-methylphthalic anhydride), 다이시안디아마이드(DICY:Dicyandiamide) 중 어느 하나로 된 것을 특징으로 하는 3중구조의 LED 조명용 백 커버 제조방법.The method of claim 1,
The curing agent is a bind resin composed by mixing 3,000 g of urethane resin (1,000 g), 3,000 g to 4,000 g, adipic dihydrazide (ADH), hexafluoroantimonate (MHHPA: Hexahydro- 4-methylphthalic anhydride), dicyandiamide (DICY: Dicyandiamide), characterized in that any one of the three-layer structure LED lighting back cover manufacturing method.
상기 촉매는 이미다졸(2MZ-A:2,4-diamino-6[2'methylimidazolyl-(1')]-ethyl-s-triazine), 트리페닐 포스핀(TPP:Triphenylphosphine), 헥사플루오로안티모네이트(BPH:hexafluoroantimonate) 중 어느 하나로 된 것을 특징으로 하는 3중구조의 LED 조명용 백 커버 제조방법.The method of claim 1,
The catalyst is imidazole (2MZ-A:2,4-diamino-6[2'methylimidazolyl-(1')]-ethyl-s-triazine), triphenylphosphine (TPP), hexafluoroantimo Nate (BPH: hexafluoroantimonate), characterized in that any one of the three-layer structure LED lighting back cover manufacturing method.
상기 코팅용 폴리머비드는, 고형분 무게 구성 중량비를 바인더 수지 1중량부에 경화제 0.1중량부 내지 0.9중량부, 촉매 0.01중량부 내지 0.1중량부, 폴리머비드0.01중량부 내지 0.1중량부로 함을 특징으로 하는 3중구조의 LED 조명용 백 커버 제조방법,
The method of claim 1,
The coating polymer beads, characterized in that the solid content weight composition weight ratio is 0.1 parts by weight to 0.9 parts by weight of the curing agent, 0.01 parts by weight to 0.1 parts by weight of the catalyst, 0.01 parts by weight to 0.1 parts by weight of the polymer beads to 1 part by weight of the binder resin. Method for manufacturing a back cover for LED lighting with a triple structure,
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR900017500A (en) | 1988-05-25 | 1990-12-19 | 테렌스 디. 드레이어 | Manufacturing method of snack product |
KR20060009464A (en) | 2004-07-23 | 2006-02-01 | 한국전자통신연구원 | Device and method for providing ringback-tone in internet telephony network |
KR20100039645A (en) | 2008-10-08 | 2010-04-16 | 정규달 | Hydroelectric power generation device |
-
2019
- 2019-02-28 KR KR1020190024403A patent/KR20200105612A/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR900017500A (en) | 1988-05-25 | 1990-12-19 | 테렌스 디. 드레이어 | Manufacturing method of snack product |
KR20060009464A (en) | 2004-07-23 | 2006-02-01 | 한국전자통신연구원 | Device and method for providing ringback-tone in internet telephony network |
KR20100039645A (en) | 2008-10-08 | 2010-04-16 | 정규달 | Hydroelectric power generation device |
Non-Patent Citations (1)
Title |
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특허출원 제10-2015-0053499호(2015.05.18)는 형상 복원력이 뛰어난 폴리프로필렌(polypropylene)이나 폴리에틸렌테레프탈레이트(polyethyleneterephtalate)를 주재료로 성형한 평탄한 반사필름에 형상 유지력이 뛰어난 합금으로 된 합금 또는 금속물로 된 피착제를 원하는 형상으로 변형한 형상에 따라서 상기 반사필름의 형상을 유지시킴으로써 최근에 개발되어 사용되는 LCD TV나 컴퓨터 모니터 등 디스플레이 분야에 사용되는 반사필름의 반사효과를 향상시키도록 함과 동시에, 사용용도가 무한한 조명용 반사판에 적용이 편리하도록 한 형상유지 반사필름과 그 제조방법 및 여기에 사용되는 접착제 및 형상유지방법에 관한 것이다. |
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