KR20200104610A - Thermoelectric device and headset comprising the same - Google Patents

Abstract

The present invention relates to a thermoelectric device which is mounted in a headset including a frame in which a speaker is installed in the center thereof and a buffer member providing a cushioning effect, and provides a cooling sensation to a user, wherein the thermoelectric device disposed between the frame and buffer member. A thermoelectric device according to one aspect of the present invention comprises: a heat dissipation member including a rim-shaped edge portion centered on a first axis from a speaker toward a buffer member, and a plate-shaped plate portion formed to extend inward at one point of the edge portion; a heat transfer member including a cooling sensation providing portion and a plate-shaped wing portion formed to extend outward at one point of the cooling sensation providing portion; a thermoelectric module disposed between the heat dissipation member and the heat transfer member and receiving power to perform a thermoelectric operation, wherein the thermoelectric module includes a cold surface for absorbing heat, and a worm surface formed on the opposite side of the cold surface and emitting heat. When viewed from the first axis direction, the heat dissipation member and the heat transfer member are disposed such that the plate portion and the wing portion overlap at least partially, and in the thermoelectric module, a cold surface and a warm surface are disposed to face at least a portion of the wing portion and the plate portion, respectively.

Description

Thermoelectric device and headset including the same {THERMOELECTRIC DEVICE AND HEADSET COMPRISING THE SAME}

The present invention relates to a thermoelectric device and a headset including the same, and more particularly, to a thermoelectric device attached to the headset to transmit a feeling of cooling and/or heat to a user, and a headset equipped with the thermoelectric device.

As the use of various game contents and multimedia contents increases, the number of users using headsets is increasing. However, when the user wears the headset for a long time, the skin in contact with the headset is sweaty, or heat cannot be released to the outside, resulting in an unpleasant feeling due to a local increase in temperature.

Thermoelectric devices are devices that exchange thermal energy and electrical energy using thermoelectric effects such as Seebeck effect and Peltier effect. Recently, research on body temperature power generation or cooling technology using such a thermoelectric element has been actively conducted. As part of this research, there have been attempts to promote comfortable use of users by arranging thermoelectric elements in a headset.

An object of the present invention is to provide a headset that provides a user with a feeling of cooling and/or a feeling of heat.

Another object of the present invention is to provide a headset that reduces user discomfort.

Another object of the present invention is to provide a structure of a thermoelectric device that efficiently provides a feeling of cooling and/or a feeling of heat to a user.

The problem to be solved by the present invention is not limited to the above-described problems, and problems that are not mentioned will be clearly understood by those of ordinary skill in the art from the present specification and the accompanying drawings. .

According to an aspect of the present invention, a thermoelectric device for providing a cool feeling to the user by being mounted on a headset including a frame in which a speaker outputting a voice is installed in the center and a buffer member that contacts the user's skin and provides a cushioning effect-the The thermoelectric device is disposed between the frame and the shock absorbing member.- In the case, a rim-shaped rim portion centering on a first axis directed from the speaker to the shock absorbing member, and a plate-shaped formed extending inward from a point of the rim portion A heat radiation member including a plate portion; A heat transfer member including a cooling sensation providing part perpendicular to the first axis and a plate-shaped wing part extending outward from a point of the cooling sensation providing part; And a thermoelectric module disposed between the heat dissipating member and the heat transfer member and receiving power to perform a thermoelectric operation.- The thermoelectric module includes a cold surface for absorbing heat and a hot surface formed on the opposite side of the cold surface and emitting heat. Including, wherein the heat dissipation member and the heat transfer member are disposed so that the plate portion and the wing portion at least partially overlap when viewed from the first axial direction, and the thermoelectric module includes the cold surface and the hot surface Thermoelectric devices may be provided that are disposed to face at least a portion of the wing portion and the plate portion, respectively.

According to another aspect of the present invention, a speaker for outputting a sound; A frame in which the speaker is installed in the center; A cushioning member that contacts the user's skin and provides a cushioning effect; And a thermoelectric device disposed between the frame and the buffer member to provide a feeling of cooling to the user, wherein the thermoelectric device comprises: a rim-shaped edge portion centered on a first axis directed from the speaker to the buffer member. And a heat dissipating member including a plate-shaped plate portion extending inward from a point of the edge portion. A heat transfer member including a cooling sensation providing part perpendicular to the first axis and a plate-shaped wing part extending outward from a point of the cooling sensation providing part; And a thermoelectric module disposed between the heat dissipating member and the heat transfer member and receiving power to perform a thermoelectric operation.- The thermoelectric module includes a cold surface that absorbs heat and a hot surface formed on the opposite side of the cold surface and radiates heat. Including;, wherein the heat dissipation member and the heat transfer member are disposed such that the plate portion and the wing portion at least partially overlap when viewed in the first axial direction, and the thermoelectric module includes the cold surface and the hot surface A headset may be provided that is disposed to face at least a portion of the wing portion and the plate portion, respectively.

The solution means of the subject of the present invention is not limited to the above-described solution means, and solutions that are not mentioned will be clearly understood by those of ordinary skill in the art from the present specification and the accompanying drawings. I will be able to.

According to the present invention, a thermoelectric device is mounted on the headset to provide a user with a feeling of cooling and/or a feeling of heat.

In addition, according to the present invention, a thermoelectric device that provides a feeling of cooling and/or a feeling of heat is mounted on the headset to reduce discomfort of the headset user.

Further, according to the present invention, a thermoelectric device having a structure for efficiently providing a feeling of cooling and/or a feeling of heat to a user can be provided.

The effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those of ordinary skill in the art from the present specification and the accompanying drawings.

1 is a diagram illustrating a configuration of a headset including a thermoelectric device according to an exemplary embodiment.
2 is a diagram of a thermoelectric module according to an embodiment.
3 is a diagram of a flexible thermoelectric module according to an exemplary embodiment.
4 to 6 are diagrams of an example of a heat transfer member according to an embodiment.
7 to 9 are views of another example of a heat transfer member according to an embodiment.
10 to 13 are views of a heat dissipating member according to an embodiment.
14 to 15 are views of a fixing member according to an embodiment.
16 is a view of a fastening member according to an embodiment.
17 to 20 are diagrams of a thermoelectric device according to an embodiment.
21 to 22 are diagrams of a headset including a thermoelectric device according to an exemplary embodiment.

Since the embodiments described in the present specification are intended to clearly explain the spirit of the present invention to those of ordinary skill in the technical field to which the present invention pertains, the present invention is not limited by the embodiments described herein, and the present invention The scope of should be construed as including modifications or variations that do not depart from the spirit of the present invention.

The terms used in the present specification have been selected as general terms that are currently widely used in consideration of functions in the present invention, but this varies depending on the intention, custom, or the emergence of new technologies of those of ordinary skill in the technical field to which the present invention belongs. I can. However, if a specific term is defined and used in an arbitrary meaning unlike this, the meaning of the term will be separately described. Therefore, terms used in the present specification should be interpreted based on the actual meaning of the term and the entire contents of the present specification, rather than a simple name of the term.

The drawings attached to the present specification are for easy explanation of the present invention, and the shapes shown in the drawings may be exaggerated and displayed as needed to aid understanding of the present invention, so the present invention is not limited by the drawings.

In the present specification, when it is determined that a detailed description of a known configuration or function related to the present invention may obscure the subject matter of the present invention, a detailed description thereof will be omitted as necessary.

According to an aspect of the present invention, a thermoelectric device for providing a cool feeling to the user by being mounted on a headset including a frame in which a speaker outputting a voice is installed in the center and a buffer member that contacts the user's skin and provides a cushioning effect-the The thermoelectric device is disposed between the frame and the shock absorbing member.- In the case, a rim-shaped rim portion centering on a first axis directed from the speaker to the shock absorbing member, and a plate-shaped formed extending inward from a point of the rim portion A heat radiation member including a plate portion; A heat transfer member including a cooling sensation providing part perpendicular to the first axis and a plate-shaped wing part extending outward from a point of the cooling sensation providing part; And a thermoelectric module disposed between the heat dissipating member and the heat transfer member and receiving power to perform a thermoelectric operation.- The thermoelectric module includes a cold surface for absorbing heat and a hot surface formed on the opposite side of the cold surface and emitting heat. Including, wherein the heat dissipation member and the heat transfer member are disposed so that the plate portion and the wing portion at least partially overlap when viewed from the first axial direction, and the thermoelectric module includes the cold surface and the hot surface Thermoelectric devices may be provided that are disposed to face at least a portion of the wing portion and the plate portion, respectively.

Here, a thickness of an inner point of the plate part may be thinner than a thickness of an outer point.

Here, the thickness of the inner one point of the wing portion may be thicker than the thickness of the outer one point.

Here, the heat dissipation member may have an uneven structure formed on the outer side of the edge portion in the first axial direction to increase waste heat dissipation to the outside.

Here, the cooling sensation providing unit may be provided in a rim shape in which a central region is opened, and an uneven structure may be formed on an inner surface of the rim shape.

Here, the uneven structure may be formed in a second axis direction perpendicular to the first axis.

Here, the cooling sensation providing unit may be provided in a plate shape in which a plurality of through holes are formed.

Here, the thermoelectric module may include an N-type semiconductor, a P-type semiconductor, and an electrode connecting the N-type semiconductor and the P-type semiconductor.

Here, the thermoelectric device further includes a fixing member disposed between the heat dissipation member and the heat transfer member and into which the thermoelectric module is inserted, wherein the thermal conductivity of the heat dissipation member and the heat transfer member May be lower than the thermal conductivity.

Here, the fixing member may include a protrusion formed to be disposed inside at least a partial region of the edge portion.

Here, the heat transfer member further includes a fastening part extending outwardly from a point of the cooling sensation providing part, and the heat transfer member and the fixing member may be coupled through the fastening part.

Here, the thermoelectric device may further include a plate-shaped fastening member disposed so as to surround at least a portion of an outer side of the cooling sensation providing unit in which the wing portion is not formed on the same plane as the plane in which the heat transfer member is disposed. .

Here, the fastening member may include one or more fastening parts that are coupled to the buffer member to fix the thermoelectric device and the buffer member.

Here, the thermoelectric device may be detachable to the headset.

According to another aspect of the present invention, a speaker for outputting a sound; A frame in which the speaker is installed in the center; A cushioning member that contacts the user's skin and provides a cushioning effect; And a thermoelectric device disposed between the frame and the buffer member to provide a feeling of cooling to the user, wherein the thermoelectric device includes a rim-shaped rim part centering on a first axis directed from the speaker to the buffer member. And a heat dissipating member including a plate-shaped plate portion extending inward from a point of the edge portion. A heat transfer member including a cooling sensation providing part perpendicular to the first axis and a plate-shaped wing part extending outward from a point of the cooling sensation providing part; And a thermoelectric module disposed between the heat dissipating member and the heat transfer member and receiving power to perform a thermoelectric operation.- The thermoelectric module includes a cold surface for absorbing heat and a hot surface formed on the opposite side of the cold surface and emitting heat. Including;, wherein the heat dissipation member and the heat transfer member are disposed such that the plate portion and the wing portion at least partially overlap when viewed from the first axial direction, and the thermoelectric module includes the cold surface and the hot surface A headset may be provided that is disposed to face at least a portion of the wing portion and the plate portion, respectively.

The headset according to an embodiment may be equipped with a thermoelectric device. 1 is a diagram illustrating a configuration of a headset including a thermoelectric device according to an exemplary embodiment. Referring to FIG. 1, the headset 10 according to an embodiment includes a thermoelectric device 100 for performing a thermoelectric operation, a speaker 700 for outputting sound, a frame 300 on which the speaker 700 is mounted, and a cushioning effect. It may include a cushioning member 500 providing a (cushioning effect).

The speaker 700 may be mounted in the center of the frame 300. The frame 300 may perform a function of protecting the speaker 700 from an external environment such as an external shock or liquid. Further, the frame 300 may perform a function of fixing the thermoelectric device 100 to the headset 10. In addition, the frame 300 may perform a function of discharging heat generated from the thermoelectric device 100 to the outside.

The frame 300 may have a concave central area. For example, the frame 300 may be formed in a hemispherical shape, but is not limited thereto and may be concave in various ways. A speaker 700 may be mounted in the concave area.

The cushioning member 500 may be implemented by including a material having a cushioning effect. Alternatively, the buffer member 500 may be implemented by including a material having elasticity. Alternatively, the buffer member 500 may be implemented by including a material having a restoring force. For example, when a force is applied to the buffer member 500 in one direction from the outside, the buffer member 500 may be deformed in one direction. When the buffer member 500 is deformed, a restoring force that attempts to recover to its original shape may occur.

When the force is removed, the buffer member 500 may recover to its original shape by a restoring force. Alternatively, the buffer member 500 may be restored to a shape substantially the same as the original shape. Alternatively, the buffer member 500 may be deformed into a third shape different from the original shape. The shape in which the buffer member 500 is recovered and deformed may vary according to a force applied to the buffer member 500.

Examples of the buffer member 500 may include a sponge, a cushion, and the like.

Referring to FIG. 1, the thermoelectric device 100 according to an exemplary embodiment includes a thermoelectric module 1000, a heat transfer member 3000, a heat radiation member 5000, a fixing member 7000, and a fastening member 9000. I can.

Since the headset and the thermoelectric device may include various other forms, the headset and the thermoelectric device in the present specification are not limited to the above-described examples, and may include additional configurations or some of the above-described configurations may be excluded.

Hereinafter, a configuration of a thermoelectric device according to an embodiment will be described.

The thermoelectric module uses thermoelectric effects such as the Seebeck effect or the Peltier effect to perform a thermoelectric operation such as a power generation operation using a temperature difference or a heating/cooling operation using electric energy. It may mean a module to perform. For example, the thermoelectric module may provide thermal stimulation including warmth/coolness to a user through a thermoelectric operation.

Here, since heat is a physical quantity expressed in the form of a positive scalar, the expression'providing a feeling of cooling' may not be a precise expression from a physical point of view, but in this specification, a sense of warmth is provided for the phenomenon in which heat is provided for convenience of explanation. The phenomena that are vice versa, that is, the phenomenon of absorbing heat, are expressed as providing a feeling of cooling.

The thermoelectric module may be provided in a plate shape. 2 is a perspective view of a thermoelectric module according to an embodiment. Referring to FIG. 2, the thermoelectric module 1000 may include an external substrate 1700, a thermoelectric element 1100, an electrode 1300, and a terminal 1500.

In addition, the thermoelectric module may have flexibility (hereinafter referred to as "flexible thermoelectric module"). Although the flexible thermoelectric module is basically provided in a plate shape, the flexible thermoelectric module can be transformed into various shapes including a curved shape by retaining the flexibility to enable curving. 3 is a perspective view of a flexible thermoelectric module according to an embodiment. Referring to FIG. 3, the flexible thermoelectric module 1000 may be used as a curved surface. In addition, a flexible thermoelectric module 1000 that can be deformed between a planar shape and a curved shape may be provided. For example, by applying a force to the flexible thermoelectric module 1000 having a flat shape as shown in FIG. 2, it can be transformed into a curved shape as shown in FIG. 3, and when the applied force is removed, the flexible thermoelectric module 1000 having a curved shape is It can be restored to a flat shape again.

The pair of external substrates 1700 may be spaced apart to face each other. The external substrate 1700 may support a thermoelectric element 1100 or an electrode 1300 disposed therebetween. In addition, the external substrate 1700 may perform a function of protecting the thermoelectric element 1100 or the electrode 1300 therein from the outside.

The external substrate 1700 may be formed of a material that is easy to conduct heat and has flexibility. For example, the external substrate 1700 may be a thin polyimide (PI) film. The polyimide film not only has excellent flexibility, but also has a high thermal conductivity, but can be manufactured with a thin thickness, so it may be advantageous for heat conduction.

The external substrate 1700 may be disposed only on one surface of the thermoelectric module 1000. The flexible thermoelectric module 1000 having the external substrate 1700 on only one side has an advantage in that its flexibility is improved compared to the flexible thermoelectric module 1000 having the external substrate 1700 on both sides. This is because even though the external substrate 1700 is made of a flexible material such as a PI film, it has some resistance to curving.

In the flexible thermoelectric module 1000 having the external substrate 1700 on only one surface, the flexibility of the surface without the external substrate 1700 may be superior to that of the opposite surface. In this case, when the flexible thermoelectric module 1000 is used in a curved shape, if the surface without the external substrate 1700 is used as a convex portion, this advantage can be fully utilized.

The thermoelectric element 1100 may be a device that induces a thermoelectric effect such as a Seebeck effect or a Peltier effect. Basically, the thermoelectric element 1100 may include a first thermoelectric element and a second thermoelectric element made of heterogeneous materials that constitute a thermoelectric couple that induces a thermoelectric effect. The first thermoelectric element and the second thermoelectric element are electrically connected to form a thermocouple. Thermocouples generate a temperature difference when electric energy is applied, and conversely, when a temperature difference is applied, electric energy can be produced. A representative example of the thermoelectric element 1100 is a pair of bismuth and antimony. In addition, recently, a pair of an N-type semiconductor and a P-type semiconductor is mainly used as the thermoelectric element 1100.

The electrode 1300 electrically connects the thermoelectric element 1100. The thermoelectric element 1100 may generate a thermoelectric effect only when at least a first thermoelectric element made of a different material and a second thermoelectric element are electrically connected to form a thermoelectric pair. Accordingly, the electrode 1300 basically forms a thermocouple by connecting a first thermoelectric element and a second thermoelectric element adjacent to each other.

In addition, the electrode 1300 may connect a plurality of thermoelectric elements 1100 in series. The thermoelectric elements 1100 connected in series by the electrode 1300 may simultaneously form a thermoelectric group that performs the same thermoelectric operation.

The electrode 1300 may be mainly made of a metal material such as copper or silver, but is not limited thereto.

The terminal 1500 is a terminal connecting the thermoelectric module 1000 to the outside. When the thermoelectric module 1000 is used as a heat outputting module, the terminal 1500 may supply power for the thermoelectric module 1000 to perform a heating/cooling operation using the Peltier effect. In addition, when the thermoelectric module 1000 is used as a thermoelectric generating module, the terminal 1500 may transmit power generated by the thermoelectric module 1000 using the Seebeck effect to the outside.

A pair of terminals 1500 is provided for each thermoelectric group, and may be connected to thermoelectric elements 1100 at both ends of an electric circuit among thermoelectric elements 1100 connected in series in the thermoelectric group.

2 to 3, the thermoelectric module 1000 may include a plurality of thermoelectric elements 1100 arranged in a two-dimensional array. In the two-dimensional array, the thermoelectric elements 1100 may be alternately arranged with a first thermoelectric element, for example, an N-type semiconductor and a second thermoelectric element, for example, a P-type semiconductor.

The thermoelectric module 1000 may include a support layer. The support layer may be positioned between the pair of external substrates 1700. The support layer may support the thermoelectric element 1100 and the electrode 1300. Accordingly, the thermoelectric element 1100 and the electrode 1300 may be supported by the support layer together with the external substrate 1700.

The support layer may be made of a flexible material so that the thermoelectric module 1000 can maintain flexibility. For example, the support layer may be a foam layer having inner pores like a sponge. Here, the foam layer may be formed by filling a foaming agent between a pair of external substrates. As the foaming agent, an organic foaming agent, an inorganic foaming agent, a physical foaming agent, a polyurethane and a silicone foam, and the like may be used.

When the support layer is included in the thermoelectric module 1000, the thermoelectric element 1100 and the electrode 1300 may be supported by the support layer, so the external substrate 1700 may not be necessary. Any one of the pair of external substrates 1700 shown in FIGS. 2 to 3 may be removed. Alternatively, all of the pair of external substrates 1700 may be removed. When the external substrate 1700 is removed, the flexibility of the thermoelectric module 1000 may be improved.

The heat transfer member may transmit a feeling of cooling and/or warmth generated as the thermoelectric module operates to a user. For example, when delivering a feeling of cooling to a user, a feeling of cooling generated from a thermoelectric module may be delivered to the user through a heat transfer member.

The heat transfer member may be made of a material having high thermal conductivity. For example, the heat transfer member may be implemented using a metal and/or alloy material such as aluminum and magnesium. As another example, the heat transfer member may be implemented using a thermally conductive polymer. In addition, it is possible to implement a heat transfer member with various materials such as ceramics, carbon composite materials, polymer/metal composite materials, and polymer/ceramic composite materials.

As the thermal conductivity of the heat transfer member increases, an efficiency in which a feeling of cooling and/or a feeling of warmth is transmitted to a user may increase.

The heat transfer member may be provided in a plate shape. Here, the plate shape may mean that the area of one or more main surfaces is larger than the area of the other surface. In addition, there may be no restrictions on the shape of a triangle, square, circle, etc.

The heat transfer member may include a thermal stimulation providing portion and a wing portion. The thermal stimulation providing unit may be formed in the central region of the heat transfer member. The wing portion may be formed to extend outward from a point of the thermal stimulation providing portion.

The thermal stimulation providing unit may provide a user with thermal stimulation including a feeling of coolness/warmth. When the thermal stimulus providing unit provides cool sensation to the user, it may be referred to as a cooling sensation providing unit, and when providing a warm sensation, it may be called a warm sensation providing unit.

One area of the thermal stimulation providing unit may be opened. An uneven structure may be formed in the open area. Thermal stimulation may be transmitted to the user through the uneven structure. In addition, thermal stimulation provided to the user may be increased due to the uneven structure formed in the thermal stimulation providing portion.

Alternatively, a plurality of through holes may be formed in the thermal stimulation providing unit.

Voices, sounds, sounds, etc. output from the speaker may be smoothly transmitted to the user through the open area or through hole of the thermal stimulation providing unit.

The wing portion may be disposed to face or contact with the thermoelectric module. The wing unit may transmit a feeling of cooling/warm generated from the thermoelectric module to a user or to a thermal stimulation providing unit.

The wing portion may be formed in a plate shape. Here, the plate shape may mean that the area of one or more main surfaces is larger than the area of the other surface. In addition, there may be no restrictions on the shape of a triangle, square, circle, etc.

The thickness of the wing can be uniform over the entire area. Alternatively, the thickness of one region of the wing may be thicker than that of the other region. For example, the thickness of a region adjacent to the thermal stimulation providing portion of the wing portion may be thicker than that of other regions. As another example, the thickness of the wing portion may become thinner toward the outside. As another example, the thickness of the inner region of the wing may be thicker than the thickness of the outer region.

Depending on the thickness of the wing portion, the efficiency of the thermal stimulation transmitted by the thermoelectric device to the user may vary. For example, when the thickness of the inner region of the wing is thicker than the outer region, the efficiency of the thermoelectric device may increase.

One or more wing portions may be formed on the heat transfer member. Alternatively, a number of wing portions corresponding to the number of thermoelectric modules disposed in the thermoelectric device may be formed on the heat transfer member, or a number of wing portions may be formed in a larger number than the number of thermoelectric modules.

The heat transfer member may include a fastening portion. The heat transfer member may be coupled to the thermoelectric device and/or other components of the headset through the fastening portion. For example, the heat transfer member may be coupled to the fixing member through a fastening portion.

The fastening portion may be formed in a groove structure and/or a protruding structure. When the fastening portion of the heat transfer member is formed in a groove structure (or a protrusion structure), it may be matched and coupled with a protruding structure (or a groove structure) formed in another configuration of the thermoelectric device and/or the headset.

The fastening portion may be formed in a hole structure with a hole to be fixed with a fixing unit such as screws or nails. For example, a hole structure formed in the heat transfer member and a hole structure formed in another configuration of the thermoelectric device and/or headset are arranged to face each other and fixed by passing them through a fixing unit to combine the heat transfer member with the other configuration. have.

The fastening portion may be formed to extend outward from a point of the thermal stimulation providing portion. In addition, one or more fastening portions may be formed on the heat transfer member.

4 to 6 are a plan view, a perspective view, and a side view of an example of a heat transfer member according to an embodiment, respectively. Referring to FIGS. 4 to 6, the heat transfer member 3000 may include a thermal stimulation providing part 3500, wing parts 3100a and 3100b, and fastening parts 3200a and 3200b.

A thermal stimulation providing unit 3500 may be formed in a central region of the heat transfer member 3000.

4 to 6, the heat transfer member 3000 may be formed with two plate-like wing portions 3100a and 3100b extending outward from one point of the thermal stimulation providing unit 3500 but facing each other. . In addition, two fastening portions 3200a and 3200b extending outward from one point of the thermal stimulation providing portion 3500 different from one point where the wing portions 3100a and 3100b are formed, but facing each other may be formed. The fastening parts 3200a and 3200b may include a hole structure.

A plurality of through-holes 3300 may be formed in the thermal stimulation providing unit 3500.

Referring to FIG. 6, the thickness of the wing portions 3100a and 3100b may not be uniform. As shown, the thickness at one point B inside the wing portions 3100a and 3100b may be thicker than the thickness at one point A outside.

7 to 9 are a plan view, a perspective view, and a side view of another example of a heat transfer member according to an embodiment, respectively. Referring to FIGS. 7 to 9, the heat transfer member 3000 may include a thermal stimulation providing part 3500, wing parts 3100a and 3100b, and fastening parts 3200a and 3200b.

The thermal stimulation providing unit 3500 may be provided in a rim shape in which the central region is open. 7 to 9 are shown as an oval-shaped rim, in addition to this, the thermal stimulation providing unit 3500 may be provided in a rim shape of various shapes without limitation, such as circular, square, hexagonal, etc.

7 to 9, an uneven structure may be formed on the inner surface of the rim-shaped thermal stimulation providing part 3500. The thickness of the uneven structure may vary according to the direction in which the rim is formed.

Referring to FIGS. 7 to 9, the heat transfer member 3000 may have two plate-shaped wing portions 3100a and 3100b extending outward from a point of the thermal stimulation providing unit 3500 but facing each other. . In addition, two fastening portions 3200a and 3200b extending outward from one point of the thermal stimulation providing portion 3500 different from one point where the wing portions 3100a and 3100b are formed, but facing each other may be formed. The fastening parts 3200a and 3200b may include a hole structure.

Referring to FIG. 9, the thickness of the wing portions 3100a and 3100b may not be uniform. As shown, the thickness at one point B inside the wing portions 3100a and 3100b may be thicker than the thickness at one point A outside. Alternatively, the thickness of the wing portions 3100a and 3100b may be thinner from the inside to the outside.

The heat dissipation member may discharge heat absorbed from the thermoelectric module to the outside. For example, waste heat generated by the operation of the thermoelectric module may be transferred to the heat dissipating member, and the heat dissipating member may discharge the received waste heat to the outside.

The heat dissipation member may be made of a material having high thermal conductivity. For example, the heat dissipation member may be implemented using a metal and/or alloy material such as aluminum and magnesium. As another example, the heat dissipation member may be implemented using a thermally conductive polymer. In addition, the heat dissipation member can be implemented with various materials such as ceramics, carbon composite materials, polymer/metal composite materials, and polymer/ceramic composite materials.

One region of the heat dissipation member is disposed to correspond to the high temperature region and the other region to the low temperature region. The heat dissipation member may be formed in a structure capable of increasing an area in contact with the low temperature region. For example, one region of the heat dissipation member may be provided in a plate shape and the other region may be provided in a fin shape. Alternatively, the other region may be formed to have a protrusion and a depression.

The heat dissipation member may be formed to open the central region.

Alternatively, the heat dissipation member may include an edge portion and a plate portion formed to extend inward from a point of the edge portion. Waste heat generated from the thermoelectric module may be transferred to the edge portion through the plate portion. The edge portion may discharge heat transferred from the plate portion to the outside.

The rim may be provided in a rim shape.

An uneven structure may be formed on the edge portion. For example, an uneven structure may be formed on the outer surface of the edge portion. As the concave-convex structure is formed in the edge portion, the efficiency in which the heat dissipating member discharges waste heat to the outside may be increased.

When the heat dissipation member is provided in a rim shape centered on the first axis, the uneven structure may be formed in the first axis direction. Here, the meaning that the uneven structure is formed in the first axis direction may mean that a change in the thickness of the uneven structure changes along the first axis.

The plate portion may be disposed to face or contact with the thermoelectric module. The plate portion may receive waste heat generated from the thermoelectric module and discharge it to the outside.

The plate portion may be formed in a plate shape. Here, the plate shape may mean that the area of one or more main surfaces is larger than the area of the other surface. In addition, there may be no restrictions on the shape of a triangle, a square, or a circle.

The thickness of the plate portion may be uniform over the entire area. Alternatively, the thickness of one region of the plate portion may be thicker than that of the other region. For example, a region adjacent to the edge portion of the plate portion may have a thickness greater than that of other regions. As another example, the thickness of the plate portion may become thinner toward the inside. As another example, the thickness of the outer region of the plate may be thicker than the thickness of the inner region.

The efficiency at which the thermoelectric device dissipates waste heat to the outside may vary depending on the thickness of the plate portion. For example, when the thickness of the outer region of the plate portion is thicker than the inner region, waste heat dissipation efficiency of the thermoelectric device may increase.

Depending on the thickness of the plate portion, the efficiency of the thermal stimulation transmitted by the thermoelectric device to the user may vary. For example, when the thickness of the outer region of the plate portion is thicker than the inner region, the efficiency of the thermoelectric device may increase. The increase in efficiency may be due to a decrease in heat transferred from the heat dissipation member to the heat transfer member or decrease in heat transferred from the heat dissipation member to the user.

One or more plate portions may be formed on the heat dissipating member. Alternatively, a number of plate portions corresponding to the number of thermoelectric modules disposed in the thermoelectric device may be formed on the heat dissipating member, or a number of plate portions greater than the number of thermoelectric modules may be formed.

The heat dissipation member may include one or more fastening portions. The heat dissipation member may be coupled to the thermoelectric device and/or other components of the headset through the fastening portion. For example, the heat dissipation member may be coupled to the frame through the fastening portion.

The fastening portion may be formed in a groove structure and/or a protruding structure. When the fastening portion of the heat dissipating member is formed in a groove structure (or a protrusion structure), it may be matched and coupled with a protruding structure (or a groove structure) formed in another configuration of the thermoelectric device and/or the headset.

The fastening portion may be formed in a hole structure with a hole so that it can be fixed with a fixing unit such as screws or nails. For example, a hole structure formed in the heat dissipating member and a hole structure formed in another configuration of the thermoelectric device and/or headset are arranged to face each other and fixed by passing them through a fixing unit, thereby combining the heat dissipating member and the other configuration.

10 to 13 are plan, perspective, side and cross-sectional views, respectively, of a heat dissipating member according to an exemplary embodiment. 10 to 13, the heat dissipation member 5000 may include plate portions 5100a and 5100b and an edge portion 5200.

The rim portion 5200 may be provided in a rim shape in which the central region is open. 10 to 13, the rim of an oval shape is shown, but in addition, the rim portion 5200 may be provided in a rim shape of various shapes without limitation, such as a circle, a square, and a hexagon.

10 to 13, an uneven structure may be formed on the outer surface of the rim-shaped edge portion 5200. The thickness of the uneven structure may vary according to a direction perpendicular to a plane in which the rim is formed.

10 to 13, plate portions 5100a and 5100b, which are two plates facing each other, may be formed in the heat dissipating member 5000 from one point of the edge portion 5200 to the inside.

Referring to FIG. 13, the thickness of the plate portions 5100a and 5100b may not be uniform. As shown, the thickness of the plate portions 5100a and 5100b at an outer point A may be thicker than the thickness at an inner point B. Alternatively, the thickness of the plate portions 5100a and 5100b may become thinner from the outside to the inside.

The fixing member may fix the thermoelectric module to the thermoelectric device. Alternatively, the fixing member may be disposed between different components of the thermoelectric device and/or the headset to perform a function as a spacer to space them apart. For example, the fixing member may be disposed between the heat transfer member and the heat dissipating member to space them apart. As the fixing member spaces the different components apart, heat transfer between the components can be reduced.

The fixing member may be made of a material having low thermal conductivity. For example, the fixing member may be formed to have lower thermal conductivity than the heat transfer member and/or the heat dissipation member. When the fixing member is disposed between the heat transfer member and the heat dissipation member, heat transfer between the heat transfer member and the heat dissipation member may be reduced by providing the fixing member having low thermal conductivity. For example, as the thermal conductivity of the fixing member is lowered, the heat dissipation member may reduce the transfer of waste heat received from the thermoelectric module to the heat transfer member.

As the thermal conductivity of the fixing member is lowered, an efficiency in which a feeling of cooling and/or a feeling of warmth is transmitted to a user may increase.

The fixing member may be provided in a plate shape. Here, the plate shape may mean that the area of one or more main surfaces is larger than the area of the other surface. In addition, there may be no restrictions on the shape of a triangle, a square, or a circle.

One area of the fixing member may be open. For example, the central region of the fixing member can be opened. Voice, sound, and sound output from the speaker can be smoothly transmitted to the user by the open area of the fixing member.

The thermoelectric module may be inserted into the open area of the fixing member. As the thermoelectric module is inserted into the open area, the thermoelectric module may be coupled to a fixing member or may be fixed to the thermoelectric device.

One or more open areas may be formed in the fixing member. Alternatively, a number of open areas corresponding to the number of thermoelectric modules disposed in the thermoelectric device may be formed in the fixing member, or a larger number of open areas may be formed than the number of thermoelectric modules.

The fixing member may include a protrusion. As the protrusion is formed, heat transfer across the region in which the protrusion is formed may be reduced.

The fixing member may include one or more fastening portions. The fixing member may be coupled to the thermoelectric device and/or other components of the headset through the fastening portion. For example, the fixing member may be coupled to the heat transfer member through the fastening portion.

The fastening portion may be formed in a groove structure and/or a protruding structure. When the fastening portion of the fixing member is formed in a groove structure (or a protrusion structure), it may be matched and coupled with a protruding structure (or a groove structure) formed in another configuration of the thermoelectric device and/or the headset.

The fastening portion may be formed in a hole structure with a hole to be fixed with a fixing unit such as screws or nails. For example, a hole structure formed in the fixing member and a hole structure formed in another configuration of the thermoelectric device and/or headset are arranged to face each other, and they are fixed by passing through the fixing unit to couple the fixing member and the other configuration.

14 to 15 are plan and perspective views, respectively, of a fixing member according to an exemplary embodiment. 14 to 15, the fixing member 7000 may include open areas 7100a and 7100b and fastening portions 7200a, 7200b, 7200c, 7200d, 7200e, and 7200f.

The fixing member 7000 may be provided in a ring shape in which the central region is open. 14 to 15 are shown as an oval-shaped ring, in addition to this, the fixing member 7000 may be provided in a ring shape of various shapes without limitation, such as a circle, a square, a hexagon.

14 to 15, two open areas 7100a and 7100b facing each other may be formed on the edge of the fixing member 7000. In addition, a plurality of fastening portions 7200a, 7200b, 7200c, 7200d, 7200e, and 7200f may be formed on the rim of the fixing member 7000.

Different types of fastening portions 7200a, 7200b, 7200c, 7200d, 7200e, and 7200f may be formed on the fixing member 7000. As shown, the fixing member 7000 may include fastening portions 7200a, 7200b, 7200c, and 7200d formed in a protruding structure and fastening portions 7200e and 7200f formed in a hole structure. The different types of fastening portions 7200a, 7200b, 7200c, 7200d, 7200e, and 7200f may be coupled to other components of the thermoelectric device and/or the headset, respectively.

The fastening member may be used to couple different components included in the thermoelectric device and/or the headset. For example, the thermoelectric device and the buffer member may be coupled through a fastening member.

The fastening member may be made of a material having low thermal conductivity. For example, the fastening member may be formed to have lower thermal conductivity than the heat transfer member and/or the heat dissipation member. As the thermal conductivity of the fastening member is lowered, the efficiency in which the feeling of cooling and/or the feeling of warmth is transmitted to the user may increase.

The fastening member may be provided in a plate shape. Here, the plate shape may mean that the area of one or more main surfaces is larger than the area of the other surface. In addition, there may be no restrictions on the shape of a triangle, a square, or a circle.

The thermoelectric device may include one or more fastening members.

The fastening member may include one or more fastening portions. The fastening member may be coupled to the thermoelectric device and/or other components of the headset through the fastening portion. For example, the fastening member may be coupled to the buffer member through the fastening portion.

The fastening portion may be formed in a groove structure and/or a protruding structure. When the fastening portion of the fastening member is formed in a groove structure (or a protrusion structure), it may be matched and coupled with a protruding structure (or a groove structure) formed in another configuration of the thermoelectric device and/or the headset.

The fastening portion may be formed in a hole structure with a hole to be fixed with a fixing unit such as screws or nails. For example, a hole structure formed in the fastening member and a hole structure formed in another configuration of the thermoelectric device and/or headset are arranged to face each other and are fixed by passing them through the fixing unit, so that the fastening member and the other configuration may be coupled.

16 is a perspective view of a fastening member according to an embodiment. Referring to FIG. 16, the fastening members 9000a and 9000b may be provided in a sector shape in which the vicinity of a vertex is cut. In addition, each of the plurality of fastening members 9000a and 9000b may include fastening portions 9100a, 9100b, 9100c, and 9100d and seating regions 9200a and 9200b in which the heat transfer member may be seated. A state in which the heat transfer member is seated on the fastening members 9000a and 9000b through the seating regions 9200a and 9200b will be described later.

The thermoelectric device may include a thermoelectric module, a heat transfer member, and a heat dissipation member. For example, a heat transfer member may be disposed to correspond to one surface of the thermoelectric module, and a heat dissipation member may be disposed to correspond to the other surface of the thermoelectric module. As another example, a heat transfer member and a heat dissipation member may be spaced apart, and a thermoelectric module may be disposed between the heat transfer member and the heat dissipation member.

The thermoelectric module may contact the heat transfer member and/or the heat dissipation member. For example, the thermoelectric module may contact the wing portion of the heat transfer member and/or the plate portion of the heat dissipation member.

Thermal stimulation generated by the thermoelectric operation of the thermoelectric module may be transmitted to the user through the heat transfer member, and waste heat may be discharged to the outside through the heat dissipation member. For example, the cooling sensation generated by the cooling operation of the thermoelectric module may be transmitted to the cooling sensation providing unit through the wing of the heat transfer member and provided to the user. In addition, waste heat generated by the operation of the thermoelectric module may be transferred to the edge portion through the plate portion of the heat dissipating member and discharged to the outside.

When viewed from a direction perpendicular to the heat transfer member and the heat dissipation member, when the wing portion and the plate portion face each other, and the thermoelectric module is disposed between the wing portion and the plate portion, the efficiency of the thermoelectric device depends on the size of the wing portion and/or the plate portion. It can be different. For example, when a wing portion and a plate portion having the same or similar size as the size of the thermoelectric module are formed, the efficiency of the thermoelectric device may increase. Specifically, when a wing portion and a plate portion larger than the size of the thermoelectric module performing the cooling operation are formed, the heat dissipation member is not disposed of the thermoelectric module from a region of the plate portion where the thermoelectric module is not disposed. It can be delivered to one area of the wing. This can increase the temperature of the heat transfer member and consequently reduce the feeling of cooling transmitted to the user.

17 and 18 are a combined perspective view and an exploded perspective view of an example of a thermoelectric device according to an embodiment, respectively. 17 to 18, the thermoelectric device 100 includes thermoelectric modules 1000a and 1000b, a heat transfer member 3000, a heat dissipation member 5000, a fixing member 7000, and a fastening member 9000a, 9000b. Can include. A fixing member 7000 may be disposed on the heat dissipating member 5000. The thermoelectric modules 1000a and 1000b may be inserted into the open edge area of the fixing member 7000. A heat transfer member 3000 and fastening members 9000a and 9000b may be disposed above the fixing member 7000 and the thermoelectric modules 1000a and 1000b. The fastening members 9000a and 9000b may be disposed on the same plane as the heat transfer member 3000, but may be disposed to surround at least a portion of the outer side of the thermal stimulation providing unit of the heat transfer member 3000 in which the wing portion is not formed. The fastening portion of the heat transfer member 3000 may be disposed to correspond to the seating area of the fastening members 9000a and 9000b.

When the thermoelectric device 100 provides cooling sensation to the user, referring to FIGS. 17 to 18, the cold noodles absorbing heat of the thermoelectric modules 1000a and 1000b come into contact with the blades of the heat transfer member 3000 to provide cooling sensation. Can be delivered. The heat transfer member 3000 may provide the user with cool feeling transmitted through the wing portion through a cool feeling providing unit. In addition, the on-surface emitting heat of the thermoelectric modules 1000a and 1000b may contact the plate portion of the heat dissipating member 5000 to transmit waste heat. The heat dissipation member 5000 may discharge waste heat transmitted through the plate part to the outside through an edge part.

19 is a cross-sectional perspective view of a central area of a thermoelectric device according to an exemplary embodiment, and FIG. 20 is a cross-sectional perspective view of an edge area of the thermoelectric device according to an exemplary embodiment.

Referring to FIG. 19, as described above, the inner thickness of the wing portion of the heat transfer member 3000 may be thicker than the outer side. Accordingly, the thermal stimulus transmitted from the thermoelectric modules 1000a and 1000b is not emitted to the outside, and the efficiency of being transmitted to the thermal stimulus providing unit may increase.

In addition, the outer thickness of the plate portion of the heat dissipation member 5000 may be thicker than the inner side. Accordingly, the efficiency in which waste heat transferred from the thermoelectric modules 1000a and 1000b is discharged to the outside of the thermoelectric device may be increased.

19 to 20, a protrusion 7300 may be formed on the fixing member. The protrusion 7300 may be disposed to correspond to the inner side of the heat dissipation member 5000. Accordingly, it is possible to reduce the heat dissipation of waste heat transferred from the thermoelectric modules 1000a and 1000b by the heat dissipating member 5000 to the inside of the thermoelectric device, and increase the efficiency of transmitting thermal stimulation to the user of the thermoelectric device.

Referring to FIG. 20, the fastening part of the heat transfer member 3000 faces the fastening part of the fixing member, and the fixing unit 2000 is inserted into the hole structure formed therein to couple the heat transfer member 3000 and the fixing member. I can.

The headset may be equipped with a thermoelectric device. The thermoelectric device may be disposed between the frame of the headset and the cushioning member. In addition, the thermoelectric device may be detachable to the headset.

Various devices to which a thermoelectric device is applied may need a power supply to drive it. The power may be provided by wire, and may be provided wirelessly or from a battery as needed. In addition, in order to control the power supply of the thermoelectric device, a remote control or the like may be provided together with the device, and the thermoelectric device may be connected to a computer or the like and controlled through a program. Hereinafter, in order to easily describe a headset including a thermoelectric device, this configuration is excluded, but this does not mean that the excluded part is not required.

When the headset is equipped with a thermoelectric device, it can deliver a cool feeling to the skin, providing a comfortable environment while the headset is mounted. For example, when the headset is worn for a long time, a problem such as sweating may occur, which can be prevented through a thermoelectric device.

21 is a perspective view of a headset including a thermoelectric device according to an exemplary embodiment. Referring to FIG. 21, the thermoelectric device 100 may be disposed between the frame 300 of the headset 10 and the buffer member 500.

Thermal stimulation generated from the thermoelectric device 100 may be provided to a user through an open central area of the buffer member 500. Looking at the case where the headset 10 provides a cool feeling to the user, power is supplied to the thermoelectric device 100 to form a cool feeling on the surface facing the buffer member 500 of the thermoelectric device 100, and the frame 300 Heat sensation may be formed on the side opposite to. In addition, heat may be generated as the thermoelectric device 100 operates. The heat may be radiated to the outside through the heat dissipating member. Alternatively, the heat may be radiated to the outside through the frame 300.

As the thermoelectric device 100 is disposed between the frame 300 and the buffer member 500, the advantage of transmitting thermal stimulation without changing the structure of a conventional headset may occur. For example, a headset structure, such as a frame, is designed in consideration of sound provided to a user. When the thermoelectric device 100 is inserted into the frame 300, sound distortion may occur, so the frame 300 There may be a need to redesign the structure of the back headset 10. On the other hand, when the thermoelectric device 100 is disposed between the frame 300 and the buffer member 500, sound distortion may not occur or be minimized without redesigning the structure of the headset 10 such as the frame 300. There may be benefits.

22 is a diagram of a headset including a detachable thermoelectric device according to an exemplary embodiment. The left side of FIG. 22 is a diagram of a headset to which the thermoelectric device 100 is attached, and the right side is a diagram of a headset with the thermoelectric device 100 attached thereto. The user may attach the thermoelectric device 100 to use a headset, or may be detached and used in some cases.

In the above, the configuration and features of the present invention have been described based on the embodiments, but the present invention is not limited thereto, and that various changes or modifications can be made within the spirit and scope of the present invention to those skilled in the art. It is obvious, and therefore such changes or modifications are found to fall within the scope of the appended claims.

10: headset 100: thermoelectric device
300: frame 500: cushioning member
700: speaker 1000: thermoelectric module
1100: thermoelectric element 1300: electrode
1500: terminal 1700: external board
2000: fixing unit 3000: heat transfer member
3100: wing portion 3200: fastening portion
3300: through hole 3400: uneven structure
3500: thermal stimulation providing unit 5000: heat dissipation member
5100: plate portion 5200: rim portion
7000: fixing member 7100: open area
7200: fastening part 7300: protruding part
9000: fastening member 9100: fastening part
9200: seating area

Claims (15)

A thermoelectric device that provides a feeling of cooling to the user by being mounted on a headset including a frame in which a speaker outputting sound is installed in the center and a cushioning member that contacts the user's skin and provides a cushioning effect.- The thermoelectric device includes the frame and the Arranged between the cushioning member-In,
A heat dissipating member including a rim-shaped edge portion centered on a first axis directed from the speaker to the buffer member, and a plate-shaped plate portion extending inward from a point of the edge portion;
A heat transfer member including a cooling sensation providing part perpendicular to the first axis and a plate-shaped wing part extending outward from a point of the cooling sensation providing part; And
A thermoelectric module disposed between the heat dissipating member and the heat transfer member and receiving power to perform a thermoelectric operation.- The thermoelectric module includes a cold surface that absorbs heat and a hot surface formed on the opposite side of the cold surface and radiates heat. -Including ;,
The heat dissipation member and the heat transfer member are disposed to at least partially overlap the plate portion and the wing portion when viewed in the first axial direction,
The thermoelectric module is disposed such that the cold surface and the hot surface face at least a portion of the wing portion and the plate portion, respectively.
Thermoelectric device.
The method of claim 1,
The thickness of one point inside the plate part is thinner than the thickness of one point outside
Thermoelectric device.
The method of claim 1,
The thickness of one point inside the wing is thicker than the thickness of one point outside
Thermoelectric device.
The method of claim 1,
The heat dissipation member has a concave-convex structure formed on the outside of the rim in the first axial direction to increase waste heat dissipation to the outside.
Thermoelectric device.
The method of claim 1,
The cooling feeling providing unit is provided in a rim shape in which a central region is opened, and an uneven structure is formed on the inner side of the rim shape.
Thermoelectric device.
The method of claim 5,
The uneven structure is formed in a second axis direction perpendicular to the first axis
Thermoelectric device.
The method of claim 1,
The cooling feeling providing unit is provided in a plate shape in which a plurality of through holes are formed
Thermoelectric device.
The method of claim 1,
The thermoelectric module includes an N-type semiconductor, a P-type semiconductor, and an electrode connecting the N-type semiconductor and the P-type semiconductor.
Thermoelectric device.
The method of claim 1,
The thermoelectric device,
A fixing member disposed between the heat dissipation member and the heat transfer member and into which the thermoelectric module is inserted; further comprising,
The thermal conductivity of the fixing member is lower than that of the heat dissipation member and the heat transfer member.
Thermoelectric device.
The method of claim 9,
The fixing member includes a protrusion formed to be disposed inside at least a partial region of the edge portion
Thermoelectric device.
The method of claim 9,
The heat transfer member further includes a fastening portion extending outwardly from a point of the cooling sensation providing portion,
The heat transfer member and the fixing member are coupled through the fastening part
Thermoelectric device.
The method of claim 1,
The thermoelectric device,
Further comprising a plate-shaped fastening member disposed so as to surround at least a portion of an outer side of the cooling sensation providing unit on which the wing portion is not formed on the same plane as the plane in which the heat transfer member is disposed;
Thermoelectric device.
The method of claim 12,
The fastening member includes one or more fastening parts that are coupled to the buffer member to fix the thermoelectric device and the buffer member.
Thermoelectric device.
The method of claim 1,
The thermoelectric device is detachable to the headset
Thermoelectric device.
A speaker outputting sound;
A frame in which the speaker is installed in the center;
A cushioning member that contacts the user's skin and provides a cushioning effect; And
Including; a thermoelectric device disposed between the frame and the buffer member to provide a feeling of cooling to the user,
The thermoelectric device,
A heat dissipating member including a rim-shaped edge portion centered on a first axis directed from the speaker to the buffer member, and a plate-shaped plate portion extending inward from a point of the edge portion;
A heat transfer member including a cooling sensation providing part perpendicular to the first axis and a plate-shaped wing part extending outward from a point of the cooling sensation providing part; And
A thermoelectric module disposed between the heat dissipating member and the heat transfer member and receiving power to perform a thermoelectric operation.- The thermoelectric module includes a cold surface that absorbs heat and a hot surface formed on the opposite side of the cold surface and radiates heat. -Including ;,
The heat dissipation member and the heat transfer member are disposed to at least partially overlap the plate portion and the wing portion when viewed in the first axial direction,
The thermoelectric module is disposed such that the cold surface and the hot surface face at least a portion of the wing portion and the plate portion, respectively.
headset.

Images