KR20200068611A - Vertical polarization antenna structure supporting 5G - Google Patents

Abstract

According to an embodiment of the present invention, the present invention relates to a vertical polarized antenna structure for supporting 5G, which has a small size and is operated at 28 GHz for supporting 5G, and can be applied to a thin user device and other structures as well. To this end, the vertical polarized antenna structure for supporting 5G of the present invention comprises: a printed circuit board having a first dielectric layer which has a first surface and a second surface opposite to the first surface, a first conductive via which is formed in a thickness direction of the first dielectric layer, a first exposed conductive plane which is connected to the first conductive via and exposed and formed on the first surface of the first dielectric layer and a first embedded conductive plane which is connected to the first conductive via and embedded and formed inside the first dielectric layer; and an injection-molded article including a second dielectric layer which has a first surface and a second surface opposite to the first surface, a second conductive via which penetrates in a thickness direction of the second dielectric layer, a second exposed conductive plane which is connected to the second conductive via and exposed and formed on the second surface of the second dielectric layer, and a second embedded conductive plane which is connected to the second conductive via and embedded and formed between the first surface of the second dielectric layer and the second surface of the first dielectric layer. The first and second embedded conductive planes are spaced part from and opposite to each other.

Description

Vertical polarization antenna structure supporting 5G}

An embodiment of the present invention relates to a vertically polarized antenna structure supporting 5G.

Research into 5th generation (5G) mobile communication systems has been actively conducted. The key performance indicator of 5G mobile communication is to increase the transmission capacity per unit area, and various wireless communication technologies have been developed with an increase in transmission capacity of approximately 1000 times compared to the existing Long Term Evolution (LTE) system.

The candidate technologies of typical 5G mobile communication systems are small cells and massive multiple input multiple outputs (MIMOs). The massive multi-antenna technology enables high-speed data transmission of approximately 20 Gbps (bit per second) per second, and allows mobile applications to transmit and receive a lot of data at a time by simultaneously using an antenna with vertical/horizontal polarization.

On the other hand, in the case of 5G mobile communication, two frequency bands are used: 6 GHz (3.6 GHz) and 28 GHz below, and in the case of 3.6 GHz, the size of the antenna is large for mounting on user equipment (UE). Use a horizontally polarized antenna.

However, when a vertical/horizontal polarization antenna is applied to the UE, the horizontal polarization antenna can be easily implemented, but the thickness of the UE is thin (approximately 6 to 7 mm), which makes it difficult to implement the vertical polarization antenna.

The above-described information disclosed in the background of the present invention is only for improving the understanding of the background of the present invention, and thus may include information that does not constitute the prior art.

Japanese Patent Publication No. 5413467 (2014.02.12) Japanese Patent Application Publication No. 2014-107746 (2014.06.09)

The problem to be solved according to an embodiment of the present invention is to provide a vertically polarized antenna structure operating at a small 28 GHz that can support 5G that can be applied to other structures as well as a thinner UE.

A vertically polarized antenna structure supporting 5G according to an embodiment of the present invention includes a first dielectric layer having a first surface and a second surface opposite to the first surface, and a first conductivity formed in a thickness direction of the first dielectric layer A via, a first exposed conductive plane connected to the first conductive via and exposed by the first surface of the first dielectric layer, and a first formed connected to the first conductive via and embedded inside the first dielectric layer A printed circuit board including an embedded conductive plane; And a second dielectric layer having a first surface and a second surface opposite to the first surface, a second conductive via penetrated in the thickness direction of the second dielectric layer, and connected to the second conductive via. A second exposed conductive plane formed by exposing the second surface of the dielectric layer, and a second embedded conductivity formed by being embedded between the first surface of the second dielectric layer and the second surface of the first dielectric layer and connected to the second conductive via It may include an injection material including a plane, the first embedded conductive plane and the second embedded conductive plane can be spaced apart from each other to face each other, the combined length of the first conductive via and the second conductive via is the operating frequency Can be equal to the half-wavelength length of.

The first embedded conductive plane and the second embedded conductive plane may be connected to a power supply unit.

The length of the first conductive via may be the same as or different from the length of the second conductive via. In some examples, the length of the first conductive via may be shorter than the length of the second conductive via.

The area of the first embedded conductive plane may be equal to or different from the area of the second embedded conductive plane. In some examples, the area may vary according to the length of the conductive via, and in the case of the shorter length, the area of the conductive plane may be widened to compensate for the length.

The area of the first exposed conductive plane may be the same as or different from the area of the second exposed conductive plane. In some examples, the area may vary according to the length of the conductive via, and in the case of the shorter length, the area of the conductive plane may be widened to compensate for the length.

An area of the first and second exposed conductive planes may be larger than an area of the first and second embedded conductive planes.

A vertically polarized antenna structure supporting 5G according to an embodiment of the present invention includes a first dielectric layer having a first surface and a second surface opposite to the first surface, and a lower conductive via formed in a thickness direction of the first dielectric layer A lower embedded conductive plane connected to the lower conductive via and embedded inside the first dielectric layer, an upper conductive via formed in a thickness direction of the first dielectric layer, and connected to the upper conductive via and the first dielectric layer A printed circuit board including an upper embedded conductive plane formed by being embedded inside, the lower embedded conductive plane and the upper embedded conductive plane spaced apart from each other; A second dielectric layer attached to the first surface of the first dielectric layer, a second conductive via formed through the second dielectric layer and connected to the lower conductive via, and connected to the second conductive via and connected to the second conductive via A lower injection molding material including a lower exposed conductive plane formed on a lower surface; And a third dielectric layer attached to the second surface of the first dielectric layer, a third conductive via formed through the third dielectric layer and connected to the upper conductive via, and the third dielectric layer connected to the third conductive via. It may be made of an upper injection material containing an upper exposed conductive plane formed on the upper surface of the.

The lower embedded conductive plane and the upper embedded conductive plane may be connected to a power supply unit.

The combined length of the lower conductive via and the second conductive via may be the same as or different from the combined length of the upper conductive via and the third conductive via.

The area of the lower embedded conductive plane may be the same as or different from the area of the upper embedded conductive plane.

The area of the lower exposed conductive plane may be the same as or different from the area of the upper exposed conductive plane.

The area of the upper and lower exposed conductive planes may be larger than that of the upper and lower embedded conductive planes.

An embodiment of the present invention provides a vertically polarized antenna structure operating at a compact 28 GHz capable of supporting 5G that can be applied to other structures as well as a thinner UE.

For example, an embodiment of the present invention implements half of the dipole antenna on the printed circuit board with conductive vias and conductive patterns, and uses the injection material (including conductive via and conductive pattern) attached to the other half of the dipole antenna on the printed circuit board. Can be implemented.

As another example, an embodiment of the present invention implements half of the dipole antenna on the printed circuit board with conductive vias and conductive patterns, and the other half of the dipole antenna is injected (conductive via and conductive) attached to the upper and lower surfaces of the printed circuit board, respectively. Pattern).

Accordingly, the vertically polarized antenna structure according to the embodiment of the present invention can be easily formed in a thin-thick UE.

1A and 1B are perspective and cross-sectional views showing a vertically polarized antenna structure supporting 5G according to an embodiment of the present invention.
2A and 2B are cross-sectional views showing only a conductor among vertically polarized antenna structures supporting 5G according to an embodiment of the present invention.
3 is a view showing a radiation pattern by a vertically polarized antenna structure supporting 5G according to an embodiment of the present invention.
4A and 4B are perspective and cross-sectional views showing a vertically polarized antenna structure supporting 5G according to an embodiment of the present invention.
5 is a plan view illustrating an example of a printed circuit board in which a vertical polarization antenna structure supporting 5G according to an embodiment of the present invention is adopted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, and the scope of the present invention is as follows. It is not limited to the Examples. Rather, these examples are provided to make the present disclosure more faithful and complete, and to fully convey the spirit of the present invention to those skilled in the art.

In addition, in the following drawings, the thickness or size of each layer is exaggerated for convenience and clarity of description, and the same reference numerals in the drawings refer to the same elements. As used herein, the term “and/or” includes any and all combinations of one or more of the listed items. In addition, in this specification, "connected" means not only when the A member and the B member are directly connected, but also when the C member is interposed between the A member and the B member to indirectly connect the A member and the B member. do.

The terms used in this specification are used to describe specific embodiments, and are not intended to limit the present invention. As used herein, singular forms may include plural forms unless the context clearly indicates otherwise. Also, when used herein, "comprise, include" and/or "comprising, including" refer to the shapes, numbers, steps, actions, elements, elements and/or groups of these mentioned. It is to specify existence and not to exclude the presence or addition of one or more other shapes, numbers, actions, elements, elements and/or groups.

Although the terms first, second, etc. are used herein to describe various members, parts, regions, layers and/or parts, these members, parts, regions, layers and/or parts are defined by these terms It is obvious that not. These terms are only used to distinguish one member, part, region, layer or part from another region, layer or part. Accordingly, the first member, component, region, layer or portion described below may refer to the second member, component, region, layer or portion without departing from the teachings of the present invention.

"Bottom surface", "beneath", "below", "lower", "top surface", "above", "upper" Terms related to spaces such as may be used for easy understanding of one element or feature shown in the drawings and another element or feature. Terms related to these spaces are for easy understanding of the present invention according to various process states or use states of the present invention, and are not intended to limit the present invention. For example, if an element or feature in a drawing is flipped over, the element or feature described as "bottom", "bottom" or "below" becomes "top", "top" or "above". Therefore, "lower surface" is a concept encompassing "upper surface".

1A and 1B are perspective and cross-sectional views illustrating a vertically polarized antenna structure 100 supporting 5G according to an embodiment of the present invention.

1A and 1B, a vertically polarized antenna structure 100 supporting 5G according to an embodiment of the present invention includes a printed circuit board 110 having a dielectric and a conductor, and an injection material having a dielectric and a conductor ( 120).

All dielectrics (eg, dielectric layers) mentioned below are, for example, but not limited to, FR-4, woven glass reinforced hydrocarbon/ceramic, polytetrafluoroethylene ( Polytetrafluoroethylene (PTFE)/woven glass, epoxy/glass, polyimide (PI), polybenzoxazole (PBO), benzocyclobuten (BCB), silicone (Silicones), acrylate (acrylate) Acrylates), plastics, ceramics, or composites thereof, or, in some examples, the thickness of the dielectric is, for example, but not limited to, about 0.5 mm to about 1.5 mm, preferably It can be about 1 mm.

In some examples, the dielectric constant of the dielectric can be, for example, but not limited to, from about 3 to about 4, and the loss tangent can be from about 0.003 to about 0.005. Further, in some examples, the dielectric may be formed in a laminate or injection method. Moreover, in some examples, the dielectric is, for example, but not limited to, coating methods such as spin coating, doctor blade, casting, painting, spray coating, slot die coating, curtain coating, slide coating or knife over edge coating, It may be formed by a printing method such as screen printing, pad printing, gravure printing, flexographic printing or offset printing, inkjet printing, which is a technique of the intermediate nature of coating and printing, or double injection.

The material and/or manufacturing method of the dielectric material may be equally applied to all dielectric materials described herein.

In addition, the conductors mentioned below (ie, conductive vias and/or conductive planes) are, for example, but not limited to copper, aluminum, gold, silver, platinum, nickel, palladium, chromium, iron, SUS, or These may be referred to or include alloys. In some examples, such a conductor is, for example, but not limited to, sputtering, electroless plating, electroplating, physical vapor deposition (PVD), chemical vapor deposition (CVD) , Metal organic chemical vapor deposition (MOCVD), atomic layer deposition (ALD), low pressure chemical vapor deposition (LPCVD) or plasma-lowering chemical vapor deposition (LPCVD) plasma enhanced chemical vapor deposition (PECVD). Further, in some examples, the thickness of the conductor may be, for example, but not limited to, approximately 10 μm to approximately 500 μm, preferably 100 μm to 300 μm.

The material and/or manufacturing method of such a conductor can be equally applied to all conductors described herein.

Subsequently, the printed circuit board 110 and the injection material 120 constituting the vertically polarized antenna structure 100 according to the embodiment of the present invention will be described.

The printed circuit board 110 may include a first dielectric layer 111, a first conductive via 112, a first exposed conductive plane 113, and a first embedded conductive plane 114.

The first dielectric layer 111 may include an approximately flat first surface (lower surface) and an approximately flat second surface (upper surface) as an opposite surface of the first surface. In addition, in some examples, a relatively wide lower ground layer 115 is formed on a first surface of the first dielectric layer 111, and a relatively wide upper ground layer 116 is also formed on a second surface of the first dielectric layer 111. It can be formed. In some examples, a first surface not covered by the lower ground layer 115 may be exposed to the lower side of the first dielectric layer 111, and a second surface not covered by the upper ground layer 116 may be upper. Can be exposed as. In some examples, some or half of the vertically polarized antenna structure 100 may be provided on the first and second surfaces of the exposed first dielectric layer 111 and inside the exposed first dielectric layer 111.

The first conductive via 112 may be formed in the thickness direction of the first dielectric layer 111 (eg, a direction from the first surface to the second surface or vice versa). In some examples, the first conductive via 112 may be formed in a direction approximately perpendicular to the first and/or second surfaces. In some examples, the bottom of the first conductive via 112 can be exposed through the first surface of the first dielectric layer 111, and the top of the first conductive via 112 is inside the first dielectric layer 111. It can be embedded.

The first exposed conductive plane 113 is connected to the lower end of the first conductive via 112 and may be formed by exposing the first surface of the first dielectric layer 111. In some examples, the planar shape of the first exposed conductive plane 113 may be approximately circular. In some examples, the planar shape of the first exposed conductive plane 113 may be square, rectangular, triangular, pentagonal, hexagonal, or polygonal.

The first embedded conductive plane 114 is connected to the top of the first conductive via 112, which can be formed by being embedded inside the first dielectric layer 111. In some examples, the planar shape of the first embedded conductive plane 114 may be approximately circular. In some examples, the planar shape of the first embedded conductive plane 114 may be square, rectangular, triangular, pentagonal, hexagonal, or polygonal. In some examples, the width of the first embedded conductive plane 114 may be narrower than the width of the first exposed conductive plane 113. In other words, the width of the first exposed conductive plane 113 may be larger than the width of the first embedded conductive plane 114.

In some examples, the first exposed conductive plane 113 and the first embedded conductive plane 114 may have an approximately parallel relationship. Further, in some examples, the first exposed conductive plane 113 and the first embedded conductive plane 114 are substantially parallel to the first surface (lower surface) and/or the second surface (upper surface) of the first dielectric layer 111. You can have a relationship. In addition, in some examples, the first exposed conductive plane 113 and the first embedded conductive plane 114 may have respective center points respectively coupled to the lower and upper ends of the first conductive via 112. In addition, in some examples, the first exposed conductive plane 113 and the first embedded conductive plane 114 may be parallel to each other, but the first conductive via 112 may be vertical.

The injection material 120 may include a second dielectric layer 121, a second conductive via 122, a second exposed conductive plane 123, and a second embedded conductive plane 124. In some examples, some or half of the vertically polarized antenna structure 100 may be provided on the first surface and the second surface of the injection mold 120, and inside thereof.

The second dielectric layer 121 may include an approximately flat first surface (lower surface) and an approximately flat second surface (upper surface) as an opposite surface of the first surface. In some examples, the second dielectric layer 121 occupies a relatively small volume (or volume) than the first dielectric layer 111, which can be directly adhered to the second dielectric layer 121. In some examples, the second dielectric layer 121 may have a substantially cylindrical or square column shape. In some examples, the first surface of the second dielectric layer 121 may be adhered to the second surface of the first dielectric layer 111 through an insulating adhesive.

The second conductive via 122 may be formed through the second dielectric layer 121 in a thickness direction (eg, a direction from the first surface toward the second surface or vice versa). In some examples, the second conductive via 122 can be formed in a direction approximately perpendicular to the first surface and/or the second surface. In some examples, the lower end of the second conductive via 122 may be exposed through the first surface of the second dielectric layer 121, and the upper end of the second conductive via 122 may be exposed through the second dielectric layer 121. It can be exposed through the surface. Further, in some examples, the longitudinal direction of the second conductive via 122 may overlap the longitudinal direction of the first conductive via 112. In some examples, the first conductive via 112 and the second conductive via 122 are spaced apart from each other, but may have approximately two spaced apart straight lines.

The second exposed conductive plane 123 is connected to the upper end of the second conductive via 122 and may be formed by exposing the second surface of the second dielectric layer 121. In some examples, the planar shape of the second exposed conductive plane 123 may be approximately circular. In some examples, the planar shape of the second exposed conductive plane 123 may be square, rectangular, triangular, pentagonal, hexagonal, or polygonal.

The second embedded conductive plane 124 is connected to the lower end of the second conductive via 122, which may be formed by being embedded between the second dielectric layer 121 and the first dielectric layer 111. In some examples, the planar shape of the second embedded conductive plane 124 may be approximately circular. In some examples, the planar shape of the second embedded conductive plane 124 may be square, rectangular, triangular, pentagonal, hexagonal, or polygonal.

In some examples, the width of the second embedded conductive plane 124 may be narrower than the width of the second exposed conductive plane 123. In other words, the width of the second exposed conductive plane 123 may be larger than the width of the second embedded conductive plane 124.

In some examples, the second exposed conductive plane 123 and the second embedded conductive plane 124 may have mutually opposite shapes or approximately parallel relations. Further, in some examples, the second exposed conductive plane 123 and the second embedded conductive plane 124 are substantially parallel to the first surface (lower surface) and/or the second surface (upper surface) of the second dielectric layer 121. You can have a relationship. In addition, in some examples, the second exposed conductive plane 123 and the second embedded conductive plane 124 may be respectively coupled to the top and bottom of the second conductive via 122, respectively. Further, in some examples, the second exposed conductive plane 123 and the second embedded conductive plane 124 may be parallel to each other, but the second conductive via 122 may be vertical.

In some examples, the first embedded conductive plane 114 and the second embedded conductive plane 124 may be spaced apart from each other to face each other. In some examples, the first dielectric layer 111 may be interposed between the first embedded conductive plane 114 and the second embedded plane.

In some examples, the length of the first conductive via 112 may be the same as the length of the second conductive via 122. In some examples, the length of the first conductive via 112 may be different from the length of the second conductive via 122. In some examples, the length of the first conductive via 112 may be shorter than the length of the second conductive via 122.

In some examples, the first embedded conductive plane 114 and the second embedded conductive plane 124 may be parallel to each other, and the area of each other may be the same or different. As the lengths of the first and second conductive vias 112 and 122 are different from each other, the areas of the first and second embedded conductive planes 114 and 124 may also vary, and in the case of the shorter side, the length of the conductive plane can be widened to compensate for the length. have.

In addition, in some examples, the first exposed conductive plane 113 and the second exposed conductive plane 123 may be parallel to each other, and the areas may be the same or different. As the lengths of the first and second conductive vias 112 and 122 are different from each other, the areas of the first and second exposed conductive planes 113 and 123 may also vary, and in the case of the shorter side, the area of the conductive plane can be widened to compensate for the length. have.

In some examples, the first embedded conductive plane 114 and the second embedded conductive plane 124 spaced apart from each other may be connected to the power feeding unit.

In some examples, the combined length of the first conductive via 112 provided on the printed circuit board 110 and the second conductive via 122 provided on the injection material 120 may be equal to the half-wavelength length of the operating frequency. .

In some examples, the antenna structure 100 according to an embodiment of the present invention may operate in the same manner as a dipole antenna. In general, dipole antennas have the same length of each arm, and a power supply is placed in the middle of the arm to operate as an antenna. The polarization of the antenna may be determined according to the direction of the dipole antenna. For example, horizontal polarization is generated when the antenna is lying, and vertical polarization is generated when the antenna is standing.

In the exemplary embodiment of the present invention, since vertical polarization is required, the antenna may be configured in a vertical direction. Also, in order to reduce the length of the antenna to less than half a wavelength, a top loading method may be used.

In this way, in the present invention, a half of the top loading dipole antenna is implemented on the printed circuit board 110, and a structure corresponding to half of the top loading dipole antenna inside the general FR-4 printed circuit board 110 is constructed. The printed circuit board 110 is implemented with a conductive via and a conductive pattern, and the other half of the antenna is implemented using an injection 120 attached on the printed circuit board 110 so that it can operate as a single dipole antenna.

2A and 2B are cross-sectional views showing only a conductor among the vertically polarized antenna structures 100 supporting 5G according to an embodiment of the present invention. Here, FIG. 2A shows a top-loading dipole antenna, and FIG. 2B shows a general straight conductor dipole antenna.

As shown in FIG. 2A, in the case of a top loading dipole antenna, a disk-shaped metal body (ie, first and second exposed conductive planes 113 and 123) is provided at the bottom and top of the antenna (ie, the first and second conductive vias 112 and 122) )) by additionally connecting, to increase the capacitance component of the antenna, thereby reducing the length of the antenna to less than a half-wavelength length, while having the same resonance frequency band. If there is no disk-shaped metal body (that is, the first and second exposed conductive planes 113 and 123), it is difficult to reduce the length of the antenna to less than half a wavelength as shown in FIG. 2B.

In this way, the antenna structure 100 according to an embodiment of the present invention provides a vertically polarized antenna operating at a small 28 GHz capable of supporting 5G applicable to other structures as well as a thin user equipment (UE). do.

3 is a view showing a radiation pattern by a vertically polarized antenna structure 100 supporting 5G according to an embodiment of the present invention. 3, the antenna structure 100 according to the embodiment of the present invention was confirmed to radiate in the vertical/horizontal direction as a general dipole antenna.

4A and 4B are perspective and cross-sectional views illustrating a vertically polarized antenna structure 200 supporting 5G according to an embodiment of the present invention.

4A and 4B, the vertical polarization antenna structure 200 supporting 5G according to an embodiment of the present invention includes a printed circuit board 210, a lower injection material 220, and an upper injection material 230. It may include.

The printed circuit board 210 includes a first dielectric layer 211 having a first surface and a second surface opposite to the first surface, a lower conductive via 212 formed in the thickness direction of the first dielectric layer 211, A lower embedded conductive plane 213 connected to the lower conductive via 212 and embedded inside the first dielectric layer 211, an upper conductive via 214 formed in a thickness direction of the first dielectric layer 211, and an upper portion It may be connected to the conductive via 214 and may include an upper embedded conductive plane 215 formed by being embedded inside the first dielectric layer 211. In some examples, the lower embedded conductive plane 213 and the upper embedded conductive plane 215 may be spaced apart from each other. In some examples, the first dielectric layer 211 may be interposed between the lower embedded conductive plane 213 and the upper embedded conductive plane 215. In some examples, the area of the lower embedded conductive plane 213 and the area of the upper embedded conductive plane 215 may be the same or different from each other. Further, in some examples, the lower conductive via 212 and the upper conductive via 214 may be approximately two spaced apart straight lines.

The lower injection material 220 is a second dielectric layer 221 attached to the first surface of the first dielectric layer 211 and a second dielectric layer 221 that is formed through and is electrically connected to the lower conductive via 212. The conductive via 222 may be connected to the second conductive via 222 and may include a lower exposed conductive plane 223 formed on the bottom surface of the second dielectric layer 221. In some examples, the second dielectric layer 221 may be adhered to the first surface of the first dielectric layer 211 through an insulating adhesive. In some examples, the second conductive via 222 can be electrically connected to the lower conductive via 212 through a conductive adhesive. In addition, in some examples, the area of the lower exposed conductive plane 223 may be larger than each of the upper and lower embedded conductive planes 213 and 215.

The upper injection material 230 is a third dielectric layer 231 attached to the second surface of the first dielectric layer 211 and a third dielectric layer 231 that is formed through and is electrically connected to the upper conductive via 214. The conductive via 232 may include an upper exposed conductive plane 233 connected to the third conductive via 232 and formed on the upper surface of the third dielectric layer 231. In some examples, the third dielectric layer 231 may be adhered to the second surface of the first dielectric layer 211 through an insulating adhesive. In some examples, the third conductive via 232 can be electrically connected to the upper conductive via 214 through a conductive adhesive. In addition, in some examples, an area of the upper exposed conductive plane 233 may be larger than each of the upper and lower embedded conductive planes 213 and 215.

In some examples, the lower embedded conductive plane 213 and the upper embedded conductive plane 215 may be connected to the feeder. In some examples, the combined length of the lower conductive via 212 and the second conductive via 222 may be equal to or different from the combined length of the upper conductive via 214 and the third conductive via 232. In some examples, the area of the bottom exposed conductive plane 223 and the area of the top exposed conductive plane 233 may be the same or different from each other.

In this way, in the present invention, the top loading dipole antenna is implemented on the printed circuit board 210, and the structure corresponding to half of the top loading dipole antenna inside the general FR-4 printed circuit board 210 is printed circuit board. It is implemented with a conductive via and a conductive pattern of 210, and the other half of the antenna is implemented using injection materials 220 and 230 respectively on the lower and upper portions of the printed circuit board 210 so that it can operate as a single dipole antenna.

5 is a plan view showing an example of a printed circuit board (110,210) employing a vertically polarized antenna structure (100,200) supporting 5G according to an embodiment of the present invention.

As illustrated in FIG. 5, in the vertically polarized antenna structure 100 and 200 supporting 5G according to an embodiment of the present invention, a part of the ground layer of the printed circuit boards 110 and 210 is removed, and the vertically polarized antenna structure is formed in the removed area. Can be. Therefore, the radiation pattern may be radiated to the side of the user equipment such as a smartphone or a mobile phone.

What has been described above is only one embodiment for implementing a vertically polarized antenna structure supporting 5G according to the present invention, and the present invention is not limited to the above-described embodiment, and as claimed in the following claims Anyone who has ordinary knowledge in the field to which the present invention belongs, without departing from the gist of the invention, will have the technical spirit of the present invention to the extent that various changes can be made.

100; Vertical polarized antenna structure
110; Printed circuit board 111; First dielectric layer
112; First conductive via 113; First exposed conductive plane
114; A first embedded conductive plane 115; Lower ground layer
116; Upper ground layer 120; Injection
121; Second dielectric layer 122; Second conductive via
123; A second exposed conductive plane 124; 2nd embedded conductive plane
200; Vertical polarized antenna structure
210; Printed circuit board 211; First dielectric layer
212; Lower conductive via 213; Lower embedded conductive plane
214; Upper conductive via 215; Upper embedded conductive plane
220; Lower injection material 221; 2nd dielectric layer
222; Second conductive via 223; Bottom exposed conductive plane
230; Upper injection 231; 3rd dielectric layer
232; Third conductive via 233; Top exposed conductive plane

Claims (6)

A first dielectric layer having a first surface and a second surface opposite to the first surface, a first conductive via formed in a thickness direction of the first dielectric layer, and connected to the first conductive via and connected to the first dielectric layer A printed circuit board including a first exposed conductive plane formed exposed on a first surface and a first embedded conductive plane connected to the first conductive via and embedded inside the first dielectric layer; And
A second dielectric layer having a first surface and a second surface opposite to the first surface, a second conductive via penetrated in the thickness direction of the second dielectric layer, and the second dielectric layer connected to the second conductive via A second exposed conductive plane formed by exposing to the second surface of the second embedded conductive plane connected to the second conductive via and embedded between the first surface of the second dielectric layer and the second surface of the first dielectric layer It includes an injection material containing,
The first embedded conductive plane and the second embedded conductive plane are spaced apart from each other, facing each other,
The vertically polarized antenna structure in which the combined length of the first conductive via and the second conductive via is equal to the half-wave length of the operating frequency. According to claim 1,
The first embedded conductive plane and the second embedded conductive plane are connected to a power feeding unit, a vertically polarized antenna structure. According to claim 1,
The length of the first conductive via is the same or different from the length of the second conductive via, a vertically polarized antenna structure. According to claim 1,
The area of the first embedded conductive plane is equal to or different from that of the second embedded conductive plane, a vertically polarized antenna structure. According to claim 1,
The area of the first exposed conductive plane is the same as or different from the area of the second exposed conductive plane, a vertically polarized antenna structure. According to claim 1,
A vertically polarized antenna structure in which the area of the first and second exposed conductive planes is larger than the area of the first and second embedded conductive planes.

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