KR20200069081A - Low temperature co-fired sintering composite and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a low temperature co-sintered composite (LTCC) capable of being sintered at a low temperature of 1,000°C or lower, and a manufacturing method thereof. According to the present invention, the LTCC comprises a base phase having a three-dimensional (3D) network structure where ceramic particles are interconnected three-dimensionally, and a glass phase filling pore parts of the base phase. Moreover, the method comprises the following steps: manufacturing a ceramic sheet including ceramic powder particles; primarily heating the ceramic sheet to form a base layer in which the ceramic powder particles are interconnected in the 3D network structure in the ceramic sheet; forming a glass layer on at least one surface of the ceramic sheet; and secondarily heating the ceramic sheet having the glass layer formed thereon to allow the melted glass to be inserted into the pore parts in the base layer, thereby manufacturing the LTCC.

Description

Low-temperature simultaneous sintering composite and its manufacturing method {LOW TEMPERATURE CO-FIRED SINTERING COMPOSITE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a low-temperature co-sintering composite, and particularly to a low-temperature co-sintering composite that is capable of low-temperature sintering and has significantly improved thermal conductivity.

In addition, the present invention relates to a method for manufacturing the low-temperature co-sintering composite.

The ultra-thin substrate material makes it possible to provide an advantageous package having a good heat dissipation function as well as miniaturization and thinning of an electronic device package product. However, when an ultra-thin (for example, a thickness of 0.3 mm or less) ceramic substrate is applied to a package, it is difficult to apply the ceramic material of the current level because its curvature level is in the range of 250 to 350 MPa and is easily fragile.

Accordingly, an ultra-thin ceramic substrate material having excellent mechanical strength and good thermal conductivity is desired, and it can be very advantageously applied to package elements including, for example, a chip type supercap package, a camera for mobile devices, and a high heat dissipation substrate for power devices. .

Ceramic substrate materials having both excellent mechanical strength and good thermal conductivity include ceramics such as alumina (Al ₂ O ₃ ), aluminum nitride (AlN), and silicon nitride (Si ₃ N ₄ ). Roughly, alumina has a bending strength of 310 to 400 MPa, thermal conductivity of 20 to 30 W/mK, aluminum nitride has a bending strength of 330 to 450 MPa, thermal conductivity of 170 to 200 W/mK, and silicon nitride has a bending strength of 650 to 850 MPa, thermal conductivity. With a value of 60 to 90 W/mK, these ceramics are very promising because they have both high mechanical strength and thermal conductivity as well as excellent dielectric properties.

However, for application to a package element, simultaneous low-temperature sintering of 1000°C or less, which can be sintered simultaneously with metal electrodes such as Al, Ag, Cu, etc. of the circuit, is required, and the ceramics (ie, alumina, aluminum nitride, silicon nitride) ) Since itself can be sintered at a high temperature, in order to obtain a dense ceramic sintered body at low temperatures with these high-temperature calcined ceramics, it is generally manufactured as a composite in which a large amount of glass having a low melting point is mixed with these ceramics. That is, such a composite is generally produced as a so-called 0-3 type glass-ceramic composite in which the high-temperature calcined ceramics material is added as a filler to a glass matrix.

FIG. 1 shows the microstructure of a green sheet of a typical glass-ceramic composite in which the glass is matrix. In addition, FIGS. 2A and 2B show the heat transfer path in the microstructure of the glass-ceramic composite prepared by sintering the green sheet of FIG. 1, and FIG. 2B is an enlarged view of the portion “A” of FIG. 2A showing the heat transfer path ( H).

As shown in FIG. 1, the glass-ceramic composite 1 in which the glass 2 is formed is a base material, and a ceramic filler material made of a glass and a high-temperature calcined ceramic powder such as alumina is simultaneously with an organic vehicle such as a binder. After mixing and molding into a green sheet, it is common to obtain a compact sintered composite having a compact structure by sintering heat treatment through a lamination and pressing process.

That is, the green sheet of the general glass-ceramic composite 1 shown in FIG. 1 is composed of a glass 2 as a base, ceramic filler particles 3, and other organic binders 4 added thereto. As described above, since the glass 2 is contained in a large amount as a matrix for low-temperature sintering, the content of the ceramic filler 3 is usually only about 30 to 50 vol% of the total amount of the complex 1. Then, the green sheet of FIG. 1 is sintered and heat-treated to produce the glass-ceramic composite 1 shown in FIG. 2A.

Therefore, as illustrated in FIGS. 2A to 2B, the final glass-ceramic composite 1 has a glass matrix phase in which ceramic crystalline particles 3 having high thermal conductivity are low thermal conductivity (which is approximately 0.2 to 0.3 W/mK). (2) is a three-dimensional microstructure isolated from each other.

That is, as better illustrated in FIG. 2B, the high thermal conductivity ceramic particles 3 are isolated from each other by a very low thermal conductivity glass 2, so that the thermal conductivity in the internal heat transfer path H is the ceramic particles 3 ) As it passes through the glass region 2 between, it is greatly attenuated. Therefore, although the glass-ceramic composite 1 is increased to 2 to 3 W/mK, which has a thermal conductivity of about 10 times that of the glass bulk material, it is significantly lower than the crystalline ceramic bulk material, which is a high-temperature plastic material, thus improving It is fundamentally limited to be applied as a full-scale heat dissipation package substrate material that requires heat dissipation characteristics (European Patent No. EP 2,065,346, Patent No. 10-1324846).

On the other hand, in order to increase the thermal conductivity of the low-temperature calcined glass-ceramic composite 1, it is inevitable to increase the filling content of the ceramic filler 3, and in this case, the glass matrix 2 is still interposed between the ceramic particles 3 As well as being positioned, the heat transfer is suppressed due to the high interfacial heat resistance between the ceramic (3)-glass (2) and the glass (2)-ceramic (3), so the rate of increase in thermal conductivity is not very large as opposed to the design intention. And, above all, in this case, since the sintering temperature of the composite 1 is only higher, it is not practical since the low-temperature simultaneous firing with the metal electrode in the package itself becomes difficult when applied later.

Accordingly, the present invention is to provide a composite for low-temperature co-sintering and a method for manufacturing the same, which is capable of low-temperature firing and has significantly improved thermal conductivity properties.

The present invention according to one aspect of the present invention for achieving the above object relates to a composite for low-temperature sintering (LTCC) capable of sintering at a low temperature of 1000° C. or less, the composite being a three-dimensional network in which ceramic particles are three-dimensionally connected to each other. It includes a matrix phase of the structure and a glass phase filling the voids of the matrix phase.

At this time, the composition of the ceramic particles may be at least one of alumina (Al ₂ O ₃ ), aluminum nitride (AlN) and silicon nitride (Si ₃ N ₄ ), and the shape of the ceramic particles may be spherical.

Further, the composite may have a thermal conductivity of 10 W/m·K or more.

On the one hand, the present invention according to another aspect relates to a method of manufacturing a composite for low-temperature sintering (LTCC) capable of sintering at a low temperature of 1000° C. or less, the manufacturing method comprising the following steps:

-Manufacturing a ceramic sheet comprising ceramic powder particles;

-Forming a matrix layer in which the ceramic powder particles are connected to each other in a three-dimensional network structure in the ceramic sheet by primary heat treatment of the ceramic sheet;

-Forming a glass layer on at least one side of the ceramic sheet;

-Manufacturing the composite by subjecting the ceramic sheet on which the glass layer is formed to a second heat treatment so that molten glass is injected into the voids in the matrix layer.

At this time, the primary heat treatment may be adjusted so that the base layer has a porosity in the range of 29-41%, or the base layer can be adjusted to have a relative density in the range of 50-70%. Alternatively, the primary heat treatment may be performed in the range of 1300 ~ 1550 ℃.

In addition, the composition of the ceramic powder particles may be selected from one or more of alumina (Al ₂ O ₃ ), aluminum nitride (AlN) and silicon nitride (Si ₃ N ₄ ).

In addition, forming a glass layer on at least one surface of the ceramic sheet may include forming the glass into a glass sheet or glass paste, and laminating the glass sheet on at least one surface of the ceramic sheet or depositing the glass paste. And forming the glass layer by applying on at least one surface of the ceramic sheet.

In addition, the step of forming a glass layer on at least one surface of the ceramic sheet may include compressing and drying the ceramic sheet having a glass layer on the at least one surface before applying the second heat treatment after forming the glass layer. It can contain.

In addition, the total amount of glass solids in the glass layer may be adjusted so that the glass fills the voids to the maximum.

In addition, the glass layer is formed on the upper and lower surfaces of the ceramic sheet, respectively, and the thickness of the lower glass layer may be formed to be thinner than the thickness of the upper glass layer.

In addition, the second heat treatment may be performed in the range of 515 ~ 925 ℃, and the second heat treatment may be performed in a vacuum sintering furnace.

In contrast to the conventional ceramic-glass composite according to the present invention, a three-dimensional network structure in which high thermally conductive ceramic particles are connected to each other forms a matrix layer, and the void portion of the matrix layer is filled with a low-temperature molten glass. Therefore, in the ceramic-glass composite according to the present invention, the main heat transfer path is formed through the three-dimensional network structure of the highly thermally conductive ceramic particles, which are known, so that the thermal conductivity is greatly improved. In addition, since the base layer, which is the network structure, is filled onto the low-temperature molten glass in the ceramic-glass composite, low-temperature firing is possible while forming a dense sintered body structure.

FIG. 1 shows the microstructure of a green sheet of a typical glass-ceramic composite in which the glass is known.
2A and 2B show the heat transfer path in the microstructure of the glass-ceramic composite prepared by sintering the green sheet of FIG. 1, and FIG. 2B is an enlarged view of the portion “A” of FIG. 2A and shows the heat transfer path (H) Looks like
3A to 3B show the internal structure of the glass-ceramic composite according to the present invention, and FIG. 3B is an enlarged view of part “B” of FIG. 3A.
4A to 4C are for explaining a method of manufacturing a high thermal conductivity porous ceramic matrix layer having a three-dimensional network structure according to the present invention,
4A shows the internal structure of a ceramic green sheet made of a high thermal conductivity ceramic crystalline powder;
Figure 4b shows the internal structure of the ceramic green sheet of Figure 4a in a pre-heated state;
FIG. 4C is an enlarged view of a portion “C” of FIG. 4B and shows that the high thermal conductivity ceramic particles are connected to each other to form a three-dimensional network structure.
Figure 5 shows the internal structure of a glass sheet formed of a green sheet according to the invention.
6A to 6B show a structure in which a pair of glass green sheets are laminated on both sides of a ceramic green sheet for impregnation of heat treatment according to an embodiment of the present invention,
FIG. 6A shows an example where the upper glass green sheet has the same thickness as the lower glass green sheet;
6B shows a case where the upper glass green sheet is larger than the lower glass green sheet.

First, the term "glass-ceramic composite" as used herein refers to a composite having a structure in which the glass is a matrix and the ceramic particles are fillers.

In addition, the term "ceramic-glass composite" as used herein refers to a composite of a structure in which a three-dimensional network structure of ceramic particles is known and a glass phase is added to the pores of the network structure.

Hereinafter, the present invention will be described in detail with reference to related drawings.

3A to 3B show the internal structure of the glass-ceramic composite according to the present invention, and FIG. 3B is an enlarged view of part “B” of FIG. 3A.

The present invention is a phenomenon in which the glass-ceramic composites are isolated from each other by a low-thermal-conductive glass phase that is known as a matrix, despite the high-thermal-conductivity ceramic particles, so that the heat conduction is attenuated when passing through the glass phase, so that it is not smooth. It was created by observing.

As shown in FIG. 3A, the present invention is a so-called ceramic-glass composite 10 having an internal structure opposite to that of the prior art, which is a three-dimensional network in which high thermal conductivity ceramic powder particles 30 are connected to each other. The structure has a built-in base, and the remaining voids are injected with low-temperature molten glass 20 to have an added internal structure.

In particular, in the present invention, the base layer of the network structure in which the ceramic powder particles 20 are three-dimensionally connected to each other as above can be achieved by first pre-heating a ceramic sheet composed of only ceramic crystalline powder. According to this pre-heat treatment, a three-dimensional network connection is made between the high thermal conductivity ceramic powder particles, and as shown in FIG. 3B, the main heat transfer path (H) in the composite 10 according to the present invention according to the network structure connected in this way Is not a path between heterogeneous materials (ie, ceramic particles-glass), which has been a barrier to heat transfer, but is a path between homogeneous materials of high thermal conductivity (i.e., high thermal conductivity ceramic particles-high thermal conductivity ceramic particles), so thermal conductivity is greatly improved.

Then, in the ceramic sheet, the remaining portions (void portions) other than the high thermal conductivity ceramic matrix layer 30 having the three-dimensional network structure as described above are injected into the low-temperature molten glass 20 and filled to form a dense sintered body structure. do.

In this way, the ceramic-glass composite 10 according to the present invention has an internal heat transfer path (H) as a path between ceramic particles 30 having high thermal conductivity, so that the heat dissipation characteristics are greatly improved, while internally injected low-temperature melting Due to the glass phase 20, both compactness and low-temperature firing are secured.

In this invention, preferably, a composite 10 of a dense sintered body structure can be obtained by first preparing a high thermal conductivity porous ceramic matrix 30 having a three-dimensional network structure and then impregnating it with the glass 20. Hereinafter, each of the above steps will be described in detail together with various embodiments of the present invention.

Preparation of a highly thermally conductive porous ceramic matrix having a three-dimensional network structure

4A to 4C are for explaining a method of manufacturing a high thermal conductivity porous ceramic matrix layer having a three-dimensional network structure according to the present invention, and FIG. 4A is an internal structure of a ceramic green sheet made of high thermal conductivity ceramic crystalline powder. FIG. 4B shows the internal structure of the ceramic green sheet of FIG. 4A pre-heated, and FIG. 4C is an enlarged view of the portion “C” of FIG. 4B where high thermally conductive ceramic particles are connected to each other to form a three-dimensional network structure. Seems to.

The ceramic-glass composite according to the present invention first produces a ceramic green sheet 10 composed of a high thermal conductivity ceramic crystalline powder (FIG. 4A) and pre-heats it to establish a three-dimensional networking between internal ceramic particles (FIGS. 4B-4C). ).

First, as shown in Figure 4a, the ceramic green sheet 10 in the present invention is at least one high temperature selected from the group consisting of alumina (Al ₂ O ₃ ), aluminum nitride (AlN) and silicon nitride (Si ₃ N ₄ ) It may be manufactured as a green sheet composed of conductive ceramic powder particles 30 and an organic vehicle 40 including a binder. In the present invention, the ceramic powder particles 30 may be various types of particle powders such as spherical, amorphous, plate-like, and acicular, but to obtain an efficient heat transfer path in the 3D network structure constructed by these particles, FIG. 4B It is most preferable to be a spherical particle powder as possible as in ~4c. In addition, the production of the green sheet 10 can be achieved by a conventional thick film process including tape casting.

In an embodiment of the present invention, when manufacturing the ceramic green sheet 10 based on the alumina powder 30, the alumina ceramic green sheet 10 is amorphous or spherical alumina powder having a particle size range of 0.3 to 10 μm As the main raw material, a binder such as polyvinyl butyral (PVB), polymethyl methacrylate (PMMA), and dibutyl phthalate (DBP) as other plasticizers, A slurry can be prepared by mixing an appropriate amount of BYK111 as a dispersing agent and one or more of ethanol, methylethylketone (MEK), and toluene as a solvent for 12 to 24 hours with a ball mill. Then, the alumina slurry can be molded and dried by thick film tape casting, aged for a certain period of time, and then cut to a predetermined size to produce a ceramic green sheet 10.

And, as shown in Figures 4b to 4c, the ceramic green sheet 10 thus manufactured is pre-heated to form a three-dimensional network structure by interconnecting the inner ceramic powder particles by a series of initial sintering operations. .

In the present invention, the conditions of the pre-heat treatment may be determined based on the degree of connection between the ceramic particles 30 after the pre-heat treatment and their relative density or porosity. In one embodiment, when the ceramic green sheet 10 is formed of a spherical powder having an average particle diameter of 7 μm, the formation rate of waste holes is increased from a relative density of 70% or more, which is disadvantageous for impregnation of the glass 20, which is a subsequent process, and furthermore, thermal conductivity. The relative density of the pre-heat-treated ceramic sheet suitable in the present invention is in the range of 50-70%. In another embodiment, when the ceramic green sheet 10 is formed of a spherical powder having an average particle diameter of 0.8 µm, the temperature at which the initial ceramic particle connection starts is lower than that of the powder particle having the 7 µm particle diameter, which is approximately 1300~. A porous sheet having a porosity of 59 to 66% can be obtained by pre-heating at around 1400°C.

In the present invention, it is preferable that the pre-heated ceramic sheet is porous and has a porosity in the range of approximately 29-41% for the construction of a three-dimensional network structure and subsequent impregnation and thermal conductivity of the glass.

Glass injection into a high thermal conductivity porous ceramic matrix and preparation of a ceramic-glass composite

Then, according to the present invention, a glass-injected glass is injected into the prepared high thermal conductivity porous ceramic matrix to prepare a dense ceramic-glass composite 10 of a sintered body structure.

In the present invention, the glass is formed of a green sheet in the same way as the thick film process of the ceramic green sheet 10, or laminated on the ceramic green sheet 10 or formed of a paste to coat the surface of the ceramic green sheet 10. can do. The glass may be a commonly known commercial glass. In one embodiment, the composition of the glass may be appropriately selected according to the composition of the ceramic green sheet 10, considering that the use condition of the ceramic-glass composite 10 is low temperature firing, which is generally 650 to 900°C. Figure 5 shows the internal structure of a glass sheet formed of a green sheet according to the present invention, which consists of an organic vehicle 40 comprising a glass 20 and an organic binder. In one embodiment, the glass paste may use ethyl cellulose as a binder and alpha-turpentine oil as a solvent due to rheology characteristics for a printing process.

In addition, in the present invention, it is preferable that the glass green sheet or glass paste is adjusted so that the amount of glass solids is diffused and penetrated into the pores in the porous ceramic green sheet 10 at the time of impregnation. If the amount of the glass solids is small, a large number of pores remain in the ceramic sheet, and conversely, if the amount of the glass solids is too large, an excess glass layer is formed thickly on the surface of the ceramic green sheet. In all cases, it is a factor that reduces the thermal conductivity of the sintered ceramic-glass composite.

And, according to the present invention, the prepared glass green sheet is laminated with the ceramic green sheet 10 and heat-treated, or the prepared glass paste is coated on the surface of the ceramic green sheet 10 and heat-treated, whereby By injecting the molten glass into the high thermal conductivity porous ceramic matrix layer, a high thermal conductivity low temperature calcined ceramic-glass composite 10 of the final dense sintered body structure is prepared as shown in FIG. 3A.

As an embodiment of the present invention, after the glass green sheet is laminated on the ceramic green sheet 10 or after the glass paste is coated on the ceramic green sheet 10, they are compressed or dried before the heat treatment. Preferably. In addition, in the present invention, the glass green sheet may be laminated on both sides or one side of the ceramic green sheet 10, but for the most effective impregnation of glass, the glass green sheet is laminated on both sides of the ceramic green sheet 10. desirable.

6A to 6B show a structure in which a pair of glass green sheets are laminated on both sides of a ceramic green sheet for impregnation of heat treatment according to an embodiment of the present invention. When the thickness is the same as that of the lower glass green sheet, FIG. 6B shows the case where the upper glass green sheet has a larger thickness than the lower glass green sheet, respectively.

When the thicknesses of the upper and lower glass green sheets are equal to each other as shown in FIG. 6A, in the process of diffusion and penetration of the glass in the molten state into the ceramic green sheet during heat treatment, some gravity action causes the molten glass of the lower glass sheet to leak downward. You can (arrows in Figure 6a). Accordingly, considering this, it is preferable to form the thickness of the lower glass green sheet thinner than the thickness of the upper glass green sheet as shown in FIG. 6B.

In addition, in the present invention, heat treatment for efficient impregnation of the glass as above is preferably performed in a vacuum sintering furnace. The conditions of the heat treatment can be adjusted according to the degree of impregnation of the glass, and the preferred temperature of the heat treatment is in the range of approximately 515-925°C.

Evaluation of thermal conductivity

As examples (Examples 1 to 6) of the present invention, ceramic-glass composites of the present invention were prepared using alumina powder having an average particle diameter (D ₅₀ ) of 0.8 μm and 7 μm, respectively. That is, a green sheet was prepared from alumina powder of each average particle diameter and pre-heated to prepare a porous ceramic green sheet networked with alumina particles, and then the glass was injected and impregnated through heat treatment, thereby producing a final ceramic-glass composite. .

To this end, green sheets made of fine alumina powder having an average particle diameter of 0.8 µm are pre-treated at temperatures ranging from 1300 to 1400°C, and green sheets made of coarse alumina powder having an average particle diameter of 7 µm are preliminary at temperatures ranging from 1450 to 1550°C. Heat-treated to prepare porous ceramic green sheets having a relative density in the range of 59 to 66% and 61 to 69%, respectively, and then impregnated with glass at the heat treatment temperature in the range of 515 to 875°C into the pore channels of the porous body. A ceramic-glass composite was prepared.

In addition, in these examples, the thermal conductivity of the ceramic-glass composite of the present invention ranged from approximately 10.09 to 13 W/m·K when the average particle diameter of the alumina matrix powder was 0.8 μm, and the average particle diameter of the alumina matrix powder was 7 μm. In the case of 10.78 to 13.27 W/m·K. Table 1 below shows the thermal conductivity properties of Examples 1 to 6 of the present invention.

Alumina
Powder particle specification Example Primary
Heat treatment conditions Alumina
Porosity
Ceramic sheet
Density (%TD) Secondary
Heat treatment conditions Of ceramic-glass composite
Thermal conductivity (W/mK)@RT D ₅₀ = 0.8 μm
(conception) One 1300℃-2h 59 515~925℃-2h 10.09~12.20 2 1350℃-2h 62 515~925℃-2h 11.25~12.97 3 1400℃-2h 66 515~925℃-2h 12.21~13.00 D ₅₀ = 7 μm
(conception) 4 1450℃-2h 61 515~925℃-2h 10.78~12.71 5 1500℃-2h 64 515~925℃-2h 11.41~12.89 6 1550℃-2h 69 515~925℃-2h 12.53~13.27

On the other hand, as comparative examples for comparing the properties with the present invention (Comparative Examples 1 to 6), as in the above embodiments, the average particle diameter (D ₅₀ ) is 0.8μm and 7μm, respectively, using alumina powder in the conventional glass- A ceramic composite was prepared. To this end, a glass-ceramic composite on a glass matrix was prepared with glass using alumina powder of each average particle size as a filler (filler fraction 30-50 vol%). The firing temperature was maintained for 2 hours at a peak temperature under an atmospheric atmosphere in the sintering temperature range of 850 to 925°C, which is a typical sintering temperature range of the glass-ceramic composite. And, the thermal conductivity characteristics of Comparative Examples 1 to 6 thus obtained are shown in Table 2 below.

Alumina
Powder particle specification Comparative example Alumina filler fraction (%) Heat treatment conditions Of glass-ceramic complex
Thermal conductivity (W/m·K)@RT D ₅₀ = 0.8 μm
(conception) One 30 850~925℃-2h 2.68~2.98 2 40 850~925℃-2h 2.74~3.12 3 50 850~925℃-2h 2.96~3.04 D ₅₀ = 7 μm
(conception) 4 30 850~925℃-2h 2.44~2.86 5 40 850~925℃-2h 2.79~3.27 6 50 850~925℃-2h 2.83~3.10

As shown in Table 2 above, when alumina filler powder having a particle diameter of 0.8 μm was used according to the prior art (Comparative Examples 1 to 3), the thermal conductivity of the conventional glass-ceramic composite was approximately 2.68 to 3.12 W/m·K, When alumina fillers having a particle diameter of 7 µm were used according to the prior art (Comparative Examples 4 to 6), the thermal conductivity of the conventional glass-ceramic composites was only approximately 2.44 to 3.27 W/m·K.

Therefore, it can be seen from Tables 1 to 2 that the ceramic-glass composite according to the present invention has a thermal conductivity of up to 500% higher than that of a conventional glass-ceramic composite, thereby obtaining significantly improved thermal conductivity characteristics.

This is because, as described above, the ceramic-glass composite of the present invention has a three-dimensional network structure in which high-temperature-conductive ceramic particles are connected to each other as opposed to the conventional one, and the void portion of the base layer is filled with a low-temperature molten glass phase.

Therefore, in the ceramic-glass composite according to the present invention, the main heat transfer path is formed through the three-dimensional network structure of the highly thermally conductive ceramic particles, which is a known phase, so that the thermal conductivity is greatly improved (approximately 10 W/m·K or more). In addition, since the base layer, which is the network structure, is filled onto the low-temperature molten glass in the ceramic-glass composite, low-temperature firing (approximately 1000°C or less, preferably 925°C or less) is possible while forming a dense sintered body structure.

As described above, in the above-described embodiments and examples of the present invention, it may be more or less fluctuating within a typical error range depending on various experimental conditions such as purity, impurity content and heat treatment conditions of selected raw materials. It is natural for those who have the knowledge of.

In addition, preferred embodiments and examples of the present invention are disclosed for the purpose of illustration, and anyone who has ordinary knowledge in the field can make various modifications, changes, additions, and the like within the spirit and scope of the present invention. , Changes, additions, etc. should be regarded as belonging to the claims.

Claims (15)

In the low-temperature simultaneous sintering (LTCC) composite for sintering at a low temperature of less than 1000 ℃,
A matrix of a three-dimensional network structure in which ceramic particles are three-dimensionally connected to each other;
Low temperature simultaneous sintering composite, characterized in that it comprises a glass phase filled with the above-described voids. According to claim 1,
The composition of the ceramic particles is at least one of alumina (Al ₂ O ₃ ), aluminum nitride (AlN) and silicon nitride (Si ₃ N ₄ ) composite for low-temperature sintering. According to claim 1,
The shape of the ceramic particles is spherical low-temperature simultaneous sintering composite, characterized in that. According to claim 1,
The composite is a low-temperature simultaneous sintering composite, characterized in that it has a thermal conductivity of 10W / m · K or more. In the method of manufacturing a low temperature simultaneous sintering (LTCC) composite for sintering at a low temperature of less than 1000 ℃,
Preparing a ceramic sheet comprising ceramic powder particles;
Forming a matrix layer in which the ceramic powder particles are connected to each other in a three-dimensional network structure in the ceramic sheet by primary heat treatment of the ceramic sheet;
Forming a glass layer on at least one surface of the ceramic sheet;
And secondly heat-treating the ceramic sheet on which the glass layer is formed, so that molten glass is injected into the voids in the matrix layer to produce the composite. The method of claim 5,
The first heat treatment is a method of manufacturing a low-temperature co-sintering composite, characterized in that the base layer is adjusted to have a porosity in the range of 29-41%. The method of claim 5,
The first heat treatment is a method of manufacturing a low temperature co-sintering composite, characterized in that the base layer is adjusted to have a relative density in the range of 50 to 70%. The method of claim 5,
The first heat treatment is a method of manufacturing a low-temperature simultaneous sintering composite, characterized in that is performed in the range of 1300 ~ 1550 ℃. The method of claim 5,
The composition of the ceramic powder particles is at least one selected from alumina (Al ₂ O ₃ ), aluminum nitride (AlN) and silicon nitride (Si ₃ N ₄ ). The method of claim 5,
Forming a glass layer on at least one side of the ceramic sheet is
Forming the glass with a glass sheet or glass paste;
And forming the glass layer by laminating the glass sheet on at least one surface of the ceramic sheet or applying the glass paste on at least one surface of the ceramic sheet. Way. The method of claim 5,
Forming a glass layer on at least one side of the ceramic sheet is
After forming the glass layer and before applying the second heat treatment, the method for manufacturing a low temperature simultaneous sintering composite, comprising compressing and drying the ceramic sheet having a glass layer on at least one surface. The method of claim 5,
The method of manufacturing a low temperature simultaneous sintering composite, characterized in that the total amount of glass solids in the glass layer is adjusted so that the glass fills the voids to the maximum. The method of claim 5,
The glass layer is formed on the upper and lower surfaces of the ceramic sheet, respectively, and the thickness of the lower glass layer is thinner than the thickness of the upper glass layer. The method of claim 5,
The second heat treatment is a method of manufacturing a low-temperature simultaneous sintering composite, characterized in that is carried out in the range of 515 ~ 925 ℃. The method of claim 5,
The second heat treatment is a method for manufacturing a low-temperature simultaneous sintering composite, characterized in that is performed in a vacuum sintering furnace.

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