KR20200081927A - Anti-static silicone release film - Google Patents

Abstract

The present invention relates to an antistatic silicone release film having an antistatic function and an excellent appearance and, more particularly, to an antistatic silicone release film, which suppresses the static electricity generated when a release film is separated from an adhesive layer, thereby solving problems such as a resulting contamination phenomenon, poor peeling and the like; has an appropriate range of peeling force and a high level of residual adhesion rate, and thus can be appropriately used in accordance with purposes without deteriorating the performance of the adhesive layer; forms a dense coating layer so as to provide excellent durability of the coating layer; has solvent resistance to organic solvents; has high adhesion between the coating layer and a substrate; and has a little change in physical properties depending on temperature and time, thereby ensuring stable release and antistatic properties.

Description

Antistatic silicone release film {ANTI-STATIC SILICONE RELEASE FILM}

The present invention relates to an antistatic silicone release film, more specifically, an excellent antistatic function to eliminate side effects due to static electricity when peeling off the adhesive, excellent adhesion to the substrate of the coating layer and excellent coating appearance It relates to a silicone release film.

Currently, the use of synthetic resins or synthetic fibers is rapidly increasing as the development of industrialization in the fields of semiconductors, electrical and electronics, and displays rapidly increases, and thus electrostatic problems in the processing process are emerging.

In general, in the release film field used for the function of protecting the adhesive layer, the demand for the antistatic function is steadily increasing. Conventionally, the anti-static function was provided to the pressure-sensitive adhesive to solve problems such as contamination and peeling defects caused by static electricity generated when the release film was separated from the pressure-sensitive adhesive layer, but due to the incompatibility between the anti-static component and the pressure-sensitive adhesive component It was difficult to implement sufficient antistatic performance. Therefore, in recent years, in many cases, an antistatic function is provided to the release layer in addition to the pressure-sensitive adhesive.

On the other hand, as a release property required for a release film for use in the display field, when a release film is prepared using a silicone release composition, the release film, which is a basic property of the release film, has excellent peel strength or residual adhesion, but has excellent coating appearance and adhesion. The need for technology development is increasing.

Conventional antistatic techniques include an internal addition method using an anion compound, a method of depositing a metal compound, a method of applying conductive inorganic particles, a method of applying a low molecular weight ionic compound, and a method of applying a conductive polymer. , By applying such an antistatic technology, a method of producing an antistatic release film by using a metal in a silicone composition has been used.

However, this method is not only disadvantageous in economical aspects, but also has limitations in implementing sufficient antistatic performance, and there is a problem in that a uniform coating layer is not formed. This is because when the antistatic composition uses an ionic compound, it is difficult to secure excellent wettability due to compatibility problems with the silicone release composition.

Thus, the present inventors confirmed that the silicone release coating composition for preparing the release film can be prepared by mixing the conductive polymer resin having excellent compatibility and a surfactant that has excellent wettability, thereby producing an antistatic silicone release film. Completed.

Korean Patent Publication No. 2015-0104477

The present invention has been devised to solve the above problems, and the object of the present invention is to use a release film for semiconductor, electrical and electronic and display applications by having an excellent antistatic property through an in-line manufacturing process. The purpose of the present invention is to provide an antistatic silicone release film that can reduce side effects such as product contamination and peeling defects due to static electricity during peeling.

Another object of the present invention is to provide an antistatic silicone release film having excellent coating appearance and adhesion to the release film and having stable antistatic and release properties.

The above and other objects and advantages of the present invention will become more apparent from the following description of the preferred embodiment.

The object includes a polyester base film and a coating layer coated at least once with an antistatic silicone release composition on at least one side of the polyester base film, wherein the antistatic silicone release composition comprises an alkenyl polysiloxane, a hydropolysiloxane, It is achieved by an antistatic silicone release film, comprising a conductive polymer resin, a binder compound, a platinum chelate catalyst and an ionic surfactant having both cations and anions simultaneously as a surfactant.

Here, the anion of the ionic surfactant may be an anion derived from sulfonic acid, phosphorous acid or carboxylic acid.

Preferably, the cation of the ionic surfactant may be a cation selected from alkali metal ions, alkaline earth metal ions, transition metal ions or ammonium ions.

Preferably, the surfactant has the structure of Formula 4,

[Formula 4]

R ₁ and R ₂ are each independently an alkyl group of C ₁ ~C ₁₈ ,

R ₃ is hydrogen, a hydrogen group or an alkyl group selected from a methyl group or an ethyl group,

R ₄ is a cationic group selected from alkali metal ions, alkaline earth metal ions, transition metal ions or ammonium ions,

A is an anionic group derived from sulfonic acid, phosphorous acid or carboxylic acid,

m and n may be integers of 1 to 4, respectively.

Preferably, the ionic surfactant may be included in an amount of 0.01 part by weight or more and less than 5 parts by weight based on 100 parts by weight of the alkenyl polysiloxane.

Preferably, the alkenyl polysiloxane has the structure of Formula 1,

[Formula 1]

In Formula 1, R ₁ , R ₂ and R ₃ are independently -CH ₃ , -CH=CH ₂ ,- CH ₂ CH=CH ₂ and -(CH ₂ ) ₄ CH=CH ₂ Alkyl or Alke It is a nil group, m and n may be an integer of 10 to 500, respectively.

Preferably, the hydropolysiloxane has the structure of Formula 2,

[Formula 2]

In Formula 2, a may be an integer from 1 to 200, and b may be an integer from 1 to 400.

Preferably, the hydropolysiloxane may include 2 to 10 parts by weight based on 100 parts by weight of the alkenyl polysiloxane.

Preferably, the platinum catalyst may include 1 to 1000ppm compared to the entire release layer.

Preferably, the antistatic silicone release composition further comprises a peel force modifier, wherein the peel force modifier comprises at least one of compounds having the structures of Formulas 3-1 to 3-4 below,

[Formula 3-1]

[Formula 3-2]

[Formula 3-3]

[Formula 3-4]

In Formula 3-1 to Formula 3-3, R ₄ may be at least any one of methyl, ethyl, hexyl, vinyl, hexenyl, phenyl, hydroxyl, methoxy and ethoxy.

Preferably, the conductive polymer resin may include 1 to 5 parts by weight based on 100 parts by weight of the alkenyl polysiloxane.

Preferably, the conductive polymer resin may be polymer particles having an average particle diameter of 10 to 90 nm.

Preferably, the thickness of the polyester base film is 15 ~ 300㎛, the thickness of the coating layer may be 0.01 ~ 10㎛.

Preferably, the antistatic silicone release composition may include 0.5 to 15% by weight of solid content and the balance of water relative to the total weight of the antistatic silicone release composition.

Preferably, the surface tension of the polyester base film may be 1.0 to 1.5 times that of the antistatic silicone release coating layer.

More preferably, the antistatic silicone release film has a defect area ratio calculated from Equation 2 below less than 1%,

[Equation 2]

Defect area ratio (%) = Area of bubble defect/ 25cm ² X 100

Here, the area of the bubble defect is calculated by calculating the area in a circle based on the longest length of the bubble defect in the antistatic silicone release film sample of 5 cm X 5 cm, and then calculating as the sum of the areas of the bubble defects (cm ² ). It can be an area.

More preferably, the coating layer satisfies the following formulas 1 to 3 at the same time,

10 ≤ RF ≤ 100 (Equation 1)

80 ≤ SA ≤ 100 (Equation 2)

SR ≤ 10^12 (Equation 3)

Here, RF (g/inch) is the peel force of the coating layer, SA (%) is the residual adhesion rate of the coating layer, and SR (Ω/sq) may be the surface resistance of the coating layer.

According to the present invention, it has an antistatic property, there is an effect that can solve problems such as contamination and peeling defects due to static electricity generated when the release film is separated from the pressure-sensitive adhesive layer.

Furthermore, the present invention has excellent coating appearance and can have stable antistatic properties and release properties. In addition, by forming a dense coating layer, it has the effect of having stable release properties with little change with temperature and time.

However, the effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a cross-sectional view of an antistatic silicone release film comprising an antistatic silicone release layer according to an aspect of the present invention.
Figure 2 is a cross-sectional view of an antistatic silicone release film comprising an antistatic silicone release layer according to another aspect of the present invention.
Figure 3 is a cross-sectional view of an antistatic silicone release film comprising an antistatic silicone release layer according to another aspect of the present invention.

Hereinafter, the present invention will be described in detail with reference to examples and drawings of the present invention. These examples are only provided by way of example to illustrate the present invention in more detail, it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples. .

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control. Also, although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, suitable methods and materials are described herein.

First, an antistatic silicone release film according to an aspect of the present invention will be described in detail with reference to FIG. 1 which is a cross-sectional view of an antistatic silicone release film including an antistatic silicone release layer according to an aspect of the present invention.

Referring to FIG. 1, the antistatic silicone release film 100 according to an aspect of the present invention includes a polyester base film 110 and an antistatic silicone release coating layer 120 formed on at least one surface of the polyester base film. do.

More specifically, the antistatic silicone release coating layer 120 of the antistatic silicone release film according to an aspect of the present invention is an alkenyl polysiloxane, a hydroelectric polysiloxane, a conductive polymer resin, a binder compound, a platinum chelate catalyst and a cation and anion as a surfactant. It may be a coating layer coated with an antistatic silicone release composition comprising an ionic surfactant having at the same time.

First, the antistatic silicone release composition according to the present invention includes an alkenyl polysiloxane having the structure of Formula 1 and a hydropolysiloxane having the structure of Formula 2 below.

[Formula 1]

Here, m and n are each independently an integer of 10 to 500. At this time, m and n do not mean a block combination, but they only mean that the sum of units is m and n, respectively. Therefore, in Formula 1, each unit is randomly coupled or blockly coupled. Further, R ₁ , R ₂ and R ₃ are each independently an alkyl or alkenyl group of -CH ₃ , -CH=CH ₂ ,- CH ₂ CH=CH ₂ and -(CH ₂ ) ₄ CH=CH ₂ . The alkenyl group may be present in any part of the molecule, but it is preferred that at least two or more are present.

[Formula 2]

Here, a is an integer from 1 to 200, and b is an integer from 1 to 400. At this time, a and b do not mean a block combination, but they only mean that the sum of units is a and b, respectively. Therefore, each unit in Formula 2 is randomly coupled or blockly coupled.

In the antistatic silicone release composition according to an embodiment of the present invention, the alkenyl polysiloxane having the structure of Formula 1 and the hydropolysiloxane having the structure of Formula 2 may be either linear, branched, radial, or cyclic, Mixtures of these are also good. In addition, it is preferable that the mixing ratio of the alkenyl polysiloxane and the hydrogen polysiloxane includes 2 to 10 parts by weight of the hydropolysiloxane based on 100 parts by weight of the alkenyl polysiloxane. When the hydroelectric polysiloxane is less than 2 parts by weight, the sufficient amount of unreacted alkenyl polysiloxane is not obtained, so that sufficient release property cannot be obtained, and thus stable release properties cannot be achieved. When it exceeds 10 parts by weight, the amount of unreacted hydropolysiloxane increases. This is because the peeling properties may be deteriorated.

In addition, the antistatic silicone release composition according to an embodiment of the present invention may further include a peeling force adjusting agent. The peel force modifier is an organo polysiloxane resin containing a hydroxyl group, and may include at least one of compounds having structures of Formula 3-1 to Formula 3-4. Compounds having the structures of Chemical Formulas 3-1 to 3-4 may have a repeating structure in a straight chain, branched, radial and cyclic form.

[Formula 3-1]

[Formula 3-2]

[Formula 3-3]

[Formula 3-4]

In Formula 3-1 to Formula 3-3, R ₄ may be at least any one of methyl, ethyl, hexyl, vinyl, hexenyl, phenyl, hydroxyl, methoxy and ethoxy.

In the antistatic silicone release composition according to an embodiment of the present invention, the peeling force modifier may preferably include 0 to 100 parts by weight of the peeling force modifier relative to 100 parts by weight of the alkenyl polysiloxane. This is because when the content of the peeling force modifier exceeds 100 parts by weight, the peeling force is too high and peeling failure with the adhesive layer may occur.

In addition, the antistatic silicone release composition according to an embodiment of the present invention may include a conductive polymer resin to impart antistatic performance. The conductive polymer resin is preferably an aqueous dispersion containing polyanions and polythiophenes or an aqueous dispersion containing polyanions and polythiophene derivatives.

The polyanion is an acidic polymer, and there are polymer carboxylic acid or polymer sulfonic acid and polyvinyl sulfonic acid. Examples of the polymer carboxylic acid include polyacrylic acid, polymethacrylic acid, and polymaleic acid, and examples of the polymer sulfonic acid include polystyrene sulfonic acid, but are not limited thereto.

With respect to the polythiophene or the polythiophene derivative, it is preferable from the viewpoint of imparting conductivity that the solid anion by weight of the polyanion is excessive. In the following examples of the present invention, an aqueous dispersion containing 0.5% by weight of poly(3,4-ethylenedioxythiophene) and 0.8% by weight of polystyrene sulfonic acid is used, but is not limited thereto. Preferably, the weight ratio of polythiophene or polythiophene derivative to polyanion is greater than 1 and less than 5, more preferably greater than 1 and less than 3.

The antistatic silicone release composition according to one embodiment of the present invention preferably contains 1 to 5 parts by weight of the conductive polymer resin with respect to 100 parts by weight of the alkenyl polysiloxane. This is because when the content of the conductive polymer resin is less than 1 part by weight, sufficient antistatic properties cannot be obtained, and when it is more than 5 parts by weight, there is a problem that the release property is deteriorated due to the influence of peeling force and residual adhesion rate. .

In addition, the conductive polymer resin is characterized by using a water dispersion having an average particle size of 10 to 90 nm to express stable antistatic performance. When the average particle diameter of the conductive polymer resin exceeds 90 nm, it is not uniformly distributed inside the coating layer, and thus the variation in surface resistance becomes very large, so that antistatic performance cannot be properly implemented. In addition, if the average particle diameter of the conductive polymer resin is less than 10 nm, as the molecular weight decreases, it becomes impossible to implement antistatic performance when the distance is greater than a certain distance between molecules, and when stretching inline, the smaller the average particle diameter, the lower the antistatic performance.

In addition, the antistatic silicone release composition according to an embodiment of the present invention controls the crosslink density to derive stable release properties and antistatic properties, and improves the compatibility of the conductive polymer resin to realize uniform antistatic properties, and It is characterized by further including a binder compound for the purpose of improving the solvent resistance and durability and increasing the adhesion between the coating layer and the substrate.

The binder compound has any one or more functional groups selected from the group consisting of amino, epoxy, hydroxy, aldehyde, ester, vinyl, acrylic, imide, cyano, and isocyanate groups, preferably epoxy functional groups It is characterized by including the epoxy-based compound. This is because the epoxy system has excellent compatibility and stretchability with a conductive polymer. That is, compatibility differs depending on the content of N, C, and O, and an alkenyl group is attached to the functional group of the conductive polymer, so that the stretchability due to the swelling effect is improved.

The binder compound in the antistatic silicone release composition preferably contains 5 to 20 parts by weight of the binder mixture relative to 100 parts by weight of the alkenyl polysiloxane. When the content of the binder compound is less than 5 parts by weight, the coating layer has a low adhesion to the substrate and the coating layer is peeled off, or the compatibility of the conductive polymer resin is poor, resulting in uneven antistatic performance, and the binder compound has a content of 20% by weight. This is because when the amount is exceeded, a problem arises in that the release property is deteriorated by affecting the peeling force and the residual adhesion rate.

In addition, the antistatic silicone release composition according to an embodiment of the present invention further includes a platinum chelate catalyst, and performs a function of helping addition reactions of Formula 1 and Formula 2, and the platinum chelate catalyst in the antistatic silicone release composition is 1ppm to It is preferred to include 1000 ppm.

In addition, the antistatic silicone release composition according to an embodiment of the present invention may include an ionic surfactant having a cation (cationic group) and an anion (anionic group) simultaneously as a surfactant. Such an ionic surfactant may be, for example, an ionic surfactant composed of an ester compound having a dissociable cation and containing an anionic group.

In the case of applying a nonionic surfactant that does not have an anionic group, there is a problem that it is difficult to properly control the surface tension of the antistatic silicone release composition. There is a problem to be recognized a lot, and in particular, when applying a silicone-based nonionic surfactant containing siloxane, the surface tension of the antistatic release composition is not properly adjusted, and compatibility with the conductive polymer resin is also insufficient. In order to solve this problem, in the present invention, an ionic surfactant having both a cation and an anion is used because there is a problem of appearance defects by forming aggregates.

In addition, the surfactant according to the present invention is an alkenyl polysiloxane by applying an antistatic release composition comprising an ionic surfactant having an anionic group selected from sulfo-, phosphor-, or carboxyl- groups among ionic surfactants containing anionic groups. , While maintaining compatibility with the hydroelectric polysiloxane and the conductive polymer resin, it is possible to secure the optimum wettability to the base film.

The surfactant according to an embodiment of the present invention may be an ionic surfactant having the structure of Formula 4 below.

[Formula 4]

R ₁ and R ₂ are each independently an alkyl group of C ₁ ~C ₁₈ ,

R ₃ is hydrogen, a hydrogen group or an alkyl group selected from a methyl group or an ethyl group,

R ₄ is a cationic group selected from alkali metal ions, alkaline earth metal ions, transition metal ions or ammonium ions,

A is an anionic group derived from sulfonic acid, phosphorous acid or carboxylic acid,

m and n are each an integer of 1-4.

The ionic surfactant according to an embodiment of the present invention may include 0.01 part by weight or more and less than 5 parts by weight based on 100 parts by weight of an alkenyl polysiloxane, and preferably 0.05 to 1 part by weight. This is because when the content of the ionic surfactant is less than 0.01 part by weight, the content is not sufficient to serve as a surfactant, so the effect of improving the appearance of the antistatic silicone release film does not appear, and the content of the ionic surfactant is 5 parts by weight or more. This is because there is a problem in that it exhibits unstable release properties, such as an increase in peeling force due to an increase in the interaction with the adhesive.

The antistatic silicone release coating layer 120 of the antistatic silicone release film according to an embodiment of the present invention comprises the above-described antistatic silicone release composition on the polyester base film 110 as a bar coat method, reverse roll coat method, gravure roll coat. It may be formed by applying one or more times through a known method such as a method.

In addition, the antistatic silicone release composition according to an embodiment of the present invention is diluted to contain 0.5 to 15% by weight of solid content relative to the total weight of the antistatic silicone release composition, and then coated on a polyester base film. When the solid content of the antistatic silicone release composition is less than 0.5% by weight, a uniform coating layer is not obtained, and thus stable release properties and antistatic properties cannot be obtained, and when it exceeds 15% by weight, blocking between films occurs. There is a problem in that the adhesion of the base material of the composition is deteriorated, causing a silicone transfer problem, and a poor coating appearance.

In addition, the solvent of the antistatic silicone release composition is not limited in kind as long as it can be applied on the polyester base film by dispersing the solid content of the present invention, but is preferably coated in the state of an aqueous coating solution using water as the main medium.

In addition, the antistatic silicone release film according to an embodiment of the present invention has a surface tension of 1.0 to 1.5 times that of the polyester base film compared to the antistatic silicone release coating layer. At this time, when the surface tension of the polyester base film is less than 1.0 times as compared to the antistatic silicone release coating layer, the wettability of the coating solution is deteriorated.

In addition, for the purpose of improving the applicability to the coating composition used in the present invention, improving transparency, etc., it may further contain a suitable organic solvent to the extent that does not impair the effects of the present invention, and preferred organic solvent is isopropyl alcohol , Butyl cellosolve, ethyl cellosolve, acetone, methanol, ethanol, and the like can be used. However, when a large amount of organic solvent is contained in the coating composition, the content of the organic solvent is 10% by weight or less, more preferably, in the coating composition, since there is a risk of explosion in the drying, stretching, and heat treatment processes when applied to the in-line coating method It is preferred to limit it to 5% by weight or less.

In addition, the thickness of the polyester base film 110 according to an embodiment of the present invention is preferably 15 to 300㎛. When the thickness of the film is less than 15 μm, the degree of deformation due to external force increases, and thus, the use as a carrier film is not satisfied. When the thickness of the film exceeds 300 μm, there is a problem that economic efficiency is deteriorated.

In addition, the thickness of the coating layer 120 according to an embodiment of the present invention is preferably 0.01 to 10㎛. This may prevent the uniform coating layer 120 from being formed when the thickness of the coating layer is less than 0.01 μm, and blocking may occur between one surface and the back surface of the polyester substrate film 110 on which the coating layer 120 is formed when it is more than 10 μm. Because it can.

Also, from FIG. 2, which is a cross-sectional view of an antistatic silicone release film including an antistatic silicone release layer according to another aspect of the present invention, an antistatic silicone release film 200 comprising an antistatic silicone release layer according to another aspect of the present invention (200) ) May include an antistatic silicone release coating layer 220 on one side of the polyester base film 210 and a polyester base film and an antistatic silicone release coating layer 230 on the other side. In this case, the coating composition for constituting the antistatic silicone release coating layer 230 may not include a peeling force adjusting agent.

Also, from FIG. 3, which is a cross-sectional view of an antistatic silicone release film comprising an antistatic silicone release layer according to another aspect of the present invention, an antistatic silicone release film comprising an antistatic silicone release layer according to another aspect of the present invention. 300 may be provided with an antistatic silicone release coating layer 320 on one side of the polyester base film 310 and a polyester base film and a silicone release coating layer 330 on the other side. In this case, the coating composition for forming the silicone release coating layer 330 may not include a conductive polymer resin.

Hereinafter, the configuration of the present invention and its effects will be described in more detail through examples and comparative examples. However, this example is intended to illustrate the present invention in more detail, and the scope of the present invention is not limited to these examples.

[Example]

[Example 1]

In order to form an antistatic silicone release layer on one side of a corona-treated polyester base film (Toray Advanced Materials, Excell-50µm), a hydroelectric polysiloxane (100 parts by weight of alkenyl polysiloxane (manufactured by Dow Corning)) Dow Corning Co.) 5 parts by weight, conductive polymer resin (poly3,4-ethylenedioxythiophene 0.5% by weight and polystyrene sulfonic acid (molecular weight Mn = 150,000) water dispersion containing 0.8% by weight, average particle diameter 50nm) 2.5 parts by weight, Antistatic silicone by mixing 10 parts by weight of an epoxy-based binder compound (CR-5L of Sprix Technology) and 50 parts by weight of a platinum chelate catalyst (manufactured by Dow Corning), 0.2 parts by weight of an ionic surfactant (dioctyl sulfo succinate sodium salt) in water A release composition was prepared. The prepared antistatic silicone release composition was diluted in water so that the solid content was 5% by weight and applied to one side of the polyester base film. After coating, drying was performed at 180° C. for 50 seconds to prepare an antistatic silicone release film.

[Example 2]

An antistatic silicone release film was prepared through the same procedure as in Example 1, except that dioctyl sulfo succinate ammonium was used as the ionic surfactant.

[Example 3]

An antistatic silicone release film was prepared through the same procedure as in Example 1, except that dioctyl phospho succinate sodium salt was used as the ionic surfactant.

[Example 4]

An antistatic silicone release film was prepared in the same manner as in Example 1, except that dioctyl carboxylate succinate sodium salt was used as the ionic surfactant.

[Example 5]

An antistatic silicone release film was prepared in the same manner as in Example 1, except that 0.02 parts by weight of the ionic surfactant was used.

[Example 6]

An antistatic silicone release film was prepared through the same procedure as in Example 1, except that 2 parts by weight of an ionic surfactant was used.

[Example 7]

An antistatic silicone release film was prepared through the same procedure as in Example 1, except that the hydropolysiloxane was used in 10 parts by weight.

[Example 8]

The same process as in Example 1, except that the antistatic silicone release composition contained 25 parts by weight of an alkenyl polysiloxane (manufactured by Dow Corning) compared to 100 parts by weight of a peel strength modifier having a structure of Formula 3-1 (manufactured by Dow Corning). Through this, an antistatic silicone release film was prepared.

[Example 9]

An antistatic silicone release film was prepared through the same process as in Example 1, except that 1 part by weight of the conductive polymer resin was used.

[Example 10]

An antistatic silicone release film was prepared through the same procedure as in Example 1, except that 3.5 parts by weight of the conductive polymer resin was used.

[Comparative Example 1]

An antistatic silicone release film was prepared in the same manner as in Example 1, except that 0.002 parts by weight of dioctyl sulfo succinate sodium salt was used as the ionic surfactant.

[Comparative Example 2]

An antistatic silicone release film was prepared in the same manner as in Example 1, except that 5 parts by weight of dioctyl sulfo succinate sodium salt was used as the ionic surfactant.

[Comparative Example 3]

An antistatic silicone release film was prepared in the same manner as in Example 1, except that 0.2 parts by weight of dioctyl hydroxy succinate was used as the nonionic surfactant.

[Comparative Example 4]

An antistatic silicone release film was prepared in the same manner as in Example 1, except that 0.22 parts by weight of a silicone surfactant (Dow Corning, Shin-Etsu) was used as the surfactant.

[Comparative Example 5]

An antistatic silicone release film was prepared in the same manner as in Example 1, except that the sulfo succinate sodium salt was used as the surfactant.

[Comparative Example 6]

An antistatic silicone release film was prepared in the same manner as in Example 1, except that the hydropolysiloxane was used in 1 part by weight.

[Comparative Example 7]

An antistatic silicone release film was prepared through the same procedure as in Example 1, except that the hydropolysiloxane was used in 20 parts by weight.

[Comparative Example 8]

An antistatic silicone release film was prepared through the same procedure as in Example 1, except that 0.5 part by weight of the conductive polymer resin was used.

[Comparative Example 9]

An antistatic silicone release film was prepared through the same process as in Example 1, except that 7 parts by weight of the conductive polymer resin was used.

Using the antistatic silicone release film according to Examples 1 to 10 and Comparative Examples 1 to 9, physical properties were measured through the following experimental examples and the results are shown in Table 1 below.

[Experimental Example]

(1) Antistatic characteristics

Using a surface resistance meter (Mitsubishi, MCP-T600), a sample was installed under an environment of a temperature of 23° C. and a humidity of 50% RH, and then the surface resistance of the coating layer was measured according to JIS K7194.

(2) Peel force measurement

After attaching the release film with a double-sided adhesive tape on the cold-rolled stainless steel plate, the adhesive tape (TESA 7475) is placed on the release layer and compressed with a 2kg compression roller, left at room temperature for 1 to 7 days, and then peeled. The force was measured.

The peel force was measured using an AR-1000 (Chem-Instrument) at a peel angle of 180ㅀ and a peel rate of 0.3mpm, and the average value (g/inch) was calculated by measuring 5 times and rounded off at the first decimal place.

(3) Residual adhesion rate measurement

After placing the adhesive tape (Nitto 31B) on the release layer and pressing it with a 2 kg crimping roller to stand at room temperature for 30 minutes, the adhesive tape was peeled off from the release layer and then attached to a cold rolled stainless steel plate to measure the peel force.

In addition, after the adhesive tape (Nitto 31B), which was never used for comparison, was attached to a cold-rolled stainless steel plate, the peel force was measured.

The peel force was measured using an AR-1000 (Chem-Instrument) at a peel angle of 180ㅀ and a peel rate of 0.3mpm, and was measured 5 times to calculate an average value.

Residual adhesion was calculated according to the following equation (1).

[Equation 1]

Residual adhesion rate = Peeling force of the adhesive tape peeled from the release layer/ Peeling force of the adhesive tape which has never been usedⅩ

(4) Defect area measurement

The area of the bubble defect was measured compared to the area of the 5 cmX 5 cm release film sample.

After measuring the longest length of the bubble defect in the 5 cm X 5 cm release film sample, the area was calculated as a circle, and the whole was added to obtain the area of the bubble defect (cm ² ).

The degree of bubble defects was calculated according to Equation 2 below.

[Equation 2]

Defect area ratio (%) = Area of bubble defect/ 25cm ² X 100

When the degree of bubble defect is 0% or more and less than 1% (◎), 1% or more and less than 2% (○), 2% or more and less than 5% (△), 5% or more and less than 100% (Ｘ ).

(5) Jungle Castle

-The coating layer was rubbed 5 times with a thumb and evaluated visually.

No smear (◎): No change after evaluation

Slightly smear (○): finely pushed but no problem in use

Smear (△): Cloudy blur of coating layer as oil is pushed

Rub-off (Ｘ): The coating layer clumps and falls off

division Surface resistance
(Ω/sq) Peeling force
(g/inch) Residual adhesion rate
(%) Exterior
(Defect area ratio) Jungle castle Example 1 1 x 10 ⁷ 15 93 ◎ ◎ Example 2 4 x 10 ⁸ 15 82 ◎ ◎ Example 3 1 x 10 ⁷ 15 93 ◎ ◎ Example 4 1 x 10 ⁷ 15 92 ◎ ◎ Example 5 1 x 10 ⁷ 17 94 ◎ ◎ Example 6 1 x 10 ⁷ 13 87 ◎ ◎ Example 7 1 x 10 ⁷ 19 97 ◎ ◎ Example 8 3 x 10 ⁸ 40 93 ◎ ◎ Example 9 1 x 10 ⁸ 15 94 ◎ ◎ Example 10 2 x 10 ⁶ 15 93 ◎ ◎ Comparative Example 1 1 x 10 ¹² 15 90 Ｘ ◎ Comparative Example 2 1 x 10 ¹¹ 10 70 △ △ Comparative Example 3 1 x 10 ¹³ 18 89 Ｘ ◎ Comparative Example 4 2 x 10 ¹² 9 62 Ｘ △ Comparative Example 5 1 x 10 ¹² 17 88 Ｘ △ Comparative Example 6 1 x 10 ⁸ 8 61 ◎ Ｘ Comparative Example 7 1 x 10 ⁷ 68 97 △ ◎ Comparative Example 8 1 x 10 ¹³ 15 92 ○ ◎ Comparative Example 9 1 x 10 ⁶ 9 69 ○ Ｘ

As can be seen from Table 1, the release films according to Examples 1 to 10 had almost no defects, so that the coating appearance was excellent, but the coating layer had excellent sliding properties, and the surface resistance and peel strength had a value in an appropriate range while remaining adhesive. It was also confirmed that the rate was excellent.

In addition, in the case of the release film according to Example 8, it was confirmed that peeling force control was also possible.

On the other hand, in the case of the release films according to Comparative Examples 1 and 2, the content of the surfactant was too small or too large, and many foam defects occurred, so that the appearance of the coating was not improved, and the release films according to Comparative Examples 3 and 4 were of the present invention. Unlike the examples, when a conventional nonionic surfactant or a silicone-based surfactant was applied, it was confirmed that the coating appearance was poor due to a large number of bubble defects.

In addition, the release film according to Comparative Example 5 exhibited poor coating appearance due to low bubble solubility in the release composition, resulting in poor coating appearance, and the release films according to Comparative Examples 6 and 7 had a content of hydropolysiloxane It was confirmed that the release properties, such as too little or too much, the peeling force excessively increased or the residual adhesiveness excessively decreased, were lowered.

In addition, it can be seen that the antistatic silicone release films according to Comparative Examples 8 and 9 had too little or too much content of the conductive polymer resin, so that the surface resistance, which is an antistatic property, was excessively increased, or the residual adhesion rate, which was a release property, was excessively decreased. there was.

As described above, according to the antistatic silicone release film according to the embodiment of the present invention, it can be seen that the antistatic property, the peeling force and the residual adhesion rate are excellent, while the coating appearance and adhesion are excellent.

In this specification, only a few examples of various embodiments performed by the present inventors are described, but the technical spirit of the present invention is not limited to or limited thereto, and can be variously implemented by a person skilled in the art.

100, 200, 300: antistatic silicone release film
110, 210, 310: polyester base film
120, 220, 320: antistatic silicone release coating layer
230: antistatic silicone release coating layer
330: silicone release coating layer

Claims (17)

Polyester base film,
The at least one side of the polyester base film includes a coating layer applied at least once with an antistatic silicone release composition,
The antistatic silicone release composition is an alkenyl polysiloxane, a hydroelectric polysiloxane, a conductive polymer resin, a binder compound, a platinum chelate catalyst, and an ionic surfactant having both an anion and an anion as a surfactant, an antistatic silicone release film. According to claim 1,
The anion of the ionic surfactant is an anion derived from sulfonic acid, phosphorous acid or carboxylic acid, antistatic silicone release film. According to claim 1,
The cation of the ionic surfactant is a cation selected from alkali metal ions, alkaline earth metal ions, transition metal ions or ammonium ions, antistatic silicone release film. According to claim 1,
The surfactant has the structure of Formula 4,
[Formula 4]

R ₁ and R ₂ are each independently an alkyl group of C ₁ ~C ₁₈ ,
R ₃ is hydrogen, a hydrogen group or an alkyl group selected from a methyl group or an ethyl group,
R ₄ is a cationic group selected from alkali metal ions, alkaline earth metal ions, transition metal ions or ammonium ions,
A is an anionic group derived from sulfonic acid, phosphorous acid or carboxylic acid,
m and n are integers of 1 to 4,
Antistatic silicone release film. According to claim 1,
The ionic surfactant is contained in less than 5 parts by weight of at least 0.01 parts by weight compared to 100 parts by weight of the alkenyl polysiloxane, antistatic silicone release film. According to claim 1,
The alkenyl polysiloxane has the structure of Formula 1,
[Formula 1]

In Formula 1, R ₁ , R ₂ and R ₃ are independently -CH ₃ , -CH=CH ₂ ,- CH ₂ CH=CH ₂ and -(CH ₂ ) ₄ CH=CH ₂ Alkyl or Alke An antistatic silicone release film, which is a nil group and m and n are integers of 10 to 500, respectively. According to claim 1,
The hydropolysiloxane has the structure of Formula 2,
[Formula 2]

In Formula 2, a is an integer from 1 to 200, and b is an integer from 1 to 400, an antistatic silicone release film. According to claim 1,
The hydropolysiloxane comprises 2 to 10 parts by weight based on 100 parts by weight of the alkenyl polysiloxane, an antistatic silicone release film. According to claim 1,
The platinum catalyst comprises 1 to 1000ppm compared to the entire release layer, antistatic silicone release film. According to claim 1,
The antistatic silicone release composition further comprises a peeling power regulator,
The peel force adjusting agent includes at least any one of compounds having a structure of Formula 3-1 to Formula 3-4 below,
[Formula 3-1]

[Formula 3-2]

[Formula 3-3]

[Formula 3-4]

In Formula 3-1 to Formula 3-3, R ₄ is at least one of methyl, ethyl, hexyl, vinyl, hexenyl, phenyl, hydroxyl, methoxy, and ethoxy, an antistatic silicone release film. According to claim 1,
The conductive polymer resin is based on 100 parts by weight of the alkenyl polysiloxane
An antistatic silicone release film comprising 1 to 5 parts by weight. According to claim 1,
The conductive polymer resin is a polymer particle having an average particle diameter of 10 to 90 nm, an antistatic silicone release film. According to claim 1,
The thickness of the polyester base film is 15 ~ 300㎛, the thickness of the coating layer is 0.01 ~ 10㎛, anti-static silicone release film. According to claim 1,
The antistatic silicone release composition is an antistatic silicone release film comprising 0.5 to 15% by weight of the solid content and the residual amount of water relative to the total weight of the antistatic silicone release composition. According to claim 1,
An antistatic silicone release film having a surface tension of 1.0 to 1.5 times that of a polyester base film compared to the antistatic silicone release coating layer. The method according to any one of claims 1 to 15,
The antistatic silicone release film has a defect area ratio calculated from Equation 2 below less than 1%,
[Equation 2]
Defect area ratio (%) = Area of bubble defect/ 25cm ² X 100
Here, the area of the bubble defect is calculated by calculating the area in a circle based on the longest length of the bubble defect in the antistatic silicone release film sample of 5 cm X 5 cm, and then calculating as the sum of the areas of the bubble defects (cm ² ). Area, antistatic silicone release film. The method according to any one of claims 1 to 15,
The coating layer satisfies the following formulas 1 to 3 at the same time,
10 ≤ RF ≤ 100 (Equation 1)
80 ≤ SA ≤ 100 (Equation 2)
SR ≤ 10^12 (Equation 3)
Here, RF (g / inch) is the peeling force of the coating layer, SA (%) is the residual adhesion rate of the coating layer, SR (Ω / sq) is the surface resistance of the coating layer, anti-static silicone release film.

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